A flow regulator configured for implementation with a flow sensor in a discharge system component, and a discharge system and process implementing the same.

A flow regulator with a static mixer and compact convection velocity sensor improves flow rate data accuracy in dispensing systems by equalizing thermal profiles and eliminating mechanical parts, addressing temperature-induced inaccuracies.

JP2026517579APending Publication Date: 2026-06-02NORDSON CORP

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
NORDSON CORP
Filing Date
2024-03-27
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Dispensing systems for flowable materials like hot-melt adhesives face inaccuracies in flow rate data due to temperature fluctuations near the sensor unit, which are caused by convective air-velocity measurement principles.

Method used

Implementing a flow regulator with a static mixer to create a homogeneous laminar flow, combined with a compact convection velocity flow sensor to equalize thermal profiles and improve measurement accuracy.

Benefits of technology

The solution enhances the accuracy of flow rate data by reducing temperature fluctuations and eliminating the need for standalone volumetric flow meters, thus avoiding mechanical parts and pressure losses.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026517579000001
    Figure 2026517579000001
  • Figure 2026517579000002
    Figure 2026517579000002
  • Figure 2026517579000003
    Figure 2026517579000003
Patent Text Reader

Abstract

The detection device comprises a flow regulating device configured to receive discharge material, the flow regulating device further configured to mix the discharge material and equalize the thermal profile of the discharge material, a sensor channel configured to receive the discharge material from the flow regulating device, and a sensor unit configured to measure the temperature of the discharge material in the sensor channel.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application claims the benefit of U.S. Provisional Application No. 63 / 492,669, filed on March 28, 2023, which is hereby incorporated by reference in its entirety as if fully set forth herein for all purposes and forms part of this specification.

[0002] This disclosure relates to a flow - regulating device configured for implementation with a flow sensor for mass - flow measurement in a component of a dispensing system. This disclosure further relates to a dispensing system implementing a flow - regulating device configured for implementation with a flow sensor for mass - flow measurement. This disclosure relates to a process for implementing a flow - regulating device configured for implementation with a flow sensor for mass - flow measurement in a component of a dispensing system.

Background Art

[0003] Dispensing systems that dispense a flowable material, such as hot - melt adhesives, are widely used in manufacturing and packaging industries. For example, hot - melt adhesives can be used for carton sealing, case sealing, tray forming, pallet stabilization, non - woven fabric applications, etc. A dispensing system can typically implement a sensor unit for measuring the mass flow rate of the flowable material. Such a sensor unit typically utilizes the principle of convective air - velocity measurement and does not require direct interference with the mass flow rate of the flowable material by movable mechanical parts. The measurement principle requires heating a temperature - measuring device above the temperature of the flowable material. The temperature of the flowable material is determined by a further temperature - measuring device. Depending on the flow rate of the flowable material surrounding the heated temperature - measuring device, more or less heat is released to the surrounding fluid. However, fluctuations in the temperature of the flowable material near the sensor unit can cause a decrease in the accuracy of the flow - rate data.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Therefore, in order to improve the accuracy of flow rate data, there is a need for equipment and processes to reduce temperature fluctuations of the fluid material near the sensor unit. [Means for solving the problem]

[0005] The aforementioned needs are largely satisfied by this disclosure, and in one embodiment, an apparatus and / or process is provided for reducing temperature fluctuations of a fluid material near a sensor unit to improve the accuracy of flow rate data.

[0006] In one schematic embodiment, the detection device comprises a flow regulator configured to receive discharge material, the flow regulator further configured to mix the discharge material and equalize its thermal profile. The detection device also comprises a sensor channel configured to receive discharge material from the flow regulator. The detection device also comprises a sensor unit configured to measure the temperature of the discharge material in the sensor channel.

[0007] In one schematic embodiment, the process includes configuring a flow regulator to receive the discharge material. The process also includes mixing the discharge material in the flow regulator to equalize the thermal profile of the discharge material. The process also includes receiving the discharge material from the flow regulator in a sensor channel. The process also includes measuring the temperature of the discharge material in the sensor channel with a sensor unit.

[0008] Thus, certain aspects of this disclosure have been outlined in considerable detail so that the detailed description herein may be better understood and the current contributions to the art may be better appreciated. Of course, there are further aspects of this disclosure, which are described below and form the subject matter of the claims appended herein.

[0009] In this regard, before describing in detail at least one aspect of this disclosure, it should be understood that in its application, this disclosure is not limited to the configuration details and arrangement of components described in the following description or shown in the drawings. Further aspects of this disclosure are possible in addition to those described, and can be implemented and carried out in a variety of ways. Furthermore, it should be understood that the expressions, terminology, and abstracts used herein are for illustrative purposes only and should not be considered limiting.

[0010] Therefore, those skilled in the art will understand that the ideas on which this disclosure is based can be readily used as a basis for designing other structures, methods, and systems to accomplish some of the purposes of this disclosure. It is therefore important that the claims be deemed to include such equivalent structures, as long as they do not deviate from the spirit and scope of this disclosure. [Brief explanation of the drawing]

[0011] [Figure 1] This figure schematically shows a flow control device implemented together with a sensor unit according to an aspect of the present disclosure. [Figure 2] This diagram schematically shows a flow control device implemented in a system according to the embodiments of this disclosure. [Figure 3] This diagram schematically shows a flow control device implemented in a system according to the embodiments of this disclosure. [Figure 4] This is a side view of an exemplary embodiment of a flow regulator and a discharge device according to an aspect of the present disclosure. [Figure 5] Figure 4 is a perspective view of an exemplary embodiment of a flow control device, a sensor unit, and a discharge device. [Figure 6] Figure 4 is a perspective view of an exemplary embodiment of a flow control device, a sensor unit, and a discharge device. [Figure 7] This is a partial side view and a partial see-through side view of an exemplary embodiment of a flow regulator and a static mixer adapter unit according to aspects of the present disclosure. [Figure 8]Figure 7 is a partial perspective view, and a partial transparency perspective view, of an exemplary embodiment of a flow control device and a static mixer adapter unit. [Figure 9] This diagram schematically shows a flow control device implemented in a system according to the embodiments of this disclosure. [Figure 10] This is a partial side view and partial see-through side view of an exemplary embodiment of a flow regulator and hose adapter unit according to aspects of the present disclosure. [Figure 11] Figure 10 is a partial perspective view, and is a partial transparency perspective view, of an exemplary embodiment of a flow adjustment device and hose adapter unit. [Figure 12] This diagram schematically shows a flow control device implemented in a system according to the embodiments of this disclosure. [Figure 13] This is a partial side view and a partial see-through side view of an exemplary embodiment of a flow control device and a material conveying device according to aspects of the present disclosure. [Figure 14] This is a side view of an exemplary embodiment of a flow control device, a material transport device, and a discharge device according to aspects of the present disclosure. [Figure 15] Figure 14 is a perspective view of an exemplary embodiment of a flow control device, a sensor unit, a material transport device, and a discharge device. [Figure 16A] This figure shows the flow and thermal profile of the discharged material in the flow path when the discharged material is homogenized by a flow adjustment device, according to an aspect of this disclosure. [Figure 16B] This figure shows the flow and thermal profile of the discharged material in the flow path when the discharged material is homogenized by a flow adjustment device, according to an aspect of this disclosure. [Figure 17] This figure shows the flow and thermal profile of the discharge material in the sensor channel according to an aspect of the present disclosure. [Figure 18] This figure shows graphs of the actual flow rate and measured flow rate versus time for an embodiment without a flow control device according to an aspect of the present disclosure, and graphs of the actual flow rate and measured flow rate versus time for an embodiment with a flow control device according to an aspect of the present disclosure. [Figure 19] FIG. showing an exemplary controller according to an aspect of the present disclosure. [Figure 20] FIG. showing a process for determining the temperature and / or mass flow rate of a dispensed material according to an aspect of the present disclosure.

DETAILED DESCRIPTION

[0012] Hereinafter, the present disclosure will be described with reference to the drawings, and throughout the drawings, like reference numerals refer to like parts. Aspects of the present disclosure advantageously provide an apparatus and / or process for reducing fluctuations in the temperature of a flowing material near a sensor unit and enhancing the accuracy of flow rate data.

[0013] Based on using the measurement principle of the convection wind speed measurement method, fluctuations in the temperature measurement of the flowing material and the temperature measurement of the heating sensor can cause a decrease in the accuracy of the flow rate data. In particular, the temperature difference of the laminar flowing material flow in the flow path has a negative impact on the mass flow rate measurement.

[0014] In an aspect of the present disclosure, by using a flow regulating device such as a static mixer, it becomes possible to have a homogeneous adhesive flow in the flow path, and the accuracy of the flow rate data is improved.

[0015] In an aspect of the present disclosure, a static mixer adapter unit that may or may not be heated can be implemented. A compact convection wind speed measurement mass flow sensor is disposed within an applicator such as a hot melt applicator to directly detect the adhesive flow at the application point and improve the accuracy of the flow rate data.

[0016] In certain embodiments, a static mixer adapter unit may be positioned between a hot melt applicator and a hot melt hose. More specifically, on one side, molten adhesive flows from the hot melt hose into the adapter unit. The molten adhesive passes through a static mixer, which creates a homogeneous laminar flow of adhesive within the flow path. The molten adhesive then passes through a compact convection velocity flow sensor integrated into the hot melt applicator to measure the mass flow rate. The hose connector on the other side connects to the applicator and is the outlet for the molten adhesive in the static mixer adapter unit. The static mixer adapter unit may be unheated or heated to avoid becoming a cold spot in the hot melt adhesive flow system.

