Processing equipment

Abstract

To provide a processing device in which a grindstone can be easily detached when replacing the grindstone.SOLUTION: A processing device comprises: a spindle flange 17 connected to a spindle; a grindstone 14 comprising a base metal part 37 which substantially closely contacts an undersurface of the spindle flange 17 and is detachably attached to the spindle flange 17, and a grindstone part 38 which is installed on an undersurface of the base metal part 37 and is integrated with the base metal part 37; and air blowout ports 29a, 29b for blowing air 100 to a location of close contact between the spindle flange 17 and the base metal part 37.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a processing apparatus for processing a wafer with a grindstone. [Background technology]

[0002] 2. Description of the Related Art Conventionally, in the field of semiconductor manufacturing, back grinding is performed to grind the back surface of a semiconductor wafer such as a silicon wafer (hereinafter, referred to as a "wafer") to form the wafer into a thin film (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a grinding device in which a cup-shaped grinding wheel is attached to a spindle flange connected to the tip of a spindle. The cup-shaped grinding wheel is fastened to the spindle flange with about 10 bolts (not shown) and is configured to be detachable from the spindle flange. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 11-309673 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the grinding device described in Patent Document 1, the cup-shaped grinding wheel must be attached to the spindle flange by an operator manually tightening approximately 10 bolts, making the process of attaching and detaching the cup-shaped grinding wheel complicated.

[0006] In addition, the cup-shaped grinding wheel fastened with a bolt is prone to water such as slurry entering between the grinding wheel and the spindle flange. Therefore, in the past, when replacing a worn grinding wheel, the surface tension of the water causes the cup-shaped grinding wheel and the spindle flange to stick to each other, making it difficult to remove the cup-shaped grinding wheel from the spindle flange. If the cup-shaped grinding wheel is forcibly removed, it may come into contact with the chuck, which may damage the chuck, or the cup-shaped grinding wheel may get caught in the spindle flange and become impossible to remove. As a result, the maintenance time of the grinding device is extended, which causes a problem of a decrease in the daily production volume.

[0007] Therefore, a technical problem arises that must be solved in order to provide a processing device that allows the grinding wheel to be easily removed when replacing the grinding wheel, and an object of the present invention is to solve this problem. [Means for solving the problem]

[0008] The present invention has been proposed to achieve the above object, and the invention described in claim 1 provides a grindstone comprising a spindle flange, a base metal portion substantially in close contact with one surface of the spindle flange and detachably attached to the spindle flange, and a grindstone portion disposed on one surface of the base metal portion and integrated with the base metal portion, and an air outlet for blowing air to a contact point between the spindle flange and the base metal portion, the air outlet being disposed at a first contact point of the spindle flange that is in close contact with the base metal portion across a horizontal direction. Face A first air outlet that blows the air outward from the boundary portion along the first contact surface, and a second contact surface of the spindle flange that contacts the base metal portion in a vertical direction. Face and a second air outlet that blows the air from the boundary portion toward the outside along the second contact surface.

[0009] According to this configuration, when the grinding wheel is removed for replacement or the like, air is blown out from the air outlet, and the air is blown to the contact area between the spindle flange and the base metal part. Then, a force that pulls the grinding wheel off from the spindle flange acts on the contact area between the spindle flange and the base metal part, and the grinding wheel can be easily removed from the spindle flange. Furthermore, when the grinding wheel is removed for replacement or the like, air is blown out from the first air outlet, and the air is blown out from the contact area between the spindle flange and the base metal part, and a force that pulls the grinding wheel off from the spindle flange part acts. Furthermore, when air is blown out from the second air outlet, the blown out air acts on the grinding wheel in a direction that removes it from the spindle flange. Therefore, the force of the air blown out from the first air outlet and the force of the air blown out from the second air outlet allow the grinding wheel to be easily removed from the spindle flange.

[0010] A second aspect of the present invention provides the processing device according to the first aspect, wherein an air circuit communicating with the air outlet is formed within the spindle flange.

[0011] According to this configuration, the air circuit communicating with the air outlet can be provided compactly inside the spindle flange by utilizing the empty space inside the spindle flange, etc. Therefore, the air circuit can be provided inside the processing device without significantly changing the shape of the processing device itself.

[0012] A third aspect of the present invention provides a processing device according to the first or second aspect, further comprising an adjustment valve capable of adjusting a flow rate of air blown out from the air outlet.

