Electronic devices including conductive connectors

Abstract

By maintaining the device's thickness while allowing only the camera portion to protrude slightly, the device's size is kept compact. [Solution] An electronic device according to one embodiment includes a housing including a main body and a cover plate, a base plate disposed on the main body, a camera flange disposed on the base plate, a cover frame covering the camera flange, a plurality of lens structures including an external lens structure connected to the cover frame and an internal lens structure connected to the camera flange, and a first conductive connector disposed between the cover frame and the camera flange.

Description

Technical Field

[0001] The present invention relates to an electronic device, for example, an electronic device including a conductive connector.

Background Art

[0002] A light module called a flash or a strobe can include a light-emitting element such as a light-emitting diode (LED) configured to irradiate an external space of the light-emitting element. To support various shooting environments or conditions, electronic devices including one or more camera modules and light modules have been developed.

[0003] In order to obtain a high-pixel or high-quality photograph, it is necessary to increase the size of an image sensor. If the size of the image sensor is large, the size of the image also becomes large, so it is necessary to relatively secure a long focal length of the lens. An increase in the focal length of the lens means an increase in the length of the camera barrel. When the length of the camera barrel increases, the size of the camera module also increases.

[0004] There is a technique for keeping the size of the terminal compact by partially protruding only the camera portion while maintaining the thickness of the terminal. The portion of the lens exposed outside can have sufficient rigidity including a metallic material. A cover frame for protecting the lens can be provided around the lens.

[0005] The above-described background art is what was held or acquired in the derivation process of the present invention, and it cannot necessarily be said that it is a known technique publicly disclosed to the general public before the filing of the present disclosure.

Summary of the Invention

Problems to be Solved by the Invention

[0006] [[ID=3十三条 By partially protruding only the camera portion while maintaining the thickness of the terminal, the size of the terminal is kept compact.

Means for Solving the Problems

[0007] According to one embodiment, the electronic device may include a main body 411, a housing 410 including a cover plate 413 connected to the main body, a base plate 430 disposed on the main body, a camera flange 440 disposed on the base plate, a cover frame 450 covering the camera flange, a plurality of lens structures 460a, 460b including an external lens structure connected to the cover frame and an internal lens structure connected to the camera flange, and a first conductive connector 491 disposed between the cover frame and the camera flange, compressed by the cover frame and the camera flange, and electrically connecting the cover frame and the camera flange.

[0008] According to one embodiment, the electronic device includes a main body 411, a housing 410 including a cover plate 413 connected to the main body, a base plate 430 disposed on the main body, a camera flange 440 disposed on the base plate, a cover frame 450 covering the camera flange, a plurality of lens structures 460a, 460b including an external lens structure connected to the cover frame and an internal lens structure connected to the camera flange, and a first conductive connector 491 disposed between the cover frame and the camera flange and compressed by the cover frame and the camera flange, wherein electrostatic discharge can occur along the cover frame, the first conductive connector, the camera flange, and the base plate.

[0009] According to one embodiment, the electronic device includes a main body 411, a housing 410 including a cover plate 413 connected to the main body, a base plate 430 disposed on the main body, a camera flange 440 disposed on the base plate, a cover frame 450 covering the camera flange, a plurality of lens structures 460a, 460b including an external lens structure connected to the cover frame and an internal lens structure connected to the camera flange, and a first conductive connector 491 disposed between the cover frame and the camera flange, which is elastic, compressed by the cover frame and the camera flange, electrically connects the cover frame and the camera flange, and is annular in shape, and electrostatic discharge may occur along the cover frame, the first conductive connector, the camera flange, and the base plate. [Brief explanation of the drawing]

[0010] The aforementioned and other aspects, features, and advantages of the particular embodiments of this disclosure will become apparent from the following detailed description with reference to the accompanying drawings. [Figure 1] This is a block diagram of an electronic device in a network environment according to one embodiment. [Figure 2] A block diagram showing a camera module according to one embodiment. [Figure 3a] This figure shows the unfolded state of an electronic device according to one embodiment. [Figure 3b] This figure shows the folded state of an electronic device according to one embodiment. [Figure 4] This is an exploded perspective view showing an electronic device according to one embodiment. [Figure 5] This is a cross-sectional view of an electronic device according to one embodiment. [Figure 6] This is a schematic plan view showing the camera flange, lens structure, and conductive connector of an electronic device according to one embodiment. [Figure 7] This is a cross-sectional view of an electronic device according to one embodiment. [Figure 8] This is a schematic plan view showing the camera flange, lens structure, and conductive connector of an electronic device according to one embodiment. [Figure 9] This is a schematic plan view showing the camera flange, lens structure, and conductive connector of an electronic device according to one embodiment. [Figure 10] This is a schematic plan view showing the camera flange, lens structure, and conductive connector of an electronic device according to one embodiment. [Modes for carrying out the invention]

[0011] Figure 1 is a block diagram of an electronic device in a network environment according to one embodiment. Referring to Figure 1, in the network environment 100, the electronic device 101 can communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to one embodiment, the electronic device 101 includes a processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197. In any embodiment, the electronic device 101 may omit at least one of its components (e.g., connection terminal 178) or have one or more other components added. In any embodiment, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0012] The processor 120 can, for example, execute software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120 and perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 can store instructions or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the instructions or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to one embodiment, the processor 120 may include a main processor 121 (e.g., central processing unit or application processor) or an auxiliary processor 123 (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor) that can operate independently or together with it. For example, if the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be used with lower power consumption than the main processor 121 or may be configured to specialize in a specified function. The auxiliary processor 123 may be implemented separately from or as part of the main processor 121.

[0013] The auxiliary processor 123 may, for example, control at least a portion of the functions or states of at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) on behalf of the main processor 121 when the main processor 121 is in an inactive (e.g., slipped) state, or together with the main processor 121 when the main processor 121 is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., neural network processing unit) may include a hardware structure dedicated to processing artificial intelligence models. The artificial intelligence model may be generated via machine learning. Such learning may be performed, for example, on the electronic device 101 itself on which the artificial intelligence model is executed, or via a separate server (e.g., server 108). Learning algorithms include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. An artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted Boltzmann machine (RBM), deep belief network (DBN), bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or one of two or more combinations of the above, but is not limited to the examples above.The artificial intelligence model may include a software structure in addition to or alternatively to the hardware structure.

[0014] Memory 130 stores various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The data may include, for example, software (e.g., the program 140) and input data or output data for the instructions related thereto. Memory 130 includes volatile memory 132 or non-volatile memory 134.

[0015] Program 140 is stored as software in memory 130 and includes, for example, an operation system 142, middleware 144, or an application 146.

[0016] Input module 150 receives instructions or data used by a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., the user). Input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0017] The acoustic output module 155 outputs an acoustic signal to the outside of the electronic device 101. The acoustic output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

[0018] The display module 160 visually provides information to the outside (e.g., the user) of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the corresponding device. According to an embodiment, the display module 160 may include a touch sensor set to detect a touch, or a pressure sensor set to measure the intensity of the force generated by the touch.

[0019] The audio module 170 converts sound into an electrical signal or, conversely, converts an electrical signal into sound. According to an embodiment, the audio module 170 may acquire sound through the input module 150, or output sound through the acoustic output module 155 or an external electronic device (e.g., the electronic device 102) (e.g., a speaker or headphones) directly or wirelessly connected to the electronic device 101.

