Standoff distance monitoring and control of directed energy deposition additive manufacturing systems

Abstract

Additive manufacturing systems with standoff distance monitoring and control that can be responsive, dynamic, and real-time. These techniques can use a standoff distance measurement system to monitor, read, or interrogate a workpiece or a substrate on which the workpiece is positioned in real time as the workpiece is moved past a directed energy source, or vice versa. These techniques can use a feedback controller to responsively and dynamically control the standoff distance in real time based on data from the standoff distance measurement system.

Description

[Technical field]

[0001] [CROSS REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 870,289, filed July 3, 2019, which is incorporated by reference in its entirety.

[0002] Generally, this disclosure relates to directed energy deposition additive manufacturing systems. More particularly, this disclosure relates to standoff distance monitoring and control. [Background technology]

[0003] A rapid plasma deposition (RPD™) additive manufacturing system can provide an inert gas environment (e.g., noble gas) that contains a wire (e.g., metal) and a plasma torch. RPD™ additive manufacturing systems additively manufacture a workpiece (e.g., an aircraft structure) based on the plasma torch being controllably directed at the wire and the plasma arc melting the wire to form the workpiece layer-by-layer as the workpiece is controllably moved past the plasma torch or vice versa within the inert gas environment.

[0004] During such operation, a standoff distance (e.g., distance along a vertical axis) is maintained between the plasma torch and the workpiece. The standoff distance determines the plasma arc resistance, and thereby the plasma arc power and characteristics (e.g., characteristics of a constant plasma arc current provided by a constant current power supply). A larger standoff distance produces a higher arc voltage, but at least some of the energy transferred to the workpiece is reduced due to radiative and convective heat transfer along the plasma arc. The standoff distance is in a static range between a lower limit imposed by the equipment setup (e.g., physical equipment constraints) and an upper limit imposed by reduced power input to the workpiece (e.g., inadequate wire melting).

[0005] There are various factors that can lead to standoff distance deviation. Some of such factors are substrate distortion, non-flat deposition surface (e.g., due to wire movement), non-flat workpiece height steps, workpiece features (e.g., joints, edges, intersections), and other complex process variations. Although the standoff distance can be indirectly controlled by maintaining a constant voltage based on voltage measurements, this technique is technically disadvantageous due to various factors. Some of such factors include that the voltage measurements can be very noisy and highly susceptible to variations (e.g., gas flow rate, mechanical or material configuration of the electrode, equipment variations, or workpiece geometry variations). As a result, indirect control of the standoff distance based on voltage measurements leads to standoff distance errors that accumulate across the workpiece layers, thereby adversely affecting the quality of the workpiece. Summary of the Invention

[0006] Thus, disclosed herein are various techniques for directed energy deposition (e.g., RPD™) additive manufacturing systems that enable monitoring and control of standoff distance that can be responsive, dynamic, and / or real-time. These techniques can use a standoff distance measurement system, such as a laser triangulation system or a laser line scanner (LLS), to monitor, read, or interrogate in real-time a workpiece (e.g., bead profile, workpiece shape) or a substrate on which the workpiece is positioned as the workpiece is moved (e.g., through a substrate) past a directed energy source (e.g., a plasma torch) or vice versa. It should be noted that as the workpiece is moved (e.g., through a substrate) past a directed energy source (e.g., a plasma torch), or vice versa, other optical measurement techniques, such as time-of-flight, confocal, chromatic confocal, interferometry, shape from shadow, depth from focus / defocus, Lidar, etc., can be used supplementally or alternatively alone or in combination with illumination of different wavelengths, e.g., infrared, visible, UV, X-ray, etc., e.g., fringe projection, pattern projection (e.g., line, multi-line, multi-spot), etc., and non-optical methods, such as sonar, ultrasonic readers or interrogators, to monitor, read, or interrogate in real time the workpiece (e.g., bead profile, workpiece shape) or the substrate on which the workpiece is positioned.These techniques can use a feedback controller to responsively and dynamically control the standoff distance in real time (e.g., raise or lower a directed energy source relative to the workpiece, or a workpiece relative to a directed energy source) based on data from a standoff distance measurement system, such as a laser triangulation system or laser line scanner (although other optical measurement techniques, such as time of flight, confocal, chromatic confocal, interferometry, shape from shadow, depth from focus / defocus, Lidar, etc., can be used alone or in combination supplementally or alternatively with illumination of different wavelengths, such as infrared, visible, UV, x-ray, etc., such as fringe projection, pattern projection (e.g., line, multi-line, multi-spot), etc., and non-optical methods, such as sonar, ultrasonic reader or interrogator, etc.). Thus, these techniques remove at least some of the technical limitations associated with industry standards that use voltage-based measurements. Moreover, these techniques can enable real-time automated measurement, evaluation, and responsive dynamic control of stand-off distance during additive manufacturing of workpieces (e.g., aircraft structures, marine structures, vehicle parts, medical devices, small arms, cutlery) via metals (e.g., titanium, aluminum) or metal alloys (e.g., Ti6Al4V, Inconel variants, etc.) using plasma arcs (e.g., RPD™) or other forms of directed energy.

[0007] The advantage of these techniques is that they provide an objective inline / in-situ automated system for real-time responsive and dynamic control of standoff distance that can provide at least some consistent plasma arc (or other form of directed energy) characteristics, such as power, pressure, shape, and energy distribution over time across the machine, reduce scrap rates, provide early detection of unacceptable deviations, shorten part development cycles, etc. These techniques also allow for standoff distance control that is more robust, faster, and more objective compared to subjective human operator manual adjustments. Such human operator manual adjustments can be based on visual feedback. Similarly, these techniques allow for typically more precise and faster standoff distance control compared to robotic arm welding, with automated standoff distance control based on movement (e.g., vertical movement) of the directed energy source relative to the substrate or vice versa. It is noted that these techniques can be used with any type of motion system (e.g., computer numerical control, robotic manipulators).

[0008] Additional features and advantages of these techniques will be set forth in the following detailed description, and in part will be obvious from the following detailed description, or may be learned by the practice of the disclosure. Various objectives and other advantages of the disclosure will be realized and attained by the structure particularly pointed out in the detailed description and claims of this disclosure as well as the appended drawing set.

[0009] To achieve these and other advantages, in accordance with the purposes of this disclosure, as embodied and broadly described, a directed energy deposition additive manufacturing system includes logic, a standoff distance measurement unit, a substrate, a torch, a supply unit, material, and a mover, the logic causes the supply unit to output material and the torch to output plasma such that the plasma melts the material on the substrate and a workpiece is thereby additively manufactured on the substrate, the workpiece having a geometric profile, the torch being positioned vertically spaced apart from the workpiece such that a standoff distance is defined, and the logic causes the standoff distance measurement unit to monitor the geometric profile such that while the workpiece is additively manufactured, the logic causes the mover to at least one of move the torch relative to the substrate or move the substrate relative to the torch to maintain the standoff distance.

[0010] To achieve these and other advantages, in accordance with the purposes of this disclosure, as embodied and broadly described, a method of additive manufacturing includes outputting a material, outputting a plasma via a torch, melting the material via the plasma such that a workpiece is additively manufactured on a substrate, the workpiece having a geometric profile, the torch being positioned vertically away from the workpiece such that a standoff distance is defined, and monitoring the geometric profile while the workpiece is additively manufactured such that a mover can at least one of move the torch relative to the substrate or move the substrate relative to the torch to maintain the standoff distance.

[0011] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claims that follow.

[0012] The accompanying drawing set, which is included to provide a further understanding of the present disclosure, and which is incorporated in and constitutes a part of this specification, illustrates embodiments of the disclosure and, together with the detailed description, serves to explain various principles of the disclosure. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 illustrates an embodiment of a directed energy deposition additive manufacturing system including a laser line scanner that reads a substrate and a geometric profile of a workpiece on the substrate in accordance with the present disclosure. [Diagram 2] FIG. 1 illustrates one embodiment of a directed energy deposition process flow according to the present disclosure. [Diagram 3] FIG. 1 illustrates one embodiment of a directed energy deposition process flow according to the present disclosure. [Figure 4] FIG. 1 illustrates one embodiment of a substrate for supporting a workpiece according to the present disclosure. [Diagram 5] FIG. 1 illustrates an embodiment of a block diagram of a directed energy deposition additive manufacturing system including a laser line scanner for reading a geometric profile of a workpiece on a substrate in accordance with the present disclosure. [Figure 6] FIG. 1 illustrates an embodiment of a diagram of a laser line scanner system according to the present disclosure. [Figure 7] FIG. 1 illustrates an embodiment of a diagram of a laser line scanner system according to the present disclosure. [Figure 8] FIG. 2 illustrates one embodiment of a substrate supporting a workpiece and a set of information related to data validation and grid spacing in accordance with the present disclosure. [Figure 9] FIG. 2 illustrates one embodiment of a control block diagram according to the present disclosure. [Figure 10] FIG. 2 illustrates one embodiment of a control block diagram according to the present disclosure. [Figure 11] FIG. 1 illustrates one embodiment of multiple scenarios for standoff monitoring and control according to the present disclosure. [Figure 12]1 illustrates an embodiment of a margin around multiple edges of a substrate that increases the risk of collision with a tool head according to the present disclosure. [Figure 13] 1 illustrates one embodiment of a technique for minimizing the risk of or avoiding collisions with a clamp that clamps a substrate according to the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The present disclosure will now be described more fully with reference to the accompanying drawing set, in which several embodiments of the present disclosure are shown. However, the present disclosure can be implemented in many different forms and should not be construed as necessarily being limited to the embodiments disclosed herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the various concepts of the present disclosure to those skilled in the art. Reference will now be made in detail to the embodiments of the present disclosure. Examples of embodiments of the present disclosure are illustrated in the accompanying drawing set.

