Electrical connection unit

Abstract

One embodiment provides an electrical connection unit that can improve heat dissipation and reduce costs. [Solution] An electrical connection unit according to one embodiment includes a first electronic component, a second electronic component, a first wiring section, and a second wiring section. The second electronic component generates less heat when energized than the first electronic component. The first wiring section is connected to a first terminal of the second electronic component, electrically connecting the first electronic component and the second electronic component. The second wiring section is connected to a second terminal of the second electronic component. The first wiring section is formed by at least one first metal plate portion. The second wiring section is formed by stacking a plurality of second metal plate portions. The first metal plate portion includes a first material. The second metal plate portion includes a second material. The thermal conductivity of the first material is higher than that of the second material.

Description

Technical Field

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[0001] Embodiments of the present invention relate to an electrical connection unit.

Background Art

[0002] An electrical connection unit having an electronic component and a wiring member electrically connected to the electronic component is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The electrical connection unit is expected to improve heat dissipation and reduce costs.

[0005] One embodiment provides an electrical connection unit capable of improving heat dissipation and reducing costs.

Means for Solving the Problems

[0007] An electrical connection unit according to one embodiment includes a first electronic component, a second electronic component, a first component, a first wiring section, and a second wiring section. The second electronic component has a first terminal and a second terminal. The first component generates less heat when energized than the first electronic component. The first wiring section is connected directly to the first terminal of the second electronic component or via a wiring member, electrically connecting the first electronic component and the second electronic component. The second wiring section is connected directly to the second terminal of the second electronic component or via a wiring member, electrically connecting the second electronic component and the first component. The first wiring section is formed by at least one first metal plate portion. The second wiring section is formed by stacking a plurality of second metal plate portions. The first metal plate portion includes a first material. The second metal plate portion includes a second material. The thermal conductivity of the first material is higher than that of the second material.

[0008] An electrical connection unit according to one embodiment includes a first electronic component, a second electronic component, a third electronic component, a fourth electronic component, a first wiring section, and a second wiring section. The third electronic component generates less heat when energized than the first electronic component. The first wiring section electrically connects the first electronic component and the second electronic component. The second wiring section electrically connects the third electronic component and the fourth electronic component. The first wiring section is formed by at least one first metal plate portion. The second wiring section is formed by stacking a plurality of second metal plate portions. The first metal plate portion includes a first material. The second metal plate portion includes a second material. The thermal conductivity of the first material is higher than that of the second material. [Effects of the Invention]

[0009] According to one embodiment, it is possible to improve heat dissipation and reduce costs. [Brief explanation of the drawing]

[0010] [Figure 1] A perspective view showing a partially disassembled electrical connection unit of the embodiment. [Figure 2] A perspective view showing the first structure of the embodiment. [Figure 3] A perspective view illustrating the electronic components and connecting components of the embodiment. [Figure 4] A plan view showing the first structure of the embodiment. [Figure 5] A perspective view showing the cable arrangement structure of the first structure of the embodiment. [Figure 6] A diagram showing a partially disassembled cable routing structure of the first structure of the embodiment. [Figure 7] A cross-sectional view along the line F7-F7 shown in Figure 4. [Figure 8] A perspective view showing a modified example of the first structure of the embodiment. [Figure 9] A perspective view showing the second structure of the embodiment. [Figure 10] A perspective view showing the cable arrangement structure of the second structure of the embodiment. [Figure 11] A plan view showing the second structure of the embodiment. [Figure 12] Cross-sectional view along the F12 - F12 line of the structure shown in FIG. 11. [Figure 13] Perspective view showing a first modification of the second structure of the embodiment. [Figure 14] Perspective view showing a second modification of the second structure of the embodiment. [Figure 15] Perspective view showing a third modification of the second structure of the embodiment. [Figure 16] Perspective view showing the third structure of the embodiment. [Figure 17] Cross-sectional view showing the third structure of the embodiment. [Figure 18] Perspective view showing a modification of the third structure of the embodiment. [Figure 19] Perspective view showing the fourth structure of the embodiment. [Figure 20] Perspective view showing the cable arrangement structure of the fourth structure of the embodiment. [Figure 21] Plan view showing the fourth structure of the embodiment. [Figure 22] Cross-sectional view along the F22 - F22 line of the structure shown in FIG. 21. [Figure 23] Perspective view showing the fifth structure of the embodiment. [Figure 24] Plan view showing the fifth structure of the embodiment. [Figure 25] Cross-sectional view along the F25 - F25 line of the structure shown in FIG. 24.

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments will be described with reference to the drawings. In the following description, components having the same or similar functions are denoted by the same reference numerals. And duplicate descriptions of those components may be omitted. Note that the configurations described below do not limit the scope of the embodiments.

[0012] In this disclosure, terms are defined as follows: “Connection” may include electrical connections, not just mechanical ones. That is, “Connection” may include cases where two elements to be connected are directly connected, not just cases where two elements to be connected are connected with another element in between. “Facing” or “overlapping” means that the virtual projections of two objects overlap when viewed from a particular direction. That is, “Facing” or “overlapping” may include cases where two objects face each other with another member or gap between them, not just cases where two objects face each other. “Parallel,” “orthogonal,” or “same” may include cases where they are “approximately parallel,” “approximately orthogonal,” or “approximately the same,” respectively.

[0013] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows: The +X direction is, for example, the direction from the first end 11e1 to the second end 11e2 of the lower wall 11 of the housing 10 described later (see Figure 1). The -X direction is the direction opposite to the +X direction. Hereinafter, when the +X direction and the -X direction are not distinguished, they will simply be referred to as the "X direction". The +Y direction and the -Y direction are directions that intersect (e.g., are orthogonal to) the X direction. The +Y direction is, for example, the direction from the third end 11e3 to the fourth end 11e4 of the lower wall 11 of the housing 10 described later (see Figure 1). The -Y direction is the direction opposite to the +Y direction. Hereinafter, when the +Y direction and the -Y direction are not distinguished, they will simply be referred to as the "Y direction". The +Z direction and the -Z direction are directions that intersect (e.g., are orthogonal to) the X direction and the Y direction. The +Z direction is the direction from the lower wall 11 of the housing 10 (described later) toward the main body MU (see Figure 1). The -Z direction is the opposite direction to the +Z direction. Hereafter, if the +Z direction and the -Z direction are not distinguished, they will simply be referred to as the "Z direction".

[0014] In the following, the X and Y directions may be referred to as the "horizontal direction" if they are not distinguished. In the following, the Z direction may be referred to as the "vertical direction." Also, in the following, the +Z direction may be referred to as "up" and the -Z direction as "down." However, these expressions are for the sake of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the installation orientation of the electrical connection unit 1).

[0015] (Embodiment) <1. Configuration of the electrical connection unit> Figure 1 is a perspective view showing a partially disassembled electrical connection unit 1 of an embodiment. The electrical connection unit 1 is an in-vehicle device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device. The electrical connection unit 1 has, for example, a housing 10 and a main body MU.

[0016] (Enclosure) The housing 10 is a component that forms the outer casing of the electrical connection unit 1. The housing 10 is, for example, a flat, box-shaped housing. The housing 10 is, for example, made of synthetic resin and has insulating properties. The housing 10 houses the main body MU. The housing 10 has, for example, a lower wall 11 (first wall), an upper wall 12 (second wall), and a peripheral wall 13 (third wall). The lower wall 11 covers at least a portion of the main body MU from below (-Z direction). The upper wall 12 covers at least a portion of the main body MU from above (+Z direction). The peripheral wall 13 surrounds the periphery of the main body MU.

[0017] The housing 10 includes, for example, a first member 10MA including a lower wall 11, and a second member 10MB including an upper wall 12 and a peripheral wall 13. In this embodiment, the housing 10 is formed by combining the first member 10MA and the second member 10MB. The lower wall 11 may be formed of an insulating sheet or the like instead of a rigid wall. Part or all of the housing 10 may be omitted.

[0018] (Main body) The main body MU is the part of the electrical connection unit 1 that performs the main function (for example, switching the electrical connection state or overcurrent protection). The main body MU may also be called a "circuit configuration". The main body MU includes, for example, a plurality of electronic components 20, a plurality of connection components 30, a plurality of wiring structures 60, and a base member 110. Here, the base member 110 will be described first.

[0019] The base member 110 is a member that supports one or more electronic components 20 and / or one or more wiring structures 60 inside the housing 10. The base member 110 is made of, for example, synthetic resin and is insulating. The base member 110 is positioned in the Z direction between the electronic components 20 and the wiring structures 60 and the lower wall 11 of the housing 10. The base member 110 is fixed to, for example, the lower wall 11 of the housing 10. The base member 110 supports one or more electronic components 20 and / or one or more wiring structures 60 from below. The base member 110 may be a wall portion along the horizontal direction, or a structure composed of multiple ribs rising vertically. The base member 110 may be formed from a part of the housing 10.

[0020] Next, the structure of each part of the main body MU will be described. The main body MU includes, for example, a first structure SA, a second structure SB, a third structure SC, a fourth structure SD, and a fifth structure SE. For example, the wiring structures 60 included in each of the first structure SA, second structure SB, third structure SC, fourth structure SD, and fifth structure SE are electrically connected to each other to form a single circuit. One or more of the first structure SA, second structure SB, third structure SC, fourth structure SD, and fifth structure SE may be electrically isolated from the other structures. Furthermore, the main body MU does not need to have all of these structures. The main body MU only needs to have one or more of the first to fifth structures SA, SB, SC, SD, and SE. The first to fifth structures SA, SB, SC, SD, and SE will be described below.

[0021] <2.First structure> First, let's explain the first structure, SA. Figure 2 is a perspective view showing the first structure SA. The first structure SA includes, for example, a plurality of electronic components 20, a plurality of connecting components 30, a plurality of external connection terminals 50, and a wiring structure 60.

[0022] <2.1 Electronic Components> Electronic component 20 is an electronic component mounted on the main unit MU according to the required functions. Electronic component 20 may be, for example, a connector, fuse, relay (e.g., mechanical relay or semiconductor relay), capacitor, branching component, various sensors (e.g., current sensor or voltage sensor), electronic control unit, or an electronic component unit in which two or more of these are unitized. However, the type of electronic component 20 is not limited to the above examples. Electronic component 20 may be, for example, a heat-generating component that generates heat when energized.

[0023] In this embodiment, the main body MU has an electronic component 20, which is an electronic component 20X of the first embodiment and an electronic component 20Y of the second embodiment. Hereinafter, when the electronic component 20X of the first embodiment and the electronic component 20Y of the second embodiment are not distinguished, they will simply be referred to as "electronic component 20".

[0024] In this embodiment, the main body MU includes, as connecting components 30, a first-mode connecting component 30X corresponding to the electronic component 20X (see Figure 3) and a second-mode connecting component 30Y corresponding to the electronic component 20Y (see Figure 13). Hereinafter, when the first-mode connecting component 30X and the second-mode connecting component 30Y are not distinguished, they will simply be referred to as "connecting component 30". The connecting component 30 is an example of a "wiring member".

[0025] <2.2 Electronic component of the first embodiment> Figure 3 is a perspective view illustrating the electronic component 20X and connecting component 30X of the first embodiment. The electronic component 20X has, for example, a case 21, a component body 22, a plurality of terminals 23, and a plurality of mounting parts 24 (only one is shown in Figure 3).

[0026] (case) The case 21 is an outer enclosure member that forms the majority of the outer casing of the electronic component 20. The case 21 is made of, for example, synthetic resin and has insulating properties. The case 21 houses the component body 22. The case 21 and the component body 22 may be formed as a single unit.

[0027] (Main part of the component) The main body portion 22 of the component is responsible for the main function of the electronic component 20. For example, if the electronic component 20 is a relay, the main body portion 22 includes a switching portion (e.g., a contact portion) that switches between a conductive state and a non-conductive state. For example, if the electronic component 20 is a fuse, the main body portion 22 includes a fuse that melts when an overcurrent flows. For example, if the electronic component 20 is a capacitor, the main body portion 22 includes a portion that stores electric charge.

[0028] (Terminals) Terminal 23 is an electrical connection part exposed to the outside of the case 21. Terminal 23 is electrically connected to the component body 22 inside the case 21. In this embodiment, the electronic component 20 includes terminals 23, namely terminal 23A and terminal 23B. One of terminals 23A and terminal 23B is the positive terminal. The other of terminals 23A and terminal 23B is the negative terminal. One of terminals 23A and terminal 23B is an example of a "first terminal". The other of terminals 23A and terminal 23B is an example of a "second terminal".

[0029] In the first embodiment of the electronic component 20X, terminals 23A and 23B are provided at one end of the electronic component 20X in the horizontal direction (e.g., the X direction). Terminals 23A and 23B are arranged side by side in the horizontal direction (e.g., the Y direction). Each of terminals 23A and 23B faces in the horizontal direction (e.g., the X direction).

