Light-emitting device

Abstract

It provides a display device with high brightness and excellent white balance. [Solution] The device comprises a first display element, a second display element, a first transistor, and a second transistor, the first display element having a light-emitting layer, the first display element being electrically connected to the first transistor, the first transistor having a first semiconductor film, a first gate electrode and a second gate electrode arranged opposite each other across the first semiconductor film, a first source electrode and a first drain electrode in contact with the first semiconductor film, and the second gate electrode being the first source A display device comprising an electrode or a first drain electrode, wherein the second display element has a light-emitting layer, the second display element is electrically connected to a second transistor, the second transistor has a second semiconductor film, and a third and fourth gate electrode positioned opposite each other across the second semiconductor film, the fourth gate electrode being electrically connected to the third gate electrode.

Description

Technical Field

[0001] One aspect of the present invention relates to a display device and a method for manufacturing the same.

[0002] Note that one aspect of the present invention is not limited to the above technical field. The invention disclosed in this specification etc. The technical field of one aspect is related to an object, a method, or a manufacturing method. Or, one aspect of the present invention is related to a process, a machine, a manufacture, or a composition (composition ·of·matter). Therefore, more specifically, as the technical field of one aspect of the present invention disclosed in this specification, semiconductor devices, display devices, light-emitting devices, power storage devices, storage devices , their driving methods, or their manufacturing methods can be cited as an example.

Background Art

[0003] There is known a liquid crystal display device that combines a transmissive liquid crystal display device with a light source that emits surface light as a backlight, thereby achieving both reduction of power consumption and suppression of deterioration in display quality ( see Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In recent years, high-definition and high-brightness display devices have been demanded. However, with the miniaturization of pixel sizes , the formation area of transistors and wirings occupied by one pixel increases, resulting in a low pixel aperture ratio This lowers the intensity of light obtained from each pixel.

[0006] In view of the above, one aspect of the present invention aims to provide a display device with high brightness. Alternatively, one aspect of the present invention aims to provide a display device with excellent white balance. One aspect of the present invention aims to provide a display device with high resolution. Alternatively, one aspect of the present invention aims to provide a display device with excellent convenience. Alternatively, one aspect of the present invention aims to provide a novel display device.

[0007] Furthermore, the description of these problems does not preclude the existence of other problems. One approach does not require that all of these issues be resolved. The title will become clear from the description in the specification, drawings, claims, etc. It is possible to extract other issues from the descriptions in the drawings, claims, etc. [Means for solving the problem]

[0008] One aspect of the present invention comprises a first display element and a second display element having lower brightness than the first display element. A first transistor electrically connected to the first display element, and an electrical... A display device having a second transistor connected to the first transistor and Each of the two transistors has a first gate electrode and a second gate electrode with a semiconductor film in between. It has electrodes. The first gate electrode of the first transistor is the source electrode or the drain electrode. Along with the pole, it is electrically connected to the first display element. Also, the first gate of the second transistor The first gate electrode and the second gate electrode are electrically connected. The source electrode and the source electrode or drain electrode are electrically connected to the first display element. Therefore, it has the effect of being able to control the threshold of the first transistor, and the second transistor The first gate electrode and the second gate electrode of the TA are electrically connected, thereby forming the second indicator element It is possible to increase the current flowing through the child, and the brightness of the second display element is increased compared to the first display element. It is possible to further improve this. As a result, a display having a first display element and a second display element The brightness of the display can be increased, and the white balance can be improved.

[0009] One aspect of the present invention comprises a first display element, a second display element, a first transistor, and a second The transistor and the first display element have a first light-emitting layer and the first display element , electrically connected to the first transistor, the first transistor and the first semiconductor film, A first gate electrode and a second gate electrode are arranged opposite each other via a first semiconductor film, and It has a first source electrode and a first drain electrode in contact with a semiconductor film, and a second g The first electrode is electrically connected to the first source electrode or the first drain electrode, and the second indicator The element has a second light-emitting layer, and the second display element is electrically connected to a second transistor. The second transistor is positioned opposite the second semiconductor film, with the second semiconductor film in between. It has a third gate electrode and a fourth gate electrode, and the fourth gate electrode is connected to the third gate electrode. It is a display device that is electrically connected to electrodes.

[0010] Furthermore, one aspect of the present invention includes a first display element, a second display element, and a first transistor. The first display element has a first light-emitting layer and a second transistor. The transistor has a first semiconductor film and a first gate disposed opposite to each other through the first semiconductor film electrodes and a second gate electrode, a first source electrode and a first drain electrode that contact the first semiconductor film, and one of the first source electrode and the first drain electrode is electrically connected to the second gate electrode, and one of the first source electrode and the first drain electrode is electrically connected to the first display element. The second display element has a second light-emitting layer. The second transistor has a second semiconductor film, a third gate electrode and a fourth gate electrode disposed opposite to each other through the second semiconductor film a second source electrode and a second drain electrode that contact the second semiconductor film, and the fourth gate electrode is electrically connected to the third gate electrode. One of the second source electrode and the second drain electrode is electrically connected to the second display element, and it is a display device.

[0011] Also, in one aspect of the present invention, in the aforementioned display device, it is preferable that the first light-emitting layer emits light of any one of red, green, or white and the second light-emitting layer emits blue light.

[0012] Also, in one aspect of the present invention, the aforementioned display device further has a third display element, and it is preferable that the third display element has a liquid crystal layer.

[0013] Also, in one aspect of the present invention, in the aforementioned display device, it is preferable that either one of the first light-emitting layer or the second light-emitting layer has a function of emitting light toward the liquid crystal layer side.

[0014] Also, in one aspect of the present invention, in the aforementioned display device, it is preferable that either one of the first transistor and the second transistor has a metal oxide in the semiconductor film.

[0015] Furthermore, one aspect of the present invention is a display module having the aforementioned display device and a touch sensor. That is the case.

[0016] Furthermore, one aspect of the present invention includes the aforementioned display device or the aforementioned display module, and an operation key or It is an electronic device that has a battery. [Effects of the Invention]

[0017] According to one aspect of the present invention, a display device with high brightness can be provided. Or, according to one aspect of the present invention A display device with superior white balance can be provided. Alternatively, according to one aspect of the present invention This can provide a display device with high resolution. Alternatively, according to one aspect of the present invention, a convenient display device can be provided. A display device can be provided. Alternatively, a novel display device can be provided according to one aspect of the present invention.

[0018] Furthermore, the description of these effects does not preclude the existence of other effects. One embodiment does not necessarily have to possess all of these effects. Furthermore, other effects may be considered. This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings It is possible to extract effects other than those mentioned above from the descriptions in the surfaces, claims, etc. [Brief explanation of the drawing]

[0019] [Figure 1] A top view showing the circuit diagram and layout explaining the pixels. [Figure 2] A block diagram illustrating the display device. [Figure 3] A schematic diagram illustrating the display area of ​​a display element. [Figure 4] A top view illustrating the structure of pixels in a display device. [Figure 5] A cross-sectional diagram illustrating the structure of pixels in a display device. [Figure 6]A cross-sectional diagram illustrating the structure of pixels in a display device. [Figure 7] A top view illustrating the method for manufacturing pixels in a display device. [Figure 8] A top view illustrating the method for manufacturing pixels in a display device. [Figure 9] A top view illustrating the method for manufacturing pixels in a display device. [Figure 10] A top view illustrating the method for manufacturing pixels in a display device. [Figure 11] A top view illustrating the method for manufacturing pixels in a display device. [Figure 12] A top view illustrating the method for manufacturing pixels in a display device. [Figure 13] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 14] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 15] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 16] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 17] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 18] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 19] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 20] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 21] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 22] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 23] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 24] A cross-sectional view illustrating the method for manufacturing pixels in a display device. [Figure 25] A perspective view showing an example of a touch panel. [Figure 26]A cross-sectional view showing an example of a touch sensor. [Figure 27] A cross-sectional view showing an example of a touch panel. [Figure 28] Block diagram and timing chart of the touch sensor. [Figure 29] A diagram illustrating the display module. [Figure 30] A diagram illustrating electronic devices. [Figure 31] A perspective view illustrating the display device. [Modes for carrying out the invention]

[0020] The embodiments will be described below with reference to the drawings. However, many embodiments are described. It can be implemented in different ways, without deviating from its purpose and scope. Those skilled in the art will readily understand that the form and details can be modified in various ways. Therefore, the present invention This shall not be interpreted as being limited to the contents described in the following embodiments.

[0021] Furthermore, in the drawings, the size, layer thickness, or area is exaggerated for clarity. There are cases where this is not the case. Therefore, it is not necessarily limited to that scale. Note that the drawing is an ideal example. This is a schematic representation and is not limited to the shapes or values ​​shown in the drawings.

[0022] Furthermore, the ordinal numbers "1st," "2nd," and "3rd" used in this specification refer to the constituent elements. This note is added to avoid confusion and does not imply any numerical limitation.

[0023] Furthermore, in this specification, phrases indicating placement such as "above" and "below" refer to the relative positions of the components. The positional relationships are used for convenience in explaining them by referring to the drawings. The relationship changes as appropriate depending on the direction in which each component is described. Therefore, as explained in the specification... It is not limited to the same words or phrases, and can be appropriately rephrased depending on the situation.

[0024] Furthermore, in this specification, the term "transistor" includes a gate, a drain, and a source. It is an element having at least three terminals. And, drain (drain terminal, drain Between the drain region (or drain electrode) and the source (source terminal, source region, or source electrode) It has a channel-forming region, and through the channel-forming region, between the source and the drain It is possible to pass an electric current through it. In this specification, the channel forming region and This refers to the region where electric current primarily flows.

[0025] Furthermore, the source and drain functions may differ when using transistors with different polarities, or when the circuit The direction of the current may change during operation, which can cause the current to switch positions. In detailed documents, the terms "source" and "drain" may be used interchangeably. ru.

[0026] Furthermore, in this specification, etc., "electrically connected" means "having some kind of electrical effect." This includes cases where the connection is made via ". Here, "has some electrical effect The term "of" is not particularly limited as long as it enables the exchange of electrical signals between connected objects. For example, "things that have some kind of electrical effect" include electrodes and wiring, as well as transistors. Switching elements such as resistors, inductors, capacitors, and other various functional elements are available. This includes elements such as [specific components].

[0027] Furthermore, in this specification, the terms "membrane" and "layer" are interchangeable. It is possible to change the term. For example, the term "conductive layer" can be changed to the term "conductive film." It may be possible to change it. Or, for example, change the term "insulating film" to "insulating layer". In some cases, it may be possible to change the terminology to this.

[0028] (Embodiment 1) In this embodiment, a display device according to one aspect of the present invention and a method for manufacturing the display device are described below. This will be explained using Figures 1 through 24.

[0029] <1-1. Display device configuration> First, the configuration of the display device will be explained using Figure 2. The display device 500 shown in Figure 2 is , pixel section 502 and gate driver circuit sections 504a, 5 arranged outside the pixel section 502 It includes 04b and a source driver circuit section 506 located outside the pixel section 502.

[0030] [Pixel area] The pixel section 502 is arranged in X rows (where X is a natural number greater than or equal to 2) and Y columns (where Y is a natural number greater than or equal to 2). It has pixels 10(1,1) to 10(X,Y). Also, pixels 10(1,1) The pixel 10(X,Y) has a first display element to a third display element, and the first display element and The second display element has a different function from the third display element. The second display element has the function of emitting light, and the third display element has the function of reflecting incident light. It has the ability. Furthermore, if a third display element is not provided, and only the first and second display elements are used... This configuration may also be used. Details of the first to third display elements will be described later.

[0031] [Gate driver circuit section] Parts of the gate driver circuit sections 504a, 504b and the source driver circuit section 506 It is desirable that all of them be formed on the same substrate as the pixel section 502. The number of parts and terminals can be reduced. Gate driver circuit sections 504a, 504b and saw If part or all of the driver circuit section 506 is not formed on the same substrate as the pixel section 502 In this case, COG (Chip On Glass) or TAB (Tape Automa) (TED Bonding) is used to power a separately prepared drive circuit board (for example, a single-crystal semiconductor board). Even if a drive circuit substrate (formed from a body film or polycrystalline semiconductor film) is formed on the display device 500 good.

[0032] Furthermore, the gate driver circuits 504a and 504b connect to pixels 10(1,1) to pixels 10 It has a function to output a signal (scan signal) to select (X,Y), and the source driver circuit section 5 06 is for driving the display elements of pixels 10(1,1) to 10(X,Y). It has the function of supplying signals (data signals).

[0033] Furthermore, the gate driver circuit section 504a is connected to a wiring to which a scanning signal is supplied (hereinafter referred to as the scanning line G Control the potentials of L_L[m], scan line GL_L[m+1], and scan line GL_L[X]). It has the function of either supplying an initialization signal or a gate driver circuit section 504. b is the wiring to which the scan signal is applied (hereinafter referred to as scan line GL_E1[m], scan line GL_E1[ m+1], scan line GL_E2[m], scan line GL_E2[m+1], scan line GL_E1[ Function to control the potential of X) and scan line GL_E2[X]), or to supply an initialization signal. It has the function of [doing something]. In the above, m represents a natural number less than or equal to X.

[0034] However, the gate driver circuits 504a and 504b are not limited to the above functions, and may also perform other functions. It may have the function of controlling or supplying signals.

