Multilayer capacitors

Abstract

The present invention is directed to multilayer capacitors, circuit boards including multilayer capacitors, and integrated circuit packages including multilayer capacitors. The multilayer capacitor includes a body, the body includes alternating dielectric layers and internal electrode layers, the internal electrode layers each including a first electrode and a second coplanar electrode, the first electrode having a main body, and at least one lead tab extending from its upper edge and bottom edge, respectively. The capacitor also includes a first external terminal and a second external terminal, which are wound from the upper surface along the end surface to the bottom surface, respectively. The first external terminal is electrically connected to a first electrode of the first internal electrode layer along its lead tab leading edge, and the second external terminal is electrically connected to a first electrode of the second internal electrode layer along its lead tab leading edge.

Description

[Technical Field]

[0001] Related applications This application is based on U.S. Provisional Patent Application No. 63 / 420,724, filed on 31 October 2022, which claims priority, and the literature is incorporated herein by reference. [Background technology]

[0002] Multilayer capacitors are generally constructed to have multiple dielectric and internal electrode layers arranged in a stack. During manufacturing, the stacked dielectric and internal electrode layers are pressed and sintered to realize a substantially integrated capacitor body. Various configurations and designs have been used for the dielectric and internal electrode layers in an attempt to improve the performance of these capacitors.

[0003] However, these configurations are generally manipulated as rapid changes are occurring in the electronics industry, which requires new performance standards. In particular, various application design considerations have created the need to redefine capacitor parameters and their performance in high-speed environments, especially in terms of faster and higher-density integrated circuits. For example, higher currents, higher density circuit boards, and rising costs have all played a role in drawing attention to the need for better and more efficient capacitors. In addition, the design of various electronic components has been driven by the general industry trend toward miniaturization and increased functionality. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] U.S. Patent No. 7,177,137 [Patent Document 2] U.S. Patent No. 7,463,474 [Overview of the project] [Problems that the invention aims to solve]

[0005] From this perspective, there is a need to provide capacitors with improved operating characteristics. [Means for solving the problem]

[0006] According to one embodiment of the present invention, a multilayer capacitor is disclosed. Each multilayer capacitor includes a body portion, the body portion having a length extending in the longitudinal direction, a width extending in the transverse direction, and a height extending in the vertical direction. The body portion includes alternating dielectric layers and internal electrode layers. The internal electrode layers include a first internal electrode layer and a second internal electrode layer. Each internal electrode layer includes a first electrode having a main body portion, the main body portion being defined by an upper edge portion extending along the longitudinal direction, a bottom edge portion extending along the longitudinal direction and opposite the upper edge portion in the height direction, and two side edges extending along the height direction between the upper edge portion and the bottom edge portion. Each internal electrode layer further includes at least one lead tab extending from the upper edge portion of the main body portion. Each internal electrode layer also includes at least one lead tab extending from the upper edge along the height direction and having a leading edge which extends along the longitudinal direction and is positioned at a distance from the main body along the height direction. Each internal electrode layer further includes a second electrode coplanar with the first electrode. The multilayer capacitor also includes external terminals electrically connected to the internal electrode layers. The external terminals include a first external terminal and a second external terminal. Each of the first and second external terminals is formed on the upper surface of the multilayer capacitor, the bottom surface of the multilayer capacitor facing the upper surface of the multilayer capacitor along the height direction, and an end surface extending between the upper surface and the bottom surface. The first external terminal is electrically connected to the first electrode of the first internal electrode layer along the leading edge of at least one lead tab extending from the upper edge and the leading edge of at least one lead tab extending from the bottom edge, and the first external terminal is also electrically connected to the second electrode of the second internal electrode layer.The second external terminal is electrically connected to the second electrode of the first internal electrode layer and the first electrode of the second internal electrode layer along the leading edge of at least one lead tab extending from the upper edge and the leading edge of at least one lead tab extending from the bottom edge.

[0007] Other features and embodiments of the present invention are described in more detail below.

[0008] A complete and implementable disclosure of the present invention (including its best mode for those skilled in the art) is described more specifically in the remainder of the specification (including by reference to the accompanying drawings). [Brief explanation of the drawing]

[0009] [Figure 1A] This is an external perspective view of the generally top and side of one embodiment of a capacitor including two external terminals according to the present invention. [Figure 1B] Figure 1A is a side perspective view of the internal electrode layer of the capacitor. [Figure 1C] Figure 1A is a side perspective view of the internal electrode layer of the capacitor. [Figure 1D] Figure 1A is a side perspective view of the internal electrode layer of the capacitor. [Figure 1E] Figure 1A is a side perspective view of the internal electrode layer of the capacitor. [Figure 2A] This is an external perspective view of the generally top and side of another embodiment of a capacitor including four external terminals according to the present invention. [Figure 2B] Figure 2A is a side view perspective of the internal electrode layer of the capacitor. [Figure 2C] Figure 2A is a side view perspective of the internal electrode layer of the capacitor. [Figure 3] This is a perspective view of the capacitor shown in Figure 1A, mounted on a mounting surface, according to the present invention. [Figure 4] This is a side view of a printed circuit board and integrated circuit package including a capacitor according to the present invention. [Modes for carrying out the invention]

[0010] It should be understood by those skilled in the art that this discussion is merely an illustrative description of exemplary embodiments and is not intended to limit broader aspects of the present invention.

[0011] Generally speaking, the present invention is directed to multilayer capacitors. A multilayer capacitor (or simply a capacitor) includes alternating dielectric layers and internal electrode layers. Each internal electrode layer includes a first electrode and a second counter electrode that is coplanar with the first electrode. The first electrode has a main body portion, and at least one lead tab extends from an upper edge of the main body portion, and at least one lead tab extends from a bottom edge of the main body portion. Also, the capacitor includes two or more external terminals, and the lead tabs and the second electrode assist in the formation of the external terminals.

[0012] A particular arrangement of the capacitor elements can provide several advantages. For example, the inventors have discovered that by utilizing such a configuration for the capacitor and the electrode layers therein, and by utilizing particular materials for the electrodes and dielectrics as described herein, a multilayer capacitor can have a low equivalent series resistance, especially over a wide range of frequencies. In particular, such a low equivalent series resistance is realized at relatively high frequencies and can be beneficial.

[0013] In this regard, the capacitor can have an equivalent series resistance of 100 ohms or less, for example, 75 ohms or less, for example, 50 ohms or less, for example, 40 ohms or less, for example, 30 ohms or less, for example, 25 ohms or less, for example, 20 ohms or less, for example, 15 ohms or less, for example, 10 ohms or less, for example, 8 ohms or less, for example, 5 ohms or less, for example, 3 ohms or less, for example, 2 ohms or less, for example, 1 ohm or less. The equivalent series resistance can be 0.01 ohm or more, for example, 0.1 ohm or more, for example, 0.2 ohm or more, for example, 0.3 ohm or more, for example, 0.5 ohm or more, for example, 0.8 ohm or more, for example, 1 ohm or more, for example, 2 ohm or more, for example, 3 ohm or more, for example, 5 ohm or more, for example, 8 ohm or more, for example, 10 ohm or more. Such an equivalent series resistance can be realized when measured over a frequency range from 1 GHz to 10 GHz, for example, from 2 GHz to 10 GHz, for example, from 3 GHz to 10 GHz, for example, from 4 GHz to 9 GHz. The equivalent series resistance can be measured using common techniques as known in the art and as described herein.

[0014] In some embodiments, the capacitor can exhibit the above-described equivalent series resistance around a single frequency. For example, in one embodiment, the capacitor can exhibit the above-described equivalent series resistance at about 2 GHz, for example, at about 3 GHz, for example, at about 4 GHz, for example, at about 5 GHz, for example, at about 6 GHz, for example, at about 7 GHz, for example, at about 8 GHz, for example, at about 9 GHz, for example, at about 10 GHz. In one embodiment, the capacitor can exhibit the above-described equivalent series resistance at more than one of the above frequencies.

[0015] In addition to exhibiting relatively low equivalent series resistance due to the specific configuration of the electrodes and capacitor, as well as selective control over the materials for the electrodes and dielectric, the resulting capacitor can also exhibit low equivalent series inductance. For example, using the capacitor of the present invention can result in inductances on the order of picohrenes or even femtohenries compared to prior art capacitors exhibiting larger inductances. Generally, the inductance can be less than 1 nanohenry. In particular, the inductance can be 900 picohrenes or less, e.g., 750 picohrenes or less, e.g., 500 picohrenes or less, e.g., 400 picohrenes or less, e.g., 250 picohrenes or less, e.g., 100 picohrenes or less, e.g., 50 picohrenes or less, e.g., 25 picohrenes or less, e.g., 15 picohrenes or less, e.g., 10 picohrenes or less. The inductance can be greater than or equal to 1 femtohenry, for example, 25 femtohenry or more, for example, 50 femtohenry or more, for example, 100 femtohenry or more, for example, 250 femtohenry or more, for example, 500 femtohenry or more, for example, 750 femtohenry or more. Minimizing such inductance can contribute to good performance (especially good decoupling performance) particularly under high-speed transient conditions. Furthermore, a low equivalent series inductance value can also be characterized by a low impedance value, which is a reflection of parasitic inductance.

[0016] As described above, the present invention includes a multilayer capacitor comprising a top surface and a bottom surface opposite the top surface. The capacitor also includes at least one side surface (in particular, at least two side surfaces) extending between the top surface and the bottom surface. The capacitor may also include at least one end surface (in particular, at least two end surfaces) extending between the top surface and the bottom surface. Generally, the side surfaces extend in the longitudinal or length (L) direction and are generally longer than the end surfaces, while the end surfaces extend in the transverse or width (W) direction and are generally shorter. In one embodiment, the capacitor comprises at least six total surfaces (e.g., one top, one bottom, two side, and two end surfaces). For example, the capacitor may have a parallelepiped shape, such as a rectangular parallelepiped shape.

[0017] In addition, the capacitor can have a desired height. For example, the height can be 10 microns or more, for example 25 microns or more, for example 50 microns or more, for example 100 microns or more, for example 200 microns or more, for example 250 microns or more, for example 300 microns or more, for example 350 microns or more, for example 400 microns or more, for example 450 microns or more, for example 500 microns or more, for example 1,000 microns or more, for example 2,000 microns or more. The height can be 5,000 microns or less, for example 4,000 microns or less, for example 2,500 microns or less, for example 2,000 microns or less, for example 1,000 microns or less, for example 750 microns or less, for example 600 microns or less, for example 500 microns or less, for example 450 microns or less. When surrounded by a ball grid array, the height of a capacitor can be within 10% of the height (or diameter) of the balls in the ball grid array, for example, within 7%, within 5%, within 3%, within 2%, within 1%, etc. For example, such a height can be the original height before any reflow.

[0018] Capacitors can have a desired length. For example, the length can be 10 microns or more, 25 microns or more, 50 microns or more, 100 microns or more, 200 microns or more, 250 microns or more, 300 microns or more, 350 microns or more, 400 microns or more, 450 microns or more, 500 microns or more, 1,000 microns or more, 1,500 microns or more, 2,000 microns or more, 2,500 microns or more, 3,000 microns or more, 3,500 microns or more, 4,000 microns or more, and so on. The length can be 10,000 microns or less, for example, 8,000 microns or less, for example, 6,000 microns or less, for example, 5,000 microns or less, for example, 4,000 microns or less, for example, 3,000 microns or less, for example, 2,500 microns or less, for example, 2,000 microns or less, for example, 1,000 microns or less, for example, 750 microns or less, for example, 600 microns or less, for example, 500 microns or less, for example, 450 microns or less, and so on.

[0019] Furthermore, the capacitor can have a desired width. For example, the width can be 10 microns or more, 25 microns or more, 50 microns or more, 100 microns or more, 200 microns or more, 250 microns or more, 300 microns or more, 350 microns or more, 400 microns or more, 450 microns or more, 500 microns or more, 750 microns or more, 1,000 microns or more, 1,500 microns or more, 2,000 microns or more, 2,500 microns or more, 3,000 microns or more, and so on. The width can be 5,000 microns or less, for example, 4,000 microns or less, for example, 3,000 microns or less, for example, 2,500 microns or less, for example, 2,000 microns or less, for example, 1,500 microns or less, for example, 1,000 microns or less, for example, 750 microns or less, for example, 600 microns or less, for example, 500 microns or less, for example, 450 microns or less.

[0020] Generally, a multilayer capacitor includes a set of alternating dielectric layers and internal electrode layers. The capacitor also includes external terminals electrically connected to the internal electrode layers, the external terminals being formed on the upper surface of the capacitor, the bottom surface of the capacitor opposite the upper surface, and at least two opposing end surfaces.

