Interface device

Abstract

This technology can improve the productivity of substrate processing systems. [Solution] An interface device according to one aspect of the present disclosure is an interface device for transferring substrates between a batch processing unit that processes a lot containing multiple substrates at once and a single-wafer processing unit that processes the substrates of the lot one by one, and comprises an immersion tank for immersing the lot, which is located outside the movement range of a first transport device that transports the lot at once in the batch processing unit, and a second transport device for transferring the lot between the first transport device and the immersion tank.

Description

Technical Field

[0001] The present disclosure relates to an interface device.

Background Art

[0002] The substrate processing system described in Patent Document 1 includes a batch processing unit and a single wafer processing unit. The batch processing unit holds a semiconductor wafer that has been subjected to water washing in water. A plurality of semiconductor wafers are subjected to chemical solution treatment while being placed on a single holding table. The transfer unit picks up semiconductor wafers one by one from the buffer tank and transfers them to the single wafer processing unit. The single wafer processing unit supports a single semiconductor wafer transferred by the transfer unit so that the main surface is horizontal and dries the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of improving the productivity of a substrate processing system.

Means for Solving the Problems

[0005] An interface device according to an aspect of the present disclosure is an interface device that transfers a substrate between a batch processing unit that collectively processes a lot including a plurality of substrates and a single wafer processing unit that processes the substrates of the lot one by one, and is disposed outside the movement range of a first transfer device that collectively conveys the lot in the batch processing unit, and includes an immersion tank that immerses the lot, and a second transfer device that transfers the lot between the first transfer device and the immersion tank.

Effects of the Invention

[0006] According to this disclosure, the productivity of the substrate processing system can be improved. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic plan view showing a substrate processing system according to an embodiment. [Figure 2] Figure 2 is a flowchart showing the substrate processing method according to the embodiment. [Figure 3] Figure 3 is a schematic perspective view showing the operation of the second interface unit. [Figure 4] Figure 4 is a schematic perspective view showing the operation of the second interface unit. [Figure 5] Figure 5 is a schematic perspective view showing the operation of the second interface unit. [Figure 6] Figure 6 is a schematic perspective view showing the operation of the second interface unit. [Figure 7] Figure 7 is a diagram illustrating the operation of the second conveying device. [Figure 8] Figure 8 is a schematic perspective view showing the second interface section of the first modified example. [Figure 9] Figure 9 is a schematic perspective view showing the second interface section of the second modified example. [Figure 10] Figure 10 is a schematic perspective view showing the second interface section of the third modified example. [Figure 11] Figure 11 is a schematic perspective view showing the second interface section of the fourth modified example. [Figure 12] Figure 12 is a schematic perspective view showing the second interface section of the fifth modified example. [Figure 13] Figure 13 is a schematic perspective view showing the second interface section of the sixth modified example. [Figure 14] Figure 14 is a schematic plan view showing a substrate processing system according to a modified embodiment. [Modes for carrying out the invention]

[0008] Hereinafter, exemplary embodiments of the present disclosure, not limited to those described herein, will be described with reference to the attached drawings. In all attached drawings, identical or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] (Circuit board processing system) Referring to Figure 1, a substrate processing system according to an embodiment will be described. As shown in Figure 1, the substrate processing system 1 includes an input / output unit 2, a first interface unit 3, a batch processing unit 4, a second interface unit 5, a single-wafer processing unit 6, and a control device 9.

[0010] The loading / unloading section 2 serves as both the loading and unloading section. This allows the substrate processing system 1 to be miniaturized. The loading / unloading section 2 includes a load port 21, a stocker 22, a loader 23, and a cassette transport device 24.

[0011] The load port 21 is located on the negative side of the X-axis direction of the loading / unloading section 2. Multiple load ports 21 (for example, four) are arranged along the Y-axis direction. However, the number of load ports 21 is not particularly limited. Cassettes C are placed on the load ports 21. Cassettes C contain multiple substrates W (for example, 25) and are loaded into and unloaded from the load ports 21. Inside the cassette C, the substrates W are held horizontally and vertically at a second pitch P2 (P2 = N × P1) which is N times the first pitch P1. N is a natural number of 2 or more, and in this embodiment it is 2, but it may be 3 or more.

