Mounting mask and method for manufacturing the mounting mask

Abstract

We provide a mounting mask that allows for greater flexibility in the placement of posts. [Solution] The mounting mask 4 comprises a thin plate forming section 10, a first post section 11, and a second post section 12. An opening pattern 6 for allowing conductive material to pass through is formed in the thin plate forming section 10. The first post section 11 is positioned to face the surface 5a when the conductive material is mounted on the substrate 5. The second post section 12 has a post height h2 that is greater than the post height h1 of the first post section 11, and is positioned to face the surface 5b when the conductive material is mounted on the substrate 5.

Description

Technical Field

[0001] The present disclosure relates to a mounting mask for mounting a conductive material on an object to be mounted and a method for manufacturing the mounting mask.

Background Art

[0002] Patent Document 1 describes a mask for mounting solder balls on an object to be mounted. The mask described in Patent Document 1 includes support protrusions for bending the mask body and slightly vibrating it. The support protrusions include a first protrusion and a second protrusion having a smaller protrusion dimension than the first protrusion.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a mask provided with protrusions (posts), it is preferable that the protrusions contact the object to be mounted when mounting the solder balls. Since conventional masks have only protrusions of the same size, for example, when a recess is formed in the object to be mounted, the protrusions have to be arranged avoiding the recess.

[0005] In addition, in the mask described in Patent Document 1, the second protrusion does not have the functions of the first protrusion.

[0006] The present disclosure has been made to solve the above-described problems. An object of the present disclosure is to provide a mounting mask capable of increasing the degree of freedom in arranging posts. Another object of the present disclosure is to provide a method for manufacturing such a mounting mask.

Means for Solving the Problems

[0007] The mounting mask according to this disclosure is a mounting mask for mounting a conductive material onto an object to be mounted, which has a first surface and a second surface that is recessed from the first surface. The mounting mask comprises a thin plate forming portion having an opening pattern formed thereon for allowing the conductive material to pass through, a first post portion positioned to face the first surface when mounting the conductive material onto the object to be mounted, and a second post portion having a post height greater than the post height of the first post portion and positioned to face the second surface when mounting the conductive material onto the object to be mounted.

[0008] The mounting mask according to this disclosure is a mounting mask for mounting a conductive material onto an object to be mounted. The mounting mask comprises a thin plate forming portion having an opening pattern formed thereon for allowing the conductive material to pass through, a first post portion arranged to surround the periphery of the opening pattern, and a second post portion having a post height greater than the post height of the first post portion and arranged within the region surrounded by the first post portion.

[0009] The mounting mask according to this disclosure is a mounting mask for mounting a conductive material onto an object to be mounted. The mounting mask has an opening pattern for allowing the conductive material to pass through and comprises a thin plate forming portion formed of a first plating layer, a first post portion formed of a plurality of plating layers including the first plating layer, and a second post portion having a post height greater than the post height of the first post portion and formed of a plurality of plating layers including the first plating layer. When mounting the conductive material onto the object to be mounted, the surface of the thin plate forming portion, the surface of the first post portion, and the surface of the second post portion facing the object to be mounted are formed of the first plating layer.

[0010] The manufacturing method for a mounting mask according to this disclosure comprises: a first step of forming a first resist on a base material so as to surround the area where the third plating layer is formed; a second step of plating the base material after the first step; a third step of removing the first resist after the second step; a fourth step of leaving the third plating layer on the base material by peeling off the plating formed in the second step, excluding the plating formed in the area where the third plating layer is formed; a fifth step of forming a second resist on at least the base material so as to surround the areas where the fourth plating layer and the second plating layer are formed, after the third and fourth steps; and after the fifth step, the base material and The process comprises: a sixth step of plating the third plating layer; a seventh step of removing the second resist after the sixth step; an eighth step of removing the plating from the sixth step that is not formed in the fourth plating layer formation region and the second plating layer formation region, thereby leaving the fourth plating layer on the base material and the second plating layer on at least the third plating layer; a ninth step of forming a third resist on the base material corresponding to a plurality of through holes included in the opening pattern after the eighth step; and a tenth step of plating at least the base material, the fourth plating layer, and the second plating layer to form the first plating layer after the ninth step. [Effects of the Invention]

