Lighting device with embedded electronic circuits

Abstract

The present invention relates to a lighting device comprising a semiconductor light source assembly (1) disposed on a support (10), an electronic circuit (13) for operating the semiconductor light source assembly (1), a cooler (3) for cooling the semiconductor light source assembly (1), an electrical connection element (4) for supplying energy to the semiconductor light source assembly (1), and a holder (2). The support (10) is disposed within a first cavity (7) of the holder (2), and the cooler (3) has at least one surface (30) substantially parallel to the support (10) formed within the first cavity (7). The lighting device is characterized in that the electronic circuit (13) is disposed on the side of the support (10) opposite to the semiconductor light source assembly (1) and is embedded within a thermally conductive layer (8) provided between the support (10) and the holder (2) and / or the cooler (3) within the first cavity (7).

Description

Technical Field

[0001] This application claims the priority of German Patent Application No. 102023105944.0 dated March 09, 2023, and hereby incorporates the disclosure thereof by reference into this application.

[0002] The present invention relates to a lighting device, particularly a lighting device suitable for use in automobiles, and a method for manufacturing such a lighting device.

Background Art

[0003] A lighting device is disclosed, for example, in Patent Document 1. This Patent Document 1 describes a lighting device / automobile headlamp having a semiconductor light source assembly, a housing, a cooling body for cooling the semiconductor light source assembly, and an electrical connection element for supplying energy to the semiconductor light source assembly.

[0004] However, known lighting devices often have the drawback that water entering the lighting device may damage the electronic circuit for operating the semiconductor light source assembly or cause electrochemical migration. This is a known problem particularly in vehicle lamps, such as rear lights or rear combination lights (RCL), fog lamps or front lamps.

[0005] In order to reduce the ingress of moisture or protect the electronic circuit from the ingress of moisture, in known lighting devices, the electronic circuit is sealed in a further process, for example, by a sealing material, a coating (conformal coating) is applied to the electronic circuit, or encapsulation of the electronic circuit by an additional cover is achieved.

[0006] However, the above-mentioned means commonly require additional method steps to protect the electronic circuit from moisture, which increases the manufacturing effort for the lighting device and, consequently, also increases the manufacturing cost.

[0007] Therefore, there is a need to provide a lighting device that offers improved means for protecting the electronic circuits for operating the semiconductor light source assembly within the lighting device from moisture ingress. Furthermore, there is a need to provide a method for manufacturing such a lighting device. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] International Publication No. 2013 / 079302 [Overview of the project]

[0009] This requirement is considered in relation to the subject matter of the independent claim. Improved forms and configurations of the proposed principle are described in the dependent claims.

[0010] The inventors propose a lighting device in which, in order to protect the electronic circuit from moisture intrusion, the electronic circuit for operating the semiconductor light source assembly within the lighting device is located on the side of the support, such as a mounting board, opposite to the semiconductor light source assembly, and the electronic circuit is embedded in a thermally conductive layer provided between the support and the holder and / or cooler of the lighting device. In this case, the thermally conductive layer undertakes the role of thermally bonding the support to the cooler, and can also undertake the role of mechanically bonding the support to the holder or cooler in the form of a thermally conductive adhesive.

[0011] By embedding the electronic circuitry, the additional conformal coating of the electronic circuitry as a further process step after insertion of the support into the holder can be eliminated, while simultaneously achieving excellent protection against electrochemical migration. Furthermore, by positioning the electronic circuitry on the side of the support opposite to the semiconductor light source assembly, more space is available on the top surface (LED side) of the support, thereby achieving greater product versatility. For example, more or larger light sources can be placed on the top surface of the support. In specific cases, for example, a bicolor or tricolor module can be placed on the top surface of the support, or, in the case of headlight applications, a (small) matrix light module can be placed on the top surface of the support if possible.

[0012] A further advantage of the assembly according to the present invention is that obstructive components are eliminated on the upper surface of the support, thereby enabling a better connection of the optical waveguide to the semiconductor light source assembly. This is because the distance between the optical waveguide and the semiconductor light source assembly can be reduced. As a result, better luminous efficiency can be achieved at the interface between the optical waveguide and the semiconductor light source assembly, and consequently, better luminous efficiency can be achieved for the lighting device as a whole.

