Articles and methods suitable for disassembly, including adhesives and films.

Abstract

An article comprising a first substrate and a second substrate is described. At least one adhesive layer is disposed between the first and second substrates. The article further includes a multilayer film within at least a portion of the adhesive layer(s). Disassembly methods are also described, which include providing the adhesive bonded article described herein; and separating the first substrate from the second substrate by peeling off the (e.g., multilayer) film. In another embodiment, adhesive articles (e.g., tapes) including the (e.g., multilayer) film, and methods for producing adhesive bonded articles including the (e.g., multilayer) film are also described. Furthermore, methods for reworking, repairing, reusing, or recycling articles, and such articles are also described.

Claims

1. The first substrate and A second substrate and At least one adhesive layer disposed between the first and second substrates, A multilayer film present in at least a portion of the adhesive layer, Goods.

2. The article according to claim 1, wherein the interlayer peel strength of the multilayer film at 23°C is at least 10, 50, 100, 200, or 500 g / inch (2.54 cm).

3. The article according to claims 1 to 2, wherein the article is exposed to a temperature of at least 60 or 70°C during the normal use of the article.

4. The article according to claim 1, wherein the first substrate and optionally the second substrate include a metal in contact with the adhesive layer.

5. The article according to claims 1 to 4, wherein the article is a battery pack.

6. The article according to claim 5, wherein the first metal substrate is a battery cell and the second substrate is a cooling plate.

7. The article according to claim 5, wherein the first and second substrates are electrochemical cells.

8. The article according to claims 1 to 7, wherein the multilayer film comprises at least two layers containing different thermoplastic polymers.

9. The article according to claims 1 to 8, wherein the components or layers of the multilayer film have a Tg of at least 70, 80, 90, 100, 115, 120, or 125°C.

10. The article according to claims 1 to 9, wherein the multilayer film has a melting temperature of at least 150, 160, 170, 180, 190, 200, 210, 220, 230, 240, 250, 260, 270, or 280°C.

11. The article according to claims 1 to 10, wherein the multilayer film comprises at least two layers with different crystalline properties.

12. The article according to claims 1 to 11, wherein the multilayer film comprises a polyester polymer, a polyolefin polymer, or a combination thereof.

13. The article according to claims 1 to 12, wherein the multilayer film comprises at least 3, 4, 5, 6, 7, 9, 10, 50, 100, or 200 layers.

14. The article according to claim 13, wherein the multilayer film includes layers having a thickness of at least 50 nm, 75 nm, 100 nm, 250 nm, 500 nm, 1 micrometer, 5 micrometers, 10 micrometers, or 25 micrometers.

15. The article according to claims 1 to 14, wherein the multilayer film spreads entirely or partially on the adhesive layer.

16. The article according to claim 15, wherein the multilayer film is partially spread over the adhesive layer, and the article further comprises an insulating layer bonded between the multilayer film and the first or second substrate.

17. The article according to claims 1 to 16, wherein the adhesive layer has a central region located between two opposite end regions, and the multilayer film is present in one or both end regions.

18. The article according to claims 1 to 17, wherein the adhesive layer is recessed relative to the edges of the first and second substrates.

19. The article according to claims 1 to 18, wherein the multilayer film is disposed between a first adhesive layer that bonds the first substrate to the multilayer film and a second adhesive layer that bonds the second substrate to the multilayer film.

20. The article according to claim 19, wherein the first adhesive layer comprises the same or a different adhesive composition as the second adhesive layer.

21. The article according to claims 1 to 20, wherein the Young's modulus of the first adhesive layer and optionally the second adhesive layer is less than 2000 MPa, less than 1700 MPa, less than 1000 MPa, less than 500 MPa, less than 250 MPa, or less than 100 MPa.

22. The article according to claims 1 to 21, wherein the interlayer peel strength of the multilayer film at 23°C is at least 50 gf / inch, and the Young's modulus of the first adhesive layer and optionally the second adhesive layer is less than 1700 MPa.