[0011] The mounting mask described in this disclosure allows for greater flexibility in the placement of posts. [Brief explanation of the drawing]

[0012] [Figure 1] This figure shows an example of a plate equipped with a mounting mask in Embodiment 1. [Figure 2] This figure shows a cross-section of the plate shown in Figure 1. [Figure 3] This figure shows an example of a mask for mounting. [Figure 4] This is an enlarged view of section C in Figure 3. [Figure 5] This is a diagram showing the DD cross-section, as shown in Figure 4. [Figure 6] This flowchart shows an example of a method for manufacturing the mounting mask in Embodiment 1. [Figure 7] It is a diagram for explaining a method of manufacturing a mounting mask. [Figure 8] It is a diagram for explaining a method of manufacturing a mounting mask. [Figure 9] It is a diagram for explaining a method of manufacturing a mounting mask. [Figure 10] It is a diagram for explaining an example of another method of forming a plating layer. [Figure 11] It is a diagram showing another example of a mounting mask.

Mode for Carrying Out the Invention

[0013] A detailed description will be given below with reference to the drawings. Redundant descriptions will be appropriately simplified or omitted. In each figure, the same reference numerals indicate the same or corresponding parts.

[0014] Embodiment 1. FIG. 1 is a diagram showing an example of Plate 1 provided with a mounting mask 4 in Embodiment 1. FIG. 2 is a diagram showing a cross-section of Plate 1 shown in FIG. 1. Plate 1 includes a frame 2, a screen 3, and a mounting mask 4. The mounting mask 4 is provided on the frame 2 via the screen 3. The screen 3 is arranged around the mounting mask 4. Tension is applied to the mounting mask 4 by the screen 3.

[0015] The mounting mask 4 is used to mount a solid conductive substance such as a solder ball or a copper pillar on an object to be mounted. The object to be mounted is the target on which the conductive substance is mounted. As an example, the object to be mounted is an IC substrate. The object to be mounted may also be a semiconductor wafer or the like. The object to be mounted may not be a single object, but may be a composite object in which, for example, an interposer or the like is combined with an IC substrate. FIG. 2 shows a simple example in which the object to be mounted is a single substrate 5. As shown in FIG. 2, when the conductive substance is mounted on the object to be mounted, the mounting mask 4 is arranged above the object to be mounted.

[0016] A large number of conductive substances are supplied to the supply surface 4a of the mounting mask 4. The supply surface 4a is flat. As shown in FIG. 2, when the conductive substance is mounted on the object to be mounted, the supply surface 4a faces upward. The conductive substance supplied to the supply surface 4a passes through the mounting mask 4 and is mounted at an appropriate position on the object to be mounted.

[0017] FIG. 3 is a diagram showing an example of the mounting mask 4. FIG. 3 is a view of the mounting mask 4 seen from the B direction in FIG. 2. FIG. 3 shows the surface facing the object to be mounted when the conductive substance is mounted on the object to be mounted. Hereinafter, this surface will also be referred to as the opposing surface 4b. FIG. 4 is an enlarged view of part C in FIG. 3. FIG. 5 is a diagram showing the D-D cross section of FIG. 4. Note that FIG. 2 shows a cross section corresponding to FIG. 5.

[0018] In FIG. 5, the substrate 5 is indicated by a two-dot chain line. In the example shown in this embodiment, a step is formed on the substrate 5 which is the object to be mounted. As shown in FIG. 5, the substrate 5 has a surface 5a (first surface) and a surface 5b (second surface) recessed from the surface 5a.

[0019] FIG. 5 shows a state in which the mounting mask 4 is disposed above the substrate 5 in order to mount the conductive substance on the substrate 5. In the state shown in FIG. 5, that is, in the state of mounting the conductive substance on the substrate 5, the surface 5b is disposed at a position farther from the supply surface 4a than the surface 5a. In FIGS. 3 and 4, the region of the substrate 5 where the surface 5b is formed is indicated by a two-dot chain line.

