Display device

Abstract

To provide a display device that enables easily darkening a sub-pixel in which a defect occurs.SOLUTION: A display device includes: a substrate that includes a plurality of sub-pixels; a pixel circuit that is disposed in the plurality of sub-pixels on the substrate; a first light emitting element that is disposed in the plurality of sub-pixels, disposed on one side of the pixel circuit, and includes a first electrode, a semiconductor layer and a second electrode; a second light emitting element that is disposed in the plurality of sub-pixels, disposed on other side of the pixel circuit, and includes the first electrode, the semiconductor layer and the second electrode; and a pixel electrode that is electrically connected to the pixel circuit and extends to the first light emitting element and the second light emitting element. Thus the light emitting element of the defective sub-pixel can be easily repaired.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present specification relates to a display device, and more particularly to a repairable display device. [Background technology]

[0002] Display devices used in computer monitors, TVs, mobile phones, etc. include organic light emitting displays (OLEDs), which emit light themselves, and liquid crystal displays (LCDs), which require a separate light source.

[0003] Display devices are now used in a wide variety of applications, including not only computer monitors and TVs but also personal portable devices. Research is currently underway into display devices that have a large display area while being reduced in volume and weight.

[0004] In recent years, displays that include LEDs have been attracting attention as the next generation of display devices. LEDs are made of inorganic materials, not organic materials, so they are highly reliable and have a longer lifespan than LCDs and OLEDs. LEDs not only light up quickly, but also have excellent luminous efficiency, strong impact resistance, excellent stability, and can display high brightness images. Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a display device capable of easily darkening a defective sub-pixel.

[0006] Another problem to be solved by the present disclosure is to provide a display device capable of repairing a light emitting element of a sub-pixel having a color mixing defect during a welding process.

[0007] Another problem to be solved by the present specification is to provide a display device that can easily connect a light emitting element connected to a defective pixel circuit and a light emitting element of a sub-pixel having a color mixing defect to a pixel circuit that normally drives the light emitting element by using an assembly electrode.

[0008] The subject of the present specification is not limited to the subject mentioned above, and other subjects not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0009] A display device according to an embodiment of the present specification includes a substrate including a plurality of sub-pixels, a pixel circuit disposed in the plurality of sub-pixels on the substrate, a first light-emitting element disposed in the plurality of sub-pixels on one side of the pixel circuit and including a first electrode, a semiconductor layer, and a second electrode, a second light-emitting element disposed in the plurality of sub-pixels on the other side of the pixel circuit and including the first electrode, a semiconductor layer, and a second electrode, and a pixel electrode electrically connected to the pixel circuit and extending to the first light-emitting element and the second light-emitting element. Thus, it is possible to easily repair a light-emitting element of a defective sub-pixel.

[0010] Further details of the embodiments are included in the detailed description and the drawings. Effect of the Invention

[0011] In the present specification, the defective sub-pixel is darkened by a welding process, and then a repair process can be performed.

[0012] In the present specification, even if a light emitting device is arranged in an undesired sub-pixel due to different sizes of the light emitting device, the corresponding light emitting device can be used normally.

[0013] In the present specification, the light emitting element of the defective sub-pixel can be easily connected to the pixel circuit of the normal sub-pixel by using the assembly electrode.

[0014] In the present specification, the repair process is performed using the assembly electrodes and pixel electrodes without a separate structure just for the repair process, so that the structure of the display device can be simplified.

[0015] The effects of the present specification are not limited to the above-mentioned examples, and various other effects are included in the present specification. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a schematic diagram illustrating a configuration of a display device according to an embodiment of the present specification. [Diagram 2] FIG. 1 is an enlarged plan view of a display device according to an embodiment of the present specification. [Diagram 3] 3 is a cross-sectional view taken along lines AA' and BB' in FIG. 2. [Figure 4] FIG. 3 is a cross-sectional view taken along the line CC' in FIG. [Diagram 5] FIG. 11 is a cross-sectional view of a display device according to another embodiment of the present specification. [Figure 6] FIG. 13 is an enlarged plan view of a display device according to still another embodiment of the present specification. [Figure 7] FIG. 7 is a cross-sectional view taken along the line DD' in FIG. [Figure 8] FIG. 13 is an enlarged plan view of a display device according to still another embodiment of the present specification. [Figure 9] 9 is a cross-sectional view taken along the line EE' in FIG. 8. [Figure 10] FIG. 13 is an enlarged plan view of a display device according to still another embodiment of the present specification. [Figure 11] 11 is a cross-sectional view taken along the line FF' in FIG. [Figure 12] FIG. 13 is an enlarged plan view of a display device according to still another embodiment of the present specification. [Figure 13] 13 is a cross-sectional view taken along line GG' of FIG. 12. [Figure 14] FIG. 13 is an enlarged plan view of a display device according to still another embodiment of the present specification. [Figure 15] 15 is a cross-sectional view taken along the line HH' in FIG. 14. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] The advantages and features of the present invention, and the methods for achieving the same, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. The embodiments are provided solely for the purpose of making the disclosure of the present invention complete and fully conveying the scope of the invention to those skilled in the art to which the present invention pertains.