[0035] In Figure 2, the gate driver circuit section is represented as gate driver circuit section 504a. As illustrated above, we have provided an example of a configuration with two gate driver circuits 504b, but we are not limited to this. Instead, one gate driver circuit section or three or more gate driver circuit sections are provided. It can also be used as a composition.

[0036] [Source driver circuit section] The source driver circuit 506 uses the image signal to process pixels 10(1,1) to pixels 10(X Function to generate data signals to write to (Y), wiring to which data signals are supplied (signal line SL) _L[n], signal line SL_L[n+1], signal line SL_L[Y], signal line SL_E1[n ], Signal line SL_E1[n+1], Signal line SL_E1[Y], Signal line SL_E2[n], Function to control the potential of signal line SL_E2[n+1] and signal line SL_E2[Y]), It has the function of supplying an initialization signal. In the above, n represents a natural number less than or equal to Y. vinegar.

[0037] However, the source driver circuit 506 is not limited to the above functions, and generates other signals. It may have a control or supply function.

[0038] Furthermore, the source driver circuit section 506 is configured using multiple analog switches, etc. The source driver circuit section 506 sequentially turns on multiple analog switches. This allows the image signal to be time-divided and output as a data signal.

[0039] In Figure 2, an example is shown of a configuration in which one source driver circuit unit 506 is provided. However, the display device 500 may also be provided with multiple source driver circuit sections. Good. For example, if two source driver circuits are provided, one source driver circuit will Control signal lines SL_L[n], SL_L[n+1], and SL_L[Y] The other source driver circuit section controls the signal line SL_E1[n], signal line SL_E1[n+ 1], Signal line SL_E1[Y], Signal line SL_E2[n], Signal line SL_E2[n+1] The signal line SL_E2[Y] may also be controlled.

[0040] [Pixels] Furthermore, pixels 10(1,1) to 10(X,Y) are scanned lines GL_L[m], scan lines GL_L[m+1], scan line GL_L[X], scan line GL_E1[m], scan line GL_E 1[m+1], scan line GL_E1[X], scan line GL_E2[m], scan line GL_E2[ A pulse signal is input via m+1] and one of the scan lines GL_E2[X], and signal line S L_L[n], signal line SL_L[n+1], signal line SL_L[Y], signal line SL_E1[ n], signal line SL_E1[n+1], signal line SL_E1[Y], signal line SL_E2[n] , data signal via signal line SL_E2[n+1] and one of signal lines SL_E2[Y] The following is entered.

[0041] For example, pixel 10(m,n) at row m and column n is gated via scan line GL_L[m] A pulse signal is input from the driver circuit section 504a, and in accordance with the potential of the scan line GL_L[m] A data signal is input from the source driver circuit 506 via the signal line SL_L[n]. .

[0042] Furthermore, pixel 10(m,n) in the mth row and nth column is the scan line GL_E1[m] and scan line GL_ A pulse signal is input from the gate driver circuit section 504b via E2[m], and scan line G The signal line SL_E1[n] and the scan line GL_E2[m] are determined according to their potentials. A data signal is input from the source driver circuit 506 via the signal line SL_E2[n]. ru.

[0043] Furthermore, as explained above, pixel 10(m,n) is a first to third display element It possesses scan lines GL_L[m], GL_L[m+1], and GL_L[X]. This is a wiring that controls the potential of the third display element, and is located on scan line GL_E1[m], scan line GL _E1[m+1], scan line GL_E1[X], scan line GL_E2[m], scan line GL_E 2[m+1] and scan line GL_E2[X] are the power of the first display element and the second display element. This is the wiring that controls the position.

[0044] Furthermore, the signal lines SL_L[n], SL_L[n+1], and SL_L[Y] are shown in Table 3. These are the wiring lines that control the potential of the indicator element, and are the signal lines SL_E1[n], SL_E1[n+1], SL_E1[Y], signal lines SL_E2[n], SL_E2[n+1], and SL_E2[ Y] is a wiring that controls the potential of the first and second display elements.

[0045] [External circuit] An external circuit 508 is connected to the display device 500. A configuration having 508 is also possible.

[0046] As shown in Figure 2, the external circuit 508 has a wire ANODE to which an anode potential is applied and an electric They are connected by energy.

[0047] <1-2. Pixel Circuit Configuration> Next, the circuit configuration of pixel 10(m,n) will be explained using Figure 1.

[0048] Figure 1(A) illustrates the pixels 10(m,n) of a display device 500 according to one embodiment of the present invention. This is a circuit diagram.

[0049] Pixel 10(m,n) is scanned by scan line GL_L[m], scan line GL_E1[m], scan line GL _E2[m], signal line SL_E1[n], signal line SL_L[n], and signal line SL_E2 [n] is present. Furthermore, pixel 10(m,n) has transistors MA1 to M A5, transistor MB1 to transistor MB4, capacitive element Cs_L, capacitive element It has capacitive elements Cs_E1 to Cs_E8, a display element 12, and a display element 14. Oh, in Figure 1(A), the display element 14 is display element 14B, display element 14G, display element It has 14R and a display element 14W. The display element 14B has the function of emitting blue light. Display element 14G has the function of emitting green light, and display element 14R has the function of emitting red light. The display element 14W has the function of emitting white light.

[0050] Furthermore, the pixel 10(m,n) is electrically connected to the display element 12 via wiring TCOM, and The wiring is electrically connected to the capacitance element Cs_L and the capacitance elements Cs_E1 through Cs_E8. The CSCOM wire, the CATHODE wiring electrically connected to the display element 14, and the transistor It has a wiring ANODE that is electrically connected to transistors MB1 to MB4.

[0051] Note that the scan line GL_L[m], signal line SL_L[n], wiring CSCOM, and wiring TC are all included. OM are wirings for supplying signals and power to the display elements 12, respectively, and the scan line GL_ E1[m], scan line GL_E2[m], signal line SL_E1[n], signal line SL_E2[n] The ANODE and CATHODE wirings each supply signals and power to the display element 14. This is wiring for supplying power.

[0052] Figure 1(B) shows a top view of the layout of pixel 10(m,n). Pixel 10(m,n) is Transistors MA1 to MA5, and transistors MB1 to M It has B4.

[0053] <1-3. Example of the configuration of the first display element> Display elements 14W, 14R, and 14G have the function of emitting light, i.e., light emission. It has the function of generating. Therefore, display element 14W, display element 14R and display element 14G are generated It may also be interpreted as an optical element. For example, display element 14W, display element 14R and display element 14G is a configuration that uses electroluminescent elements (also called EL elements), Alternatively, a configuration using light-emitting diodes may be used.

[0054] <1-4. Example of the configuration of the second display element> The display element 14B has a function of emitting light, that is, a function of emitting light. Therefore, the display element 14B may be interpreted as a light-emitting element. For example, as the display element 14B, A configuration using a trollescent element (also called an EL element), or using a light-emitting diode. The configuration should be such that it is present.

[0055] <1-5. Example of the configuration of the third display element> The display element 12 has a function to control the reflection or transmission of light. In particular, the display element 1 It is preferable to use a so-called reflective display element that controls the reflection of light for element 2. By using a light-emitting display element, it becomes possible to display using ambient light, thus enabling the display device. This can reduce power consumption. For example, the display element 12 may consist of a reflective film and a liquid crystal element. A configuration combining a polarizing plate, or a micro-electro-mechanical system. A configuration using MEMS (Mechanical Energy Management Systems) would be appropriate.

[0056] Thus, the display element 12, display element 14B, display element 14G, display element 14R and the display Display elements with different functions are used for the display element 14W. For example, one or more of the display elements are reversed. By using a light-emitting liquid crystal element and other elements being transmissive EL elements, a display device with superior convenience is achieved. It can be placed in this position. In addition, in environments with bright ambient light, a reflective liquid crystal element can be used. Furthermore, in environments with low ambient light, using transmissive EL elements results in lower power consumption. This allows for the creation of a display device with high display quality.

[0057] <1-6. Method for driving display elements> Next, the driving method for display elements 12 and 14 will be explained using Figure 1(A). In the following explanation, the first display element will be referred to as display element 14G, display element 1 The configuration uses light-emitting elements for 4R and the display element 14W. As the second display element, The child 14B is configured to use a light-emitting element. As a third display element, the display element 12 is configured to use a liquid crystal element. The structure will use children.

[0058] [Method for driving the first display element] As shown in Figure 1(A), at pixel 10(m,n), the gate of transistor MA1 The electrodes are electrically connected to the scan line GL_E1[m]. Also, the transistor MA1 One of the drain electrodes is electrically connected to the signal line SL_E1[n], and the other is connected to the signal line SL_E1[n]. These are the gate electrode of transistor MB1, and the capacitive elements Cs_E1 and Cs_E2 It is electrically connected to one of the electrodes. Transistor MA1 switches between an on state and an off state. By replacing it, it has the function of controlling the writing of data to the data signal.

[0059] One of the source and drain electrodes of transistor MB1 is a pair of display elements 14W. It is electrically connected to one of the electrodes, and is also connected to the source electrode and drain electrode of transistor MB1. One side is electrically connected to the wiring ANODE. Also, the other side of the pair of electrodes of the display element 14W It is electrically connected to the wiring CATHODE. Transistor MB1 is a 14W display element. It functions as a so-called drive transistor, controlling the current supplied to it.

[0060] Transistor MB1 has a first gate electrode and a second gate electrode above and below the semiconductor film. This is a dual-gate type transistor. In this specification, the first gate electrode is The front gate electrode is called the front gate electrode, and the second gate electrode is called the back gate electrode. Transistor MB1 The back gate electrode is either the source electrode or the drain electrode of transistor MB1. By electrically connecting to it, the potential of the back channel side of the transistor is fixed. This is possible. With this configuration, the threshold voltage of the transistor can be controlled. Therefore, the off-current of the transistor can be reduced.

[0061] Between the front gate electrode of transistor MB1 and wiring ANODE is a capacitive element C. s_E1 is formed. Also, the front gate electrode of transistor MB1 and the wiring CSC A capacitive element Cs_E2 is formed between OM and the pixel 10(m,n). It has the function of holding the data written to it.

[0062] Furthermore, as shown in Figure 1(A), in pixel 10(m,n), transistor MA2 The gate electrode is electrically connected to the scan line GL_E1[m]. Also, transistor MA One of the source and drain electrodes of 2 is electrically connected to the signal line SL_E2[n]. The other side is the gate electrode of transistor MB2, and the capacitive element Cs_E3 and the capacitive element Cs It is electrically connected to one of the electrodes of _E4. Transistor MA2 has an on state and an off state. By switching between these two states, it has the function of controlling the writing of data to the data signal.

[0063] One of the source and drain electrodes of transistor MB2 is a pair of display elements 14R. It is electrically connected to one of the electrodes, and is also connected to the source and drain electrodes of transistor MB2. One side is electrically connected to the wiring ANODE. Also, the other side of the pair of electrodes of the display element 14R It is electrically connected to the wiring CATHODE. Transistor MB2 is the display element 14R It functions as a so-called drive transistor, controlling the current supplied to it.

[0064] Transistor MB2 has a front gate electrode and a back gate electrode above and below the semiconductor film. It is a dual-gate type transistor. The back gate electrode of transistor MB2. This is electrically connected to either the source or drain electrode of transistor MB2. This allows the potential of the back channel side of the transistor to be fixed.

[0065] Between the front gate electrode of transistor MB2 and the wiring ANODE, there is a capacitive element Cs _E3 is formed. Also, the front gate electrode of transistor MB2 and the wiring CSCO A capacitive element Cs_E4 is formed between M and the pixel 10(m,n). It has the function of retaining the data written to it.

[0066] Furthermore, as shown in Figure 1(A), in pixel 10(m,n), transistor MA3 The gate electrode is electrically connected to the scan line GL_E2[m]. Also, transistor MA One of the source and drain electrodes of 3 is electrically connected to the signal line SL_E1[n]. The other side is the gate electrode of transistor MB3, and the capacitive element Cs_E5 and the capacitive element Cs It is electrically connected to one of the electrodes of _E6. Transistor MA3 has an on state and an off state. By switching between these two states, it has the function of controlling the writing of data to the data signal.

[0067] One of the source and drain electrodes of transistor MB3 is a pair of display elements 14G. It is electrically connected to one of the electrodes, and is also connected to the source and drain electrodes of transistor MB3. One side is electrically connected to the wiring ANODE. The other side of the pair of electrodes of the display element 14G It is electrically connected to the wiring CATHODE. Transistor MB3 is a 14G display element. It functions as a so-called drive transistor, controlling the current supplied to it.

[0068] The MB3 transistor has a front gate electrode and a back gate electrode above and below the semiconductor film. It is a dual-gate type transistor. The back gate electrode of transistor MB3. This is electrically connected to either the source or drain electrode of transistor MB3. This allows the potential of the back channel side of the transistor to be fixed.

[0069] Between the front gate electrode of transistor MB3 and the wiring ANODE, there is a capacitive element Cs _E5 is formed. Also, the front gate electrode of transistor MB3 and the wiring CSCO A capacitive element Cs_E6 is formed between M and the pixel 10(m,n). It has the function of retaining the data written to it.