[0021] Generally, a capacitor includes at least one set of alternating dielectric layers and internal electrode layers. A capacitor may also include a second set of alternating dielectric layers and internal electrode layers. In this regard, a capacitor may include at least two sets of alternating dielectric layers and internal electrode layers, for example, at least three sets, for example, at least four sets, etc. However, it should be understood that the present invention may include any number of sets of alternating dielectric layers and internal electrode layers and is not necessarily limited to such sets. In addition, each set of alternating dielectric layers and internal electrode layers may be separated from adjacent sets by a certain distance. For example, the distance is greater than the thickness of the individual dielectric layers in the set. In particular, the distance can be at least twice the thickness of the dielectric layers in the set, for example, at least three times, for example, at least five times, for example, at least ten times, etc.

[0022] An alternating set of dielectric layers and internal electrode layers can form at least a portion of the body of a capacitor. By arranging the dielectric layers and internal electrode layers in a stacked or laminated configuration, the capacitor can be referred to as a multilayer capacitor, and, for example, when the dielectric layers include ceramic, it can be referred to as a multilayer ceramic capacitor.

[0023] An alternating set of dielectric layers and internal electrode layers includes dielectric layers arranged alternately with the internal electrode layers. In particular, the internal electrode layers include a first internal electrode layer and a second internal electrode layer that are interleaved, spaced apart and facing each other, such that the dielectric layers are positioned between each other.

[0024] Generally, the thickness of the dielectric layer and the internal electrode layer is not limited and can be any desired thickness depending on the performance characteristics. For example, the thickness of the internal electrode layer is not limited to approximately 500 nm or more, for example approximately 1 μm or more, for example approximately 2 μm or more, for example approximately 10 μm or less, for example approximately 5 μm or less, for example approximately 4 μm or less, for example approximately 3 μm or less, for example approximately 2 μm or less, etc. For example, the internal electrode layer can have a thickness of approximately 1 μm to approximately 2 μm.

[0025] In addition, the present invention is not necessarily limited to the number of internal electrode layers in each set of alternating dielectric layers and internal electrode layers, or in the capacitor as a whole. For example, each set may include 10 or more, for example 25 or more, for example 50 or more, for example 100 or more, for example 200 or more, for example 300 or more, for example 500 or more, for example 600 or more, for example 750 or more, for example 1,000 or more internal electrode layers. Each set can have an internal electrode layer of 5,000 or less, for example, 4,000 or less, for example, 3,000 or less, for example, 2,000 or less, for example, 1,500 or less, for example, 1,000 or less, for example, 750 or less, for example, 500 or less, for example, 400 or less, for example, 300 or less, for example, 250 or less, for example, 200 or less, for example, 175 or less, for example, 150 or less, etc. Furthermore, the entire capacitor can contain the above number of electrode layers.

[0026] Each of the multiple internal electrode layers, which alternate with multiple dielectric layers, includes a first electrode and a second (counter) electrode. For example, each first internal electrode layer includes a first electrode and a second electrode, and each second internal electrode layer includes a first electrode and a second electrode. The second internal electrode layer may have a mirror-symmetric structure similar to that of the first internal electrode.

[0027] The first and second electrodes of the internal electrode layer are coplanar in the longitudinal and transverse directions, i.e., substantially in the same plane. The first electrode includes a central portion or main body portion, which extends toward the other external terminal away from the external terminal and one end of the first electrode. Such a portion can extend directly from the external terminal. Alternatively, such a portion can extend from the base portion of the first electrode, which also extends from the external terminal together with the central portion or main body portion. Generally, the base portion of the first electrode extends along the lateral edge of the first electrode adjacent to the external terminal. In addition, the main bodies of the first electrodes of adjacent electrode layers overlap at least partially in the horizontal direction.

[0028] The central portion or main body of the first electrode can have a specific length in the longitudinal direction, for example, the length being the distance of the main body of the first electrode from a side edge adjacent to and connected to an external terminal to the opposing side edge of the central portion or main body. For example, the internal electrode layer (including the first and second electrodes) extends between the first external terminal and the second external terminal. The main body of the first electrode can extend for 40% or more, for example, 50% or more, for example, 55% or more, for example, 60% or more, for example, 65% or more, for example, 70% or more, etc., of the length of the capacitor body in the longitudinal direction between the opposing end surfaces (i.e., the length between the external terminals formed along the end surfaces). The main body of the first electrode can extend to less than 100% of the length of the capacitor body, for example, to 90% or less, 85% or less, 80% or less, 75% or less, 70% or less, 65% or less, and so on.

[0029] The second (counter) electrode in each internal electrode layer can extend for 5% or more of the distance between the first external terminal and the second external terminal, for example, 10% or more, for example, 15% or more, for example, 18% or more, for example, 20% or more, for example, 22% or more. The second electrode can extend for 50% or less of the distance between the first external terminal and the second external terminal, for example, 40% or less, for example, 35% or less, for example, 30% or less, for example, 25% or less.

[0030] In addition, a gap may exist within the internal electrode layer between the central portion or main body portion of the first electrode and the second electrode. Such a gap may be 2% or more of the distance between the first external terminal and the second external terminal, for example, 5% or more, for example, 7% or more, for example, 9% or more, for example, 10% or more, for example, 12% or more, etc. Such a gap may be 40% or less of the distance between the first external terminal and the second external terminal, for example, 30% or less, for example, 25% or less, for example, 20% or less, for example, 15% or less, for example, 13% or less, for example, 11% or less, etc.

[0031] The gap can be 5% or more of the length of the central part of the first electrode, for example, 7% or more, for example, 10% or more, for example, 13% or more, for example, 15% or more, for example, 18% or more, for example, 20% or more. The gap can be 40% or less of the length of the central part of the first electrode, for example, 35% or less, for example, 30% or less, for example, 25% or less, for example, 22% or less, for example, 20% or less, for example, 18% or less, for example, 15% or less.

[0032] Furthermore, the main body of the first electrode in each internal electrode layer has an upper edge and a bottom edge opposite the upper edge. The main body also has two side edges extending between the upper and bottom edges. The side edges, upper edge, and bottom edge define the main body of the first electrode. Generally, the main body can have a rectangular configuration or shape.

[0033] Generally, the upper and lower edges of the main body can have the same dimensions (e.g., length or longitudinal L). The side edges of the main body can have the same dimensions (e.g., height T). Generally, the side edges can have shorter dimensions (e.g., height T) than the dimensions (e.g., length or longitudinal L) of the upper and / or lower edges. In this regard, the height of the side edges of the main body when they extend between the upper and lower surfaces of the capacitor can be less than the length of the upper and / or lower edges when they extend between the end surfaces of the capacitor. In other words, the main body can have upper and / or lower edges that are larger in dimension than side edges of smaller dimension. In this regard, the "short" side of the internal electrode layer can coincide with the height direction of the capacitor.

[0034] The internal electrode layer has lead tabs extending from the main body portion of the first electrode. The lead tabs extend from the upper and bottom edges. In other words, the internal electrode layer may have lead tabs extending from the "longer" side or edge of the layer. The lead tabs may extend to the edge of the dielectric layer and / or the surface of the capacitor. For example, in a stacked configuration, the leading edge of each lead tab may extend to the edge of the dielectric layer. Such leading edges may be used to form external terminals. In addition, the upper and bottom edges of the first electrode of the internal electrode layer may have at least one lead tab extending from there, for example, at least two lead tabs, for example, at least three lead tabs, for example, at least four lead tabs, and so on.

[0035] Each upper and lower edge of the main body of the first electrode may have an equal number of lead tabs extending from it. For example, each upper and lower edge may have at least one lead tab extending from it. In another embodiment, each upper and lower edge may have at least two lead tabs extending from it. However, it should be understood that the present invention may and may not necessarily include any number of lead tabs extending from the internal electrode layer.

[0036] In one embodiment, at least one lead tab extends from the upper edge of the main body of the first electrode of the internal electrode layer, and at least one lead tab extends from the bottom edge, and the edge of at least one lead tab is aligned with the side edge of the main body. For example, at least one lateral edge (i.e., an edge that coincides with the height direction) of at least one lead tab extending from the upper edge or at least one lead tab extending from the bottom edge can be substantially aligned with the respective side edges of the main body of the first electrode. In this regard, at least one lead tab does not have to be offset from the side edge of the main body.

[0037] In addition, when more than one lead tab can be present along the edge, the lead tabs can extend from the inner portions of the upper and bottom edges of the main body of the first electrode. In this respect, the lead tabs do not have to extend immediately from the lateral edges of the main body. In other words, the lead tabs can be offset from the lateral edges of the main body. The offset may be offset and positioned between the lateral edges of the main body (in particular, at a position that is at least 50% of the length of the main body (for example, beyond the center of the main body)).

[0038] Lead tabs extending from the upper edge and the bottom edge of each first electrode in the internal electrode layer can be offset by the same distance from the lateral edge. In this regard, at least one lateral edge of the lead tab (i.e., the edge that coincides with the height direction) can be substantially aligned. In one embodiment, both lateral edges of each lead tab can be substantially aligned.

[0039] Similarly, the length of a lead tab extending from the upper edge (i.e., extending longitudinally or lengthwise from one end surface to another) can be the same as the length of a corresponding lead tab extending from the bottom edge.

[0040] The length of the lead tab can be 0.3 mm or more, for example, 0.4 mm or more, for example, 0.5 mm or more, for example, 0.6 mm or more, for example, 0.7 mm or more. The length of the lead tab can be 1.1 mm or less, for example, 0.9 mm or less, for example, 0.8 mm or less, for example, 0.7 mm or less, for example, 0.6 mm or less, for example, 0.5 mm or less. When there are more than one lead tab along the edge, each lead tab can be of the same length.

[0041] In another embodiment, each lead tab can have a different length. For example, a lead tab substantially aligned with the side edge of the main body of the first electrode can have a longer length than a lead tab offset from the side edge of the main body. In this regard, the ratio of the length of the lead tab aligned with the side edge of the main body to the length of the lead tab offset from the side edge of the main body can be 0.3 or greater, for example, 0.5 or greater, for example, 0.7 or greater, for example, 0.9 or greater, for example, 1 or greater, for example, 1 or greater, for example, 1.1 or greater, for example, 1.2 or greater, for example, 1.3 or greater, for example, 1.4 or greater, for example, 1.5 or greater. The ratio can be 5 or less, for example, 4 or less, for example, 3 or less, for example, 2 or less, for example, 1.8 or less, for example, 1.7 or less, for example, 1.6 or less, for example, 1.5 or less, for example, 1.4 or less.

[0042] Being substantially aligned means that the offset from the side edge to one lateral edge of the first lead tab and / or second lead tab at the upper edge is within + / -10% of the offset from the side edge to the corresponding lateral edge of the first lead tab and / or second lead tab at the bottom edge, for example, within + / -5%, for example, within + / -4%, for example, within + / -3%, for example, within + / -2%, for example, within + / -1%, for example, within + / -0.5%, etc.

[0043] The distance between adjacent exposed lead tabs of the internal electrode layer in a given row can be specifically designed to ensure guided formation of the terminations. Such a distance between exposed lead tabs of the internal electrode layer in a given row can be about 10 microns or less, for example, about 8 microns or less, for example, about 5 microns or less, for example, about 4 microns or less, for example, about 2 microns or less, for example, about 1.5 microns or less, for example, about 1 micron or less. The distance can be about 0.25 microns or more, for example, about 0.5 microns or more, for example, about 1 micron or more, for example, about 1.5 microns or more, for example, about 2 microns or more, for example, about 3 microns or more. However, it should be understood that such a distance may not necessarily be limited.

[0044] Additionally, the distance between adjacent columnar stacks of electrode tabs can be at least twice the distance between adjacent lead tabs in a given column, but is not limited to this, to ensure that individual terminations do not mix. In some embodiments, the distance between adjacent columnar stacks of exposed metallization is about four times the distance between adjacent exposed electrode tabs in a particular stack. However, such distances can vary depending on the desired capacitance performance and circuit board configuration.

[0045] The distance can be 0.1 mm or more, for example, 0.2 mm or more, for example, 0.3 mm or more, for example, 0.4 mm or more, for example, 0.5 mm or more, for example, 0.6 mm or more. The distance can be 1.5 mm or less, for example, 1.3 mm or less, for example, 1 mm or less, for example, 0.9 mm or less, for example, 0.7 mm or less, for example, 0.6 mm or less, for example, 0.5 mm or less, for example, 0.4 mm or less. In one embodiment, such a distance can be determined based on the center point of each lead tab. In another embodiment, such a distance can be based on the distance between adjacent lateral edges of the lead tabs. In addition, such a distance can correspond to the separation distance of balls on a ball grid array.

