Elastic wave devices and modules

Abstract

To improve the heat dissipation effect of elastic wave devices and modules. [Solution] Transmitter-side terminals and antenna-side terminals are formed on the first surface of the chip substrate facing the package substrate. Chip-side wiring is formed on the first surface, and the transmitter-side resonator is formed on the first surface and connected between the transmitter-side terminal and the antenna-side terminal via the chip-side wiring. The transmitter-side resonator includes a first series resonator connected to the transmitter-side terminal, a second series resonator connected to the antenna-side terminal, and a plurality of intermediate series resonators connected between the first series resonator and the second series resonator. Heat dissipation bumps are formed on the first surface and are electrically connected to the chip-side wiring. The plurality of transmitter-side resonators are arranged on the first surface so as to surround the heat dissipation bumps, and at least one heat dissipation bump is provided adjacent to any intermediate series resonator among the plurality of intermediate series resonators.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and particularly to elastic wave devices and modules.

Background Art

[0002] In conventional elastic wave devices, such as SAW (Surface Acoustic Wave) devices, a piezoelectric substrate made of a piezoelectric material such as quartz or lithium niobate is generally used. However, these materials may exhibit non-linear characteristics under high output conditions. When the input power increases, the stress and strain in the piezoelectric material increase, leading to problems such as increased energy loss and heat generation. Therefore, how to improve the heat dissipation effect and efficiency in elastic wave devices has become an extremely important issue.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present invention is to provide an elastic wave device and module with improved heat dissipation effect.

Means for Solving the Problems

[0004] To achieve the above object, in this invention, from a first perspective, the elastic wave device is a package substrate, a chip substrate facing the package substrate, transmission-side terminals and antenna-side terminals formed on a first surface of the chip substrate facing the package substrate, chip-side wiring formed on the first surface, and a transmission-side resonator formed on the first surface and connected between the transmission-side terminals and the antenna-side terminals via the chip-side wiring, and The transmitting side resonator includes a plurality of series resonators, the plurality of series resonators including a first series resonator connected to the transmitting side terminal, a second series resonator connected to the antenna side terminal, and a plurality of intermediate series resonators connected between the first series resonator and the second series resonator. A heat dissipation bump is formed on the first surface and electrically connected to the chip-side wiring. Multiple transmitting resonators are arranged on the first surface so as to surround the heat dissipation bump, The configuration is such that at least one of the multiple intermediate series resonators is provided adjacent to at least one of the heat dissipation bumps.

[0005] One embodiment of this invention is to provide at least one of the first series resonator and the second series resonator adjacent to each other, with at least one of the heat dissipation bumps provided next to each other.

[0006] Furthermore, one embodiment of this invention is that the chip-side wiring includes an intermediate wiring section between the first series resonator and the second series resonator, and the heat dissipation bump is connected to the intermediate wiring section. In this case, the plurality of intermediate series resonators further include a third series resonator, a fourth series resonator, and a fifth series resonator that are sequentially electrically connected between the first series resonator and the second series resonator. The heat dissipation bump includes a first heat dissipation bump and a second heat dissipation bump. One embodiment of this invention involves connecting the first heat dissipation bump between the third series resonator and the fourth series resonator, and connecting the second heat dissipation bump between the fifth series resonator and the second series resonator. Furthermore, in this case, the transmitting resonator is also, One end of the first parallel resonator is connected between the first series resonator and the third series resonator, A second parallel resonator, one end of which is connected between the third series resonator and the fourth series resonator, It includes a third parallel resonator, one end of which is connected between the fourth series resonator and the fifth series resonator, One embodiment of this invention involves grounding the other ends of the first parallel resonator, the second parallel resonator, and the third parallel resonator. Furthermore, in this case, one embodiment of the present invention is to provide on the first surface, each of the first series resonator, the second series resonator, the third series resonator, the fourth series resonator, the first parallel resonator, the second parallel resonator, and the third parallel resonator adjacent to at least one of the first heat dissipation bump and the second heat dissipation bump.

[0007] Furthermore, a grounding terminal is formed on the chip substrate. The aforementioned transmitting resonator further includes a parallel resonator, One embodiment of this invention involves connecting one end of the parallel resonator between a plurality of series resonators and connecting the other end to the ground terminal.

