Heat treatment apparatus, heat treatment method, and method for producing chemical products

Abstract

To provide a heat treatment apparatus that can control the temperature of a heating resistor to a constant level based on the resistance value of the heating resistor. [Solution] The heat treatment apparatus of the present disclosure comprises a heating furnace 1 having an internal space into which a workpiece is supplied, a heat-generating resistor 2, a power supply unit 3, a current measuring unit 4, a voltage measuring unit 5, and a control unit 6. The control unit 6 includes a temperature setting unit 61 for setting a target temperature for heating the workpiece, an electrical resistance value calculation unit 62 for calculating the electrical resistance value of the heat-generating resistor 2 from the current and voltage measured by the current measuring unit 4 and the voltage measuring unit 5, a temperature calculation unit 63 for calculating the temperature of the heat-generating resistor 2 based on the electrical resistance value, a temperature comparison unit 64 for comparing the temperature of the heat-generating resistor 2 with the target temperature, a determination unit 65 for determining the amount of power to be supplied from the power supply unit 3 to the heat-generating resistor 2 based on the comparison result by the temperature comparison unit 64, and a correction unit 66 for correcting the power supplied from the power supply unit 3 to the heat-generating resistor 2 based on the amount of power determined by the determination unit 65.

Description

[Technical Field]

[0001] This disclosure relates to a heat treatment apparatus, a heat treatment method, and a method for producing chemical products. [Background technology]

[0002] Conventionally, thermocouples, platinum thermometers, and radiation thermometers have been used to measure the temperature of heating elements and furnaces (see, for example, Non-Patent Document 1). However, when the heating element is in the shape of a thread, drawn wire, coil, mesh, or net, it is difficult to use thermocouples and platinum thermometers, which require physical contact. Furthermore, in the case of radiation thermometers, it is necessary to install a window in the furnace to measure the infrared radiation emitted from the heating element, which is costly and also makes accurate measurement impossible if there is dirt in the path of the infrared radiation, so it is necessary to keep the window clean. When the material being processed contains carbon, carbonization occurs due to heating, making it difficult to keep the window clean. [Prior art documents] [Non-patent literature]

[0003] [Non-Patent Document 1] VM Shekunova et al., Petroleum Chemistry, 2017, Volume 57, pages 446-451 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] The purpose of this disclosure is to provide a heat treatment apparatus that can control the temperature of a heating resistor to a constant level based on the resistance value of the heating resistor. [Means for solving the problem]

[0005] The means to solve the aforementioned problem are as follows: <1> A heating furnace having an internal space into which the material to be processed is supplied, A heating resistor placed inside the aforementioned heating furnace, A power supply unit that supplies power to the aforementioned heat-generating resistor, A current measuring unit that measures the current flowing through the heating resistor due to the power supplied to the heating resistor from the power supply unit, A voltage measuring unit that measures the voltage applied to the heating resistor by the power supplied to the heating resistor from the power supply unit, A control unit that controls the power supplied from the power supply unit to the heating resistor, Equipped with, The control unit, A temperature setting unit for setting a target temperature for heating the object to be processed, An electrical resistance value calculation unit calculates the electrical resistance value of the heating resistor from the current measured by the current measuring unit and the voltage measured by the voltage measuring unit. A temperature calculation unit calculates the temperature of the heating resistor based on the electrical resistance value calculated by the electrical resistance value calculation unit, A temperature comparison unit compares the temperature of the heating resistor calculated by the temperature calculation unit with the target temperature set by the temperature setting unit. A determination unit determines the amount of power to be supplied from the power supply unit to the heating resistor based on the comparison results from the temperature comparison unit, A correction unit corrects the amount of power supplied from the power supply unit to the heating resistor based on the amount of power determined by the determination unit, This is a heat treatment apparatus characterized by having the following features. <2> A processing object supply unit connected to the heating furnace and supplying the processing object to the internal space of the heating furnace, A processing object removal unit connected to the heating furnace, which removes the processed object that has been heat-treated in the internal space of the heating furnace, The further comprising the above <1> This is the heat treatment apparatus described above. <3> The heating furnace is further provided with a gas supply unit that is connected to the heating furnace and supplies gas to the internal space of the heating furnace. <1> or the above <2> This is the heat treatment apparatus described above. <4> A material recovery unit connected to the material removal unit for collecting the material, A cooling unit disposed between the heating furnace and the processed material recovery unit, The heat treatment apparatus according to <2> or <3>, further comprising the above. <5> The heat treatment apparatus according to any one of <1> to <4>, wherein the heating resistor is one or more metals selected from the group consisting of kanthal, tungsten, molybdenum, and tantalum. <6> The heat treatment apparatus according to any one of <1> to <5>, wherein the heating resistor is rod-shaped, thread-shaped, wire-drawn, film-shaped, plate-shaped, coil-shaped, double helical coil-shaped, net-shaped, mesh-shaped, foil-shaped, cloth-shaped, film-shaped, or layer-shaped. <7> A heat treatment method characterized by heat-treating the object to be treated using the heat treatment apparatus according to any one of <1> to <6>. <8> The heat treatment method according to <7>, including continuously heating the object to be treated with the heating resistor. <9> The heat treatment method according to <7> or <8>, wherein the temperature coefficient of resistance of the heating resistor at the target temperature is 1,000 ppm / °C or more. <10> A method for producing a chemical, Comprising heat-treating the object to be treated using the heat treatment apparatus according to any one of <1> to <6>, The object to be treated is plastic, The chemical product is a method for producing a chemical product, characterized by containing at least one chemical product selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons.

Advantages of the Invention

[0006] According to an embodiment of the present disclosure, a heat treatment apparatus capable of controlling the temperature of a heating resistor to be constant based on the resistance value of the heating resistor can be provided.

Brief Description of the Drawings

[0007] [Figure 1]Figure 1 is a schematic circuit diagram showing an example of the configuration circuit of a heat treatment apparatus according to one embodiment of the present disclosure. [Figure 2] Figure 2 is a functional block diagram showing an example of a control unit of a heat treatment apparatus according to one embodiment of the present disclosure. [Figure 3] Figure 3 is a schematic cross-sectional view showing an example of a heating furnace of a heat treatment apparatus according to the first embodiment of this disclosure. [Figure 4] Figure 4 is a functional block diagram showing an example of other components of the control unit of the heat treatment apparatus according to the first embodiment of this disclosure. [Figure 5] Figure 5 is a schematic cross-sectional view showing an example of a heating furnace of a heat treatment apparatus according to the second embodiment of this disclosure. [Figure 6] Figure 6 is a functional block diagram showing an example of other components of the control unit of a heat treatment apparatus according to the second embodiment of this disclosure. [Figure 7] Figure 7 is a schematic cross-sectional view showing an example of a heating furnace, a material recovery unit, and a cooling unit of a heat treatment apparatus according to the third embodiment of this disclosure. [Figure 8] Figure 8 is an example of a flowchart of a heat treatment method according to one embodiment of the present disclosure. [Figure 9] Figure 9 is an example of a flowchart of a method for producing a chemical product according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0008] A heat treatment apparatus and a heat treatment method according to the embodiments of this disclosure will be described in detail with reference to the drawings. However, the embodiments described below are illustrative examples of a heat treatment apparatus and a heat treatment method for realizing the technical concept of this disclosure and are not limited to those described below, and can be modified as appropriate without departing from the gist of this disclosure.

[0009] Furthermore, the dimensions, materials, shapes, numbers, and relative arrangements of the components described in the embodiments are merely illustrative examples and not intended to limit the scope of this disclosure unless otherwise specified. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for clarity. Also, in the following description, the same name and reference numeral indicate the same or identical components, and detailed explanations are omitted as appropriate. To avoid overly complex drawings, schematic diagrams may be used with some elements omitted, or end views showing only the cross-section may be used as cross-sectional views.

[0010] Furthermore, in this disclosure, the term "polygon" refers to polygons such as rectangles, triangles, and quadrilaterals, including shapes where the corners of the polygon have been rounded, chamfered, or otherwise modified. Similarly, shapes where modifications have been made not only to the corners (ends of the sides) but also to the middle parts of the sides will also be referred to as polygons. In other words, shapes that retain the shape of a polygon but have been partially modified are included in the interpretation of "polygon" as described in this disclosure.

[0011] Furthermore, the same applies not only to polygons, but also to terms describing specific shapes such as cylinders, rectangular prisms, trapezoids, circles, and tapered shapes. The same also applies when dealing with each side that forms such a shape. In other words, even if a side has been processed at a corner or in the middle, the interpretation of "side" includes the processed part. When distinguishing a "polygon" or "side" without partial processing from a processed shape, the term "strictly" should be added, for example, "strictly quadrilateral."

[0012] Furthermore, the following description uses terms to indicate specific directions or positions as needed (e.g., "up," "down," "side," "top surface," "bottom surface," "side," "X," "Y," "Z," and other terms including these terms). However, the use of these terms is solely to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not excessively limit the technical scope of the invention. For example, if "top surface" is mentioned, the invention must not always be used in a way that it faces upwards.

[0013] Furthermore, in this specification, the "~" symbol indicating a numerical range means that the values ​​before and after it are included as the lower and upper limits, respectively, unless otherwise specified.