[0012] Multiple stockers 22 are arranged in the center of the loading / unloading section 2 in the X-axis direction, along the Y-axis direction (for example, four). Multiple stockers 22 are also arranged on the positive X-axis side of the loading / unloading section 2, adjacent to the first interface section 3 along the Y-axis direction (for example, two). Stockers 22 may be arranged in multiple tiers in the vertical direction. Stockers 22 temporarily store cassettes C containing substrates W before cleaning, cassettes C after the substrates W have been removed and the contents are empty, etc. The number of stockers 22 is not particularly limited.

[0013] The loader 23 is adjacent to the first interface unit 3 and is arranged on the positive side in the X-axis direction of the loading / unloading unit 2. A cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. A plurality of loaders 23 may be provided. The loaders 23 may be arranged in multiple stages in the vertical direction.

[0014] The cassette transfer device 24 is, for example, an articulated transfer robot. The cassette transfer device 24 transfers the cassette C between the load port 21, the stocker 22, and the loader 23.

[0015] The first interface unit 3 is arranged on the positive side in the X-axis direction of the loading / unloading unit 2. The first interface unit 3 transfers the substrate W between the loading / unloading unit 2, the batch processing unit 4, and the single sheet processing unit 6. The first interface unit 3 includes a substrate transfer device 31, a lot forming unit 32, and a first delivery stand 33.

[0016] The substrate transfer device 31 transfers the substrate W between the cassette C placed on the loader 23, the lot forming unit 32, and the first delivery stand 33. The substrate transfer device 31 is composed of a multi-axis (for example, 6-axis) arm robot and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has a plurality of holding claws (not shown) that can hold a plurality of substrates W (for example, 25 substrates). The substrate holding arm 31a can take an arbitrary position and posture in the three-dimensional space while holding the substrate W by the holding claws.

[0017] The lot forming unit 32 is arranged on the positive side in the X-axis direction of the first interface unit 3. The lot forming unit 32 holds a plurality of substrates W at the first pitch P1 to form a lot L.

[0018] The first delivery stand 33 is adjacent to the single sheet processing unit 6 and is arranged on the positive side in the Y-axis direction of the first interface unit 3. The first delivery stand 33 temporarily stores the substrate W received from the fourth transfer device 61 until it is passed to the loading / unloading unit 2.

[0019] The batch processing unit 4 is located on the positive X-axis side of the first interface unit 3. That is, the loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4 are arranged in this order, from the negative X-axis side to the positive X-axis side. The batch processing unit processes a lot L containing multiple substrates W (for example, 50 or 100) at a first pitch P1 all at once. One lot L consists of, for example, M cassettes C containing substrates W. M is a natural number greater than or equal to 2. M may be the same natural number as N, or a natural number different from N. The batch processing unit 4 includes a chemical tank 41, a rinse tank 42, a first transport device 43, a processing tool 44, and a drive device 45.

[0020] The chemical solution tank 41 and the rinse solution tank 42 are arranged along the X-axis. For example, the chemical solution tank 41 and the rinse solution tank 42 are arranged in this order from the positive side of the X-axis to the negative side of the X-axis. The chemical solution tank 41 and the rinse solution tank 42 are collectively referred to as the treatment tank. The number of chemical solution tanks 41 and rinse solution tanks 42 is not limited to that shown in Figure 1. For example, although there is one set of chemical solution tank 41 and rinse solution tank 42 in Figure 1, there may be multiple sets.

[0021] The chemical tank 41 stores the chemical solution into which lot L is immersed. The chemical solution is, for example, an aqueous phosphoric acid solution (H3PO4). The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film from the silicon oxide film. The chemical solution is not limited to an aqueous phosphoric acid solution. For example, it may be DHF (dilute hydrofluoric acid), BHF (mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (mixture of sulfuric acid, hydrogen peroxide, and water), SC1 (mixture of ammonia, hydrogen peroxide, and water), SC2 (mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (mixture of tetramethylammonium hydroxide and water), a plating solution, etc. The chemical solution may be for stripping treatment or plating treatment. The number of chemical solutions is not particularly limited and may be multiple.

[0022] The rinsing solution tank 42 stores the first rinsing solution into which the lot L is immersed. The first rinsing solution is pure water that removes the chemical solution from the substrate W, for example, DIW (deionized water).

[0023] The first conveying device 43 includes a guide rail 43a and a first conveying arm 43b. The guide rail 43a is positioned on the negative side of the Y-axis direction from the processing tank. The guide rail 43a extends horizontally (in the X-axis direction) from the first interface unit 3 to the batch processing unit 4. The first conveying arm 43b moves horizontally (in the X-axis direction) along the guide rail 43a. The first conveying arm 43b may also move vertically or rotate around a vertical axis. The first conveying arm 43b conveys a lot L in one piece between the first interface unit 3 and the batch processing unit 4.