[0015] FIG. 1 illustrates an embodiment of a directed energy deposition additive manufacturing system including a substrate and a laser line scanner that reads the geometric profile of the workpiece on the substrate according to the present disclosure. In particular, the directed energy deposition (e.g., RPD™) additive manufacturing system 100 includes a workpiece 118 and a substrate 102 that supports the workpiece 118. It should be noted that the workpiece 118 may not be attached, positioned, or resting on the substrate 102 (e.g., another workpiece serves as the substrate 102). For example, the workpiece 118 does not have to be a plate (substrate 102), but can be, for example, a forged part, a printed part, or a part made using any other technique (e.g., additive manufacturing, subtractive manufacturing). For example, initiating deposition on a plate (substrate 102) is not required, but is optional. For example, another workpiece or part can serve as the substrate 102.

[0016] The directed energy deposition additive manufacturing system 100 includes a controller 119, a wire source 104 (connected to a wire feed system) controlled (e.g., wired, wireless, waveguide) by the controller 119, a directed energy source 106 (e.g., a plasma torch) controlled (e.g., wired, wireless, waveguide) by the controller 119, a directed energy source 110 (e.g., a plasma torch) controlled (e.g., wired, wireless, waveguide) by the controller, and a laser line scanner (LLS) 112 (or another form of standoff distance measurement system) controlled (e.g., wired, wireless, waveguide) by the controller 119.

[0017] The controller 119 can be a programmable logic controller (PLC), an industrial PC (IPC), etc. For example, the PLC can be a master PLC. The directed energy source 106 can be a primary directed energy source, whereas the directed energy source 110 can be a secondary directed energy source. The LLS 112 can include a laser source that generates a laser beam and an optical camera that reads multiple reflections from the laser beam. The directed energy source 106 hosts the electrode 108. The LLS 112, which can be pre-calibrated, projects a laser pattern 114 onto the workpiece 118 and the substrate 102. The laser pattern 114 can be projected via the laser source. The substrate 102 is moving in a three-dimensional space.

[0018] Various components of the directed energy deposition additive manufacturing system 100 can be omitted, replaced, or supplemented. For example, the LLS 112 can be supplemented or replaced by other optical measurement techniques, such as time of flight, confocal, chromatic confocal, interferometry, shape from shadow, depth from focus / defocus, Lidar, etc., alone or in combination with illumination of different wavelengths, such as infrared, visible, UV, X-ray, etc., such as fringe projection, pattern projection (e.g., line, multi-line, multi-spot, random spot, random pattern, gradient pattern), etc., and non-optical methods, such as sonar, ultrasonic reader, or other interrogator. Similarly, the directed energy source 110 or the directed energy source 106 hosting the electrode 108 can be supplemented or replaced by other energy output devices (e.g., flame torch) or other forms of directed energy (e.g., heat, acoustic, electricity). Similarly, the directed energy source 110 can be omitted (but can be optionally included). Moreover, the wire source 104 may be supplemented or replaced by other material feeders (eg, nozzles).

[0019] The directed energy source 106 hosting the electrode 108 may be a primary energy source that generates directed energy (e.g., a plasma arc) toward the substrate 102 in operative proximity to the wire source 104. The directed energy may be transferred from the electrode 108 to the wire from the wire source 104, or the directed energy may be transferred optionally from the electrode 108 to the substrate 102 or to both simultaneously (e.g., using multiple plasma arcs). The directed energy source 106 may be stationary or movable (e.g., horizontally, vertically) relative to the wire source 104, or vice versa. The wire source 104 may be stationary or movable (e.g., horizontally, vertically) relative to the directed energy source 106, or vice versa. The substrate 102 may be stationary or may be movable (e.g., horizontally, vertically) relative to the wire source 104 or the directed energy source 106, or vice versa. For example, the substrate 102 may be moved in a direction along a horizontal axis relative to the wire source 104 and the directed energy source 106. When a directed energy source 110 is included, the directed energy source 110 may include an electrode (or another energy output support device) that may be a preheater electrode (or another energy output support device) that preheats the substrate 102, which may be at a relatively low temperature before additive manufacturing of the workpiece 118 begins via the directed energy source 106 and the wire source 104. When a directed energy source 110 is included, the directed energy source 110 may be positioned along a horizontal axis between the LLS 112 and the directed energy source 106.

[0020] The substrate 102 moves in three-dimensional space relative to the wire source 104, the directed energy source 106, the directed energy source 110, and the LLS 112. The wire source 104 supplies a wire (e.g., metals such as titanium, aluminum, steel, metal alloys such as Ti6Al4V, Inconel variants, etc.) above the substrate 102 such that while the substrate 102 moves in three-dimensional space, the directed energy source 106 hosting the electrode 108 generates a plasma arc that melts the wire above the substrate 102, and a plurality of droplets are formed from the molten wire via the directed energy (e.g., plasma arc) and the droplets are deposited, positioned, layered, cascaded, or dropped layer by layer onto the substrate 102 or onto a pre-loaded workpiece 118 to additively form or extend the workpiece 118. For example, the workpiece 118 does not have to be a plate (substrate 102) but can be, for example, a stamped part, a printed part, or a part made using any other technique (e.g., additive manufacturing, subtractive manufacturing). For example, initiating deposition on a plate (substrate 102) is not required, but is an option. For example, another workpiece or part can function as the substrate 102.

[0021] Since the workpiece 118 has a geometric profile, which may vary vertically or horizontally, or may describe a geometric outline or a vertical or horizontal outline, the LLS 112 projects the laser pattern 114 onto the geometric profile of the workpiece 118. The workpiece 118 may be supported by the substrate 102 or may be unsupported. This projection is performed such that the LLS 112 optically illuminates the geometric profile of the workpiece 118 and / or the substrate 102, which may be present on at least some of the bottom layers of the substrate 102. The LLS 112 can then read the reflection from the laser pattern 114 using a camera. When the substrate 102 is used as a base for the workpiece 118 (e.g., when printing or forging), at some point the substrate 102 can become part of the workpiece 118. For example, the workpiece 118 does not have to be a plate (substrate 102) but can be, for example, a stamped part, a printed part, or a part made using any other technique (e.g., additive manufacturing, subtractive manufacturing). For example, initiating deposition on a plate (substrate 102) is not required, but is an option. For example, another workpiece or part can function as the substrate 102.

[0022] More than one LLS 112 can be used (e.g., optically reading the geometric profile of the substrate 102 and / or the workpiece 118 from different viewpoints or angles). For example, the laser patterns 114 can be perpendicular to each other, parallel to each other, or L-shaped, U-shaped, or O-shaped, and the patterns can be single line, multi-line, single spot, multi-spot, random spot, random pattern, pulsed, non-pulsed, etc. For example, more than one LLS 112 can be used according to different scenarios, and different reading offsets along both X and Y from the tip of the electrode 108 may be required when measuring the standoff distance (see also FIG. 11). Moreover, when the directed energy deposition additive manufacturing system 100 involves a plasma arc, the plasma arc may affect the quality of the measurement of the LLS 112, so at least some measurements or calibrations of the LLS 112 can be performed when the plasma arc is off to avoid measurement inaccuracies.

[0023] In a directed energy deposition additive manufacturing system 100, the standoff distance can be measured between the tool center point and a point on the workpiece 118 along the vertical axis. The tool center point (TCP) can be statically defined based on tool mechanics (e.g., the tip of the electrode 108 or the origin end of the directed energy source (e.g., plasma arc)) or dynamically offset (e.g., calculated in real time based on process variables such as wire speed, arc angle, deflection, shape, etc., in scenarios where the point of interest needs to be offset to the section where the droplet contacts the workpiece 118 rather than directly under the electrode tip). Without loss of generality, this point is referred to interchangeably as TCP or DTCP in the following.

[0024] For example, the standoff distance can be measured at about 100 millimeters or less, about 90 millimeters or less, about 80 millimeters or less, about 70 millimeters or less, about 60 millimeters or less, about 50 millimeters or less, about 40 millimeters or less, about 30 millimeters or less, about 20 millimeters or less, about 10 millimeters or less, and can include any value therebetween (e.g., about 1 millimeter, about 2 millimeters, about 3 millimeters, about 4 millimeters, about 5 millimeters, about 6 millimeters, about 7 millimeters, about 8 millimeters, or about 9 millimeters), although values ​​greater than 100 millimeters (e.g., about 125 millimeters, about 150 millimeters, about 200 millimeters, about 225 millimeters, about 250 millimeters, about 300 millimeters or more) are possible, including various orders of magnitude greater, e.g., centimeters, decimeters, meters). The workpiece 118 and / or substrate 102 can move in 3d space using the X-axis (e.g., length), Y-axis (e.g., depth), Z-axis (e.g., height), C-axis (e.g., rotational XY plane), B-axis rotation (e.g., XZ plane or YZ plane), and without loss of generality, the vertical axis can be referred to as the Z-axis. The geometric profile of the workpiece 118 can change along the X-axis, Y-axis, or Z-axis, whether gradually or abruptly. When the directed energy deposition additive manufacturing system 100 avoids or supplements the electrode 108 with another energy output device (e.g., a flame torch), the standoff distance can be measured along the vertical axis between the DTCP (e.g., center portion) of the energy output device and the workpiece 118. For example, the DTCP can be in the same Z-plane as those vertically above the electrode tip or other energy support device above the point where at least some droplets land.

