Mounting apparatus and control method for mounting apparatus

Abstract

To provide an assembly device with improved efficiency in assembly operations. [Solution] The mounting apparatus according to the present disclosure comprises: a first support portion that supports a component carrier that holds a plurality of components on a holding surface; a second support portion that supports a substrate having a mounting surface on which components are mounted; an inversion device that has a component support portion for supporting components and inverts the front and back sides of components; a head that holds components and transports them between the first support portion, the inversion device and the second support portion; a drive unit for moving the head; and a control unit, wherein the control unit makes substantially the same at least one of the height position between the holding surface of the component carrier and the component support portion of the inversion device before inversion, or the height position between the component support portion of the inversion device after inversion and the mounting surface of the substrate.

Description

Technical Field

[0001] The present disclosure relates to a mounting device and a method for controlling the mounting device.

Background Art

[0002] As a mounting device, for example, Patent Document 1 discloses a mounting device having an inversion device for inverting components.

[0003] The mounting device of Patent Document 1 has two heads. One head supplies components to the inversion device, and the other head takes out the components from the inversion device and mounts them on a substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, from the perspective of the efficiency of the mounting operation, there is still room for improvement.

[0006] An object of the present disclosure is to provide a mounting device with improved efficiency of the mounting operation in order to solve the above problems.

Means for Solving the Problems

[0007] The mounting apparatus according to this disclosure comprises: a first support portion that supports a component carrier that holds a plurality of components on a holding surface; a second support portion that supports a substrate having a mounting surface on which components are mounted; an inversion device that has a component support portion for supporting components and inverts the front and back sides of components; a head that holds components and transports them between the first support portion, the inversion device and the second support portion; a drive unit for moving the head; and a control unit, wherein the control unit makes substantially the same at least one of the height position between the holding surface of the component carrier and the component support portion of the inversion device before inversion, or the height position between the component support portion of the inversion device after inversion and the mounting surface of the substrate.

[0008] The control method for the mounting apparatus according to this disclosure includes: holding components with a head from a first support portion that supports a component carrier that holds multiple components on a holding surface; transporting the components to an inversion device that has a component support portion that supports the components and inverts the front and back sides of the components; inverting the front and back sides of the components with the inversion device; transporting the components to a second support portion that supports a substrate; and mounting the components on the mounting surface of the substrate, wherein at least one of the height position between the holding surface of the component carrier and the component support portion of the inversion device before inversion, or the height position between the component support portion of the inversion device after inversion and the mounting surface of the substrate, is substantially the same. [Effects of the Invention]

[0009] According to this disclosure, it is possible to provide an assembly device with improved efficiency in assembly operations. [Brief explanation of the drawing]

[0010] [Figure 1] Plan view showing the schematic configuration of the mounting device according to the embodiment of this disclosure. [Figure 2] schematic side view of the mounting device [Figure 3] Side view of the part [Figure 4] Perspective view of the inversion device [Figure 5] Perspective view of the inversion device [Figure 6] Perspective view of the inversion device [Figure 7] Partial exploded view of the component holding section [Figure 8A] Partial cross-sectional view of the component holding part [Figure 8B] Partial cross-sectional view of the component holding part [Figure 8C] Partial cross-sectional view of the component holding part [Figure 9] Flowchart of the operation of the mounting device [Figure 10] Plan view of the mounting device showing the movement of the head in the first control [Figure 11A] Schematic side view of the mounting device in the first control [Figure 11B] Schematic side view of the mounting device in the first control [Figure 12] Plan view of the mounting device showing the movement of the head in the second control [Figure 13] Schematic side view of the mounting device in the second control

Mode for carrying out the invention

[0011] [Embodiment 1] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the mounting device 1. In FIG. 1 and a part described later, as two axes orthogonal to each other in the horizontal plane, the X-axis in the lateral direction of the mounting device 1 (the left-right direction in FIG. 1) and the Y-axis orthogonal to the longitudinal direction of the mounting device 1 (the up-down direction in FIG. 1) are shown. Further, as an axis orthogonal to the XY plane, the Z-axis is shown. The Z direction may be referred to as the "height direction".

[0012] (Overall configuration) The overall configuration of the mounting device 1 will be described with reference to FIGS. 1 to 3. FIG. 1 is a plan view of the mounting device 1 according to Embodiment 1 of the present disclosure. FIG. 2 is a schematic side view of the mounting device 1. FIG. 3 is a side view of the component P.

[0013] The mounting device 1 in Embodiment 1 is a device that mounts a component P on a component carrier R supported by a first support portion 4 onto a substrate B supported by a second support portion 5.

[0014] The component carrier R is a member that integrally holds multiple components P. For example, the component carrier R integrally holds multiple components P formed by dicing a semiconductor wafer on a tape. The component carrier R has a tape having a holding surface S2 on which multiple components P are held, and a frame that supports the tape. The frame has a ring shape that supports the outer circumference of the tape, and may be called, for example, a tape frame, a dicing frame, or a wafer ring. In Embodiment 1, the component carrier R holds multiple components P of one type, but it may hold multiple types of components P. The components P are plate-shaped members, and may be bare chips, dies, IC chips, etc. The substrate B is a plate-shaped member having a mounting surface S1 on which components P are mounted. The substrate B is formed from, for example, silicon, glass, or resin.

[0015] As shown in Figure 1, the mounting device 1 includes a base 2, a first support part 4, a second support part 5, a reversing device 6, a pickup head 7, a mounting head 8, cameras 9 and 10, drive units 11 and 12, a component recognition camera 13, and a control unit C.

[0016] The base 2 is a member that supports the components of the mounting device 1. The base 2 is, for example, a stage having an upper surface extending in the XY direction.

[0017] The first support portion 4 is a member that supports the component carrier R. The first support portion 4 may have a frame or stage that supports the component carrier R such that the holding surface S2 faces the +Z direction. In Embodiment 1, the first support portion 4 is a wafer expander that supports the component carrier R and widens the spacing between components P on the component carrier R.

[0018] The second support portion 5 is a member that supports the substrate B. The second support portion 5 may have a frame or stage that supports the substrate B such that the mounting surface S1 of the substrate B faces the +Z direction. In Embodiment 1, the second support portion 5 is a stage that supports the substrate B from below.

[0019] The first support section 4 and the second support section 5 are aligned in the Y direction, and a reversing device 6 is positioned between the first support section 4 and the second support section 5.

[0020] The inversion device 6 is a device that inverts the front and back sides of a component P before mounting. Specifically, as shown in Figure 2, the inversion device 6 has a plate member 31, each having a plurality of housing holes capable of accommodating a component P. The plate member 31 has a front surface R11, a back surface R12, and a central surface S3 located at the center of the front surface R11 and the back surface R12. The inversion device 6 inverts the housed component P by inverting the front and back sides of the plate member 31. Inverting the front and back sides of the plate member 31 is the operation of changing the orientation of the plate member 31 from one orientation with the front surface R11 facing upwards to one orientation with the back surface R12 facing upwards. The inversion device 6 further has a rotation mechanism (rotation mechanism 23, described later) that rotates the plate member 31 180° around a rotation axis (rotation axis V0, described later) extending into the central surface S3 to invert the front and back sides.

