Display device

Abstract

To provide a display device that is simple in structure, and has improved flexibility.SOLUTION: A display device includes: an organic light emitting display panel that includes a circuit layer; and a touch sensing unit that is arranged on the organic light emitting display panel, and is coupled to a sensor block and a touch signal line coupled to the sensor block. The circuit layer includes: a first signal line that is arranged on a base layer; a first inter-layer insulation layer that is arranged on the first signal line; a second signal line that is arranged on the first inter-layer insulation layer; and a dummy conductive pattern. Respective first touch signal lines of the touch signal line include: a touch wiring part; and a touch pad part that is coupled to a final end of the touch wiring part. The dummy conductive pattern includes a dummy conductive pad that is arranged on the same layer as the first signal line or the second signal line, and is superimposed on a touch pad part.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a display device, and more particularly, to a display device integrated with a touch sensing unit. [Background technology]

[0002] A variety of display devices have been developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles. Input devices for the display devices include keyboards and mice. Recently, display devices have also been equipped with touch panels as input devices. Summary of the Invention [Problem to be solved by the invention]

[0003] An object of the present invention is to provide a display device having a simple structure and improved flexibility. [Means for solving the problem]

[0004] A display device according to an embodiment of the present invention includes an organic light emitting display panel and a touch sensing unit, the organic light emitting display panel including a base layer, a circuit layer disposed on the base layer, a light emitting element layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting element layer.

[0005] The touch sensing units are disposed on the thin film encapsulation layer, and each includes a sensor block arranged in a column direction, first and second sensor columns arranged along a row direction intersecting the column direction, and touch signal lines connected to the sensor blocks.

[0006] Each of the sensor blocks includes a first sensor and i (where i is a natural number equal to or greater than 2) second sensors arranged in the column direction.

[0007] The touch signal lines include a first touch signal line respectively connected to first sensors of the sensor blocks, a second touch signal line connecting a jth (where j is a natural number from 1 to i) second sensor among the i second sensors of an nth sensor block among the sensor blocks to an i-j+1th second sensor among the i second sensors of an n+1th sensor block among the sensor blocks, and a third touch signal line.

[0008] The third touch signal line is connected to one of the second touch signal lines connected to the jth second sensor of the first sensor block of the first sensor row and another of the second touch signal lines connected to the jth second sensor of the first sensor block of the second sensor row, or connected to one of the first touch signal lines connected to the first sensor of the first sensor block of the first sensor row and another of the first touch signal lines connected to the first sensor of the first sensor block of the second sensor row.

[0009] The circuit layer includes a first signal line disposed on the base layer, a first interlayer insulating layer disposed on the first signal line, a second signal line disposed on the first interlayer insulating layer, and a dummy conductive line disposed on the same layer as the first signal line or the second signal line.

[0010] Among the one first touch signal line, the other one first touch signal line, the one second touch signal line, and the other one second touch signal line, signal lines that are not connected to the third touch signal line are disposed on the same layer as the third touch signal line, and one of the signal lines that are not connected to the third touch signal line and the third touch signal line is connected to the dummy conductive line.

[0011] The third touch signal line is connected to the one second touch signal line and the other one second touch signal line, and the signal lines not connected to the third touch signal line include the one first touch signal line and the other one first touch signal line, the one first touch signal line and the other one first touch signal line are connected to the dummy conductive line, and the third touch signal line overlaps the dummy conductive line.

[0012] Each of the first touch signal line and the other touch signal line includes a touch wiring portion and a touch pad portion connected to an end of the touch wiring portion.

[0013] The touch wiring portion includes a first wiring portion having one end connected to a corresponding first sensor among the first sensors of the sensor block and the other end connected to the dummy conductive line, and a second wiring portion having one end connected to the dummy conductive line and the other end connected to the touch pad portion.

[0014] The dummy conductive line is disposed on the same layer as the first signal line, and the first wiring portion is connected to the dummy conductive line through a first contact hole penetrating the first interlayer insulating layer.

[0015] The third touch signal line is connected to the one second touch signal line and the other one second touch signal line, and signal lines not connected to the third touch signal line include the one first touch signal line and the other one first touch signal line. The third touch signal line is connected to the dummy conductive line, and the one first touch signal line and the other one first touch signal line overlap the dummy conductive line.

[0016] The third touch signal line includes a first wiring portion having one end connected to the dummy conductive line and a second wiring portion having one end connected to the dummy conductive line and spaced apart from the first wiring portion in the row direction.

[0017] The third touch signal line is connected to the one of the first touch signal lines and the other one of the first touch signal lines, and signal lines not connected to the third touch signal line include the one of the second touch signal lines and the other one of the second touch signal lines. The one of the second touch signal lines and the other one of the second touch signal lines are connected to the dummy conductive line, and the third touch signal line overlaps the dummy conductive line.

[0018] Each of the one second touch signal line and the other one second touch signal line includes a touch wiring portion and a touch pad portion connected to an end of the touch wiring portion.

[0019] The touch wiring portion includes a first wiring portion having one end connected to the jth second sensor and the other end connected to the dummy conductive line, and a second wiring portion having one end connected to the dummy conductive line and the other end connected to the touch pad portion.

[0020] The third touch signal line is connected to the one of the first touch signal lines and the other one of the first touch signal lines, and signal lines not connected to the third touch signal line include the one of the second touch signal lines and the other one of the second touch signal lines. The third touch signal line is connected to the dummy conductive line, and the one of the second touch signal lines and the other one of the second touch signal lines overlap the dummy conductive line.

[0021] The third touch signal line includes a first wiring portion having one end connected to the dummy conductive line and a second wiring portion having one end connected to the dummy conductive line and spaced apart from the first wiring portion in the row direction.

[0022] A display device according to an embodiment of the present invention includes an organic light emitting display panel including a base layer, a circuit layer disposed on the base layer, a light emitting element layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting element layer, and a touch sensing unit disposed on the thin film encapsulation layer, the touch sensing unit including a touch sensor and a touch signal line connected to the touch sensor.

[0023] The circuit layer includes a first signal line disposed on the base layer, a first interlayer insulating layer disposed on the first signal line, a second signal line disposed on the first interlayer insulating layer, and a dummy conductive pad. Each of the first touch signal lines among the touch signal lines includes a touch wiring portion and a touchpad portion connected to an end of the touch wiring portion. The dummy conductive pad is disposed on the same layer as the first signal line or the second signal line and overlaps the touchpad portion.

[0024] The dummy conductive pads include a first dummy conductive pad disposed on the same layer as the first signal line and a second dummy conductive pad disposed on the same layer as the second signal line.

[0025] The touch pad portion is connected to the first dummy conductive pad through a first contact hole penetrating at least the first interlayer insulating layer.

[0026] The circuit layer further includes a second interlayer insulating layer disposed on the second signal line, and the touch pad portion is connected to the second dummy conductive pad through a second contact hole penetrating the second interlayer insulating layer.

[0027] Each of the first dummy conductive pad and the second dummy conductive pad is a floating electrode.

[0028] Each of the second touch signal lines includes a signal wiring portion and a signal pad portion connected to an end of the signal wiring portion. The touch sensing unit further includes a floating electrode disposed on the same layer as the touch pad portion and connected to the signal pad portion.

[0029] The touch sensing device further includes an engineered member overlying the touch sensing unit. The touch panel further includes a resin layer covering a portion of the touch signal line exposed from the optical member.

[0030] The touch sensor and the touch signal line are disposed directly on the thin film encapsulation layer.

[0031] The light emitting device layer includes a light emitting region and a non-light emitting region adjacent to the light emitting region, and the touch signal line has a mesh shape overlapping the non-light emitting region.