[0070] [Method for driving the second display element] Furthermore, as shown in Figure 1(A), in pixel 10(m,n), transistor MA4 The gate electrode is electrically connected to the scan line GL_E2[m]. Also, transistor MA One of the source and drain electrodes of 4 is electrically connected to the signal line SL_E2[n]. The other side is the gate electrode of transistor MB4, and the capacitive element Cs_E7 and the capacitive element Cs It is electrically connected to one of the electrodes of _E8. Transistor MA4 has an on state and an off state. By switching between these two states, it has the function of controlling the writing of data to the data signal.

[0071] One of the source and drain electrodes of transistor MB4 is a pair of display elements 14B. It is electrically connected to one of the electrodes, and is also connected to the source and drain electrodes of transistor MB4. One side is electrically connected to the wiring ANODE. The other side of the pair of electrodes of the display element 14B It is electrically connected to the wiring CATHODE. Transistor MB4 is the display element 14B It functions as a so-called drive transistor, controlling the current supplied to it.

[0072] The MB4 transistor has a front gate electrode and a back gate electrode on the top and bottom of the semiconductor film. It is a dual-gate type transistor. The back gate electrode of transistor MB4. This is achieved by electrically connecting to the front gate electrode of transistor MB4, This can improve the current drive capability.

[0073] Between the front gate electrode of transistor MB4 and the wiring ANODE, there is a capacitive element Cs _E7 is formed. Also, the front gate electrode of transistor MB4 and the wiring CSCO A capacitive element Cs_E8 is formed between M and the pixel 10(m,n). It has the function of retaining the data written to it.

[0074] For example, the gate driver circuit section 504b shown in Figure 2 controls the pixels 10(m,1) in each row. Select pixels 10(m,Y) sequentially and turn on transistors MA1 to MA4. The data signal is written to the pixels 10(m,1) to 10. (m,Y) is held when transistors MA1 through MA4 are turned off. Furthermore, the source of transistors MB1 to MB4 depends on the potential of the written data signal. The amount of current flowing between the electrode and the drain electrode is controlled, and the display element 14 responds to the amount of current flowing. It emits light at a certain brightness. By doing this sequentially for each row, an image can be displayed.

[0075] As described above, the first display element is a display element 14W that has the function of emitting white light. The transistor MB1 drives the first display element, which has the function of emitting red light. A transistor MB2 drives the display element 14R, and the first display element emits green light. Front gate electrode of transistor MB3 that drives the display element 14G which has the function of emitting light These are electrically connected to either the source electrode or the drain electrode, respectively. In response, the second display element, a display element 14B having the function of emitting blue light, is driven. The front gate electrode of transistor MB4 is electrically connected to the back gate electrode. By using this configuration, compared to transistors MB1 to MB3, The MB4 transistor can improve current drive capability. It emits white, red, and green light. A second display element 14 emits blue light in relation to the first display elements 14W, 14R, and 14G. Because the current flowing through B can be increased, the brightness of the blue light emitted from the display element 14B is increased. Yes. Therefore, the brightness of the display device can be increased.

[0076] Furthermore, even if the current density flowing through the drive transistor is the same, the luminous brightness will differ depending on the EL material. This may vary. If the brightness balance of red, green, and blue light is poor, the display device may be affected. White balance may be poor. Low-brightness blue EL material is used for the display element 14B. If present, by applying the MB4 transistor, which has high current drive capability, the display element 14B or The brightness of the blue light emitted is increased. Therefore, the brightness of the red, green, and blue light is increased. The lance improves, allowing for better white balance on the display device.

[0077] Furthermore, the back gate electrode of the transistor that drives the first display element is connected to the source electrode. Compared to a transistor that electrically connects to either one of the drain electrodes, see Table 2 The back gate electrode of the transistor that drives the display element is electrically connected to the front gate electrode. The transistors connected to them increase the area of ​​wiring, thus reducing the aperture ratio of the pixels. In some cases, the back gate electrode is located at the front of the transistor only if you want to increase the brightness of the light-emitting element. By configuring a second display element to be electrically connected to the gate electrode, the aperture ratio of the pixels decreases. This allows for the creation of high-resolution display devices while suppressing noise.

[0078] Thus, in a display device according to one aspect of the present invention, the brightness is high and the white balance is excellent. Furthermore, it is possible to provide a display device with high resolution.

[0079] Furthermore, an example of a configuration in which blue is used as the second display element to increase the brightness of blue light is shown. However, the present invention is not limited to this. That's good. Alternatively, two or more colors may be represented by a second display element.

[0080] [Method for driving the third display element] At pixel 10(m,n), the gate electrode of transistor MA5 is on the scan line GL_L[ It is electrically connected to [m]. Also, the source electrode or drain electrode of transistor MA5. One side is electrically connected to the signal line SL_L[n], and the other side is connected to the pair of electrodes of the display element 12. It is electrically connected to one side. Transistor MA5 switches between an on state and an off state. This provides a function to control the writing of data to the data signal.

[0081] Furthermore, the other electrode of the pair of electrodes of the display element 12 is electrically connected to the wiring TCOM.

[0082] Furthermore, one of the pair of electrodes of the capacitive element Cs_L is the source electrode of transistor MA5. It is electrically connected to the other drain electrode and to one of the pair of electrodes of the display element 12, and the capacitance The other electrode of the pair of electrodes of element Cs_L is electrically connected to the wiring CSCOM. Capacitive element C s_L has the function of holding the data written to pixel 10(m,n). Wiring CS COM is the noise generated in the display element 12, from transistor MB1 to transistor MB 4. Suppress the transmission to at least one of the front gate electrode or the back gate electrode. It has a controlling effect.

[0083] For example, the gate driver circuit 504a shown in Figure 2 controls the pixels 10(m,1) in each row. By sequentially selecting pixels 10(m,Y), transistor MA5 turns on, Write the data signal. The data is written to pixel 10(m,1) to pixel 10( m,Y) is held when transistor MA5 is turned off. This is done row by row. By performing these steps sequentially, the image can be displayed.

[0084] Furthermore, even if the third display element is omitted and only the first and second display elements are used, good.

[0085] Furthermore, transistors MA1 to MA5 used in a display device according to one aspect of the present invention, and Zistar MB1 to MB4 preferably have a metal oxide in the semiconductor film. Transistors that achieve relatively high field-effect mobility can be driven at high speeds. Furthermore, the off-current of transistors containing metal oxides is extremely small. Therefore, Even if the refresh rate of the display device is reduced, the brightness of the display device can be maintained, and power consumption is reduced. It can be suppressed.

[0086] Furthermore, the display method for display elements 12 and 14 may be a progressive method or an indexed display. A tar-lace method can be used. Also, when displaying in color, color requirements are controlled by pixels. The basic components are not limited to the above configuration. For example, in addition to the above configuration, yellow, cyan, You may add one or more colors, such as magenta. Also, the size of the display area for each dot of a color element. They may be different. However, the display device according to one aspect of the present invention is a color display device. It is not limited to this, and can also be applied to monochrome display devices.

[0087] Furthermore, the display device 500 has at least one of the display elements 12 or 14. It can be used to display grayscale. For example, the display element 12 is a so-called reflective liquid crystal element. Therefore, visibility can be improved in environments with strong ambient light. When using sub-unit 12 to perform grayscale display, the backlight and other components are controlled compared to a transmissive liquid crystal display. Because there is no need to control it, it becomes possible to reduce power consumption.

[0088] On the other hand, the display element 14 is a so-called light-emitting element, and therefore its visibility is low in environments with weak ambient light. This can improve the performance. Also, when performing grayscale display using the display element 14, the transmissive type Compared to liquid crystal displays, it does not use a backlight and can control light emission at the pixel level, so It can improve the image quality of trusts and other elements.

[0089] Furthermore, even if the display device 500 performs grayscale display using the display elements 12 and 14, Good. By performing grayscale display using display element 12 and display element 14, display element 12 and Compared to the case where grayscale display is performed using any one of the display elements 14, visibility is improved. It is possible.

[0090] <1-7. Display area of ​​display element> Next, regarding the display area at pixel 10(m,n) of display element 12 and display element 14 This will be explained using Figure 3.

[0091] Figure 3 is a schematic diagram illustrating the display area of ​​pixel 10(m,n).

[0092] As shown in Figure 3, the display area of ​​pixel 10(m,n) functions as the display area of ​​display element 12. A display area 12d, a display area 14Bd that functions as a display area for the display element 14B, and Display area 14Gd that functions as a display area for display element 14G, and display area for display element 14R A display area 14Rd that functions as a display area for the display element 14W, and a display area that functions as a display area for the display element 14W It has 14Wd.

[0093] Display area 12d has a light-reflecting area, and display area 14Bd has a blue light-transmitting area. The display area 14Gd has a region that transmits green light, and the display area 14Rd has a region that transmits red light. The display area 14Wd has a region that transmits light, and the display area 14Wd has a region that transmits white light.

[0094] For example, by using the display area of ​​pixel 10(m,n) as shown in Figure 3, the display area 12d can be used Then, a black and white image is displayed, with display area 14Bd, display area 14Gd, and display area 14Rd. Furthermore, full-color images can be displayed using the display area 14Wd.

[0095] <1-8. Example of Display Device Configuration> Next, an example of the structure of the pixels 10 of the display device 500 will be shown using Figures 4 and 5. explain.

[0096] Figure 4 shows an example of a top view of pixel 10, and Figure 5 shows the dashed line shown in Figure 4. A1-A2, A3-A4, A5-A6, A7-A8, A9-A10 and A11-A12 This corresponds to a cross-sectional view of the cut surface. Note that in the top view of pixel 10 shown in Figure 4, it becomes complicated. To avoid this, some of the components are omitted from the diagram. Also, in Figure 4, adjacent The display area of ​​the pixels (the area corresponding to display areas 14Rd, 14Gd, 14Bd, and 14Wd) This is clearly stated. Furthermore, the same applies to the top view of pixel 10 in subsequent drawings.

[0097] The pixel 10 shown in Figures 4 and 5 has a display element 12 between the substrate 80 and the substrate 90, and displays It comprises element 14a, display element 14b, and transistors Tr1 to Tr5. ru.

[0098] Note that the display element 14a is the same as the display element 14W, display element 14R, and display element 14 mentioned above. It corresponds to one of the Gs. Also, the display element 14b corresponds to the display element 14B shown above. Also, transistor Tr1 corresponds to transistor MA5 shown earlier. Transistor Tr2 is one of the transistors MA1 to MA3 shown above. It corresponds to one. Also, transistor Tr3 corresponds to the transistor MB1 to the transistors shown above. It corresponds to one of the MB3 transistors. Also, transistor Tr4 is the transistor shown above. This corresponds to transistor MA4. Also, transistor Tr5 is equivalent to transistor MB4 shown above. It is correct.

[0099] Furthermore, the display element 12 has a liquid crystal layer 96, and the display elements 14a and 14b are Each has an EL layer 76. In addition, transistor Tr1 has the function of selecting the display element 12. It has the function of selecting the display element 14a, and transistor Tr2 has the function of selecting the display element 14a, Tr3 has the function of controlling the drive of the display element 14a. Transistor Tr4 controls the display The transistor Tr5 has a function to select element 14b and controls the driving of the display element 14b. It has the function of: Transistors Tr1, Tr2, and Tr4 , formed on the same surface, transistor Tr3 and transistor Tr5 are transistors It is formed above transistors Tr1, Tr2, and Tr4. Transistor Tr3 is either the source electrode or the drain electrode of transistor Tr2. It has one side as the gate electrode. Transistor Tr5 has the same side as transistor Tr4. It has either a source electrode or a drain electrode as a gate electrode.

[0100] Furthermore, the display element 12 has a conductive film 36 that functions as a first pixel electrode. Rangista Tr1 is electrically connected to the conductive film 36 and has the function of selecting the display element 12. In addition, transistor Tr3 is electrically connected to the conductive film 70a and the display element 14a. It has the function to select. Transistor Tr5 is electrically connected to the conductive film 70b, and It has the function of selecting the indicator element 14b.

[0101] Furthermore, the pixel 10 has capacitive elements 16 and 18. Sub-element 18 has a pair of electrodes, one of which is a conductive film 42 that functions as a capacitive electrode. The pair of electrodes has a conductive film 36 on the other side. The conductive film 42 is on the transistor Tr3 It is also positioned below transistor Tr5. The conductive film 42 is located below transistor Tr3 It may be placed below transistor Tr5.

[0102] Note that the capacitive element 16 corresponds to the capacitive elements Cs_E1 to Cs_E8 described earlier. The capacitance element 18 corresponds to the capacitance element Cs_L described earlier. Capacitance elements Cs_E1 to Cs_ E8 and the capacitance element 18 can be manufactured using the same materials and the same process.

[0103] A conductive film 42, which functions as a capacitive electrode, is placed between transistors Tr1 and Tr5. By placing one or more of them below, noise associated with rewriting the display element 12 is reduced, in other words... This reduces noise associated with the rewriting of pixels in the liquid crystal element.

[0104] Furthermore, as shown in Figure 5, transistor Tr1, transistor Tr2 and transistor Transistor Tr4 is formed on the same surface as transistors Tr3 and Tr5. It is formed above transistors Tr1, Tr2, and Tr4. This allows for a reduction in circuit area. Also, transistor Tr3 is a transistor The source electrode or drain electrode of Tr2 is used as the gate electrode. This configuration is such that transistor Tr5 has the source electrode of transistor Tr4. Since the configuration has either the drain electrode or the gate electrode, the manufacturing process It can be shortened.