[0013] A further advantage of inserting / pressing electronic circuits into a thermally conductive layer is that the required thickness of the thermally conductive layer is less. This layer thickness will inevitably not be significantly thicker than the tallest components of the electronic circuit placed on the support. Therefore, the heat path from the electronic circuit to the coolant is shorter compared to, for example, a module in which the entire electronic circuit is inserted into a housing (e.g., a tube) and then sealed.

[0014] Furthermore, in the automotive sector (KFZ sector), the requirements for electromagnetic compatibility (EMV) of individual components within a vehicle are extremely high. In this regard, the lighting device according to the present invention arranges the electronic circuit on the side of the support opposite to the semiconductor light source assembly and embeds the electronic circuit in a thermally conductive layer, thereby causing the support, holder, and thermally conductive layer to exhibit already improved electromagnetic radiation characteristics, thereby requiring only fewer or no additional precautions to meet the EMV requirements in the KFZ sector.

[0015] A lighting device according to a first embodiment comprises a semiconductor light source assembly disposed on a support, an electronic circuit for operating the semiconductor light source assembly, a cooler for cooling the semiconductor light source assembly, an electrical connection element for supplying energy to the semiconductor light source assembly, and a holder. The support is disposed within a first cavity of the holder, and the cooler has at least one surface substantially parallel to the support that is formed within the first cavity.

[0016] The lighting device is characterized in that the electronic circuit is located on the side of the support opposite to the semiconductor light source assembly and is embedded in a thermally conductive layer provided between the support and the holder and / or cooler within a first cavity. In particular, in this case, the electronic circuit is completely surrounded by the thermally conductive layer.

[0017] In some embodiments, a support and / or electronic circuitry is thermally coupled to a cooler via a thermally conductive layer. This allows heat generated in the semiconductor light source assembly and electronic circuitry during operation of the lighting device to be released toward the cooler. The cooler may, in particular, be configured to absorb the heat generated in the semiconductor light source assembly and electronic circuitry and release it to the surrounding environment or to a medium surrounding the cooler.

[0018] In some embodiments, the holder and / or cooler has at least one projection on which the support is at least partially supported. For example, the holder may have a circumferentially extending projection / edge in the region of the first cavity on which the support is at least partially supported. This circumferentially extending projection / edge may be partially interrupted so as to ensure that excess material of the thermally conductive layer can escape when the support is pressed against the thermally conductive layer. Alternatively or additionally, the cooler may have at least one projection / bulge formed inside the first cavity and in the direction of the support on which the support is at least partially supported. For example, the cooler may have a central, for example, cylindrical bulge on which the support is at least partially supported.

[0019] At least one protrusion of the holder and / or cooler may be used, in particular, to provide a mounting surface for the support and at the same time to define its height, thereby preventing the electronic circuit from colliding with the holder or cooler when the support is pressed against the thermally conductive layer. If such a collision occurs, the electronic circuit will be damaged. Accordingly, the position or height of the protrusion may be selected so that the electronic circuit does not collide with the holder or cooler when the support is pressed against the thermally conductive layer. In cases where the protrusion / bulge is part of the cooler, and optionally the cooler is made of metal, the bulge may further form a heat sink for the support, and optionally may be used to provide, for example, an electrical terminal (ground potential) for the support.

[0020] In some embodiments, the holder and / or cooler has at least one second cavity in which an electronic circuit is disposed. For example, the holder and / or cooler may at least partially form slightly spaced recesses in the support to which the electronic circuit is mounted, so that the electronic circuit mounted in the support is located in one or more corresponding cavities in the holder and / or cooler. This can reduce, for example, the amount of thermally conductive layer material required to embed the electronic circuit, and nevertheless ensure optimal thermal coupling between the electronic circuit + support and the holder and / or cooler. Such a configuration may be particularly suitable when the holder and cooler are manufactured integrally from a single component, such as a plastic injection molded member, because in such cases, the formation of slightly spaced recesses in the holder / cooler for the support to which the electronic circuit is mounted can be easily achieved.

[0021] In some embodiments, the thermally conductive layer has a thermal conductivity of 1.5 watts per meter per kelvin (W / mK) or more, particularly 5 W / mK or more. In particular, the material of the thermally conductive layer may be selected such that the thermally conductive layer has a thermal conductivity of at least 1.79 W / mK, or at least 2.3 W / mK, or at least 3.5 W / mK, or at least 5.0 W / mK, or at least 6.0 W / mK, or at least 9.2 W / mK, or at least 10.0 W / mK.