[0021] As shown in Figure 3, part P has a first part surface R1 that is held by adhesion to the holding surface S2 of the part carrier R, and a second part surface R2 opposite to the first part surface R1. Here, inversion of part P is the operation of changing part P from a position where the first part surface R1 is facing downward to a position where the first part surface R1 is facing upward. When part P is housed, of the front surface R11 and back surface R12 of the plate member 31, the downward surface is located at substantially the same height as the downward surface of part P.

[0022] In Embodiment 1, some of the components P mounted on the substrate B are not inverted by the inversion device 6, but are mounted while maintaining the orientation held by the component carrier R. The control unit C is capable of executing both a first control, which inverts the components P using the inversion device 6, and a second control, which does not invert the components P.

[0023] Returning to Figure 1, the pickup head 7 is a device that holds and transports the component P in the first support section 4. The pickup head 7 has a suction nozzle at its lower end for picking up the component P by suction. In Embodiment 1, the pickup head 7 has 16 suction nozzles, each capable of simultaneously picking up a component P, but it may have any number of suction nozzles.

[0024] When component P is to be inverted, the pickup head 7 transports component P from the first support unit 4 to the inversion device 6. On the other hand, when inversion of component P is not required, the pickup head 7 transports component P from the first support unit 4 to the second support unit 5 and mounts it onto the substrate B. In other words, in Embodiment 1, the pickup head 7 is movable along two different movement paths: a first path between the first support unit 4 and the inversion device 6, and a second path between the first support unit 4 and the second support unit 5.

[0025] Since the first component surface R1 of component P in the first support section 4 is facing downwards and the second component surface R2 is facing upwards, the suction nozzle of the pickup head 7 attracts the second component surface R2 of component P.

[0026] The mounting head 8 is a device that holds the inverted component P in the inverting device 6, transports it from the inverting device 6 to the second support unit 5, and mounts it onto the substrate B in the second support unit 5. The mounting head 8 has a suction nozzle at its lower end for picking up the component P by suction. In Embodiment 1, the mounting head 8 has 16 suction nozzles, each capable of simultaneously picking up a component P, but it may have any number of suction nozzles, similar to the pickup head 7.

[0027] Furthermore, when reversing the component P is not required, the mounting head 8 does not need to be involved in the transport of the component P. When reversing the component P is not required, the mounting head 8 may, for example, be stopped at a predetermined standby position.

[0028] Since the first component surface R1 of the inverted component P is facing upwards and the second component surface R2 is facing downwards, the suction nozzle of the mounting head 8 will pick up the first component surface R1 of component P.

[0029] The first camera 9 is a device that images an object located below the pickup head 7 in order to recognize and align the position for picking up or storing the component P. The first camera 9 is installed adjacent to the pickup head 7 and moves together with the pickup head 7 in the XY direction, has an optical axis extending in the height direction, and images the area below. Specifically, the first camera 9 images the component carrier R in the first support section 4, the inversion device 6, and the substrate B in the second support section 5 from above.

[0030] Specifically, the first camera 9 captures a first image D1 relating to the holding surface S2 of the component carrier R in the first support section 4. The first image D1 targets, for example, circuit patterns or recognition marks on the component P held on the holding surface S2 and to be picked up next, or bad marks on the component P that have been removed from the mounting target. Note that the thickness of the component P is smaller than the depth of field of the first camera 9, and if the focus of the first camera 9 is set on the holding surface S2, the component P can be clearly imaged. If the component P is not inverted, in addition to the first image D1, the first camera 9 also captures an image relating to the mounting surface S1 of the substrate B in the second support section 5 (the third image D3 described later). The recognition marks may be planar or three-dimensional in shape.

[0031] The second camera 10 is a device that images an object located below the mounting head 8 in order to recognize and align the position for picking up or mounting a component P. The second camera 10 is installed adjacent to the mounting head 8 and moves together with the mounting head 8 in the XY direction, has an optical axis extending in the height direction, and images the area below. Specifically, the second camera 10 images the inversion device 6 and the substrate B on the second support part 5 from above.

[0032] Specifically, the second camera 10 captures a second image D2 of the component P in the inversion device 6 after inversion. The second image D2 targets, for example, the circuit pattern or recognition mark on the component P housed in the inversion device 6. Note that the thickness of the component P is smaller than the depth of field of the second camera 10, and the component P can be clearly imaged when the focus of the second camera 10 is aligned with the surface supporting the component P in the inversion device 6 (i.e., the surface facing the surface R11 of the plate member 31). Furthermore, the second camera 10 captures a third image D3 of the mounting surface S1 of the substrate B in the second support part 5. The third image D3 targets, for example, the recognition mark indicating the mounting position of the component P on the mounting surface S1.

[0033] Cameras 9 and 10 are fixed-focus cameras. A fixed-focus camera is a camera whose field of view and focus are fixed. The distance from cameras 9 and 10 to the focus is constant. Cameras 9 and 10 each have, for example, a fixed-focus lens and a CMOS image sensor. In Embodiment 1, cameras 9 and 10 have the same configuration.

[0034] As shown in Figure 2, in order to capture a clear image with the first camera 9, which is a fixed-focus camera, the first camera 9 performs imaging while positioned at a constant focal height H1 relative to the object. Specifically, the first camera 9 performs imaging while positioned at a focal height H1 relative to the holding surface S2 of the component carrier R or the mounting surface S1 of the substrate B.

[0035] Similarly, in order to capture a clear image with the second camera 10, which is a fixed-focus camera, the second camera 10 performs imaging while positioned at a constant focal height H2 relative to the object. Specifically, the second camera 10 performs imaging while positioned at a focal height H2 relative to the inverted surface R11 of the inverting device 6 and the mounting surface S1 of the substrate B. In Embodiment 1, the focal height H2 of the second camera 10 is the same as the focal height H1 of the first camera 9.

[0036] In the mounting device 1, the holding surface S2 of the component carrier R and the back surface R12 of the inversion device 6 before inversion are at substantially the same height, and the surface R11 of the inversion device 6 after inversion and the mounting surface S1 of the substrate B are at substantially the same height. That is, the surfaces supporting the component P before inversion are at substantially the same height, and the surfaces supporting the component P after inversion are also at substantially the same height. Furthermore, in Embodiment 1, since the rotation axis of the inversion device 6 extends to the central surface S3 of the plate member 31, the central surface S3 is at substantially the same height before and after inversion of the inversion device 6. Therefore, the back surface R12 before inversion and the surface R11 after inversion are at substantially the same height, and the holding surface S2, the back surface R12 before inversion, the surface R11 after inversion, and the mounting surface S1 are at substantially the same height. In this specification, "two objects are at substantially the same height" means that the height difference between the two objects is within the depth of field of cameras 9 and 10.

