Battery pack

Abstract

To provide a battery pack.SOLUTION: A battery pack includes: battery cells; and sensing units for acquiring state information of the battery cells. The sensing units include: sensing substrates extending in a first direction and having a first position at which sensing devices are positioned; and sensing terminals connected to the sensing substrates at a second position different from the first position and connected to the battery cells to acquire the state information. The sensing substrates and the sensing terminals (i) overlap each other at the first and second positions and (ii) extend to cross each other so that upper and lower positions are reversed in the second direction in which they overlap each other at the first and second positions. With this, there is provided the battery pack in which the sensing substrates formed as one surface circuit substrates are applied, and in which lamination of the sensing devices and sensing terminals can be formed on the upper and lower surfaces of the sensing substrates via the sensing substrates and sensing terminals extending to cross each other while forming the sensing units for collecting the state information of the battery cells.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a battery pack. [Background technology]

[0002] Generally, a secondary battery is a battery that can be charged and discharged, unlike a primary battery that cannot be charged. Secondary batteries are used as energy sources for mobile devices, electric vehicles, hybrid vehicles, electric bicycles, uninterruptible power supplies, etc., and are used in the form of a single battery or in the form of a module in which multiple batteries are connected together to form a single unit, depending on the type of external device to which they are applied.

[0003] Small mobile devices such as mobile phones can operate for a certain period of time with the output and capacity of a single battery, but when long-term operation and high power operation are required, such as in power-hungry electric and hybrid vehicles, a modular form containing multiple batteries is preferred due to issues of output and capacity, and the output voltage and output current are increased depending on the number of built-in batteries. Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a battery pack in which a sensing substrate formed as a one-sided circuit board is used to form a sensing portion for collecting status information of a battery cell, while a stack of sensing elements and sensing terminals can be formed on the upper and lower surfaces of the sensing substrate via the sensing substrate and sensing terminals that extend crosswise relative to each other. [Means for solving the problem]

[0005] In order to solve the above problems and other problems, a battery pack of the present invention includes a battery cell, and a sensing unit for obtaining status information of the battery cell, the sensing board extending side by side along a first direction and including a first position where a sensing element is formed, and a sensing terminal connected to the sensing board at a second position different from the first position and connected to a side of the battery cell to capture the status information, wherein the sensing board and the sensing terminal i) overlap each other at the first and second positions, and ii) extend crossing each other along the second direction such that their up-down positions are inverted to overlap each other at the first and second positions.

[0006] For example, in the first position, the sensing substrate and the sensing terminal on which the sensing element is formed may be disposed at an upper position opposite the battery cell and a lower position facing the battery cell, respectively, and in the second position, the sensing substrate and the sensing terminal may be disposed at a lower position facing the battery cell and an upper position opposite the battery cell, respectively.

[0007] For example, the sensing elements may be formed on a top surface of a sensing substrate opposite the battery cells.

[0008] For example, at least one of the sensing board and the sensing terminal may include a deformation portion for connecting upper and lower positions that are inverted to each other at the first and second positions.

[0009] For example, the deformation portion may connect the upper and lower positions that are inverted to each other at the first and second positions with a step or with an inclination.

[0010] For example, the sensing board may include a deformation portion that intersects with the sensing terminal and connects between a position above the sensing terminal in the first position and a position below the sensing terminal in the second position.

[0011] For example, the sensing terminal may include a deformation portion for intersecting the sensing substrate and connecting between a position below the sensing substrate at the first position and a position above the sensing substrate at the second position.

[0012] For example, a through hole through which the sensing terminal passes may be formed at a third position between the first and second positions of the sensing substrate along the first direction such that the sensing substrate and the sensing terminal cross each other.

[0013] For example, the deformation portion may be formed within the through hole.

[0014] For example, along a third direction intersecting the first and second directions, the periphery of the through hole of the sensing substrate extending along the first direction to surround the through hole at a position outside the through hole of the sensing substrate, and the through portion of the sensing terminal penetrating the through hole may intersect with each other.

[0015] For example, at least one of the periphery of the through hole and the through portion may extend obliquely to connect between upper and lower positions that are inverted from each other at the first and second positions, and may cross each other.

[0016] For example, the through-hole periphery and the through-hole portion may extend at an inclination in the opposite direction to each other so as to connect between upper and lower positions that are inverted to each other at the first and second positions, and may cross each other.

[0017] For example, the sensing substrate and the sensing terminals may be bonded to each other by thermocompression or laminating.

[0018] For example, along the first direction, the sensing substrate extends from the first position to a second position, and the sensing terminal extends from the first position to a fourth position offset from the second position.

[0019] For example, the sensing terminal may be connected to a battery cell at a fourth position outside the sensing substrate along the first direction.

[0020] For example, the sensing terminal may be connected to a terminal surface of a battery cell on which an electrode is formed.

[0021] For example, a weld may be formed between the sensing terminal and a terminal surface of the battery cell.

[0022] For example, a metal layer may be formed in a first location of the sensing substrate, the metal layer including a first bond pad for coupling to the sensing element.

[0023] For example, a first adhesive member for coupling with the sensing terminal may be interposed at a first position of the sensing substrate.

[0024] For example, in the first position, a metal layer including the first bonding pad may be formed on an upper surface of the sensing substrate opposite the battery cell, and the first adhesive member may be formed on a lower surface of the sensing substrate facing the battery cell.

[0025] For example, a metal layer may be formed at a second location on the sensing substrate that includes a second bonding pad for coupling to the sensing terminal.

[0026] For example, a second adhesive member for coupling with the sensing terminal may be interposed at a second position of the sensing substrate.

[0027] For example, a metal layer including first and second bond pads for connection to a sensing element and a sensing terminal, respectively, may be formed at first and second positions of the sensing substrate, and the metal layers including the first and second bond pads may be formed together on an upper surface of the sensing substrate opposite the battery cell.

[0028] For example, the sensing substrate may be formed as a one-sided circuit board that does not include the metal layer on a lower surface facing the battery cell. Effect of the Invention

[0029] According to the present invention, a one-sided circuit board having a relatively low manufacturing cost is applied, and a sensing unit for collecting status information of a battery cell is formed, and a sensing element and a sensing terminal are stacked or coupled on opposite upper and lower surfaces of the sensing board provided as a one-sided circuit board through the sensing board and the sensing terminal extending crosswise with each other. By stacking the sensing element and the sensing terminal on the opposite upper and lower surfaces of the sensing board in this manner, soldering of the sensing element and the sensing board can be stably supported under the support base of the sensing terminal. Also, according to the present invention, by applying a sensing board formed as a one-sided circuit board, soldering of the sensing element and soldering of the sensing terminal are performed collectively on one surface of the sensing board.

