Solid-state battery packaging

Abstract

Provided is a solid-state battery package formed as a result of including a substrate and a solid-state battery disposed on the substrate. The solid-state battery package is formed as a result of a water vapor barrier layer being included between the substrate and the solid-state battery.

Description

[Technical field]

[0001] The present invention relates to solid-state battery packages, and more particularly to solid-state batteries packaged in a manner conducive to packaging. [Background technology]

[0002] 2. Description of the Related Art Secondary batteries that can be repeatedly charged and discharged have been used for various purposes. For example, secondary batteries are used as power sources for electronic devices such as smartphones and laptop computers.

[0003] In secondary batteries, liquid electrolytes are generally used as a medium for ion migration that contributes to charging and discharging. In other words, so-called electrolytic solutions are used in secondary batteries. However, in such secondary batteries, safety is generally required in terms of preventing leakage of the electrolytic solution. In addition, organic solvents and the like used in the electrolytic solution are flammable substances, so safety is also required in that respect.

[0004] Therefore, research is being conducted on solid-state batteries that use solid electrolytes instead of liquid electrolytes. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2015-220107 A [Patent Document 2] JP 2007-5279 A Summary of the Invention [Problem to be solved by the invention]

[0006] The inventors of the present application have realized that there are still problems to be overcome in the solid-state batteries proposed so far, and have found the need to take measures to address these problems. Specifically, the inventors of the present application have found the following problems:

[0007] It is expected that solid-state batteries will be mounted on printed circuit boards together with other electronic components, and in such cases a structure suitable for mounting is required. For example, a package in which a solid-state battery is mounted on a substrate will be useful for mounting by making the substrate responsible for electrical connection to the outside.

[0008] However, the inventors of the present application have noticed that a package in which a solid-state battery is disposed on a substrate cannot necessarily be said to be able to sufficiently prevent the intrusion of water vapor from the substrate side. In other words, the inventors of the present application have found that although the substrate itself can prevent the intrusion of water vapor to some extent because it is a thick member, this may not be sufficient for the solid-state battery, and there remains a concern that the solid-state battery characteristics may deteriorate in the long term.

[0009] The present invention has been made in view of the above problems. That is, a main object of the present invention is to provide a technology for a solid-state battery that has a substrate conducive to mounting and can more effectively prevent water vapor permeation associated with the substrate. [Means for solving the problem]

[0010] The inventors of the present application attempted to solve the above problems by taking a new approach rather than simply extending the conventional technology, and as a result, they have invented a solid-state battery that achieves the above-mentioned main object.

[0011] The present invention provides a solid-state battery package comprising a substrate and a solid-state battery provided on the substrate, with a water vapor barrier layer between the substrate and the solid-state battery. Effect of the Invention

[0012] The solid-state battery package according to the present invention has a substrate that is conducive to mounting, and yet has superior water vapor permeation prevention properties.

[0013] More specifically, the present invention provides a solid-state battery package that is more effectively designed to prevent water vapor transmission through a substrate that is useful for mounting. In the solid-state battery package according to the present invention, a water vapor barrier layer is provided between the substrate and the solid-state battery, which reduces the inconvenient transmission of water vapor from the external environment through the substrate to the solid-state battery. Thus, the solid-state battery package according to the present invention is less likely to cause degradation of the solid-state battery characteristics over the long term, and is more reliable. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a cross-sectional view that illustrates a schematic diagram of a solid-state battery package. [Diagram 2] FIG. 2 is a cross-sectional view that illustrates a schematic diagram of a solid-state battery package. [Diagram 3] FIG. 3 is a cross-sectional view that illustrates a schematic diagram of a solid-state battery package, and is particularly a diagram for explaining "layers that constitute the substrate" and "layers that constitute the solid-state battery." [Figure 4] FIG. 4 is a cross-sectional view and a partially enlarged view showing a schematic diagram of a solid-state battery package, and is a view for explaining in particular the wide extension form of the water vapor barrier layer. [Diagram 5] FIG. 5 is a cross-sectional view and a partially enlarged view showing a schematic diagram of a solid-state battery package, and is a diagram for explaining the resist layer in particular. [Figure 6] FIG. 6 is a cross-sectional view showing a schematic diagram of a solid-state battery package and a schematic diagram showing a substrate configuration. [Figure 7] FIG. 7 is a schematic diagram showing each layer constituting the substrate. [Figure 8] FIG. 8 is a cross-sectional view showing a schematic diagram of a solid-state battery package and a plan view showing a metal layer included in a substrate. [Figure 9] 9(A) to 9(E) are cross-sectional views illustrating steps in a process for obtaining a solid-state battery package. [Figure 10] FIG. 10 is a cross-sectional view that illustrates a schematic diagram of a solid-state battery package, and is a view for explaining an aspect in which no resist is provided. [Figure 11] FIG. 11 is a cross-sectional view showing a schematic diagram of a solid-state battery package, and is a view particularly for explaining the mode of the coating inorganic layer. [Figure 12] FIG. 12 is a cross-sectional view showing a schematic diagram of a solid-state battery package, particularly showing an example of a substrate configuration. [Figure 13] FIG. 13 is a cross-sectional view and a partially enlarged view showing a schematic diagram of a solid-state battery package, and is a diagram for explaining the conductive paste in particular. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The solid-state battery package of the present invention will be described in detail below. Although the description will be made with reference to the drawings as necessary, the contents shown in the drawings are merely schematic and illustrative for understanding the present invention, and the appearance and / or dimensional ratio may differ from the actual product.

[0016] In this specification, the term "solid-state battery package" refers, in a broad sense, to a solid-state battery device (or solid-state battery product) configured to protect a solid-state battery from the external environment, and, in a narrow sense, to a solid-state battery product that is provided with a substrate useful for mounting and in which a solid-state battery is protected from the external environment.

[0017] In this specification, the term "cross-sectional view" refers to the shape of the solid-state battery when viewed from a direction approximately perpendicular to the stacking direction in the stacked structure (in simple terms, the shape when cut along a plane parallel to the thickness direction of the layers). In addition, the term "planar view" or "planar shape" used in this specification refers to a sketch of an object viewed from above or below along the thickness direction of the layers (i.e., the stacking direction described above). In simple terms, the shape of the target surface viewed from its normal direction can be called the "planar shape."

[0018] The "upper and lower directions" and "left and right directions" used directly or indirectly in this specification correspond to the upper and lower directions and left and right directions in the drawings, respectively. Unless otherwise specified, the same reference numerals or symbols indicate the same members and / or parts or the same meanings. In a preferred embodiment, the vertical downward direction (i.e., the direction in which gravity acts) can be considered to correspond to the "lower direction" / "bottom side", and the opposite direction can be considered to correspond to the "upper direction" / "top side".

[0019] In the present invention, the term "solid-state battery" refers to a battery whose components are made of solids in a broad sense, and to an all-solid-state battery whose components (particularly preferably all components) are made of solids in a narrow sense. In a preferred embodiment, the solid-state battery of the present invention is a laminated solid-state battery in which each layer constituting a battery unit is laminated on top of each other, and preferably each such layer is made of a fired body. The term "solid-state battery" includes not only so-called "secondary batteries" capable of repeated charging and discharging, but also "primary batteries" capable of only discharging. According to a preferred embodiment of the present invention, the "solid-state battery" is a secondary battery. The term "secondary battery" is not limited to being overly limited by its name, and may include, for example, a power storage device. In the present invention, a solid-state battery included in a package may also be referred to as a "solid-state battery element".

[0020] In the following, first, a basic configuration of the solid-state battery of the present invention will be described. The configuration of the solid-state battery described here is merely an example for understanding the invention, and does not limit the invention.

[0021] [Basic structure of solid-state batteries] A solid-state battery includes at least positive and negative electrode layers and a solid electrolyte. Specifically, as shown in Fig. 1, a solid-state battery 100 includes a solid-state battery laminate including battery building blocks including a positive electrode layer 110, a negative electrode layer 120, and at least a solid electrolyte 130 interposed therebetween.

[0022] In addition, the layers constituting the solid-state battery may be formed by firing, and the positive electrode layer, the negative electrode layer, the solid electrolyte, etc. may form fired layers. Preferably, the positive electrode layer, the negative electrode layer, and the solid electrolyte are each fired integrally with one another, and therefore the solid-state battery laminate forms an integrally fired body.

[0023] The positive electrode layer 110 is an electrode layer comprising at least a positive electrode active material. The positive electrode layer may further comprise a solid electrolyte. In a preferred embodiment, the positive electrode layer is made of a sintered body comprising at least positive electrode active material particles and solid electrolyte particles. On the other hand, the negative electrode layer is an electrode layer comprising at least a negative electrode active material. The negative electrode layer may further comprise a solid electrolyte. In a preferred embodiment, the negative electrode layer is made of a sintered body comprising at least negative electrode active material particles and solid electrolyte particles.

[0024] The positive electrode active material and the negative electrode active material are materials involved in the transfer of electrons in a solid-state battery. Ions move (or are conducted) between the positive electrode layer and the negative electrode layer via the solid electrolyte, transferring electrons to charge and discharge the battery. Each electrode layer of the positive electrode layer and the negative electrode layer is preferably a layer capable of absorbing and releasing lithium ions or sodium ions in particular. In other words, the solid-state battery is preferably an all-solid-state secondary battery in which lithium ions or sodium ions move between the positive electrode layer and the negative electrode layer via the solid electrolyte to charge and discharge the battery.

[0025] (Cathode active material) The positive electrode active material contained in the positive electrode layer 110 may be at least one selected from the group consisting of a lithium-containing phosphate compound having a Nasicon structure, a lithium-containing phosphate compound having an olivine structure, a lithium-containing layered oxide, and a lithium-containing oxide having a spinel structure. An example of a lithium-containing phosphate compound having a Nasicon structure is Li3V2(PO4)3. An example of a lithium-containing phosphate compound having an olivine structure is Li3Fe2(PO4)3, LiFePO4, and / or LiMnPO4. An example of a lithium-containing layered oxide is LiCoO2 and / or LiCo 1 / 3 Ni 1 / 3 Mn 1 / 3 Examples of lithium-containing oxides having a spinel structure include LiMn2O4 and / or LiNi 0.5 Mn 1.5 O4, etc. The type of lithium compound is not particularly limited, but may be, for example, a lithium transition metal composite oxide and a lithium transition metal phosphate compound. The lithium transition metal composite oxide is a general term for oxides containing lithium and one or more transition metal elements as constituent elements, and the lithium transition metal phosphate compound is a general term for phosphate compounds containing lithium and one or more transition metal elements as constituent elements. The type of transition metal element is not particularly limited, but may be, for example, cobalt (Co), nickel (Ni), manganese (Mn), iron (Fe), etc.