[0017] In aspects of this disclosure, a hose connection adapter unit with an integrated mixer may be implemented in combination with a compact convective velocity flow sensor. The compact convective velocity mass flow sensor is positioned near the hot melt applicator and can directly detect the adhesive flow near the application point to improve the accuracy of the flow data. In certain embodiments, a static mixer adapter unit may be positioned between the hot melt applicator and the hot melt hose. More specifically, on one side, molten adhesive flows from the hot melt hose into the adapter unit. The molten adhesive passes through a static mixer. The static mixer creates a homogeneous laminar flow of adhesive within the flow path. The molten adhesive then passes through a compact convective velocity flow sensor integrated with the hot melt applicator to measure the mass flow rate. The hose connector on the other side is connected to the applicator and is the outlet for the molten adhesive in the static mixer adapter unit. In embodiments, the static mixer adapter unit may be unheated or heated to avoid becoming a cold spot in the hot melt adhesive flow system.

[0018] In aspects of this disclosure, a "Uni Flow" heated hot melt hose equipped with an integrated static mixer may be implemented. In aspects, a compact convective velocity mass flow sensor is positioned within the hot melt applicator to directly detect the adhesive flow at the application point and improve the accuracy of flow data. In further aspects, molten adhesive flows from a melter pump or pump station through the "Uni Flow" hot melt hose to the hot melt applicator. The molten adhesive passes through a static mixer integrated with the "Uni Flow" hot melt hose. The static mixer induces a homogeneous laminar flow of adhesive within the flow path. The molten adhesive then passes through a compact convective velocity flow sensor integrated with the hot melt applicator for measuring the mass flow rate. In aspects, the static mixer integrated with the hose is either unheated or heated to avoid negative effects as a cold spot in the hot melt adhesive flow system.

[0019] In these embodiments, the principle of convective anemometry using a constant-temperature algorithm (CTA) allows for the determination of flow velocity by utilizing heat transfer. In these embodiments, as the molten adhesive passes across the sensor plate of the sensor unit, heat is transferred from the heated sensor plate to the hot-melt material. The amount of heat transferred depends on the increase or decrease in material flow. By knowing the heat transfer, the mass flow rate can be determined and calculated from the amount of electrical energy compensation required to maintain a constant temperature difference in a closed-loop control system. The heater and sensor feedback signals can be controlled by a closed-loop system with a PID (proportional-integral-derivative) algorithm implemented by a PID (proportional-integral-derivative) controller.

[0020] In these embodiments, standalone volumetric flow meters can be eliminated. Eliminating volumetric flow meter devices offers many significant advantages, including the absence of rotating mechanical parts, the absence of pressure loss in the hot melt system, the absence of reduction in mass density effects, and / or equivalent.

[0021] Using a static mixer makes it possible to have a homogeneous adhesive flow within the flow path, improving the accuracy of flow rate data. Based on convection velocity measurement method flow detection, the static mixer reduces the negative effects of viscosity and temperature changes of the molten adhesive within the flow path.

[0022] Figure 1 schematically shows a flow control device implemented together with a sensor unit according to an aspect of this disclosure.

[0023] In particular, Figure 1 shows a flow control device 100 implemented with a sensor unit 104 according to an embodiment of this disclosure. The embodiment shown in Figure 1 may be implemented in any other embodiment of this disclosure. Furthermore, the embodiment shown in Figure 1 may include any other embodiment disclosed herein.

[0024] In this regard, the flow regulating device 100 may receive the discharge material 208. The flow regulating device 100 may then regulate the discharge material 208 as it moves through the flow regulating device 100. In some embodiments, the flow regulating device 100 may provide a more homogeneous laminar flow of the discharge material 208 as it moves through the flow regulating device 100. In some embodiments, the flow regulating device 100 may induce mixing, vortex generation, turbulence generation, and / or equivalent within the discharge material 208 as it moves through the flow regulating device 100. In some embodiments, the flow regulating device 100 may be a mixing device and / or equivalent.

[0025] The discharge material 208 may exit the flow regulator 100 and enter the sensor channel 120. A sensor unit 104 may be positioned at least partially within the sensor channel 120 to measure the characteristics of the discharge material 208. In some embodiments, the sensor unit 104 may be implemented as a compact convection velocity measuring mass flow sensor.

[0026] Therefore, the flow regulator 100 and the sensor flow path 120 may be configured as a detection device 300. In some embodiments, the detection device 300 may further include other components described herein. In some embodiments, the detection device 300 may be configured as an adhesive detection device.

[0027] In one embodiment, the detection device 300 may mix the discharge material 208 within the flow adjustment device 100 to equalize its thermal profile. The detection device 300 may then guide the discharge material 208 into the sensor flow path 120 and / or the sensor unit 104. In this regard, equalizing the profile of the discharge material 208 may provide better and / or more accurate temperature measurement, temperature detection, and / or mass flow rate determination.

[0028] Therefore, the flow regulator 100 is configured to provide a more homogeneous laminar flow of the discharge material 208 within the sensor flow path 120. Subsequently, as the discharge material 208 passes through the sensor unit 104, the sensor unit 104 can measure the flow rate of the discharge material 208 with greater accuracy. In these embodiments, a standalone volumetric flow meter can be eliminated. Eliminating the volumetric flow meter device has many significant advantages, including the absence of rotating mechanical parts, the absence of pressure loss in the hot melt system, the absence of a reduction in mass density effect, and / or equivalent.

[0029] Furthermore, in order to ensure that the sensor unit 104 receives a more homogeneous laminar flow of the discharge material 208 in the sensor channel 120, the flow regulator 100 may be positioned upstream of the sensor channel 120 in the vicinity of the sensor unit 104. In some embodiments, the flow regulator 100 may be positioned at a distance 302 upstream from the center of the sensor unit 104, as shown in Figure 1. In some embodiments, the distance 302 may be proportional to the dimensions 304 of the sensor channel 120, as shown in Figure 1. The dimensions 304 may be the radius of the sensor channel 120, the width of the sensor channel 120, and / or the height of the sensor channel 120. In some embodiments, the distance 302 may be less than the dimensions 304. In some embodiments, the distance 302 may be greater than the dimensions 304. In some embodiments, the distance 302 may be N times greater than the dimensions 304. In this embodiment, N may be 2-50, 2-4, 4-6, 6-8, 8-10, 10-20, 20-30, 30-40, or 40-50.

[0030] In some embodiments, the sensor unit 104 may be configured to implement the principle of convective anemometer measurement. In particular, the sensor unit 104 may output a signal that can be used in conjunction with a constant temperature algorithm (CTA: constant temperature anemometer) that can utilize heat transfer to determine the flow velocity of the discharge material 208. In some embodiments, the sensor unit 104 may include a sensor plate positioned within the sensor flow path 120. The sensor plate of the sensor unit 104 may include a heated sensor plate and / or a temperature sensor plate. In some embodiments, when the discharge material 208 passes across the sensor plate of the sensor unit 104, heat is transferred from the heated sensor plate to the discharge material 208. The temperature sensor plate can then detect the temperature of the discharge material 208. The heated sensor plate and the temperature sensor plate of the sensor unit 104 may generate heater and sensor feedback signals.

[0031] The amount of heat transferred is a function of the increase or decrease in the flow rate of the discharged material 208. By knowing the amount of heat transferred, the mass flow rate of the discharged material 208 can be determined and calculated from the amount of electrical energy compensation required to maintain a constant temperature difference in a closed-loop control system. The heater and sensor feedback signals can be controlled by a closed-loop system equipped with a PID (proportional-integral-derivative) algorithm implemented by a PID (proportional-integral-derivative) controller.

[0032] Figure 2 schematically shows a flow control device implemented in a system according to an aspect of this disclosure.

[0033] In particular, Figure 2 shows a flow regulator 100 implemented in a discharge system 200 according to an embodiment of the present disclosure. The embodiment shown in Figure 2 may be implemented in any other embodiment of the present disclosure. Furthermore, the embodiment shown in Figure 2 may include any other embodiment disclosed herein.

[0034] The discharge system 200 may include a material source 202, a material transporter 204, a discharge device 206, and / or equivalent. The material source 202 may supply a source of discharge material 208 to the material transporter 204. The material transporter 204 may transport the discharge material 208 to the static mixer adapter unit 102 and the flow regulator 100. The flow regulator 100 may then deliver the discharge material 208 to the sensor flow path 120, the sensor unit 104, and the discharge device 206.

[0035] In some embodiments, the flow adjustment device 100 may be located in the discharge device 206, the material transport device 204, or another component of the discharge system 200. In some embodiments, the sensor unit 104 may be located in the discharge device 206, the material transport device 204, or another component of the discharge system 200. In some embodiments, the sensor flow path 120 may be located in the discharge device 206, the material transport device 204, or another component of the discharge system 200.

[0036] Therefore, the flow adjustment device 100 and the sensor flow path 120 may be configured as a detection device 300. In some embodiments, the detection device 300 may further include a dispensing device 206, a material transporting device 204, and / or other components of the dispensing system 200. In some embodiments, the detection device 300 may be configured as an adhesive detection device.