[0020] The sensor module 176 may detect the operating state (e.g., power or temperature) of the electronic device 101 or an external environmental state (e.g., the user state), and generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0021] The interface 177 supports one or more specified protocols used for the electronic device 101 to be directly or wirelessly connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, HDMI (registered trademark) (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, or an audio interface.

[0022] The connection terminal 178 includes a connector through which the electronic device 101 is physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI® connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0023] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that the user can perceive through touch or kinesthetic sense. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0024] The camera module 180 captures still images and videos. According to one embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0025] The power management module 188 manages the power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented, for example, as at least part of a PMIC (power management integrated circuit).

[0026] The battery 189 supplies power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0027] The communication module 190 supports the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and the execution of communication through the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) or wireless communication. According to one embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). Of these communication modules, the relevant communication module can communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth®, Wi-Fi® (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). Such various types of communication modules may be implemented in a single component (e.g., a single chip) or in multiple separate components (e.g., multiple chips). The wireless communication module 192 can verify or authenticate the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., an International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196.

[0028] The wireless communication module 192 supports 5G networks and next-generation communication technologies beyond 4G networks, such as NR (new radio access) technology. NR technology supports high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and linking of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 may support high-frequency bands (e.g., mmWave bands) to achieve high data transmission rates. The wireless communication module 192 may support various technologies to ensure performance in high-frequency bands, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or large-scale antennas. The wireless communication module 192 supports various requirements specified by the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to one embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., 164 dB or less) for realizing mMTC, or a U-plane latency (e.g., 0.5 ms or less for both downlink (DL) and uplink (UL), or 1 ms or less for round trip) for realizing URLLC.

[0029] The antenna module 197 transmits or receives signals or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module 197 may include an antenna comprising a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In such a case, at least one antenna suitable for a communication scheme used in a communication network such as a first network 198 or a second network 199 may be selected from the plurality of antennas, for example, by a communication module 190. Signals or power may be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to any embodiment, other components besides the radiator (e.g., an RFIC (radio frequency integrated circuit)) may be further formed as part of the antenna module 197.

[0030] According to one embodiment, the antenna module 197 can form an mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC (Radio Frequency Control Unit) disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board and capable of supporting a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., the top or side surface) of the printed circuit board and capable of transmitting or receiving signals in the specified high-frequency band.

[0031] At least some of the above components are interconnected via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface) and can exchange signals (e.g., instructions or data) with each other).

[0032] According to one embodiment, commands or data are transmitted to or received between the electronic device 101 and an external electronic device 104 via a server 108 connected to a second network 199. Each of the external electronic devices 102 or 104 may be the same type of device as the electronic device 101 or a different type of device. According to one embodiment, all or part of the operations performed by the electronic device 101 may be performed by one or more external electronic devices among the external electronic devices 102, 104, or the server 108. For example, if the electronic device 101 must perform any function or service automatically or in response to a request from a user or another device, the electronic device 101 may, instead of performing the function or service itself, or additionally, request one or more external electronic devices to perform at least part of that function or service. One or more external electronic devices that receive the request perform at least part of the requested function or service, or additional functions or services related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 can process the results as they are or additionally and provide them as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 may include IoT (Internet of Things) devices. The server 108 may be an intelligent server utilizing machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 may be included within the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0033] The electronic devices according to the embodiments of the present invention can take on various forms. These electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0034] The embodiments and terminology used herein are not intended to limit the technical features described herein to any particular embodiment, but should be understood to include various modifications, equivalents, or substitutes of the applicable embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items unless otherwise indicated to be clearly different in the relevant context. In this document, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may include any one of the items listed together in the phrase, or any possible combination thereof. Terms such as “first,” “second,” or “first,” or “second” are used merely to distinguish one component from other such components and do not limit the component to other aspects (e.g., importance or order). When any (e.g., the first) component is described as "combined" or "connected" to another (e.g., the second) component, with or without the terms "functionally" or "to communicate", it means that the first component may be connected to the other component directly (e.g., by wire), wirelessly, or via the third component.

[0035] As used in the embodiments herein, the term “module” may include units embodied in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module can be the smallest unit or part thereof of a component that performs the functions of a component or more. For example, according to one embodiment, a module may be implemented in the form of an ASIC (application-specific integrated circuit).

[0036] Embodiments of this specification may be implemented as software (e.g., program 140) containing one or more instruction words stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call and execute at least one instruction from the one or more instruction words stored in the storage medium. This allows the machine to be operated to perform at least one function in response to the one or more instruction words called. The one or more instruction words may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, "non-transitory" means only that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily on the storage medium.

[0037] According to one embodiment, the methods of the embodiments disclosed herein may be provided as part of a computer program product. The computer program product is traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or online (e.g., downloaded or uploaded) via an application store (e.g., PlayStore™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a device-readable storage medium such as the memory of a manufacturer's server, an application store server, or an intermediary server.

[0038] According to the embodiment, each of the aforementioned components (e.g., a module or a program) may include one or more individuals, and some of the individuals may be separated and arranged in other components. According to the embodiment, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the respective components of the multiple components before the integration. According to the embodiment, operations performed by a module, program or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

[0039] Figure 2 is a block diagram showing a camera module according to one embodiment.

[0040] Referring to Figure 2, the camera module 180 includes a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (e.g., buffer memory), or an image signal processor 260. The lens assembly 210 collects light emitted from a subject that is the subject of image capture. The lens assembly 210 may include one or more lenses. According to one embodiment, the camera module 180 may include a plurality of lens assemblies 210. In such a case, the camera module 180 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 may have the same lens attributes (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens attributes that differ from the lens attributes of the other lens assemblies. The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

[0041] The flash 220 can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash 220 may include one or more light-emitting diodes (e.g., RGB (red-green-blue) LEDs, white LEDs, infrared LEDs, or ultraviolet LEDs) or a xenon lamp. The image sensor 230 can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal. According to one embodiment, the image sensor 230 may include one image sensor selected from image sensors with different attributes, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, multiple image sensors having the same attributes, or multiple image sensors having different attributes. Each image sensor included in the image sensor 230 can be embodied using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0042] The image stabilizer 240 may respond to the movement of the camera module 180 or the electronic device 101 containing it by moving at least one lens or image sensor 230 included in the lens assembly 210 in a specific direction, or by controlling the operating characteristics of the image sensor 230 (e.g., by adjusting the read-out timing). This compensates for at least some of the negative effects of the movement on the captured image. According to one embodiment, the image stabilizer 240 can detect such movement of the camera module 180 or the electronic device 101 using a gyro sensor (not shown) or an accelerometer (not shown) located inside or outside the camera module 180. According to one embodiment, the image stabilizer 240 may be implemented, for example, as an optical image stabilizer. The memory 250 may temporarily store at least some of the images acquired via the image sensor 230 for subsequent image processing operations. For example, if image acquisition by the shutter is delayed, or if multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) may be stored in memory 250, and the corresponding copy image (e.g., a low-resolution image) may be previewed via the display module 160. Subsequently, if specified conditions are met (e.g., user input or system instruction), at least a portion of the original image stored in memory 250 may be acquired and processed by, for example, an image signal processor 260. According to one embodiment, memory 250 may consist of at least a portion of memory 130, or a separate memory operating independently thereof.