[0022] In some embodiments, the thermal conductive layer is silicone-free. Silicone-free thermal conductive pastes possess ideal thermal properties, resulting in reliable heat dissipation over longer periods than most industrial thermal conductive materials. In contrast, conventional silicone-containing thermal conductive pastes flow out after multiple heating and cooling stages (the so-called pump-out phenomenon). This creates gaps, causing the paste to lose its effectiveness, leading to module overheating and premature product failure. Therefore, the thermal conductive layer is designed to almost completely eliminate the pump-out phenomenon, resulting in long-lasting thermal management and effective heat conduction. The major advantages of such silicone-free thermal conductive layers are their long durability and functionality.

[0023] In some embodiments, the thermally conductive layer, in its cured state, exhibits greater elasticity / viscosity than epoxy or polyurethane sealants. In particular, the material of the thermally conductive layer may be selected to retain a certain degree of elasticity / viscosity rather than completely curing. This has the advantage that, when stress may occur inside the lighting device, the electronic circuits embedded within the thermally conductive layer will not be damaged by the fully cured sealant. Rather, the thermally conductive layer, being relatively more elastic than epoxy or polyurethane sealants, can compensate for any stress that may occur, at least to some extent.

[0024] According to some aspects, the cooling body has a first cooling body section disposed within a first cavity of the holding body and forming at least one surface substantially parallel to the support body. Further, the cooling body has a second cooling body section arranged to fit properly / fit precisely between the holding body and the electrical connection element. This can be achieved, for example, by injection molding the cooling body together with the holding body and the electrical connection element as an insertion member in one step. Alternatively, the cooling body may be positioned to fit properly between the holding body and the electrical connection element by the holding body and the electrical connection element being mated or adhered to the cooling body section so as to surround at least the second cooling body section.

[0025] According to some aspects, the electrical connection element is formed integrally with the holding body, particularly as a plastic injection-molded member.

[0026] According to some aspects, the cooling body is formed integrally with the holding body and optionally also with the electrical connection element. For example, the holding body may comprise the cooling body as a constituent part and be formed as a plastic injection-molded member together with the holding body.

[0027] According to some aspects, the electrical connection element has an electrical contact which is led through a through-hole provided in the cooling body and is in electrical contact connection with the support body or a conductor located on the support body. For example, the electrical contact may form a press fit with an opening provided in the support body of the lighting device.

[0028] According to some aspects, a locking element is arranged on the holding body, for example, for forming a bayonet lock with the frame of a vehicle lamp. For example, the frame may be formed according to a defined standard, and the locking element may be configured to form a bayonet lock with the frame.

[0029] In some embodiments, the support is formed as a mounting board. This allows multiple components of a semiconductor light source assembly to be easily mounted on the surface of the mounting board and electrically connected to one another by conductive paths. However, alternatively, the support may be formed as a conductive frame, also referred to below as a lead frame, thereby achieving the same advantages.

[0030] In some embodiments, the support is fitted into a mounting portion provided on a holder and positioned within a first cavity, or is held in another form. Advantageously, the support comprising the semiconductor light source assembly and electronic circuitry may be arranged and pre-mounted on the support, and the support comprising the semiconductor light source assembly and electronic circuitry may be manufactured as an independent module and then incorporated into the lighting device according to the present invention.

[0031] The lighting device according to the present invention is preferably formed as an LED retrofit and is provided for use in an automobile. Preferably, the lighting device according to the present invention is compatible with a glow lamp used in an automobile as a taillight, brake light, turn signal light, position light or daytime running light.

[0032] Furthermore, a method for manufacturing a lighting device, in particular a lighting device according to the embodiments described above, is described. The method includes preparing a holder comprising a cooler disposed in a first cavity of the holder and an electrical connection element coupled to the holder. The method further includes depositing a thermally conductive layer on the area of ​​the holder and / or cooler inside the first cavity and pressing a support comprising a semiconductor light source assembly disposed on a first surface of the support and an electronic circuit disposed on a second surface opposite to the first surface for operating the semiconductor light source assembly, onto the thermally conductive layer. In this case, the pressing is carried out so as to embed the electronic circuit in the thermally conductive layer between the support and the holder and / or cooler.