[0014] (Heat treatment equipment) A heat treatment apparatus according to one embodiment of the present disclosure comprises: a heating furnace having an internal space into which a workpiece is supplied; a heat-generating resistor disposed in the heating furnace; a power supply unit that supplies power to the heat-generating resistor; a current measuring unit that measures the current flowing through the heat-generating resistor due to the power supplied to the heat-generating resistor from the power supply unit; a voltage measuring unit that measures the voltage applied to the heat-generating resistor due to the power supplied to the heat-generating resistor from the power supply unit; and a control unit that controls the power supplied to the heat-generating resistor from the power supply unit, wherein the control unit includes a temperature setting unit that sets a target temperature for heating the workpiece, and the current measuring unit The heat treatment apparatus includes: an electrical resistance value calculation unit that calculates the electrical resistance value of the heating resistor from the measured current and the voltage measured by the voltage measurement unit; a temperature calculation unit that calculates the temperature of the heating resistor based on the electrical resistance value calculated by the electrical resistance value calculation unit; a temperature comparison unit that compares the temperature of the heating resistor calculated by the temperature calculation unit with a target temperature set by the temperature setting unit; a determination unit that determines the amount of power to be supplied to the heating resistor from the power supply unit based on the comparison result by the temperature comparison unit; and a correction unit that corrects the power supplied to the heating resistor from the power supply unit based on the amount of power determined by the determination unit. The heat treatment apparatus according to one embodiment may further include other components as needed.

[0015] A heat treatment apparatus according to one embodiment of the present disclosure heats a workpiece supplied to the internal space of a heating furnace by heating a heat-generating resistor placed inside the heating furnace. This apparatus allows for the decomposition of the workpiece and the acquisition of a processed material.

[0016] Conventionally, in heating furnaces that utilize the heating of a heat-generating resistor, continued use leads to deterioration of the heat-generating resistor, changing its heat dissipation characteristics. This results in the inability to maintain the initial heating temperature even when the same amount of power is supplied to the heat-generating resistor. Furthermore, when the material being processed in the heating furnace contains carbon, such as naphtha, hydrocarbons, plastics, or biomass, carbonization (sometimes referred to as "coking" in this disclosure) occurs on the surface of the metal wire that serves as the heating element, which alters the heat dissipation characteristics of the heat-generating resistor.

[0017] In contrast, the heat treatment apparatus according to one embodiment of the present disclosure can control the temperature of the heating resistor to a constant level based on the resistance value of the heating resistor, even when the heat dissipation characteristics change due to deterioration or contamination of the heating resistor. As a result, the heat treatment apparatus can operate stably for a long time, efficiently thermally decompose the material to be treated, and increase the yield of the treated material.

[0018] First, the operating principle of a heat treatment apparatus according to one embodiment of this disclosure will be described. Figure 1 is a schematic circuit diagram showing an example of the configuration circuit of a heat treatment apparatus according to one embodiment of this disclosure. Figure 2 is a functional block diagram showing an example of the control unit of a heat treatment apparatus according to one embodiment of this disclosure.

[0019] The drive circuit of the heat treatment apparatus 100 is mainly a feedback circuit. The feedback circuit comprises a heat-generating resistor 2, a power supply unit 3, a current measuring unit 4, a voltage measuring unit 5, and a control unit 6.

[0020] The control unit 6 includes a temperature setting unit 61 for setting a target temperature T for heating the object to be processed 7, an electrical resistance value calculation unit 62 for calculating the electrical resistance value Rt of the heating resistor 2 from the current measured by the current measuring unit 4 and the voltage measured by the voltage measuring unit 5, a temperature calculation unit 63 for calculating the temperature t of the heating resistor 2 based on the electrical resistance value Rt calculated by the electrical resistance value calculation unit 62, a temperature comparison unit 64 for comparing the temperature t of the heating resistor 2 calculated by the temperature calculation unit 63 with the target temperature T set by the temperature setting unit 61, a determination unit 65 for determining the amount of power to be supplied from the power supply unit 3 to the heating resistor 2 based on the comparison result by the temperature comparison unit 64, and a correction unit 66 for correcting the amount of power supplied from the power supply unit 3 to the heating resistor 2 based on the amount of power determined by the determination unit 65. The control unit 6 may further include other components as needed.

[0021] The current supplied from the power supply unit 3 to the heating resistor 2 is measured by the current measurement unit 4, and an input signal based on the measured current is input to the control unit 6. The voltage across the heating resistor 2 is measured by the voltage measurement unit 5, and an input signal based on the measured voltage is input to the control unit 6.

[0022] There are no particular restrictions on the method of connecting the heating resistor 2, the power supply unit 3, and the current measuring unit 4, but connecting them using the four-terminal method is preferable because it minimizes measurement errors.

[0023] In the control unit 6, the temperature setting unit 61 sets the target temperature T (°C) for heating the object to be processed 7. The target temperature T (°C) information in the temperature setting unit 61 is input by the operator to the control unit 6.

[0024] Furthermore, when the temperature setting unit 61 sets a target temperature T, an output signal based on the setting is output to the power supply unit 3, which determines the initial amount of power to be supplied to the heating resistor 2.

[0025] Next, based on the current I (A) measured by the current measurement unit 4 and the voltage E (V) measured by the voltage measurement unit 5, the electrical resistance value calculation unit 62 of the control unit 6 calculates the electrical resistance value R of the heating resistor 2 at regular intervals. tCalculate (Ω). In the electrical resistance value calculation unit 62, the electrical resistance value R of the heating resistor 2 t (Ω) is calculated by the following formula 1 based on Ohm's law.

[0026]

Number

[0027] Next, based on the target temperature T (°C) set by the temperature setting unit 61 and the electrical resistance value R of the heating resistor 2 calculated by the electrical resistance value calculation unit 62 t (Ω), the temperature calculation unit 63 of the control unit 6 calculates the actual temperature t (°C) of the heating resistor 2. This utilizes the fact that the relationship between the temperature t (°C) of the heating resistor 2 and the electrical resistance value R t (Ω) is represented by the following formula 2.

[0028]

Number

[0029] Specifically, under the condition that the temperature of the heating resistor 2 and the surrounding environment are the same, for example, after leaving the heat treatment apparatus 100 unused for a sufficient period of time, the temperature of the surrounding environment can be used as the temperature of the heating resistor 2, and this is used as the reference temperature t r (°C). Power is supplied from the power supply unit 3 to the heating resistor 2, and based on the current I (A) measured by the current measurement unit 4 and the voltage E (V) measured by the voltage measurement unit 5, in the electrical resistance value calculation unit 62 of the control unit 6, the electrical resistance value R at the reference temperature t r at the reference temperature t is calculated by the above formula 1. tr(Ω) is calculated. At this time, the power supplied from the power supply unit 3 to the heating resistor 2 is set to the minimum magnitude and duration necessary for measuring the current I and voltage E, so that the temperature change of the heating resistor 2 can be ignored.

[0030] Also, α t This value depends on the material and temperature of the heating resistor 2. Using a test specimen made of the same material as the heating resistor 2, the electrical resistance value is measured in advance in the range from room temperature to approximately the target temperature T(°C) + 100°C of the heating resistor 2, and then calculated using the following equation 3.

[0031]

number

[0032] Thus, the reference temperature t r (℃), reference temperature t r The electrical resistance value R of the heating resistor 2 in tr (Ω), and the actual temperature t of the heating resistor 2 to the reference temperature t r The temperature coefficient of resistance α in the interval up to t Since the value (ppm / °C) can be measured and calculated in advance, the electrical resistance value R of the heating resistor 2 can be used. t By calculating this, the actual temperature t (°C) of the heating resistor 2 during operation can be determined using equation 2.

[0033] Next, the temperature comparison unit 64 compares the temperature t (°C) of the heat-generating resistor 2 calculated by the temperature calculation unit 63 with the target temperature T (°C) set by the temperature setting unit 61. The temperature difference X, which is the result of the comparison by the temperature comparison unit 64, is calculated by the following equation 4.

[0034]

number

[0035] Next, the determination unit 65 determines the amount of power to be supplied from the power supply unit 3 to the heat-generating resistor 2 based on the temperature difference X, which is the comparison result from the temperature comparison unit 64. The determination unit 65 calculates the amount of power to be supplied to the heat-generating resistor 2 based on data showing the relationship between the temperature difference X and the heat dissipation characteristics, or the relationship between the amount of power supplied and the temperature rise from the start of operation of the heat treatment device 100 up to temperature t.

[0036] Next, the correction unit 66 outputs an output signal to the power supply unit 3 to correct the amount of power supplied from the power supply unit 3 to the heating resistor 2, based on the amount of power determined by the determination unit 65.

[0037] Therefore, the power supply unit 3 receives only one of the output signals: the output signal based on the temperature setting unit 61 or the output signal based on the correction unit 66.

[0038] For example, if the temperature difference X, which is the comparison result from the temperature comparison unit 64, satisfies X=0, the amount of energy determined by the determination unit 65 is the same as the amount of energy due to the target temperature T in the temperature setting unit 61. Therefore, no output signal is output based on the correction unit 66, and the power supply unit 3 operates based on the output signal from the temperature setting unit 61. If the temperature difference X, which is the comparison result from the temperature comparison unit 64, satisfies X>0, the amount of energy determined by the determination unit 65 is greater than the amount of energy due to the target temperature T in the temperature setting unit 61. Therefore, no output signal is output based on the temperature setting unit 61, and the power supply unit 3 operates based on the output signal from the correction unit 66. If the temperature difference X, which is the comparison result from the temperature comparison unit 64, satisfies X<0, the amount of energy determined by the determination unit 65 is less than the amount of energy due to the target temperature T in the temperature setting unit 61. Therefore, no output signal is output based on the temperature setting unit 61, and the power supply unit 3 operates based on the output signal from the correction unit 66.

[0039] Furthermore, when X > 0 is satisfied and the power supply unit 3 is operated by the output signal based on the correction unit 66, adjustments may be made, for example, to speed up the arrival of the target temperature T, such as increasing the amount of power supplied by the power supply unit 3 to the heating resistor 2 or increasing the heating time by the heating resistor 2.

[0040] Furthermore, when X < 0 is satisfied and the power supply unit 3 is operated by the output signal based on the correction unit 66, adjustments may be made, for example, to speed up the arrival of the target temperature T, such as reducing the amount of power supplied by the power supply unit 3 to the heating resistor 2 or shortening the heating time by the heating resistor 2.