[0037] In one embodiment, the detection device 300 may mix the discharge material 208 within the flow adjustment device 100 to equalize its thermal profile. The detection device 300 may then guide the discharge material 208 into the sensor flow path 120 and / or the sensor unit 104. In this regard, equalizing the profile of the discharge material 208 may provide better and / or more accurate temperature measurement, temperature detection, and / or mass flow rate determination.

[0038] Therefore, the flow regulator 100 may be configured to provide a more homogeneous laminar flow of the discharge material 208 within the sensor flow path 120. Subsequently, as the discharge material 208 passes through the sensor unit 104, the sensor unit 104 can measure the flow rate of the discharge material 208 with greater accuracy. In these embodiments, a standalone volumetric flow meter may be eliminated. Eliminating the volumetric flow meter device has many significant advantages, including the absence of rotating mechanical parts, the absence of pressure loss in the hot melt system, the absence of a reduction in mass density effect, and / or equivalent.

[0039] In certain embodiments, the discharge system 200 may be a fluid material discharge system, an adhesive discharge system, a hot melt adhesive discharge system, and / or equivalent. In certain embodiments, the material supply source 202 may be a fluid material source, an adhesive source, a hot melt adhesive source, an adhesive melter, a hot melt adhesive melter, a pump, a fluid material pump, an adhesive pump, a hot melt adhesive pump, and / or equivalent. In certain embodiments, the discharge device 206 may be a material dispenser, an adhesive dispenser, a hot melt dispenser, and / or equivalent. In some embodiments, the material transport device 204 may be a transport hose, an adhesive transport hose, a hot melt adhesive transport hose, a manifold, an adhesive manifold, a hot melt adhesive manifold, and / or equivalent. In some embodiments, the discharge material 208 may be an adhesive, a hot melt adhesive, and / or equivalent.

[0040] Figure 3 schematically shows a flow control device implemented in a system according to an aspect of this disclosure.

[0041] In particular, Figure 3 shows a flow regulator 100 implemented in a discharge system 200 according to an embodiment of the present disclosure. The embodiment shown in Figure 3 may be implemented in any other embodiment of the present disclosure. Furthermore, the embodiment shown in Figure 3 may include any other embodiment disclosed herein.

[0042] In particular, Figure 3 shows that the flow regulator 100 can be mounted on the static mixer adapter unit 102. Furthermore, Figure 3 shows that the flow regulator 100 and the static mixer adapter unit 102 can be mounted on the discharge system 200. The material transport device 204 can transport the discharge material 208 to the static mixer adapter unit 102 and the flow regulator 100. The flow regulator 100 can then deliver the discharge material 208, which has a more homogeneous laminar flow, to the sensor channel 120, the sensor unit 104, and the discharge device 206. As shown in Figure 3, the sensor unit 104 and the sensor channel 120 can be integrated with the discharge device 206. In other embodiments, the sensor unit 104, the sensor channel 120, and the flow regulator 100 (shown by a dashed box) can be integrated with the discharge device 206. In certain embodiments, the flow regulator 100 can be integrated into the channel of the discharge device 206. In certain embodiments, the flow regulator 100 may be integrated into the applicator manifold of the discharge device 206.

[0043] Therefore, the flow adjustment device 100 and the sensor flow path 120 may be configured as a detection device 300. In some embodiments, the detection device 300 may further include a static mixer adapter unit 102, a discharge device 206, a material transport device 204, and / or other components of the discharge system 200. In some embodiments, the detection device 300 may be configured as an adhesive detection device.

[0044] In one embodiment, the detection device 300 may mix the discharge material 208 within the flow adjustment device 100 to equalize its thermal profile. The detection device 300 may then guide the discharge material 208 into the sensor flow path 120 and / or the sensor unit 104. In this regard, equalizing the profile of the discharge material 208 may provide better and / or more accurate temperature measurement, temperature detection, and / or mass flow rate determination.

[0045] In aspects of this disclosure, the static mixer adapter unit 102 may be heated. In other aspects, the static mixer adapter unit 102 may not be heated. Furthermore, the sensor unit 104 may be located within the dispensing device 206 to directly detect the flow of the discharge material 208 in the sensor channel 120 at the dispensing point in order to improve the accuracy of the flow rate data.

[0046] In certain embodiments, the static mixer adapter unit 102 may be positioned between the discharge device 206 and the material transport device 204. More specifically, on one side, the discharge material 208 flows from the material transport device 204 into the static mixer adapter unit 102. The discharge material 208 passes through a flow regulator 100, which ensures that the discharge material 208 has a more homogeneous laminar flow within the flow path of the static mixer adapter unit 102. The discharge material 208 then enters a sensor flow path 120 and may pass through a sensor unit 104 integrated with the discharge device 206 in order to measure the mass flow rate of the discharge material 208 in the discharge device 206.

[0047] Therefore, the flow regulator 100 may be configured to provide a more homogeneous laminar flow of the discharge material 208 within the sensor flow path 120. Subsequently, as the discharge material 208 passes through the sensor unit 104, the sensor unit 104 can measure the flow rate of the discharge material 208 with greater accuracy. In these embodiments, a standalone volumetric flow meter may be eliminated. Eliminating the volumetric flow meter device has many significant advantages, including the absence of rotating mechanical parts, the absence of pressure loss in the hot melt system, the absence of a reduction in mass density effect, and / or equivalent.

[0048] In certain embodiments, the discharge system 200 may be a fluid material discharge system, an adhesive discharge system, a hot melt adhesive discharge system, and / or equivalent. In certain embodiments, the material supply source 202 may be a fluid material source, an adhesive source, a hot melt adhesive source, an adhesive melter, a hot melt adhesive melter, a pump, a fluid material pump, an adhesive pump, a hot melt adhesive pump, and / or equivalent. In certain embodiments, the discharge device 206 may be a material dispenser, an adhesive dispenser, a hot melt dispenser, and / or equivalent. In some embodiments, the material transport device 204 may be a transport hose, an adhesive transport hose, a hot melt adhesive transport hose, a manifold, an adhesive manifold, a hot melt adhesive manifold, and / or equivalent. In some embodiments, the discharge material 208 may be an adhesive, a hot melt adhesive, and / or equivalent.

[0049] Figure 4 shows a side view of one exemplary embodiment of a flow regulator and a discharge device according to the present disclosure.

[0050] Figure 5 shows a perspective view of an exemplary embodiment of the flow control device, sensor unit, and discharge device according to Figure 4.

[0051] Figure 6 shows a perspective view of an exemplary embodiment of the flow control device, sensor unit, and discharge device according to Figure 4.

[0052] In particular, Figures 4, 5, and 6 show an exemplary embodiment of the flow regulator 100, the sensor unit 104, and the discharge device 206. The embodiments shown in Figures 4, 5, and 6 may be implemented in any other embodiments of this disclosure. Furthermore, the embodiments shown in Figures 4, 5, and 6 may include any other embodiments disclosed herein.

[0053] As shown in Figures 4, 5, and 6, the flow regulator 100 and the static mixer adapter unit 102 can be mounted on the discharge device 206. In particular, Figure 4 shows that the static mixer adapter unit 102 can be mounted on the discharge device 206 so as to extend from the discharge device 206 along the x-axis. Furthermore, the sensor channel 120 can be integrated with the discharge device 206. Furthermore, the sensor channel 120 can be configured and positioned in the vicinity of the flow regulator 100 and / or the static mixer adapter unit 102. As shown in Figure 5, the sensor unit 104 can be mounted on the discharge device 206. In particular, the sensor unit 104 can extend from the discharge device 206 along the z-axis. Furthermore, the sensor unit 104 can be positioned at least partially within the sensor channel 120.

[0054] Therefore, the flow regulator 100 and / or the static mixer adapter unit 102 may be configured to provide a more homogeneous laminar flow of the discharge material 208 within the sensor flow path 120. Subsequently, as the discharge material 208 passes through the sensor unit 104, the sensor unit 104 can measure the flow rate of the discharge material 208 with greater accuracy. In these embodiments, a standalone volumetric flow meter may be eliminated. Eliminating the volumetric flow meter device has many significant advantages, including the absence of rotating mechanical parts, the absence of pressure loss in the hot melt system, the absence of a reduction in mass density effect, and / or equivalent.

[0055] In some embodiments, the dispensing device 206 may have a nozzle mechanism 210 for delivering the dispensing material 208 to a substrate or workpiece (not shown). The dispensing device 206 may include a housing, a flow path formed therein, a valve mechanism, a connection for introducing the dispensing material 208 from the static mixer adapter unit 102, a control device for controlling the material transport device 204, and further components.

[0056] Figure 7 is a partial side view, and a partial see-through side view, of an exemplary embodiment of a flow regulator and a static mixer adapter unit according to an aspect of the present disclosure.

[0057] Figure 8 is a partial perspective view, and a partial transmission perspective view, of an exemplary embodiment of the flow control device and static mixer adapter unit shown in Figure 7.

[0058] In particular, Figures 7 and 8 show exemplary embodiments of the flow regulator 100 and the static mixer adapter unit 102. The embodiments shown in Figures 7 and 8 may be implemented in any other embodiments of this disclosure. Furthermore, the embodiments shown in Figures 7 and 8 may include any other embodiments disclosed herein.

[0059] In some embodiments, the static mixer adapter unit 102 may include a housing 106 configured to house a flow regulator 100. Furthermore, the housing 106 may include a heating device 112. The heating device 112 may be configured to heat the static mixer adapter unit 102, the discharge material 208 flowing through the static mixer adapter unit 102, the flow regulator 100, and / or equivalent.