[0033] By pressing the support into a thermally conductive layer, the electronic circuit is embedded within the thermally conductive layer, that is, surrounded by it. This ensures optimal thermal conductivity between the electronic circuit and the cooler or holder. The pressing may also cause, for example, excess material of the thermally conductive layer to pass alongside the support and be pushed upward, forming an overhang of the thermally conductive layer on or to the side of the support.

[0034] In this case, preparing the holder may include inserting a cooler and optionally electrical terminals into the mold of a plastic injection molding die, injecting plastic material so as to surround the optionally electrical terminals and cooler in the mold, forming a holder with the plastic material after solidification, and fixing the optionally electrical terminals and cooler within the material of this holder.

[0035] Further aspects and embodiments of the proposed principle are disclosed with respect to various different embodiments and examples, which are described in detail with reference to the accompanying drawings. [Brief explanation of the drawing]

[0036] [Figure 1] This is a perspective view of a lighting device based on the proposed principle. [Figure 2] This is a perspective view of a further embodiment of a lighting device based on the proposed principle. [Figure 3] This is a cross-sectional view of a lighting device based on the proposed principle. [Figure 4] This is a cross-sectional view of a further embodiment of a lighting device based on the proposed principle. [Figure 5] This is a plan view of the support structure based on the proposed principle. [Modes for carrying out the invention]

[0037] The following embodiments and examples illustrate various aspects and combinations thereof based on the proposed principle. The embodiments and examples are not always to scale. Furthermore, different elements may be enlarged or reduced in order to highlight individual aspects. Obviously, the individual aspects and features of the embodiments and examples shown in the drawings may be combined with one another without impairing the principle of the present invention. Some aspects have regular structures or shapes. It should be noted that while slight deviations from the ideal shape may occur in practice, these do not contradict the spirit of the invention.

[0038] Furthermore, individual drawings, features, and aspects are not necessarily depicted in the correct size, nor are the proportions between individual elements fundamentally correct. Some aspects and features become more prominent when they are enlarged. However, terms such as "up," "above," "down," "below," "larger," "smaller," and similar terms are appropriately indicated in relation to the elements in the drawings. Therefore, it is possible to derive such relationships between elements from the drawings.

[0039] Figures 1 to 4 schematically show a lighting device based on the proposed principle.

[0040] The lighting device comprises a semiconductor light source assembly 1 placed on a support 10, a cooler 3 for cooling the semiconductor light source assembly 1, an electrical connection element 4 with three electrical terminals 41, 42, and 43 for supplying energy to the semiconductor light source assembly 1, and a common holder 2 for the electrical connection element 4, the support 10, and the cooler 3. The lighting device is used, for example, in an automobile to generate brake lights and taillights.

[0041] The semiconductor light source assembly 1 comprises a number of light-emitting diodes (LEDs), which are arranged on a mounting board 10 together with an electronic circuit 13 for operating the LEDs. In the illustrated example, the semiconductor light source assembly 1 comprises three LEDs, but the number three should be understood as merely an example in this specification, and the number of LEDs may be more or less than three.

[0042] The mounting board 10 is used as a common support 10 for the light-emitting diodes and electronic circuits 13 of the semiconductor light source assembly 1, in which case the semiconductor light source assembly 1 is located on one side of the mounting board 10, and the electronic circuits 13 are located on the side of the mounting board 10 opposite to the semiconductor light source assembly 1.

[0043] The light-emitting diodes and the electronic circuit 13 are mounted on opposite surfaces of the mounting board 10 and are electrically connected to each other by a conductive path or contact through-path that penetrates the mounting board 10. The electronic circuit 13 may be a driver circuit, for example, a so-called linear driver, i.e., a linear voltage regulator. The light-emitting diodes may emit, for example, red light when in operation. In the illustrated example, three light-emitting diodes are arranged in a row, whereas in the example of five light-emitting diodes, for example, four light-emitting diodes may be placed at the corners of a virtual square on the surface of the mounting board 10, and the fifth light-emitting diode may be placed at the center of the virtual square. The light-emitting diodes may be covered by a hemispherical transparent dome 14, which is placed on the surface of the mounting board 10 and is used as a primary optical system as well as to protect the light-emitting diodes. In the example of five light-emitting diodes, the light-emitting diodes placed at the corners of the virtual square may be used together to generate brake lights, for example, while the central light-emitting diode may be used to generate taillights.