[0041] By the way, if the heating resistor 2 deteriorates or contaminants adhere to the heating resistor 2, even if the temperature remains constant, the electrical resistance value R of the heating resistor 2 will change. t (Ω) changes. Therefore, after the heat treatment apparatus 100 reaches the target temperature T (°C), while maintaining a constant power supply to the heating resistor 2 and the supply of the material to be processed 7 during steady operation, the voltage measurement unit 5 measures the voltage across the heating resistor 2 at regular intervals, and the electrical resistance value R of the heating resistor 2 is calculated by the electrical resistance value calculation unit 62. t The (Ω) value is calculated, and the degree of change from the electrical resistance value at the start of steady-state operation is observed. This allows for the determination of the degree of deterioration or contamination of the heating resistor 2. Alternatively, during non-steady-state operation, such as from the start of operation of the heat treatment device 100 to the time it is heating up to the target temperature T (°C), measurements are taken at regular intervals by the current measurement unit 4 and the voltage measurement unit 5, and the electrical resistance value R of the heating resistor 2 is determined. t Calculate (Ω). Then, as described above, the temperature before operation is the reference temperature t. r The temperature t(°C) obtained by Equation 2 as (°C) and the temperature of the heat-generating resistor 2 calculated at an earlier point during operation are used as the reference temperature t r If there is a difference between the temperature t(°C) obtained by Equation 2 (as (°C)) and , the degree of deterioration or contamination of the heat-generating resistor 2 can be determined by the extent of that difference.

[0042] The contaminants adhering to the heat-generating resistor 2 vary depending on the type of material being treated 7. For example, if the material being treated 7 is one or more selected from the group consisting of naphtha, hydrocarbons, plastics, and biomass, the contaminants may be carbonized versions of these materials (sometimes referred to as "coking" in this disclosure).

[0043] Furthermore, causes of deterioration of the heat-generating resistor 2 include the reaction between the heat-generating resistor 2 and one or more substances selected from the object to be processed 7, the processed material 8, and the gas 21, and physical damage caused by contact or collision between the heat-generating resistor 2 and one or more objects selected from the object to be processed 7 and the processed material 8.

[0044] Next, the components of a heat treatment apparatus according to one embodiment of this disclosure will be described.

[0045] [First Embodiment] The following describes a heat treatment apparatus according to the first embodiment of this disclosure, which includes a material supply unit 9 and a material removal unit 10 as other components; however, the heat treatment apparatus according to one embodiment of this disclosure is not limited thereto.

[0046] Figure 3 is a schematic cross-sectional view showing an example of a heating furnace of a heat treatment apparatus according to the first embodiment of this disclosure.

[0047] The heat treatment apparatus 100 comprises a heat-generating resistor 2 located inside the heating furnace 1, and a power supply unit 3, a current measuring unit 4, a voltage measuring unit 5, a control unit 6, a material to be processed supply unit 9, and a material to be processed removal unit 10, all located outside the heating furnace 1.

[0048] The direction in which the object to be processed 7 flows by its own weight within the internal space of the heating furnace 1 is defined as the Y-axis direction, the direction approximately perpendicular to the Y-axis direction is defined as the X-axis direction, and the direction approximately perpendicular to both the X-axis and Y-axis directions is defined as the Z-axis direction. The X-axis, Y-axis, and Z-axis are mutually orthogonal. The plane directions of the first surface 1a and the second surface 1b of the heating furnace 1 are preferably in the XZ plane direction, which consists of the X-axis and Z-axis, but the first surface 1a and the second surface 1b are not limited to being parallel. For example, the first surface 1a may be parallel to the XZ plane, and the second surface 1b may be inclined with respect to the XZ plane.

[0049] In this disclosure, "approximately orthogonal" is not limited to 90°, but allows for a difference of 90° ± 5°.

[0050] <Heating furnace 1> The heating furnace 1 has an internal space into which the object to be processed 7 is supplied. In the heating furnace 1, the heating resistor 2, which is placed inside the heating furnace 1, heats up the object to be processed 7 supplied to the internal space of the heating furnace 1.

[0051] The material of the heating furnace 1 is not particularly limited, as long as it is stable in terms of surface temperature and atmosphere on the inside of the heating furnace 1, that is, on the side of the heating furnace 1 that houses the object to be processed 7.

[0052] For example, if the internal space of the heating furnace 1 is a nitrogen gas atmosphere and the inner surface temperature of the heating furnace 1 is 400°C or less, the material of the heating furnace 1 can be metals such as iron (Fe) and titanium (Ti); inorganic compounds such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), and mullite (3Al2O3·2SiO2) or ceramics thereof; or alloys such as stainless steel (e.g., SUS304, SUS304L, SUS316, SUS316L, etc.), Inconel (INCONEL®), and Hastelloy (HASTELLOY®). These can be used individually or in combination of two or more. Among these, when the internal space of the heating furnace 1 is in a nitrogen gas atmosphere and the inner surface temperature of the heating furnace 1 is 400°C or less, iron (Fe) and general stainless steels such as SUS304, SUS304L, SUS316, and SUS316L are preferred as the material of the heating furnace 1 from the viewpoint of material cost.

[0053] For example, if the internal space of the heating furnace 1 is a nitrogen gas atmosphere and the inner surface temperature of the heating furnace 1 is between 400°C and 700°C, the material of the heating furnace 1 may be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as stainless steel (e.g., SUS304, SUS304L, SUS316, SUS316L, etc.), Inconel (INCONEL®), Hastelloy (HASTELLOY®), etc.

[0054] For example, if the internal space of the heating furnace 1 is a nitrogen gas atmosphere and the inner surface temperature of the heating furnace 1 is between 700°C and 950°C, the material of the heating furnace 1 can be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as SUS310S, Inconel (INCONEL®), or Hastelloy (HASTELLOY®).

[0055] For example, if the internal space of the heating furnace 1 is a water vapor atmosphere and the inner surface temperature of the heating furnace 1 is 700°C or less, the material of the heating furnace 1 can be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as SUS316, SUS316L, SUS310S, Inconel (INCONEL®), Hastelloy (HASTELLOY®).

[0056] For example, if the internal space of the heating furnace 1 is a water vapor atmosphere and the inner surface temperature of the heating furnace 1 is between 700°C and 950°C, the material of the heating furnace 1 can be an inorganic compound such as alumina (Al2O3), zirconia (ZrO3), silicon carbide (SiC), silicon nitride (Si3N4), mullite (3Al2O3·2SiO2), or ceramics thereof; or an alloy such as Inconel (INCONEL®) or Hastelloy (HASTELLOY®).

[0057] The shape, structure, and size of the heating furnace 1 are not particularly limited, as long as they are capable of accommodating the heat-generating resistor 2 and the object to be processed 7.

[0058] Examples of the shape of the heating furnace 1 include cylindrical, rectangular parallelepiped, conical, frustoconical, and columnar shapes where the cross section parallel to the first surface 1a and / or second surface 1b of the heating furnace 1 is polygonal. Among these, it is preferable that the shape of the heating furnace 1 is such that the cross-sectional area of ​​the cross section parallel to the first surface 1a and / or second surface 1b continuously decreases in the direction from the material supply section 9 to the material removal section 10, that is, the cross-sectional shape of the heating furnace 1 in the Y-axis direction is tapered. When the cross-sectional shape of the heating furnace 1 in the Y-axis direction is tapered in this way, the flow velocity of the material to be processed 7 tends to increase from the material supply section 9 to the material removal section 10, improving the yield of the processed material 8 and minimizing the power consumption of the heating resistor 2.

[0059] Furthermore, when the material supply unit 9 is located at the top of the heating furnace 1 in the Y-axis direction, and the material removal unit 10 is located at the bottom of the heating furnace 1 in the Y-axis direction, if the cross-sectional shape of the heating furnace 1 in the Y-axis direction is such a tapered shape, the flow velocity of the material 7 tends to increase from the material supply unit 9 to the material removal unit 10, improving the yield of the material 8 and minimizing the power consumption of the heating resistor 2.

[0060] The size of the heating furnace 1 is not particularly limited, as long as it has a length and inner diameter that can accommodate the heating resistor 2 and the object to be processed 7.

[0061] <Heat-generating resistor 2> The heating resistor 2 is placed inside the heating furnace 1. The heating resistor 2 generates heat when power is supplied. In addition, since the electrical resistance of the heating resistor 2 changes with temperature changes, the temperature can be calculated by measuring the electrical resistance of the heating resistor 2.

[0062] There are no particular restrictions on the material of the heat-generating resistor 2, and it can be appropriately selected according to the purpose. For example, one or more metals selected from the group consisting of Kanthal, Tungsten, Molybdenum, and Tantalum can be used.

[0063] For example, when the heating element 2 is used under conditions of a nitrogen gas atmosphere when heating the object to be processed, the material of the heating element 2 is preferably one or more metals selected from the group consisting of Kanthal, tungsten, molybdenum, and tantalum. Also, when durability is required, such as when the heating element 2 is used under conditions of a water vapor atmosphere when heating the object to be processed, tantalum is preferably used as the material of the heating element 2.

[0064] Furthermore, the heating resistor 2 may be made by coating the surface of the material with a conductive ceramic such as tungsten oxide, molybdenum(VI) oxide, molybdenum disilide, lanthanum chromite, triiron tetroxide, copper(I) oxide, tin dioxide, or indium oxide, so as to be stable in the atmosphere when the object to be processed is heated.

[0065] From the viewpoint of not hindering the electrical connections and heat conduction between the particles of the heat-generating resistor 2, the thickness of the coating on the heat-generating resistor 2 is preferably 0.001 μm to 5 μm.