[0030] Each terminal 23 has a mounting hole 23h into which a fastening member 41 (e.g., a screw or bolt), described later, is inserted. The mounting hole 23h opens horizontally (e.g., in the +X direction). In this embodiment, the fastening member 41 is inserted into the mounting hole 23h from the X direction (e.g., from the +X direction side). The inner circumferential surface of the mounting hole 23h of the electronic component 20X has a screw groove. The mounting hole 23h is a bottomed hole provided in the electronic component 20X. In this disclosure, the term "mounting hole" is not limited to a hole with a screw groove, and may also be a hole without a screw groove.

[0031] (Mounting part) The mounting portion 24 is a part for fixing the electronic component 20X. The mounting portion 24 is superimposed from the Z direction on a fixing portion 111 (e.g., a boss) provided on the base member 110. The mounting portion 24 has a mounting hole 24h into which a fastening member 29 (e.g., a screw or bolt) is inserted. The mounting hole 24h is open in the Z direction. The mounting portion 24 is attached to the base member 110 by fastening the fastening member 29 passed through the mounting hole 24h to the fixing portion 111 of the base member 110. The electronic component 20X is fixed to the base member 110 by the mounting portion 24 being attached to the base member 110.

[0032] <2.3 Connecting parts of the first embodiment> In this embodiment, the connecting component 30 is a member that electrically connects the electronic component 20 and the wiring structure 60. For example, when the terminal 23 of the electronic component 20 and the wiring structure 60 are located at different heights in the Z direction, the connecting component 30 is placed between the terminal 23 of the electronic component 20 and the wiring structure 60 to electrically connect the electronic component 20 and the wiring structure 60. The connecting component 30 may also be called a "vertical wiring member". For example, the length L12 of the connecting component 30 in the longitudinal direction of the electronic component 20 is shorter than the length L11 of the electronic component 20 in the longitudinal direction of the electronic component 20.

[0033] Figure 3 shows a first embodiment of a connecting component 30X corresponding to an electronic component 20X. The connecting component 30X has, for example, a first portion 31 and a second portion 32. In this embodiment, the first portion 31 and the second portion 32 form an L-shaped single piece of connecting component 30X.

[0034] (Part 1) The first portion 31 of the connecting component 30X is the portion that connects to the terminal 23 of the electronic component 20X. The first portion 31 is a plate-like or rectangular parallelepiped portion that extends in the Z direction. The first portion 31 extends in the Z direction along one end of the electronic component 20X (for example, the end in the X direction). The first portion 31 is an upright portion that stands upright in the Z direction relative to the wiring structure 60. The first portion 31 is adjacent to the terminal 23 of the electronic component 20X in the horizontal direction (for example, the X direction) and is connected to the terminal 23 of the electronic component 20X from the horizontal direction (for example, the X direction).

[0035] The first portion 31 of the connecting component 30X has a first mounting hole 31h into which a fastening member 41 (e.g., a screw or bolt) is inserted. The first mounting hole 31h opens horizontally (e.g., in the X direction). The first portion 31 is physically and electrically connected to the terminal 23 of the electronic component 20X by engaging the fastening member 41, which has been passed through the first mounting hole 31h, with the mounting hole 23h of the terminal 23 of the electronic component 20X.

[0036] (Second part) The second portion 32 of the connecting component 30X is the portion that connects to the cable routing structure 60. The second portion 32 extends horizontally (for example, in the X direction) from the -Z direction end of the first portion 31. The second portion 32 is a plate portion that runs horizontally. The second portion 32 overlaps the cable routing structure 60 from the Z direction and connects to the cable routing structure 60 from the Z direction.

[0037] The second portion 32 of the connecting component 30X has a second mounting hole 32h into which a fastening member 43 (e.g., a screw or bolt, see Figure 5) is inserted. The fastening member 43 protrudes from the cable routing structure 60 in the +Z direction. The fastening member 43 is, for example, a crimp bolt attached to the cable routing structure 60. The second mounting hole 32h opens in the Z direction. The second portion 32 is physically and electrically connected to the cable routing structure 60 by engaging an engaging member 44 (e.g., a nut, see Figure 2) with the tip of the fastening member 43 that has passed through the second mounting hole 32h. Thus, the connecting component 30X electrically connects the electronic component 20X to the cable routing structure 60.

[0038] <2.4 Electronic components of the second embodiment> Next, we will return to Figure 2 and describe the electronic component 20Y of the second embodiment. The electronic component 20Y of the second embodiment is an electronic component in which two terminals 23 are arranged separately at both ends in the horizontal direction of the electronic component 20Y. The electronic component 20Y has, for example, a case 21, a component body 22, and multiple terminals 23. In the electronic component 20Y, components that have the same function as those of the electronic component 20X are denoted by the same reference numerals. The explanation of the electronic component 20Y can be understood by replacing "electronic component 20X" with "electronic component 20Y" in the explanation of the electronic component 20X described above.

[0039] As described above, terminals 23A and 23B of the electronic component 20Y are separated and arranged at both ends of the electronic component 20Y in the horizontal direction (e.g., the X direction). Each terminal 23 has a mounting hole 23h into which a fastening member 43 (e.g., a screw or bolt) is inserted. The mounting hole 23h opens in the Z direction. The mounting hole 23h does not have, for example, a screw thread. The terminals 23 of the electronic component 20Y are physically and electrically connected to the wiring structure 60 by engaging an engaging member 44 (e.g., a nut) with the tip of the fastening member 43 that has passed through the mounting hole 23h.

[0040] <2.5 Connecting parts of the second embodiment> As described above, the electronic component 20Y may be connected to the wiring structure 60 via a connecting component 30Y (see Figure 13) of the second embodiment, instead of being directly connected to the wiring structure 60. The connecting component 30Y has, for example, a first portion 31 and a second portion 32.

[0041] (Part 1) The first part 31 of the connecting component 30Y is the part that connects to the terminal 23 of the electronic component 20Y. The first part 31 is a rectangular parallelepiped that extends in the Z direction. The first part 31 is adjacent to the terminal 23 of the electronic component 20Y in the Z direction and is connected to the terminal 23 of the electronic component 20Y from the Z direction.

[0042] The first portion 31 of the connecting component 30Y has a first mounting hole 31h into which a fastening member 41 (e.g., a screw or bolt) is inserted. The first mounting hole 31h opens in the Z direction. The first mounting hole 31h of the connecting component 30Y has a screw groove. The first portion 31 is physically and electrically connected to the terminal 23 of the electronic component 20Y by engaging the fastening member 41, which is passed through the mounting hole 23h of the terminal 23 of the electronic component 20Y, with the first mounting hole 31h.

[0043] (Second part) The second portion 32 of the connecting component 30Y is the portion that connects to the cable routing structure 60. The second portion 32 extends horizontally (for example, in the X direction) from the -Z direction end of the first portion 31. The details of the second portion 32 of the connecting component 30Y are the same as the details of the second portion 32 of the connecting component 30X described above.

[0044] <2.6 Electronic Components of the First Structure> Next, the electronic components 20 of the first structure SA will be described. The first structure SA includes three electronic components 20A, 20B, and 20C as multiple electronic components 20.

[0045] Each of the electronic components 20A and 20B is, for example, a component included in the main circuit CM of the electrical connection unit 1. In this disclosure, "component included in the main circuit" means, for example, a component through which a current having a first current value as an average current value (main current) flows. In this disclosure, "main current" means, for example, a current used to drive a device (such as a vehicle) that is output to or input from an external device. The external device may be a power conversion device such as an inverter, or a battery.

[0046] Electronic components 20A and 20B are, for example, electrically connected in series. Each of electronic components 20A and 20B is, for example, a relay. However, the types of electronic components 20A and 20B are not limited to the above example. Each of electronic components 20A and 20B generates more heat when energized than electronic component 20C, which will be described later. Electronic component 20A is an example of a "first electronic component". Electronic component 20B is an example of a "second electronic component".

[0047] On the other hand, electronic component 20C is, for example, a component included in the sub-circuit CS of the electrical connection unit 1. In this disclosure, "component included in a sub-circuit" means, for example, a component through which a current having a second current value smaller than the first current value as an average current value flows. In this disclosure, "sub-circuit" means a circuit through which the main current described above does not flow, and through which a current with a current value smaller than the main current flows.

[0048] Electronic component 20C is, for example, a fuse. However, the type of electronic component 20C is not limited to the above example. Electronic component 20 included in sub-circuit CS may be a smaller relay or various sensors compared to electronic component 20 included in main circuit CM.

[0049] <2.7 External connection terminals of the first structure> Next, the external connection terminal 50 of the first structure SA will be described. The external connection terminal 50 is a terminal to which an external connection bus bar 54 can be attached. The external connection bus bar 54 is a wiring member that connects the electrical connection unit 1 and external equipment. In this disclosure, "external equipment" means equipment located outside the electrical connection unit 1 (for example, a power conversion device such as an inverter, a battery, various sensors, or a control device).

[0050] For example, the external connection terminal 50 is a component that protrudes from the wiring structure 60 in the +Z direction. In this embodiment, the external connection terminal 50 is formed by the shaft portion of a fastening member 43 attached to the wiring structure 60. The bus bar 54 for external connection has a mounting hole 54h into which the external connection terminal 50 is inserted. In this embodiment, the bus bar 54 for external connection is physically and electrically connected to the external connection terminal 50 by engaging an engaging member 55 (e.g., a nut) with the tip of the external connection terminal 50 inserted into the mounting hole 54h. The external connection terminal 50 generates less heat when energized than the electronic component 20A. Furthermore, the external connection terminal 50 generates less heat when energized than the electronic component 20B. Furthermore, the external connection terminal 50 generates less heat when energized than the electronic component 20C.

[0051] The first structure SA includes three external connection terminals 51, 52A, and 52B as a plurality of external connection terminals 50. External connection terminal 51 is, for example, a component included in the main circuit CM of the electrical connection unit 1. External connection terminal 51 is electrically connected in series with two electronic components 20A and 20B. A current (main current) having the above-mentioned first current value as an average current value flows through external connection terminal 51.

[0052] External connection terminals 52A and 52B are components included in the subcircuit CS of the electrical connection unit 1, for example. External connection terminals 52A and 52B are electrically connected in parallel with electronic component 20B, for example, with respect to electronic component 20A. External connection terminals 52A and 52B are also electrically connected in parallel with each other. External connection terminals 52A and 52B are arranged side by side in the Y direction, for example. Current flows through external connection terminals 52A and 52B with a second current value that is smaller than the first current value as an average current value. Current is output to various sensors or control devices, for example, through external connection terminals 52A and 52B. External connection terminal 52A is an example of a "first component". External connection terminal 52B is an example of a "second component". Each of external connection terminals 52A and 52B generates less heat when energized than external connection terminal 51.

[0053] <2.8 Cable Management Structure> Next, the cable arrangement structure 60 of the first structure SA will be described. The first structure SA has a cable routing structure 60A as an example of a cable routing structure 60. The cable routing structure 60A includes, for example, a cable routing structure 65, a cable routing section 70C, a cable routing section 70D, and a cable routing section 70E.

[0054] The wiring structure 65 is provided, for example, across electronic component 20A, electronic component 20B, and external connection terminals 52A and 52B. The wiring structure 65 electrically connects electronic component 20A, electronic component 20B, and external connection terminals 52A and 52B. The wiring structure 65 includes, for example, a wiring section 70A and a wiring section 70B.

[0055] (Riding section 70A) The wiring section 70A is provided across electronic component 20A and electronic component 20B, and electrically connects electronic component 20A and electronic component 20B. The wiring section 70A is a wiring section included in the main circuit CM of the electrical connection unit 1. The wiring section 70A is an example of the "first wiring section".

[0056] The cable routing section 70A is formed by a first number (e.g., two) of metal plate sections 81. The metal plate sections 81 are plate sections that align horizontally. The metal plate sections 81 are made of, for example, aluminum or an aluminum alloy. The thickness (thickness in the Z direction) of the metal plate sections 81 is, for example, 3 mm. The cable routing section 70A is formed by arranging a first number (e.g., two) of metal plate sections 81 in overlapping positions in the Z direction. The multiple metal plate sections 81 may be integrated by welding or machining, or they may be separable from one another.

[0057] Figure 4 is a plan view showing the first structure SA. The cable routing section 70A includes, for example, a first connection section 71, a second connection section 72, an extension section 73, and an expansion section 74.

[0058] The first connection portion 71 is located at one end of the wiring portion 70A. When viewed from the Z direction, the first connection portion 71 overlaps with the connecting component 30 corresponding to terminal 23B of the electronic component 20A. The first connection portion 71 is connected to the connecting component 30 and is electrically connected to terminal 23B of the electronic component 20A via the connecting component 30. Alternatively, the first connection portion 71 may be directly connected to terminal 23B of the electronic component 20A without going through the connecting component 30.

