Processing control system for microelectronic devices
A modular system with integrated sensors and software addresses the inefficiencies in monitoring electrolyte components, enhancing process control and quality in microelectronic substrate manufacturing.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- NOVA MEASURING INSTR GMBH
- Filing Date
- 2024-03-28
- Publication Date
- 2026-05-19
AI Technical Summary
Existing methods for monitoring and controlling electrolyte components in microelectronic substrate processing are time-consuming and costly, and they struggle with complex interactions and degradation, making it difficult to maintain consistent processing quality.
A modular, flexible, and expandable system for monitoring and controlling electrolyte components, featuring a housing with sealed doors, chemical and electrical cabinets, and modular workstations for various analytical techniques, with integrated sensors and software for data management and process control.
Enables efficient, adaptable, and cost-effective monitoring and control of electrolyte components, facilitating improved characterization, troubleshooting, and process improvement in high-volume manufacturing environments.
Smart Images

Figure 2026515633000001_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to systems for controlling the manufacture of microelectronic substrates. In particular, systems for monitoring and controlling the processing of substrates using electrolytic and electroless techniques are described. Specifically, it is intended for application in the semiconductor industry for the analysis / control of the concentration of the processing bath components.
Background Art
[0002] Microelectronic devices are manufactured by depositing multiple material layers on a substrate such as a silicon wafer and also removing them from the substrate to form a number of individual devices. For example, layers of photoresist, conductive material, and dielectric material are deposited, patterned, etched, planarized, etc. within and / or on the substrate to form features (the fine shapes and characteristics of the devices). These features are arranged to form integrated circuits (ICs), MEMS, and other microelectronic structures.
[0003] Wet chemical processes are commonly used to form features on microelectronic substrates. Wet chemical processes are typically carried out in a wet chemical processing apparatus having a plurality of processing chambers corresponding to a combination of cleaning, etching, electrochemical deposition, and rinsing. Electrochemical deposition processes include electrolytic deposition in which a current is applied to the substrate and electroless deposition in which no external current is supplied to the substrate.
[0004] It is customary to include a function to monitor the chemical composition or chemical activity of the electrolyte used in the process described above. This is done to control the concentration of the electrolyte's chemical components in order to maintain consistent processing of multiple substrates throughout the entire lifespan of the electrolyte. Generally, it is necessary to develop analytical techniques specific to each component of the electrolyte at specific combinations and concentrations of components present in a particular electrolyte. Methods for monitoring the components of an electrolyte include, among others, electroanalysis. Titration (also known as titration analysis and volumetric analysis) is a very common absolute method of quantitative chemical analysis for determining the concentration of a specific / known substance with very high accuracy. Electrochemical analysis uses potential / current to reduce / deposit metallic components onto a rotating disc electrode (RDE), and to oxidize / exfoliate them from the rotating disc electrode (RDE). Absorption spectrophotometry utilizes the different optical properties of different chemical species. The concentration of a specific chemical species can be measured by transmitting light through a sample and analyzing the transmission intensity over a wide wavelength range. High-performance liquid chromatography (HPLC) works by separating and detecting bath components. This allows for the analysis of organic additives, complexing agents, degradation products, and eluted photoresist components.
[0005] Classically, individual analytical techniques are used to express the concentration of each known component in an electrolyte. Designing analytical techniques or methods for each component of an electrolyte using electrolysis, HPLC, titration, near-infrared spectroscopy (NIR spectroscopy), etc., can be time-consuming and costly. Furthermore, some commercially available additives contain two or more components, and their separation may be impossible without prior knowledge of the chemical species. Monitoring the chemical components of these electrolytes can be complex because multiple interactions can occur between components as the concentration of each component changes and as the electrolyte degrades over time. Degradation of the electrolyte over time may result in the decomposition of one or more components through oxidation, reduction, or catalytic action, and may also involve interactions with hardware or substrates that the electrolyte comes into contact with throughout its lifespan, or other contamination. [Overview of the project] [Problems that the invention aims to solve]
[0006] Therefore, there is a need for an apparatus or system that enables monitoring and control of electrolyte components within a single structure during high-volume manufacturing (HVM) in a cleanroom environment. Furthermore, the apparatus or system should be adaptable to various analytical techniques. The invention described in this specification addresses the above-mentioned needs. [Means for solving the problem]
[0007] One aspect of this invention discloses a system for monitoring and controlling the quality of solutions used in the processing of microelectronic substrates. The system is modular, flexible, and expandable, and is configured to form a large-scale system by connecting with similar systems. The system allows full access to data collected and generated by measurement and analysis techniques, thereby enabling improved characterization, troubleshooting, and process improvement.
