A circuit board device having one or more inductors for routing power from a power management integrated circuit (IC) (PMIC) to a secondary circuit board, and a related assembly method.

Abstract

A circuit board device employing a multilayer circuit board having one or more inductors for routing power from a power management integrated circuit (IC) (PMIC) to a secondary circuit board, and a related manufacturing method. The inductors are first vertically coupled between the first and second circuit boards as part of a power routing path between the PMIC on the first circuit board and the second electronic component(s) on the second circuit board. In this way, the PMIC can be shared between the first and second circuit boards to manage power signals supplied to both the first electronic component(s) on the first circuit board and the second electronic component(s) on the second circuit board. The inductors may also be strategically positioned to provide a shorter power signal routing path with reduced impedance between the PMIC and the second electronic component(s) to reduce or avoid power performance issues.

Description

Technical Field

[0001] Priority Application

[0001] This application claims priority to U.S. Patent Application No. 18 / 319,852, filed May 18, 2023, titled "CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWER MANAGEMENT INTEGRATED CIRCUIT (IC) (PMIC) TO A SECONDARY CIRCUIT BOARD, AND RELATED ASSEMBLY METHODS," which is incorporated herein by reference in its entirety.

Background Art

[0002]

[0002] The field of the present disclosure relates to electronic devices including printed circuit boards (PCBs) on which electrical components and integrated circuit (IC) chips (singular or plural) are mounted, and more particularly to electronic devices including multilayer PCBs.

[0003]

[0003] Electronic devices such as smartphones, laptops, and televisions have revolutionized modern society by enabling worldwide communication, entertainment, and access to information. These electronic devices include circuit boards also known as "printed circuit boards" (PCBs). A PCB is an electronic assembly that includes one or more conductive layers including metal wires or traces for providing electrical connections and electrical signal paths between electrical components coupled to the PCB. Electrical components such as integrated circuit (IC) chips and passive electrical components (e.g., resistors, capacitors, inductors) are physically attached to the PCB to provide electrical circuit connectivity for the electrical components. The PCB electrical components are also electrically coupled to external metal interconnects (e.g., metal pads) on the PCB, and the external metal interconnects are then electrically coupled to signal routing paths provided in the conductive layers of the PCB to provide electrical connections and electrical signal paths between the electrical components coupled to the PCB.

[0004]

[0004] The demand for smaller and more powerful electronic devices has led to the development of multilayer PCBs. Multilayer PCBs can be combined together or "stacked" to form a stacked PCB. A stacked PCB comprises multiple PCBs, each having its own conductive layers and electrical components coupled to the PCB. The multiple PCBs are stacked vertically on top of each other, with electrical signal paths provided in each conductive layer that are electrically interconnected with one another. For example, a first PCB in a stacked PCB device may include one or more application processors and a first power management integrated circuit (PMIC) for managing the power supplied to the application processors. A second PCB in a stacked PCB device may include radio frequency (RF) transceivers and a second PMIC for managing the power supplied to the RF transceivers. In this way, the RF transceivers and application processors are physically isolated from each other using their signal routing provided in their respective PCBs to minimize signal interference. However, electronic components within a multilayer PCB can be electrically connected to one another via standoff conductive structures such as metal posts or vias between the multilayer PCBs. Providing multilayer PCBs with electronic devices can also offer greater flexibility, as different manufacturers or suppliers can offer each PCB as an independent device, i.e., tested separately and then assembled into a multilayer PCB configuration as part of a separate assembly process. [Overview of the project]

[0005]

[0005] Embodiments disclosed herein include a circuit board device having one or more inductors for routing power from a power management integrated circuit (IC) (PMIC) to a secondary circuit board. Related assembly methods are also disclosed. The circuit board device includes a first electronic device comprising a first circuit board (e.g., a first printed circuit board (PCB)), one or more first electronic components (e.g., an application processor) coupled to the first circuit board, and a PMIC coupled to the first circuit board. The PMIC manages the power supplied to the one or more first electronic components. The circuit board device also includes a second electronic device comprising a second circuit board (e.g., a second PCB) and one or more second electronic components (e.g., a radio frequency (RF) transceiver) coupled to the second circuit board. The first and second circuit boards are stacked vertically on top of each other and coupled to each other via standoff conductive structures (e.g., solder joints, metal posts, vias, edge connectors) to provide both physical standoff connections and signal routing paths between the first and second electronic components(s). In an exemplary embodiment, the PMIC of the first circuit board is shared with the second circuit board so that the PMIC of the first circuit board also manages the power supplied to the second electronic components(s) of the second circuit board. In this way, the PMIC can be shared between the first and second circuit boards to manage the power signals supplied to both the first and second electronic components(s) to reduce costs and save space in the stacked circuit board. Each of the first and second circuit boards does not require a separate PMIC to manage power only for their respective first and second electronic components.

[0006]

[0006] In other exemplary embodiments, to provide a power routing path between a PMIC on a first circuit board and a second circuit board, the circuit board device includes one or more inductors coupled between the first circuit board and the second circuit board in the first vertical direction. The inductors can function as interposer connections between the first circuit board and the second circuit board. The inductors form part of the power routing path between the PMIC and the second electronic component(s) of the second circuit board. The inductors are coupled to the power port of the PMIC on the first circuit board via their coupling to the first circuit board. The inductors are also coupled to the second electronic component(s) of the second circuit board via their coupling to the second circuit board. By providing inductors(s) as part of the power routing path between the first and second circuit boards, the inductors(s)(s) can be more strategically positioned to reduce the length of the power routing path between the PMIC and the second electronic component(s). In this way, the power routing path between the PMIC and the second electronic component(s) will have reduced impedance to avoid power performance issues such as undesirable voltage drops, power signal loss, and electromagnetic interference (EMI) problems. This is in contrast to having to provide a power routing path through other conductive structures (e.g., standoff conductive structures) that may be located further away from the PMIC (e.g., around the circuit board).

[0007]

[0007] In another exemplary embodiment, the power routing path between the first circuit board and the second circuit board in the circuit board device also includes one or more ground signal routing paths to provide a ground return path from the second electronic component(s) of the second circuit board back to the PMIC of the first circuit board. In one exemplary embodiment, the ground signal routing path includes a separate short-circuit conductor coupled in the first vertical direction between the first circuit board and the second circuit board and coupled to ground of the PMIC and the second electronic component(s). The short-circuit conductor can also provide power switching noise isolation between the inductor and other first and / or second electronic components to provide a faster transient response in the PMIC.

[0008]

[0008] In another exemplary embodiment, to further reduce the inductance loop of the inductor (e.g., to avoid or mitigate undesirable EMI, signal interference, and / or power switching noise isolation problems), the inductor may be provided as a ground-shielded inductor. The ground-shielded inductor is a structure comprising an inductor core surrounded by an integrated conductive core, with a dielectric material placed between the inductor core and the conductive core to prevent short circuits of the inductor core to the conductive core. To reduce the inductance loop of the inductor, the conductive core is coupled to ground and can magnetically couple the inductor's inductance loop to ground. To reduce the inductance loop, by incorporating the conductive core into the ground-shielded inductor, the conductive core becomes more capable of magnetically coupling the inductor's inductance loop to ground. Thus, the conductive core acts as a ground shield for the inductor, reducing the inductor's antenna function and thus reducing EMI from signals carried through signal routing paths in the first and second circuit boards. The short-circuit conductor can also provide power switching noise isolation between the inductor and other electrical components to provide a faster transient response in the PMIC.

[0009]

[0009] In another example, the dielectric material of the ground-shielded inductor is selected to have a lower dielectric constant (e.g., carbon-doped oxide, highly porous oxide). This minimizes the capacitance between the conductive core and the inductor, and thus reduces the additional capacitance between the inductor and ground. The inductor may also include a plurality of terminals, including a first terminal connected to the inductor core for positioning the inductor core in a power signal routing path, and a separate second terminal connected to the integrated conductive core for positioning the integrated conductive core in a power ground routing path.

[0010]

[0010] In this regard, in one exemplary embodiment, a circuit board device is provided. The circuit board device comprises a first electronic device. The first electronic device includes a first circuit board. The first electronic device also includes a PMIC including a first power port coupled to the first circuit board and a second power port coupled to the first circuit board. The first electronic device also includes a first electronic component coupled to the first power port via the first circuit board. The circuit board device also comprises a second electronic device including a second circuit board coupled to the first circuit board in a first direction and a second electronic component coupled to the second circuit board. The circuit board device also comprises an inductor coupled to the first circuit board and the second circuit board in a first direction. The inductor is coupled to the second electronic component via the second circuit board. The inductor is also coupled to the second power port via the first circuit board.