[0043] The image signal processor 260 can perform one or more image processing operations on images acquired via the image sensor 230 or images stored in the memory 250. These one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor 260 may perform control operations on at least one of the components included in the camera module 180 (e.g., the image sensor 230) (e.g., control of exposure time or control of readout timing). Images processed by the image signal processor 260 may be stored again in the memory 250 for further processing, or in the camera module... 180 may be provided to external components (for example, memory 130, display module 160, electronic device 102, electronic device 104, or server 108). According to one embodiment, the image signal processor 260 may be configured as at least part of the processor 120, or as a separate processor operating independently of the processor 120. If the image signal processor 260 is configured as a separate processor from the processor 120, at least one image processed by the image signal processor 260 may be displayed via the display module 160 by the processor 120 either as is or after additional image processing.

[0044] According to one embodiment, the electronic device 101 includes a plurality of camera modules 180, each having different attributes or functions. In such a case, for example, at least one of the plurality of camera modules 180 may be a wide-angle camera and at least one other may be a telephoto camera. Similarly, at least one of the plurality of camera modules 180 may be a front camera and at least one other may be a rear camera.

[0045] Figure 3a shows the electronic device according to one embodiment in an unfolded state. Figure 3b shows the electronic device according to one embodiment in a folded state. Figure 4 is an exploded perspective view of the electronic device according to one embodiment.

[0046] Referring to Figures 3a to 4, a foldable electronic device 301 according to one embodiment may include a pair of housings 310, 320 rotatably coupled via a hinge structure (e.g., hinge structure 334 in Figure 4) so ​​as to fold relative to each other, a hinge cover 365 covering the foldable portion of the pair of housings 310, 320, and a display 361 (e.g., a flexible display or foldable display) positioned in the space formed by the pair of housings 310, 320. In this document, the surface on which the display 361 is positioned is defined as the front of the foldable electronic device 301, and the opposite surface of the front is defined as the rear of the foldable electronic device 301. Furthermore, the surfaces surrounding the space between the front and rear surfaces may be defined as the sides of the foldable electronic device 301.

[0047] In one embodiment, the pair of housings 310, 320 includes a first housing 310, a second housing 320, a first rear cover 340, and a second rear cover 350. The pair of housings 310, 320 of the electronic device 301 are not limited to the shapes and combinations and / or combinations of parts shown in Figures 3a and 3b, and may be realized by other shapes and combinations and / or combinations of parts.

[0048] In one embodiment, the first housing 310 and the second housing 320 may be arranged on either side of the convolution axis A and substantially symmetrically with respect to the convolution axis A. In one embodiment, the angle or distance formed between the first housing 310 and the second housing 320 may vary depending on whether the electronic device 301 is in an unfolded state, a folded state, or an intermediate state. In one embodiment, the first housing 310 and the second housing 320 may have substantially symmetrical shapes.

[0049] In one embodiment, the first housing 310 may be connected to a hinge structure (e.g., a hinge structure 334 in Figure 4) when the electronic device 301 is unfolded. The first housing 310 includes a first surface 311 positioned toward the front of the electronic device 301, a second surface 312 facing the opposite direction from the first surface 311, and a first side portion 313 enclosing at least a portion of the space between the first surface 311 and the second surface 312. The first side portion 313 includes a first side surface 313a positioned substantially parallel to the convolution axis A, a second side surface 313b extending substantially perpendicular to the convolution axis A from one end of the first side surface 313a, and a third side surface 313c extending substantially perpendicular to the convolution axis A and substantially parallel to the second side surface 313b from the other end of the first side surface 313a. The second housing 320 may be connected to a hinge structure (e.g., hinge structure 334 in Figure 4) when the electronic device 301 is unfolded. The second housing 320 includes a third surface 321 positioned toward the front of the electronic device 301, a fourth surface 322 facing the opposite direction from the third surface 321, and a second side portion 323 enclosing at least a portion of the space between the third surface 321 and the fourth surface 322. The second side portion 323 includes a fourth side surface 323a positioned substantially parallel to the folding axis A, a fifth side surface 323b extending substantially perpendicular to the folding axis A from one end of the fourth side surface 323a, and a sixth side surface 323c extending substantially perpendicular to the folding axis A and substantially parallel to the fifth side surface 323b from the other end of the fourth side surface 323a. The first surface 311 and the third surface 321 face each other when the electronic device 301 is folded.

[0050] In one embodiment, the electronic device 301 includes at least one acoustic output module (e.g., acoustic output module 155 in Figure 1) located on the fifth side 323b and / or the sixth side 323c of the second housing 320.

[0051] In one embodiment, the electronic device 301 includes a recessed housing 302 that accommodates a display 361, formed by the structural connection of a first housing 310 and a second housing 320. The housing 302 is substantially the same size as the display 361.

[0052] In one embodiment, at least portions of the first housing 310 and the second housing 320 may be formed from a metallic or non-metallic material having any rigidity suitable for supporting the display 361.

[0053] In one embodiment, the electronic device 301 may include at least one component for performing various functions, which is arranged to be exposed on the front of the electronic device 301. For example, the component may include at least one of a front camera module, a receiver, a proximity sensor, an illuminance sensor, a rosacea recognition sensor, an ultrasonic sensor, or an indicator.

[0054] In one embodiment, the first rear cover 340 is positioned on the second surface 312 of the first housing 310 and may have substantially rectangular edges. At least a portion of the edges of the first rear cover 340 may be surrounded by the first housing 310. The second rear cover 350 is positioned on the fourth surface 322 of the second housing 320 and may have substantially rectangular edges. At least a portion of the edges of the second rear cover 350 may be surrounded by the second housing 320.

[0055] In one embodiment, the first rear cover 340 and the second rear cover 350 may have substantially symmetrical shapes with respect to the folding axis A. In another embodiment, the first rear cover 340 and the second rear cover 350 may have different shapes from each other. In yet another embodiment, the first housing 310 and the first rear cover 340 may be formed integrally, and the second housing 320 and the second rear cover 350 may be formed integrally.

[0056] In one embodiment, the first housing 310, the second housing 320, the first rear cover 340, and the second rear cover 350 can provide space for various components of the electronic device 301 (e.g., a printed circuit board, the antenna module 197 in Figure 1, the sensor module 176 in Figure 1, or the battery 189 in Figure 1) to be arranged through a structure coupled to one another. In one embodiment, at least one or more components may be visually exposed on the rear surface of the electronic device 301. For example, at least one or more components may be visually exposed through the first rear area 341 of the first rear cover 340, where the components may include a proximity sensor, a rear camera module, and / or a flash.