[0025] The standoff distance can be dynamically maintained within various prescribed limits to achieve consistent plasma arc conditions (e.g., voltage, power, temperature distribution) from the electrode 108. Accordingly, the directed energy deposition additive manufacturing system 100 includes a standoff distance monitoring and control system that enables real-time automatic measurement and responsive, dynamic control of the standoff distance via vertical movement (e.g., up, down, away from the workpiece 118 or substrate 102) of the electrode 108 relative to a sampling point from a section on the substrate 102 below the TCP / DTCP or a sampling point from a section on the geometric profile of the workpiece 118 below the TCP / DTCP, as described further below. For example, as the substrate 102 moves the workpiece 118 in 3D space, the directed energy source 106 can move vertically with the electrode 108 relative to a sampling point from a section on the substrate 102 below the TCP / DTCP or a sampling point from a section on the geometric profile of the workpiece 118 below the TCP / DTCP. It should be noted that the reverse configuration (eg, substrate 102 moving vertically upwards or downwards relative to directed energy source 106 or electrode 108) is also possible.

[0026] The directed energy deposition additive manufacturing system 100 executes an RPD™ program (e.g., executable code, a list of numerical control (NC) values, markup code, delimited text, populated spreadsheet) that sets various parameters of the standoff distance monitoring and control system, such as standoff distance setpoint, setpoint trajectory, control mode, control enable, measurement offset, read offset, among others. The standoff distance monitoring and control system responsively and dynamically maintains in real time the standoff distance between the TCP / DTCP and the highest point on the workpiece 118 below the TCP / DTCP based on the geometric profile of the workpiece 118, or the lowest point on the workpiece 118 based on the geometry of the workpiece 118, or the average of the highest and lowest points on the workpiece 118 based on the geometric profile of the workpiece 118, within specific ranges around various specified read offsets.The standoff distance monitoring and control system can dynamically and responsively maintain or dynamically and responsively adjust the standoff distance in real-time based on the LLS 112 (e.g., a camera that reads laser beam reflections) that optically reads the substrate 102 and workpiece 118 via a laser pattern 114 that extends laterally along or across the substrate 102 and workpiece 118, and then determines whether the geometric profile of the workpiece 118 is within the standoff distance (e.g., about 100 millimeters or less, about 90 millimeters or less, about 80 millimeters or less, about 70 millimeters or less, about 60 millimeters or less, about 50 millimeters or less, about 40 millimeters or less, about 30 millimeters or less, about 20 millimeters or less, about 10 millimeters or less). The electrode 108 is moved vertically relative to the geometric profile of the substrate 102 or workpiece 118 in dynamic response to meeting or not meeting a predefined threshold (e.g., a set numerical value) associated with a bead height of less than or equal to 100 mm, including any value therebetween (e.g., about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, or about 9 mm), but including values ​​greater than 100 mm (e.g., about 125 mm, about 150 mm, about 200 mm, about 225 mm, about 250 mm, about 300 mm, or more), including various orders of magnitude greater, e.g., centimeters, decimeters, meters). Note that the reverse configuration (e.g., the substrate 102 is moved vertically relative to the directed energy source 106) is also possible. For example, the laser pattern 114 can be perpendicular to the bead cross section forming the workpiece 118, and the center portion of the laser pattern 114 can be the target point for height measurement. It should be noted that the laser pattern 114 can be dynamically projected below the TCP / DTCP onto a target point for distance measurement, onto a fixed location in front of the TCP, or onto a fixed location behind the TCP.In scenarios where the laser pattern 114 is not exactly below the TCP / DTCP, the extracted standoff distance data needs to be associated with the workpiece position information and stored (e.g., buffered in a grid) so that the standoff control system can retrieve at least some values ​​from storage (e.g., memory) when the TCP / DTCP is at the point of interest for which the standoff distance is to be maintained.

[0027] The standoff distance monitoring and control system optically measures the standoff distance using the LLS 112 (or another laser-based triangulation system) mounted such that the directed energy source 110 is positioned along a horizontal axis between the LLS 112 and the directed energy source 106, and then responsively and dynamically causes a positioning system or mover (e.g., motor, engine, actuator, mechanical linkage, gear mechanism, pulley mechanism, hydraulic mechanism, pneumatic mechanism) to move the electrode 108 vertically (e.g., up, down) along the Z-axis relative to the substrate 102 or workpiece 118 in real time. This functionality allows the mover to responsively and dynamically hold, maintain, or adjust the standoff distance in real time via control functions executed on a controller (e.g., PLC, IPC) of the directed energy deposition additive manufacturing system 100. For example, the PLC can be a master PLC. Note that the reverse configuration (e.g., the substrate 102 is moved vertically relative to the directed energy source 106 by the mover) is possible.

[0028] It is noted that the directed energy deposition additive manufacturing system 100 can be implemented as disclosed in U.S. Patent Application Serial No. 15 / 206,163, as well as U.S. Patent Nos. 7,301,120, 7,326,377, 9,346,116, and 9,481,931, all of which are incorporated herein by reference in their entirety for all purposes. For example, the directed energy deposition additive manufacturing system 100 can receive a design file for the workpiece 118, such as a computer-aided design (CAD) file, receive a spool of wire, such as wire including titanium, via the wire source 104, and fabricate the workpiece 118, which can be aerospace grade, etc., based on a particular workpiece geometry extracted from the design file for the workpiece 118. For example, the directed energy deposition additive manufacturing system 100 can include a chamber filled with an inert gas, such as argon, helium, xenon, krypton, or a combination thereof. Thus, the substrate 102, wire source 104, directed energy source 106, electrode 108, directed energy source 110, laser line scanner 112, laser pattern 114, and work piece 118 may be positioned within the chamber.

[0029] In one mode of operation, the standoff distance can be the distance along the vertical direction between the DTCP and the workpiece 118. The standoff distance is kept within a prescribed limit to achieve a consistent arcing condition. The standoff monitoring and control system allows for automatic measurement and control of the standoff distance. It is noted that the RPD™ program defines various parameters of the directed energy deposition additive manufacturing system 100 (e.g., standoff distance set point, control mode, control enable, measurement offset, read offset). The directed energy deposition additive manufacturing system 100 then maintains the standoff distance between the DTCP and the highest or lowest point on the workpiece 118 within a certain range centered around some specified read offset. The directed energy deposition additive manufacturing system 100 measures the standoff distance using the LLS 112 mounted in front of the electrode 108 and maintains the standoff distance using a mover with the assistance of a control function running on the master logic controller of the directed energy deposition additive manufacturing system 100.

[0030] In one mode of operation, the directed energy deposition additive manufacturing system 100 can be configured to monitor and control standoff based on a small average distance (about 0 mm to about 10 mm in length) at the start of the string prior to deposition at layer 0 (where measurements will be taken on the substrate). The directed energy deposition additive manufacturing system 100 can be configured for monitoring and control of standoff over the entire deposition length of the string by scanning with the arc turned on or when returning to deposit the next string (without major impact to the part deposition schedule or process). The directed energy deposition additive manufacturing system 100 can be configured for in-line shape monitoring and standoff estimation. This can be based on a model of the bead / string including overlap and laser measurements while providing a user interface to monitor and detect deviations from the model and log the entire shape of the deposited string.

[0031] 2 illustrates one embodiment of a directed energy deposition process flow according to the present disclosure. In particular, the directed energy deposition process 200 includes a number of inputs 202 (e.g., wire, substrate, noble gas) that are input into a directed energy deposition (e.g., RPD™) additive manufacturing machine 204. In response, the directed energy deposition additive manufacturing machine 204 outputs a number of outputs 206 including a workpiece 224 and a process machine-readable log 226 (e.g., data structures, files). The directed energy deposition additive manufacturing machine 204 also receives an RPD™ program 214 (e.g., NC commands, executable code, lists of numbers, markup code, delimited text, filled-in spreadsheets) from a graphical conversion software application 212 that converts a computer-aided design (CAD) file 210 (e.g., a multi-dimensional illustration of an object to be additively manufactured) into the RPD™ program 214. The graphical conversion software application 212 is linked to or communicates with a data source 208 (e.g., a database, data structure, software application, function, API) that supplies (e.g., via wire, waveguide, wirelessly) a set of directed energy deposition (e.g., RPD™) additive manufacturing process knowledge data (e.g., machine settings, deposition parameters) to the graphical conversion software application 212 to assist the graphical conversion software application 212 in converting the CAD file 210 into an RPD™ program 214.

[0032] Within the directed energy deposition additive manufacturing machine 204, the RPD™ program 214 is input into a logic controller 216 (e.g., a PLC) that controls a directed energy deposition (e.g., RPD™) additive manufacturing process 218 that results in a workpiece 224. It is noted that the directed energy deposition additive manufacturing machine 204 hosts the logic controller 216. During the directed energy deposition additive manufacturing process 218, the logic controller 216 executes a parameter monitoring process 220 and a parameter control process 222 that assist the directed energy deposition additive manufacturing process 218 in producing the workpiece 224.

