Method and apparatus for drying electronic devices - Patents.com

Abstract

Methods and apparatus for drying electronic devices are disclosed. Embodiments include methods and apparatus for heating and reducing pressure within an electronic device. Some embodiments apply heat while increasing or decreasing pressure. Other embodiments include a desiccator that removes moisture from air being exhausted from the electronic device before the air reaches an exhaust pump. Further embodiments detect humidity in a low-pressure chamber and determine when to increase and / or decrease pressure based on the humidity. Still further embodiments determine when the device is dry enough to restore proper functionality based on the detected humidity, in some embodiments based on changes in humidity while the pressure is increased or decreased. Yet further alternative embodiments automatically control some or all aspects of drying an electronic device. Additional embodiments sterilize electronic devices.

Description

[Technical field]

[0001] This application claims priority to U.S. Provisional Patent Application No. 61 / 593,617, filed February 1, 2012, and U.S. Provisional Patent Application No. 61 / 638,599, filed April 26, 2012, the entireties of which are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE Embodiments of the present invention relate generally to the repair and maintenance of electronic devices, and more particularly to the repair and maintenance of electronic devices that have become at least partially inoperable due to moisture ingress. [Background technology]

[0003] Electronic devices are often manufactured with ultra-precise parts and tight fit-and-finish dimensions that are intended to keep moisture out of the device. Many electronic devices are also manufactured in a way that makes it difficult for the owner and / or user to even attempt to disassemble and dry the device without rendering it inoperable. With electronic devices continually becoming smaller and software applications becoming more and more powerfully computerized, it is not uncommon today for people to own multiple electronic devices, such as portable electronic devices. Mobile phones are now more common than telephone land lines, and many people inadvertently and unintentionally expose their electronic devices to water or other fluids on a daily basis all over the world. This happens every day, for example, in bathrooms, kitchens, swimming pools, ponds, washing machines, or any other area where various electronic devices (e.g., small portable electronic devices) may be submerged in water or exposed to high humidity conditions. These electronic devices often have miniaturized solid-state transistor memory that captures and stores digitized media in the form of phone contact lists, email addresses, digital photographs, digital music, and the like. Summary of the Invention

[0004] In the prior art, it is currently difficult to remove moisture from within an electronic device. The electronic device can be heated, but to no avail, since in many cases the moisture within the device cannot escape due to the tortuous path of travel. Without thoroughly disassembling the electronic device and using a combination of heat drying and air drying, it is difficult to properly dry a device once it has been exposed to water and / or other wetting agents or fluids. Furthermore, if the device is dried using general heating, and the heat exceeds the recommended maximum for the electronic device or other components, damage may occur, rendering the device inoperable and causing the owner's digitized data to be lost forever. It was recognized that a new type of drying system was needed to allow individuals or repair shops to dry electronic devices without disassembly, while at the same time preserving the digitized data and / or protecting the electronic device from general corrosion.

[0005] Embodiments of the present invention relate to an apparatus and method for vacuum drying objects by lowering the vapor pressure and boiling point of a liquid. More particularly, certain embodiments of the present invention relate to a vacuum chamber with a heated platen that may be automatically controlled to conductively heat an electronic device, such as an inoperable portable electronic device, thereby lowering the overall vapor pressure temperature in order to dry the device and make it operational again.

[0006] In some embodiments, an electrically heated platen provides thermal conduction to a portable electronic device exposed to water or other unintentional wetting agent. This heated platen may form the base of a vacuum chamber from which air is selectively evacuated. The heated conductive platen may raise the overall temperature of the wetted device by physical contact and the heat transfer coefficient of the material. The heated conductive platen is housed in a convection box and may radiate heat and also heat other parts of the vacuum chamber (e.g., outside the vacuum chamber) for simultaneous convection heating. The pressure within the vacuum chamber housing containing the wetted electronic device may be simultaneously reduced. The reduced pressure provides an environment in which the liquid vapor pressure is reduced, allowing the boiling point of any liquid or wetting agent within the chamber to be reduced. By combining a reduced pressure with a heated path (e.g., a heated conductive path) to the wetted electronic device, in the vapor pressure phase, the wetting agent and liquid are "boiled off" in gas form at a lower temperature, drying while preventing damage to the electronics. This drying occurs because the evaporation of the liquid into a gas can flow more easily through the airtight enclosure of the electronic device and through the tortuous path defined in the design and manufacture of the device. The water or wetting agent essentially boils off over time into a gas that is then vented from within the chamber housing.

[0007] Another embodiment includes an automatically controlled vacuum chamber with a heated platen. The vacuum chamber is controlled by a microprocessor with different heat and vacuum pressure profiles for different electronic devices. This exemplary heating and vacuum system creates localized conditions on the wet electronic device that lower the overall vapor pressure point, allowing the wetting agent to boil off at a much lower temperature. This allows for complete drying of the electronic device without damage due to excessive (high) temperatures to the device itself.

[0008] Several features of the present invention address these and other needs and provide other significant advantages.

[0009] This summary is provided to introduce a selection of concepts that are more fully described in the detailed description and drawings contained herein. This summary is not intended to identify any key or essential features of the claimed subject matter. Some or all of the described features may be present in corresponding independent or dependent claims, but should not be construed as limiting unless expressly recited in a particular claim. Each embodiment described herein is not necessarily intended to address every object described herein, and each embodiment does not necessarily include every feature described. Other forms, embodiments, objects, advantages, benefits, features, and aspects of the invention will become apparent to those skilled in the art from the detailed description and drawings contained herein. Moreover, the various apparatus and methods described in this summary section as well as elsewhere herein may be expressed in a number of different combinations and subcombinations. Since all such useful, novel, and inventive combinations and subcombinations are contemplated herein, it is recognized that it is unnecessary to expressly express each and every one of these combinations. [Brief description of the drawings]

[0010] Some of the following figures may include dimensions or may be made from scale drawings. However, such dimensions or relative scales in the figures are merely for illustration purposes and should not be construed as limiting the scope of the invention.

[0011] [Figure 1] FIG. 1 is an isometric view of an apparatus for drying electronic devices according to one embodiment of the present invention.

[0012] [Diagram 2] FIG. 2 is an isometric bottom view of the electrically heated conductive platen element of the electronic device drying apparatus depicted in FIG.

[0013] [Diagram 3] FIG. 3 is an isometric perspective view of the electrically heated conductive platen element and vacuum chamber depicted in FIG.

[0014] [Figure 4A] FIG. 4A is an isometric view of the electrically heated conductive platen element and vacuum chamber of FIG. 1 in an open position.

[0015] [Figure 4B] FIG. 4B is an isometric view of the electrically heated conductive platen element and vacuum chamber of FIG. 1 in a closed position.

[0016] [Diagram 5] FIG. 5 is a block diagram illustrating an electronic control system and an electronic device drying apparatus according to one embodiment of the present invention.

[0017] [Figure 6A] FIG. 6A is a graphical representation of water vapor pressure curves at various vacuum pressures and temperatures, as well as target heating and exhaust drying zones in one embodiment of the present invention.

[0018] [Figure 6B] FIG. 6B is a graphical representation of the vapor pressure curve of water at a particular vacuum pressure, illustrating the heat loss as a result of the latent heat of vaporization.

[0019] [Figure 6C] FIG. 6C is a graphical representation of the vapor pressure curve of water at a particular vacuum pressure, illustrating the heat gain as a result of conductive platen heating.

[0020] [Figure 7] FIG. 7 is a graphical illustration of heated platen temperature and associated electronic device temperature without a vacuum applied in one embodiment of the present invention.