[0008] In one aspect of this invention, the system comprises a housing having a plurality of sealed doors, each of which has a front side and a back side. The system also comprises one or more wet component cabinets located on the front side of each sealed door, each of which is divided into a plurality of clusters and occupies one or more chemical workstations configured to run one or more analytical applications. The system further comprises one or more electrical cabinets located on the back side of each sealed door, each of which is configured to contain electrical components for controlling the operation of the workstations. The system further comprises one or more chemical cabinets for storing and supplying chemicals required for analytical applications run through the workstations, and interfaces for connecting to one or more computing devices, through which the electroanalytical applications can be monitored and controlled.
[0009] Preferably, the system is configured to maintain negative pressure inside the wet components cabinet and overpressure inside the electrical cabinet.
[0010] Preferably, the system has the flexibility to increase or decrease the number of occupied clusters.
[0011] Preferably, the above system is essentially modular, and the chemical workstation is set up as a modular workstation that performs various analytical techniques.
[0012] Preferably, the above system is configured to be connected to a similar system to form a larger system for performing electroanalysis applications.
[0013] Preferably, the wet components cabinet has a Lego-like structure in which standard chemical and analytical modules are installed.
[0014] Preferably, the execution process and analysis results of the analysis application run via the workstation can be displayed on the screen of the computing device.
[0015] Preferably, errors in the execution of analytical applications run via a workstation can be corrected via the computing device.
[0016] Preferably, the workstation may include one or more of the following: a titration workstation, an electrochemical analysis-CVS workstation, a high-pressure liquid chromatography (HPLC) workstation, and a spectrophotometric workstation.
[0017] In another aspect of this invention, the system comprises a memory unit configured to store configurations and parameters of an analytical application executed via a workstation.
[0018] In a further aspect of this invention, the system comprises a capacity top tray configured to support the superstructure of a modular system including a wet parts cabinet and an electrical cabinet.
[0019] In yet another aspect of this invention, the system comprises a capacity bottom tray configured to support the lower structure of the system, including a chemical cabinet.
[0020] Preferably, the electrical cabinet is configured to control the power supplied to the workstation to ensure the controlled execution of the application. Furthermore, the electrical cabinet is configured to provide interconnectivity between workstations for running analytical applications.
[0021] Preferably, each of the sealed doors is provided with a sealing strip around its periphery to seal the wet parts cabinet from the electrical cabinet while the sealed door is closed.
[0022] Preferably, the sealing strip is configured to maintain different pressure conditions in the wet components cabinet and the corresponding electrical cabinet. The sealing strip maintains a negative pressure inside the wet components cabinet to prevent chemicals from leaking into the electrical cabinet and out of the system. The sealing strip also maintains an overpressure inside the electrical cabinet to prevent the ingress of chemical vapors and dust.
[0023] In another aspect of this invention, the system includes an exhaust vent for drawing air from a wet parts cabinet and a chemical cabinet.
[0024] Preferably, the housing includes a transparent or translucent outer door for the operator to visually check the wet component cabinet, and the door is designed as a foldable two-part door (to decrease footprint while opening) to reduce the area when opened.
[0025] In yet another aspect of the invention, the system includes a pressure sensor configured to detect pressure values within the wet component cabinet and within the chemical cabinet. An operation indicator displays the pressure sensor values in a color-coded format.
[0026] In another aspect of the invention, the system further includes a pressure control system within the wet component cabinet and within the chemical cabinet.
[0027] In a further aspect of the invention, the system includes a leak sensor configured to detect leakage of liquid from the wet component cabinet. The leakage state is displayed in a color-coded format via a light indicator on the leak sensor.
[0028] Preferably, the chemical cabinet is provided as a drawer shelf to facilitate easy loading / unloading of chemicals.
[0029] To better understand the embodiments and show how it can be implemented, an example will be described below with reference to the accompanying drawings.