[0044] The holder 2, as shown in Figures 2 and 4, may be formed, for example, as a single-piece plastic injection molded member, and comprises a cylindrical first holder section 200 and a second holder section 201 formed as a socket. The ends of electrical terminals 41, 42, and 43, which are formed as contact pins, are arranged inside the second holder section 201. The second holder section 201 constitutes an electrical connection element 4.

[0045] In contrast, the retainer 2 may be formed by two separate plastic injection molded members, as shown in Figures 1 and 3, namely a cylindrical first retainer section 200 and a second retainer section 201, with the ends of the electrical terminals 41, 42, and 43, formed as contact pins, arranged within the second retainer section 201. In this configuration as well, the second retainer section 201 or a portion of the second retainer section 201 formed as a socket constitutes the electrical connection element 4.

[0046] In all illustrated examples, the cylindrical first retainer section 200 has a first cavity 7 in which the mounting board 10 and the cooling section 31 are arranged, and an end face side having a flat, annular, disc-shaped end face 20, the end face 20 being used as a reference plane for aligning the light-emitting diodes of the semiconductor light source assembly 1 with respect to the retainer 2 and the optical axis of the frame of the automotive lamp into which the lighting device is inserted.

[0047] Three locking elements 21, 22, and 23 are arranged along the outer circumference of the annular disc-shaped end face 20. These three locking elements 21, 22, and 23 project radially from the outer circumferential surface of the cylindrical holder section 200, forming a bayonet lock with a correspondingly molded portion of the frame of the automotive lamp. To activate this bayonet lock, the lighting device is inserted into the frame of the automotive lamp and then twisted clockwise or counterclockwise about the cylindrical axis of the cylindrical holder section 200. One locking element 23 has a stopper that contacts the frame of the automotive lamp or within the assembly opening after the bayonet lock to limit the aforementioned twisting motion. Inside the cylindrical holder section 200 is a mounting board 10 on which the semiconductor light source assembly 1 is mounted. This mounting board 10 is positioned perpendicular to the cylindrical axis of the cylindrical holder section 200. The cylindrical retaining section 200 has a housing on its outer circumferential surface for a seal ring 5 that will come into contact with the lighting device after it is assembled into the frame of the automobile headlight.

[0048] The second retaining section 201, formed as a socket, may be bent relative to the cylindrical axis of the cylindrical retaining section 200, as shown in Figures 2 and 4. The ends of the electrical terminals 41, 42, and 43, formed as contact pins, are located inside the socket 201 in a plane perpendicular to the cylindrical axis of the cylindrical retaining section 200. The electrical terminals 41, 42, and 43 are made of metal and are partially embedded in the plastic material of the retaining section 2, which is formed as a plastic injection molded member, thereby allowing free access to the ends of the electrical terminals 41, 42, and 43 for electrical contact connection. The first ends of the electrical terminals 41, 42, and 43 are each formed as contact pins and are located inside the socket 201. The second ends of the electrical terminals 41, 42, and 43 are each led through through-holes provided in the mounting board 10 and are electrically connected to conductor paths provided in the mounting board 10, thereby forming an electrical connection to the semiconductor light source assembly 1.

[0049] In contrast, the second retainer section 201 may be formed as a separate plastic injection molded member, as shown in Figures 1 and 3. The second retainer section 201 also has three electrical contact pins 41, 42, and 43, each of which is made of metal and embedded in the plastic material of the second retainer section 201. The second retainer section 201 has a circular disc-shaped flange section, which contacts the annular disc-shaped cooler section 32 on the side opposite to the cylindrical first retainer section 200. The flange section of the second retainer section 201 is bonded to the annular disc-shaped cooler section 32 by an adhesive 6. The adhesive 6 also serves as a sealing means between the flange section of the second retainer section 201 and the annular cooler section 32, and between the cylindrical first retainer section 200 and the annular disc-shaped cooler section 32. For this purpose, adhesive 6 is applied annularly to both surfaces of the annular disc-shaped cooling body section 32. Furthermore, the second retaining body section 201 has a section formed as a socket 4, which extends parallel to the ring axis of the retaining body 2, is offset parallel to the ring axis, and is integrally molded with a circular disc-shaped flange section. The free ends of the electrical contact pins 41, 42, and 43 each extend into the socket 4, where they are used as electrical contacts for the lighting device and are provided for connecting plugs that can be fitted into the socket 4. After the socket and plug are mated together, this connection may be sealed. The other ends of the three electrical contact pins 41, 42, and 43 each protrude through through-holes 300 provided in the mounting surface 30 of the cooling body 3, for example, forming a press fit with the mounting board 10 and connecting to electrical contacts provided on the mounting board 10. The electrical contact pins are used to supply energy to the light-emitting diode 11.