[0021] [Figure 8A] FIG. 8A is a graph illustrating heated platen temperature and associated electronic device temperature response when periodically evacuated and vented to atmospheric pressure for a period of time in accordance with another embodiment of the present invention.

[0022] [Figure 8B] FIG. 8B is a graph illustrating another embodiment of the invention that has been periodically evacuated and vented to atmospheric pressure for a period of time.

[0023] [Figure 8C] FIG. 8C is a graph overlaying an electronic device temperature response to being periodically evacuated and vented to atmospheric pressure for a period of time in accordance with another embodiment of the present invention.

[0024] [Figure 9] FIG. 9 is a graph illustrating relative humidity sensor output occurring during sequential heat and vacuum cycles of an electronic device drying apparatus in one embodiment of the present invention.

[0025] [Figure 10] FIG. 10 is an isometric view of an electronic device drying and sterilizing unit in accordance with another embodiment of the present invention.

[0026] [Figure 11] FIG. 11 is a block diagram illustrating an electronic control system, an electronic device drying apparatus and a sterilizer according to a further embodiment of the present invention.

[0027] [Figure 12] FIG. 12 is a block diagram of a regenerative desiccator according to another embodiment, showing the three-way solenoid valve in an open position to evacuate the exhaust chamber, for example, during moisture removal.

[0028] [Figure 13] FIG. 13 is a block diagram of the regenerative desiccator of FIG. 12, with the three-way solenoid valve shown in a closed position, for example, to air purge the desiccator. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] For the purpose of promoting an understanding of the principles of the invention, reference will now be made to selected embodiments illustrated in the drawings. Certain terms will be used to describe the same. It will be understood, however, that no limitation of the scope of the invention is intended thereby. Any modifications and further variations of the embodiments described or illustrated, and any further applications of the principles of the invention as set forth herein, are contemplated as would normally occur to one skilled in the art to which the invention pertains. Although at least one embodiment of the invention has been shown in considerable detail, it will be apparent to one skilled in the art that for purposes of clarity, some features, or some combinations of features, may not be shown.

[0030] Any reference to an "invention" herein is a reference to a family of embodiments of the invention, and no single embodiment includes features that are necessarily included in all embodiments, unless otherwise specified. Furthermore, while there may be reference to "advantages" achieved by some embodiments of the invention, other embodiments may not include the same advantages, or may include different advantages. Any advantages described herein should not be construed as limiting the scope of any claim.

[0031] Specific quantities (such as spatial dimensions, temperature, pressure, time, force, resistance, current, voltage, concentration, wavelength, frequency, heat transfer coefficients, dimensionless parameters, etc.) may be used explicitly or implicitly herein, and such specific quantities are given by way of example only and are approximations, unless otherwise indicated. Discussions relating to specific compositions of matter, if any, are given by way of example only, unless otherwise indicated, and do not limit the applicability of other compositions of matter, particularly other compositions of matter having similar properties.

[0032] Embodiments of the present invention include devices and apparatuses that are typically used to dry items under reduced pressure. Embodiments include methods and apparatuses for drying (e.g., auto-drying) electronic devices (e.g., portable electronic devices (cell phones, digital music players, watches, pagers, cameras, tablet computers, etc.)) after exposure to water, high humidity conditions, or other unintentional harmful wetting agents that would render these devices inoperable. At least one embodiment provides a platen (e.g., a user-controlled heated platen) that is heated under vacuum to heat the portable electronic device and / or reduces pressure to evaporate undesired liquids below their atmospheric boiling point. Heat may also be applied by other means, such as other heating components of the vacuum chamber or a gas (e.g., air) within the vacuum chamber. Heat and vacuum may be applied sequentially, simultaneously, or in various combinations of sequential and simultaneous operations.

[0033] The vaporization point of the liquid present within the device is lowered such that, based on the material of construction of the device being heated, the temperature excursion does not exceed the melting point and / or glass transition temperature of that material. Thus, a device exposed to a drying cycle under vacuum pressure can be safely dried and operational again with no damage to the device itself.

[0034] Referring first to FIG. 1, an isometric view of a drying apparatus, e.g., an automatic drying apparatus 1 for portable electronic devices, according to one embodiment of the present invention is shown. The electronic device drying apparatus 1 includes a housing 2, a vacuum chamber 3, a heater (e.g., an electrically heated conductive platen 16), an optional convection chamber 4, and an optional modem Internet interface connector 12. An optional user interface may be used for the electronic device drying apparatus 1, which may optionally consist of one or more of an input device selection switch 11, a device selection indicator light 15, a timer display 14, a power switch 19, a start-stop switch 13, and an audio indicator 20. The vacuum chamber 3 may be made, for example, from a polymer plastic, glass, or metal, and has a thickness and geometry suitable to withstand a vacuum (reduced pressure). The vacuum chamber 3 may be made from any material, e.g., sufficiently nonporous, that is at least structurally rigid enough to withstand and maintain the vacuum pressure within the structure.

[0035] The electrically heated conductive platen 16 may be powered through heater power wires 10 and may be fabricated from a thermally conductive material and may be of a thickness suitable for supporting a high vacuum. In some embodiments, the electrically heated conductive platen 16 is made from aluminum, while other embodiments include platens made from copper, steel, iron, or other thermally conductive materials, including but not limited to other metallic, plastic, or ceramic materials. The electrically heated conductive platen 16 may be mounted inside the convection chamber 4 and may be coupled to the vacuum chamber 3, for example, optionally using a sealing O-ring 5. Air within the vacuum chamber 3 is exhausted through exhaust port 7 and vented through vent port 6. The convection chamber 4 may include a fan 9, if used, to circulate warm air within the convection chamber 4.

[0036] 2 shows a conductive heating platen 16 with a heat generator (e.g., a thermofoil resistive heater 21). The conductive heating platen 16 may also include a temperature feedback sensor 8, a thermofoil resistive heater power connector 10, an exhaust port 7, and / or a vent port 6. In one embodiment of the invention, the conductive heating platen 16 is a stand-alone separate heated platen on the vacuum chamber mounting plate.

[0037] 3 shows the conductive heating platen 16 and vacuum chamber 3 in an isometric view with an internal view. The vacuum chamber 3 is coupled to the conductive heating platen 16 using a sealing O-ring 5. The platen 16 provides thermal energy to and from the vacuum chamber 3 using a thermofoil resistance heater 21 attached to the bottom of the platen 16 and is temperature controlled by a temperature feedback sensor 8. The temperature feedback sensor 8 may be a thermistor, a semiconductor temperature sensor, or one of many types of thermocouples. The exhaust port 7 and vent port 6 are shown as through holes that utilize the bottom surface of the conductive heating platen 16 to facilitate a pneumatic connection to the interior of the vacuum chamber 3.

[0038] 4A and 4B show the vacuum chamber 3 in an open state 17 and a closed state 18. When transitioning from the open state 17 to the closed state 18, the sealing O-ring 5 mates with the vacuum chamber sealing surface 31. While in the closed state 18, the exhaust port 7 and the atmospheric vent port 6 are sealed within the interior of the vacuum chamber 3 because they are located within the diameter of the sealing O-ring 5.