[0008] Furthermore, a heat dissipation pattern is provided on the side of the package substrate facing the chip substrate, and one embodiment of this invention is to connect the heat dissipation bumps to the heat dissipation pattern.

[0009] Furthermore, one embodiment of this invention is to further provide a receiving filter on the first surface and connect the receiving filter to the antenna-side terminal.

[0010] Furthermore, in order to achieve the above objectives, in this invention, from a second perspective, the module is provided with the elastic wave device described in the first perspective. [Effects of the Invention]

[0011] According to the above embodiment of the present invention, by arranging a plurality of transmission-side resonators around the heat dissipation bumps, the heat dissipation bumps can be positioned near the central part where the heat generation amount of the plurality of transmission-side resonators is large, and heat can be efficiently dissipated. Further, by connecting the heat dissipation bumps to the chip-side wiring, the heat dissipation bumps and a specific transmission-side resonator can be electrically connected via the chip-side wiring, and the heat generated by the transmission-side resonator can be effectively dissipated, improving the heat dissipation performance. Furthermore, by designing the arrangement of the heat dissipation bumps corresponding to the intermediate series resonators, at least one heat dissipation bump can be adjacent to the vicinity of each intermediate series resonator, enhancing the heat dissipation effect on the plurality of intermediate series resonators.

Brief Description of the Drawings

[0012] [Figure 1] FIG. 1 is a schematic diagram showing a cross-sectional configuration of an elastic wave device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a schematic diagram showing a configuration on the first surface of an elastic wave device according to an embodiment of the present invention, representing the configuration on the first surface as seen from the upper side of FIG. 1, and also representing the configuration of the main surface facing the chip substrate side of the package substrate located thereunder. [Figure 3] FIG. 3 is a schematic diagram showing a circuit configuration of an elastic wave device according to an embodiment of the present invention. [Figure 4] FIG. 4 is a schematic diagram showing a configuration on the first surface of an elastic wave device in Experiment 2 of the present invention. [Figure 5] FIG. 5 is a schematic diagram showing a configuration on the first surface of an elastic wave device in Experiment 3 of the present invention. [Figure 6] FIG. 6 is a schematic diagram showing a configuration on the first surface of an elastic wave device in Experiment 4 of the present invention. [Figure 7] FIG. 7 is a schematic diagram showing a configuration of a module according to an embodiment of the present invention.

Embodiments for Carrying Out the Invention

[0013] To more clearly understand the above objects, features, and effects of the present invention, the following will describe in detail specific embodiments of the present invention while referring to the drawings. To enable those of ordinary skill in the art to better understand the technical idea of the present invention, the following will clearly and completely describe its technical configuration by referring to the drawings related to the embodiments of the present invention. Note that the embodiments described herein are only some embodiments of the present invention and do not represent all embodiments of the present invention. Other embodiments that can be obtained by those skilled in the art based on the embodiments of the present invention without creative effort are also included in the protection scope of the present invention. In addition, terms such as "first" and "second" used in the specification, claims, and the foregoing drawings of the present invention are used to distinguish similar objects and do not limit a specific order or priority. Therefore, these terms can be used interchangeably as appropriate, and the embodiments of the present invention can also be implemented in an order other than the illustrated or described order. Also, terms such as "include (including)" and "have" and their variants mean non-exclusive inclusion. For example, a process, method, system, product, or device that includes a plurality of steps or components is not limited to the explicitly listed steps or components but is intended to further include other steps or components. Furthermore, the classification of the multiple embodiments in the present invention is for convenience of explanation and does not mean a special limitation. The features described in each embodiment can be implemented in combination as long as they do not conflict with each other, and can also be applied by referring to each other.

