Light-emitting device

Abstract

The present invention provides a method for manufacturing a light-emitting device that can efficiently cure ultraviolet light-curable resins. [Solution] A method for manufacturing a light-emitting device, comprising: a structure preparation step comprising a frame-shaped member 120 that holds a sheet containing a first resin 112 on which a light-emitting element 130 is bonded, which is arranged on the first surface of a substrate 111 and is curable by ultraviolet light; a holding member preparation step that can hold a structure 100, which comprises a light source unit 220 surrounded by an adsorption unit 210 and capable of emitting ultraviolet light; a holding step of holding the structure with the holding member by suction, with the holding member 200 facing the second surface of the substrate; a substrate preparation step comprising a substrate preparation step comprising a component mounting unit; a placement step of a second resin 300 that is curable by ultraviolet light on the component mounting unit; a bonding step of moving the holding member and the structure onto a substrate 400, irradiating the first resin and the second resin with ultraviolet light to reduce the bonding strength between the first resin and the light-emitting element, and bonding the light-emitting element to the component mounting unit via the second resin; and a separation step of the light-emitting element and the first resin.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a light-emitting device.

Background Art

[0002] It is known to place a light-emitting element on a substrate using an ultraviolet curable resin (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Efficient curing of the ultraviolet curable resin is required.

Means for Solving the Problems

[0005] An embodiment of the present invention includes the following configuration. A structure preparation step of preparing a structure including a base material having a first surface and a second surface opposite to the first surface, a sheet including the first resin disposed on the first surface and curable by ultraviolet light, a frame member holding the outer periphery of the sheet, and a plurality of light-emitting elements joined to the first resin of the sheet, the plurality of light-emitting elements each including a first element surface provided with an electrode and a second element surface opposite to the first element surface; A holding member preparation step of preparing a holding member capable of holding the structure, the holding member including a cylindrical suction portion provided with a plurality of suction holes and a light source portion surrounded by the suction portion in a top view and provided with a plurality of light sources capable of emitting ultraviolet light; A holding step of arranging the holding member so as to face the second surface of the base material, contacting the suction portion with the frame member or the second surface, and sucking from the suction holes to hold the structure with the holding member; A substrate preparation step of preparing a substrate having an element mounting section on which the plurality of light-emitting elements can be mounted, A placement step of placing a second resin that can be cured by ultraviolet light on the element mounting portion, A bonding step comprising: moving the holding member and the structure onto the substrate while holding the structure to bring the second resin and the light-emitting element into contact; irradiating the first resin and the second resin with ultraviolet light emitted from the light source to harden the first resin, thereby reducing the bonding strength between the first resin and the light-emitting element; and hardening the second resin to bond the light-emitting element to the element mounting portion of the substrate via the second resin; A separation step of separating the light-emitting element and the first resin by moving the holding member or the substrate, A method for manufacturing a light-emitting device equipped with the following features. [Effects of the Invention]

[0006] As a result, UV-curable resins can be cured efficiently. [Brief explanation of the drawing]

[0007] [Figure 1A] This is a schematic top view illustrating an example of a structure according to the embodiment. [Figure 1B] Figure 1A is a schematic end view of the IB-IB line. [Figure 2A] This is a schematic top view showing an example of a retaining member according to the embodiment. [Figure 2B] Figure 2A is a schematic end view of the IIB-IIB line. [Figure 2C] This is a schematic end view showing a modified example of the retaining member according to the embodiment. [Figure 3] This is a schematic end view showing a method for manufacturing a light-emitting device according to an embodiment. [Figure 4] This is a schematic end view showing a method for manufacturing a light-emitting device according to an embodiment. [Figure 5] This is a schematic end view showing a method for manufacturing a light-emitting device according to an embodiment. [Figure 6A]It is a schematic end view showing a method for manufacturing a light-emitting device according to an embodiment. [Figure 6B] It is a schematic end view showing a method for manufacturing a light-emitting device according to an embodiment. [Figure 7A] It is a schematic end view showing a method for manufacturing a light-emitting device according to an embodiment. [Figure 7B] It is a schematic end view showing a method for manufacturing a light-emitting device according to an embodiment. [Figure 8] It is a schematic end view showing a method for manufacturing a light-emitting device according to an embodiment. [Figure 9] It is a schematic cross-sectional view showing a light-emitting device obtained by a method for manufacturing a light-emitting device according to an embodiment.