[0050] In all illustrated examples, the cooler 3 has a hollow cylindrical cooler section 31 which is embedded in or adjacent to the plastic material of the holder 2 in the region of the cylindrical first holder section 200. The hollow cylindrical cooler section 31 has at least one flat or substantially parallel surface 30 on the side facing the end face 20 of the cylindrical first holder section 200. The cylindrical axis of the hollow cylindrical cooler section 31 is identical to the cylindrical axis of the cylindrical first holder section 200, and the substantially parallel surface 30 is positioned perpendicular to the cylindrical axis of the hollow cylindrical cooler section 31.

[0051] The surface 30 of the hollow cylindrical cooling body section 31 has a through-hole 300 through which one second end of each of the three electrical terminals 41, 42, and 43 is led. The second ends of the three electrical terminals 41, 42, and 43, together with the mounting board 10, form, for example, a press fit. However, alternatively or additionally to this press fit, the second ends of the electrical terminals 41, 42, and 43 may be connected to electrical contacts on the mounting board 10, respectively, by brazing.

[0052] Furthermore, the cooler 3 has a cooler section 32 formed in the shape of an annular disc, which is integrally molded with a hollow cylindrical cooler section 31, and the ring axis of the cooler section 32 coincides with the cylindrical axis of the hollow cylindrical cooler section 31. Multiple cooling fins 33 are integrally molded along the circumferential surface of the annular disc-shaped cooler section 32. These cooling fins 33 are bent at an angle of 90° from the annular disc-shaped cooler section 32 and extend parallel to the ring axis of the annular disc-shaped cooler section 32. The outer edge of the annular disc-shaped cooler section 32 and the cooling fins 33 integrally molded with the cooler section 32 protrude beyond the plastic material of the holder 2 or the cylindrical first holder section 200. The cooler 3 is made of, for example, metal, such as special steel sheet, and is integrally formed as a deep-drawn and bent member. The cooling fins 33 form a cavity through which, in the embodiments of Figures 2 and 4, the second retaining section 201, formed as a socket, extends. In the embodiments of Figures 1 and 3, the cooling fins 33 also form a cavity, however, this cavity is left open to ensure, for example, access to the socket 4.

[0053] As shown in Figures 3 and 4, particularly in their respective detail views, the electronic circuit 13 is located on the side of the mounting board 10 opposite to the semiconductor light source assembly 1. The semiconductor light source assembly 1 is located on the side of the mounting board 10 opposite to the cooler 3, and the electronic circuit 13 for operating the semiconductor light source assembly 1 is located on the side of the mounting board 10 facing the cooler 3.

[0054] Furthermore, the cooling body 3 has a projection 9 in the region of the first cavity 7 that extends in the direction of the mounting board 10 from the center. In this case, the projection 9 may be formed integrally with the cooling body 3 or it may be attached to and bonded to the cooling body. The mounting board 10 is positioned in the first cavity such that the electronic circuit 13 for operating the semiconductor light source assembly 1 is located on the side where the electronic circuit 13 is oriented toward the cooling body 3, and the mounting board is at least partially resting on the projection 9. For this reason, the electronic circuit 13 is located on the mounting board 10 in the region surrounding the projection 9, rather than in the central region of the projection 9.

[0055] A thermally conductive layer 8 is placed between the cooling body 3 and the mounting board 10. This thermally conductive layer 8 fills the area between the cooling body 3 and the mounting board 10, embedding the electronic circuit 13 between the mounting board 10, the holder 2, and the cooling body 3. In this case, the height of the protrusion 9 is selected so that the tallest component of the electronic circuit 13 does not collide with the cooling body 3 when the mounting board is placed on the protrusion 9. The mounting board has multiple through-passages 100 through which the ends of the contact pins 41, 42, and 43 are guided, thereby additionally mounting the mounting board 10.