[0014] As shown in FIG. 1, an elastic wave device 100 according to an embodiment of the present invention includes a package substrate 30, a chip substrate 10, a chip-side wiring 20, a plurality of transmission-side resonators 40, and heat dissipation bumps 50. The chip substrate 10 is positioned facing the package substrate 30. Referring to Figure 2, the transmitting terminal Tx and the antenna terminal Ant are formed on the first surface 11 of the chip substrate 10 facing the package substrate 30. The chip-side wiring 20 is formed on the first surface 11. The transmitting resonator 40 is formed on the first surface 11 and is connected between the transmitting terminal Tx and the antenna terminal Ant via the chip-side wiring 20. The transmitting resonator 40 includes a plurality of series resonators 41, which include a first series resonator S1 connected to the transmitting terminal Tx, a second series resonator S2 connected to the antenna terminal Ant, and a plurality of intermediate series resonators 411 connected between the first series resonator S1 and the second series resonator S2. The heat dissipation bumps 50 are formed on the first surface 11 and are electrically connected to the chip-side wiring 20. Multiple transmitter-side resonators 40 are arranged on the first surface 11 so as to surround the heat dissipation bumps 50, and at least one heat dissipation bump 50 is provided adjacent to at least one of the multiple intermediate series resonators 411.

[0015] The package substrate 30 may be, for example, a multilayer substrate made of resin. As an example, the package substrate 30 is a low-temperature co-fired ceramic (LTCC) multilayer substrate formed by multiple dielectric layers. On the main surface of the package substrate 30 facing the chip substrate 10, substrate-side wiring is provided.

[0016] The chip substrate 10 may include, for example, a piezoelectric substrate. In some embodiments, the piezoelectric substrate can be a substrate such as lithium tantalate or lithium niobate. In other embodiments, the piezoelectric substrate may consist of a piezoelectric material layer and a support material layer. The piezoelectric material layer can be made of materials such as lithium tantalate or lithium niobate, and the support material layer can be made of materials such as sapphire or spinel. Both the transmitting terminal Tx and the antenna terminal Ant are metal terminals.

[0017] The chip-side wiring 20 is provided on the first surface 11. A conductive bump may be provided between the chip substrate 10 and the package substrate 30, and the conductive bump may be connected to the substrate-side wiring and the chip-side wiring 20, respectively.

[0018] The heat dissipation bumps 50 are metal bumps, and the same material as the conductive bumps can be used. Depending on the number and relative positions of the multiple transmitting resonators 40, there may be one or more heat dissipation bumps 50. For example, as shown in Figure 2, the heat dissipation bump 50 includes a first heat dissipation bump TB1 and a second heat dissipation bump TB2, with the first heat dissipation bump TB1 and the second heat dissipation bump TB2 spaced apart.

[0019] Multiple transmitter-side resonators 40 are connected between the transmitter-side terminal Tx and the antenna-side terminal Ant, forming a transmit filter that allows electrical signals of a desired frequency band to pass through. The multiple transmitter-side resonators 40 include, for example, multiple series resonators 41 and multiple parallel resonators 42, which are formed to obtain the function of a transmit filter and constitute a ladder-type filter. As shown in Figures 2 and 3, the multiple series resonators 41 include a first series resonator S1 and a second series resonator S2, as well as a third series resonator S3, a fourth series resonator S4, and a fifth series resonator S5 connected sequentially as intermediate series resonators 411. As shown in Figure 2, on the first surface 11, i.e., in an overhead view of the chip substrate 10 from the first surface 11 side, the multiple transmitter-side resonators 40 are arranged to surround the heat dissipation bump 50. In other words, on the first surface 11, the heat dissipation bumps 50 are located in the central part of the array where the multiple transmitting resonators 40 are arranged, rather than in the peripheral part. In other words, on the first surface 11, the heat dissipation bumps 50 are located inside the outer edges of the multiple transmitting resonators 40.

[0020] A single series resonator may contain multiple divided resonators, which can improve the power handling capacity of the series resonator. Similarly, a single parallel resonator may also contain multiple divided resonators.

[0021] In the elastic wave device 100, by arranging multiple transmitting resonators 40 around a heat dissipation bump 50, the heat dissipation bump 50 can be brought as close as possible to the vicinity of the central part where the heat generation of the multiple transmitting resonators 40 is large, thereby efficiently dissipating heat. Furthermore, by connecting the heat dissipation bump 50 to the chip-side wiring 20, the heat dissipation bump 50 and some or more of the transmitting resonators 40 can be electrically connected via the chip-side wiring 20, thereby more effectively dissipating heat from the transmitting resonators 40 connected to the heat dissipation bump 50 and enhancing the heat dissipation effect.