[0066] There are no particular limitations on the method for coating the surface of the heat-generating resistor 2. A known method can be appropriately selected depending on the material, shape, structure, and size of the heat-generating resistor 2. For example, a method of coating with a ceramic raw material such as tungsten oxide using a spray coating method, printing method, immersion method, dispenser coating method, etc. The heat-generating resistor 2 coated with the ceramic raw material can be fired using a known method to form a ceramic coating on its surface.

[0067] Furthermore, the heat-generating resistor 2 may be coated by a dry method such as physical vapor deposition, chemical vapor deposition, or sputtering, or the surface of the heat-generating resistor 2 itself may be oxidized to form an oxide film of the aforementioned thickness.

[0068] Furthermore, a catalyst may be supported on the surface of the heat-retaining resistor 2, depending on the purpose of the heat treatment. There are no particular restrictions on the type of catalyst, but examples include various zeolites and FCC (Fluid Catalytic Cracking) catalysts when the material to be treated 7 is one or more selected from the group consisting of naphtha, hydrocarbons, plastics, and biomass, and the material to be treated 8 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. The catalyst supported on the surface of the heat-retaining resistor 2 may be an unused catalyst or a catalyst that has been used in heat treatment one or more times.

[0069] Figure 3 shows a thread-shaped heat-generating resistor 2, but the shape, structure, and size of the heat-generating resistor 2 are not limited to this, and can be appropriately selected from known types depending on the purpose. For example, in addition to thread-shaped, other types include rod-shaped, drawn wire-shaped, film-shaped, plate-shaped, coil-shaped, double helix coil-shaped, mesh-shaped, foil-shaped, fabric-shaped, film-shaped, and layer-shaped. Furthermore, the heat treatment apparatus 100 may be equipped with one type of heat-generating resistor 2, or with two or more types.

[0070] For example, if the shape of the heat-generating resistor 2 is coil-shaped or double-helix coil-shaped, the heat-generating resistor 2 can be arranged without gaps in the heating furnace 1, making it easier for the material to be processed 7 to come into contact with the heat-generating resistor 2, and improving the yield of the processed material 8.

[0071] There are no particular restrictions on the number of heating resistors 2 in the heating furnace 1; there may be one or two or more. For example, if the heating resistor 2 is thread-shaped, two or more thread-shaped heating resistors 2 may be bundled together and used.

[0072] <Power supply section 3> The power supply unit 3 supplies power to the heating resistor 2. Specifically, the power supply unit 3 is electrically connected to the heating resistor 2 and heats the heating resistor 2 by supplying power to it.

[0073] The power supplied by the power supply unit 3 to the heating resistor 2 may be voltage or current. The current supplied to the heating resistor 2 may be direct current or alternating current, but from the viewpoint of minimizing energy consumption when controlling the temperature of the heating resistor 2, it is preferable to use alternating current without rectification when using commercial power.

[0074] There are no particular restrictions on the maximum current supplied to the heating resistor 2. It can be appropriately selected according to the desired temperature for heating the object to be processed 7, the size (diameter, thickness, etc.) of the heating resistor 2, the number of heating resistors 2, the tension of the heating resistors 2, etc. In order to bring the heating resistor 2 to the desired temperature, it is necessary to increase the maximum current. On the other hand, in order to suppress the deterioration of the heating resistor 2 and prevent it from burning out, it is necessary to decrease the maximum current.

[0075] The power supply unit 3 can be appropriately selected from known types, such as a constant voltage power supply or a constant current power supply.

[0076] There are no particular restrictions on the number of power supply units 3; there may be one or two or more.

[0077] <Current measurement section 4> The current measuring unit 4 measures the current flowing through the heating resistor 2 due to the power supplied to the heating resistor 2 from the power supply unit 3.

[0078] The current measuring unit 4 can be appropriately selected from known current measuring meters, etc., without any particular limitations, as long as it is capable of measuring the current flowing through the heating resistor 2.

[0079] <Voltage measurement section 5> The voltage measuring unit 5 measures the voltage applied to the heating resistor 2 by the power supplied to the heating resistor 2 from the power supply unit 3.

[0080] The voltage measurement unit 5 can be appropriately selected from known voltage meters, etc., without any particular limitations, as long as it is capable of measuring the voltage applied to the heating resistor 2. If the power supply unit 3 is an AC power source, it is preferable to measure the voltage using a microcontroller or the like with an A / D converter (analog-to-digital converter) having a sampling rate appropriate to the frequency.

[0081] Alternatively, the electrical resistance Rt of the heating resistor 2 may be measured directly using an analog multiplier or the like. In this case, the analog multiplier can also function as the current measuring unit 4, the voltage measuring unit 5, and the electrical resistance value calculation unit 62 within the control unit 6.

[0082] <Control Unit 6> The control unit 6 controls the power supplied from the power supply unit 3 to the heat-generating resistor 2. The control unit 6 includes a temperature setting unit 61, an electrical resistance value calculation unit 62, a temperature calculation unit 63, a temperature comparison unit 64, a determination unit 65, and a correction unit 66. The functions of these units are as described above.

[0083] The control unit 6 may further have other components that control each component of the heat treatment apparatus 100, as needed. Figure 4 is a functional block diagram showing an example of other components of the control unit of the heat treatment apparatus according to the first embodiment of this disclosure.

[0084] Other components of the control unit 6 include, for example, a CPU (central processing unit) 201, memory 202, display unit 203, input / output unit 204, communication unit 205, various controllers 206, and storage unit 207.

[0085] < <cpu201>> The CPU 201 reads various programs and data necessary for program execution from the storage unit 207 as needed and uses them.

[0086] <<Memory 202>> Memory 202 is used for various processes performed by CPU 201.

[0087] <<Display section 203>> The display unit 203 is a liquid crystal display that displays the operation screen, selection screen, etc., of the heat treatment apparatus 100.

[0088] <<I / O section 204>> The input / output unit 204 consists of an operation panel, keyboard, etc., for performing various operations such as inputting various data by the operator and outputting various data to a predetermined storage medium. It is preferable that the input of target temperature T information in the temperature setting unit 61 is performed in the input / output unit 204.

[0089] <<Communications Section 205>> The communications unit 205 handles data exchange via networks and other means.

[0090] <<Controller 206>> Examples of the various controllers 206 include a supply speed controller 206a and a take-out speed controller 206b.

[0091] -Supply rate controller 206a- The supply speed controller 206a controls the supply speed of the material to be processed 7 to the heating furnace 1 by the supply speed adjustment unit 15, which will be described later. The supply speed controller 206a receives the supply speed detection signal from the supply speed sensor 16 and can feedback control the supply speed of the material to be processed 7 using PID (Proportional-Integral-Differential) control or on-off control.

[0092] -Extraction speed controller 206b- The removal speed controller 206b controls the removal speed of the processed material 8 from the heating furnace 1 by the removal speed adjustment unit 17, which will be described later. The removal speed controller 206b receives the removal speed detection signal from the removal speed sensor 18 and can feedback control the removal speed of the processed material 8 using PID control or on-off control.

[0093] <<Storage section 207>> The memory unit 207 consists of a hard disk drive (HDD) and other components that store various programs executed by the CPU 201 and processing recipe data 208 necessary for program execution.

[0094] <Processing Material Supply Unit 9> The material to be processed supply unit 9 is connected to the heating furnace 1 and supplies the material to be processed 7 into the internal space of the heating furnace 1.

[0095] In this disclosure, "connection" of the material to be processed supply unit 9 to the heating furnace 1 means that the inside of the material to be processed supply unit 9 and the inside of the heating furnace 1 are in communication so that the material to be processed 7 can pass through them.

[0096] There are no particular restrictions on the material of the material supply unit 9 to be processed; for example, it can be appropriately selected from the same materials as the heating furnace 1, depending on the purpose.

[0097] The shape, structure, and size of the material supply unit 9 are not particularly limited as long as it can be connected to the heating furnace 1 and supply the material to be processed 7 to the heating furnace 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the heating furnace 1 has an opening, this opening can be used as the material supply unit 9.

[0098] There are no particular restrictions on the position of the material to be processed supply unit 9, as long as it can be connected to the heating furnace 1, and it can be appropriately selected according to the type of material to be processed 7. In Figure 3, the material to be processed supply unit 9 is shown to be placed on the side of the heating furnace 1 near the first surface 1a of the heating furnace 1, but the material to be processed supply unit 9 may be placed at any position on the side of the heating furnace 1, or it may be placed on the first surface 1a of the heating furnace 1, or it may be placed on the second surface 1b of the heating furnace 1.

[0099] -Item to be processed 7- There are no particular restrictions on the materials to be processed (7), and they can be appropriately selected depending on the purpose. Examples include naphtha, hydrocarbons, plastics, and biomass.

[0100] <Processing material removal section 10> The processed material removal unit 10 is connected to the heating furnace 1 and removes the processed material 8 that has been processed in the heating furnace 1.

[0101] In this disclosure, "connection" of the processed material removal unit 10 to the heating furnace 1 means that the inside of the processed material removal unit 10 and the inside of the heating furnace 1 are in communication so that the processed material 8 can pass through them.

[0102] There are no particular restrictions on the material of the material removal section 10; for example, it can be appropriately selected from the same materials as the heating furnace 1, depending on the purpose.

[0103] The shape, structure, and size of the processed material removal section 10 are not particularly limited as long as the processed material 8 processed in the heating furnace 1 can be removed, and can be appropriately selected according to the purpose. Examples include cylindrical shapes and rectangular parallelepipeds. Furthermore, if a part of the heating furnace 1 has an opening, this opening can also be used as the processed material removal section 10.

[0104] The position of the material removal unit 10 is not particularly restricted as long as it can be connected to the heating furnace 1, and can be appropriately selected according to the type of material to be processed 8. Figure 3 shows the material removal unit 10 being placed on the side of the heating furnace 1 near the second surface 1b of the heating furnace 1, but the material removal unit 10 may be placed at any position on the side of the heating furnace 1, or it may be placed on the first surface 1a of the heating furnace 1, or it may be placed on the second surface 1b of the heating furnace 1.