[0011]

[0011] In another exemplary embodiment, a method for assembling a circuit board device is provided. The method comprises providing a first electronic device, which includes providing a first circuit board and coupling a first power port and a second power port of a power management integrated circuit (PMIC) to the first circuit board, and coupling a first electronic component to the first power port. The method also comprises providing a second electronic device, which includes providing a second circuit board and coupling a second electronic component to the second circuit board. The method also comprises coupling an inductor to the first circuit board in a first direction in order to couple the inductor to a second power port. The method also comprises coupling an inductor to the second circuit board in order to couple the inductor to a second electronic component. [Brief explanation of the drawing]

[0012] [Figure 1A]

[0012] A side view of a circuit board device including a first circuit board laminated on a second circuit board, the circuit board device further including one or more inductors and separate short-circuit conductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a power management integrated circuit (IC) (PMIC) on the first circuit board is shared between the first and second circuit boards to manage the supply of power to one or more second electronic components of the first and second circuit boards. [Figure 1B]

[0013] Figure 1A is an enlarged side view of a portion of the circuit board device. [Figure 2]

[0014] This is a side view of a circuit board device, which includes a first circuit board stacked on a second circuit board, with a separate PMIC provided on each circuit board to manage the power supply to the electronic components (one or more) on that circuit board. [Figure 3]

[0015] This is a side view of another circuit board device, which includes a first circuit board stacked on a second circuit board, where one or more second electronic components of the second circuit board receive power via a power routing path provided through a standoff conductive structure coupled to a PMIC on the first circuit board. [Figure 4]

[0016] A side view of another circuit board device, which includes a first circuit board stacked on a second circuit board, the circuit board device further includes one or more ground-shielded inductors, each containing an inductor core surrounded by an integrated conductive core, both coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to one or more second electronic components on the first and second circuit boards. [Figure 5A]

[0017] Figure 4 shows a side perspective view, a front perspective view, a cross-sectional front view, and a top view, respectively, of an exemplary box-shaped, grounded inductor that may be included as an inductor. [Figure 5BCD] Figures 5B to 5D are side perspective views, front perspective views, cross-sectional front views, and top views, respectively, of an exemplary box-shaped, grounded inductor that may be included as the inductor in Figure 4. [Figure 6]

[0018] Figures 6A to 6C are a front perspective view, a cross-sectional front view, and a top view, respectively, of another exemplary cylindrical, grounded inductor that may be included as the inductor in Figure 4. [Figure 7]

[0019] This flowchart illustrates an exemplary assembly process for assembling a circuit board device, which includes a first circuit board stacked on a second circuit board, the circuit board device further including one or more ground-shielded inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to the first circuit board and to one or more second electronic components on the second circuit board, including but not limited to the circuit board devices shown in Figures 1A, 1B, and 4. [Figure 8A]

[0020] Figure 8A is a flowchart illustrating another exemplary assembly process for assembling a circuit board device, which includes a first circuit board stacked on a second circuit board, further comprising one or more ground-shielded inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to the first circuit board and to one or more second electronic components on the second circuit board, including but not limited to the circuit board devices of Figures 1A, 1B, and 4. [Figure 8B] Figure 8B is a flowchart illustrating another exemplary assembly process for assembling a circuit board device, which includes a first circuit board stacked on a second circuit board, further comprising one or more ground-shielded inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to the first circuit board and to one or more second electronic components on the second circuit board, including but not limited to the circuit board devices of Figures 1A, 1B, and 4. [Figure 8C]Figure 8C is a flowchart illustrating another exemplary assembly process for assembling a circuit board device, which includes a first circuit board stacked on a second circuit board, further comprising one or more ground-shielded inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to the first circuit board and to one or more second electronic components on the second circuit board, including but not limited to the circuit board devices of Figures 1A, 1B, and 4. [Figure 9AB]

[0021] Figures 9A and 9B show exemplary assembly stages during the assembly of a circuit board device using the assembly process shown in Figures 8A to 8C. [Figure 9CD] Figures 9C and 9D show exemplary assembly stages during the assembly of a circuit board device using the assembly process shown in Figures 8A to 8C. [Figure 9EF] Figures 9E and 9F show exemplary assembly stages during the assembly of a circuit board device using the assembly process shown in Figures 8A to 8C. [Figure 10]

[0022] Block diagram of an exemplary processor-based system that may be provided as, or may be included in, a circuit board device(s), which includes, or may be included in, a first circuit board stacked on a second circuit board, the circuit board device(s), which further includes, a first circuit board device(s), which includes, a first circuit board device(s), which is coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board which is shared between the first and second circuit boards to manage the supply of power to the first circuit board and to, but not limited to, the second electronic components(s) of the second circuit board, including, but not limited to, the circuit board devices of Figures 1A, 1B, and 4, and which may be assembled according to the assembly process of Figures 7 to 8C. [Figure 11]

[0023] A block diagram of an exemplary wireless communication device that can be provided as or included in a circuit board device (s) including a first circuit board laminated on a second circuit board device, the circuit board device further including an inductor (s) coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and the PMIC on the first circuit board manages the supply of power to the first circuit board and to the second electronic component (s) of a second circuit board including but not limited to the circuit board devices of FIGS. 1A, 1B, and 4, and can be assembled according to the assembly process of FIGS. 7-8C.

Best Mode for Carrying Out the Invention

[0013]

[0024] Next, some exemplary aspects of the present disclosure will be described with reference to the drawings. The term "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" should not necessarily be construed as being more preferable or advantageous than other aspects.

[0014]

[0025] Embodiments disclosed herein include a circuit board device having one or more inductors for routing power from a power management integrated circuit (IC) (PMIC) to a secondary circuit board. Related assembly methods are also disclosed. The circuit board device includes a first electronic device comprising a first circuit board (e.g., a first printed circuit board (PCB)), one or more first electronic components (e.g., an application processor) coupled to the first circuit board, and a PMIC coupled to the first circuit board. The PMIC manages the power supplied to the one or more first electronic components. The circuit board device also includes a second electronic device comprising a second circuit board (e.g., a second PCB) and one or more second electronic components (e.g., a radio frequency (RF) transceiver) coupled to the second circuit board. The first and second circuit boards are stacked vertically on top of each other and coupled to each other via standoff conductive structures (e.g., solder joints, metal posts, vias, edge connectors) to provide both physical standoff connections and signal routing paths between the first and second electronic components(s). In exemplary embodiments, the PMIC on the first circuit board is shared with the second circuit board so that the PMIC on the first circuit board also manages the power supplied to the second electronic components(s) on the second circuit board. In this way, the PMIC can be shared between the first and second circuit boards to manage the power signals supplied to both the first and second electronic components(s) to reduce costs and save space within the stacked circuit board. Each of the first and second circuit boards does not require a separate PMIC to manage power solely for its respective first and second electronic components.

[0015]

[0026] In other exemplary embodiments, to provide a power routing path between a PMIC on a first circuit board and a second circuit board, the circuit board device includes one or more inductors coupled between the first and second circuit boards in the first vertical direction. The inductors can function as an interposer connection between the first and second circuit boards. The inductors form part of the power routing path between the PMIC and the second electronic component(s) on the second circuit board. The inductors are coupled to the power port of the PMIC on the first circuit board via their coupling to the first circuit board. The inductors are also coupled to the second electronic component(s) on the second circuit board via their coupling to the second circuit board. By providing inductors(s) as part of the power routing path between the first and second circuit boards, the inductors(s)(s) can be more strategically positioned to reduce the length of the power routing path between the PMIC and the second electronic component(s). In this way, the power routing path between the PMIC and the second electronic component(s) will have reduced impedance to avoid power performance problems such as undesirable voltage drops, power signal loss, and electromagnetic interference (EMI) issues. This is in contrast to having to provide a power routing path through other conductive structures (e.g., standoff conductive structures) that may be located further away from the PMIC (e.g., around the circuit board).

[0016]

[0027] In this regard, Figure 1A is a side view of a circuit board device 100 (also referred to herein as the “laminated circuit board device 100”) which includes a first electronic device 102(1) and a second electronic device 102(2) stacked on top of each other in a first vertical direction (Z-axis direction). The first electronic device 102(1) includes a first circuit board 104(1) (e.g., a printed circuit board (PCB)) which includes a first electronic component 106(1) coupled to the first circuit board 104(1). The second electronic device 102(2) includes a second circuit board 104(2) (e.g., a PCB) which includes a second electronic component 106(2) coupled to the second circuit board 104(2). The multilayer circuit board device 100 includes one or more standoff conductive structures 108 (e.g., solder joints, metal posts, vias, edge connectors) connected to the first circuit board 104(1) and the second circuit board 104(2) to provide physical support for stacking and connecting the first circuit board 104(1) and the second circuit board 104(2) together in a first vertical direction (Z-axis direction). The standoff conductive structures 108 provide a gap distance D1 between the first circuit board 104(1) and the second circuit board 104(2) in the first vertical direction (Z-axis direction). The first and second circuit boards 104(1) and 104(2) are at least partially parallel to each other in a second horizontal direction (X and Y axis direction) perpendicular to the first vertical direction (Z-axis direction). For example, the standoff conductive structures 108 may be interposer frames. In this example, the standoff conductive structure 108 also includes one or more vertical conductors 110(1), 110(2) (e.g., metal posts, metal vias) that provide a conductive signal path between the first circuit board 104(1) and the second circuit board 104(2), so that the first electronic component 106(1) in the first circuit board 104(1) of the first electronic device 102(1) may be electrically coupled to the second electronic component(s) 106(2) in the second circuit board 104(2) of the second electronic device 102(2) as part of the multilayer circuit board device 100.

[0017]

[0028] Continuing to refer to Figure 1A, the first electronic device 102(1) includes a PMIC 112 as one of the first electronic components 106(1) coupled to the first circuit board 104(1). In this example, the PMIC 112 is coupled to the second surface 113(2) of the first circuit board 104(1), which is opposite the first surface 113(1) of the first circuit board 104(1) in the first vertical direction (Z-axis direction). Thus, the PMIC 112 on the second surface 113(2) is located between the first circuit board 104(1) and the second circuit board 104(2), and is adjacent to the second circuit board 104(2) in the first vertical direction (Z-axis direction). The PMIC 112 is configured to manage the supply of power in the first power distribution network (PDN) 114(1) within the first circuit board 104(1). The PMIC 112 manages the supply of power within the PDN 114(1) to other first electronic components 106(3), 106(4) coupled to the first circuit board 104(1) as part of the first electronic device 102(1). For example, the PMIC 112 may be a switch-mode power supply (SMPS). The first electronic component 106(1) coupled to the first circuit board 104(1) and receiving power managed by the PMIC 112 as part of the first PDN 114(1) for operation in this example is a first application processor 116(1) which may be a system-on-a-chip (SoC). The first circuit board 104(1) includes a first metal interconnect 118(1) (e.g., metal traces or metal wires) within one or more first metallization layers 120(1) which are part of the first PDN 114(1) in order to provide a power routing path between the first application processor 116(1) and the PMIC 112.