[0013] According to this configuration, the flow rate of air blown out from the air outlet, i.e., the force of the air, can be adjusted by the adjusting valve, making it easy to obtain the optimum force for removing the grinding wheel from the spindle flange. Effect of the Invention

[0014] According to the invention, when removing the grinding wheel for replacement or the like, air is blown from the air outlet onto the contact point between the spindle flange and the base metal part, and the grinding wheel can be forcibly peeled off from the spindle flange part and easily removed. This is expected to reduce the maintenance time of the processing equipment and to increase the daily production volume. [Brief description of the drawings]

[0015] [Figure 1] 1 is a perspective view showing a schematic view of a processing device according to an embodiment of the present invention; [Diagram 2] 2 is a vertical sectional side view showing the internal structure of a main unit and a transport unit shown in FIG. [Diagram 3] 1 is a perspective view of a grinding wheel applied to the processing device, the grinding wheel being attached to the lower surface of a spindle flange, as viewed obliquely from below. FIG. [Figure 4] FIG. 2 is a vertical cross-sectional view illustrating the structure of the spindle flange and the grinding wheel, showing the spindle flange with the grinding wheel attached thereto. [Diagram 5] FIG. 2 is a vertical cross-sectional view illustrating the structure of the spindle flange and the grinding wheel, showing the grinding wheel removed from the spindle flange. [Figure 6] 6 is an enlarged cross-sectional view of a portion of the spindle flange shown in FIG. 5. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] In order to achieve the object of providing a processing apparatus which allows the grinding wheel to be easily removed when replacing it, the present invention has been realized by providing a processing apparatus for processing wafers which is configured to include a grinding wheel comprising a disk-shaped spindle flange, a ring-shaped base metal portion which is attached to the spindle flange in a manner that allows it to be attached and detached freely, and a grinding wheel portion which is installed on one surface of the base metal portion and integrated with the base metal portion, and an air outlet which blows air onto the contact point between the spindle flange and the base metal portion. EXAMPLES

[0017] An embodiment of the present invention will be described in detail below with reference to the accompanying drawings. In the following embodiment, when the number, value, amount, range, etc. of components are mentioned, the number is not limited to the specific number, and may be more or less than the specific number, unless otherwise specified or when it is clearly limited to a specific number in principle.

[0018] In addition, when referring to the shape or positional relationship of components, etc., this includes things that are substantially similar or approximate to those shapes, etc., unless otherwise specified or considered to be clearly different in principle.

[0019] In addition, the drawings may exaggerate characteristic parts to make the features easier to understand, and the dimensional ratios of the components may not be the same as the actual ones. In addition, in cross-sectional views, hatching of some components may be omitted to make the cross-sectional structure of the components easier to understand.

[0020] In the following description, expressions indicating directions such as up, down, left, right, etc. are not absolute, but are appropriate when each part of the processing apparatus of the present invention is in the posture depicted, but if the posture is changed, the interpretation should be changed accordingly. Also, the same elements are given the same symbols throughout the description of the embodiment.

[0021] 1 and 2 show an example of a processing device 10 according to an embodiment of the present invention. Fig. 1 is a perspective view showing a schematic basic configuration of the processing device 10, omitting a spindle feed mechanism 11C and a transport unit 12 shown in Fig. 2. Fig. 2 is a vertical cross-sectional side view showing the internal structure of the main unit 11 and the transport unit 12 shown in Fig. 1.

[0022] 1 and 2, the processing device 10 polishes the back surface of a wafer W, specifically, the back surface (the surface opposite to the front surface on which devices are formed) of a substrate made of a hard-to-cut material such as sapphire or silicon carbide. However, the object to be processed by the processing device 10 is not limited to these, and may be, for example, glass or silicon, or a composite substrate attached to a support substrate.

[0023] The processing apparatus 10 includes a main unit 11, a transport unit 12, and a control unit 13 that controls the overall operation of the processing apparatus 10.

[0024] As shown in Figures 1 and 2, the main unit 11 includes an arch-shaped column 11A, a spindle 15 to which a grinding wheel 14 is attached, three linear guides 11B that support the spindle 15 so that it can slide in the vertical direction V, and a spindle feed mechanism 11C that raises and lowers the spindle 15 in the vertical direction V.

[0025] As shown in FIG. 1, the column 11A has an opening on a front surface 11Aa and a groove 11Ab recessed in the vertical direction V so as to penetrate vertically.