[0057] In one embodiment, the display 361 may be located in a housing 302 formed by a pair of housings 310, 320. For example, the display 361 may be located so as to occupy substantially a large portion of the front surface of the electronic device 301. The front surface of the electronic device 301 may include the area in which the display 361 is located, and a portion of the first housing 310 adjacent to the display 361 (e.g., an end area) and a portion of the second housing 320 adjacent to the display 361 (e.g., an end area). The rear surface of the electronic device 301 may include a first rear cover 340, a portion of the first housing 310 adjacent to the first rear cover 340 (e.g., an end area), a second rear cover 350, and a portion of the second housing 320 adjacent to the second rear cover 350 (e.g., an end area). In one embodiment, the display 361 may be a display in which at least a portion of the area is deformed into a planar or curved surface. In one embodiment, the display 361 includes a flexible region 361c, a first region 361a on the first side (e.g., the right side) relative to the flexible region 361c, and a second region 361b on the second side (e.g., the left side) relative to the flexible region 361c. The first region 361a may be located on the first surface 311 of the first housing 310, and the second region 361b may be located on the third surface 321 of the second housing 310. However, the region division of the display 361 is illustrative, and the display 361 may be divided into multiple regions depending on the structure or function of the display 361. For example, as shown in Figure 3a, the region of the display 361 is divided by a flexible region 361c extending parallel to the Y-axis, or by a convolution axis A, but the region of the display 361 may be divided relative to other flexible regions (e.g., a flexible region extending parallel to the X-axis) or different convolution axes (e.g., a convolution axis parallel to the X-axis). The area division of the display 361 as described above is merely a physical division by a pair of housings 310, 320 and a hinge structure (for example, the hinge structure 334 in Figure 4), and the display 361 may substantially display a single screen through the pair of housings 310, 320 and the hinge structure (for example, the hinge structure 334 in Figure 4).In one embodiment, the first region 361a and the second region 361b may have substantially symmetrical shapes with respect to the flexible region 361c.

[0058] In one embodiment, the hinge cover 365 is positioned between the first housing 310 and the second housing 320 and configured to cover the hinge structure (for example, the hinge structure 334 in Figure 4). Depending on the operating state of the electronic device 301, the hinge cover 365 may be hidden by at least a portion of the first housing 310 and the second housing 320 or exposed to the outside. For example, as shown in Figure 3a, when the electronic device 301 is in the unfolded state, the hinge cover 365 is hidden by the first housing 310 and the second housing 320 and not exposed to the outside, and as shown in Figure 3b, when the electronic device 301 is in the folded state, the hinge cover 365 may be exposed to the outside between the first housing 310 and the second housing 320. On the other hand, when the electronic device 301 is in an intermediate state where the first housing 310 and the second housing 320 form an angle with each other, at least a portion of the hinge cover 365 may be exposed to the outside between the first housing 310 and the second housing 320. Here, the area of ​​the hinge cover 365 that is exposed to the outside is smaller than the area of ​​the hinge cover 365 that is exposed when the electronic device 301 is in the folded state. In one embodiment, the hinge cover 365 may have a curved surface.

[0059] In one embodiment, the operation of the electronic device 301 is described as follows: When the electronic device 301 is in the unfolded state (for example, the state of the electronic device 301 in Figure 3a), the first housing 310 and the second housing 320 form a first angle (for example, about 180°) with respect to each other, and the first region 361a and the second region 361b of the display 361 are oriented substantially in the same direction. The flexible region 361c of the display 361 lies substantially on the same plane as the first region 361a and the second region 361b. In another embodiment, when the electronic device 301 is in the unfolded state, the first housing 310 may rotate relative to the second housing 320 at a second angle (for example, about 360°) so that the first housing 310 and the second housing 320 fold in the opposite direction so that the second surface 312 and the fourth surface 322 face each other. On the other hand, when the electronic device 301 is in a folded state (for example, the state of the electronic device 301 in Figure 3b), the first housing 310 and the second housing 320 may face each other. The first housing 310 and the second housing 320 form an angle of about 0 to about 10 degrees, and the first region 361a and the second region 361b of the display 361 may face each other. At least a portion of the flexible region 361c of the display 361 may be deformed into a curved surface. On the other hand, when the electronic device 301 is in an intermediate state, the first housing 310 and the second housing 320 may form a specific angle with respect to each other. The angle formed between the first region 361a and the second region 361b of the display 361 (for example, a third angle, about 90 degrees) is greater than the angle when the electronic device 301 is in a folded state, and smaller than the angle when the electronic device 301 is in an unfolded state. At least a portion of the flexible region 361c of the display 361 may be deformed into a curved surface. Here, the curvature of the surface of the flexible region 361c is smaller than the curvature of the surface of the flexible region 361c when the electronic device 301 is in the folded state.

[0060] On the other hand, the various embodiments of the electronic device described herein are not limited to the form factor of the electronic device 301 described with reference to Figures 3a and 3b, and may be applied to electronic devices of various form factors.

[0061] Referring to Figure 4, various embodiments of the electronic device 301 include a display module 360 ​​(e.g., display module 160 in Figure 1), a hinge assembly 330, a substrate 370, a first housing 310 (e.g., the first housing 310 in Figures 3a and 3b), a second housing 320 (e.g., the second housing 320 in Figures 3a and 3b), a first rear cover 340 (e.g., the first rear cover 340 in Figures 3a and 3b), and a second rear cover 350 (e.g., the second rear cover 350 in Figures 3a and 3b).

[0062] The display module 360 ​​includes a display 361 (for example, the display 361 in Figures 3a and 3b) and at least one layer or plate 362 on which the display 361 is mounted. In one embodiment, the plate 362 may be positioned between the display 361 and the hinge assembly 330. The display 361 may be positioned on at least a portion of one side of the plate 362 (for example, the top surface). The plate 362 may be formed in a shape corresponding to the display 361.

[0063] The hinge assembly 330 includes a first bracket 331, a second bracket 332, a hinge structure 334 positioned between the first bracket 331 and the second bracket 332, a hinge cover 365 that covers the hinge structure 334 when viewed from the outside, and a printed circuit board 333 that crosses the first bracket 331 and the second bracket 332. In one embodiment, the printed circuit board 333 may be a flexible printed circuit board (FPCB).

[0064] In one embodiment, the hinge assembly 330 may be positioned between the plate 362 and the substrate 370. For example, the first bracket 331 may be positioned between the first region 361a of the display 361 and the first substrate 371. The second bracket 332 may be positioned between the second region 361b of the display 361 and the second substrate 372.

[0065] In one embodiment, a printed circuit board 333 and at least a portion of the hinge structure 334 may be arranged inside the hinge assembly 330. The printed circuit board 333 may be arranged in a direction that crosses the first bracket 331 and the second bracket 332 (for example, in the X-axis direction). The printed circuit board 333 may be arranged in a direction perpendicular to the convolution axis (for example, the Y-axis or convolution axis A in Figure 3a) of the flexible region 361c of the electronic device 301 (for example, in the X-axis direction).

[0066] The substrate 370 includes a first substrate 371 positioned on the first bracket 331 side and a second substrate 372 positioned on the second bracket 332 side. The first substrate 371 and the second substrate 372 may be positioned inside the space formed by the hinge assembly 330, the first housing 310, the second housing 320, the first rear cover 340, and the second rear cover 350. Components for realizing various functions of the electronic device 301 may be positioned on the first substrate 371 and the second substrate 372.

[0067] The first housing 310 and the second housing 320 are assembled together so as to connect to each other on both sides of the hinge assembly 330, with the display module 360 ​​connected to the hinge assembly 330. The first housing 310 and the second housing 320 slide on both sides of the hinge assembly 330 to connect with the hinge assembly 330.