[0037] Since the holding surface S2, the back surface R12 before inversion, the front surface R11 after inversion, and the mounting surface S1 are all at substantially the same height, the height control of the heads 7 and 8 becomes easier, and the time required for height adjustment of the heads 7 and 8 is reduced. Therefore, the efficiency of the mounting operation is improved.

[0038] Furthermore, while maintaining the image quality of cameras 9 and 10, which are fixed-focus cameras, at a predetermined standard, the adjustment of the focus and field of view of cameras 9 and 10 for each image can be suppressed. As a result, the time required for mounting operations can be further reduced, and the mounting efficiency of the mounting device 1 can be further improved.

[0039] Note that the height of the mounting surface S1, the height of the holding surface S2, the height of the back surface R12 before inversion, and the height of the front surface R11 after inversion may differ at times other than when the heads 7 and 8 hold and place the component P, or when cameras 9 and 10 take images.

[0040] Returning to Figure 1, the first drive unit 11 is a device for moving the pickup head 7 and the first camera 9. Specifically, the first drive unit 11 moves the pickup head 7 and the first camera 9 in the XY direction relative to the base 2. The first drive unit 11 also raises and lowers the suction nozzles of the pickup head 7. The first drive unit 11 may also raise and lower the pickup head 7 itself. In Embodiment 1, the first drive unit 11 has a pair of Y-axis tables 15, a beam 16A, and a base 17.

[0041] A pair of Y-axis tables 15 are fixed to the ends of the base 2 and are devices that extend in the Y direction with a distance between them in the X direction. The Y-axis tables 15 move the beam 16A in the Y direction by transmitting driving force to both ends of the beam 16A. The Y-axis tables 15 include, for example, actuators that convert energy into motion in the Y direction, and may include motors, air cylinders, hydraulic cylinders, etc. The beam 16A is a member that extends in the X direction from one Y-axis table 15 to the other Y-axis table 15. The beam 16A includes, for example, rails. The base 17 is a device that is movably connected to the beam 16A in the X direction and supports the pickup head 7. The base 17 supports the pickup head 7. The base 17 includes, for example, actuators that convert energy into motion in the X and Z directions, and may include motors, air cylinders, hydraulic cylinders, etc.

[0042] In Embodiment 1, the first camera 9 is fixed to the base 17. With this configuration, the first camera 9 can move in the XY direction together with the pickup head 7. In Embodiment 1, the pickup head 7, the base 17, and the first camera 9 are fixed to the base 2 in the Z direction.

[0043] The second drive unit 12 is a device for moving the mounting head 8 and the second camera 10. Specifically, the second drive unit 12 moves the mounting head 8 and the second camera 10 in the XY direction relative to the base 2. The second drive unit 12 also raises and lowers the mounting head 8. In Embodiment 1, the second drive unit 12 has a pair of Y-axis tables 15, a beam 16B, and a base 18, and shares the pair of Y-axis tables 15 with the first drive unit 11.

[0044] The Y-axis table 15 moves the beam 16B in the Y direction by transmitting driving force to both ends of the beam 16B. The beam 16B, like the beam 16A of the first drive unit 11, is a member that extends in the X direction from one Y-axis table 15 to the other Y-axis table 15. The beam 16B includes, for example, a rail. The base 18 is a device that is movably connected to the beam 16B in the X direction and supports the mounting head 8. The base 18 supports the mounting head 8 so that it is movable in the Z direction. The base 18 includes, for example, actuators that convert energy into motion in the X and Z directions, and may include motors, air cylinders, hydraulic cylinders, etc.

[0045] In Embodiment 1, the second camera 10 is fixed to the base 18. With this configuration, the second camera 10 can move in the XY direction together with the mounting head 8. However, since the mounting head 8 is movable in the Z direction relative to the base 18, the transmission of the mounting head 8's movement in the Z direction to the second camera 10 is suppressed. In Embodiment 1, the base 18 and the second camera 10 are fixed to the base 2 in the Z direction.

[0046] The component recognition camera 13 is positioned between the first support section 4 and the second support section 5, which are aligned in the Y direction, and captures an image of the component P passing above from below, recognizing the orientation and relative position of the component P. Specifically, when the heads 7 and 8 pass above while holding the component P, the component recognition camera 13 captures an image of the component P and recognizes the orientation and relative position of the component P with respect to the heads 7 and 8. In Embodiment 1, the component recognition camera 13 is positioned adjacent to the inversion device 6. The component recognition camera 13 includes, for example, a CMOS image sensor.

[0047] The control unit C is a controller that oversees the control of the entire mounting device 1. The control unit C includes a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that implements predetermined functions by executing a program. The control unit C can implement various controls in the mounting device 1 by calling and executing a control program stored in memory M. Memory M can be implemented as, for example, flash memory, SSD (Solid State Device), hard disk, RAM, other storage devices, or a combination thereof as appropriate. The control unit C is not limited to one that implements predetermined functions through the cooperation of hardware and software, but may also be a hardware circuit specifically designed to implement predetermined functions.

[0048] The control unit C determines, based on the production program or information about the component P, whether to perform a first control to invert the component P using the inversion device 6, or to perform a second control to maintain the orientation of the component P. Here, the information about the component P includes the type of component P, the method of connecting the component P at the mounting position, the orientation of the active surface of the component P, whether inversion is necessary, and identification information of the component P. The production program or information about the component P may be stored in memory M.

[0049] (Configuration of the inversion device) Next, the configuration of the inversion device 6 will be described in more detail with reference to Figures 4 to 6. Figures 4 to 6 are perspective views of the inversion device 6.

[0050] As shown in Figures 4 and 5, the inversion device 6 includes a base 20, a parts holding section 21, a lifting mechanism 22, a rotation mechanism 23, a pump connection section 24, and shutter moving mechanisms 26 and 27.

[0051] The base 20 is a member that supports the component holding section 21, the lifting mechanism 22, the rotating mechanism 23, the pump connection section 24, and the shutter moving mechanisms 26 and 27. The base 20 is fixed to the mounting device 1. Two fixed frame sections 25 are connected to the base 20 on both sides of the component holding section 21 in the Y direction.

[0052] The component holding section 21 is a component having a plate member 31 (Figure 2) capable of accommodating the component P. The component holding section 21 is rotatable around a rotation axis V0 (Figure 6), and rotates with the component P accommodated in the accommodating hole to invert the component P.

[0053] The component holding section 21, the rotation mechanism 23, and the pump connection section 24 are configured to be able to move up and down relative to the fixed frame section 25 by the lifting mechanism 22. Specifically, the component holding section 21 can move up and down between a raised position (Figure 4) and a lowered position (Figure 5) that is lower than the raised position. In the raised position, image D2 is captured, component P is placed in the component holding section 21, and component P is removed from the component holding section 21. In the lowered position, the component holding section 21 rotates in the rotation direction C0. With this configuration, interference between the component holding section 21 and the member located above the reversing device 6 can be suppressed when the component holding section 21 rotates.