[0059] The second connection portion 72 is located at another end of the wiring portion 70A. When viewed from the Z direction, the second connection portion 72 overlaps with the connecting component 30 corresponding to terminal 23A of the electronic component 20B. The second connection portion 72 is connected to the connecting component 30 and is electrically connected to terminal 23A of the electronic component 20B via the connecting component 30. Alternatively, the second connection portion 72 may be connected directly to terminal 23A of the electronic component 20B without going through the connecting component 30.

[0060] The extension portion 73 extends between the first connection portion 71 and the second connection portion 72. The extension portion 73 includes a portion that extends in the X direction or the Y direction. In this embodiment, the extension portion 73 includes a first portion 73a that extends from the first connection portion 71 in the -Y direction and a second portion 73b that extends from the first portion 73a in the -X direction and is connected to the second connection portion 72.

[0061] The extended portion 74 is the part in which the wiring portion 70A is extended to an area that is not electrically necessary, for example, in order to increase the heat capacity. Here, the direction in which terminals 23A and terminal 23B of the electronic component 20B are aligned (for example, the Y direction) is defined as the "first direction". Then, with the electronic component 20B as the reference, the side closer to the electronic component 20A in the first direction (+Y direction side) is defined as the "first side", and the side opposite to the first side (-Y direction side) is defined as the "second side". In this case, the extended portion 74 extends and protrudes from the second connection portion 72 or extension portion 73 toward the second side (-Y direction side).

[0062] In this embodiment, the extension portion 74 is provided on the second side (-Y direction side) with respect to both the second connecting portion 72 and the extension portion 73. That is, the extension portion 74 extends in the X direction across a position adjacent to the second connecting portion 72 in the Y direction and a position adjacent to the extension portion 73 in the Y direction. The extension portion 74 extends in the X direction, for example, across the entire length of the extension portion 73 in the X direction.

[0063] (Routing section 70B) Next, we will return to Figure 2 and explain the wiring section 70B. The wiring section 70B is a branch section that branches off from the wiring section 70A. The wiring section 70B is provided across the wiring section 70A and the external connection terminals 52A and 52B, and electrically connects the wiring section 70A and the external connection terminals 52A and 52B. The wiring section 70B is a wiring section included in the sub-circuit CS of the electrical connection unit 1. The wiring section 70B is an example of a "second wiring section".

[0064] The cable routing section 70B is formed by a second number of metal plate sections 82 (for example, one sheet), which is fewer than the first number of metal plate sections described above. The metal plate section 82 is a plate that aligns horizontally. The metal plate section 82 is made of, for example, aluminum or an aluminum alloy. The thickness of the metal plate section 82 (thickness in the Z direction) is, for example, 3 mm. The thickness of the metal plate section 82 is the same as the thickness of the metal plate section 81 described above.

[0065] In this embodiment, the cable routing section 70B branches off from a part of the cable routing section 70A. For example, the longitudinal length (Y direction) L22 of the cable routing section 70B is more than twice the Y-direction width W21 of the busbar 54 for external connection (see Figure 4). For example, the longitudinal length (Y-direction) L22 of the cable routing section 70B is greater than the Y-direction width W11 of the electronic component 20A or electronic component 20B (see Figure 4).

[0066] Figure 5 shows the cable routing structure 60A of the first structure SA. Figure 6 shows a partially exploded view of the cable routing structure 60A of the first structure SA. In this embodiment, the cable routing structure 65 includes a first metal plate 91 and a second metal plate 92. Each of the first metal plate 91 and the second metal plate 92 is a metal plate oriented horizontally. The thickness (thickness in the Z direction) of each of the first metal plate 91 and the second metal plate 92 is, for example, 3 mm. The first metal plate 91 and the second metal plate 92 differ in size when viewed from the Z direction.

[0067] The first metal plate 91 has an outer shape corresponding to the cable routing section 70A when viewed from the Z direction. On the other hand, the second metal plate 92 has an outer shape corresponding to the cable routing section 70A and the cable routing section 70B when viewed from the Z direction. In this embodiment, one metal plate portion 81 included in the cable routing section 70A and one metal plate portion 82 included in the cable routing section 70B are formed by a single metal plate 92. That is, in this embodiment, the cable routing structure 65 including the cable routing section 70A and the cable routing section 70B is formed by arranging the first metal plate 91, which has an outer shape corresponding to the cable routing section 70A, and the second metal plate 92, which has an outer shape corresponding to the cable routing section 70A and the cable routing section 70B, on top of each other in the Z direction.

[0068] (Routing section 70C) Next, let's return to Figure 2 and explain the wiring section 70C. The wiring section 70C is a wiring section connected to the electronic component 20A, the terminal 23A of the electronic component 20C, and another part within the electrical connection unit 1. For example, the wiring section 70C is electrically connected to the terminal 23A of the electronic component 20A via the connection component 30. Alternatively, the wiring section 70C may be directly connected to the terminal 23A of the electronic component 20A without going through the connection component 30.

[0069] The wiring section 70C is a wiring section included in the main circuit CM of the electrical connection unit 1. The wiring section 70C is formed, for example, by arranging a first number (e.g., two) of metal plate sections 81 in the Z direction, similar to the wiring section 70A. However, if the temperature rise of the wiring section 70C is limited, the wiring section 70C may be formed by a second number (e.g., one) of metal plate sections 82.

[0070] (Routing section 70D) Next, the wiring section 70D will be described. The wiring section 70D is a wiring section that connects the electronic component 20B and the external connection terminal 51. For example, the wiring section 70D is electrically connected to the terminal 23B of the electronic component 20B via the connecting component 30. Alternatively, the wiring section 70D may be directly connected to the terminal 23B of the electronic component 20B without using the connecting component 30.

[0071] The wiring section 70D is a wiring section included in the main circuit CM of the electrical connection unit 1. The wiring section 70D is formed, for example, by arranging a first number (e.g., two) of metal plate sections 81 in the Z direction, similar to the wiring section 70A. However, if the temperature rise of the wiring section 70D is limited, the wiring section 70D may be formed by a second number (e.g., one) of metal plate sections 82.

[0072] (Riding section 70E) Next, the wiring section 70E will be described. The wiring section 70E is a wiring section connected to the terminal 23B of the electronic component 20C. For example, the wiring section 70E is directly connected to the terminal 23B of the electronic component 20C. Alternatively, the wiring section 70E may be connected to the terminal 23B of the electronic component 20C via a connecting component 30 (for example, a connecting component 30Y).

[0073] The wiring section 70E is a wiring section included in the subcircuit CS of the electrical connection unit 1. The wiring section 70E is formed, for example, by arranging a first number (e.g., two) of metal plate sections 81 in the Z direction, similar to the wiring section 70A. However, if the temperature rise of the wiring section 70E is limited, the wiring section 70E may be formed by a second number (e.g., one) of metal plate sections 82.

[0074] <2.9 Cross-sectional structure of the first structure> Figure 7 is a cross-sectional view along the line F7-F7 shown in Figure 4. In this embodiment, a step ST exists at the boundary between the cable routing section 70A and the cable routing section 70B, due to the difference in the number of metal plates between the first number of metal plates 81 and the second number of metal plates 82. The step ST is positioned on the opposite side from the base member 110.

[0075] In other words, the second metal plate 92 is positioned along the base member 110. The first metal plate 91 is positioned on the opposite side of the base member 110 from the second metal plate 92. The base member 110 supports the second metal plate 92 by contacting it from below. By supporting the second metal plate 92, the base member 110 supports the wiring structure 65.

[0076] <2.10 Modification of the first structure> Figure 8 is a perspective view showing a modified example of the first structure SA. In this modified example, multiple electronic components 20 (electronic components 20DA, 20DB) are connected to the wiring section 70B. Electronic components 20DA and 20DB are, for example, fuses, sensors, or small relays. Each of electronic components 20DA and 20DB generates less heat when energized than electronic component 20A. Also, each of electronic components 20DA and 20DB generates less heat when energized than electronic component 20B. Furthermore, each of electronic components 20DA and 20DB may be an electronic component that generates less heat when energized than electronic component 20C. Electronic components 20DA and 20DB are components included in the sub-circuit CS of the electrical connection unit 1. Electronic component 20DA is an example of a "first component". Electronic component 20DB is an example of a "second component". That is, the components connected to the wiring section 70B are not limited to external connection terminals 50, but may also be electronic components.

[0077] <2.11 Advantages of the First Structure> As a comparative example, consider a configuration in which each wiring section in the entire electrical connection unit is made of only one metal plate. In such a comparative example configuration, if the heat generated by the electronic components increases, the heat dissipation capacity may be insufficient, and the temperature of the electrical connection unit may rise significantly. On the other hand, if each wiring section in the entire electrical connection unit is formed of two or more metal plates, the cost and weight of the electrical connection unit will increase.

[0078] Therefore, the electrical connection unit of this embodiment has a first electronic component (e.g., electronic component 20A), a second electronic component (e.g., electronic component 20B), a first component (e.g., an external connection terminal 52A or electronic component 20DA), and a wiring structure (e.g., wiring structure 65). The first component generates less heat when energized than the first electronic component. The wiring structure includes a first wiring section (e.g., wiring section 70A) that electrically connects the first electronic component and the second electronic component, and a second wiring section (e.g., wiring section 70B) that electrically connects the first wiring section and the first component. The first wiring section is formed by stacking a first number of metal plate sections (e.g., metal plate section 81). The second wiring section is formed by a second number of metal plate sections (e.g., metal plate section 82) which is fewer than the first number.

[0079] With this configuration, the first wiring section connected to the first electronic component is formed from a first number of metal plates, allowing for good heat dissipation of the first electronic component, which tends to become relatively hot. On the other hand, since the second wiring section connected to the first component is formed from a second number of metal plates, which is fewer than the first number, the cost and weight associated with the wiring structure can be reduced. This structure improves the heat dissipation of the electrical connection unit, while also reducing costs and weight.

[0080] In this embodiment, one metal plate portion included in the first number of metal plate portions in the first wiring section and one metal plate portion included in the second number of metal plate portions in the second wiring section are formed from a single metal plate (for example, metal plate 92). With this configuration, in a configuration where the number of metal plate portions differs between the first wiring section and the second wiring section, the number of parts related to the wiring structure can be reduced, and the cost and weight of the electrical connection unit can be further reduced. Furthermore, with this configuration, a good connection between the first wiring section and the second wiring section can be achieved, and the electrical characteristics of the electrical connection unit can be improved compared to the case where the first wiring section and the second wiring section are formed from different metal plates.

[0081] In this embodiment, the electrical connection unit further includes a second component (e.g., an external connection terminal 52B or an electronic component 20DB) that generates less heat when energized than the first electronic component. The second wiring section is provided across the first wiring section, the first component, and the second component. With this configuration, the second wiring section is provided continuously in a certain area spanning the first component and the second component. In this configuration, because the second wiring section is large, the cost and weight associated with the wiring structure can be further reduced.

[0082] In this embodiment, the first wiring section includes a first connection section (e.g., first connection section 71) directly connected to the first electronic component or via a wiring member, a second connection section (e.g., second connection section 72) directly connected to the first terminal of the second electronic component or via a wiring member, and an extension section (e.g., extension section 73) extending between the first connection section and the second connection section. In this embodiment, the first wiring section further includes an extension section (e.g., extension section 74) extending from the second connection section or the extension section toward the second side (e.g., the -Y direction). With this configuration, the heat capacity of the first wiring section is increased by providing the extension section. This configuration further improves the heat dissipation of the electrical connection unit.

[0083] In this embodiment, the electrical connection unit further includes a base member (e.g., base member 110) that supports the cable routing structure. At the boundary between the first cable routing section and the second cable routing section, there is a step (e.g., step ST) due to the difference in the number of metal plates between the first number of metal plates and the second number of metal plates. The step is positioned on the opposite side from the base member. With this configuration, even if the number of metal plates differs between the first cable routing section and the second cable routing section, the shape of the support surface of the base member that supports the cable routing structure can be simplified. This makes it possible to further reduce the cost of the electrical connection unit.

[0084] <3.Second structure> Next, we will explain the second structure, SB. Figure 9 is a perspective view showing the second structure SB. Figure 10 is a perspective view showing the wiring structure 60 of the second structure SB. Figure 11 is a plan view showing the second structure SB. The second structure SB includes, for example, a plurality of electronic components 20, a plurality of connecting components 30, an external connection terminal 50, and a wiring structure 60.

[0085] <3.1 Electronic components of the second structure> Next, the electronic components 20 of the second structure SB will be described. The second structure SB includes three electronic components 20E, 20F, and 20G as multiple electronic components 20.

[0086] Each of the electronic components 20E and 20F is, for example, a component included in the main circuit CM of the electrical connection unit 1. The electronic components 20E and 20F are, for example, electrically connected in series. Each of the electronic components 20E and 20F is, for example, a relay. However, the types of electronic components 20E and 20F are not limited to the above examples. Electronic component 20E or electronic component 20F is an example of a "first electronic component".