[0022] In actual application, the inventors found that all signal currents pass through the series resonators 41 within the multiple transmitting resonators 40. Therefore, the multiple series resonators 41 need to handle large currents, and especially in high-power applications, the amount of heat generated by the current flowing through the series resonators 41 becomes significant. The first series resonator S1 is connected to the transmitter terminal Tx, and can dissipate some of the heat through at least the transmitter terminal Tx. The second series resonator S2 is connected to the antenna terminal Ant, and can dissipate some of the heat through at least the antenna terminal Ant. On the other hand, among the multiple series resonators 41, the heat generated from the intermediate series resonator 411 located between the first series resonator S1 and the second series resonator S2 is difficult to dissipate. Therefore, in this embodiment, the arrangement of heat dissipation bumps 50 is designed to correspond to the intermediate series resonators 411, and at least one heat dissipation bump 50 is provided adjacent to each intermediate series resonator 411, thereby enhancing the heat dissipation effect for the multiple intermediate series resonators 411. Specifically, as shown in Figure 2, the first heat dissipation bump TB1 is adjacent to the third series resonator S3, the first heat dissipation bump TB1 and the second heat dissipation bump TB2 are adjacent to the fourth series resonator S4, and the second heat dissipation bump TB2 is adjacent to the fifth series resonator S5.

[0023] Of course, in some embodiments, preferably, at least one heat dissipation bump 50 may be provided adjacent to any of the series resonators 41 among the multiple series resonators 41. Referring to Figure 2, the first heat dissipation bump TB1 is adjacent to the first series resonator S1, and the second heat dissipation bump TB2 is adjacent to the second series resonator S2. With this configuration, the heat dissipation bump 50 can exert a heat dissipation effect on each of the multiple series resonators 41, further improving the heat dissipation performance and heat dissipation efficiency.

[0024] In some embodiments, referring to Figure 3, the chip-side wiring 20 includes an intermediate wiring section 21 located between a first series resonator S1 and a second series resonator S2, and the heat dissipation bump 50 is connected to the intermediate wiring section 21. The heat dissipation bump 50 is connected to at least one or more intermediate series resonators 411 via the intermediate wiring section 21, allowing heat from the intermediate series resonators 411 connected to the heat dissipation bump 50 via the intermediate wiring section 21 to be quickly released, thereby improving heat dissipation efficiency.

[0025] In some embodiments, specifically referring to Figure 3, the heat dissipation bump 50 includes a first heat dissipation bump TB1 and a second heat dissipation bump TB2, where the first heat dissipation bump TB1 is connected between a third series resonator S3 and a fourth series resonator S4, and the second heat dissipation bump TB2 is connected between a fifth series resonator S5 and a second series resonator S2. As a result, the heat generated in the third series resonator S3 and the fourth series resonator S4 is transferred to the first heat dissipation bump TB1 via the wiring between the third series resonator S3 and the fourth series resonator S4, and released from there. Similarly, the heat generated in the fifth series resonator S5 and the second series resonator S2 is transferred to the second heat dissipation bump TB2 via the wiring between the fifth series resonator S5 and the second series resonator S2, and released from there.

[0026] In some embodiments, the transmitting resonator 40 further includes a parallel resonator 42, one end of which is connected between a plurality of series resonators 41, and the other end of which is connected to a ground terminal GND.

[0027] In one specific embodiment, the parallel resonator 42 includes a first parallel resonator P1, a second parallel resonator P2, and a third parallel resonator P3. One end of the first parallel resonator P1 is connected between a first series resonator S1 and a third series resonator S3, one end of the second parallel resonator P2 is connected between a third series resonator S3 and a fourth series resonator S4, and one end of the third parallel resonator P3 is connected between a fourth series resonator S4 and a fifth series resonator S5. The other ends of the first parallel resonator P1, the second parallel resonator P2, and the third parallel resonator P3 are grounded.

[0028] Specifically, multiple independent grounding terminals GND can be provided, each corresponding to one of the multiple parallel resonators 42. The multiple grounding terminals GND are spaced apart from each other, and each is located on opposite sides of the multiple parallel resonators 42. As shown in Figure 2, the first parallel resonator P1 is connected to the first grounding terminal located on the right side of the multiple parallel resonators 42, and the second parallel resonator P2 and the third parallel resonator P3 are connected to the second grounding terminal located on the left side of the multiple parallel resonators 42. The parallel resonators 42 have a bypass or filter function, and the current flowing through the parallel resonators 42 is smaller than the current flowing through the series resonator 41, resulting in less heat generation. By grounding each of the multiple parallel resonators 42 via the grounding terminal GND, heat dissipation of the parallel resonators 42 can be improved. Furthermore, by separating and arranging the multiple grounding terminals GND, the heat dissipation structure can be further dispersed, and the heat dissipation effect can be further improved.