[0026] The spindle 15 is housed in the groove 11Ab of the column 11A via a spindle casing 16 so as to be slidable in the up-down direction (vertical direction V). As shown in Fig. 2, the grindstone 14 is detachably attached to the spindle 15 via a spindle flange 17 connected to the lower end of the spindle 15. Although not shown, the spindle 15 is rotated by a motor (not shown) and rotates together with the grindstone 14. The detailed configurations of the grindstone 14 and the spindle flange 17 will be described later.

[0027] 1, the linear guide 11B is composed of two front linear guides 11Ba (left and right) that are disposed in the front part of the groove 11Ab in the column 11A and support both the front left and right ends of the spindle casing 16, and one rear linear guide 11Bb that is disposed in the rear part (rear surface) of the groove 11Ab and supports the rear center of the spindle casing 16. The front linear guide 11Ba and rear linear guide 11Bb are provided parallel to each other along the axis (vertical direction V) of the spindle 15. As a result, the front linear guide 11Ba and rear linear guide 11Bb function as guide rails for the spindle casing 16.

[0028] 2, the spindle feed mechanism 11C includes a slider 18 connected to the spindle casing 16, a ball screw 19 for raising and lowering the spindle casing 16 up and down (vertical direction V), and a spindle motor 20 for rotating the ball screw 19. When the spindle motor 20 is driven to rotate the ball screw 19 in a positive or negative direction, the slider 18 descends or ascends in the vertical direction V together with the spindle casing 16 and the spindle 15 according to the rotation direction of the ball screw 19. As a result, the grindstone 14 attached to the lower end of the spindle 15 also descends or ascends together with the spindle 15, and the wafer W is ground by the descent of the grindstone 14.

[0029] The main unit 11 is also provided with an in-process gauge (not shown) for measuring the thickness of the wafer W. When the thickness of the wafer W measured by the in-process gauge reaches a desired value, the ball screw 19 is rotated in the reverse direction by the drive of the spindle motor 20, and the slider 18 rises together with the spindle casing 16 and the spindle 15. In addition, the grindstone 14 attached to the lower end of the spindle 15 also moves away from the wafer W.

[0030] The transfer unit 12 includes a chuck table 21 capable of suction-holding the wafer W, a slider 22 on which the chuck table 21 is placed, and a slider drive mechanism 23 for driving the slider 22.

[0031] The chuck table 21 is connected to a negative pressure source (not shown), and is capable of suction-holding the wafer W on the chuck table 21. In addition, the chuck table 21 is capable of rotating about the axis center of the chuck table 21 by a chuck table motor 24.

[0032] The slider drive mechanism 23 includes the slider 22, a rail 25, a belt and pulley mechanism 26, and a slider motor 27. The drive of the slider motor 27 is transmitted to the slider 22 via the belt and pulley mechanism 26, so that the slider 22 can slide integrally with the chuck table 21 on the rail 25 in the left-right direction in FIG.

[0033] The operation of the processing device 10 is controlled by the control unit 13. The control unit 13 controls the components constituting the processing device 10 according to respective predetermined procedures. The control unit 13 is composed of, for example, a CPU, a memory, etc. The functions of the control unit 13 may be realized by control using software, or may be realized by operation using hardware.

[0034] The processing apparatus 10 thus configured grinds the wafer W in the following procedure under the control of the control unit 13. First, the wafer W is held on the chuck table 21 by suction.

[0035] Next, the wafer W is carried in below the grindstone 14 by the slider 22, and then the spindle motor 20 is driven. When the spindle motor 20 is driven, the ball screw 19 rotates forward, and the spindle casing 16 connected to the slider 22 moves down together with the spindle 15 and the grindstone 14, bringing the grindstone 14 close to the wafer W. Furthermore, the chuck table motor 24 is also driven in addition to the spindle motor 20, and while rotating the grindstone 14 and the chuck table 21, the grindstone 14 is pressed against one surface (rear surface) of the wafer W, and the wafer W is ground.

[0036] When the wafer W is ground to a desired thickness, the control unit 13 stops driving the spindle motor 20 and the chuck table motor 24. This causes the rotation of the grindstone 14 and the chuck table 21 to also stop.

