Sensor configuration and method for manufacturing the sensor configuration - Patents.com

Abstract

A sensor configuration (1) is described, the sensor configuration (1) including a ceramic-based substrate (2), at least one sensor chip (3) directly connected to the substrate (2) in a horizontal position by a bonding material (5), a first contact element (8a) and a second contact element (8b) configured and arranged to act as outer electrodes (6) of the sensor configuration (1), and an insulating body (7) surrounding the sensor chip (3) and at least portions of the contact elements (8a, 8b), the first contact element (8a) including a contact member (11) configured and arranged to electrically contact the sensor chip (3) by the bonding material (5), and the substrate (2) being largely free of material from the insulating body (7). Further, a method of manufacturing the sensor configuration is described.

Description

[Technical field]

[0001] The present invention relates to a sensor arrangement, for example a sensor arrangement for measuring temperature. Moreover, the present invention relates to a method for manufacturing a sensor arrangement, for example a sensor arrangement for measuring temperature. [Background technology]

[0002] Temperature surface sensitivity cannot be optimally achieved in NTC (Negative Temperature Coefficient) sensor designs, mainly due to the position constraints of the sensing element in the vertical position, which is exacerbated by the fact that aggressive packaging is required to meet the high voltage withstand and moisture resistance requirements.

[0003] Furthermore, achieving high operating temperatures up to 200° C. is difficult due to the very limited selection of available materials. None of the known sensor designs can solve all the aforementioned challenges in a cost-comprehensive design with small size and packaging solutions suitable for mass production.

[0004] Patent Document 1 describes a temperature sensor that includes a carrier substrate, an NTC element, a pair of electrodes, and a metal block that is in electrical contact with the NTC element and forms an outer electrode on a surface of an insulating housing.

[0005] US 2007 / 0133963 A1 describes a temperature sensor having a housing consisting of an insulating material, a heat-conducting element, a heat-sensitive sensor chip arranged in the area of ​​the heat-conducting element and / or pressed against the heat-conducting element, and at least two connection elements. At least one conductive pin is provided, one of whose ends applies a pressure directed against the heat-conducting element on the sensor chip, and whose other end is supported by an end of one of the two connection elements arranged inside the housing or by an end of a separate fixed part of a contact spring.

[0006] US Pat. No. 5,399,433 describes a semiconductor sensor including a carrier having a conductive structure with pads and leads, with conductive wires protruding from a resin package.

[0007] US Pat. No. 5,399,433 describes a sensor chip package having a ceramic carrier, a conductive structure having pads and leads, and a resin package.

[0008] US Pat. No. 5,999,333 describes the construction of a chip thermistor soldered to a bent lead frame.

[0009] US Patent No. 6,399,633 describes a sensor arrangement including a sensor chip having at least one electrode and at least one contact element shaped as a metal bracket, the contact element being arranged and configured for wireless contact of the sensor chip. Summary of the Invention [Problem to be solved by the invention]

[0010] It is an object of the present disclosure to solve the above mentioned problems. This object is solved by a sensor arrangement and a method according to the independent claims. [Means for solving the problem]

[0011] According to a first aspect of the present disclosure, a sensor arrangement is provided. The sensor arrangement may be configured for measuring temperature. The sensor arrangement may be a temperature sensor arrangement. The sensor arrangement may be configured to operate at high temperatures up to 200°C.

[0012] The sensor configuration includes a substrate. The substrate may be ceramic-based. In other words, the substrate may include a ceramic material. The substrate may be a high-performance ceramic substrate with good electrical insulation and moisture resistance, and high thermal conductivity. The substrate may be further constructed and arranged to mechanically stabilize and electrically insulate further components of the sensor configuration.

[0013] The ceramic material may include, for example, Al2O3. 2 O 3 (Alumina) ceramics are commonly used and have well-known properties, namely high thermal conductivity, high electrical insulation, and low thermal expansion. However, alternative materials, both oxide and non-oxide ceramics, are also available. Silicate ceramics, or even ZTA (Zirconia Toughen Alumina), are examples of oxide ceramics, due to their higher mechanical strength. Alternatively, AIN (Alumina Nitride) or Si 3 N 4 Non-oxide ceramics such as (silicon nitride) ceramics may be used.

[0014] The sensor configuration further includes at least one sensor chip. The sensor chip may be an NTC sensor chip. Alternatively, the sensor chip may be a PTC (Positive Temperature Coefficient) sensor chip. The sensor configuration may include more than one sensor chip. For example, the sensor configuration may include a combination of an NTC sensor chip and a PTC sensor chip.