[0030] The following will be described in particular detail with reference to the accompanying drawings, but each of the matters shown is merely shown as an example for the purpose of explanatory discussion of the selected embodiments, and it is emphasized that it is presented for the purpose of describing the principles and conceptual aspects of the invention in the most useful and easily understandable manner. In this regard, it is not intended to show structural details in more detail than necessary for a basic understanding, and the description, together with the accompanying drawings, is to make it clear to those skilled in the art how each of the selected embodiments can be implemented. [Brief explanation of the drawing]
[0031] [Figure 1] A front view of a system 100 configured to monitor and control electrochemical techniques according to one aspect of this invention is shown. [Figure 2A] The external dimensions of a "dual cluster" device 200a according to an exemplary embodiment of this invention are shown. [Figure 2B] A schematic diagram of a dual cluster device 200b according to another aspect of this invention is shown. [Figure 2C] A schematic diagram of a dual cluster device 200c according to another aspect of this invention is shown. [Figure 2D] A schematic diagram of a single-cluster device 200d according to another aspect of this invention is shown. [Figure 3A] This diagram shows an open structure of a dual cluster process control device including a wet component cabinet configuration according to one embodiment of the present invention. [Figure 3B] This diagram shows the open structure of a dual-cluster process control unit with a pull-out shelf. [Figure 4] This diagram shows the open structure of the process control unit with the module door open. [Figure 5A] A schematic front view of the process control device 500, showing its various components, is provided. [Figure 5B] A schematic top view of the process control unit, including the electrical cabinet, is shown. [Figure 6A] This diagram shows an open structure of a process control device including a single-cluster wet component cabinet configuration according to one embodiment of the present invention. [Figure 6B] A schematic diagram of a dual-cluster wet component cabinet configuration according to another embodiment of this invention is shown. [Figure 7] An open diagram of a process control device including a single-cluster wet component cabinet configuration according to another embodiment of the present invention is shown. [Figure 8]The electrical cabinet 800 is shown behind the modular door of the process control unit. [Figure 9] This shows a setup of a multi-tank wafer-level package (WLP) plating apparatus connected to a dual-cluster system according to one embodiment of this invention. [Figure 10] This shows the operation indicator on the process control unit. [Figure 11] This shows a leak sensor inside a wet parts cabinet. [Figure 12] This shows a leak sensor inside a wet parts cabinet. [Figure 13] This shows the fan located under the cover at the top of the device frame. [Figure 14A] This shows a titration workstation. [Figure 14B] Electrochemical analysis - CVS workstation shown. [Figure 14C] This shows a high-performance liquid chromatography (HPLC) workstation. [Figure 15] This shows a barcode / QR code reader on a process control device. [Figure 16] This document illustrates exemplary systems for carrying out various aspects of this invention. [Modes for carrying out the invention]
[0032] This disclosure relates to an apparatus or system capable of monitoring and controlling the components of an electrolyte within a single structure. The system is flexible, expandable, and adaptable to the application. The system features a Lego-like structure to which various chemical analysis modules can be mounted. Various measurement units can be mounted as modular workstations that perform various analytical techniques. Each workstation performs defined tasks such as analysis, sampling, and standardization. These workstations are equipped with identical apparatus and assemblies whenever possible to simplify maintenance. The system can be a highly customizable, multi-metal compatible wafer-level packaging (WLP) platform.
[0033] In certain embodiments of the above system, process control can be enabled via liquid replenishment, solid replenishment (direct metal replenishment: DMR), bleed and feed to maintain decomposition products and / or impurities below a desired level, and can be used for bleed and replenishment of ECP chemicals.
[0034] In other embodiments of the system described above, the system may include software for storing the workstation configuration and parameters. The workstation processes can be synchronized according to their application. The software can also independently perform updates, repairs, and maintenance of the workstation without affecting the operation of other modules.
[0035] Detailed embodiments of the invention are disclosed in this specification as needed, but it should be understood that the disclosed embodiments are merely examples of the invention, which can be embodied in various alternative forms. The drawings are not necessarily to scale, and some features may be exaggerated or reduced in order to illustrate the details of certain components. Accordingly, the specific structural and functional details disclosed in this specification should not be interpreted restrictively, but rather are presented simply as representative grounds to teach those skilled in the art how to utilize the invention in various ways.
[0036] Of particular note is that the systems and methods disclosed in this specification may not be limited in their application to the configuration details, component arrangements, or methods described in the specification or shown in the drawings and examples. The systems and methods disclosed may be applicable to other embodiments and may be implemented and performed in various ways and techniques.
[0037] Alternative methods and materials similar to or equivalent to those described in this specification may be used in the implementation or testing of embodiments of this disclosure. However, the specific methods and materials described in this specification are provided for illustrative purposes only. The materials, methods and examples are not necessarily intended to be limiting. Therefore, various embodiments may omit, substitute or add various procedures or components as appropriate. For example, the methods may be carried out in an order different from that described, and various steps may be added, omitted or combined. Furthermore, aspects and components described in relation to a particular embodiment may be combined in various other embodiments.