[0037] Next, the spindle motor 20 is driven in the reverse direction to reversely rotate the ball screw 19. Due to the reverse rotation of the ball screw 19, the spindle casing 16 connected to the spindle feed mechanism 11C rises together with the spindle 15 and the grinding wheel 14, and moves the grinding wheel 14 away from the wafer W. Next, the slider 22 transports the wafer W together with the chuck table 21 to the rear of the main unit 11. Thereafter, the suction and holding of the wafer W by the chuck table 21 is released, and the grinding process of the wafer W by the processing device 10 is completed.

[0038] Next, a mechanism for attaching and detaching the grinding wheel 14 to and from the spindle flange 17, particularly a mechanism for smoothly removing the grinding wheel 14 from the spindle flange 17, will be described in detail with reference to FIGS.

[0039] Fig. 3 is a perspective view of the grindstone 14 attached to the underside of the spindle flange 17, as viewed from below. Fig. 4 and Fig. 5 are vertical cross-sectional views of Fig. 3, with Fig. 4 showing the grindstone 14 attached to the spindle flange 17 and Fig. 5 showing the grindstone 14 removed from the spindle flange 17. Fig. 6 is an enlarged view of a portion of the spindle flange 17 shown in Fig. 5.

[0040] 3 to 6, the spindle flange 17 is fixedly connected to the lower end of the spindle 15 shown in FIG. 2, and is provided integrally with the spindle 15, and is formed in a substantially circular plate shape.

[0041] A circular small diameter protrusion 17B having an outer diameter smaller than that of the main body 17A is uniformly provided on the underside of the main body 17A of the spindle flange 17. An inverted cone-shaped recess 29 is formed on the underside of the small diameter protrusion 17B, the recess 29 having an inclined surface 28 on the inner circumferential surface that gradually slopes upward from the lower opening toward the center. An inner plate 30 is disposed within the recess 29.

[0042] The inner plate 30 is a disk-shaped member that can be accommodated in the recess 29 of the spindle flange 17 in a substantially tight fit, and its outer circumferential surface is provided with an inclined surface 30a that corresponds to the inclined surface 28 of the recess 29. The inner plate 30 is accommodated in the recess 29 and attached to the underside of the spindle flange 17 with bolts 31.

[0043] An air circuit 32 for carrying air 100 is formed in the main body 17A of the spindle flange 17. The air circuit 32 includes a first air circuit 32a having an air supply port 33a for taking in air 100 and an air outlet 34a, which is a first air outlet for blowing the air 100 taken in from the air supply port 33a to the outside, and a second air circuit 32b having an air supply port 33b for taking in air 100 and an air outlet 34b, which is a second air outlet for blowing the air 100 taken in from the air supply port 33b to the outside. The opening diameters of the air outlet 34a of the first air circuit 32a and the air outlet 34b of the second air circuit 32b are set smaller than the passage diameters of the circuits 32a and 32b, and are narrowed to increase the force of blowing out the air 100.

[0044] The air outlet 34a of the first air circuit 32a is formed at the boundary between the small diameter protrusion 17B and the main body 17A, and the air 100 is blown out from the base of the small diameter protrusion 17B along the outer circumferential bottom surface 17a of the main body 17A in a substantially horizontal direction, i.e., the air 100 is blown out substantially perpendicularly to the direction in which the grindstone 14 is attached and detached. On the other hand, the air outlet 34b of the second air circuit 32b is also formed at the boundary between the small diameter protrusion 17B and the main body 17A, and the air 100 is blown out from the base of the small diameter protrusion 17B along the outer circumferential surface 17b of the small diameter protrusion 17B in a substantially vertical direction, i.e., the air 100 is blown out substantially parallel to the direction in which the grindstone is attached and detached. The air outlets 34a of the first air circuit 32a and the air outlets 34b of the second air circuit 32b are preferably provided in a plurality of units each at substantially equal intervals in the circumferential direction.

[0045] Moreover, the air supply port 33a of the first air circuit 32a and the air supply port 33b of the second air circuit 32b are each connected to an air source 35. Moreover, flow rate adjustment valves 36a, 36b capable of adjusting the flow rate of air 100 are provided between the air source 35 and the air supply port 33a, and between the air source 35 and the air supply port 33b, respectively.

[0046] The grindstone 14 includes an annular base metal portion 37 and a grindstone portion 38 disposed on one surface of the base metal portion 37 .