[0033] One of several ways in which the parameter monitoring process 220 and parameter control process 222 assist the directed energy deposition additive manufacturing process 218 can be by using a standoff distance monitoring and control system that responsively and dynamically maintains or controls in real time the standoff distance between the DTCP of the electrode 108 and the highest point of the workpiece 118 based on the geometric profile of the workpiece 118 or the lowest point of the workpiece 118 based on the geometric profile of the workpiece 118 within specific ranges centered around various specified read offsets. The standoff distance monitoring and control system can dynamically and responsively maintain or dynamically and responsively adjust the standoff distance in real-time based on the LLS 112 optically reading the substrate 102 and workpiece 118 via the laser pattern 114 extending laterally along or across the substrate 102 and workpiece 118, and then, when the geometric profile of the workpiece 118 reaches a predefined threshold (e.g., numerical value) associated with the standoff distance (e.g., about 100 millimeters or less, about 90 millimeters or less, about 80 millimeters or less, about 70 millimeters or less, about 60 millimeters or less, about 50 millimeters or less, about 40 millimeters or less, about 30 millimeters or less, about 20 millimeters or less, about 10 millimeters or less, about 2 ... In one embodiment, the electrode 108 moves vertically (e.g., upward, downward) relative to the geometric profile of the substrate 102 or workpiece 118 in response to meeting or failing to meet a predetermined distance from the workpiece 118, including any value therebetween (e.g., about 1 millimeter, about 2 millimeters, about 3 millimeters, about 4 millimeters, about 5 millimeters, about 6 millimeters, about 7 millimeters, about 8 millimeters, or about 9 millimeters), but including various orders of magnitude greater, e.g., greater than 100 millimeters (e.g., about 125 millimeters, about 150 millimeters, about 200 millimeters, about 225 millimeters, about 250 millimeters, about 300 millimeters or more), including centimeters, decimeters, meters, or less (e.g., about 1 millimeter, about 2 millimeters, about 3 millimeters, about 4 millimeters, about 5 millimeters, about 6 millimeters, about 7 millimeters, about 8 millimeters, or about 9 millimeters).Thus, the logic controller 216 dynamically and responsively maintains, maintains, or adjusts the standoff distance (eg, a feedback iterative process) based on the parameter monitoring process 220 and the parameter control process 222 .

[0034] 3 illustrates one embodiment of a directed energy deposition process flow according to the present disclosure. In particular, the directed energy deposition process 200 illustrates how the process monitoring techniques 230 feed into the process control techniques 228, which in turn feed the logic controller 216. The process monitoring techniques 230 monitor the directed energy deposition additive manufacturing process 218 based on a standoff distance monitoring control system. For example, the process monitoring techniques 230 can include the LLS 112 optically reading the changing profile of the substrate 102 or workpiece 118 via a laser pattern 114 that extends laterally along or across the substrate 102 and workpiece 118.

[0035] If the process monitoring techniques 230 determine that adjusting, controlling, maintaining, or adjusting the standoff distance that can be dynamic, responsive, and real-time is not feasible (e.g., large standoff distance deviations that cannot be corrected or cannot be corrected in a timely manner), the process monitoring techniques 230 log an error in the process machine readable log 226 and do not additively manufacture the workpiece 118. If instead the process monitoring techniques 230 determine that maintaining or adjusting the standoff distance that can be dynamic, responsive, and real-time is feasible, the process monitoring techniques 230 communicate with the process control techniques 228 and timely inform the process control techniques of various parameters or characteristics of the directed energy deposition additive manufacturing machine 204 that can be adjusted in a timely manner (e.g., standoff distance control, mover movement parameters, wire-in-arc control). The process control techniques 228 then communicate with the logic controller 216 such that the logic controller 216 can operate in a timely manner based on various parameters or characteristics of the directed energy deposition additive manufacturing machine 204, which can be adjusted in a timely manner. For example, the logic controller 216 can communicate with a mover (e.g., motor, engine, actuator, mechanical linkage, gear mechanism, pulley mechanism, hydraulic mechanism, pneumatic mechanism) coupled to the electrode 108 such that the mover moves the electrode 108 in a timely manner (e.g., vertically) along the Z-axis (e.g., upward, downward) relative to the geometric profile of the workpiece 118 or the substrate 102. For example, the mover can move the electrode in a timely manner (e.g., vertically) in a smooth manner while avoiding sudden or sporadic movements that may be undesirable. This functionality allows the mover to dynamically and responsively maintain the standoff distance in real time via control functions operating on the logic controller 216.

[0036] 4 shows one embodiment of a substrate supporting a workpiece according to the present disclosure. In particular, the substrate 102 or workpiece 118 can be structured in various ways to ensure control of the standoff distance between the electrode 108 and the workpiece 118, whether vertically or horizontally. For example, the workpiece 118 can have distortions, especially in the case of double-sided parts, non-flat string surfaces, non-flat height steps, features (e.g., start features, end features, joints). Similarly, the substrate 102 can be non-horizontal (e.g., vertically, horizontally) and may have its opposing ends bent upwards towards each other (e.g., vertically, horizontally). For example, the substrate 102 may not be horizontal (e.g., an up-sloping edge) or the workpiece 118 may have an increasing or decreasing slope (e.g., a feature), and the LLS 112 may optically read the substrate 102 as being not horizontal or having an increasing or decreasing slope, and gradually move the electrode 108 (e.g., vertically upward away from the substrate 102 or workpiece 118 or vertically downward toward it) to dynamically and smoothly maintain the pre-set stand-off distance. Such timely and gradual movement may be in advance or well before the electrode 108 is positioned above the point of the substrate 102 or workpiece 118 (e.g., above the point where wire melting occurs) or may be too slow or not to gradually maintain the stand-off distance (e.g., with a sudden or abrupt movement that may be undesirable) until such time that the point of the substrate 102 or workpiece 118 is positioned under the electrode 108. A similar process applies when the substrate 102 (eg, a decreasing slope edge) or the workpiece 118 may have a decreasing slope (eg, a feature).

[0037] 5 illustrates an embodiment of a block diagram of a directed energy deposition additive manufacturing system including a laser line scanner for reading a geometric profile of a workpiece on a substrate according to the present disclosure. In particular, the directed energy deposition (e.g., RPD™) additive manufacturing system 500 includes an LLC 112, data validation logic 502, grid spacing logic 504, an RPD™ program 506, an operator human machine interface (HMI) 508, control logic 510, Z-axis drive logic 512, an integrated position sensor 514 (e.g., a Bosch Integrated Measuring System (IMS) version), workpiece-coordinate-system (WCS) logic 516, and a processor 518 (e.g., single-core, multi-core, PLC, circuit, printed circuit board).

[0038] The RPD™ program 506 (e.g., executable code, list of numerical control (NC) values, markup code, delimited text, filled-in spreadsheet) contains various directed energy deposition additive manufacturing system settings (e.g., maintaining a specified standoff distance), and the operator HMI 508 is programmed to provide a user interface (e.g., analog, digital) that can override the RPD™ program 506, if necessary, while the RPD™ program 506 is executing on the logic controller 214. This override can occur in real-time while the workpiece 118 is being additively manufactured via the directed energy deposition additive manufacturing system 500.

[0039] When the directed energy deposition additive manufacturing system 500 reads the RPD™ program 506 and the operator HMI 508 has not disabled the RPD™ program 506, the directed energy deposition additive manufacturing system 500 additively manufactures a workpiece 118 on the substrate 102 via the electrode 106 which induces a plasma arc on the wire supplied from the wire source 104 while the substrate 102 moves in three-dimensional space relative to the wire source 104, the directed energy source 106, the directed energy source 110, and the LLS 112. A wire source 104 supplies (e.g., off a spool, supplies) a wire (e.g., metal, alloy, titanium, aluminum, steel) above the substrate 102, such that droplets are formed from the wire being melted via a plasma arc (or any other relevant energy source) and the electrode 108 generates a plasma arc that melts the wire above the substrate 102 while the substrate 102 moves in three-dimensional space, such that droplets are deposited, positioned, layered, cascaded, or dropped onto the substrate 102 to additively form the workpiece 118 layer by layer. Because the workpiece 118 has a geometric profile, the LLS 112 outputs a laser pattern 114 across the geometric profile of the substrate 102 and workpiece 118, such that the LLS 112 optically reads the geometric profile of the substrate 102 and workpiece 118 and, in response, generates a set of readings (e.g., workpiece profile, workpiece height, workpiece width). The set of readings may be filtered, saturated, and smoothed, as described further below.

[0040] The LLS 112 provides the set of readings into data validation logic 502 (e.g., hardware circuitry, software function, API) that compares (e.g., serially, simultaneously) the set of readings from the LLS 112 with a set of expected values ​​for the workpiece 118 to validate the set of readings. The set of expected values ​​may be provided from a data structure (e.g., an array) that is populated based on user input from an operator HMI 508. For example, comparing the set of readings from the LLS 112 with the set of expected values ​​for the workpiece 118 may include filtering the set of readings based on a set of expected parameters, criteria, ranges, or thresholds for the workpiece 118 or a geometric profile of the substrate 102. If the data validation logic 502 is able to validate the set of readings from the LLS 112, it inputs the set of readings into grid spacing logic 504 (e.g., hardware circuitry, software function, API), which converts the set of readings into an array or grid (e.g., two-dimensional, three-dimensional) that corresponds (e.g., dimensionally shaped) to the workpiece 118. The grid spacing logic 504 provides the array or grid to control logic 510 (e.g., hardware circuitry, software function, API).