[0068] In one embodiment, the first housing 310 includes a first rotation support surface 314, and the second housing 320 includes a second rotation support surface 324 corresponding to the first rotation support surface 314. The first rotation support surface 314 and the second rotation support surface 324 may include curved surfaces corresponding to curved surfaces included in the hinge cover 365.

[0069] In one embodiment, when the electronic device 301 is in an unfolded state (for example, the electronic device 301 in Figure 3a), the first rotation support surface 314 and the second rotation support surface 324 cover the hinge cover 365, so that the hinge cover 365 is not exposed to the rear surface of the electronic device 301, or is exposed to a minimal extent. On the other hand, when the electronic device 301 is in a folded state (for example, the electronic device 301 in Figure 3b), the first rotation support surface 314 and the second rotation support surface 324 rotate along the curved surface contained in the hinge cover 365, so that the hinge cover 365 is exposed to the maximum extent on the rear surface of the electronic device 301.

[0070] Figure 5 is a cross-sectional view of an electronic device according to one embodiment, and Figure 6 is a schematic plan view showing the camera flange, lens, and conductive connector of the electronic device according to one embodiment.

[0071] Referring to Figures 5 and 6, in one embodiment, the electronic device 401 (for example, the electronic device 101 in Figure 1) includes a housing 410, a base plate 430, a camera flange 440, a cover frame 450, a plurality of lens structures 460a, 460b, an image sensor 470, a printed circuit board 480, a first conductive connector 491, a second conductive connector 492, and a plurality of adhesive members 499a, 499b.

[0072] In one embodiment, the housing 410 has a hollow interior. The housing 410 includes a main body 411, a side frame 412, and a cover plate 413.

[0073] In one embodiment, the main body 411 supports a plurality of components internally. For example, the main body 411 may include a processor (e.g., processor 120 in Figure 1), memory (e.g., memory 130 in Figure 1), input module (e.g., input module 150 in Figure 1), acoustic output module (e.g., acoustic output module 155 in Figure 1), display module (e.g., display module 160 in Figure 1), audio module (e.g., audio module 170 in Figure 1), sensor module (e.g., sensor module 176 in Figure 1), interface (e.g., interface 177 in Figure 1), and connection terminals. It supports at least one of the following: a child (e.g., connection terminal 178 in Figure 1), a haptic module (e.g., haptic module 179 in Figure 1), a camera module (e.g., camera module 180 in Figure 1), a power management module (e.g., power management module 188 in Figure 1), a battery (e.g., battery 189 in Figure 1), a communication module (e.g., communication module 190 in Figure 1), a subscriber identification module (e.g., subscriber identification module 196 in Figure 1), or an antenna module (e.g., antenna module 197 in Figure 1).

[0074] In one embodiment, the side frame 412 may be connected to the main body 411. For example, the side frame 412 may surround the main body 411. For example, the side frame 412 may be positioned on the +y side, -y side, +x side and / or -x side of the main body 411. Although the side frame 412 is shown as a separate part from the main body 411, it is important to clarify that this is not limited to that. For example, the side frame 412 may be formed integrally with the main body 411. The side frame 412 may, for example, have an annular shape.

[0075] In one embodiment, the cover plate 413 may be connected to the main body 411. For example, the cover plate 413 may cover the hollow of the housing 410.

[0076] In one embodiment, the base plate 430 may be placed on the main body 411. The base plate 430 may be made of a metal material. The base plate 430 may have a flat plate shape.

[0077] In one embodiment, the camera flange 440 may be positioned on the base plate 430. The camera flange 440 can protect the lens structure. The camera flange 440 may include a metallic material. The camera flange 440 includes a flange base 441, a flange body 442, and a flange head 443. The flange base 441 may be connected to the base plate 430. The flange body 442 may be formed as an extension from the flange base 441. For example, the flange body 442 may be formed as an extension in the z-axis direction. The flange head 443 may be formed protruding from the inner wall of the flange body 442. The flange head 443 may have a structure for locking the lens structure.

[0078] In one embodiment, the cover frame 450 covers the camera flange 440. The cover frame 450 can protect the camera flange 440. The cover frame 450 may overlap the camera flange 440 in the z-axis direction. The frame portion of the cover frame 450 may overlap the cover plate 413 in the z-axis direction. The cover frame 450 and the camera flange 440 may be connected to each other by a first conductive connector 491. The frame portion of the cover frame 450 and the cover plate 413 may be connected to each other by a first adhesive member 499a. A portion of the cover frame 450 may be located inside the housing 410, and a portion of the cover frame 450 may protrude outside the housing 410.

[0079] In one embodiment, the plurality of lens structures 460a, 460b include an external lens structure 460a and an internal lens structure 460b. The plurality of lens structures 460a, 460b include lenses and lens cases that support the lenses. The external lens structure 460a and the internal lens structure 460b may be stacked in the z-axis direction. The external lens structure 460a includes glass G for preventing or reducing the inflow of moisture and / or foreign matter from the outside. Each of the plurality of lens structures 460a, 460b may have an optical axis. The plurality of lens structures 460a, 460b may be aligned in the optical axis direction. For example, the optical axis may be aligned with the z-axis.

[0080] In one embodiment, the image sensor 470 is connected to an internal lens structure 460b. The image sensor 470 may convert light incident through a plurality of lens structures 460a, 460b into an electrical signal. The image sensor 470 may be electrically connected to a printed circuit board 480. The image sensor 470 may be positioned to be substantially aligned with the optical axes of the plurality of lens structures 460a, 460b.

[0081] In one embodiment, the printed circuit board 480 comprises various circuit elements for driving the camera module. For example, the printed circuit board 480 may be electrically connected to the image sensor 470. The electronic device 401 may further include connecting paths 498 for electrically connecting the printed circuit board 480 and the image sensor 470. For example, the connecting paths 498 may be paths through which signals are transmitted and / or through which power is transmitted. At least one or more connecting paths 498 may be formed. However, the connecting paths 498 shown in the drawings are illustrative and are not limited to the number, location and / or shape of the connecting paths 498.

[0082] In one embodiment, the first conductive connector 491 may be positioned between the cover frame 450 and the camera flange 440. The first conductive connector 491 may be provided in a state of compression by the cover frame 450 and the camera flange 440. The first conductive connector 491 electrically connects the cover frame 450 and the camera flange 440.

[0083] In one embodiment, the first conductive connector 491 can block the inflow of moisture and / or foreign matter by providing a space between the cover frame 450 and the camera flange 440. The first conductive connector 491 performs the function of blocking the inflow of moisture and / or foreign matter while simultaneously electrically connecting the cover frame 450 and the camera flange 440.

[0084] In one embodiment, the first conductive connector 491 can provide a discharge path E extending from the cover frame 450 to the base plate 430. Specifically, the discharge path E consists of the cover frame 450, the first conductive connector 491, the camera flange 440, the second conductive connector 492, and the base plate 430. For example, the second conductive connector 492 may be omitted from the discharge path E. For example, the discharge path may consist of the cover frame 450, the first conductive connector 491, the camera flange 440, and the base plate 430. With such a structure, since the discharge path E does not pass through the printed circuit board 480 while electrostatic discharge occurs, the effect of electrostatic discharge acting on the wiring provided on the printed circuit board 480 can be reduced or eliminated. The stability of the wiring provided on the printed circuit board 480 is improved.