[0032] The touch sensor includes a plurality of sensor rows each including a sensor block arranged in a column direction, each sensor block including a sensor connected to the touch signal line, the sensor having a mesh shape overlapping the non-light emitting area.

[0033] The organic light emitting device panel includes a display area overlapping the thin film encapsulation layer and a non-display area not overlapping the thin film encapsulation layer, and the dummy conductive pad and the touch pad unit are disposed in the non-display area.

[0034] A display device according to an embodiment of the present invention includes an organic light emitting display panel including a base layer, a circuit layer disposed on the base layer, a light emitting element layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting element layer, and a touch sensing unit disposed on the thin film encapsulation layer, including a first touch sensor, a second touch sensor, and first and second touch signal lines disposed in the same layer as the first and second touch sensors and respectively connected to the first and second touch sensors.

[0035] The circuit layer includes a first signal line disposed on the base layer, a second signal line insulated from and crossing the first signal line, and a dummy conductive line disposed on the same layer as the first signal line or the second signal line.

[0036] The first touch signal line includes a first wiring portion having one end connected to the first sensor and the other end connected to the dummy conductive line, and a second wiring portion having one end connected to the dummy conductive line and the other end connected to a touch pad portion, and the second touch signal line crosses the dummy conductive line in an insulated manner. Effect of the Invention

[0037] As described above, the display device includes a single-layer touch sensing unit, which simplifies the structure compared to a display device including a multi-layer touch sensing unit, and reduces stress on the touch sensing unit even when the display device is bent, because the touch sensing unit is slim.

[0038] By using the dummy conductive pattern disposed on the organic light emitting display panel, the pad area of ​​the touch sensing unit may be formed in a laminated structure similar to that of the pad area of ​​the organic light emitting display panel. Since the pad area of ​​the display device has a uniform laminated structure, the reliability of bonding with the circuit board may be improved.

[0039] The crossing area of ​​the touch signal lines can be realized by using the conductive pattern disposed on the organic light emitting display panel, and a single-layer touch sensing unit can be formed without requiring an additional process for forming a bridge. [Brief description of the drawings]

[0040] [Figure 1] 1 is a perspective view of a display device according to an embodiment of the present invention in a first operation; [Diagram 2] 4 is a perspective view of a display device according to an embodiment of the present invention in a second operation; FIG. [Diagram 3] FIG. 11 is a perspective view of a display device according to an embodiment of the present invention in a third operation. [Figure 4] 1 is a perspective view of a display device according to an embodiment of the present invention in a first operation; [Diagram 5] 4 is a perspective view of a display device according to an embodiment of the present invention in a second operation; FIG. [Figure 6]1 is a cross-sectional view of a display device according to an embodiment of the present invention. [Figure 7] 1 is a cross-sectional view of a display module according to an embodiment of the present invention. [Figure 8] 1 is a plan view of an organic light emitting display panel according to an embodiment of the present invention; [Figure 9] FIG. 2 is an equivalent circuit diagram of a pixel according to an embodiment of the present invention. [Figure 10] 1 is a partial cross-sectional view of an organic light-emitting display panel according to an embodiment of the present invention. [Figure 11] 1 is a partial cross-sectional view of an organic light-emitting display panel according to an embodiment of the present invention. [Figure 12] 2 is a plan view of a pad area of ​​an organic light-emitting display panel according to an embodiment of the present invention; [Figure 13] 2 is a cross-sectional view of a pad area of ​​an organic light-emitting display panel according to an embodiment of the present invention; [Figure 14] FIG. 2 is a plan view of a touch sensing unit according to an embodiment of the present invention. [Figure 15] FIG. 2 is a plan view of a sensor block according to one embodiment of the present invention. [Figure 16] FIG. 2 is a plan view of a touch sensing unit according to an embodiment of the present invention. [Figure 17] FIG. 2 is an enlarged plan view of a touch sensor and a touch signal line according to an embodiment of the present invention. [Figure 18] 1 is a cross-sectional view of a display module according to an embodiment of the present invention. [Figure 19] FIG. 2 is a plan view of a pad area of ​​a touch sensing unit according to an embodiment of the present invention. [Figure 20] 4 is a cross-sectional view of a pad area of ​​a touch sensing unit according to an embodiment of the present invention; [Figure 21] FIG. 2 is a plan view of a pad area of ​​a touch sensing unit according to an embodiment of the present invention. [Figure 22] 4 is a cross-sectional view of a pad area of ​​a touch sensing unit according to an embodiment of the present invention; [Figure 23] FIG. 2 is a plan view showing the positional relationship between a display module and a circuit board according to an embodiment of the present invention. [Figure 24] FIG. 2 is a plan view of a pad area of ​​a touch sensing unit according to an embodiment of the present invention. [Diagram 25] 4 is a cross-sectional view of a pad area of ​​a touch sensing unit according to an embodiment of the present invention; [Figure 26] FIG. 2 is a plan view of a pad area of ​​a touch sensing unit according to an embodiment of the present invention. [Figure 27] 4 is a cross-sectional view of a pad area of ​​a touch sensing unit according to an embodiment of the present invention; [Figure 28] 1 is a cross-sectional view of a display module according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0041] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification, when a component (or a region, layer, portion, etc.) is referred to as being "on," "connected," or "bonded" to another component, this means that it is directly disposed / connected / bonded to the other component, or that a third component may be disposed therebetween.

[0042] The same reference numerals represent the same components. Also, in the drawings, thickness, ratio and size of components may be exaggerated for effective explanation of technical contents. "And / or" includes all one or more combinations that the related configurations may define.

[0043] Terms such as first and second are used to describe various components, but the components are not limited to the terms. The terms are used only to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of the present invention. A singular expression includes a plural expression unless otherwise specified in the context.

[0044] In addition, terms such as "under", "below", "up" and "above" are used to describe the relationship between components shown in the drawings. The terms are relative concepts and will be described based on the directions shown in the drawings.

[0045] It should be understood that the terms "comprise" or "have" are intended to indicate the presence of a specified feature, numeral, step, operation, component, part, or combination thereof, but do not preclude the presence or additional possibility of one or more other features, numerals, steps, operations, components, parts, or combinations thereof.

[0046] Fig. 1 is a perspective view of a display device DD according to an embodiment of the present invention in a first operation. Fig. 2 is a perspective view of a display device DD according to an embodiment of the present invention in a second operation. Fig. 3 is a perspective view of a display device DD according to an embodiment of the present invention in a third operation. Fig. 4 is a perspective view of a display device according to an embodiment of the present invention in a first operation. Fig. 5 is a perspective view of a display device according to an embodiment of the present invention in a second operation.

[0047] As shown in FIG. 1, in the first operation mode, a display surface IS on which an image IM is displayed is parallel to a plane defined by a first directional axis DR1 and a second directional axis DR2. A normal direction of the display surface IS, i.e., a thickness direction of the display device DD, is indicated by a third directional axis DR3. A front surface (or upper surface) and a rear surface (or lower surface) of each member are divided by the third directional axis DR3. However, the directions indicated by the first to third directional axes DR1, DR2, and DR3 are relative concepts and may be converted to other directions. Hereinafter, the first to third directions refer to the directions indicated by the first to third directional axes DR1, DR2, and DR3, respectively, and the same drawing symbols are used. In this embodiment, a flexible device is illustrated, but the present invention is not limited thereto. The display device DD according to this embodiment may be a flat display device.

[0048] 1 to 3 show a foldable display device as an example of a flexible display device DD. However, the present invention is not particularly limited and may be a rollable flexible display device that is rolled up. The flexible display device DD according to the present invention can be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation systems, game consoles, and smart watches.