[0020] An opening pattern 6 is formed in the mounting mask 4. The opening pattern 6 includes a large number of through holes 7 for allowing the conductive substance to pass through. That is, the conductive substance supplied to the supply surface 4a passes through the through holes 7 and drops to an appropriate position on the substrate 5. In FIGS. 3 and 4, the opening pattern 6 is indicated by hatching surrounded by a one-dot chain line. The arrangement of the opening pattern 6, that is, the number and position of the through holes 7 are arbitrarily set according to the specifications of the substrate 5 and the like.

[0021] The mounting mask 4 comprises a thin plate forming section 10, a first post section 11, and a second post section 12. An opening pattern 6 for allowing conductive material to pass through is formed in the thin plate forming section 10. Figure 5 shows a preferred example in which the thin plate forming section 10 is formed in the shape of a thin plate having a certain thickness t0.

[0022] The first post portion 11 and the second post portion 12 are thicker than the thin plate forming portion 10. As described above, the supply surface 4a is flat. The supply surface 4a consists of the surface of the thin plate forming portion 10, the surface of the first post portion 11, and the surface of the second post portion 12, which face upward when the conductive material is mounted. Therefore, the opposing surface 4b that faces the substrate 5 when the conductive material is mounted is formed so that each portion of the first post portion 11 and the second post portion 12 protrudes downward. The opposing surface 4b consists of the surface of the thin plate forming portion 10, the surface of the first post portion 11, and the surface of the second post portion 12, which face downward when the conductive material is mounted.

[0023] Figure 5 shows a preferred example in which the mounting mask 4 comprises two types of post sections: a first post section 11 having a thickness t1 and a second post section 12 having a thickness t2. In the example shown in Figure 5, the thickness t2 of the second post section 12 is greater than the thickness t1 of the first post section 11. Hereafter, the distance from the surface of the thin plate forming section 10 that faces downward when the conductive material is mounted is also referred to as the post height. In the example shown in Figure 5, the post height h2 (=t2-t0) of the second post section 12 is greater than the post height h1 (=t1-t0) of the first post section 11.

[0024] The first post portion 11 is a post portion formed to match the surface 5a of the substrate 5. The first post portion 11 is positioned to face the surface 5a when the conductive material is mounted on the substrate 5. The second post portion 12 is a post portion formed to match the surface 5b of the substrate 5. The second post portion 12 is positioned to face the surface 5b of the substrate 5 when the conductive material is mounted on the substrate 5. In the example shown in Figure 3, the post portion located in the area enclosed by the dashed line is the second post portion 12. The post portion located in the area other than the area enclosed by the dashed line is the first post portion 11.

[0025] The mounting mask 4 may have three or more types of post sections. For example, if the substrate 5 has a third surface recessed from surface 5b in addition to surfaces 5a and 5b, the mounting mask 4 may further include a third post section. The third post section has a thickness greater than the thickness t2 of the second post section 12, i.e., a post height greater than the post height h2. The third post section is positioned to face the third surface of the substrate 5 when mounting the conductive material onto the substrate 5, and contacts the third surface.

[0026] In the preferred example shown in this embodiment, the post portions arranged in three rows to surround the periphery of the opening pattern 6 are the first post portions 11. This is based on the fact that the surface 5b of the substrate 5 is rarely formed to extend beyond the area where the conductive material is mounted. In this example, the second post portion 12 is located within the region surrounded by the three rows of first post portions 11. As shown in Figure 3, a portion of the first post portions 11 may also be located within the region surrounded by these three rows of first post portions 11.

[0027] Furthermore, in the preferred example shown in this embodiment, the mounting mask 4 is formed by multiple plating layers. Viewing the mounting mask 4 from the viewpoint of the plating layers, the mounting mask 4 comprises a plating layer 21 (first plating layer), a plating layer 22 (second plating layer), a plating layer 23 (third plating layer), and a plating layer 24 (fourth plating layer). Each plating layer provided on the mounting mask 4 is formed by a plating method such as electroforming or electroless plating.

[0028] Plating layer 21 is provided so as to cover the other plating layers, namely plating layer 22, plating layer 23, and plating layer 24, from one side. This one side is the side that is in close proximity to the substrate 5 when the conductive material is mounted. Therefore, the opposing surface 4b that faces the substrate 5 when the conductive material is mounted is formed by plating layer 21.