[0018] The shapes, areas, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are illustrative, and the specification is not limited to the matters illustrated. The same reference symbols refer to the same components throughout the specification. In addition, in explaining this specification, if it is determined that a specific description of related known technology may unnecessarily cloud the gist of this specification, the detailed description will be omitted. When "includes," "has," "is made," etc. are used in this specification, other parts may be added since "only" is not used. When a component is expressed in the singular, it includes the case where it includes a plural, unless otherwise expressly stated.

[0019] When interpreting elements, they are interpreted as including a margin of error even if there is no other explicit description.

[0020] When describing a positional relationship, for example when describing the positional relationship of two parts using "on top of," "at the top of," "at the bottom of," "next to," etc., one or more other parts may be located between the two parts, so long as "immediately" or "directly" is not used.

[0021] When an element or layer is referred to as "on" another element or layer, this includes the case where the element or layer is directly on top of the other element, or has other layers or elements interposed therebetween.

[0022] In addition, although the terms "first", "second" and the like are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, the first component referred to below may be the second component within the technical concept of this specification.

[0023] Like reference numbers refer to like elements throughout the specification.

[0024] The area and thickness of each component shown in the drawings are shown for convenience of explanation, and the present specification is not necessarily limited to the area and thickness of the components shown.

[0025] The features of the various embodiments of this specification may be combined or combined with each other, either partially or in whole, and may be technically interlocked and driven in various ways, and each embodiment may be implemented independently of each other or may be implemented together in a related relationship.

[0026] Various embodiments of the present specification will now be described in detail with reference to the accompanying drawings.

[0027] FIG. 1 is a schematic plan view of a display device according to an embodiment of the present specification.

[0028] For ease of explanation, FIG. 1 shows only a display panel PN, a gate driver GD, a data driver DD, and a timing controller TC among various components of the display device 100.

[0029] Referring to FIG. 1, a display device 100 includes a display panel PN including a plurality of sub-pixels SP, a gate driver GD and a data driver DD for supplying various signals to the display panel PN, and a timing controller TC for controlling the gate driver GD and the data driver DD.

[0030] The display panel PN is a component for displaying an image to a user and includes a plurality of sub-pixels SP. A plurality of scan lines SL and a plurality of data lines DL cross each other in the display panel PN, and each of the sub-pixels SP is connected to the scan lines SL and the data lines DL. In addition, each of the sub-pixels SP may be connected to a high potential power supply line VDD, a low potential power supply line, a reference line RL, etc.

[0031] The sub-pixels SP are the minimum units constituting a screen, and each of the sub-pixels SP includes a light-emitting element and a pixel circuit for driving the light-emitting element. The light-emitting elements may be defined differently depending on the type of the display panel PN. For example, when the display panel PN is an inorganic light-emitting display panel, the light-emitting element may be an LED (Light-emitting Diode) or a micro LED (Micro Light-emitting Diode).

[0032] The gate driver GD supplies a plurality of scan signals SCAN to a plurality of scan lines SL in response to a plurality of gate control signals GCS provided by a timing controller TC. Although one gate driver GD is shown to be disposed separately on one side of the display panel PN in FIG. 1, the number and arrangement of the gate driver GD are not limited thereto.

[0033] The data driver DD converts image data RGB input from the timing controller TC into data voltages Vdata using a reference gamma voltage in response to a plurality of data control signals DCS provided from the timing controller TC. The data driver DD can supply the converted data voltages Vdata to a plurality of data lines DL.