[0049] As shown in FIG. 1, the display surface IS of the flexible display device DD includes a plurality of regions. The flexible display device DD includes a display area DD-DA in which an image IM is displayed, and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area in which no image is displayed. In FIG. 1, a vase is shown as an example of an image IM. As an example, the display area DD-DA is rectangular. The non-display area DD-NDA surrounds the display area DD-DA. However, this is not limited to this, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA may be designed relatively.

[0050] As shown in Figures 1 to 3, the display device DD includes a number of regions defined according to the operating form. The display device DD includes a bending region BA that is bent based on a bending axis BX, a first non-bending region NBA1 that is not bent, and a second non-bending region NBA2. As shown in Figure 2, the display device DD is inner-bending so that the display surface IS of the first non-bending region NBA1 faces the display surface IS of the second non-bending region NBA2. As shown in Figure 3, the display device DD may be outer-bending so that the display surface IS is exposed to the outside.

[0051] In one embodiment of the present invention, the display device DD includes a plurality of bending areas BA. In addition, the bending areas BA may be defined in accordance with the manner in which the user operates the display device DD. For example, the bending areas BA may be defined parallel to the first directional axis DR1, or may be defined diagonally, unlike in Figs. 2 and 3. The area of ​​the bending areas is not fixed, but is determined by the radius of curvature. In one embodiment of the present invention, the display device DD may be configured to repeat only the operation modes shown in Figs. 1 and 2.

[0052] 4 and 5 show an example of a foldable display device DD-1, which shows a display device in which a non-display area DD-NDA is folded. As such, the display device DD-1 according to the present invention does not limit the number of bending areas BA and non-bending areas NBA, and does not limit the position of the bending area.

[0053] Fig. 6 is a cross-sectional view of a display device DD according to an embodiment of the present invention. Fig. 7 is a cross-sectional view of a display module DM according to an embodiment of the present invention. Fig. 6 shows a cross section defined by a first directional axis DR1 and a third directional axis DR3, and Fig. 7 shows a cross section defined by the first directional axis DR1 and the third directional axis DR3.

[0054] 6, the display device DD includes a protective film PM, a window WM, a display module DM, a first adhesive member AM1, and a second adhesive member AM2. The display module DM is disposed between the protective film PM and the window WM. The first adhesive member AM1 connects the display module DM to the protective film PM, and the second adhesive member AM2 connects the display module DM to the window WM.

[0055] The protective film PM protects the display module DM. The protective film PM provides a first outer surface OS-L exposed to the outside and an adhesive surface AS1 to be attached to a first adhesive member AM1. Hereinafter, the adhesive surface AS1 of the protective film PM will be referred to as the first adhesive surface AS1 to distinguish it from the adhesive surfaces of other members. The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external shocks.

[0056] The protective film PM includes a plastic film as a base layer, which includes any one selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), polyarylene ether sulfone, and combinations thereof.

[0057] The material constituting the protective film PM is not limited to plastic resin, but may include organic / inorganic composite materials. The protective film PM includes a porous organic layer and an inorganic material filled in the pores of the organic layer. The protective film PM further includes a functional layer formed on the plastic film. The functional layer includes a resin layer. The functional layer is formed by a coating method.

[0058] The window WM protects the display module DM from external impacts and provides an input surface for a user. The window WM provides a second outer surface OS-U exposed to the outside and an adhesive surface AS2 to be attached to a second adhesive member AM2. The display surface IS shown in Figures 1 to 3 may be the second outer surface OS-U. Hereinafter, the adhesive surface AS2 of the window WM will be referred to as the second adhesive surface AS2 to distinguish it from the adhesive surfaces of other members.

[0059] The display module DM includes an organic light-emitting display panel DP and a touch sensing unit TS integrally formed by a continuous process. The organic light-emitting display panel DP generates an image IM (see FIG. 1) corresponding to input image data. The organic light-emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing each other in a thickness direction DR3.

[0060] The touch sensing unit TS obtains coordinate information of an external input. The touch sensing unit TS is disposed directly on the second display panel surface BS1-U. In this embodiment, the touch sensing unit TS is provided by a continuous process with the organic light emitting display panel DP.

[0061] Although not shown, the display module DM according to an embodiment of the present invention may further include an anti-reflection layer. The anti-reflection layer may include a color filter, a laminated structure of a conductive layer / a dielectric layer / a conductive layer, or an optical member. The anti-reflection layer absorbs, destructively interferes, or polarizes light incident from the outside, thereby reducing reflection of the external light.

[0062] Each of the first adhesive member AM1 and the second adhesive member AM2 is an optically clear adhesive film (OCA), an optically clear adhesive resin (OCR), or a pressure sensitive adhesive film (PSA). Each of the first adhesive member AM1 and the second adhesive member AM2 includes a photocurable adhesive material or a thermosetting adhesive material, but the material is not particularly limited. Although not shown, the display device DD further includes a frame structure supporting the functional layer in order to maintain the state shown in Figures 1 to 3. The frame structure includes a joint structure or a hinge structure.

[0063] The display device DD-1 shown in Figures 4 and 5 is fixed in one form and operates, unlike the display device DD shown in Figures 1 to 3. The display device DD-1 operates in a folded state as shown in Figure 5. The display device DD-1 is fixed to a frame or the like in the folded state, and the frame is coupled to the housing of the electronic device.

[0064] The display device DD-1 shown in Figures 4 and 5 has a cross section along the first direction DR1 that is different from the display device DD shown in Figures 1 to 3. The display device DD-1 shown in Figures 4 and 5 has a stacked structure in which the non-bending area NBA and the bending area BA have different stacked structures. The non-bending area NBA has the same cross-sectional structure as that shown in Figure 6, and the bending area BA has a cross-sectional structure different from that shown in Figure 2. The optical member LM and the window WM may not be arranged in the bending area BA. That is, the optical member LM and the window WM may be arranged only in the non-bending area NBA. The second adhesive member AM2 and the third adhesive member AM3 may also not be arranged in the bending area BA.

[0065] 7, the organic light emitting display panel DP includes a base layer SUB, a circuit layer DP-CL disposed on the base layer SUB, a light emitting element layer DP-OLED, and a thin film encapsulation layer TFE. The base layer SUB includes at least one plastic film. The base layer SUB is a flexible substrate, and may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate.

[0066] The circuit layer DP-CL includes a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer DP-CL constitute a signal line or a circuit part of a pixel. The light-emitting element layer DP-OLED includes an organic light-emitting diode. The thin-film encapsulation layer TFE seals the light-emitting element layer DP-OLED. The thin-film encapsulation layer TFE includes at least two inorganic thin films and an organic thin film disposed therebetween. The inorganic thin films protect the light-emitting element layer DP-OLED from moisture, and the organic thin films protect the light-emitting element layer DP-OLED from foreign substances such as dust particles.

[0067] In this embodiment, the touch sensing unit TS is a single-layer type. The touch sensing unit TS includes a single conductive layer. Here, the single conductive layer means that there is one conductive layer separated by an insulating layer. The stacked structure of the first metal layer / second metal layer / metal oxide layer corresponds to a single conductive layer, and the stacked structure of the first metal layer / insulating layer / metal oxide layer corresponds to a double conductive layer.

[0068] The single conductive layer is patterned to form sensors and touch signal lines. That is, the sensors of the touch sensing units TS are disposed on the same layer as each other. The sensors are disposed directly on the thin film encapsulation layer TFE. Also, a portion of each of the touch signal lines is disposed on the same layer as the sensors. A portion of each of the touch signal lines is disposed on the circuit layer DP-CL. A detailed description of the structure of the touch sensing units TS will be provided later.