[0105] Furthermore, as shown in Figure 5, transistors Tr1 through Tr5 are inversely reversed. A staggered transistor (also called a bottom-gate transistor) is preferable. By using a rifling transistor structure, transistors can be fabricated using a relatively simple process. This is possible. However, one aspect of the present invention is not limited thereto, and the top gate structure You may use a generator.

[0106] Furthermore, the display element 12 has the function of reflecting incident light. This is a so-called liquid crystal element, having a liquid crystal layer 96 between a pair of electrodes. One of the pair of electrodes is conductive. The pair of electrodes has a film 36, and the other electrode has a conductive film 92. Also, as shown in Figure 5, The element 12 may have alignment films 94 and 98 in contact with the liquid crystal layer 96. The film 36 functions as a reflective electrode. As shown by the dashed arrow in Figure 5, it is incident from the outside. By reflecting the incoming light with the conductive film 36, the light can be reflected towards the viewing side.

[0107] Display elements 14a and 14b have the function of emitting light. a and the display element 14b are so-called light-emitting elements, and each has an EL layer 76 between a pair of electrodes. One of the pair of electrodes has conductive films 70a and 70b, and the other of the pair of electrodes... It has a conductive film 78. Furthermore, the conductive film 78 functions as a reflective electrode. Figure 5-2 As shown by the dashed arrow, the light emitted by the EL layer 76 is reflected by the conductive film 78, and the conductive film 7 It passes through 0a and the conductive film 70b and is extracted to the liquid crystal layer 96 side. Also, from the display element 14 The emitted light passes through an opening in the conductive film 36 and is extracted to the substrate 90 side. In Figure 5, the opening is clearly indicated as the display area 14d.

[0108] As the display element 14, an FMM (Fine Metal Mask) is used to create R (Re d) EL layers 76 that emit light such as G (Green) and B (Blue) are formed. A light-emitting element can be used. However, the display element 14 is not limited to this, and W(Wh) An element that emits light (R), is provided, and the light from this element passes through the colored film to emit R, G, It may also be configured to emit light such as B separately.

[0109] An example of the above configuration is shown in Figure 6. Figure 6 is a cross-sectional view of a modified example of pixel 10 shown in Figure 5. As shown in Figure 6, light from display elements 14a and 14b passes through the colored film 69. It is then removed to the outside. Also, as shown in Figure 6, the colored film 69 is connected to transistor Tr3 and It is preferable to have a configuration that covers a part of transistor Tr5. In particular, transistor Tr3 and By configuring it to cover the channel formation region of transistor Tr5, the channel formation region can be entered The amount of light entering can be reduced. By reducing the amount of light entering the channel formation region... This makes it possible to improve the light resistance of transistors Tr3 and Tr5. The colored film 69 is configured to cover transistors other than transistors Tr3 and Tr5. That is also acceptable.

[0110] <1-9. Method for manufacturing a display device> Next, regarding the method for manufacturing the pixels 10 of the display device 500 shown in Figure 2, see Figures 7 to 2. We will use number 4 to explain.

[0111] First, a conductive film 31, an insulating film 32, and an insulating film 34 are formed sequentially on the substrate 30. A conductive film is formed on the insulating film 34, and the conductive film is processed into an island shape to form a conductive film 36. (See Figures 7(A) and 13).

[0112] The conductive film 31 functions as a first release layer, and the insulating film 32 and insulating film 34 function as a second release layer. The conductive film 36 functions as a release layer and as a reflective film. 36 is sometimes referred to as the first pixel electrode. The first pixel electrode is made of silver and aluminum. It is preferable to have either or both of the following: the first pixel electrode is made of silver and aluminum. By incorporating a titanium-containing structure, it becomes possible to increase reflectivity. Electrode compositions containing silver include, specifically, alloys containing silver, palladium, and copper. It is possible.

[0113] Next, a conductive film is formed on the insulating film 34 and the conductive film 36, and the conductive film is processed into an island shape. A conductive film 38 is formed. Then, an insulating film 40 is formed on the conductive film 36 and the conductive film 38. (See Figures 7(B) and 14).

[0114] The conductive film 36 functions as part of one of the pair of electrodes of the display element 12. The conductive film 36 has the following function: The conductive film 36 is a distribution of the liquid crystal layer 96 of the display element 12. It has a function to control the direction of the state.

[0115] The conductive film 38 is electrically connected to the conductive film 36. The conductive film 38 is a light-transmitting conductive material. It is formed using a material.

[0116] Next, a conductive film is formed on the insulating film 40, and the conductive film is processed into an island shape to form a conductive film 42 A conductive film 42 is formed. Then, an insulating film 44 is formed on the conductive film 42. After that, the insulating film 40 and the insulating film 42 are formed. A first opening 45 is formed in a desired region of the edge film 44. The first opening 45 is conductive The film 38 is formed so that a portion of it is exposed (see Figures 8(A) and 15).

[0117] Next, a conductive film is formed on the insulating film 44, and the conductive film is processed into an island shape to form a conductive film 46 a, conductive film 46b, conductive film 46c, conductive film 46d, conductive film 46e, and conductive film 46f form It is completed. Then insulating film 44, conductive film 46a, conductive film 46b, conductive film 46c, conductive film 46 d, an insulating film 48 is formed on the conductive film 46e and the conductive film 46f. Then, on the insulating film 48 By forming an oxide semiconductor film on it and processing the oxide semiconductor film into an island shape, an oxide semiconductor is formed. Film 50a, oxide semiconductor film 50b, and oxide semiconductor film 50c are formed. Then, insulation A second opening 51 is formed in a desired region of the film 48. It is provided so as to overlap with the opening 45 and is formed so that a part of the conductive film 46f is exposed. (See Figures 8(B) and 16).

[0118] Furthermore, the conductive film 42 functions as the other electrode of the pair of electrodes of the capacitive element 16. In other words, the capacitive element 16 consists of a conductive film 36, a conductive film 38, an insulating film 40, and a conductive film 42. The conductive film 36 and conductive film 38 function as one of a pair of electrodes of the capacitive element 16, and are conductive The film 42 functions as the other electrode of the pair of electrodes of the capacitive element 16, and the insulating film 40 induces the capacitive element 16. It functions as an electrochemical film.

[0119] Furthermore, the conductive film 46a functions as the gate electrode of transistor Tr1. The conductive film 46b functions as the gate electrode of transistor Tr2. The film 46d functions as the gate electrode of transistor Tr4.

[0120] Next, insulating film 48, oxide semiconductor film 50a, oxide semiconductor film 50b, and second opening A conductive film is formed on 51, and the conductive film is processed into an island shape to form conductive film 52a, conductive film 52 b, conductive film 52c, conductive film 52d, conductive film 52e, conductive film 52f, conductive film 52g, and conductive film 52h are formed (see FIGS. 9(A) and 17).

[0121] Conductive films 52a and 52b function as the source electrode and drain electrode of transistor Tr1. Conductive films 52c and 52d function as the source electrode and drain electrode of transistor Tr2. Conductive films 52f and 52g function as the source electrode and drain electrode of transistor Tr4.

[0122] Also, conductive film 52e functions as the gate electrode of transistor Tr3. Conductive film 52h functions as the gate electrode of transistor Tr5.

[0123] Next, an insulating film 54 is formed over the insulating film 48, oxide semiconductor films 50a, 50b, and conductive films 52a, 52b, 52 c, 52d, 52e. Thereafter, an oxide semiconductor film is formed over the insulating film 54, and the oxide semiconductor film is processed to form island-shaped oxide semiconductor films 56a and oxide semiconductor film 56b. Thereafter, a third opening 55 is formed in a desired region of the insulating film 54 . Note that the third opening 55 is formed so that a part of the conductive film 52 is exposed. Thereafter, a conductive film is formed over the island-shaped oxide semiconductor films 56a and oxide semiconductor film 5 6b so as to cover the third opening 55, and the conductive film is processed into an island shape to form conductive films 58a, conductive film 5 8b, conductive film 58c, and conductive film 58d (see FIGS. 9(B) and 18). Conductive films 58a and 58b function as the source electrode and drain electrode of transistor Tr3.

[0124] ​​​It has the function of the conductive film 58c and conductive film 58d are the source of transistor Tr5. It functions as both an electrode and a drain electrode.

[0125] Next, insulating film 62 is formed on insulating film 54 and conductive films 58a and 58b. After that, insulating film 62 is formed on the insulating film 54 and conductive films 58a and 58b. A fourth opening 63a reaches the conductive film 58a in a desired region of the edge film 62, and reaches the conductive film 58c. A fifth opening 63b and a sixth opening 63c reaching the conductive film 58d are formed. The sixth opening 63c is provided so as to overlap with the third opening 55. 3a, the fifth opening 63b, and the sixth opening 63c are conductive film 58a, conductive film 58c and a portion of the conductive film 58d are formed to be exposed. Subsequently, the fourth opening 63 a, a conductive film on the insulating film 62 so as to cover the fifth opening 63b and the sixth opening 63c A conductive film is formed, and the conductive film is processed into an island shape to form conductive films 64a and 64b. (See Figures 10(A) and 19).

[0126] The conductive film 64a functions as the back gate electrode of transistor Tr3. 64a is electrically connected to the conductive film 58a. Also, the conductive film 64b is connected to the transistor Tr It functions as the back gate electrode of 5. The conductive film 64b is electrically connected to the conductive film 58d. They are connected. With this configuration, the back gate electrode of transistor Tr3 is Electrically connected to either the source or drain electrode of the lampistor Tr3. This allows the potential of the back channel side of the transistor to be fixed. The back gate electrode of transistor Tr5 is electrically connected to the front gate electrode of transistor Tr5. This can improve the current driving capability of the transistor.

[0127] Next, an insulating film 68 having openings on the insulating film 62, the conductive film 64a, and the conductive film 64b is formed. After that, a conductive film is formed on the insulating film 68, and the conductive film is processed into an island shape to form the conductive film 70a and the conductive film 70b. After that, an insulating film 72 having openings on the insulating film 68, the conductive film 70a, and the conductive film 70b is formed (see FIGS. 10(B) and 20).

[0128] The insulating film 68 has a function as a planarizing insulating film. The conductive film 70a has a function as one of a pair of electrodes of the display element 14a and a function as a second pixel electrode. The conductive film 70b has a function as one of a pair of electrodes of the display element 14b and a function as a second pixel electrode. The conductive film 70a is electrically connected to the conductive film 58a and the conductive film 64a. The conductive film 70b is electrically connected to the conductive film 58d and the conductive film 64b. The conductive film 70a and the conductive film 70b having a function as a second pixel electrode preferably have any one or more selected from indium, zinc, tin, and silicon. For example, as the conductive film 70a and the conductive film 70b, a conductive film having indium, tin, and silicon can be used. In FIG. 10(B), in order to clarify the configuration below the conductive film 70a and the conductive film 70b, the hatching of the conductive film 70a and the conductive film 70b is shown transparently. <​​​​​​​​​​​​​​​​​​​​​​​​​​To illustrate this, the hatching of conductive film 70a, conductive film 70b, EL layer 76, and conductive film 78 is shown. The image is shown transparently.

[0130] Furthermore, an island-shaped structure may be provided between the insulating film 72 and the EL layer 76. It has a function to control the distance between the display element 14 and the substrate 80. In addition, the EL layer 76 emits light. It has the function of doing so. In addition, the conductive film 78 functions as the other of the pair of electrodes of the display element 14. It holds.

[0131] Next, a sealing material 82 is applied to the conductive film 78, and a substrate on which transistors, display elements, etc. are formed is formed. The board 30 and the substrate 80 are bonded together (see Figures 11(B) and 22). Note that Figure 11( In B), in order to clarify the lower structure of conductive film 70a and conductive film 70b, conductive film 7 The figure shows the hatching of 0a, conductive film 70b, EL layer 76, conductive film 78 and sealing material 82. It is showing.

[0132] Next, substrate 30 and substrate 80 are separated. In this embodiment, substrate 30 and substrate The plate 80 is separated near the interface between the conductive film 31 and the insulating film 32 (Figures 12(A) and 2) (See 3). Note that in Figure 12(A), the lower configuration of conductive film 70a and conductive film 70b is For clarity, conductive film 70a, conductive film 70b, EL layer 76, conductive film 78 and sealing material 82 The hatching is shown transparently in the illustration.

[0133] When separating the element from the interface of the conductive film 31, polarity is present at the interface between the conductive film 31 and the insulating film 32. It is preferable to add a solvent (typically water) or a nonpolar solvent. For example, the conductive film 31 By using water when separating the element from the interface, damage caused by delamination and subsequent charging can be reduced. Therefore, it is suitable.

[0134] For example, the following materials can be used as the conductive film 31. tungsten, molybdenum, titanium, tantalum, zinc, ruthenium, rhodium, paradoxical Elements selected from um, osmium, iridium, gallium, and silicon, including said elements Using an alloy material or a compound material containing the element, in a single-layer or laminated structure. This is possible. Furthermore, in the case of a silicon-containing layer, the crystal structure of the silicon-containing layer is as follows: It can be amorphous, microcrystalline, polycrystalline, or single crystal.