[0056] In the examples shown in Figures 3 and 4, the holder 2 is configured such that its end face 20 terminates substantially flat with the surface of the mounting board 10. However, this should be considered merely an example, and the holder 2 may be well configured such that its end face 20 protrudes beyond both the mounting board 10 and the semiconductor light source assembly 1. This ensures additional protection between the mounting board 10 and the semiconductor light source assembly 1.

[0057] Furthermore, the protrusion 9 may be formed on the holder 2 or the first holder section 200 in the form of a circumferential end or a partially interrupted edge, thereby allowing the mounting board 10 to be placed on the protrusion 9. This also allows, for example, electronic circuit components to be placed in the central region of the mounting board 10.

[0058] To manufacture the lighting device schematically shown in Figures 2 and 4, electrical terminals 41, 42, and 43, formed as contact pins, are inserted into the mold half of a plastic injection molding die, with the ends of the electrical terminals 41, 42, and 43 protruding beyond the mold. The cooling body 3 is also inserted into the mold half, with a portion of the hollow cylindrical section 31 and a portion of the annular disc-shaped section 32 of the cooling body 3 positioned within the mold half. The mold is then clamped, and plastic material is injected to surround the sections of the electrical terminals 41, 42, and 43 enclosed by the mold, and the portions of the cooling body sections 31 and 32 positioned within the mold. After further injection and solidification of the plastic material, the holder 2, particularly its cylindrical holder section 200 and the holder section 201 formed as a socket, is molded according to the shape of the plastic injection molding die. A thermally conductive layer 8 is applied to the surface 30 and protrusions 9 of the cooler 3 that extend beyond the plastic material of the holder 2, and the mounting board 10, which includes the semiconductor light source assembly 1 and the electronic circuit 13, is positioned and fixed to the cooler 3 or within the holder 2, for example, by press-fitting with the second ends of the contact pins 41, 42, 43. This is done by pressing the mounting board 10 into the thermally conductive layer 8 while the thermally conductive layer 8 is still liquid or viscous, in which case the electronic circuit 13 is embedded within the thermally conductive layer 8 by the pressing.

[0059] To manufacture the lighting device schematically shown in Figures 1 and 3, the individual components (first holder section 200, cooler 3, and second holder section 201) are manufactured separately and then bonded together. Subsequently, a thermally conductive layer 8 is applied to the surface 30 and protrusions 9 of the cooler 3 that protrude beyond the plastic material of the holder 2, and a mounting board 10, comprising the semiconductor light source assembly 1 and electronic circuitry 13, is positioned and fixed to the cooler 3 or within the holder 2, for example, by press-fitting with the second ends of the contact pins 41, 42, and 43. This is done by pressing the mounting board 10 into the thermally conductive layer 8 while it is still liquid or viscous, in which case the electronic circuitry 13 is embedded within the thermally conductive layer 8 by the pressing.

[0060] The present invention is not limited to the embodiments described in detail above. For example, the retainer 2 may be formed as a plastic injection molded member manufactured by a multi-stage plastic injection molding process. For example, during the first stage of the plastic injection molding process, electrical terminals 41, 42, and 43 may be inserted into a first injection mold and surrounded by plastic injection, thereby forming a retainer section 201 formed as a socket in which the electrical terminals 41, 42, and 43 are fixed inside during the first method stage. Then, this socket-formed retainer section 201, including the electrical terminals 41, 42, and 43 fixed inside, may be inserted into a second injection mold together with the cooler 3 and surrounded by plastic injection, thereby forming a complete retainer 2 with an additional cylindrical retainer section 200. This two-stage plastic injection molding method has the advantage that the retaining body section 201, which is formed as a socket, and the cylindrical retaining body section 200 may be made of different plastic materials.

[0061] Furthermore, the cooling body of the lighting device according to the present invention may have a cooling body section made of a phase-change material that changes its aggregated state when heated. This cooling body section made of the phase-change material is, for example, completely enclosed within the plastic material of the holder, and changes its aggregated state, for example, from solid to liquid when heated, and returns to a solid state when cooled.

[0062] The holder is made of, for example, polyamide (PA). Furthermore, the holder may be made of a plastic material having high thermal conductivity in order to promote the cooling function of the cooling body.