[0087] On the other hand, electronic component 20G is, for example, a component included in the sub-circuit CS of the electrical connection unit 1. Electronic component 20G is electrically connected in parallel with electronic component 20F to electronic component 20E. Electronic component 20G is, for example, a fuse. However, the type of electronic component 20G is not limited to the above example. Electronic component 20G generates less heat when energized than electronic component 20E. Also, electronic component 20G generates less heat when energized than electronic component 20F. Electronic component 20G is an example of a "second electronic component".

[0088] <3.2 External connection terminals of the second structure> The second structure SB includes an external connection terminal 52 as an external connection terminal 50. The external connection terminal 52 is, for example, a component included in the subcircuit CS of the electrical connection unit 1. The external connection terminal 52 is electrically connected in parallel with electronic component 20F to, for example, electronic component 20E. The external connection terminal 52 is electrically connected in series with electronic component 20G. The external connection terminal 52 generates less heat when energized than electronic component 20E. Also, the external connection terminal 52 generates less heat when energized than electronic component 20F. The external connection terminal 52 is an example of the "first component".

[0089] <3.3 Cable Management Structure> Next, we will describe the cable arrangement structure 60 of the second structure SB. The second structure SB has a cable routing structure 60B as an example of the cable routing structure 60. The cable routing structure 60B includes, for example, cable routing sections 70F, 70G, 70H, and 70I. The details of the metal plate sections 81 and 82 of the second structure SB are the same as the details of the metal plate sections 81 and 82 described in the first structure SA.

[0090] (Riding section 70F) The wiring section 70F is provided across electronic component 20E, electronic component 20F, and electronic component 20G. The wiring section 70F electrically connects electronic component 20E, electronic component 20F, and electronic component 20G. The wiring section 70F is an example of a "first wiring section". The wiring section 70F has, for example, a first part 70Fa and a second part 70Fb.

[0091] The first portion 70Fa of the wiring section 70F is provided across electronic component 20E and electronic component 20F, and electrically connects electronic component 20E and electronic component 20F. For example, the first portion 70Fa is connected to a connecting component 30 corresponding to terminal 23B of electronic component 20E, and electrically connected to terminal 23B of electronic component 20E via the connecting component 30. Alternatively, the first portion 70Fa is connected to a connecting component 30 corresponding to terminal 23A of electronic component 20F, and electrically connected to terminal 23A of electronic component 20F via the connecting component 30. The first portion 70Fa is included, for example, in the main circuit CM of the electrical connection unit 1. Alternatively, the first portion 70Fa may be directly connected to electronic components 20E and 20F without using the connecting component 30.

[0092] The second portion 70Fb of the wiring section 70F is a branched portion that branches off from the first portion 70Fa. The second portion 70Fb is provided across the first portion 70Fa and the electronic component 20G, and electrically connects the first portion 70Fa and the electronic component 20G. For example, the second portion 70Fb is directly connected to terminal 23A of the electronic component 20G, and is electrically connected to the electronic component 20G. Alternatively, the second portion 70Fb may be connected to the electronic component 20G via a connecting component 30 (for example, connecting component 30Y). The second portion 70Fb is included, for example, in the subcircuit CS of the electrical connection unit 1.

[0093] In this embodiment, the second portion 70Fb of the cable routing section 70F includes an inclined portion 70Fba and a flat portion 70Fbb. The inclined portion 70Fba is connected to the first portion 70Fa of the cable routing section 70F. The inclined portion 70Fba extends from the first portion 70Fa of the cable routing section 70F, inclined toward the +Z direction with respect to the horizontal. The flat portion 70Fbb is located on the opposite side of the first portion 70Fa of the cable routing section 70F from the inclined portion 70Fba. The flat portion 70Fbb is connected to the inclined portion 70Fba. In this embodiment, the flat portion 70Fbb is directly connected to terminal 23A of the electronic component 20G.

[0094] In this embodiment, the entire cable routing section 70F is formed by a first number (e.g., two) of metal plate portions 81. That is, the first portion 70Fa and the second portion 70Fb of the cable routing section 70F are formed by the first number (e.g., two) of metal plate portions 81. The cable routing section 70F is formed by the first number (e.g., two) of metal plate portions 81 being arranged in overlapping directions in the Z direction. In this embodiment, the entire cable routing section 70F, including the inclined portion 70Fba and the flat portion 70Fbb, is formed by a first number (e.g., two) of metal plate portions 81.

[0095] (Routing section 70G) Next, the wiring section 70G will be described. The wiring section 70G is provided across the electronic component 20G and the external connection terminal 52, and electrically connects the electronic component 20G and the external connection terminal 52. For example, the wiring section 70G is directly connected to terminal 23B of the electronic component 20G and electrically connected to the electronic component 20G. Alternatively, the wiring section 70G may be connected to the electronic component 20G via a connecting component 30 (for example, connecting component 30Y). The wiring section 70G is an example of a "second wiring section".

[0096] The wiring section 70G is, for example, a wiring section included in the subcircuit CS of the electrical connection unit 1. The wiring section 70G is formed by a second number (for example, one) of metal plate sections 82, which is fewer than the first number mentioned above.

[0097] (Routing section 70H) The wiring section 70H is a wiring section connected to an electronic component 20E and another part within the electrical connection unit 1. For example, the wiring section 70H is connected to a connection component 30 corresponding to terminal 23A of the electronic component 20E, and is electrically connected to terminal 23A of the electronic component 20E via the connection component 30. The wiring section 70H is, for example, a wiring section included in the main circuit CM of the electrical connection unit 1. The wiring section 70H is formed, for example, by arranging a first number (e.g., two) of metal plate sections 81 in the Z direction, similar to the wiring section 70F. In cases where the temperature rise of the wiring section 70H is limited, the wiring section 70H may be formed by a second number (e.g., one) of metal plate sections 82.

[0098] (Routing section 70I) The wiring section 70I is a wiring section connected to an electronic component 20F and another part within the electrical connection unit 1. For example, the wiring section 70I is connected to a connection component 30 corresponding to terminal 23B of the electronic component 20F, and is electrically connected to terminal 23B of the electronic component 20F via the connection component 30. The wiring section 70I is, for example, a wiring section included in the main circuit CM of the electrical connection unit 1. The wiring section 70I is formed, for example, by arranging a first number (e.g., two) of metal plate sections 81 in the Z direction, similar to the wiring section 70F. However, in cases where the temperature rise of the wiring section 70I is limited, the wiring section 70I may be formed by a second number (e.g., one) of metal plate sections 82.

[0099] <3.4 Cross-sectional structure of the second structure> Figure 12 is a cross-sectional view of the structure shown in Figure 11 along the line F12-F12. In this embodiment, the cable routing section 70F has a first mounting surface S1 facing the terminal 23A of the electronic component 20G. For example, the first mounting surface S1 contacts the terminal 23A of the electronic component 20G from below. Similarly, the cable routing section 70G has a second mounting surface S2 facing the terminal 23B of the electronic component 20G. The second mounting surface S2 contacts the terminal 23B of the electronic component 20G from below. In this embodiment, the first mounting surface S1 of the cable routing section 70F and the second mounting surface S2 of the cable routing section 70G are located on the same plane.

[0100] In this embodiment, the cable routing structure 60B has a step ST due to the difference in the number of metal plates between the first number of metal plate portions 81 and the second number of metal plate portions 82. The step ST is positioned facing downward. The base member 110 includes a first support portion 121 that supports the cable routing portion 70F from below and a second support portion 122 that supports the cable routing portion 70F from below. The first support portion 121 and the second support portion 122 are positioned at different locations (for example, different locations in the Z direction) corresponding to the difference in the number of metal plates between the first number of metal plate portions 81 and the second number of metal plate portions 82. For example, the end face 121a on the +Z direction side of the first support portion 121 is located on the -Z direction side relative to the end face 122a on the +Z direction side of the second support portion 122.

[0101] <3.5 Modified Examples of the Second Structure> Next, we will describe some variations of the second structure SB. Note that, apart from the configurations described below, the configurations of each variation are the same as those of the second structure SB described above.

[0102] <3.5.1 First Variation> Figure 13 is a perspective view showing a first modified example of the second structure SB. In this modified example, the wiring section 70F is connected to terminal 23A of the electronic component 20G via a connecting component 30 (for example, connecting component 30Y). The wiring section 70G is also connected to terminal 23B of the electronic component 20G via a connecting component 30 (for example, connecting component 30Y).

[0103] <3.5.2 Second Variation> Figure 14 is a perspective view showing a second modified example of the second structure SB. In this modified example, the wiring section 70G is connected to an electronic component 20D instead of an external connection terminal 50. The electronic component 20D is, for example, a fuse, a sensor, or a small relay. The electronic component 20D generates less heat when energized than the electronic component 20E. The electronic component 20D generates less heat when energized than the electronic component 20F. The electronic component 20D is a component included in the sub-circuit CS of the electrical connection unit 1. The electronic component 20D is an example of the "first component". That is, the component connected to the wiring section 70G is not limited to an external connection terminal 50, but may also be an electronic component.

[0104] <3.5.3 Third Variation> In the above-described embodiment, the wiring section 70F included in the main circuit CM is formed by a first number (e.g., two) of metal plate sections 81, and the wiring section 70G included in the sub-circuit CS is formed by a second number (e.g., one) of metal plate sections 82. Alternatively, one wiring section 70F included in the main circuit CM may be formed by a first number (e.g., two) of metal plate sections 81, and another wiring section 70G included in the main circuit CM may be formed by a second number (e.g., one) of metal plate sections 82.

[0105] Figure 15 is a perspective view showing a third modified example of the second structure SB. In this modified example, the second structure SB includes three electronic components 20E, 20F, and 20H as a plurality of electronic components 20. The electronic components 20E, 20F, and 20H are, for example, components included in the main circuit CM of the electrical connection unit 1. The three electronic components 20E, 20F, and 20H are, for example, electrically connected in series.

[0106] Electronic component 20H is, for example, a large fuse. However, the type of electronic component 20H is not limited to the above example. Electronic component 20H is an example of a "first electronic component". Electronic components 20E and 20F are relays, respectively. However, the types of electronic components 20E and 20F are not limited to the above example. Electronic components 20E and 20F generate less heat when energized than electronic component 20H. Electronic component 20E is an example of a "second electronic component". Electronic component 20F is an example of both a "first component" and a "third electronic component".

[0107] (Riding section 70F) The wiring section 70F is provided across electronic component 20H and electronic component 20E, and is electrically connected to both electronic component 20H and electronic component 20E. For example, the wiring section 70E is directly connected to terminal 23B of electronic component 20H and is electrically connected to electronic component 20H. Alternatively, the wiring section 70F is connected to a connecting component 30 corresponding to terminal 23A of electronic component 20E, and is electrically connected to terminal 23A of electronic component 20E via the connecting component 30. Instead of the above example, the wiring section 70F may be connected to terminal 23B of electronic component 20H via a connecting component 30 (for example, connecting component 30Y). Alternatively, the wiring section 70F may be directly connected to terminal 23A of electronic component 20E without going through the connecting component 30.

[0108] In this modified example, the wiring section 70F is a wiring section included in the main circuit CM of the electrical connection unit 1. The wiring section 70F is formed by arranging the first number (for example, two) of metal plate sections 81 in the Z direction. The wiring section 70F is an example of the "first wiring section".

[0109] (Routing section 70G) The wiring section 70G is provided across electronic component 20E and electronic component 20F, and electrically connects electronic component 20E and electronic component 20F. For example, the wiring section 70G is connected to a connecting component 30 corresponding to terminal 23B of electronic component 20E, and electrically connected to terminal 23B of electronic component 20E via the connecting component 30. Alternatively, the wiring section 70G is connected to a connecting component 30 corresponding to terminal 23A of electronic component 20F, and electrically connected to terminal 23A of electronic component 20F via the connecting component 30. In addition to the above examples, the wiring section 70G may be directly connected to terminal 23B of electronic component 20E and terminal 23A of electronic component 20F without going through the connecting component 30.

[0110] In this modified example, the wiring section 70G is a wiring section included in the main circuit CM of the electrical connection unit 1. In this modified example, the wiring section 70G is formed by the second number (for example, one) of metal plate sections 82. The wiring section 70G is an example of a "second wiring section".

[0111] (Routing section 70H) The wiring section 70H is a wiring section connected to an electronic component 20H and another part within the electrical connection unit 1. For example, the wiring section 70H is directly connected to terminal 23A of the electronic component 20H. Alternatively, the wiring section 70H may be connected to terminal 23A of the electronic component 20H via a connecting component 30 (e.g., connecting component 30Y). The wiring section 70G is a wiring section included in the main circuit CM of the electrical connection unit 1. The wiring section 70H is formed by a second number (e.g., one) of metal plate sections 82, similar to the wiring section 70G. In cases where the temperature rise of the wiring section 70H is large, the wiring section 70H may be formed by stacking a first number (e.g., two) of metal plate sections 81 in the Z direction.