[0135] The conductive film 31 has a laminated structure consisting of a tungsten-containing layer and a tungsten oxide-containing layer. When forming it, a layer containing tungsten is formed, and an insulating layer formed of oxide is placed on top of it. By forming this, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating layer. The formation of this can be utilized. Alternatively, the surface of the tungsten-containing layer can be subjected to thermal oxidation treatment. , oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, or oxidizing power of ozonated water, etc. A layer containing tungsten oxide may be formed by treatment with a strong solution. Razma treatment and heat treatment can be performed using oxygen, nitrogen, nitrous oxide alone, or a combination of these gases. The process may be carried out in a gaseous atmosphere mixed with a gas. The conductive film is formed by the plasma treatment or heat treatment described above. By changing the surface state of 31, the adhesion between the conductive film 31 and the insulating film 32 that is formed later can be improved. It is possible to control it.

[0136] In this embodiment, an example of a configuration in which a conductive film 31 is provided has been given, but It is not limited to this. For example, a configuration without the conductive film 31 is also possible. In this case, the conductive film 31 An organic resin film should be formed at the location where the [unclear element] is formed. For example, the organic resin film may be: Polyimide resin films, polyamide resin films, acrylic resin films, epoxy resin films, and Examples include phenolic resin films. Note that when using polyimide resin films, photosensitive materials are used. Photosensitive and thermosetting organic resin materials are preferred. By using this material, it becomes possible to impart shape and other properties to the organic resin material.

[0137] Furthermore, when the above organic resin film is used instead of the conductive film 31, the element formed on the substrate 30 As a method for separating the offspring, a laser beam (for example, with a wavelength of 308 nm) is applied from the lower side of the substrate 30. (Examples include Kishima lasers and UV lasers with a wavelength of 355nm, which are the third harmonic of YAG lasers.) By irradiating, the above organic resin film becomes weakened, affecting the interface between the substrate 30 and the organic resin film, and the organic resin film It can be separated either inside the film or at the interface between the organic resin film and the insulating film 32.

[0138] When irradiating with the above laser light, the irradiation energy density of the laser light can be adjusted to control the substrate. After creating regions with high adhesion and regions with low adhesion between 30 and the insulating film 32 The material may be peeled off. Furthermore, a linear laser may be used as the laser beam.

[0139] Next, the insulating film 32 and insulating film 34 formed below the substrate 80 are removed, and the conductive film 36 and Then expose the back surface of the conductive film 38 (see Figures 12(B) and 24). Note that Figure 12(B) In order to clarify the lower structure of conductive film 70a and conductive film 70b, conductive film 70a The diagram shows the hatching of the conductive film 70b, EL layer 76, conductive film 78, and sealing material 82. It is.

[0140] Methods for removing insulating film 32 and insulating film 34 include dry etching and wet etching. Either one or both of the ching methods can be used.

[0141] Next, an orientation film 98 is formed in contact with the conductive film 36 and the conductive film 38. After that, the conductive film 92 And prepare a substrate 90 on which the alignment film 94 is formed, and the side of the substrate 80 on which the alignment film 98 is formed By filling the liquid crystal layer 96 between the side of the substrate 90 on which the alignment film 94 is formed, as shown in Figure 4 and A display device 500 having the pixels 10 shown in Figure 5 can be manufactured.

[0142] <1-10. Components of a display device> Next, the method for manufacturing the display device 500 and the display device 500 illustrated in Figures 1 to 24 will be described. The following is an explanation of each component.

[0143] [substrate] Substrates 30, 80, and 90 are made of materials with sufficient heat resistance to withstand heat treatment during the manufacturing process. You can use the fee.

[0144] Specifically, alkali-free glass, soda-lime glass, alkali glass, crystal glass Materials such as quartz or sapphire can be used. Inorganic insulating films may also be used. Examples of such inorganic insulating films include silicon oxide films, silicon nitride films, and silicon oxide nitride. Examples include films, aluminum oxide films, and the like.

[0145] Furthermore, the alkali-free glass mentioned above has a thickness of, for example, 0.2 mm to 0.7 mm. This would be appropriate. Alternatively, the above thickness can be achieved by polishing alkali-free glass.

[0146] Furthermore, as alkali-free glass, the 6th generation (1500mm x 1850mm) and the 7th generation... (1870mm x 2200mm), 8th generation (2200mm x 2400mm), 9th generation Areas such as (2400mm x 2800mm), 10th generation (2950mm x 3400mm), etc. This allows for the use of large glass substrates, enabling the fabrication of large display devices. It is possible.

[0147] Furthermore, the substrates 30, 80, and 90 are single-crystal semiconductor groups made of silicon or silicon carbide. Using plates, polycrystalline semiconductor substrates, compound semiconductor substrates such as silicon germanium, SOI substrates, etc. It's okay to be there.

[0148] In addition, inorganic materials such as metals may be used as substrates 30, 80, and 90. Examples of materials include stainless steel or aluminum.

[0149] Furthermore, the substrates 30, 80, and 90 are organic materials such as resin, resin film, or plastic. Materials may be used. Examples of such resin films include polyester, polyolefin, and poly Amides (nylon, aramid, etc.), polyimides, polycarbonates, polyurethanes, acrylics Lyl resin, epoxy resin, polyethylene terephthalate (PET), polyethylene naphtha A phosphate (PEN), polyethersulfone (PES), or siloxane bonded Examples include resins, etc.

[0150] Furthermore, composite materials combining inorganic and organic materials are used as substrates 30, 80, and 90. It may be used. The composite material may consist of a metal plate or a thin glass plate and a resin film. Materials bonded together, fibrous metal, particulate metal, fibrous glass, or particulate A material in which glass is dispersed in a resin film, or a fibrous resin, or a particulate resin, as an inorganic material. Examples include materials dispersed in various ways.

[0151] Furthermore, the substrates 30, 80, and 90 include at least a film or layer formed above or below them. Any material that can support it is acceptable, and one or more of the following can be used: insulating film, semiconductor film, or conductive film. It's okay to have it.

[0152] [Conductive film] Conductive film 31, 36, 38, 42, 46a, 46b, 46c, 52a, 52b, 52c, As 52d, 52e, 58a, 58b, 64a, 64b, 70a, 70b, 78, 92 This includes conductive metal films, conductive films that reflect visible light, or films that transmit visible light. A conductive film having the function of doing so can be used.

[0153] Examples of conductive metal films include aluminum, gold, platinum, silver, copper, chromium, and tantalum. Titanium, molybdenum, tungsten, nickel, iron, cobalt, palladium, or manganese Materials containing metal elements selected from the above can be used. Alternatively, the above metal elements can be used. Alloys containing these alloys may also be used.

[0154] Specifically, the conductive metal film mentioned above is a two-layer structure in which a copper film is laminated on a titanium film. Two-layer structure with a copper film laminated on a titanium nitride film, and two-layer structure with a copper film laminated on a tantalum nitride film. The structure uses a three-layer structure in which a copper film is laminated on a titanium film, and then another titanium film is formed on top of that. This is sufficient. In particular, by using a conductive film containing copper, the resistance can be lowered. Suitable. Also suitable as a conductive film containing copper elements, or an alloy film containing copper and manganese. The alloy film is suitable because it can be processed using a wet etching method. .

[0155] Furthermore, as the conductive metal film mentioned above, a conductive polymer or conductive polymer can be used. That's fine.

[0156] Furthermore, the conductive film having the function of reflecting visible light as described above may be gold, silver, copper, or paraben. Materials containing metallic elements selected from zinc can be used. In particular, conductive materials containing silver can be used. Using a film is preferable because it can increase the reflectivity in visible light.

[0157] Furthermore, the conductive films having the function of transmitting visible light as described above include indium, tin, zinc, Materials containing gallium or elements selected from silicon can be used. Specifically These include In oxide, Zn oxide, In-Sn oxide (also called ITO), and In-Sn-Si Examples include oxides (also called ITSO), In-Zn oxide, In-Ga-Zn oxide, etc. ru.

[0158] Furthermore, the conductive film having the function of transmitting visible light as described above is graphene or graph A film containing a phytomethic acid may also be used. Examples of films containing graphene include films containing graphene oxide. By forming a film containing graphene oxide and reducing the film containing graphene oxide, a film containing graphene is formed. It is possible to reduce it. Methods of reduction include applying heat and using reducing agents. It is possible.

[0159] Also, conductive films 31, 36, 38, 42, 46a, 46b, 46c, 52a, 52b, 5 2c, 52d, 52e, 58a, 58b, 64a, 64b, 70a, 70b, 78, 92 This can be formed by electroless plating. Examples of materials include Cu, Ni, Al, Au, Sn, Co, Ag, and Pd. It is possible to use one or more of the selected options. In particular, using Cu or Ag Having this feature is preferable because it can lower the resistance of the conductive film.

[0160] Furthermore, when a conductive film is formed by electroless plating, the constituent elements of the conductive film may spread to the outside. To prevent diffusion, a diffusion-preventing film may be formed beneath the conductive film. A seed film on which a conductive film can be grown may be formed between the film and the conductive film. The above-mentioned diffusion prevention film can be formed, for example, using a sputtering method. Furthermore, as the diffusion prevention film, for example, a tantalum nitride film or a titanium nitride film may be used. This can be done. Furthermore, the above seed film can be formed by electroless plating. Furthermore, the seed film can be a conductive film material that can be formed by electroless plating. The same materials as those used for the ingredients can be used.

[0161] Furthermore, the conductive film having the function of reflecting visible light and the conductive film having the function of transmitting visible light By combining it with a conductive film, a conductive film having the function of reflecting and transmitting visible light is formed. This is also acceptable. For example, one of the pair of electrodes of the display element 14 may have the function of reflecting visible light. One conductive film is used, and the other is a conductive film having the function of reflecting and transmitting visible light. This configuration allows for the use of the resonance effect of light between a pair of electrodes to achieve minute optical resonance. Because it forms a vibrator (microcavity) structure, it increases the light intensity at a specific wavelength. It is possible.

[0162] Furthermore, the other of the pair of electrodes that the display element 14 has (for example, conductive film 70a, conductive film 70b) This can be a laminated structure of In-Sn-Si oxide and an alloy containing silver. As for the alloys to be included, thin films (for example, 50 nm or less, and even better) are used to transmit visible light. (The wavelength should be 30nm or less.)

[0163] [Insulated film] As insulating films 32, 34, 40, 44, 48, 54, 62, 68, and 72, they are non-insulating. Equipment materials, insulating organic materials, or insulating materials including insulating inorganic materials and insulating organic materials Composite materials can be used.

[0164] The aforementioned insulating inorganic materials include silicon oxide films, silicon nitride films, and silicon oxide nitride films. Examples include silicon nitride film, silicon oxide film, aluminum oxide film, etc. Also, the above-mentioned inorganic materials Multiple stacks may be made.

[0165] Furthermore, examples of the insulating organic materials mentioned above include polyester, polyolefin, and poly Aramid (nylon, aramid, etc.), polyimide, polycarbonate, polyurethane, Examples include materials containing acrylic resins, epoxy resins, or resins with siloxane bonds. Furthermore, a photosensitive material may be used as the insulating organic material mentioned above.

[0166] [Oxide semiconductor film] The oxide semiconductor films 50a, 50b, 56a, and 56b are made of In-M-Zn oxide (where M is Al). It is formed from oxides such as Ga, Y, or Sn. Also, oxide semiconductor films 50a, 50 In-Ga oxide and In-Zn oxide may be used for b, 56a, and 56b. Oxide semiconductor films that can be used for oxide semiconductor films 50a, 50b, 56a, and 56b This will be explained in detail in Embodiment 3.

[0167] [Liquid crystal layer] The liquid crystal layer 96 can be a thermotropic liquid crystal, a low molecular weight liquid crystal, a polymer liquid crystal, or a polymer dispersed liquid crystal. Examples include liquid crystals, ferroelectric liquid crystals, and antiferroelectric liquid crystals. Alternatively, cholesteric phase, sme Using liquid crystal materials exhibiting the kuttic phase, cubic phase, chiral nematic phase, isotropic phase, etc. Alternatively, a liquid crystal material exhibiting a blue phase may be used.

[0168] Furthermore, the driving method for the liquid crystal layer 96 is IPS (In-Plane-Switching). g) mode, TN (Twisted Nematic) mode, FFS (Fringe Field Switching) mode, ASM (Axially Symmetri) mode c ) Micro-cell) mode, OCB (Optically C Compensated Birefringence) mode, FLC (Ferroel etric Liquid Crystal) mode, AFLC (AntiFerro Examples include the electric liquid crystal mode. Direct orientation (VA) mode, specifically MVA (Multi-Domain Vertical) al Alignment) mode, PVA(Patterned Vertical) mode Alignment) mode, ECB (Electrically Controlled) mode d Birefringence) mode, CPA (Continuous Pinwh eel Alignment) mode, ASV (Advanced Super-Vie A driving method such as w) mode may also be used.

[0169] [EL layer] The EL layer 76 has at least a light-emitting material. The light-emitting material is an organic compound Examples include materials or inorganic compounds such as quantum dots. This specification includes such light-emitting materials. The luminescent layer is also called the light-emitting layer.

[0170] Examples of the above-mentioned organic and inorganic compounds include those produced by vapor deposition (including vacuum deposition), It can be formed using methods such as inkjet printing, coating, and gravure printing.

[0171] Examples of materials that can be used with organic compounds include fluorescent materials or phosphorescent materials. From the perspective of lifespan, fluorescent materials should be used, and from the perspective of efficiency, phosphorescent materials should be used. Alternatively, the configuration may include both a fluorescent material and a phosphorescent material.