[0060] In a further embodiment, the housing 106 may include a flow channel 114. The flow channel 114 may have a flow regulating device 100 located therein. In particular, the flow channel 114 may extend along the x-axis over the length of the housing 106 of the static mixer adapter unit 102. The flow regulating device 100 may also extend along the x-axis over most of the length of the flow channel 114.

[0061] Furthermore, the flow regulating device 100 may have any type of configuration. In some embodiments, the flow regulating device 100 may include a number of elements extending along its length to form a more homogeneous laminar flow of the discharge material 208 as it flows through the flow path 114 of the static mixer adapter unit 102. In some embodiments, the elements of the flow regulating device 100 may be mixing elements and / or equivalent for forming a more homogeneous laminar flow of the discharge material 208. Mixing elements may be located within the flow regulating device 100. Mixing elements may divide the flow of the discharge material 208, fold back the flow of the discharge material 208, mix the flow of the discharge material 208, combine the flow of the discharge material 208, swirl the flow of the discharge material 208, and / or equivalent.

[0062] Furthermore, the static mixer adapter unit 102 may include a first connector 108. The first connector 108 may be configured to connect the static mixer adapter unit 102 to a material transport device 204 such as a hose. Thus, the first connector 108 can receive the discharged material 208 from the material transport device 204.

[0063] The first connector 108 may include a first end 116 located at one end of the first connector 108. The first end 116 may include a threaded portion configured to connect the first connector 108 to the material conveying device 204. In this regard, the material conveying device 204 may include a corresponding threaded portion for connecting the material conveying device 204 to the first end 116 of the first connector 108.

[0064] The first connector 108 may include a second end 118 at the other opposing end of the first connector 108. The second end 118 may include a threaded portion configured to connect the first connector 108 to the housing 106. In this regard, the housing 106 may include a corresponding threaded portion for connecting the housing 106 to the second end 118 of the first connector 108.

[0065] Furthermore, the static mixer adapter unit 102 may include a second connector 110 which can be configured to connect the static mixer adapter unit 102 to the dispensing device 206. Thus, the first connector 108 can deliver the dispensing material 208 to the dispensing device 206.

[0066] The second connector 110 may include a first end 126 located at one end of the second connector 110. The first end 126 may include a portion configured to connect the second connector 110 to the dispensing device 206. In this regard, the dispensing device 206 may include a corresponding portion for connecting the dispensing device 206 to the first end 126 of the second connector 110.

[0067] The second connector 110 may include a second end 128 at the other opposing end of the second connector 110. The second end 128 may include a threaded portion configured to connect the second connector 110 to the housing 106. In this regard, the housing 106 may include a corresponding threaded portion for connecting the housing 106 to the second end 128 of the second connector 110.

[0068] Figure 9 schematically shows a flow control device implemented in a system according to an aspect of this disclosure.

[0069] In particular, Figure 9 shows a flow regulator 100 implemented in a discharge system 200 according to an embodiment of the present disclosure. The embodiment shown in Figure 9 may be implemented in any other embodiment of the present disclosure. Furthermore, the embodiment shown in Figure 9 may include any other embodiment disclosed herein.

[0070] In particular, Figure 9 shows that the flow regulating device 100 can be mounted on the hose adapter unit 150. Furthermore, Figure 9 shows that the flow regulating device 100 and the hose adapter unit 150 can be mounted on the discharge system 200. The hose adapter unit 150 may include a sensor flow path 120 and a sensor unit 104.

[0071] The material transport device 204 can transport the discharge material 208 to the hose adapter unit 150 and the flow adjustment device 100. The flow adjustment device 100 can then deliver the discharge material 208, which has a more homogeneous laminar flow, to the sensor channel 120 and the sensor unit 104. As shown in Figure 9, the sensor unit 104 and the sensor channel 120 can be integrated into the hose adapter unit 150. The discharge material 208 can then be delivered from the hose adapter unit 150 to the discharge device 206.

[0072] In aspects of this disclosure, the hose adapter unit 150 may be heated. In other aspects, the hose adapter unit 150 may not be heated. Furthermore, the sensor unit 104 may be located within the hose adapter unit 150 to directly detect the flow of the discharge material 208 in the sensor channel 120.

[0073] In certain embodiments, the hose adapter unit 150 may be positioned between the discharge device 206 and the material transport device 204. More specifically, on one side, the discharge material 208 flows from the material transport device 204 into the hose adapter unit 150. The discharge material 208 passes through a flow regulator 100. The flow regulator 100 ensures that the discharge material 208 has a more homogeneous laminar flow within the flow path of the hose adapter unit 150. The discharge material 208 then enters a sensor flow path 120 and may pass through a sensor unit 104 integrated with the hose adapter unit 150 in order to measure the mass flow rate of the discharge material 208 within the hose adapter unit 150.

[0074] Therefore, the flow adjustment device 100 and the sensor flow path 120 may be configured as a detection device 300. In some embodiments, the detection device 300 may further include a hose adapter unit 150, a discharge device 206, a material transport device 204, and / or other components of the discharge system 200. In some embodiments, the detection device 300 may be configured as an adhesive detection device.

[0075] In one embodiment, the detection device 300 may mix the discharge material 208 within the flow adjustment device 100 to equalize its thermal profile. The detection device 300 may then guide the discharge material 208 into the sensor flow path 120 and / or the sensor unit 104. In this regard, equalizing the profile of the discharge material 208 may provide better and / or more accurate temperature measurement, temperature detection, and / or mass flow rate determination.

[0076] Therefore, the flow regulator 100 may be configured to provide a more homogeneous laminar flow of the discharge material 208 within the sensor flow path 120. Subsequently, as the discharge material 208 passes through the sensor unit 104, the sensor unit 104 can measure the flow rate of the discharge material 208 with greater accuracy. In these embodiments, a standalone volumetric flow meter may be eliminated. Eliminating the volumetric flow meter device has many significant advantages, including the absence of rotating mechanical parts, the absence of pressure loss in the hot melt system, the absence of a reduction in mass density effect, and / or equivalent.

[0077] In certain embodiments, the discharge system 200 may be a fluid material discharge system, an adhesive discharge system, a hot melt adhesive discharge system, and / or equivalent. In certain embodiments, the material supply source 202 may be a fluid material source, an adhesive source, a hot melt adhesive source, an adhesive melter, a hot melt adhesive melter, a pump, a fluid material pump, an adhesive pump, a hot melt adhesive pump, and / or equivalent. In certain embodiments, the discharge device 206 may be a material dispenser, an adhesive dispenser, a hot melt dispenser, and / or equivalent. In some embodiments, the material transport device 204 may be a transport hose, an adhesive transport hose, a hot melt adhesive transport hose, a manifold, an adhesive manifold, a hot melt adhesive manifold, and / or equivalent. In some embodiments, the discharge material 208 may be an adhesive, a hot melt adhesive, and / or equivalent.

[0078] Figure 10 is a partial side view, and a partial see-through side view, of an exemplary embodiment of a flow regulator and hose adapter unit according to an aspect of the present disclosure.

[0079] Figure 11 is a partial perspective view, and is a partial transmission perspective view, of an exemplary embodiment of the flow adjustment device and hose adapter unit shown in Figure 10.

[0080] In particular, Figures 10 and 11 show exemplary embodiments of the flow regulator 100 and the hose adapter unit 150. The embodiments shown in Figures 10 and 11 may be implemented in any other embodiments of this disclosure. Furthermore, the embodiments shown in Figures 10 and 11 may include any other embodiments disclosed herein.

[0081] In particular, the hose adapter unit 150 may include an integrated sensor unit 104 and a sensor flow path 120. Thus, the flow regulator 100 and / or the hose adapter unit 150 may be configured to provide a more homogeneous laminar flow of the discharge material 208 within the sensor flow path 120. Subsequently, as the discharge material 208 passes through the sensor unit 104, the sensor unit 104 can measure the flow rate of the discharge material 208 with greater accuracy. In these embodiments, a standalone volumetric flow meter may be eliminated. Eliminating the volumetric flow meter device has many significant advantages, including the absence of rotating mechanical parts, the absence of pressure loss in the hot melt system, the absence of a reduction in mass density effect, and / or equivalent.

[0082] In some embodiments, the hose adapter unit 150 may include a housing 106, a flow path 114, a first connector 108, a first end 116, a second end 118, a second connector 110, a first end 126, a second end 128, and / or equivalent, in a manner similar to that of the static mixer adapter unit 102.

[0083] Figure 12 schematically shows a flow control device implemented in a system according to an aspect of this disclosure.

[0084] In particular, Figure 12 shows a flow regulator 100 implemented in a discharge system 200 according to an embodiment of the present disclosure. The embodiment shown in Figure 12 may be implemented in any other embodiment of the present disclosure. Furthermore, the embodiment shown in Figure 12 may include any other embodiment disclosed herein.

[0085] In particular, Figure 12 shows that the flow regulating device 100 can be mounted on the material conveying device 204. Furthermore, Figure 12 shows that the flow regulating device 100 and the material conveying device 204 can be mounted on the discharge system 200. In particular, Figure 12 shows that the flow regulating device 100 can be integrated with the material conveying device 204. In certain embodiments, the flow regulating device 100 can be integrated with the material conveying device 204 adjacent to the discharge device 206.