[0038] Referring to Figure 1, which shows a front view of a system 100 configured to monitor and control electrochemical techniques according to one aspect of the present invention. The system 100 includes a process control device having a housing / frame 101 divided into multiple compartments / cabinets, and comprising (analytical) clusters (in this example, a dual cluster configuration). The housing 101 has two transparent or translucent external protective doors 102 and 102', which can be designed as foldable two-part doors (102a, 102b, 102'a and 102'b) to reduce the area when open. The protective doors are preferably not sealed, allowing limited air circulation from the outside air (ambient). Each cluster is configured to occupy a number of modular workstations for performing various analytical techniques, as detailed below. The housing 101 is flexible and expandable, and can accommodate fewer or more analytical clusters (additional clusters). The protective doors (102a, 102b, 102'a, and 102'b) may be removable from their hinges for service / maintenance work. For safety reasons, the protective doors (102a, 102b, 102'a, and 102'b) may be equipped with open / close detectors (switches) that completely or partially stop the operation of the system.
[0039] Figure 2A shows the external dimensions of the housing of a dual-cluster device 200a according to an exemplary embodiment of the present invention. The device 200a is shown to have structural dimensions of 1.27 × 0.56 meters. Figures 2B and 2C show schematic diagrams of dual-cluster devices 200b and 200c with the external protective door open, according to other aspects of the present invention. Figure 2D shows a schematic diagram of a single-cluster device 200d according to another aspect of the present invention. It should be clearly understood that the dimensions and structural elements described above are essentially illustrative and do not limit the scope of the present invention. Device 101 has the flexibility to accommodate the required number of clusters depending on the application.
[0040] Returning to Figure 1, device 101 is connected to Human Machine (HM) interface 103 via connection medium 104. The HM interface 103 can be a communication device such as a personal computer, notebook computer, mobile phone, tablet, or paging device (pager). The communication device 103 can be connected to the process control device 101 via a wired or wireless connection medium 104. Wired mediums include Ethernet cables, fiber optic cables, etc. Wireless mediums include one or more of the following: the Internet, Bluetooth® network, wired LAN, wireless LAN, WiFi network, Zigbee network, Z-Wave network, or Ethernet network. The HM interface 103 can be located near the process control device 101, as shown in Figure 1. Alternatively, the HM interface 103 may be located at a distance from the process control device 101. The HM interface can be connected to multiple process control devices, and a user can control various process control devices via the same communication device. In a further embodiment, two or more HM interfaces are connected to a single process control device, allowing multiple operators to monitor and control the operation of the process control device.
[0041] Data from various electrochemical and analytical processes performed on the workstation, including their chemical composition and concentration, desired and measured ranges, operating conditions including errors and failures, replenishment needs, process time (elapsed and remaining time), and analysis results, are transferred from the process control device 101 to the communication device 103. The communication device 103 may be configured to include a display screen, allowing the operator full access to the data collected and generated by the measurement and analysis techniques performed on the various workstations of the process control device 101. For example, the screen may provide information about the liquids used in the electrochemical process, including the current liquid level, lower and upper threshold values, deviations from the desired range, and contamination levels. The communication device 103 also allows the process to be controlled directly by commands from the communication device 103 or by accessing the workstation of the process control device 101. Furthermore, the communication device 103 can also be used for characterization, troubleshooting, and process improvement.
[0042] In one aspect of this invention, the system 100 is installed against a wall and fully accessible from the front during operation, thus offering the advantage of a smaller footprint. All internal compartments / modules of the device 101 are accessible from the front. The rear of the device 101 may be closed after the assembly or repair of the workstation. The device can also be serviced or inspected from the front, providing easy access for the operator.
[0043] Referring to Figure 3A, Figure 3A shows an open structure view 300a of a process control device 301 having a dual-cluster or double wet-type component cabinet configuration according to one embodiment of the present invention. The device 301 comprises two (analytical) clusters formed by modular doors 302a and 302b. The modular doors 302a and 302b have frames divided into a plurality of subclusters 303 having standard dimensions (e.g., 10 × 10 cm). A specific measurement unit or operating unit may occupy one or more areas of these subclusters 303. These measurement units can be formed as "independent" workstations from standard submodules having the dimensions of one or more subclusters and can be assembled on the frames of the modular doors 302a and 302b. In a particular embodiment of the present invention, the weight of each single subcluster module is limited to 1 kg or less, for example, in a 6 × 10 cluster configuration, the total weight of the measurement modules does not exceed 60 kg (to maintain a stable center of gravity for the entire system). The empty subcluster 304 is covered by a removable plate made of a chemically resistant material (e.g., plastic), assembled and sealed on the frame of the module door.
[0044] Referring to Figure 4, Figure 4 shows an open structure diagram 400 of the process control device 401 with the module door 402 open. Behind the module door 402 of the wet components cabinet (the compartment containing the chemical modules) is an electrical cabinet 407 which mainly contains low-voltage electronic / electrical modules (controllers, etc.), and the illustrated part is a partially assembled low-voltage module.