[0030] According to the present invention, the sensing element is not disposed on the lower surface of the sensing substrate facing the battery cell, but is disposed on the upper surface of the sensing substrate opposite the battery cell, thereby preventing damage to the sensing element due to impact with the battery cell. [Brief description of the drawings]

[0031] [Figure 1] 1 is an exploded perspective view of a battery pack according to a preferred embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded perspective view showing a part of the battery pack shown in FIG. 1, illustrating the arrangement of a sensing unit and a battery cell. [Diagram 3] FIG. 3 is a perspective view of the sensing unit shown in FIG. 2; [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] 4 is a view showing a top view of the sensing unit shown in FIG. 3; [Figure 6] 4 is a view showing a bottom surface of the sensing unit shown in FIG. 3; [Figure 7] 4 is a diagram showing the assembly of the sensing unit shown in FIG. 3; [Figure 8] 11 is a perspective view of a sensing unit according to another embodiment of the present invention; FIG. [Figure 9]9 is a view showing a top view of the sensing unit shown in FIG. 8. [Figure 10] 9 is a view showing a bottom surface of the sensing unit shown in FIG. 8. [Figure 11] 10 is a cross-sectional view taken along line XI-XI in FIG. 8. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a battery pack according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

[0033] FIG 1 is an exploded perspective view of a battery pack according to a preferred embodiment of the present invention. FIG 2 is an exploded perspective view showing a part of the battery pack shown in FIG 1, and is an exploded perspective view showing an arrangement of a sensing unit and battery cells. FIG 3 is a perspective view of the sensing unit shown in FIG 2. FIG 4 is a cross-sectional view taken along line IV-IV in FIG 3. FIG 5 and FIG 6 are views showing different upper and lower surfaces of the sensing unit shown in FIG 3, respectively. FIG 7 is a view showing the assembly of the sensing unit shown in FIG 3.

[0034] 1, a battery pack according to an embodiment of the present invention includes a plurality of battery cells B arranged along a first direction Z1, and a bus bar 50 disposed on the plurality of battery cells B to electrically connect different battery cells B to each other. A bus bar holder H is interposed between the bus bar 50 and the battery cells B for electrical insulation therebetween and for aligning an assembly position of the bus bar 50. A sensing board 20 for collecting status information of the battery cells B together with the bus bar 50 is disposed on the bus bar holder H. In an embodiment of the present invention, the bus bar 50 may be connected to first and second electrode terminals E1 and E2 of different polarities disposed on a terminal surface 11 of the battery cells B along a third direction Z3 intersecting with the first direction Z1 in which the plurality of battery cells B are arranged. The first and second electrode terminals E1, E2 may form first and second row electrode terminals E1, E2 along a first direction Z1 in which the plurality of battery cells B are arranged, and the bus bars 50 electrically connected to the first and second row electrode terminals E1, E2 may form the first and second row bus bars 50 on the first and second row electrode terminals E1, E2. A sensing board 20 for collecting state information of the plurality of battery cells B may be disposed between the first and second row electrode terminals E1, E2 or the first and second row bus bars 50. For example, the first and second row bus bars 50 and the sensing board 20 disposed between the first and second row bus bars 50 may be supported together on a bus bar holder H, and may be disposed on the bus bar holder H to align the assembly positions while ensuring insulation from the battery cells B.

[0035] The battery cell B includes a terminal surface 11 on which first and second electrode terminals E1 and E2 are formed, a bottom surface 12 opposite to the terminal surface 11, and side surfaces 13 and 14 connecting the terminal surface 11 and the bottom surface 12, the wide side surface 13 occupying a relatively wide area and the narrow side surface 14 occupying a relatively narrow area. For example, the plurality of battery cells B arranged along the first direction Z1 may be arranged such that the wide side surfaces 13 face each other. A vent portion 15 for relieving internal pressure of the battery cell B is formed between the first and second electrode terminals E1 and E2 of opposite polarities on the terminal surface 11 of the battery cell B, and vent holes V and 20' for allowing the flow of exhaust gas discharged through the vent portion 15 of the battery cell B may be formed in the bus bar holder H and the sensing substrate 20 disposed on the vent portion 15, respectively. A connector CN electrically connected to the sensing board 20 is formed at one end of the sensing board 20, and the sensing board 20 is electrically connected to a battery management unit (not shown) through the connector CN. In an embodiment of the present invention, in addition to the vent hole V, the bus bar holder H may be formed with an opening H' for exposing the sensing unit 25 including the connection portion 22 of the sensing board 20 toward the terminal surface 11 of the battery cell B.

[0036] The busbar 50 may electrically connect different battery cells B to each other, and the plurality of busbars 50 electrically connected to each other are also electrically connected to an external device through input / output terminals 51, 52. The input / output terminals 51, 52 include a pair of input / output terminals 51, 52 different from each other connected to the busbar 50 connected to the battery cells B at one end position and the other end position, or the battery cells B at one end position and the other end position, in the electrical connection of the plurality of battery cells B electrically connected to each other through the busbar 50. The external device to which the plurality of battery cells B are connected through the input / output terminals 51, 52 corresponds to an external load to which discharge power is supplied from the battery pack, or an external charger that supplies charging power to the battery pack.

[0037] The sensing board 20 also includes a body 21 of the sensing board 20 and a plurality of connection parts 22 of the sensing board 20 branched from the body 21 of the sensing board 20 toward different battery cells B. Throughout this specification, the sensing board 20 forming a part of the sensing part 25 refers to the connection parts 22 of the sensing board 20 branched from the body 21 of the sensing board 20 toward each battery cell B, rather than the body 21 of the sensing board 20. Hereinafter, the sensing board 20 forming the sensing part 25 is referred to as the sensing board 20 without distinguishing between the body 21 and the connection part 22 of the sensing board 20, but the sensing board 20 forming the sensing part 25 refers to the connection part 22 of the sensing board 20 branched from the body 21 of the sensing board 20 toward the battery cell B. In one embodiment of the present invention, the connection portion 22 of the sensing substrate 20 extends in a meandering manner from the main body 21 of the sensing substrate 20, and the connection portion 22 of the sensing substrate 20 extends in a meandering manner so as to flexibly follow the displacement of the battery cell B in the first direction Z1 due to the expansion and contraction of the battery cell B.

[0038] Hereinafter, the sensing unit 25 for collecting state information of a plurality of battery cells in an embodiment of the present invention will be described in more detail with reference to FIGS.

[0039] That is, a battery pack according to one embodiment of the present invention includes a battery cell B, a sensing substrate 20 extending side by side along a first direction Z1 and including a first position P1 where a sensing element 40 is formed, and a sensing terminal 30 connected to the sensing substrate 20 at a second position P2 different from the first position P1 and connected to the battery cell B side to acquire the status information, and the sensing substrate 20 and the sensing terminal 30 include a sensing portion 25 for obtaining status information of the battery cell B, the sensing substrate 20 and the sensing terminal 30 extending crosswise to each other such that i) they overlap each other at the first and second positions P1, P2, and ii) they overlap each other at the first and second positions P1, P2, extending crossing each other in a manner that their up-down positions are inverted along the second direction Z2.