[0026] In addition, the positive electrode active material capable of absorbing and releasing sodium ions may be at least one selected from the group consisting of sodium-containing phosphate compounds having a Nasicon structure, sodium-containing phosphate compounds having an olivine structure, sodium-containing layered oxides, and sodium-containing oxides having a spinel structure. For example, in the case of sodium-containing phosphate compounds, at least one selected from the group consisting of Na3V2(PO4)3, NaCoFe2(PO4)3, Na2Ni2Fe(PO4)3, Na3Fe2(PO4)3, Na2FeP2O7, Na4Fe3(PO4)2(P2O7), and sodium-containing layered oxides such as NaFeO2 may be used.

[0027] In addition, the positive electrode active material may be, for example, an oxide, a disulfide, a chalcogenide, or a conductive polymer. The oxide may be, for example, titanium oxide, vanadium oxide, or manganese dioxide. The disulfide may be, for example, titanium disulfide or molybdenum sulfide. The chalcogenide may be, for example, niobium selenide. The conductive polymer may be, for example, disulfide, polypyrrole, polyaniline, polythiophene, polyparastyrene, polyacetylene, or polyacene.

[0028] (Negative electrode active material) The negative electrode active material contained in the negative electrode layer 120 may be, for example, at least one selected from the group consisting of an oxide containing at least one element selected from the group consisting of titanium (Ti), silicon (Si), tin (Sn), chromium (Cr), iron (Fe), niobium (Nb) and molybdenum (Mo), a carbon material such as graphite, a graphite-lithium compound, a lithium alloy, a lithium-containing phosphate compound having a Nasicon structure, a lithium-containing phosphate compound having an olivine structure, and a lithium-containing oxide having a spinel structure. An example of a lithium alloy is Li-Al. An example of a lithium-containing phosphate compound having a Nasicon structure is Li3V2(PO4)3 and / or LiTi2(PO4)3. An example of a lithium-containing phosphate compound having an olivine structure is Li3Fe2(PO4)3 and / or LiCuPO4. An example of a lithium-containing oxide having a spinel structure is Li4Ti5O 12 etc.

[0029] In addition, examples of negative electrode active materials capable of absorbing and releasing sodium ions include at least one selected from the group consisting of sodium-containing phosphate compounds having a Nasicon structure, sodium-containing phosphate compounds having an olivine structure, and sodium-containing oxides having a spinel structure.

[0030] In addition, in the solid-state battery, the positive electrode layer and the negative electrode layer may be made of the same material.

[0031] The positive electrode layer and / or the negative electrode layer may contain a conductive material. The conductive material contained in the positive electrode layer and the negative electrode layer may include at least one of metal materials such as silver, palladium, gold, platinum, aluminum, copper, and nickel, and carbon.

[0032] Furthermore, the positive electrode layer and / or the negative electrode layer may contain a sintering aid, which may be at least one selected from the group consisting of lithium oxide, sodium oxide, potassium oxide, boron oxide, silicon oxide, bismuth oxide, and phosphorus oxide.

[0033] The thickness of the positive electrode layer and the negative electrode layer is not particularly limited, but may be, for example, each independently from 2 μm to 50 μm, particularly from 5 μm to 30 μm.

[0034] (Positive electrode current collecting layer / Negative electrode current collecting layer) Although not essential elements of the electrode layer, the positive electrode layer 110 and the negative electrode layer 120 may each have a positive electrode current collecting layer and a negative electrode current collecting layer. The positive electrode current collecting layer and the negative electrode current collecting layer may each have the form of a foil. However, if more importance is placed on the viewpoints of improving electronic conductivity by co-firing, reducing the manufacturing cost of the solid battery, and / or reducing the internal resistance of the solid battery, the positive electrode current collecting layer and the negative electrode current collecting layer may each have the form of a sintered body. As the positive electrode current collecting layer and the negative electrode current collecting layer, it is preferable to use a material with high electrical conductivity, and for example, silver, palladium, gold, platinum, aluminum, copper, and / or nickel may be used. The positive electrode current collecting layer and the negative electrode current collecting layer may each have an electrical connection part for electrically connecting to the outside, and may be configured to be electrically connectable to the end surface electrode. When the positive electrode current collecting layer and the negative electrode current collecting layer have the form of a sintered body, they may be configured of a sintered body containing a conductive material and a sintering aid. The conductive material contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected from, for example, the same materials as the conductive materials that may be contained in the positive electrode layer and the negative electrode layer. The sintering aid contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected from, for example, the same materials as the sintering aid that may be contained in the positive electrode layer and the negative electrode layer. As described above, the positive electrode current collecting layer and the negative electrode current collecting layer are not essential in the solid-state battery, and a solid-state battery that does not have such a positive electrode current collecting layer and a negative electrode current collecting layer is also conceivable. In other words, the solid-state battery included in the package of the present invention may be a solid-state battery without a current collecting layer.

[0035] (solid electrolyte) The solid electrolyte is a material capable of conducting lithium ions or sodium ions. In particular, the solid electrolyte 130 constituting a battery unit in a solid-state battery may be a layer capable of conducting lithium ions between the positive electrode layer 110 and the negative electrode layer 120. The solid electrolyte may be provided at least between the positive electrode layer and the negative electrode layer. In other words, the solid electrolyte may be present around the positive electrode layer and / or the negative electrode layer so as to protrude from between the positive electrode layer and the negative electrode layer. Specific examples of the solid electrolyte include one or more of a crystalline solid electrolyte, a glass-based solid electrolyte, and a glass ceramic-based solid electrolyte.

[0036] The crystalline solid electrolyte is, for example, an oxide-based crystalline material and a sulfide-based crystalline material. Examples of the oxide-based crystalline material include a lithium-containing phosphate compound having a Nasicon structure, an oxide having a perovskite structure, an oxide having a garnet type or a garnet-like structure, and an oxide glass ceramic-based lithium ion conductor. Examples of the lithium-containing phosphate compound having a Nasicon structure include Li x M y (PO4)3 (1≦x≦2, 1≦y≦2, M is at least one selected from the group consisting of titanium (Ti), germanium (Ge), aluminum (Al), gallium (Ga) and zirconium (Zr)). An example of a lithium-containing phosphate compound having a Nasicon structure is Li 1.2 Al 0.2 Ti 1.8 (PO4)3, etc. An example of an oxide having a perovskite structure is La 0.55 Li 0.35 An example of an oxide having a garnet-type or garnet-like structure is Li7La3Zr2O 12 Examples of sulfide crystal materials include thio-LISICON, for example Li 3.25 Ge 0.25 P 0.75 S4 and Li 10 GeP2S 12The crystalline solid electrolyte may include a polymer material (eg, polyethylene oxide (PEO)).

[0037] Examples of glass-based solid electrolytes include oxide-based glass materials and sulfide-based glass materials. Examples of oxide-based glass materials include 50Li4SiO4·50Li3BO3. Examples of sulfide-based glass materials include 30Li2S·26B2S3·44LiI, 63Li2S·36SiS2·1Li3PO4, 57Li2S·38SiS2·5Li4SiO4, 70Li2S·30P2S5, and 50Li2S·50GeS2.

[0038] The glass ceramics-based solid electrolyte may be, for example, an oxide-based glass ceramics material or a sulfide-based glass ceramics material. As the oxide-based glass ceramics material, for example, a phosphate compound containing lithium, aluminum, and titanium as constituent elements (LATP) or a phosphate compound containing lithium, aluminum, and germanium as constituent elements (LAGP) may be used. LATP is, for example, Li 1.07 Al 0.69 Ti 1.46 (PO4)3, etc. LAGP is also known as Li 1.5 Al 0.5 Ge 1.5 (PO4), etc. Examples of sulfide-based glass ceramic materials include Li7P3S 11 and Li 3.25 P 0.95 Examples include S4.

[0039] Examples of the solid electrolyte capable of conducting sodium ions include sodium-containing phosphate compounds having a Nasicon structure, oxides having a perovskite structure, and oxides having a garnet type or garnet-like structure. Examples of the sodium-containing phosphate compounds having a Nasicon structure include Na x M y (PO4)3 (1≦x≦2, 1≦y≦2, M is at least one selected from the group consisting of Ti, Ge, Al, Ga and Zr).

[0040] The solid electrolyte may contain a sintering aid. The sintering aid contained in the solid electrolyte may be selected from, for example, the same materials as the sintering aids that may be contained in the positive electrode layer and the negative electrode layer.

[0041] The thickness of the solid electrolyte is not particularly limited. The thickness of the solid electrolyte layer located between the positive electrode layer and the negative electrode layer may be, for example, 1 μm or more and 15 μm or less, and particularly 1 μm or more and 5 μm or less.

[0042] (end face electrode) A solid-state battery is generally provided with an end electrode 140. In particular, the end electrode is provided on the side surface of the solid-state battery. More specifically, a positive end electrode 140A connected to the positive electrode layer 110 and a negative end electrode 140B connected to the negative electrode layer 120 are provided (see FIG. 1). Such an end electrode is preferably made of a material having high electrical conductivity. Specific examples of the material of the end electrode include, but are not limited to, at least one selected from the group consisting of silver, gold, platinum, aluminum, copper, tin, and nickel.

[0043] [Characteristics of the solid-state battery package of the present invention] The present invention relates to a packaged solid-state battery, that is, a solid-state battery package having a substrate conducive to mounting and configured to protect the solid-state battery from the external environment.

[0044] The solid-state battery package of the present invention is characterized in that it can more effectively prevent water vapor permeation related to the substrate. In other words, the solid-state battery package is not merely packaged, but also prevents water vapor permeation in consideration of the substrate that contributes to mounting.

[0045] Specifically, the solid-state battery package of the present invention comprises a substrate and a solid-state battery provided thereon, with a water vapor barrier layer therebetween. That is, as shown in Fig. 2, a solid-state battery package 1000 includes a substrate 200 for supporting a solid-state battery 100, and a water vapor barrier layer 300 is provided between the solid-state battery 100 and the substrate 200. In such a solid-state battery package, inconvenient permeation of water vapor from the external environment through the substrate to the solid-state battery is reduced, and therefore deterioration of the solid-state battery characteristics is reduced or prevented in the long term.