[0015] The sensor chip, in particular the electrodes arranged on the surface (e.g., the underside) of the sensor chip, are directly connected to the substrate in a horizontal position. By "horizontal" it is meant that the surface of the sensor chip with the greatest extension is connected to the substrate. This increases the surface sensitivity of the sensor chip. Although the sensor chip 3 is directly bonded, the sensor chip 3 is nevertheless completely insulated due to the excellent electrical insulating and moisture-resistant properties of the ceramic substrate.

[0016] The sensor chip is connected to the substrate by a bonding material. In other words, the sensor chip is bonded to the substrate, in particular to the metallized pads of the substrate. The bonding material may be a high melting point solder material with an operating temperature >200° C. The bonding material may be lead or lead-free. Suitable materials are, for example, Pb 97.5 SnAg 1.5 , SnAg 0.3 Cu 0.7 or Sn 90 Sb 10 It may be the case.

[0017] The sensor configuration further includes a first contact element and a second contact element. The contact elements include, for example, copper, brass, or phosphorus bronze. The contact elements are configured and arranged to act as outer electrodes of the sensor configuration. This means that the contact elements allow electrical connection of the sensor configuration from outside the sensor configuration.

[0018] The contact elements are electrically and mechanically connected to the substrate, in particular to the metallized pads of the substrate, by means of the aforementioned bonding material.

[0019] The first contact element further includes a contact member. The first contact element and the contact member may be integrally formed. The contact member is configured to electrically contact the sensor chip by a bonding material. In other words, the contact member is bonded to the sensor chip, in particular to an electrode arranged on a surface (e.g., a top surface) of the sensor chip, by said bonding material.

[0020] The sensor arrangement further includes an insulating body. The insulating body is designed to electrically insulate the sensor arrangement and to protect the sensor arrangement from environmental influences. The insulating body completely surrounds the sensor chip. The insulating body surrounds at least a portion of the contact element. For example, the insulating body completely covers the contact member. However, the substrate is largely free of the material of the insulating body.

[0021] Due to its specific design and composition, the sensor configuration provides high performance thermal coupling for excellent surface sensitivity. In other words, the sensor configuration is a fast response sensor. Moreover, the sensor configuration has high voltage resistance and can operate at temperatures up to 200° C. In addition, the sensor configuration is compact and small in size, making it suitable for mass production. Overall, a very robust, fast and cost-effective sensor configuration is provided that is very flexible in use.

[0022] According to one embodiment, the material of the insulating body is configured to increase the electrical resistance and moisture resistance of the sensor arrangement. The insulating material of the insulating body includes a thermosetting epoxy material with a glass transition temperature near 200° C.

[0023] The combination between the ceramic substrate and the insulating material meets the requirements of high voltage resistance, moisture resistance, high operating temperature (up to 200°C). Moreover, it offers a specific design for a compact and small sensor configuration. Due to the specific selection of materials and the well-known production process, the sensor configuration is additionally very cost-effective. The materials are selected to meet the green product according to ROHS, lead-free and halogen-free requirements.

[0024] The insulating body material is arranged directly on the top surface of the substrate, in particular the insulating body material covers the surface of the substrate to which the sensor chip and the contact elements are connected, i.e. at least a portion of the top surface of the substrate.

[0025] The connections between the sensor chip and the substrate, as well as the connections between the contact elements and the substrate, are packaged by the insulating body material. The sides and bottom surface of the substrate are free of the insulating body material. This free area of ​​the substrate serves as the sensing portion of the sensor arrangement. Moreover, the circumferential edge area of ​​the top surface of the substrate may also be free of the insulating body material.

[0026] According to one embodiment, each contact element is U-shaped. In particular, the contact element comprises a U-shaped bracket or spring member. In other words, each contact element may comprise two legs connected by a bar or a bridge. The legs and the bar are integrally formed. This means that a first leg merges with the bar and the bar merges with a second leg of the respective contact element. In other words, the legs and the bar may be made into a single piece.

[0027] The particular shape of the contact elements provides good solderability, less mass density, and less mechanical stress on the sensor chip during the bonding process.

[0028] According to an embodiment, each contact element comprises a first contact area. The first contact area may be formed / provided by one of the two legs of the respective U-shaped spring member. The first contact area is free of the insulating material of the insulating body. In other words, the first contact area protrudes from the insulating material of the insulating body. The first contact area serves as an outer electrode of the sensor arrangement. In this way, an effective further processing of the sensor arrangement is enabled.