[0040] In one embodiment of the present invention, the sensing unit 25 can measure status information such as the temperature, voltage, and current of the battery cell B. For example, the sensing unit 25 includes a sensing element 40 including a thermistor that measures temperature by using a characteristic in which resistance increases or decreases according to temperature, such as a positive temperature coefficient thermistor (PTC) or negative temperature coefficient thermistor (NTC) for sensing the temperature of the battery cell B, and can generate and output an electrical signal corresponding to temperature information of the battery cell B.

[0041] In one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 extend in a first direction Z1 in parallel with each other, and the first direction Z1 corresponds to a longitudinal direction of the sensing substrate 20 and / or the sensing terminal 30 in this specification. For reference, the second direction Z2 corresponds to a thickness direction intersecting the first direction Z1 corresponding to the longitudinal direction and perpendicularly intersecting the first direction Z1, and may refer to the thickness direction of each of the sensing substrates 20 and the sensing terminals 30, or may refer to the thickness direction of the entire sensing unit 25 including the sensing substrates 20 and the sensing terminals 30 assembled with respect to each other. In this specification, the terms "upper position", "upper position" or "lower position" refer to positions in the vertical direction following the second direction Z2, or positions relative to each other in the vertical direction following the second direction Z2. As described below, the sensing substrate 20 and the sensing terminal 30 each include a lower surface facing the battery cell B and an upper surface facing away from the battery cell B. Among first and second positions P1 and P2 that are different from each other along the first direction Z1, at the first position P1, the sensing substrate 20 and the sensing terminal 30 are disposed at upper and lower positions relative to each other, i.e., at the first position P1, the lower surface of the sensing substrate 20 and the upper surface of the sensing terminal 30 are disposed opposite to each other. In contrast, at the second position P2, the sensing substrate 20 and the sensing terminal 30 are disposed at lower and upper positions relative to each other, i.e., at the second position P2, the upper surface of the sensing substrate 20 and the lower surface of the sensing terminal 30 are disposed opposite to each other.

[0042] As described below, the sensing substrate 20 and the sensing terminal 30 extend side by side along a first direction Z1, are arranged to overlap each other along a second direction Z2 at first and second positions P1, P2 that are different from each other along the first direction Z1, and extend crossing each other such that their relative positions are inverted along the second direction Z2 at the first and second positions P1, P2.

[0043] Throughout this specification, the third direction Z3 corresponds to a width direction that intersects with the first and second directions Z1 and Z2 and perpendicularly intersects with the first and second directions Z1 and Z2. For reference, the first direction Z1 corresponding to the longitudinal direction and the third direction Z3 corresponding to the width direction may refer to the longitudinal and width directions of the sensing substrate 20 and the sensing terminal 30, respectively, or may refer to the longitudinal and width directions of the entire sensing unit 25 in which the sensing substrate 20 and the sensing terminal 30 are assembled with each other. As described below, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 extend side by side along the first direction Z1, and extend crossing each other between the first and second positions P1, P2 such that their up-down positions are inverted at different first and second positions P1, P2 along the first direction Z1, and cross each other through a through hole 20' formed at a third position P3 between the first and second positions P1, P2. In this case, the periphery of the through hole 20' outside the through hole 20' along the third direction Z3 of the sensing substrate 20 in which the through hole 20' is formed and the through portion of the sensing terminal 30 penetrating the through hole 20' may cross each other.

[0044] Throughout this specification, the fact that the sensing substrate 20 and the sensing terminal 30 extend crosswise relative to each other means that the sensing terminal 30 is disposed to face opposite bottom and top surfaces of the sensing substrate 20 at first and second positions P1 and P2 that are different from each other along the first direction Z1. For example, the sensing terminal 30 faces the bottom surface of the sensing substrate 20 at the first position P1, and faces the top surface of the sensing substrate 20 at the second position P2. In one embodiment of the present invention, the sensing terminal 30 extends crossing the sensing substrate 20 while penetrating the sensing substrate 20 at a third position P3 between the first and second positions P1 and P2, such that the relative top and bottom positions with respect to the sensing substrate 20 are reversed at the first and second positions P1 and P2. For example, the fact that the sensing terminal 30 and the sensing substrate 20 extend crossing each other means that, between the sensing terminal 30 and the sensing substrate 20, which have upper and lower surfaces that are opposite to each other along the second direction Z2, the upper surface of the sensing terminal 30 and the lower surface of the sensing substrate 20 face each other at the first position P1, while the lower surface of the sensing terminal 30 and the upper surface of the sensing substrate 20 face each other at the second position P2. That is, the sensing terminal 30 is exposed on the lower surface of the sensing substrate 20 at the first position P1, while the sensing terminal 30 is exposed on the upper surface of the sensing substrate 20 at the second position P2.

[0045] In an embodiment of the present invention, the sensing terminal 30 and the sensing substrate 20 each include an upper and lower surface that are opposite to each other along the second direction Z2, and the upper and lower surfaces of the sensing terminal 30 and the sensing substrate 20 refer to opposite surfaces that are arranged in the same orientation. More specifically, the lower surface of the sensing terminal 30 and the sensing substrate 20 refers to a surface that is adjacent to or faces the battery cell B among the upper and lower surfaces that are opposite to each other along the second direction Z2, and the upper surface of the sensing terminal 30 and the sensing substrate 20 refers to a surface that is relatively far from the battery cell B among the upper and lower surfaces that are opposite to each other along the second direction Z2, or a surface that faces away from the battery cell B.

[0046] The sensing terminal 30 is exposed on the lower surface of the sensing substrate 20 at the first position P1, i.e., at the first position P1, the sensing terminal 30 is disposed on the lower surface of the sensing substrate 20 and leaves the upper surface of the sensing substrate 20 open as a space for mounting the sensing element 40, thereby allowing connection of the sensing element 40 on the upper surface of the sensing substrate 20 while supporting the sensing substrate 20 on which the sensing element 40 is formed. At the second position P2 different from the first position P1, the sensing terminal 30 is exposed on the upper surface of the sensing substrate 20 and can form a bond with the upper surface of the sensing substrate 20.

[0047] According to an embodiment of the present invention, the sensing substrate 20 is provided as a one-sided circuit board through the sensing substrate 20 and the sensing terminal 30 extending crosswise to each other, and the sensing element 40 and the sensing terminal 30 may be stacked or coupled on the upper and lower surfaces of the sensing substrate 20, which are opposite to each other. For example, a stacked structure may be formed in which the sensing terminal 30, the sensing substrate 20, and the sensing element 40 are stacked on each other along the second direction Z2 from the lower surface to the upper surface of the sensing substrate 20 at the first position P1. As described below, the sensing terminal 30 may form an input side to which status information of the battery cell B is input while being coupled to the battery cell B side at the fourth position P4, and the status information of the battery cell B is also transmitted to the sensing element 40 through the sensing terminal 30 extending from the second position P2 to the first position P1, and the status information of the battery cell B converted into an electrical signal through the sensing element 40 is also transmitted to a battery management unit connected to one end of the sensing substrate 20 through the sensing substrate 20 electrically connected to the sensing element 40.