[0086] The material transport device 204 can transport the discharge material 208 to the flow adjustment device 100. The flow adjustment device 100 can then deliver the discharge material 208, which has a more homogeneous laminar flow, to the sensor channel 120, the sensor unit 104, and the discharge device 206. As shown in Figure 12, the sensor unit 104 and the sensor channel 120 can be integrated into the discharge device 206.

[0087] More specifically, on one side, the discharge material 208 flows through the material transport device 204 and enters a flow regulating device 100 integrated within the material transport device 204. The discharge material 208 passes through the flow regulating device 100, which ensures the discharge material 208 has a more homogeneous laminar flow within the flow path of the material transport device 204. The discharge material 208 then exits the flow regulating device 100 and / or the material transport device 204, and enters a sensor flow path 120 to measure the mass flow rate of the discharge material 208 within the discharge device 206, passing through a sensor unit 104 integrated with the discharge device 206.

[0088] In aspects of this disclosure, the material transport device 204 may be heated. Furthermore, the sensor unit 104 may be located within the dispensing device 206 to directly detect the flow of the discharged material 208 in the sensor channel 120 at the application point in order to improve the accuracy of the flow rate data.

[0089] Therefore, the flow adjustment device 100 and the sensor flow path 120 may be configured as a detection device 300. In some embodiments, the detection device 300 may further include a dispensing device 206, a material transporting device 204, and / or other components of the dispensing system 200. In some embodiments, the detection device 300 may be configured as an adhesive device.

[0090] In one embodiment, the detection device 300 may mix the discharge material 208 within the flow adjustment device 100 to equalize its thermal profile. The detection device 300 may then guide the discharge material 208 into the sensor flow path 120 and / or the sensor unit 104. In this regard, equalizing the profile of the discharge material 208 may provide better and / or more accurate temperature measurement, temperature detection, and / or mass flow rate determination.

[0091] Therefore, the flow regulator 100 may be configured to provide a more homogeneous laminar flow of the discharge material 208 within the sensor flow path 120. Subsequently, as the discharge material 208 passes through the sensor unit 104, the sensor unit 104 can measure the flow rate of the discharge material 208 with greater accuracy. In these embodiments, a standalone volumetric flow meter may be eliminated. Eliminating the volumetric flow meter device has many significant advantages, including the absence of rotating mechanical parts, the absence of pressure loss in the hot melt system, the absence of a reduction in mass density effect, and / or equivalent.

[0092] In certain embodiments, the discharge system 200 may be a fluid material discharge system, an adhesive discharge system, a hot melt adhesive discharge system, and / or equivalent. In certain embodiments, the material supply source 202 may be a fluid material source, an adhesive source, a hot melt adhesive source, an adhesive melter, a hot melt adhesive melter, a pump, a fluid material pump, an adhesive pump, a hot melt adhesive pump, and / or equivalent. In certain embodiments, the discharge device 206 may be a material dispenser, an adhesive dispenser, a hot melt dispenser, and / or equivalent. In some embodiments, the material transport device 204 may be a transport hose, an adhesive transport hose, a hot melt adhesive transport hose, a manifold, an adhesive manifold, a hot melt adhesive manifold, and / or equivalent. In some embodiments, the discharge material 208 may be an adhesive, a hot melt adhesive, and / or equivalent.

[0093] Figure 13 is a partial side view, and is a partial see-through side view, of an exemplary embodiment of a flow control device and a material conveying device according to an aspect of the present disclosure.

[0094] In particular, Figure 13 shows exemplary embodiments of the flow adjustment device 100 and the material conveying device 204. The embodiments shown in Figure 13 may be implemented in any other embodiments of this disclosure. Furthermore, the embodiments shown in Figure 13 may include any other embodiments disclosed herein.

[0095] In some embodiments, the material conveying device 204 may include a housing 256 configured to house a flow regulating device 100. Furthermore, the housing 256 may include a heating device 270. The heating device 270 may be configured to heat the material conveying device 204, the discharge material 208 flowing through the material conveying device 204, the flow regulating device 100, and / or equivalent.

[0096] In a further embodiment, the housing 256 may include a flow channel 254. The flow channel 254 may have a flow regulating device 100 disposed therein. In particular, the flow channel 254 may extend along the x-axis over the length or a portion of the length of the housing 256. The flow regulating device 100 may also extend along the x-axis over most of the length of the flow channel 254.

[0097] Furthermore, the material transport device 204 and / or housing 256 may include a connector 260 that can be configured to connect the material transport device 204 to the dispensing device 206. Thus, the connector 260 can deliver the dispensing material 208 to the dispensing device 206.

[0098] In a further embodiment, the flow regulating device 100 may extend from the flow path 254 and / or housing 256 into the connector 260. In a further embodiment, the flow regulating device 100 may extend from the flow path 254 and / or housing 256 into the connector 260 and extend from the connector 260.

[0099] Furthermore, the flow regulating device 100 may have any type of configuration. In some embodiments, the flow regulating device 100 may include a number of elements extending along its length to form a more homogeneous laminar flow of the discharge material 208 as it flows through the flow path 254. In some embodiments, the elements of the flow regulating device 100 may be mixing elements and / or equivalent for forming a more homogeneous laminar flow of the discharge material 208. Mixing elements may be located within the flow regulating device 100. Mixing elements may divide the flow of the discharge material 208, fold the flow of the discharge material 208, mix the flow of the discharge material 208, combine the flow of the discharge material 208, swirl the flow of the discharge material 208, and / or equivalent.

[0100] Figure 14 shows a side view of an exemplary embodiment of a flow control device, a material transport device, and a discharge device according to an aspect of the present disclosure.

[0101] Figure 15 shows a perspective view of an exemplary embodiment of the flow control device, sensor unit, material transport device, and discharge device according to Figure 14.

[0102] In particular, Figures 14 and 15 show an exemplary embodiment of the flow regulator 100, the sensor unit 104, and the discharge device 206. The embodiment shown in Figures 14 and 15 may be implemented in any other embodiment of this disclosure. Furthermore, the embodiment shown in Figures 14 and 15 may include any other embodiment disclosed herein.

[0103] As shown in Figures 14 and 15, the flow regulating device 100 and the material conveying device 204 can be mounted on the discharge device 206. In particular, Figure 14 shows that the material conveying device 204, together with the flow regulating device 100, can be mounted on the discharge device 206 such that it extends from the discharge device 206 along the x-axis. Furthermore, the sensor channel 120 can be integrated with the discharge device 206. Furthermore, the sensor channel 120 can be configured and positioned in the vicinity of the flow regulating device 100. As shown in Figure 15, the sensor unit 104 can be mounted on the discharge device 206. In particular, the sensor unit 104 can extend from the discharge device 206 along the z-axis. Furthermore, the sensor unit 104 can be positioned at least partially within the sensor channel 120.

[0104] Therefore, the flow regulator 100 integrated with the material transport device 204 may be configured to provide a more homogeneous laminar flow of the discharge material 208 within the sensor channel 120. Subsequently, as the discharge material 208 passes through the sensor unit 104, the sensor unit 104 can measure the flow rate of the discharge material 208 with greater accuracy. In these embodiments, a standalone volumetric flow meter may be eliminated. Eliminating the volumetric flow meter device has many significant advantages, including the absence of rotating mechanical parts, the absence of pressure loss in the hot melt system, the absence of a reduction in mass density effect, and / or equivalent.

[0105] In some embodiments, the dispensing device 206 may have a nozzle mechanism 210 for delivering the dispensing material 208 to a substrate or workpiece (not shown). The dispensing device 206 may include a housing, a flow path formed therein, a valve mechanism, a connection for introducing the dispensing material 208 from the static mixer adapter unit 102, a control device for controlling the material transport device 204, and further components.

[0106] Figures 16A and 16B show the flow and thermal profile of the discharge material in the flow path when the discharge material is homogenized by a flow adjustment device according to an aspect of the present disclosure.

[0107] In particular, Figures 16A and 16B show the thermal profile of the discharge material 208 in the flow channel 114 as it is homogenized by the flow regulator 100 according to aspects of the present disclosure. As shown in Figures 16A and 16B, the discharge material 208 can enter the flow regulator 100 in the static mixer adapter unit 102, the hose adapter unit 150, and / or the material transport device 204 at its end 290. In this regard, the discharge material 208 at the end 290 is shown as having a heterogeneous thermal profile. As the discharge material 208 passes through the flow regulator 100 in the flow channel 114, the discharge material 208 becomes increasingly homogeneous laminar. Subsequently, when the discharge material 208 leaves the flow regulator 100 and enters the sensor flow channel 120, the discharge material 208 becomes even more homogeneous laminar due to the implementation of the flow regulator 100. Furthermore, Figures 16A and 16B show different structures of the mixing element of the flow regulating device 100, respectively. In this regard, the flow regulating device 100 may have a mixing element having a spiral structure, a mixing element having a helix structure, and / or equivalent. The mixing element may divide the flow of the discharge material 208, fold back the flow of the discharge material 208, mix the flow of the discharge material 208, combine the flow of the discharge material 208, swirl the flow of the discharge material 208, and / or equivalent.

[0108] Figure 17 shows the flow and thermal profile of the discharge material in the sensor channel according to an embodiment of the present disclosure.