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In the following description, terms indicating specific directions or positions (for example, "up", "down", and other terms including those terms) are used as necessary. The use of those terms is for facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of those terms.

[0009] Also, parts denoted by the same reference numerals in a plurality of drawings indicate the same or equivalent parts or members. Furthermore, the embodiments shown below illustrate a method for manufacturing a light-emitting device for embodying the technical idea of the present invention, and the present invention is not limited thereto. Also, the dimensions, materials, shapes, relative arrangements, etc. of the constituent members described below are not intended to limit the scope of the present invention only thereto without specific description, but are intended to be illustrative. Also, the content described in one embodiment or example is applicable to other embodiments or examples. Also, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation.

[0010] The manufacturing method of the light-emitting device according to the embodiment includes: (1) a structure preparation step, (2) a holding member preparation step, (3) a holding step, (4) a substrate preparation step, (5) an arrangement step, (6) a bonding step, and (7) a separation step. Note that the steps (1) and (2) only need to be before the step (3). For example, they may be performed simultaneously or in reverse order. Also, the step (4) may be performed at any stage as long as it is before the step (6). Further, any one or all of the steps (1), (2), and (4) may be performed simultaneously. The step (5) may be performed at any stage as long as it is after the step (4) and before the step (6).

[0011] Hereinafter, each step will be described in detail with reference to the drawings.

[0012] (1) Structure preparation step Prepare a structure 100. As shown in FIGS. 1A and 1B, the structure 100 includes a frame-shaped member 120, a sheet 110 supported by the frame-shaped member 120, and a plurality of light-emitting elements 130 joined to the sheet 110. The structure 100 can be prepared by purchase. Alternatively, the structure 100 can be prepared by performing the steps of preparing the sheet 110, supporting the sheet 110 with the frame-shaped member 120, and joining the light-emitting elements 130 onto the sheet 110. Or, a sheet 110 supported by the frame-shaped member 120 can be purchased, and the structure 100 can be prepared by performing the step of joining the light-emitting elements 130 onto the sheet 110.

[0013] The frame-shaped member 120 is an annular member and can be, for example, circular-ring-shaped or square-ring-shaped, etc. The frame-shaped member 120 supports and fixes the outer periphery of the sheet 110. The frame-shaped member 120 may be located on only one surface of the sheet 110 or may be located on both surfaces of the sheet 110. In the example shown in FIG. 1B, the frame-shaped member 120 is located on only one surface of the sheet 110. The light-emitting elements 130 are joined onto the sheet 110 at a position away from the frame-shaped member 120 within the portion surrounded by the frame-shaped member 120.

[0014] The sheet 110 is a ductile member. The thickness of the sheet 110 can be, for example, 90 mm. The size and shape of the sheet 110 can be such that it can be supported by the frame-shaped member 120. It is preferable that the sheet 110 is supported by the frame-shaped member 120 without sagging. The sheet 110 and the frame-shaped member 120 may be supported by joining them with an adhesive, or they may be mechanically supported, such as by sandwiching them between two frame-shaped members 120. Alternatively, the sheet 110 may be made of an adhesive material and supported by the frame-shaped member 120.

[0015] The base material 111 of the sheet 110 comprises a first surface 1111 and a second surface 1112 opposite to the first surface 1111. The thickness of the base material 111 can be, for example, 80 mm. Examples of materials for the base material 111 include resin materials such as silicone and PVC.

[0016] The first resin 112 of the sheet 110 is an ultraviolet-curable resin. The ultraviolet-curable resin is an adhesive material that has a viscosity sufficient to adhere the light-emitting element 130 before irradiation with ultraviolet light. Furthermore, the first resin 112 is a component that can be cured by irradiation with ultraviolet light. The first resin 112 hardens and its viscosity decreases when irradiated with ultraviolet light. The first resin 112 only needs to be placed on at least the portion of the first surface 1111 of the substrate 111 that is joined to the light-emitting element 130. In other words, the first resin 112 can be placed on part or all of the first surface 1111 of the substrate 111. In the example shown in Figure 1B, the first resin 112 is placed on the entire surface of the first surface 1111 of the substrate 111. In this case, the size of the substrate 111 and the size of the first resin 112 are the same when viewed from above.

