Molecular sieve sound absorbing material, its manufacturing method and speaker
A modified molecular sieve sound absorbing material with a specific silicon-to-aluminum ratio and phosphorus treatment ensures stability and sound quality under high temperature and humidity, addressing the deactivation issues of conventional materials.
Patent Information
- Application Number
- JP2022581590
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2022-08-19
- Filing Date
- 2022-09-28
- Publication Date
- 2025-01-08
- Estimated Expiration
- 2042-09-28
AI Technical Summary
Conventional sound-absorbing materials for speakers deteriorate in sound quality and generate noise under high temperature and high humidity conditions due to irreversible deactivation of molecular sieves, especially those with low silica alumina ratios.
A modified molecular sieve sound absorbing material is developed with a specific silicon-to-aluminum mass ratio and phosphorus element modification, combined with an adhesive, to enhance stability and maintain sound-absorbing performance under high temperature and humidity.
The modified molecular sieve maintains superior sound-absorbing performance for extended periods in environments ranging from 50°C to 150°C and 60% to 100% relative humidity, outperforming unmodified materials.
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Abstract
Description
[Technical field]
[0001] The present invention relates to the field of materials technology, and in particular to a molecular sieve sound absorbing material and its manufacturing method and speaker. [Background technology]
[0002] With the development of portable electronic devices such as smartphones and Bluetooth earphones, people's requirements for sound quality are also becoming higher and higher. In order to improve the sound quality and improve the sound effect of the speaker, one of the common methods currently adopted is to fill the speaker back chamber with sound-absorbing material to increase the volume of the virtual back chamber, thereby improving the sound quality.
[0003] Molecular sieves, as a material with a high specific surface area, can continuously adsorb and desorb the air in the chamber when the chamber vibrates, thereby indirectly achieving the effect of increasing the chamber volume, and therefore are commonly used sound-absorbing materials in speaker back chambers. However, when a speaker operates in a high-temperature and high-humidity environment for a long period of time, the sound quality may deteriorate and even noise may be generated. This is because molecular sieves, especially low-silica-alumina ratio molecular sieves, are prone to irreversible inactivation under high-temperature and high-humidity conditions, which increases the F0 value and further deteriorates the sound quality and generates noise.
[0004] Therefore, there is a need to develop a molecular sieve sound absorbing material that has excellent reliability in high temperature and high humidity environments. Summary of the Invention [Problem to be solved by the invention]
[0005] The present invention provides a molecular sieve sound-absorbing material, a manufacturing method thereof, and a speaker, in order to solve the problem that conventional sound-absorbing materials for speakers are prone to irreversible inactivation under high temperature and high humidity conditions, which increases the F0 value, deteriorates sound quality, and generates noise. [Means for solving the problem]
[0006] According to a first aspect of the present invention, the present invention provides a molecular sieve sound-absorbing material, the sound-absorbing material comprising a modified molecular sieve and an adhesive, the mass of the adhesive accounting for 2% to 10% of the mass of the modified molecular sieve, the modified molecular sieve being obtained by subjecting the molecular sieve to a phosphorus element modification treatment, the mass ratio of silicon to aluminum in the molecular sieve being (50 to 800): 1, and the molar ratio of phosphorus element to aluminum element in the modified molecular sieve being (0.1 to 2): 1.
[0007] In accordance with the first aspect, in a possible embodiment, the phosphorus source used in the phosphorus element modification treatment is one or more of phosphoric acid, ammonium phosphate, and ammonium hydrogen phosphate.
[0008] In a possible embodiment, the adhesive is one or more of the following: polyacrylic acid ester, polystyrene acrylic acid ester, polystyrene acetate ester, polyurethane resin, polyethylene ethylene acetate salt.
[0009] In a possible embodiment, the molecular sieve comprises one or more of the following structure types: MFI, FER, MEL.