[0046] The substrate 200 is disposed close to one of the main surfaces of the solid-state battery 100, and is disposed so as to shield the main surface of the solid-state battery 100 from the external environment. Therefore, although it is generally believed that the presence of the substrate can prevent the intrusion of water vapor into the solid-state battery, the present inventors have particularly focused on the fact that the substrate alone is not sufficient to prevent water vapor permeation. This is because, in the long term, the substrate may exhibit permeability to water vapor in the external environment due to the material and / or configuration of the substrate. For this reason, in the present invention, a water vapor barrier layer 300 is provided between the solid-state battery 100 and the substrate 200, and water vapor permeation to the solid-state battery 100 through the substrate 200 is effectively suppressed. Therefore, for example, an undesirable event such as a decrease in the ionic conductivity of the solid electrolyte due to a reaction between the water vapor (or moisture) infiltrating from the substrate and the solid electrolyte is suppressed or prevented.

[0047] In this specification, "water vapor" is not limited to water in a gaseous state, but also includes water in a liquid state. In other words, the term "water vapor" is used to broadly include anything related to water, regardless of its physical state. Therefore, "water vapor" can also be referred to as moisture, and in particular, liquid water can include condensed water formed by condensing water in a gaseous state.

[0048] The present invention is a packaged solid-state battery, and may have a configuration that contributes to preventing water vapor permeation not only of the substrate but also of the entire battery. For example, the solid-state battery package of the present invention may be covered with a covering material so that the solid-state battery provided on the substrate is entirely surrounded. In other words, the solid-state battery on the substrate may be packaged so that the side and main surfaces are surrounded by the covering material. In such a configuration, all surfaces constituting the solid-state battery are not exposed to the outside, and water vapor permeation can be more effectively prevented.

[0049] For example, the covering material may be composed of a covering insulating layer and a covering inorganic film. That is, as shown in FIG. 2, the solid-state battery 100 provided on the substrate 200 may have a form in which the covering insulating layer 160 and the covering inorganic layer 170 thereon are covered as the covering material 150. The covering insulating layer 160 is a layer provided so as to cover the main surface and the side surface of the solid-state battery 100. As shown in FIG. 2, the covering insulating layer 160 is provided so as to cover at least the top surface 100A and the side surface 100B of the solid-state battery 100, and the solid-state battery 100 on the substrate 200 is largely wrapped as a whole by the covering insulating layer 160. The material of the covering insulating layer 160 may be any type as long as it exhibits insulating properties. For example, the covering insulating layer 160 may contain a resin (i.e., may be a resin layer), and the resin may be either a thermosetting resin or a thermoplastic resin. That is, the covering material may be a resin layer (coating resin layer), and in a preferred embodiment, the covering material 150 may be composed of a resin layer (coating resin layer) 160 and a coating inorganic layer 170 provided thereon. The coating insulating layer 160 may contain an inorganic filler. As only one example, the coating insulating layer 160 may be composed of an epoxy-based resin containing an inorganic filler such as SiC. The coating inorganic layer 170 is provided so as to cover the coating insulating layer 160. As shown in FIG. 2, the coating inorganic layer 170 is positioned on the coating insulating layer 160, and thus has a form that largely envelops the solid-state battery 100 on the substrate 200 as a whole together with the coating insulating layer 160. The coating insulating layer 160 cooperates with the coating inorganic layer 170 to form a suitable water vapor barrier, and the coating inorganic layer 170 cooperates with the coating insulating layer 160 to form a suitable water vapor barrier. The material of the coated inorganic layer 170 is not particularly limited, and may be metal, glass, oxide ceramics, or a mixture thereof. The coated inorganic layer 170 may be an inorganic film. That is, the coated inorganic layer 170 may correspond to an inorganic layer having a thin film form, for example, a metal film. As merely one example, the coated inorganic layer 170 may be made of a Cu-based and / or Ni-based material plated to a thickness of 2 μm to 50 μm.

[0050] In the solid-state battery package 1000 of the present invention, the substrate 200 may be a package member provided to support the solid-state battery 100. That is, the substrate 200 provided closer to one main surface side (the main surface opposite to the main surface forming the top surface) of the solid-state battery 100 may be a supporting substrate. As shown in FIG. 2, the substrate 200 has a main surface larger than that of the solid-state battery 100, for example. The substrate 200 may be a resin substrate. Alternatively, the substrate 200 may be a ceramic substrate. In short, the substrate 200 may belong to a printed circuit board, a flexible substrate, an LTCC substrate, an HTCC substrate, or the like.

[0051] The substrate 200 is preferably a member for an external terminal of a packaged solid-state battery. In other words, the substrate 200 may be a terminal substrate for an external terminal of the solid-state battery 100. A solid-state battery package including such a substrate can mount a solid-state battery on another external substrate (i.e., a secondary substrate) such as a printed wiring board with the substrate interposed therebetween. For example, the solid-state battery can be surface-mounted via the substrate through solder reflow or the like. For this reason, the solid-state battery package of the present invention is preferably an SMD (Surface Mount Device) type battery package.

[0052] Since the substrate is a terminal substrate, it is preferable that the substrate has wiring and / or an electrode layer. In particular, the substrate may have an electrode layer that electrically connects the upper and lower main surfaces. That is, the substrate 200 according to a preferred embodiment has electrode layers (upper main surface electrode layer 210 and lower main surface electrode layer 220) that electrically connect the upper and lower main surfaces of the substrate, and serves as a member for an external terminal of a packaged solid-state battery (see FIG. 2). In a solid-state battery package that includes such a substrate, the electrode layer of the substrate and the terminal portion of the solid-state battery are connected to each other. Preferably, the electrode layer of the substrate and the end surface electrode of the solid-state battery are electrically connected to each other. For example, the end surface electrode 140A on the positive electrode side of the solid-state battery is electrically connected to the electrode layer (210A, 220A) on the positive electrode side of the substrate, while the end surface electrode 140B on the negative electrode side of the solid-state battery is electrically connected to the electrode layer (210B, 220B) on the negative electrode side of the substrate. As a result, the electrode layers on the positive and negative sides of the substrate (particularly the electrode layers located on the lower / bottom side of the package product or the lands connected thereto) serve as the positive and negative terminals of the solid-state battery package, respectively.

[0053] The solid-state battery package 1000 of the present invention has a configuration in which a water vapor barrier layer 300 is interposed between the solid-state battery 100 and the substrate 200 so as to provide a suitable barrier property for preventing moisture from penetrating into the solid-state battery (see FIG. 2). In this specification, the term "barrier" means having a water vapor permeation prevention property that prevents water vapor in the external environment from causing inconvenient property deterioration for the solid-state battery. In a narrower sense, the term "barrier" in this specification means a barrier having a water vapor permeation rate of 5×10 -3 g / (m 2 ·Day). In short, the water vapor barrier layer is preferably 0 g / (m 2 Day) or more 5×10 -3 g / (m 2 ·Day) (e.g., 0.5×10 -3 g / (m 2 Day) or more 5×10 -3 g / (m 2The water vapor transmission rate in this specification refers to the transmission rate obtained by the MA method using a gas transmission rate measuring device (Model WG-15S) manufactured by MORESCO Corporation under the measurement conditions of 85°C and 85% RH.

[0054] As shown in Fig. 2, the water vapor barrier layer 300 may be provided so as to be in contact with the covering insulating layer 160. In other words, the covering insulating layer 160 is preferably provided so as to cover not only the side surface of the solid-state battery 100 but also the lower surface of the solid-state battery 100, and the water vapor barrier layer 300 may be provided so as to be in contact with the covering insulating layer 160 covering the side surface and / or the lower surface of the solid-state battery 100. This means that the water vapor barrier layer is provided between the sealing resin surrounding the periphery of the solid-state battery and the substrate. When the resist layer 400 is provided on the substrate 200 (an embodiment of the resist layer installation will be described later), the water vapor barrier layer 300 may be disposed between the covering insulating layer 160 and the resist layer 400.

[0055] In a preferred embodiment, the water vapor barrier layer is thinner than the layers constituting the solid-state battery. That is, as shown in FIG. 3, the thickness of the water vapor barrier layer 300 located between the solid-state battery 100 and the substrate 200 may be smaller than the layer thickness of the layers 110, 120, 130 (e.g., at least one of them) constituting the laminated structure of the solid-state battery. In other words, the water vapor barrier layer may be smaller than the layer thickness of the positive electrode layer, the layer thickness of the negative electrode layer, and / or the layer thickness of the solid electrolyte layer. In another preferred embodiment, the water vapor barrier layer is thinner than each layer constituting the substrate. That is, as shown in FIG. 3, the thickness of the water vapor barrier layer 300 located between the solid-state battery 100 and the substrate 200 may be smaller than the layer thickness of the layer 200' (e.g., at least one of them) constituting the laminated structure of the substrate 200. For example, the water vapor barrier layer may be thinner than the metal layer included in the substrate, and if the substrate is a resin substrate, it may be thinner than the resin layers constituting the substrate, and if the substrate is a ceramic substrate, it may be thinner than the ceramic layers constituting the substrate. If the water vapor barrier layer is relatively thinner than the various constituent layers of the solid-state battery package, it is possible to prevent undesirable water vapor permeation while keeping the solid-state battery package in a low-profile or small-sized design. In other words, while preventing water vapor permeation, the influence of the water vapor permeation on other aspects is suppressed. The water vapor barrier layer may have, for example, a film form.

[0056] Here, the term "layers constituting a laminated structure of a solid-state battery" in the present specification means layers constituting a battery unit of a solid-state battery in a broad sense, and in a narrow sense, any of the positive electrode layer, the negative electrode layer, and the solid electrolyte layer therebetween. For example, the water vapor barrier layer is thinner than the battery electrode layers such as the positive electrode layer and / or the negative electrode layer of the solid-state battery, and / or the water vapor barrier layer is thinner than the solid electrolyte layer of the solid-state battery.

[0057] In addition, the term "layers constituting the substrate" in this specification means, for example, each layer assumed when constructing a substrate by lamination. Taking a resin substrate as an example, when a substrate is constructed by laminating a resin layer (for example, a layer made of a resin material impregnated in a substrate such as glass fiber cloth) and a metal layer when viewed macroscopically, each layer such as the resin layer and / or the metal layer corresponds to the "layers constituting the substrate". When a ceramic substrate is constructed by laminating a ceramic layer and another metal layer when viewed macroscopically, each layer such as the ceramic layer and the metal layer corresponds to the "layers constituting the substrate".