[0039] Referring to FIG. 5, an isometric view of the electronic device drying apparatus housing 1 is shown illustrating the control in block diagram form according to one embodiment of the present invention. A controller, e.g., a microprocessor 44, is electrically connected to a user interface 47, a memory 45, a modem internet interface circuit 46, and an exhaust pump relay 42 via a user interface bus 48, a memory interface bus 49, a modem internet interface bus 51, and an exhaust pump relay control line 66, respectively. A power supply 53 provides power to the entire system, e.g., through a positive power line 58 and a negative ground line 55. A thermofoil resistor heater power line 10 is connected directly to the positive power line 58 and the negative power line 55 via a heater platen control transistor 54. An exhaust manifold 6 is connected to an exhaust pump 41, which is electrically controlled via an exhaust pump control line 68. A vacuum pressure sensor 43 is connected to the exhaust manifold 62 and generates a vacuum pressure level signal via a vacuum pressure sensor signal wire 52. A relative humidity sensor 61 may be pneumatically connected to the exhaust manifold 62 to generate an analog voltage signal related to the relative humidity in the exhaust manifold 62. The analog voltage signal is sensed on relative humidity signal wire 61 and sent to the control microprocessor 44. A convection chamber vent solenoid 57 is connected to the convection chamber vent manifold 64 and is controlled by the control microprocessor 44 via a convection chamber solenoid vent valve control signal 56. An atmospheric vent solenoid valve 67 is connected to the atmospheric vent manifold 75 and is controlled by the control microprocessor 44 via an atmospheric solenoid vent valve control signal wire 69.

[0040] 6A-6C, a graphical illustration of water vapor pressure curve 74 is derived from known vapor pressure conversions for water temperature 72 and air vacuum pressure 70 surrounding the water. In the example shown in FIG. 6B, water maintained at temperature 81 (about 104°F) will begin to boil at vacuum pressure 83 (about -27Hg). Using the vapor pressure curve 74, a target or preferred heating and exhaust drying zone 76 for automatic drying of portable electronic devices was determined. The upper temperature limit of the exhaust drying zone 76 may be determined by the temperature at which materials used to construct the electronic device to be dried will begin to deform or melt. The lower temperature limit of the exhaust drying zone 76 may be determined by the ability of the exhaust pump 41 to generate low pressure or the time required for the exhaust pump 41 to achieve low pressure.

[0041] 7, a graphical illustration of a conductive platen heating curve 80 in accordance with one embodiment of the present invention is shown being heated to a temperature value on a temperature axis 85 over a period of time shown on a time axis 87. A portable electronic device placed on the conductive platen 16 is influenced by the conductive platen heating curve 80 and heats up generally according to a device heating curve 82, which is shown delayed in time due to variations in thermal conductivity coefficients.

[0042] 8, a graphical illustration of a thermal transfer platen heating curve 80 according to another embodiment of the present invention is shown by a temperature axis 85 and a vacuum pressure axis 92 over time on a time axis 87. A device heating curve 96 results as a result of varying the vacuum pressure curve 98 and the dissipation of latent heat due to vapor evaporation from a wet portable electronic device.

[0043] When the moisture in the device evaporates, the device will typically cool due to the latent heat of vaporization. Heating the process helps minimize cooling of the device and increases the rate at which moisture is removed from the device.

[0044] 9, a graphical illustration of a relative humidity sensor 61 according to an embodiment of the present invention is shown plotting a relative humidity axis 102 against a cycle time axis 87. As moisture evaporates in the portable electronic device, the resulting relative humidity curve 100 becomes smaller and smaller and follows a decreasing line 106. The relative humidity peak 104 gradually drops off, eventually decreasing to the room humidity 108.

[0045] In one embodiment, the electronic device drying apparatus 1 operates as follows: A wet or moisture-exposed portable electronic device is placed into the convection chamber 4 by opening the door 22 and placing the device underneath the vacuum chamber 3, which is elevated from the heat-conducting platen 16. Lifting of the vacuum chamber 3 may be done manually or by a lifting mechanism. The door 22 may be hinged to the top of the convection chamber 4. (Either approach does not detract from or enhance the spirit or purpose of the present invention.)

[0046] To begin a drying cycle operation, a user powers on drying apparatus 1 by pressing or moving on-off switch 19. Once apparatus 1 is powered, the user selects the electronic device to be dried using the input device selection switches (see FIGS. 1 and 5). Control microprocessor 44 detects the user's switch selection via user interface bus 48 by polling input device selection switches 11, and subsequently acknowledges the user's selection by illuminating the appropriate input device selection indicator light 15 (FIG. 1) for the appropriate selection. Microprocessor 44 stores software in non-volatile memory 45 and communicates with the software code through memory interface bus 49.

[0047] In one embodiment of the present invention, the memory 45 contains algorithms for various portable electronic devices that can be dried by the present invention (each algorithm including a specific temperature setting for the heated conductive platen 16), and the correct algorithm is automatically selected for the type of electronic device placed in the apparatus 1.

[0048] In one embodiment, the microprocessor 44 activates or powers the heating conductive platen 16 via a control transistor 54. The control transistor 54 switches the positive supply line 58 and the negative supply line 55 of the power supply 53 to the heater power wires 10, respectively. This power switching causes the thermofoil resistive heater 21 to heat up by resistive heating. The thermofoil resistive heater 21 is in thermal contact with the heating conductive platen 16 (and may be overlaid on the heating conductive platen 16), begins to heat up to a target temperature, and then flows heat to and within the device by thermal conduction, for example through physical contact with the target device. In one embodiment, the target temperature of the heating platen is at least 70° F. and at most 150° F. In further embodiments, the target temperature of the heating platen is at least about 110° F. and at most about 120° F.

[0049] In alternative embodiments, heating of the conductive platen 16 is accomplished in other ways, such as with hot water heating, infrared lamps, incandescent lamps, gas or combustible fuels, Fresnel lenses, steam, human body heat, hair dryers, fissile material, or frictional heat, any of which will provide the heat necessary for the conductive platen 16 to transfer heat to the portable electronic device.

[0050] In operation, the microprocessor 44 polls the heated platen temperature sensor 8 (via the heated platen temperature sensor signal line 26) and provides power to the platen 16 until it achieves the target temperature. Once the target temperature is achieved, the microprocessor 44 starts a timer based on variables in memory 45 via memory interface bus 49. The timer allows sufficient time for the conductive platen 16 to transfer heat into the portable electronic device. In some embodiments, the platen 16 has a conductive platen heating profile 80 that requires a finite amount of time to achieve the target temperature. The heating profile 80 (FIG. 7) is merely one such algorithm, and the target temperature may be at any point on a temperature axis 85. The conductive platen 16 transfers heat to the target device, resulting in a device temperature profile 82. In general, the portable electronic device temperature profile 82 follows the conductive platen heating profile 80 and may generally fall anywhere on the temperature axis 85. Without further action, the conductive platen heating profile 80 and the portable electronic device heating profile 82 will reach a quiescent point and maintain this temperature for a finite period of time along the time axis 87. If power is interrupted to the device 1, the conductive platen heating profile 80 and the portable electronic device heating profile 85 will cool as per profile 84.

[0051] During thermal cycling, the vacuum chamber 3 can be in an open position 17 or a closed position 18 as shown in Figures 4A and 4B. Either position has little effect on the conductive heat transfer from the heated conductive platen 16 to the portable electronic device.

[0052] A convection chamber fan 9 may be powered (via fan control signal line 24, which is electrically connected to microprocessor 44) to circulate air within convection chamber 4 and outside vacuum chamber 3. The air within convection chamber 4 is heated, at least in part, by radiant heat from heat conductive platen 16. The convection chamber fan 9 provides a means of circulating air within convection chamber 4 to help maintain a relatively uniform heated air temperature within convection chamber 4 and around vacuum chamber 3. Microprocessor 44 may close atmospheric vent solenoid valve 67 by sending an electrical signal via atmospheric vent solenoid valve control signal line 69.

[0053] In one embodiment of the invention, there are separate heating elements that control the heat within the convection chamber 4. These heating elements may be conventional electrical resistance heaters. In some embodiments, the platen 16 may be used to heat the convection chamber 4 without the need for a separate convection chamber heater.