[0109] In particular, Figure 17 shows the flow and thermal profile of the discharge material 208 in the sensor channel 120 according to an aspect of this disclosure. In this regard, Figure 17 further shows the position of the sensor unit 104 in the vicinity of the sensor channel 120.

[0110] In this regard, Figure 17 shows that the flow and temperature fluctuations of the discharge material 208 in the sensor channel 120 after processing by the flow adjustment device 100 are highly homogeneous. Similarly, in other operating configurations of the discharge system 200, the flow and temperature of the discharge material 208 will fluctuate similarly to a minimum.

[0111] Figure 18 shows graphs of the actual flow rate and measured flow rate versus time for an implementation without a flow control device according to an aspect of the present disclosure, and further shows graphs of the actual flow rate and measured flow rate versus time for an implementation with a flow control device according to an aspect of the present disclosure.

[0112] In particular, Figure 18 shows a graph 702 of the actual flow rate 722 and measured flow rate 712 versus time for an implementation without the flow control device 100 according to an aspect of the present disclosure, and Figure 18 shows a graph 704 of the actual flow rate 724 and measured flow rate 714 versus time for an implementation with the flow control device 100 according to an aspect of the present disclosure.

[0113] In this regard, Graph 702 shows that the actual flow rate 722 without the flow regulator 100 is dramatically different from the measured flow rate 712. On the other hand, as can be seen from Graph 704, the actual flow rate 724 and the measured flow rate 714 with the flow regulator 100 implemented according to the embodiment of this disclosure provide a very accurate determination of the flow rate of the discharge material 208 in the discharge system 200.

[0114] Figure 19 shows an exemplary controller according to an aspect of this disclosure.

[0115] In particular, Figure 19 shows a controller 800 for a dispensing system 200 that responds to a sensor unit 104. Specifically, the controller 800 may include a PID controller 802 that outputs a signal to a digital-to-analog device (D / A 804) to output a pulse-width modulated signal to sensor A 806 of the sensor unit 104. The embodiment shown in Figure 19 may be implemented in any other embodiment of this disclosure. Furthermore, the embodiment shown in Figure 19 may include any other embodiment disclosed herein.

[0116] Furthermore, the sensor unit 104 may provide the heated temperature to the analog-to-digital device (D / A812) of the controller 800. Additionally, the sensor unit 104 may provide a reference temperature to the sensor B808. The reference temperature may be provided to the analog-to-digital device (D / A810) of the controller 800. The output of D / A810 may be combined with the target temperature difference 812. The combined output may be combined with the output of D / A812 and input to the PID controller 802.

[0117] Figure 20 shows a process for determining the temperature and / or mass flow rate of the discharge material according to an aspect of this disclosure.

[0118] In particular, Figure 20 shows a process 900 for determining the temperature and / or mass flow rate of the discharge material. In this regard, determining the temperature and / or mass flow rate of the discharge material 900 relates to determining the temperature and / or mass flow rate of the discharge material 208 as described herein. In particular, note that determining the temperature and / or mass flow rate of the discharge material 900 is merely illustrative and can be modified to match the various embodiments disclosed herein. Note that determining the temperature and / or mass flow rate of the discharge material 900 can be performed in a different order to match the embodiments described above. Furthermore, determining the temperature and / or mass flow rate of the discharge material 900 can be modified to have more or fewer process steps to match the various embodiments disclosed herein. Furthermore, determining the temperature and / or mass flow rate of the discharge material 900 can be implemented in any embodiment of 200 and / or 800 as described herein.

[0119] Determining the temperature and / or mass flow rate of the discharge material in this disclosure 900 may include receiving the discharge material from a material source in a flow regulator 902. In this regard, receiving the discharge material from a material source in a flow regulator 902 may include any one or more materials, structures, arrangements, processes, and / or equivalents as described herein. Furthermore, one or more preceding or succeeding processes may also be implemented in accordance with this disclosure with respect to receiving the discharge material from a material source in a flow regulator 902. In particular embodiments, receiving the discharge material from a material source in a flow regulator 902 may include receiving the discharge material 208 from a material source 202 in a flow regulator 100 as described herein.

[0120] Determining the temperature and / or mass flow rate of the discharge material in this disclosure 900 may include mixing and / or adjusting the discharge material in a flow regulator 904. In this regard, mixing and / or adjusting the discharge material in a flow regulator 904 may include any one or more materials, structures, arrangements, processes, and / or equivalents as described herein. Furthermore, one or more preceding or subsequent processes may also be implemented in accordance with this disclosure with respect to mixing and / or adjusting the discharge material in a flow regulator 904. In particular embodiments, mixing and / or adjusting the discharge material in a flow regulator 904 may include mixing and / or adjusting the discharge material 208 in a flow regulator 100 as described herein.

[0121] Determining the temperature and / or mass flow rate of the discharge material in this disclosure 900 may include guiding the discharge material from the flow regulator to the sensor channel 906. In this regard, guiding the discharge material from the flow regulator to the sensor channel 906 may include any one or more materials, structures, arrangements, processes, and / or equivalents as described herein. Furthermore, one or more preceding or succeeding processes may also be implemented in accordance with this disclosure with respect to guiding the discharge material from the flow regulator to the sensor channel 906. In particular embodiments, guiding the discharge material from the flow regulator to the sensor channel 906 may include guiding the discharge material 208 from the flow regulator 100 to the sensor channel 120 as described herein.

[0122] Determining the temperature and / or mass flow rate of the discharge material in this disclosure 900 may include detecting the temperature of at least one of the discharge material in the sensor channel by a sensor unit 908. In this regard, detecting the temperature of at least one of the discharge material in the sensor channel by a sensor unit 908 may include any one or more materials, structures, arrangements, processes, and / or equivalents as described herein. Furthermore, one or more preceding or succeeding processes may also be implemented in accordance with this disclosure with respect to detecting the temperature of at least one of the discharge material in the sensor channel by a sensor unit 908. In particular embodiments, detecting the temperature of at least one of the discharge material in the sensor channel by a sensor unit 908 may include detecting the temperature of at least one of the discharge material 208 in the sensor channel 120 by a sensor unit 104, as described herein.

[0123] Determining the temperature and / or mass flow rate of the discharged material 900 in this disclosure may include determining the mass flow rate of the discharged material based on at least one temperature detected by a sensor unit 910. In this regard, determining the mass flow rate of the discharged material based on at least one temperature detected by a sensor unit 910 may include any one or more materials, structures, arrangements, processes, and / or equivalents as described herein. Furthermore, one or more preceding or succeeding processes may also be implemented in accordance with this disclosure with respect to determining the mass flow rate of the discharged material based on at least one temperature detected by a sensor unit 910. In particular embodiments, determining the mass flow rate of the discharged material based on at least one temperature detected by a sensor unit 910 may include determining the mass flow rate of the discharged material 208 based on at least one temperature detected by a sensor unit 104, as described herein.

[0124] Therefore, this disclosure describes an apparatus and process for reducing temperature fluctuations of a fluid material near a sensor unit to improve the accuracy of flow rate data.

[0125] The following are some non-limiting embodiments of the present disclosure.

[0126] One embodiment includes a flow regulator configured to receive discharge material, the flow regulator further configured to mix the discharge material and equalize its thermal profile, and a sensing device. The sensing device also includes a sensor channel configured to receive discharge material from the flow regulator. The sensing device also includes a sensor unit configured to measure the temperature of the discharge material in the sensor channel.

[0127] The above embodiments may further include combinations of one or more of the following embodiments: A detection device of the above embodiment in which a flow regulator is configured to mix the discharge material so that the sensor unit produces more accurate temperature measurement, temperature detection, and / or mass flow determination. A detection device of the above embodiment in which a flow regulator is configured to mix the discharge material when the discharge material is in the flow regulator. A detection device of the above embodiment in which a flow regulator is configured to provide a more homogeneous laminar flow of the discharge material. A detection device of the above embodiment in which a flow regulator is configured to mix, generate vortices, and / or generate turbulence in the discharge material when the discharge material is in the flow regulator. A detection device of the above embodiment in which a flow regulator may include a mixing element configured to mix the flow of the discharge material. A detection device of the above embodiment in which the sensor unit may include a convective velocity measurement mass flow sensor. A detection device of the above embodiment in which a flow regulator is configured to provide a more homogeneous laminar flow of the discharge material in the sensor flow path. The detection device of the above embodiment, wherein the flow regulating device is configured to provide the sensor unit with more accurate temperature and / or flow rate measurements of the discharged material. The detection device of the above embodiment, wherein the flow regulating device is located upstream of and near the sensor flow path and the sensor unit. The detection device of the above embodiment, wherein the flow regulating device is located a certain distance upstream from the center of the sensor unit, the sensor flow path may include a certain dimension, and the distance is less than the dimension. The detection device of the above embodiment, wherein the flow regulating device is located a certain distance upstream from the center of the sensor unit, the sensor flow path may include a certain dimension, and the distance is 1 to 20 times greater than the dimension. The detection device of the above embodiment, wherein the flow regulating device is mounted on a static mixer adapter unit, and the static mixer adapter unit is located between the discharge device and the material transport device. The detection device of the above embodiment, wherein the material transport device is an adhesive transport hose. The detection device of the above embodiment, wherein the sensor unit and the sensor flow path are located within the discharge device. The detection device of the above embodiment, wherein the static mixer adapter unit may include a housing configured to accommodate a flow adjustment device, and the housing may include a heating device.A detection device according to the above embodiment, wherein the static mixer adapter unit may include at least one connector configured to connect the static mixer adapter unit to a material conveying device. A detection device according to the above embodiment, wherein the static mixer adapter unit may include at least one connector configured to connect the static mixer adapter unit to a discharge device. A detection device according to the above embodiment, wherein a flow regulator is mounted on the hose adapter unit, and the hose adapter unit may include a sensor flow path and a sensor unit. A detection device according to the above embodiment, wherein the hose adapter unit is positioned between the discharge device and the material conveying device. A detection device according to the above embodiment, wherein the hose adapter unit may include at least one connector configured to connect the hose adapter unit to a material conveying device. A detection device according to the above embodiment, wherein the hose adapter unit may include at least one connector configured to connect the hose adapter unit to a discharge device. A detection device according to the above embodiment, wherein the flow regulator is mounted on the material conveying device. A detection device according to the above embodiment, wherein the material conveying device may include an adhesive conveying hose. A detection device according to the above embodiment, wherein the material transport device may include a heating device configured to heat the material transport device, the discharged material flowing through the material transport device, and / or a flow regulator. A detection device according to the above embodiment, wherein the material transport device may include a connector configured to connect the material transport device to the discharge device. A detection device according to the above embodiment, wherein the flow regulator is configured to extend within the connector. A discharge system according to the above embodiment, wherein the discharge system may include a material source, a discharge device, and a material transport device. A discharge system according to the above embodiment, wherein the discharge system may include an adhesive discharge system, wherein the discharge device is an adhesive dispenser and the material transport device is an adhesive transport hose. A discharge system according to the above embodiment, wherein the discharge system may include a hot melt adhesive discharge system, wherein the discharge device is a hot melt adhesive dispenser and the material transport device is a hot melt adhesive transport hose.