[0046] In a set of alternating dielectric and internal electrode layers, the lead tabs of the first and second internal electrode layers are offset from each other in the longitudinal direction. That is, the lead tabs of each internal electrode layer can be symmetrically offset by a certain distance from the centerline of the internal electrode layer and / or dielectric layer (e.g., from the longitudinal centerline or with respect to the perpendicular line). That is, the lead tabs of each internal electrode layer can be symmetrically offset with respect to the perpendicular line of the internal electrode layer and / or dielectric layer. Nevertheless, a gap region is formed between the lead tabs of each internal electrode layer.

[0047] In addition, the internal electrode layer can be symmetrical in a given direction, regardless of the number of lead tabs extending from it. For example, the lead tabs can be symmetrical with respect to a horizontal line passing through the center of the main body of the first electrode (i.e., a line extending from the center of one side edge of the first electrode in the internal electrode layer to the center of the other side edge).

[0048] Furthermore, as shown herein, each first electrode of the internal electrode layer includes at least two side edges. When stacked to form the body of the capacitor, such side edges of the first electrodes of the alternating internal electrode layers do not have to be substantially aligned with each other. For example, the side edges can be offset from each other.

[0049] As described herein, a capacitor includes one set of alternating dielectric layers and internal electrode layers. If the capacitor includes a second set of alternating dielectric layers and internal electrode layers, in one embodiment, the distance between a first internal electrode layer in one set and the last internal electrode layer in another set can be greater than the distance between adjacent internal electrode layers in a given set. For example, the distance between a first internal electrode layer in the first set and the last internal electrode layer in the second set can be greater than the distance between a first internal electrode layer in the first set and the second internal electrode layer.

[0050] Furthermore, the capacitor of the present invention includes external terminals on the top surface and the bottom surface. The capacitor also includes external terminals on the opposing end surfaces. In one particular embodiment, it is possible that the external terminals are not present on the side surfaces of the capacitor. For example, external terminals present on the top and bottom surfaces extend only to the end surfaces, and the respective top and bottom external terminals (including the wrap-around ends) are not in contact with each other. In this regard, each external terminal is in contact with three surfaces (for example, the top surface, one end surface, and the bottom surface, and the top surface, the other end surface, and the bottom surface) by wrapping around them. Such wrap-around ends can be provided by using various electrode configurations (including anchor or dummy electrodes as described herein).

[0051] Additionally, the capacitor includes a first external terminal and a second external terminal. Generally, the first electrode of the first internal electrode layer and the second electrode of the second internal electrode layer are electrically connected to the first external terminal. On the other hand, the first electrode of the second internal electrode layer and the second electrode of the first internal electrode layer are electrically connected to the second external terminal. As described herein, the second electrode of the internal electrode layer can be an anchor or dummy electrode (also referred to as an anchor or dummy tab) configured to assist in the formation of the first and second external terminals.

[0052] The external terminals include at least one first polarity terminal and at least one second and opposite polarity terminal. The capacitor may include at least one, for example, at least two, for example, at least four, for example, at least six, for example, at least eight, etc., first polarity terminals and / or second and opposite polarity terminals on the upper surface of the capacitor. In addition, the capacitor may include the above-mentioned number of terminals on the bottom surface of the capacitor.

[0053] A capacitor may have an equal number of first polarity terminals and / or second polarity terminals on its top surface and bottom surface. The number of first polarity terminals may be equal to the number of second and opposite polarity terminals on the top surface of the capacitor. The number of first polarity terminals may be equal to the number of second and opposite polarity terminals on the bottom surface of the capacitor. The total number of terminals present on the top surface of the capacitor may be equal to the total number of terminals present on the bottom surface of the capacitor. The total number of first polarity terminals present on the top and bottom surfaces of the capacitor may be equal to the total number of second and opposite polarity terminals present on the top and bottom surfaces of the capacitor.

[0054] Generally, similar polarity terminals on the bottom surface of a capacitor, corresponding to a particular set of alternating dielectric and internal electrode layers, are electrically connected to similar polarity terminals on the top surface of the capacitor. Similar polarity terminals located on the top and bottom surfaces of a capacitor do not necessarily have to mesh with each other. In this regard, corresponding similar polarity terminals on the top and bottom surfaces may not be offset by their terminal position, but instead may be positioned directly above or below another similar polarity terminal on the opposite top or bottom surface. In other words, corresponding similar polarity terminals, and above all, corresponding lead tabs of such sets, corresponding to a particular set of alternating dielectric and internal electrode layers, can be substantially aligned. The substantial alignment means that the offset of one lateral edge of a polarity terminal on the upper surface from the side edge is within + / -10% of the offset of the corresponding polarity terminal on the bottom surface from the side edge, for example, within + / -5%, within + / -4%, within + / -3%, within + / -2%, within + / -1%, within + / -0.5%, etc.

[0055] Generally, the pitch of external terminals (i.e., the nominal distance between centers, also called the center-to-center spacing) can be determined by a particular circuit board configuration. The pitch between external terminals in one direction (i.e., the x-direction or the y-direction) can be the same as the pitch between adjacent external terminals in the other direction (i.e., the y-direction or the x-direction, respectively). That is, the pitch between any two adjacent external terminals can be substantially the same as the pitch between any other two adjacent external terminals.

[0056] The pitch can be approximately 0.1 mm or more, for example, approximately 0.2 mm or more, for example, approximately 0.3 mm or more, for example, 0.4 mm or more, for example, approximately 0.5 mm or more, for example, approximately 0.6 mm or more, for example, approximately 0.7 mm or more, for example, approximately 0.8 mm or more, for example, approximately 0.9 mm or more, for example, approximately 1.0 mm or more. The pitch can be approximately 2.0 mm or less, for example, approximately 1.5 mm or less, for example, approximately 1.4 mm or less, for example, approximately 1.3 mm or less, for example, approximately 1.2 mm or less, for example, approximately 1.1 mm or less, for example, approximately 1.0 mm or less. For example, the pitch can be approximately 0.2 mm, approximately 0.4 mm, approximately 0.6 mm, approximately 0.8 mm, approximately 1.0 mm, approximately 1.2 mm, etc. In particular, the pitch can be 0.6 mm, 0.8 mm, or 1.0 mm. In one embodiment, the pitch can be about 0.6 mm, for example, 0.6 mm + / - 10%, for example, + / - 5%, for example, + / - 2%, for example, + / - 1%, etc. In another embodiment, the pitch can be about 0.8 mm, for example, 0.8 mm + / - 10%, for example, + / - 5%, for example, + / - 2%, for example, + / - 1%, etc. In a further embodiment, the pitch can be about 1 mm, for example, 1 mm + / - 10%, for example, + / - 5%, for example, + / - 2%, for example, + / - 1%, etc.

[0057] As shown above, the extension of the leading edge of the lead tab can assist in the formation of external terminals. In this regard, the pitch between the lead tab on the first electrode of the first internal electrode layer and the lead tab on the first electrode of the second internal electrode layer can be the same as that described above. That is, the pitch between the lead tab on the first electrode of the first internal electrode layer and the lead tab on the second electrode of the second internal electrode layer can be substantially the same as the pitch between the corresponding external terminals from which the lead tab is used during formation.

[0058] In addition, external terminals can be positioned in a manner similar to that of a ball grid array. For example, external terminals can be provided to make contact in a manner typically used by a ball grid array (particularly a surrounding ball grid array). In this regard, the pitch of the external terminals can be the same as the pitch of the surrounding ball grid array. That is, the pitch can be within 10% of the pitch of the surrounding ball grid array, for example, within 5%, within 2%, within 1%, within 0.5%, within 0.1%, etc.

[0059] In addition, as in a ball grid array, external terminals can be provided in rows and columns. That is, external terminals can be provided such that they exist in at least one row and at least two columns. For example, external terminals can be provided in at least one row, for example, at least two rows, for example, at least three rows, for example, at least four rows, for example. The number of rows can be determined by the number of different sets of alternating dielectric layers and internal electrode layers. In addition, external terminals can be provided in at least two columns, for example, at least three columns, for example, at least four columns, for example. The number of columns can be determined by the number of different columnar tabs of the internal electrodes.

[0060] Furthermore, the length of an external terminal extending longitudinally or lengthwise along the upper surface can be the same as the length of a corresponding external terminal extending along the bottom surface. The length of the external terminals can be measured from one terminal end surface to another, and these terminals face each other in the longitudinal direction.

[0061] The length of the external terminals can be 0.3 mm or more, for example, 0.4 mm or more, for example, 0.5 mm or more, for example, 0.6 mm or more, for example, 0.7 mm or more. The length of the external terminals can be 1.1 mm or less, for example, 0.9 mm or less, for example, 0.8 mm or less, for example, 0.7 mm or less, for example, 0.6 mm or less, for example, 0.5 mm or less. When there is more than one external terminal along the surface, each external terminal can have the same length. Furthermore, the length of the external terminals can be less than the length of the capacitor, for example, 50% or less of the length of the capacitor, for example, 40% or less, for example, 30% or less, for example, 25% or less, for example, 20% or less, for example, 15% or less.

[0062] In another embodiment, each external terminal can have a different length. For example, an external terminal adjacent to an end surface can have a longer length than an external terminal offset from the end surface. In this regard, the ratio of the length of an external terminal adjacent to an end surface to the length of an external terminal offset from the end surface can be 0.3 or greater, for example, 0.5 or greater, for example, 0.7 or greater, for example, 0.9 or greater, for example, 1 or greater, for example, 1 or greater, for example, 1.1 or greater, for example, 1.2 or greater, for example, 1.3 or greater, for example, 1.4 or greater, for example, 1.5 or greater. The ratio can be 5 or less, for example, 4 or less, for example, 3 or less, for example, 2 or less, for example, 1.8 or less, for example, 1.7 or less, for example, 1.6 or less, for example, 1.5 or less, for example, 1.4 or less.

[0063] Furthermore, the width of external terminals extending laterally or in the width direction can be the same on the top and bottom surfaces. The width of external terminals can be measured from one terminal side surface to another, where they face each other laterally.

[0064] The width of the external terminals can be 0.3 mm or more, for example, 0.4 mm or more, for example, 0.5 mm or more, for example, 0.6 mm or more, for example, 0.7 mm or more. The width of the external terminals can be 1.1 mm or less, for example, 0.9 mm or less, for example, 0.8 mm or less, for example, 0.7 mm or less, for example, 0.6 mm or less, for example, 0.5 mm or less. When there are more than one external terminal along the surface, each external terminal can have the same width. Furthermore, the width of the external terminals can be smaller than the width of the capacitor.

[0065] As described herein, the formation of external terminals or external terminations is generally guided by the location of the exposed edges of the internal electrode layer. Such a phenomenon can be referred to as "self-determinism" because the formation of the externally plated terminal is determined by the configuration of the exposed conductive metal of the electrode layer at a selected peripheral location on the capacitor. In some embodiments, the capacitor may include "dummy tabs" for providing exposed conductive metal along a portion of the capacitor body that does not contain other electrodes (e.g., active or shield electrodes). In some embodiments, one or more "dummy tabs," "dummy electrodes," anchor tabs, and / or anchor electrodes may be additional features for a nucleate function that occurs, for example, during an FCT (Fine Copper Termination, Electroless Plating) process. Such dummy or anchor tabs or electrodes may be positioned internally or externally to the body of the component to nucleate the metallized plating material to form the externally plated terminal in the FCT process. For example, a first set of dummy tabs can be connected to a first external terminal, and a second set of dummy tabs can be connected to a second external terminal. Generally, the second electrode of the internal electrode layer can be a dummy or anchor tab or electrode that assists in the formation of the first and second external terminals.

[0066] The second electrode (i.e., dummy or anchor tab or electrode) can have any configuration known in the art. For example, in some embodiments, the second electrode can have a rectangular configuration or shape, while in other embodiments, the second electrode can have a C-shaped or L-shaped configuration. For example, the second electrode can have a base portion and at least one (e.g., two) electrode arms extending from the base portion (particularly from the lateral ends of the base portion). Such electrode arms can extend longitudinally away from the ends of the capacitor body. Furthermore, such electrode arms of the second electrode can be longitudinally aligned. However, it will be recognized that the second electrode can have any shape as is generally known in the art.

[0067] The capacitor of the present invention can be further described according to embodiments as illustrated in Figures 1A to 1E and Figures 2A to 2C.

[0068] Figure 1A illustrates a capacitor 10 in a 1x2 configuration. That is, the capacitor 10 includes two external terminals arranged in a linear manner in a single dimension on the top and bottom surfaces of the capacitor. In the embodiment depicted, the capacitor 10 includes external terminals arranged in a linear manner or in a single row along the longitudinal direction L, which can be referred to as a linear terminal arrangement.