[0010] According to a second aspect of the present invention, there is further provided a method for producing the sound absorbing material as described above, the method comprising the steps of: Step S1: uniformly mixing a molecular sieve and water to obtain a molecular sieve slurry; Step S2: adding phosphorus source to the molecular sieve slurry obtained in step S1, ultrasonically immersing the molecular sieve slurry by ultrasonic microwave immersion method, filtering the immersed solution, taking the cake, drying and polishing the cake to obtain intermediate molecular sieve powder; Step S3: calcining the intermediate molecular sieve powder obtained in step S2 to obtain a modified molecular sieve; Step S4: uniformly mixing the modified molecular sieve obtained in step S3 with water, and then adding an adhesive to obtain a suspension; Step S5: molding the suspension and obtaining the molecular sieve sound-absorbing material after drying.
[0011] In accordance with the second aspect, in a feasible embodiment, in the step S1, the weight / volume ratio of the molecular sieve to the water is (10-30):(150-250).
[0012] In a feasible embodiment, in step S2, the ultrasonic device used in the ultrasonic microwave immersion method is a probe type ultrasonic wave, the microwave heating temperature of the ultrasonic microwave immersion method is 60°C to 90°C, and the ultrasonic immersion time of the ultrasonic microwave immersion method is 0.5h to 2h.
[0013] In a possible embodiment, in step S4, the weight ratio of the modified molecular sieve, the water, and the adhesive is 1:(0.6-1.5):(0.02-0.10).
[0014] In a possible embodiment, in step S5, the drying method comprises one or more of freeze drying, vacuum drying, and atmospheric drying.
[0015] According to a third aspect of the present invention, the present invention further provides a speaker comprising: a housing having an accommodating space; a sound-producing element disposed within the housing; and a back chamber surrounded by the sound-producing element and the housing, the back chamber being filled with the sound-absorbing material. Effect of the Invention
[0016] The beneficial effects of the present invention are as follows:
[0017] The molecular sieve sound-absorbing material of the present invention comprises a modified molecular sieve, which is obtained by subjecting the molecular sieve to phosphorus element modification treatment. The phosphorus element enters the molecular sieve skeleton and combines with silicon and aluminum in the skeleton to form P~O~Si and P~O~Al structures, which has the effect of enhancing the stability of the molecular sieve skeleton. Therefore, the obtained modified molecular sieve has a stable skeleton structure and is better resistant to steam hydrolysis under high temperature. The application of such modified molecular sieve to a sound-absorbing material can ensure that the sound-absorbing material maintains good sound-absorbing performance even under high temperature and high humidity conditions.
[0018] By limiting the molar ratio of phosphorus element to aluminum element in the modified molecular sieve to (0.1-2):1, the stability of the resulting modified molecular sieve framework can be improved, the resistance to steam hydrolysis under high temperature can be better, and the sound absorbing performance of the sound absorbing material can be more effectively guaranteed. If the phosphorus of the modified molecular sieve is too little, it cannot form sufficient coordinate bonds and cannot effectively protect the molecular sieve framework, but if the phosphorus content in the framework is high, the phosphorus species may block some of the molecular sieve pores, which may affect the molecular sieve's adsorption ability for gas.
[0019] The present invention further limits the mass ratio of silicon and aluminum in the molecular sieve, and the reasonable silicon / aluminum mass ratio can ensure the stability of the molecular sieve framework structure, and further ensure the stability of the modified molecular sieve framework structure. The sound-absorbing material of the present invention further comprises an adhesive, and adding the adhesive to the sound-absorbing material is for increasing the viscosity of the molecular sieve slurry to better form spherical particles, and the present invention limits the mass of the adhesive to 2%-10% of the mass of the modified molecular sieve, so that the viscosity of the molecular sieve slurry can be guaranteed and the spherical particles can be better formed.
[0020] The sound absorbing material of the present invention can be used for a long period of time under conditions of a temperature of 50° C. to 150° C. and a humidity of 60 to 100% rh, and its performance is clearly superior to that of unmodified molecular sieve sound absorbing materials.