[0048] According to an embodiment of the present invention, the sensing board 20 includes upper and lower surfaces that are opposite to each other along the second direction Z2, and a metal layer including bonding pads S1 and S2 for coupling with other components is formed on the upper surface of the sensing board 20, but a metal layer including bonding pads S1 and S2 for coupling with other components is not formed on the lower surface of the sensing board 20 opposite to the upper surface. For example, the sensing board 20 may be soldered to the sensing element 40 at a first position P1 and may be soldered to the sensing terminal 30 at a second position P2 through the metal layer including the first and second bonding pads S2 formed on the upper surface of the sensing board 20.

[0049] In one embodiment of the present invention, the sensing board 20 is also formed as a one-sided circuit board in which a metal layer including the first and second bonding pads S2 is formed on an upper surface of one of the upper and lower surfaces that are opposite to each other in the second direction Z2, and no metal layer is formed on the lower surface. As such, the sensing board 20 applicable to one embodiment of the present invention is formed as a one-sided circuit board, and the sensing board 20 of such a one-sided circuit board can be understood as having a different configuration from a double-sided circuit board in which a metal layer is formed on both the upper and lower surfaces of the upper and lower surfaces that are opposite to each other in the second direction Z2, and can be formed in a simplified form and through an easy process compared to a double-sided circuit board, thereby reducing production costs.

[0050] In one embodiment of the present invention, a single-sided circuit board sensing board 20 is used, which can reduce manufacturing costs due to its relatively simplified form. The sensing board 20 and the sensing terminal 30 extend crossing each other to form soldering with other components through a metal layer formed on the top surface of the sensing board 20, instead of a double-sided circuit board having metal layers on both the top and bottom surfaces. Instead, a single-sided circuit board sensing board having a metal layer formed on the top surface of the sensing board 20 may be used, and the sensing element 40 and the sensing terminal 30 may be stacked or coupled on the top and bottom surfaces of the sensing board 20, which are opposite to each other.

[0051] In the comparative example compared to the present invention, a double-sided circuit board sensing board 20 including metal layers on both the top and bottom surfaces is used, so that a sensing element 40 can be stacked on the top surface of the sensing board 20 and a sensing terminal 30 can be stacked on the bottom surface of the sensing board 20, for example, at a position corresponding to the first position P1 of the present invention. However, unlike the comparative example in which a double-sided circuit board sensing board 20 is used, an embodiment of the present invention uses a single-sided circuit board sensing board having a relatively simple structure, but forms a structure in which the sensing board 20 and the sensing terminal 30 cross each other, so that the sensing element 40 and the sensing terminal 30 can be stacked on the top and bottom surfaces of the sensing board 20, respectively.

[0052] In one embodiment of the present invention, the sensing element 40 and the sensing terminal 30 are respectively formed on the upper and lower surfaces of the sensing substrate 20, i.e., the sensing element 40 and the sensing terminal 30 are formed on the upper and lower surfaces of the sensing substrate 20, which are opposite to each other. As a result, the sensing substrate 20 on which the sensing element 40 is formed can be stably supported via the sensing terminal 30. Also, since the sensing element 40 is disposed on the upper surface of the sensing substrate 20 opposite the battery cell B, rather than on the lower surface of the sensing substrate 20 opposite the battery cell B, damage to the sensing element 40 due to impact with the battery cell B can be prevented.

[0053] In one embodiment of the present invention, the sensing substrate 20 may have a laminate of the sensing element 40 and the sensing terminal 30 via a metal layer formed on either a lower surface facing the battery cell B or an upper surface opposite the battery cell B. A one-sided circuit board in which a metal layer is formed on the upper surface opposite the battery cell B but no metal layer is formed on the lower surface facing the battery cell B may be applied.

[0054] In one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 extend crossing each other. Throughout this specification, the sensing substrate 20 and the sensing terminal 30 extend crossing each other means that the sensing substrate 20 and the sensing terminal 30 extend crossing each other so that their vertical positions are reversed along the second direction Z2. For example, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 are reversed in vertical positions at first and second positions P1 and P2 that are different from each other along the first direction Z1. For example, at the first position P1, the sensing substrate 20 and the sensing terminal 30 are disposed at the upper and lower positions, respectively, along the second direction Z2, while at the second position P2, the sensing terminal 30 and the sensing substrate 20 are disposed at the upper and lower positions, respectively.

[0055] More specifically, the intersection between the sensing substrate 20 and the sensing terminal 30 may also be performed at a third position P3 between the first and second positions P1 and P2 along the first direction Z1, and the sensing terminal 30 may cross the sensing substrate 20 through a through-hole 20' of the sensing substrate 20 formed at the third position P3. For example, the sensing terminal 30 extends from a lower position of the sensing substrate 20 at the first position P1 to an upper position of the sensing substrate 20 at the second position P2 through the through-hole 20' of the sensing substrate 20. Here, the through-hole 20' of the sensing substrate 20 may provide an intersection position between the sensing substrate 20 and the sensing terminal 30, and the intersection position between the sensing substrate 20 and the sensing terminal 30 may also correspond to a position where a thickness center line of the sensing substrate 20 and a thickness center line of the sensing terminal 30 cross each other along an extension direction of the sensing substrate 20 and the sensing terminal 30. For example, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 also intersect within a through hole 20' of the sensing substrate 20 formed at a third position P3 between the first and second positions P1, P2, and the sensing substrate 20 and the sensing terminal 30 are disposed at upper and lower positions, respectively, from the first position P1 to the third position P3 along the first direction Z1, and the top and bottom positions are inverted at the third position P3 corresponding to the intersection position, and the sensing substrate 20 and the sensing terminal 30 are disposed at lower and upper positions, respectively, from the third position P3 to the second position P2.

[0056] As described above, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 form upside-down positions at the first and second positions P1, P2, and form upside-down positions relative to each other. For example, along a level following the second direction Z2 from the terminal surface 11 of the battery cell B where the sensing unit 25 including the sensing substrate 20 and the sensing terminal 30 is disposed, the sensing substrate 20 and the sensing terminal 30 may form different levels from each other at the first and second positions P1, P2. For example, the sensing substrate 20 extends from a high level at the first position P1 to a low level at the second position P2, whereas the sensing terminal 30 extends from a low level at the first position P1 to a high level at the second position P2. For this purpose, the sensing substrate 20 and the sensing terminal 30 each include a deformation portion F2, F3 for connecting different levels at the first and second positions P1, P2 along a level following the second direction Z2 from the terminal surface 11, and the deformation portion F2, F3 of the sensing substrate 20 and the sensing terminal 30 may connect the different levels of the first and second positions P1, P2 with a step or may connect the different levels of the first and second positions P1, P2 with an incline. The deformation portion F2, F3 of the sensing substrate 20 and the sensing terminal 30 may continuously connect the different levels of the first and second positions P1, P2 without discontinuity of the sensing substrate 20 between the first and second positions P1, P2, and for this purpose, the deformation portion F2, F3 of the sensing substrate 20 and the sensing terminal 30 may connect the different levels of the first and second positions P1, P2 with a step or may connect with an incline. For example, the deformation portions F2 and F3 may be formed between the first and second positions P1 and P2 of the sensing substrate 20 or the sensing terminal 30. Throughout this specification, when it is said that the deformation portions F2 and F3 incline to connect the first and second positions P1 and P2 at different levels, the inclination may include not only an inclination at a constant angle but also an inclination at an angle that changes along the extension direction of the sensing substrate 20 and the sensing terminal 30. Also, the inclination may extend linearly or curvedly.