[0041] The Z-axis drive logic 512 is coupled (e.g., wired, wireless, electrically, mechanically) to the mover (e.g., motor, engine, actuator, mechanical linkage, gear mechanism, pulley mechanism, hydraulic mechanism, pneumatic mechanism). Thus, the control logic 510 takes a set of readings while taking into account how the mover is currently positioned relative to the substrate 102 or workpiece 118 based on the IMS 514. For example, the directed energy source 106 and the IMS 514 can be mounted on a track. For example, the IMS 514 can include a linear position sensor, a linear encoder, a distance sensor, or another sensor, interrogator, or reader to determine its position. Note that when the directed energy source 106 is mounted on a track, the mover can be mounted on a track. In that case, the control logic 510 converts that position information (e.g., Cartesian X / Y coordinates) to a set of coordinates (e.g., two-dimensional, three-dimensional) in the workpiece coordinate system (WCS) of the workpiece 118. Because the mover is coupled (e.g., mechanically, electrically) to the electrode 108, the set of WCS coordinates are provided (e.g., sequentially, simultaneously) to the processor 518, which then requests the mover to move the electrode 108 (e.g., vertically) based on the set of WCS coordinates to maintain a standoff distance between the workpiece 118 or substrate (layer 0) and the electrode 108 as the substrate 102 with the workpiece 118 is moving relative to the LLS 112 (or vice versa).

[0042] In one mode of operation, the laser line scanner 112 measures the geometric profile of the workpiece 118 and substrate 102 and forms a data set based on such measurements. The data set is computationally validated and then stored in an X,Y array or grid in the WCS system that is used to calculate distance control deviation values. The WCS system takes set points from the RPD™ program 506, operator overrides from the operator HMI 508, and drive position results, allowing the mover to move (e.g., vertically) and thereby align the electrode 108 with respect to the geometric profile of the workpiece 118 and substrate 102.

[0043] In one mode of operation, there are several factors that result in standoff deviations, including substrate warping, non-flat string surfaces, non-flat height steps, joints, features, and other complex process variations, as shown in FIG. 4. The standoff monitoring and control system automates the monitoring and control using a laser distance measurement scanner and control system, as shown in FIG. 5. The system block of the LLS 112 is responsible for capturing, filtering, and extracting the distance of the workpiece 118 in the laser coordinate system, and the data validation block validates the data from the laser, transforms it to the workpiece coordinate system, resamples it, and stores it in a data array (in workpiece coordinates). The control block uses this data, a set point from the program, and feedback from a drive position sensor (e.g., IMS) to control the Z axis to maintain the standoff distance at the set point.

[0044] FIG 6 illustrates one embodiment of a diagram of a laser line scanner system according to the present disclosure. FIG 7 illustrates one embodiment of a diagram of a laser line scanner system according to the present disclosure. In particular, the LLS 112 performs, enables, or causes a set of operations 600 to be performed. The set of operations 600 includes set 602, set 604, set 606, and set 608, as illustrated by diagram 700.

[0045] Set 602 is concerned with ensuring that data from LLS 112 is appropriate, as illustrated by diagram 700. For example, if wire source 104 provides a wire that includes a reflective metal or metal alloy, LLS 112 may have at least some optical readings that may be distorted due to at least some undesired or unexpected reflections from the metal or metal alloy, especially when electrode 106 induces a plasma arc into the wire, resulting or introducing other optical distortions. Set 602 thus involves control of the operation of frames per second read, camera level filters, high dynamic range (HDR) image processing, image saturation processing, image smoothing, and other related image processing or data pre-processing. It is noted that substrate 102 may be pre-processed to reduce gloss or shine to reduce optical distortions or deviations at the substrate level (e.g., within layers 0, 1, and 2).

[0046] Similarly, set 604, as illustrated by diagram 700, involves determining various measurements of the substrate 102 (e.g., data that meets expectations, data that minimizes outliers) and the geometric profile of the workpiece 118 relative to the substrate 102 based on the data from set 602. For example, these measurements can include laser pattern widths, timing values, lowest points (e.g., extracted valleys) of the geometric profile of the workpiece 118 relative to the substrate 102, highest points (e.g., extracted peaks) of the geometric profile of the workpiece 118 relative to the substrate 102, etc.

[0047] Similarly, set 606 involves determining a number of peak-valley-average height workpiece gaps, workpiece profile slopes, and other related heights, widths, lengths based on data from set 604, as illustrated by diagram 700. For example, set 606 can include determining GAP1 (e.g., 80-84 in FIG. 7) based on finding the difference in height between (a) the peak (e.g., highest point) of workpiece 118 relative to substrate 102 at the time, (b) the valley (e.g., lowest point) of workpiece 118 relative to substrate 102 at the time, or (c) the average height of workpiece 118 relative to substrate 102 at the time and the height at the center point of laser pattern 114. For example, set 606 can include determining GAP2 (e.g., 80-81 in FIG. 7) based on finding the difference in height between the peak and valley at the time (e.g., search window). For example, set 606 can include fitting a line segment through the peak and valley, thereby determining the slope of the line segment. It should be noted that these are example functions and the software is capable of much more data and image processing.

[0048] Further, the set 608 involves validating the data from the set 606 and communicating with the logic controller 216 based on the successful or unsuccessful validation, as illustrated by diagram 700. For example, based on the laser pattern 114 from the LLS 112, the distance between the LLS 112 and the substrate 102 or workpiece 118 can be determined (e.g., based on a conversion) and then converted to a standoff distance value based on a set of calibration parameters (this can be done by the data validation logic 502). For example, the set 608 can include validating the height (e.g., peak distance, valley distance, average distance) of the workpiece 118 relative to the substrate 102, Gap 1, Gap 2, and the slope of the bead of the workpiece 118, and then sending the set of data to the logic controller 216 based on the validity of the height being verified. For example, this can be done by looking at the first deposited layer in the top layer, which may or may not involve a substrate, but the distance can be measured relative to a previously deposited layer. For example, the set of data may include an X parameter (e.g., length), a Y parameter (e.g., depth), a Z parameter (e.g., height), Gap 1, Gap 2, and an error code. Thus, the logic controller 216 can cause the mover to move the electrode 108. Otherwise, if the height data is not valid, an appropriate error message and error code are sent to the logic controller 216, based on which the logic controller 216 takes action or avoids action.

[0049] The diagram 700 shows that the string formed from melting of the wire from the wire source 104 can be measured (e.g., from 1 frame per second to over 10,000 frames per second (fps)) and, depending on the traverse speed, this will be a certain number of samples per millimeter along the deposition (e.g., at a traverse speed of 10 mm / s and a frame rate of 100 fps, there will be 10 samples per millimeter). Similarly, HDR and filters are used to suppress noise and stray light to the maximum extent possible. The LLS system 112 has been developed to be flexible to return either the highest point (e.g., peak), the lowest point (e.g., valley), or the average standoff around or within about ±10 mm of the center of the laser pattern 114. This can be particularly useful for features, blocks, and other structural parts of the workpiece 118.

[0050] FIG. 8 illustrates an embodiment of a substrate supporting a workpiece and a set of information related to data validation and grid spacing according to the present disclosure. In particular, diagram 800 relates to data validation logic 502 and grid spacing logic 504 provided by LLS 112. Thus, data obtained from LLS 112 can be downsampled and stored based on the location in workpiece coordinates where workpiece 118 is deposited, as shown in FIG. 8. Furthermore, at least some, many, most, or all of the measurements can be validated (e.g., based on expected values) to eliminate outliers. Also, at least some, many, most, or all of the data is further validated for several layers and stored in an array or grid having a resolution of about 10 millimeters or less, about 9 millimeters or less, about 8 millimeters or less, about 7 millimeters or less, about 6 millimeters or less, about 5 millimeters or less, about 4 millimeters or less, about 3 millimeters or less, about 2 millimeters or less, about 1 millimeter or less, or less than 1 millimeter along the X-axis and Y-axis. As shown in FIG. 8, a tolerance is established based on a low pass filter (e.g., a moving average filter) that is applied to eliminate outliers. Also, the validity of at least some, many, most, or all of the measurements is verified for at least some, many, most, or all of the measurements from the previous layer. If data is missing for any reason in the previous layer for more than a defined period (e.g., within about 10 seconds, about 9 seconds, about 8 seconds, about 7 seconds, about 6 seconds, about 5 seconds, about 4 seconds, about 3 seconds, about 2 seconds, about 1 second, about 0.5 seconds, about 0.3 seconds), the directed energy deposition additive manufacturing system 500 can verify the validity of the data using the maximum value of the previous layer. For example, methods or regimes can be used to deal with missing data and outliers, noise in measurements, corrupted measurements, etc. These forms of processing allow for outlier removal and collision avoidance (e.g., substrate 102, objects on workpiece 118, clamps on substrate 102).It should be noted that the operator-input average substrate height or average workpiece height, which may be obtained based on precise substrate height measurements before loading, can serve as an initial condition for data validation and also help avoid or minimize unnecessary corrections at the ends of the strings (e.g., molten material, molten wire) that form the workpiece 118.