[0069] In addition, the capacitor includes terminals along its end surfaces, with each terminal wrapping around the adjacent end surface from the top surface to the bottom surface. In this respect, the capacitor 10 includes a body portion 16 having external terminals 12, 14, including a first external terminal 12 and a second external terminal 14. The first external terminal 12 is disposed on the top surface 18a, the end surface 18c, and the bottom surface 18b, and is electrically connected to the first internal electrode layer 105 (Figures 1B to 1E). The second external terminal 14 is disposed on the top surface 18a, the end surface 18d, and the bottom surface 18b, and is electrically connected to the second internal electrode layer 115 (Figures 1B and 1C).

[0070] Additionally, the capacitor 10 in Figure 1A includes at least one first polarity terminal 12 and at least one second and opposite polarity terminal 14 on the upper surface 18a. Although not shown, the bottom surface 18b includes at least one first polarity terminal 12 and the second and opposite terminal 14.

[0071] The main body 16 of the capacitor 10 has a length 15 extending in the longitudinal direction or length direction L. The length 15 can be measured from one end surface 18c to the opposite end surface 18d. Furthermore, the main body 16 of the capacitor 10 has a width 17 extending in the lateral direction or width direction W. The width 17 can be measured from one side surface 18e to the opposite side surface 18e. In addition, the main body 16 of the capacitor 10 has a height 19 extending in the vertical direction or height direction T. The height 19 can be measured from the upper surface 18a to the opposite bottom surface 18b.

[0072] As shown in Figure 1A, the external terminals 12 and 14 have a terminal width BW that extends in the lateral or width direction W. The external terminals 12 and 14 also have a terminal length BL along the upper surface 18a, and this terminal length BL extends in the longitudinal or length direction L. Furthermore, one or both terminals 12 and 14 may have a terminal length BL along the bottom surface 18b, which may be the same as or different from the terminal length BL along the upper surface 18a.

[0073] Referring to Figures 1A to 1C, the capacitor 10 includes external terminals 12 and 14, and a set of alternating dielectric layers and internal electrode layers 110. Referring particularly to Figures 1B and 1C, the set of alternating dielectric layers and internal electrode layers 110 includes first and second internal electrode layers 105 and 115 and dielectric layers (not shown) in an alternating arrangement.

[0074] Generally, each of the first internal electrode layers 105 includes a first electrode 101 and a second electrode 102, and each of the second internal electrode layers 115 includes a first electrode 103 and a second electrode 104. Furthermore, the internal electrode layers 105, 115 include at least one lead tab 120, 130, 140, 150 extending vertically or along the height direction T from the upper and bottom edges of the main body portions of the first electrodes 101, 103. Thus, the lead tabs 120, 130, 140, 150 extend perpendicularly from the main body portions to the lengths 107, 108 of the first electrodes 101, 103 and the length 15 of the capacitor body portion 16, where the lengths 107, 108 of the first electrodes and the length 15 of the capacitor body portion each extend along the longitudinal direction L.

[0075] Generally, the lead tabs 120, 130, 140, and 150 of the internal electrode layers 105 and 115 extend to the upper and bottom surfaces of the capacitor, assisting in the formation of the external terminals 12 and 14. In this regard, the lead tabs 120, 130, 140, and 150 are exposed on the upper surface 18a and bottom surface 18b of the capacitor, enabling connection between the main body portions of the first electrodes 101 and 103 and the external terminals 12 and 14.

[0076] For example, lead tabs 120, 130, 140, and 150 may include leading edges 123, 133, 143, and 153, which may extend to the edge of the dielectric layer, enabling the formation of external terminals. The leading edges 123, 133, 143, and 153 each extend along the longitudinal direction L and are spaced apart from the main body along the vertical or height direction T. The first external terminal 12 can be electrically connected to the first electrode 101 of the first internal electrode layer 105 along the leading edge 123 of lead tab 120 and the leading edge 133 of lead tab 130. Similarly, the second external terminal 14 can be electrically connected to the first electrode 103 of the second internal electrode layer 115 along the leading edge 143 of lead tab 140 and the leading edge 153 of lead tab 150.

[0077] As illustrated in Figures 1B and 1C, the first internal electrode layer 105 includes one lead tab 120, 130 extending from the main body 135 along the upper edge 105c and the bottom edge 105d. The second internal electrode layer 115 includes one lead tab 140, 150 extending from the main body 145 along the upper edge and the bottom edge.

[0078] The main body portions 135 and 145 of the first electrodes 101 and 103 of the respective internal electrode layers 105 and 115 have an upper edge portion 105c and a bottom edge portion 105d opposite the upper edge portion 105c along the vertical or height direction T. Each of the upper edge portion 105c and the bottom edge portion 105d extends along the longitudinal direction L. The main body portions 135 and 145 also have two side edges 105a and 105b that extend vertically or along the height direction T between the upper edge portion 105c and the bottom edge portion 105d. The side edges 105a and 105b, the upper edge portion 105c, and the bottom edge portion 105d define the main body portions 135 and 145 of the first electrodes 101 and 103. Generally, the main body portions 135 and 145 can have a rectangular configuration or shape.

[0079] The lead tabs 120 and 130 located on the upper and lower edges of the main body portion 135 can be aligned in the vertical or height direction T. For example, the lateral edges 121 and 122 of the first lead tab 120 along the upper edge 105c can be aligned with the lateral edges 131 and 132 of the first lead tab 130 along the lower edge 105d opposite the upper edge 105c. In addition, such lateral edges 121 and 131 can be aligned with the side edge 105a of the main body portion 135.

[0080] However, it should be understood that both lateral edges 121 and 122 of the first lead tab 120 along the upper edge 105c can be aligned with the lateral edges 131 and 132 of the first lead tab 130 along the bottom edge 105d opposite the upper edge 105c. In other words, the lateral edges 122 and 132 can be aligned, and both lateral edges 122 and 132 can be offset by the same distance from the lateral edges 105a and 105b along the bottom edge 105d and the upper edge 105c.

[0081] Similarly, the lead tabs 140 and 150 on the upper and lower edges of the main body portion 145 can be aligned in the vertical or height direction T. That is, the lateral edges 141 and 142 of the first lead tab 140 along the upper edge can be aligned with the lateral edges 151 and 152 of the first lead tab 150 along the lower edge opposite the upper edge. In one embodiment, both lateral edges 141 and 142 of the first lead tab 140 along the upper edge can be aligned with the lateral edges 151 and 152 of the first lead tab 150 along the lower edge opposite the upper edge. The relationship between the lateral edges of the first lead tabs at the upper edge and the lateral edges of the first lead tabs at the lower edge, as described with respect to the internal electrode layer 105, can also be applied to the internal electrode layer 115.

[0082] Such an arrangement allows a tab gap 116 to be formed between the lead tab 120 of the first internal electrode layer 105 and the lead tab 140 of the second internal electrode layer 115. Similarly, a tab gap 118 can be formed between the lead tab 130 of the first internal electrode layer 105 and the lead tab 150 of the second internal electrode layer 115. The sizes of the respective tab gaps 116 and 118 can be substantially the same.

[0083] The lead tabs 120 and 140 can be arranged in parallel with the lead tabs 130 and 150 extending from the internal electrode layers 105 and 115, respectively, so that the lead tabs extending from the alternating electrode layers 105 and 115 can be aligned in their respective rows. For example, the lead tabs 120 and 130 of the internal electrode layer 105 can be arranged in their respective stacked configurations, while the lead tabs 140 and 150 of the internal electrode layer 115 can be arranged in their respective stacked configurations.

[0084] It is understood that lead tab 120 is connected to external terminal 12, while lead tab 140 is connected to external terminal 14. Therefore, each lead tab 120 interlocks with each other with each other with the respective lead tab 140 in the same manner as external terminals 12 and 14. The interlocked lead tabs can provide multiple adjacent current injection points on the associated main electrode portion.

[0085] As shown in Figures 1B, 1D, and 1E, the second electrode 102 of the first internal electrode layer 105 is coplanar or substantially in the same plane as the first electrode 101, and as shown in Figure 1C, the second electrode 104 of the second internal electrode layer 115 is coplanar or substantially in the same plane as the first electrode 103. In one embodiment, the first electrode 101 can be viewed as having an end or base portion 109, which extends to the surface of the unterminated stack of dielectric and electrode layers and is exposed along the dimensions of the surface of the unterminated stack of dielectric and electrode layers. Similarly, the first electrode 103 can be viewed as having an end or base portion 111, which extends to the surface of the unterminated stack of dielectric and electrode layers and is exposed along the dimensions of the surface of the unterminated stack of dielectric and electrode layers. Each main body portion 135, 145 extends from its respective end portions 109, 111 along the longitudinal direction or length direction L, while the lead tabs 120, 130, 140, 150 extend from their respective end portions 109, 111 along the height direction T. The second electrodes 102, 104 extend to the surface of the unterminated stack of dielectric and electrode layers and are exposed along the surface of the unterminated stack of dielectric and electrode layers. Comparing Figures 1B and 1C, the second internal electrode layer 115 is configured similarly to the first internal electrode layer 105 and has a mirror-symmetric structure to that of the first internal electrode layer 105.

[0086] In the specific embodiments shown in Figures 1B and 1C, the respective second electrodes 102, 104 can be generally rectangular. However, in other embodiments, the second electrodes 102, 104 can have other shapes. For example, as shown in Figure 1D, each second electrode 102 can be generally C-shaped, with a first arm 102a extending from the end or top of the base portion 102c of the second electrode 102 and a second arm 102b extending from the end or bottom of the base portion 102c. Referring to Figure 1E, in another example, each second electrode 102 can be generally L-shaped, with an arm 102d extending from the end or top or bottom of the base portion 102c of the second electrode. In some embodiments of the L-shaped second electrode 102, an internal electrode layer 105 having an arm 102d extending from the end or base portion 102c can be alternately stacked with an internal electrode layer 105 (as well as dielectric layers and internal electrode layers 115 as described herein) having an arm 102d extending from the bottom of the end or base portion 102c. Figures 1D and 1E illustrate the second electrode 102 of the first internal electrode layer 105, but it will be recognized that the second electrode 104 of the second internal electrode layer 115 can be configured similarly to the illustrated second electrode 102 and can have a C-shape or an L-shape. Naturally, in other embodiments, the second electrodes 102, 104 can have any suitable shape.

[0087] In some embodiments, the first electrodes 101, 103 and the second electrodes 102, 104 extend along and / or are exposed along the entire surface of the unterminated stack of dielectric and electrode layers. In other embodiments, the first electrodes 101, 103 and the second electrodes 102, 104 do not extend along and / or are not exposed along the entire surface of the unterminated stack of dielectric and electrode layers.

[0088] The main body portion 135 of the first electrode 101 has a length 107 in the longitudinal direction or length direction L, and the main body portion 145 of the first electrode 103 has a length 108 in the longitudinal direction or length direction L. The lengths 107 and 108 are the distances between the main body portions 135 and 145 of the first electrodes 101 and 103, from the side edge adjacent to the external terminal and connected to the external terminal to the opposing side edge of the main body portions 135 and 145. For example, the first electrode 101 of the first internal electrode layer 105 may have a length 107 from side edge 105a to side edge 105b.

[0089] The main body portions 135 and 145 of the first electrodes 101 and 103 can extend for 40% or more of the length 15 of the capacitor body portion 16 (i.e., the length between opposing end surfaces 18c and 18d in the longitudinal direction or longitudinal direction L, as shown in Figure 1A), for example, 50% or more, for example, 55% or more, for example, 60% or more, for example, 65% or more, for example, 70% or more. The main body portions 135 and 145 of the first electrodes 101 and 103 can extend for less than 100% of the length 15 of the body portion 16 of the capacitor 10, for example, 90% or less, for example, 85% or less, for example, 80% or less, for example, 75% or less, for example, 70% or less, for example, 65% or less. For example, the main body sections 135 and 145 can extend to less than 50% to 100% of the length 15 of the capacitor body section 16.

[0090] As shown in Figures 1B to 1E, the second electrode 102 has a length 117 extending in the longitudinal direction or length direction L, and the second electrode 104 has a length 119 extending in the longitudinal direction or length direction L. The lengths 117 and 119 of the respective second electrodes 102 and 104 can be smaller than the length 15 of the capacitor body 16, that is, the lengths 117 and 119 of the respective second electrodes 102 and 104 can be a fraction or a percentage of the length 15 of the capacitor body 16. For example, the respective second electrodes 102 and 104 can extend from 5% to 50% of the length 15 of the capacitor body 16. As a further example, the second electrodes 102 and 104 in each internal electrode layer 105 and 115 can extend for 5% or more of the length 15 of the main body 16 of the capacitor 10, for example, 10% or more, for example, 15% or more, for example, 18% or more, for example, 20% or more, for example, 22% or more. The second electrodes 102 and 104 can extend for 50% or less of the length 15 of the main body 16 of the capacitor, for example, 40% or less, for example, 35% or less, for example, 30% or less, for example, 25% or less.