[0029] According to one embodiment, each contact element includes a second contact area, which is formed by the other of the two legs of each U-shaped spring member. The second contact area is completely surrounded by the insulating material of the insulating body. In other words, it is disposed within the insulating body of the sensor arrangement.

[0030] The second contact area is bonded to a metallized pad of the substrate to establish an electrical contact between the contact element and the substrate. In this way, an effective electrical connection between the substrate and the contact element is made possible. Moreover, the particular shape of the contact element accumulates less heat compared to, for example, a metal block. Due to the fast dissipation, this results in more accurate measurement results.

[0031] According to one embodiment, the contact member is designed to reduce mechanical stress between the first contact element and the sensor chip. The contact member may include a flat or arcuate shape. The contact member may include an additional spring arranged at the free end of the second contact area of ​​the first contact element. The contact member is arranged in the insulating material of the body. The particular shape of the contact member allows the sensor chip to be used as a sensing element without wire bonds, allowing a more robust connection and a very economical solution.

[0032] According to a further aspect, a method of manufacturing a sensor configuration is described. The sensor configuration may be a sensor configuration as described above. All features described in relation to the sensor configuration apply to the method and vice versa.

[0033] The method includes the following steps.

[0034] A) providing a ceramic-based substrate and disposing a plurality of metallized pads on the upper surface of the substrate, in particular on the upper surface of the substrate. The substrate may be a high-performance ceramic substrate with excellent electrical insulation and moisture resistance, and high thermal conductivity. The substrate may be Al 2 O 3 , ZTA, silicate, AlN or Si 3 N 4 It may comprise ceramic.

[0035] B) Providing a bonding material. The bonding material may include a solder paste. The bonding material may be a high melting point solder material with an operating temperature >200° C. The bonding material may be lead or lead-free. An example of a high melting solder material with added lead is Pb 97.5 SnAg 1.5 Alternatively, SnAg 0.3 Cu 0.7 or Sn 90 Sb 10However, for applications above 200°C, lead-free and high temperature solder materials may be an option.

[0036] The bonding material may be applied in dots. In particular, one respective dot of bonding material may be applied to a portion of the metallized pad. The bonding material may be dispensed or screen printed onto the metallized pad.

[0037] C) Providing a plurality of sensor chips, each of which may include electrodes (upper and lower electrodes) disposed on the upper and lower sides of the sensor chip, the sensor chips may include NTC and / or PTC sensor chips.

[0038] The sensor chips may be arranged on the substrate, in particular on a bonding material applied to a metallized pad of the substrate, in particular with a tip of each sensor chip arranged on the dot-like bonding material, the sensor chips being arranged such that each sensor chip is arranged on the substrate in a horizontal position.

[0039] D) A step of reflow soldering to electrically connect one of the electrodes (i.e., the lower electrode) of each sensor chip with the substrate so that each sensor chip is placed on the substrate in a horizontal position.

[0040] E) applying again a bonding material, which may be the same bonding material as that applied in step B).

[0041] The bonding material may be applied in dots. In particular, one respective dot of bonding material may be applied to the upper electrode of each sensor chip. Further dots of bonding material may be applied to at least a portion of the metallized pads. In particular, two dots of bonding material may be applied to two of the metallized pads to achieve one final sensor configuration. The bonding material may be dispensed or screen printed onto the metallized pads and the sensor chip.

[0042] F) providing a plurality of first and second contact elements, each contact element including a first contact region and a second contact region, the first contact region adapted to act as an outer electrode of the sensor arrangement, the second contact region adapted to electrically connect the substrate to the respective contact element, each first contact element including a contact member, the contact member configured and arranged to establish an electrical connection between the sensor chip and the first contact element.

[0043] The contact elements are arranged on the substrate such that one respective second contact area is disposed on one respective point of bonding material disposed on the metallized pad, and the contact elements are arranged such that each contact member is disposed on a point of bonding material disposed on the upper electrode of the sensor chip.

[0044] Reflow soldering to electrically connect the second contact area with the metallized pad and to electrically connect the contact member with another one of the electrodes of the sensor chip (i.e., the upper electrode).

[0045] H) packaging, which includes providing an insulating material and molding an insulating body from the insulating material, the insulating material being molded to cover only the portion of the surface of the substrate to which the sensor chip and the second contact area are connected, i.e. the top surface of the substrate.