[0018]

[0029] In this example, another first electronic component 106(3), coupled to the first circuit board 104(1) and receiving power managed by the PMIC 112 as part of the first PDN 114(1), is a second application processor 116(2), which may also be an SoC. The first circuit board 104(1) includes a second metal interconnect 118(2) (e.g., metal traces or metal wires) within one or more first metallization layers 120(1), which are also part of the first PDN 114(1), to provide a power routing path between the second application processor 116(2) and the PMIC 112 in order to power the second application processor 116(2) for operation. The first electronic device 102(1) in this example also includes a surface-mount decoupling capacitor 122 as another first electronic component 106(1), coupled to the first circuit board 104(1) and configured to provide decoupling capacitance as part of the first PDN 114(1). In this example, the first electronic device 102(1) is also coupled to the first circuit board 104(1) and includes a surface-mount inductor 124 as another first electronic component 106(1) configured to provide inductance within the first PDN 114(1) to store energy, such as during the off-switching time of the power supply in the PMIC 112.

[0019]

[0030] As will be described in more detail below, the laminated circuit board device 100 includes an inductor 126 to enable the sharing of the PMIC 112 in the first electronic device 102(1) coupled to the first circuit board 104(1), and to manage the supply of power to the second electronic component 106(2) in the second electronic device 102(2). In this example, the inductor 126 is positioned between the first circuit board 104(1) and the second circuit board 104(2) in the first vertical direction (Z-axis direction) and coupled to them. In this example, the inductor 126 functions as an interposer connection between the first circuit board 104(1) and the second circuit board 104(2). For example, inductor 126 may be connected (e.g., soldered) between the first and / or second metal interconnects 118(1), 118(2) in the first PDN 114(1) in the first circuit board 104(1) and the third metal interconnect 118(3) in the second PDN 114(2) in the second circuit board 104(2) to electrically couple (e.g., directly couple) the first and second PDNs 114(1), 114(2) to each other. Inductor 126 may be connected in series (e.g., directly couple) between the first PDN 114(1) in the first circuit board 104(1) and the second PDN 114(2) in the second circuit board 104(2) to distribute power from the shared PMIC 112 to one or more second electronic components 106(2) in the second electronic device 102(2).

[0020]

[0031] In this regard, the second circuit board 104(2) includes a third metal interconnect 118(3) (e.g., metal traces or metal wires) within one or more second metallization layers 120(2), which are also part of the second PDN114(2), to provide a power routing path between the inductor 126 and the first PDN114(1) and the PMIC112 within the first circuit board 104(1). In this example, the inductor 126 is coupled to the RFIC128 as a second electronic component 106(2) within the second circuit board 104(2). Thus, as will be described in more detail below, power signals can flow from the PMIC112 and the first PDN114(1) within the first circuit board 104(1) through the inductor 126 to the second PDN114(2) and the RFIC128 within the second circuit board 104(2), supplying power to the RFIC128 for operation. Inductor 126 not only provides inductance within the second PDN 114(2), but also provides a power routing path between the first PDN 114(1) in the first circuit board 104(1) and the second PDN 114(2) in the second circuit board 104(2). In this way, PMIC 112 can manage the power supplied to both the first electronic component(s) 106(1) and the second electronic component(s) 106(2) in both the first circuit board 104(1) and the second circuit board 104(2), respectively, and can be shared between the first PDN 114(1) and the second PDN 114(2) in the first circuit board 104(1) and the second circuit board 104(2) to reduce costs and save area of ​​the multilayer circuit board device 100. Therefore, by sharing the PMIC 112 between the first and second PDNs 114(1) and 114(2) in the first and second circuit boards 104(1) and 104(2), in this example, no additional separate PMIC(s) are required to manage the supply of power to the second electronic component(s) 106(2) in the second electronic device 102(2).

[0021]

[0032] Furthermore, by providing the inductor 126 as part of the power routing path between the first and second PDNs 114(1) and 114(2) on the respective first and second circuit boards 104(1) and 104(2), the inductor 126 can be more strategically positioned on the first circuit board 104(1) to reduce the length of the power routing path between the PMIC 112 and the second electronic component(s) 106(2) in the second circuit board 104(2). In this way, the power routing path between the PMIC 112 and the second electronic component(s) 106(2) will have reduced impedance to avoid power performance problems such as undesirable voltage drops, power signal losses, and electromagnetic interference (EMI) problems. This is in contrast to the need to provide power routing paths through other conductive structures, such as the standoff conductive structure 108, which may be located further away from the PMIC 112, such as around the first and second circuit boards 104(1) and 104(2), as shown in Figure 1A.

[0022]

[0033] To illustrate the multilayer circuit board device 100 of Figure 1A, and the coupling of the first and second circuit boards 104(1), 104(2) via an inductor 126 for coupling their first and second PDNs 114(1), 114(2) together to supply power from the PMIC 112 to the second electronic device 102(2), Figure 1B is provided to illustrate further illustrative details of the multilayer circuit board device 100 of Figure 1A for illustrating more illustrative details below.

[0023]

[0034] As shown in Figure 1B, the PMIC 112 includes a first power port 130(1) and a second power port 130(2) coupled to (e.g., directly connected to) the first circuit board 104(1). The first power port 130(1) includes a first power signal port 132P and a first ground signal port 132G. In this example, the first power signal port 132P and the first ground signal port 132G are provided through external metal interconnects (e.g., bumps) of the PMIC 112 coupled to the first circuit board 104(1). The first power signal port 132P is configured to carry a first power signal 133(1) from the PMIC 112 as part of the first PDN 114(1). The first ground signal port 132G is configured to be coupled to ground of the PMIC 112 as part of the first PDN 114(1) to provide a return signal path from an electronic component powered via the first power port 130(1). The second power port 130(2) includes the second power signal port 134P and the second ground signal port 134G, which are provided through the external metal interconnects (e.g., bumps) of the PMIC 112, which are also coupled to the first circuit board 104(1) in this example. The second power signal port 134P is configured to carry the second power signal 133(2) from the PMIC 112 as part of the first PDN 114(1). The second ground signal port 132G is configured to be coupled to ground of the PMIC 112 as part of the first PDN 114(1) to provide a return signal path from an electronic component powered via the second power port 130(2).

[0024]

[0035] Continuing to refer to Figure 1B, the power and ground metal interconnects 118(1)P and 118(1)G of the first circuit board 104(1) are coupled to the first power signal port 132P and the first ground signal port 132G of the first power port 130(1) to couple the first electronic component 106(1) of the first application processor 116(1) to the first PDN 114(1) and to receive power from the PMIC 112 for operation. In this regard, the first application processor 116(1) includes a first input power port 136, which includes a first input power signal port 138P and a first input ground signal port 138G. In this example, the first input power signal port 138P and the first input ground signal port 138G are provided through the external metal interconnects (e.g., bumps) of the PMIC 112 coupled to the first circuit board 104(1). In this example, the first input power signal port 138P of the first application processor 116(1) is connected in series with an inductor 124 coupled to the first power signal port 132P of the PMIC 112. The first input ground signal port 138G of the first application processor 116(1) is connected in series (for example, directly) with a decoupling capacitor 122 coupled to the first ground signal port 132G of the PMIC 112.

[0025]

[0036] Continuing to refer to Figure 1B, in order to supply power from the PMIC 112 to the second circuit board 104(2) and its second PDN 114(2), the second power and ground metal interconnects 118(2)P and 118(2)G of the first circuit board 104(1) are also coupled to the second power signal port 134P and the second ground signal port 134G of the second power port 130(2) of the PMIC 112, thereby coupling the first PDN 114(1) to the second PDN 114(2) (for example, directly). This is because the second electronic component 106(2), coupled to the second circuit board 104(2) of the RFIC 128, receives the second power signal 133(2) from the PMIC 112 for operation. In this regard, the RFIC 128 includes a second input power port 140 which includes a second input power signal port 142P and a second input ground signal port 142G. In this example, the second input power signal port 142P and the second input ground signal port 142G are provided through external metal interconnects (e.g., bumps) of the RFIC 128 coupled to the second circuit board 104(2). In this example, the second input power signal port 142P of the RFIC 128 is coupled in series with an inductor 126, which is coupled to the second power signal port 134P of the PMIC 112. The second input ground signal port 142G of the RFIC 128 is coupled in series with a short-circuit conductor 144, which is coupled to the second ground signal port 134G of the PMIC 112. The short-circuit conductor 144 is a conductive structure which may be, for example, a conductive metal bar, a conductive metal post, or other metallic structure. The short-circuit conductor 144 provides a signal return path from the RFIC 128 to the PMIC 112 from the power received at the RFIC 128's second input ground signal port 142G.

[0026]

[0037] In this example, similar to the inductor 126, the short-circuit conductor 144 is positioned between the first circuit board 104(1) and the second circuit board 104(2) in the first vertical direction (Z-axis direction) and coupled to them. In this way, the short-circuit conductor 144 also provides support for the connection of the second circuit board 104(2) to the first circuit board 104(1) within the multilayer circuit board device 100. For example, the short-circuit conductor 144 can be connected (e.g., soldered) between the second power and ground metal interconnects 118(2)P, 118(2)G in the first PDN114(1) in the first circuit board 104(1) and the third power and ground metal interconnects 118(3)P, 118(3)G in the second PDN114(2) in the second circuit board 104(2), thereby electrically coupling the ground signal paths of the first and second PDN114(1) and 114(2) together. The short-circuit conductor 144 connects the first PDN 114(1) in the first circuit board 104(1) to the second PDN 114(2) in the second circuit board 104(2) for a return ground signal from one or more second electronic components 106(2) in the second electronic device 102(2) back to the shared PMIC 112. In this example, the short-circuit conductor 144 is adjacent to the inductor 126 in the second horizontal direction (X-axis direction). For example, the short-circuit conductor 144 may be adjacent to the inductor 126 by a distance D2 or less in the second horizontal direction (X-axis direction) as specified by the PCB manufacturer according to the design for manufacturing guidelines.