23. The article according to claims 1 to 22, wherein the overlap shear strength of the adhesive layer at 23°C is at least 2 MPa, 3 MPa, 5 MPa, 10 MPa, 15 MPa, or 20 MPa.

24. The article according to claim 23, wherein the splitting strength of the article at 23°C is less than 5000, 2000, 1500, 1000, 750, 500, or 250 N / inch.

25. The article according to claim 24, wherein the splitting strength of the article at 23°C is less than 1000 N / inch, and the overlap shear strength of the adhesive layer at 23°C is at least 3 MPa.

26. The article according to claims 1 to 25, wherein the adhesive layer comprises a curable adhesive comprising a (meth)acrylate portion, a urethane portion, an epoxy portion, or a combination thereof, and the curable adhesive is cured.

27. The article according to claim 26, wherein the curable adhesive is not a pressure-sensitive adhesive after curing.

28. The article according to claims 26 to 27, wherein the curable adhesive comprises an epoxy resin and at least one polymer including a (meth)acrylic polymer.

29. The article according to claims 26 to 28, wherein the curable adhesive comprises polymerization units of a low Tg monofunctional (meth)acrylate monomer, and the homopolymer thereof has a glass transition temperature (Tg) of less than 0°C.

30. The article according to claims 26 to 29, wherein the curable adhesive comprises polymerization units of a non-acidic polar (meth)acrylate monomer.

31. The article according to claims 26 to 30, wherein the curable adhesive further comprises a polyfunctional (meth)acrylate crosslinking agent, or an interfacial crosslinking agent comprising a (meth)acrylate group and an epoxy group.

32. The article according to claims 26 to 31, wherein the curable adhesive has two Tg after curing, the first Tg being in the range of -10°C to 50°C, and the second Tg being greater than 50, 55, 60, 65, 70, or 75°C.

33. The article according to claims 1 to 32, further comprising at least one additional multilayer film or monolithic film in at least a portion of the adhesive layer.

34. The article according to claims 1 to 33, wherein the multilayer film has at least two different interlayer peel strengths, or the article comprises at least two (e.g., multilayer) films having different peel strengths.

35. The first substrate and A second substrate and At least one adhesive layer disposed between the first and second substrates, The adhesive layer comprises a film present in at least a portion of the adhesive layer, The bonding strength between the adhesive layer and the film is greater than the interplane strength of the film, and the bonding strength between the adhesive layer and the substrate is also greater than the interplane strength of the film. Goods.

36. The article according to claim 35, wherein the article is further characterized by claims 1 to 34.

37. To provide the articles described in claims 1 to 34, By applying force, the first substrate is separated from the second substrate by peeling off the (for example, multilayer) film, A method of decomposition, including the following.

38. The method according to claim 37, wherein the substrate and / or the adhesive layer and / or the (e.g., multilayer) film is further described in claims 2 to 34.

39. (For example, a multilayer) film having a first main surface and an opposite main surface, A first adhesive layer disposed on the first main surface of the (for example, multilayer) film, Optionally, a second adhesive layer disposed on the second main surface of the (e.g., multilayer) film, An adhesive article (e.g., tape) comprising the above.

40. The bonded article according to claim 39, wherein, at ambient temperature, the bonding strength of the adhesive layer to the film is greater than the inter-plane strength of the film.

41. The adhesive article according to claims 39 to 40, wherein the (for example, multilayer) film is partially spread on the adhesive layer, and the tape further comprises an insulating layer.

42. The adhesive article according to claim 41, wherein the insulating layer is a monolithic film or a multilayer film.

43. The adhesive article according to claims 39 to 42, wherein the first adhesive layer and optionally the second adhesive layer are pressure-sensitive adhesives.

44. The adhesive article according to claims 39 to 43, wherein the (e.g., multilayer) film and / or the adhesive layer is further characterized by claims 2 to 34.

45. Adhesives for use in the manufacture, rework, repair, reuse, or recycling of electric battery modules.

46. This includes bonding a first metal substrate to a second substrate with at least one adhesive layer, For example, a multilayer film is present in at least a portion of the adhesive layer. Method of manufacturing an item.