[0029] In the preferred example shown in Figure 5, the thin plate forming portion 10 is formed by a plating layer 21. The first post portion 11 is formed by multiple plating layers including the plating layer 21. The second post portion 12 is formed by multiple plating layers including the plating layer 21.

[0030] Specifically, plating layers 22 and 23 are plating layers for forming the second post portion 12. That is, the second post portion 12 is formed by plating layer 21, plating layer 22, and plating layer 23. Plating layer 22 is positioned between plating layer 21 and plating layer 23. Of the surface of plating layer 23, the surface that faces upward when the conductive material is mounted is part of the supply surface 4a.

[0031] The plating layer 24 is a plating layer for forming the first post portion 11. That is, the first post portion 11 is formed by the plating layer 21 and the plating layer 24. Of the surface of the plating layer 24, the surface that faces upward when the conductive material is mounted is part of the supply surface 4a. Figure 5 shows a preferred example in which the number of plating layers forming the second post portion 12 is greater than the number of plating layers forming the first post portion 11.

[0032] When the manufacturing method described later is adopted, the plating layer 22 contained in the second post section 12 and the plating layer 24 contained in the first post section 11 are produced simultaneously. In this case, the plating layer 24 has the same thickness as the plating layer 22. The thickness of the plating layer 24 is set to match the post height h1 of the first post section 11. The thickness of the plating layer 23 is set to match the value obtained by subtracting the post height h1 from the post height h2 of the second post section 12.

[0033] Next, a method for manufacturing the mounting mask 4 will be described, with reference to Figures 6 to 9. Figure 6 is a flowchart showing an example of a method for manufacturing the mounting mask 4 in Embodiment 1. Figures 7 to 9 are diagrams illustrating the method for manufacturing the mounting mask 4.

[0034] First, in step S101, a first step is performed to form a first resist 31 on the base material 30. In this embodiment, the resist is an example of a photosensitive material. In the first step, first, a conductive base material 30 is prepared as shown in Figure 7(a). Next, a layered resist is formed on the surface 30a of the base material 30, and then exposure and development are performed. As a result, as shown in Figure 7(b), an annular first resist 31 is formed on the surface 30a of the base material 30 so as to surround the area for forming the plating layer 23. Hereinafter, the area for forming the plating layer 23 will also be referred to as area F3.

[0035] After the first step, in step S102, a second step is performed in which primary plating is carried out on the surface 30a of the base material 30. As a result, a plating layer is formed on the area F3 surrounded by the first resist 31 and the area other than area F3 of the surface 30a. For example, in the second step, primary plating is performed so that the thickness of the plating layer is the value obtained by subtracting the post height h1 of the first post portion 11 from the post height h2 of the second post portion 12.

[0036] In the following, the plating formed in region F3 during the second step will be denoted by the code J3, and the plating formed in regions other than region F3 will be denoted by the code J5. As a result of the second step, the base material 30 is plated, and as shown in Figure 7(c), plating layers J3 and J5 are formed on the surface 30a.

[0037] After the second step, in S103, a third step is performed to remove the first resist 31. In the third step, a stripping solution is used to remove the first resist 31. As a result, the first resist 31 is removed from the base material 30, as shown in Figure 7(d).

[0038] After the third step, in S104, a fourth step is performed to remove the plating that was formed in the second step, excluding the plating formed in region F3. That is, in the fourth step, the plating layer J5 is removed from the base material 30. As a result, as shown in Figure 7(e), the plating layer J3 remains on the surface 30a of the base material 30. The plating layer 23 is the plating layer J3 that was not removed from the base material 30 in the fourth step and remained on the surface 30a.

[0039] The order of steps 3 and 4 can be reversed. For example, step 4 may be performed immediately after step 2, and step 3 may be performed after step 4.

[0040] After steps 3 and 4, step 5 is performed in S105 to form a second resist 32 on the base material 30 and the plating layer J3. In step 5, a layered resist is formed to cover the surface of the plating layer J3 and the surface 30a of the base material 30 where the plating layer J3 is not formed, and then exposure and development are performed. As a result, as shown in Figure 8(a), an annular second resist 32 is formed on the surface 30a of the base material 30 and the surface of the plating layer J3, surrounding the respective formation regions of the plating layer 24 and the plating layer 22. Figure 8(a) shows an example where the formation region of the plating layer 24 is on the surface 30a of the base material 30 and the formation region of the plating layer 22 is on the plating layer J3. Hereafter, the formation region of the plating layer 24 will also be referred to as region F4, and the formation region of the plating layer 22 will also be referred to as region F2.