[0058] The thickness of the water vapor barrier layer and each layer of the solid-state battery and the substrate may be based on an electron microscope image. For example, the thickness of the water vapor barrier layer and the thickness of the layers constituting the substrate and the solid-state battery may be based on an image obtained by cutting a cross section using an ion milling device (manufactured by Hitachi High-Tech Corporation, model number IM4000PLUS) and using a scanning electron microscope (SEM) (manufactured by Hitachi High-Tech Corporation, model number SU-8040). In other words, the thickness dimension in this specification may refer to a value calculated from the dimension measured from the image obtained by such a method.

[0059] In the solid-state battery package, the water vapor barrier layer may extend in a direction along the surface direction of the substrate. As shown in the cross-sectional views of Figs. 1 to 3, the water vapor barrier layer may extend in the width direction of the solid-state battery package 1000, and the water vapor barrier layer 300 may extend across the solid-state battery package. "Extending in a direction along the surface direction" here means extending in a direction parallel to the main surface of the substrate. In other words, it can be said that the water vapor barrier layer extends in a direction perpendicular to the stacking direction of the solid-state battery. Preferably, the water vapor barrier layer extends in all directions (all directions) perpendicular to the "stack direction of the solid-state battery". The water vapor barrier layer thus extending widely in the surface direction of the substrate can more suitably block water vapor that penetrates from the external environment via the substrate. In other words, the water vapor barrier layer can more suitably act to prevent water vapor that penetrates from the outside of the package from finally reaching the solid-state battery, and thus a suitable solid-state battery package in which deterioration of the solid-state battery characteristics is suppressed in the long term can be obtained.

[0060] The water vapor barrier layer extending along the surface direction of the substrate is preferably provided widely to the outer region of the solid-state battery. In other words, it is preferable that the water vapor barrier layer is provided widely so as to extend beyond the installation region of the solid-state battery. In this regard, the water vapor barrier layer may extend to the periphery of the solid-state battery package, for example, the water vapor barrier layer may extend to the covering material covering the solid-state battery. It can be said that the water vapor barrier layer may extend (particularly in the surface direction of the substrate) so that the outer periphery of the water vapor barrier layer (preferably the entire outer periphery) reaches the outer periphery of the solid-state battery package.

[0061] For example, the water vapor barrier layer may extend to the outer surface of the covering insulating layer covering the solid-state battery on the substrate. In other words, when the solid-state battery package 1000 has the covering insulating layer 160 provided on the substrate 200 so as to cover at least the top surface 100A and the side surface 100B of the solid-state battery 100, it is preferable that the water vapor barrier layer 300 extends to the outer surface 160A of the covering insulating layer 160 covering the side surface 100B (see FIG. 4). As can be seen from the cross-sectional view of FIG. 4, this is because water vapor infiltrating from the external environment via the substrate 200 can be more reliably prevented. In other words, the water vapor barrier layer can more reliably act to prevent external water vapor infiltrating via the substrate from reaching the solid-state battery, resulting in a more suitable solid-state battery package in which deterioration of the solid-state battery characteristics is suppressed in the long term.

[0062] In a preferred embodiment, the water vapor barrier layer is an insulating film. In other words, the water vapor barrier layer is an insulating film or insulating layer having electrical insulation. In this regard, the water vapor barrier layer may be a film containing a material with high electrical insulation. In this specification, "insulation" may have electrical resistivity due to the insulating properties of a general insulator, and while this is merely an example, it may have an electrical resistivity of at least 1.0×10 5 Ω·m or more, preferably 1.0×10 6 Ω·m or more, preferably 1.0×10 7The resistivity of the water vapor barrier layer may be Ω·m or more (at room temperature 20° C.). This is because it is possible to suppress undesirable events such as short circuits. In other words, while preventing water vapor permeation, it is possible to suitably suppress undesirable electrical effects caused by the water vapor permeation. Such a water vapor barrier film or layer is not particularly limited as long as it is made of a material that exhibits insulating properties, and specific examples of such materials include inorganic insulators such as glass and alumina, and organic insulators such as resins, and these may be used alone or in combination of two or more types. For example, the water vapor barrier layer may be an inorganic film containing an inorganic material, and may be an insulating film that exhibits electrical insulation in terms of the inorganic material. Alternatively, the water vapor barrier layer may be an organic film containing an organic material, and may be an insulating film that exhibits electrical insulation in terms of the organic material. Furthermore, it may be a film in which such inorganic materials and organic materials are combined. In this specification, the term "film" or "thin film" refers to a form having a small layer thickness, and can be understood to refer to, for example, a "nanometer-order thickness" (10 nm or more and 900 nm or less) as described below.

[0063] The water vapor barrier layer may have a single layer form. Alternatively, the water vapor barrier layer may have a multi-layer form (i.e., a multi-layer form as described below). There are no particular limitations on the form as long as the desired water vapor transmission prevention properties are obtained.

[0064] In a preferred embodiment, the water vapor barrier layer is an insulating multi-layer film. By forming a multi-layer film, the water vapor barrier property of the water vapor barrier layer can be improved. Such an insulating multi-layer film may be formed by forming the same film (e.g., films of the same material) multiple times, or may be formed by forming different films (e.g., films of different materials). In the case of different films, an organic insulating barrier layer may be formed on an inorganic insulating barrier layer.

[0065] In a preferred embodiment, the water vapor barrier layer is provided so as to occupy a substantially large area of ​​the planar view area of ​​the solid-state battery package. Specifically, the water vapor barrier layer may be provided so as to occupy the entire area of ​​the planar view area of ​​the solid-state battery package except for the connection area (i.e., the connection portion) between the end surface electrode of the solid-state battery and the electrode layer of the main surface of the substrate. The water vapor barrier layer having a large area in plan view can more reliably prevent water vapor from penetrating from the external environment through the substrate. The water vapor barrier layer 300 in this embodiment may extend at the height level of the bonding member 600 provided between the end surface electrode and the electrode layer of the main surface of the substrate (see FIG. 4). For example, the water vapor barrier layer 300 may extend so as to cross the bonding member 600 while being interposed therebetween in a cross-sectional view. It can also be said that the water vapor barrier layer 300 may extend so as to contact the bonding member 600 in a cross-sectional view, and may extend beyond the bonding member 600 to the outside until it contacts the outer surface 160A of the covering insulating layer. The bonding member 600 at least provides electrical connection between the end electrodes of the solid-state battery and the substrate, and may, for example, comprise a conductive adhesive (as merely one example, the bonding member 600 may be made of an epoxy-based conductive adhesive containing a metal filler such as Ag).

[0066] The water vapor barrier layer is preferably a layer containing silicon. This is because it is likely to be a layer suitable in terms of electrical insulation. For example, the water vapor barrier layer may be an inorganic layer or film containing silicon. The water vapor barrier layer containing silicon may be a layer composed of a molecular structure containing not only silicon atoms but also nitrogen atoms and / or oxygen atoms. This is because it is likely to be a layer suitable in terms of electrical insulation and thinning. For example, the water vapor barrier layer is composed of both Si-O bonds and Si-N bonds. That is, both Si-O bonds and Si-N bonds may be present in the molecular structure constituting the layer material for the water vapor barrier layer. If the molecular structure of the layer contains both Si-O bonds and Si-N bonds, it is likely to be a dense layer despite being a thin layer, and it is likely to be a water vapor barrier layer that exhibits more suitable water vapor permeation prevention properties. In other words, it is likely to be a water vapor barrier layer that is not only desirable in terms of electrical insulation and thinning, but also exhibits more suitable water vapor permeation prevention properties. This means that while water vapor permeation can be prevented effectively, the adverse effects thereof (particularly, adverse effects from the viewpoint of reducing the height and / or size of the solid-state battery package and / or from the viewpoint of electricity) can be suppressed. Note that the above-mentioned "water vapor barrier layer containing silicon" and "water vapor barrier layer having both Si-O bonds and Si-N bonds" are not based on siloxane. In other words, the water vapor barrier layer according to the present invention preferably has a molecular structure containing silicon and Si-O bonds but not a siloxane skeleton.

[0067] The "Si-O bond" and "Si-N bond" in this specification refer to those that can be confirmed based on, for example, Fourier transform infrared spectroscopy (FT-IR). That is, in the water vapor barrier layer according to this embodiment, the Si-O bond and the Si-N bond can be confirmed by measuring the absorption of light in the infrared region. In this specification, FT-IR refers to those measured by a microscopic ATR method using, for example, Spotlight 150 manufactured by PerkinElmer.

[0068] In terms of the thin film form, the water vapor barrier layer having Si-O bonds and Si-N bonds is, for example, a film thinner than each layer constituting the laminated structure of the solid-state battery, and / or a film thinner than each layer constituting the substrate. Therefore, water vapor permeation can be suitably prevented in a design that does not contradict the low height or small size of the solid-state battery package. For example, the water vapor barrier layer having Si-O bonds and Si-N bonds preferably has a thickness on the order of nanometers, preferably 10 nm to 900 nm, more preferably 50 nm to 700 nm, even more preferably 50 nm to 500 nm, for example 50 nm to 400 nm, 50 nm to 300 nm, or 100 nm to 300 nm.

[0069] In addition, the water vapor barrier layer having Si-O bonds and Si-N bonds can be a layer with relatively high toughness. This means that the water vapor barrier layer can act favorably during charging and discharging of the solid-state battery. During charging and discharging of the solid-state battery, the solid-state battery may expand and contract due to the movement of ions between the positive and negative electrode layers via the solid electrolyte layer, but even if it is subjected to the stress of such expansion and contraction, the water vapor barrier layer has high toughness and is unlikely to crack and / or crack. Usually, a layer with high water vapor barrier properties is dense and hard and may tend to crack and / or crack due to stress, while a layer that is relatively flexible and does not crack and / or crack may tend to have low water vapor barrier properties. In this regard, the water vapor barrier layer containing Si-O bonds and Si-N bonds according to the present invention is unlikely to crack or crack even if it is subjected to the stress of expansion and contraction of the solid-state battery, and yet has high water vapor permeability, making it highly reliable as a solid-state battery package.