[0017] The thickness of the first resin 112 can be, for example, 10 mm. Examples of materials for the first resin 112 include resin materials such as acrylic.

[0018] The frame-shaped member 120 is a member with higher rigidity than the sheet 110. The frame-shaped member 120 can be made of a metal plate such as stainless steel. For example, in the example shown in Figure 1A, the frame-shaped member 120 is annular. The annular frame-shaped member 120 can have an outer diameter of approximately 29.5 cm and an inner diameter of approximately 24 cm. In other words, the frame-shaped member 120 can have a width of approximately 24 cm. The thickness of the frame-shaped member 120 can be approximately 1.5 mm.

[0019] The light-emitting element 130 can be a semiconductor light-emitting element such as a light-emitting diode. The light-emitting element 130 comprises a semiconductor laminate and a positive and negative pair of electrodes. Here, the surface with the electrodes is called the first element surface 131, and the surface opposite the first element surface 131 is called the second element surface 132. The semiconductor laminate includes an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer sandwiched between them. Such a semiconductor laminate including a light-emitting layer is, for example, made of In x Al y Ga 1-x-y N(0≦x, 0≦y, x+y≦1) may be included. As electrodes, good electrical conductors can be used, and can be made of, for example, gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel, or alloys thereof. In the structure 100, the first element surface 131 of the light-emitting element 130 is arranged to face the sheet 110, and the first element surface 131 is bonded to the first resin 112 of the sheet 110.

[0020] (2) Preparation process for retaining member The holding member 200 is a member capable of holding the structure 100 and is also a member capable of emitting ultraviolet light. More specifically, the holding member 200 comprises an adsorption part 210 capable of holding the structure 100 and a light source part 220 capable of emitting ultraviolet light. The adsorption part 210 comprises a first base material 211 and an adsorption hole 212 having an opening on its lower surface. The light source part 220 comprises a second base material 222 and a light source 221 disposed on its lower surface and capable of emitting ultraviolet light.

[0021] The suction portion 210 and the light source portion 220 may be an integrated unit or separate. In either case, the suction portion 210 is positioned on the outer circumference of the light source portion 220 when viewed from above. That is, the suction portion 210 of the holding member 200 is positioned so as to overlap with the frame-shaped member 120 of the structure 100 when viewed from above, and the light source portion 220 of the holding member 200 is positioned so as to overlap with the portion enclosed by the frame-shaped member 120 of the structure 100.

[0022] If the suction part 210 and the light source part 220 are separate components, they can be moved while remaining fixed in place so that their relative positions do not change. Alternatively, if the suction part 210 and the light source part 220 are separate components, they can be moved individually.

[0023] When the suction part 210 and the light source part 220 are separate, in the state before the structure 100 is held, the lower surface of the suction part 210 and the lower surface of the light source part 220 may be on the same plane, or, as shown in Figure 2B, the lower surface of the light source part 220 may be located above the lower surface of the suction part 210. When the suction part 210 and the light source part 220 are integrated, it is preferable that the lower surface of the suction part 210 and the lower surface of the light source part 220 are on the same plane.

[0024] The shape of the suction part 210 in a top view can be such that all of the suction holes 212 are located in a position that overlaps with the frame-shaped member 120 of the structure 100. Similarly, the shape of the light source part 220 in a top view can be such that it partially or completely overlaps with the area enclosed by the frame-shaped member 120 of the structure 100. In other words, the shape of the suction part 210 in a top view only needs to satisfy the above requirements in terms of shape and size; for example, it may be approximately the same shape and size as the frame-shaped member 120 of the structure 100, or it may be a different shape. Likewise, the shape of the light source part 220 in a top view only needs to satisfy the above requirements in terms of shape and size; for example, it may be approximately the same shape and size as the area enclosed by the frame-shaped member 120 of the structure 100.

[0025] In the examples shown in Figures 2A and 2B, the light source unit 220 is cylindrical, and the suction unit 210 is cylindrical. In a top view, the light source unit 220 is positioned inside the cylindrical suction unit 210. This corresponds to the case where the frame-shaped member 120 of the structure 100 is annular in shape as shown in Figure 1A, and the portion enclosed by the frame-shaped member 120 is circular.