[0054] During operation, the microprocessor 44 may signal the user, such as via the audio indicator 20 (FIGS. 1 and 5), that the heat transfer platen 4 has achieved the target temperature, and may issue an audible signal at the audio indicator 20 for the user to move the vacuum chamber 3 from the open position 17 to the closed position 18 (see FIGS. 4A and 4B) to begin the drying cycle. The start-stop switch 13 may then be pressed or actuated by the user, which the microprocessor 44 then detects through polling the user interface bus 48. The microprocessor 44 then sends a signal to the convection vent solenoid valve 57 (via the convection chamber vent solenoid control signal wire 56) which then closes the atmospheric vent 6 through the pneumatically connected atmospheric vent manifold 64. Closing the convection chamber vent solenoid valve 57 ensures that the vacuum chamber 3 is sealed as evacuation of its interior air begins.

[0055] After the electronic device is heated to the target temperature (or, in an alternative embodiment, the heating platen reaches the target temperature), and after an optional time delay, the pressure in the vacuum chamber is reduced. In at least one embodiment, the microprocessor 44 sends a control signal to the motor relay 42 (via the motor relay control signal line 66) to activate the exhaust pump 41. The motor relay 42 powers the exhaust pump 41 via the exhaust pump power line 68. Upon activation, the exhaust pump 41 begins to exhaust air from within the vacuum chamber 3 through the exhaust port 7. The exhaust port 7 is pneumatically connected to the exhaust manifold 62. The microprocessor 44 can display the elapsed time on the display timer 14 (FIG. 1). As the evacuation of air proceeds within the vacuum chamber 3, the vacuum chamber sealing surface 31 presses the vacuum chamber sealing O-ring 5 against the surface of the heat conducting platen 16, thus achieving a vacuum-tight seal. The exhaust manifold 62 is pneumatically connected to the vacuum pressure sensor 43. Vacuum pressure sensor 43 directs a vacuum pressure analog signal over vacuum pressure signal line 52 to microprocessor 44 for monitoring and control based on algorithms appropriate for the particular electronic device being processed.

[0056] As the air is being evacuated, the microprocessor 44 polls the temperature of the heat transfer platen 16, the vacuum chamber exhaust pressure sensor 43, and the relative humidity sensor 61 via the temperature signal line 26, the vacuum pressure signal line 52, and the relative humidity signal line 65, respectively. During this evacuation process, the vapor pressure point of water present on the surfaces of components within, for example, the portable electronic device, follows a known vapor pressure curve 74, as shown in Figures 6A-6C. In some embodiments, the target temperature and vacuum pressure variables of the microprocessor 44 algorithm fall within, for example, a preferred vacuum drying target zone 76. The vacuum drying target zone 76 evaporates water at a lower temperature based on the pressure reduced within the chamber 4. The microprocessor 44 can monitor the pressure (via the vacuum pressure sensor 43) and the relative humidity (via the relative humidity sensor 61) and control the drying process accordingly.

[0057] As the pressure in the chamber is reduced, the temperature of the electronic device will typically decrease, even though the heating platen (or any type of component being used to apply heat) is maintained at a constant temperature. This is due, at least in part, to the escape of the latent heat of vaporization and the removal of vapor through exhaust manifold 62. The drop in pressure also increases the relative humidity, which will be detected by relative humidity sensor 61, which is pneumatically connected to exhaust manifold 62.

[0058] After the pressure in the chamber is reduced, it is increased again. This may occur after a predetermined time or after a particular condition is detected (such as the relative humidity reaching or approaching a steady state). The increase in pressure may be accomplished by the microprocessor 44 sending a signal to the convection chamber vent solenoid valve 57 and the atmosphere vent solenoid valve 67 (via the convection chamber vent solenoid valve control signal 56 and the atmosphere solenoid valve control signal 69) to open. This allows air, which may be ambient air, to enter the atmosphere control solenoid valve 67 and thereby vent convection chamber 4. Simultaneously with the opening of the convection chamber vent solenoid valve 57 and / or the atmosphere vent solenoid valve 67, the convection vent solenoid valve 57 may open, and when the convection vent solenoid valve 57 opens, the heated air in the convection chamber 4 is drawn into the vacuum chamber 3 by the vacuum pump 41. The exhaust pump 41 remains on and draws atmospheric air (eg, room air) into the vacuum chamber 3 through the atmospheric vent manifold 64 and the exhaust manifold 62 .

[0059] After the relative humidity has been lowered (as sensed through relative humidity sensor 61 and the relative humidity sensor feedback signal sent to microprocessor 44 via relative humidity sensor feedback line 65), convection chamber vent solenoid valve 57 and atmosphere solenoid valve 67 may be closed, such as through convection chamber vent solenoid valve control signal 56 and atmosphere solenoid valve control signal 69, and the pressure in the vacuum chamber is again lowered.

[0060] This sequence results in an exhaust chamber profile curve 98 (FIGS. 8B and 8C) that may be repeated based on a selected algorithm and controlled under software control of the microprocessor 44. Repeated vacuum cycles (which may be performed under constant heating) force the wetting agent to evaporate and change from a liquid state to a gaseous state. This gaseous state of water allows the resulting water vapor to escape the tortuous paths of the electronic device that liquid water would not otherwise be able to escape through.

[0061] In at least one embodiment, the microprocessor 44 detects the relative humidity peak 104 (represented in FIG. 9), for example, by using a software algorithm that determines the peak by detecting a decrease or lack of rate of change of the relative humidity. Once the relative humidity peak 104 is detected, the pressure in the vacuum chamber is increased (such as by venting the vacuum chamber) and the relative humidity is decreased. Once the relative humidity reaches a minimum relative humidity 108 (which may be detected by a software algorithm similar to the algorithm described above), another cycle may be initiated by lowering the pressure in the vacuum chamber.

[0062] 8A and 8C, the arrow 96A plotting the direction of the response curve is typically due to heat gain when the system is in a purge air recovery mode where the electronic device gains heat. The arrow 96B plotting the direction of the response curve is typically due to the latent heat of vaporization when the system is in a vacuum drying mode. As successive cycles are performed, the temperature 96 of the electronic device tends to gradually increase, and the temperature change between successive cycles tends to decrease.

[0063] In some embodiments, the microprocessor 44 continues this repeated or cyclical heating and evacuation of the vacuum chamber 3 to result in a relative humidity response curve 100 (FIG. 9). This relative humidity response curve 100 may be monitored by a software algorithm, and the relative humidity cycle maxima 104 and cycle minima 108 are stored in registers of the microprocessor 44. In an alternative embodiment, the relative humidity maxima 104 and minima 108 typically follow relative humidity drying profiles 106A and 106B and asymptotically decrease over time to minima 109 and 110. Through one or more successive heating cycles 96 and evacuation cycles 98 shown in FIG. 8, the portable electronic device placed in the vacuum chamber 3 is dried. The control algorithm of the microprocessor 44 may identify when the difference between the relative humidity maxima 104 and the relative humidity minima 108 is within a certain tolerance range, which is a reason to not operate or to shut off the vacuum pump 41.

[0064] The system may automatically stop running the continuous drying cycle when one or more criteria are reached. For example, the system may stop running the continuous drying cycle when a parameter that changes as the device dries approaches or reaches a steady or ending value. In one exemplary embodiment, the system automatically stops running the continuous drying cycle when the relative humidity falls below a certain level or approaches (or reaches) a steady state value. In another exemplary embodiment, the system automatically stops running the continuous drying cycle when the difference between the cycle's maximum and minimum relative humidity falls below a certain level. In yet another exemplary embodiment, the system automatically stops running the continuous drying cycle when the temperature 96 of the electronic device approaches or reaches a steady state value.