[0105] In the heating furnace 1, processed material 8 is generated from the material to be processed 7, so the material to be processed 7 and processed material 8 may be mixed inside the heating furnace 1. Therefore, the processed material removal unit 10 may remove not only processed material 8 but also a mixture of processed material 8 and material to be processed 7. In addition, if by-products are generated inside the heating furnace 1, the processed material removal unit 10 may also remove the by-products.

[0106] Furthermore, when the heating furnace 1 is used as a batch reaction vessel, the material supply unit 9 and the material removal unit 10 may be the same component. That is, a single component located in the same position may serve as both the material supply unit 9, which supplies the material 7 to the heating furnace 1, and the material removal unit 10, which removes the processed material 8 from the heating furnace 1. In this case, both the supply speed adjustment unit 15 and the removal speed adjustment unit 17, which will be described later, are also a single component located in the same position.

[0107] -Processed item 8- There are no particular restrictions on the processed material 8, and it can be appropriately selected depending on the type of object to be processed 7. For example, if the object to be processed 7 is plastic, the processed material 8 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. Therefore, the heat treatment apparatus 100 can be suitably used as a production apparatus for at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. In the case of the object to be processed 7 being plastic, the processed material 8 may also contain by-products in addition to at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons. In that case, the processed material 8 includes at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, as well as the by-products.

[0108] <Other components> Other components are not particularly limited as long as they do not impair the effects of the heat treatment apparatus according to the first embodiment of this disclosure. Examples include lead wires 11a, 11b, outer casing 12, sealing portion 13, current, voltage, or signal input terminal 14, supply speed adjustment unit 15, supply speed sensor 16, extraction speed adjustment unit 17, extraction speed sensor 18, and the like.

[0109] <<Lead wires 11a, 11b>> Lead wires 11a and 11b are wires that electrically connect the heating resistor 2 to the power supply unit 3, the current measurement unit 4, or the voltage measurement unit 5.

[0110] For the lead wires 11a and 11b, it is preferable to use materials that have conductivity and sliding properties. For example, carbon brushes commonly used in motors (e.g., manufactured by Fuji Carbon Manufacturing Co., Ltd.), ceramics, metals, etc., can be used.

[0111] <<Exterior 12>> The outer casing 12 connects to the heating furnace 1 and encloses the heating resistor 2, lead wires 11a and 11b, etc., outside the heating furnace 1. This protects the heating resistor 2 and lead wires 11a and 11b outside the heating furnace 1. In addition, since the heating resistor 2 is not exposed, the heat treatment apparatus 100 is easy to handle.

[0112] In this disclosure, "connecting" the outer casing 12 to the heating furnace 1 means that the inside of the outer casing 12 and the inside of the heating furnace 1 are in communication so that the heating resistor 2 and lead wires 11a and 11b can be housed inside.

[0113] There are no particular restrictions on the material of the exterior 12; for example, it can be appropriately selected from the same materials as those used for the heating furnace 1, depending on the purpose.

[0114] The shape, structure, and size of the outer casing 12 are not particularly limited as long as it can be connected to the heating furnace 1 and enclose the heating resistor 2, lead wires 11a, 11b, etc., outside the heating furnace 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped.

[0115] There are no particular restrictions on the number of outer casings 12, and they can be appropriately selected depending on the type of heat-generating resistor 2. If the heat-generating resistor 2 is thread-like, for example, there can be two outer casings 12: one connected to the first surface 1a of the heating furnace 1, and another connected to the second surface 1b of the heating furnace 1.

[0116] <<Seal part 13>> The sealing portion 13 seals the space between the first surface 1a or the second surface 1b of the heating furnace 1 and the outer casing 12. The presence of the sealing portion 13 in the heat treatment apparatus 100 is preferable because it prevents the material to be processed 7 and the material to be processed 8 from leaking out of the heating furnace 1.

[0117] There are no particular restrictions on the material of the sealing portion 13, and it can be appropriately selected depending on the purpose. However, it is preferable that the material has thermal resistance to the temperature of the heating resistor 2, as well as resistance to the object to be processed 7 and the processed object 8. For example, a member that can generate a sealing gas such as nitrogen gas can be used.

[0118] There are no particular restrictions on the shape, structure, and size of the sealing portion 13, and they can be appropriately selected according to the purpose. However, it is preferable that the shape, structure, and size prevent the processed material 7 and the processed material 8 from leaking out of the heating furnace 1.

[0119] Specific examples of the sealing section 13 include the gas seal unit GU-10 series and GU-25 series (both manufactured by Kaneko Sangyo Co., Ltd.), and the N2 blanketing system (manufactured by Iwatani Corporation).

[0120] <<Current, voltage, or signal input terminal 14>> The current, voltage, or signal input terminal 14 is electrically connected to the heating resistor 2, and introduces current, voltage, or signals from the power supply unit 3 or the like to the heating resistor 2.

[0121] The input terminal 14 can be appropriately selected from known ones, for example, known current input terminals such as field-through (manufactured by Cosmo-Tech Co., Ltd.) can be used.

[0122] There are no particular restrictions on the number of input terminals 14; there may be two or more.

[0123] <<Feeding speed adjustment section 15>> The supply speed adjustment unit 15 adjusts the supply speed at which the material to be processed supply unit 9 supplies the material to be processed 7 to the heating furnace 1, or stops the material to be processed supply unit 9 from supplying the material to be processed 7 to the heating furnace 1.

[0124] For example, a known pump, a cock, etc., can be used as the supply speed adjustment unit 15.

[0125] <<Supply speed sensor 16>> The supply speed sensor 16 measures the supply speed of the material to be processed 7 by the supply speed adjustment unit 15. The supply speed sensor 16 is not particularly limited as long as it can accurately measure the supply speed of the material to be processed 7 by the supply speed adjustment unit 15; for example, a known flow sensor for liquids or gases can be used.

[0126] The supply speed detection signal from the supply speed sensor 16 is suitably transmitted to the supply speed controller 206a of the control unit 6. The heat treatment apparatus 100 is preferable because it has a supply speed sensor 16, which improves the yield of the processed material 8 and minimizes the power consumption of the heating resistor 2, and the supply speed controller 206a can provide feedback control of the supply speed of the processed material supply unit 9.

[0127] <<Removal speed adjustment unit 17>> The removal speed adjustment unit 17 adjusts the removal speed at which the processed material removal unit 10 removes the processed material 8 from the heating furnace 1, or stops the processed material removal unit 10 from removing the processed material 8 from the heating furnace 1.

[0128] For example, a known pump, a cock, etc., can be used as the extraction speed adjustment unit 17.

[0129] By adjusting the supply of the material to be processed 7 to the heating furnace 1 by the supply rate adjustment unit 15 and the removal of the processed material 8 from the heating furnace 1 by the removal rate adjustment unit 17, the heating furnace 1 can be used as a batch reaction vessel or a continuous reaction vessel.

[0130] For example, by stopping the removal of the material 8 from the heating furnace 1 by the removal speed adjustment unit 17, supplying a certain amount of the material to be processed 7 to the heating furnace 1 by the supply speed adjustment unit 15, then stopping the supply of the material to be processed 7 to the heating furnace 1 by the supply speed adjustment unit 15, and then heating the material to be processed 7 with the heating resistor 2, the heating furnace 1 can be used as a batch reaction vessel to perform a batch reaction.

[0131] Furthermore, for example, if the removal speed adjustment unit 17 continuously removes the processed material 8 from the heating furnace 1, while the supply speed adjustment unit 15 continuously supplies the material to be processed 7 to the heating furnace 1, the heating furnace 1 can be used as a continuous reaction vessel to carry out a continuous reaction.

[0132] <<Removal speed sensor 18>> The extraction speed sensor 18 measures the extraction speed of the processed material 8 by the extraction speed adjustment unit 17. The extraction speed sensor 18 is not particularly limited as long as it can accurately measure the extraction speed of the processed material 8 by the extraction speed adjustment unit 17; for example, a known flow sensor for liquids or gases can be used.

[0133] The extraction speed detection signal from the extraction speed sensor 18 is suitably transmitted to the extraction speed controller 206b of the control unit 6. The inclusion of the extraction speed sensor 18 in the heat treatment apparatus 100 is preferable because it improves the yield of the processed material 8 and minimizes the power consumption of the heating resistor 2, and the extraction speed controller 206b allows for feedback control of the extraction speed of the processed material extraction unit 10.

[0134] Next, we will explain specific examples of the operation of the heat treatment apparatus 100 according to the first embodiment, in addition to the matters described above regarding the operating principle of the heat treatment apparatus according to one embodiment of this disclosure.

[0135] Power is supplied from the power supply unit 3 to the heating resistor 2, causing the heating resistor 2 to heat up in the internal space. The material to be processed 7 is then supplied from the material to be processed supply unit 9. At this time, the supply speed of the material to be processed 7 into the internal space is adjusted by the supply speed adjustment unit 15. The supply speed of the material to be processed 7 into the internal space is also measured by the supply speed sensor 16, and the supply speed detection signal is transmitted to the gas supply speed controller 206c of the control unit 6 for control.

[0136] Within the internal space, the object to be processed 7 and the heating resistor 2 come into contact, causing the object to be processed 7 to be heated and thermally decomposed, thereby generating the processed material 8. The temperature control at this time is as described in the operating principle of the heat treatment apparatus according to one embodiment of this disclosure.

[0137] In the case of a batch reaction, the material removal unit 10 operates after a desired time has elapsed since the supply of the material to be processed 7. In the case of a continuous reaction, the material removal unit 10 operates together with the material supply unit 9. As a result, the material 8 is removed from the material removal unit 10. At this time, the removal speed adjustment unit 17 adjusts the removal speed of the material 8 from the internal space. The removal speed of the material 8 is measured by the removal speed sensor 18, and the removal speed detection signal is transmitted to the removal speed controller 206b of the control unit 200 for control.