[0069] The touch signal lines and sensors may include ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), PEDOT, metal nanowires, graphene. The touch signal lines and sensors may include a metal layer, such as molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The touch signal lines and sensors may include the same material or different materials.

[0070] The display module DM according to this embodiment includes a single-layer touch sensing unit, which simplifies the structure compared to a display module DM including a multi-layer touch sensing unit. Even if the display module DM is bent as shown in Figures 2 and 3, stress generated in the touch sensing unit TS is reduced because the touch sensing unit TS is slim.

[0071] Fig. 8 is a plan view of an organic light emitting display panel DP according to an embodiment of the present invention. Fig. 9 is an equivalent circuit diagram of a pixel PX according to an embodiment of the present invention. Figs. 10 and 11 are partial cross-sectional views of an organic light emitting display panel DP according to an embodiment of the present invention. Fig. 12 is a plan view of a pad area of ​​an organic light emitting display panel DP according to an embodiment of the present invention. Fig. 13 is a cross-sectional view of a pad area of ​​an organic light emitting display panel DP according to an embodiment of the present invention.

[0072] 8, the organic light-emitting display panel DP includes a display area DA and a non-display area NDA on a plane. The display area DA and non-display area NDA of the organic light-emitting display panel DP correspond to the display area DD-DA and non-display area DD-NDA of the display device DD, respectively. The display area DA and non-display area NDA of the organic light-emitting display panel DP do not necessarily have to be the same as the display area DD-DA and non-display area DD-NDA of the display device DD, and may be changed according to the structure / design of the organic light-emitting display panel DP.

[0073] The organic light emitting display panel DP includes a plurality of signal lines SGL and a plurality of pixels PX. The area in which the plurality of pixels PX are arranged is defined as a display area DA. In this embodiment, the non-display area NDA is defined along the periphery of the display area DA.

[0074] The signal lines SGL include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. The gate lines GL are connected to corresponding pixels PX among the pixels PX, and the data lines DL are connected to corresponding pixels PX among the pixels PX. The power lines PL are connected to the pixels PX. A gate driving circuit DCV to which the gate lines GL are connected is disposed on one side of the non-display area NDA. The control signal line CSL provides a control signal to the gate driving circuit DCV.

[0075] Some of the gate lines GL, data lines DL, power lines PL, and control signal lines CSL are arranged on the same layer, and some are arranged on other layers. When a signal line arranged on one layer of the gate lines GL, data lines DL, power lines PL, and control signal lines CSL is defined as a first signal line, a signal line arranged on another layer is defined as a second signal line. Furthermore, a signal line arranged on yet another layer is defined as a third signal line.

[0076] Each of the gate line GL, the data line DL, the power line PL, and the control signal line CSL includes a signal wiring portion and a signal pad portion connected to an end of the signal wiring portion. The signal wiring portion is defined as a portion of each of the gate line GL, the data line DL, the power line PL, and the control signal line CSL excluding the signal pad portion. As an example of the signal pad portion, a control pad portion CSL-P, a data pad portion DL-P, and a power pad portion PL-P are illustrated. Although not illustrated, the gate pad portion overlaps with the gate driving circuit DCV and is connected to the gate driving circuit DCV. Although not illustrated, a portion of the non-display area NDA where the control pad portion CSL-P, the data pad portion DL-P, and the power pad portion PL-P are aligned is defined as a pad area. As will be described later, the pad portion of the touch sensing unit TS is disposed adjacent to the pad portion of the above-mentioned organic light emitting display panel DP.

[0077] 9 shows an example of a pixel PX connected to one gate line GL, one data line DL, and a power line PL. The configuration of the pixel PX is not limited thereto and may be modified.

[0078] The pixel PX is a display element and includes an organic light emitting diode OLED. The organic light emitting diode OLED may be a front-emitting diode or a back-emitting diode. The pixel PX includes a first transistor TFT1 (or a switching transistor), a second transistor TFT2 (or a driving transistor), and a capacitor (CAP) as a circuit unit for driving the organic light emitting diode OLED.

[0079] The first transistor TFT1 outputs a data signal applied to the data line DL in response to a scan signal applied to the gate line GL. The capacitor CAP charges a voltage corresponding to the data signal received from the first transistor TFT1.

[0080] The second transistor TFT2 is connected to the organic light emitting diode OLED. The second transistor TFT2 controls a driving current flowing through the organic light emitting diode OLED according to the amount of charge stored in the capacitor CAP. The organic light emitting diode OLED emits light during a turn-on period of the second transistor TFT2.

[0081] Fig. 10 shows a cross section of a portion corresponding to the first transistor TFT1 and the capacitor CAP in the equivalent circuit shown in Fig. 9. Fig. 11 shows a cross section of a portion corresponding to the second transistor TFT2 and the organic light emitting diode OLED in the equivalent circuit shown in Fig. 9.

[0082] 10 and 11, a circuit layer DP-CL is disposed on a base layer SUB. A semiconductor pattern AL1 (hereinafter, first semiconductor pattern) of a first transistor TFT1 and a semiconductor pattern AL2 (hereinafter, second semiconductor pattern) of a second transistor TFT2 are disposed on the base layer SUB. The first semiconductor pattern and the second semiconductor pattern are selected from amorphous silicon, polysilicon, and metal oxide semiconductors to be the same or different from each other.

[0083] Although not shown, a functional layer may be further disposed on one surface of the base layer SUB. The functional layer includes at least one of a barrier layer or a buffer layer. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 are disposed on the barrier layer or the buffer layer.

[0084] A first insulating layer 12 is disposed on the base layer SUB to cover the first semiconductor pattern AL1 and the second semiconductor pattern AL2. The first insulating layer 12 includes an organic layer and / or an inorganic layer. In particular, the first insulating layer 12 includes a plurality of inorganic thin films. The plurality of inorganic thin films includes a silicon nitride layer and a silicon oxide layer.

[0085] A control electrode GE1 (hereinafter, first control electrode) of the first transistor TFT1 and a control electrode GE2 (hereinafter, second control electrode) of the second transistor TFT1 are disposed on the first insulating layer 12. A first electrode E1 of the capacitor CAP is disposed on the first insulating layer 12. The first control electrode GE1, the second control electrode GE2, and the first electrode E1 are manufactured by the same photolithography process as the gate line GL (see FIG. 8). In other words, the first electrode E1 is made of the same material as the gate line GL, has the same laminated structure, and is disposed on the same layer.

[0086] A second insulating layer 14 is disposed on the first insulating layer 12, covering the first control electrode GE1, the second control electrode GE2, and the first electrode E1. The second insulating layer 14 includes an organic layer and / or an inorganic layer. In particular, the second insulating layer 14 includes a plurality of inorganic thin films. The plurality of inorganic thin films includes a silicon nitride layer and a silicon oxide layer.

[0087] A data line DL (see FIG. 8) is disposed on the second insulating layer 14. An input electrode SE1 (hereinafter, first input electrode) and an output power DE1 (hereinafter, first output electrode) of the first transistor TFT1 are disposed on the second insulating layer 14. An input electrode SE2 (hereinafter, second input electrode) and an output power DE2 (hereinafter, second output electrode) of the second transistor TFT2 are disposed on the second insulating layer 14. The first input electrode SE1 branches off from a corresponding one of the data lines DL. A power supply line PL (see FIG. 8) is disposed on the same layer as the data line DL. The second input electrode SE2 branches off from the power supply line PL.