[0091] In addition, a gap 113 may exist within the first internal electrode layer 105 between the main body portion 135 of the first electrode 101 and the second electrode 102, and a gap 114 may exist within the second internal electrode layer 115 between the main body portion 145 of the first electrode 103 and the second electrode 104. Such gaps 113 and 114 can be 2% or more of the length 15 of the capacitor body portion 16, for example, 5% or more, for example, 7% or more, for example, 9% or more, for example, 10% or more, for example, 12% or more, etc. Such gaps 113 and 114 can be 40% or less of the length 15 of the capacitor body portion 16, for example, 30% or less, for example, 25% or less, for example, 20% or less, for example, 15% or less, for example, 13% or less, for example, 11% or less, etc. As one example, the gaps 113 and 114 can be between 2% and 40% of the length 15 of the capacitor body 16.

[0092] Each gap 113, 114 can be 5% or more of the length 107, 108 of the main body portions 135, 145 of the respective first electrodes 101, 103, for example, 7% or more, for example, 10% or more, for example, 13% or more, for example, 15% or more, for example, 18% or more, for example, 20% or more. The gaps 113, 114 can be 40% or less of the length 107, 108 of the main body portions 135, 145 of the respective first electrodes 101, 103, for example, 35% or less, for example, 30% or less, for example, 25% or less, for example, 22% or less, for example, 20% or less, for example, 18% or less, for example, 15% or less. For example, the gaps 113, 114 can be between 5% and 40% of the length 107, 108 of the main body portions 135, 145 of the respective first electrodes 101, 103.

[0093] Referring back to Figure 1A, the external terminals 12 and 14 can be a first external terminal 12 and a second external terminal 14. The first external terminal 12 is located at one end of the capacitor 10, for example, at the end of the body portion 16 adjacent to the end surface 18c, and the second external terminal 14 is located at the opposite end of the capacitor 10 along the longitudinal direction or length L, for example, at the end of the body portion 16 adjacent to the end surface 18d. The first external terminal 12 is electrically connected to the first electrode 101 of the first internal electrode layer 105 and the second electrode 104 of the second internal electrode layer 115. The second external terminal 14 is electrically connected to the second electrode 102 of the first internal electrode layer 105 and the first electrode 103 of the second internal electrode layer 115. As previously described, the external terminals of the capacitor 10 are wrapped around the capacitor body 16 from the upper surface 18a to the bottom surface 18b, with a portion of the first external terminal 12 formed along the end surface 18c and a portion of the second external terminal 14 formed along the end surface 18d. The second electrodes 102 and 104 can be dummy tabs or electrodes that extend to the respective ends of the body 16 to assist in the formation of the external terminals 12 and 14 along the end surfaces 18c and 18d.

[0094] Furthermore, in Figure 1A, the external terminals 12 and 14 of the capacitor 10 are positioned at a distance from the side surface of the main body 16. That is, the side surfaces of the external terminals 12 and 14 are positioned at a distance from the side surfaces 18e and 18f or the longer side of the main body 16 that extend along the longitudinal direction L between the end surfaces 18c and 18d, and only the dielectric material is disposed between the external terminals 12 and 14 and the side surfaces 18e and 18f of the main body 16. However, in other embodiments, one or both of the external terminals 12 and 14 can extend to one or both of the side surfaces of the capacitor main body 16, and may not be positioned at a distance from the side surface as shown in Figure 1A.

[0095] As illustrated in Figures 1A to 1E, the capacitor includes two external terminals formed on the top and bottom surfaces, and each internal electrode layer includes at least one lead tab extending from the top and bottom edges of the main body of the respective layer. However, as stated above, the present invention is not limited by the number of external terminals, and / or the number of lead tabs extending from the top and / or bottom edges.

[0096] For example, Figure 2A illustrates a capacitor 20 including four external terminals on the top and bottom surfaces, and two lead tabs extending from the top and bottom edges of the main body of each internal electrode layer. The same reference numerals as in Figures 1A to 1E are used in Figures 2A to 2C to indicate the same or similar features.

[0097] As illustrated in Figure 2A, the capacitor 20 has a 1x4 configuration. That is, the capacitor 20 includes four external terminals arranged in a linear manner in a single dimension on the top and bottom surfaces of the capacitor. In the embodiment depicted, the capacitor 20 includes external terminals arranged in a linear manner or in a single row along the longitudinal direction L, which can be referred to as a linear terminal arrangement.

[0098] In this regard, the capacitor 20 includes a main body 26, the main body 26 having a total of four external terminals 22a, 22b, 24a, and 24b on its upper surface 28a, and four corresponding external terminals (not shown) on its bottom surface 28b, the external terminals 22a, 22b, 24a, and 24b on the upper surface 28a being electrically connected to the corresponding external terminals 22a, 22b, 24a, and 24b on the bottom surface 28b.

[0099] In addition, the capacitor includes terminals along its end surfaces, with each terminal wrapping around the adjacent end surface from the top surface to the bottom surface. In this regard, the external terminals 22a, 22b, 24a, and 24b include a first external terminal 22a and a second external terminal 24a. The first external terminal 22a is located on the top surface 28a, the end surface 28c, and the bottom surface 28b and is electrically connected to the first internal electrode layer 205 (Figures 2B and 2C). The second external terminal 24a is located on the top surface 28a, the end surface 28d, and the bottom surface 28b and is electrically connected to the second internal electrode layer 215 (Figures 2B and 2C). The remaining external terminals include a third external terminal 22b on the upper surface 28a, a fourth external terminal 24b on the upper surface 28a, a fifth external terminal 22b on the bottom surface 28b, and a sixth external terminal 24b on the bottom surface 28b.

[0100] Additionally, the capacitor 20 in Figure 2A includes at least one first polarity terminal and at least one second and opposite polarity terminal on its upper surface. Although not shown, the bottom surface includes at least one first polarity terminal and the second and opposite terminal. In particular, as shown in Figure 2A, the capacitor 20 includes two positive terminals 22a, 22b and two negative terminals 24a, 24b on its upper surface 28a.

[0101] The main body 26 of the capacitor 20 has a length 25 extending in the longitudinal direction or length direction L, which can be measured from one end surface 28c to the opposite end surface 28d. Furthermore, the main body 26 of the capacitor 20 has a width 27 extending in the lateral direction or width direction W, which can be measured from one side surface 28e to the opposite side surface 28e. In addition, the main body 26 of the capacitor 20 has a height 29 extending in the vertical direction or height direction T, which can be measured from the upper surface 28a to the opposite bottom surface 28b.

[0102] As shown in Figure 2A, the external terminals 22a, 22b, 24a, and 24b each have a terminal width BW extending in the lateral or width direction W. Furthermore, the external terminals 22a and 24a have a terminal length BLA along the upper surface 18a, and this terminal length BLA extends in the longitudinal or length direction L. Similarly, the external terminals 22b and 24b have a terminal length BLB along the upper surface 18a, which extends in the longitudinal or length direction L. It is possible that one or both terminals 22a, 24a or one or both terminals 22b and 24b each have a terminal length BLA or BLB along the bottom surface 18b, which may be the same as or different from their respective terminal lengths BLA and BLB along the upper surface 18a.

[0103] Referring to Figures 2A to 2C, the capacitor 20 includes external terminals 22a, 22b, 24a, and 24b, and a set of alternating dielectric layers and internal electrode layers 210. Referring particularly to Figures 2B and 2C, the set of alternating dielectric layers and internal electrode layers 210 includes first and second internal electrode layers 205, 215 and dielectric layers (not shown) in an alternating arrangement.

[0104] Generally, each of the first internal electrode layers 205 includes a first electrode 201 and a second electrode 202, and each of the second internal electrode layers 215 includes a first electrode 203 and a second electrode 204. Furthermore, the internal electrode layers 205, 215 include at least one lead tab 220a, 220b, 230a, 230b, 240a, 240b, 250a, 250b extending vertically or along the height direction T from the upper and bottom edges of the main body portions of the first electrodes 201, 203. Therefore, the lead tabs 220a, 220b, 230a, 230b, 240a, 240b, 250a, and 250b extend from the main body perpendicular to the lengths 207 and 208 of the first electrodes 201 and 203 and the length 25 of the capacitor body 26, where the lengths 207 and 208 of the first electrodes and the length 25 of the capacitor body each extend along the longitudinal direction L.

[0105] Generally, the lead tabs 220a-b, 230a-b, 240a-b, and 250a-b of the internal electrode layers 205 and 215 extend to the upper and bottom surfaces of the capacitor, assisting in the formation of the external terminals 22a, 22b, 24a, and 24b. In this regard, the lead tabs 220a-b, 230a-b, 240a-b, and 250a-b are exposed on the upper and bottom surfaces 28a and 28b of the capacitor, enabling connections between the main bodies of the first electrodes 201 and 203 and the external terminals 22a, 22b, 24a, and 24b.

[0106] For example, the lead tabs 220a~b, 230a~b, 240a~b, and 250a~b may include leading edges 223a, 223b, 233a, 233b, 243a, 243b, 253a, and 253b, which extend to the edge of the dielectric layer, enabling the formation of external terminals. The leading edges 223a, 223b, 233a, 233b, 243a, 243b, 253a, and 253b each extend along the longitudinal direction L and are spaced apart from the main body along the vertical or height direction T. The first external terminal 22a can be electrically connected to the first electrode 201 of the first internal electrode layer 205 along the leading edge 223a of the lead tab 220a and the leading edge 233a of the lead tab 230a. Similarly, the second external terminal 14 can be electrically connected to the second electrode 102 of the first internal electrode layer 105 and the first electrode 103 of the second internal electrode layer 115 along the leading edge 143 of the lead tab 140 and the leading edge 153 of the lead tab 150.

[0107] As illustrated in Figures 2B and 2C, the first internal electrode layer 205 includes at least two lead tabs 220a, 220b, 230a, and 230b extending from the main body 235 along the upper edge 205c and the bottom edge 205d. For example, in the embodiment depicted, two lead tabs 220a and 220b extend from the main body 235 along the upper edge 205c, and two lead tabs 230a and 230b extend from the main body 235 along the bottom edge 205d. The second internal electrode layer 215 includes at least two lead tabs 240a, 240b, 250a, and 250b extending from the main body 245 along the upper edge and the bottom edge. For example, as shown in Figures 2B and 2C, two lead tabs 240a and 240b extend from the main body 245 along the upper edge, and two lead tabs 250a and 250b extend from the main body along the bottom edge.

[0108] As shown in the figure, the main body portion 235 of the first electrode 201 of the first internal electrode layer 205 has an upper edge portion 205c and a bottom edge portion 205d opposite the upper edge portion 205c along the vertical or height direction T. Each of the upper edge portion 205c and the bottom edge portion 205d extends along the longitudinal direction L. The main body portion 235 also has two side edges 205a and 205b that extend along the vertical or height direction T between the upper edge portion 205c and the bottom edge portion 205d. The side edges 205a and 205b, the upper edge portion 205c, and the bottom edge portion 205d define the main body portion 235 of the first electrode 201. It will be recognized that the main body portion 245 of the first electrode 203 of the second internal electrode layer 215 is defined by an upper edge, a bottom edge, and two side edges in the same or substantially similar manner as the main body portion 235 of the first electrode 201. Generally, the main body portions 235, 245 can have a rectangular configuration or shape.

[0109] The lead tabs 220a-b and 230a-b located on the upper edge 205c and bottom edge 205d of the main body portion 235 can be aligned in the vertical or height direction T. For example, the lateral edges 221a and 222a of the first lead tab 220a along the upper edge 205c can be aligned with the lateral edges 231a and 232a of the first lead tab 230a along the bottom edge 205d on the opposite side of the upper edge 205c. In addition, such lateral edges 221a and 231a can be aligned with the side edge 205a of the main body portion 235.

[0110] However, it should be understood that both lateral edges 221a, 222a of the first lead tab 220a along the upper edge 205c can be aligned with the lateral edges 231a, 232a of the first lead tab 230a along the bottom edge 205d opposite the upper edge 205c. In other words, the lateral edges 222a, 232a can be aligned with each other, and both lateral edges 222a, 232a can be offset by the same distance from the lateral edges 205a, 205b along the bottom edge 205d and the upper edge 205c.

[0111] When the upper edge 205c and the bottom edge 205d include at least two lead tabs 220a-b, 230a-b, at least one lateral edge of each lead tab on the upper edge 205c can be aligned with the corresponding lateral edge of the lead tab on the bottom edge 205d. Also, both lateral edges of each lead tab on the upper edge 205c can be aligned with the corresponding lateral edges of the lead tab on the bottom edge 205d.