[0057] In an embodiment of the present invention, the deformation portion F2 of the sensing substrate 20 may be formed in the periphery of the through hole 20' extending in the first direction Z1 to surround the through hole 20' at a position outside the through hole 20' in the third direction Z3 corresponding to the width direction of the sensing substrate 20. The deformation portion F3 of the sensing terminal 30 may be formed in a through portion passing through the through hole 20'. In this case, the sensing substrate 20 and the sensing terminal 30 may form an intersection position within the through hole 20', and more specifically, the periphery of the through hole 20' surrounding the through hole 20' of the sensing substrate 20 and the through portion of the sensing terminal 30 passing through the through hole 20' may form an intersection position while intersecting with each other. In an embodiment of the present invention, the sensing terminal 30 may be formed of a metal plate having excellent rigidity, and the sensing terminal 30 having excellent rigidity may be assembled with the sensing substrate 20 having insufficient rigidity with the deformation portion F3 formed in advance, and the sensing substrate 20 may flexibly deform to correspond to the shape of the sensing terminal 30, and the deformation portion F2 may be formed while adaptively responding to the shape of the sensing terminal 30. For example, the sensing terminal 30 having the deformation portion F3 formed in advance may be assembled to the sensing substrate 20 so as to pass through the through-hole 20' of the sensing substrate 20, and the deformation portion F3 of the sensing terminal 30 may be assembled to the sensing substrate 20 so as to be located within the through-hole 20' of the sensing substrate 20, and the deformation portion F2 may be formed around the through-hole 20' of the sensing substrate 20 so as to correspond to the shape of the sensing terminal 30. In one embodiment of the present invention, the sensing substrate 20 may be formed as a flexible circuit board, and a deformation portion F2 may be formed around the through-hole 20', which has excellent flexibility, in order to prevent damage to the sensing substrate 20 due to insufficient flexibility of the sensing substrate 20. In various embodiments of the present invention, the deformation portions F2 and F3 of the sensing substrate 20 and the sensing terminal 30 may be formed in a process of bonding the sensing substrate 20 and the sensing terminal 30 to each other by thermocompression bonding or lamination after assembling the sensing substrate 20 and the sensing terminal 30. For example, the deformation portions F2 and F3 having corresponding shapes may be formed in the sensing substrate 20 and the sensing terminal 30 while the assembly including the sensing terminal 30 sandwiched in the through-hole 20' of the sensing substrate 20 is thermocompression bonded or laminated to each other in a flat shape.

[0058] As described above, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 may be at different levels from each other along the second direction Z2 from the terminal surface 11 of the battery cell B. Alternatively, while one of the sensing substrate 20 and the sensing terminal 30 may be at different levels from each other at the first and second positions P1, P2, the other may be at the same level from each other at the first and second positions P1, P2, and the sensing substrate 20 and the sensing terminal 30 may be at positions that are inverted from each other at the first and second positions P1, P2. For example, the sensing substrate 20 may have different levels at the first and second positions P1 and P2, but the sensing terminal 30 may have the same level at the first and second positions P1 and P2. For example, the sensing terminal 30 may be formed of a relatively light metal plate, and the sensing terminal 30 of a relatively strong metal plate may be formed of a flat metal plate forming the same level. The sensing terminal 30 forming the same level may extend across a lower position of the sensing substrate 20 that is relatively lacking in rigidity or has flexibility and an upper position of the sensing substrate 20 at the same level. For example, the sensing terminal 30 having excellent rigidity may pass through the through-hole 20', extend across the lower portion of the sensing substrate 20 at a first position P1 on one side of the through-hole 20', and extend across the upper portion of the sensing substrate 20 at a second position P2 on the other side of the through-hole 20', thereby inducing deformation portions F2 and F3 between the first and second positions P1 and P2 of the sensing substrate 20 that is relatively lacking in rigidity or has flexibility. For example, the deformation portion F2 of the sensing substrate 20 may be formed around the through hole 20' of the sensing substrate 20 extending in the first direction Z1 to surround the through hole 20' at a position outside the through hole 20' in the third direction Z3 corresponding to the width direction of the sensing substrate 20. In this case, the periphery of the through hole 20' of the sensing substrate 20 and a through portion of the sensing terminal 30 that passes through the through hole 20' may intersect with each other, and the sensing substrate 20 and the sensing terminal 30 may form an intersection position within the through hole 20'.

[0059] As described above, in one embodiment of the present invention, the sensing terminal 30 and the sensing substrate 20 may be at different levels at the first and second positions P1 and P2, while the other may be at the same level at the first and second positions P1 and P2, and the sensing substrate 20 and the sensing terminal 30 may be at upside-down positions at the first and second positions P1 and P2. However, as described above, in one embodiment of the present invention, the sensing terminal 30 may be at the same level at the first and second positions P1 and P2, but the sensing substrate 20 may be at different levels at the first and second positions P1 and P2. In another embodiment of the present invention, the sensing substrate 20 may be at the same level at the first and second positions P1 and P2, but the sensing terminal 30 may be at different levels at the first and second positions P1 and P2. For example, the sensing terminal 30 having a relatively high rigidity is previously formed with a deformation portion F3, and the sensing terminal 30 is sandwiched in the through hole 20' of the sensing substrate 20 so that the deformation portion F3 is located within the through hole 20' of the sensing substrate 20, and extends across the lower and upper positions of the sensing substrate 20 formed at the same level, around the through hole 20' in the first direction Z1. In such an embodiment, the deformation portion F3 is previously formed in the sensing terminal 30 having a relatively high rigidity, and the sensing substrate 20 having a relatively low rigidity to be assembled with the sensing terminal 30 can be prevented from being damaged during the assembly process. More specifically, in order to prevent the sensing substrate 20 having a relatively low rigidity from being damaged when the sensing substrate 20 is deformed to follow the shape of the sensing terminal 30, the sensing substrate 20 can be maintained at the same level at the first and second positions P1 and P2, and the deformation portion F3 can be formed in the sensing terminal 30 sandwiched in the through hole 20' of the sensing substrate 20 instead of the sensing substrate 20.Even in such an embodiment, an intersection position is formed at a third position P3 between the first and second positions P1, P2, for example, within the through hole 20' formed at the third position P3, and for example, the penetration portion of the sensing terminal 30 penetrating the through hole 20' and the periphery of the through hole 20' extending along the first direction Z1 to surround the through hole 20' at a position outside the through hole 20' along the third direction Z3 corresponding to the width direction of the sensing substrate 20 intersect with each other within the through hole 20'.