[0070] The water vapor barrier layer according to the present invention may, for example, contain a SiON and / or SiNH site in its molecular structure. That is, the water vapor barrier layer having Si-O bonds and Si-N bonds may contain SiON and / or SiNH. The water vapor barrier layer having Si-O bonds and Si-N bonds may have different molecular or atomic concentrations in its thickness direction. For example, a relatively lower layer region may have more SiNH formed therein, while a relatively upper layer region may have more SiON formed therein. In other words, the water vapor barrier layer provided between the substrate and the solid-state battery may have a relatively higher Si-O bond in the relatively upper layer region (i.e., the side relatively closer to the solid-state battery) and a relatively higher Si-N bond in the relatively lower layer region (i.e., the side relatively closer to the substrate). For example, the upper half region of the water vapor barrier layer (the upper half region relatively closer to the solid-state battery) may contain more Si-O bonds, while the lower half region of the water vapor barrier layer (the lower half region relatively closer to the substrate) may contain more Si-N bonds. In other words, the H atom concentration may be relatively high in the layer region that is relatively lower in the water vapor barrier layer, and the O atom concentration may be relatively high in the layer region that is relatively upper in the water vapor barrier layer. In such a case, the effect of the water vapor barrier layer, such as "a layer that is unlikely to crack or break even when subjected to stress due to expansion and contraction caused by the solid-state battery, and yet has high water vapor permeability," is easily manifested. Also, in the layer region with more SiON on the relatively upper side, the oxygen atom concentration may be relatively high on the upper side, and the oxygen atom concentration may be relatively low on the lower side. From this point of view, the water vapor barrier layer (particularly, the water vapor barrier layer having Si-O bonds and Si-N bonds) may be a layer containing both SiON moieties and SiNH moieties as its molecular structure. The water vapor barrier layer containing both SiON moieties and SiNH moieties is a dense layer and can be a layer with superior water vapor permeation prevention properties.

[0071] Preferably, the water vapor barrier layer having Si-O bonds and Si-N bonds is formed from a liquid raw material. Specifically, it is preferable to form a water vapor barrier layer having both Si-O bonds and Si-N bonds by applying the liquid raw material to a substrate and exposing the substrate to light irradiation. This allows the water vapor barrier layer to be formed without exposing the substrate to a higher temperature, and the adverse thermal effects on the substrate can be suppressed. In addition, while a vacuum deposition method or the like generally requires an expensive deposition device, the formation using such a liquid raw material does not require such an expensive device, and can relatively reduce costs. Furthermore, while a layer formed by a vacuum deposition method or the like may cause warping of the substrate due to stress acting on the layer, as described above, a layer formed from a liquid raw material has little or no such stress. Therefore, the risk of warping of the substrate is reduced or prevented when the water vapor barrier layer is produced from the liquid raw material.

[0072] The solid-state battery package of the present invention can be embodied in various forms. For example, the following forms are conceivable.

[0073] (Registration method) This embodiment has a form in which a resist layer is disposed between the substrate and the solid-state battery. In particular, due to the resist present on the substrate 200, the solid-state battery package 1000 may have a resist layer 400 between the substrate 200 and the solid-state battery 100 (see FIG. 5).

[0074] The resist layer 400 is particularly provided on the main surface of the substrate 200. The resist layer is a layer that at least partially covers the substrate surface to prevent physical processing or chemical reaction. Thus, the resist layer may be an insulating layer including a resin material provided on the main surface of the substrate 200. Such a resist layer may be considered to correspond to a heat-resistant coating provided on the main surface of the substrate 200. For example, it may be a resist that maintains insulation when the solid-state battery and the substrate are connected and serves to protect conductive parts such as the electrode layer of the substrate. Such a resist layer 400 provided on the main surface of the substrate 200 may be a so-called "solder resist" layer.

[0075] When the solid-state battery package has a resist layer, the water vapor barrier layer may have a higher barrier property than the resist layer. For example, when the resist layer 400 is provided on the substrate 200, it is preferable that the water vapor barrier layer 300 has a lower water vapor transmission rate than the resist layer 400. For example, a resist layer made of solder resist is not necessarily sufficient in terms of preventing water vapor transmission, but the water vapor barrier layer 300 can more effectively block water vapor that penetrates from the external environment via the substrate. For example, when the resist layer is made of solder resist containing a resin such as epoxy and / or acrylic, the resist layer has a water vapor transmission rate of 1 g / (m 2 .Day) or more. In other words, the insulating layer may correspond to an insulating layer having a water vapor permeability lower than that of such an insulating layer (i.e., for example, 0 g / (m 2 ·Day) or more 1g / (m 2 The water vapor barrier layer may have a water vapor transmission rate (water vapor transmission rate) of less than 100 nm.

[0076] As shown in Fig. 5, in the solid-state battery package 1000 of the present invention, a resist layer 400 may be provided on the main surface of the substrate 200 (particularly, the main surface relatively close to the solid-state battery 100). In such a case, the water vapor barrier layer 300 may be disposed at least on the resist layer 400. In the embodiment shown in Fig. 5, the water vapor barrier layer 300 is disposed in direct contact with the resist layer 400 so that the water vapor barrier layer 300 and the resist layer 400 are stacked on each other. When the water vapor barrier layer is provided on the resist layer in this way, water vapor penetrating from the external environment via the substrate and the resist layer thereon can be more effectively prevented.

[0077] When the solid-state battery package has a resist layer, the water vapor barrier layer may be partially provided on the substrate surface. For example, as shown in the cutout diagram of FIG. 5, the water vapor barrier layer 300 on the resist layer 400 may be partially positioned on the substrate 200 (in FIG. 5, the portion of the water vapor barrier layer positioned on the substrate 200 is shown as 310). That is, in a cross-sectional view, the water vapor barrier layer overlapping the resist layer in the stacking direction may extend beyond the resist layer so that a part of the resist layer and the resist layer are aligned side by side. When the water vapor barrier layer is partially positioned on the substrate in this manner, the water vapor barrier property of the solid-state battery package may be improved. For example, when the substrate is a resin substrate, the boundary between the electrode layer of the substrate made of a metal having high water vapor barrier property and the substrate resin part having low water vapor barrier property can be more reliably covered with the water vapor barrier layer, and the water vapor barrier property of the solid-state battery package may be improved. From this point of view, the water vapor barrier layer provided to overlap the resist layer may be partially positioned at least on the electrode of the substrate.

[0078] (Embodiment 1 of the substrate metal layer for retarding moisture permeation) In such an embodiment, the substrate has a metal layer as its moisture permeation retarding structure, that is, the substrate of the solid-state battery package itself has a structure that contributes to preventing water vapor permeation.

[0079] For example, the substrate 200 includes a metal layer 240 as a layer constituting the substrate 200, and the outer contour of the planar shape of the substrate 200 and the outer contour of the planar shape of the metal layer 240 overlap (see Figs. 6 and 7). That is, the metal layer 240 extends widely to the periphery of the substrate 200. When the substrate is a resin substrate, it can be said that the metal layer extends to a position exposed at the outer periphery (outermost periphery) of the resin substrate. In a preferred embodiment, while the outer contour of the planar shape of the substrate 200 and the outer contour of the planar shape of the metal layer 240 overlap, the metal layer 240 has an overall solid form (for example, a solid form except for the opening region described below) as an internal region inside the outer contour.

[0080] The metal layer in the substrate is denser than the resin portion and / or the ceramic portion, which contributes to preventing water vapor transmission. Therefore, water vapor penetrating from the external environment can be prevented at the substrate location in advance. In other words, combined with the effect of the water vapor barrier layer, the effect of preventing external water vapor from penetrating through the substrate and reaching the solid-state battery is more reliably achieved, resulting in a more suitable solid-state battery package that suppresses deterioration of the solid-state battery characteristics in the long term. For example, when the substrate has a metal layer that contributes to retarding moisture transmission, the solid-state battery package has a water vapor transmission rate of 2.5×10 -3 g / (m 2 ·Day) (the lower limit is 0 g / (m 2 ·Day may be used).

[0081] The metal layer may be, for example, a layer made of at least one metal material selected from the group consisting of copper, aluminum, stainless steel, nickel, silver, gold, tin, etc. The metal layer may be a metal foil, for example, a copper foil.

[0082] The metal layer may correspond to a layer located inside the substrate. That is, when the substrate has a first electrode layer for electrical connection with the solid-state battery on one main surface thereof and a second electrode layer for mounting the solid-state battery package on an external substrate on the other main surface thereof, the metal layer may be located between the first electrode layer and the second electrode layer. For example, the metal layer 240 may be provided in an internal region of the substrate between the first electrode layer 210 corresponding to the mounting layer of the solid-state battery 100 and the second electrode layer 220 (for example, the second electrode layer 220 corresponding to the so-called customer mounting layer) (see FIG. 6). In this way, the metal layer can be provided separately from the electrode layer solely for preventing water vapor permeation, so that water vapor permeation can be more effectively prevented by the substrate. Note that such a metal layer may or may not be responsible for electrical connection between the upper and lower main surfaces of the substrate. When the metal layer 240 is not responsible for electrical connection between the upper and lower main surfaces of the substrate, it corresponds to a non-electrically connected metal layer provided in the internal region of the substrate. That is, the metal layer 240 in such a case is not electrically connected to the first electrode layer 210 and the second electrode layer 220. On the other hand, when the metal layer 240 is responsible for the electrical connection between the upper and lower main surfaces of the substrate, the metal layer 240 corresponds to a metal layer for electrical connection provided in the internal region of the substrate. That is, the metal layer 240 in such a case is electrically connected to the first electrode layer 210 and the second electrode layer 220. In one preferred embodiment, the metal layer may be a dummy electrode layer that is not responsible for the electrical connection between the upper and lower main surfaces. That is, the metal layer may be a metal layer that is not electrically connected to the first electrode layer and the second electrode layer and is provided solely for preventing water vapor permeation. Alternatively, the metal layer may be a ground layer. That is, the metal layer for preventing water vapor permeation may be used as a ground layer. Such a metal layer for preventing water vapor permeation may be one layer, but is not necessarily limited to this. If more importance is placed on the point of further increasing the effect of preventing water vapor permeation, the metal layer may be provided as at least two layers in the substrate. 8, when the metal layer 240 is provided on the substrate 200, the substrate base material layer 250 such as a resin layer has a meandering shape in the cross-sectional view of the substrate. In other words, the water vapor intrusion path of the substrate becomes a roundabout shape, and water vapor permeation to the solid-state battery can be more effectively prevented.