[0047] The base metal portion 37 is formed in an annular shape. The cross section of the base metal portion 37 has an inclined surface 37a, an inner peripheral surface 37b, an outer peripheral surface 37c, an upper surface 37d, and a lower surface 37e, and is generally pentagonal in cross section. The inner diameter of the base metal portion 37 is generally equal to the outer diameter of the small diameter protruding portion 17B of the spindle flange 17, and the outer diameter is generally equal to the outer diameter of the main body portion 17A of the spindle flange 17. The thickness of the base metal portion 37, i.e., the height of the outer peripheral surface 37c, is set to be larger than the amount of protrusion from the outer peripheral bottom surface 17a of the spindle flange 17 in a state in which the inner plate 30 is accommodated and attached in the recess 29 provided on the lower surface of the spindle flange 17. The inclination angle of the inclined surface 37a is about 30 degrees, and is inclined downward from the inner peripheral surface 37b toward the outer periphery.

[0048] A plurality of grindstone portions 38 are provided on a lower surface 37 e of the base metal portion 37 along the outer periphery of the base metal portion 37 and are integrated with the base metal portion 37 .

[0049] 3 and 5, when the grindstone 14 is attached to the spindle flange 17, the grindstone portion 38 faces downward and the upper surface 37d of the base metal portion 37 is in close contact with the outer circumferential bottom surface 17a of the spindle flange 17, and the grindstone 14 is fixed to the spindle flange 17 using mounting screws (not shown). In this attached state, the inner circumferential surface 37b of the base metal portion 37 and the outer circumferential surface 17b of the small diameter protrusion portion 17B of the spindle flange 17 are also in almost close contact with each other.

[0050] In the processing device 10 configured as described above, when water such as slurry is used during grinding, water may infiltrate between the outer circumferential bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal part 37, and between the outer circumferential surface 17b of the small diameter protrusion 17B and the inner circumferential surface 37b of the base metal part 37. The infiltration of water generates an adhesive force due to surface tension between the outer circumferential bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal part 37, and between the outer circumferential surface 17b of the small diameter protrusion 17B and the inner circumferential surface 37b of the base metal part 37. Therefore, when replacing the grindstone 14 whose grindstone part 38 is worn, the grindstone 14 may be difficult to remove from the spindle flange 17.

[0051] Therefore, in the processing device 10 of this embodiment, under the control of the control unit 13, air 100 is blown out from the air circuit 32 to between the outer circumferential bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal portion 37, and between the outer circumferential surface 17b of the small diameter protrusion portion 17B and the inner circumferential surface 37b of the base metal portion 37, respectively, and the force of the blown air 100 weakens the surface tension between the respective portions, forcibly peeling them off, allowing them to be easily removed.

[0052] More specifically, when removing the grindstone 14 from the spindle flange 17, first, the attachment screw (not shown) that attaches the grindstone 14 to the spindle flange 17 is removed. Next, as shown in FIG. 4, air 100 is fed from the air source 35 into the first air circuit 32a through the air supply port 33a. The amount of air 100 fed is adjusted by the flow rate control valve 36a. The air 100 fed into the first air circuit 32a is compressed in the first air circuit 32a and blown from the air blowing port 34a substantially horizontally toward the gap between the outer circumferential bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal part 37, thereby applying a peeling force while blowing away water between the outer circumferential bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal part 37. Then, when the air 100 is supplied for a predetermined time, the supply of the air 100 into the first air circuit 32a is stopped.

[0053] 5, air 100 is sent from the air source 35 into the second air circuit 32b through the air supply port 33b. The amount of air 100 sent here is also adjusted by the flow rate control valve 36b. The air 100 sent into the second air circuit 32b is compressed in the second air circuit 32b and blown from the air outlet 34b toward the space between the outer peripheral surface 17b of the spindle flange 17 and the upper surface 37d of the base metal part 37 in a substantially vertical direction, blowing away water between the outer peripheral surface 17b of the spindle flange 17 and the upper surface 37d of the base metal part 37 while applying a downward peeling force to the grinding wheel 14. This downward peeling force allows the grinding wheel 14 to be smoothly removed from the spindle flange 17. This allows the grinding wheel 14 to be replaced with another grinding wheel 14.

[0054] Furthermore, if the position of the air outlet 43a communicating with the first air circuit 32a and the position of the air outlet 43b communicating with the second air circuit 32b are shifted by a predetermined interval in the circumferential direction so that the air 100 blown out does not interfere with each other, it is also possible to simultaneously blow air 100 from the air outlet 43a communicating with the first air circuit 32a and the air outlet 43b communicating with the second air circuit 32b, thereby applying a peeling force to the grinding wheel 14.