[0065] 1 and 5, the microprocessor 44 may be remotely connected to the Internet, for example, via the RJ11 modem Internet connector 12 integrated with the modem interface 46. Thus, the microprocessor 44 may send Internet or telephone signals via the modem Internet interface 46 and the RJ11 Internet connector 12 to inform the user that a processing cycle has been completed and the electronic device is sufficiently dry.

[0066] Thus, conductive heating and vacuum drying are accomplished simultaneously and tailored to the specific electronic device based on the materials of the portable electronic structure to dry the various types of electronic devices on the market today without damage.

[0067] In an alternative embodiment, an optional desiccator 63 (FIG. 5) may be connected to the exhaust manifold 62 upstream of the exhaust pump 41. One example of a location for the desiccator 63 is downstream of the relative humidity sensor 61 and upstream of the exhaust pump 41. The desiccator 63, when included, can absorb moisture in the air arriving from the vacuum chamber 3 before the moisture reaches the exhaust pump 41. In some embodiments, the desiccator 63 may be a replaceable cartridge or a regenerative desiccator.

[0068] In embodiments where the exhaust pump is of the oil-based type, the oil in the exhaust pump will tend to draw (or absorb) water from the air, which can lead to water being drawn into the exhaust pump, premature breakdown of the oil in the exhaust pump, and / or premature failure of the exhaust pump itself. In embodiments where the exhaust pump is of the oil-free type, high humidity conditions can also lead to premature failure of the pump. Thus, the benefits of removing water (and possibly other air constituents) from the air by desiccator 63 before the air reaches exhaust pump 41 will be appreciated.

[0069] While many of the embodiments described above describe drying apparatus and methods that are automatically controlled, other embodiments include drying apparatus and methods that are manually controlled, for example, in some embodiments, a user controls the application of heat to the wet device, the application of vacuum to the wet device, and the release of vacuum to the wet device.

[0070] FIG. 10 shows a drying apparatus according to another embodiment of the present invention, for example, a portable electronic device automatic drying apparatus 200. Many features and components of the drying apparatus 200 are similar to those of the drying apparatus 1, and the same reference numbers are used to indicate similar features and components between the two embodiments. The drying apparatus 200 includes a sterilizing unit, for example, an ultraviolet (UV) sterilizing light 202, which can kill germs. The light 202 may be mounted inside the convection chamber 4 and controlled by a UV sterilizing light control signal 204. In one embodiment, the UV sterilizing light 202 is mounted inside the convection chamber 4 and outside the vacuum chamber 3, and UV radiation is emitted by the sterilizing light 202 and passes through the vacuum chamber 3. The vacuum chamber 3 may be made of a UV light transmitting material (one example is acrylic plastic). In an alternative embodiment, the UV sterilizing light 202 is mounted inside the vacuum chamber 3, which may be advantageous in an embodiment in which the vacuum chamber 3 is made of a non-UV light transmitting material.

[0071] In one embodiment, the operation of drying apparatus 200 is similar to that of drying apparatus 1 described above, with the following modifications and refinements: Microprocessor 44 sends a control signal over UV germicidal lamp control line 204 to power UV germicidal lamp 202. This may occur at or about the time of activation of heat transfer platen 16 by microprocessor 44. In one embodiment, UV germicidal lamp 202 then emits UV waves at a wavelength of approximately 254 nm, which can penetrate vacuum chamber 3, particularly in embodiments where vacuum chamber 3 is made from clear plastic.

[0072] In yet further embodiments, one or more of the desiccators 218 can be isolated from the exhaust manifold 62. This can be advantageous when performing routine maintenance of the drying apparatus or when performing automated maintenance cycles. By way of example, the embodiment shown in FIGS. 11-13 includes valves (e.g., three-way air purge solenoid valves 210 and 212) that can selectively connect and isolate the desiccator 218 to the exhaust manifold 62. The solenoid valve 210 is disposed between the relative humidity sensor 61 and the desiccator 218, and the solenoid valve 212 is disposed between the desiccator 218 and the vacuum sensor 43. In the illustrated embodiment, the three-way air purge valves 210 and 212 have a common distribution port that is pneumatically connected to the desiccator 218. This common port connection simultaneously isolates the desiccator 218 from the exhaust manifold 62 and decouples the exhaust manifold 62 from the vacuum pump 41. This decoupling prevents moisture from reaching the vacuum pump 41 from the vacuum chamber 3 while the desiccator 63 is being regenerated. The operation of this embodiment is similar to the embodiment described with respect to Figure 5, with the following modifications and refinements.

[0073] An optional desiccator heater 220 and an optional desiccator air purge pump 224 may be included. While the desiccator 218 is isolated from the exhaust manifold 62 and vacuum pump 41, the desiccator 218 may be heated by the desiccator heater 220 without affecting the vacuum manifold 62 and associated air vacuum circuit. As the desiccant inside the desiccator 218 is heated, for example, to a target temperature to bake off absorbed moisture, the purge pump 224 may be adjusted (e.g., according to a maintenance control algorithm with a defined time and / or temperature profile dictated by the microprocessor 44) to aid in the removal of moisture from the desiccant 218. In one embodiment, the target temperature of the desiccator heater is at least 200° F. and at most 300° F. In a further embodiment, the target temperature of the desiccator heater is about 250° F.

[0074] When the purge pump 224 is adjusted, atmospheric air is forced along air path 235 across the desiccant contained inside the desiccator 218, and the moist air is blown out through atmospheric port 238. An optional desiccator cooling fan 222 may be included (and optionally adjusted by microprocessor 44) to reduce the desiccant temperature inside the desiccator 218 to a temperature suitable for the desiccant to absorb rather than outgas moisture.

[0075] When a drying cycle is initiated according to one embodiment, atmospheric vent 6 is closed and microprocessor 44 sends a control signal to three-way air purge solenoid valves 210 and 212 via three-way air purge solenoid control line 214. This action closes three-way air purge solenoid valves 210 and 212 and pneumatically connects vacuum pump 41 to exhaust manifold 62. This pneumatic connection causes exhaust air to flow along air flow path 215, through exhaust manifold 62, desiccator 218, and to vacuum pump 41. One advantage that may be realized by removing moisture from the exhaust air before it reaches vacuum pump 41 is a dramatic reduction in the failure rate of vacuum pump 41.

[0076] After the algorithm of the microprocessor 44 detects that the portable electronic device has dried, the microprocessor 44 may signal the system to enter a maintenance mode. The UV germicidal light 202 may be powered off from the microprocessor 44 via the UV germicidal light control line 204. The microprocessor 44 powers the desiccator heater 220 via the desiccator heater power relay control signal 166 and the desiccator heater power relay 228. The control signal 226 is the control signal for the relay 228. The temperature of the desiccator 218 may be sampled by the microprocessor 44 via the desiccator temperature probe 230, and the heating of the desiccator 218 may be controlled to a particular temperature that begins to bake out the moisture of the desiccant contained in the desiccator 218. The three-way air purge solenoid valves 210 and 212 may be electrically switched via the three-way air purge solenoid control line 202 once it is determined that sufficient drying has occurred, which may occur for a finite amount of time specified by the maintenance algorithm of the microprocessor 44. The air purge pump 224 may then be turned on by the microprocessor 44 via the air purge pump control signal 232 to direct the moist air through the desiccator 218 to the atmospheric vent port 238. The microprocessor 44 may use a timer in the maintenance algorithm to heat and purge the moist air for a finite amount of time. Once the optional maintenance cycle is complete, the microprocessor 44 may turn on the desiccator cooling fan 222 to cool the desiccator 218. The microprocessor 44 may then turn off the air purge pump 224, preparing the system for drying and optionally sterilizing another electronic device.