[0024] The processing device 44 receives and holds the lot L from the first transport arm 43b. The processing device 44 holds multiple substrates W in the Y-axis direction at a first pitch P1, and holds each of the multiple substrates W vertically.

[0025] The drive unit 45 moves the processing tool 44 in the X-axis and Z-axis directions. The processing tool 44 immerses the lot L in the chemical solution stored in the chemical solution tank 41, then immerses the lot L in the first rinse solution stored in the rinse solution tank 42, and then passes the lot L to the first conveying device 43.

[0026] In this embodiment, there is one unit for the processing tool 44 and the drive unit 45, but there may be multiple units. In the latter case, one unit immerses the rod L in the chemical solution stored in the chemical solution tank 41, and another unit immerses the rod L in the first rinse solution stored in the rinse solution tank 42. In this case, the drive unit 45 only needs to move the processing tool 44 in the Z-axis direction, and does not need to move the processing tool 44 in the X-axis direction.

[0027] The second interface unit 5 is positioned on the positive side of the Y-axis of the batch processing unit 4. The second interface unit 5 transports the substrate W between the batch processing unit 4 and the single-wafer processing unit 6. The second interface unit 5 includes an immersion tank 51, a second transport device 52, a third transport device 53, and a second transfer table 54.

[0028] The immersion tank 51 is positioned outside the movement range of the first transport arm 43b. For example, the immersion tank 51 is positioned offset to the positive side in the Y-axis direction relative to the processing tank. The immersion tank 51 stores a second rinse liquid into which the lot L is immersed. The second rinse liquid is, for example, DIW (deionized water). The substrate W is held in the second rinse liquid until it is lifted out of the second rinse liquid by the third transport device 53. Since the substrate W is below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate W, preventing the collapse of the uneven pattern on the substrate W. The immersion tank 51 may be configured to be movable in the X-axis direction. In this case, when immersing the lot L in the immersion tank 51, the X-axis positional displacement between the immersion tank 51 and the lot L can be corrected. An X-axis drive device (not shown) for moving the immersion tank 51 in the X-axis direction is attached, for example, to the bottom surface of the immersion tank 51.

[0029] The second transport device 52 includes a Y-axis drive device 52a, a Z-axis drive device 52b, and a second transport arm 52c.

[0030] The Y-axis drive unit 52a is positioned on the positive X-axis side of the second interface unit 5. The Y-axis drive unit 52a extends horizontally (in the Y-axis direction) from the second interface unit 5 to the batch processing unit 4. The Y-axis drive unit 52a moves the Z-axis drive unit 52b and the second transport arm 52c in the Y-axis direction. The Y-axis drive unit 52a may include a ball screw. The Y-axis drive unit 52a is an example of a horizontal drive unit.

[0031] The Z-axis drive unit 52b is movably mounted on the Y-axis drive unit 52a. The Z-axis drive unit 52b moves the second transport arm 52c in the Z-axis direction. The Z-axis drive unit 52b may include a ball screw. The Z-axis drive unit 52b is an example of a vertical drive unit.

[0032] The second transport arm 52c is movably mounted to the Z-axis drive unit 52b. The second transport arm 52c receives and holds the lot L from the first transport arm 43b. The second transport arm 52c holds multiple substrates W in the Y-axis direction at a first pitch P1, and holds each of the multiple substrates W vertically. The second transport arm 52c moves in the Y-axis direction and the Z-axis direction by the Y-axis drive unit 52a and the Z-axis drive unit 52b. The second transport arm 52c is configured to move between multiple positions, including the handover position A1, the immersion position A2, and the standby position A3 shown in Figure 7. The second transport arm 52c may also be configured to move in the X-axis direction. In this case, when immersing the lot L in the immersion tank 51, the X-axis misalignment between the immersion tank 51 and the lot L can be corrected. An X-axis drive unit (not shown) that moves the second transport arm 52c in the X-axis direction is movably mounted, for example, to the Z-axis drive unit 52b. In this case, the second transport arm 52c is movably mounted to the X-axis drive unit.

[0033] The transfer position A1 is the position where the lot L is transferred between the first transport arm 43b and the second transport arm 52c. The transfer position A1 is located on the negative side of the Y-axis and the positive side of the Z-axis.