[0045] The modular door 402 is equipped with a (rubber / silicone) sealing strip 409 around its periphery, sealing the wet parts cabinet from the electrical cabinet while the modular door 402 is closed.
[0046] The sealing member 409 prevents the electronic / electrical modules from being contaminated by chemicals by creating different pressure conditions in the two compartments, with the wet components cabinet under pressure (relative to the outside air) and the electrical cabinet over-pressure.
[0047] The electrical cabinet 407 includes low-voltage electronic / electrical modules (such as controllers), electrical connectors in the form of copper wire or optical cables, voltage / current stabilizers, regulators, protection circuits, switches, temperature and pressure controllers, etc. The electrical cabinet 407 is configured to interconnect each cluster of workstations. It also provides interconnectivity between different workstations for running applications. The electrical cabinet 407 controls the power supplied to the various workstations, ensuring controlled execution of applications.
[0048] The wet components cabinet can preferably be maintained under negative pressure relative to the surrounding (outside air) to prevent chemicals from leaking into the electrical cabinet and from leaking from the system to the outside air. During operation, the operator is protected from chemical leaks by a monitored protective door. If a leak occurs, the liquid is collected in a monitored secondary containment of the chemical cabinet 503 and subsequent discharge procedures are carried out as shown in Figure 5.
[0049] The air inside the wet parts cabinet is continuously drawn in and replaced with outside air through an exhaust port that can be installed in the apparatus. Referring to Figure 5A, the exhaust port 506 can be provided at the top of the apparatus 500 (arrows in Figure 10 indicate the positions of the side and bottom of the exhaust port). The exhaust of the above system can be connected to the exhaust system of the FAB. The exhaust vent 506 is connected to the wet parts cabinet 501 and the chemical cabinet 503. In a preferred embodiment, the air inside these cabinets is replaced at least three times per minute. The pressure in the exhaust pipe of the exhaust vent 506 is detected by a pressure sensor. In a particular embodiment, the pressure sensor typically measures 75-120 m 3 A pressure of / h (60-150 Pascals) is maintained. If the pressure difference between the outside air pressure and the pressure inside the exhaust pipe of the exhaust vent 506 is outside the acceptable range, the pressure sensor detects this and displays it on the operation indicator 505.
[0050] Figure 6B shows a schematic diagram of a dual-cluster configuration or double wet parts cabinet configuration having 6 × 12 clusters 602. Figures 6A and 7 show open-structure diagrams 600A and 700 of a process control device having a single wet parts cabinet configuration with 6 × 12 clusters 601 and 701, respectively, according to another embodiment of the invention.
[0051] As shown in Figures 14A, 14B, and 14C, each workstation can be formed on various subclusters to perform various electrochemical and analytical processes. Each workstation performs predetermined tasks such as analysis, sampling, and standardization, depending on the application. For example, a titration workstation 1400A can be formed from a cluster on a modular door. Titration is a very common absolute method in quantitative chemical analysis for determining the concentration of a specific / known substance with very high accuracy. Various titration workstations include acid-base titration workstations, photometric titration (PHT) workstations, stability index workstations, and redox workstations.
[0052] In an alternative embodiment, the electrochemical analysis-CVS workstation 1400B is formed from a cluster on a modular door. Electrochemical analysis techniques utilize potential / current to reduce / deposit metallic components onto a rotating disk electrode (RDE) or to oxidize / exfoliate them from the electrode. Current-voltage curves are measured and evaluated to obtain analytical results. Various electrochemical analysis workstations include accelerator / leveler workstations, suppressor workstations, and inorganic stability (Pb) workstations.
[0053] In a further embodiment, a High Pressure Liquid Chromatography (HPLC) workstation 1400C is formed from a cluster on a modular door. HPLC functions by separating and detecting single bath components, allowing for the analysis of organic additives, complexing agents, degradation products, and eluted photoresists.
[0054] During operation, depending on the workstation, liquids (chemicals, water, etc.) are moved into, within, or outside a wet parts cabinet. These liquids are temporarily stored in containers, mixed, heated, or cooled as required. All liquids are monitored and analyzed via various sensors located on the process control unit. Various workstations are equipped with standardized and identical equipment and assemblies whenever possible to simplify maintenance. The process control unit may further include software for executing, controlling, and modifying processes on the process control unit. Equipment configuration / parameters are stored in the process control unit's memory. The software further synchronizes sequences within each workstation cluster and between different workstations. The software also allows operators to add, delete, and modify sequences executed on workstations. Furthermore, the software may allow operators to add, delete, and modify applications executed on workstations.