[0021] It is to be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the invention. [Brief description of the drawings]
[0022] The drawings herein are incorporated in and constitute a part of the specification, are illustrative of the embodiments of the invention, and together with the specification serve to explain the principles of the invention. [Figure 1] 1 is a schematic diagram showing the internal structure of a speaker provided by the present invention. [Diagram 2] 1 is a comparison diagram of the results of a high-temperature, high-humidity test in which Example 1 of the present invention and Comparative Example 1 were continuously monitored for 5 days. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0023] In order to better understand the technical solution of the present invention, the following detailed description of the embodiments of the present invention is given with reference to the accompanying drawings.
[0024] It is clear that the described embodiments are only some of the embodiments of the present invention, and are not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are included in the protection scope of the present invention.
[0025] The terms used in the embodiments of the present invention are intended to describe particular embodiments only and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly dictates otherwise.
[0026] The term "and / or" used in this specification is only to describe the related relationship of related objects, and three types of relationships may exist, for example, A and / or B should be understood to have three situations: A exists alone, A and B exist simultaneously, and B exists alone. Note that the sign " / " generally means that the preceding and following related objects are in an "or" relationship.
[0027] In addition, terms indicating directions such as "upper", "lower", "left", and "right" described in the embodiments of the present invention are described from the angles shown in the drawings, and should not be construed as limiting the embodiments of the present invention. Furthermore, in this context, when an element is described as being connected "upper" or "lower" to another element, it should be understood that it may not only be directly connected "upper" or "lower" to the other element, but may also be indirectly connected "upper" or "lower" to the other element through an intermediate element.
[0028] In a first aspect, the present invention provides a molecular sieve sound-absorbing material, the sound-absorbing material comprising a modified molecular sieve and an adhesive, the mass of the adhesive accounting for 2% to 10% of the mass of the modified molecular sieve, the modified molecular sieve being obtained by subjecting a molecular sieve to a phosphorus element modification treatment, a mass ratio of silicon to aluminum in the molecular sieve being (50 to 800): 1, and a molar ratio of phosphorus element to aluminum element in the modified molecular sieve being (0.1 to 2): 1.
[0029] Preferably, the percentage content of the mass of the adhesive relative to the mass of the modified molecular sieve may be 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, etc., and of course may be other values within the above range, and is not limited here. The adhesive may be selected from one or more of polyacrylic acid ester, polystyrene acrylic acid ester, polystyrene acetate ester, polyurethane resin, and polyethylethylene acetate salt. The solid content of the adhesive may be 35% to 60%, specifically 35%, 40%, 45%, 50%, 55%, 60%, etc., and of course may be other values within the above range, and is not limited here.
[0030] Preferably, the mass ratio of silicon to aluminum in the molecular sieve may be 50:1, 100:1, 200:1, 300:1, 400:1, 500:1, 600:1, 700:1, or 800:1, etc., and of course may be other values within the above range, and is not limited thereto.
[0031] Preferably, the molar ratio of phosphorus element to aluminum element in the modified molecular sieve is 0.1:1, 0.25:1, 0.5:1, 0.75:1, 1:1, 1.25:1, 1.5:1, 1.75:1 or 2:1, etc., and of course, it may be other values within the above range, and is not limited here. Preferably, the molar ratio of phosphorus element to aluminum element in the modified molecular sieve is (0.5-1.5):1.
[0032] In the above technical solution, the sound-absorbing material comprises a modified molecular sieve, which is obtained by subjecting the molecular sieve to phosphorus element modification treatment. The phosphorus element enters the molecular sieve skeleton and combines with silicon and aluminum in the skeleton to form P~O~Si and P~O~Al structures, which has the effect of enhancing the stability of the molecular sieve skeleton. Therefore, the obtained modified molecular sieve has a more stable skeleton structure and better resistance to steam hydrolysis under high temperature. The application of such modified molecular sieve to a sound-absorbing material can ensure that the sound-absorbing material maintains good sound-absorbing performance even under high temperature and high humidity conditions.