[0046] The insulating material is disposed to completely package the connections between the contact elements and the substrate and the connections between the sensor chip and the substrate. The insulating material is further disposed to completely cover the sensor chip, the second contact area and the contact members. The first contact area and the side and bottom surfaces of the substrate remain free of insulating material. Moreover, a portion of the top surface of the substrate (e.g., a circumferential edge area) may also remain free of insulating material.

[0047] The insulating material includes a thermosetting epoxy material with a glass transition temperature approaching 200°C.

[0048] I) Singulation: This step involves sawing the substrate into individual components to provide multiple sensor configurations.

[0049] The described method provides a fast and cost-effective process for fabricating multiple sensor configurations with high surface sensitivity, small size, high voltage resistance, moisture resistance, and high operating temperature up to 200° C. The sensor configuration with two robust electrodes (contact elements) allows easy further processing and provides optimal system integration.

[0050] Further configurations, improvements and advantages will become apparent from the following description of exemplary embodiments taken in conjunction with the drawings. [Brief description of the drawings]

[0051] [Figure 1] FIG. 1 diagrammatically shows a cross-sectional side view of a sensor arrangement according to a first embodiment; [Diagram 2] FIG. 4 diagrammatically shows a cross-sectional side view of a sensor arrangement according to a second embodiment; [Diagram 3] 13A and 13B diagrammatically show cross-sectional side views of sensor configurations according to further embodiments; [Figure 4] FIG. 2 diagrammatically illustrates a top view of a multi-sensor configuration package. [Diagram 5] 13 diagrammatically illustrates a top view of a multi-sensor configuration package according to a further embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0052] In the figures, elements of the same structure and / or functionality may be referred to by the same reference numerals. It should be understood that the embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.

[0053] 1 shows a sensor configuration 1 for temperature measurement according to a first embodiment. The sensor configuration 1 is configured to provide high surface sensitivity, high voltage resistance, and an operating temperature up to 200° C. The sensor configuration is of small and compact design.

[0054] The sensor arrangement 1 comprises a ceramic-based substrate 2. The ceramic material of the substrate 2 is, for example, Al 2 O 3 , ZTA, silicate, AlN or Si 3 N 4 The substrate 2 is electrically insulating and has high moisture resistance.

[0055] The substrate 2 includes a top surface 2a, a bottom surface 2c, and a side surface 2b. The substrate 2 includes metallization pads 4 that allow electrical connection of the substrate 2. The metallization pads 4 are disposed directly on the top surface 2a of the substrate 2.

[0056] The sensor arrangement 1 further includes a sensor chip 3. In this embodiment, the sensor chip 3 is an NTC temperature sensor chip. However, in alternative embodiments, the sensor arrangement 1 may include a PTC sensor or a combination of an NTC sensor and a PTC sensor.

[0057] The sensor chip 3 includes an electrode 3a (upper electrode) disposed on the upper surface of the sensor chip 3, and an electrode 3a (lower electrode) disposed on the lower surface of the sensor chip 3.

[0058] The sensor chip 3, in particular the lower electrode 3a, is directly bonded to the metallization pad 4 of the substrate 2 in a horizontal position in order to achieve good surface sensitivity. In this context, the term "horizontal position" means that the lower surface of the sensor chip 3, which is bonded to the substrate 2, has a greater extension than the side surfaces of the sensor chip 3 which extend perpendicularly to the upper surface 2a of the substrate 2.

[0059] The sensor chip 3 is bonded to the substrate 2 by a bonding material 5. The bonding material 5 is a high melting point solder material with an operating temperature >200° C. For example, the bonding material 5 is a high melting point solder but with Pb 97.5 SnAg 1.5 Alternatively, the bonding material 5 may be a lead-free material such as SnAg. 0.3 Cu 0.7 or Sn 90 Sb 10 Includes.

[0060] The sensor arrangement 1 further comprises a first contact element 8a and a second contact element 8b. The contact elements 8a, 8b are U-shaped. In particular, they comprise two legs connected by a bar or middle piece 9. The legs and the bar 9 are integrally formed, i.e. they are made from a single piece.

[0061] The contact elements 8a, 8b are at least to some extent elastically deformable. This helps to reduce mechanical stresses that arise when the components of the sensor arrangement 1 are connected to each other. The contact elements 8a, 8b are U-shaped spring members. They comprise a metal. Suitable materials for the contact elements 8a, 8b may be copper, brass, or phosphorus bronze.