[0041] After the fifth step, in S106, a sixth step is performed in which secondary plating is carried out on the surface 30a of the base material 30 and the surface of the plating layer J3. As a result, a plating layer is formed on the region F4 surrounded by the second resist 32 and the region other than region F4 of the surface 30a, and on the surface of the plating layer J3 in region F2 surrounded by the second resist 32. For example, in the sixth step, secondary plating is performed so that the thickness of the plating layer is the same as the post height h1 of the first post portion 11.

[0042] In the following steps, the plating formed in region F4 is designated as J4, and the plating formed in region F2 is designated as J2. In addition, the plating formed in regions other than F4 and F2 is designated as J6. As a result of the sixth step, the base material 30 and the plating layer J3 are plated, and as shown in Figure 8(b), the plating layer J4 and the plating layer J6 are formed on the surface 30a, and the plating layer J2 is formed on the surface of the plating layer J3.

[0043] After the sixth step, in S107, the seventh step is performed to remove the second resist 32. In the seventh step, a stripping solution is used to remove the second resist 32. As a result, the second resist 32 is removed from the base material 30 and the plating layer J3, as shown in Figure 8(c).

[0044] After the seventh step, in S108, the eighth step is performed to remove the plating that was formed in the sixth step, excluding the plating formed in regions F4 and F2. That is, in the eighth step, the plating layer J6 is removed from the base material 30. As a result, as shown in Figure 8(d), the plating layer J4 remains on the surface 30a of the base material 30. The plating layer 24 is the plating layer J4 that remained on the surface 30a of the base material 30 without being removed in the eighth step. In addition, the plating layer J2 remains on the surface of the plating layer J3. The plating layer 22 is the plating layer J2 that remained on the surface of the plating layer J3 without being removed in the eighth step.

[0045] The order of steps 7 and 8 can be reversed. For example, step 8 may be performed immediately after step 6, and step 7 may be performed after step 8.

[0046] After steps 7 and 8, step 9 is performed in S109 to form a third resist 33 on the base material 30. The third resist 33 is a resist corresponding to the multiple through holes 7 included in the opening pattern 6. That is, the third resist 33 is provided at the positions where the through holes 7 are formed. In step 9, a layered resist is formed to cover the plating layers J2 to J4 and the surface 30a of the base material 30 where the plating layers J2 to J4 are not formed, and then exposure and development are performed. As a result, the third resist 33 is formed on the surface 30a of the base material 30, as shown in Figure 9(a).

[0047] After step 9, step 10 is performed in S110, in which tertiary plating is performed on the plating layers J2 to J4 and the base material 30. As a result, as shown in Figure 9(b), a plating layer J1 is formed so as to cover the plating layers J2 to J4 and the surface 30a of the base material 30. The plating layer J1 formed in step 10 is the first plating layer 21.

[0048] After step 10, step 11 is performed in S111 to remove the third resist 33. In step 11, a stripping solution is used to remove the third resist 33. As the third resist 33 is removed, holes are formed in the plating layer J1, as shown in Figure 9(c). The holes formed in the plating layer J1 in step 11 are through holes 7.

[0049] Finally, in step S112, a 12th step is performed to separate the plating layers J1 to J4 from the base material 30 as a single unit. This allows for the creation of a mounting mask 4 as shown in Figures 3 to 5. By attaching the mounting mask 4 to the frame 2 via the mesh 3, the plate 1 as shown in Figures 1 and 2 is completed.

[0050] The mounting mask 4 shown in this embodiment includes a first post portion 11 formed to match the surface 5a of the substrate 5 and a second post portion 12 formed to match the surface 5b of the substrate 5. The first post portion 11 is positioned to face the surface 5a when mounting the conductive material onto the substrate 5. The second post portion 12 is positioned to face the surface 5b of the substrate 5 when mounting the conductive material onto the substrate 5. Therefore, for example, even if a recess is formed in the object to be mounted, it is not necessary to position the post portion to avoid the recess, and the degree of freedom in positioning the post portion can be increased.