[0077] 12, a desiccator 218 is shown along with a desiccator heater 220, a desiccator temperature sensor 230, a desiccator cooling fan 222, and desiccator air purge solenoid valves 210 and 212. A vacuum pump 41 is connected to the exhaust manifold 62, and an air purge pump 224 is pneumatically connected to the air purge solenoid valve 212 through an air purge manifold 240. The three-way air purge solenoid valves 210 and 212 are shown enabling a vacuum through the desiccator 218 as shown by the air flow path.

[0078] 13, the desiccator 3-way air purge solenoid valves 210 and 212 are shown in a maintenance state, with air flow from the air purge pump 224 flowing "backwards" through the desiccator in direction 235 and out through the purge air port 238. The air purge pump 224 can blow pressurized air along air flow path 235. This preferred flow path of atmospheric air allows the desiccant to deliver moisture as it is removed to the air, preventing moisture from entering the air purge pump 224, as would occur if the air purge pump were to pull air through the desiccator 218. The purge pump 224 can continue to blow air into the air flow path 235 for a period of time as defined by the maintenance control algorithm of the microprocessor 44. In one embodiment, an in-line relative humidity sensor, similar to the relative humidity sensor 61, is incorporated to detect when the desiccator 218 is sufficiently dry.

[0079] As previously described for at least one embodiment, when the desiccator 218 is isolated from the exhaust manifold 62, the exhaust manifold 62 is isolated from the vacuum pump 41. Nevertheless, alternative embodiments include exhaust manifold 62 remaining in pneumatic connection with the vacuum pump 41 even when the desiccator 218 is isolated from the exhaust manifold 62. Such a configuration is useful in situations where the desiccator 218 is blocking air flow, such as when the desiccator 218 malfunctions, but operation of the drying apparatus 200 is still desired.

[0080] In some embodiments, all of the above operations are performed automatically, such that the user simply places the electronic device in an appropriate position and activates the drying device so that it removes moisture from the electronic device.

[0081] The microprocessor 44 may be a microcontroller, a general purpose microprocessor, or generally any type of controller capable of performing the required control functions. The microprocessor 44 may read its program from memory 45 and may consist of one or more components configured as a single unit. Alternatively, if in multi-component form, the processor 44 may have one or more components located remotely with respect to the others. The one or more components of the processor 44 may consist of various combinations of electronic circuits including digital circuits, analog circuits, or both. In one embodiment, the processor 44 is a conventional integrated circuit microprocessor device, such as one or more of the CORE i7 HEXA processors from INTEL Corporation, 450 Mission College Boulevard, Santa Clara, California 95052, USA, the ATHLON or PHENOM processors from Advanced Micro Devices, One AMD Place, Sunnyvale, California 94088, USA, the POWER8 processors from IBM Corporation, 1 New Orchard Road, Armonk, New York 10504, USA, or the PIC Microcontrollers from Microchip Technologies, 2355 West Chandler Boulevard, Chandler, Arizona 85224, USA. In alternative embodiments, one or more application specific integrated circuits (ASICs), reduced instruction set computing (RISC) processors, general purpose microprocessors, programmable logic arrays, or other devices may be used, alone or in combination as would occur to one skilled in the art.

[0082] Additionally, memory 45 in various embodiments may include one or more types of solid state electronic, magnetic, or optical memory, to name just a few. By way of non-limiting examples, memory 45 may include solid state electronic random access memory (RAM), sequentially accessible memory (SAM) (such as the First-In, First-Out (FIFO) variety or the Last-In First-Out (LIFO) variety), programmable read-only memory (PROM), electrically programmable read-only memory (EPROM), or electrically erasable programmable read-only memory (EEPROM), optical disk memory (such as recordable, rewritable, or read-only DVD or CD-ROM), magnetically encoded hard drive, floppy disk, tape, or cartridge media, or multiples and / or combinations of these memory types. Memory 45 may also be volatile, non-volatile, or a hybrid combination of volatile and non-volatile. Memory 45 in various embodiments is encoded with program instructions executable by processor 44 to perform the automated methods disclosed herein.

[0083] Various aspects of various embodiments of the present invention are described in paragraphs X1, X2, X3, X4, X5, X6 and X7 as follows:

[0084] X1. One embodiment of the present invention includes an electronic device drying apparatus for drying water damaged or other wetting agent damaged electronic devices, the apparatus including a heated conductive platen means, a vacuum chamber means, an exhaust pump means, a convection oven means, a solenoid valve control means, a microprocessor control system for automatically controlling heating and exhaust, a vacuum sensing device, a humidity sensing device, and a switch array for algorithm selection.

[0085] X2. Another embodiment of the present invention includes a method including the steps of placing a portable electronic device that has become at least partially inoperable due to moisture ingress into a low pressure chamber, heating the electronic device, reducing the pressure in the low pressure chamber, removing moisture from inside the portable electronic device to outside the portable electronic device, increasing the pressure in the low pressure chamber after the step of reducing the pressure, equalizing the pressure in the low pressure chamber to the pressure outside the low pressure chamber, and removing the portable electronic device from the low pressure chamber.

[0086] X3. Another embodiment of the present invention includes an apparatus including a low pressure chamber defining an interior, the interior sized and configured to allow placement of an electronic device within the low pressure chamber and removal of the electronic device from the interior, an exhaust pump connected to the chamber, a heater connected to the chamber, and a controller connected to the exhaust pump and the heater, the controller controlling the exhaust pump to reduce pressure within the low pressure chamber and controlling operation of the heater to apply heat to the electronic device, thereby controlling removal of moisture from the electronic device.

[0087] X4. Another embodiment of the present invention comprises a device for removing moisture from an electronic device substantially as herein described with reference to the accompanying drawings.

[0088] X5. Another embodiment of the present invention comprises a method of removing moisture from an electronic device substantially as herein described with reference to the accompanying drawings.

[0089] X6. Another embodiment of the present invention comprises a method of manufacturing a device substantially as hereinbefore described with reference to the accompanying drawings.

[0090] X7. Another embodiment of the present invention includes an apparatus including means for heating an electronic device, means for reducing pressure within the electronic device, and means for detecting when a sufficient amount of moisture has been removed from the electronic device.

[0091] Still other embodiments include the features described in any of statements X1, X2, X3, X4, X5, X6, and X7 above in combination with one or more of the following aspects:

[0092] A regenerative desiccator means that automatically dries the desiccant.

[0093] A UV germicidal lamp means for sterilizing portable electronic devices.

[0094] The heated conductive platen consists of a thermofoil heater superimposed on a metallic conductive platen.

[0095] The thermofoil heaters in the heat transfer platen are between 25 watts and 1000 watts.

[0096] The heated conductive platen utilizes a temperature feedback sensor.

[0097] The surface area of ​​the heat transfer platen is between 4 square inches and 1500 square inches.

[0098] The conductive heat platen is also used as a convection oven heater to heat the outside of the vacuum chamber.

[0099] A convection oven is used to heat the outside of the vacuum chamber to minimize compression of the interior vacuum chamber as evaporation occurs.

[0100] The vacuum chamber is made from a vacuum-rated material such as plastic, metal, or glass.

[0101] The vacuum chamber is constructed to withstand vacuum pressures up to 30 inches of mercury below atmospheric pressure.

[0102] The volume of the vacuum chamber varies between 0.25 liters and 12 liters.