[0138] In a continuous reaction, if the supply rate of the material to be processed 7 exceeds the removal rate of the material to be processed 8, and the material to be processed 7 in the internal space is about to overflow, feedback control slows down the supply rate of the material to be processed 7 or speeds up the removal rate of the material to be processed 8. This allows a constant amount of the material to be processed 7 to come into contact with the heat-generating resistor 2.

[0139] These operations can be stored in the storage unit 207 as processing recipe data 208, and the desired reaction conditions (processing recipe data 208) can be read from the storage unit 207 and used as needed.

[0140] [Second Embodiment] The heat treatment apparatus according to the second embodiment of this disclosure is the same as the heat treatment apparatus according to the first embodiment of this disclosure, except that it further comprises a gas supply unit.

[0141] Figure 5 is a schematic cross-sectional view showing an example of a heating furnace of a heat treatment apparatus according to the second embodiment of this disclosure.

[0142] <Gas supply unit 20> The gas supply unit 20 is connected to the heating furnace 1 and supplies gas 21 to the internal space of the heating furnace 1.

[0143] In this disclosure, "connection" of the gas supply unit 20 to the heating furnace 1 means that the inside of the gas supply unit 20 and the inside of the heating furnace 1 are in communication so that gas 21 can pass through them.

[0144] There are no particular restrictions on the material of the gas supply unit 20; for example, it can be appropriately selected from the same materials as those used for the heating furnace 1, depending on the purpose.

[0145] The shape, structure, and size of the gas supply unit 20 are not particularly limited as long as it can be connected to the heating furnace 1 and supply gas 21 to the heating furnace 1. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped. Also, if a part of the heating furnace 1 has an opening, this opening can be used as the gas supply unit 20.

[0146] There are no particular restrictions on the position of the gas supply unit 20, as long as it can be connected to the heating furnace 1, and it can be appropriately selected according to the type of material to be processed 7. In Figure 5, the gas supply unit 20 is shown to be placed on the side of the heating furnace 1 near the first surface 1a of the heating furnace 1, but the gas supply unit 20 may be placed at any position on the side of the heating furnace 1, on the first surface 1a of the heating furnace 1, or on the second surface 1b of the heating furnace 1.

[0147] Furthermore, the material to be processed supply unit 9 and the gas supply unit 20 may be the same component. That is, a single component located in the same position may be both the material to be processed supply unit 9, which supplies the material to be processed 7 to the heating furnace 1, and the gas supply unit 20, which supplies the gas 21 to the heating furnace 1. In this case, both the supply speed adjustment unit 15 and the gas supply speed adjustment unit 22 are a single component located in the same position.

[0148] -Gas 21- Examples of gas 21 include inert gases and oxygen. There are no particular restrictions on the type of inert gas, and it can be appropriately selected depending on the type of material to be processed 7, but it is preferable to use one that is stable in the temperature range heated by the heating furnace 1.

[0149] Specific examples of inert gases include nitrogen gas, water vapor, carbon dioxide, and noble gases. These may be used individually or in combination of two or more. Among these, one or more gases selected from the group consisting of nitrogen gas and water vapor are preferred as inert gases because they are inexpensive, with nitrogen gas being more preferred.

[0150] When the gas 21 is an inert gas or water vapor, it can be suitably used when heating the object to be treated 7. This prevents oxidation of the object to be treated 8.

[0151] When gas 21 is oxygen, for example, synthesis gas can be suitably obtained by processing plastics, etc. Also, when gas 21 is oxygen, for example, by stopping the supply of the material to be processed 7 into the device and introducing oxygen to heat it, it can be suitably used to heat and remove coking attached to the heat-generating resistor 2.

[0152] The heat treatment apparatus 100 according to the second embodiment of this disclosure may also include other components such as a gas supply rate adjustment unit 22, a gas supply rate sensor 23, and a gas supply rate controller 206c as one of the various controllers 206 in the control unit 6.

[0153] Figure 6 is a functional block diagram showing an example of other components of the control unit of a heat treatment apparatus according to the second embodiment of this disclosure.

[0154] <Gas supply rate adjustment unit 22> The gas supply rate adjustment unit 22 adjusts the supply rate at which the gas supply unit 20 supplies gas 21 to the heating furnace 1, or stops the gas supply unit 20 from supplying gas 21 to the heating furnace 1.

[0155] For example, a known pump, a cock, etc., can be used as the gas supply rate adjustment unit 22.

[0156] The rate at which gas 21 is supplied to the heating furnace 1 by the gas supply rate adjustment unit 22 can be adjusted by the gas supply rate controller 206c of the control unit 6.

[0157] <Gas supply rate sensor 23> The gas supply rate sensor 23 measures the supply rate of gas 21 by the gas supply rate adjustment unit 22. The gas supply rate sensor 23 is not particularly limited as long as it can accurately measure the supply rate of gas 21 by the gas supply rate adjustment unit 22; for example, a known flow sensor for liquids or gases can be used.

[0158] <Control Unit 6> <<Controller 206>> -Gas supply rate controller 206c- The gas supply rate controller 206c controls the supply rate of gas 21 by the gas supply rate adjustment unit 22. The gas supply rate controller 206c receives an inert gas supply rate detection signal from the gas supply rate sensor 23 and can feedback control the supply amount of gas 21 using PID control or on-off control.

[0159] Next, we will explain a specific example of the operation of the heat treatment apparatus 100 according to the second embodiment, highlighting the differences from the heat treatment apparatus 100 according to the first embodiment.

[0160] Gas 21, preferably an inert gas, is supplied from the gas supply unit 20 to the internal space of the heating furnace 1. At this time, the gas supply rate adjustment unit 22 adjusts the supply rate of gas 21 into the heating furnace 1. The supply rate of gas 21 is measured by the gas supply rate sensor 23, and the inert gas supply rate detection signal is transmitted to the gas supply rate controller 206c of the control unit 6 for control.

[0161] The gas 21 supplied into the heating furnace 1 generates turbulence around the material to be processed 7. This causes the material to come into frequent contact with the heat-generating resistor 2, further improving the production efficiency of the processed material 8.

[0162] The gas 21 supplied to the internal space of the heating furnace 1 is discharged to the outside of the heating furnace 1 from the processed material removal section 10 together with the processed material 8. Therefore, in the heat treatment apparatus 100 according to the second embodiment, the gas 21 is discharged from the processed material removal section 10 together with the removal of the processed material 8. For this reason, the discharge rate of the gas 21 from the processed material removal section 10 is adjusted by the removal rate adjustment section 17 together with the removal rate of the processed material 8 from the heating furnace 1. The removal rates of the processed material 8 and the gas 21 are measured by the removal rate sensor 18, and the removal rate detection signal is transmitted to the removal rate controller 206b of the control unit 6.

[0163] [Third Embodiment] The heat treatment apparatus according to the third embodiment of this disclosure is the same as the heat treatment apparatus according to the first embodiment of this disclosure or the heat treatment apparatus according to the second embodiment of this disclosure, except that it further comprises a material recovery unit and a cooling unit.

[0164] Figure 7 is a schematic cross-sectional view showing an example of a heating furnace, a material recovery unit, and a cooling unit of a heat treatment apparatus according to the third embodiment of this disclosure.

[0165] <Processing and collection section 30> The processed material collection unit 30 is connected to the processed material removal unit 10 and collects the processed material 8. The processed material collection unit 30 may consist of only one unit or may consist of two or more units.

[0166] There are no particular restrictions on the structure, shape, material, and size of the processed material collection section 30, and they can be appropriately selected according to the purpose and the type of processed material 8, including known containers.

[0167] Furthermore, the treated material recovery section 30 may contain a solvent capable of separating useful components from the treated material 8. There are no particular restrictions on the solvent, and it can be appropriately selected depending on the type of useful components to be recovered. For example, if plastic is used as the material to be treated 7, solvents for extracting basic chemicals, such as olefins or aromatic compounds having 2 to 5 carbon atoms, from the treated material 8 as a decomposition product of the plastic include ethanol, hexane, dimethylformamide, cyclopentane, and water.

[0168] <Cooling section 31> The cooling unit 31 is positioned between the heating furnace 1 and the processed material recovery unit 30. The cooling unit 31 is a component that cools the processed material 8. This can sometimes be used to obtain the desired components from the processed material 8. For example, when using plastic as the material to be processed 7, and extracting basic chemicals, such as olefins or aromatic compounds having 2 to 5 carbon atoms, from the processed material 8 which is a decomposition product of the plastic, it is preferable to cool the processed material 8 in the cooling unit 31.

[0169] The cooling unit 31 includes a cooling trap 31a for cooling the workpiece 8 and a cooling section 31b for cooling the cooling trap 31a. The structure, shape, material, and size of the cooling trap 31a and the cooling section 31b are not particularly limited as long as they can cool the workpiece 8, and can be appropriately selected according to the purpose.

[0170] The cooling trap 31a may contain an organic solvent 31c for dissolving the material to be processed 8. The organic solvent 31c may condense useful components in the material to be processed 8, particularly liquid useful components. The organic solvent for dissolving the material to be processed 8 can be appropriately selected depending on the type of material to be processed 8 and the target components. For example, when using plastic as the material to be processed 7 and obtaining basic chemicals, such as olefins or aromatic compounds having 2 to 5 carbon atoms, from the material to be processed 8 as a decomposition product of the plastic, a non-aqueous solvent is preferred for the organic solvent 31c. Examples of non-aqueous solvents include aromatic organic solvents such as monochlorobenzene, o-dichlorobenzene, and mesitylene. It is preferable that the outlet of the material removal section 10 be placed in the organic solvent 31c so that the material to be processed 8 (e.g., the generated gas) bubbles in the organic solvent 31c.