[0060] In one embodiment of the present invention, the third position P3 and the second position P2 are formed adjacent to each other along the first direction Z1. For example, the third position P3 providing the intersection position and the second position P2 where the sensing substrate 20 and the sensing terminal 30, which are inverted vertically through the third position P3, are coupled to each other are formed adjacent to each other. That is, a through hole 20' corresponding to the third position P3 and the second position P2 where the coupling between the sensing terminal 30 and the sensing substrate 20 outside the adjacent through hole 20' is formed are formed.

[0061] In an embodiment of the present invention, the first and second positions P1 and P2 refer to positions where the sensing element 40 and the sensing terminal 30 are connected on the sensing substrate 20 along the first direction Z1. For example, in an embodiment of the present invention, the first position P1 refers to a position where the sensing element 40 is connected on the sensing substrate 20 or a position where the sensing element 40 is coupled on the sensing substrate 20, and the second position P2 refers to a position where the sensing terminal 30 is connected on the sensing substrate 20 or a position where the sensing terminal 30 is coupled on the sensing substrate 20. For example, in an embodiment of the present invention, the sensing element 40 and the sensing terminal 30 may be coupled at different first and second positions P1 and P2 along the sensing substrate 20, and the coupling at the first and second positions P1 and P2 may be performed via soldering. For example, in one embodiment of the present invention, the first and second positions P1 and P2 are connected to the sensing element 40 and the sensing terminal 30 at the first and second positions P1 and P2, respectively, through a metal layer formed on the upper surface of the sensing substrate 20 among the upper and lower surfaces of the sensing substrate 20 that are opposite to each other. In one embodiment of the present invention, the sensing substrate 20 has a lower surface facing the battery cell B and a metal layer (first and second bonding pads S1 and S2) formed on an upper surface of the sensing substrate 20 that is opposite to the battery cell B. That is, by applying the sensing substrate 20 which is a one-sided circuit board having a metal layer (first and second bonding pads S1, S2) alternatively formed on the upper surface, the connection of the first and second positions P1, P2 which form connections on the upper surface of the sensing substrate 20 is performed simultaneously and collectively. For example, the connection to the sensing element 40 at the first position P1 and the connection to the sensing terminal 30 at the second position P2 are performed collectively by a single soldering process such as reflow soldering through the metal layer (first and second bonding pads S1, S2) formed on the upper surface of the sensing substrate 20.In various embodiments of the present invention, the connection between the first and second positions P1, P2 is made by various forms of thermal bonding, including soldering. For example, at the first position P1, the connection between the electrode of the sensing element 40 and the metal layer (first bonding pad S1) of the sensing substrate 20 is made by any available thermal bonding, and at the second position P2, the connection between the sensing terminal 30 and the metal layer (second bonding pad S2) of the sensing substrate 20 is made by any available thermal bonding.

[0062] In one embodiment of the present invention, the sensing board 20 that forms the connection at the first and second positions P1 and P2 may be formed as a one-sided circuit board having a metal layer (first and second bonding pads S1 and S2) formed on an upper surface alternatively out of upper and lower surfaces, or may be provided as a flexible circuit board having flexibility. Thus, in the soldering process, for example, in a soldering process such as reflow soldering, a support base that can firmly support the flexible circuit board is provided, and in one embodiment of the present invention, the soldering performed at the first and second positions P1 and P2 on the sensing board 20 can be firmly supported through the sensing terminal 30 that can support the sensing board 20. For example, in one embodiment of the present invention, the sensing terminal 30 disposed below the sensing substrate 20 at the first position P1 can firmly support the sensing substrate 20 on which the sensing element 40 is formed, and can prevent the sensing element 40, which has a relatively narrow soldering area, from moving out of its correct position due to distortion or twisting caused by the flexibility of the sensing substrate 20, thereby forming a firm electrical and physical connection between the sensing element 40 and the sensing substrate 20.

[0063] Throughout this specification, the connection at the first position P1, or stacking or forming the sensing substrate 20 and the sensing element 40 at the first position P1, etc., comprehensively means electrical connection as well as physical connection, for example, the sensing substrate 20 and the sensing element 40 are electrically connected to each other, so that an electrical signal related to status information of the battery cell B generated through the sensing element 40 is transmitted through the sensing substrate 20, and status information of the battery cell B is collected through a battery management unit connected to one end of the sensing substrate 20. Similarly, the connection at the second position P2, or stacking or forming the sensing substrate 20 and the sensing terminal 30, etc., means physical connection, for example, the sensing substrate 20 and the sensing terminal 30 may be coupled to each other through a physical connection.

[0064] In an embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 are coupled to each other at the second position P2, and are coupled to each other at the first position P1 as well as the second position P2. More specifically, the sensing unit 25 according to an embodiment of the present invention includes the sensing substrate 20 and the sensing terminal 30 on which the sensing element 40 is formed, and the coupling between the sensing substrate 20 and the sensing terminal 30 is performed at first and second positions P1 and P2 that are different from each other along the first direction Z1. For example, at the second position P2, the sensing substrate 20 (e.g., the second bonding pad S2 of the sensing substrate 20) and the sensing terminal 30 that overlap each other are coupled to each other with a soldering material, and at the first position P1, the sensing substrate 20 and the sensing terminal 30 are coupled to each other with an adhesive member 60. In an embodiment of the present invention, the adhesive member 60 may be a double-sided adhesive tape. In an embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 are formed to extend elongatedly along the first direction Z1, and may be firmly coupled to each other by forming a coupling at first and second positions P1 and P2 different from each other along the first direction Z1. That is, the sensing substrate 20 and the sensing terminal 30 may be coupled to each other at the first position P1 through an adhesive member 60 interposed between a lower surface of the sensing substrate 20 and an upper surface of the sensing terminal 30, and may be coupled to each other at the second position P2 through a soldering material interposed between an upper surface of the sensing substrate 20 and a lower surface of the sensing terminal 30.

[0065] In an embodiment of the present invention, the sensing substrate 20 includes an insulating substrate and a metal layer formed on one side of the insulating substrate, i.e., an upper surface of the insulating substrate opposite to the battery cell B. For example, the sensing substrate 20 may include a copper layer as a metal layer formed on an upper surface of a polyimide substrate as an insulating substrate. The metal layer of the sensing substrate 20 includes a first bonding pad S1 formed in a shape corresponding to an electrode of the sensing element 40 at a first position P1, and a second bonding pad S2 formed in an area sufficient to cover the sensing terminal 30 at a second position P2, and may further include a conductive line L extending from the first bonding pad S1 and connected to the electrode of the sensing element 40.

