Metallized ferrite planar transformer

Abstract

This invention provides a method for incorporating magnetic components into a printed circuit board (PCB) assembly. [Solution] A magnetic component assembly includes a first ferrite body having a first surface and a first metallized layer containing silver and glass frit disposed on the first surface. A printed circuit board includes a coil pattern and is provided with a second ferrite body having a second surface having a second metallized layer. The first ferrite body is disposed on the first side of the printed circuit board, and the second ferrite body is disposed on the second side, and the metallized layer is coupled to the coil pattern via a solder joint to enable power transmission between windings. The metallized layer provides both mechanical attachment and conductivity, eliminating a separate bonding process while maintaining an insulating capability of at least 1000 volts. The manufacturing method includes ultrasonic cleaning of the ferrite surface before applying the metallized layer by screen printing.

Description

Technical Field

[0001] The present disclosure generally relates to magnetic components and power electronics. More specifically, the present disclosure relates to transformers, magnetic components within printed circuit board assemblies, and methods of manufacturing electronic components. This field includes power conversion systems, isolation transformers, and surface mount technology for electronic assemblies. The present disclosure further relates to manufacturing processes for electronic components, particularly in the fields of power electronics and circuit board assembly technology.

Background Art

[0002] Power electronics and electronic assemblies generally require magnetic components for power conversion and signal isolation. In modern electronic device manufacturing, printed circuit board (PCB) assemblies incorporate various magnetic components that are important for device operation. Conventional manufacturing processes for incorporating magnetic components into PCB assemblies often involve multiple manufacturing steps and special assembly techniques.

[0003] The integration of magnetic components, particularly transformers, with printed circuit boards has become increasingly important in power electronics applications. Current manufacturing methods for attaching magnetic components to PCBs may involve adhesive-based processes, which can introduce manufacturing complexities including adhesive storage requirements, development of application patterns, and additional manufacturing cycle times.

[0004] Quality control and consistency of magnetic component assemblies remain important considerations in electronic device manufacturing. Variations in the assembly process can affect electrical performance characteristics and overall system design parameters. Furthermore, the increasing demand for high voltage insulation capabilities in power electronics has led to a need for reliable insulation solutions that can meet the increasing power requirements in modern applications.

[0005] The electronics industry continues to seek improved methods for integrating magnetic components into PCB assemblies, particularly techniques that can enhance manufacturing efficiency, reduce process complexity, and maintain consistent performance characteristics across the entire manufacturing unit. [Brief explanation of the drawing]

[0006] To facilitate the identification of any particular element or action description, the leading digit of the reference number refers to the number of the figure in which that element is first introduced.

[0007] [Figure 1] This figure shows a dimensional drawing of a ferrite disk component with a metallized surface, including multiple cross-sectional views, based on a specific example.

[0008] [Figure 2] This figure shows a transformer assembly in a specific example.

[0009] [Figure 3] This figure shows a transformer assembly in a specific example.

[0010] [Figure 4] This figure shows a transformer assembly containing metallized ferrite components, as in a specific example. [Modes for carrying out the invention]

[0011] Modern power electronics increasingly rely on planar magnetic components integrated into printed circuit board (PCB) assemblies for power conversion and signal isolation. Conventional methods for integrating magnetic components, particularly ferrite elements, into PCB assemblies typically utilize adhesive-based mounting processes. These conventional methods present several manufacturing challenges, including adhesive storage requirements, the development of appropriate application patterns, and increased production cycle times. Furthermore, variations in adhesive application can lead to inconsistent electrical performance between manufactured units.

[0012] This disclosure seeks to provide a solution to these manufacturing challenges through a magnetic component assembly that integrates a special metallization technique with a ferrite component. The assembly comprises a first ferrite body having a metallized surface on a first side of a printed circuit board and a second ferrite body having a metallized surface on a second side of the printed circuit board, with a coil pattern positioned between them.