[0128] One embodiment includes a process comprising configuring a flow regulator to receive discharge material. The process further includes mixing the discharge material in the flow regulator and equalizing the thermal profile of the discharge material. The process also includes receiving the discharge material from the flow regulator in a sensor channel. The process also includes measuring the temperature of the discharge material in the sensor channel in a sensor unit.

[0129] The above embodiments may further include combinations of one or more of the following embodiments: The process of the above embodiment, wherein the flow regulator is configured to mix the discharge material so that the sensor unit produces more accurate temperature measurement, temperature detection, and / or mass flow determination. The process of the above embodiment, wherein the flow regulator is configured to mix the discharge material when the discharge material is in the flow regulator. The process of the above embodiment, wherein the flow regulator is configured to provide a more homogeneous laminar flow of the discharge material. The process of the above embodiment, wherein the flow regulator is configured to mix, generate vortices, and / or generate turbulence within the discharge material when the discharge material is in the flow regulator. The process of the above embodiment, wherein the flow regulator may include a mixing element configured to mix the flow of the discharge material. The process of the above embodiment, wherein the sensor unit may include a convective velocity measurement mass flow sensor. The process of the above embodiment, wherein the flow regulator is configured to provide a more homogeneous laminar flow of the discharge material in the sensor channel. The process of the above embodiment, wherein the flow regulator is configured to provide the sensor unit with more accurate temperature and / or flow rate measurements of the discharge material. The process of the above embodiment, wherein the flow regulating device is located upstream and near the sensor flow path and sensor unit. The process of the above embodiment, wherein the flow regulating device is located a certain distance upstream from the center of the sensor unit, the sensor flow path may include a certain dimension, and the distance is less than the dimension. The process of the above embodiment, wherein the flow regulating device is located a certain distance upstream from the center of the sensor unit, the sensor flow path may include a certain dimension, and the distance is 1 to 20 times greater than the dimension. The process of the above embodiment, wherein the flow regulating device is mounted on a static mixer adapter unit, and the static mixer adapter unit is located between the discharge device and the material transport device. The process of the above embodiment, wherein the material transport device is an adhesive transport hose. The process of the above embodiment, wherein the sensor unit and sensor flow path are located inside the discharge device. The process of the above embodiment, wherein the static mixer adapter unit may include a housing configured to accommodate the flow regulating device, and the housing may include a heating device.The process of the above embodiment, wherein the static mixer adapter unit may include at least one connector configured to connect the static mixer adapter unit to a material conveying device. The process of the above embodiment, wherein the static mixer adapter unit may include at least one connector configured to connect the static mixer adapter unit to a dispensing device. The process of the above embodiment, wherein a flow regulator is mounted on the hose adapter unit, and the hose adapter unit may include a sensor flow path and a sensor unit. The process of the above embodiment, wherein the hose adapter unit is positioned between the dispensing device and the material conveying device. The process of the above embodiment, wherein the hose adapter unit may include at least one connector configured to connect the hose adapter unit to a material conveying device. The process of the above embodiment, wherein the hose adapter unit may include at least one connector configured to connect the hose adapter unit to a dispensing device. The process of the above embodiment, wherein the flow regulator is mounted on the material conveying device. The process of the above embodiment, wherein the material conveying device may include an adhesive conveying hose. The process of the above embodiment, wherein the material conveying device may include a heating device configured to heat the material conveying device, the discharged material flowing through the material conveying device, and / or the flow regulator. The process of the above embodiment, wherein the material transport device may include a connector configured to connect the material transport device to the dispensing device. The process of the above embodiment, wherein the flow regulating device is configured to extend within the connector. The process of the above embodiment may include implementing a sensing device, and a dispensing system which may include a material source, a dispensing device, and a material transport device. The process of the above embodiment, wherein the dispensing system may include an adhesive dispensing system, wherein the dispensing device is an adhesive dispenser, and the material transport device is an adhesive transport hose. The process of the above embodiment, wherein the dispensing system may include a hot melt adhesive dispensing system, wherein the dispensing device is a hot melt adhesive dispenser, and the material transport device is a hot melt adhesive transport hose.

[0130] In this specification, terms such as "first," "second," etc., may be used to describe various elements, but it will be understood that these elements should not be limited by these terms. These terms are used solely to distinguish one element from another. For example, without departing from the scope of this disclosure, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element. As used herein, the term "and / or" includes any combination of one or more of the relevant enumerated items.

[0131] When an element such as a layer, region, or substrate is described as being "on" or extending "onto" another element, it will be understood that it may be directly on or extending directly onto another element, or there may be an intervening element. In contrast, when an element is described as being "directly on" or extending "directly onto" another element, there is no intervening element. Similarly, when an element such as a layer, region, or substrate is described as being "over" or extending "over" another element, it will be understood that it may be directly over another element, or there may be an intervening element. In contrast, when an element is described as being "directly over" or extending "directly over" another element, there is no intervening element. When an element is referred to as "connected" or "coupled" to another element, it should be understood that it may be directly connected or coupled to the other element, or there may be an intermediary element. In contrast, when an element is referred to as "directly connected" or "directly coupled" to another element, there is no intermediary element.

[0132] In this specification, relative terms such as “down,” “up,” “above,” “downward,” “horizontal,” or “vertical” may be used to describe the relationship between one element, layer, or region and another element, layer, or region, as shown in the figures. It will be understood that these terms and the terms described above are intended to encompass different orientations of the apparatus in addition to the orientation shown in the figures.

[0133] The technical terms used herein are for the sole purpose of describing specific aspects and are not intended to limit the disclosure. Where used herein, the singular forms "a," "an," and "the" are intended to include the plural unless the context explicitly indicates otherwise. Where used herein, the terms "comprises," "comprising," "includes," and / or "including" identify the presence of the described features, integers, steps, actions, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, actions, elements, components, and / or groups thereof.

[0134] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art to which this disclosure belongs. Terms used herein should be construed to have meanings consistent with their meanings in the context of this specification and in the relevant art, and it will be further understood that they should not be construed in an idealized or overly formal sense unless expressly defined herein.

[0135] Many of the features and advantages of this disclosure are evident from the detailed specification, and therefore the attached claims are intended to encompass all such features and advantages of this disclosure that fall within the true intent and scope of this disclosure. Furthermore, since many modifications and variations will readily come to mind for those skilled in the art, it is not desirable to limit this disclosure to the exact configuration and operation illustrated and described, and therefore all suitable modifications and equivalents that fall within the scope of this disclosure can be relied upon.

Claims

1. A flow regulating device configured to receive discharge material, the flow regulating device further configured to mix the discharge material and equalize the thermal profile of the discharge material, A sensor channel configured to receive the discharged material from the flow adjustment device, A sensor unit configured to measure the temperature of the discharged material in the sensor flow path, A detection device equipped with the following features.

2. The detection device according to claim 1, wherein the flow regulator is configured to mix the discharge material so that the sensor unit produces more accurate temperature measurement, temperature detection, and / or mass flow rate determination.

3. The detection device according to claim 1, wherein the flow adjusting device is configured to mix the discharged material when the discharged material is inside the flow adjusting device.

4. The detection device according to claim 1, wherein the flow adjustment device is configured to provide a more homogeneous laminar flow of the discharged material.

5. The detection device according to claim 1, wherein when the discharged material is in the flow regulating device, the flow regulating device is configured to perform mixing, vortex generation, and / or turbulence generation within the discharged material.

6. The detection device according to claim 1, wherein the flow adjustment device comprises a mixing element configured to mix the flow of the discharge material.

7. The detection device according to claim 1, wherein the sensor unit includes a convection velocity measurement method mass flow sensor.