[0171] Useful components dissolved in a non-aqueous solvent can sometimes be suitably separated by further distillation at atmospheric pressure.

[0172] The cooling section 31b is not particularly limited as long as it can cool the cooling trap 31a, and may, for example, contain a refrigerant 31d. Examples of refrigerant 31d include ice water.

[0173] The heat treatment apparatus 100 according to the third embodiment of this disclosure may also have other components, such as a pre-processing unit, a post-processing unit, a separation unit, etc. (not shown).

[0174] <Pre-processing> The pre-processing unit is a component that pre-processes the object to be processed 7. It is preferable that the pre-processing unit is connected to the object to be processed supply unit 9.

[0175] In this disclosure, "connecting" the pre-processing unit to the processing material supply unit 9 means that the inside of the pre-processing unit and the inside of the processing material supply unit 9 are in communication so that the processing material 7 can pass through them.

[0176] The pre-processing unit, for example, if the object to be processed 7 is plastic, performs the task of transforming the plastic into a form or state that is easily decomposed.

[0177] There are no particular restrictions on the material of the pre-processing section; for example, it can be appropriately selected from the same materials as those used for the pre-processing section, depending on the purpose.

[0178] The shape, structure, and size of the pre-processing unit are not particularly limited as long as it can be connected to the material supply unit 9 and perform pre-processing on the material to be processed 7. They can be appropriately selected according to the purpose, and examples include cylindrical and rectangular parallelepiped shapes.

[0179] <Post-processing> The post-processing unit is a component that decomposes unwanted components such as by-products from the processed material 8. It is preferable that the post-processing unit is connected to the processed material recovery unit 30.

[0180] In this disclosure, "connecting" the post-processing unit to the processed material recovery unit 30 means that the inside of the post-processing unit and the inside of the processed material recovery unit 30 are in communication so that the processed material 8 can pass through them.

[0181] The post-processing unit, for example, removes paraffin, halogens, etc. generated from plastic when the object to be processed 7 is plastic.

[0182] There are no particular restrictions on the material of the post-processing section; for example, it can be appropriately selected from the same materials as those used for the post-processing section, depending on the purpose.

[0183] The shape, structure, and size of the post-processing unit are not particularly limited as long as it can be connected to the processed material recovery unit 30 and decompose unwanted components in the processed material 8. They can be appropriately selected according to the purpose, for example, cylindrical or rectangular parallelepiped shapes.

[0184] <Separation Processing Unit> The separation processing unit is a component that separates useful components from the processed material 8 collected in the processed material recovery unit 30. It is preferable that the separation processing unit is connected to the processed material recovery unit 30 or the post-processing unit.

[0185] In this disclosure, "connecting" the separation processing unit to the processed material recovery unit 30 or the post-processing unit means that the inside of the post-separation processing unit and the inside of the processed material recovery unit 30 or the post-processing unit are in communication so that the processed material 8 can pass through them.

[0186] There are no particular restrictions on the material of the separation processing unit; for example, it can be appropriately selected from the same materials as those used for the separation processing unit, depending on the purpose.

[0187] The shape, structure, and size of the separation processing unit are not particularly limited as long as it can be connected to the processed material recovery unit 30 or the post-processing unit and separate useful components from the processed material 8. They can be appropriately selected according to the purpose, for example, a cylindrical shape or a rectangular parallelepiped.

[0188] The separation unit includes, for example, a pressurized distillation apparatus. This separates the useful components from the treated material 8. For example, if the object to be treated 7 is plastic, and the treated material 8, which is a decomposition product of the plastic, contains olefins or aromatic compounds having 2 to 5 carbon atoms, these useful components can be suitably separated from the treated material 8 by pressurized distillation.

[0189] Next, we will explain a specific example of the operation of the heat treatment apparatus 100 according to the third embodiment, and the differences from the heat treatment apparatus 100 according to the third embodiment.

[0190] The processed material 8 removed from the processed material removal section 10 is transferred to the cooling trap 31a of the cooling section 31. When the processed material 8 is cooled in the cooling section 31, which contains organic solvent 31c cooled by the refrigerant 31d in the cold-insulation section 31b, components in the processed material 8 that can dissolve in the organic solvent 31c condense in the organic solvent 31c. On the other hand, components in the processed material 8 that do not dissolve in the organic solvent 31c are transferred as is to the processed material recovery section 30. As a result, the target components can be recovered in the organic solvent 31c and in the processed material recovery section 30.

[0191] If necessary, the material to be processed 7 is pre-processed in a pre-processing unit before being supplied to the processing unit. Furthermore, the processed material 8 recovered in the processed material recovery unit 30 undergoes post-processing in a post-processing unit according to the type of processed material 8 to decompose unwanted components. Additionally, the processed material 8 recovered in the processed material recovery unit 30, or the processed material 8 from which unwanted components have been decomposed in the post-processing unit, undergoes decomposition processing in a separation unit according to the type of useful components to separate the useful components within the processed material 8.

[0192] (Heat treatment method) A heat treatment method according to one embodiment of this disclosure is a method of heat treating an object to be treated using a heat treatment apparatus according to one embodiment of this disclosure.

[0193] Figure 8 is an example of a flowchart of a heat treatment method according to one embodiment of the present disclosure.

[0194] A heat treatment method according to one embodiment of the present disclosure preferably includes S2, which is the process of continuously heating the object to be treated with a heat-generating resistor. A heat treatment method according to one embodiment of the present disclosure may further include, as necessary, other processes such as supplying the object to be treated S1 and removing the object S3.

[0195] <Supplying S1> Supply S1 involves supplying the material to be processed 7 from the material to be processed supply unit 9 to the heating furnace 1.

[0196] There are no particular restrictions on the supply speed of the material to be processed 7 to the heating furnace 1, and it can be appropriately selected depending on the type of material to be processed 7.

[0197] <Heat it S2> Heating S2 involves continuously heating the object to be processed 7 with the heat-generating resistor 2 inside the heating furnace 1. Heating S2 is performed by supplying current to the heat-generating resistor 2 inside the furnace using the power supply unit 3.

[0198] The supplying process S1 and the heating process S2 may be performed separately or simultaneously. However, from the viewpoint of improving the yield of the processed material 8, it is preferable to first perform the heating process S2, bring the heating furnace 1 to a desired temperature according to the type of material to be processed 7, and then perform the supplying process S1 and the heating process S2 simultaneously.

[0199] In heating S2, it is preferable to use a heat-generating resistor 2 whose temperature coefficient of resistance at the target temperature T (°C) is 1,000 ppm / °C or higher.

[0200] There are no particular restrictions on the heating temperature in heating S2, and it can be appropriately selected depending on the type of material to be treated 7 and the target treated product 8. For example, if the heating furnace 1 is made of plastic and the treated product 8 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, the heating temperature in heating S2 is preferably 400°C or higher, and if heating S2 is carried out without a catalyst, it is more preferably 650°C to 950°C from the viewpoint of yield of the treated product 8, and even more preferably 700°C to 900°C.

[0201] Furthermore, the heating temperature in heating S2 should be controlled so that the inner surface of the heating furnace 1 does not become so hot that the material cannot be used stably. The relationship between the heating temperature in heating S2 and the temperature of the inner surface of the heating furnace 1 varies depending on various conditions such as the distance between the inner surface of the heating furnace 1 and the heat-generating resistor 2, the type of inert gas used as gas 21, and the supply rate of the inert gas. When the inert gas is nitrogen gas or water vapor, and the distance between the inner surface of the heating furnace 1 and the heat-generating resistor 2 is 2 mm or more and 15 mm or less, a heating temperature of 750°C or less is preferable because the temperature of the inner surface of the heating furnace 1 does not rise too high, and SUS316 stainless steel or SUS316L stainless steel can be used.

[0202] In heating S2, from the viewpoint of improving the yield of the processed material 8 and minimizing the power consumption of the heating resistor 2, it is preferable that the material to be processed 7 becomes turbulent in the heating furnace 1 and comes into frequent contact with the heating resistor 2. Turbulence of the material to be processed 7 in the heating furnace 1 can be suitably achieved by supplying an inert gas as gas 21 into the heating furnace 1. In this case, it is preferable to use the heat treatment apparatus according to the second embodiment of this disclosure or the heat treatment apparatus according to the third embodiment of this disclosure.

[0203] When the object to be processed 7 is plastic, and the processed material 8 is at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, and heating S2 is performed without a catalyst, the supply rate of the inert gas v(m 3 The rate ( / min) is preferably such that the residence time N (seconds) in the inert gas, calculated by the following formula 5, is 0.05 to 10, and more preferably 0.1 to 4.

[0204]

number

[0205] <Taking it out S3> In removal step S3, the heated processed object 8 is removed from the processed object removal unit 10. <Other processing> A heat treatment method according to one embodiment of the present disclosure may further include, as necessary, other processes besides supplying S1, heating S2, and removing S3. These other processes are not particularly limited and can be appropriately selected depending on the purpose. Examples include recovering useful components from the treated material 8, separating useful components, etc. The process may also include pre-treating the treated material 7 by a known method depending on the type of treated material 7 to facilitate thermal decomposition by heating S2, post-treating the treated material 8 by a known method depending on the type of treated material 8 to remove by-products, or decomposing only the useful components from the treated material 8.

[0206] (Methods for manufacturing chemicals) A method for producing a chemical product according to one embodiment of the present disclosure is a method for producing a chemical product by heat-treating a target object using a heat treatment apparatus according to one embodiment of the present disclosure. In the method for producing a chemical product according to one embodiment of the present disclosure, the target object 7 is a plastic, and the treated product 8 includes at least one chemical product selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons.

[0207] Figure 9 is an example of a flowchart of a method for producing a chemical product according to one embodiment of the present disclosure.