[0112] (Routing section 70I) The wiring section 70I is a wiring section connected to an electronic component 20F and another part within the electrical connection unit 1. For example, the wiring section 70I is connected to a connection component 30 corresponding to terminal 23B of the electronic component 20F, and is electrically connected to terminal 23B of the electronic component 20F via the connection component 30. Alternatively, the wiring section 70I may be connected to terminal 23B of the electronic component 20F without going through the connection component 30. The wiring section 70I is formed by a second number (e.g., one) of metal plate portions 82, similar to the wiring section 70G. In cases where the temperature rise of the wiring section 70I is large, the wiring section 70I may be formed by stacking a first number (e.g., two) of metal plate portions 81 in the Z direction.

[0113] <3.6 Advantages of the second structure> As a comparative example, consider a configuration in which each wiring section in the entire electrical connection unit is made of only one metal plate. In such a comparative example configuration, if the heat generated by the electronic components increases, the heat dissipation capacity may be insufficient, and the temperature of the electrical connection unit may rise significantly. On the other hand, if each wiring section in the entire electrical connection unit is formed of two or more metal plates, the cost and weight of the electrical connection unit will increase.

[0114] Therefore, the electrical connection unit of this embodiment includes a first electronic component (e.g., electronic component 20E or electronic component 20H), a second electronic component (e.g., electronic component 20G or electronic component 20E), a first wiring section (e.g., wiring section 70F), and a second wiring section (wiring section 70G). The second electronic component has a first terminal (e.g., terminal 23A) and a second terminal (e.g., terminal 23B). The second electronic component generates less heat when energized than the first electronic component. The first wiring section is connected directly to the first terminal of the second electronic component or via a wiring member, electrically connecting the first electronic component and the second electronic component. The second wiring section is connected directly to the second terminal of the second electronic component or via a wiring member. The first wiring section is formed by stacking a first number of metal plate sections (e.g., metal plate section 81). The second cable section described above is formed by a second number of metal plate sections (for example, metal plate section 82) which is fewer than the first number described above.

[0115] With this configuration, the first wiring section provided between the first and second electronic components is formed of a first number of metal plates, allowing for good heat dissipation of the first electronic component, which tends to become relatively hot. On the other hand, the second wiring section, which is less affected by heat from the first electronic component than the first wiring section, is formed of a second number of metal plates, fewer than the first number, thus reducing the cost and weight associated with the wiring structure. This structure improves the heat dissipation of the electrical connection unit, while also reducing costs and weight.

[0116] In this embodiment, the first wiring section has a first mounting surface (e.g., first mounting surface S1) facing the first terminal or a wiring member (e.g., connecting component 30) connected to the first terminal. The second wiring section has a second mounting surface (e.g., second mounting surface S2) facing the second terminal or a wiring member (e.g., connecting component 30) connected to the second terminal. The first mounting surface and the second mounting surface are located on the same plane. With this configuration, even if the number of metal plates differs between the first wiring section and the second wiring section, the two mounting surfaces facing the terminals of the electronic components or the wiring members (e.g., connecting component 30) are located on the same plane, making it easier to mount electronic components. This makes it possible to further reduce the cost of the electrical connection unit.

[0117] In this embodiment, the electrical connection unit further comprises a base member (e.g., base member 110) that supports the first wiring section and the second wiring section. The base member has a first support section (e.g., first support section 121) that supports the first wiring section and a second support section (e.g., second support section 122) that supports the second wiring section. The first support section and the second support section are provided at different positions corresponding to the difference in the number of metal plates between the first number of metal plates and the second number of metal plates. With this configuration, even if the number of metal plates differs between the first wiring section and the second wiring section, the different positions of the first support section and the second support section allow for stable support of the first wiring section and the second wiring section. This increases the durability of the electrical connection unit.

[0118] From another perspective, the second structure SB described above can be described as follows: The second structure SB includes a first electronic component (e.g., electronic component 20E or electronic component 20H), a second electronic component (e.g., electronic component 20G or electronic component 20E), a first component (e.g., external connection terminal 50, electronic component 20D, or electronic component 20F), a first wiring section (e.g., wiring section 70F), and a second wiring section (e.g., wiring section 70G). The second electronic component has a first terminal (e.g., terminal 23A) and a second terminal (e.g., terminal 23B). The first component generates less heat when energized than the first electronic component. The first wiring section is connected to the first terminal of the second electronic component, electrically connecting the first electronic component and the second electronic component. The second wiring section is connected to the second terminal of the second electronic component, electrically connecting the second electronic component and the first component. The first cable routing section is formed by arranging a first number of metal plate sections (for example, metal plate section 81) in the Z direction. The second cable routing section is formed by a second number of metal plate sections (for example, metal plate section 82).

[0119] With this configuration, the first wiring section between the first and second electronic components is formed from a first number of metal plates, allowing for good heat dissipation of the first electronic component, which tends to become relatively hot. On the other hand, the second wiring section between the second and first electronic components is formed from a second number of metal plates, which is fewer than the first number, thus reducing the cost and weight associated with the wiring structure. This structure improves the heat dissipation of the electrical connection unit, while also reducing costs and weight.

[0120] In the above relationship, the second electronic component (electronic component 20G or electronic component 20E) is not limited to an electronic component that generates less heat when energized than the first electronic component (electronic component 20E, electronic component 20F, or electronic component 20H). The second electronic component (electronic component 20G or electronic component 20E) may be an electronic component that generates the same or greater heat when energized than the first electronic component (electronic component 20E, electronic component 20F, or electronic component 20).

[0121] From another perspective, for example, the second modified example described above can be described as follows. The second structure SB has a first electronic component (e.g., electronic component 20E), a second electronic component (e.g., electronic component 20F), a third electronic component (e.g., electronic component 20G), a fourth electronic component (e.g., electronic component 20D), a first wiring section (e.g., wiring section 70F), and a second wiring section (e.g., wiring section 70G). The third electronic component generates less heat when energized than the first electronic component. The first wiring section electrically connects the first electronic component and the second electronic component. The second wiring section electrically connects the third electronic component and the fourth electronic component. The first wiring section is formed by arranging a first number of metal plate sections (e.g., metal plate section 81) in the Z direction. The second wiring section is formed by the second number of metal plate sections (e.g., metal plate section 82).

[0122] With this configuration, the first wiring section between the first and second electronic components is formed from a first number of metal plates, allowing for good heat dissipation of the first electronic component, which tends to become relatively hot. On the other hand, the second wiring section between the third and fourth electronic components is formed from a second number of metal plates, which is fewer than the first number, thus reducing the cost and weight associated with the wiring structure. This structure improves the heat dissipation of the electrical connection unit, while also reducing costs and weight.

[0123] <4.Third structure> Next, we will explain the third structure, SC. Figure 16 is a perspective view showing the third structure SC. The third structure SC includes, for example, an electronic component 20, a plurality of connecting components 30, an external connection terminal 50, and a wiring structure 60.

[0124] <4.1 Electronic Components of the Third Structure> Electronic component 20 is, for example, a component included in the main circuit CM of the electrical connection unit 1. Electronic component 20 is, for example, a relay. However, the type of electronic component 20 is not limited to the above example. Electronic component 20 may also be a component included in the sub-circuit CS of the electrical connection unit 1.

[0125] <4.2 External connection terminals of the third structure> External connection terminal 50 is, for example, external connection terminal 51 included in the main circuit CM of the electrical connection unit 1. Alternatively, external connection terminal 50 may also be external connection terminal 52 included in the sub-circuit CS of the electrical connection unit 1.

[0126] <4.3 Cable routing structure> Next, we will describe the cable arrangement structure 60 of the third structure SC. The third structure SC has a cable routing structure 60C as an example of a cable routing structure 60. The cable routing structure 60C includes, for example, a cable routing section 70J and a cable routing section 70K. The details of the metal plate sections 81 and 82 of the third structure SC are the same as the details of the metal plate sections 81 and 82 described in the first structure SA.

[0127] (Routing section 70J) The wiring section 70J is provided across the electronic component 20 and another part within the electrical connection unit 1. The wiring section 70J is connected to a connection component 30 corresponding to terminal 23A of the electronic component 20, and is electrically connected to terminal 23A of the electronic component 20 via the connection component 30. Alternatively, the wiring section 70J may be directly connected to terminal 23A of the electronic component 20 without going through the connection component 30. The wiring section 70J is formed by arranging the first number (for example, two) of metal plate sections 81 in the Z direction.

[0128] (Routing section 70K) The wiring section 70K is provided across the electronic component 20 and the external connection terminal 50. The wiring section 70K is connected to a connection component 30 corresponding to terminal 23B of the electronic component 20, and is electrically connected to terminal 23B of the electronic component 20 via the connection component 30. Alternatively, the wiring section 70K may be directly connected to terminal 23B of the electronic component 20 without going through the connection component 30. The wiring section 70K includes, for example, a first connection section 71, a second connection section 72, and an extension section 73.

[0129] The first connection portion 71 is located at the end portion 70e2 of the wiring portion 70K. The end portion 70e2 is an example of a "second end portion". The first connection portion 71 overlaps with the connecting component 30 when viewed from the Z direction. The first connection portion 71 is connected to the connecting component 30 and is electrically connected to the electronic component 20 via the connecting component 30. Alternatively, the first connection portion 71 may be connected directly to the terminal 23B of the electronic component 20 without going through the connecting component 30.

[0130] The second connection section 72 is located at end 70e1 of the cable routing section 70K. End 70e1 is the end opposite to end 70e2. End 70e1 is an example of the "first end". The second connection section 72 is provided with an external connection terminal 50. When viewed from the Z direction, the second connection section 72 overlaps with the external connection bus bar 54 attached to the external connection terminal 50. The second connection section 72 is electrically connected to the external connection bus bar 54 via the external connection terminal 50.

[0131] The extension portion 73 extends between the first connecting portion 71 and the second connecting portion 72. The extension portion 73 extends between the end portion 70e1 and the end portion 70e2. The extension portion 73 extends in the X direction or the Y direction. The length L31 of the extension portion 73 in the longitudinal direction (e.g., Y direction) of the cable section 70K is greater than, for example, the length L32 of the second connecting portion 72 in the longitudinal direction (e.g., Y direction) of the cable section 70K.

[0132] In this embodiment, the cable section 70K includes a first section C1 and a second section C2. The first section C1 includes a first connecting section 71 and an extension section 73. In other words, the first section C1 includes an end section 70e2 and an extension section 73. On the other hand, the second section C2 includes a second connecting section 72. In other words, the second section C2 includes an end section 70e1.

[0133] In this embodiment, the first portion C1 is formed by arranging the first number (for example, two) of metal plate portions 81 in the Z direction, overlapping each other. On the other hand, the second portion C2 is formed by the second number (for example, one) of metal plate portions 82.

[0134] In this embodiment, the cable routing section 70K includes a first metal plate 91 and a second metal plate 92. Each of the first metal plate 91 and the second metal plate 92 is a metal plate oriented horizontally. The thickness (thickness in the Z direction) of each of the first metal plate 91 and the second metal plate 92 is, for example, 3 mm. The first metal plate 91 and the second metal plate 92 differ in size when viewed from the Z direction.

[0135] The first metal plate 91 has an outer shape that corresponds to the first portion C1 of the cable routing section 70K when viewed from the Z direction. On the other hand, the second metal plate 92 has an outer shape that corresponds to the entire cable routing section 70K (for example, the first portion C1 and the second portion C2) when viewed from the Z direction. In this embodiment, one metal plate portion 81 included in the first portion C1 and one metal plate portion 82 included in the second portion C2 are formed by a single metal plate 92. That is, in this embodiment, the cable routing section 70K is formed by arranging the first metal plate 91, which has an outer shape that corresponds to the first portion C1 of the cable routing section 70K, and the second metal plate 92, which has an outer shape that corresponds to the entire cable routing section 70K, on ​​top of each other in the Z direction.

[0136] <4.4 Cross-sectional structure of the third structure> Figure 17 is a cross-sectional view showing the third structure SC. In this embodiment, a step ST exists at the boundary between the first part C1 and the second part C2 of the cable routing section 70K, due to the difference in the number of metal plates between the first number of metal plates 81 and the second number of metal plates 82. The step ST is positioned facing away from the base member 110.

[0137] In other words, the second metal plate 92 is positioned along the base member 110. The first metal plate 91 is positioned on the opposite side of the base member 110 from the second metal plate 92. The base member 110 supports the second metal plate 92 by contacting it from below. By supporting the second metal plate 92, the base member 110 supports the cable routing section 70K.

[0138] <4.5 Variations of the third structure> Figure 18 is a perspective view showing a modified example of the third structure SC. In this modified example, the cable routing section 70K is a flat plate extending in the X and Y directions. The extended portion 73 of the cable routing section 70K includes a first portion 73a adjacent to the external connection terminal 50 in the X direction and a second portion 73b adjacent to the external connection terminal 50 in the Y direction. In this modified example, the first portion 73a and the second portion 73b of the extended portion 73 are formed by arranging the above-mentioned first number (e.g., two) of metal plate portions 81 in the Z direction.