[0103] The exhaust pump provides a minimum vacuum pressure of 19 inches of mercury below atmospheric pressure.

[0104] Solenoid valves have orifice diameters between 0.025 inches and 1.000 inches.

[0105] A solenoid valve is used to provide an atmospheric path for replacing the heated air in the convection oven.

[0106] The microprocessor controller utilizes algorithms stored in memory for controlled vacuum drying.

[0107] A relative humidity sensor is pneumatically connected to the vacuum chamber and is used to sample the real-time relative humidity.

[0108] A microprocessor controller utilizes the relative humidity maximum and minimum values ​​for controlled vacuum drying.

[0109] A microprocessor controller automatically controls the heat transfer temperature, vacuum pressure and cycle time.

[0110] The microprocessor controller utilizes pressure, temperature and relative humidity sensors as feedback for the heated vacuum drying.

[0111] The microprocessor controller can record performance data and transmit it via a modem internet interface.

[0112] A switch array for algorithm selection provides a simple control method.

[0113] The regenerative desiccator is heated by an external thermofoil heater of between 25W and 1000W.

[0114] Regenerative desiccators can utilize a fan and a temperature signal to bake the desiccant with precise closed-loop temperature control.

[0115] Regenerative desiccators utilize a three-way pneumatic valve to pneumatically isolate and switch the air flow direction and path to purge the desiccator.

[0116] The UV germicidal light emits UV radiation at a wavelength of 254nm and a power range between 1W and 250W to provide enough UV radiation to sterilize portable electronic devices.

[0117] The UV germicidal light sterilizes portable electronic devices for between 1 and 480 minutes.

[0118] The regenerative desiccator is heated from 120°F to 500°F to provide a dry medium.

[0119] The regenerative desiccator is heated for between 5 and 600 minutes to provide sufficient drying time.

[0120] The heat transfer platen is heated to between 70° F. and 200° F. to reintroduce heat to compensate for losses due to the loss of latent heat of vaporization.

[0121] The microprocessor controller records performance data and can transmit and receive performance data and software updates wirelessly over a cellular radio network.

[0122] The microprocessor controller can log performance data and print the results on an Internet Protocol wireless printer or a locally installed printer.

[0123] The placing step includes placing the portable electronic device on a platen, and the heating step includes heating the platen to a temperature of at least about 110°F and at most about 120°F.

[0124] Reducing the pressure includes reducing the pressure to at least about 28 inches of Hg, which is less than the pressure outside the chamber.

[0125] Reducing the pressure includes reducing the pressure to at least about 30 inches of Hg, which is less than the pressure outside the chamber.

[0126] The placing step includes placing the portable electronic device on a platen, the heating step includes heating the platen to at least about 110° F. and at most about 120° F., and the reducing pressure step includes reducing the pressure to at least about 28 inches of Hg, which is less than the pressure outside the chamber.

[0127] The steps of decreasing pressure and increasing pressure are repeated sequentially prior to the step of removing the portable electronic device.

[0128] Automatically controlling the repetition of the steps of decreasing pressure and increasing pressure according to at least one predetermined criterion.

[0129] Detecting when a sufficient amount of moisture has been removed from the electronic device.

[0130] Stopping the repetition of the steps of decreasing pressure and increasing pressure after the step of detecting.

[0131] Measuring the relative humidity within the chamber.

[0132] After the relative humidity has decreased and the rate of decrease in the relative humidity has slowed, increasing the pressure in the chamber.

[0133] The steps of reducing pressure and increasing pressure are repeated sequentially before removing the portable electronic device.

[0134] The pressure reduction process begins as the relative humidity increases and the rate of increase of the relative humidity slows.

[0135] The repeated steps of decreasing and increasing the pressure are stopped when the difference between successive relative humidity maxima and minima is within a predetermined tolerance.

[0136] The repeated steps of decreasing pressure and increasing pressure are stopped when the relative humidity within the chamber reaches a predetermined value.

[0137] Reducing the pressure in the low pressure chamber using a pump.

[0138] Removing moisture from the gas being pumped out of the chamber before the gas reaches the pump.

[0139] The step of removing the moisture includes removing the moisture using a desiccator containing a desiccant.

[0140] The process of removing moisture from the desiccant.

[0141] Isolating the desiccant from the pump prior to the step of removing moisture from the desiccant.

[0142] The process of reversing the air flow through a desiccator while removing moisture from the desiccant.

[0143] During the step of removing moisture from the desiccant, heating the desiccant.

[0144] The heating step includes heating the desiccant to a temperature of at least 200°F and at most 300°F.

[0145] The heating step includes heating the desiccant to about 250°F.

[0146] The controller controls the exhaust pump to reduce the pressure in the low pressure chamber multiple times, with the pressure in the low pressure chamber increasing between successive reductions in pressure.

[0147] A humidity sensor is connected to the low pressure chamber and to a controller, the controller controlling the exhaust pump to at least temporarily stop reducing pressure in the low pressure chamber based at least in part on a signal received from the humidity sensor.

[0148] When the rate of change of the relative humidity decreases or is about zero, the controller controls the exhaust pump to at least temporarily stop reducing the pressure in the low pressure chamber.

[0149] When the rate of change of the relative humidity decreases or is about zero, the controller controls the exhaust pump to begin reducing the pressure in the low pressure chamber.

[0150] As the exhaust pump reduces the pressure in the low pressure chamber multiple times, the humidity sensor detects maximum and minimum relative humidity values, and the controller determines that the device is dry if the difference between successive maximum and minimum relative humidity values ​​is equal to or less than a predetermined value.

[0151] A valve is connected to the low pressure chamber and to a controller, and pressure in the low pressure chamber increases during the sequential reductions in pressure due at least in part to the controller controlling the valve to increase the pressure.

[0152] The controller controls the valve to increase the pressure in the low pressure chamber, and at about the same time, the controller controls the exhaust pump to stop decreasing the pressure in the low pressure chamber.

[0153] The controller controls the valve to equalize pressure between the inside of the low pressure chamber and the outside of the low pressure chamber.

[0154] A temperature sensor is connected to the heater and to a controller, the controller controlling the heater to maintain a predetermined temperature based at least in part on the signal received from the pressure sensor.

[0155] A pressure sensor is connected to the low pressure chamber and to a controller, and the controller controls the exhaust pump to at least temporarily stop reducing pressure in the low pressure chamber based at least in part on a signal received from the pressure sensor.

[0156] The heater includes a platen that the electronic device directly contacts while removing moisture from the electronic device.

[0157] A process for sterilizing electronic devices.

[0158] UV lamps that sterilize electronic devices.

[0159] Although illustrated examples, representative embodiments and specific aspects of the present invention have been described and illustrated in detail in the drawings and the foregoing description, they should be considered as illustrative and not restrictive or limiting. The description of a particular feature in an embodiment does not mean that the particular feature is necessarily limited to that embodiment. Features of one embodiment may be utilized in combination with features of other embodiments, as will be understood by those skilled in the art, whether or not explicitly described as such. Exemplary embodiments have been shown and described, and it is desired to protect all changes and modifications that come within the spirit of the invention.

Claims

1. placing a portable electronic device that has become at least partially inoperable due to moisture ingress into a low pressure chamber; conductively heating the portable electronic device based on physical contact between the portable electronic device and a physical heating surface within the low pressure chamber; performing at least one exhaust cycle, the at least one exhaust cycle comprising: reducing pressure in the low pressure chamber to remove moisture from an interior of the portable electronic device; after the step of reducing pressure, increasing the pressure in the low pressure chamber using a vent valve connected to the low pressure chamber; and measuring moisture-based information within the low pressure chamber during the at least one evacuation cycle; determining whether to perform an additional evacuation cycle of the low pressure chamber based on the moisture-based information; Contains the steps of heating, reducing the pressure, and increasing the pressure using a vent valve connected to the low pressure chamber are controlled by at least one controller; The at least one controller controls a vent valve to: by increasing the pressure in the low pressure chamber, or Equalizing pressure between the interior of the low pressure chamber and the exterior of the low pressure chamber; configured to control the removal of moisture; The method, wherein the step of determining whether to perform a further exhaust cycle is controlled by the at least one controller.