[0033] By limiting the molar ratio of phosphorus element to aluminum element in the modified molecular sieve to (0.1-2):1, the stability of the resulting modified molecular sieve framework can be improved, the resistance to steam hydrolysis under high temperature can be better, and the sound absorbing performance of the sound absorbing material can be more effectively guaranteed. If the phosphorus of the modified molecular sieve is too little, it cannot form sufficient coordinate bonds and cannot effectively protect the molecular sieve framework, but if the phosphorus content in the framework is high, the phosphorus species may block some of the molecular sieve pores, which may affect the molecular sieve's adsorption ability for gas.
[0034] The present invention further limits the mass ratio of silicon and aluminum in the molecular sieve, and the reasonable silicon / aluminum mass ratio can ensure the stability of the molecular sieve framework structure, and further ensure the stability of the modified molecular sieve framework structure. The sound-absorbing material of the present invention further includes an adhesive, and adding the adhesive to the sound-absorbing material is to increase the viscosity of the molecular sieve slurry to better form spherical particles, and the present invention limits the mass of the adhesive to 2%-10% of the mass of the modified molecular sieve, so that the viscosity of the molecular sieve slurry can be guaranteed and the spherical particles can be better formed. The sound-absorbing material of the present invention can be used for a long time under the conditions of a temperature of 50°C to 150°C and a humidity of 60% to 100%rh, and its performance is obviously superior to that of unmodified molecular sieve sound-absorbing materials.
[0035] As an optional technical solution of the present invention, the phosphorus source used in the phosphorus element modification treatment may be one or more of phosphoric acid, ammonium phosphate and ammonium hydrogen phosphate, and is of course not limited to these phosphorus sources.
[0036] As an optional technical solution of the present invention, the adhesive is one or more of polyacrylic acid ester, polystyrene acrylic acid ester, polystyrene acetate ester, polyurethane resin, and polyethylene acetate salt.
[0037] As an optional technical solution of the present invention, the molecular sieve has one or more of the structure types of MFI, FER, MEL, etc.
[0038] As can be seen, by specifically limiting the type of phosphorus source, the type of adhesive, and the structure of the molecular sieve, a higher synergistic effect can be achieved between the raw materials for producing the sound-absorbing material, and the sound-absorbing material can maintain better sound-absorbing performance even under high temperature and high humidity conditions.
[0039] In a second aspect, the present invention further provides a method for producing the sound absorbing material as described above, the method comprising the steps of: Step S1: uniformly mixing a molecular sieve and water to obtain a molecular sieve slurry; Step S2: adding phosphorus source to the molecular sieve slurry obtained in step S1, ultrasonically immersing the molecular sieve slurry by ultrasonic microwave immersion method, filtering the immersed solution, taking the cake, drying and polishing the cake to obtain intermediate molecular sieve powder; Step S3: calcining the intermediate molecular sieve powder obtained in step S2 to obtain a modified molecular sieve; Step S4: uniformly mixing the modified molecular sieve obtained in step S3 with water, and then adding an adhesive to obtain a suspension; Step S5: molding the suspension and obtaining the molecular sieve sound-absorbing material after drying.
[0040] Alternatively, in step S2, the specific steps of filtering the soaked solution and removing and drying the cake may be to suction filter the soaked solution, and repeatedly wash and filter the filtered solid with deionized water, and then dry it in an oven at 120°C.
[0041] Alternatively, the suspension can be processed to obtain a final sound-absorbing material by rationally selecting a corresponding molding means according to specific use demands. The molding methods include, but are not limited to, granulating the suspension by spraying or other methods and then drying to obtain a granular sound-absorbing material resistant to high temperatures and high humidity, molding the suspension in a specific mold and then drying to obtain a block-shaped sound-absorbing material resistant to high temperatures and high humidity, supporting the suspension on a porous material, such as an organic foam, activated carbon foam, etc., and drying to obtain a foam-based sound-absorbing material resistant to high temperatures and high humidity, and obtaining a sheet-shaped or film-shaped sound-absorbing material by coating or printing.