[0066] In an embodiment of the present invention, the sensing terminal 30 has a structural rigidity superior to that of the sensing substrate 20 so as to stably support the sensing substrate 20, and is also formed of a metal material having excellent soldering properties with a metal layer (e.g., a copper layer) formed on the sensing substrate 20. For example, the sensing terminal 30 is also formed of a metal plate extending along a first direction Z1. More specifically, the sensing terminal 30 is also formed of a nickel plate. In an embodiment of the present invention, the sensing terminal 30 extends from a first position P1 to a second position P2 along the first direction Z1 and is connected to the battery cell B side at a fourth position P4 outside the second position P2, and can transmit temperature information of the battery cell B as status information of the battery cell B from the second position P2 connected to the battery cell B side to the first position P1 where the sensing element 40 is disposed. For this reason, the sensing terminal 30 is formed of a metal material having excellent thermal conductivity, and can sensitively capture status information of the battery cell B.

[0067] In an embodiment of the present invention, a welded portion W may be formed between the sensing terminal 30 removed from the sensing substrate 20 and the battery cell B at a fourth position P4, which is opposite to the first position P1 with respect to the second position P2. In an embodiment of the present invention, at the fourth position P4, the sensing terminal 30 removed from the sensing substrate 20 directly faces the battery cell B and is directly coupled to the battery cell B, for example, the sensing terminal 30 and the battery cell B are coupled to each other through the welded portion W. For example, the welded portion W formed at the fourth position P4 may transmit information such as temperature, voltage, and current as status information transmitted from the battery cell B while forming a thermal and / or electrical connection between the sensing terminal 30 and the battery cell B, which are coupled to each other, and the status information of the battery cell B transmitted through the welded portion W at the fourth position P4 is converted into an electrical signal related to the status information of the battery cell B through the sensing element 40 formed at the first position P1 and transmitted to the sensing substrate 20.

[0068] In one embodiment of the present invention, the battery cell B side refers to a measurement location where status information of the battery cell B can be measured, and for example, collectively refers to the battery cell B itself or a configuration thermally and / or electrically connected to the battery cell B. In various embodiments of the present invention, the battery cell B side includes the battery cell B itself or a bus bar electrically connected to the battery cell B, where the bus bar is a configuration that electrically connects different battery cells B, is thermally and / or electrically connected to the battery cell B, and can transmit status information of the battery cell B to the sensing element 40 via the sensing terminal 30.

[0069] In one embodiment of the present invention, the sensing terminal 30 may be directly coupled to the battery cell B itself, and the sensing terminal 30 may be coupled to an outer surface of the case 10 forming the outer shape of the battery cell B. In one embodiment of the present invention, the sensing terminal 30 is coupled to a terminal surface 11 on the outer surface of the case 10 on which the electrodes E1 and E2 are formed, and the terminal surface 11 to which the sensing terminal 30 is coupled is insulated from the electrodes E1 and E2 of the battery cell B and corresponds to a position outside the charge / discharge path of the battery cell B, and can sensitively capture state information of the battery cell B outside Joule heat due to the charge / discharge power of the battery cell B. In this respect, the configuration in which the terminal surface 11 of the battery cell B is used as a measurement point in one embodiment of the present invention can increase reliability of state information of the battery cell B compared to an embodiment in which a bus bar forming a charge / discharge path of the battery cell B is used as a measurement point.

[0070] For reference, in one embodiment of the present invention, the battery cell B includes an internal electrode assembly (not shown) and a case 10 that accommodates the internal electrode assembly (not shown), and the case 10 includes main surfaces 13 formed facing each other between adjacent battery cells B along a first direction Z1, and may further include a bottom surface 12 opposite to a terminal surface 11 on which the electrodes E1 and E2 are formed, and a side surface 14 that connects the terminal surface 11 and the bottom surface 12 to each other and has an area narrower than the main surface 13.

[0071] In one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 forming the sensing unit 25 extend to different lengths along the first direction Z1. For example, the sensing substrate 20 extends from the first position P1 to the second position P2 along the first direction Z1, and does not extend beyond the second position P2 to a fourth position P4. In one embodiment of the present invention, the sensing substrate 20 extends from the first position P1 to the second position P2 along the first direction Z1. Unlike the sensing substrate 20, the sensing terminal 30 extends from the first position P1 to the fourth position P4 beyond the second position P2 along the first direction Z1, and may form a connection with the battery cell B side at the fourth position P4 beyond the sensing substrate 20. That is, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 forming the sensing unit 25 may be arranged to overlap each other from the first position P1 to the second position P2. However, the sensing substrate 20 in which the through-hole 20' is formed at the third position P3 does not overlap with the sensing terminal 30 passing through the through-hole 20'.

[0072] 4, the sensing substrate 20 and the sensing terminal 30 forming the sensing unit 25 are bonded to each other at first and second positions P1 and P2 by adhesion and thermal bonding, for example, by adhesion at the first position P1 and thermal bonding at the second position P2. For example, an adhesive member 60 is disposed on the sensing terminal 30 disposed opposite the sensing substrate 20 at the first position P1, and a bonding pad (second bonding pad S2) is formed on the sensing substrate 20 disposed opposite the sensing terminal 30 at the second position P2. The bonding pad (second bonding pad S2) also corresponds to a metal layer formed on the sensing substrate 20 at the second position P2. The sensing substrate 20 includes a first bonding pad S1 formed corresponding to an electrode of the sensing element 40 to be connected to the sensing element 40 at a first position P1, and a second bonding pad S2 formed with a wide area covering the sensing terminal 30 to be connected to the sensing terminal 30 at a second position P2, and the bonding pads S1 and S2 also correspond to a metal layer formed on an insulating substrate forming the sensing substrate 20. In addition to the bonding pads S1 and S2, the insulating substrate may further include a conductive line L electrically connected to the bonding pads S1 and S2. Also, reference numeral 30' denotes a bonding hole formed in the sensing terminal 30 to provide a bonding (soldering) between the sensing terminal 30 and the sensing substrate 20.

[0073] 7 is a diagram showing the assembly of the sensing unit 25 shown in FIG. 7, the sensing substrate 20 and the sensing terminal 30 forming the sensing portion 25 are assembled at positions corresponding to each other. For example, the sensing terminal 30 is sandwiched in the through hole 20' of the sensing substrate 20 so that the first to third positions P1, P2, and P3 of the sensing substrate 20 correspond to the first to third positions P1', P2', and P3' of the sensing terminal 30. In FIG. 7, the first to third positions P1, P2, and P3 of the sensing substrate 20 are used as a reference. Although the third positions P1', P2', and P3' are shown to be aligned, it is sufficient that the sensing substrate 20 and the sensing terminal 30 at the first to third positions P1, P2, P3, P1', P2', and P3' are aligned with each other through relative positional alignment, and the fourth position P4' of the sensing terminal 30 can be exposed from the third position P3 while being sandwiched in the through hole 20' of the sensing substrate 20 and connected onto the terminal surface 11 of the battery cell B.

[0074] Fig. 8 is a perspective view of a sensing unit according to another embodiment of the present invention, Figs. 9 and 10 are views showing different upper and lower surfaces of the sensing unit shown in Fig. 8, and Fig. 11 is a cross-sectional view taken along line XI-XI in Fig. 8.