[0112] Similarly, the lead tabs 240a, 240b, 250a, 250b located on the upper and lower edges of the main body portion 245 can be aligned in the vertical or height direction T. That is, the lateral edges 241a, 242a of the first lead tab 240 along the upper edge can be aligned with the lateral edges 251a, 252a of the first lead tab 250 along the lower edge opposite the upper edge. In one embodiment, both lateral edges 241a, 242a of the first lead tab 240a along the upper edge can be aligned with the lateral edges 251a, 252a of the first lead tab 250a along the lower edge opposite the upper edge. The relationship between the lateral edges of the first lead tabs at the upper edge and the lateral edges of the first lead tabs at the lower edge, as described with respect to the internal electrode layer 205, can also be applied to the internal electrode layer 215.

[0113] Such arrangements allow tab gaps to be formed between any of the lead tabs along the upper edge 205c of the first internal electrode layer 205, the second internal electrode layer 215, or both. For example, tab gaps can be formed between any of the lead tabs 220a-b, 240a-b extending from the upper edge of each internal electrode layer. Additionally, tab gaps can be formed between any of the lead tabs along the bottom edge 205d of the first internal electrode layer 205, the second internal electrode layer 215, or both. For example, tab gaps can be formed between any of the lead tabs 230a-b, 250a-b extending from the bottom edge of each internal electrode layer. Furthermore, the size of the tab gap between each pair of tabs extending from the upper edge (whether from the same internal electrode layer or from adjacent internal electrode layers) can be substantially the same as the size of the tab gap between each of the corresponding tabs extending from the bottom edge. For example, the first tab gap 216a between lead tab 220a and lead tab 220b can be substantially the same as the first tab gap 218a between lead tab 230a and lead tab 230b. Similarly, the second tab gap 216b between lead tab 220a and lead tab 240a can be substantially the same as the second tab gap 218b between lead tab 230 and lead tab 250a.

[0114] Any or all of the lead tabs 220a-b and 240a-b can be arranged in parallel with the lead tabs 230a-b and 250a-b extending from layers 205 and 215, respectively, so that the lead tabs extending from the alternating electrode layers 205 and 215 can be aligned in their respective rows. For example, the lead tabs 220a-b and 230a-b of the internal electrode layer 205 can be arranged in their respective stacked configurations, while the lead tabs 240a-b and 250a-b of the internal electrode layer 215 can be arranged in their respective stacked configurations.

[0115] It is understood that lead tabs 220a and 220b are connected to external terminals 22a and 22b, respectively, while lead tabs 240a and 240b are connected to external terminals 24a and 24b, respectively. Therefore, each lead tab 220a-b interlocks with each other's lead tabs 240a-b in the same manner as external terminals 22a-b and 24a-b. The interlocked lead tabs can provide multiple adjacent current injection points on the associated main electrode portion.

[0116] As shown in Figures 2B and 2C, the second electrode 202 of the first internal electrode layer 205 is coplanar or substantially in the same plane as the first electrode 201, and the second electrode 204 of the second internal electrode layer 215 is coplanar or substantially in the same plane as the first electrode 203. In one embodiment, the first electrode 201 can be seen as having an end or base portion 209, which extends to the surface of the unterminated stack of dielectric and electrode layers and is exposed along the dimensions of the surface of the unterminated stack of dielectric and electrode layers. Similarly, the first electrode 203 can be seen as having an end or base portion 211, which extends to the surface of the unterminated stack of dielectric and electrode layers and is exposed along the dimensions of the surface of the unterminated stack of dielectric and electrode layers. Each main body portion 235, 245 extends longitudinally or along the length direction L from its respective end portions 209, 211, and the lead tabs 220a, 230a, 240b, 250b extend along the height direction T from their respective end portions 209, 211. Similar to the first electrodes 201, 203, the second electrodes 202, 204 also extend to the surface of the unterminated stack of dielectric and electrode layers and are exposed along the surface of the unterminated stack of dielectric and electrode layers. Comparing Figures 2B and 2C, the second internal electrode layer 215 is configured similarly to the first internal electrode layer 205 and has a mirror-symmetric structure to that of the first internal electrode layer 205.

[0117] In the specific embodiments shown in Figures 2B and 2C, the second electrodes 202 and 204 can be generally rectangular. However, in other embodiments, the second electrodes 202 and 204 can have other shapes. For example, the second electrodes 202 and 204 can be generally C-shaped, or they can be generally L-shaped, as described above, for example, with respect to capacitor 10. Naturally, in other embodiments, the second electrodes 202 and 204 can have any suitable shape.

[0118] In some embodiments, the first electrodes 201, 203 and the second electrodes 202, 204 extend along and / or are exposed along the entire surface of the unterminated stack of dielectric and electrode layers. In other embodiments, the first electrodes 201, 203 and the second electrodes 202, 204 do not extend along and / or are not exposed along the entire surface of the unterminated stack of dielectric and electrode layers.

[0119] The main body portion 235 of the first electrode 201 has a length 207 in the longitudinal direction or length direction L, and the main body portion 245 of the first electrode 203 has a length 208 in the longitudinal direction or length direction L. The lengths 207 and 208 are the distances between the main body portions 235 and 245 of the first electrodes 201 and 203, from the side edge adjacent to the external terminal and connected to the external terminal to the opposing side edge of the main body portions 235 and 245. For example, the first electrode 201 of the first internal electrode layer 205 may have a length 207 from side edge 205a to side edge 205b.

[0120] The main body portions 235 and 245 of the first electrodes 201 and 203 can extend for 40% or more of the length 25 of the capacitor body portion 26 (i.e., the length between opposing end surfaces 28c and 28d in the longitudinal direction or longitudinal direction L, as shown in Figure 2A), for example, 50% or more, for example, 55% or more, for example, 60% or more, for example, 65% or more, for example, 70% or more. The main body portions 235 and 245 of the first electrodes 201 and 203 can extend for less than 100% of the length 25 of the body portion 26 of the capacitor 20, for example, 90% or less, for example, 85% or less, for example, 80% or less, for example, 75% or less, for example, 70% or less, for example, 65% or less. For example, the main body sections 235 and 245 can extend to less than 50% to 100% of the length 25 of the capacitor body section 26.

[0121] As shown in Figures 2B and 2C, the second electrode 202 has a length 217 extending in the longitudinal direction or length direction L, and the second electrode 204 has a length 219 extending in the longitudinal direction or length direction L. The lengths 217 and 219 of the respective second electrodes 202 and 204 can be smaller than the length 25 of the capacitor body 26, that is, the lengths 217 and 219 of the respective second electrodes 202 and 204 can be a fraction or a percentage of the length 25 of the capacitor body 26. For example, the respective second electrodes 202 and 204 can extend from 5% to 50% of the length 25 of the capacitor body 26. As a further example, the second electrodes 202 and 204 in each internal electrode layer 205 and 215 can extend for 5% or more of the length 25 of the main body 26 of the capacitor 20, for example, 10% or more, for example, 15% or more, for example, 18% or more, for example, 20% or more, for example, 22% or more. The second electrodes 202 and 204 can extend for 50% or less of the length 25 of the main body 26 of the capacitor 26, for example, 40% or less, for example, 35% or less, for example, 30% or less, for example, 25% or less.

[0122] In addition, a gap 213 may exist within the first internal electrode layer 205 between the main body portion 235 of the first electrode 201 and the second electrode 202, and a gap 214 may exist within the second internal electrode layer 215 between the main body portion 245 of the first electrode 203 and the second electrode 204. Such gaps 213 and 214 can be 2% or more of the length 25 of the capacitor body portion 26, for example, 5% or more, for example, 7% or more, for example, 9% or more, for example, 10% or more, for example, 12% or more, etc. Such gaps 213 and 214 can be 40% or less of the length 25 of the capacitor body portion 26, for example, 30% or less, for example, 25% or less, for example, 20% or less, for example, 15% or less, for example, 13% or less, for example, 11% or less, etc. As one example, the gaps 213 and 214 can be between 2% and 40% of the length 25 of the capacitor body 26.

[0123] Each gap 213, 214 can be 5% or more of the length 207, 208 of the main body portions 235, 245 of the respective first electrodes 201, 203, for example, 7% or more, for example, 10% or more, for example, 13% or more, for example, 15% or more, for example, 18% or more, for example, 20% or more. The gaps 213, 214 can be 40% or less of the length 207, 208 of the main body portions 235, 245 of the respective first electrodes 201, 203, for example, 35% or less, for example, 30% or less, for example, 25% or less, for example, 22% or less, for example, 20% or less, for example, 18% or less, for example, 15% or less. For example, the gaps 213, 214 can be between 5% and 40% of the length 207, 208 of the main body portions 235, 245 of the respective first electrodes 201, 203, for example, 35% or less, for example, 30% or less, for example, 25% or less, for example, 22% or less, for example, 20% or less, for example, 18% or less, for example, 15% or less.

[0124] Referring back to Figure 2A, the external terminals 22a, 22b, 24a, and 24b may include a first external terminal 22a and a second external terminal 24a, the first external terminal 22a being located at one end of the capacitor 20, for example, at the end of the body portion 26 adjacent to the end surface 28c, and the second external terminal 24a being located at the opposite end of the capacitor 20 along the longitudinal direction or length L, for example, the second external terminal 24a being located at the end of the body portion 26 adjacent to the end surface 28d. The first external terminal 22a is electrically connected to the first electrode 201 of the first internal electrode layer 205 and the second electrode 204 of the second internal electrode layer 215. The second external terminal 24a is electrically connected to the second electrode 202 of the first internal electrode layer 205 and the first electrode 203 of the second internal electrode layer 215. As previously described, the first and second external terminals 22a, 24a (or end external terminals) of the capacitor 20 are wrapped around the capacitor body 26 from the upper surface 28a to the bottom surface 28b, with a portion of the first external terminal 22a formed along the end surface 28c and a portion of the second external terminal 24a formed along the end surface 28d. The second electrodes 202, 204 can be dummy tabs or electrodes that extend to the respective ends of the body 26 to assist in the formation of the external terminals 22a, 24a along the end surfaces 28c, 28d.

[0125] Furthermore, in Figure 2A, the external terminals 22a, 22b, 24a, and 24b of the capacitor 20 are spaced apart from the side surfaces of the main body 26. That is, the side surfaces of the external terminals 22a-b and 24a-b are spaced apart from the side surfaces 28e, 28f or the longer side of the main body 26 that extends along the longitudinal direction L between them and the end surfaces 28c, 28d, and only the dielectric material is disposed between the external terminals 22a-b and 24a-b and the side surfaces 28e, 28f of the main body 26. However, in other embodiments, one or more of the external terminals 22a-b and 24a-b can extend to one or both of the side surfaces of the capacitor main body 26, and may not be spaced apart from the side surfaces as shown in Figure 2A.

[0126] As illustrated in Figures 2A to 2C, the capacitor includes four external terminals formed on the top and bottom surfaces, two of which also extend along their respective end surfaces. Furthermore, each internal electrode layer includes at least two lead tabs extending from the top and bottom edges of the main body of each layer. However, as shown above, the present invention is not limited by the number of external terminals, the number of lead tabs extending from the top and / or bottom edges, and / or the number of sets of alternating dielectric layers and internal electrode layers.

[0127] Additionally, the embodiment shown in the figure uses only two internal electrode layers per set of alternating dielectric layers and internal electrode layers. However, it should be understood that the present invention can and is not necessarily limited to including any number of internal electrode layers per set, as shown herein.

[0128] Generally, the present invention provides a capacitor having a unique configuration that offers various benefits and advantages. In this regard, it should be understood that the materials used in constructing the capacitor are not limited and can be any materials commonly used in the art, and can be formed using any methods commonly used in the art.

[0129] Generally, dielectric layers are typically formed from materials having a relatively high dielectric constant (K), such as about 10 to about 40,000 in some embodiments, about 50 to about 30,000 in some embodiments, and about 100 to about 20,000 in some embodiments.

[0130] In this regard, the dielectric material can be a ceramic. Ceramics can be provided in various forms, such as wafers (e.g., pre-sintered) or as dielectric materials co-sintered within the device itself.

