Frequency converter support, cooking appliances, heat dissipation devices and home appliances

JP2026519462APending Publication Date: 2026-06-16GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD
Filing Date
2024-04-29
Publication Date
2026-06-16

AI Technical Summary

Benefits of technology

【0136】 なお、放熱装置10の実施形態および有益な効果に対する上記の説明は、本願の実施形態の家電製品にも適用され、冗長を回避するために、ここで繰り返して説明しない。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026519462000001_ABST
    Figure 2026519462000001_ABST
Patent Text Reader

Abstract

This application provides a frequency converter support, a cooking appliance, a heat dissipation device, and a home appliance. The frequency converter support includes a base and a mounting platform, the mounting platform being connected to the base, with a portion of the mounting platform extending from at least one side of the base, and the mounting platform being used to mount the frequency converter. By allowing the mounting platform to extend from the side of the base, the distance between the frequency converter and the fan can be changed, without needing to change the mounting position of the base and the fan, thereby eliminating the need to change the layout of each device within the cooking appliance and resulting in minimal changes to the internal structure of the cooking appliance.
Need to check novelty before this filing date? Find Prior Art

Claims

1. Bass and, Connected to the base, with a portion extending from at least one side of the base, includes a mounting platform for mounting a frequency converter, A frequency converter support characterized by the following features.

2. The base is provided with a first side portion and a second side portion. The first side and the second side are two adjacent sides of the base, A portion of the mounting platform extends beyond the first side and / or the second side. The frequency converter support according to feature 1.

3. The lid further includes a cover connected to the aforementioned mounting base, with a heat dissipation passage for housing the frequency converter provided between it and the aforementioned mounting base. The frequency converter support according to claim 1 or 2.

4. It further includes a guide plate connected to the cover and positioned diagonally to the cover, for guiding airflow into the heat dissipation passage, The frequency converter support according to feature 3.

5. The aforementioned air guide plate is A first air guide plate connected to the top plate of the lid and provided at an angle to the top plate, and / or The lid includes a second air guide plate connected to the side plate and positioned diagonally to the side plate, The frequency converter support according to feature 4.

6. A notch is provided on the side of the first air guide plate that is away from the cover. The frequency converter support according to feature 5.

7. The mounting base is provided with a first mounting portion. The lid is provided with a second mounting portion. The first mounting portion and the second mounting portion are used to connect to the frequency converter. The frequency converter support according to feature 3.

8. The aforementioned base is A support frame connected to the aforementioned mounting base, A leg portion, wherein the number of the leg portions is multiple, the multiple leg portions are connected to the support frame, and two adjacent leg portions are spaced apart, The frequency converter support according to feature 3.

9. An intake port and an exhaust port are provided in the heat dissipation passage. The aforementioned base is The invention further includes a windbreak plate for connecting two adjacent legs, blocking the gap between the two adjacent legs, and restricting the airflow discharged from the exhaust port from returning to the intake port through the gap. The frequency converter support according to feature 8.

10. The cover is detachably connected to the base described above. The frequency converter support according to feature 3.

11. It further includes a first connecting part and a connecting plate, The first connection portion is provided on the base described above, and there are multiple first connection portions, with two adjacent first connection portions spaced apart. The connecting plate is connected to the lid, and the connecting plate is provided with a plurality of second connecting portions. The first connection part is detachably connected to the second connection part. The frequency converter support according to feature 3.

12. A flange is provided on the side of the mounting base that protrudes from the side. The frequency converter support according to claim 1 or 2.

13. A frequency converter support according to any one of claims 1 to 12, A cooking utensil characterized by the following features.

14. The frequency converter is further connected to the mounting base, with a portion of it extending beyond the side of the base. The cooking utensil according to feature 13.