[0208] A method for producing a chemical product according to one embodiment of the present disclosure preferably includes S14, which is the process of continuously heating the material to be processed with a heat-retaining resistor. A method for producing a chemical product according to one embodiment of the present disclosure may further include, as necessary, other processes such as pre-treatment S11, decomposition treatment S12, supplying the material to be processed S13, removing the material S15, recovering useful components from the material S16, post-treatment S17, and separation of useful components S18.

[0209] In the method for producing a chemical product according to one embodiment of the present disclosure, supplying S13, heating S14, and removing S15 are the same as supplying S1, heating S2, and removing S3 in the heat treatment method according to one embodiment of the present disclosure, and are as described in the (heat treatment method) section above.

[0210] An example of a method for producing a chemical according to one embodiment of the present disclosure is described below, in which the object to be treated 7 is a plastic, and the processed product 8 obtained by heat-treating the object to be treated 7 contains at least one chemical selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons, and involves pre-treatment S11, decomposition treatment S12, recovery of useful components in the processed product S16, post-treatment S17, and separation of useful components S18.

[0211] <<Pre-treatment S11>> Pretreatment S11 is a pretreatment of the plastic before supplying S13 and heating S14. Pretreatment S11 is performed by a pretreatment unit.

[0212] By pre-treating the plastic in S11 to a form or state that is easily decomposed, the plastic can be decomposed more efficiently during heating in S14.

[0213] Examples of pretreatments performed in S11 include plastic crushing, pelletizing (chip) the crushed plastic, and plastic melting.

[0214] There are no particular restrictions on the method for obtaining pulverized plastic, and any conventionally known method can be appropriately selected. For example, a method of crushing plastic with a pulverizer to obtain powder or flakes can be used.

[0215] Furthermore, there are no particular restrictions on the method of pelletizing (chipping) the pulverized material, and any conventionally known method can be appropriately selected. For example, one method is to melt-extrude the pulverized material and then cut the strand-shaped melt-extruded material to obtain chipped raw material.

[0216] There are no particular restrictions on the melting treatment of the plastic, and a conventionally known method can be appropriately selected. However, it is preferable to treat the plastic at a temperature above its melting point and below its thermal decomposition temperature, and more preferably at a temperature of 100°C to 300°C.

[0217] The plastic can also be subjected to heat treatment as a molten material; for example, it can be supplied to a heating furnace 1 using a melt extruder.

[0218] <<Disassembly process S12>> The decomposition process S12 is a process of decomposing the plastic before subjecting it to supplying S13 and heating S14. The decomposition process S12 can preferably be carried out by a pre-treatment process.

[0219] In the decomposition process S12, the plastic may be the raw material as is, or it may be the plastic that has been pre-treated in the pre-treatment process S11. Therefore, in the method for producing a chemical product according to one embodiment of this disclosure, the pre-treatment process S11 and the decomposition process S12, which are other processes performed as needed, may be either performed individually or both.

[0220] There are no particular restrictions on the method of decomposing plastic, and any conventionally known method can be appropriately selected. For example, one method is to heat-treat the plastic at a temperature above its decomposition temperature (e.g., 200°C or higher).

[0221] Thus, the object to be processed 7 can also be the decomposed plastic material obtained in the decomposition process S12, and the heating furnace 1 can be used.

[0222] <<Collection S16>> Recovery S16 is a process of recovering gases, which are products containing ethylene and other lower olefins obtained by thermally decomposing the plastic by heating S14, and liquid substances as needed. Recovery S16 is carried out by the processed material recovery unit 30 and the cooling unit 31.

[0223] There are no particular restrictions on the recovery method, and a method can be appropriately selected from known methods depending on the type of product obtained. For example, gaseous products can be separated by pressurized distillation at atmospheric pressure, and liquid hydrocarbons can be separated by atmospheric pressure and reduced pressure distillation.

[0224] <<Post-processing steps S17>> Post-treatment S17 is a process to decompose the by-products generated by the thermal decomposition of the plastic by heating S14. Post-treatment S17 is performed in a post-treatment unit.

[0225] By-products generated by the thermal decomposition of plastics include, for example, paraffin and halogens.

[0226] Post-treatment methods performed in S17 include, for example, the removal of halogen compounds. Methods for removing halogen compounds include a fixed bed filled with an oxide or hydroxide of one metal selected from alkali metals and alkaline earth metals, or a method of passing an aqueous solution of the oxide or hydroxide of the said metal through the bed.

[0227] <<Separation S18>> The separation process S18 is a process of separating useful components from the gas and liquid substances recovered in the recovery process S16. Alternatively, the separation process S18 may be a process of further removing unwanted components from the post-treatment product obtained in the post-treatment process S17. The separation process is performed by the separation unit.

[0228] By decomposing plastics, useful components such as ethylene and other lower olefins may be produced, as well as by-components such as paraffins with 2 to 5 carbon atoms.

[0229] In separation S18, there are no particular restrictions on the method used to separate the useful components from the minor components, and a known method can be appropriately selected depending on the type of product obtained or the type of minor components.

[0230] As described above, this disclosure has been explained based on specific embodiments and examples, but these embodiments and examples are merely presented as examples, and this disclosure is not limited to the above embodiments and examples. The above embodiments can be implemented in various other forms, and various combinations, omissions, substitutions, additions, modifications, etc., are possible without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]

[0231] 1 … Heating furnace 2. Heat-generating resistor 3 … Power supply section 4 … Current measurement unit 5 … Voltage measurement unit 6 … Control unit 7 … Object to be processed 8 … Processed object 9 … Object to be processed supply unit 10 … Processed object extraction unit 11a, 11b … Lead wires 12 … Exterior 13 … Sealing part 14 … Introduction terminal 15 … Supply speed adjustment unit 16 … Supply speed sensor 17 … Extraction speed adjustment unit 18 … Extraction speed sensor 20 … Gas supply unit 21 … Gas 22 … Gas supply speed adjustment unit 23 … Gas supply speed sensor 30 … Processed object recovery unit 31 … Cooling unit 31a … Cooling trap<\(0000901\)>31b … Cold insulation part 31c … Organic solvent 31d … Refrigerant 61 … Temperature setting unit 62 … Electrical resistance value calculation unit 63 … Temperature calculation unit 64 … Temperature comparison unit 65 … Decision unit 66 … Correction unit[[ID=\(62\)]] 100 … Heat treatment device 201 … CPU 202 … Memory 203 … Display unit 204 … Input / output unit 205 … Communication unit 206 … Controller 206a … Supply speed controller 206b … Extraction speed controller<\(0000919\)>206c … Gas supply speed controller 207 … Storage unit Note: There seems to be an error in the original text where and are not properly formatted in the provided text. I've left them as they are in the translation but they might need to be corrected in the original source. Also, I'm not sure if the "…" in the original should be translated exactly as "…" or if there's a more appropriate English equivalent. I've left it as is for consistency with the original. 208… Processing recipe data

Claims

1. A heating furnace having an internal space into which the material to be processed is supplied, A heating resistor placed inside the aforementioned heating furnace, A power supply unit that supplies power to the aforementioned heat-generating resistor, A current measuring unit that measures the current flowing through the heating resistor due to the power supplied to the heating resistor from the power supply unit, A voltage measuring unit that measures the voltage applied to the heating resistor by the power supplied to the heating resistor from the power supply unit, A control unit that controls the power supplied from the power supply unit to the heating resistor, Equipped with, The control unit, A temperature setting unit for setting a target temperature for heating the object to be processed, An electrical resistance value calculation unit calculates the electrical resistance value of the heating resistor from the current measured by the current measuring unit and the voltage measured by the voltage measuring unit. A temperature calculation unit calculates the temperature of the heating resistor based on the electrical resistance value calculated by the electrical resistance value calculation unit, A temperature comparison unit compares the temperature of the heating resistor calculated by the temperature calculation unit with the target temperature set by the temperature setting unit. A determination unit determines the amount of power to be supplied from the power supply unit to the heating resistor based on the comparison results from the temperature comparison unit, A correction unit corrects the amount of power supplied from the power supply unit to the heating resistor based on the amount of power determined by the determination unit, A heat treatment apparatus characterized by having

2. A processing object supply unit connected to the heating furnace and supplying the processing object to the internal space of the heating furnace, A processing object removal unit connected to the heating furnace, which removes the processed object that has been heat-treated in the internal space of the heating furnace, The heat treatment apparatus according to claim 1, further comprising the following:

3. The heat treatment apparatus according to claim 1, further comprising a gas supply unit connected to the heating furnace and supplying gas to the internal space of the heating furnace.

4. A material recovery unit connected to the material removal unit for collecting the material, A cooling unit is disposed between the heating furnace and the processed material recovery unit. The heat treatment apparatus according to claim 2, further comprising the following:

5. The heat treatment apparatus according to claim 1, wherein the heat-generating resistor is one or more metals selected from the group consisting of Kanthal, tungsten, molybdenum, and tantalum.

6. The heat treatment apparatus according to claim 1, wherein the heat-generating resistor is in the form of a rod, thread, drawn wire, film, plate, coil, double helix coil, mesh, foil, fabric, film, or layer.

7. A heat treatment method characterized by heat-treating the object to be treated using a heat treatment apparatus described in any one of claims 1 to 6.

8. The heat treatment method according to claim 7, further comprising continuously heating the object to be treated with the heating resistor.

9. The heat treatment method according to claim 7, wherein the temperature coefficient of resistance of the heat-generating resistor at the target temperature is 1,000 ppm / °C or more.

10. A method for manufacturing chemical products, This includes heat-treating the object to be treated using the heat treatment apparatus described in any one of claims 1 to 6, The object to be processed is plastic, A method for producing a chemical product, characterized in that the chemical product comprises at least one chemical product selected from the group consisting of olefins having 2 to 5 carbon atoms and aromatic hydrocarbons.

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