[0085] In one embodiment, the first conductive connector 491 is elastic. One end of the first conductive connector 491 may be supported by a camera flange 440, and the other end may be supported by a cover frame 450.

[0086] In one embodiment, the first conductive connector 491 includes a conductive sponge. The first conductive connector 491 may also include a metallic material. The first conductive connector 491 may include a sponge or foam. The first conductive connector 491 allows air to pass through but largely blocks the movement of moisture and / or foreign matter. The first conductive connector 491 can close the space between the base plate 430 and the camera flange 440.

[0087] In one embodiment, the first conductive connector 491 can surround at least a portion of the internal lens structure 460b. For example, the first conductive connector 491 may have an annular shape. The first conductive connector 491 may be provided in a configuration that surrounds the optical axis.

[0088] In one embodiment, the second conductive connector 492 may be positioned between the base plate 430 and the camera flange 440. The second conductive connector 492 may be attached to the base plate 430 and the camera flange 440, respectively.

[0089] In one embodiment, the plurality of adhesive members 499a, 499b include a first adhesive member 499a and a second adhesive member 499b. The first adhesive member 499a may connect the cover plate 413 and the cover frame 450. The second adhesive member 499b may connect the cover plate 413 and the main body 411.

[0090] Figure 7 is a cross-sectional view of an electronic device according to one embodiment, and Figure 8 is a schematic plan view showing the camera flange, lens structure, and conductive connector of the electronic device according to one embodiment.

[0091] Referring to Figures 7 and 8, in one embodiment, the electronic device 501 (for example, the electronic device 101 in Figure 1) includes a housing 510, a base plate 530, a camera flange 540, a cover frame 550, a plurality of lens structures 560a, 560b, 560c, 560d, an image sensor 570, a printed circuit board 580, a first conductive connector 591, a second conductive connector 592, and a plurality of adhesive members 599a, 599b.

[0092] In one embodiment, the housing 510 has a hollow interior. The housing 510 includes a main body 511, a side frame 512, and a cover plate 513.

[0093] In one embodiment, the main body 511 can support multiple components internally. For example, the main body 511 may include a processor (e.g., processor 120 in Figure 1), memory (e.g., memory 130 in Figure 1), input module (e.g., input module 150 in Figure 1), acoustic output module (e.g., acoustic output module 155 in Figure 1), display module (e.g., display module 160 in Figure 1), audio module (e.g., audio module 170 in Figure 1), sensor module (e.g., sensor module 176 in Figure 1), interface (e.g., interface 177 in Figure 1), connection terminals ( For example, it may support at least one of the following: connection terminal 178 in Figure 1, haptic module (e.g., haptic module 179 in Figure 1), camera module (e.g., camera module 180 in Figure 1), power management module (e.g., power management module 188 in Figure 1), battery (e.g., battery 189 in Figure 1), communication module (e.g., communication module 190 in Figure 1), subscriber identification module (e.g., subscriber identification module 196 in Figure 1), or antenna module (e.g., antenna module 197 in Figure 1).

[0094] In one embodiment, the side frame 512 may be connected to the main body 511. For example, the side frame 512 may surround the main body 511. For example, the side frame 512 may be positioned on the +y side, -y side, +x side, and / or -x side of the main body 511. It is made clear that the side frame 512 is shown as a separate part from the main body 511, or is not limited thereto. For example, the side frame 512 may be formed integrally with the main body 511. The side frame 512 may have, for example, an annular shape.

[0095] In one embodiment, the cover plate 513 may be connected to the main body 511. For example, the cover plate 513 may cover the hollow of the housing 510.

[0096] In one embodiment, the base plate 530 may be placed on the main body 511. The base plate 530 may be made of a metal material. The base plate 530 may have a flat plate shape.

[0097] In one embodiment, the camera flange 540 may be positioned on the base plate 530. The camera flange 540 can protect the lens structure. The camera flange 540 may include a metallic material. The camera flange 540 includes a flange base 541, a flange body 542, and a flange head 543. The flange base 541 may be connected to the base plate 530. The flange body 542 may be formed as an extension from the flange base 541. For example, the flange body 542 may be formed as an extension in the z-axis direction. The flange head 543 may be formed protruding from the inner wall of the flange body 542. The flange head 543 may be provided with a structure for locking the lens structure.

[0098] In one embodiment, the cover frame 550 may cover the camera flange 540. The cover frame 550 can protect the camera flange 540. The cover frame 550 may overlap the camera flange 540 in the z-axis direction. The frame portion of the cover frame 550 may overlap the cover plate 513 in the z-axis direction. The cover frame 550 and the camera flange 540 may be connected to each other by a first conductive connector 591. The frame portion of the cover frame 550 and the cover plate 513 may be connected to each other by a first adhesive member 599a. A portion of the cover frame 550 may be located inside the housing 510, and a portion of the cover frame 550 may protrude outside the housing 510.

[0099] In one embodiment, the plurality of lens structures 560a, 560b, 560c, 560d include an external lens structure 560a and a plurality of internal lens structures 560b, 560c, 560d. It should be made clear that a plurality of external lens structures may also be provided. The external lens structures 560a and the internal lens structures 560b may be stacked in the z-axis direction. The external lens structure 560a may include glass G to prevent or reduce the inflow of moisture and / or foreign matter from the outside. Each of the plurality of lens structures 560a, 560b may have an optical axis. The plurality of lens structures 560a, 560b may be aligned in the optical axis direction. For example, the optical axis may be aligned with the z-axis.

[0100] In one embodiment, the multiple internal lens structures 560b, 560c, and 560d may be positioned at locations separated from each other in the y-axis direction. Connectors may be provided around each of the multiple internal lens structures 560b, 560c, and 560d to prevent the inflow of foreign matter. For example, the connectors may be made of sponge.

[0101] In one embodiment, the image sensor 570 may be connected to an internal lens structure 560b. The image sensor 570 may convert light incident through a plurality of lens structures 560a, 560b into an electrical signal. The image sensor 570 may be electrically connected to a printed circuit board 580. The image sensor 570 may be positioned to be substantially aligned with the optical axes of the plurality of lens structures 560a, 560b.

[0102] In one embodiment, the printed circuit board 580 may include various circuit elements for driving the camera module. For example, the printed circuit board 580 may be electrically connected to the image sensor 570. The electronic device 501 may further include connecting paths 598 for electrically connecting the printed circuit board 580 and the image sensor 570. For example, the connecting paths 598 may be paths through which signals are transmitted and / or through which power is transmitted. At least one or more connecting paths 598 may be formed. However, the connecting paths 598 shown in the drawings are illustrative, and the number, location and / or shape of the connecting paths 598 are not limited thereto.

[0103] In one embodiment, there may be a plurality of first conductive connectors 591, 593. The plurality of first conductive connectors 591, 593 include a first first conductive connector 591 and a second first conductive connector 593. The first first conductive connector 591 and the second first conductive connector 593 may be positioned spaced apart from each other along a direction perpendicular to the optical axis.

[0104] In one embodiment, the first conductive connector 591 may be positioned between the cover frame 550 and the camera flange 540. The first conductive connector 591 may be provided in a state of compression by the cover frame 550 and the camera flange 540. The first conductive connector 591 can electrically connect the cover frame 550 and the camera flange 540.