[0054] As shown in Figure 6, the component holder 21 is configured to be rotatable around the rotation axis V0 by the rotation mechanism 23. The rotation axis V0 extends into the central plane S3 (Figure 2) of the plate member 31. The component holder 21 has a shaft 35 that extends along the rotation axis V0 and protrudes in the X direction, and is connected to the rotation mechanism 23.

[0055] The pump connection portion 24 is a component that connects the internal space of the component holding portion 21 to the pump V (Figure 1). More specifically, the pump connection portion 24 selectively connects the housing hole of the component holding portion 21 to the pump V. The pump connection portion 24 is provided on both sides of the component holding portion 21 in the X direction.

[0056] The shutter movement mechanisms 26 and 27 are components for opening the housing hole of the component holding section 21 that houses the component P. The component holding section 21 has two shutter members (shutter members 32 and 33, described later) that cover the upper and lower openings of the pocket. The shutter members are biased to keep the housing hole closed at all times. The shutter movement mechanisms 26 and 27 have projections 28 and 29 that catch on hooks provided on the shutter members, and a drive unit (not shown, for example, an actuator) that slides the projections 28 and 29. By driving the drive unit to slide the projections 28 and 29, the shutter movement mechanisms 26 and 27 slide the housing hole relative to the opening of the pocket.

[0057] (Configuration of the component holding section) Next, the configuration of the component holding section 21 will be described in more detail with reference to Figures 7 to 8C. Figure 7 is an exploded view of a part of the component holding section 21. Figures 8A to 8C are partial cross-sectional views of the component holding section 21.

[0058] As shown in Figure 7, the component holding section 21 includes a plate member 31, a first shutter member 32, and a second shutter member 33. In Embodiment 1, the shutter members 32 and 33 have a common structure.

[0059] The plate member 31 is positioned between the first shutter member 32 and the second shutter member 33. The surface R11 of the plate member 31 faces the first shutter member 32, and the back surface R12 opposite to the surface R11 faces the second shutter member 33. In Embodiment 1, the distance between the surface R11 and the back surface R12 is smaller than the depth of field of the cameras 9 and 10.

[0060] The plate member 31 is a plate-shaped member that forms a plurality of housing holes 41, each housing a single component P. The housing holes 41 penetrate the plate member 31 in the thickness direction (Z direction) from the surface R11 to the back surface R12. In this embodiment, 16 housing holes 41 are arranged in two rows. The housing holes 41 have rounded corners in a plan view, which helps to prevent the corners of the component P from contacting the corners of the housing holes 41 and causing cracking or chipping of the component P.

[0061] The shutter members 32 and 33 are plate-shaped members for opening and closing the housing hole 41. In this embodiment, the shutter members 32 and 33 are slidable between a closed position and an open position aligned in the X direction with respect to the housing hole 41, so as to open and close the housing hole 41.

[0062] The first shutter member 32 has a first shutter surface 52 facing the surface R11 of the plate member 31 and a through hole 42 that penetrates in the thickness direction. The second shutter member 33 has a second shutter surface 53 facing the back surface R12 of the plate member 31 and a through hole 43 that penetrates in the thickness direction. Before and after inversion, the surface R11 and the first shutter surface are at substantially the same height, and the back surface R12 and the second shutter surface 53 are at substantially the same height. The through holes 42 and 43 are formed in the same number and at the same pitch to correspond to the accommodating holes 41.

[0063] As shown in Figure 8A, when both shutter members 32 and 33 are in the closed position, the shutter surfaces 52 and 53 each cover the opening of the housing hole 41. In the closed position, the opening of the housing hole 41 faces the shutter surfaces 52 and 53, and the through holes 42 and 43 and the housing hole 41 are offset from each other in the X direction.

[0064] The reversal operation is performed when both shutter members 32 and 33 are in the closed position.

[0065] As shown in Figure 8B, when the first shutter member 32 is in the first open position, one of the openings on the upper or lower side of the housing hole 41 is opened, and the housing hole 41 and the through hole 42 are in communication. The second shutter member 33 is in the second closed position, and the second shutter surface 53 is capable of supporting the component P. The second shutter surface 53 functions as a component support.

[0066] As shown in Figure 8C, when the second shutter member 33 is in the second open position, one of the openings on the upper or lower side of the housing hole 41 is opened, and the housing hole 41 and the through hole 43 are in communication. The first shutter member 32 is in the first closed position, and the first shutter surface 52 is capable of supporting the component P. The first shutter surface 52 functions as a component support.

[0067] Returning to Figure 7, the side wall of the first shutter member 32 is provided with a hook portion 39a that protrudes away from the side wall. When the first shutter member 32 is facing upward, the hook portion 39a engages with the shutter movement mechanism 26 (Figure 4), and the first shutter member 32 slides between the open position and the closed position.

[0068] The side wall of the second shutter member 33 is provided with a hook portion 39b that protrudes away from the side wall. When the second shutter member 33 is facing upward, the hook portion 39b engages with the shutter movement mechanism 27 (Figure 4), and the second shutter member 33 slides between the open position and the closed position.

[0069] Furthermore, on the shutter surfaces 52 and 53 of each shutter member 32 and 33, suction holes 45 are provided between adjacent through holes 42 and 43. The suction holes 45 are connected to the pump V (Figure 1) via an air circuit (not shown) and a pump connection part 24 that passes through the inside of the shutter members 32 and 33.

[0070] When the housing hole 41 is closed by the shutter members 32 and 33, the component P can be held by the lower shutter members 32 and 33 by drawing air in through the suction holes 45 of the lower shutter members 32 and 33. Also, by blowing air out through the suction holes 45 of the upper shutter members 32 and 33, the component P that was being held by the upper shutter member can be dropped onto the lower shutter members 32 and 33.

[0071] (operation) With the above configuration, an example of the operation of the mounting device 1 will be described with reference to Figures 9 to 13. Figure 9 is a flowchart of the operation of the mounting device 1. Figure 10 is a plan view of the mounting device 1 showing the movement of the pickup head 7 and the mounting head 8 in the first control. Figures 11A and 11B are schematic side views of the mounting device 1 in the first control. Figure 12 is a plan view of the mounting device 1 showing the movement of the pickup head 7 and the mounting head 8 in the second control. Figure 13 is a schematic side view of the mounting device 1 in the second control.

[0072] As shown in Figure 9, first, the control unit C loads the component carrier R into the mounting device 1 (S10).

[0073] Next, the control unit C refers to memory M to obtain information about the production program or part P (S11). Memory M may store information about the production program or part P for each part carrier R. In Embodiment 1, the control unit C obtains the type of part P held in the part carrier R.

[0074] Next, the control unit C determines whether or not to perform an inversion operation on component P based on the acquired information about component P (S12).

[0075] If an inversion operation is performed on component P (Yes in S12), the control unit C performs the first control (S13-S25), as shown in Figure 10. On the other hand, if an inversion operation is not performed on component P (No in S12), the control unit C performs the second control (S33-S39), as shown in Figure 12.