[0034] Immersion position A2 is the position where the rod L is immersed in the immersion tank 51. Immersion position A2 is located on the positive side in the Y-axis direction and the negative side in the Z-axis direction compared to the handover position A1.

[0035] Standby position A3 is the position where the second transport arm 52c waits when the lot L is not being transferred or when the lot L is not being immersed in the immersion tank 51. Standby position A3 is directly below the transfer position A1 (negative side in the Z-axis direction) and does not obstruct the movement of the first transport arm 43b. In this case, the second transport arm 52c can move to the transfer position A1 by moving only upward (positive side in the Z-axis direction), thus improving throughput. Standby position A3 may be in the same position as the immersion position A2. In this case, it is possible to prevent particles that may be generated as a result of the operation of the first transport device 43 from adhering to the second transport arm 52c. Standby position A3 may also be directly above the immersion position A2 (positive side in the Z-axis direction). In this way, by setting the standby position A3 to a position different from the transfer position A1, contact between the first transport arm 43b and the second transport arm 52c can be prevented.

[0036] The second conveying device 52 moves the second conveying arm 52c to the immersion position A2 or the standby position A3 while the first conveying device 43 is operating. This prevents contact between the first conveying arm 43b and the second conveying arm 52c.

[0037] The third transport device 53 consists of a multi-axis (e.g., 6-axis) arm robot and has a third transport arm 53a at its tip. The third transport arm 53a has a holding claw (not shown) capable of holding one substrate W. The third transport arm 53a can assume any position and orientation in three-dimensional space while holding the substrate W with the holding claw. The third transport device 53 transports the substrate W between the second transport arm 52c, which is at the immersion position A2, and the second transfer table 54. At this time, since the immersion tank 51 is located outside the movement range of the first transport arm 43b, the first transport arm 43b and the third transport arm 53a do not interfere with each other. As a result, one of the first transport device 43 and the third transport device 53 can be operated independently regardless of the operating state of the other. Therefore, the first transport device 43 and the third transport device 53 can be operated at any timing, so the time required to transport the substrate W can be shortened. As a result, the productivity of the substrate processing system 1 is improved.

[0038] The second transfer table 54 is adjacent to the single-wafer processing unit 6 and is positioned on the negative side of the X-axis direction of the second interface unit 5. The second transfer table 54 receives the substrates W from the third transport device 53 and temporarily stores them until they are handed over to the single-wafer processing unit 6. That is, the substrates W removed from the immersion tank 51 are placed on the second transfer table 54. It is preferable that the substrates W placed on the second transfer table 54 have their surfaces wet with the second rinsing liquid. In this case, the surface tension of the second rinsing liquid does not act on the substrates W, and the collapse of the uneven pattern of the substrates W can be suppressed. Multiple substrates (for example, two) W are placed on the second transfer table 54.

[0039] The single-wafer processing unit 6 is located on the negative side of the X-axis of the second interface unit 5 and on the positive side of the Y-axis of the loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4. The single-wafer processing unit 6 processes the substrates W one by one. The single-wafer processing unit 6 includes a fourth transport device 61, a liquid processing device 62, and a drying device 63.

[0040] The fourth transport device 61 includes a guide rail 61a and a fourth transport arm 61b. The guide rail 61a is positioned on the negative side of the Y-axis direction of the single-wafer processing unit 6. The guide rail 61a extends horizontally (in the X-axis direction) within the single-wafer processing unit 6. The fourth transport arm 61b moves horizontally (in the X-axis direction) and vertically along the guide rail 61a and rotates around the vertical axis. The fourth transport arm 61b transports the substrate W between the second transfer table 54, the liquid processing unit 62, the drying unit 63, and the first transfer table 33. There may be one or more fourth transport arms 61b; in the latter case, the fourth transport device 61 transports multiple substrates W (for example, five) at once.

[0041] The liquid processing apparatus 62 is positioned on the positive X-axis and positive Y-axis side of the single-wafer processing apparatus 6. The liquid processing apparatus 62 is a single-wafer type and processes one substrate W at a time with the processing liquid. The liquid processing apparatus 62 is arranged in multiple stages (for example, 3 stages) in the vertical direction (Z-axis direction). This allows multiple substrates W to be processed with the processing liquid simultaneously. The processing liquid may consist of multiple components, for example, pure water such as DIW and a drying liquid with a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA (isopropyl alcohol).