[0131] Specific examples of high dielectric material types include, for example, NPO(COG) (up to about 100), X7R (about 3,000 to about 7,000), X7S, Z5U, and / or Y5V materials. It should be noted that the materials described above are described by their industry-recognized definitions, some of which are standard classifications established by the Electronic Industries Alliance (EIA), and therefore should be recognized by those skilled in the art. For example, such materials may include ceramics. Such materials may include perovskites, for example, barium titanate and related solid solutions (e.g., barium strontium titanate, barium calcium titanate, barium zirconate titanate, barium strontium zirconate titanate, barium calcium zirconate, etc.), lead titanate and related solid solutions (e.g., lead zirconate titanate, lead lanthanum zirconate titanate), and sodium bismuth titanate, etc. In one particular embodiment, for example, chemical formula Ba x Sr 1-x Barium strontium titanate ("BSTO") of TiO3 can be used, where x is from 0 to 1, and in some embodiments from about 0.15 to about 0.65, and in some embodiments from about 0.25 to about 0.6. Other suitable perovskites include, for example, Ba x Ca 1-x TiO3 (where x is approximately 0.2 to approximately 0.8, and in some embodiments approximately 0.4 to approximately 0.6), Pb x Zr 1-x TiO3 ("PZT") (where x is in the range of approximately 0.05 to approximately 0.4), lead lanthanum zirconate titanate ("PLZT"), lead titanate (PbTiO3), barium calcium zirconate titanate (BaCaZrTiO3), sodium nitrate (NaNO3), KNbO3, LiNbO3, LiTaO3, PbNb2O6, PbTa2O6, KSr(NbO3), and NaBa2(NbO3)5KHb2PO4 may be included. Further additional composite perovskites include A[B1 1 / 3B2 2 / 3 O3 material (where A is Ba x Sr 1-x (x can be a value from 0 to 1), B1 is Mg y Zn 1-y (y can be a value from 0 to 1), and B2 is Ta z Nb 1-z (z can be a value from 0 to 1)) can be included. In one particular embodiment, the dielectric layer can include titanate.

[0132] The internal electrode layer can be formed from any of a variety of different metals as known in the art. The internal electrode layer can be made from a metal such as a conductive metal. The materials can include noble metals (e.g., silver, gold, palladium, platinum, etc.), base metals (e.g., copper, tin, nickel, chromium, titanium, tungsten, etc.), and various combinations thereof. Sputtered titanium / tungsten (Ti / W) alloy, as well as sputtered layers of chromium, nickel, and gold respectively, may also be appropriate. In one particular embodiment, the internal electrode layer can include nickel or its alloy.

[0133] The external terminals can be formed from any of a variety of different metals as known in the art. The external terminals can be made from a metal such as a conductive metal. The materials can include noble metals (e.g., silver, gold, palladium, platinum, etc.), base metals (e.g., copper, tin, nickel, chromium, titanium, tungsten, etc.), and various combinations thereof. In one particular embodiment, the external terminals can include copper or its alloy.

[0134] External terminals can be formed using any method commonly known in the art. External terminals can be formed using techniques such as sputtering, painting, printing, electroless plating or fine copper termination (FCT), electroplating, plasma deposition, propellant spray / airbrushing, etc.

[0135] External terminals can be formed such that they are thin-film plated with metal. Such thin-film plating can be formed by depositing a conductive material (e.g., a conductive metal) onto an exposed portion of the internal electrode layer. For example, the leading edge of the internal electrode layer can be exposed to allow for the formation of a plated terminal.

[0136] External terminals can have an average thickness ranging from approximately 50 μm or less, for example, approximately 40 μm or less, for example, approximately 30 μm or less, for example, approximately 25 μm or less, for example, approximately 20 μm or less, to approximately 5 μm or more, for example, approximately 10 μm or more, for example, approximately 15 μm or more. For example, external terminals can have an average thickness of approximately 5 μm to approximately 50 μm, for example, approximately 10 μm to approximately 40 μm, for example, approximately 15 μm to approximately 30 μm, for example, approximately 15 μm to approximately 25 μm.

[0137] Generally, external terminals can include plated terminals. For example, external terminals can include electroplated terminals, electroless plated terminals, or a combination thereof. For example, electroplated terminals can be formed via electroplating. Electroless plated terminals can be formed via electroless plating.

[0138] When multiple layers constitute an external terminal, the external terminal can include electroplated and electroless plated terminals. For example, electroless plating can be used first to deposit the initial layer of material. The plating technique can then be switched to an electrochemical plating system, which can enable faster accumulation of the material.

[0139] When forming terminals plated by any of the plating methods, the leading edges of the lead tabs of the internal electrode layer exposed from the main body of the capacitor are exposed to the plating solution. By exposure, in one embodiment, the capacitor can be immersed in the plating solution.

[0140] The plating solution contains a conductive material (e.g., a conductive metal) and is used to form a plated end. Such a conductive material can be any of the materials described above or any that is commonly known in the art. For example, the plating solution can be a nickel sulfamate bath solution or other nickel solution, so that the plated layer and the outer terminal contain nickel. Alternatively, the plating solution can be a copper acid bath or other suitable copper solution, so that the plated layer and the outer terminal contain copper.

[0141] Additionally, it should be understood that the plating solution may contain other additives as are commonly known in the art. For example, the additives may include other organic additives and media that can assist the plating process. Furthermore, the additives may be used to use the plating solution at a desired pH. In one embodiment, a resistance-reducing additive may be used in the solution to assist in complete plating, as well as in the bonding of the plating material to the exposed leading edges of the lead tabs of the capacitor and internal electrode layers.

[0142] The capacitor can be exposed, submerged, or immersed in a plating solution for a predetermined amount of time. Such exposure time is not necessarily limited, but can be long enough to allow sufficient plating material to deposit to form plated terminals. In this regard, the time should be sufficient to allow the formation of continuous connections between the desired exposed adjacent leading edges of the lead tabs of a given polarity in each internal electrode layer within a set of alternating dielectric and internal electrode layers.

[0143] Generally, the difference between electrolytic and electroless plating is that electrolytic plating uses an electrical bias (for example, by using an external power supply). Electrolytic plating solutions typically have a high current density range, e.g., 10 to 15 amp / ft. 2 It may be exposed to (rated 9.4 volts). The connection can be formed by a negative connection to the capacitor, which requires the formation of plated terminals, and a positive connection to a solid material in the same plating solution (e.g., Cu in a Cu plating solution). That is, the capacitor is biased to a polarity opposite to the polarity of the plating solution. Using such a method, the conductive material of the plating solution is attracted to the metal of the exposed leading edge of the lead tab of the internal electrode layer.

[0144] Various pretreatment steps can be used before immersing or exposing the capacitors to the plating solution. Such steps can be performed for a variety of purposes, including catalytically accelerating, and / or improving, the adhesion of the plating material to the leading edge of the lead tabs.

[0145] Additionally, an initial cleaning step may be used prior to plating or any other pretreatment step. Such a step may be used to remove any oxide buildup that may form on the exposed lead tabs of the internal electrode layer. This cleaning step may be particularly useful in assisting the removal of any nickel oxide buildup when the internal electrode or other conductive element is formed from nickel. Component cleaning can be achieved by complete immersion in a pre-cleaning tank (e.g., one containing an acid cleaner). In one embodiment, the exposure can be over a predetermined time (e.g., on the order of about 10 minutes). Alternatively, cleaning can be achieved by a chemical polishing or hyper-rising step.

[0146] In addition, to promote the deposition of conductive materials, a step may be performed to activate the exposed metal leading edge of the lead tab of the internal electrode layer. Activation can be achieved by immersion in a palladium salt, a photo-patterned palladium organometallic precursor (via a mask or laser), a screen-printed or inkjet-deposited palladium compound, or an electrophoretic palladium deposit. It should be recognized that the palladium-based activation is disclosed merely as an example of an activating solution, which often works well for activating exposed tab portions formed from nickel or its alloys. However, it should be understood that other activating solutions may be used and are therefore not necessarily limited.

[0147] Furthermore, instead of or in addition to the activation step described above, the activating dopant can be introduced into the conductive material when forming the internal electrode layer of the capacitor. For example, when the internal electrode layer contains nickel and the activating dopant contains palladium, the palladium dopant can be introduced into the nickel ink or composition forming the internal electrode layer. Doing so makes it possible to eliminate the palladium activation step. It should be further understood that some of the above activation methods, such as organometallic precursors, are also useful for co-deposition of glass-forming agents to improve adhesion to the generally ceramic body of the capacitor. When the activation step is performed as described above, traces of the activating material may often remain on the exposed conductive portion before and after terminal plating.

[0148] Additionally, post-plating treatment steps may be used as desired or as needed. Such steps may be performed for a variety of purposes, including strengthening and / or improving the adhesion of the materials. For example, a heating (or annealing) step may be used after the plating step has been carried out. Such heating may be performed via baking, laser subjecting, UV exposure, microwave exposure, arc welding, etc.

[0149] As shown herein, the external terminal may include at least one plating layer. In one embodiment, the external terminal may include only one plating layer. However, it should be understood that the external terminal may include multiple plating layers. For example, the external terminal may include a first plating layer and a second plating layer. In addition, the external terminal may include a third plating layer. Furthermore, the materials of these plating layers may be any of those described above, or may be those commonly known in the art.

[0150] For example, one plating layer (e.g., a first plating layer) may contain copper or an alloy thereof. Another plating layer (e.g., a second plating layer) may contain nickel or an alloy thereof. Alternatively, another plating layer (e.g., a second plating layer) may contain copper or an alloy thereof. Another plating layer (e.g., a third plating layer) may contain tin, lead, gold, or a combination thereof (e.g., an alloy). Alternatively, the initial plating layer may contain nickel, followed by a tin or gold plating layer. In another embodiment, an initial copper plating layer may be formed, followed by a nickel layer.

[0151] In one embodiment, the initial plating layer or first plating layer can be a conductive metal (e.g., copper). This area can then be covered by a second layer containing a resistive polymer material for sealing. The area can then be polished to selectively remove the resistive polymer material and then re-plated with a third layer containing a conductive metallic material (e.g., copper).

[0152] The aforementioned second layer above the initial plating layer can correspond to a solder barrier layer (e.g., a nickel-solder barrier layer). In some embodiments, the aforementioned layer can be formed by electroplating an additional layer of metal (e.g., nickel or copper) onto the initial electroless or electroplated layer (e.g., plated copper). Other exemplary materials for the layer (the aforementioned solder barrier layer) include nickel-phosphorus, gold, and silver. In some embodiments, the aforementioned third layer above the solder barrier layer can correspond to a conductive layer (e.g., plated Ni, Ni / Cr, Ag, Pd, Sn, Pb / Sn, or other suitable plated solder).

[0153] In addition, a layer of metal plating may be formed, followed by an electroplating step to provide a resistive alloy or a higher resistive metal alloy coating (e.g., electroless Ni-P alloy) on such metal plating. However, it should be understood that any metal coating is possible, as will be understood by those skilled in the art from the full disclosure herein.

[0154] It should be recognized that any of the steps described above can occur as a bulk process, such as barrel plating, fluidized bed plating, and / or flow-through plating termination processes (all of which are commonly known in the art). Such bulk processes allow multiple components to be processed at once, providing an efficient and rapid termination process. This is a particular advantage over conventional termination methods (e.g., printing of thick film terminations, which requires processing of individual components).

[0155] As described herein, the formation of external terminals is generally guided by the position of the exposed leading edge of the lead tab of the internal electrode layer. Such a phenomenon can be referred to as "self-determinism" because the formation of the externally plated terminals is determined by the configuration of the exposed conductive metal of the internal electrode layer at selected peripheral locations on the capacitor.

[0156] Additional aspects of the above techniques for forming thin-film plated terminations are described in U.S. Patents 7,177,137 and 7,463,474 by Ritter et al., which are incorporated herein by reference for all purposes. It should be recognized that additional techniques for forming capacitor terminals may also be within the scope of this technique. Exemplary alternatives, but not limited to, include forming terminations by plating, magnetization, masking, electrophoresis / static, sputtering, vacuum deposition, printing, or other techniques for forming either a thick or thin conductive layer.

[0157] Furthermore, the capacitor can then be exposed to a solder mask. For example, this can allow the capacitor to be coated. Although not intended to be limiting, such a mask can help prevent oxidation of plated layers (e.g., copper-plated layers) (especially when such layers are the final plating layers for external terminals). Such solder mask materials may not necessarily be limited by the present invention. For example, such materials may include any of the materials described above with respect to the solder barrier layer. Additionally or alternatively, such materials may include epoxy (e.g., liquid epoxy that is then cured).

[0158] When providing such a material on a capacitor, it may be necessary to access the plating layer and external terminals to form electrical connections. In this regard, a laser can be used to form holes through the mask layer. Such holes can then be filled with a conductive material (e.g., copper). This can then be used to form electrical connections with the capacitor.

[0159] Referring to Figures 3 and 4, capacitors such as those disclosed herein can be mounted using a variety of means. For example, a capacitor can be mounted on a circuit board including a substrate (e.g., an insulating layer) having an upper surface and a lower surface. Referring to Figure 3, a capacitor 10 as shown in Figure 1A is mounted on a circuit board 350 having an upper surface 352 and a lower surface 354. The circuit board 350 has a number of defined current paths therein. The external terminals 12 and 14 of the capacitor 10 are electrically in communication with the predetermined current paths of the circuit board 350, respectively. In addition, the external terminals 12 and 14 of the capacitor 10 can be physically connected to the circuit board 350 using any method commonly known in the art, such as a general soldering technique. It will be recognized that capacitor 10 is used merely as an example, and in other embodiments, a capacitor 20 can be mounted on a mounting surface such as the circuit board 350.