[0026] The suction part 210 comprises a cylindrical first base material 211 and one or more suction holes 212 arranged on the first base material 211. In the example shown in Figure 2A, 12 suction holes 212 are arranged. The suction part 210 has one or more suction holes 212 at positions that can face the frame-shaped member 120 of the structure 100. In other words, the suction holes 212 of the suction part 210 are arranged at positions that can overlap with the frame-shaped member 120 of the structure 100 when viewed from above. By creating a vacuum inside the suction holes 212, the structure 100 can be held by the suction part 210. The opening shape of the suction holes 212 can be circular as shown in Figure 2A, or it can be elliptical, square, or the like.

[0027] The light source unit 220 comprises a second substrate 222 and a plurality of light sources 221 supported by the second substrate 222. In the example shown in Figures 2A and 2B, the second substrate 222 of the light source unit 220 is cylindrical, and the light sources 221 are arranged on the lower bottom surface of the second substrate 222. The light sources 221 are capable of emitting ultraviolet light with an emission peak wavelength of 365 nm to 405 nm. For example, light-emitting diodes can be used as light sources 221. The emission peak wavelengths of the plurality of light sources 221 may all be the same, or they may be two or more different emission peak wavelengths. For example, the light source 21 shown in Figure 2A comprises a first light source 2211 capable of emitting ultraviolet light with a first emission peak wavelength, and a second light source 2212 capable of emitting ultraviolet light with a second emission peak wavelength different from the first emission peak wavelength. For example, the first emission peak wavelength is 365 nm and the second emission peak wavelength is 405 nm.

[0028] The light source unit 220 shown in Figures 2A and 2B comprises a total of 63 light sources 221, including 33 first light sources 2211 and 30 second light sources 2212. However, the number of first light sources 2211 and second light sources 2212 may be the same, or the number of first light sources 2211 may be less than the number of second light sources 2212. Furthermore, the light sources 221 can be arranged so that all light sources 221 are equally spaced, or they can be arranged in rows in one direction, as in the example shown in Figure 2A, with the distance between light sources 221 in each row being less than the distance between each row. Alternatively, multiple light sources 221 may be arranged in concentric circles. In Figure 2A, a light source 221 arranged in 7 rows is shown as an example, with first light sources 2211 and second light sources 2212 arranged alternately in each row. However, the arrangement is not limited to this, and each row may consist only of light sources 221 with the same emission peak wavelength. The first light source 2211 and the second light source 2212 may be illuminated simultaneously, or one may be illuminated first, followed by the other. Alternatively, the first light source 2211 and the second light source 2212 may be illuminated alternately. Furthermore, the number of light sources 221 that emit light, the intensity of the emitted light, the emission time, etc., can be adjusted depending on the size or number of light-emitting elements 130, the viscosity of the first resin 112, etc.

[0029] Here, a light source unit 220A can be used that includes a light-transmitting member 223 on the lower surface of the second base material 222, as shown in the holding member 200A in Figure 2C. This reduces the risk of the light source 221 and the light-emitting element 130 coming into contact and damaging the light-emitting element 130. For example, glass can be used as the light-transmitting member 223. The light-transmitting member 223 can be sized and shaped to cover multiple light sources 221 at once. For example, it can be the same size and shape as the lower surface of the second base material 222. The light-transmitting member 223 may be in contact with the lower surface of the second base material 222, or it may be partially or completely separated. For example, when adhesive is placed on the outer circumference of the lower surface of the second base material 222 and the light-transmitting member 223 is attached, a structure can be provided in which an air layer equal to the thickness of the adhesive is provided.

[0030] (3) Holding process The holding member 200 holds the structure 100 by suction. In Figure 1B, the structure 100 has the light-emitting element 130 located on the upper side of the sheet 110, while in Figure 3, the orientation is reversed. That is, the light-emitting element 130 is located on the lower side of the sheet 110. In this state, the frame-shaped member 120 of the structure 100 is positioned below the suction part 210 of the holding member 200, and the inside of the suction hole 212 is evacuated. This allows the holding member 200 to hold and lift the structure 100.

[0031] In the example shown in Figure 3, the suction portion 210 and the light source portion 220 of the holding member 200 are separate, and the lower surface of the light source portion 220 is located above the lower surface of the suction portion 210. Therefore, at this point, the suction portion 210 of the holding member 200 is in contact with the structure 100, while the light source portion 220 of the holding member 200 is not in contact with the structure 100. However, the light source portion 220 and the structure 100 may be in contact at this point.