[0055] Referring again to Figure 5A, which shows a schematic diagram of the process control unit 500 showing various structural components. Behind the front door, which includes chemical modules (workstations) assembled on a frame divided into standard subclusters, piping, etc., is a wet parts cabinet 501. The unit 500 includes a chemical cabinet 503 that stores various chemicals necessary for the various processes and / or replenishment performed through the workstations. The chemical cabinet 503 supplies chemicals to the workstations according to the required application and timeline. As shown in Figure 3, the chemical cabinet 305 stores the necessary chemicals in holding devices (e.g., containers, bottles). These holding devices can be made of any suitable material, but are not limited to, plastics, glass, steel, other metals, etc., that do not react with or contaminate the stored chemicals. Preferably, to facilitate easy loading / retrieval of chemicals, the chemical cabinet is provided with pull-out shelves 306 and 307, as shown in Figure 3B, for easy access and organization.
[0056] Figure 8 shows the electrical cabinet 800 behind the module door of the process control unit. The electrical cabinet 800 includes low-voltage electronic / electrical modules (controllers, etc.), electrical connectors in the form of copper wire or optical cables, voltage / current stabilizers, regulators, protection circuits, switches, temperature and pressure controllers, etc. The electrical cabinet 800 is configured to interconnect each cluster of workstations. It also provides interconnectivity between different workstations for running applications. The electrical cabinet 800 controls the power supplied to the various workstations, ensuring controlled execution of applications.
[0057] Figure 9 shows a multi-bath wafer-level packaging (WLP) plating setup 901 connected to a dual-cluster system 902. The WLP plating setup 901, along with system 902, includes various tanks for sampling and optional replenishment. Setup 901 can include pre-wetting tanks, rinse tanks, and tin-silver, nickel, copper, and gold plating cells (tanks). System 900 enables fully automated process control analysis and integrated chemical supply measurement. Furthermore, system 900 enables multi-metals on the same plater running four STDs and slipstreams.
[0058] Referring to Figure 10, exhaust gas value information is displayed on the operation indicator 1001, which can display the information in a color-coded format. For example, exhaust gas values within the range are displayed in green 1002, while exhaust gas values outside the range are displayed in red 1003. Negative pressure is monitored by a pressure sensor located inside the exhaust pipe.
[0059] Referring to Figure 11, which shows a leak sensor 1101 inside a wet parts cabinet. The leak sensor 1101 detects leaks of liquid (chemicals, water, etc.) from the wet parts cabinet. A "green" light signal is displayed as long as no liquid is detected by the leak sensor 1101. When the leak sensor 1101 reacts, the light signal turns "red" as shown in Figure 12. When the "red" signal is displayed, one or more of the following action points are automatically executed. The actuator circuit is immediately turned off. • The supply of chemicals from the wet components cabinet to the workstation is stopped. • The external supply line for filling bulk containers is shut off. All current analysis and replenishment jobs will be canceled. The signal light turns red and the horn sounds. The signal output notifies an external receiver that the process control unit is no longer usable. The signal output may also be displayed on a connected communication device.
[0060] In a particular embodiment of this invention, a fan is provided on the device to generate an overpressure condition within the electrical cabinet. Figure 13 shows the position of the fan 1301 under the cover on the top of the frame of the device 1300. The fan provides an overpressure condition within the electrical cabinet to prevent the ingress of chemical vapors / dust. The fan's rotation speed can be displayed on the screen of the device 1300, the screen of the communication device, or on a separate indicator. Fan failure can also be displayed on the screen of the device 1300, the screen of the communication device, or on an alarm signal lamp. A protective guard prevents contact with the fan while it is rotating. CDA pressure control (detector / control electronics) can be located inside the cabinet. In a particular embodiment of the system, the system is enabled to control the process through various steps, including, but not limited to, liquid replenishment, solid replenishment (Direct Metal Replenishment (DMR)), bleed and feed to maintain decomposition products and / or impurities below a desired level, and bleed and replenish for ECP chemicals.
[0061] The process control device includes a barcode / QR code reader 1501 as shown in Figure 15, which can identify each chemical container before connecting the device to the analysis system and / or supply system. The chemicals can be used for analysis or replenishment. The status of the chemical containers can be displayed on the screen 1502 of the communication device. The expiration date of each chemical can be read and stored in the chemical management device, and can be displayed on the screen 1502 of the communication device. The system may also include level sensors for each chemical container corresponding to the minimum level and below the minimum level.
[0062] During replenishment, the desired amount of chemical to be added is precisely determined to reach the target concentration in the bath. Liquid and solid replenishment (direct metal replenishment (DMR)) is performed according to amp time, product-wafer pass-throughs, elapsed time, and analytical results. Bleed and feed is performed to maintain decomposition products and / or impurities below a desired level. The above bleed and feed can be performed, like replenishment, according to amp time, product-wafer pass-throughs, elapsed time, and analytical results. Bleed and feed for ECP chemicals (low α solder, Cu, Ni) is also performed according to amp time, product-wafer pass-throughs, elapsed time, and analytical results.