[0042] The drying apparatus 63 is positioned adjacent to the liquid processing apparatus 62 on the negative side in the X-axis direction. In this case, the end face of the single-wafer processing unit 6 on the positive side in the Y-axis direction can be positioned flush or nearly flush with the end face of the second interface unit 5 on the positive side in the Y-axis direction. As a result, there is almost no dead space, and the footprint of the substrate processing system 1 can be reduced. In contrast, if the drying apparatus 63 is positioned adjacent to the liquid processing apparatus 62 on the positive side in the Y-axis direction, the end face of the single-wafer processing unit 6 on the positive side in the Y-axis direction will protrude beyond the end face of the second interface unit 5 on the positive side in the Y-axis direction, potentially creating dead space. The drying apparatus 63 is a single-wafer type and dries one substrate W at a time with supercritical fluid. The drying apparatus 63 is arranged in multiple stages (for example, 3 stages) in the vertical direction. This allows multiple substrates W to be dried simultaneously.

[0043] The liquid processing apparatus 62 and the drying apparatus 63 do not necessarily have to be single-wafer type; the liquid processing apparatus 62 may be single-wafer type and the drying apparatus 63 may be batch type. The drying apparatus 63 may dry multiple substrates W at once using a supercritical fluid. The number of substrates W processed at once in the drying apparatus 63 may be greater than or less than the number of substrates W processed at once in the liquid processing apparatus 62. Other apparatus besides the liquid processing apparatus 62 and the drying apparatus 63 may be arranged in the single-wafer processing apparatus 6.

[0044] The control device 9 is, for example, a computer and comprises a CPU (Central Processing Unit) 91 and a recording medium 92 such as memory. The recording medium 92 stores programs that control various processes performed in the board processing system 1. The control device 9 controls the operation of the board processing system 1 by causing the CPU 91 to execute the programs stored in the recording medium 92. The control device 9 comprises an input interface 93 and an output interface 94. The control device 9 receives signals from the outside through the input interface 93 and transmits signals to the outside through the output interface 94.

[0045] The above program is stored, for example, on a computer-readable recording medium and installed from that medium to the recording medium 92 of the control device 9. Examples of computer-readable recording media include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnetic optical disks (MOs), and memory cards. The program may also be downloaded from a server via the internet and installed to the recording medium 92 of the control device 9.

[0046] In the substrate processing system described above, the substrate W is transported in the following order from the loading / unloading section 2 to the first interface section 3, the batch processing section 4, the second interface section 5, and the single-wafer processing section 6, and then returns to the loading / unloading section 2.

[0047] (Operation of the circuit board processing system) Referring to Figure 2, the operation of the substrate processing system 1 according to this embodiment, that is, the substrate processing method, will be described. The processing shown in Figure 2 is carried out under the control of the control device 9.

[0048] First, cassette C, containing multiple circuit boards W, is loaded into the loading / unloading section 2 and placed on the load port 21. Inside cassette C, the circuit boards W are held horizontally and vertically at a second pitch P2 (P2 = N × P1). N is a natural number greater than or equal to 2, and in this embodiment it is 2, but it may be 3 or greater.

[0049] Next, the cassette transport device 24 transports the cassette C from the load port 21 to the loader 23. Once the cassette C is transported to the loader 23, the lid is opened by the lid opening / closing mechanism.

[0050] Next, the substrate transfer device 31 receives the substrate W contained in the cassette C (S101 in Figure 2) and transports it to the lot formation unit 32.

[0051] Next, the lot forming unit 32 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L (S102 in Figure 2). One lot L consists of, for example, M substrates W for cassette C. Since the pitch of the substrates W narrows from the second pitch P2 to the first pitch P1, the number of substrates W processed at once can be increased.

[0052] Next, the first conveying device 43 receives the lot L from the lot forming unit 32 and conveys it to the processing device 44.

[0053] Next, the processing tool 44 descends from above the chemical tank 41, immersing the rod L in the chemical solution and performing the chemical treatment (S103 in Figure 2). After that, the processing tool 44 rises to lift the rod L out of the chemical solution, and then moves horizontally (negative side of the X-axis) towards the top of the rinse solution tank 42.

[0054] Next, the processing tool 44 descends from above the rinse liquid tank 42, immerses the lot L in the first rinse liquid, and performs the rinse liquid treatment (S103 in Figure 2). After that, the processing tool 44 rises to lift the lot L out of the first rinse liquid. Then, the first conveying device 43 receives the lot L from the processing tool 44 and hands it over to the second conveying device 52.