15. A heat dissipation device used in home appliances, The heat dissipation device includes a substrate and a plurality of heat dissipation fins. The plurality of heat dissipation fins are provided on the same surface of the substrate, The aforementioned plurality of heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin, The first heat sink and the second heat sink are not parallel to each other. A heat dissipation device characterized by the following features.

16. The substrate is provided with two first heat dissipation fins and a plurality of second heat dissipation fins. Multiple of the second heat dissipation fins are arranged in parallel to form a first fin group. The two first heat dissipation fins and the substrate are formed surrounding the first heat dissipation passage, The first group of fins is located within the first heat dissipation passage. The heat dissipation device according to feature 15.

17. The substrate includes a first substrate and a second substrate, The second substrate is connected perpendicularly to the bottom surface of the first substrate. Mounting spaces for attaching heating elements are formed on the bottom surface of the first substrate and the side surface of the second substrate. The heat dissipation device according to feature 15.

18. The substrate includes a first substrate, The first substrate is provided with two first heat dissipation fins and a plurality of second heat dissipation fins. Multiple of the second heat dissipation fins are arranged in parallel to form a second fin group. The two first heat dissipation fins and the first substrate are formed surrounding the second heat dissipation passage. The second group of fins is located within the second heat dissipation passage. The heat dissipation device according to feature 15.

19. The substrate includes a first substrate and a second substrate. The first substrate is connected to the second substrate, The second substrate is provided with one of the first heat dissipation fins and a plurality of the second heat dissipation fins. The multiple second heat dissipation fins are arranged in parallel to form a third fin group. The first heat dissipation fin, the second substrate, and the first substrate are formed surrounding the third heat dissipation passage, The third fin group is located within the third heat dissipation passage. The heat dissipation device according to feature 15.

20. The substrate includes a first substrate and a second substrate. The first substrate is connected to the second substrate, A plurality of the second heat dissipation fins are provided on the second substrate, Multiple of the second heat dissipation fins are provided perpendicular to the second substrate, Some of the second heat dissipation fins form a third fin group, The outermost second heat dissipation fin, the second substrate, and the first substrate are formed surrounding the third heat dissipation passage. The third fin group is located within the third heat dissipation passage. The heat dissipation device according to feature 15.

21. The substrate includes a first substrate and a second substrate. The first substrate is connected to the second substrate, A plurality of the second heat dissipation fins are provided on the first substrate, Multiple of the second heat dissipation fins are provided perpendicular to the first substrate, Some of the second heat dissipation fins form a second fin group, The two outermost second heat dissipation fins and the first substrate are formed surrounding the second heat dissipation passage. The second group of fins is located within the second heat dissipation passage. The heat dissipation device according to feature 15.

22. The substrate includes a first substrate, A plurality of the second heat dissipation fins are provided on the first substrate, Multiple second heat dissipation fins are provided perpendicular to the first substrate. The two adjacent second heat dissipation fins and the first substrate are formed surrounding the second heat dissipation passage. At least one of the first heat dissipation fins is provided within the second heat dissipation passage. The heat dissipation device according to feature 15.

23. The substrate includes a first substrate and a second substrate. The first substrate is connected to the second substrate, A plurality of the second heat dissipation fins are provided on the second substrate, Multiple of the second heat dissipation fins are provided perpendicular to the second substrate. Two adjacent second heat dissipation fins and the second substrate are formed surrounding a third heat dissipation passage, and at least one of the first heat dissipation fins is provided within the third heat dissipation passage, and / or The second heat dissipation fin and the first substrate are formed surrounding the fourth heat dissipation passage, and at least one of the first heat dissipation fins is provided within the fourth heat dissipation passage. The heat dissipation device according to feature 15.

24. The substrate includes a first substrate and a second substrate. The first substrate is connected to the second substrate, Mounting holes are provided in the second substrate. The aforementioned mounting holes are used for fastening the heating element. The heat dissipation device according to feature 15.

25. A heat dissipation device including the one described in any one of claims 15 to 24, A home appliance characterized by the following features.