47. The method according to claim 46, wherein the substrate and / or the adhesive layer and / or the (e.g., multilayer) film is further described in claims 2 to 34.

48. The method according to claims 46 and 47, wherein the adhesive layer and the (e.g., multilayer) film are applied sequentially to the first and / or second substrate.

49. The method according to claims 46 to 48, wherein at least one adhesive layer is provided together with the (e.g., multilayer) film as an adhesive article according to claims 40 to 46.

50. The method according to claims 46 to 49, wherein the (e.g., multilayer) film is surface-treated with an adhesion promoter before the adhesive layer is applied.

51. The method according to claims 46 to 50, wherein the manufacturing method is a method for reworking a defective article, a method for repairing an article, a method for reusing an article, or a method for recycling an article.

52. The first substrate and An adhesive layer disposed on the substrate, A peeled (e.g., multilayer) film bonded to the adhesive layer, An article that is equipped with [something].

53. The article according to claim 52, wherein the peeled film is a multilayer film.

54. The article according to claims 52 to 53, wherein the first substrate, adhesive layer, or multilayer film is further characterized by claims 1 to 34.

55. To provide a part of the first article, where the first article is First substrate, An adhesive layer disposed on the substrate, and The adhesive layer comprises a peeled (e.g., multilayer) film bonded to the adhesive layer; Applying an adhesive to the first substrate, the second substrate, or a combination thereof; The first substrate is bonded to the second substrate with the adhesive to form a second article; Methods of manufacturing, reworking, repairing, reusing, or recycling articles, including the manufacturing, reworking, repairing, repurposing, or recycling of articles.

56. The method according to claim 55, further comprising applying a monolithic film or a multilayer film to at least a portion of the adhesive layer.

57. The method according to claim 56, wherein the film includes tabs, markings, or a combination thereof indicating one or more peel positions.

58. The method according to claims 55 to 57, wherein the film and at least one adhesive are applied as a tape.

59. The method according to claims 55 to 58, further comprising surface-treating the peeled film, substrate, or applied monolithic or multilayer film before applying the adhesive and / or the second substrate.

60. The method according to claims 55 to 59, wherein the method is repeated at least two, three, or four times.

61. The method according to claim 60, wherein the same film is peeled off and bonded by adhesive at least two, three, or four times.

62. The method according to claim 60, wherein two or more films are each peeled off and bonded together by adhesive at least once.

63. The method according to claims 56 to 62, wherein the thickness of the adhesive applied to the peeled film and the thickness of the monolithic or multilayer film applied are selected such that the total thickness when combined with the thickness of the peeled film is within 50%, 40%, 30%, 20%, or 10% of the thickness of the (e.g., multilayer) film of the first article before peeling.

64. The method according to claims 56 to 63, wherein the thickness of the adhesive applied to the peeled film and the thickness of the monolithic or multilayer film applied are selected such that the total thickness when combined with the thickness of the peeled film is ±0.5 mm, 0.25 mm, 0.1 mm, or 0.05 mm with respect to the thickness of the (e.g., multilayer) film of the first article before peeling.

65. The method according to claims 55 to 64, wherein the adhesive and film to be applied are selected such that the first article has a first bonding thickness between the first and second substrates, and the bonding thickness between the first and second substrates of the second article is ±10% of the first bonding thickness.

66. Reworked or repaired articles (e.g., battery modules), The first substrate and A second substrate and The device comprises one or more adhesive layers disposed between the first and second substrates and defining the bonding thickness, An article in which the bonding thickness of the reworked or repaired article (e.g., a battery module) is ±10% compared to the article before it was reworked or repaired.

67. The reworked or repaired (e.g., battery module) article according to claim 66, further comprising a film in at least a portion of the adhesive layer.

68. The reworked or repaired (e.g., battery module) article according to claims 66 to 67, wherein the film is a multilayer film.

69. Furthermore, the reworked or repaired (e.g., battery module) article according to claims 66 to 67, characterized by claims 2 to 34.

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