[0139] <4.6 Advantages of the third structure> When the cable routing section is formed by overlapping two metal plates, the axial force loss in the fixing structure that secures the external cable routing member is greater compared to when the cable routing section is formed by a single metal plate. When the axial force loss is greater, it becomes necessary to enlarge the fixing structure that secures the external cable routing member, which requires changes to the dimensions related to the external cable routing member.

[0140] On the other hand, the electrical connection unit of this embodiment has an external connection terminal (for example, an external connection terminal 50) and a wiring section (for example, a wiring section 70K). The external connection terminal is to which a wiring member for external connection can be attached. The wiring section has a first part (for example, a first part C1) and a first end (for example, an end 70e1) to which the external connection terminal is provided. The first part is formed by stacking a first number of metal plate sections (for example, a metal plate section 81). The first end is formed by a second number of metal plate sections (for example, a metal plate section 82) which is fewer than the first number.

[0141] With this configuration, since a portion of the cable routing section is formed from a first number of metal plates, the heat capacity of the cable routing section is increased, improving the heat dissipation of the electrical connection unit. On the other hand, since the first end of the cable routing section is formed from a second number of metal plates, which is fewer than the first number, it is possible to suppress the increase in size caused by axial force loss in the fixing structure that secures the cable routing member for external connection. This structure makes it possible to improve the heat dissipation of the electrical connection unit and to reduce its size.

[0142] In this embodiment, the first portion of the cable routing section includes a second end (e.g., end 70e2) connected directly to an electronic component (e.g., electronic component 20) or via a cable routing member (e.g., connecting component 30), and an extension (e.g., extension 73) extending between the first end and the second end. Each of the second end and the extension is formed by overlapping the first number of metal plate sections. With this configuration, since the extension is formed by overlapping the first number of metal plate sections in addition to the second end, the heat capacity of the cable routing section can be increased significantly. This configuration further enhances the heat dissipation of the electrical connection unit.

[0143] In this embodiment, one metal plate portion included in the first number of metal plate portions in the first part and one metal plate portion included in the second number of metal plate portions in the first end are formed from a single metal plate (for example, metal plate 92). With this configuration, in a configuration where the number of metal plate portions differs between the first part and the first end, the number of parts related to the wiring structure can be reduced, and the cost and weight of the electrical connection unit can be further reduced. Furthermore, with this configuration, a good connection between the first part and the first end can be achieved, and the electrical characteristics of the electrical connection unit can be improved compared to the case where the first part and the first end are formed from different metal plates.

[0144] In this embodiment, the electrical connection unit further includes a base member (e.g., base member 110) that supports the cable routing section. At the boundary between the first portion and the first end, there is a step (e.g., step ST) due to the difference in the number of metal plates between the first number of metal plates and the second number of metal plates. The step is positioned on the opposite side from the base member. With this configuration, even if the number of metal plates differs between the first portion and the first end, the shape of the support surface of the base member that supports the cable routing section can be simplified. This makes it possible to further reduce the cost of the electrical connection unit.

[0145] <5.Fourth structure> Next, we will explain the fourth structure, SD. Figure 19 is a perspective view showing the fourth structure SD. Figure 20 is a perspective view showing the wiring structure 60 of the fourth structure SD. Figure 21 is a plan view showing the fourth structure SD. The fourth structure SD has, for example, a plurality of electronic components 20, a plurality of connecting components 30, and a wiring structure 60.

[0146] <5.1 Electronic Components> The fourth structure SD includes three electronic components 20E, 20F, and 20H as multiple electronic components 20. Electronic components 20E, 20F, and 20H are, for example, components included in the main circuit CM of the electrical connection unit 1. The three electronic components 20E, 20F, and 20H are, for example, electrically connected in series.

[0147] Electronic component 20H is, for example, a large fuse. However, the type of electronic component 20H is not limited to the above example. Electronic component 20H is an example of a "first electronic component". Electronic components 20E and 20F are relays, respectively. However, the types of electronic components 20E and 20F are not limited to the above example. Each of electronic components 20E and 20F generates less heat when energized than electronic component 20H. Electronic component 20E is an example of a "second electronic component". Electronic component 20F is an example of a "first component" and a "third electronic component", respectively. Furthermore, the fourth structure SD may have an external connection terminal 50 instead of electronic component 20F as the first component.

[0148] <5.2 Cable Routing Structure> The fourth structure SD includes a cable routing structure 60, which includes a cable routing structure 60D. The cable routing structure 60D includes cable routing sections 70L, 70M, 70N, and 70P.

[0149] (Routing section 70L) The wiring section 70L is a wiring section connected to the electronic component 20H and another part of the electrical connection unit 1. For example, the wiring section 70L is directly connected to terminal 23A of the electronic component 20H and is electrically connected to the electronic component 20H. Alternatively, the wiring section 70L may be connected to terminal 23A of the electronic component 20H via a connecting component 30 (for example, connecting component 30Y) and is electrically connected to the electronic component 20H.

[0150] (Routing section 70M) The wiring section 70M is provided across electronic component 20H and electronic component 20E, and electrically connects electronic component 20H and electronic component 20E. For example, the wiring section 70M is directly connected to terminal 23B of electronic component 20H, and is electrically connected to electronic component 20H. Alternatively, the wiring section 70E is connected to a connecting component 30 corresponding to terminal 23A of electronic component 20E, and is electrically connected to terminal 23A of electronic component 20E via the connecting component 30. Instead of the above example, the wiring section 70M may be connected to terminal 23B of electronic component 20H via the connecting component 30. Alternatively, the wiring section 70M may be directly connected to terminal 23A of electronic component 20E without going through the connecting component 30. The wiring section 70M is an example of the "first wiring section".

[0151] (Routing section 70N) The wiring section 70N is provided across electronic component 20E and electronic component 20F, and electrically connects electronic component 20E and electronic component 20F. For example, the wiring section 70N is connected to a connecting component 30 corresponding to terminal 23B of electronic component 20E, and electrically connected to terminal 23B of electronic component 20E via the connecting component 30. Alternatively, the wiring section 70N is connected to a connecting component 30 corresponding to terminal 23A of electronic component 20F, and electrically connected to terminal 23A of electronic component 20F via the connecting component 30. Instead of the above examples, the wiring section 70N may be directly connected to terminal 23B of electronic component 20E. Alternatively, the wiring section 70N may be directly connected to terminal 23A of electronic component 20F. The wiring section 70N is an example of a "second wiring section".

[0152] (Routing section 70P) The wiring section 70P is a wiring section connected to the electronic component 20F and another part of the electrical connection unit 1. For example, the wiring section 70P is connected to a connection component 30 corresponding to terminal 23B of the electronic component 20F, and is electrically connected to terminal 23B of the electronic component 20F via the connection component 30. Alternatively, the wiring section 70P may be directly connected to terminal 23B of the electronic component 20F.

[0153] <5.3 Materials and Thickness of Cable Structure> In this embodiment, the cable routing portion 70M is formed by at least one metal plate portion 83. In this embodiment, the cable routing portion 70M is formed by one metal plate portion 83. However, the cable routing portion 70M may be formed by two or more metal plate portions 83 being arranged in overlapping positions in the Z direction. The metal plate portion 83 is a plate portion that is aligned horizontally. The metal plate portion 83 contains a first material M1. The first material M1 is a material with a higher thermal conductivity than the second material M2, which will be described later. The first material M1 is, for example, copper or a copper alloy. The plate thickness (thickness in the Z direction) T42 of the metal plate portion 83 is, for example, 5 mm. The metal plate portion 83 is an example of the "first metal plate portion".

[0154] On the other hand, each of the cable routing section 70L, cable routing section 70N, and cable routing section 70P is formed by stacking multiple (e.g., two) metal plate sections 81 in the Z direction. The metal plate section 81 is a plate along the horizontal direction. The metal plate section 81 contains a second material M2. The second material M2 is, for example, aluminum or an aluminum alloy. The plate thickness (thickness in the Z direction) T41 of the metal plate section 81 is, for example, 3 mm. The metal plate section 81 is an example of a "second metal plate section".

[0155] In this embodiment, the number of metal plate portions 83 is less than the number of metal plate portions 81. However, the number of metal plate portions 83 may be the same as the number of metal plate portions 81, or it may be more than the number of metal plate portions 81.

[0156] In this embodiment, the total thickness T52 (e.g., 5 mm) in the Z direction of the at least one metal plate portion 83 is smaller than the total thickness T51 (e.g., 6 mm) in the Z direction of the plurality of metal plate portions 81. In other words, the thickness in the Z direction of the cable routing portion 70M is smaller than the respective thicknesses in the Z direction of the cable routing portions 70L, 70N, and 70P.

[0157] On the other hand, the thickness T42 (e.g., 5 mm) of the metal plate portion 83 in the Z direction is greater than the thickness T41 (e.g., 3 mm) of the metal plate portion 81 in the Z direction.

[0158] <5.4 Cross-sectional structure of the fourth structure> Figure 22 is a cross-sectional view of the structure shown in Figure 21 along the line F22-F22. In this embodiment, the cable routing section 70M has a first mounting surface S11. The first mounting surface S11 faces the terminal 23B of the electronic component 20H from below and also faces the connecting component 30 corresponding to the terminal 23A of the electronic component 20E from below. For example, the first mounting surface S11 contacts the terminal 23B of the electronic component 20H from below and also contacts the connecting component 30 corresponding to the terminal 23A of the electronic component 20E from below. Note that the first mounting surface S11 may be a surface that contacts the connecting component 30 corresponding to the terminal 23B of the electronic component 20H from below, or a surface that contacts the terminal 23A of the electronic component 20E from below.

[0159] The cable routing section 70N has a second mounting surface S12. The second mounting surface S12 faces from below a connecting component 30 corresponding to terminal 23B of electronic component 20E, and also faces from below a connecting component 30 corresponding to terminal 23A of electronic component 20F. For example, the second mounting surface S12 contacts from below a connecting component 30 corresponding to terminal 23B of electronic component 20E, and also contacts from below a connecting component 30 corresponding to terminal 23A of electronic component 20F. Note that the second mounting surface S12 may be the surface that contacts from below terminal 23B of electronic component 20E, or the surface that contacts from below terminal 23A of electronic component 20F.

[0160] The cable routing section 70L has a third mounting surface S13. The third mounting surface S13 faces the terminal 23A of the electronic component 20H from below. For example, the third mounting surface S13 contacts the terminal 23A of the electronic component 20H from below. Alternatively, the third mounting surface S13 may be a surface that contacts the connecting component 30 corresponding to the terminal 23A of the electronic component 20H from below.

[0161] The cable routing section 70P has a fourth mounting surface S14 (see Figure 19). The fourth mounting surface S14 faces the connecting component 30 corresponding to the terminal 23B of the electronic component 20F from below. For example, the fourth mounting surface S14 contacts the connecting component 30 corresponding to the terminal 23B of the electronic component 20F from below. Alternatively, the fourth mounting surface S14 may be a surface that contacts the terminal 23B of the electronic component 20F from below.

[0162] In this embodiment, the first mounting surface S11 of the cable routing section 70M, the second mounting surface S12 of the cable routing section 70N, the third mounting surface S13 of the cable routing section 70L, and the fourth mounting surface S14 of the cable routing section 70P are located on the same plane.

[0163] In this embodiment, the base member 110 has a first support portion 121, a second support portion 122, a third support portion 123, and a fourth support portion 124 (see Figure 20). The first support portion 121 supports the cable routing portion 70M from below. The second support portion 122 supports the cable routing portion 70N from below. The third support portion 123 supports the cable routing portion 70L from below. The fourth support portion 124 supports the cable routing portion 70P from below.

[0164] In this embodiment, the first support portion 121, the second support portion 122, the third support portion 123, and the fourth support portion 124 are provided at different positions corresponding to the difference between the thickness of the cable routing portion 70M in the Z direction and the respective thicknesses of the cable routing portion 70L, cable routing portion 70M, and cable routing portion 70P in the Z direction. For example, the +Z direction end faces 122a, 123a, and 124a of the second support portion 122, the third support portion 123, and the fourth support portion 124 are located on the -Z direction side relative to the +Z direction end face 121a of the first support portion 121.

[0165] <5.5 Advantages of the Fourth Structure> As a comparative example, consider a configuration in which each wiring section in all areas of the electrical connection unit is provided by stacking two metal plates made of a specific material. In such a comparative example configuration, if the heat generated by the electronic components increases, the heat dissipation capacity may be insufficient, and the temperature rise of the electrical connection unit may increase significantly.