[0032] (4) Board preparation process As shown in Figure 4, a substrate 400 is prepared. The substrate 400 is part of the components that make up the light-emitting device and has an upper surface including an element mounting section 410 on which the light-emitting element 130 can be mounted, and a lower surface located on the opposite side of the upper surface. The substrate 400 can be purchased in advance in a size that will make up one light-emitting device, or prepared through some processes. Alternatively, it can be purchased in a size that will make up multiple light-emitting devices, or prepared through some processes. For example, if a substrate large enough for multiple light-emitting devices is purchased, the process includes cutting the substrate 400 before or after performing the following steps.

[0033] The substrate 400 comprises an insulating substrate and wiring arranged on the upper surface of the substrate. The element mounting section 410 includes a part of the upper surface of the substrate and / or a part of the upper surface of the wiring. Examples of the substrate include ceramic and glass epoxy. Examples of the wiring include Cu, and its outermost surface may be plated with Au or the like. The wiring may also be arranged on the lower surface of the substrate, in which case the wiring arranged on the upper surface of the substrate and the wiring arranged on the lower surface of the substrate are electrically connected by wiring arranged on the side surface of the substrate or vias arranged inside the substrate.

[0034] (5) Placement process As shown in Figure 5, a second resin 300 that can be cured by ultraviolet light is placed on the element mounting portion 410 on the upper surface of the substrate 400. Examples of methods for placing the second resin 300 include transfer, printing, and potting. At the time before contact with the light-emitting element 130, the second resin 300 is uncured. Note that "uncured" includes resin that has not cured at all, or resin that has been partially cured. For example, it includes resin that has started curing during the process and has partially cured, and is in a deformable state when the light-emitting element 130 is placed on it. The number and position of the element mounting portions 410 are preferably the same as the light-emitting element 130 bonded to the sheet 110 of the structure 100. Examples of materials for the second resin 300 include resin materials such as UV-curable resin.

[0035] (6)Joining process With the structure 100 held by the holding member 200, the holding member 200 and the structure 100 are moved above the substrate 400. Next, by moving the holding member 200 and the structure 100 downward, or by moving the substrate 400 upward, the light-emitting element 130 of the structure 100 is brought into contact with the second resin 300 on the substrate 400. As a result, the light-emitting element 130 has its first element surface 131 in contact with the first resin 112 and its second element surface 132 in contact with the second resin 300. At this time, since the second resin 300 is in an uncured state, pressing the light-emitting element 130 changes its shape, and a part of it creeps up onto the side of the light-emitting element 130. Alternatively, the amount of the second resin 300 can be adjusted so that it does not creep up onto the side of the light-emitting element 130.

[0036] In the example shown in Figure 6A, the light source unit 220 of the holding member 200 is not in contact with the structure 100. In this state, ultraviolet light can be emitted from the light source 221 of the light source unit 220. As a result, ultraviolet light is irradiated onto both the first resin 112 and the second resin 300.

[0037] Furthermore, as shown in Figure 6B, when the light source unit 220 of the holding member 200 is moved downward to come into contact with the structure 100, ultraviolet light can be emitted from the light source 221 of the light source unit 220. Since the light source unit 220 can hold down the sheet 110 of the structure 100, defects such as tilting of the light-emitting element 130 can be made less likely to occur. In this state, ultraviolet light is emitted from the light source 221 of the light source unit 220. As a result, ultraviolet light is irradiated onto both the first resin 112 and the second resin 300. In the examples shown in Figures 6A and 6B, the sheet 110 is not deformed, and the top and bottom surfaces of the sheet 110 are flat.

[0038] Alternatively, as shown in Figure 7A, the light source unit 220 or the adsorption unit 210 can be moved so that the lower surface of the light source unit 220 is positioned below the lower surface of the adsorption unit 210. This allows the ductile sheet 110 to be stretched and spread out. Then, as shown in Figure 7B, the holding member 200 is moved downward, or the substrate 400 is moved upward, bringing the light-emitting element 130 into contact with the second resin 300. With the sheet 110 deformed in this way, ultraviolet light is emitted from the light source 221. This irradiates both the first resin 112 and the second resin 300 with ultraviolet light.