[0076] (First control) In the first control, as shown in Figure 11A, the control unit C causes the first camera 9 to capture the first image D1 (S13). Specifically, the control unit C controls the first drive unit 11 to move the base 17 above the holding surface S2 of the component carrier R in the first support unit 4, causing the first camera 9 to capture the first image D1. In Embodiment 1, the first camera 9 captures the recognition mark on the component P that is held on the holding surface S2 as the target of the first image D1 and then held by the pickup head 7.

[0077] Next, the control unit C aligns the pickup head 7 with respect to the component P based on the first image D1 (S14). Specifically, the control unit C controls the first drive unit 11 to align the pickup head 7 with respect to the component P.

[0078] Next, the control unit C lowers the pickup head 7 and holds the component P in place by adsorption to each nozzle of the pickup head 7 (S15).

[0079] Next, the control unit C moves the pickup head 7 above the reversing device 6 to transport the part P (S16). Specifically, the control unit C controls the first drive unit 11 to move the pickup head 7 above the reversing device 6.

[0080] Next, the control unit C lowers the pickup head 7, releasing the suction of the component P from each nozzle of the pickup head 7, and places the component P into the housing hole 41 of the inversion device 6 (S17). The component P is supported by the second shutter surface 53.

[0081] Here, since the holding surface S2 of the component carrier R and the back surface R12 of the inversion device 6 (i.e., the second shutter surface 53) are set at substantially the same height, it becomes easy to equalize the lifting distance of the pickup head 7 when holding the component P in step S15 and when placing the component P in step S17. Therefore, height control of the pickup head 7 becomes easier.

[0082] Next, the control unit C causes the reversing device 6 to perform a reversal operation (S18). Specifically, the control unit C controls the lifting mechanism 22 and the rotating mechanism 23 to lower the part holding part 21, rotate it 180°, and raise it. Through this operation, the orientation of part P is changed from an orientation where the first part surface R1 is facing downwards to an orientation where the first part surface R1 is facing upwards. Part P is then supported by the first shutter surface 52.

[0083] Since the lowered component holding section 21 rises to substantially the same height after inversion, the component holding section 21 can move up and down relative to the cameras 9 and 10, but the central plane S3 of the inversion device 6 is at substantially the same height before and after inversion.

[0084] Next, as shown in Figure 11B, the control unit C causes the second camera 10 to capture the second image D2 (S19). Specifically, the control unit C controls the second drive unit 12 to move the base 18 above the inversion device 6, causing the second camera 10 to capture the second image D2. In Embodiment 1, the second camera 10 captures the circuit pattern and recognition marks on the first component surface R1 of the component P as the target of the second image D2. Since the focus of the second camera 10 is aligned with the surface R11 of the plate member 31 of the inversion device 6, and the thickness of the component P is less than the depth of field, the second camera 10 can clearly capture the first component surface R1 of the component P from a focal height H2.

[0085] Next, the control unit C aligns the mounting head 8 with respect to the inversion device 6 based on the second image D2 (S20). Specifically, the control unit C controls the second drive unit 12 to align the mounting head 8 with respect to the housing hole 41 of the inversion device 6.

[0086] Next, the control unit C lowers the mounting head 8 and holds the component P by adsorption to each nozzle of the mounting head 8 (S21).

[0087] Next, the control unit C moves the mounting head 8 above the second support unit 5 (S22). Specifically, the control unit C controls the second drive unit 12 to move the mounting head 8 above the mounting surface S1 of the substrate B on the second support unit 5.

[0088] In Embodiment 1, the mounting head 8 passes above the component recognition camera 13 as it moves toward the second support portion 5. The component recognition camera 13 images the mounting head 8 from below and recognizes the relative position between the mounting head 8 and the component P held by the mounting head 8. Through this operation, the control unit C can determine the position of the component P relative to the mounting head 8.

[0089] Next, the control unit C causes the second camera 10 to capture the third image D3 (S23). Specifically, the control unit C controls the second drive unit 12 to move the base 18 above the mounting surface S1 of the substrate B on the second support unit 5, causing the second camera 10 to capture the third image D3. In Embodiment 1, the second camera 10 captures a recognition mark M4, which is provided on the mounting surface S1 of the substrate B and indicates the mounting position of the component P, as the target of the third image D3.

[0090] Here, the surface R11 (i.e., the first shutter surface 52) of the inversion device 6 and the mounting surface S1 of the substrate B are set at substantially the same height, and the base 18 is fixed in the Z direction so that the focal height H2 is relative to the surface R11 and the mounting surface S1. Therefore, the control unit C can suppress the focus adjustment operation of the second camera 10 between the acquisition of images D2 and D3.

[0091] Next, the control unit C aligns the mounting head 8 with respect to the substrate B based on the imaging results from the component recognition camera 13 and the third image D3 (S24). Specifically, the control unit C controls the second drive unit 12 to align the mounting head 8 with respect to the mounting position on the substrate B.

[0092] Next, the control unit C lowers the mounting head 8 to mount the component P onto the substrate B (S25).

[0093] Here, since the surface R11 of the inversion device 6 (i.e., the first shutter surface 52) and the mounting surface S1 of the substrate B are set at substantially the same height, it becomes easy to equalize the lifting distance of the mounting head 8 when holding component P in step S21 and when mounting component P in step S25. Therefore, height control of the mounting head 8 becomes easier.

[0094] (Second control) In the second control, first, as shown in Figures 12 and 13, the control unit C, similar to the first control, causes the first camera 9 to capture the first image D1 (S33), aligns the pickup head 7 with the component P (S34), and causes the nozzle of the pickup head 7 to attract and hold the component P (S35).

[0095] Next, the control unit C moves the pickup head 7 above the second support unit 5 to transport the part P (S36). Specifically, the control unit C controls the first drive unit 11 to move the pickup head 7 above the second support unit 5.

[0096] Since component P does not pass through the inversion device 6, the time required for mounting component P can be reduced, and the mounting efficiency of the mounting device 1 can be improved.

[0097] In Embodiment 1, the pickup head 7 passes above the component recognition camera 13 as it moves toward the second support portion 5. The component recognition camera 13 images the pickup head 7 from below and recognizes the relative position between the pickup head 7 and the component P held by the pickup head 7. Through this operation, the control unit C can determine the position of the component P relative to the pickup head 7.

[0098] Next, the control unit C causes the first camera 9 to capture the third image D3 (S37). Specifically, the control unit C controls the first drive unit 11 to move the base 17 above the mounting surface S1 of the substrate B on the second support unit 5, causing the first camera 9 to capture the third image D3. In Embodiment 1, the first camera 9 captures the recognition mark M4 provided on the mounting surface S1 of the substrate B as the target of the third image D3. The first camera 9 may also capture other recognition marks provided on the mounting surface S1.