[0029] In some embodiments, as shown in Figure 2, the parallel resonator 42 further includes a fourth parallel resonator P4. One end of the fourth parallel resonator P4 is connected between the first series resonator S1 and the third series resonator S3, and the other end is grounded. The fourth parallel resonator P4 is located closer to the first series resonator S1 than the first parallel resonator P1. For example, in the arrangement shown in Figure 2, the fourth parallel resonator P4 and the first series resonator S1 are arranged side by side horizontally, and the first parallel resonator P1 is located further away from the transmitting terminal Tx when viewed vertically from the fourth parallel resonator P4.

[0030] In some embodiments, on the first surface 11, the first series resonator S1, the second series resonator S2, the third series resonator S3, the fourth series resonator S4, the first parallel resonator P1, the second parallel resonator P2, and the third parallel resonator P3 are adjacent to at least one of the first heat dissipation bump TB1 and the second heat dissipation bump TB2. As shown in Figure 2, the first parallel resonator P1 is adjacent to the first heat dissipation bump TB1, the second parallel resonator P2 is adjacent to the first heat dissipation bump TB1 and the second heat dissipation bump TB2, and the third parallel resonator P3 is adjacent to the second heat dissipation bump TB2. Therefore, in the configuration shown in Figure 2, with the exception of the fourth parallel resonator P4, at least one heat dissipation bump 50 is provided adjacent to any of the multiple transmitter resonators 40, allowing heat to be dissipated to more of the multiple transmitter resonators 40, thereby improving the heat dissipation effect.

[0031] In one embodiment, the heat dissipation bump 50 and the grounding terminal GND are spaced apart. That is, the heat dissipation bump 50 and the grounding terminal GND are not electrically connected, and there is an open space between them.

[0032] In some embodiments, the multiple transmitting resonators 40 constitute a band-pass filter in their configuration. Among the multiple series resonators 41 is a target series resonator, the resonant frequency of which is 0.8 to 1.2 times the upper limit of the passband frequency of the band-pass filter, for example, 0.8, 0.9, 1.0, 1.1, or 1.2 times. A heat dissipation bump 50 is connected to the target series resonator. In this embodiment, the upper limit of the passband frequency can also be referred to as the upper limit of the passband edge frequencies. During the experimental process, the inventors found that when performing power withstand tests on elastic wave devices, resonators whose resonant frequency is close to the input power, i.e., close to the passband upper limit frequency, generate significant heat when the input power is near the passband upper limit frequency. Therefore, in this embodiment, by connecting the heat dissipation bump 50 to the target series resonator among the series resonators 41 whose resonant frequency is close to the passband upper limit frequency, it is possible to prevent the target series resonator from being destroyed by overheating during power withstand tests.

[0033] In some embodiments, referring to Figure 1, a heat dissipation pattern 31 is provided on the side of the package substrate 30 facing the chip substrate 10, and the heat dissipation bumps 50 are connected to the heat dissipation pattern 31. The heat dissipation pattern 31 is made of a metallic material and is formed of a metal or an alloy thereof, such as silver, aluminum, copper, titanium, or palladium.

[0034] In some embodiments, the elastic wave device 100 further includes a receiving filter 60. The receiving filter 60 is provided on the first surface 11 and connected to the antenna-side terminal Ant. A receiving-side terminal Rx is also provided on the chip substrate 10, and the receiving filter 60 is connected between the antenna-side terminal Ant and the receiving-side terminal Rx. The receiving filter 60 includes, for example, a plurality of receiving-side resonators, specifically a plurality of receiving-side resonators including a plurality of receiving-side series resonators and a plurality of receiving-side parallel resonators. The plurality of receiving-side series resonators and the plurality of receiving-side parallel resonators are formed to obtain the function of a receiving filter, and constitute a ladder-type filter to form the receiving filter 60. As shown in Figures 2 and 3, the plurality of receiving-side series resonators include a first receiving-side series resonator RxS1 and a second receiving-side series resonator RxS2, and the plurality of receiving-side parallel resonators include a first receiving-side parallel resonator RxP1 and a second receiving-side parallel resonator RxP2. In addition, a DMS (Double-Mode Surface Acoustic Wave) is provided between the plurality of receiving-side series resonators and the receiving-side terminal Rx. In this embodiment, the elastic wave device 100 is a duplexer equipped with a transmit filter and a receive filter.