[0083] In a preferred embodiment, the metal layer extending across the substrate has a form that occupies substantially the entire plane level of the substrate. It can also be said that a metal layer provided inside the substrate and extending in the surface direction of the substrate occupies substantially the entire substrate surface (virtual plane inside the substrate) at such an extension level. For example, the area of ​​the shape of the metal layer 240 in plan view is 90% or more, preferably 95% or more, and more preferably 99% or more, of the area of ​​the shape of the substrate 200 in plan view. That is, the metal area ratio in the substrate may be 90% or more, preferably 95% or more, and more preferably 99% or more. The upper limit of such area ratio may be 100% (other area ratios / occupancies mentioned in this specification may also have an upper limit of 100%). Note that such metal area ratio may include metal parts (e.g., vias) in the openings of the metal layer described later. In addition, as only one example, the area of ​​the shape of the metal layer 240 in plan view may be 90% to 99.5%, or 95% to 99.5%, of the area of ​​the shape of the substrate 200 in plan view. It can also be said that the substrate surface occupancy rate of the metal layer extending in the substrate surface direction inside the substrate may be 90% or more, preferably 95% or more, and more preferably 99% or more. This means that the shape of the metal layer 240 in plan view and the shape of the substrate 200 in plan view are substantially the same macroscopically (see FIG. 7), and therefore it is possible to more reliably prevent water vapor from entering from the external environment at the substrate location.

[0084] (Moisture permeation retarding substrate metal layer embodiment 2) In this embodiment, the metal layer provided as a moisture permeation retarding structure of the substrate has a unique opening shape. Specifically, the opening area provided in the metal layer has a circular shape in plan view. As shown in FIG. 8, the metal layer 240 extending widely to the periphery of the substrate 200 may have a circular shape in plan view of the opening area 245 (or a circular outline in plan view at the opening). A circular shape in plan view has little shape anisotropy and is likely to contribute to an improvement in the metal area ratio. In other words, such an opening can improve the metal area ratio in the plan view shape of the substrate, and can further enhance the effect of preventing water vapor permeation. Therefore, it is easy to obtain a long-life solid-state battery package in which the deterioration of solid-state battery characteristics is more suitably suppressed in the long term.

[0085] For example, the opening area for a via that provides electrical connection between the upper and lower main surfaces may have a circular shape in plan view. In such a case, the metal part or conductive part that joins the upper and lower layers in the substrate is preferably circular (circular in plan view).

[0086] In this specification, the term "circular" is not limited to a perfect circle (i.e., simply a "circle" or a "perfect circle"), but also includes an approximately circular shape that may be generally included in a "round shape" as recognized by those skilled in the art, even if it has been modified from the perfect circle. For example, it may be not only a circle or a perfect circle, but also a shape whose arc curvature varies locally, and may further be a shape derived from a circle or a perfect circle, such as an ellipse.

[0087] The above "metal area ratio" may be considered to include the metal area of ​​the via portion. In other words, the area of ​​the shape of the metal layer in plan view, including the area of ​​the via located in the opening region (the area of ​​the shape of the via in plan view on the same plane as the metal layer), may be 90% or more, preferably 95% or more, and more preferably 99% or more.

[0088] (Aspects of Resin Substrate) In this embodiment, the substrate is particularly a resin substrate. That is, the solid-state battery package includes a substrate that contains a resin as a base material. In this embodiment, the laminated structure of the substrate may contain a resin layer. The resin material of such a resin layer may be any thermoplastic resin and / or any thermosetting resin. The resin layer may be formed by impregnating a fiber cloth and / or paper, etc., that serves as a base material, with a resin material. For example, the resin layer may be formed by impregnating a glass fiber cloth with a resin material such as an epoxy resin.

[0089] The resin substrate can act favorably during charging and discharging of the solid-state battery. During charging and discharging of the solid-state battery, the solid-state battery may expand and contract due to the movement of ions between the positive and negative electrode layers via the solid electrolyte layer, but the resin substrate can favorably absorb the stress during charging and discharging, and can reduce the load on the water vapor barrier layer. In other words, the risk of the water vapor barrier layer being damaged during use of the solid-state battery package can be reduced, and the reliability of the package can be improved in terms of preventing water vapor transmission.

[0090] The inventors of the present application have found that resins are permeable to water vapor (various forms of moisture including, for example, water vapor in the air) to a certain extent, and that in a solid-state battery package, there is a risk that moisture may penetrate into the inside of the package through the resin portion of the substrate. Therefore, when the substrate is a resin substrate, the effect of a substrate metal layer that retards moisture permeation, i.e., a metal layer that more reliably blocks water vapor from the external environment at the substrate location, is likely to become apparent.

[0091] [Method of manufacturing solid-state battery package] The packaged product of the present invention can be obtained by preparing a solid-state battery including a battery building block having a positive electrode layer, a negative electrode layer, and a solid electrolyte between the electrodes, and then packaging the solid-state battery.

[0092] The production of the solid-state battery package of the present invention can be broadly divided into the production of the solid-state battery itself (hereinafter also referred to as a "pre-packaged battery"), which corresponds to a stage prior to packaging, the preparation of the substrate, and packaging.

[0093] <Manufacturing method of unpackaged batteries> The prepackaged battery can be manufactured by a printing method such as a screen printing method, a green sheet method using a green sheet, or a combination of these methods. In other words, the prepackaged battery itself may be manufactured in accordance with a conventional method for manufacturing solid-state batteries (therefore, raw materials such as the solid electrolyte, organic binder, solvent, optional additives, positive electrode active material, and negative electrode active material described below may be those used in the manufacture of known solid-state batteries).

[0094] In the following, in order to better understand the present invention, one manufacturing method will be described as an example, but the present invention is not limited to this method. In addition, the chronological matters such as the order of description below are merely for the convenience of explanation, and are not necessarily bound by them.

[0095] (Laminated block formation) A solid electrolyte, an organic binder, a solvent, and optional additives are mixed to prepare a slurry, which is then fired to form a sheet comprising the solid electrolyte. A paste for a positive electrode is prepared by mixing a positive electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and any additives. Similarly, a paste for a negative electrode is prepared by mixing a negative electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and any additives. Print the positive electrode paste onto the sheet, and if necessary, print the current collecting layer and / or negative layer. Similarly, print the negative electrode paste onto the sheet, and if necessary, print the current collecting layer and / or negative layer. A laminate is obtained by alternately stacking sheets printed with a paste for a positive electrode and sheets printed with a paste for a negative electrode. Note that the outermost layer (the uppermost layer and / or the lowermost layer) of the laminate may be an electrolyte layer, an insulating layer, or an electrode layer.

[0096] (Battery firing formation) After the laminate is pressure-bonded and integrated, it is cut to a predetermined size. The cut laminate is degreased and fired to obtain a fired laminate. The laminate may be degreased and fired before cutting, and then cut.

[0097] (Edge electrode formation) The positive end electrode can be formed by applying a conductive paste to the exposed positive electrode side of the fired laminate. Similarly, the negative end electrode can be formed by applying a conductive paste to the exposed negative electrode side of the fired laminate. The positive and negative end electrodes may be provided so as to extend to the main surface of the fired laminate. This is because they can be connected to the main electrode layer of the substrate with a small area in the next process (more specifically, the end electrode provided so as to extend to the main surface of the fired laminate has a folded portion on the main surface, and such a folded portion can be electrically connected to the main electrode layer of the substrate). The component of the end electrode can be at least one selected from silver, gold, platinum, aluminum, copper, tin, and nickel.

[0098] The end electrodes on the positive and negative electrodes do not necessarily have to be formed after firing of the laminate, but may be formed before firing and then subjected to simultaneous firing.

[0099] By going through the above steps, a desired pre-packaged battery can finally be obtained.

[0100] <Preparation of substrate> (Resin substrate) When the substrate is a resin substrate, the substrate may be prepared by laminating a plurality of layers and applying heat and pressure. For example, at least one resin sheet, which is made by impregnating a fiber cloth and / or paper as a base material with a resin raw material, and at least one metal sheet (e.g., a metal foil sheet) are prepared, and these are stacked together to form a substrate precursor. The substrate precursor is then heated and pressed in a press to obtain a resin substrate.

[0101] The principal surface electrode layer provided on the principal surface of the substrate for electrical connection may be appropriately patterned.

[0102] In addition, when providing the above-mentioned "substrate metal layer for retarding moisture transmission", the above-mentioned metal sheet may include a sheet having a desired shape. A substrate precursor is formed by laminating metal sheets including at least the sheet for retarding moisture transmission alternately with the above-mentioned resin sheet, and the substrate precursor is subjected to a heat and pressure treatment to obtain a resin substrate provided with a moisture transmission retarding metal layer.

[0103] (Ceramic substrate) When the substrate is a ceramic substrate, the preparation may be carried out, for example, by stacking and firing a plurality of green sheets.

[0104] The semi-rack substrate may have vias and / or lands. In such a case, for example, holes may be formed in the green sheet by a punch press or a carbon dioxide gas laser, and the holes may be filled with a conductive paste material, or a precursor of a metal part or a conductive part such as a via, a land, a wiring layer and / or an electrode layer may be formed by carrying out a printing method or the like. In addition, the ceramic substrate preferably has a non-connected metal layer that is not electrically connected as a water vapor permeation prevention layer. In such a case, the metal layer (particularly its precursor) may be formed on the green sheet. Such a metal layer may be formed by a printing method, or may be formed by arranging a metal foil or the like. Next, a predetermined number of such green sheets are stacked and thermocompressed to form a green sheet laminate, and the green sheet laminate is subjected to firing to obtain a ceramic substrate. The lands and the like may also be formed after firing the green sheet laminate.

[0105] By going through the above steps, the desired substrate can finally be obtained.

[0106] (Formation of water vapor barrier layer) The water vapor barrier layer may be formed on the substrate, i.e., the water vapor barrier may be formed on the substrate prior to packaging in which the substrate and the solid-state battery are combined together.

[0107] The water vapor barrier layer is not particularly limited as long as it can form a desired barrier layer. For example, a "water vapor barrier layer having Si-O bonds and Si-N bonds" can be formed by applying a liquid source and irradiating ultraviolet light. Preferably, a "water vapor barrier layer having Si-O bonds and Si-N bonds" can be obtained by applying a liquid source containing a silicon compound, for example, a liquid source containing a silicon compound containing Si-N-Si bonds and a solvent (for example, an organic solvent), and irradiating ultraviolet light onto a precursor layer obtained by applying the liquid source. In other words, the water vapor barrier layer can be formed from a liquid source under relatively low temperature conditions (for example, a temperature condition of about 100°C) without using a gas phase deposition method such as CVD or PVD.