[0099] Here, the holding surface S2 of the component carrier R and the mounting surface S1 of the substrate B are set at substantially the same height, and the base 17 is fixed in the Z direction so that the focal height H1 is relative to the holding surface S2 and the mounting surface S1. Therefore, the control unit C can suppress the focus adjustment operation of the first camera 9 between the acquisition of images D1 and D3.

[0100] Next, the control unit C aligns the pickup head 7 with respect to the substrate B based on the imaging results from the component recognition camera 13 and the third image D3 (S38). Specifically, the control unit C controls the first drive unit 11 to align the pickup head 7 with respect to the mounting position on the substrate B.

[0101] Next, the control unit C lowers the pickup head 7 to mount the component P onto the circuit board B (S39).

[0102] In Embodiment 1, during the second control, the control unit C controls the second drive unit 12 to stop the movement of the mounting head 8 and the second camera 10.

[0103] The control unit C repeatedly executes either the first control (S13-S25) or the second control (S33-S39) until the component carrier R is replaced. The control unit C may also repeatedly execute steps S11-S12. When the component carrier R is replaced, there may be components P remaining in the component carrier R, or all components P may have been removed.

[0104] (effect) The mounting device 1 according to Embodiment 1 can achieve the following effects.

[0105] The mounting apparatus 1 of Embodiment 1 comprises a first support section 4, a second support section 5, an inversion device 6, heads 7 and 8, drive units 11 and 12, and a control unit C. The first support section 4 supports a component carrier R that holds a plurality of components P on a holding surface S2, and the second support section 5 supports a substrate B having a mounting surface S1 on which components P are mounted. The inversion device 6 has component support sections (shutter surfaces 52 and 53) that support components P and inverts the front and back sides of the components P. The heads 7 and 8 hold the components P and transport them between the first support section 4, the inversion device 6, and the second support section 5. The drive units 11 and 12 move the heads 7 and 8. The control unit C makes at least one of the height positions between the holding surface S2 of the component carrier R and the component support section of the inversion device 6 before inversion, or the height position between the component support section of the inversion device 6 and the mounting surface S1 of the substrate B after inversion, substantially the same.

[0106] This configuration allows the distance that the heads 7 and 8 descend towards the first support section 4 or the second support section 5 from the height at which they move horizontally during transport to be matched with the distance they descend towards the reversing device 6. As a result, height control of the heads 7 and 8 becomes easier, and the time required for height adjustment is reduced. Consequently, the efficiency of the mounting operation is improved.

[0107] In the mounting device 1 of Embodiment 1, the control unit C makes the height position of the holding surface S2 of the component carrier R the same as the height position of the component support portion of the inversion device 6 before inversion, and makes the height position of the component support portion of the inversion device 6 after inversion substantially the same as the mounting surface S1 of the substrate B.

[0108] This configuration makes it even easier to control the height of heads 7 and 8.

[0109] In the mounting device 1 of Embodiment 1, the control unit C is capable of executing a first control and a second control that is different from the first control. In the first control, the pickup head 7 holds the component P in the first support section 4 with the first drive unit 11 and transports it to the inversion device 6. In the second control, the pickup head 7 holds the component P in the first support section 4 with the first drive unit 11 and transports it to the second support section 5. The control unit C makes the height position of the component support section of the inversion device 6 substantially the same before and after inversion.

[0110] With this configuration, the height positions of the first support section 4, the reversing device 6 before and after reversal, and the second support section 5 are all aligned. Therefore, even when switching between the first and second control modes, it becomes easy to control the height of the pickup head 7, and the time required for height adjustment can be reduced.

[0111] The mounting apparatus 1 of Embodiment 1 is a fixed-focus camera and further comprises cameras 9 and 10 that move together with the heads 7 and 8 by drive units 11 and 12. The cameras 9 and 10 capture images of the holding surface S2 of the component carrier R, the components in the inversion device 6 after inversion, and the mounting surface S1 of the substrate B.

[0112] This configuration ensures that the heights of the objects being imaged are aligned, thus reducing the need to adjust the heights of cameras 9 and 10 for focusing. Consequently, the efficiency of the implementation operation is further improved.

[0113] In the mounting device 1 of Embodiment 1, the head includes a first head (pickup head 7) that holds the component P in the first support section 4 and transports it to the inversion device 6 by a drive unit 11, and a second head (mounting head 8) that holds the inverted component P in the inversion device 6 and transports it to the second support section 5 by a drive unit 12.

[0114] This configuration allows for the separation of the operation of the pickup head 7 between the first support unit 4 and the reversing device 6, and the operation of the mounting head 8 between the reversing device 6 and the second support unit 5. The parallel movement of the two heads 7 and 8 further improves the efficiency of the mounting operation.

[0115] In the mounting apparatus 1 of Embodiment 1, the camera includes a first camera 9 that moves together with the pickup head 7 by a drive unit 11, and a second camera 10 that moves together with the mounting head 8 by a drive unit 12. The first camera 9 captures an image of the holding surface S2 of the component carrier R. The second camera 10 captures an image of the component P and the mounting surface S1 of the substrate B in the inverting apparatus 6 after inversion.

[0116] This configuration makes it easier to capture images of the component carrier R, the inversion device 6, and the substrate B in a configuration with two heads 7 and 8.

[0117] In the mounting apparatus 1 of Embodiment 1, the pickup head 7 has a plurality of nozzles, each capable of simultaneously holding a component P. The control unit C causes the first camera 9 to image the holding surface S2 of the component carrier R, and then causes the pickup head 7 to hold the plurality of components P.

[0118] This configuration reduces the time required to pick up component P, thereby further improving the efficiency of the mounting process.

[0119] In the mounting device 1 of Embodiment 1, when viewed from the height direction, the inversion device 6 is located between the first support part 4 and the second support part 5.

[0120] This configuration reduces the movement of heads 7 and 8 in the X and Y directions, thereby further improving the efficiency of the implementation operation.

[0121] The control method for the mounting apparatus 1 of Embodiment 1 includes holding components P with heads 7 and 8 from a first support section 4 that supports a component carrier R that holds a plurality of components P on a holding surface S2. The control method includes transporting components P to an inversion device 6 that has a component support section for supporting components P and inverts the front and back sides of components P, inverting the front and back sides of components P, transporting components to a second support section 5 that supports a substrate B, and mounting components P on the mounting surface S1 of the substrate B. At least one of the height position between the holding surface S2 of the component carrier R and the component support section of the inversion device 6 before inversion, or the height position between the component support section of the inversion device 6 after inversion and the mounting surface S1 of the substrate B is substantially the same.

[0122] This configuration makes it easier to control the height of heads 7 and 8, reducing the time required for height adjustment. Consequently, the efficiency of the mounting operation is improved.

[0123] This disclosure is not limited to Embodiment 1, and can be implemented in various other forms.

[0124] In Embodiment 1, an example was described in which the reversing device 6 has a plate member 31 and the component P is reversed by reversing the front and back sides of the plate member 31, but the invention is not limited to this. The mounting device 1 may have a component reversing device having other configurations. For example, the mounting device 1 may have a component reversing device that has two heads, each having a plurality of component suction nozzles, and reverses one head that has picked up a component to transfer the component to the other head. In such a component reversing device, the tip of the component suction nozzle functions as a component support that supports the component P.