[0063] Figure 16 shows an exemplary system 1600 for carrying out various embodiments of the present invention. System 1600 includes a data processor 1602, a system memory 1604, and a system bus 1616. The system bus 1616 connects system components, including, but not limited to, the system memory 1604, to the data processor 1602. The data processor 1602 may be any of the available processors. The data processor 1602 refers to an integrated circuit or other electronic device (or a collection thereof) capable of performing operations for at least one instruction, and includes, but is not limited to, a reduced instruction set core (RISC) processor, a CISC microprocessor, a microcontroller unit (MCU), a CISC-based central processing unit (CPU), and a digital signal processor (DSP). Furthermore, various functional aspects of the data processor 1602 may be implemented independently as software or firmware associated with the processor. Dual microprocessors and other multiprocessor configurations can also be employed as the data processor 1602.
[0064] The system bus 1616 may be any of several bus structures, including a memory bus or memory controller, a peripheral bus or external bus, and / or a local bus, using various available bus architectures known to those skilled in the art.
[0065] System memory 1604 may include computer-readable storage media, including volatile and non-volatile memory. Non-volatile memory stores a basic input / output system (BIOS) containing basic routines for transferring information between elements within system 1600. Non-volatile memory includes, but is not limited to, read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory includes random access memory (RAM) that functions as external cache memory. RAM is available in various forms, including static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), extended SDRAM (ESDRAM), SynchLink® DRAM (SLDRAM), Rambus® Direct RAM (RDRAM), Direct Rambus® Dynamic RAM (DRDRAM), and Rambus® Dynamic RAM (RDRAM).
[0066] System memory 1604 includes an operating system 1606, which performs functions such as managing the resources of system 1600, establishing the user interface, and executing application software and providing services. System applications 1608, module 1610, and data 1612 provide various functions to system 1600.
[0067] System 1600 also includes a disk storage device 1614. The disk storage device 1614 includes, but is not limited to, devices such as magnetic disk drives, floppy disk drives, tape drives, Jaz drives, Zip drives, LS-100 drives, flash memory cards, or memory sticks. Furthermore, the disk storage device 1614 includes, but is not limited to, storage devices used in combination with other storage media, storage devices used alone, storage devices used in combination with other storage media, storage devices used in combination with optical disk drives such as compact disk ROM devices (CD-ROMs), CD recordable drives (CD-R drives), CD rewritable drives (CD-RW drives), or digital multipurpose disk ROM drives (DVD-ROMs).
[0068] The user inputs commands or information to the system 1600 via input device 1624. Input device 1624 includes, but is not limited to, pointing devices (mouse, trackball, stylus, etc.), keyboards, microphones, joysticks, satellite antennas, scanners, TV tuner cards, digital cameras, digital video cameras, webcams, etc. Input device 1624 is connected to the data processor 1602 via interface port 1622 and system bus 1616. Interface port 1622 includes, for example, serial ports, parallel ports, game ports, and Universal Serial Bus (USB).
[0069] Output devices 1620, such as monitors, speakers, and printers, are used to provide the output of the data processor 1602 to the user. In another example, a USB port is used as an input device 1624, providing input to the system 1600 and also used for outputting information from the system 1600 to the output device 1620. The output device 1620 is connected to the data processor 1602 via the system bus 1616 through an output adapter 1618. The output adapter 1632 may include, for example, a video card and a sound card that provide means of connection between the output device 1620 and the system bus 1616.
[0070] System 1600 can communicate with remote communication device 1628 for information exchange. Remote communication device 1628 may be a personal computer, server, router, network PC, workstation, microprocessor-based device, mobile phone, notebook computer, tablet, paging device (pager), peer device, or other common network node.
[0071] Network interface 1626 encompasses wired and / or wireless communication networks, such as local area networks (LANs) and wide area networks (WANs). LAN technologies include fiber-distributed data interfaces (FDDI), copper-distributed data interfaces (CDDI), Ethernet, Token Ring, etc. WAN technologies include, but are not limited to, point-to-point links, circuit-switched networks such as Integrated Services Digital Networks (ISDN) and its variations, packet-switched networks, and digital subscriber lines (DSL).
[0072] Preferred embodiments and advantages of the present invention have been disclosed in the above detailed description, but the invention is not limited thereto and is limited only by the appended claims.