[0051] FIG. 9 illustrates one embodiment of a control block diagram according to the present disclosure. FIG. 10 illustrates one embodiment of a control block diagram according to the present disclosure. In particular, diagram 900 represents control logic 510 implemented via logic controller 216 as illustrated by diagram 1000. Diagram 900 has input 902, input 904, input 906, and input 908. Input 902 is provided from RPD™ program 506. Input 904 is provided from LLS 112. Input 906 is provided from operator HMI 508. Input 908 is provided from IMS 514. Input 902 is provided to saturation logic 910 for selection of a number of additive manufacturing values ​​from a set of pre-defined values ​​provided from RPD™ program 506 to ensure that at least some required standoff values ​​are within at least some process specification limits. The results are then provided to comparison law block 940 to calculate the standoff control deviation of control law block 926.

[0052] An input 904 (e.g., representing the expected string height increase based on the RPD program) is provided to a decision logic that determines whether the input 904 is valid based on a set of expected values. The expected values ​​are based on the RPD™ program (e.g., the expected string height increases layer by layer based on process variables defined in the RPD program). If yes (e.g., valid), the input 904 is provided to a low pass filter 912 and then to a logic bus or gate 918 in the logic controller 216. If no (e.g., invalid), the input 904 is provided to invalid measurement logic 920, which holds a set of data based on a previous valid measurement (up to a certain distance) and provides this set of data to a standoff control law logic 926, which determines whether this set of data complies with a set of standoff distance control rules (e.g., conditions / commands to move the electrode 108 vertically). The input 906 is provided to saturation logic 914 which verifies whether the operator contribution is within a specified range of allowed contributions defined in the process control specification and then provided to a logic bus or gate 918. The input 908 is provided to a low pass filter 916 which generates a directed energy source height and then provides the directed energy source height to a logic bus or gate 918.

[0053] The comparison law unit 940 receives data from the saturation logic 910 and the logic bus or gate 918 and generates a standoff distance deviation value based on this data. The processor 940 then performs, causes to be performed, or enables to be performed an initial condition check 922 (e.g., validity verification) on the standoff distance deviation value, a control gain selection 924 on the output of the initial condition check 922, a standoff control law logic 926 on the output of the control gain selection 924, and then performs a set of condition checks including sudden motion avoidance 928, correction limits per part 930, correction limits per deposited string 932, a low pass filter 934, an RPD™ program reset check 936, and a drive dynamic ramp control 938. These operations thus allow for a flexible set of control modes (e.g., start no-control, string start based, or full control to standoff set point (per string)), a set of dynamic adjustments (e.g., slow for small errors, fast for large or larger errors), a set of correction limits (e.g., prevent collisions or too many corrections both per string and per part as a whole), dynamic ramp control (e.g., allow smooth corrections and avoid vibrations, sudden movements), and operator override (e.g., operator has control to override the system at any time to prevent machine damage).

[0054] FIG. 11 illustrates an embodiment of multiple scenarios of standoff monitoring and control according to the present disclosure. In particular, FIG. 1100 illustrates different scenarios with different definitions of standoff distance (e.g., highest or lowest point or average distance around the center point of the laser pattern), whether on the substrate profile or on the bead profile. Note that for accurate or consistent interpass temperature measurements, the standoff can be set to a first predefined distance, even if the string standoff is only for T1 and a second predefined distance may be set for T3. Here, the first predefined distance is smaller than the second predefined distance (but can be larger, as this is not required), and the standoff distance is maintained at the set point during directed energy deposition. Furthermore, note that the DTCP is calculated based on the wire speed that moves the standoff control to the point where the droplet contacts the workpiece 118, not directly under the tip of the electrode 108. Moreover, sufficient logging in a log database where all raw measurements, layer heights, corrections, control deviations and drive operations are logged. In addition, a configuration management is designed that allows the directed energy deposition additive manufacturing system to load control settings based on pre-configuration required by the RPD™ program.

[0055] 12 illustrates one embodiment of a margin around multiple edges of a substrate where there is an increased risk of collision with a tool head according to the present disclosure. In particular, FIG. 1200 illustrates a margin of electrode center point location around an edge of a substrate where there is a high risk of tool head collision (e.g., clearance of about 10 millimeters or less, about 9 millimeters or less, about 8 millimeters or less, about 7 millimeters or less, about 6 millimeters or less, about 5 millimeters or less, about 4 millimeters or less, about 3 millimeters or less, about 2 millimeters or less, about 1 millimeter or less, an undamaged clamp with no spatter).

[0056] FIG. 13 illustrates one embodiment of a technique for minimizing or avoiding collisions with clamps that clamp a substrate according to the present disclosure. In particular, FIG. 1300 illustrates important geometries that need to be considered to avoid collisions during active control. The actual clearance (lower correction limit) is actually smaller due to string height variations. Furthermore, FIG. 1300 illustrates substrate clamp considerations during standoff control (e.g., different geometries define lower correction limits depending on standoff set points to avoid collisions). For example, when some measurements are such that standoff distance control has a risk of tool head collision with the clamp, the logic controller 214 system can limit the lower control action to avoid collisions.

[0057] In one mode of operation, the directed energy deposition (e.g., RPD™) additive manufacturing system can provide a variety of control modes, including frame rate and filtering (e.g., measurements are taken at 1 frame per second to 10,000 frames per second, using HDR capabilities and pre-filtering to reduce reflections and stray light from the plasma arc or energy source), flexible measurement mode (e.g., maximum standoff, minimum standoff, average standoff less than about (±10 mm) around or from the center of the laser pattern 114), measurement validity verification (e.g., difference between maximum and minimum z, and tilt used to verify validity of measurement), flexible control mode (e.g., no start control, string start based, or full control (per string) to standoff set point), dynamic adjustments (e.g., slow for small errors, fast for large or larger errors), dynamic correction limits (e.g., calculated and dynamically applied correction limits are applied to prevent collisions and excessively large errors, both per string and per part as a whole). compensation), dynamic ramp control (e.g., dynamic ramp is used to allow smooth compensation and avoid vibrations, sudden movements), operator override (e.g., operator has control to override the system at any time to prevent machine damage), accurate or consistent interpass temperature measurement (e.g., the standoff can be set to a first preset distance even if the string standoff is only for T1 and a second preset distance may be set for T3 and the standoff is maintained at a set point during deposition), DTCP (e.g., calculated based on wire speed that moves the standoff distance control to a point where the droplet contacts the workpiece rather than under the electrode tip), full logging to a data log server (e.g., some, most, or all raw measurements, layer heights, compensations, and drive actions are logged), or configuration management (e.g., load control settings based on presets required by the program).

[0058] In one mode of operation, the directed energy deposition additive manufacturing system 100 includes a controller 119, an LLS 112, a substrate 102, a directed energy source 106, an additive manufacturing material (e.g., a wire source 104), and a mover. The controller 119 is coupled to the LLS 112, the directed energy source 106, and the mover. The substrate 102 is movable in three-dimensional space relative to the LLS 112. The directed energy source 106 is movable along a vertical axis relative to the substrate 102. The mover is coupled to the directed energy source 106. The mover moves the directed energy source 106 along the vertical axis. The directed energy source 106 generates energy that melts the additive manufacturing material onto the substrate 102 as the substrate 102 is moved in three-dimensional space relative to the directed energy source 106 and the LLS 112 toward the LLS 112 such that a workpiece 118 is additively manufactured on the substrate 102. The workpiece 118 has a geometric profile, and the directed energy source 106 is positioned vertically away from the workpiece 118 such that a standoff distance is defined. The LLS 112 monitors the geometric profile of the workpiece 118 while the substrate 102 is moving in three-dimensional space such that the controller 119 controls the mover to move the directed energy source 106 along the vertical axis to maintain the standoff distance. The controller 119 can control the mover to move the directed energy source 108 along the vertical axis to maintain the standoff distance based on how fast the substrate 102 is moving in three-dimensional space. The controller 119 can control the mover to move the directed energy source 106 along the vertical axis to maintain the standoff distance based on how fast the additive manufacturing material is being melted via a plasma arc generated via the directed energy source 106.The directed energy source 106 includes a central tip portion, and the controller can control the mover to move the directed energy source 106 along a vertical axis to maintain a standoff distance based on the rate at which additive manufacturing material is being delivered (e.g., via the wire source 104) such that a resulting droplet of the additive manufacturing material is melted and contacts the workpiece 118 before the droplet is positioned directly beneath the central tip portion of the electrode 108. The controller 119 can be programmed to request the mover to move the directed energy source 106 smoothly along the vertical axis to minimize vibrations of the directed energy source 106 while the directed energy source 106 is moving along the vertical axis. The controller 119 can be programmed to request the mover to move the directed energy source 106 smoothly along the vertical axis to minimize sudden movements of the directed energy source 106 while the directed energy source 106 is moving along the vertical axis. The controller 119 can be programmed to request the mover to move the directed energy source 106 along the vertical axis to avoid collision with an object that engages the substrate. The object is other than the workpiece 118. The object can be a clamp that clamps the substrate. The controller 119 can be programmed to limit the movement of the directed energy source 106 along the vertical axis for each bead. The controller 119 can be programmed to limit the movement of the directed energy source 106 along the vertical axis for each workpiece. The controller 119 can be programmed to dynamically adjust the movement of the directed energy source 106 along the vertical axis based on the error type. The LLS 112 generates multiple readings, and the controller 119 can be programmed to receive the readings from the LLS 112 and verify the validity of the readings before the controller requests the mover to move the directed energy source 106 along the vertical axis. The directed energy source 106 can generate a plasma arc that melts the additive manufacturing material.The LLS 112 can generate multiple readings. The workpiece 118 can generate reflections, and the controller can be programmed to apply at least one of HDR or pre-filtering techniques to the readings from the LLS 112 to reduce at least one of reflections or stray light due to at least one of the workpiece 118 or the plasma arc. The directional energy source 106 can be a first directional energy source, and the directional energy source 110 can pre-heat the substrate 102 when the directional energy source 110 is positioned between the LLS 112 and the directional energy source 106 along the horizontal axis. The controller 119 can control a mover to move the directional energy source 106 along the vertical axis to maintain a standoff distance based on the substrate 102 being distorted, bowed, or deformed along the horizontal or vertical axis, whether vertical or horizontal. The controller 119 can control the mover to move the directed energy source 106 along the vertical axis to maintain the standoff distance based on at least one of a feature of the workpiece 118, a joint of the workpiece 118, an intersection of the workpiece 118, a non-flat height step, a non-flat string surface, or a distortion of the substrate 102. A sensor (e.g., IMS 514) can monitor the mover. A controller can be coupled to the sensor, and the controller controls the mover to move the directed energy source 106 along the vertical axis to maintain the standoff distance based on the sensor.