[0039] As described above, with both the first resin 112 and the second resin 300 in contact with the light-emitting element 130, ultraviolet light is emitted from the light source 221 and irradiated onto the first resin 112 and the second resin 300. This hardens the first resin 112, reducing its viscosity and decreasing its adhesion to the light-emitting element 130. In other words, it becomes easier to separate the first resin 112 and the light-emitting element 130. Similarly, the unhardened second resin 300 is also hardened, allowing the substrate 400 and the light-emitting element 130 to be joined via the second resin 300.

[0040] As shown in Figure 6B, the sheet 110 may be deformed by first curing the first resin 112 and the second resin 300 by emitting ultraviolet light from the light source 221 of the light source unit 220 with the sheet 110 in an undeformed state, and then moving the adsorption unit 210 upward. In other words, the sheet 110 may be deformed either after or before irradiation with ultraviolet light.

[0041] The irradiation time and intensity of ultraviolet light can be appropriately adjusted according to the composition of the first resin 112 and / or the second resin 300, the size and number of the light-emitting elements 130, etc.

[0042] (7) Separation process Next, as shown in Figure 8, the light-emitting element 130 and the first resin 112 can be separated by moving the holding member 200 upward or moving the substrate 400 downward.

[0043] In this way, by simultaneously irradiating the first resin 112 and the second resin 300 with ultraviolet light emitted from the light source 221, the second resin 300 can be efficiently cured to bond the light-emitting element 130 to the substrate 400, and the viscosity of the first resin 112 can be reduced to make it easier to separate the light-emitting element 130 from the first resin 112. Alternatively, the second resin 300 can be cured first, and then the first resin 112 can be cured. That is, the second resin 300 that bonds the light-emitting element 130 to the substrate 400 is cured first, while the viscosity of the first resin 112 is maintained, before the first resin 112 is cured. This reduces the misalignment of the light-emitting element 130. Then, with the second resin 300 cured and the substrate 400 and the light-emitting element 130 bonded, the viscosity of the first resin 112 is reduced by curing it. Thus, in order to cure either the first resin 112 or the second resin 300 at different times, it is preferable to select materials such that the first resin 112 and the second resin 300 cure with ultraviolet light of different wavelengths. For example, the first resin 112 is a resin that cures easily with an emission peak wavelength of 405 nm, and the second resin 300 is a resin that cures easily with an emission peak wavelength of 365 nm. In this case, ultraviolet light with an emission peak wavelength of 365 nm is emitted first to irradiate and cure the second resin 300, and then ultraviolet light with an emission peak wavelength of 405 nm is emitted to irradiate and cure the first resin 112.

[0044] The light-emitting device obtained as described above can be further modified to produce a light-emitting device 500A, such as the one shown in Figure 9, by adding the following steps. Specifically, steps can be taken to electrically connect the electrodes of the light-emitting element 130, which is bonded to the substrate 400 with the second resin 300, to the wiring of the substrate 400 using a conductive member such as wire or solder, and to arrange a sealing member 510 that seals the light-emitting element 130 and the conductive member. In the example shown in Figure 9, the sealing member 510 consists of a light-transmitting first sealing member 5110 that covers the upper surface of the light-emitting element 130, and a light-reflective second sealing member 5120 that covers a part of the first sealing member 5110 so that a part of the first sealing member 5110 is exposed.