[0073] As will be readily apparent to those skilled in the art, this invention can be readily implemented in other specific forms without departing from its essential features. Therefore, the present embodiments are merely illustrative and should not be construed as limiting; the scope of this invention is indicated not by the above description but by the claims, and therefore, all modifications included within the claims are intended to be encompassed within this invention.
Claims
1. A housing (101) comprising sealed doors (102, 102'), each of which has a front side and a rear side; One or more wet parts cabinets (501) positioned on the front side of each sealed door, each of the wet parts cabinets (501) is divided into multiple clusters and occupies one or more chemical workstations (1400A, 1400B, 1400C) configured to perform one or more analytical applications, One or more electrical cabinets (507, 800) located on the rear side of each sealed door, each configured to include electrical components that control the operation of the workstation; One or more chemical cabinets (503) for storing and supplying chemicals required for analytical applications performed via the workstation, and It includes an interface (104) for connecting to one or more computing devices (103), and the analysis application is monitored and controlled via the computing devices. The inside of the wet components cabinet is maintained under negative pressure, and the inside of the electrical cabinet is maintained under overpressure. A system for monitoring and controlling the processing of a microelectronic substrate (100, 500).
2. The system according to claim 1, wherein the system has the flexibility to increase or decrease the number of occupied clusters.
3. The system according to claim 1, wherein the system is essentially modular, and the chemical workstation can be installed as a modular workstation that performs various electrochemical applications.
4. The system according to claim 1, wherein the system described above is configured to be connected to a similar system to form a large-scale system for executing the analysis application described above.
5. The system according to claim 1, wherein the wet parts cabinet has a Lego-like structure in which a standard chemical module and an analytical module are installed.
6. The system according to claim 1, wherein the above interface includes a wired interface, a wireless interface, or a combination thereof.
7. The system according to claim 1, wherein the execution process and analysis results of the analysis application executed via the workstation can be displayed on the screen of the computing device.
8. The system according to claim 1, wherein errors in the execution of the analysis application performed via the workstation can be corrected via the computing device.
9. The system according to claim 1, wherein the workstation includes one or more of a titration workstation, an electrochemical analysis-CVS workstation, a high-pressure liquid chromatography (HPLC) workstation, and a spectrophotometric workstation.
10. The system according to claim 1, further comprising a memory unit configured to store the settings and parameters of the analysis application executed via the workstation described above.
11. The system according to claim 1, further comprising a capacitive upper tray (502) configured to support the superstructure of the system including the wet parts cabinet and the electrical cabinet.
12. The system according to claim 1, further comprising a capacity lower tray (504) configured to support the lower structure of the system including the chemical cabinet.
13. The system according to claim 1, wherein the electrical cabinet is configured to control the power supplied to the workstation to ensure controlled execution of the application.
14. The system according to claim 1, wherein the electrical cabinet is further configured to provide interoperability between the workstations for performing the analysis application.
15. The system according to claim 1, wherein each of the above-mentioned sealed doors is provided with a sealing strip (409) on its periphery to seal the wet parts cabinet from the electrical cabinet while the sealed door is closed.
16. The system according to claim 15, wherein the sealing strip is configured to maintain different pressure conditions in the wet components cabinet and the corresponding electrical cabinet.
17. The system according to claim 16, wherein the inside of the wet components cabinet is kept under negative pressure to prevent chemicals from leaking toward and out of the electrical cabinet.
18. The system according to claim 16, wherein the inside of the electrical cabinet is kept under overpressure to prevent the ingress of chemical vapors and dust.
19. The system according to claim 18, wherein the inside of the electrical cabinet is maintained under overpressure via a fan provided on the upper side of the above system.
20. The system according to claim 1, further comprising an exhaust vent (506) for drawing air from the wet parts cabinet and the chemical cabinet.
21. The system according to claim 1, wherein the housing comprises a transparent or translucent external door for an operator to view the wet parts cabinet, and the door is designed as a folding two-part door to reduce the area when open.
22. The system according to claim 1, further comprising a pressure sensor configured to detect pressure values inside the wet parts cabinet and the chemical cabinet.
23. The system according to claim 22, further comprising an operation indicator (505) that displays pressure sensor values in a color-coded format.
24. The system according to claim 1, further comprising a pressure control system within the wet components cabinet and the chemical cabinet.
25. The system according to claim 1, wherein the wet parts cabinet is equipped with a leak sensor (1101) configured to detect liquid leakage from the wet parts cabinet.
26. The system according to claim 25, wherein the leak status is displayed in a color-coded format via an optical indicator on the leak sensor.
27. The system according to claim 1, wherein the above-mentioned chemical cabinet is provided as a pull-out shelf to facilitate the easy loading and unloading of chemicals.