[0035] The following describes the heat dissipation effect of the elastic wave device 100 according to an embodiment of the present invention, based on the temperature measurement results from Experiments 1 to 4.

[0036] The configuration of the first surface 11 of the elastic wave device in Experiment 1 is shown in Figure 2, and the configuration of the first surface 11 of the elastic wave device in Experiment 2 is shown in Figure 4. Experiment 2 differs from Experiment 1 in that it has only the second heat dissipation bump TB2 and does not have the first heat dissipation bump TB1. The configuration of the first surface 11 of the elastic wave device in Experiment 3 is shown in Figure 5, and the difference of Experiment 3 compared to Experiment 1 is that it has only the first heat dissipation bump TB1 and does not have the second heat dissipation bump TB2. The configuration of the first surface 11 of the elastic wave device in Experiment 4 is shown in Figure 6, and the difference of Experiment 4 compared to Experiment 1 is that it does not have either the first heat dissipation bump TB1 or the second heat dissipation bump TB2.

[0037] Table 1 shows the temperatures (in °C) obtained by measuring the temperature of each component in Experiments 1 to 4. [Table 1]

[0038] Table 2 shows the temperature difference between Experiments 1 through 3 and Experiment 4. Here, "Temperature Difference 1" represents the temperature difference between Experiment 1 and Experiment 4, "Temperature Difference 2" represents the temperature difference between Experiment 2 and Experiment 4, and "Temperature Difference 3" represents the temperature difference between Experiment 3 and Experiment 4 (unit: °C). [Table 2]

[0039] In Tables 1 and 2, S1-1 and S1-2 represent the two divided resonators included in the first series resonator S1, respectively. S3-1 and S3-2 represent the two divided resonators included in the third series resonator S3, respectively. P4-1 and P4-2 represent the two divided resonators included in the fourth parallel resonator P4, respectively.

[0040] As is clear from the results in Tables 1 and 2, in Experiment 1, the temperature reduction effect was significant at each part of the elastic wave device, demonstrating that the device temperature can be effectively reduced. In Experiment 2, only the second heat dissipation bump was provided, and a significant temperature reduction effect was confirmed in the second parallel resonator P2, the fourth series resonator S4, the third parallel resonator P3, the fifth series resonator S5, and the second series resonator S2, all located near the second heat dissipation bump. In Experiment 3, only the first heat dissipation bump was provided, and a significant temperature reduction effect was confirmed in the first series resonator S1, the first parallel resonator P1, and the third series resonator S3, all located near the first heat dissipation bump. Furthermore, in both Experiment 2 and Experiment 3, the fourth series resonator S4 had a heat dissipation bump adjacent to it, and it was found that the difference in heat dissipation effect was small.

[0041] Referring to Figure 7, the present invention further provides module 1000. Module 1000 comprises a wiring board 700, a plurality of external connection terminals 701, integrated circuit components 600, an elastic wave device 100, an inductor 400, and a sealing section 500. The plurality of external connection terminals 701 are formed on one surface of the wiring board 700 and mounted on the motherboard of a given mobile communication terminal. The integrated circuit components 600 (also referred to as ICs) are mounted inside the wiring board 700 and include a switch circuit and a low-noise amplifier. The elastic wave device 100 is mounted on the main surface of the wiring board 700. The inductor 400 is used for impedance matching and is, for example, an integrated passive device (IPD). The sealing section 500 is for sealing the plurality of electronic components, including the elastic wave device 100, on the wiring board 700.

[0042] The module 1000 according to this embodiment includes an elastic wave device 100 and has the same effects as the elastic wave device 100. Therefore, a detailed description thereof is omitted.