[0062] The contact elements 8a, 8b each include a first contact area 12 and a second contact area 13. In this embodiment, the first contact area 12 and the second contact area 13 are arranged oppositely. The first contact area 12 is located in an upper region of the sensor arrangement 1. The second contact area 13 is arranged in a lower region of the sensor arrangement 1. The first contact area 12 is provided by one of the two legs (in particular, the upper leg) of the respective U-shaped spring member. The second contact area 13 is provided by the other of the two legs (in particular, the lower leg) of the respective U-shaped spring member.

[0063] The first contact area 12 protrudes from the insulating body 7 of the sensor arrangement 1. Details of the insulating body 7 will be described later. However, as can be seen from FIG. 1 , the contact area 12 does not protrude from the top surface of the insulating body 7 / sensor arrangement 1. Rather, the top surface of the insulating body 7 / sensor arrangement 1 is flat. The contact area 12 is integrated into the top surface and forms part of the top surface of the insulating body 7 / sensor arrangement 1.

[0064] As already mentioned, in this embodiment the first contact area 12 is formed on the upper surface of the sensor arrangement 1. In other words, the first contact area 12 is accessible from the top side of the sensor arrangement 1 to enable further processing. The first contact area 12 acts as the outer electrode 6 of the sensor arrangement 1. A free end 14 of an upper leg of each contact element 8a, 8b is bent towards the first contact surface 12. In particular, the free end 14 is bent towards the substrate 2. This may help to further reduce mechanical stresses.

[0065] The second contact areas 13 are connected to the metallized pads 4 by means of the aforementioned bonding material 5 .

[0066] The first contact element 8a further comprises a contact member 11 which is bonded to the upper electrode 3a of the sensor chip 3 by means of the aforementioned bonding material 5.

[0067] The contact member 11 is part of the first contact element 8a. In particular, it is formed integrally with the first contact element 8a. The contact member 11 is formed by the free end of the second contact region 13 of the first contact element 8a. In the intermediate region 15, the second contact region 13 passes and becomes the contact member 11. The intermediate region 15 is bent.

[0068] The contact element 11 is designed to reduce mechanical stress between the first contact element 8a and the sensor chip 3. The contact element 11 includes an additional spring arranged at the free end of the second contact area 13. In this embodiment, the contact element 11 has a flat shape. The contact element 11 rests completely on the upper electrode 3a of the sensor chip 3.

[0069] The sensor configuration 1 further includes the aforementioned insulating body 7. The insulating body 7 increases the electrical resistance and moisture resistance of the sensor configuration 1. It includes a thermosetting epoxy material with a glass transition at a temperature close to 200°C.

[0070] The material of the insulating body 7 (insulating material) completely covers the sensor chip 3, the contact elements 11 and the second contact areas 13. The free ends 14 of the first contact areas 12 are also completely located within the insulating body 7.

[0071] However, the first contact areas 12, in particular the top surface of the first contact areas 12, are free of the insulating material of the insulating body 7. In other words, they protrude from the insulating body 7 and thus act as outer electrodes 6 of the sensor arrangement 1.

[0072] Moreover, the insulating body 7 covers only a part of the substrate 2. The material of the insulating body 7 is at least partially arranged on the upper surface 2a of the substrate 2. In particular, the insulating material covers the part of the surface of the substrate 2 to which the sensor chip 3 and the contact elements 8a, 8b are connected. The connections between the contact elements 8a, 8b and the substrate 2, as well as the connections between the sensor chip 3 and the substrate 2, are thus completely packaged by the material of the insulating body 7.

[0073] 1, however, the material of the insulating body 7 does not protrude above the top surface 2a of the substrate 2. The side surface 2b and the bottom surface 2c of the substrate 2 are free of the material of the insulating body 7. This part free of insulating material functions as the sensing part of the sensor arrangement 1.

[0074] The above-mentioned design and materials of sensor configuration 1 provide sensor configuration 1 with high surface sensitivity, high voltage resistance, high moisture resistance, and high operating temperature (up to 200° C.).

[0075] 2 shows a sensor arrangement 1 for temperature measurement according to a second embodiment. The sensor arrangement 1 comprises the same components as the sensor arrangement 1 described above, namely a substrate 2, a sensor chip 3, contact elements 8a, 8b with first and second contact areas 12, 13, and an insulating body 7. For these components, see the description of FIG. 1.