[0027]

[0038] By positioning the short-circuit conductor 144 in close proximity to the inductor 126, the short-circuit conductor 144 can also provide power switching noise isolation between the inductor 126 and other first electronic component 106(1) and / or second electronic component 106(2) (for example, if the PMIC 112 has a switched power supply (SPS)), thereby providing a faster transient response in the PMIC 112.

[0028]

[0039] Figure 2 is a side view of an alternative circuit board device 200 (also referred to herein as the “multilayer circuit board device 200”) which includes the first electronic device 102(1) of Figures 1A and 1B, stacked on the second circuit board 204(2) of the second electronic device 202(2). Common elements between the multilayer circuit board device 200 of Figure 2 and the multilayer circuit board devices 100 of Figures 1A and 1B are indicated by common element numbers. However, in the multilayer circuit board device 200 of Figure 2, the first PDN 114(1) provided by the PMIC 112 is not shared with the second circuit board 204(2). Instead, the second PMIC 212 is coupled to the second circuit board 204(2) which provides the second PDN 214(2) to the second circuit board 204(2) which is not coupled to the first PDN 114(1). In this regard, the RFIC128 is powered by the second PMIC212 through the second PDN214(2) located in the second circuit board 204(2). Since the first and second PDN114(1) and 214(2) are separated from each other on their respective first and second circuit boards 104(1) and 204(2), in this example no inductor is provided in the multilayer circuit board device 200 to couple the first PDN114(1) in the first circuit board 104(1) to the second PDN214(2) in the second circuit board 204(2). Therefore, the multilayer circuit board device 200 would incur more costs and consume more board area by having a second PMIC212 to provide a separate second PDN214(2) in the second circuit board 204(2).

[0029]

[0040] Figure 3 is a side view of yet another alternative circuit board device 300 (also referred to herein as “multilayer circuit board device 300”), which includes the first electronic device 102(1) including the first circuit board 104(1) of Figures 1A and 1B, stacked on the second circuit board 304(2) of the second electronic device 302(2). Common elements between the multilayer circuit board device 300 of Figure 3 and the multilayer circuit board devices 100 of Figures 1A and 1B are indicated by common element numbers. In the multilayer circuit board device 300 of Figure 3, the first PDN 114(1) provided by the PMIC 112 is shared with the second circuit board 304(2) to also supply power to the second PDN 314(2) in the second circuit board 304(2). However, no inductor is provided to couple the first PDN 114(1) to the second PDN 314(2). Instead, the second power port 130(2) of the PMIC 112 is coupled to the second input power port 140 of the RFIC 128 through a second power metal interconnect 118(2)P and a second ground metal interconnect 118(2)G coupled to the vertical conductor 110(1) of the standoff conductive structure 108, and through a third power and ground metal interconnect 318(3)P, 318(3)G. Thus, the PMIC 112 is shared between the first and second circuit boards 104(1), 304(2) to supply power to both the first and second PDNs 114(1), 314(2) in the respective first and second circuit boards 104(1), 304(2), but the signal path length between the PMIC 112 and the RFIC 128 is much longer than that of the multilayer circuit board device 100 in Figures 1A and 1B. Therefore, the second PDN314(2) will experience more losses due to the increased impedance resulting from the increased signal path length between the PMIC112 and RFIC128.

[0030]

[0041] Figure 4 is a side view of another circuit board device 400 (also referred to herein as “Multilayer Circuit Board Device 400”) which includes the first electronic device 102(1) and the second electronic device 102(2) of the multilayer circuit board device 100 of Figures 1A and 1B. Common elements between the multilayer circuit board device 100 of Figures 1A and 1B and the multilayer circuit board device 400 of Figure 4 are indicated by common element numbers. However, in the exemplary multilayer circuit board device 400 of Figure 4, an alternative ground-shielded inductor 426 is provided to couple the first PDN 114(1) in the first circuit board 104(1) to the second PDN 114(2) in the second circuit board 104(2). In this example, the ground-shielded inductor 426 functions as an interposer connection between the first circuit board 104(1) and the second circuit board 104(2). As illustrated in the following example, the ground-shielded inductor 426 includes a short-circuit conductor in the form of an inductive core 426I that provides inductance in series with first and second PDNs 114(1), 114(2) both coupled to the PMIC 112 in the first electronic device 102(1). The ground-shielded inductor 426 also includes a conductive core 426C that surrounds the inductive core 426I in a second horizontal direction (X-axis and Y-axis direction) to provide shielding to the inductive core 426I using a dielectric material placed between the conductive core 426C and the inductive core 426I, as shown in the further example below. The conductive core 426C is connected in series to the second ground metal interconnect 118(2)G in the first PDN114(1) of the first circuit board 104(1) and to the third ground metal interconnect 118(3)G of the second PDN114(2) of the second circuit board 104(2). By being connected in series between them, the conductive core 426C is short-circuited to ground, connecting the conductive core 426C to the ground of the first and second PDN114(1) and 114(2). By short-circuiting the conductive core 426C to ground, the inductance loop of the inductive core 426I is magnetically coupled to ground, and the inductance loop of the inductive core 426I is reduced.The inductive core 426I is connected in series to the second power metal interconnect 118(2)P in the first PDN114(1) of the first circuit board 104(1) and to the third power metal interconnect 118(3)P of the second PDN114(2) of the second circuit board 104(2), and is connected in series between them, thereby connecting the inductive core 426I to the second power port 130(2) of the PMIC112.

[0031]

[0042] In this way, by incorporating the conductive core 426C into the ground-shielded inductor 426, the conductive core 426C is positioned closer to the inductive core 426I, and therefore it is more possible to magnetically couple the inductive core 426I's inductance loop to ground and reduce the inductance loop. The inductance loops of inductor 426 and its inductive core 426I can be reduced even further than the reduction of the inductance loop of inductor 126 in the multilayer circuit board device 100 of Figures 1A and 1B by using the short-circuit conductor 144. By reducing the inductance loop of the inductive core 426I, undesirable EMI, signal interference, and / or power switching noise isolation problems in the first and second PDNs 114(1) and 114(2) can be reduced or mitigated. The conductive core 426C acts as a ground shield for the inductive core 426I, mitigating the inductive core 426I's antenna function and thus reducing EMI with signals carried through the signal routing paths in the first and second circuit boards 104(1) and 104(2). Shorting the conductive core 426C to ground can also provide power switching noise isolation between the inductor and other electrical components to offer a faster transient response in the PMIC.

[0032]

[0043] Referring to Figure 4, the ground-shielded inductor 426 is positioned between the first circuit board 104(1) and the second circuit board 104(2) in the first vertical direction (Z-axis direction) and coupled to them. For example, the ground-shielded inductor 426 can be connected (e.g., soldered) between the first and / or second metal interconnects 118(1), 118(2) in the first PDN 114(1) in the first circuit board 104(1) and the third metal interconnect 118(3) in the second PDN 114(2) in the second circuit board 104(2), thereby electrically coupling the first and second PDNs 114(1), 114(2) to each other. The ground-shielded inductor 426 connects the first PDN 114(1) in the first circuit board 104(1) in series with the second PDN 114(2) in the second circuit board 104(2) in order to distribute power from the shared PMIC 112 to one or more second electronic components 106(2) in the second electronic device 102(2).

[0033]

[0044] A ground-shielded inductor that can couple a power distribution network between multilayer circuit boards so that a PMIC in one circuit board can supply power to a PDN in the other multilayer circuit board, such as the ground-shielded inductor 426 in the circuit board device 400 of Figure 4, can be provided in different designs. For example, Figures 5A to 5D are a side perspective view, a front perspective view, a cross-sectional front view, and a top view, respectively, of an exemplary box-shaped ground-shielded inductor 526 that may be included, for example, as the ground-shielded inductor 426 of Figure 4. In this regard, as shown in Figure 5A, the ground-shielded inductor 526 includes a box-shaped inductive core 526I in the form of a metal coil. The box-shaped ground-shielded inductor 526 can provide an interposer connection between two circuit boards, such as the first circuit board 104(1) and the second circuit board 104(2) in the circuit board device 400 of Figure 4. The dielectric material 500 surrounds the box-shaped inductive core 526I, short-circuiting the box-shaped inductive core 526I from the conductive core 526C surrounding the box-shaped inductive core 526I. As shown in Figures 5B to 5D, the box-shaped inductive core 526I is located within a box-shaped cavity 502 containing a plurality of inner surfaces 504(1) to 504(4). As also shown in Figures 5B to 5D, the box-shaped inductive core 526I is surrounded by the dielectric material 500 located on or adjacent to the inner surfaces 504(1) to 504(4), and is surrounded by the conductive core 526C in a second direction (X-axis direction). The dielectric material 500 may have a lower dielectric constant (e.g., carbon-doped oxide, highly porous oxide) and may be formed from a structure or material having a dielectric constant of 4.0 or less. This minimizes the capacitance between the conductive core 526C and the box-shaped inductive core 526I, and therefore reduces the additional capacitance between the ground-shielded inductor 526 and ground.

[0034]

[0045] Furthermore, as shown in Figures 5B to 5D, the box-shaped inductive core 526I can be exposed from the ground-shielded inductor 526, and the ends of the box-shaped inductive core 526I form first and second terminals 506(1) and 506(2) that are coupled to power metal interconnects between two circuit boards, such as the power metal interconnects 130(2)P and 130(3)P in the first and second circuit boards 104(1) and 104(2) in the circuit board device 400 in Figure 4. Furthermore, as shown in Figures 5B to 5D, the conductive core 526C has third and fourth terminals 506(3) and 506(4) at one end and fifth and sixth terminals 506(5) and 506(6) at the opposite end, and is configured to be coupled to ground metal interconnects between two circuit boards, such as the ground metal interconnects 130(2)G and 130(3)G in the first and second circuit boards 104(1) and 104(2) within the circuit board device 400 in Figure 4.