[0172] Furthermore, quantum dots are semiconductor nanocrystals with a size of several nanometers, and 1 × 10⁻¹⁶ 3 From individual to 1 x 1 0 6 It is composed of approximately 100 atoms. Quantum dots exhibit energy shifts depending on their size. Therefore, even quantum dots composed of the same material will emit different wavelengths depending on their size. Furthermore, the emission wavelength can be easily adjusted by changing the size of the quantum dots used. It is possible.

[0173] Furthermore, quantum dots have a narrow peak width in their emission spectrum, resulting in emission with good color purity. It is possible. Furthermore, the theoretical internal quantum efficiency of quantum dots is said to be almost 100%. It accounts for a significant portion of the 25% of organic compounds that exhibit fluorescence, and the proportion of organic compounds that exhibit phosphorescence is much higher than that of organic compounds that exhibit phosphorescence. It is equivalent to a compound. Therefore, by using quantum dots as a light-emitting material... This allows for the creation of light-emitting elements with high luminescence efficiency. Moreover, quantum dots are inorganic compounds. Because it also has excellent inherent stability, it is desirable to obtain a light-emitting element from the perspective of lifespan. It is possible.

[0174] The materials that make up quantum dots include elements from Group 14 of the periodic table, elements from Group 15 of the periodic table, and periodic Group 16 elements of the periodic table, compounds consisting of multiple Group 14 elements of the periodic table, and elements from Group 4 to Group 16 of the periodic table. Compounds of elements belonging to Group 14 and elements of Group 16 of the periodic table, and compounds of elements belonging to Group 2 and Group 16 of the periodic table Compounds with group elements, compounds of group 13 elements and group 15 elements of the periodic table, group 13 Compounds of group elements and group 17 elements of the periodic table, and compounds of group 14 elements and group 15 elements of the periodic table Compounds, compounds of Group 11 and Group 17 elements of the periodic table, iron oxides, titanium oxides Examples include chalcogenide spinels and various semiconductor clusters.

[0175] Specifically, cadmium selenide, cadmium sulfide, cadmium telluride, and selenium sulfide. Lead, zinc oxide, zinc sulfide, zinc telluride, mercury sulfide, mercury selenide, mercury telluride, arsenic Indium, indium phosphide, gallium arsenide, gallium phosphide, indium nitride, nitride Gallium, indium antimonide, gallium antimonide, aluminum phosphide, arsenide Aluminum, aluminum antimonide, lead selenide, lead telluride, lead sulfide, selenide Indium, indium telluride, indium sulfide, gallium selenide, arsenic sulfide, sele Arsenic arsenide, arsenic telluride, antimony sulfide, antimony selenide, antimony telluride, Bismuth sulfide, bismuth selenide, bismuth telluride, silicon, silicon carbide, germanium M, tin, selenium, tellurium, boron, carbon, phosphorus, boron nitride, boron phosphide, boron arsenide Aluminum nitride, aluminum sulfide, barium sulfide, barium selenide, barium telluride Beryllium, calcium sulfide, calcium selenide, calcium telluride, beryllium sulfide, Beryllium selenide, beryllium telluride, magnesium sulfide, magnesium selenide, Germanium sulfide, germanium selenide, germanium telluride, tin sulfide, tin selenide tin telluride, lead oxide, copper fluoride, copper chloride, copper bromide, copper iodide, copper oxide, copper selenide, acid Nickel oxide, cobalt oxide, cobalt sulfide, triiron tetroxide, iron sulfide, manganese oxide, molar sulfide Ribdenum, vanadium oxide, tungsten oxide, tantalum oxide, titanium oxide, zirconium oxide Aluminum, silicon nitride, germanium nitride, aluminum oxide, barium titanate, selenium Compounds of zinc and cadmium, compounds of indium, arsenic and phosphorus, cadmium and selenium Sulfur compounds, cadmium and selenium and tellurium compounds, indium and gallium and arsenic compounds Compounds, compounds of indium, gallium, and selenium, compounds of indium, selenium, and sulfur, copper Examples include compounds of indium and sulfur, and combinations thereof, but these It is not limited to this. Also, so-called alloy-type quantum particles, whose composition can be expressed in any ratio. You may also use dots. For example, a quantum dot of cadmium, selenium, and sulfur is an alloy of elements. By changing the content ratio, the emission wavelength can be changed, so to obtain blue emission, It is one effective method.

[0176] Quantum dot structures include core type, core-shell type, and core-multishell type. Either of these can be used, but another inorganic ion with a wider band gap can be used to cover the core. By forming a shell with the material, defects and dangling bones present on the nanocrystalline surface can be eliminated. The effects of the luminescence can be reduced. This greatly improves the quantum efficiency of the luminescence. It is preferable to use A-shell type or core-multi-shell type quantum dots. Examples of materials include zinc sulfide and zinc oxide.

[0177] Furthermore, because quantum dots have a high proportion of surface atoms, they are highly reactive and prone to aggregation. Therefore, a protective agent is attached to the surface of the quantum dot or a protective group is provided. It is preferable that the protective agent is attached or a protective group is provided. This prevents aggregation and increases solubility in the solvent. Furthermore, it reduces reactivity and electrical... It is also possible to improve stability. Examples of protective agents (or protective groups) include polio Polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene Polyoxyethylene alkyl ethers such as ethylene oleyl ether, tripropyl phosphate Fins, tributylphosphine, trihexylphosphine, trioctylphosphine, etc. Trialkylphosphines, polyoxyethylene n-octylphenyl ether, polio Polyoxyethylene alkylphenyl ethers such as xyethylene n-nonylphenyl ether Tel compounds, tri(n-hexyl)amines, tri(n-octyl)amines, tri(n-decyl) ) Tertiary amines such as amines, tripropylphosphine oxide, tributylphosphine Oxide, trihexylphosphine oxide, trioctylphosphine oxide, tridec Organophosphorus compounds such as sylphosphine oxide, polyethylene glycol dilaurate, Polyethylene glycol diesters such as polyethylene glycol distearate, and Organic nitrogen compounds such as nitrogen-containing aromatic compounds like pyridine, lutidine, colidine, and quinolines. , hexylamine, octylamine, decylamine, dodecylamine, tetradecylamine aminoalkanes such as hexadecylamine and octadecylamine, and dibutyl sulfide Dialkyl sulfides such as dipropyl sulfate, dipropyl sulfate such as dimethyl sulfoxide and dibutyl sulfoxide Organic sulfur compounds such as sulfur-containing aromatic compounds including sulfur sulfoxides and thiophenes, palmite Higher fatty acids such as tinic acid, stearic acid, and oleic acid, alcohols, and sorbitan fatty acid Polyesters, fatty acid-modified polyesters, tertiary amine-modified polyurethanes, polyethylene Examples include mines, etc.

[0178] Quantum dots have a larger band gap as their size decreases, so they can produce the desired wave. The size is adjusted appropriately to obtain sufficient light. As the crystal size decreases, Because the light emitted by quantum dots shifts towards the blue side, that is, towards the higher energy side, quantum dots By changing the size, the wavelength range of the spectrum in the ultraviolet, visible, and infrared regions can be changed. The emission wavelength can be adjusted across a wide range. The size (diameter) of the quantum dot is 0 A range of 0.5 nm to 20 nm, preferably 1 nm to 10 nm, is commonly used. Furthermore, the narrower the size distribution of quantum dots, the more the emission spectrum becomes narrower, and the color High-purity luminescence can be obtained. Furthermore, the shape of the quantum dot is not particularly limited; spherical shapes are possible. They may be rod-shaped, disc-shaped, or in other shapes. Note that a rod-shaped quantum dot is a quantum rod Since the rod exhibits directional light polarized in the c-axis direction, a quantum rod is used as a light-emitting material. By doing so, it is possible to obtain a light-emitting element with better external quantum efficiency.

[0179] Furthermore, in many cases, EL elements achieve light emission by dispersing the light-emitting material in the host material. While the rate increases, the host material requires a singlet or triplet excitation energy higher than that of the luminescent material. It is necessary that the material contains ghee. This is especially true when using blue phosphorescent materials. A material having a triplet excitation energy greater than or equal to that, and which is excellent in terms of lifetime. The development of quantum dot materials is extremely difficult. On the other hand, quantum dots do not use host materials. Even if the light-emitting layer is composed solely of luminescence, the luminous efficiency can be maintained, and in this respect, it also has a longer lifespan. A desirable light-emitting element can be obtained from a point. When forming the light-emitting layer using only quantum dots. Quantum dots are preferred to have a core-shell structure (including core-multi-shell structures). It's nice.

[0180] [Orientation layer] As the alignment films 94 and 98, materials containing polyimide resin or the like can be used. If the material containing polyimide resin, etc., is oriented in a predetermined direction, it is subjected to rubbing or light treatment. Orientation processing should be performed.

[0181] [Colored film] The colored film 69 has the function of a so-called color filter. The colored film 69 is a predetermined Materials that transmit light of a certain color (for example, materials that transmit blue light, materials that transmit green light, (For example, materials that transmit red light, materials that transmit yellow light, or materials that transmit white light.) You can use it.

[0182] [Structure] The structure includes organic materials, inorganic materials, or composite materials of organic and inorganic materials. An insulating material can be used. The insulating material may include insulating films 32, 34, and 40. The materials listed in 44, 48, 54, 62, 68, and 72 can be used.

[0183] [Sealing material] The sealing material 82 may be an inorganic material, an organic material, or a composite material of an inorganic material and an organic material, etc. The following can be used: Examples of the above-mentioned organic materials include heat-meltable resins or thermosetting resins. Examples include organic materials containing resins. Furthermore, the sealing material 82 may include adhesives containing resin materials. Using an adhesive (such as a reaction-curing adhesive, a photocuring adhesive, a thermosetting adhesive, or an anaerobic adhesive) These are also good. Furthermore, the resin materials mentioned above include epoxy resins, acrylic resins, and silicone resins. Polyvinyl chloride resins, phenolic resins, polyimide resins, imide resins, PVC (polyvinyl chloride) PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins Examples include (artificial) resins.

[0184] Furthermore, although not explicitly shown in Figures 1 to 24, the display device 500 has the following components: It's okay to be there.

[0185] [Functional membrane] The display device 500 has a functional film in contact with either or both of the substrates 80 and 90. They may have. The functional film may be a polarizing plate, a phase difference plate, a diffusion film, or an anti-reflective film. A film or light-collecting film can be used. In addition, a functional film can be used to prevent dust from adhering. It has an antistatic coating to suppress static electricity, a water-repellent coating to make it difficult for dirt to adhere, and it suppresses the occurrence of scratches that occur with use. A hard coat film or the like can be used.

[0186] [Light-blocking film] The display device 500 may have a light-shielding film between adjacent pixels that suppresses light transmission. Examples of materials for the light-shielding film include metal materials or organic resin materials containing black pigment. It can be done.

[0187] Thus, in a display device according to one aspect of the present invention, the first to third display elements Each child can be controlled independently using different transistors. Therefore, the table This enables the provision of a display device with high display quality.

[0188] The configuration shown in this embodiment may be used in appropriate combination with the configurations shown in other embodiments. It is possible.

[0189] (Embodiment 2) In this embodiment, the configuration involves attaching an input device to a display device according to one aspect of the present invention. Next, we will explain using Figures 25 to 28.

[0190] <2-1. Explanation of Input Devices> In this embodiment, the touch panel combines the display device 500 and the input device. Let's explain 2000. Also, as an example of an input device, let's consider the case where a touch sensor is used. I will explain about that.

[0191] Figures 25(A) and 25(B) are perspective views of the touch panel 2000. In Figures 5(A) and 25(B), for clarity, a typical configuration of the touch panel 2000 is shown. Shows the constituent elements.

[0192] The touch panel 2000 has a display device 500 and a touch sensor 2595 (Figure 25). (See (A) and Figure 25(B)). Also, the touch panel 2000 consists of circuit board 80, circuit board 90, and has a substrate 2590.

[0193] The display device 500 can have multiple pixels on the substrate 80 and can supply signals to those pixels. It has multiple wires 2511. The multiple wires 2511 are routed to the outer periphery of the substrate 80. A portion of it constitutes terminal 2519. Terminal 2519 is connected to FPC2509(1) and Connect electrically.

[0194] The circuit board 2590 has a touch sensor 2595 and is electrically connected to the touch sensor 2595. It has multiple wires 2598. The multiple wires 2598 are routed around the outer periphery of the substrate 2590. A portion of it forms a terminal. This terminal is electrically connected to FPC2509(2). The process continues. Note that in Figure 25(B), for clarity, the back side of substrate 2590 (opposite substrate 80) is shown. The electrodes and wiring of the touch sensor 2595, which is provided on the facing side, are shown by solid lines.

[0195] For example, a capacitive touch sensor can be used as the touch sensor 2595. Capacitive capacitance methods include surface capacitance and projected capacitance.

[0196] Projected capacitance systems are classified into self-capacitance and mutual-capacitance types, mainly based on differences in their driving methods. There are such methods. Using a mutual capacitance method is preferable because it enables simultaneous multi-point detection. See Figure 2. The touch sensor 2595 shown in 5(B) is a projected capacitive touch sensor. It is structured.

[0197] Furthermore, the touch sensor 2595 can detect the proximity or contact of an object to be detected, such as a finger. Yes, various sensors can be applied.

