Multidimensional matrix transducer connection
The multidimensional transducer array system addresses channel limitations and connection issues by using an extended dematching layer and tiled flexible circuits, enhancing reliability and cost-effectiveness in ultrasound imaging systems.
Patent Information
- Application Number
- JP2025539666
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-01-04
- Filing Date
- 2023-11-28
- Publication Date
- 2026-01-08
AI Technical Summary
Existing ultrasound imaging systems face limitations due to the limited number of channels, high resistance, and susceptibility to breakage in connections between transducer arrays and electronics, particularly in chip-on-array designs, which use low-temperature connections and flexible circuits with poor process yields.
A multidimensional transducer array system with a dematching layer extending beyond the mounting area, allowing for a ground plane connection without sidewall metallization, and using tiled flexible circuit material to reduce thermal distortion and improve process yield.
The solution provides a reliable and cost-effective ground return path for 2D matrix transducers, enabling high-temperature ASIC attachment and improving design freedom and process yield, while reducing the risk of connection breakage.
Smart Images
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