[0035]

[0046] Figures 6A to 6C are a front perspective view, a front section view, and a top view of an exemplary cylindrical ground-shielded inductor 626, which may be included, for example, as the ground-shielded inductor 426 in Figure 4. The cylindrical ground-shielded inductor 626 can provide an interposer connection between two circuit boards, such as the first and second circuit boards 104(1) and 104(2) in the circuit board device 400 in Figure 4. In this regard, as shown in Figure 6A, the ground-shielded inductor 626 includes a cylindrical inductive core 626I in the form of a metal coil. A dielectric material 600 surrounds the cylindrical inductive core 626I and short-circuits the cylindrical inductive core 626I from a conductive core 626C surrounding the cylindrical inductive core 626I. As shown in Figures 6A to 6C, the inductive core 626I is located within a cylindrical cavity 602 containing a plurality of inner surfaces 604(1) to 604(4). As also shown in Figures 6A to 6C, the cylindrical inductive core 626I is surrounded by a dielectric material 600 located on or adjacent to the inner surfaces 604(1) to 604(4) and surrounded in a second direction (X-axis direction) by a conductive core 626C. The dielectric material 600 may be formed of a structure or material having a lower dielectric constant (e.g., carbon-doped oxide, highly porous oxide) and having a dielectric constant of 4.0 or less. This minimizes the capacitance between the conductive core 626C and the cylindrical inductive core 626I, and therefore reduces the additional capacitance between the ground-shielded inductor 626 and ground.

[0036]

[0047] Furthermore, as shown in Figures 6A to 6C, the cylindrical inductive core 626I can be exposed from the ground-shielded inductor 626, thereby forming first and second terminals 606(1) and 606(2) that are coupled to power metal interconnects between two circuit boards, such as the power metal interconnects 118(2)P and 118(3)P in the first and second circuit boards 104(1) and 104(2) in the circuit board device 400 of Figure 4. Furthermore, as shown in Figures 6A to 6C, the conductive core 626C has third and fourth terminals 606(3) and 606(4) at one end and fifth and sixth terminals 606(5) and 606(6) at the opposite end, and is configured to be coupled to ground metal interconnects between two circuit boards, such as the ground metal interconnects 118(2)G and 118(3)G in the first and second circuit boards 104(1) and 104(2) within the circuit board device 400 in Figure 4.

[0037]

[0048] The assembly process can be used to assemble a circuit board device, which includes a first circuit board laminated on a second circuit board, the circuit board device further including one or more inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to the first circuit board and to the second electronic components (one or more) of the second circuit board, including but not limited to the circuit board devices 100, 400 in Figures 1A, 1B, and 4.

[0038]

[0049] In this regard, Figure 7 is a flowchart illustrating an exemplary assembly process 700 for assembling a circuit board device, which includes a first circuit board stacked on a second circuit board, the circuit board device further including one or more inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to the first circuit board and to the second electronic components (one or more) of the second circuit board, including but not limited to the circuit board devices 100, 400 in Figures 1A, 1B, and 4. The assembly process 700 in Figure 7 is described with respect to the circuit board device 100 in Figures 1A and 1B as an example, but it should be noted that the assembly process 700 in Figure 7 is not limited to assembling the circuit board device 100 in Figures 1A and 1B. The assembly process 700 in Figure 7 may be used to manufacture other circuit board devices, including the circuit board device 400 in Figure 4, which include inductors (one or more) coupled between the first circuit board and the second circuit board as part of a power routing path between the first circuit board and the second circuit board, such that a PMIC on the first circuit board is shared between the first circuit board and the second circuit board.

[0039]

[0050] In this regard, as shown in Figure 7, the first step of the assembly process 700 may be to provide the first electronic device 102(1) (block 702 in Figure 7). Providing the first electronic device 102(1) may include providing the first circuit board 104(1) (block 704 in Figure 7), coupling the first power port 130(1) and the second power port 130(2) of the PMIC 112 to the first circuit board 104(1) (block 706 in Figure 7), and coupling the first electronic component 106(1) to the first power port 130(1) in the first circuit board 104(1) (block 708 in Figure 7). The next step in the assembly process 700 may be to provide the second electronic device 102(2) (block 710 in Figure 7). Providing the second electronic device 102(2) may include providing the second circuit board 104(2) (block 712 in Figure 7) and coupling the second electronic component 106(2) (e.g., RFIC128) to the second circuit board 104(2) (block 714 in Figure 7). The next step in the assembly process 700 may be coupling the inductor 126 to the first circuit board 104(1) in a first direction (Z-axis direction) and coupling the inductor 126 to the second power port 130(2) (block 716 in Figure 7). The next step in the assembly process 700 may be coupling the inductor 126 to the second circuit board 104(2) and coupling the inductor 126 to the second electronic component 106(2) (e.g., RFIC128) (block 718 in Figure 7).

[0040]

[0051] Other assembly processes can be used to assemble a circuit board device, which includes a first circuit board laminated on a second circuit board, the circuit board device further including one or more inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to the first circuit board and to the second electronic components (one or more) of the second circuit board, including but not limited to the circuit board devices 100, 400 in Figures 1A, 1B, and 4.

[0041]

[0052] In this regard, Figures 8A–8C are flowcharts illustrating an exemplary assembly process 800 for assembling a circuit board device, which includes a first circuit board stacked on a second circuit board, the circuit board device further including one or more inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, and a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to the first circuit board and to the second electronic components(s) of the second circuit board, including but not limited to the circuit board devices 100, 400 in Figures 1A, 1B, and 4. The assembly process 800 in Figures 8A–8C is described with respect to the circuit board device 400 in Figure 4, but it should be noted that the assembly process 800 in Figures 8A–8C is not limited to manufacturing the circuit board device 400 in Figure 4. The assembly process 800 shown in Figures 8A to 8D can, as another example, be used to manufacture the circuit board device 100 shown in Figures 1A and 1B.

[0042]

[0053] Figures 9A to 9F show exemplary assembly stages 900A to 900F during the assembly of the circuit board device 400 according to the assembly process 800 shown in Figures 8A to 8C. The assembly process 800 will be explained in conjunction with the assembly stages 900A to 900F shown in Figures 9A to 9F.

[0043]

[0054] In this regard, as shown in exemplary assembly stage 900A in Figure 9A, the first step of the assembly process 800 may be to provide a first circuit board 104(1) including the first metal interconnect 118(1) of the first PDN 114(1) (block 802 in Figure 8A). Then, as shown in exemplary assembly stage 900B in Figure 9B, the next step of the assembly process 800 may be to couple the first electronic component 106(1) (in this example, the first application processor 116(1)), the decoupling capacitor 122, and the inductor 124 to the first circuit board 104(1) (block 804 in Figure 8A). The first input power port 136 of the application processor 116(1) is coupled to the first PDN 114(1).

[0044]

[0055] As shown in the exemplary assembly stage 900C of Figure 9C, the next step in assembly process 800 may be coupling the PMIC 112 to the first circuit board 104(1) (block 806 in Figure 8B). Coupling the PMIC 112 to the first circuit board 104(1) couples the first and second power ports 130(1) and 130(2) of the PMIC 112 to the first circuit board 104(1) and the first PDN 114(1). Assembly stage 900C also shows that the inductor 426 is coupled to the first circuit board 104(1) and the second power port 130(2) of the PMIC 112 (block 806 in Figure 8B). The standoff conductive structure 108 is also coupled to the first circuit board 104(1) to prepare the first circuit board 104(1) to be stacked on the second circuit board 104(2) (block 806 in Figure 8B).

[0045]

[0056] Next, as shown in the exemplary assembly step 900D of Figure 9D, the next step in the assembly process 800 may be to provide a second circuit board 104(2) in which a third metal interconnect 118(3) is disposed to form a second PDN 114(2) (block 808 in Figure 8B). The second circuit board 104(2) can be aligned with the first circuit board 104(1) and its standoff conductive structure 108 so that the first circuit board 104(1) is bonded and laminated onto the second circuit board 104(2) having the standoff conductive structure 108.

[0046]

[0057] Next, as shown in the exemplary assembly step 900E of Figure 9E, the next step in the assembly process 800 may be to supply and couple the RFIC 128 to the second circuit board 104(1) and couple the RFIC 128 to the second PDN 114(2) in the second circuit board 104(2) (block 810 in Figure 8C). The second input power port 140 of the RFIC 128 is coupled to the third metal interconnect 118(3) of the second PDN 114(2). Next, as shown in the exemplary assembly step 900F of Figure 9F, the next step in the assembly process 800 may be to couple the first circuit board 104(1) to the second circuit board 104(2) and couple the first PDN 114(1) in the first circuit board 104(1) to the second PDN 114(2) in the second circuit board 104(2) via inductors 426 coupled to the first circuit board 104(1) and the second circuit board 104(2) (block 812 in Figure 8C). This forms the circuit board device 400 as shown in Figure 4. The first and second circuit boards 104(1) and 104(2) are coupled to each other by coupling the standoff conductive structure 108 and the inductor 426 to the first and second circuit boards 104(1) and 104(2).

[0047]

[0058] It should be noted that, as described herein, the term “joining” can mean either being directly connected or being indirectly connected. When two objects are directly connected, there are no intervening parts connecting the two objects. When two objects are indirectly connected, there may be one or more intervening parts connecting the two joined objects.