[0076] In contrast to the sensor arrangement described in connection with Fig. 1, the contact member 11 of the first contact element 8a is not flat but has an arcuate shape. Thus, the contact member 11 does not lie completely, i.e. over its entire extension, on the upper electrode 3a of the sensor chip 3. Rather, it is joined to the upper electrode 3 only in a small area, namely the central area 16. Side areas 17 surrounding the central area 16 of the contact member 11 are bent upwards towards the upper surface of the sensor arrangement 1.

[0077] This design helps to further reduce the mechanical stress between the sensor chip 3 and the first contact element 8a. Moreover, the thickness variation of the sensor chip 3 may be compensated in a better way with the arcuate shape of the contact member 11.

[0078] 3 shows a sensor arrangement 1 for temperature measurement according to a third embodiment. The sensor arrangement 1 comprises the same components as the sensor arrangement 1 described above, namely a substrate 2, a sensor chip 3, contact elements 8a, 8b with first and second contact areas 12, 13, an insulating body 7 and a contact member 11. For these components, see the description of FIG. 1.

[0079] In contrast to the embodiment described above, the first contact area 12 is not formed on the top surface of the insulating body 7 / sensor arrangement 1. In this embodiment, the first contact area 12 is formed on the side of the insulating body 7 / sensor arrangement 1. Thus, the first contact surface 12 acting as the outer electrode 6 is accessible from the side of the sensor arrangement 1 to enable further processing.

[0080] Moreover, in this embodiment, the free ends 14 of the upper legs of each contact element 8a, 8b are not bent towards the first contact surface 12. Rather, the free ends extend along the sides of the insulating body 7 and are accessible from outside the insulating body 7.

[0081] As already explained in connection with FIG. 1, the contact area 12 does not protrude from the side surface but is integrated into it and forms part of it.

[0082] 4 and 5 diagrammatically show top views of a multi-chip package 10. The multi-chip package 10 includes multiple sensor chips 3, for example, two sensor chips 3 (see FIG. 4) or three sensor chips 3 (see FIG. 5). Of course, the multi-chip package 10 can include more than three sensor chips 3, for example, five or ten sensor chips 3.

[0083] The multi-chip package 10 can be electrically connected by outer electrodes 6 formed by first contact areas 12 of the contact elements 8a, 8b as described above. The contact elements 8a, 8b and the sensor chip 3 are bonded to a substrate 2 (not shown, see Figures 1-3) and embedded in an insulating body 7.

[0084] In the following, a method is described for manufacturing the sensor arrangement 1 and / or the multi-chip package 10. In particular, this method produces the aforementioned sensor arrangement 1 / multi-chip package 10.

[0085] The method includes the following steps.

[0086] A) In a first step, a ceramic-based substrate 2 is provided. The substrate 2 is a high-performance ceramic substrate with excellent electrical insulation and moisture resistance, and high thermal conductivity. The substrate 2 is made of Al 2 O 3 , ZTA, silicate, AlN or Si 3 N 4 Thereafter, a plurality of metallized pads 4 are disposed on the substrate 2. The metallized pads 4 are disposed on an upper surface 2a of the substrate 2.

[0087] B) In a second step, the bonding material 5 is provided. The bonding material 5 is a high melting point solder material with an operating temperature >200° C. The bonding material 5 is, for example, Pb 97.5 SnAg 1.5 , SnAg 0.3 Cu 0.7 or Sn 90 Sb 10 It may include:

[0088] One respective point of bonding material 5 is applied to a partial amount of metallized pad 4. In particular, one specific point of bonding material 5 is applied to one metallized pad 4 to enable electrical connection of one of the sensor chips 3. The bonding material 5 is dispensed or screen printed onto the partial amount of metallized pad 4.

[0089] C) In a further step, a number of sensor chips 3 are provided. The sensor chips 3 may be NTC or PTC chips or a combination thereof. A combination of NTC and PTC chips is used for applications where the temperature measurement is equipped with a safety function requirement. Each sensor chip 3 includes electrodes 3a arranged on the upper and lower sides of the sensor chip 3.

[0090] The sensor chips 3 are arranged on the substrate 2, in particular on the dot-like bonding material 5. The sensor chips 3 are arranged such that each sensor chip 3 is located on the substrate 2 in a horizontal position.