[0198] The projected capacitive touch sensor 2595 has electrodes 2591 and 2592. Electrode 2591 is electrically connected to one of the multiple wires 2598, and electrode 2592 It electrically connects to any of the other wires 2598.

[0199] As shown in Figures 25(A) and 25(B), the electrodes 2592 are repeatedly arranged in one direction. It has a shape in which multiple quadrilaterals are connected at their corners.

[0200] Electrode 2591 is quadrilateral and repeats in a direction intersecting the direction in which electrode 2592 extends. It is positioned.

[0201] Wiring 2594 is electrically connected to the two electrodes 2591 that sandwich electrode 2592. A shape that minimizes the area of ​​the intersection between electrode 2592 and wiring 2594 is preferable. This reduces the area where electrodes are not provided, thereby reducing variations in transmittance. Yes, it is possible. As a result, it reduces the variation in brightness of the light transmitted through the touch sensor 2595. It is possible.

[0202] Note that the shapes of electrodes 2591 and 2592 are not limited to these and can take on various shapes. For example, multiple electrodes 2591 are arranged so that there are as few gaps as possible, and an insulating layer is used. Multiple electrodes 2592 are provided spaced apart so that there is a region that does not overlap with electrode 2591. This configuration may also be used. In this case, between the two adjacent electrodes 2592, there is an electrical connection between them. Providing an insulated dummy electrode is preferable because it reduces the area of ​​regions with different transmittances. .

[0203] Note that conductive films such as electrode 2591, electrode 2592, and wiring 2598, i.e., touch panel Materials that can be used for wiring and electrodes that make up the circuit include indium oxide, tin oxide, and acid Examples include transparent conductive films containing zinc oxide (e.g., ITO). Also, touch panels. For example, materials that can be used for the wiring and electrodes that make up the system are preferred if they have a low resistance value. For example, silver, copper, aluminum, carbon nanotubes, graphene, and halogens. Metal halides (such as silver halides) may also be used. Furthermore, extremely thin (for example, Even when using metal nanowires composed of multiple conductors (with a diameter of several nanometers), That's fine. Alternatively, a metal mesh made of conductive material in a network structure may be used. For example, Ag Nanowires, Cu nanowires, Al nanowires, Ag mesh, Cu mesh, Al mesh You may also use materials such as scouring pads. For example, Ag nanowires can be used for the wiring and electrodes that make up a touch panel. When using this, the transmittance in visible light must be 89% or higher, and the sheet resistance must be 40Ω / □ or higher. It can be set to 0Ω / □ or less. Also, the wiring and electrodes that make up the touch panel as described above Examples of materials that can be used include metal nanowires, metal meshes, and carbon nanochips. Tubes, graphene, etc., have high transmittance in visible light, so they are used as electrodes in display elements. For example, it may be used as a pixel electrode or a common electrode.

[0204] <2-2. Explanation of Touch Sensors> Next, we will explain the details of the touch sensor 2595 using Figure 26. Figure 26 is a diagram. This corresponds to the cross-sectional view between the dashed line X1 and X2 shown in 25(B).

[0205] The touch sensor 2595 has electrodes 2591 and electrodes arranged in a staggered pattern on the substrate 2590. 2592, an insulating layer 2593 covering electrodes 2591 and 2592, and adjacent electrodes 25 It has wiring 2594 that electrically connects 91.

[0206] Electrodes 2591 and 2592 are formed using a light-transmitting conductive material. Conductive materials having this property include indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium can be used. Furthermore, a film containing graphene can also be used. A film containing graphene can, for example, oxidize. A film containing graphene can be formed by reduction. One method of reduction involves applying heat. Methods such as the following can be listed.

[0207] For example, a light-transmitting conductive material is deposited on a substrate 2590 by sputtering. Afterwards, various patterning techniques such as photolithography are used to remove unwanted parts. Electrodes 2591 and 2592 can be formed.

[0208] Furthermore, materials used for the insulating layer 2593 include, for example, acrylic resins and epoxy resins. Resin materials containing lipids or siloxane bonds, or silicon oxide, silicon oxide and nitride. Inorganic insulating materials such as aluminum oxide can be used.

[0209] Furthermore, an opening reaching the electrode 2591 is provided in the insulating layer 2593, and the wiring 2594 is adjacent to it. It is electrically connected to electrode 2591. The light-transmitting conductive material increases the aperture ratio of the touch panel. Because it can be done this way, it can be suitably used in wiring 2594. Also, electrode 2591 Furthermore, materials with higher conductivity than electrode 2592 are preferable for wiring 2594 because they can reduce electrical resistance. It can be used appropriately.

[0210] The electrode 2592 extends in one direction, and multiple electrodes 2592 are arranged in a stripe pattern. Furthermore, the wiring 2594 is provided intersecting with the electrode 2592.

[0211] A pair of electrodes 2591 are provided flanking one electrode 2592. Also, the wiring 2594 is A pair of electrodes 2591 are electrically connected.

[0212] Note that the multiple electrodes 2591 are not necessarily arranged in a direction perpendicular to that of a single electrode 2592. It is not necessary to do so; they may be positioned to form an angle greater than 0 degrees but less than 90 degrees.

[0213] Furthermore, wiring 2598 is electrically connected to electrode 2591 or electrode 2592. A portion of the wiring 2598 functions as a terminal. Wiring 2598 can be, for example, made of aluminum. Nium, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, corn Using metallic materials such as balsamic, copper, or palladium, or alloy materials containing such metallic materials. It is possible.

[0214] Furthermore, an insulating layer is provided to cover the insulating layer 2593 and the wiring 2594, and the touch sensor 2595 It may be protected.

[0215] Furthermore, the connecting layer 2599 electrically connects the wiring 2598 and the FPC2509(2). .

[0216] The connecting layer 2599 is an anisotropic conductive film (ACF: Anisotropic C (conductive film) or anisotropic conductive paste (ACP: Anisotropic) You can use tools such as IC Conductive Paste.

[0217] <2-3. Explanation regarding the touch panel> Next, we will explain the details of the touch panel 2000 using Figure 27. Figure 27 is a diagram. This corresponds to the cross-sectional view between the dashed line X3 and X4 shown in 25(A).

[0218] The touch panel 2000 shown in Figure 27 is a display having pixels 10 as described in Figures 4 and 5. The device 500 and the touch sensor 2595, as described in Figure 26, are bonded together.

[0219] Furthermore, the touch panel 2000 shown in Figure 27 has the pixels 10 described in Figures 4 and 5. In addition to the display device 500 and the touch sensor 2595 described in Figure 26, there is also an adhesive layer 2597 and It has an anti-reflective layer 2569.

[0220] The adhesive layer 2597 is provided in contact with the wiring 2594. The substrate 2590 is attached to the substrate 90 so that the sensor 2595 overlaps the display device 500. Furthermore, it is preferable that the adhesive layer 2597 is translucent. For example, thermosetting resins or UV-curing resins can be used. You can use urethane resins, epoxy resins, or siloxane resins. Cut.

[0221] The anti-reflective layer 2569 is provided in a position that overlaps with the pixel 10. For example, a circular polarizer can be used.

[0222] Furthermore, the Touch Panel 2000 is a so-called out-cell type touch panel. However, One aspect of the invention is not limited to the above configuration, and includes an in-cell type touch panel or an on-cell type touch panel. It can also be used as a touch panel.

[0223] <2-4. Explanation of the touch panel's operating method> Next, an example of a touch panel driving method will be explained using Figure 28.

[0224] Figure 28(A) is a block diagram showing the configuration of a mutual capacitive touch sensor. Figure A shows the pulse voltage output circuit 2601 and the current detection circuit 2602. In 28(A), the electrodes 2621 to which the pulse voltage is applied are X1-X6, and the change in current is measured. The electrodes 2622 that detect the signal are designated as Y1-Y6, and each is illustrated with six wires. Figure 28(A) shows the capacitance formed by the superposition of electrode 2621 and electrode 2622. This indicates 603. Note that electrodes 2621 and 2622 have interchangeable functions. That's fine.

[0225] The pulse voltage output circuit 2601 is for sequentially applying pulse voltages to the X1-X6 wiring. This is a circuit. When a pulse voltage is applied to the wiring X1-X6, capacitance 2603 is formed. An electric field is generated between electrode 2621 and electrode 2622. This electric field generated between electrodes is shielded, etc. By causing a change in the mutual capacitance of the 2603 capacity, the proximity of the detected object, and It can detect contact.

[0226] The current detection circuit 2602 detects changes in the mutual capacitance of capacitor 2603, and the wiring of Y1-Y6 This is a circuit for detecting changes in current. In the wiring of Y1-Y6, proximity of the object to be detected, Alternatively, if there is no contact, the detected current value will not change, but if the object being detected is nearby, When the mutual capacitance decreases due to contact, a change in the current value is detected. Output can be performed using an integrating circuit or similar.

[0227] Next, Figure 28(B) shows the input of the mutual capacitive touch sensor shown in Figure 28(A). The timing chart of the output waveform is shown. Figure 28(B) shows the timing of each matrix in one frame period. The system will detect the object to be detected. Also, in Figure 28(B), the case where the object to be detected is not detected ( This shows two cases: one where the object to be detected is not touched, and another where the object to be detected is touched. Regarding the wiring of Y1-Y6, the waveforms shown represent the voltage values ​​corresponding to the detected current values. Yes, they are.

[0228] A pulse voltage is applied sequentially to the wiring of X1-X6, and Y1- The waveform changes in the Y6 wiring. If there is no proximity or contact with the detected object, X1-X6 The waveforms of Y1-Y6 change uniformly in response to changes in the voltage of the wiring. Meanwhile, when the object to be detected is nearby... Alternatively, at the point of contact, the current value decreases, and therefore the waveform of the corresponding voltage value also changes. ru.

[0229] In this way, by detecting changes in mutual capacitance, the proximity or contact of the object being detected can be detected. It is possible.

[0230] The configuration shown in this embodiment may be used in appropriate combination with the configurations shown in other embodiments. It is possible.

[0231] (Embodiment 3) In this embodiment, the oxide semiconductor film of the transistor disclosed in one aspect of the present invention This section will explain the metal oxides that can be used for this purpose.

[0232] <3-1. Metal Oxides>

[0233] In this specification and elsewhere, "metal oxide" refers to a metal in a broad sense. It is an oxide. Metal oxides are oxide insulators and oxide conductors (including transparent oxide conductors). ), oxide semiconductor (also called Oxide Semiconductor or simply OS) They are classified into categories such as the following. For example, when a metal oxide is used in the active layer of a transistor, the metal Oxides are sometimes referred to as oxide semiconductors. In other words, metal oxides have amplification and rectification effects. , and if it has at least one switching action, the metal oxide is a metal oxide Semiconductors (metal oxide semiconductors), abbreviated as OS This is possible. Also, when referring to OS FET, it means metal oxide or oxide semiconductor. It can be rephrased as a transistor having a conductor.

[0234] Furthermore, in this specification, metal oxides containing nitrogen are also referred to as metal oxides (metal oxides). They are sometimes collectively referred to as metal oxynitrides (metal oxides). Also, metal oxides containing nitrogen are sometimes called metal oxynitrides (metal oxides). It may also be called tal oxynitride.

[0235] Furthermore, in this specification, etc., CAAC (c-axis aligned crystal l) and when referring to CAC (Cloud-Aligned Composite) There is. Note that CAAC represents one example of a crystal structure, and CAC represents one of the functions or components of the material. This illustrates an example.

[0236] Furthermore, in this specification, CAC-OS or CAC-metal oxide is defined as follows: In part of the material, it has conductive properties, and in part of the material, it has insulating properties, and the whole material It has semiconductor properties. Note that CAC-OS or CAC-metal oxi When de is used in the active layer of a transistor, its conductive function is to provide electron carriers (ma The function of a hole is to allow electrons to flow, while the insulating function is to prevent the flow of electrons, which act as carriers. Yes, it exists. By making the conductive and insulating functions work complementaryly, the switch The switching function (the function to turn it on / off) is CAC-OS or CAC-metal It can be applied to oxides. CAC-OS or CAC-metal oxi In de, separating each function maximizes the potential of both. can.

[0237] Furthermore, in this specification, CAC-OS or CAC-metal oxide is defined as follows: It has a conductive region and an insulating region. The conductive region has the conductive function described above, and the insulating region... The conductive region has the insulating function described above. Furthermore, within the material, the conductive region and the insulating region These regions may be separated at the nanoparticle level. Furthermore, there are conductive regions and insulating regions. These can be unevenly distributed within the material. Also, the conductive region may appear blurred around the edges. They may sometimes be observed connected in a do-like pattern.

[0238] Furthermore, in CAC-OS or CAC-metal oxide, the conductive region and The insulating region is defined as 0.5 nm to 10 nm, preferably 0.5 nm to 3 nm. They may be dispersed in the material in sizes smaller than m.

[0239] Furthermore, CAC-OS or CAC-metal oxide have different band gaps. It is composed of components having [a certain characteristic]. For example, CAC-OS or CAC-metal ox The ide consists of a component with a wide gap due to the insulating region and a component with a wide gap due to the conductive region. It consists of a component having a narrow gap. In this configuration, when the carrier is flowing... In components with a narrow gap, the carrier mainly flows. The component with a gap acts complementaryly with the component with a wide gap, and the component with a narrow gap In conjunction with the components that perform this action, carriers also flow to components with a wide gap. Therefore, the above CAC-OS or CAC-metal oxide in the channel formation region of the transistor When used in this way, a high current driving force, i.e., a large on-current, is required in the transistor's on state. Furthermore, high field-effect mobility can be obtained.

