Gaming Machines
Patent Information
- Application Number
- JP2022049333
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-03-25
- Publication Date
- 2025-01-08
- Estimated Expiration
- 2042-03-25
AI Technical Summary
【0008】 上記構成の遊技機によれば、遊技の興趣を向上させることができる。
Smart Images

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Abstract
Claims
1. A substrate having a first surface portion on which a plurality of types of components are arranged and a second surface portion to which lead wires of the plurality of types of components are soldered, the plurality of types of parts include a first part, a second part having the same performance as the first part, a third part having a different performance from the first part, and a fourth part having a different performance from the first part, the second part, and the third part; The first component has a lead 1a and a lead 1b, The second component has a lead wire 2a and a lead wire 2b, The third component has a lead wire 3a and a lead wire 3b, The fourth component has a plurality of leads 4; a lead wire 1 a of the first component is inserted into a through hole of the board from the first surface portion side, and the lead wire 1 a protruding from the second surface portion forms an angle of n1 degrees with respect to a predetermined imaginary line 1 connecting a position where the lead wire 1 a protrudes from the second surface portion and a position where the lead wire 1 b is inserted into a through hole of the board from the first surface portion side and protrudes from the second surface portion when the board is in a predetermined orientation and the second surface portion is viewed in plan; the lead wire 1b of the first component is inserted into a through hole of the board from the first surface portion side, and the lead wire 1b protruding from the second surface portion forms an angle of n2 degrees with respect to the predetermined imaginary line segment 1; a lead wire 2a of the second component is inserted into a through hole of the board from the first surface portion side, and the lead wire 2a protruding from the second surface portion forms an angle of n3 degrees with respect to a predetermined imaginary line segment 2 connecting a position where the lead wire 2a protrudes from the second surface portion and a position where the lead wire 2b is inserted into the through hole of the board from the first surface portion side and protrudes from the second surface portion when the board is in the predetermined orientation and the second surface portion is viewed in plan; the lead wire 2b of the second component is inserted into the through hole of the board from the first surface portion side, and the lead wire 2b protruding from the second surface portion forms an angle of n4 degrees with respect to the predetermined imaginary line segment 2; a lead wire 3a of the third component is inserted into a through hole of the board from the first surface portion side, and the lead wire 3a protruding from the second surface portion forms an angle of n5 degrees with respect to a predetermined imaginary line 3 connecting a position where the lead wire 3a protrudes from the second surface portion and a position where the lead wire 3b is inserted into the through hole of the board from the first surface portion side and protrudes from the second surface portion when the board is in the predetermined orientation and the second surface portion is viewed in plan; the lead wire 3b of the third component is inserted into the through hole of the board from the first surface portion side, and the lead wire 3b protruding from the second surface portion forms an angle of n6 degrees with respect to the predetermined imaginary line segment 3; The n1 degree and the n3 degree are substantially the same angle, The n2 degrees and the n4 degrees are substantially the same angle, The n1 degree and the n5 degree are different angles, the plurality of lead wires 4 of the fourth component are inserted into through holes of the board from the first surface portion side, and a height of the plurality of lead wires 4 protruding from the second surface portion is higher than a height of the lead wires 3 a and 3 b protruding from the second surface portion; A gaming machine characterized in that the multiple lead wires 4 of the fourth component are stronger and less prone to bending than the lead wires 1a, 1b, 2a and 2b.
2. A substrate having a first surface portion on which a plurality of types of components are arranged and a second surface portion to which lead wires of the plurality of types of components are soldered, the plurality of types of components include a first resistance component, a second resistance component having the same performance as the first resistance component, a capacitor component having a different performance from the first resistance component, and an IC driver having a different performance from the first resistance component, the second resistance component, and the capacitor; The first resistance component has a lead wire 1a and a lead wire 1b, The second resistance component has a lead wire 2a and a lead wire 2b, The capacitor component has a lead wire 3a and a lead wire 3b, The IC driver has a plurality of leads 4, a lead wire 1 a of the first resistance component is inserted into a through hole of the board from the first surface portion side, and the lead wire 1 a protruding from the second surface portion forms an angle of n1 degrees with a predetermined imaginary line 1 connecting a position where the lead wire 1 a protrudes from the second surface portion and a position where the lead wire 1 b is inserted into the through hole of the board from the first surface portion side and protrudes from the second surface portion when the board is in a predetermined orientation and the second surface portion is viewed in plan; a lead wire 1b of the first resistance component is inserted into a through hole of the board from the first surface portion side, and the lead wire 1b protruding from the second surface portion forms an angle of n2 degrees with respect to the predetermined imaginary line segment 1; a lead wire 2a of the second resistance component is inserted into a through hole of the board from the first surface side, and the lead wire 2a protruding from the second surface forms an angle of n3 degrees with a predetermined imaginary line 2 connecting a position where the lead wire 2a protrudes from the second surface and a position where the lead wire 2b is inserted into the through hole of the board from the first surface side and protrudes from the second surface when the board is in the predetermined orientation and the second surface is viewed in plan; a lead wire 2b of the second resistance component is inserted into a through hole of the board from the first surface portion side, and the lead wire 2b protruding from the second surface portion forms an angle of n4 degrees with respect to the predetermined imaginary line segment 2; when the second surface portion is viewed in a plan view with the substrate in the predetermined orientation, the lead wire 3a of the capacitor component forms an angle of n5 degrees with respect to a predetermined imaginary line 3 connecting a position where the lead wire 3a protrudes from the second surface portion and a position where the lead wire 3b is inserted into a through hole of the substrate from the first surface portion side and protrudes from the second surface portion, a lead wire 3b of the capacitor component is inserted into a through hole of the board from the first surface portion side, and the lead wire 3b protruding from the second surface portion forms an angle of n6 degrees with respect to the predetermined imaginary line segment 3; The n1 degree and the n3 degree are substantially the same angle, The n2 degrees and the n4 degrees are substantially the same angle, The n1 degree and the n5 degree are different angles, the plurality of lead wires 4 of the IC driver are inserted into through holes of the board from the first surface portion side, and a height of the plurality of lead wires 4 protruding from the second surface portion is higher than a height of the lead wires 3 a and 3 b protruding from the second surface portion; The gaming machine is characterized in that the plurality of lead wires 4 of the IC driver are stronger and less prone to bending than the lead wires 1a, 1b, 2a and 2b.
Citation Information
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