[0059] Various embodiments of the present disclosure may be implemented in a data processing system suitable for storing and / or executing program code, including at least one processor coupled directly or indirectly through a system bus to memory elements including, for example, local memory used during the actual execution of the program code, bulk storage devices, and cache memories that provide temporary storage of at least some of the program code to reduce the number of times the code must be retrieved from bulk storage devices during execution.

[0060] I / O devices (including but not limited to keyboards, displays, pointing devices, DASD, tapes, CDs, DVDs, thumb drives and other memory media, etc.) may be coupled to the system either directly or through intervening I / O controllers. Network adapters may also be coupled to the system to enable the data processing system to couple to other data processing systems or remote printers or remote storage devices through intervening private or public networks. Modems, cable modems, and Ethernet cards are just a few of the available types of network adapters.

[0061] The present disclosure may be embodied in a system, a method, and / or a computer program product. The computer program product may include a computer readable storage medium(s) having computer readable program instructions thereon for causing a processor to execute aspects of the present disclosure. The computer readable storage medium may be a tangible device that can hold and store instructions used by an instruction execution device. The computer readable storage medium may be, for example, but not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination thereof. A non-exhaustive list of more specific examples of computer readable storage media includes the following: portable computer diskettes, hard disks, random access memories (RAM), read only memories (ROM), erasable programmable read only memories (EPROM or flash memory), static random access memories (SRAM), portable compact disk read only memories (CD-ROM), digital versatile disks (DVD), memory sticks, floppy disks, mechanically encoded devices such as punch cards or protruding structures in grooves with instructions recorded thereon, and the like, and any suitable combination thereof.

[0062] The computer readable program instructions described herein can be downloaded from a computer readable storage medium into each computing / processing device or to an external computer or storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer readable program instructions from the network and forwards these computer readable program instructions for storage in a computer readable storage medium within the respective computing / processing device.

[0063] Computer-readable program instructions for carrying out the operations of the present disclosure can be either assembler instructions, instruction-set-architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state-setting data, or source or object code written in any combination of one or more programming languages. Programming languages ​​include object-oriented programming languages, such as Smalltalk, C++, and the like, and traditional procedural programming languages, such as the "C" programming language or similar programming languages. A code segment or machine-executable instructions can represent a procedure, a function, a subprogram, a program, a routine, a subroutine, a module, a software package, a class, or any combination of instructions, data structures, or program statements. A code segment can be coupled to another code segment or a hardware circuit by passing and / or receiving information, data, arguments, parameters, or memory contents. Information, arguments, parameters, data, and the like can be passed, forwarded, or transmitted via any suitable means, including memory sharing, message passing, token passing, network transmission, among others. The computer readable program instructions may run entirely on the user's computer as a stand-alone software package, or partly on the user's computer, or partly on the user's computer and partly on a remote computer, or entirely on a remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a LAN or WAN, or the connection may be to an external computer (e.g., through the Internet using an Internet Service Provider).In some embodiments, electronic circuitry including, for example, programmable logic circuitry, a field programmable gate array (FPGA), or a programmable logic array (PLA) can execute computer readable program instructions by utilizing state information of the computer readable program instructions to personalize the electronic circuitry to perform aspects of the present disclosure.

[0064] Aspects of the present disclosure are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present disclosure. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions. The various illustrative logical blocks, modules, circuits, and algorithmic steps described in connection with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability of hardware and software, the various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the particular application and design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in various ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0065] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowcharts or block diagrams may represent a module, segment, or a portion of instructions, including one or more executable instructions for implementing a specified logical function(s). In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the figures. For example, two blocks shown in succession may in fact be executed substantially simultaneously, or the blocks may sometimes be executed in reverse order depending on the functionality involved. It should also be noted that each block of the block diagrams and / or flowchart illustrations, and combinations of blocks in the block diagrams and / or flowchart illustrations, may be implemented by a dedicated hardware-based system that executes the specified functions or acts, or executes a combination of dedicated hardware and computer instructions.

[0066] Words such as "then," "next," etc. are not intended to limit the order of the steps. These words are used merely to guide the reader through the method description. Although a process flow diagram may describe operations as a sequential process, many of the operations may occur in parallel or simultaneously. Additionally, the order of operations may be rearranged. A process may correspond to a method, a function, a procedure, a subroutine, a subprogram, etc. When a process corresponds to a function, its termination may correspond to a return of the function to the calling function or to the main function.

[0067] Features or functions described with respect to a particular embodiment may be combined and subcombined in and / or with various other embodiments. Also, different aspects and / or elements of the embodiments as disclosed herein may be combined and subcombined in a similar manner. Furthermore, some embodiments, whether individually and / or collectively, may be components of larger systems in which other procedures may take precedence over and / or otherwise modify their application. In addition, some steps may be required before, after, and / or simultaneously with the embodiments as disclosed herein. Any and / or all methods and / or processes as disclosed herein may be performed in any manner, at least in part, via at least one entity or actor.

[0068] Terms used herein can refer to direct or indirect, full or partial, temporary or permanent action or no action. For example, when an element is referred to as being "on," "connected" to, or "coupled" to another element, the element may be directly on, or directly connected to, or coupled to, the other element, and / or there may be intervening elements present, including indirect and / or direct variations. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

[0069] The terms "first", "second", etc. may be used herein to describe various elements, components, ranges, layers, and / or sections, and these elements, components, ranges, layers, and / or sections should not necessarily be limited by such terms. These terms are used to distinguish one element, component, range, layer, or section from another element, component, range, layer, or section. Thus, a first element, first component, first range, first layer, or first section discussed below can be referred to as a second element, second component, second range, second layer, or second section without departing from the teachings of the present disclosure.

[0070] The terminology used herein is for the purpose of describing particular embodiments and is not necessarily intended to limit the present disclosure. When used herein, the absence of a specified number is intended to include both the singular and the plural, unless the context clearly dictates otherwise. Also, when used herein, the absence of a specified number is intended to mean "one or more," although the phrase "one or more" is also used herein. The terms "comprising" and / or "including," when used herein, specify the presence of specified features, wholes, steps, operations, elements, and / or components, but do not exclude the presence and / or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups thereof. Furthermore, when the present disclosure specifies herein that something is "based on" another, such specification refers to a basis that may be based on one or more others as well. In other words, unless expressly specified otherwise, as used herein, "based on" inclusively means "based at least in part on" or "based at least partially on."

[0071] The term "or" as used herein is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X uses A or B" is intended to mean any of the natural inclusive permutations. That is, if X uses A; X uses B; or X uses both A and B, then "X uses A or B" is satisfied under any of these cases.

[0072] Unless otherwise specified, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. Terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning related to the relevant art, and should not be interpreted in an idealized and / or overly formal sense unless specifically defined herein.

[0073] The terms "about" and / or "substantially" as used herein refer to a ±10% variation from the nominal value / term. Such a variation is always included in each case.

[0074] In the event that any disclosures are incorporated herein by reference and such disclosures conflict in part and / or in whole with the present disclosure, the present disclosure shall control to the extent of the conflict and / or the scope of the broader disclosure and / or the scope of the broader definition of a term. In the event that such disclosures conflict in part and / or in whole with each other, the later-dated disclosure shall control to the extent of the conflict.

[0075] It will be apparent to those skilled in the art that various modifications and variations can be made in the present disclosure without departing from the spirit or scope of the disclosure. Therefore, the present disclosure is intended to cover modifications and variations of the present disclosure, provided that such modifications and variations come within the scope of the following claims and their equivalents.

Claims

1. The controller contains the logic, Standoff distance measuring unit, substrate, Plasma torch, Supply unit, Materials, and Equipped with movers, The logic causes the supply unit to output the material and the plasma torch to output the plasma such that the plasma melts the material on the substrate and a workpiece is thereby additively manufactured on the substrate; the workpiece has a geometric profile, and the plasma torch is positioned vertically away from the workpiece such that a standoff distance is defined between the plasma torch and the workpiece; The logic causes the standoff distance measurement unit to monitor the geometric profile while the workpiece is additively manufactured, such that the logic causes the mover to at least one of move the plasma torch relative to the substrate or move the substrate relative to the plasma torch to maintain the standoff distance while the workpiece is additively manufactured.