[0013] In some examples, the ferrite body includes a disk-shaped structure with a diameter of approximately 20 millimeters. The ferrite material may include Siferrit or equivalent magnetic materials suitable for power electronics applications. The metallized layer may, in some examples, include silver combined with a glass frit material, achieving a minimum thickness of 5 micrometers to ensure appropriate electrical and mechanical properties.

[0014] In some examples, the metallization process involves ultrasonic cleaning of the ferrite surface followed by screen printing of silver and glass frit materials. The metallized surface can provide mechanical mounting points via solder joints and form electrical paths for current from the center of a coil pattern.

[0015] In some examples, the assembly provides electrical isolation capability of at least 1000 volts, making it suitable for high-voltage applications such as vehicle power supplies with batteries exceeding 500V. Direct soldering eliminates separate bonding processes while maintaining consistent electrical performance characteristics throughout the entire manufacturing unit.

[0016] In some cases, the metallized surface can incorporate additional helical patterns to increase inductance and improve the quality of the transformer. For example, in addition to having helices on the PCB substrate, the metallized layer can include additional helical patterns through which current traverses as it escapes from the center of the coil. These additional helices within the metallized layer increase inductance, thereby improving the overall quality and performance of the transformer.

[0017] Figure 100 shows a dimensional drawing of a ferrite disc part with a metallized surface, including multiple cross-sectional views, by a specific example. Figure 100 includes an example of measurements and tolerances for a disc-shaped ferrite body with a diameter of approximately 20 millimeters. Multiple cross-sectional views and detailed indicator symbols illustrate key features, including the metallized surface to which silver and glass frit materials are applied. This figure provides manufacturing-level specifications for surface finish, angles, and other dimensional requirements essential for manufacturing.

[0018] Figure 200 shows a transformer assembly according to a specific example. Figure 200 shows a coil pattern on a printed circuit board configured to receive ferrite bodies. For example, the ferrite bodies may be placed on both sides of the printed circuit board on the coil pattern, and the metallized surface of the ferrite bodies contacts the coil pattern on the PCB to form both mechanical and electrical connections.

[0019] Figure 300 shows a transformer assembly according to a specific example. Figure 300 shows a first ferrite disk that can be soldered onto a coil pattern on a first surface of the PCB (e.g., the coil pattern shown in Figure 200). Figure 300 also includes a depiction of a second ferrite disk to show a metallized surface. In some examples, the second ferrite disk may be soldered onto the second surface of the PCB, on the coil pattern on the second surface of the PCB.

[0020] Figure 4 is a figure 400 showing a transformer assembly including metallized ferrite components according to a specific example. As seen in Figure 400, the first and second ferrite bodies may be arranged on either side of a PCB (not shown) (not shown) with a coil pattern in between. The metallized surfaces of both ferrite bodies are bonded to the coil pattern via solder joints to form a single assembly that can provide at least 1000 volts of electrical insulation. Examples

[0021] Example 1 is a magnetic component assembly including a first ferrite body including a first surface, a first metallization layer on the first surface of the first ferrite body, the first metallization layer including silver and glass frit, a printed circuit board including a coil pattern, a second ferrite body including a second surface, and a second metallization layer on the second surface of the second ferrite body, wherein the first ferrite body is disposed on a first side of the printed circuit board, the second ferrite body is disposed on a second side of the printed circuit board, and the first and second metallization layers are coupled to the coil pattern via solder joints.

[0022] In Example 2, in the subject matter of Example 1, the first ferrite body includes a disk having a diameter of about 20 millimeters.

[0023] In Example 3, in the subject matter of Examples 1-2, the first metallization layer has a thickness of at least 5 micrometers.

[0024] In Example 4, in the subject matter of Examples 1-3, the first metallization layer includes a screen printing layer.

[0025] In Example 5, in the subject matter of Examples 1-4, the first surface includes a surface ultrasonically cleaned adjacent to the first metallization layer.