[0166] Therefore, the electrical connection unit of this embodiment includes a first electronic component (e.g., electronic component 20H), a second electronic component (e.g., electronic component 20E), a first wiring section (e.g., wiring section 70M), and a second wiring section (e.g., wiring section 70N). The second electronic component has a first terminal (e.g., terminal 23A) and a second terminal (e.g., terminal 23B). The second electronic component generates less heat when energized than the first electronic component. The first wiring section is connected directly to the first terminal of the second electronic component or via a wiring member, electrically connecting the first electronic component and the second electronic component. The second wiring section is connected directly to the second terminal of the second electronic component or via a wiring member. The first wiring section is formed from at least one first metal plate portion (e.g., metal plate portion 83). The second wiring section is formed by stacking a plurality of second metal plate portions (e.g., metal plate portions 81). The first metal plate portion includes a first material. The second metal plate portion includes a second material. The thermal conductivity of the first material is higher than that of the second material.

[0167] With this configuration, the first wiring section provided between the first and second electronic components is formed from a metal plate of the first material having high thermal conductivity, thereby enabling good heat dissipation from the first electronic component, which tends to become relatively hot. On the other hand, by forming the second wiring section, which is less affected by heat from the first electronic component than the first wiring section, from a second material that is cheaper and / or has a lower specific gravity than the first material, the cost and / or weight associated with the wiring structure can be reduced. This structure improves the heat dissipation of the electrical connection unit and also reduces costs and / or weight.

[0168] In this case, if the wiring section is formed from a single metal plate with a large thickness, the metal plate becomes expensive, making it difficult to reduce the cost of the electrical connection unit. On the other hand, in this embodiment, by arranging the second wiring section by stacking multiple metal plates, the cost associated with the wiring structure can be reduced compared to when the wiring section is formed from a single metal plate with a large thickness. This makes it possible to further reduce the cost of the electrical connection unit.

[0169] In this embodiment, the number of at least one first metal plate portion is less than the number of the plurality of second metal plate portions. This configuration makes it possible to reduce the amount of the first material used, which is more expensive and / or has a higher specific gravity than the second material, for example. This structure makes it possible to further reduce the cost and / or weight of the electrical connection unit.

[0170] In this embodiment, the total thickness of the at least one first metal plate portion in the first direction is smaller than the total thickness of the plurality of second metal plate portions in the first direction. With this configuration, for example, the amount of the first material used, which is more expensive and / or has a higher specific gravity than the second material, can be reduced. This structure makes it possible to further reduce the cost and / or weight of the electrical connection unit. Furthermore, with this configuration, the height of the electrical connection unit can be reduced.

[0171] In this embodiment, the thickness of each individual first metal plate in the first direction is greater than the thickness of each individual second metal plate in the first direction. With this configuration, the number of first metal plates can be reduced while improving the heat dissipation of the first wiring section. This structure allows for further improvement of the heat dissipation of the electrical connection unit.

[0172] In this embodiment, the first wiring section has a first mounting surface (e.g., first mounting surface S11) facing the first terminal or a wiring member (e.g., connecting component 30) connected to the first terminal. The second wiring section has a second mounting surface (e.g., second mounting surface S12) facing the second terminal or a wiring member (e.g., connecting component 30) connected to the second terminal. The first mounting surface and the second mounting surface are located on the same plane. With this configuration, even if the thickness of the first wiring section and the second wiring section differs, the two mounting surfaces facing the terminals of the electronic component or the wiring member (e.g., connecting component 30) are located on the same plane, making it easier to mount the electronic component. This makes it possible to further reduce the cost of the electrical connection unit.

[0173] From another perspective, the fourth structure SD described above can be described as follows: The fourth structure SD comprises a first electronic component (e.g., electronic component 20H), a second electronic component (e.g., electronic component 20E), a first component (e.g., electronic component 20F), a first wiring section (e.g., wiring section 70M), and a second wiring section (e.g., wiring section 70N). The second electronic component has a first terminal (e.g., terminal 23A) and a second terminal (e.g., terminal 23B). The first component generates less heat when energized than the first electronic component. The first wiring section (e.g., wiring section 70M) is connected to the first terminal of the second electronic component, electrically connecting the first electronic component and the second electronic component. The second wiring section (e.g., wiring section 70N) is connected to the second terminal of the second electronic component, electrically connecting the second electronic component and the first component. The first cable routing section is formed by at least one first metal plate (e.g., metal plate 83). The second cable routing section is formed by a plurality of second metal plate sections (e.g., metal plate 81) being arranged in a stack in the Z direction. The first metal plate section includes a first material. The second metal plate section includes a second material. The thermal conductivity of the first material is higher than that of the second material.

[0174] With this configuration, the first wiring section between the first and second electronic components is formed from a metal plate of the first material having high thermal conductivity, thus enabling good heat dissipation for the first electronic component, which tends to become relatively hot. On the other hand, by forming the second wiring section between the second and first electronic components from a second material that is cheaper and / or has a lower specific gravity than the first material, the cost and / or weight associated with the wiring structure can be reduced. This structure improves the heat dissipation of the electrical connection unit and also reduces costs and / or weight.

[0175] In the above relationship, the second electronic component (electronic component 20E) is not limited to an electronic component that generates less heat when energized than the first electronic component (electronic component 20H). The second electronic component (electronic component 20E) may be an electronic component that generates the same or greater heat when energized than the first electronic component (electronic component 20H).

[0176] <5.6 A perspective combining the fourth structure and the first structure> In this embodiment, the electronic component 20H included in the fourth structure SD generates more heat when energized than the electronic component 20A included in the first structure SA. Therefore, the electrical connection unit 1 can be described as follows.

[0177] The electrical connection unit 1 includes a first electronic component (e.g., electronic component 20H of the fourth structure SD), a second electronic component (e.g., electronic component 20E of the fourth structure SD), a third electronic component (e.g., electronic component 20A of the first structure SA), a fourth electronic component (e.g., electronic component 20B of the first structure SA), a first wiring section (e.g., wiring section 70M of the fourth structure SD), and a second wiring section (e.g., wiring section 70A of the first structure SA). The third electronic component generates less heat when energized than the first electronic component. The first wiring section electrically connects the first electronic component and the second electronic component. The second wiring section electrically connects the third electronic component and the fourth electronic component. The first wiring section is formed by at least one first metal plate portion (e.g., metal plate portion 83). The second cable section described above is formed by arranging a plurality of second metal plate sections (for example, metal plate section 81) in the Z direction. The first metal plate section includes a first material. The second metal plate section includes a second material. The thermal conductivity of the first material is higher than that of the second material.

[0178] With this configuration, the first wiring section between the first and second electronic components is formed from a metal plate of the first material having high thermal conductivity, thus enabling good heat dissipation for the first electronic component, which tends to become relatively hot. On the other hand, by forming the second wiring section between the third and fourth electronic components from a second material that is cheaper and / or has a lower specific gravity than the first material, the cost and / or weight associated with the wiring structure can be reduced. This structure improves the heat dissipation of the electrical connection unit and also reduces costs and / or weight.

[0179] From another perspective, the electrical connection unit 1 can be described as follows: The electrical connection unit 1 has an electronic component 20H (which generates a relatively large amount of heat), electronic components 20A, 20B, 20E, and 20F (which generate a relatively moderate amount of heat), and a first component which is an external connection terminal 50 or an electronic component 20Da (which generates a relatively small amount of heat).

[0180] Furthermore, the wiring section 70M connecting the electronic component 20H, which generates a relatively large amount of heat, and the electronic component 20E, which generates a relatively moderate amount of heat, is formed by at least one metal plate portion 83 containing a first material with high thermal conductivity. On the other hand, the wiring section 70A connecting electronic components 20A and 20B, which both generate relatively moderate amounts of heat, is formed by stacking a first number (e.g., two) of metal plate portions 81 containing a second material. Similarly, the wiring section 70N connecting electronic components 20E and 20F, which both generate relatively moderate amounts of heat, is formed by stacking a first number (e.g., two) of metal plate portions 81 containing a second material. Finally, the wiring section 70B connecting the electronic component 20A, which generates a relatively moderate amount of heat, and the first component, which is assumed to generate a small amount of heat, is formed by a second number (e.g., one) of metal plate portions 82 containing a second material. This configuration provides three types of wiring sections with different heat dissipation characteristics depending on the amount of heat generated by the components. This configuration allows for further improvement in heat dissipation and cost reduction of the electrical connection unit.

[0181] <5.7 A perspective combining the fourth and second structures> In this embodiment, the electronic component 20H included in the fourth structure SD generates more heat when energized than the electronic component 20E included in the second structure SB. Therefore, the electrical connection unit 1 can be described as follows.

[0182] The electrical connection unit 1 includes a first electronic component (e.g., electronic component 20H of the fourth structure SD), a second electronic component (e.g., electronic component 20E of the fourth structure SD), a third electronic component (e.g., electronic component 20E of the second structure SB), a fourth electronic component (e.g., electronic component 20F or electronic component 20G of the second structure SB), a first wiring section (e.g., wiring section 70M of the fourth structure SD), and a second wiring section (e.g., wiring section 70F of the second structure SB). The third electronic component generates less heat when energized than the first electronic component. The first wiring section electrically connects the first electronic component and the second electronic component. The second wiring section electrically connects the third electronic component and the fourth electronic component. The first wiring section is formed by at least one first metal plate portion (e.g., metal plate portion 83). The second wiring section described above is formed by arranging a plurality of second metal plate sections (e.g., metal plate section 81) in the Z direction in overlapping order. The first metal plate section includes a first material. The second metal plate section includes a second material. The thermal conductivity of the first material is higher than that of the second material. With this configuration, similar to the configuration described above, it is possible to improve the heat dissipation of the electrical connection unit, as well as to reduce costs and / or weight.

[0183] From another perspective, the electrical connection unit 1 can be described as follows: The electrical connection unit 1 has an electronic component 20H (relatively large heat generation), electronic components 20E and 20F (relatively moderate heat generation), an electronic component 20G (relatively moderate or small heat generation), and a first component which is an external connection terminal 50 or electronic component 20D (relatively small heat generation).

[0184] Furthermore, the wiring section 70M connecting the electronic component 20H, which generates a relatively large amount of heat, and the electronic component 20E, which generates a relatively moderate amount of heat, is formed by at least one metal plate portion 83 containing a first material with high thermal conductivity. On the other hand, the wiring section 70N connecting the electronic components 20E and 20F, which both generate relatively moderate amounts of heat, is formed by stacking a first number (e.g., two) of metal plate portions 81 containing a second material. Similarly, the wiring section 70F between the electronic component 20E, which generates a relatively moderate amount of heat, and the electronic component 20G, which generates a relatively moderate or small amount of heat, is formed by stacking a first number (e.g., two) of metal plate portions 81 containing a second material. Finally, the wiring section 70G connecting the electronic component 20G, which generates a relatively moderate or small amount of heat, and the first component, which is assumed to generate a small amount of heat, is formed by a second number (e.g., one) of metal plate portions 82 containing a second material. This configuration provides three types of wiring sections with different heat dissipation characteristics depending on the amount of heat generated by the components. This configuration allows for further improvement in heat dissipation and cost reduction of the electrical connection unit.

[0185] <6.Fifth structure> Next, I will explain the fifth structural SE. Figure 23 is a perspective view showing the fifth structure SE. Figure 24 is a plan view showing the fifth structure SE. The fifth structure SE includes, for example, multiple electronic components 20, multiple connecting components 30, external connection terminals 50, a wiring structure 60, and a sensor 130.

[0186] <6.1 Electronic Components> The fifth structure SE includes two electronic components 20J and 20K as a plurality of electronic components 20. Electronic components 20J and 20K are, for example, components included in the main circuit CM of the electrical connection unit 1. The two electronic components 20J and 20K are, for example, electrically connected in series. Each of the electronic components 20J and 20K is, for example, a relay. However, the types of electronic components 20J and 20K are not limited to the above examples.

[0187] <6.2 Sensors> Sensor 130 is a sensor for measuring physical quantities related to the electrical connection unit 1. Sensor 130 is, for example, a current sensor. However, the type of sensor 130 is not limited to the above example. Sensor 130 has an insertion portion 131 through which the wiring portion 70U, described later, passes. The insertion portion 131 penetrates sensor 130 in the horizontal direction (for example, the Y direction). Sensor 130 is, for example, formed in an annular shape.

[0188] <6.3 Cable Routing Structure> The fifth structure SE includes a wiring structure 60E as a wiring structure 60. The wiring structure 60E includes wiring sections 70R, 70S, 70U, and 70V.

[0189] (Routing section 70R) The wiring section 70R is a wiring section connected to the electronic component 20J and another part of the electrical connection unit 1. For example, the wiring section 70R is connected to a connection component 30 corresponding to terminal 23A of the electronic component 20J, and is electrically connected to terminal 23A of the electronic component 20J via the connection component 30. Alternatively, the wiring section 70R may be directly connected to terminal 23A of the electronic component 20J.