[0105] In one embodiment, the first conductive connector 591 can block the inflow of moisture and / or foreign matter into the space between the cover frame 550 and the camera flange 540. The first conductive connector 591 can electrically connect the cover frame 550 and the camera flange 540 while simultaneously performing the function of blocking the inflow of moisture and / or foreign matter.

[0106] In one embodiment, the first conductive connector 591 can provide a discharge path E extending from the cover frame 550 to the base plate 530. Specifically, the discharge path E may consist of the cover frame 550, the first conductive connector 591, the camera flange 540, the second conductive connector 592, and the base plate 530. For example, the second conductive connector 592 may be omitted from the discharge path E. For example, the discharge path may consist of the cover frame 550, the first conductive connector 591, the camera flange 540, and the base plate 530. With such a structure, since the discharge path E does not pass through the printed circuit board 580 while electrostatic discharge occurs, the effect of electrostatic discharge acting on the wiring provided on the printed circuit board 580 can be reduced or eliminated. The stability of the wiring provided on the printed circuit board 580 is improved.

[0107] In one embodiment, the first conductive connector 591 may be elastic. One end of the first conductive connector 591 is supported by the camera flange 540, and the other end is supported by the cover frame 550.

[0108] In one embodiment, the first conductive connector 591 may include a conductive sponge. The first conductive connector 591 may also include a metallic material. The first conductive connector 591 allows air to pass through but largely blocks the movement of moisture and / or foreign matter. The first conductive connector 591 can close the space between the base plate 530 and the camera flange 540.

[0109] In one embodiment, the first conductive connector 591 can surround at least a portion of the internal lens structure 560b. For example, the first conductive connector 591 may have an annular shape. The first conductive connector 591 may be provided in a configuration that surrounds the optical axis.

[0110] In one embodiment, the second first conductive connector 593 may be positioned between the cover frame 550 and the camera flange 540. The second first conductive connector 593 may be provided in a compressed state between the cover frame 550 and the camera flange 540. The second first conductive connector 593 may have a columnar shape. For example, the second first conductive connector 593 may have a cylindrical or rectangular prism shape. It is important to clarify that the shape of the second first conductive connector 593 is not limited thereto.

[0111] In one embodiment, the second first conductive connector 593 can provide a discharge path extending from the cover frame 550 to the base plate 530. Specifically, the discharge path E may consist of the cover frame 550, the second first conductive connector 593, the camera flange 540, the second conductive connector 592, and the base plate 530. For example, the second conductive connector 592 may be omitted from the discharge path. For example, the discharge path may consist of the cover frame 550, the second first conductive connector 593, the camera flange 540, and the base plate 530. With such a structure, since the discharge path does not pass through the printed circuit board 580 while electrostatic discharge occurs, the effect of electrostatic discharge acting on the wiring provided on the printed circuit board 580 can be reduced or eliminated. The stability of the wiring provided on the printed circuit board 580 is improved.

[0112] In one embodiment, the second conductive connector 592 may be positioned between the base plate 530 and the camera flange 540. The second conductive connector 592 may be attached to the base plate 530 and the camera flange 540, respectively.

[0113] In one embodiment, the plurality of adhesive members 599a, 599b include a first adhesive member 599a and a second adhesive member 599b. The first adhesive member 599a may connect the cover plate 513 and the cover frame 550. The second adhesive member 599b may connect the cover plate 513 and the main body 511.

[0114] Figure 9 is a schematic plan view showing the camera flange, lens structure, and conductive connector of an electronic device according to one embodiment.

[0115] Referring to Figure 9, in one embodiment, the electronic device 601 (for example, the electronic device 101 in Figure 1) includes a housing 610, a camera flange 640, a plurality of internal lens structures 660b, 660c, 660d, and a first conductive connector 691.

[0116] In one embodiment, the multiple internal lens structures 660b, 660c, and 660d may be spaced apart from each other. The multiple internal lens structures 660b, 660c, and 660d include a first internal lens structure 660b, a second internal lens structure 660c, and a third internal lens structure 660d.

[0117] In one embodiment, there may be multiple first conductive connectors 691. For example, the first conductive connector 691 includes a first first conductive connector 6911 covering a first internal lens structure 660b, a second first conductive connector 6913 covering a second internal lens structure 660c, a third first conductive connector 6915 covering a third internal lens structure 660d, a first connecting connector 6912 connecting the first first conductive connector 6911 and the second first conductive connector 6913, and a second connecting connector 6914 connecting the second first conductive connector 6913 and the third first conductive connector 6915.

[0118] Figure 10 is a schematic plan view showing the camera flange, lens structure, and conductive connector of an electronic device according to one embodiment.

[0119] Referring to Figure 10, in one embodiment, the electronic device 701 (for example, the electronic device 101 in Figure 1) includes a housing 710, a camera flange 740, a plurality of internal lens structures 760b, 760c, 760d, first conductive connectors 792, 793, 794, and adhesive sponges 797a, 797b. The adhesive sponges 797a, 797b may include a non-conductive material.

[0120] In one embodiment, the multiple internal lens structures 760b, 760c, and 760d may be spaced apart from each other. The multiple internal lens structures 760b, 760c, and 760d include a first internal lens structure 760b, a second internal lens structure 760c, and a third internal lens structure 760d.

[0121] In one embodiment, there may be multiple first conductive connectors 792, 793, 794. For example, the first conductive connectors 792, 793, 794 include a first conductive connector 792 surrounding the third internal lens structure 760d, a second first conductive connector 793 provided around the first internal lens structure 760b, and a third first conductive connector 794. The first first conductive connector 792, the second first conductive connector 793, and the third first conductive connector 794 may be provided at positions spaced apart from each other.

[0122] According to one embodiment, the electronic device includes a main body 411, a housing 410 including a cover plate 413 connected to the main body, a base plate 430 disposed on the main body, a camera flange 440 disposed on the base plate, a cover frame 450 covering the camera flange, a plurality of lens structures 460a, 460b including an external lens structure connected to the cover frame and an internal lens structure connected to the camera flange, and a first conductive connector 491 disposed between the cover frame and the camera flange, compressed by the cover frame and the camera flange, and electrically connecting the cover frame and the camera flange.

[0123] In one embodiment, electrostatic discharge occurs along the cover frame 450, the first conductive connector 491, the camera flange 440, and the base plate 430.

[0124] In one embodiment, the first conductive connector 491 may be elastic.

[0125] In one embodiment, the first conductive connector 491 may include a conductive sponge.

[0126] In one embodiment, the first conductive connector 491 may surround at least a portion of the internal lens structure.

[0127] In one embodiment, the first conductive connector 491 may have an annular shape.

[0128] In one embodiment, the first conductive connector 491 may close the space provided between the camera flange and the cover frame.

[0129] In one embodiment, the electronic device may further include a second conductive connector 492 positioned between the base plate 430 and the camera flange 440.

[0130] In one embodiment, the first conductive connector 491 and the second conductive connector 492 may contain the same material.

[0131] In one embodiment, the electronic device may further include a printed circuit board 480, which is located inside the housing and is not electrically connected to the camera flange.

[0132] In one embodiment, the printed circuit board 480 may be located inside the housing and separated from the camera flange.