[0088] A second electrode E2 of the capacitor CAP is disposed on the second insulating layer 14. The second electrode E2 is manufactured by the same photolithography process as the data line DL and the power line PL, is made of the same material, has the same layered structure, and is disposed on the same layer.

[0089] The first input electrode SE1 and the first output electrode DE1 are respectively connected to the first semiconductor pattern AL1 through a first through hole CH1 and a second through hole CH2 that penetrate the first insulating layer 12 and the second insulating layer 14. The first output electrode DE1 is electrically connected to the first electrode E1. For example, the first output electrode DE1 is connected to the first electrode E1 through a through hole (not shown) that penetrates the second insulating layer 14. The second input electrode SE2 and the second output electrode DE2 are respectively connected to the second semiconductor pattern AL2 through a third through hole CH3 and a fourth through hole CH4 that penetrate the first insulating layer 12 and the second insulating layer 14. Meanwhile, in another embodiment of the present invention, the first transistor TFT1 and the second transistor TFT2 may be modified to be implemented as a bottom gate structure.

[0090] A third insulating layer 16 is disposed on the second insulating layer 14, covering the first input electrode SE1, the first output electrode DE1, the second input electrode SE2, and the second output electrode DE2. The third insulating layer 16 includes an organic layer and / or an inorganic layer. In particular, the third insulating layer 16 includes an organic material to provide a flat surface.

[0091] Any one of the first insulating layer 12, the second insulating layer 14, and the third insulating layer 16 may be omitted depending on the circuit structure of the pixel. Each of the second insulating layer 14 and the third insulating layer 16 is defined as an interlayer insulating layer. The interlayer insulating layer is disposed between a conductive pattern disposed below and a conductive pattern disposed above the interlayer insulating layer, and insulates the conductive patterns.

[0092] The circuit layer DP-CL includes a dummy conductive pattern. The dummy conductive pattern is disposed in the same layer as the semiconductor patterns AL1, AL2, the control electrodes GE1, GE2, or the output electrodes DE1, DE2. The dummy conductive pattern is disposed in the non-display area NDA (see FIG. 8). A detailed description of the dummy conductive pattern will be given later.

[0093] A light emitting element layer DP-OLED is disposed on the third insulating layer 16. A pixel defining film PXL and an organic light emitting diode OLED are disposed on the third insulating layer 16. An anode AE ​​is disposed on the third insulating layer 16. The anode AE ​​is connected to the second output electrode DE2 via a fifth through hole CH5 penetrating the third insulating layer 16. An opening OP is defined in the pixel defining film PXL. The opening OP of the pixel defining film PXL exposes at least a portion of the anode AE.

[0094] The light-emitting element layer DP-OLED includes a light-emitting area PXA and a non-light-emitting area NPXA adjacent to the light-emitting area PXA. The non-light-emitting area NPXA surrounds the light-emitting area PXA. In this embodiment, the light-emitting area PXA is defined corresponding to the anode AE. However, the light-emitting area PXA is not limited thereto, and it is sufficient that the light-emitting area PXA is defined as an area where light is generated. The light-emitting area PXA may be defined corresponding to a portion of the anode AE ​​exposed by the opening OP.

[0095] The hole control layer HCL is disposed in common to the light emitting area PXA and the non-light emitting area NPXA. Although not shown, a common layer such as the hole control layer HCL may be formed in common to a plurality of pixels PX (see FIG. 8).

[0096] The organic light-emitting layer EML is disposed on the hole control layer HCL. The organic light-emitting layer EML is disposed only in the region corresponding to the opening OP. In other words, the organic light-emitting layer EML is formed separately for each of the multiple pixels PX.

[0097] An electronic control layer ECL is disposed on the organic light emitting layer EML. A cathode CE is disposed on the electronic control layer ECL. The cathode CE is disposed in common to a plurality of pixels PX.

[0098] In this embodiment, the patterned organic light emitting layer EML is illustrated as an example, but the organic light emitting layer EML may be disposed in common to a plurality of pixels PX. In this case, the organic light emitting layer EML generates white light. The organic light emitting layer EML has a multi-layer structure.

[0099] In this embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In this embodiment, a capping layer is further disposed to cover the cathode CE. In this case, the thin film encapsulation layer TFE directly covers the capping layer.

[0100] Fig. 12 shows an enlarged view of region AA in Fig. 8, and Fig. 13 shows a cross section corresponding to I-I' in Fig. 12. The control signal line CSL includes a control wiring portion CSL-L and a control pad portion CSL-P. The data line DL includes a data wiring portion DL-L and a data pad portion DL-P.

[0101] Dummy patterns DMP1 and DMP2 are disposed on the third insulating layer 16. The dummy patterns DMP1 and DMP2 are manufactured by the same photolithography process as the anode AE. In other words, the dummy patterns DMP1 and DMP2 are made of the same material as the anode AE, have the same layered structure, and are disposed on the same layer.

[0102] The dummy patterns DMP1 and DMP2 are floating electrodes. The dummy patterns DMP1 and DMP2 are not connected to other conductive patterns on a plane. The dummy patterns DMP1 and DMP2 are not connected to anything other than the corresponding pad portions. The first dummy pattern DMP1 is connected to the control pad portion CSL-P via a first contact hole CNT1. The second dummy pattern DMP2 is connected to the data pad portion DL-P via a second contact hole CNT2. The first contact hole CNT1 penetrates the second insulating film 14 and the third insulating film 16. The second contact hole CNT2 penetrates the third insulating film 16.

[0103] Although not shown, the cross section corresponding to the power supply pad portion PL-P is substantially the same as the cross section corresponding to the data pad portion DL-P.

[0104] In one embodiment of the present invention, the dummy patterns DMP1 and DMP2 form part of the touch sensing unit TS. The dummy patterns DMP1 and DMP2 are fabricated by the same photolithography process as the touch signal lines described below. In other words, the dummy patterns DMP1 and DMP2 are made of the same material as the touch signal lines, have the same stacking structure, and are disposed on the same layer.

[0105] Fig. 14 is a plan view of a touch sensing unit TS according to an embodiment of the present invention, Fig. 15 is a plan view of a sensor block SB according to an embodiment of the present invention, and Fig. 16 is a plan view of a touch sensing unit TS according to an embodiment of the present invention.

[0106] As shown in FIG. 14, the touch sensing unit TS includes a touch sensor and a plurality of touch signal lines SL1 to SL4 connected to the touch sensor. The touch sensor includes a plurality of sensor blocks SB arranged in a display area DA. A thin film encapsulation layer TFE (see FIG. 7) overlaps at least the display area DA and is directly disposed on the sensor blocks SB and the thin film encapsulation layer TFE. A portion of each of the plurality of touch signal lines SL1 to SL4 is disposed on the thin film encapsulation layer TFE. A portion of each of the touch signal lines SL1 is disposed on the thin film encapsulation layer TFE, and a portion of each of the touch signal lines SL1 is disposed on the third insulating layer 16 (see FIG. 19 to FIG. 22).

[0107] The sensor block SB defines a plurality of sensor columns TSC1 to TSC6 or a plurality of sensor rows TSL1 to TSL3. Each of the plurality of sensor columns TSC1 to TSC6 includes a plurality of sensor blocks SB arranged in a column direction (first direction DR1 in FIG. 14). Each of the plurality of sensor rows TSL1 to TSL3 is arranged in a row direction (second direction DR2 in FIG. 14).

[0108] 14 shows a plurality of sensor blocks SB arranged in a matrix, but is not limited to this. The plurality of sensor columns TSC1 to TSC6 include different numbers of sensor blocks SB, and the plurality of sensor rows TSL1 to TSL3 include different numbers of sensor blocks SB. The plurality of sensor columns TSC1 to TSC6 and / or the plurality of sensor rows TSL1 to TSL3 may be defined in a diagonal direction on the thin-film encapsulation layer TFE.