[0042] In the above technical solution, the molecular sieve immersion modification method is an ultrasonic microwave immersion method, in which ultrasonic immersion has a better dispersion effect than normal immersion due to the cavitation effect of ultrasonic waves, and phosphorus is more uniformly dispersed in the molecular sieve framework. The dielectric heating effect and deep penetration properties of microwave heating provide better heat conduction efficiency and heat reception uniformity than normal water bath.
[0043] As an optional technical solution of the present invention, in step S1, the weight / volume ratio of the molecular sieve to the water is (10-30):(150-250). Note that the weight / volume ratio refers to the unit of the molecular sieve being grams and the unit of the water being milliliters.
[0044] Preferably, the weight / volume ratio of the molecular sieve to the water may be 10:150, 10:200, 10:250, 20:150, 20:200, 20:250, 30:150, 30:200 or 30:250, etc., and of course may be other values within the above range, and is not limited here. As can be understood, by limiting the weight / volume ratio of the molecular sieve to the water, a molecular sieve slurry with an appropriate concentration can be obtained, which can contribute to the subsequent phosphorus modification treatment step.
[0045] As an optional technical solution of the present invention, in step S2, the ultrasonic device used in the ultrasonic microwave immersion method is a probe type ultrasonic wave. The microwave heating temperature of the ultrasonic microwave immersion method is 60°C to 90°C. The ultrasonic immersion time of the ultrasonic microwave immersion method is 0.5h to 2h.
[0046] Alternatively, the microwave heating temperature of the ultrasonic microwave immersion method may be 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, or 90°C, etc., and of course may be other values within the above range, and is not limited thereto.
[0047] Alternatively, the ultrasonic immersion time of the ultrasonic microwave immersion method may be 0.5h, 0.8h, 1h, 1.2h, 1.5h, 1.8h or 2h, etc., and of course may be other values within the above range, and is not limited thereto.
[0048] As can be understood, by limiting the ultrasonic device, microwave heating temperature and ultrasonic immersion time used in the ultrasonic microwave immersion method, phosphorus can be more uniformly dispersed in the molecular sieve framework and the dispersion efficiency can be improved.
[0049] As an optional technical solution of the present invention, in step S3, the firing temperature is 400°C to 600°C.
[0050] Alternatively, the firing temperature may be 400°C, 420°C, 450°C, 480°C, 500°C, 550°C, 580°C, or 600°C, etc., and of course may be other values within the above ranges, and are not limited thereto.
[0051] As an optional technical solution of the present invention, in step S3, the baking time is 0.5 h to 1.5 h.
[0052] Alternatively, the baking time may be 0.5h, 0.6h, 0.7h, 0.8h, 0.9h, 1.0h, 1.1h, 1.2h, 1.3h, 1.4h, or 1.5h, etc., and of course may be other values within the above ranges, and is not limited thereto.
[0053] As can be seen, by limiting the calcination temperature and time, a modified molecular sieve with a stable structure can be obtained.
[0054] In some specific embodiment modes, the step S5 of molding the suspension specifically includes dispersing the suspension into droplets of uniform size using a granulator, and then sending the droplets into a cooling tower to freeze them into solid particles a. By such molding, a microspherical sound-absorbing material can be obtained.
[0055] In some specific embodiments, the step S5 of molding the suspension specifically includes the steps of first filtering the suspension with a screen to remove undispersed large particles, dispersing the suspension into droplets of uniform size with a granulator, and then sending the droplets into a cooling tower to freeze them into solid particles a. By such molding, a microspherical sound-absorbing material can be obtained.
[0056] In some specific embodiments, the step S5 of molding the suspension specifically includes the steps of first filtering the suspension through a screen to remove undispersed large particles, and then putting the suspension into a molding die for molding, so as to obtain a block-shaped sound-absorbing material.