[0045] This disclosure includes the following embodiments. [Section 1] A structural preparation step for preparing a structure comprising: a sheet including a substrate having a first surface and a second surface opposite to the first surface; a first resin disposed on the first surface and curable by ultraviolet light; a frame-shaped member holding the outer periphery of the sheet; and a plurality of light-emitting elements bonded to the first resin of the sheet, each having a first element surface with electrodes and a second element surface opposite to the first element surface; A holding member preparation step for preparing a holding member capable of holding the aforementioned structure, comprising: a cylindrical suction part having a plurality of suction holes; and a light source part surrounded by the suction part in a top view and having a plurality of light sources capable of emitting ultraviolet light; A holding step in which the holding member is positioned so that the holding member and the second surface of the substrate face each other, and the suction portion is brought into contact with the frame-shaped member or the second surface and suction is applied from the suction hole to hold the structure with the holding member, A substrate preparation step of preparing a substrate having an element mounting section on which the plurality of light-emitting elements can be mounted, A placement step of placing a second resin that can be cured by ultraviolet light on the element mounting portion, A bonding step comprising: moving the holding member and the structure onto the substrate while holding the structure to bring the second resin and the light-emitting element into contact; irradiating the first resin and the second resin with ultraviolet light emitted from the light source to harden the first resin, thereby reducing the bonding strength between the first resin and the light-emitting element; and hardening the second resin to bond the light-emitting element to the element mounting portion of the substrate via the second resin; A separation step of separating the light-emitting element and the first resin by moving the holding member or the substrate, A method for manufacturing a light-emitting device equipped with the necessary components. [Section 2] The method for manufacturing a light-emitting device according to item 1, wherein the light source section includes a translucent member covering a plurality of the light sources, and ultraviolet light emitted from the light sources is irradiated onto the structure through the translucent member. [Section 3] A method for manufacturing a light-emitting device according to claim 1 or 2, wherein the adsorption part and the light source part are relatively movable. [Section 4] A method for manufacturing a light-emitting device according to any one of claims 1 to 3, wherein the light source unit comprises a first light source capable of emitting ultraviolet light having a first emission peak wavelength, and a second light source capable of emitting ultraviolet light having a second emission peak wavelength different from the first emission peak wavelength. [Section 5] A method for manufacturing a light-emitting apparatus according to item 4, wherein the first emission peak wavelength is 365 nm and the second emission peak wavelength is 405 nm. [Explanation of Symbols]

[0046] 100...Structure 110...sheet 111...Base material (1111...1st side, 1112...2nd side) 112...First resin 120... Frame-shaped member 130...Light-emitting element (131...First element surface, 132...Second element surface) 200, 200A... Retaining member 210...Adsorption part (211...First base material, 212...Adsorption hole) 220, 220A...Light source section 221...Light source (2211...1st light source, 2212...2nd light source) 222...Second base material 223...Translucent member 300...Second resin 400... Circuit board (410... Element mounting section) 500... Light-emitting device 510...Sealing member (5110...First sealing member, 5120...Second sealing member)

Claims

1. A structural preparation step for preparing a structure comprising: a sheet including a substrate having a first surface and a second surface opposite to the first surface; a first resin disposed on the first surface and curable by ultraviolet light; a frame-shaped member holding the outer periphery of the sheet; and a plurality of light-emitting elements bonded to the first resin of the sheet, each having a first element surface with electrodes and a second element surface opposite to the first element surface; A holding member preparation step for preparing a holding member capable of holding the aforementioned structure, comprising: a cylindrical suction part having a plurality of suction holes; and a light source part surrounded by the suction part in a top view and having a plurality of light sources capable of emitting ultraviolet light; A holding step in which the holding member is positioned so that the holding member and the second surface of the substrate face each other, and the suction portion is brought into contact with the frame-shaped member or the second surface and suction is applied from the suction hole to hold the structure with the holding member, A substrate preparation step of preparing a substrate having an element mounting section on which the plurality of light-emitting elements can be mounted, A placement step of placing a second resin that can be cured by ultraviolet light on the element mounting portion, A bonding step in which, while holding the structure, the holding member and the structure are moved onto the substrate to bring the second resin and the light-emitting element into contact, ultraviolet light emitted from the light source is irradiated onto the first resin and the second resin to cure the first resin, thereby reducing the bonding strength between the first resin and the light-emitting element, and the second resin is cured to bond the light-emitting element to the element mounting portion of the substrate via the second resin, A separation step of separating the light-emitting element and the first resin by moving the holding member or the substrate, A method for manufacturing a light-emitting device equipped with the following features.

2. The method for manufacturing a light-emitting device according to claim 1, wherein the light source unit includes a translucent member covering a plurality of the light sources, and ultraviolet light emitted from the light sources is irradiated onto the structure through the translucent member.

3. The method for manufacturing a light-emitting device according to claim 1, wherein the adsorption part and the light source part are relatively movable.

4. The method for manufacturing a light-emitting device according to claim 1, wherein the light source unit comprises a first light source capable of emitting ultraviolet light having a first emission peak wavelength, and a second light source capable of emitting ultraviolet light having a second emission peak wavelength different from the first emission peak wavelength.

5. The method for manufacturing a light-emitting apparatus according to claim 4, wherein the first emission peak wavelength is 365 nm and the second emission peak wavelength is 405 nm.

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