2. the standoff distance measurement unit includes a laser source and a camera; the logic causes the laser source to output a laser pattern onto the geometric profile such that a plurality of reflections are generated; 2. The directed energy deposition additive manufacturing system of claim 1, wherein the logic causes the camera to read the reflection and the standoff distance measuring unit to monitor the geometric profile based on the reflection.

3. 2. The directed energy deposition additive manufacturing system of claim 1 , wherein the mover is configured to move the plasma torch relative to the substrate to maintain the standoff distance based on the standoff distance measurement unit monitoring the geometric profile.

4. 4. The directed energy deposition additive manufacturing system of claim 3, wherein the substrate is configured to move in at least one of a vertical direction or a horizontal direction relative to the plasma torch.

5. 2. The directed energy deposition additive manufacturing system of claim 1 , wherein the mover is configured to move the substrate relative to the plasma torch to maintain the standoff distance based on the standoff distance measurement unit monitoring the geometric profile.

6. 10. The directed energy deposition additive manufacturing system of claim 1 , wherein the workpiece is a first workpiece and the substrate is a second workpiece onto which the first workpiece is additively manufactured.

7. The directed energy deposition additive manufacturing system of claim 1 , wherein the substrate is not a workpiece.

8. 2. The directed energy deposition additive manufacturing system of claim 1, wherein the geometric profile has a maximum height and a minimum height, and the standoff distance measuring unit monitors the geometric profile based on the maximum height and the minimum height.

9. 10. The directed energy deposition additive manufacturing system of claim 1 , wherein the system is configured to maintain the standoff distance based on a standoff set point accessed via the logic.

10. 10. The directed energy deposition additive manufacturing system of claim 1, further comprising a user interface usable to override the logic with respect to control of at least one of the standoff distance measurement unit, the substrate, the plasma torch, the supply unit, or the mover.

11. 10. The directed energy deposition additive manufacturing system of claim 1, wherein the system is configured to maintain the standoff distance based on a standoff distance for temperature measurement.

12. 10. The directed energy deposition additive manufacturing system of claim 1, wherein the logic reads control inputs from a deposition specification and inputs from a user interface, the deposition specification and the inputs associated with the workpiece.

13. 10. The directed energy deposition additive manufacturing system of claim 1 , wherein the logic controls the mover to enable deposition and measurement scans, the deposition and the measurement scans associated with the workpiece.

14. 10. The directed energy deposition additive manufacturing system of claim 1, wherein the logic obtains a set of measurements from the standoff distance measuring unit, the set of measurements being associated with the workpiece.

15. 2. The directed energy deposition additive manufacturing system of claim 1 , wherein the standoff distance measurement unit is configured to scan at least one of the workpiece or the substrate on demand to determine the standoff distance and input the standoff distance to the logic.

16. 16. The directed energy deposition additive manufacturing system of claim 15, wherein the standoff distance measurement unit is configured to scan at least one of the workpiece or the substrate based on at least one of a time interval, a position, a resolution, or a filter.

17. 2. The directed energy deposition additive manufacturing system of claim 1, wherein the standoff distance measurement unit is configured to determine a characteristic of the workpiece, and the standoff distance is determined based on the characteristic.

18. 20. The directed energy deposition additive manufacturing system of claim 17, wherein the feature is at least one of a shape of the workpiece, a gap in the workpiece, or an angle of the workpiece.

19. 10. The directed energy deposition additive manufacturing system of claim 1, wherein the standoff distance measurement unit is at least one of calibrated or programmed to eliminate at least one of optical aberrations or stray light disturbances.

20. 2. The directed energy deposition additive manufacturing system of claim 1 , wherein the logic performs validation of a set of measurements, sampling of the set of measurements based on the validation to a pre-set spatial resolution, and fitting of the set of measurements to a workpiece coordinate system based on a grid spacing.

21. The directed energy deposition additive manufacturing system of claim 1 , wherein the controller operates feedback control logic to maintain the standoff distance.

22. Further comprising a positioning unit, 10. The directed energy deposition additive manufacturing system of claim 1, wherein the logic is programmed to avoid at least one of vibration or sudden movement of the positioning unit.

23. 10. The directed energy deposition additive manufacturing system of claim 1 , wherein the feed unit is a wire feed unit having a feed rate, and the logic maintains the feed rate and further calculates a real-time dynamic tool center point position.

24. 10. The directed energy deposition additive manufacturing system of claim 1, wherein the logic is programmed to control at least one of an inert gas flow rate, a welding current, a temperature, loading the workpiece, unloading the workpiece, loading a wire spool, or unloading the wire spool.

25. 10. The directed energy deposition additive manufacturing system of claim 1, wherein the mover is at least one of a motor, an engine, an actuator, a mechanical linkage, a gear mechanism, a pulley mechanism, a hydraulic mechanism, or a pneumatic mechanism.

26. The logic runs on a controller, Further comprising a sensor, 10. The directed energy deposition additive manufacturing system of claim 1 , wherein the controller controls the mover to vertically move the plasma torch based at least in part on data from the sensor to maintain the standoff distance based on a speed at which the substrate is moving.

27. The logic runs on a controller, 10. The directed energy deposition additive manufacturing system of claim 1, wherein the controller controls the mover to vertically move the plasma torch to maintain the standoff distance based on how quickly the material is being melted via the plasma.

28. The logic runs on a controller, 2. The directed energy deposition additive manufacturing system of claim 1, wherein the plasma torch includes a central tip portion, and the controller controls the mover to vertically move the plasma torch to maintain the standoff distance based on a rate at which the material is being fed through a wire source such that a droplet resulting from the material being melted contacts the workpiece before the droplet is positioned directly beneath the central tip portion.

29. The logic runs on a controller, 10. The directed energy deposition additive manufacturing system of claim 1, wherein the controller is programmed to request the mover to move the plasma torch vertically incrementally to minimize vibration of the plasma torch while the plasma torch is moving vertically.

30. The logic operates on a controller, 2. The directed energy deposition additive manufacturing system of claim 1, wherein the controller is programmed to request the mover to gradually move the plasma torch along the vertical axis to minimize sudden movements of the plasma torch while the plasma torch is moving along the vertical axis.

31. The logic runs on a controller, further comprising an object other than a workpiece that engages the substrate; 10. The directed energy deposition additive manufacturing system of claim 1, wherein the controller is programmed to request the mover to move the plasma torch vertically to avoid collision with the object.

32. 32. The directed energy deposition additive manufacturing system of claim 31 , wherein the object is a clamp that clamps the substrate.

33. The logic runs on a controller, 10. The directed energy deposition additive manufacturing system of claim 1, wherein the controller is programmed to limit vertical movement of the plasma torch based on a bead profile.

34. The logic runs on a controller, 10. The directed energy deposition additive manufacturing system of claim 1, wherein the controller is programmed to limit vertical movement of the plasma torch based on a workpiece profile.

35. 10. The directed energy deposition additive manufacturing system of claim 1, wherein the controller is programmed to dynamically adjust vertical movement of the plasma torch based on an error generated from validating a standoff distance deviation value.

36. 2. The directed energy deposition additive manufacturing system of claim 1, wherein the standoff distance measurement unit is configured to generate a plurality of readings, and the controller is programmed to receive the readings from the standoff distance measurement unit and verify the validity of the readings before the controller requests the mover to vertically move the plasma torch.

37. 2. The directed energy deposition additive manufacturing system of claim 1, wherein the standoff distance measurement unit is configured to generate a plurality of readings, the workpiece generating reflections from the plasma, and the controller is programmed to apply at least one of a high dynamic range (HDR) technique or a pre-filtering technique to the readings to reduce at least one of the reflections or stray light due to at least one of the workpiece or the plasma.

38. 2. The directed energy deposition additive manufacturing system of claim 1, wherein the plasma torch is a first plasma torch, and the directed energy deposition additive manufacturing system further comprises a second plasma torch that preheats the substrate, the second plasma torch being positioned between the standoff distance measurement unit and the first plasma torch.

39. 10. The directed energy deposition additive manufacturing system of claim 1, wherein the controller controls the mover to vertically move the plasma torch to maintain the standoff distance based on the substrate experiencing at least one of a distortion, warping, or deformation in at least one of a vertical or horizontal direction.

40. 10. The directed energy deposition additive manufacturing system of claim 1, wherein the controller controls the mover to vertically move the plasma torch to maintain the standoff distance based on at least one of a feature of the workpiece, a joint of the workpiece, an intersection of the workpiece, a non-planar height step, a non-planar string surface, or at least one of a distortion, bow, or deformation of the substrate.

41. 13. The directed energy deposition additive manufacturing system of claim 1, further comprising a sensor monitoring the mover, the logic coupled to the sensor, the logic controlling the mover to vertically move the plasma torch to maintain the standoff distance based on the sensor.

42. Outputting the material; outputting plasma via a plasma torch; melting the material via the plasma such that a workpiece is additively manufactured on a substrate, the workpiece having a geometric profile, the plasma torch being positioned vertically spaced apart from the workpiece such that a standoff distance is defined between the plasma torch and the workpiece; monitoring the geometric profile while the workpiece is additively manufactured such that a mover can at least one of move the plasma torch relative to the substrate or move the substrate relative to the plasma torch to maintain the standoff distance; A method of additive manufacturing comprising:

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