[0057] In some specific embodiment modes, in step S5, molding the suspension comprises the steps of first filtering the suspension through a screen to remove undispersed large particles, and then immersing the suspension in a porous material, which may be organic foam, carbon fiber foam, etc. Through such molding, a foam-based sound-absorbing material can be obtained.
[0058] As an optional technical solution of the present invention, in step S4, the weight ratio of the modified molecular sieve, the water and the adhesive is 1:(0.6-1.5):(0.02-0.10).
[0059] As an optional technical solution of the present invention, in step S5, the drying method includes one or more of freeze drying, vacuum drying, and atmospheric drying.
[0060] In some specific embodiment modes, the specific step of the drying is to put the frozen solid particles a into a freezing oven and dry them for 12 hours, obtain solid particles b after all the ice in the particles is sublimated, and then put the solid particles b into an oven at 100°C to 150°C and dry them for 2 hours.
[0061] In some specific embodiment modes, the specific step of drying is to put the frozen solid particles a into a vacuum oven at -40°C for 12 hours and then dry the dried particles in an oven at 110°C for 2 hours.
[0062] In a third aspect, the present invention further provides a speaker, and as shown in FIG. 1, the speaker 10 comprises a housing 1 having an accommodation space, a sound-producing element 2 arranged in the housing 1, and a back chamber 3 surrounded by the sound-producing element 2 and the housing 1, and the back chamber 3 is filled with the sound-absorbing material of the present invention.
[0063] As can be understood, the above-mentioned sound-absorbing material of the present invention can be filled into the resonating chamber of a speaker to adapt to high temperature and high humidity environments. Such speakers can be applied to electronic devices such as smart watches, mobile phones, tablets, earphones, smart audio, and notebook computers.
[0064] In the following, the embodiments of the present invention will be described in a single set of embodiments, but the embodiments of the present invention are not limited to the following specific embodiments. Appropriate modifications can be made within the scope of protection.
[0065] [Example 1] The method for producing the molecular sieve sound absorbing material is carried out according to the following steps.
[0066] In step S1, 20 g of ZSM-5 (MFI) zeolite is weighed and added to 200 ml of deionized water, and stirred uniformly to obtain a molecular sieve slurry.
[0067] In step S2, (NH4)2HPO4 having a molar ratio of 1:1 by mass to Al in ZSM-5 (MFI) zeolite is weighed and added to the molecular sieve slurry, followed by ultrasonic immersion at 80°C for 1 hour using microwaves.
[0068] After immersion, the solution is filtered, the cake is taken and repeatedly washed with deionized water, and then dried in an oven at 120°C.
[0069] In step S3, the solid obtained in step S2 is calcined in a muffle furnace at 500° C. for 1 h, then removed and ground into powder to obtain a modified molecular sieve.
[0070] In step S4, 20 g of the modified molecular sieve, 20 g of deionized water, and 2 g of acrylic binder are weighed and mixed uniformly, and stirred at room temperature for 2 hours to obtain a suspension.
[0071] In step S5, the suspension obtained in step S4 is dispersed into small droplets of uniform size using a granulator, and the droplets are sent to a cooling tower where they are frozen to become solid particles.
[0072] The solid particles are dried in a vacuum oven at -40°C for 12 hours, and then dried in an oven at 110°C for 2 hours. The solid particles obtained are the high temperature and humidity resistant molecular sieve sound-absorbing microsphere material.
[0073] [Comparative Example 1] This comparative example differs from Example 1 in that steps S1 to S3 are omitted and sound-absorbing microspheres are produced using unmodified ZSM-5 (MFI) molecular sieve raw powder as is.
[0074] [Experimental Example] 1. Acoustic measurement The resonant frequency of the speaker is identified by measuring the frequency dependent resistance and its phase, and its corresponding zero crossing. A speaker with a 0.5ml back chamber and a 11mm*15mm*3mm sound generating unit is connected to an impedance analyzer, and microspheres with a diameter of 300-350μm are selected to fill the back chamber of the speaker, and the offset value of F0, i.e. F0, is calculated by comparing with the empty chamber.