[0048]

[0059] A circuit board device, comprising a first circuit board stacked on a second circuit board, further comprising one or more inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, wherein a PMIC on the first circuit board is shared between the first and second circuit boards to manage the supply of power to the first circuit board and to the second electronic components (one or more) of the second circuit board, including but not limited to the circuit board devices 100, 400 of Figures 1A, 1B, and 4, and assembled according to the exemplary assembly processes 700, 800 of Figures 7 and 8A-8C, may be provided for or integrated into an electronic device, an IC package, and / or any processor-based device. Examples include, but are not limited to, set-top boxes, entertainment units, navigation devices, communication devices, fixed location data units, mobile location data units, global positioning system (GPS) devices, mobile phones, cell phones, smartphones, session initiation protocol (SIP) phones, tablets, phablets, servers, computers, portable computers, mobile computing devices, wearable computing devices (e.g., smartwatches, health or fitness trackers, eyewear, etc.), desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, vehicle components, avionics systems, drones, and multirotors.

[0049]

[0060] In this regard, Figure 10 shows an example of a processor-based system 1000 including circuit board devices 1002, 1002(1) to 1002(7) including a board containing a first circuit board stacked on a second circuit board, the circuit board devices further including one or more inductors coupled between the first and second circuit boards as part of a power routing path between the first and second circuit boards, a PMIC on the first circuit board shared between the first and second circuit boards to manage the supply of power to the first circuit board and to the second electronic components (one or more) of the second circuit board, including but not limited to the circuit board devices 100, 400 in Figures 1A, 1B, and 4, and assembled according to the exemplary assembly processes 700, 800 in Figures 7 and 8A to 8C.

[0050]

[0061] In this example, the processor-based system 1000 may be formed as a system-on-a-chip (SoC) 1006, as a circuit board device 1002 or IC 1004. The processor-based system 1000 includes a central processing unit (CPU) 1008, which includes one or more processors 1010, which may also be called CPU cores or processor cores. The CPU 1008 may be provided on the circuit board device 1002(1). The CPU 1008 may have a cache memory 1012 coupled to the CPU 1008 for quick access to temporarily stored data. The CPU 1008 is coupled to a system bus 1014, which can interconnect master and slave devices included in the processor-based system 1000. As is well known, the CPU 1008 communicates with these other devices by exchanging address information, control information, and data information via the system bus 1014. For example, the CPU 1008 can communicate bus transaction requests to the memory controller 1016 as an example of a slave device. Although not shown in Figure 10, it is possible to provide multiple system buses 1014, each system bus 1014 constituting a different fabric.

[0051]

[0062] Other master and slave devices can be connected to the system bus 1014. As shown in Figure 10, these devices may be provided as or included as their respective circuit board devices 1002(2) to 1002(6), for example, a memory system 1020 including a memory controller 1016 and one or more memory arrays 1018, one or more input devices 1022, one or more output devices 1024, one or more network interface devices 1026, and one or more display controllers 1028. The input devices 1022 may include, but are not limited to, input keys, switches, audio processors, etc., and may include any type of input device. The output devices 1024 may include, but are not limited to, audio indicators, video indicators, other visual indicators, etc., and may include any type of output device. The network interface devices 1026 may be any device configured to enable data exchange with the network 1030. Network 1030 can be any type of network, including but not limited to wired or wireless networks, private or public networks, local area networks (LANs), wireless local area networks (WLANs), wide area networks (WANs), Bluetooth® networks, and the Internet. Network interface devices 1026 (one or more) can be configured to support any desired type of communication protocol.

[0052]

[0063] The CPU 1008 may also be configured to access a display controller(s) 1028 via the system bus 1014 to control information sent to one or more displays 1032. The display controller(s) 1028 sends the information to be displayed to the displays(s) 1032 via one or more video processors 1034, and the one or more video processors 1034 process the information to be displayed into a format suitable for the displays(s) 1032. The displays(s) 1032 may include any type of display, including but not limited to cathode ray tubes (CRTs), liquid crystal displays (LCDs), plasma displays, and light-emitting diode (LED) displays. The displays 1032 may be provided as or included in a circuit board device 1002(7).

[0053]

[0064] Figure 11 shows an exemplary wireless communication device 1100 that may be provided as a circuit board device 1102, or may be included therein, which includes a circuit board including a first circuit board laminated on a second circuit board, and which includes radio frequency (RF) components, the circuit board device further including one or more inductors coupled between the first circuit board and the second circuit board as part of a power routing path between the first circuit board and the second circuit board, and a PMIC on the first circuit board shared between the first circuit board and the second circuit board to manage the supply of power to the first circuit board and to the second electronic components (one or more) on the second circuit board, including but not limited to the circuit board devices 100, 400 in Figures 1A, 1B, and 4, and is assembled according to exemplary assembly processes 700, 800 in Figures 7 and 8A-8C. The wireless communication device 1100 may be included in or provided within any of the devices mentioned above as an example. The wireless communication device 1100 may be located within IC 1103. As shown in Figure 11, the wireless communication device 1100 includes a transceiver 1104 and a data processor 1106. The transceiver 1104 and the data processor 1106 may be provided as or included in each or the same circuit board devices 1102(1), 1102(2), and / or included in each or the same IC 1103(1), 1103(2). The data processor 1106 may include memory for storing data and program code. The transceiver 1104 includes a transmitter 1108 and a receiver 1110 that support bidirectional communication. Generally, the wireless communication device 1100 may include any number of transmitters 1108 and / or receivers 1110 for any number of communication systems and frequency bands. All or part of the transceiver 1104 may be implemented in one or more analog ICs, RF ICs (RFICs), mixed-signal ICs, etc.

[0054]

[0065] The transmitter 1108 or receiver 1110 may be implemented using a superheterodyne architecture or a direct conversion architecture. In a superheterodyne architecture, the signal is frequency-converted between RF and baseband in multiple stages; for example, in the case of receiver 1110, in one stage the signal is frequency-converted from RF to intermediate frequency (IF), and then in another stage the signal is frequency-converted from IF to baseband. In a direct conversion architecture, the signal is frequency-converted between RF and baseband in one stage. Superheterodyne architectures and direct conversion architectures may use different circuit blocks and / or may have different requirements. In the wireless communication device 1100 in Figure 11, the transmitter 1108 and receiver 1110 are implemented using a direct conversion architecture.

[0055]

[0066] In the transmission path, the data processor 1106 processes the data to be transmitted and provides the transmitter 1108 with an I analog output signal and a Q analog output signal. In an exemplary wireless communication device 1100, the data processor 1106 includes digital-to-analog converters (DACs) 1112(1), 1112(2) that convert the digital signals generated by the data processor 1106 into an I analog output signal and a Q analog output signal, such as an I output current and a Q output current, for further processing.

[0056]

[0067] Within the transmitter 1108, low-pass filters 1114(1) and 1114(2) filter the I analog output signal and the Q analog output signal, respectively, to remove undesirable signals generated by the preceding digital-to-analog conversion. Amplifiers (AMPs) 1116(1) and 1116(2) amplify the signals from the low-pass filters 1114(1) and 1114(2), respectively, to provide the I baseband signal and the Q baseband signal. The upconverter 1118 upconverts the I baseband signal and the Q baseband signal using the I TX LO signal and the Q TX LO signal from the transmit (TX) local oscillator (LO) signal generator 1122 via the mixers 1120(1) and 1120(2), to provide the upconverted signal 1124. Filter 1126 filters the upconverted signal 1124 to remove undesirable signals caused by frequency upconversion and noise in the receive frequency band. A power amplifier (PA) 1128 amplifies the upconverted signal 1124 from the filter 1126 to obtain the desired output power level and provides the transmit RF signal. The transmit RF signal is routed through a duplexer or switch 1130 and transmitted via antenna 1132.

[0057]

[0068] In the receiving path, antenna 1132 receives signals transmitted by the base station and provides a received RF signal, which is routed through a duplexer or switch 1130 and supplied to a low-noise amplifier (LNA) 1134. The duplexer or switch 1130 is designed to operate with specific RX vs. TX duplexer frequency separation so that the received (RX) signal is separated from the TX signal. The received RF signal is amplified by the LNA 1134 and filtered by filter 1136 to obtain the desired RF input signal. Down-conversion mixers 1138(1), 1138(2) mix the output of filter 1136 with the I RX LO signal and Q RX LO signal (i.e., LO_I and LO_Q) from the RX LO signal generator 1140 to generate the I baseband signal and the Q baseband signal. The I baseband signal and the Q baseband signal are amplified by AMPs 1142(1) and 1142(2) and further filtered by low-pass filters 1144(1) and 1144(2) to obtain the I analog input signal and the Q analog input signal provided to the data processor 1106. In this example, the data processor 1106 includes analog-to-digital converters (ADCs) 1146(1) and 1146(2) that convert the analog input signals into digital signals that will be further processed by the data processor 1106.

[0058]

[0069] In the wireless communication device 1100 shown in Figure 11, the TX LO signal generator 1122 generates the I TX LO signal and the Q TX LO signal used for frequency upconversion, while the RX LO signal generator 1140 generates the I RX LO signal and the Q RX LO signal used for frequency downconversion. Each LO signal is a periodic signal with a specific fundamental frequency. The TX phase-locked loop (PLL) circuit 1148 receives timing information from the data processor 1106 and generates a control signal used to adjust the frequency and / or phase of the TX LO signal from the TX LO signal generator 1122. Similarly, the RX PLL circuit 1150 receives timing information from the data processor 1106 and generates a control signal used to adjust the frequency and / or phase of the RX LO signal from the RX LO signal generator 1140.

[0059]

[0070] Those skilled in the art will further understand that various exemplary logic blocks, modules, circuits, and algorithms described in relation to the embodiments disclosed herein may be implemented as electronic hardware, as instructions stored in memory or another computer-readable medium and executed by a processor or other processing device, or a combination of both. The memory disclosed herein may be of any type and size and may be configured to store any desired type of information. To clearly demonstrate this compatibility, various exemplary components, blocks, modules, circuits, and steps have been described above in general terms of their function. How such functions are implemented depends on the specific application, design choices, and / or design constraints imposed on the overall system. Those skilled in the art may implement the described functions in various ways for specific applications, but such implementation decisions should not be construed as causing a departure from the scope of this disclosure.