[0051] In this embodiment, an example was shown where the area of ​​surface 5b is smaller than the area of ​​surface 5a. In other examples, the area of ​​surface 5b may be larger than the area of ​​surface 5a. For example, the area of ​​surface 5b may be significantly larger than the area of ​​surface 5a, and surface 5a may be the surface of a portion of the substrate 5 that is formed like a convex part. In this example as well, surface 5b is a surface that is recessed compared to surface 5a.

[0052] In this embodiment, an example is shown where the mounted object is a single substrate 5, and the substrate 5 has a surface 5a (first surface) and a surface 5b (second surface). In other examples, if the mounted object includes multiple objects, one of the objects may have a first surface corresponding to surface 5a, and another object may have a second surface corresponding to surface 5b. For example, if the mounted object is a composite object combining an IC substrate and an interposer, the first surface may be formed on the interposer and the second surface on the IC substrate.

[0053] Furthermore, the mask described in Patent Document 1 may result in a deterioration of the flatness of the supply surface for the conductive material. On the other hand, the mounting mask 4 shown in this embodiment, which is formed by multiple plating layers, can prevent deterioration of the flatness of the supply surface 4a, even if it is equipped with multiple types of post portions.

[0054] In this embodiment, a preferred example was described in which the plating layer J2 is formed only on the surface of the plating layer J3 in the sixth step. In this example, the accuracy of the thickness of the plating layer 22 can be improved.

[0055] As another example, in step 6, the plating layer J2 may be formed on the surface of the plating layer J3 and on the surface 30a of the base material 30. Figure 10 is a diagram illustrating an example of another method for forming the plating layer J2. In the example shown in Figure 10, in step 5, the second resist 32 is formed on the surface 30a of the base material 30, and the second resist 32 is not formed on the plating layer J3. The second resist 32 is arranged to surround the plating layer J3 (see Figure 10(a)).

[0056] Then, in the sixth step, plating is performed on the plating layer J3 and the base material 30, forming a plating layer J2 on the surface of the plating layer J3 and the surrounding surface 30a, as shown in Figure 10(b). Subsequently, in the seventh step, the second resist 32 is removed, and in the eighth step, the plating layer J6 is removed, leaving the plating layer J2 on the surface of the plating layer J3 and the surface 30a of the base material 30. In the tenth step, tertiary plating is performed on the plating layer J2, the plating layer J4, and the base material 30.

[0057] In this embodiment, a preferred example was described in which the number of plating layers forming the second post portion 12 is greater than the number of plating layers forming the first post portion 11. When the mounting mask 4 is provided with multiple types of post portions, it is preferable that the number of plating layers included in the post portion with a larger post height is greater. However, if the manufacturability of the mounting mask 4 is not considered, it is also possible, for example, to make the number of plating layers in the post portion with a larger post height the same as the number of plating layers in the post portion with a smaller post height. Furthermore, it is also possible to make the number of plating layers in the post portion with a larger post height less than the number of plating layers in the post portion with a smaller post height.

[0058] In this embodiment, a preferred example has been described in which all of the post portions arranged to surround the opening pattern 6 (hereinafter also referred to as the "surrounding post portion") are first post portions 11. In other examples, the surrounding post portion may include both the first post portion 11 and the second post portion 12.

[0059] Figure 11 shows another example of the mounting mask 4. The mounting mask 4 shown in Figure 11 differs from the mounting mask 4 shown in Figure 3 in that the second post portion 12 is also positioned outside the opening pattern 6. That is, in the example shown in Figure 11, both the first post portion 11 and the second post portion 12 are included in the surrounding post portion.

[0060] Furthermore, the second post portion 12, which is located outside the opening pattern 6 and constitutes the peripheral post portion, is a post portion formed to match the surface 5b of the substrate 5, similar to the second post portion 12 located within the region surrounded by the peripheral post portion. That is, this second post portion 12 located outside the opening pattern 6 is also positioned to face the surface 5b when the conductive material is mounted on the substrate 5, and contacts the surface 5b, similar to the second post portion 12 shown in Figure 3. In addition, in the example shown in Figure 11, a part of the first post portion 11 may also be located within the region surrounded by the peripheral post portion.