[0075] 2. High temperature and humidity test After the initial performance test, Example 1 and Comparative Example 1 of the present invention were both placed in a high temperature and humidity tank at 85° C. / 85% rh, and were taken out every 24 hours and placed at room temperature for 1 hour, after which F0 was measured. The results of the high temperature and humidity test, which was continuously monitored for 5 days, are shown in FIG. 2.
[0076] From Figure 2, it can be seen that the phosphorus-modified molecular sieve sound-absorbing microspheres do not lose their performance obviously even after being left in a high temperature and high humidity environment for more than one day, while the performance loss of the non-phosphorus-modified molecular sieve sound-absorbing microspheres is twice as much after being left in a high temperature and high humidity environment for more than one day. The results show that the phosphorus-modified molecular sieve sound-absorbing material has better resistance to high temperature and high humidity.
[0077] The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention. [Explanation of symbols]
[0078] 1. Housing 2. Single pronunciation 3 Back Chamber 10 Speaker
Claims
1. A molecular sieve sound-absorbing material, comprising a modified molecular sieve and an adhesive, the mass of the adhesive accounting for 2% to 10% of the mass of the modified molecular sieve, the modified molecular sieve being obtained by subjecting the molecular sieve to a phosphorus element modification treatment, the mass ratio of silicon to aluminum in the molecular sieve being (50 to 100):1, and the molar ratio of phosphorus element to aluminum element in the modified molecular sieve being (0.1 to 2):
1.
2. 2. The molecular sieve sound absorbing material according to claim 1, wherein the phosphorus source used in the phosphorus element modification treatment is one or more of phosphoric acid, ammonium phosphate and ammonium hydrogen phosphate.
3. 2. The molecular sieve sound absorbing material of claim 1, wherein the adhesive is one or more of polyacrylic acid ester, polystyrene acrylic acid ester, polystyrene acetate ester, polyurethane resin, and polyethylene acetate salt.
4. 2. The molecular sieve sound absorbing material of claim 1, wherein the molecular sieve comprises one or more of the following structure types: MFI, FER, MEL, etc.
5. A method for producing the sound absorbing material according to any one of claims 1 to 4, comprising the steps of: Step S1: uniformly mixing a molecular sieve and water to obtain a molecular sieve slurry; Step S2: adding a phosphorus source to the molecular sieve slurry obtained in step S1, and ultrasonically immersing the slurry by ultrasonic microwave immersion method, filtering the immersed solution, taking the cake, drying and polishing the cake to obtain an intermediate molecular sieve powder; Step S3: calcining the intermediate molecular sieve powder obtained in step S2 to obtain a modified molecular sieve; Step S4: uniformly mixing the modified molecular sieve obtained in step S3 with water, and then adding an adhesive to obtain a suspension; and step S5: subjecting the suspension to a molding process and drying to obtain the molecular sieve sound-absorbing material.
6. 6. The method for producing a sound-absorbing material according to claim 5, wherein in step S1, a weight / volume ratio of the molecular sieve to the water is (10-30):(150-250).
7. In the step S2, the ultrasonic device used in the ultrasonic microwave immersion method is a probe-type ultrasonic wave, the microwave heating temperature in the ultrasonic microwave immersion method is 60 ° C to 90 ° C, and the ultrasonic immersion time in the ultrasonic microwave immersion method is 0.5h to 2h. The method for producing a sound-absorbing material according to claim 5.
8. The method for producing a sound-absorbing material according to claim 5, wherein in step S4, a weight ratio of the modified molecular sieve, the water, and the adhesive is 1:(0.6-1.5):(0.02-0.10).
9. The method for producing a sound-absorbing material according to claim 5, wherein in step S5, the drying method includes one or more of freeze drying, vacuum drying, and atmospheric drying.
10. A speaker comprising: a housing having an accommodating space; a sound-emitting element disposed within the housing; and a back chamber surrounded by the sound-emitting element and the housing, the back chamber being filled with the sound-absorbing material according to any one of claims 1 to 4.
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