[0034] The timing controller TC aligns externally input image data RGB and supplies it to the data driver DD. The timing controller TC can generate gate control signals GCS and data control signals DCS using externally input synchronous signals, for example, a dot clock signal, a data enable signal, and a horizontal / vertical synchronous signal. The timing controller TC can then supply the generated gate control signals GCS and data control signals DCS to the gate driver GD and data driver DD, respectively, to control the gate driver GD and data driver DD.

[0035] In the following, reference will be made jointly to FIGS. 2 to 4 for a more detailed description of the display panel PN of the display device 100. FIG.

[0036] FIG 2 is an enlarged plan view of a display device according to an embodiment of the present specification. FIG 3 is a cross-sectional view taken along lines A-A' and B-B' in FIG 2. FIG 4 is a cross-sectional view taken along line C-C' in FIG 2. Referring to FIG 2, each of the sub-pixels SP includes a first transistor T1, a second transistor T2, a third transistor T3, a storage capacitor Cst, and one or more light-emitting elements LED. In FIG 3, for the sake of simplicity, hatching of the assembly electrode 120, the pixel electrode PE, and the light-emitting element LED is omitted, and the chip contact electrode CCE is omitted.

[0037] Referring to FIG. 2, the display device 100 includes a plurality of sub-pixels SP, which are repeated in the row direction, including a first sub-pixel SP1 arranged in a first column, a second sub-pixel SP2 arranged in a second column, and a third sub-pixel SP3 arranged in a third column.

[0038] Each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may include a light-emitting element LED and a pixel circuit and independently emit light. For example, the first sub-pixel SP1 may be a red sub-pixel, the second sub-pixel SP2 may be a green sub-pixel, and the third sub-pixel SP3 may be a blue sub-pixel, but is not limited thereto. In addition, the pixel circuit may include a first transistor T1, a second transistor T2, a third transistor T3, and a storage capacitor Cst.

[0039] The display panel PN includes a substrate 110, a buffer layer 111, a gate insulating layer 112, an interlayer insulating layer 113, a first passivation layer 114, a first planarization layer 115, a second passivation layer 116, a third passivation layer 117, and a second planarization layer 118.

[0040] The substrate 110 is a component for supporting various components included in the display panel PN and may be made of an insulating material. For example, the substrate 110 may be made of glass, resin, etc. The substrate 110 may also be made of a material including a polymer or plastic and having flexibility.

[0041] On the substrate 110, a high potential power supply line VDD, a plurality of data lines DL, a reference line RL, an assembly electrode 120, a light shielding layer LS, and a first capacitor electrode SC1 are arranged.

[0042] The high potential power supply wiring VDD is a wiring that transmits a high potential power supply voltage to each of the sub-pixels SP. The multiple high potential power supply wirings VDD can transmit the high potential power supply voltage to the second transistor T2 of each of the sub-pixels SP. The high potential power supply wiring VDD can extend along the column direction between the multiple sub-pixels SP. For example, the high potential power supply wiring VDD can be disposed along the column direction between the first sub-pixel SP1 and the third sub-pixel SP3. The high potential power supply wiring VDD can transmit the high potential power supply voltage to each of the multiple sub-pixels SP arranged in the row direction through an auxiliary high potential power supply wiring VDDA described later. In this case, the high potential power supply wiring VDD can be referred to as a first power supply wiring. The column direction can be referred to as a first direction, and the row direction can be referred to as a second direction.

[0043] The data lines DL are lines that transmit data voltages Vdata to the subpixels SP, respectively. The data lines DL may be connected to the first transistors T1 of the subpixels SP, respectively. The data lines DL may extend in the column direction between the subpixels SP. For example, the data line DL extending in the column direction between the first subpixel SP1 and the high potential power line VDD may transmit the data voltage Vdata to the first subpixel SP1, the data line DL disposed between the first subpixel SP1 and the second subpixel SP2 may transmit the data voltage Vdata to the second subpixel SP2, and the data line DL disposed between the third subpixel SP3 and the high potential power line VDD may transmit the data voltage Vdata to the third subpixel SP3.

[0044] The reference line RL is a line that transmits a reference voltage to each of the subpixels SP. The reference line RL may be connected to the third transistor T3 of each of the subpixels SP. The reference line RL may extend in the column direction between the subpixels SP. For example, the reference line RL may extend in the column direction between the second subpixel SP2 and the third subpixel SP3. The third drain electrodes DE3 of the third transistors T3 of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 adjacent to the reference line RL may extend in the row direction and be electrically connected to the reference line RL. In this case, the reference line RL may be referred to as a third power supply line.