[0125] In Embodiment 1, an example was described in which the mounting device 1 has two heads 7 and 8, but it is not limited to this. The mounting device 1 may also have one head that transports the component P between the first support unit 4, the inversion device 6, and the second support unit 5.

[0126] In Embodiment 1, an example was described in which the mounting device 1 has cameras 9 and 10, but it is not limited to this. Cameras 9 and 10 may be omitted from the mounting device 1.

[0127] In addition, Embodiment 1 may have other configurations for supplying components P, separate from the first support unit 4. The mounting device 1 may have, for example, a component supply unit such as a tray feeder, stick feeder, or tape feeder, separate from the first support unit 4. If the component supply unit is located further from the first support unit 4 than the second support unit 5, the mounting head 8 may pick up the components from the component supply unit and mount them onto the substrate B. In this case, the operation of heads 7 and 8 can be made independent by having the pickup head 7 perform the mounting of the inverted component P instead of the mounting head 8.

[0128] Embodiment 1 may have a processing unit that performs processing on the component P at a position further away from the first support 4 than from the second support 5. The processing unit is, for example, a transfer unit. The transfer unit is a unit for forming a film of transfer material such as flux on the surface of the component P, and is used in processes that require flux transfer, such as the PoP (Package-on-Package) top package mounting process. The mounting head 8 performs the transfer of component P by pressing the component P against the film formed by the transfer unit. The mounting head 8 may transport the component P to the processing unit after holding the component P housed in the inversion device 6. After that, the mounting head 8 may pass over the component recognition camera. The pickup head 7 may or may not pass over the component recognition camera 13 after holding the component P and before housing the component P in the inversion device 6.

[0129] In Embodiment 1, an example was described in which the heights of the holding surface S2, the back surface R12 before inversion, the front surface R11 after inversion, and the mounting surface S1 are substantially the same, but the invention is not limited to this. It is sufficient if the heights of the holding surface S2 and the back surface R12 before inversion are substantially the same, or if the heights of the front surface R11 after inversion and the mounting surface S1 are substantially the same. Even with such a configuration, height control of the heads 7 and 8 becomes easier.

[0130] In Embodiment 1, an example was described in which the surface R11 and back surface R12 of the plate member 31 are substantially the same height as the mounting surface S1 and the holding surface S2, but the invention is not limited to this. For example, other reference surfaces of the inversion device 6, such as the center surface S3, may be substantially the same height as the mounting surface S1 and the holding surface S2.

[0131] In Embodiment 1, an example was described in which the first camera 9 is fixed to the base 17 of the first drive unit 11 and the second camera 10 is fixed to the base 18 of the second drive unit 12, but the invention is not limited to this. Cameras 9 and 10 only need to be connected to the pickup head 7 and mounting head 8 so as to be movable in the XY direction. For example, cameras 9 and 10 may be directly fixed to the pickup head 7 and mounting head 8, respectively.

[0132] In Embodiment 1, an example was described in which the mounting device 1 has a component recognition camera 13 positioned between the first support portion 4 and the second support portion 5, but the invention is not limited to this. The mounting device 1 may also have another component recognition camera positioned further from the first support portion 4 than the second support portion 5, which images the component P passing above from below. In this case, the mounting head 8 may pass above the component recognition camera after holding the component P housed in the inversion device 6. The mounting head 8 may align the component P with respect to the substrate B according to the recognition result of the component recognition camera before mounting the component P.

[0133] In Embodiment 1, an example was described in which the mounting head 8 passes above the component recognition camera 13, but the invention is not limited to this. The pickup head 7 may also pass above the component recognition camera 13 after it has held the component P but before it is placed in the inversion device 6. This operation allows the component P to be placed in the inversion device 6 with high precision.

[0134] In Embodiment 1, an example was described in which the control unit C performs both the first and second controls, but the invention is not limited to this. The control unit C may perform only the first control. In this case, the control unit C controls the number of times the reversing device 6 reverses in the reversing operation of step S20 based on the production program or information about the part P. Specifically, for parts P that require reversal, the control unit C determines the number of reversals of the reversing device 6 to be 1, i.e., the amount of rotation of the reversing device 6 to be 180°. For parts P that do not require reversal, the control unit C determines the number of reversals of the reversing device 6 to be 0 or 2, i.e., the amount of rotation of the reversing device 6 to be 0 or 360°.

[0135] In Embodiment 1, the control unit C was described as performing the second control using the pickup head 7, but it is not limited to this. The control unit C may also perform the second control using the mounting head 8.

[0136] In Embodiment 1, an example was described in which, after capturing the first image D1, each nozzle of the pickup head 7 attracts and holds the component P, but the invention is not limited to this. After capturing the first image D1, one nozzle of the pickup head 7 may attract and hold the component P. That is, the first camera 9 may capture the first image D1 each time it holds one component P. Similarly, after capturing the second image D2, one nozzle of the mounting head 8 may attract and hold the component P, and the second camera 10 may capture the second image D2 each time it holds one component P. With this operation, the heads 7 and 8 can pick up the component P more reliably and suppress the dropping of the component P.

[0137] In Embodiment 1, an example was described in which the first image D1 targets a circuit pattern on component P, but the invention is not limited to this. For example, the first image D1 may target an edge of component P that is in contact with the holding surface S2 of the component carrier R. By targeting the circuit pattern on component P with the first image D1, defects in the internal circuit of component P can be detected.

[0138] In Embodiment 1, an example was described in which the first camera 9 captures only the first image D1 when inversion is performed, but the invention is not limited to this. For example, the first camera 9 may capture an image of the back surface R12 of the plate member 31 before inversion. The second image D2 targets, for example, a recognition mark provided on the surface supporting the component P, facing the back surface R12 of the plate member 31. By performing such operations, calibration and maintenance of the relative position between the first camera 9 and the inversion device 6 can be performed.

[0139] In Embodiment 1, an example was described in which the second camera 10 captures both images D2 and D3, but the invention is not limited to this. The capture of the second image D2 by the second camera 10 may be omitted. Omitting the capture of the second image D2 improves the mounting efficiency of the mounting device 1. On the other hand, performing the capture of the second image D2 enables high-precision handling of the component P.

[0140] Cameras 9 and 10 may capture one or more recognition marks in one or more images in each of the images D1 to D3. If the component holding section 21 of the inversion device 6 is replaceable depending on the type of component P, the second camera 10 or other camera may, in addition to or instead of the second image D2, capture an image of the component holding section 21 to confirm whether the correct one corresponding to component P is installed. Recognition holes may be provided in the component holding section 21 of the inversion device 6 for imaging.