[0109] As shown in Fig. 15, each of the sensor blocks SB includes a first sensor RP and a plurality of second sensors TP1 to TPi. The first sensor RP is separated from the plurality of second sensors TP1 to TPi. The sensor block SB includes the first sensor RP and i (where i is a natural number of 2 or more) second sensors TP1 to TPi arranged adjacent to the first sensor RP and aligned in a predetermined direction. The i second sensors TP1 to TPi form one sensor group. The direction in which the second sensors TP1 to TPi are aligned is substantially the same as the extension direction of the first sensor RP.

[0110] Here, whether the sensor block SB includes "one first sensor" or "multiple first sensors" is determined according to the number of electrically isolated first sensors. Even if the sensor block SB includes two patterns, two conductive patterns electrically connected by a touch signal line are defined as one first sensor. This also applies to the second sensors TP1 to TPi. That is, the i second sensors TP1 to TPi shown in FIG. 15 are electrically isolated from each other. FIG. 14 exemplarily shows a sensor block SB including three second sensors TP1 to TP3.

[0111] Thereafter, the sensor columns TSC1 to TSC6 are arranged from left to right, the sensor rows TSL1 to TSL3 are arranged from top to bottom, and the i second sensors TP1 to TPi increase in order of configuration from top to bottom.

[0112] When the second sensors TP1 to TPi receive a detection signal (or a transmission signal) detecting an external input, the first sensor RP is capacitively coupled to the second sensors TP1 to TPi. When an input means is placed on a specific second sensor among the capacitively coupled first sensor RP and the second sensors TP1 to TPi, a capacitance between the first sensor RP and the specific second sensor changes. A touch detection circuit detects the changed capacitance from the specific second sensor and calculates coordinate information of the input means.

[0113] When the first sensor RP receives a detection signal detecting an external input, the touch detection circuit detects the changed capacitance from the specific second sensor and calculates coordinate information of the input means.

[0114] 14, the connection relationship between the sensor blocks SB and the touch signal lines SL1 to SL4 will be described. The connection relationship between the sensor blocks SB and the touch signal lines SL1 to SL4 will be described mainly with respect to the first sensor row TSC1 and the second sensor row TSC2.

[0115] The touch signal lines SL1 to SL4 include a first touch signal line SL1, a second touch signal line SL2, a third touch signal line SL3, and a fourth touch signal line SL4. The first touch signal lines SL1 are respectively connected to first sensors RP of the sensor blocks SB of the first sensor column TSC1.

[0116] The first touch signal lines SL1 include a touch wiring portion and a touch pad portion SL1-P connected to an end of the touch wiring portion. The touch wiring portion is defined as a portion of the first touch signal lines SL1 excluding the touch pad portions SL1-P. The touch pad portions SL1-P of the first touch signal lines SL1 are aligned in the non-display area NDA.

[0117] The second touch signal line SL2 connects a j-th (where j is a natural number from 1 to i) second sensor among the i second sensors in the n-th sensor block in the sensor block SB of the sensor row to an i-j+1-th second sensor among the i second sensors in the n+1-th sensor block. Hereinafter, a detailed description will be given with reference to three second signal lines SL2-1, SL2-2, and SL2-3 corresponding to the first sensor row TSC1.

[0118] Any one of the second touch signal lines SL2-1 connects the first second sensor TP1 of the first sensor block SB, the third second sensor TP3 of the second sensor block SB, and the first second sensor TP1 of the third sensor block SB. Another one of the second touch signal lines SL2-2 connects the second second sensor TP2 of the first to third sensor blocks SB. The remaining one of the second touch signal lines SL2-3 connects the third second sensor TP3 of the first sensor block SB, the first second sensor TP1 of the second sensor block SB, and the third second sensor TP3 of the third sensor block SB.

[0119] The second touch signal line SL2 corresponding to the first sensor row TSC1 and the second touch signal line SL2 corresponding to the second sensor row TSC2 are connected through the third touch signal line SL3. The number of the third touch signal lines SL3 is the same as the number of the second sensors arranged in one sensor block. That is, i third touch signal lines SL3 are provided. In this embodiment, three third touch signal lines SL3 are illustrated.

[0120] Any one of the second touch signal lines SL2-1 corresponding to the first sensor column TSC1 and any one of the second touch signal lines SL2-1 corresponding to the second sensor column TSC2 are connected by any one of the three third touch signal lines SL3. Another one of the second touch signal lines SL2-2 corresponding to the first sensor column TSC1 and another one of the second touch signal lines SL2-2 corresponding to the second sensor column TSC2 are connected by another one of the third touch signal lines SL3. The corresponding second sensors TP1, TP2, TP3 arranged in the plurality of sensor columns TSC1 to TSC6 are electrically connected to each other by the third touch signal line SL3.

[0121] The number of fourth touch signal lines SL4 is the same as the number of third touch signal lines SL3, i.e., i fourth touch signal lines SL4 are provided, and the i fourth touch signal lines SL4 are connected to the i third touch signal lines SL3 in one-to-one correspondence.

[0122] The fourth touch signal line SL4 includes a touch wiring portion and a touch pad portion SL4-P connected to an end of the touch wiring portion. The touch wiring portion is defined as a portion of the fourth touch signal line SL4 excluding each touch pad portion SL4-P. The touch pad portion SL4-P of the fourth touch signal line SL4 is aligned in the non-display area NDA.

[0123] The third touch signal line SL3 and the fourth touch signal line SL4 reduce the number of pads, thereby reducing short circuit defects that occur in the pad area of ​​the touch sensing unit TS.

[0124] The touch sensing unit TS' of FIG. 16 is different from the touch sensing unit TS of FIG. 14 in the connection relationship of touch signal lines.

[0125] The second touch signal line SL2 includes a touch wiring portion and a touch pad portion SL2-P connected to an end of the touch wiring portion. The first touch signal line SL1 corresponding to the first sensor column TSC1 and the first touch signal line SL1 corresponding to the second sensor column TSC2 are connected through the third touch signal line SL3. The number of the third touch signal lines SL3 is the same as the number of the first sensors arranged in one sensor column. In this embodiment, three third touch signal lines SL3 are illustrated.

[0126] The first first sensor RA of the first sensor column TSC1 and the first first sensor RA of the second sensor column TSC2 are connected by one of the three third touch signal lines SL3. The second first sensor RA of the first sensor column TSC1 and the second first sensor RA of the second sensor column TSC2 are connected by another of the three third touch signal lines SL3. The third first sensor RA of the first sensor column TSC1 and the third first sensor RA of the second sensor column TSC2 are connected by another of the three third touch signal lines SL3. The fourth touch signal lines SL4 are provided in the same number as the number of the third touch signal lines SL3. That is, i fourth touch signal lines SL4 are provided.

[0127] Fig. 17 is an enlarged plan view of a second sensor TP and a second touch signal line SL2 according to an embodiment of the present invention. Fig. 18 is a cross-sectional view of a display module DM according to an embodiment of the present invention. Fig. 17 shows one second sensor TP and a part of a second touch signal line SL2 connected thereto. Fig. 18 shows a cross section corresponding to II-II' in Fig. 17.

[0128] The display area DA includes a plurality of light-emitting areas PXA and a non-light-emitting area NPXA surrounding the plurality of light-emitting areas PXA. The second sensor TP and the second touch signal line SL2 are each a mesh-like shape overlapping the non-light-emitting area NPXA. Although not shown, the first sensor RP may also be a mesh-like shape.