[0055] Therefore, according to the processing device 10 of this embodiment, when the grindstone 14 is removed for replacement or the like, air 100 is blown out from the air outlets 34a, 34b, and the air 100 is blown onto the contact area between the spindle flange 17 and the base metal part 37, forcing the grindstone 14 to be peeled off from the spindle flange 17 and easily removed. This makes it possible to reduce the maintenance time of the processing device 10 and to improve the daily production volume.

[0056] In addition, since the air circuit 32 having the air outlets 34a, 34b is provided inside the spindle flange 17, it can be provided compactly inside the spindle flange 17, and the air circuit 32 can be provided without changing the size of the processing device 10.

[0057] In addition, the air circuit 32 has air outlet 34a from which air 100 is blown out approximately horizontally toward the contact point between the spindle flange 17 and the base metal portion 37, and air outlet 34b from which air 100 is blown out approximately parallel to the vertical direction in which the grinding wheel 14 is attached or detached. Therefore, the grinding wheel 14 can be easily removed from the spindle flange 17 by the force of the air 100 blown out from air outlet 34a and the force of the air 100 blown out from air outlet 34b.

[0058] In addition, since flow rate control valves 36a, 36b capable of adjusting the amount of air 100 flowing are provided between the air source 35 and the air circuit 32, the flow rate of the air 100 blown out from the air outlets 34a, 34b, i.e., the force of the air 100, can be adjusted by the flow rate control valves 36a, 36b, making it possible to easily obtain the optimum force for removing the grinding wheel 14 from the spindle flange 17.

[0059] In the above embodiment, the air circuit 32 is disclosed as having both the first air circuit 32a having the air supply port 33a and the air outlet 34a, and the second air circuit 32b having the air supply port 33b and the air outlet 34b. However, the air circuit 32 may have a structure in which only one of the first air circuit 32a and the second air circuit 32b is provided.

[0060] Furthermore, the present invention can be modified in various ways without departing from the spirit of the present invention, and it is natural that the present invention covers such modifications. [Explanation of symbols]

[0061] 10: Processing equipment 11: Main unit 11A: Column 11Aa: Front 11Ab: Groove 11B: Linear guide 11Ba: Front linear guide 11Bb: Rear linear guide 11C: Spindle feed mechanism 12: Transport unit 13: Control unit 14: Grindstone 15: Spindle 16: Spindle casing 17: Spindle flange 17A: Main body 17B: Small diameter protrusion 17a: Bottom of outer periphery 17b: Outer surface 18: Slider 19: Ball screw 20: Spindle motor 21: Chuck table 22: Slider 23: Slider drive mechanism 24: Chuck table motor 25: Rail 26: Pulley mechanism 27: Slider motor 28: Inclined surface 29: Recess 30: Inner plate 30a: Inclined surface 31: Bolt 32: Air circuit 32a: First air circuit 32b: Second air circuit 33a: Air supply port 33b: Air supply port 34a: Air outlet 34b: Air outlet 35: Air source 36a: Flow control valve 36b: Flow control valve 37: Base metal part 37a: Inclined surface 37b: Inner peripheral surface 37c: Outer surface 37d:Top surface 37e: Bottom surface 38: Grindstone section 100: Air V: Vertical direction W: Wafer

Claims

1. A spindle flange; a grindstone including a base metal portion that is substantially in close contact with one surface of the spindle flange and is detachably attached to the spindle flange, and a grindstone portion that is disposed on one surface of the base metal portion and integrated with the base metal portion; an air outlet for blowing air onto a contact portion between the spindle flange and the base metal portion; Equipped with The air outlet is a first air outlet that blows the air from a boundary portion of a first contact surface of the spindle flange that is in contact with the base metal portion in a horizontal direction toward the outside along the first contact surface; a second air outlet that blows the air from a boundary portion of a second contact surface of the spindle flange that is in close contact with the base metal portion along the second contact surface toward the outside; A processing apparatus comprising:

2. 2. The processing device according to claim 1, wherein an air circuit communicating with the air outlet is formed inside the spindle flange.

3. 3. The processing apparatus according to claim 1, further comprising an adjusting valve capable of adjusting a flow rate of the air blown out from the air outlet.

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