[0091] D) In ​​the next step, reflow soldering is performed. In this way, the lower electrodes 3a of each sensor chip 3 are electrically connected to the substrate 2. The lower electrodes 3a are connected to metallized pads 4 by means of a bonding material 5, such that each sensor chip 3 is placed on the substrate 2 in a horizontal position. In this way, the surface sensitivity of the sensor arrangement 1 / multi-chip package 10 is increased.

[0092] E) In a next step, the bonding material 5 is again, for example, screen printed or dispensed. The bonding material 5 is applied in dots to the upper electrodes 3a of each sensor chip 3.

[0093] Further dots of bonding material 5 are applied to the remaining metallized pads 4. In particular, two dots of bonding material 5 are applied to two of the metallized pads 4 to achieve one final sensor configuration 1. Thus, in this method step, a total of three dots of bonding material 5 are applied to obtain one final sensor configuration 1.

[0094] F) In a further step, a plurality of first and second contact elements 8a, 8b are provided, whereby a pair of contact elements 8a, 8b is provided for one sensor chip 3. Each contact element 8a, 8b comprises a first contact area 12 and a second contact area 13.

[0095] The first contact area 12 serves as the outer electrode 6 of the sensor arrangement 1 / multi-chip package 10 and is therefore accessible from the outside of the sensor arrangement 1 / multi-chip package 10 .

[0096] The second contact areas 13 are used to electrically connect the substrate 2 to the respective contact elements 8a, 8b. Each first contact element 8a includes a contact member 11 that is used to electrically connect the sensor chip 3 and the first contact element 8a.

[0097] One respective contact element 8a, 8b is arranged on one point of bonding material 5 arranged on the metallized pad 4. Moreover, the contact elements 8a, 8b are arranged such that the respective contact member 11 is arranged on a point of bonding material 5 arranged on the upper electrode 3a of the sensor chip 3. In other words, three points of bonding material 5 are required to electrically connect a pair of contact elements 8a, 8b to the substrate 2 and further electrically connect the first contact element 8a (in particular the contact member 11) to the sensor chip 3.

[0098] G) In a next step, reflow soldering is performed to electrically connect the contact elements 8a, 8b, in particular the second contact areas 13, with the metallized pads 4 and to electrically connect the contact members 11 with the upper electrodes 3a of the respective sensor chips 3.

[0099] H) The next step is packaging, whereby an insulating material is provided and an insulating body 7 is molded from the insulating material. The insulating material comprises a thermosetting epoxy material with a glass transition temperature close to 200°C.

[0100] The insulating body 7 is formed such that the insulating material covers at least a portion of the top surface 2a of the substrate 2. For example, circumferential edge regions of the top surface 2 may remain free of insulating material. However, the insulating material completely covers the connections between the contact elements 8a, 8b and the substrate 2, as well as the connections between the sensor chip 3 and the substrate 2.

[0101] The insulating material further completely covers the sensor chip 3, the second contact area 13 and the contact members 11. The first contact area 12 remains free of insulating material. Moreover, the side surface 2a and the bottom surface 2c of the substrate 2 also remain free of insulating material.

[0102] I) In the final step, singulation takes place, whereby the substrate 2 is cut into individual components to provide a number of sensor configurations 1. The cutting pattern can be different in order to obtain a multi-chip package 10. [Prior art documents] [Patent documents]

[0103] [Patent Document 1] US Patent Application Publication No. 2018 / 122537A [Patent Document 2] International Publication No. 96 / 04536A1 [Patent Document 3] US Patent Application Publication No. 2008 / 308886A [Patent Document 4] US Patent Application Publication No. 2017 / 352603A [Patent Document 5] Korean Patent Publication No. 2005 / 0112719A [Patent Document 6] US Patent Application Publication No. 2018 / 0306646AA [Explanation of symbols]

[0104] 1 Sensor configuration 2. Board 2a Top side 2b side 2c Bottom surface 3 Sensor chip 3a Sensor chip electrodes 4 Metallized Pads 5 Bonding materials 6 outer electrode 7 Insulation / Body 8a First Contact Element 8b Second Contact Element 9. Bar 10 Multi-chip packages 11 Contact material 12 First Contact Region 13 Second Contact Area 14 Free end 15 Central area 16 Lateral area

Claims

1. 1. A sensor arrangement for measuring temperature, comprising: - a ceramic-based substrate; at least one sensor chip connected directly to said substrate in a horizontal position by means of a bonding material; at least one first contact element and at least one second contact element constructed and arranged to act as outer electrodes of the sensor arrangement; an insulating body surrounding the sensor chip and at least a portion of the contact elements, a first contact element including a contact member constructed and arranged to electrically contact the sensor chip by the bonding material; the substrate is largely free of the material of the insulating body; the material of the insulating body is disposed directly over at least a portion of a top surface of the substrate, and a side surface and a bottom surface of the substrate are free of the material of the insulating body; the contact member is designed to reduce mechanical stress between the first contact element and the sensor chip; Sensor configuration.