[0190] (Riding section 70S) The wiring section 70S is provided across electronic component 20J and electronic component 20K, and electrically connects electronic component 20J and electronic component 20K. For example, the wiring section 70S is connected to a connecting component 30 corresponding to terminal 23B of electronic component 20J, and electrically connected to terminal 23B of electronic component 20J via the connecting component 30. Alternatively, the wiring section 70S is connected to a connecting component 30 corresponding to terminal 23A of electronic component 20K, and electrically connected to terminal 23A of electronic component 20K via the connecting component 30. Instead of the above examples, the wiring section 70S may be directly connected to terminal 23B of electronic component 20J. Alternatively, the wiring section 70S may be directly connected to terminal 23A of electronic component 20K. The wiring section 70S is an example of a "second wiring section".

[0191] (Routing section 70U) The wiring section 70U is provided across the electronic component 20K and another wiring section 70V, electrically connecting the electronic component 20K and the other wiring section 70V. For example, the wiring section 70U is connected to a connecting component 30 corresponding to terminal 23B of the electronic component 20K, and is electrically connected to terminal 23B of the electronic component 20K via the connecting component 30. The wiring section 70U is also connected to another wiring section 70V. Alternatively, the wiring section 70U may be directly connected to terminal 23B of the electronic component 20K. Furthermore, the wiring section 70U may be directly connected to another electronic component 20 or connected via the connecting component 30 instead of the other wiring section 70V.

[0192] The wiring section 70U extends through the insertion section 131 of the sensor 130. The wiring section 70U has, for example, a first end 70e1 and a second end 70e2. The first end 70e1 is connected to a connecting component 30 corresponding to the electronic component 20K and is electrically connected to the electronic component 20K via the connecting component 30. The second end 70e2 is the end opposite to the first end 70e1. The second end 70e2 is connected to the wiring section 70V. The wiring section 70U is an example of the "first wiring section".

[0193] (Routing section 70V) The wiring section 70V is located on the opposite side of the sensor 130 from the electronic component 20K. The wiring section 70V is directly connected to the wiring section 70U. Alternatively, the wiring section 70V may be connected to the wiring section 70U via a connecting component 30 (for example, connecting component 30Y). The wiring section 70V is an example of a "third wiring section".

[0194] The cable routing section 70V extends from the cable routing section 70U to the external connection terminal 50, and electrically connects the cable routing section 70U to the external connection terminal 50. For example, the cable routing section 70V is fixed to the cable routing section 70U by fastening members 43 and engaging members 44. The external connection terminal 50 is provided on the cable routing section 70V. The external connection terminal 50 protrudes from the cable routing section 70V in the Z direction, for example.

[0195] <6.4 Materials and Thickness of Cable Structure> In this embodiment, the cable routing portion 70U is formed by at least one metal plate portion 83. In this embodiment, the cable routing portion 70U is formed by one metal plate portion 83. However, the cable routing portion 70U may be formed by a plurality of metal plate portions 83 being arranged in a stack in the Z direction. The metal plate portion 83 is a plate portion that is aligned horizontally. The metal plate portion 83 includes the first material M1 described above. The first material M1 is, for example, copper or a copper alloy. The plate thickness (thickness in the Z direction) T42 of the metal plate portion 83 is, for example, 5 mm. The metal plate portion 83 is an example of the "first metal plate portion".

[0196] In this embodiment, each of the cable routing section 70R, cable routing section 70S, and cable routing section 70V is formed by a plurality (e.g., two) of metal plate sections 81. The metal plate section 81 is a plate section that is aligned horizontally. The metal plate section 81 contains the second material M2 described above. The second material M2 is, for example, aluminum or an aluminum alloy. The plate thickness (thickness in the Z direction) T41 of the metal plate section 81 is, for example, 3 mm. The metal plate section 81 included in the cable routing section 70S is an example of a "second metal plate section". The metal plate section 81 included in the cable routing section 70V is an example of a "third metal plate section".

[0197] In this embodiment, the number of metal plate portions 83 is less than the number of metal plate portions 81. However, the number of metal plate portions 83 may be the same as the number of metal plate portions 81, or it may be more than the number of metal plate portions 81.

[0198] In this embodiment, the total thickness T52 (e.g., 5 mm) in the Z direction of the at least one metal plate portion 83 is smaller than the total thickness T51 (e.g., 6 mm) in the Z direction of the plurality of metal plate portions 81. In other words, the thickness of the cable routing portion 70M in the Z direction is smaller than the respective thicknesses in the Z direction of the cable routing portions 70R, 70S, and 70V.

[0199] On the other hand, the thickness T42 (e.g., 5 mm) of the metal plate portion 83 in the Z direction is greater than the thickness T41 (e.g., 3 mm) of the metal plate portion 81 in the Z direction.

[0200] <6.5 Cross-sectional structure of the fifth structure> Figure 25 is a cross-sectional view of the structure shown in Figure 24 along the line F25-F25. In this embodiment, the cable routing section 70U has a first mounting surface S11. The first mounting surface S11 faces the connecting component 30 corresponding to the terminal 23B of the electronic component 20K from below. For example, the first mounting surface S11 contacts the connecting component 30 corresponding to the terminal 23B of the electronic component 20K from below. Alternatively, the first mounting surface S11 may contact the terminal 23B of the electronic component 20K.

[0201] The cable routing section 70S has a second mounting surface S12. The second mounting surface S12 faces the connecting component 30 corresponding to the terminal 23A of the electronic component 20K from below. For example, the second mounting surface S12 contacts the connecting component 30 corresponding to the terminal 23A of the electronic component 20K from below. The second mounting surface S12 may also contact the terminal 23A of the electronic component 20K. In this embodiment, the first mounting surface S11 of the cable routing section 70U and the second mounting surface S12 of the cable routing section 70S are located on the same plane.

[0202] In this embodiment, the base member 110 has a first support portion 121 and a second support portion 122. The first support portion 121 supports the cable routing portion 70U from below. The second support portion 122 supports the cable routing portion 70S from below. In this embodiment, the first support portion 121 and the second support portion 122 are provided at different positions corresponding to the difference between the thickness of the cable routing portion 70U in the Z direction and the thickness of the cable routing portion 70S in the Z direction. For example, the +Z direction end face 122a of the second support portion 122 is located on the -Z direction side relative to the +Z direction end face 121a of the first support portion 121.

[0203] <6.6 Advantages of the fifth structure> As a comparative example, consider a configuration in which each wiring section of the electrical connection unit is thickened to improve heat dissipation. In such a comparative example configuration, the wiring section becomes thicker, which may prevent it from passing through the sensor insertion section.

[0204] Therefore, the electrical connection unit of this embodiment includes an electronic component (e.g., electronic component 20K), a sensor (e.g., sensor 130), a first wiring section (e.g., wiring section 70U), and a second wiring section (e.g., wiring section 70V). The electronic component has a first terminal (e.g., terminal 23B) and a second terminal (e.g., 23A). The sensor has a through section (e.g., through section 131). The first wiring section is passed through the through section and connected to the first terminal directly or via a wiring member. The second wiring section is connected to the second terminal directly or via a wiring member. The thickness of the first wiring section is smaller than the thickness of the second wiring section. The first wiring section includes a first material. The second wiring section includes a second material. The thermal conductivity of the first material is higher than that of the second material.

[0205] With this configuration, the first cable section inserted into the sensor's insertion portion is formed from a metal plate of a first material having high thermal conductivity. Therefore, even if the first cable section is thinner than the second cable section, a significant rise in temperature can be suppressed. This structure improves the heat dissipation of the electrical connection unit in a configuration where a sensor with an insertion portion is provided.

[0206] In this embodiment, the first wiring section is formed from at least one first metal plate (e.g., metal plate 83). The second wiring section is formed by stacking a plurality of second metal plate sections (e.g., metal plate 81). With this configuration, the cost associated with the wiring structure can be reduced compared to the case where the second wiring section is formed from a single metal plate with a large thickness. This makes it possible to further reduce the cost of the electrical connection unit.

[0207] In this embodiment, the number of at least one first metal plate portion is less than the number of the plurality of second metal plate portions. With this configuration, for example, the amount of the first material used, which is more expensive and / or has a higher specific gravity than the second material, can be reduced. This structure makes it possible to further reduce the cost and / or weight of the electrical connection unit.

[0208] In this embodiment, the total thickness of the at least one first metal plate portion in the first direction is smaller than the total thickness of the plurality of second metal plate portions in the first direction. With this configuration, for example, the amount of the first material used, which is more expensive and / or has a higher specific gravity than the second material, can be reduced. This structure makes it possible to further reduce the cost and / or weight of the electrical connection unit. Furthermore, with this configuration, the height of the electrical connection unit can be reduced.

[0209] In this embodiment, the electrical connection unit further includes a third wiring section (e.g., wiring section 70V) located on the opposite side of the sensor from the electronic component and connected directly to the first wiring section or via a wiring member. The third wiring section is formed by stacking a plurality of third metal plate sections (e.g., metal plate section 81). With this configuration, each of the second and third wiring sections located on both sides of the first wiring section that passes through the sensor insertion section is formed by a plurality of metal plate sections. This makes it possible to further improve the heat dissipation of the electrical connection unit.

[0210] Several embodiments and modifications have been described above. However, the embodiments and modifications are not limited to the examples described above. For example, the first to fifth structures SA, SB, SC, SD, and SE described above may be implemented in combination with each other. In the embodiments described above, a case was described in which two metal plates are used as the "first number" and one metal plate is used as the "second number". However, the "first number" and "second number" are not limited to the above examples. For example, the "first number" may be three or more. The "second number" may be two or more. [Explanation of Symbols]

[0211] 1…Electrical connection unit 20, 20A, 20B, 20C, 20D, 20DA, 20DB, 20E, 20F, 20G, 20H, 20J, 20K… Electronic components 30…Connecting parts (routing members) 60, 60A, 60B, 60C, 60D, 60E… Cable routing structure 65… Cable routing structure 70A,70B,70C,70D,70E,70F,70G,70H,70I,70J,70K,70L,70M,70N,70P,70R,70S,70U,70V...Routing section 81...Metal plate part 82...Metal plate part 91...Metal plate 92...Metal plate 110...Base component 121...First support part 122…Second support part 123…Third support part 124…Fourth support part 130...Sensor 131... Insertion part

Claims

1. First electronic component and, A second electronic component having a first terminal and a second terminal, and generating less heat when energized than the first electronic component, A first wiring section is connected directly to the first terminal of the second electronic component or via a wiring member, and electrically connects the first electronic component and the second electronic component. A second wiring portion connected directly to the second terminal of the second electronic component or via a wiring member, Equipped with, The first cable routing portion is formed from at least one first metal plate portion, The second cable routing section is formed by stacking and arranging a plurality of second metal plate sections. The first metal plate portion includes the first material, The second metal plate portion includes the second material, The thermal conductivity of the first material is higher than that of the second material. Electrical connection unit.

2. The first material is copper or a copper alloy, The second material is aluminum or an aluminum alloy. The electrical connection unit according to claim 1.

3. The number of at least one first metal plate portion is less than the number of the plurality of second metal plate portions. The electrical connection unit according to claim 1 or claim 2.

4. When the thickness direction of the first metal plate portion is defined as the first direction, The total thickness of the at least one first metal plate portion in the first direction is smaller than the total thickness of the plurality of second metal plate portions in the first direction. The electrical connection unit according to claim 1 or claim 2.

5. The thickness of the first metal plate portion in the first direction is greater than the thickness of the second metal plate portion in the first direction. The electrical connection unit according to claim 4.

6. The first cable routing portion has a first mounting surface facing the first terminal or a cable routing member connected to the first terminal, The second cable routing portion has a second mounting surface that faces the second terminal or the cable routing member connected to the second terminal, The first mounting surface and the second mounting surface are located on the same plane. The electrical connection unit according to claim 1 or claim 2.

7. First electronic component and, A second electronic component having a first terminal and a second terminal, A first component that generates less heat when energized than the first electronic component, A first wiring section is connected directly to the first terminal of the second electronic component or via a wiring member, and electrically connects the first electronic component and the second electronic component. A second wiring section is connected directly to the second terminal of the second electronic component or via a wiring member, and electrically connects the second electronic component and the first component. Equipped with, The first cable routing portion is formed from at least one first metal plate portion, The second cable routing section is formed by stacking and arranging a plurality of second metal plate sections. The first metal plate portion includes the first material, The second metal plate portion includes the second material, The thermal conductivity of the first material is higher than that of the second material. Electrical connection unit.

8. First electronic component and, The second electronic component, A third electronic component that generates less heat when energized than the first electronic component, The fourth electronic component, A first wiring section electrically connects the first electronic component and the second electronic component, A second wiring section electrically connects the third electronic component and the fourth electronic component, Equipped with, The first cable routing portion is formed from at least one first metal plate portion, The second cable routing section is formed by stacking and arranging a plurality of second metal plate sections. The first metal plate portion includes the first material, The second metal plate portion includes the second material, The thermal conductivity of the first material is higher than that of the second material. Electrical connection unit.

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