[0026] In Example 6, in the subject matter of Examples 1-5, the first metallization layer and the first ferrite body provide electrical insulation of at least 1000 volts.

[0027] In Example 7, a method of manufacturing a magnetic component assembly includes providing a first ferrite body including a first surface and a second ferrite body including a second surface, applying a first metallization layer including silver and glass frit to the first surface, applying a second metallization layer to the second surface, soldering the first metallization layer to a first coil pattern on a first side of a printed circuit board, and soldering the second metallization layer to a second coil pattern on a second side of the printed circuit board.

[0028] In Example 8, the application of the first metallized layer to the subject of Example 7 includes screen printing.

[0029] Example 9 further includes ultrasonic cleaning of the first surface before applying the first metallized layer, in accordance with the themes of Examples 7-8.

[0030] In Example 10, in the same manner as in Examples 7-9, the first metallized layer forms an electrical path for current from the center of the coil pattern.

[0031] Example 11 may include methods, techniques, or processes described or related to any of the above-mentioned examples or any part thereof. term

[0032] Ferrite: A magnetic material used as a core component in transformers and other magnetic devices.

[0033] Planar transformer: A type of transformer that utilizes flat (planar) windings, which are typically incorporated into printed circuit boards, and in which the magnetic material is attached to the PCB assembly.

[0034] Metallization: The process of applying a metallic coating to a non-metallic surface. In this context, it refers to the application of silver and glass frit coatings to a ferrite surface.

[0035] Glass frit: A component used in metallizing materials along with silver to form conductive coatings.

[0036] Pick-and-place operation: A standard manufacturing process in electronic equipment assembly where components are automatically placed onto a printed circuit board.

Claims

1. A magnetic component assembly, A first ferrite body including a first surface, The first metallized layer on the first surface of the first ferrite body, A printed circuit board having a coil pattern, A second ferrite body having a second surface, The second metallized layer on the second surface of the second ferrite body, A magnetic component assembly comprising:

2. The magnetic component assembly according to claim 1, wherein the first ferrite body is arranged on the first side of the printed circuit board, and the second ferrite body is arranged on the second side of the printed circuit board.

3. The magnetic component assembly according to claim 1, wherein the first and second metallized layers are coupled to the coil pattern of the printed circuit board via a first solder joint and a second solder joint.

4. The magnetic component assembly according to claim 1, wherein the metallized layer comprises silver and glass frit.

5. The magnetic component assembly according to claim 1, wherein the first ferrite body includes a disk having a diameter of at least 20 millimeters.

6. The magnetic component assembly according to claim 1, wherein the metallized layer has a thickness of at least 5 micrometers.

7. The magnetic component assembly according to claim 1, wherein the metallized layer includes a screen-printed layer.

8. The magnetic component assembly according to claim 1, wherein the first ferrite body includes an ultrasonically cleaned surface adjacent to the metallized layer.

9. The magnetic component assembly according to claim 1, wherein the metallized layer and the ferrite body provide electrical insulation of at least 1,000 volts.

10. A method for manufacturing a magnetic component assembly, The steps include providing a first ferrite body having a first surface, The steps include applying a first metallized layer to the first surface, The steps include providing a second ferrite body having a second surface, The steps include applying a second metallized layer to the second surface, A method comprising the steps of soldering the first metallized layer to a first coil pattern on a first side of a printed circuit board, and soldering the second metallized layer to a second coil pattern on a second side of the printed circuit board.

11. The method according to claim 10, wherein the step of applying the metallized layer includes screen printing.

12. The method according to claim 10, further comprising the step of ultrasonically cleaning the first surface before applying the metallized layer.

13. The method according to claim 10, wherein the metallized layer comprises silver and glass frit.

14. The method according to claim 10, wherein the first ferrite body includes a disk having a diameter of at least 20 millimeters.

15. The method according to claim 10, wherein the metallized layer has a thickness of at least 5 micrometers.

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