[0063] Figure 5 shows plan views of the mounting board 10 according to several embodiments of the proposed principle. In the illustrated example, the mounting board 10 is still mounted on its manufacturing support. A semiconductor light source assembly 1, comprising three light-emitting diodes, is positioned on the top surface of the mounting board 10. Furthermore, the mounting board 10 has two through-passages 100 through which the ends of contact pins 41, 42, and 43 are guided, thereby enabling the mounting board 10 to be contact-connected or mounted. In addition, the mounting board 10 has a conductive path 11 that connects the semiconductor light source assembly 1 to an electronic circuit located on the bottom surface of the mounting board 10. [Explanation of Symbols]

[0064] 1. Semiconductor light source assembly 10 mounting boards 11 Conductor 13 Electronic circuit 14 Optical system 100 Throughway 2 Holding body 20 End side 21, 22, 23 Lock elements 200,201 Holder classification 3 Cooling element 30 surface 31,32,33 Cooling body classification 300 Throughway 4 sockets 41, 42, 43 Contact pins 5 Seal ring 6 Adhesive 7. Blank 8. Thermally conductive layer 9 Protrusion

Claims

1. A lighting device, A semiconductor light source assembly (1) is placed on a support (10), An electronic circuit (13) for operating the semiconductor light source assembly (1), A cooling body (3) for cooling the semiconductor light source assembly (1), An electrical connection element (4) for supplying energy to the semiconductor light source assembly (1), It comprises a holder (2) and, The support (10) is positioned within the first cavity (7) of the holder (2), and the cooling body (3) has at least one surface (30) substantially parallel to the support (10) within the first cavity (7). A lighting device in which the electronic circuit (13) is located on the side of the support (10) opposite to the semiconductor light source assembly (1) and embedded in a thermally conductive layer (8) provided between the support (10) and the holder (2) and / or the cooler (3) within the first cavity (7).

2. The lighting device according to claim 1, wherein the support (10) and / or the electronic circuit (13) are thermally coupled to the cooling body (3) via the thermally conductive layer (8).

3. The lighting device according to claim 1 or 2, wherein the holder (2) and / or the cooling body (3) have at least one projection (9) on which the support (10) is at least partially resting.

4. The lighting device according to any one of claims 1 to 3, wherein the holder (2) and / or the cooling body (3) have at least one second cavity in which the electronic circuit (13) is disposed.

5. The lighting device according to any one of claims 1 to 4, wherein the thermally conductive layer (8) has a thermal conductivity of 1.5 W / mK or more, and particularly 5 W / mK or more.

6. The lighting device according to any one of claims 1 to 5, wherein the thermally conductive layer (8) is silicone-free.

7. The cooling body (3) is A first cooling element section (31) is disposed within the first cavity (7) of the holder (2) and forms at least one surface (30) substantially parallel to the support (10), The lighting device according to any one of claims 1 to 6, further comprising a second cooling element section (32) disposed to fit appropriately between the holder (2) and the electrical connection element (4).

8. The lighting device according to any one of claims 1 to 7, wherein the electrical connection element (4) is formed integrally with the holder (2).

9. The lighting device according to any one of claims 1 to 8, wherein the cooling body (3) is formed integrally with the holder (2).

10. The lighting device according to any one of claims 1 to 9, wherein the electrical connection element (4) has electrical contacts (41, 42, 43) which are led through to a through-hole (300) provided in the cooling body (3) and in particular form a press fit with the support (10) of the semiconductor light source assembly (1).

11. The lighting device according to any one of claims 1 to 10, wherein locking elements (21, 22, 23) used to form a frame and bayonet lock are arranged on the holder (2).

12. The lighting device according to any one of claims 1 to 11, wherein the support (10) is formed as a mounting board.

13. The lighting device according to any one of claims 1 to 12, wherein the holder (2) is formed as a plastic member, particularly as a plastic injection molded member.

14. A method for manufacturing a lighting device, particularly a lighting device according to any one of claims 1 to 13, The process involves preparing a holder (2), a cooling element (3) placed in a first cavity (7) of the holder (2), and an electrical connection element (4) coupled to the holder (2). A step of applying a thermally conductive layer (8) to the region of the retainer (2) and / or the cooler (3) inside the first cavity, A method comprising the steps of pressing a support (10), which comprises a support (10) having a semiconductor light source assembly (1) disposed on a first surface of the support (10) and an electronic circuit (13) disposed on a second surface opposite to the first surface for operating the semiconductor light source assembly (1), against a thermally conductive layer (8) to embed the electronic circuit (13) in the thermally conductive layer (8) between the support (10) and the holder (2) and / or the cooler (3).

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