[0061] Examples of aspects that may be included in this disclosure are listed below as an addendum.

[0062] [Note 1] A mounting mask for mounting a conductive material onto an object having a first surface and a second surface recessed from the first surface, A thin plate forming portion having an opening pattern formed for allowing the conductive material to pass through, A first post portion is positioned to face the first surface when the conductive material is mounted on the object to be mounted, A second post portion having a post height greater than the post height of the first post portion and positioned to face the second surface when the conductive material is mounted on the object to be mounted, A mask for mounting, equipped with the following features. [Note 2] The thin plate forming portion is formed by the first plating layer, The first post portion is formed of a plurality of plating layers including the first plating layer, The second post portion is formed of a plurality of plating layers including the first plating layer, The mounting mask according to Appendix 1, wherein the surface of the thin plate forming portion, the surface of the first post portion, and the surface of the second post portion facing the object to be mounted when the conductive material is mounted onto the object to be mounted are formed of the first plating layer. [Note 3] A mounting mask for mounting conductive material onto an object to be mounted, A thin plate forming portion having an opening pattern formed for allowing the conductive material to pass through, A first post portion is arranged to surround the periphery of the aforementioned opening pattern, A second post portion having a post height greater than the post height of the first post portion and positioned within the region enclosed by the first post portion, A mask for mounting, equipped with the following features. [Note 4] The thin plate forming portion is formed by the first plating layer, The first post portion is formed of a plurality of plating layers including the first plating layer, The second post portion is formed of a plurality of plating layers including the first plating layer, The mounting mask according to Appendix 3, wherein the surface of the thin plate forming portion, the surface of the first post portion, and the surface of the second post portion facing the object to be mounted when the conductive material is mounted onto the object to be mounted are formed of the first plating layer. [Note 5] A mounting mask for mounting conductive material onto an object to be mounted, A thin plate forming portion formed by a first plating layer, having an opening pattern for allowing the conductive material to pass through, A first post portion formed of a plurality of plating layers including the first plating layer, A second post portion having a post height greater than the post height of the first post portion and formed of multiple plating layers including the first plating layer, Equipped with, A mounting mask in which the surface of the thin plate forming portion, the surface of the first post portion, and the surface of the second post portion facing the object to be mounted when the conductive material is mounted onto the object to be mounted are formed of the first plating layer. [Note 6] The first post portion is arranged to surround the periphery of the opening pattern, The second post portion is a mounting mask as described in Appendix 1 or Appendix 5, located within the area enclosed by the first post portion. [Note 7] The mounted object has a first surface and a second surface that is recessed from the first surface. The first post portion is positioned to face the first surface when the conductive material is mounted onto the object to be mounted. The mounting mask according to Appendix 3 or Appendix 5, wherein the second post portion is positioned to face the second surface when mounting the conductive material onto the object to be mounted. [Note 8] The mounting mask according to Appendix 2, Appendix 4, or Appendix 5, wherein the number of plating layers forming the second post portion is greater than the number of plating layers forming the first post portion. [Note 9] The second post portion includes the first plating layer, the second plating layer, and the third plating layer. The mounting mask according to Appendix 2, Appendix 4, or Appendix 5, wherein the first post portion includes a fourth plating layer having the same thickness as the first plating layer and the second plating layer. [Note 10] A method for manufacturing the mounting mask described in Appendix 9, A first step is to form a first resist on the base material so as to surround the area where the third plating layer is formed, After the first step described above, a second step is performed in which the base material is plated, After the second step, a third step is taken to remove the first resist, A fourth step is performed in which, after the second step, the plating formed in the second step, excluding the plating formed in the region where the third plating layer is formed, is removed, thereby leaving the third plating layer on the base material. A fifth step is to form a second resist on the base material, at least around the periphery of the formation areas of the fourth plating layer and the second plating layer, after the third and fourth steps, After the fifth step, a sixth step is performed in which the base material and the third plating layer are plated, After the sixth step, a seventh step is performed to remove the second resist, After the sixth step, an eighth step is performed in which the plating formed in the sixth step, excluding the plating formed in the fourth plating layer formation region and the second plating layer formation region, is removed, thereby leaving the fourth plating layer on the base material and the second plating layer on at least the third plating layer. After the eighth step, a ninth step is to form a third resist on the base material that corresponds to a plurality of through holes included in the opening pattern, A tenth step is performed in which at least the base material, the fourth plating layer, and the second plating layer are plated to form the first plating layer, A method for manufacturing a mask for mounting, equipped with the necessary components. [Explanation of symbols]