[0055] Next, the second transport arm 52c of the second transport device 52 moves horizontally (positive side of the Y-axis) and descends from above the immersion tank 51, immersing the lot L in the second rinsing liquid (S104 in Figure 2). The multiple substrates W of the lot L are held in the second rinsing liquid until they are pulled out of the second rinsing liquid by the third transport device 53. Since the substrates W are below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrates W, preventing the collapse of the uneven pattern on the substrates W.

[0056] Next, the third transport device 53 transports the substrates W of lot L, which are held by the second transport arm 52c in the second rinsing liquid, to the second transfer table 54. The third transport device 53 transports the substrates W one by one to the second transfer table 54.

[0057] Next, the fourth transport device 61 receives the substrate W from the second transfer table 54 and transports it to the liquid processing device 62.

[0058] Next, the liquid processing apparatus 62 processes each substrate W with liquid (S105 in Figure 2). The liquid may consist of multiple liquids, for example, pure water such as DIW and a drying liquid with a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA. The liquid processing apparatus 62 supplies pure water and the drying liquid in that order to the upper surface of the substrate W, forming a liquid film of the drying liquid.

[0059] Next, the fourth transport device 61 receives the substrate W from the liquid processing device 62 and holds the substrate W horizontally with the drying liquid film facing upwards. The fourth transport device 61 then transports the substrate W from the liquid processing device 62 to the drying device 63.

[0060] Next, the drying apparatus 63 dries the substrates W one by one with supercritical fluid (S105 in Figure 2). The drying liquid can be replaced with supercritical fluid, and the collapse of the uneven pattern on the substrate W due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure vessel, the process is carried out one sheet at a time rather than in batches in order to miniaturize the pressure vessel.

[0061] In this embodiment, the drying apparatus 63 is a single-wafer type, but as mentioned above, it may also be a batch type. The batch type drying apparatus 63 dries multiple substrates W, each with a liquid film formed on it, all at once using a supercritical fluid. While the single-wafer type drying apparatus 63 has one transport arm to hold the substrates W, the batch type drying apparatus 63 has multiple transport arms.

[0062] Next, the fourth transport device 61 receives the substrate W from the drying device 63 and transports it to the first transfer table 33.

[0063] Next, the substrate transfer device 31 receives the substrate W from the first transfer table 33 and stores it in the cassette C (S106 in Figure 2). The cassette C, containing multiple substrates W, is then discharged from the loading / unloading section 2.

[0064] (Operation of the second interface unit) The operation of the second interface unit 5 will be explained with reference to Figures 3 to 7. The operation of the second interface unit 5 is controlled by the control device 9.

[0065] First, as shown in Figure 3, the first transport arm 43b receives the lot L from the processing tool 44 and moves along the guide rail 43a to the negative side in the X-axis direction to a position where it can hand over the lot L to the second transport arm 52c. At this time, the second transport arm 52c is waiting at standby position A3. This allows the first transport arm 43b to move to the position where it can hand over the lot L to the second transport arm 52c without coming into contact with the second transport arm 52c.

[0066] Next, as shown in Figure 4, the second transport arm 52c moves from the standby position A3 to the handover position A1, receives the lot L from the first transport arm 43b, and holds it. That is, as shown by arrow F1 in Figure 7, the second transport arm 52c moves upward (towards the positive Z-axis) from the standby position A3 and receives the lot L from the first transport arm 43b.

[0067] Next, as shown in Figure 5, the second transport arm 52c moves from the handover position A1 to the immersion position A2, immersing the rod L into the immersion tank 51. That is, as shown by arrow F2 in Figure 7, the second transport arm 52c moves horizontally (positive Y-axis direction) from the handover position A1 to above the immersion tank 51. Then, as shown by arrow F3 in Figure 7, the second transport arm 52c descends from above the immersion tank 51 to the immersion position A2, immersing the rod L in the second rinsing liquid stored in the immersion tank 51.

[0068] Next, as shown in Figure 6, the third transport device 53 transports the substrates W of lot L, held by the second transport arm 52c in the second rinsing liquid, to the second transfer table 54. The third transport device 53 transports the substrates W one by one to the second transfer table 54. At this time, since the immersion tank 51 is located outside the movement range of the first transport arm 43b, the first transport arm 43b and the third transport arm 53a do not interfere with each other. As a result, one of the first transport device 43 and the third transport device 53 can be operated independently of the operating state of the other. In other words, mutual exclusion control is unnecessary. Therefore, the first transport device 43 and the third transport device 53 can be operated at any timing, so the time required to transport the substrates W can be shortened. As a result, the productivity of the substrate processing system 1 is improved.