[0129] The second sensor TP includes a plurality of vertical portions extending in a first direction DR1 and a plurality of horizontal portions extending in a second direction DR2. The vertical portions and the horizontal portions are defined as mesh lines. The mesh lines have a line width of several μm.

[0130] The vertical portions and the horizontal portions are connected to each other to form a plurality of touch openings TS-OP. In FIG. 17, one touch opening TS-OP is indicated by a dotted line. Although the touch opening TS-OP is illustrated to correspond to the light emitting area PXA in a 1:1 manner, this is not limited thereto. One touch opening TS-OP may correspond to two or more light emitting areas PXA. Although FIG. 18 illustrates the mesh lines exposed to the outside, the display module DM may further include an insulating layer disposed on the thin film encapsulation layer TFE to cover the mesh lines.

[0131] Figures 19 to 22 show planes or cross sections of a pad area of ​​a touch sensing unit TS according to an embodiment of the present invention. Figure 19 shows an enlarged view of the BB area of ​​Figure 14, and Figure 20 shows a cross section corresponding to III-III' of Figure 19. Figure 21 shows an enlarged view of the BB area of ​​Figure 14, and Figure 22 shows a cross section corresponding to III-III' of Figure 21. Figure 23 is a plan view showing the positional relationship between a display module DM and a circuit board PCB according to an embodiment of the present invention.

[0132] 19 and 20, each of the fourth touch signal lines SL4 includes a touch wiring portion SL4-L and a touchpad portion SL4-P connected to an end of the touch wiring portion SL4-L. The dummy conductive patterns described with reference to Figures 8 to 13 include dummy conductive pads DCP1, DCP2, and DCP3 shown in Figures 19 and 20. The dummy conductive pads DCP1, DCP2, and DCP3 overlap the touchpad portion SL4-P.

[0133] The dummy conductive pads DCP1, DCP2, and DCP3 are classified according to their positions on the cross section as a first dummy conductive pad DCP1, a second dummy conductive pad DCP2, and a third dummy conductive pad DCP3. The first dummy conductive pad DCP1 is manufactured by the same photolithography process as the first semiconductor pattern AL1 (see FIG. 10). In other words, the first dummy conductive pad DCP1 is made of the same material as the first semiconductor pattern AL1, has the same laminated structure, and is disposed on the same layer. The second dummy conductive pad DCP2 is manufactured by the same photolithography process as the first control electrode GE1 (see FIG. 10). The third dummy conductive pad DCP3 is manufactured by the same photolithography process as the first input electrode SE1 (see FIG. 10).

[0134] The dummy conductive pads DCP1, DCP2, and DCP3 may include a plurality of any one of the first dummy conductive pad DCP1, the second dummy conductive pad DCP2, and the third dummy conductive pad DCP3.

[0135] As shown in Figures 21 and 22, the dummy conductive pads DCP1, DCP2, and DCP3 become the second dummy conductive pad DCP2 and the third dummy conductive pad DCP3. One of the three touch pad parts SL4-P is connected to the second dummy conductive pad DCP2 through the first contact hole CNT1. Two of the three touch pad parts SL4-P are connected to the third dummy conductive pad DCP3 through the second contact hole CNT2. The first contact hole CNT1 penetrates the second insulating film 14 and the third insulating film 16. The second contact hole CNT2 penetrates the third insulating film 16.

[0136] The dummy conductive pads DCP1, DCP2, and DCP3 are floating electrodes. The dummy conductive pads DCP1, DCP2, and DCP3 are not connected to other conductive patterns on a plane. The dummy conductive pads DCP1, DCP2, and DCP3 are not connected to any part other than the corresponding touch pad part.

[0137] As shown in FIG. 23, the touch pad parts SL1-P and SL4-P of the touch sensing unit TS are aligned with the signal pad parts CSL-P, DL-P, and PL-P of the organic light emitting display panel DP. The touch pad parts SL1-P and SL4-P and the signal pad parts CSL-P, DL-P, and PL-P are aligned to define a pad area of ​​the display device. In the pad area, the touch sensing unit TS and the organic light emitting display panel DP are bonded to one circuit board PCB. The bonding is performed via an anisotropic conductive film (ACF) or solder bumps. The circuit board PCB may be a flexible circuit board and includes pads PCB-P corresponding to the touch pad parts SL1-P and SL4-P and the signal pad parts CSL-P, DL-P, and PL-P.

[0138] A driving IC for controlling the organic light emitting display panel DP and / or the touch sensing unit TS is mounted on the circuit board PCB.

[0139] Although not shown, a driving IC is mounted in the non-display area DD-NDA shown in Fig. 1. The driving IC (e.g., input terminal of the driving IC) is bonded to the touch pad parts SL1-P, SL4-P and the signal pad parts CSL-P, DL-P, PL-P via anisotropic conductive film or solder bumps. At this time, pads for electrically connecting the driving IC (e.g., output terminal of the driving IC) to the circuit board PCB are additionally arranged in the non-display area DD-NDA.

[0140] The pad area of ​​the touch sensing unit TS and the pad area of ​​the organic light emitting panel DP have a similar laminated structure, thereby improving the reliability of bonding between the pad area of ​​the display device and the circuit board PCB. As shown in Figures 13, 20 and 22, the pad area of ​​the touch sensing unit TS is formed in a laminated structure similar to that of the pad area of ​​the organic light emitting panel DP by using dummy conductive pads DCP1, DCP2, and DCP3 arranged on the organic light emitting display panel DP. The pad area of ​​the touch sensing unit TS and the pad area of ​​the organic light emitting panel DP have a conductive pattern arranged on a third insulating layer 16 in common, and another conductive pattern arranged under the third insulating layer 16. The conductive pattern arranged on the third insulating layer 16 is bonded to the pad PCB-P of the circuit board PCB.

[0141] Figures 24 to 27 show planes or cross sections of a pad area of ​​a touch sensing unit TS according to an embodiment of the present invention. Figure 24 shows an enlarged view of CC area in Figure 14, and Figure 25 shows a cross section corresponding to IV-IV' in Figure 24. Figure 26 shows an enlarged view of CC area in Figure 14, and Figure 27 shows a cross section corresponding to V-V' in Figure 26.

[0142] The dummy conductive patterns described with reference to Figures 8 to 13 include the dummy conductive lines DCL shown in Figures 24 to 27. A plurality of dummy conductive lines DCL are provided. The dummy conductive lines DCL may be disposed on the same layer or on different layers.

[0143] The dummy conductive line DCL is manufactured by the same photolithography process as the first control electrode GE1 (see FIG. 10) or the same photolithography process as the first input electrode SE1 (see FIG. 10). Fig. 25 shows the dummy conductive line DCL manufactured by the same photolithography process as the first control electrode GE1, and Fig. 27 shows the dummy conductive line DCL manufactured by the same photolithography process as the first input electrode SE1.

[0144] As shown in FIG. 24 and FIG. 25, the touch wiring portion SL1-L of each of the first touch signal lines SL1 includes a first touch wiring portion SL1-L1 and a second touch wiring portion SL1-L2. One end of the first wiring portion SL1-L1 is connected to the corresponding first sensor RP (see FIG. 14), and the other end is connected to the dummy conductive line DCL. One end of the second wiring portion SL1-L2 is connected to the dummy conductive line DCL, and the other end is connected to the touch pad portion SL1-P (see FIG. 14) of the first touch signal line SL1. The other end of the first wiring portion SL1-L1 and one end of the second wiring portion SL1-L2 are connected to the dummy conductive line DCL through the first contact hole CNT1. At least one of the three dummy conductive lines DCL shown in FIG. 24 may be disposed on the second insulating layer 14.