2. The sensor arrangement of claim 1 , wherein the material of the insulating body is constructed and arranged to increase electrical resistance and moisture resistance of the sensor arrangement.

3. The sensor arrangement of claim 1 or 2, wherein each contact element comprises a U-shaped spring member.

4. A sensor arrangement according to any one of claims 1 to 3, wherein each contact element comprises a first contact area free of the material of the insulating body, the first contact area acting as the outer electrode of the sensor arrangement.

5. The sensor arrangement of claim 4 when relying on claim 3, wherein the first contact area is formed by one of two legs of the respective U-shaped spring member.

6. 6. The sensor arrangement of claim 1, wherein each contact element includes a second contact area disposed entirely within the insulating body, the second contact area being bonded to a metallized pad of the substrate to establish electrical contact between the contact element and the substrate.

7. The sensor arrangement of claim 6 when relying on claim 3, wherein the second contact area is formed by the other one of the two legs of each of the U-shaped spring members.

8. The sensor arrangement of claim 6 , wherein the contact member includes an additional spring disposed at a free end of the second contact area of ​​the first contact element.

9. The sensor arrangement of any one of claims 1 to 8, wherein the contact element comprises copper, brass or phosphor bronze.

10. The substrate is Al ２ O ３ , ZTA, silicate, AlN or Si ３ N ４ The sensor arrangement of any one of claims 1 to 9, comprising a ceramic.

11. The sensor arrangement according to any one of claims 1 to 10, wherein the sensor arrangement comprises at least one NTC sensor chip and / or at least one PTC sensor chip.

12. The sensor arrangement of any one of claims 1 to 11, wherein the bonding material comprises a high melting point solder material with an operating temperature >200°C.

13. A sensor arrangement according to any one of claims 1 to 12, wherein the sensor arrangement is configured to operate at high temperatures up to 200°C.

14. A sensor configuration as described in claim 1, wherein the first contact element and the contact member are integrally formed.

15. The sensor configuration of claim 1, wherein the contact member includes an arcuate shape.

16. A sensor configuration as described in claim 1, wherein the first contact element and the second contact element are elastically deformable to at least a certain degree.

17. The sensor configuration of claim 6, wherein in an intermediate region, the second contact region passes through and becomes the contact member, and the intermediate region is bent.

18. 1. A method of manufacturing a sensor arrangement for measuring temperature, comprising the steps of: A) providing a ceramic-based substrate and disposing a plurality of metallized pads on an upper surface of said substrate; B) providing a bonding material to at least a portion of the plurality of metallized pads; C) providing a plurality of sensor chips, each sensor chip including electrodes disposed on an upper and lower side of the sensor chip; D) reflow soldering to electrically connect one of the electrodes of each sensor chip to the substrate such that each sensor chip is disposed on the substrate in a horizontal position; E) providing the bonding material to one of the electrodes and at least a portion of the metallized pads of each sensor chip; F) providing a plurality of first and second contact elements, each contact element including a first contact region and a second contact region, each first contact element including a contact member; G) reflow soldering to electrically connect the second contact area with the metallized pad and to electrically connect the contact member with another one of the electrodes of the sensor chip; H) packaging the top surface of the substrate with an insulating material; I) singulating the packaged substrate; method.

19. 20. The method of claim 18, wherein step H) comprises providing an insulating material and forming an insulating body such that the insulating material covers at least a portion of a surface of the substrate to which the sensor chip and the second contact area are connected.

20. 20. The method of claim 19, wherein the insulating material completely covers the sensor chip, the second contact area and the contact members, and the first contact area is free of insulating material.

21. The substrate is Al ２ O ３ , ZTA, silicate, AlN or Si ３ N ４ The method of any one of claims 18 to 20, comprising a ceramic.

22. The method according to any one of claims 18 to 21, wherein the sensor chip comprises a plurality of NTC sensor chips and / or PTC sensor chips.

23. The method of any one of claims 18 to 22, wherein the bonding material comprises a high melting point solder material with an operating temperature >200°C.

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