[0240] In other words, CAC-OS or CAC-metal oxide is a matrix composite Material (matrix composite), or metal matrix composite material (metal It can also be called a matrix composite.

[0241] The configuration shown in this embodiment may be used in appropriate combination with the configurations shown in other embodiments. It is possible.

[0242] (Embodiment 4) In this embodiment, a display module and electronic device having a display device according to one aspect of the present invention This will be explained using Figures 29 to 31.

[0243] <4-1. Display Module> The display module 8000 shown in Figure 29 consists of an upper cover 8001 and a lower cover 8002. Between them, the touch panel 8004 and FPC8005 are connected, with the FPC8003 connected to them. The display panel 8006, frame 8009, printed circuit board 8010, and battery 8011 To possess.

[0244] A display device according to one aspect of the present invention can be used, for example, as a display panel 8006.

[0245] The upper cover 8001 and the lower cover 8002 are the touch panel 8004 and the display panel. The shape and dimensions can be appropriately modified to match the size of the 8006.

[0246] The touch panel 8004 is a display panel using either a resistive or capacitive touch panel. It can be used superimposed on 8006. Also, the opposing substrate (sealing substrate) of the display panel 8006 It is also possible to give the board a touch panel function. It is also possible to install a light sensor in each pixel of 006 to create an optical touch panel.

[0247] Frame 8009 provides protection for the display panel 8006, as well as the movement of the printed circuit board 8010. It has the function of an electromagnetic shield to block electromagnetic waves generated by the operation. The 8009 may also function as a heat sink.

[0248] The printed circuit board 8010 contains power supply circuits and signals for outputting video and clock signals. It has a power processing circuit. The power supply that provides power to the power supply circuit is an external commercial power supply. Alternatively, a separate power source, the battery 8011, may also be used. This can be omitted when using commercial power.

[0249] Furthermore, the display module 8000 includes components such as polarizing plates, phase difference plates, and prism sheets. They may also be provided.

[0250] <4-2.Electronic equipment> Figures 30(A) to 30(E) and 31(A) to 31(E) show electronic equipment. This is a diagram. These electronic devices consist of a housing 9000, a display unit 9001, a camera 9002, and Speaker 9003, operation key 9005 (including power switch or operation switch), connection terminal Child 9006, Sensor 9007 (force, displacement, position, velocity, acceleration, angular velocity, rotational speed, distance, Light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, electric current, voltage, power, radiation, (Including functions for measuring flow rate, humidity, gradient, vibration, odor, or infrared radiation), Microphone It has n9008, etc.

[0251] The electronic devices shown in Figures 30(A) to 30(E) and Figures 31(A) to 31(E) are It can have various functions. For example, various types of information (still images, videos, text images). Functions that display (etc.) on the display unit, touch panel function, calendar, date or time, etc. Display function, function to control processing by various software (programs), wireless communication Communication function, function to connect to various computer networks using wireless communication, wireless communication A function that transmits or receives various types of data using communication functions, and data recorded on a recording medium. It may have functions such as reading out a program or data and displaying it on a display unit. The electronic devices shown in Figures 30(A) to 30(E) and Figures 31(A) to 31(E). The functions it possesses are not limited to these, and it may have other functions as well.

[0252] The electronic equipment shown in Figures 30(A) to 30(E) and Figures 31(A) to 31(E) Further details will be explained below.

[0253] Figure 30(A) is a perspective view showing the television equipment 9100. 100 refers to a large screen, for example, 50 inches or larger, 80 inches or larger, or 100 inches or larger. It is possible to incorporate the display unit 9001.

[0254] Figure 30(B) shows the personal digital assistant 9101, and Figure 30(C) shows the personal digital assistant 9102. Figure 30(D) shows the personal digital assistant 9103, and Figure 30(E) shows the personal digital assistant 9104, respectively. This is a perspective view.

[0255] The portable information terminal 9101 shown in Figure 30(B) is, for example, a telephone, a notebook, or an information viewing device. It has one or more functions selected from among them. Specifically, it can be used as a smartphone. This is possible. Although not shown in the diagram, the portable information terminal 9101 has a speaker 9003, Connection terminals 9006, sensors 9007, etc. may be provided. Also, the portable information terminal 9101 is Text and image information can be displayed on multiple surfaces. For example, three operation buttons 90 Display 50 (also called an operation icon or simply an icon) on one side of the display unit 9001. It is possible to also display the information 9051 shown by the dashed rectangle on another surface of the display unit 9001 (for example). It can be displayed on the side. For example, information 9051 can be displayed via email or S A display that notifies you of incoming calls from NS (Social Networking Services) or telephones, etc. Subject of emails and social media posts, sender's name, date, time, battery This includes the remaining battery level, the strength of the received signal, etc. Alternatively, at the location where information 9051 is displayed, Instead of information 9051, operation button 9050 or the like may be displayed. Also, mobile information terminal The display section 9001 of the end 9101 has a curved surface in part.

[0256] The portable information terminal 9102 shown in Figure 30(C) displays information on three or more sides of the display unit 9001. It has the function of doing so. Here, information 9052, information 9053, and information 9054 are different An example of what is displayed on the surface is shown. For example, the user of the mobile information terminal 9102 will see the chest of their clothing. With the portable information terminal 9102 stored in the pocket, its display (in this case, information 9053) This allows you to verify the following: Specifically, the phone number or name of the caller of the incoming call. It is displayed in a position that can be observed from above the mobile information terminal 9102. Without taking the 102 out of your pocket, you can check the display and decide whether or not to answer the call. Furthermore, the display unit 9001 of the portable information terminal 9102 has a curved surface in part.

[0257] The personal information terminal 9103 shown in Figure 30(D) is the same as the personal information terminals 9101 and 910 shown earlier. Unlike the previous version (2), the display unit 9001 does not have a curved surface.

[0258] Furthermore, the portable information terminal 9104 shown in Figure 30(E) has a curved display unit 9001. Furthermore, as shown in Figure 30(E), a camera 9002 is provided on the portable information terminal 9104. Features include the ability to take still images, the ability to record videos, and the ability to store the captured images on a recording medium (external or camera). It has functions such as saving to the built-in (RA) and displaying the captured image on the display unit 9001. preferable.

[0259] Figure 31(A) shows the wristwatch-type portable information terminal 9200, and Figure 31(B) shows the wristwatch-type portable information terminal These are perspective views showing the information terminal 9201.

[0260] The mobile information terminal 9200 shown in Figure 31(A) is a mobile phone, email, document viewing and editing device. Various applications such as music playback, internet communication, and computer games. This can be performed. In addition, the display unit 9001 is provided with a curved display surface. The display can be shown along the display surface. In addition, the mobile information terminal 9200 is a communication standard It is possible to perform short-range wireless communication. For example, a wireless communication headset. By communicating with each other, hands-free calls are also possible. The terminal 9200 has a connection terminal 9006 and can directly connect to other information terminals via a connector for data transfer. It is possible to exchange data. It is also possible to charge the device via the connection terminal 9006. The charging operation may also be performed by wireless power supply without using the connection terminal 9006.

[0261] Furthermore, the personal information terminal 9201 shown in Figure 31(B) is the same as the personal information terminal shown in Figure 31(A). Unlike the 9200, the display surface of the display unit 9001 is not curved. Also, the portable information terminal 92 The outer shape of the display unit 01 is not rectangular (it is circular in Figure 31(B)).

[0262] Figures 31(C) to 31(E) are perspective views showing a foldable portable information terminal 9202. Figure 31(C) is a perspective view of the mobile information terminal 9202 in its unfolded state. 31(D) moves from one of the unfolded or folded states of the personal information terminal 9202 to the other This is a perspective view of the state in which the device is changing, and Figure 31(E) shows the mobile information terminal 9202 folded. This is a perspective view of the state.

[0263] The 9202 personal digital assistant offers excellent portability when folded, and when unfolded, it is easy to connect. The wide display area without eyes provides excellent readability of the display. (Display of the mobile information terminal 9202) The section 9001 is supported by three housings 9000 connected by hinges 9055. By bending the two housings 9000 via the hinge 9055, the portable information terminal The 9202 can be reversibly transformed from an unfolded state to a folded state. For example, For example, the mobile information terminal 9202 can be bent with a radius of curvature of 1 mm or more and 150 mm or less. .

[0264] Furthermore, a display device according to one aspect of the present invention can be suitably used in the display unit 9001. .

[0265] The electronic device described in this embodiment has a display unit for displaying some kind of information. It is characterized by having the following characteristics. However, one embodiment of the present invention is an electronic device that does not have a display unit. It can also be applied to containers.

[0266] The configuration shown in this embodiment may be used in appropriate combination with the configurations shown in other embodiments. It is possible. [Explanation of Symbols]

[0267] ANODE Wiring CATHODE wiring CSCOM wiring Cs_E1 Capacitive element Cs_E2 Capacitive element Cs_E3 Capacitive element Cs_E4 Capacitive element Cs_E5 Capacitive element Cs_E6 Capacitive element Cs_E7 Capacitive element Cs_E8 Capacitive element Cs_L Capacitive element GL_E1 scan line GL_E2 scan line GL_L scan line MA1 transistor MA2 transistor MA3 transistor MA4 transistor MA5 transistor MB1 Transistor MB2 Transistor MB3 Transistor MB4 Transistor SL_E1 signal line SL_E2 signal line SL_L signal line TCOM wiring Tr1 Transistor Tr2 transistor Tr3 transistor Tr4 transistor Tr5 transistor 10 pixels 12 Display elements 12d display area 14 display elements 14a Display element 14b Display elements 14B Display element 14Bd display area 14d display area 14G Display Elements 14Gd display area 14R display elements 14Rd display area 14W display element 14Wd display area 16 Capacitive elements 18 Capacitive elements 30 circuit boards 31 Conductive film 32 Insulating film 34 Insulating Film 36 Conductive film 38 Conductive film 40 insulating film 42 Conductive film 44 insulating film 45 Opening 46a Conductive film 46b Conductive film 46c conductive film 46d conductive film 46e conductive film 46f conductive film 48 Insulating film 50a Oxide semiconductor film 50b Oxide semiconductor film 50c oxide semiconductor film 51 Opening 52a Conductive film 52b Conductive film 52c conductive film 52d conductive film 52e Conductive film 52f conductive film 52g conductive film 52h conductive film 54 Insulating film 55 Opening 56a Oxide semiconductor film 56b Oxide semiconductor film 58a Conductive film 58b Conductive film 58c conductive film 58d Conductive film 62 Insulating film 63a opening 63b opening 63c opening 64a Conductive film 64b Conductive film 68 Insulating film 69 Colored film 70a conductive film 70b Conductive film 72 Insulating film 76 EL layer 78 Conductive film 80 circuit boards 82 Sealing material 90 circuit boards 92 Conductive film 94-alignment film 96 liquid crystal layers 98 alignment film 500 display device 502 pixel section 504a Gate driver circuit section 504b Gate driver circuit section 506 Source Driver Circuit Section 508 External circuit 2000 Touch Panel 2509 FPC 2511 Wiring 2519 terminal 2569 Anti-reflection layer 2590 circuit board 2591 Electrode 2592 Electrode 2593 Insulating layer 2594 Wiring 2595 Touch Sensor 2597 Adhesive layer 2598 Wiring 2599 Connectivity Layer 2601 Pulse voltage output circuit 2602 Current detection circuit 2603 Capacity 2621 Electrode 2622 Electrode 8000 Display Module 8001 Top cover 8002 Lower cover 8003 FPC 8004 Touch Panel 8005 FPC 8006 Display Panel 8009 Frame 8010 Printed Circuit Board 8011 Battery 9000 cabinets 9001 Display section 9002 Camera 9003 Speaker 9005 Operation Keys 9006 Connection terminal 9007 Sensor 9008 Microphone 9050 Operation Buttons 9051 Information 9052 Information 9053 Information 9054 Information 9055 Hinge 9100 Television equipment 9101 Mobile Information Terminal 9102 Mobile Information Terminal 9103 Mobile Information Terminal 9104 Mobile Information Terminal 9200 Mobile Information Terminal 9201 Mobile Information Terminal 9202 Mobile Information Terminal

Claims

1. The pixel has a first transistor, a second dual-gate transistor, wiring to which a data signal is supplied, and a light-emitting element. The first transistor has the function of writing the data signal to the second transistor. The second transistor has the function of driving the light-emitting element in accordance with the data signal. The wiring to which the data signal is supplied and the lower gate electrode of the second transistor are made of the same metal. The wiring to which the data signal is supplied is arranged vertically within the pixel using continuous layers. The lower gate electrode is arranged in an island-like configuration. The first transistor has a first oxide semiconductor film, The second transistor is a light-emitting device having a second oxide semiconductor film.

2. In claim 1, The second transistor has a conductive film that supplies potential to the source or drain, The conductive film is a light-emitting device arranged in the vertical direction of the pixel.

3. In claim 1 or claim 2, A light-emitting device in which the wiring to which the data signal is supplied and the lower gate electrode of the second transistor are arranged on the same insulating surface.

Images