[0145] 26 and 27, each of the third touch signal lines SL3 includes a first wiring portion SL3-L1 and a second wiring portion SL3-L2. One end of the first wiring portion SL1-L1 is connected to the dummy conductive line DCL through a second contact hole CNT2, and one end of the second wiring portion SL3-L2 is connected to the dummy conductive line DCL through a second contact hole CNT2. The first wiring portion SL1-L1 and the second wiring portion SL3-L2 are spaced apart in the row direction (second direction DR2).

[0146] The crossing areas of the touch signal lines SL1 and SL3 can be realized by using the conductive patterns disposed on the organic light emitting display panel DP, and a single-layer touch sensing unit TS can be formed without requiring an additional process for forming a bridge.

[0147] 24 to 27 have been described based on the CC region of Fig. 14, but the same applies to the CC region of Fig. 16. If the first touch signal line SL1 described in Fig. 24 to 27 is changed to the second touch signal line SL2, the intersection region of the CC region of Fig. 16 is implemented.

[0148] 28 is a cross-sectional view of a display module DM1 according to an embodiment of the present invention. The display module DM1 further includes an optical member LM overlapping the touch sensing unit TS. The optical member LM includes a polarizing film and a phase retardation film. The optical member LM is coupled to the thin film encapsulation layer TFE and the touch sensing unit TS via an adhesive member (not shown). The optical member LM overlaps at least the display area DA (see FIG. 8).

[0149] The display module DM1 further includes a resin layer TF that covers parts of the touch signal lines SL1 to SL4 exposed from the optical member LM. The resin layer TF prevents the parts of the touch signal lines SL1 to SL4 exposed from the optical member LM from being oxidized. The resin layer TF is a sealing material. In addition, the resin layer TF is a moisture-proof material known as "Tuffy (registered trademark)", and includes, for example, an epoxy-based resin or a silicone-based resin.

[0150] Although the present invention has been described above with reference to preferred embodiments thereof, it will be understood by those skilled in the art or those having ordinary knowledge in the art that various modifications and variations of the present invention may be made without departing from the spirit and technical scope of the present invention as set forth in the claims below.

[0151] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the invention, but should be determined by the claims. [Explanation of symbols]

[0152] 12 First insulating layer 14 Second insulating layer 16 Third insulating layer DA:Display area DD:Display device DM: Display module NDA: Hidden area PM: Protective film WM: Window

Claims

1. an organic light-emitting display panel including a base layer, a circuit layer disposed on the base layer, a light-emitting element layer disposed on the circuit layer, and a thin-film encapsulation layer disposed on the light-emitting element layer and overlapping a display area; a touch sensing unit disposed on the thin film encapsulation layer, the touch sensing unit including sensor blocks arranged in a column direction, first and second sensor columns arranged in a row direction intersecting the column direction, and touch signal lines connected to the sensor blocks; Each of the sensor blocks includes: A first sensor; i (where i is a natural number equal to or greater than 2) second sensors arranged in the column direction, The touch signal line is first touch signal lines respectively connected to first sensors of the sensor blocks and extending onto the circuit layer without overlapping the thin film encapsulation layer; a second touch signal line connecting a jth second sensor (where j is a natural number from 1 to i) of the i second sensors in an nth sensor block among the sensor blocks and an i-j+1th second sensor of the i second sensors in an n+1th sensor block among the sensor blocks, and extending onto the circuit layer without overlapping with the thin film encapsulation layer; a third touch signal line connected to one second touch signal line connected to the jth second sensor of the first sensor block of the first sensor row among the second touch signal lines and another second touch signal line connected to the jth second sensor of the first sensor block of the second sensor row among the second touch signal lines, or connected to one first touch signal line connected to the first sensor of the first sensor block of the first sensor row among the first touch signal lines and another first touch signal line connected to the first sensor of the first sensor block of the second sensor row among the first touch signal lines; a fourth touch signal line connected to the third touch signal line and extending in the column direction, the circuit layer includes a first signal line disposed on the base layer, a first interlayer insulating layer disposed on the first signal line, a second signal line disposed on the first interlayer insulating layer, a second interlayer insulating layer disposed on the second signal line, and a dummy conductive line disposed in the same layer as the first signal line or the second signal line; a floating electrode is disposed on the second interlayer insulating layer; the dummy conductive line, the third touch signal line, and the fourth touch signal line are disposed in a non-display area not overlapping with the thin film encapsulation layer; Among the one first touch signal line, the other one first touch signal line, the one second touch signal line, and the other one second touch signal line, signal lines that are not connected to the third touch signal line are disposed on the same layer as the third touch signal line, one of the signal lines not connected to the third touch signal line and the third touch signal line is connected to the dummy conductive line; The fourth touch signal line is a touch wiring part, one end of which is connected to the third touch signal line; and a touch pad part, the other end of which is connected to the touch wiring part, The touch pad unit is aligned with a signal pad unit of the organic light emitting display panel, and is disposed on the same layer as the floating electrode connected to the signal pad unit, and has the same laminate structure.

2. the third touch signal line is connected to the one second touch signal line and the other one second touch signal line, and the signal lines not connected to the third touch signal line include the one first touch signal line and the other one first touch signal line; The display device of claim 1 , wherein the one first touch signal line and the other one first touch signal line are connected to the dummy conductive line, and the third touch signal line overlaps the dummy conductive line.

3. Each of the one first touch signal line and the other one first touch signal line includes a touch wiring part and a touch pad part connected to an end of the touch wiring part, The touch wiring portion is a first wiring portion having one end connected to a corresponding one of the first sensors of the sensor block and the other end connected to the dummy conductive line; The display device of claim 2 , further comprising: a second wiring portion, one end of which is connected to the dummy conductive line and the other end of which is connected to the touch pad portion.

4. the dummy conductive line is disposed on the same layer as the first signal line; 4. The display device of claim 3, wherein the first wiring portion is connected to the dummy conductive line through a first contact hole penetrating the first interlayer insulating layer.

5. the third touch signal line is connected to the one second touch signal line and the other one second touch signal line, and the signal lines not connected to the third touch signal line include the one first touch signal line and the other one first touch signal line; The display device of claim 1 , wherein the third touch signal line is connected to the dummy conductive line, and the one first touch signal line and the other one first touch signal line overlap the dummy conductive line.

6. The third touch signal line is a first wiring portion, one end of which is connected to the dummy conductive line; 6. The display device of claim 5, further comprising: a second wiring portion, one end of which is connected to the dummy conductive line, and spaced apart from the first wiring portion in the row direction.

7. the third touch signal line is connected to the one first touch signal line and the other one first touch signal line, and the signal lines not connected to the third touch signal line include the one second touch signal line and the other one second touch signal line; The display device of claim 1 , wherein the one second touch signal line and the other one second touch signal line are connected to the dummy conductive line, and the third touch signal line overlaps the dummy conductive line.

8. Each of the one second touch signal line and the other one second touch signal line includes a touch wiring part and a touch pad part connected to an end of the touch wiring part, The touch wiring portion is a first wiring portion, one end of which is connected to the j-th second sensor and the other end of which is connected to the dummy conductive line; The display device of claim 7 , further comprising: a second wiring portion, one end of which is connected to the dummy conductive line and the other end of which is connected to the touch pad portion.

9. the third touch signal line is connected to the one first touch signal line and the other one first touch signal line, and the signal lines not connected to the third touch signal line include the one second touch signal line and the other one second touch signal line; 2 . The display device of claim 1 , wherein the third touch signal line is connected to the dummy conductive line, and the one second touch signal line and the other second touch signal line overlap the dummy conductive line.

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