[0108] Specifically, a liquid raw material containing a silicon compound such as silazane is prepared, and the liquid raw material is applied to a substrate by spin coating or spray coating, and dried to form a barrier precursor. Then, the barrier precursor is irradiated with UV light in an atmosphere containing nitrogen and / or oxygen, thereby obtaining a "water vapor barrier layer having Si-O bonds and Si-N bonds." For example, a "water vapor barrier layer in which a layer region relatively closer to a solid-state battery contains relatively more Si-O bonds, while a layer region relatively closer to a substrate contains relatively more Si-N bonds" can be obtained by irradiating a barrier precursor layer containing a silicon compound containing Si-N-Si bonds (e.g., silazane) with UV light in an ambient atmosphere containing nitrogen and oxygen. In particular, in the UV irradiation step of the barrier precursor layer, active oxygen is generated in the ambient atmosphere by the UV irradiation, and the active oxygen penetrates from the outer surface of the barrier precursor layer, thereby obtaining the water vapor barrier layer. More specifically, active oxygen is generated in an ambient atmosphere containing oxygen and nitrogen, and UV irradiation is continued to promote the severing of molecular bonds of "silicon compounds containing Si-N-Si bonds" in the barrier precursor layer, so that the active oxygen that has penetrated from the outer surface of the barrier precursor layer is bonded to the severing molecular sites. The outer surface of the barrier precursor layer and the region within the layer near it contain relatively more Si-O bonds, while the region within the layer that is relatively farther from the outer surface of the barrier precursor layer contains relatively more Si-N bonds because the influence of UV irradiation is relatively small and the severing of the molecular bonds is less promoted. By obtaining a water vapor barrier layer on the substrate in this manner, it is possible to obtain a water vapor barrier layer in which "the layer region relatively closer to the solid-state battery contains relatively more Si-O bonds, while the layer region relatively closer to the substrate contains relatively more Si-N bonds."

[0109] When forming the water vapor barrier layer, it is preferable to locally remove the barrier layer at the joint between the conductive portion of the substrate and the end electrode of the solid-state battery so that the water vapor barrier layer is not present at that joint. Alternatively, a mask may be used so that the water vapor barrier layer is not formed only at the joint. In other words, a mask may be applied to the area to be the joint, the water vapor barrier layer may be formed overall, and then the mask may be removed.

[0110] When a resist layer is provided on the main surface of the substrate, the water vapor barrier layer 300 may be formed on the resist layer 400 as shown in Figures 9(A) and 9(B). In this case, as described above, it is preferable to form the water vapor barrier layer 300 so as to exclude the bonding region 500 with the solid-state battery 100. In other words, it is preferable to prepare the substrate 200 on which the resist layer 400 and the water vapor barrier layer 300 are formed so that the front electrode of the substrate is exposed. If necessary, the water vapor barrier layer may be formed on the resist layer so that a part of the water vapor barrier layer is positioned at the front electrode of the substrate.

[0111] Packaging The battery and substrate obtained above are used for packaging. Figures 9(C) to 9(E) are schematic diagrams showing the steps of packaging to obtain the solid-state battery package of the present invention.

[0112] 9(C) and 9(D), a pre-packaged battery 100 is placed on a substrate 200. That is, an "unpackaged solid-state battery" is placed on the substrate (hereinafter, a battery used for packaging is also simply referred to as a "solid-state battery").

[0113] Preferably, the solid-state battery is placed on the substrate so that the conductive portion of the substrate and the end electrode of the solid-state battery are electrically connected to each other. For example, a conductive paste may be applied to the substrate (particularly to the region of the above-mentioned "joint"), thereby electrically connecting the conductive portion of the substrate and the end electrode of the solid-state battery to each other. More specifically, the electrode layer on the substrate main surface and the folded portion of the end electrode on the positive electrode side of the solid-state battery are aligned, and another electrode layer on the substrate main surface and the folded portion of the end electrode on the negative electrode side of the solid-state battery are aligned, and then the bonding is performed using a conductive paste (e.g., Ag conductive paste). That is, a precursor 600' of a bonding member that is responsible for the electrical connection between the solid-state battery 100 and the substrate 200 may be provided in advance. Such a precursor 600' of a bonding member may be provided by printing a conductive paste that does not require washing with flux after formation, such as Ag conductive paste, nanopaste, alloy paste, brazing material, etc. Next, the solid-state battery 100 is placed on the substrate so that the end surface electrodes of the solid-state battery and the precursor 600' of the bonding member are in contact with each other, and a heat treatment is performed to form the bonding member 600 from the precursor 600', which contributes to electrical connection between the solid-state battery 100 and the substrate 200.

[0114] Next, a covering material is formed. As shown in FIG. 9(E), the covering material 150 may include a covering insulating layer 160 and a covering inorganic layer 170.

[0115] First, the covering insulating layer 160 is formed so as to cover the solid-state battery 100 on the substrate 200. Therefore, the raw material of the covering insulating layer 160 is provided so as to cover the entire solid-state battery on the substrate. When the covering insulating layer is made of a resin material, a resin precursor is provided on the substrate and cured to form the covering insulating layer. In a preferred embodiment, the covering insulating layer may be molded by applying pressure with a mold. As an example only, the covering insulating layer that seals the solid-state battery on the substrate may be molded through compression molding. If it is a resin material generally used in molding, the form of the raw material of the covering insulating layer may be granular, and the type may be thermoplastic. Note that such molding is not limited to mold molding, and may be performed through polishing, laser processing, and / or chemical treatment.

[0116] After the coating insulating layer 160 is formed, the coating inorganic layer 170 is formed. Specifically, the coating inorganic layer 170 is formed on the "coating precursor in which each solid-state battery 100 is covered with the coating insulating layer 160 on the support substrate 200." For example, a plating layer is formed. As a mere example, dry plating may be performed to provide a dry plating film as the coating inorganic layer.

[0117] Through the above-mentioned steps, a packaged product can be obtained in which a water vapor barrier layer is provided between the substrate and the solid-state battery, and the solid-state battery on the substrate is entirely covered with a coating insulating layer and a coating inorganic layer, that is, the "solid-state battery package" according to the present invention can be finally obtained.

[0118] Although the embodiments of the present invention have been described above, they are merely typical examples. The present invention is not limited to these, and those skilled in the art will easily understand that various modifications are possible without departing from the scope of the present invention.

[0119] For example, in the above description, a drawing showing a form in which the solid-state battery package has a resist layer is used, but the present invention is not particularly limited thereto. For example, a resist layer may not be provided between the substrate 200 and the solid-state battery 100 (see FIG. 10). That is, for example, the resist layer 400 described with reference to FIG. 5 may not be provided. As shown in FIG. 10, since there is no resist layer between the substrate 200 and the solid-state battery 100, the water vapor barrier 300 may be disposed directly on the base material portion (e.g., the resin portion or the ceramic portion) on the substrate and / or the electrode layer 210 (the electrode layer 210A on the positive electrode side and / or the electrode layer 210B on the negative electrode side) on the substrate surface.

[0120] In the above description, the package has the covering material 150, but the present invention may have a configuration in which the solid-state battery 100 is largely covered by the covering material 150. For example, the covering inorganic layer 170 provided on the covering insulating layer 160 that encases the solid-state battery 100 on the substrate 200 may extend to the lower main surface of the substrate 200 (see FIG. 2). That is, the covering inorganic layer 170 on the covering insulating layer 160 as the covering material 150 may extend to the side surface of the substrate 200 and extend beyond the side to the lower main surface (particularly the peripheral portion) of the substrate 200. In this case, a solid-state battery package in which moisture permeation (moisture permeation from the outside to the solid-state battery stack) is more suitably prevented can be obtained. The covering inorganic layer 170 may be provided as a multi-layer structure consisting of at least two layers, as shown in FIG. 11. FIG. 11 shows a two-layer covering inorganic layer 170 of 170A and 170B. Such a multi-layer structure is not limited to between different materials, but may be between the same materials. When such a multi-layer structure coated inorganic layer is provided, the water vapor barrier properties of the entire package can be improved. When a coated inorganic layer is provided, the water vapor barrier layer may extend to or contact the coated inorganic layer. In particular, the water vapor barrier layer 300 may extend to or contact the coated inorganic layer 170 covering the side surface of the solid-state battery 100 (see Figs. 2 and 11). As can be seen from the cross-sectional views of Figs. 2 and 11, this is because water vapor penetrating from the external environment via the substrate 200 can be more reliably prevented. In other words, when the coated inorganic layer 170 is provided on the coated insulating layer 160 so as to cover at least the coated insulating layer 160, the water vapor barrier layer 300 may extend to the coated inorganic layer 170 covering the side surface of the solid-state battery 100 (in particular, its inner side surface or inner surface). In such an embodiment, the water vapor barrier layer can be made to function more reliably so that external water vapor penetrating through the substrate does not reach the solid-state battery, resulting in a solid-state battery package that suppresses deterioration of the solid-state battery characteristics over the long term. Note that, when the coating inorganic layer 170 is provided on the coating insulating layer 160, the water vapor barrier layer 300 extending to the outer side surface or outer surface of the coating insulating layer 160 may be in contact with the coating inorganic layer 170.

[0121] In the above description, a metal layer having a high "metal area ratio" was mentioned, but the present invention may achieve a high metal area ratio from multiple substrate metal layers. As shown in FIG. 12, multiple metal layers, for example, metal layers provided as metal layers 240A, 240B, and 240C, may achieve a metal area ratio of 90% or more, preferably a metal area ratio of 95% or more, and more preferably a metal area ratio of 99% or more. This means that the total area of ​​the planar shapes of multiple metal layers such as metal layers 240A, 240B, and 240C may have an area ratio (area ratio relative to the area of ​​the planar shape of substrate 200) of 90% or more, preferably 95% or more, and more preferably 99% or more. It can be said that the target metal layers may have a metal area ratio of 99% or more in total in plan view. It should be noted that such multiple metal layers (e.g., metal layer 240A, metal layer 240B and metal layer 240C) may be positioned on different planes (in short, different height or depth levels) within the substrate and / or may not overlap each other in a planar perspective view of the substrate.