[0133] In one embodiment, there may be multiple first conductive connectors 591, 593.

[0134] In one embodiment, there may be multiple internal lens structures 560b, 560c, and 560d, and the camera flange 540 may surround each of the multiple internal lens structures 560b, 560c, and 560d.

[0135] In one embodiment, the first conductive connectors may be provided in multiple locations, and the multiple first conductive connectors 591, 593 may include a first conductive connector 591 surrounding any one of the multiple internal lens structures, and a second conductive connector 593 provided at a location spaced apart from the first conductive connector.

[0136] In one embodiment, the plurality of first conductive connectors 6911, 6912, 6913, 6914, 6915 may further include connecting connectors 6912, 6914 that connect the first conductive connector and the second first conductive connector.

[0137] According to the embodiment, the electronic device includes a main body 411, a housing 410 including a cover plate 413 connected to the main body, a base plate 430 disposed on the main body, a camera flange 440 disposed on the base plate, a cover frame 450 covering the camera flange, a plurality of lens structures 460a, 460b including an external lens structure connected to the cover frame and an internal lens structure connected to the camera flange, and a first conductive connector 491 disposed between the cover frame and the camera flange and compressed by the cover frame and the camera flange, wherein electrostatic discharge occurs along the cover frame, the first conductive connector, the camera flange and the base plate.

[0138] In one embodiment, the first conductive connector 491 may include a conductive sponge.

[0139] In one embodiment, the first conductive connector 491 may have an annular shape.

[0140] In one embodiment, the electronic device may further include a printed circuit board 480, which is located inside the housing and is not electrically connected to the camera flange.

[0141] According to one embodiment, the electronic device includes a main body 411, a housing 410 including a cover plate 413 connected to the main body, a base plate 430 disposed on the main body, a camera flange 440 disposed on the base plate, a cover frame 450 covering the camera flange, a plurality of lens structures 460a, 460b including an external lens structure connected to the cover frame and an internal lens structure connected to the camera flange, and a first conductive connector 491 disposed between the cover frame and the camera flange, which is elastic, compressed by the cover frame and the camera flange, electrically connects the cover frame and the camera flange, and is annular in shape, and electrostatic discharge occurs along the cover frame, the first conductive connector, the camera flange, and the base plate.

[0142] The effects of the electronic device according to this embodiment are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description in this specification.

[0143] The embodiments described herein are illustrative and not intended to be restrictive. Various modifications to the details of this disclosure, including the appended claims and equivalents, may be made. Any embodiment described herein may be used in combination with any other embodiment described herein. [Explanation of Symbols]

[0144] 100 Network Environment 101, 102, 104, 401, 501, 601, 701 Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary processors 130, 250 memory 132 Volatile memory 134 Non-volatile memory 136 Interior memory 138 External memory 140 programs 142 Management Structure 144 Middleware 146 applications 150 Input Modules 155 Audio Output Module 160 display modules 170 Audio Modules 176 Sensor Modules 177 Interface 178 Connection terminals 179 Haptic Modules 180 Camera Module 188 Power Management Modules 189 batteries 190 Communication Module 192 Wireless Communication Module 194 Wired Communication Module+ 196 Subscriber Identification Module 197 Antenna Module 198 First Network 199 Second Network 210 Lens Assembly 220 flashes 230 Image Sensors 240 Image Stabilizer 260 Image Signal Processors 301 Foldable Electronic Device 302 Accommodation Unit 310 Housing No. 1 311 Page 1 312 2nd page 313 First side section 314 is the first rotation support surface 320 Second Housing 321 3rd page 322 Page 4 323 Second side section 324 Second rotation support surface 330 Hinge Assembly 331 First bracket 332 Second bracket 333, 480, 580 Printed Circuit Boards 334 Hinge Structure 340 First rear cover 341 1st posterior area 350 Second rear cover 360 Display Module 361 displays 365 Hinge Cover 370 circuit boards 371 First board 372 Second board 410, 510, 610, 710 Housing 411 Main body 412 Side frame 3 413, 513 Cover Plate 430, 530 base plate 440, 540, 640, 740 Camera flange 441, 541 Flange base 442, 542 Flange Body 443, 543 Flange head 450, 550 cover frame 460, 560 lens structure 470, 570 Image Sensors 491, 591, 593, 691, 792, 793, 794 First conductive connector 492 Second conductive connector Routes 498 and 598 512 Side frame 592 Second conductive connector 599 Adhesive material 797 Adhesive sponge

Claims

1. A main body 411 and a housing 410 including a cover plate 413 connected to the main body 411, A base plate 430 is placed on the main body 411, A camera flange 440 is positioned on the base plate 430, A cover frame 450 that covers the camera flange 440, Multiple lens structures 460a, 460b, including an external lens structure connected to the cover frame 450 and an internal lens structure connected to the camera flange 440, A first conductive connector 491 is positioned between the cover frame 450 and the camera flange 440, and electrically connects the cover frame 450 and the camera flange 440. An electronic device characterized by including

2. The electronic device according to claim 1, characterized in that electrostatic discharge occurs along the cover frame 450, the first conductive connector 491, the camera flange 440, and the base plate 430.

3. The electronic device according to claim 1 or 2, characterized in that the first conductive connector 491 is elastic and is provided in a compressed state by the cover frame 450 and the camera flange 440.

4. The electronic device according to any one of claims 1 to 3, characterized in that the first conductive connector 491 includes a conductive sponge.

5. The electronic device according to any one of claims 1 to 4, characterized in that the first conductive connector 491 surrounds at least a portion of the internal lens structure.

6. The electronic device according to any one of claims 1 to 5, characterized in that the first conductive connector 491 has an annular shape.

7. The electronic device according to any one of claims 1 to 6, characterized in that the first conductive connector 491 closes the space provided between the camera flange 440 and the cover frame 450.

8. The electronic device according to any one of claims 1 to 7, further comprising a second conductive connector 492 disposed between the base plate 430 and the camera flange 440.

9. The electronic device according to any one of claims 1 to 8, characterized in that the first conductive connector 491 and the second conductive connector 492 contain the same material.

10. The electronic device according to any one of claims 1 to 9, further comprising a printed circuit board 480 disposed inside the housing 410 and provided in a state not electrically connected to the camera flange 440.

11. The electronic device according to any one of claims 1 to 10, characterized in that the printed circuit board 480 is disposed inside the housing 410 and separated from the camera flange 440.

12. The electronic device according to any one of claims 1 to 11, characterized in that a plurality of the first conductive connectors 591, 593 are provided.

13. Multiple internal lens structures 560b, 560c, and 560d are provided. The electronic device according to any one of claims 1 to 12, characterized in that the camera flange 540 surrounds each of the plurality of internal lens structures 560b, 560c, and 560d.

14. The plurality of first conductive connectors 591, 593 are, A first conductive connector 591 surrounds one of the plurality of internal lens structures 560b, 560c, and 560d, The electronic device according to any one of claims 1 to 13, characterized in that it includes a second first conductive connector 593 provided at a position spaced apart from the first first conductive connector 591.

15. The plurality of first conductive connectors 6911, 6912, 6913, 6914, 6915 are, The electronic device according to any one of claims 1 to 14, further comprising connecting connectors 6912 and 6914 that connect the first conductive connector 591 and the second conductive connector 593.

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