[0043] Although preferred embodiments of the present invention have been described above, the present invention is not limited thereto. Embodiments incorporating various modifications, improvements, or substitutions that are easily conceivable by those skilled in the art, without departing from the scope of the technical concept of the present invention, are also included within the technical scope of the present invention. [Explanation of Symbols]

[0044] 100 Elastic wave devices 10 Chip boards 11 First side 20 Chip-side wiring 21 Intermediate wiring section 30 Package substrates 31 Heat dissipation patterns 40 Transmitter-side resonator 41 Series resonator 411 Intermediate series resonator 42 parallel resonators 50 Heat dissipation bumps 60 Receiving Filter 400 Inductors 500 Sealing section 600 Integrated Circuit Components 700 Wiring board 701 External connection terminal Tx Transmitter Terminal Antenna side terminal GND Grounding terminal S1 First series resonator S2 Second series resonator S3 Third series resonator S4 Fourth Series Resonator S5 Fifth series resonator P1 First parallel resonator P2 Second parallel resonator P3 Third parallel resonator P4 Fourth parallel resonator TB1 First heat dissipation bump TB2 Second heat dissipation bump Rx Receiver terminal RxS1 First Receiver Series Resonator RxS2 Second Receiver Series Resonator RxP1 First Receiver Parallel Resonator RxP2 Second Receiver Parallel Resonator

Claims

1. Package substrate and A chip substrate facing the aforementioned package substrate, A transmitting terminal and an antenna terminal are formed on the first surface of the chip substrate facing the package substrate, The chip-side wiring formed on the first surface, It includes a transmitting resonator formed on the first surface and connected between the transmitting terminal and the antenna terminal via the chip-side wiring, The transmitting resonator includes a plurality of series resonators, the plurality of series resonators including a first series resonator connected to the transmitting terminal, a second series resonator connected to the antenna terminal, and a plurality of intermediate series resonators connected between the first series resonator and the second series resonator. A heat dissipation bump is formed on the first surface and electrically connected to the chip-side wiring. Multiple of the transmitting resonators are arranged on the first surface so as to surround the heat dissipation bump, An elastic wave device comprising at least one heat dissipation bump adjacent to at least one of the multiple intermediate series resonators.

2. The elastic wave device according to claim 1, wherein at least one of the first series resonator and the second series resonator is provided adjacent to at least one of the heat dissipation bumps.

3. The elastic wave device according to claim 1, wherein the chip-side wiring includes an intermediate wiring section between the first series resonator and the second series resonator, and the heat dissipation bump is connected to the intermediate wiring section.

4. The plurality of intermediate series resonators include a third series resonator, a fourth series resonator, and a fifth series resonator that are sequentially electrically connected between the first series resonator and the second series resonator. The heat dissipation bump includes a first heat dissipation bump and a second heat dissipation bump. The elastic wave device according to claim 3, wherein the first heat dissipation bump is connected between the third series resonator and the fourth series resonator, and the second heat dissipation bump is connected between the fifth series resonator and the second series resonator.

5. The aforementioned transmitting resonator further comprises, One end of the first parallel resonator is connected between the first series resonator and the third series resonator, A second parallel resonator, one end of which is connected between the third series resonator and the fourth series resonator, It includes a third parallel resonator, one end of which is connected between the fourth series resonator and the fifth series resonator, The elastic wave device according to claim 4, wherein the other ends of the first parallel resonator, the second parallel resonator, and the third parallel resonator are grounded.

6. The elastic wave device according to claim 5, wherein on the first surface, each of the first series resonator, the second series resonator, the third series resonator, the fourth series resonator, the first parallel resonator, the second parallel resonator, and the third parallel resonator is provided adjacent to at least one of the first heat dissipation bump and the second heat dissipation bump.

7. A grounding terminal is formed on the aforementioned chip substrate. The aforementioned transmitting resonator further includes a parallel resonator, The elastic wave device according to claim 1, wherein one end of the parallel resonator is connected between a plurality of series resonators, and the other end is connected to the ground terminal.

8. The elastic wave device according to claim 1, wherein a heat dissipation pattern is provided on the side of the package substrate facing the chip substrate, and the heat dissipation bumps are connected to the heat dissipation pattern.

9. The elastic wave device according to claim 1, further comprising a receiving filter on the first surface, wherein the receiving filter is connected to the antenna-side terminal.

10. A module comprising the elastic wave device according to any one of claims 1 to 9.

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