[0122] In the above description, the vias in the opening regions of the metal layer were mentioned, but the metal layer or metal portion connecting the first electrode layer and the second electrode layer can also be considered to have a via structure. That is, the substrate may be provided with a metal structure or metal portion that is connected to one or more layers in a cross-sectional view. In consideration of such matters, the substrate according to the present invention can be expressed in various metal layer forms. For example, the substrate may have a first metal layer positioned between the first electrode layer (electrode layer for electrical connection with the solid-state battery on one main surface of the substrate) and the second electrode layer (electrode layer for mounting the solid-state battery package on an external substrate on the other main surface of the substrate), and the substrate may further have a second metal layer that is not connected to the first electrode layer and the second electrode layer. The first metal layer may preferably correspond to a metal layer (or metal portion, for example, a via portion) that electrically connects the first electrode layer and the second electrode layer to each other. In this case, the substrate may have a first metal layer (or a metal portion, for example, a via portion) between the first electrode layer and the second electrode layer, which is electrically connected to the first electrode layer and the second electrode layer, and a second metal layer that is not electrically connected to the first electrode layer and the second electrode layer. The first metal layer and the second metal layer may be made of the same metal material, or may be made of different metal materials. In this embodiment, the package substrate is provided as a terminal substrate for the external terminal of the solid-state battery, and water vapor permeation from the external environment to the solid-state battery in the solid-state battery package can be suitably prevented. Such a first metal layer and second metal layer may be positioned on the same plane (in short, at the same height level or depth level) inside the substrate, or may be positioned on different planes (in short, at different height levels or depth levels). The area of ​​the planar shape of the first metal layer and the second metal layer may be, for example, 90% or more of the area of ​​the planar shape of the substrate. More specifically, the total area of ​​the planar view shape of the first metal layer and the planar view shape of the second metal layer is preferably 90% or more of the area of ​​the planar view shape of the substrate, more preferably 95% or more, and even more preferably 99% or more (the upper limit of such area ratio may be 100%).When such an area relationship is achieved, water vapor transmission from the external environment to the solid-state battery can be more effectively prevented.

[0123] Furthermore, in the above description, the conductive portion of the substrate and the end electrode of the solid-state battery are electrically connected to each other using the conductive paste provided on the substrate. However, the provided conductive paste 600' may have a shape as shown in FIG. 13. When the solid-state battery 100 and the substrate 200 are electrically connected via the conductive paste 600', the solid-state battery 100 applies a pressing force to the conductive paste 600', so that the end electrode 140 of the solid-state battery 100 is likely to be slightly embedded in the conductive paste 600'. In other words, the conductive paste 600' is likely to be pressed by the end electrode 140 and have a slightly raised shape on the outside (part "M" in FIG. 13). Also, when the solid-state battery 100 and the substrate 200 are electrically connected via the conductive paste 600', a part of the conductive paste 600' may flow so as to straddle the resist layer 400 due to the pressing force of the conductive paste 600'. That is, as shown in FIG. 13, the conductive paste 600' is positioned on the main surface electrode layer 210 of the substrate inside the resist layer 400 and the water vapor barrier layer 300, but a part 600'' of the conductive paste 600' extends onto the water vapor barrier layer 300. This is related to the fact that the resist layer 400 and the water vapor barrier layer 300 act as a "dam" for the conductive paste 600'. More specifically, the openings of the resist layer 400 and the water vapor barrier layer 300 that expose the conductive parts of the substrate (particularly, the main surface electrode layer 210 of the substrate) have edges that form the openings that act to partially prevent the conductive paste 600' from moving, so that a part of the conductive paste 600' once provided in the openings flows onto the water vapor barrier layer 300 as it is pressed, but most of the conductive paste 600' can remain in the openings of the resist layer 400 and the water vapor barrier layer 300. In other words, preferably, the resist layer (e.g., a solder resist layer) and the water vapor barrier layer thereon act as a dam to suppress the bleeding of the conductive paste. When the bleeding of the conductive paste is suppressed, the bonding area between the water vapor barrier layer 300 and the covering insulating layer 160 (particularly the covering insulating layer 160 provided between the solid-state battery 100 and the substrate 200) is more easily ensured, and the adhesive force therebetween can be more stabilized.Note that the conductive paste 600′ is an expression assuming the time of manufacture, but in terms of a manufactured solid-state battery, the conductive paste 600′ corresponds to the bonding member 600. Thus, in the solid-state battery package 1000 according to an embodiment of the present disclosure, as shown in FIG 13, the bonding member 600 is positioned inside the resist layer 400 and the water vapor barrier layer 300 (particularly the region on the upper principal surface electrode layer 210 of the substrate), but a part of it extends onto the water vapor barrier layer 300.

[0124] Although the present invention relates to a solid-state battery package, the package may be provided as an electronic device mounted on an external substrate separate from the substrate of the package. In other words, the substrate of the solid-state battery package can be a terminal substrate for an external terminal of the solid-state battery, and the solid-state battery package may be surface-mounted on an external substrate (i.e., a secondary substrate) such as a printed wiring board via the terminal substrate, and the solid-state battery package may be provided as such an electronic device. [Industrial Applicability]

[0125] The solid-state battery package of the present invention can be used in various fields where battery use or power storage is envisioned. By way of example only, the solid-state battery package of the present invention can be used in the electrical, information, and communication fields in which mobile devices and the like are used (for example, the electrical and electronic equipment fields or mobile equipment fields including mobile phones, smartphones, notebook computers, digital cameras, activity meters, arm computers, electronic paper, and small electronic devices such as RFID tags, card-type electronic money, and smart watches), household and small industrial applications (for example, power tools, golf carts, household, nursing care, and industrial robots), large industrial applications (for example, forklifts, elevators, and port cranes), transportation systems (for example, hybrid cars, electric cars, buses, trains, electrically assisted bicycles, and electric motorcycles), power system applications (for example, various power generation, road conditioners, smart grids, and general household installation-type power storage systems), medical applications (medical devices such as earphone hearing aids), pharmaceutical applications (medical management systems), as well as the IoT field, and space and deep sea applications (for example, space probes, submersible research vessels, and the like). [Explanation of symbols]

[0126] 100 solid state battery Top surface (upper surface) of 100A solid-state battery Side view of 100B solid-state battery 110 Positive electrode layer 120 Negative electrode layer 130 Solid electrolyte or solid electrolyte layer 140 End electrode 140A Positive end electrode 140B Negative end electrode 150 Covering material 160 Insulating coating layer 160A Outer surface of the insulation layer 170 Inorganic coating layer 170A Sub-coated inorganic layer (sub-lower layer) 170B Sub-coated inorganic layer (sub-upper layer) 200 boards 200' Layers constituting the laminate structure of the substrate 210 Principal surface electrode layer (upper side of substrate) 210A Positive electrode upper main surface electrode layer 210B Upper main surface electrode layer on the negative electrode side 220 Main surface electrode layer (bottom side of substrate) 220A Positive electrode lower main surface electrode layer 220B Lower main surface electrode layer on the negative electrode side 240 Metal layer of the board 245 Metal layer opening 300 Water Vapor Barrier Layer 310 Water vapor barrier layer part located on the substrate 400 resist layer 500 Bonding area between end electrode of solid-state battery and electrode layer of substrate 600 Joint materials 600' Precursor for joint components 1000 Solid-state Battery Packages M Conductive paste / raised part of joining material

Claims

1. A substrate and a solid-state battery provided on the substrate, a water vapor barrier layer between the substrate and the solid-state battery; The substrate has a metal layer as a layer constituting the substrate, A solid-state battery package, wherein an outer contour of the planar shape of the substrate overlaps with an outer contour of the planar shape of the metal layer.

2. 2. The solid-state battery package according to claim 1, wherein the water vapor barrier layer is thinner than a layer constituting a laminate structure of the solid-state battery.

3. The solid-state battery package according to claim 1 , wherein the water vapor barrier layer is an insulating film.

4. 2. The solid-state battery package of claim 1, wherein the water vapor barrier layer comprises both Si--O and Si--N bonds.

5. 5. The solid-state battery package according to claim 4, wherein the water vapor barrier layer has a layer region relatively closer to the solid-state battery that contains a relatively large number of Si—O bonds, while a layer region relatively closer to the substrate that contains a relatively large number of Si—N bonds.

6. The water vapor barrier layer is 5×10 -3 g / (m 2 10. The solid-state battery package of claim 1, having a water vapor transmission rate of less than 1000 sq. m. Day.

7. 2. The solid-state battery package according to claim 1, wherein a resist layer is provided on the substrate, and the water vapor barrier layer has a water vapor transmission rate lower than that of the resist layer.

8. The solid-state battery package according to claim 1 , wherein the water vapor barrier layer extends in a direction parallel to a surface of the substrate.

9. Further comprising a coating insulating layer provided so as to cover a main surface and a side surface of the solid-state battery, 9. The solid-state battery package according to claim 8, wherein the water vapor barrier layer extends to an outer surface of the covering insulating layer covering the side surface.

10. 9. The solid-state battery package according to claim 8, further comprising a covering insulating layer provided so as to cover the main surface and the side surface of the solid-state battery, and a covering inorganic layer provided on the covering insulating layer, wherein the water vapor barrier layer extends to an inner surface of the covering inorganic layer covering the side surface of the solid-state battery.

11. 2. The solid-state battery package according to claim 1, wherein the substrate has a first electrode layer on one main surface for electrical connection with the solid-state battery and a second electrode layer on the other main surface for mounting the solid-state battery package to an external substrate, the metal layer being positioned between the first electrode layer and the second electrode layer.

12. The solid-state battery package according to claim 1 , wherein an area of ​​the metal layer in a plan view is 99% or more of an area of ​​the substrate in a plan view.

13. The solid-state battery package of claim 1 , wherein the metal layer extends to a side surface of the substrate.

14. The solid-state battery package according to claim 1 , wherein the opening region provided in the metal layer has a circular shape in a plan view.

15. the substrate has a first electrode layer on one main surface for electrical connection with the solid-state battery, and a second electrode layer on the other main surface for mounting the solid-state battery package to an external substrate; 2. The solid-state battery package according to claim 1, further comprising a first metal layer between the first electrode layer and the second electrode layer, the first metal layer being electrically connected to the first electrode layer and the second electrode layer, and a second metal layer being not electrically connected to the first electrode layer and the second electrode layer.

16. 16. The solid-state battery package according to claim 15, wherein a total area of ​​the planar shape of the first metal layer and the planar shape of the second metal layer is 99% or more of an area of ​​the planar shape of the substrate.

17. The solid-state battery package according to claim 1 , wherein the substrate is a resin substrate.

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