[0060]

[0071] Various exemplary logic blocks, modules, and circuits described in relation to the embodiments disclosed herein may be implemented or carried out using processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate logic or transistor logic, discrete hardware components, or any combination thereof, designed to perform the functions described herein. The processor may be a microprocessor, but alternatively, the processor may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors working with a DSP core, or any other such configuration).

[0061]

[0072] The embodiments disclosed herein may be embodied in hardware, or in instructions stored within hardware, which may reside, for example, in random access memory (RAM), flash memory, read-only memory (ROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), registers, hard disks, removable disks, CD-ROMs, or any other form of computer-readable media known in the art. An exemplary storage medium is coupled to a processor so that the processor can read information from and write information to the storage medium. Alternatively, the storage medium may be integrated with the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a remote station. Alternatively, the processor and storage medium may reside as separate components in a remote station, base station, or server.

[0062]

[0073] Furthermore, it should be noted that the operating steps described in any of the exemplary embodiments of this specification are described for the purpose of providing examples and explanations. The operations described can also be performed in many different orders other than the order shown in the illustrations. Moreover, an operation described in a single operating step can actually be performed in several different steps. Furthermore, one or more operating steps described in the exemplary embodiments can be combined. It should be understood that, as will be readily apparent to those skilled in the art, many different modifications can be made to the operating steps shown in the flowcharts. It will also be understood that information and signals can be represented using a wide variety of techniques and methods. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0063]

[0074] The above descriptions in this disclosure are provided to enable any person skilled in the art to make or use the disclosure. Various modifications to this disclosure will be readily apparent to a person skilled in the art, and the general principles defined herein may also be applicable to other modifications. Accordingly, this disclosure is not intended to be limited to the examples and designs described herein, but should be given the broadest scope consistent with the principles and novel features disclosed herein.

[0064]

[0075] Implementation examples are described in the following numbered clauses. Article 1. The first electronic device, The first circuit board and A power management integrated circuit (IC) (PMIC) including a first power port coupled to a first circuit board and a second power port coupled to the first circuit board, A first electronic component coupled to a first power port via a first circuit board and A first electronic device including, A second electronic device, A second circuit board coupled to a first circuit board in a first direction, A second electronic component coupled to a second circuit board, In the first direction, an inductor coupled to the first circuit board and the second circuit board and A second electronic device including It is equipped with, The inductor is coupled to the second electronic component via the second circuit board. A circuit board device in which an inductor is coupled to a second power port via a first circuit board. Article 2. The PMIC is configured to distribute a first power signal to a first electronic component via a first power port. The circuit board device according to Clause 1, wherein the PMIC is further configured to distribute a second power signal to a second electronic component via a second power port and an inductor. Article 3. The second power port includes a second power signal port and a second ground signal port. The inductor is coupled to the second power signal port via the first circuit board. The circuit board device according to Clause 1 or 2, wherein the second electronic component is coupled to the second signal port. Article 4. The circuit board device according to any one of the clauses 1 to 3, wherein the inductor is coupled in series between the second power port and the second electronic component. Article 5. An inductor is A first terminal connected to the first circuit board, The second terminal connected to the first circuit board and A circuit board device as described in any of clauses 1 to 4, including the following: Article 6. The first terminal is soldered to the first circuit board. The circuit board device according to Clause 4 or 5, wherein the second terminal is soldered to the first circuit board. Article 7. An inductor is a circuit board device as described in any of clauses 1 to 6, comprising an inductive core. Article 8. It further comprises a short-circuit conductor coupled to the first circuit board and the second circuit board in the first direction, The first circuit board includes a second power supply metal interconnect and a second ground metal interconnect. The second power port includes a second power signal port coupled to the second power metal interconnect and a second ground signal port coupled to the second ground metal interconnect. The second circuit board includes a third power metal interconnect connected to the second electronic component and a third ground metal interconnect connected to the second electronic component. The inductor is coupled to the second power metal interconnect and the third power metal interconnect. The circuit board device according to any one of the clauses 1, 2, and 4 to 7, wherein the short-circuit conductor is coupled to a second earth metal interconnect and a third earth metal interconnect. Article 9. A short-circuit conductor is adjacent to an inductor in the circuit board device described in Clause 8. Article 10. An inductor is The first terminal connected to the second power metal interconnect, The second terminal connected to the third power metal interconnect and It includes, Short-circuit conductors are A third terminal connected to the second grounding metal interconnect, The fourth terminal connected to the third grounding metal interconnect and A circuit board device as described in Clause 8 or 9, which includes the following: Article 11. The inductor includes a ground-shielded inductor, and the ground-shielded inductor is Inductive core, A short-circuit conductor including a conductive core adjacent to an inductive core, A dielectric material is placed between the inductive core and the conductive core. It includes, The first circuit board includes a second power supply metal interconnect and a second ground metal interconnect. The second power port includes a second power signal port coupled to the second power metal interconnect and a second ground signal port coupled to the second ground metal interconnect. The second circuit board includes a third power metal interconnect connected to the second electronic component and a third ground metal interconnect connected to the second electronic component. The inductive core is coupled to the second power metal interconnect and the third power metal interconnect. The circuit board device according to any one of the clauses 1, 2, and 4 to 7, wherein the conductive core is coupled to a second ground metal interconnect and a third ground metal interconnect. Article 12. The dielectric material has a dielectric constant of 4.0 or less, as described in Clause 11 of the circuit board device. Article 13. The inductive core is The first terminal connected to the second power metal interconnect, The second terminal connected to the third power metal interconnect and It includes, The conductive core is A third terminal connected to the second grounding metal interconnect, The fourth terminal connected to the third grounding metal interconnect and A circuit board device as described in Clause 11 or 12, which includes the following: Article 14. The first circuit board includes a fourth ground metal interconnect. The second ground signal port is connected to the fourth ground metal interconnect. The second circuit board includes a fifth ground metal interconnect connected to the second electronic component. The conductive core is A fifth terminal located on the first side of the inductive core, the fifth terminal connected to the fourth ground metal interconnect, The circuit board device according to Clause 13, further comprising a sixth terminal located on the second side of the inductive core opposite to the first side in a second direction perpendicular to the first direction, the sixth terminal being connected to a fifth ground metal interconnect. Article 15. Grounded shielded inductors include box-type inductors. The conductive core includes a box-shaped cavity containing multiple inner surfaces. The dielectric material is arranged on multiple inner surfaces. The circuit board device according to Clause 14, wherein the inductive core is located within a box-shaped cavity and includes a box-shaped inductive core adjacent to a dielectric material. Article 16. A ground-shielded inductor includes a cylindrical inductor. The conductive core includes a cylindrical conductive core that contains a cylindrical cavity including an inner surface. The dielectric material is placed on the inner surface. The circuit board device according to Clause 14, wherein the inductive core is located within a cylindrical cavity and includes a cylindrical inductive core adjacent to a dielectric material. Article 17. The first circuit board is The first power metal interconnect, Second power metal interconnect and It includes, The first power port includes a first power signal port coupled to the first power metal interconnect, The second power port includes a second power signal port coupled to the second power metal interconnect, The second circuit board is Third power metal interconnect coupled to the second electronic component It includes, The circuit board device according to any one of the clauses 1 to 16, wherein the inductor is coupled to a second power metal interconnect and a third power metal interconnect. Article 18. The first circuit board includes a first surface and a second surface located opposite to the first surface in a first direction and adjacent to the second circuit board. The PMIC is a circuit board device according to any one of the clauses 1 to 17, coupled to a second surface of a first circuit board. Article 19. The device further comprises one or more standoff conductive structures coupled to the first circuit board and the second circuit board, respectively, in a first direction. Each of the one or more standoff conductive structures is: It includes at least one vertical conductor coupled to a first circuit board and a second circuit board, A circuit board device according to any one of the clauses 1 to 18, wherein at least one vertical conductor is coupled to the first electronic component and the second electronic component. Clause 20. A circuit board device according to any of Clauses 1 to 19, comprising one or more standoff conductive structures including an interposer frame. Article 21. The first electronic component includes a processor. The second electronic component is a circuit board device as described in any of clauses 1 to 20, which includes a radio frequency (RF) (IC) (RFIC). Article 22. A PMIC is a circuit board device as described in any one of Clauses 1 to 21, which includes a switch-mode power supply (SMPS). Article 23. Set-top boxes, entertainment units, navigation devices, communication devices, fixed-position data units, mobile-position data units, Global Positioning System (GPS) devices, mobile phones, cell phones, smartphones, Session Initiation Protocol (SIP) phones, tablets, phablets, servers, computers, portable computers, mobile computing devices, wearable computing devices, desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, vehicle parts, avionics systems, drones, and multicopters A circuit board device according to any one of the clauses 1 to 22, which is integrated within a device selected from the group consisting of the following. Article 24. A method for assembling circuit board devices, To provide a first electronic device, and to provide, To provide a first circuit board, The first power port and the second power port of the power management integrated circuit (PMIC) are coupled to the first circuit board, Connecting the first electronic component to the first power port and To provide a first electronic device that includes, To provide a second electronic device, To provide a second circuit board, Connecting the second electronic component to the second circuit board, In order to couple the inductor to the second power port, the inductor is coupled to the first circuit board in the first direction, In order to connect the inductor to the second electronic component, the inductor is connected to the second circuit board. To provide a second electronic device that includes Methods that include... Article 25. The method according to Clause 24, comprising connecting an inductor in series between a second power port and a second electronic component. Article 26. Coupling the inductor to the first circuit board includes coupling the inductor to the second power metal interconnect in the second power signal port of the second power port in the first circuit board, Coupling the inductor to the second circuit board includes coupling the inductor to a third power metal interconnect in the second circuit board that is coupled to the second electronic component. The method is, In the first direction, a short-circuit conductor is connected to the second ground metal interconnect in the second ground signal port of the second power port in the first circuit board, The method according to clause 24 or 25, further comprising coupling a short-circuit conductor to a third ground metal interconnect in a second circuit board coupled to a second electronic component. Article 27. The inductor includes a ground-shielded inductor, and the ground-shielded inductor is Inductive core, A short-circuit conductor including a conductive core adjacent to an inductive core, A dielectric material is placed between the inductive core and the conductive core. It includes, Coupling the inductor to the first circuit board includes coupling the dielectric core to the second power metal interconnect in the second power signal port of the second power port in the first circuit board, The coupling of the inductor to the second circuit board includes coupling the dielectric core to a third power metal interconnect in the second circuit board which is coupled to the second electronic component. The method is, In the first direction, a short-circuit conductor is connected to the second ground metal interconnect in the second ground signal port of the second power port in the first circuit board, The method according to clause 24 or 25, further comprising coupling a short-circuit conductor to a third ground metal interconnect in a second circuit board coupled to a second electronic component. Article 28. The method according to any one of the clauses 24 to 27, further comprising coupling one or more standoff conductive structures to a first circuit board and a second circuit board in a first direction.