[0141] The mounting apparatus in the first embodiment includes a first support section that supports a component carrier that holds a plurality of components on a holding surface, a second support section that supports a substrate having a mounting surface on which components are mounted, an inversion device that has a component support section for supporting components and inverts the front and back sides of components, a head that holds components and transports them between the first support section, the inversion device and the second support section, a drive section for moving the head, and a control section, wherein the control section makes substantially the same at least one of the height position between the holding surface of the component carrier and the component support section of the inversion device before inversion, or the height position between the component support section of the inversion device after inversion and the mounting surface of the substrate.

[0142] In the second embodiment, as a mounting apparatus, in the mounting apparatus of the first embodiment, the control unit makes the height position of the component carrier holding surface and the component support portion of the inverting device before inversion substantially the same, and makes the height position of the component support portion of the inverting device after inversion substantially the same as the mounting surface of the substrate.

[0143] In a third embodiment of the mounting apparatus, in the mounting apparatus of the second embodiment, the control unit is capable of performing a first control and a second control different from the first control, in the first control, the head holds the component at the first support by a drive unit and transports it to the inversion device, in the second control, the head holds the component at the first support by a drive unit and transports it to the second support, and the control unit makes the height position of the component support of the inversion device substantially the same before and after inversion.

[0144] As a mounting apparatus in the fourth embodiment, the mounting apparatus in any of the first to third embodiments further comprises a fixed-focus camera which moves together with the head by a drive unit, and the camera captures an image of the holding surface of the component carrier, or an image of the mounting surface of the component and substrate in the inversion device after inversion.

[0145] In the fifth embodiment, as a mounting apparatus, in the mounting apparatus of the fourth embodiment, the head includes a first head that holds the component in the first support section by a drive unit and transports it to an inversion device, and a second head that holds the inverted component in the inversion device by a drive unit and transports it to a second support section.

[0146] In the sixth embodiment, the mounting apparatus, in the fifth embodiment, includes a first camera that moves together with the first head by a drive unit, and a second camera that moves together with the second head by a drive unit, wherein the first camera captures an image of the holding surface of the component carrier, and the second camera captures an image of the mounting surface of the component and the substrate in the inverted inverting apparatus.

[0147] In the seventh embodiment, as a mounting apparatus, in the fourth embodiment, the head holds the component in the first support section with a drive unit and transports it to the inversion device, and holds the inverted component in the inversion device and transports it to the second support section.

[0148] As a mounting apparatus in the eighth embodiment, in a mounting apparatus in any of the fourth to seventh embodiments, the head has a plurality of nozzles, each capable of simultaneously holding a component, and the control unit causes the camera to capture an image of the holding surface of the component carrier, and then causes the head to hold the plurality of components.

[0149] In the ninth embodiment, as an mounting device, in any of the first to eighth embodiments, the inversion device is located between the first support and the second support when viewed from the height direction.

[0150] The control method for the mounting apparatus in the tenth embodiment includes: holding components with a head from a first support portion that supports a component carrier that holds a plurality of components on a holding surface; transporting the components to an inversion device that has a component support portion that supports the components and inverts the front and back sides of the components; inverting the front and back sides of the components with the inversion device; transporting the components to a second support portion that supports a substrate; and mounting the components on the mounting surface of the substrate, wherein at least one of the height position between the holding surface of the component carrier and the component support portion of the inversion device before inversion, or the height position between the component support portion of the inversion device after inversion and the mounting surface of the substrate, is substantially the same.

[0151] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined by the appended claims, as long as they do not fall outside that scope. [Industrial applicability]

[0152] The mounting apparatus of this disclosure is particularly useful in mounting apparatuses that invert components and mount them onto a substrate. [Explanation of Symbols]

[0153] 1. Mounting device 2 bases 4 First support part 5 Second support part 6. Inversion device 7 Pickup head 8 Mounting Head 9. Camera 1 10. Second camera 11 First drive unit 12 Second drive unit 31 Plate Member C control section S1 Implementation side S2 holding surface S3 center plane R11 surface R12 Reverse side

Claims

1. A first support portion supports a component carrier that holds multiple components on a holding surface, A second support portion supports a circuit board having a mounting surface on which components are mounted, A component support section is provided to support the component, and a reversing device is provided to reverse the front and back sides of the component. A head that holds the parts and transports them between the first support unit, the reversing device, and the second support unit, A drive unit for moving the head, It comprises a control unit and, The control unit makes at least one of the height positions of the holding surface of the component carrier and the component support portion of the inversion device before inversion, or the height position of the component support portion of the inversion device after inversion and the mounting surface of the substrate substantially the same.

2. The mounting apparatus according to claim 1, wherein the control unit makes the height position of the holding surface of the component carrier substantially the same as the height position of the component support portion of the reversing device before reversal, and makes the height position of the component support portion of the reversing device after reversal substantially the same as the height position of the mounting surface of the substrate.

3. The control unit is capable of executing a first control and a second control different from the first control. In the first control, the head holds the component in the first support section with the drive unit and transports it to the reversing device. In the second control, the head holds the component in the first support unit and transports it to the second support unit by the drive unit. The mounting apparatus according to claim 2, wherein the control unit makes the height position of the component support portion of the reversing device substantially the same before and after reversal.

4. A fixed-focus camera, further comprising a camera that moves together with the head by the drive unit, The mounting apparatus according to any one of claims 1 to 3, wherein the camera captures an image of the holding surface of the component carrier, an image of the component in the inversion device after inversion, and an image of the mounting surface of the substrate.

5. The mounting apparatus according to claim 4, wherein the head includes a first head that holds the component in the first support section and transports it to the reversing device by the drive unit, and a second head that holds the reversed component in the reversing device and transports it to the second support section by the drive unit.

6. The camera comprises a first camera that moves together with the first head by the drive unit, and a second camera that moves together with the second head by the drive unit. The first camera captures an image of the holding surface of the component carrier, The mounting apparatus according to claim 5, wherein the second camera captures an image of the component in the inversion device after inversion and the mounting surface of the substrate.

7. The mounting apparatus according to claim 4, wherein the head holds the component in the first support section by the drive unit and transports it to the reversing device, and holds the component after reversal in the reversing device and transports it to the second support section.

8. The head has a plurality of nozzles, each capable of simultaneously holding a part, The mounting apparatus according to claim 4, wherein the control unit causes the camera to capture an image of the holding surface of the component carrier, and then causes the head to hold a plurality of components.

9. The mounting device according to any one of claims 1 to 3, wherein, when viewed from the height direction, the inversion device is located between the first support portion and the second support portion.

10. From the first support section, which supports a component carrier that holds multiple components on the holding surface, to the head that holds the components, It has a component support section that supports the component, and transports the component to a reversing device that flips the component over. The reversing device inverts the front and back sides of the component, The process involves transporting components to the second support section where the circuit board is supported, This includes mounting components on the mounting surface of the circuit board, A control method for a mounting device, wherein at least one of the height positions between the holding surface of the component carrier and the component support portion of the inversion device before inversion, or the height position between the component support portion of the inversion device after inversion and the mounting surface of the substrate, is substantially the same.

Images