8. The detection device according to claim 1, wherein the flow adjustment device is configured to provide a more homogeneous laminar flow of the discharge material within the sensor flow path.

9. The detection device according to claim 1, wherein the flow adjustment device is configured to provide the sensor unit with more accurate temperature and / or flow rate measurement of the discharged material.

10. The detection device according to claim 1, wherein the flow adjustment device is arranged upstream of and near the sensor flow path and the sensor unit.

11. The flow adjustment device is positioned a certain distance upstream from the center of the sensor unit. The sensor flow path includes a certain dimension, The detection device according to claim 1, wherein the distance is smaller than the dimension.

12. The flow adjustment device is positioned a certain distance upstream from the center of the sensor unit. The sensor flow path includes a certain dimension, The detection device according to claim 1, wherein the distance is 1 to 20 times greater than the dimension.

13. The flow adjustment device is mounted on the static mixer adapter unit. The detection device according to claim 1, wherein the static mixer adapter unit is positioned between the discharge device and the material conveying device.

14. The detection device according to claim 13, wherein the material transport device is an adhesive transport hose.

15. The detection device according to claim 13, wherein the sensor unit and the sensor flow path are arranged within the discharge device.

16. The static mixer adapter unit comprises a housing configured to accommodate the flow adjustment device, The detection device according to claim 13, wherein the housing comprises a heating device.

17. The detection device according to claim 13, wherein the static mixer adapter unit comprises at least one connector configured to connect the static mixer adapter unit to the material conveying device.

18. The detection device according to claim 13, wherein the static mixer adapter unit comprises at least one connector configured to connect the static mixer adapter unit to the discharge device.

19. The flow adjustment device is mounted on the hose adapter unit. The detection device according to claim 1, wherein the hose adapter unit comprises the sensor flow path and the sensor unit.

20. The detection device according to claim 19, wherein the hose adapter unit is positioned between the discharge device and the material conveying device.

21. The detection device according to claim 19, wherein the hose adapter unit comprises at least one connector configured to connect the hose adapter unit to a material conveying device.

22. The detection device according to claim 19, wherein the hose adapter unit comprises at least one connector configured to connect the hose adapter unit to a discharge device.

23. The detection device according to claim 1, wherein the flow adjustment device is mounted on a material conveying device.

24. The detection device according to claim 23, wherein the material transport device includes an adhesive transport hose.

25. The detection device according to claim 23, wherein the material conveying device comprises a heating device configured to heat the material conveying device, the discharged material flowing through the material conveying device, and / or the flow adjustment device.

26. The detection device according to claim 23, wherein the material transport device comprises a connector configured to connect the material transport device to a discharge device.

27. The detection device according to claim 26, wherein the flow adjustment device is configured to extend within the connector.

28. The detection device according to claim 1, wherein the flow adjustment device is arranged within the flow path of the discharge device.

29. The detection device according to claim 28, wherein the sensor unit and the sensor flow path are arranged within the discharge device.

30. The detection device according to claim 1, wherein the flow adjustment device is located within the applicator manifold of the discharge device.

31. The detection device according to claim 30, wherein the sensor unit and the sensor flow path are arranged within the discharge device.

32. The detection device according to claim 1, wherein the sensor unit and the sensor flow path are arranged within the discharge device.

33. The detection device according to claim 32, wherein the flow adjustment device is arranged within the flow path of the discharge device.

34. A discharge system comprising the detection device described in claim 1, wherein the discharge system is Material supply source, discharge device, and material conveying device, A dispensing system that is further equipped with these features.

35. The aforementioned dispensing system includes an adhesive dispensing system, The aforementioned dispensing device is an adhesive dispensing device, The discharge system according to claim 34, wherein the material transport device is an adhesive transport hose.

36. The aforementioned dispensing system includes a hot melt adhesive dispensing system. The aforementioned dispensing device is a hot melt adhesive dispensing device. The discharge system according to claim 34, wherein the material transport device is a hot melt adhesive transport hose.

37. The process of implementing a detection device, The flow adjustment device is configured to receive the discharged material, The flow adjustment device mixes the discharge material and equalizes the thermal profile of the discharge material. The discharge material is received from the flow adjustment device via a sensor channel, The sensor unit measures the temperature of the discharged material in the sensor flow path, A process that includes this.

38. A process for implementing the detection device according to claim 37, wherein the flow regulator is configured to mix the discharge material so that the sensor unit produces more accurate temperature measurement, temperature detection, and / or mass flow rate determination.

39. A process for implementing the detection device according to claim 37, wherein the flow adjusting device is configured to mix the discharged material when the discharged material is inside the flow adjusting device.

40. A process for implementing the detection device according to claim 37, wherein the flow adjustment device is configured to provide a more homogeneous laminar flow of the discharged material.

41. A process for implementing the detection device according to claim 37, wherein when the discharged material is in the flow regulating device, the flow regulating device is configured to perform mixing, vortex generation, and / or turbulence generation within the discharged material.

42. A process for implementing the detection device according to claim 37, wherein the flow adjustment device comprises a mixing element configured to mix the flow of the discharge material.

43. A process for implementing the detection device according to claim 37, wherein the sensor unit includes a convection velocity measurement mass flow sensor.

44. A process for implementing the detection device according to claim 37, wherein the flow adjustment device is configured to provide a more homogeneous laminar flow of the discharged material within the sensor flow path.

45. A process for implementing the detection device according to claim 37, wherein the flow adjustment device is configured to provide the sensor unit with more accurate temperature and / or flow rate measurements of the discharge material.

46. A process for implementing the detection device according to claim 37, wherein the flow adjustment device is arranged upstream of and near the sensor flow path and the sensor unit.

47. The flow adjustment device is positioned a certain distance upstream from the center of the sensor unit. The sensor flow path includes a certain dimension, A process for implementing the detection device according to claim 37, wherein the distance is smaller than the dimension.

48. The flow adjustment device is positioned a certain distance upstream from the center of the sensor unit. The sensor flow path includes a certain dimension, A process for implementing the detection device according to claim 37, wherein the distance is 1 to 20 times greater than the dimension.

49. The flow adjustment device is mounted on the static mixer adapter unit. A process for implementing the detection device according to claim 37, wherein the static mixer adapter unit is positioned between the discharge device and the material conveying device.

50. A process for implementing the detection device according to claim 49, wherein the material transport device is an adhesive transport hose.

51. A process for implementing the detection device according to claim 49, wherein the sensor unit and the sensor flow path are arranged within the discharge device.

52. The static mixer adapter unit comprises a housing configured to accommodate the flow adjustment device, A process for mounting the detection device according to claim 49, wherein the housing comprises a heating device.

53. A process for implementing the detection device according to claim 49, wherein the static mixer adapter unit comprises at least one connector configured to connect the static mixer adapter unit to the material conveying device.

54. A process for implementing the detection device according to claim 49, wherein the static mixer adapter unit comprises at least one connector configured to connect the static mixer adapter unit to the discharge device.

55. The flow adjustment device is mounted on the hose adapter unit. A process for implementing the detection device according to claim 37, wherein the hose adapter unit comprises the sensor flow path and the sensor unit.

56. A process for implementing the detection device according to claim 55, wherein the hose adapter unit is positioned between the discharge device and the material conveying device.

57. A process for implementing the detection device according to claim 55, wherein the hose adapter unit comprises at least one connector configured to connect the hose adapter unit to a material conveying device.

58. A process for implementing the detection device according to claim 55, wherein the hose adapter unit comprises at least one connector configured to connect the hose adapter unit to a discharge device.

59. A process for implementing the detection device according to claim 37, wherein the flow adjustment device is mounted on a material transport device.

60. A process for implementing the detection device according to claim 59, wherein the material transport device includes an adhesive transport hose.

61. A process for implementing the detection device according to claim 59, wherein the material conveying device comprises a heating device configured to heat the material conveying device, the discharged material flowing through the material conveying device, and / or the flow adjustment device.

62. A process for implementing the detection device according to claim 59, wherein the material transport device includes a connector configured to connect the material transport device to a discharge device.

63. A process for implementing the detection device according to claim 62, wherein the flow adjustment device is configured to extend within the connector.

64. A process for implementing the detection device according to claim 37, further comprising implementing the detection device and a discharge system comprising a material supply source, a discharge device, and a material transport device.

65. The aforementioned dispensing system includes an adhesive dispensing system, The aforementioned dispensing device is an adhesive dispensing device, A process for implementing the detection device according to claim 64, wherein the material transport device is an adhesive transport hose.

66. The aforementioned dispensing system includes a hot melt adhesive dispensing system. The aforementioned dispensing device is a hot melt adhesive dispensing device. A process for implementing the detection device according to claim 64, wherein the material transport device is a hot melt adhesive transport hose.

67. A process for implementing the detection device according to claim 43, wherein the flow adjustment device is located within the flow path of the discharge device.

68. A process for implementing the detection device according to claim 67, wherein the sensor unit and the sensor flow path are arranged within the discharge device.

69. A process for implementing the detection device according to claim 43, wherein the flow adjustment device is located within the applicator manifold of the discharge device.

70. A process for implementing the detection device according to claim 69, wherein the sensor unit and the sensor flow path are arranged within the discharge device.

71. A process for implementing the detection device according to claim 43, wherein the sensor unit and the sensor flow path are arranged within a discharge device.

72. A process for implementing the detection device according to claim 71, wherein the flow adjustment device is arranged within the flow path of the discharge device.