[0069] Next, once all the substrates W of the lot L held by the second transport arm 52c have been removed, the second transport arm 52c moves to the standby position A3 and waits until the next lot L is transported by the first transport arm 43b. As shown by arrow F4 in Figure 7, the second transport arm 52c moves upward (upward in the Z-axis direction) from the immersion position A2 to the same height as the standby position A3, and then moves horizontally (negative in the Y-axis direction) to the standby position A3, as shown by arrow F5 in Figure 7. In this case, since the second transport arm 52c moves to the standby position A3 via a position lower than the transfer position A1, contact with the first transport arm 43b can be prevented. Note that the path taken by the second transport arm 52c from the immersion position A2 to the standby position A3 may be the same as the path taken by the second transport arm 52c from the standby position A3 to the immersion position A2.

[0070] According to the second interface unit 5 described above, the substrate W transported from the batch processing unit 4 to the single-wafer processing unit 6 is held in the second rinsing liquid until it is lifted out of the second rinsing liquid by the third transport device 53. Since the substrate W is below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrate W, and the collapse of the uneven pattern on the substrate W can be prevented.

[0071] (modified version) Referring to Figure 8, the second interface section 5A relating to the first modified example will be described. The second interface section 5A differs from the second interface section 5 in that the third transport device 53 is mounted above the upper surface of the immersion tank 51. Other configurations of the second interface section 5A may be the same as those of the second interface section 5.

[0072] As shown in Figure 8, the third conveying device 53 is attached, for example, to a frame member 55 that extends in the X-axis direction above the immersion tank 51, among the frame members that define the second interface section 5A. The third conveying device 53 may be supported by the frame member 55 so as to be movable along the X-axis direction. The third conveying device 53 may also be attached to a frame member (not shown) that extends in the Y-axis direction above the immersion tank 51, among the frame members that define the second interface section 5A.

[0073] Referring to Figure 9, the second interface section 5B relating to the second modified example will be described. The second interface section 5B differs from the second interface section 5 in that the second transport arm 52c is supported by a Y-axis drive device 52a so as to be movable along the Y-axis direction, and the Y-axis drive device 52a is supported by a Z-axis drive device 52b so as to be movable along the Z-axis direction. Other configurations in the second interface section 5B may be the same as those in the second interface section 5.

[0074] As shown in Figure 9, the Y-axis drive unit 52a is mounted on the negative side of the Z-axis drive unit 52b in the X-axis direction. The Y-axis drive unit 52a is supported by the Z-axis drive unit 52b so as to be movable along the Z-axis direction. The second transport arm 52c is supported by the Y-axis drive unit 52a so as to be movable along the Y-axis direction.

[0075] Referring to Figure 10, the second interface section 5C according to the third modified example will be described. The second interface section 5C differs from the second interface section 5B in that it is provided with two Z-axis drive devices 52b, and the Y-axis drive device 52a is supported by the two Z-axis drive devices 52b so as to be movable along the Z-axis direction. Other configurations in the second interface section 5C may be the same as those in the second interface section 5B.

[0076] As shown in Figure 10, the two Z-axis drive units 52b are spaced apart and parallel to each other in the Y-axis direction. The Y-axis drive unit 52a is supported by the two Z-axis drive units 52b so as to be movable along the Z-axis direction.

[0077] Referring to Figure 11, the second interface section 5D relating to the fourth modified example will be described. The second interface section 5D differs from the second interface section 5 in that the Y-axis drive device 52a is provided below the Z-axis drive device 52b. Other configurations of the second interface section 5D may be the same as those of the second interface section 5.

[0078] As shown in Figure 11, the Y-axis drive unit 52a extends along the Y-axis direction from the second interface unit 5 to the batch processing unit 4, below the Z-axis drive unit 52b. The Z-axis drive unit 52b is mounted on the positive Z-axis side of the Y-axis drive unit 52a. The Z-axis drive unit 52b is supported by the Y-axis drive unit 52a so as to be movable along the Y-axis direction.

[0079] Referring to Figure 12, the second interface section 5E relating to the fifth modified example will be described. The second interface section 5E differs from the second interface section 5 in that the Y-axis drive device 52a is provided above the Z-axis drive device 52b. Other configurations of the second interface section 5E may be the same as those of the second interface section 5.