Claims

1. The first electronic device, The first circuit board and A power management integrated circuit (IC) (PMIC) including a first power port coupled to the first circuit board and a second power port coupled to the first circuit board, A first electronic component coupled to the first power port via the first circuit board and Electronic devices including, A second electronic device, A second circuit board coupled to the first circuit board in a first direction, A second electronic component coupled to the second circuit board, In the first direction, the inductor coupled to the first circuit board and the second circuit board and A second electronic device including It is equipped with, The inductor is coupled to the second electronic component via the second circuit board, The inductor is coupled to the second power port via the first circuit board, forming a circuit board device.

2. The PMIC is configured to distribute a first power signal to the first electronic component via the first power port. The circuit board device according to claim 1, wherein the PMIC is further configured to distribute a second power signal to the second electronic component via the second power port and the inductor.

3. The second power port includes a second power signal port and a second ground signal port. The inductor is coupled to the second power signal port via the first circuit board. The circuit board device according to claim 1, wherein the second electronic component is coupled to the second signal port.

4. The circuit board device according to claim 1, wherein the inductor is coupled in series between the second power port and the second electronic component.

5. The aforementioned inductor is A first terminal connected to the first circuit board, The second terminal connected to the first circuit board and The circuit board device according to claim 1, comprising:

6. The first terminal is soldered to the first circuit board. The circuit board device according to claim 4, wherein the second terminal is soldered to the first circuit board.

7. The circuit board device according to claim 1, wherein the inductor includes an inductive core.

8. The device further comprises a short-circuit conductor coupled to the first circuit board and the second circuit board in the first direction, The first circuit board includes a second power supply metal interconnect and a second ground metal interconnect, The second power port includes a second power signal port coupled to the second power metal interconnect and a second ground signal port coupled to the second ground metal interconnect. The second circuit board includes a third power metal interconnect connected to the second electronic component and a third ground metal interconnect connected to the second electronic component. The inductor is coupled to the second power metal interconnect and the third power metal interconnect, The circuit board device according to claim 1, wherein the short-circuit conductor is coupled to the second grounding metal interconnect and the third grounding metal interconnect.

9. The circuit board device according to claim 8, wherein the short-circuit conductor is adjacent to the inductor.

10. The aforementioned inductor is The first terminal connected to the second power metal interconnect, The second terminal connected to the third power metal interconnect and It includes, The aforementioned short-circuit conductor is The third terminal connected to the second grounding metal interconnection portion, The fourth terminal connected to the third grounding metal interconnection part and The circuit board device according to claim 8, comprising:

11. The inductor includes a ground-shielded inductor, and the ground-shielded inductor is Inductive core, A short-circuit conductor including a conductive core adjacent to the inductive core, A dielectric material disposed between the inductive core and the conductive core. It includes, The first circuit board includes a second power supply metal interconnect and a second ground metal interconnect, The second power port includes a second power signal port coupled to the second power metal interconnect and a second ground signal port coupled to the second ground metal interconnect. The second circuit board includes a third power metal interconnect connected to the second electronic component and a third ground metal interconnect connected to the second electronic component. The inductive core is coupled to the second power metal interconnect and the third power metal interconnect, The circuit board device according to claim 1, wherein the conductive core is coupled to the second ground metal interconnect and the third ground metal interconnect.

12. The circuit board device according to claim 11, wherein the dielectric material has a dielectric constant of 4.0 or less.

13. The inductive core is The first terminal connected to the second power metal interconnect, The second terminal connected to the third power metal interconnect and It includes, The conductive core is The third terminal connected to the second grounding metal interconnection portion, The fourth terminal connected to the third grounding metal interconnection part and The circuit board device according to claim 11, comprising:

14. The first circuit board includes a fourth grounding metal interconnect, The second ground signal port is connected to the fourth ground metal interconnect, The second circuit board includes a fifth grounding metal interconnect connected to the second electronic component. The conductive core is A fifth terminal located on the first side of the inductive core, the fifth terminal connected to the fourth ground metal interconnect, A sixth terminal located on the second side of the inductive core opposite to the first side in a second direction perpendicular to the first direction, the sixth terminal being connected to the fifth grounding metal interconnect, The circuit board device according to claim 13, further comprising the following:

15. The aforementioned ground-shielded inductor includes a box-shaped inductor. The conductive core includes a conductive core that includes a box-shaped cavity with multiple inner surfaces, The dielectric material is arranged on the plurality of inner surfaces, The circuit board device according to claim 14, wherein the inductive core is disposed within the box-shaped cavity and includes a box-shaped inductive core adjacent to the dielectric material.

16. The aforementioned ground-shielded inductor includes a cylindrical inductor, The conductive core includes a cylindrical conductive core that includes a cylindrical cavity including an inner surface, The dielectric material is disposed on the inner surface, The circuit board device according to claim 14, wherein the inductive core is disposed within the cylindrical cavity and includes a cylindrical inductive core adjacent to the dielectric material.

17. The first circuit board is, The first power metal interconnect, Second power metal interconnect and It includes, The first power port includes a first power signal port coupled to the first power metal interconnect, The second power port includes a second power signal port coupled to the second power metal interconnect, The second circuit board is, Third power metal interconnect connected to the second electronic component It includes, The circuit board device according to claim 1, wherein the inductor is coupled to the second power metal interconnect and the third power metal interconnect.

18. The first circuit board includes a first surface and a second surface located opposite to the first surface in the first direction and adjacent to the second circuit board. The circuit board device according to claim 1, wherein the PMIC is bonded to the second surface of the first circuit board.

19. The device further comprises one or more standoff conductive structures coupled to the first circuit board and the second circuit board, respectively, in the first direction. Each of the one or more standoff conductive structures is: It includes at least one vertical conductor coupled to the first circuit board and the second circuit board, The circuit board device according to claim 1, wherein the at least one vertical conductor is coupled to the first electronic component and the second electronic component.

20. The circuit board device according to claim 19, wherein the one or more standoff conductive structures include an interposer frame.

21. The first electronic component includes a processor, The circuit board device according to claim 1, wherein the second electronic component includes a radio frequency (RF) (IC) (RFIC).

22. The circuit board device according to claim 1, wherein the PMIC includes a switch-mode power supply (SMPS).

23. Set-top boxes, entertainment units, navigation devices, communication devices, fixed-location data units, mobile-location data units, Global Positioning System (GPS) devices, mobile phones, cell phones, smartphones, Session Initiation Protocol (SIP) phones, tablets, phablets, servers, computers, portable computers, mobile computing devices, wearable computing devices, desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, vehicle parts, avionics systems, drones, and multicopters A circuit board vise according to claim 1, which is integrated into a device selected from the group consisting of the following.

24. A method for assembling circuit board devices, To provide a first electronic device, the provision of which is To provide a first circuit board, The first power port and the second power port of the power management integrated circuit (PMIC) are coupled to the first circuit board, The first electronic component is coupled to the first power port. To provide a first electronic device that includes, To provide a second electronic device, To provide a second circuit board, The second electronic component is coupled to the second circuit board, In order to couple the inductor to the second power port, the inductor is coupled to the first circuit board in a first direction, In order to connect the inductor to the second electronic component, the inductor is connected to the second circuit board. To provide a second electronic device that includes Methods that include...

25. The method according to claim 24, comprising connecting the inductor in series between the second power port and the second electronic component.

26. Connecting the inductor to the first circuit board includes connecting the inductor to the second power metal interconnect in the second power signal port of the second power port in the first circuit board, The coupling of the inductor to the second circuit board includes coupling the inductor to a third power metal interconnect in the second circuit board that is coupled to the second electronic component, The aforementioned method, In the first direction, a short-circuit conductor is connected to the second grounding metal interconnect in the second grounding signal port of the second power port in the first circuit board, The method according to claim 24, further comprising connecting the short-circuit conductor to a third ground metal interconnect in the second circuit board which is coupled to the second electronic component.

27. The inductor includes a ground-shielded inductor, and the ground-shielded inductor is Inductive core, A short-circuit conductor including a conductive core adjacent to the inductive core, A dielectric material disposed between the inductive core and the conductive core. It includes, The coupling of the inductor to the first circuit board includes coupling the dielectric core to the second power metal interconnect in the second power signal port of the second power port in the first circuit board, The coupling of the inductor to the second circuit board includes coupling the dielectric core to a third power metal interconnect in the second circuit board that is coupled to the second electronic component. The aforementioned method, In the first direction, the short-circuit conductor is connected to the second grounding metal interconnect in the second grounding signal port of the second power port in the first circuit board, The method according to claim 24, further comprising connecting the short-circuit conductor to a third ground metal interconnect in the second circuit board which is coupled to the second electronic component.

28. The method according to claim 24, further comprising coupling one or more standoff conductive structures to the first circuit board and the second circuit board in the first direction.

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