[0063] 1 Plate, 2 Frame, 3 Gauze, 4 Mounting mask, 4a Supply surface, 4b Opposing surface, 5 Substrate, 5a-5b Surface, 6 Aperture pattern, 7 Through hole, 10 Thin plate forming section, 11 First post section, 12 Second post section, 21-24 Plating layer, 30 Base material, 30a Surface, 31 First resist, 32 Second resist, 33 Third resist

Claims

1. A mounting mask for mounting a conductive material onto an object having a first surface and a second surface recessed from the first surface, A thin plate forming portion having an opening pattern formed for allowing the conductive material to pass through, A first post portion is positioned to face the first surface when the conductive material is mounted on the object to be mounted, A second post portion having a post height greater than the post height of the first post portion and positioned to face the second surface when the conductive material is mounted on the object to be mounted, A mask for mounting, equipped with the following features.

2. The thin plate forming portion is formed by the first plating layer, The first post portion is formed of a plurality of plating layers including the first plating layer, The second post portion is formed of a plurality of plating layers including the first plating layer, The mounting mask according to claim 1, wherein the surface of the thin plate forming portion, the surface of the first post portion, and the surface of the second post portion facing the object to be mounted when the conductive material is mounted on the object to be mounted are formed of the first plating layer.

3. A mounting mask for mounting conductive material onto an object to be mounted, A thin plate forming portion having an opening pattern formed for allowing the conductive material to pass through, A first post portion is arranged to surround the periphery of the aforementioned opening pattern, A second post portion having a post height greater than the post height of the first post portion and positioned within the region enclosed by the first post portion, A mask for mounting, equipped with the following features.

4. A mounting mask for mounting conductive material onto an object to be mounted, A thin plate forming portion formed by a first plating layer, having an opening pattern for allowing the conductive material to pass through, A first post portion formed of a plurality of plating layers including the first plating layer, A second post portion having a post height greater than the post height of the first post portion and formed of multiple plating layers including the first plating layer, Equipped with, A mounting mask in which the surface of the thin plate forming portion, the surface of the first post portion, and the surface of the second post portion facing the object to be mounted when the conductive material is mounted onto the object to be mounted are formed of the first plating layer.

5. The mounting mask according to claim 2 or claim 4, wherein the number of plating layers forming the second post portion is greater than the number of plating layers forming the first post portion.

6. The second post portion includes the first plating layer, the second plating layer, and the third plating layer. The mounting mask according to claim 2 or claim 4, wherein the first post portion includes a fourth plating layer having the same thickness as the first plating layer and the second plating layer.

7. A method for manufacturing a mounting mask according to claim 6, A first step is to form a first resist on the base material so as to surround the area where the third plating layer is formed, After the first step, a second step is performed in which the base material is plated, After the second step, a third step is taken to remove the first resist, A fourth step is performed in which, after the second step, the plating formed in the second step, excluding the plating formed in the region where the third plating layer is formed, is removed, thereby leaving the third plating layer on the base material. A fifth step is to form a second resist on the base material, at least around the periphery of the formation areas of the fourth plating layer and the second plating layer, after the third and fourth steps, After the fifth step, a sixth step is performed in which the base material and the third plating layer are plated, After the sixth step, a seventh step is performed to remove the second resist, After the sixth step, an eighth step is performed in which the plating formed in the sixth step, excluding the plating formed in the fourth plating layer formation region and the second plating layer formation region, is removed so that the fourth plating layer remains on the base material and at least the second plating layer remains on the third plating layer, After the eighth step, a ninth step is to form a third resist on the base material that corresponds to a plurality of through holes included in the opening pattern, A tenth step is performed after the ninth step, in which at least the base material, the fourth plating layer, and the second plating layer are plated to form the first plating layer. A method for manufacturing a mask for mounting, equipped with the necessary components.

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