[0160] As illustrated in Figure 4, the integrated circuit package 460 can also be supplied on a circuit board 450. The integrated circuit package 460 can be connected to the circuit board 450 using a ball grid array 462. The circuit board may further include a processor 464. The processor 464 can similarly be connected to the integrated circuit package 460 using a ball grid array 466.

[0161] Generally, the ball grid array 462 can be configured such that the pitch is 1.5 mm or less, for example 1.25 mm or less, for example 1 mm or less, for example 0.8 mm or less, for example 0.6 mm or less, and 0.4 mm or more, for example 0.5 mm or more, for example 0.6 mm or more.

[0162] In addition, the integrated circuit package 460 may also be connected to the circuit board 450 using capacitors as defined herein. In this regard, the internal electrode layers of the capacitors 10 / 20 may be positioned so that they are orthogonal to the horizontal plane of the circuit board 450 and the integrated circuit package 460. In other words, the internal electrode layers of the capacitors 10 / 20 may be positioned so that they are substantially non-parallel to the circuit board 450. For example, the capacitors 10 / 20 may be positioned between the integrated circuit package 460 and the circuit board 450, so that the capacitors 10 / 20 are "sandwiched" between the two components. In this regard, the capacitors 10 / 20 are directly connected to the integrated circuit package 460 and the circuit board 450. For example, the capacitors 10 / 20 may be connected (e.g., physically and / or electrically) to the circuit board 450 and / or the circuit package 460 using any method commonly known in the art, such as general soldering techniques.

[0163] By using capacitors in the configuration described above, capacitors 10 / 20 can be removed from the original ball grid array 462. However, capacitors 10 / 20 can still be surrounded by the ball grid array 462, as illustrated in Figure 4.

[0164] Therefore, as shown in Figure 4, the capacitors 10 / 20 of the present invention can be directly connected to the integrated circuit package 460 and the circuit board 450 (e.g., a printed circuit board). This direct connection allows current 468 to flow through the capacitor, thereby providing a direct power-ground connection.

[0165] In addition to the above, although not illustrated herein, in one embodiment the integrated circuit package itself can include a multilayer capacitor. In this regard, the capacitor can be directly embedded within the package. Such incorporation of the capacitor can allow for size reduction, which may be beneficial for a variety of electronic applications.

[0166] The foregoing provides one example of a means for mounting capacitors as disclosed herein, but it should be understood that other methods may also be available. For example, capacitors can be mounted via a land grid array configuration. Alternatively, capacitors can be embedded within another substrate or component.

[0167] In the embodiments referenced above, the internal electrode layer is generally oriented in a vertical configuration. For example, the internal electrode layer may have a length perpendicular to the direction in which one or more tabs extend to assist in the formation of external terminals. In another example, one or more tabs extend from the main body of the internal electrode layer along a direction perpendicular to the surface on which the capacitor is mounted or to the substrate in which the capacitor is embedded. However, in some embodiments, it may be appropriate to use other geometric configurations (e.g., a horizontal configuration).

[0168] These and other modifications and variations of the present invention can be practiced by those skilled in the art without departing from the spirit and scope of the invention. In addition, it should be understood that the aspects of the various embodiments can be interchanged, both in whole and in part. Furthermore, those skilled in the art will understand that the foregoing description is merely illustrative and not intended to limit the invention, and that the invention is further described in such appended claims. [Explanation of Symbols]

[0169] 10 Multilayer Capacitors 12 First external terminal 14. Second external terminal 15 Capacitor length 16 Capacitor body 17 width 18a Upper surface 18b Bottom surface 18c end surface 18d end surface 18e Side surface 18f Side surface 19 Height 20 multilayer capacitors 22a First external terminal 22b Third external terminal 24a Second external terminal 24b Fourth external terminal 25 Capacitor length 26 Capacitor body 27 width 28a Upper surface 28b Bottom surface 28c end surface 28d end surface 28e Side surface 28f Side surface 29 Height 101 First electrode 102 Second electrode 102a First Arm 102b Second Arm 102c End section, base section 102d Arm 103 First electrode 104 Second electrode 105 First internal electrode layer 105a Side edge 105b Side edge 105c Upper edge 105d bottom edge 107 First electrode length 108 First electrode length 109 End section, base section 110 Internal electrode layer 111 End section, base section 113 Gap 114 Gap 115 Second internal electrode layer 116 Tab gap 118 tab gap 120 lead tabs 121 Lateral edge 122 Lateral edge 123 Front edge 130 Lead Tabs 131 Lateral edge 132 Lateral edge 133 Front edge 135 Main body 140 lead tabs 141 Lateral edge 142 Lateral edge 143 Front edge 145 Main body 150 lead tabs 151 Lateral edge 152 Lateral edge 153 Front edge 201 First electrode 202 Second electrode 203 First electrode 204 Second electrode 205 First internal electrode layer 205a Side edge 205b Side edge 205c Upper edge 205d bottom edge 207 First electrode length 208 First electrode length 209 End section, base section 210 Internal electrode layer 211 End section, base section 213 Gap 214 Gap 215 Second internal electrode layer 216a First tab gap 216b Second tab gap 218a First tab gap 218b Second tab gap 220a Lead Tab 220b Lead Tab 221a Lateral edge 221b Lateral edge 222a Lateral edge 222b Lateral edge 223a Leading edge 223b Leading edge 230a Lead Tab 230b Lead Tab 231a Lateral edge 231b Lateral edge 232a Lateral edge 232b Lateral edge 233a Leading edge 233b Leading edge 235 Main body 240a Lead Tab 240b Lead Tab 241a Lateral edge 241b Lateral edge 242a Lateral edge 242b Lateral edge 243a Leading edge 243b Leading edge 245 Main body 250a Lead Tab 250b Lead Tab 251a Lateral edge 251b Lateral edge 252a Lateral edge 252b Lateral edge 253a Leading edge 253b Leading edge 350 Circuit Boards 352 Upper surface 354 Lower surface 450 Circuit Boards 460 Integrated Circuit Package 462 Ball Grid Array 464 processors 466 Ball Grid Array 468 Current BL terminal length BLA terminal length BLB terminal length BW terminal width L Longitudinal direction, length direction T Vertical direction, height direction W (horizontal direction, width direction)

Claims

1. A multilayer capacitor, wherein the multilayer capacitor is A main body having a length extending in the longitudinal direction, a width extending in the transverse direction, and a height extending in the vertical direction, wherein the main body includes alternating dielectric layers and internal electrode layers, and the internal electrode layers include a first internal electrode layer and a second internal electrode layer, the main body includes Each internal electrode layer is, A first electrode having a main body portion, the main body portion being defined by an upper edge portion extending along the longitudinal direction, a bottom edge portion located opposite the upper edge portion in the height direction and extending along the longitudinal direction, and two side edges portion extending along the height direction between the upper edge portion and the bottom edge portion, At least one lead tab extending from the upper edge of the main body, wherein the at least one lead tab extends from the upper edge along the height direction, and the at least one lead tab extending from the upper edge has a front edge, the front edge extends along the longitudinal direction, and is positioned at a distance from the main body along the height direction, At least one lead tab extending from the bottom edge of the main body, wherein the at least one lead tab extends from the bottom edge along the height direction, and the at least one lead tab extending from the bottom edge has a front edge, the front edge extends along the longitudinal direction, and is positioned at a distance from the main body along the height direction, A second electrode that lies on the same plane as the first electrode and Includes, Furthermore, the multilayer capacitor is Includes an external terminal electrically connected to the internal electrode layer, The aforementioned external terminals include a first external terminal and a second external terminal, Each of the first external terminal and the second external terminal is formed on the upper surface of the multilayer capacitor, the bottom surface of the multilayer capacitor facing the upper surface of the multilayer capacitor along the height direction, and the end surface extending between the upper surface and the bottom surface. The first external terminal is electrically connected to the first electrode of the first internal electrode layer along the leading edge of the at least one lead tab extending from the upper edge and the leading edge of the at least one lead tab extending from the bottom edge, and the first external terminal is also electrically connected to the second electrode of the second internal electrode layer. A multilayer capacitor in which the second external terminal is electrically connected to the second electrode of the first internal electrode layer and the first electrode of the second internal electrode layer along the leading edge of the at least one lead tab extending from the upper edge and along the leading edge of the at least one lead tab extending from the bottom edge.

2. The multilayer capacitor according to claim 1, wherein the external terminals are arranged in a linear manner on the upper surface and the bottom surface of the main body.

3. The multilayer capacitor according to claim 2, wherein the main body portion has a pair of side surfaces facing each other along the lateral direction, the external terminals are arranged at a distance from the side surfaces of the main body portion, and only the dielectric material is disposed between the external terminals and the side surfaces of the main body portion.

4. The multilayer capacitor according to claim 1, wherein the second electrode is generally rectangular in configuration.

5. The multilayer capacitor according to claim 1, wherein the second electrode generally has a C-shaped configuration.

6. The multilayer capacitor according to claim 1, wherein the second electrode generally has an L-shaped configuration.

7. The multilayer capacitor according to claim 1, wherein the main body portion of the first electrode extends from 40% to less than 100% of the length of the main body portion of the capacitor.

8. The multilayer capacitor according to claim 7, wherein the main body portion extends from 50% to less than 100% of the length of the main body portion of the capacitor.

9. The multilayer capacitor according to claim 1, wherein a gap exists between the first electrode and the second electrode.

10. The multilayer capacitor according to claim 9, wherein the gap is 2% to 40% of the length of the main body of the capacitor.

11. The multilayer capacitor according to claim 9, wherein the gap is 5% to 40% of the length of the main body portion of the first electrode.

12. The multilayer capacitor according to claim 1, wherein the second electrode extends to 5% to 50% of the length of the main body of the capacitor.

13. The multilayer capacitor according to claim 1, wherein the first internal electrode layer and the second internal electrode layer are interleaved in a facing relationship, and the dielectric layer is positioned between the first internal electrode layer and the second internal electrode layer.

14. The multilayer capacitor according to claim 13, wherein the dielectric layer includes ceramic.

15. The multilayer capacitor according to claim 1, wherein the at least one lead tab extending from the upper edge of the main body and the at least one lead tab extending from the bottom edge of the main body include a lateral edge aligned with the side edge of the main body.

16. The multilayer capacitor according to claim 1, wherein each internal electrode layer includes at least two lead tabs extending from the upper edge, the bottom edge, or both the upper edge and the bottom edge, and the two lead tabs include a first lead tab and a second lead tab.

17. The multilayer capacitor according to claim 1, wherein at least one lateral edge of the lead tab located at the upper edge is substantially aligned with at least one lateral edge of the lead tab located at the bottom edge.

18. The multilayer capacitor according to claim 1, wherein both lateral edges of the lead tabs on the upper edge are substantially aligned with both lateral edges of the lead tabs on the bottom edge.

19. The multilayer capacitor according to claim 16, wherein at least one lateral edge of the first lead tab located on the upper edge and at least one lateral edge of the second lead tab are substantially aligned with the at least one lateral edge of the first lead tab located on the upper edge and at least one lateral edge of the second lead tab, respectively.

20. The multilayer capacitor according to claim 16, wherein both lateral edges of the first lead tabs and both lateral edges of the second lead tabs located on the upper edge are substantially aligned with both lateral edges of the first lead tabs and both lateral edges of the second lead tabs located on the upper edge.

21. The multilayer capacitor according to claim 1, wherein the internal electrode layer includes a conductive metal.

22. The multilayer capacitor according to claim 1, wherein the external terminal includes an electroplated layer.

23. The multilayer capacitor according to claim 1, wherein the external terminal includes an electroless plated layer.

24. The multilayer capacitor according to claim 1, wherein the external terminal includes an electroless plated layer and an electroplated layer.

25. The multilayer capacitor according to claim 1, wherein the external terminal includes a first electroless plated layer, a second electroplated layer, and a third electroplated layer.

26. The multilayer capacitor according to claim 25, wherein the first electroless plated layer contains copper, the second electroplated layer contains nickel, and the third electroplated layer contains tin.

27. The multilayer capacitor according to claim 1, wherein the capacitor comprises at least three sets of alternating dielectric layers and internal electrode layers.

28. A circuit board comprising a multilayer capacitor as described in claim 1, wherein the multilayer capacitor is positioned on the circuit board.

29. The circuit board according to claim 28, wherein the substrate further includes an integrated circuit package, the multilayer capacitor is positioned vertically between the circuit board and the integrated circuit package, and the circuit board, the multilayer capacitor, and the integrated circuit package are in a stacked arrangement.

30. The circuit board according to claim 29, wherein the multilayer capacitor is directly connected to the circuit board and the integrated circuit package.

31. An integrated circuit package comprising a multilayer capacitor as described in claim 1.

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