[0075] Hereinafter, a battery pack according to another embodiment of the present invention will be described with reference to Figs. 8 to 11. Referring to the drawings, in another embodiment of the present invention, the sensing board 120 and the sensing terminal 130 forming the sensing unit 125 may be bonded to each other at the first and second positions P1 and P2 by thermocompression or lamination. For example, the sensing board 120 and the sensing terminal 130 are arranged to overlap each other along the first direction Z1, except for the third position P3 where the through hole 120' is formed and the fourth position P4 where the connection with the battery cell B is formed, and thermocompression or lamination is performed over the entire overlapping area along the first direction Z1. Thus, unlike the embodiment shown in Fig. 4, in the embodiment of Fig. 11, a separate bonding pad (the second bonding pad S2 of Fig. 4) is not formed at the second position P2. An adhesive member 70 may be interposed between the sensing substrate 120 and the sensing terminal 130 where the thermocompression bonding or lamination is performed, and the adhesive member 70 may be interposed between the sensing substrate 120 in the upper position and the sensing terminal 130 in the lower position at the first position P1, and between the sensing terminal 130 in the upper position and the sensing substrate 120 in the lower position at the second position P2. However, in addition to the first and second positions P1 and P2, the adhesive member 70 may be formed over the entire area between the sensing substrate 120 and the sensing terminal 130 overlapping each other.

[0076] For example, in the embodiment shown in FIG. 4, the sensing substrate 20 and the sensing terminal 30 are bonded separately at the first and second positions P1 and P2, whereas in the embodiment shown in FIG. 11, the sensing substrate 120 and the sensing terminal 130 are bonded collectively at the first and second positions P1 and P2, for example, thermocompression bonding or lamination may be performed collectively over the entire area between the sensing substrate 120 and the sensing terminal 130 that overlap each other, including the first and second positions P1 and P2.

[0077] The present invention has been described with reference to the embodiments shown in the accompanying drawings, but this is merely illustrative, and those skilled in the art to which the present invention pertains will appreciate that various modifications and equivalent alternative embodiments are possible. [Explanation of symbols]

[0078] 11 Terminal surface 20 Sensing Board 21 Sensor board body 22 Sensor board connection 25 Sensing part 30 Sensing terminal 40 Sensing element 60,70 Adhesive material B. Battery cell F2, F3 deformation section L Conductive Line P1 1st position P2 2nd position P3 3rd position P4 4th position S1 First Bonding Pad S2 Second Bonding Pad W Welding

Claims

1. A battery cell; A sensing unit for obtaining status information of the battery cell, a sensing substrate extending side by side along a first direction and including first locations at which sensing elements are formed; a sensing terminal connected to the sensing substrate at a second position different from the first position and connected to a side of the battery cell to capture the state information; The sensing substrate and the sensing terminal are i) overlapping one another at said first and second locations; ii) a sensing portion extending in a second direction in which the first and second positions overlap each other and cross each other such that the up-down positions are inverted, The battery pack, wherein the sensing elements are formed on a top surface of a sensing substrate opposite the battery cells.

2. In the first position, a sensing substrate on which the sensing element is formed and a sensing terminal are disposed at an upper position opposite to a battery cell and a lower position facing the battery cell, respectively; The battery pack of claim 1 , wherein, in the second position, the sensing board and the sensing terminal are disposed at a lower position facing the battery cell and an upper position opposite the battery cell, respectively.

3. The battery pack of claim 1 , wherein at least one of the sensing board and the sensing terminal includes a deformation portion for connecting upper and lower positions that are inverted to each other at the first and second positions.

4. The battery pack according to claim 3 , wherein the deformation portion connects the upper and lower positions that are inverted to each other at the first and second positions with a step or with an inclination.

5. 4. The battery pack according to claim 3, wherein the sensing board includes a deformation portion that intersects with the sensing terminal and connects between a position above the sensing terminal at the first position and a position below the sensing terminal at the second position.

6. 4. The battery pack according to claim 3, wherein the sensing terminal includes a deformation portion for intersecting the sensing board and connecting between a position below the sensing board at the first position and a position above the sensing board at the second position.

7. 4. The battery pack of claim 3, wherein a through hole through which the sensing terminal passes is formed at a third position between the first and second positions of the sensing board along the first direction such that the sensing board and the sensing terminal cross each other.

8. The battery pack according to claim 7 , wherein the deformation portion is formed within the through hole.

9. 8. The battery pack of claim 7, wherein a periphery of the through hole of the sensing board extending along the first direction to surround the through hole at a position outside the through hole of the sensing board along a third direction intersecting the first and second directions, and a through portion of the sensing terminal penetrating the through hole intersect with each other.

10. 10. The battery pack of claim 9, wherein at least one of the periphery of the through hole and the through portion extends obliquely to connect between upper and lower positions that are inverted to each other at the first and second positions and crosses each other.

11. 10. The battery pack of claim 9, wherein the periphery of the through hole and the through portion extend inclinedly in opposite directions to connect between upper and lower positions that are inverted to each other at the first and second positions, and cross each other.

12. The battery pack according to claim 1 , wherein the sensing substrate and the sensing terminal are coupled to each other by thermocompression or laminating.

13. Along the first direction, the sensing substrate extends from the first location to a second location; 2. The battery pack according to claim 1, wherein the sensing terminal extends from the first position to a fourth position offset from the second position.

14. The battery pack of claim 13, wherein the sensing terminal is connected to a side of the battery cell at a fourth position spaced apart from the sensing board along the first direction.

15. The battery pack according to claim 14, wherein the sensing terminal is connected to a terminal surface of a battery cell on which an electrode is formed.

16. The battery pack according to claim 15, wherein a weld is formed between the sensing terminal and a terminal surface of the battery cell.

17. The battery pack according to claim 1 , wherein a metal layer including a first bonding pad for connection with the sensing element is formed at a first position of the sensing substrate.

18. The battery pack of claim 17, wherein a first adhesive member for coupling with the sensing terminal is interposed at a first position of the sensing board.

19. In the first position, a metal layer including the first bonding pad is formed on an upper surface of the sensing substrate opposite to the battery cell; The battery pack of claim 18, wherein the first adhesive member is formed on a lower surface of the sensing substrate facing the battery cell.

20. The battery pack according to claim 1 , wherein a metal layer including a second bonding pad for coupling with the sensing terminal is formed at a second location of the sensing substrate.

21. The battery pack of claim 1 , wherein a second adhesive member is interposed at a second position of the sensing board for coupling with the sensing terminal.

22. A metal layer including a first bonding pad and a second bonding pad for connection to a sensing element and a sensing terminal, respectively, is formed at a first and a second position of the sensing substrate; The battery pack of claim 1 , wherein the metal layer including the first and second bond pads is formed together on a top surface of a sensing substrate opposite the battery cell.

23. The sensing substrate comprises: The battery pack according to claim 22, wherein a lower surface facing the battery cell is formed as a one-sided circuit board not including the metal layer.

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