[0080] As shown in Figure 12, the Y-axis drive unit 52a extends along the Y-axis direction from the second interface unit 5 to the batch processing unit 4, above the Z-axis drive unit 52b. The Z-axis drive unit 52b is mounted on the negative Z-axis side of the Y-axis drive unit 52a. The Z-axis drive unit 52b is supported by the Y-axis drive unit 52a so as to be movable along the Y-axis direction.

[0081] Referring to Figure 13, the second interface unit 5F relating to the sixth modified example will be described. The second interface unit 5F differs from the second interface unit 5 in that it has a multi-axis (e.g., 6-axis) robot arm 52d instead of the Y-axis drive unit 52a and the Z-axis drive unit 52b. The other components of the second interface unit 5F may be the same as those of the second interface unit 5.

[0082] As shown in Figure 13, the second transport device 52 includes a multi-axis robot arm 52d and a second transport arm 52c. The multi-axis robot arm 52d may be, for example, a 6-axis robot arm. The second transport arm 52c is attached to the tip of the multi-axis robot arm 52d. The second transport arm 52c can assume any position and orientation in three-dimensional space while holding multiple substrates W with the help of the multi-axis robot arm 52d.

[0083] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.

[0084] In the above embodiment, the drying apparatus 63 dries the substrate W with a supercritical fluid, but the drying method is not particularly limited. The drying method can be any method that can suppress the collapse of the uneven pattern of the substrate W, such as spin drying, scan drying, or water-repellent drying. In spin drying, the substrate W is rotated and the liquid film is shaken off the substrate W by centrifugal force. In scan drying, the substrate W is rotated while the supply position of the drying liquid is moved from the center of the substrate W toward the outer circumference of the substrate W, and the liquid film is shaken off the substrate W by centrifugal force. In scan drying, the supply position of the drying gas, such as N2 gas, may also be moved from the center of the substrate W toward the outer circumference of the substrate W so as to follow the supply position of the drying liquid.

[0085] Figure 14 is a schematic plan view showing a modified substrate processing system 1A according to the embodiment. The substrate processing system 1A shown in Figure 14 can be used when the drying method is spin drying, scan drying, or water-repellent drying.

[0086] As shown in Figure 14, in the substrate processing system 1A, a liquid processing device 62 is provided instead of a drying device 63. That is, the substrate processing system 1A has a single-wafer processing unit 6A which includes a fourth transport device 61 and a liquid processing device 62.

[0087] The liquid processing apparatus 62 is single-wafer type and processes one substrate W at a time with the processing liquid. The liquid processing apparatus 62 is configured to perform at least one of spin drying, scan drying, and water-repellent drying. The liquid processing apparatus 62 is arranged in multiple rows (e.g., two rows) in the horizontal direction (X-axis direction) and in multiple stages (e.g., three stages) in the vertical direction (Z-axis direction). This allows multiple substrates W to be processed with the processing liquid simultaneously. [Explanation of Symbols]

[0088] 1. 1A Substrate Processing System 2 Loading / Unloading Section 4. Batch Processing Unit 41 Chemical solution tank 42 Rinse solution tank 43. First conveying device 5. Second Interface Section 51 Soaking tank 52 Second conveying device 6, 6A Single-wafer processing unit C Cassette L lot W board

Claims

1. An interface device for transferring substrates between a batch processing unit that processes a lot containing multiple substrates at once and a single-wafer processing unit that processes the substrates in the lot one by one, In the batch processing unit, an immersion tank for immersing the lot is located outside the movement range of the first conveying device that transports the lot in a batch, A second conveying device that transfers the lot between the first conveying device and the immersion tank, An interface device having the following features.

2. The second transport device is, A conveying arm that holds the aforementioned lot, A drive device for moving the transport arm in the horizontal and vertical directions, Having, The interface device according to claim 1.

3. The transport arm is movable to a plurality of positions, including a transfer position for receiving the lot from the first transport device, an immersion position for immersing the lot in the immersion tank, and a standby position located directly below the transfer position. The drive device moves the transport arm to the immersion position or the standby position while the first transport device is operating. The interface device according to claim 2.

4. A transfer table is located adjacent to the single-wafer processing unit and is used to transfer the substrate between it and the single-wafer processing unit, A third conveying device for transporting the substrate from the immersion tank to the transfer table, It further has, The interface device according to claim 1.

5. The immersion tank stores the pure water in which the lot is immersed. The interface device according to claim 1.

6. The substrates transported to the aforementioned single-wafer processing unit are dried using a supercritical fluid. The interface device according to claim 4.

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