2. determining whether to perform an additional evacuation cycle of the low pressure chamber, determining second moisture-based information associated with the at least one evacuation cycle; calculating a result based on the moisture-based information and the second moisture-based information; The method of claim 1 , comprising:

3. 3. The method of claim 2, wherein the moisture-based information includes a maximum humidity value, the second moisture-based information includes a minimum humidity value, and the result includes a calculated result based on the maximum humidity value and the minimum humidity value.

4. the at least one controller maintains a predetermined temperature based at least in part on a signal received from a temperature sensor coupled to a heater and the at least one controller; or 4. The method of claim 1, wherein the at least one controller increases or decreases pressure in the low pressure chamber based at least in part on a signal received from a pressure sensor coupled to the low pressure chamber and the at least one controller.

5. The method of claim 1 , wherein the at least one controller stores the moisture-based information in a register.

6. 6. The method of claim 1, wherein the portable electronic device is placed on a platen including the physical heating surface, and the heating step includes heating the platen to at least about 110° F. or at most about 120° F.

7. Reducing the pressure in the low pressure chamber includes reducing the pressure until it is at least about 28 inches Hg less than the pressure outside the low pressure chamber; or 7. The method of claim 1, wherein reducing the pressure in the low pressure chamber includes reducing the pressure until it is at least about 30 inches Hg less than the pressure outside the low pressure chamber.

8. the steps of decreasing pressure and increasing pressure are repeated sequentially; detecting when a sufficient amount of moisture has been removed from the portable electronic device or from the low pressure chamber; ceasing the repetition of the steps of decreasing pressure and increasing pressure after the step of detecting; The method of claim 1 , further comprising:

9. The method of claim 1 , wherein the moisture-based information comprises humidity information.

10. reducing the pressure in the low pressure chamber using a pump; removing moisture from the gas being pumped from the low pressure chamber using the pump; 10. The method of claim 1, comprising:

11. The method of claim 10, wherein removing the moisture comprises removing the moisture using a desiccator containing a desiccant.

12. at least partially sterilizing the portable electronic device; 12. The method of claim 1, wherein the sterilizing step comprises exposing the portable electronic device to ultraviolet light.

13. 13. A method according to any preceding claim, including the step of selecting algorithms for temperature and pressure monitoring and control.

14. a low pressure chamber defining an interior, the interior configured to accommodate placement of an electronic device within the low pressure chamber and removal of the electronic device from the interior; an exhaust pump connected to the low pressure chamber; a heater connected to the low pressure chamber; a moisture-based sensor in the low pressure chamber; at least one controller connected to the exhaust pump, the heater, and the moisture-based sensor, the at least one controller controlling moisture removal by controlling the exhaust pump by reducing pressure in the low-pressure chamber, controlling operation of the heater to apply heat to the electronic device via conduction based on physical contact between the electronic device and a physical heating surface in the low-pressure chamber, and performing at least one evacuation cycle of the low-pressure chamber; a valve connected to the low pressure chamber and to the at least one controller, wherein pressure in the low pressure chamber increases at least in part due to the at least one controller controlling the valve to increase pressure; and Equipped with The at least one controller further comprises: measuring moisture-based information using the moisture-based sensor in the low pressure chamber; operative to determine whether to perform an additional evacuation cycle of the low pressure chamber based on the moisture-based information; The at least one controller controls the valve to: by increasing the pressure in the low pressure chamber, or Equalizing pressure between the interior of the low pressure chamber and the exterior of the low pressure chamber; configured to control the removal of moisture; The determining whether to perform a further exhaust cycle is controlled by the at least one controller.

15. The apparatus of claim 14 , wherein the at least one controller is further operative to detect when a sufficient amount of moisture has been removed from the electronic device or from the low pressure chamber.

16. determining whether to perform an additional evacuation cycle of the low pressure chamber comprises: determining second moisture-based information associated with the at least one evacuation cycle; and calculating a result based on the moisture-based information and the second moisture-based information; 16. The apparatus of claim 14 or claim 15, comprising:

17. 17. The apparatus of claim 16, wherein the moisture-based information includes a maximum humidity value, the second moisture-based information includes a minimum humidity value, and the result includes a calculated result based on the maximum humidity value and the minimum humidity value.

18. 18. The apparatus of claim 14, wherein the at least one controller controls the exhaust pump to reduce pressure in the low pressure chamber multiple times, the pressure in the low pressure chamber increasing between successive reductions in pressure.

19. 18. The apparatus of claim 14, wherein the at least one controller controls the exhaust pump to at least temporarily cease reducing pressure in the low pressure chamber based at least in part on a signal received from the moisture-based sensor.

20. 20. The apparatus of claim 19, wherein the at least one controller controls the exhaust pump to at least temporarily stop reducing the pressure in the low pressure chamber when a rate of change of the moisture-based information decreases or is about zero, or the at least one controller controls the exhaust pump to begin reducing the pressure in the low pressure chamber when a rate of change of the moisture-based information decreases or is about zero.

21. 21. The apparatus of claim 14, wherein the moisture-based sensor detects maximum and minimum humidity values ​​when the exhaust pump reduces the pressure in the low-pressure chamber multiple times, and the at least one controller determines that the electronic device is dry if a difference between successive maximum and minimum humidity values ​​is less than or equal to a predetermined value.

22. a temperature sensor coupled to the heater and to the at least one controller, the at least one controller controlling the heater to maintain a predetermined temperature based at least in part on a signal received from the temperature sensor; or 22. The apparatus of claim 14, further comprising a pressure sensor connected to the low pressure chamber and to the at least one controller, the at least one controller controlling the exhaust pump to at least temporarily stop a reduction in pressure in the low pressure chamber based at least in part on a signal received from the pressure sensor.

23. 23. The apparatus of any of claims 14 to 22, wherein the physical heating surface is part of a platen.

24. 24. Apparatus according to any of claims 14 to 23, comprising sterilisation means connected to the low pressure chamber and configured to kill at least a portion of bacteria on the electronic device placed within the low pressure chamber.

25. 25. The apparatus of claim 24, wherein the sterilization means is configured to kill at least a portion of bacteria on the electronic device disposed within the low pressure chamber using at least one of light or gas.

26. means for conductively heating the electronic device based on physical contact between the electronic device and a physical heating surface; means for reducing the pressure in a chamber containing the electronic device; a means for increasing pressure in the chamber containing the electronic device, the means being connected to the chamber; means for controlling one or more evacuation cycles of the chamber containing the electronic device; means for controlling the increase in pressure within the chamber containing the electronic device; means for determining information based on moisture in the chamber; means for determining when to stop one or more evacuation cycles of the chamber containing the electronic device based on the moisture-based information; Equipped with The means for controlling the increase in pressure comprises: increasing the pressure in the chamber containing the electronic device; or To equalize the pressure between the inside of the chamber and the outside of the chamber. It is composed of An apparatus, wherein the means for determining when to stop the one or more exhaust cycles is controlled by the means for controlling the one or more exhaust cycles.

27. 27. The apparatus of claim 26, further comprising means for at least partially sterilizing the electronic device within the chamber.

Images