[0045] In each of the sub-pixels SP, a light blocking layer LS is disposed on the substrate 110. The light blocking layer LS may block light incident on a transistor below the substrate 110 to minimize leakage current. For example, the light blocking layer LS may block light incident on a second active layer ACT2 of a second transistor T2, which is a driving transistor.

[0046] In each of the sub-pixels SP, a first capacitor electrode SC1 is disposed on the substrate 110. The first capacitor electrode SC1 may form a storage capacitor Cst together with other capacitor electrodes. The first capacitor electrode SC1 may be formed integrally with the light blocking layer LS.

[0047] A buffer layer 111 is disposed on the high potential power supply line VDD, the plurality of data lines DL, the reference line RL, the light shielding layer LS, and the first capacitor electrode SC1. The buffer layer 111 can reduce the penetration of moisture or impurities through the substrate 110. The buffer layer 111 can be, for example, but is not limited to, a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx). However, the buffer layer 111 may be omitted depending on the type of substrate 110 or the type of transistor, and is not limited to this.

[0048] First, a first transistor T1 is disposed on the buffer layer 111 in each of the sub-pixels SP. The first transistor T1 is a transistor that transmits a data voltage Vdata to a second gate electrode GE2 of the second transistor T2. The first transistor T1 may be turned on by a scan signal from a scan line SL, and the data voltage Vdata may be transmitted from a data line DL to the second gate electrode GE2 of the second transistor T2 through the turned-on first transistor T1. Therefore, the first transistor T1 may be referred to as a switching transistor.

[0049] The first transistor T1 includes a first active layer ACT1, a first gate electrode GE1, a first source electrode SE1, and a first drain electrode DE1.

[0050] A first active layer ACT1 is disposed on the buffer layer 111. The first active layer ACT1 may be made of a semiconductor material such as, but not limited to, an oxide semiconductor, amorphous silicon, or polysilicon.

[0051] A gate insulating layer 112 is disposed on the first active layer ACT1. The gate insulating layer 112 is an insulating layer for insulating the first active layer ACT1 and the first gate electrode GE1, and may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0052] A first gate electrode GE1 is disposed on the gate insulating layer 112. The first gate electrode GE1 may be electrically connected to the scan line SL. The first gate electrode GE1 may be made of a conductive material, for example, but is not limited to, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof.

[0053] An interlayer insulating layer 113 is disposed on the first gate electrode GE1. Contact holes are formed in the interlayer insulating layer 113 for connecting the first source electrode SE1 and the first drain electrode DE1 to the first active layer ACT1. The interlayer insulating layer 113 is an insulating layer for protecting the components below the interlayer insulating layer 113, and may be formed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0054] A first source electrode SE1 and a first drain electrode DE1 electrically connected to the first active layer ACT1 are disposed on the interlayer insulating layer 113. The first drain electrode DE1 may be connected to the data line DL and the first active layer ACT1, and the first source electrode SE1 may be connected to the first active layer ACT1 and the second gate electrode GE2 of the second transistor T2. The first source electrode SE1 and the first drain electrode DE1 may be made of a conductive material, for example, but not limited to, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof.

[0055] A second transistor T2 is disposed on the buffer layer 111 in each of the sub-pixels SP. The second transistor T2 is a transistor that supplies a driving current to the light-emitting element LED. The second transistor T2 can be turned on to control the driving current flowing through the light-emitting element LED. Therefore, the second transistor T2 that controls the driving current can be referred to as a driving transistor.

[0056] The second transistor T2 includes a second active layer ACT2, a second gate electrode GE2, a second source electrode SE2, and a second drain electrode DE2.

[0057] A second active layer ACT2 is disposed on the buffer layer 111. The second active layer ACT2 may be made of a semiconductor material such as, but not limited to, an oxide semiconductor, amorphous silicon, or polysilicon.

[0058] A gate insulating layer 112 is disposed on the second active layer ACT2, and a second gate electrode GE2 is disposed on the gate insulating layer 112. The second gate electrode GE2 may be electrically connected to the first source electrode SE1 of the first transistor T1. The second gate electrode GE2 may be made of a conductive material, for example, but is not limited to, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof.

[0059] An interlayer insulating layer 113 is disposed on the second gate electrode GE2, and a second source electrode SE2 and a second drain electrode DE2 electrically connected to the second active layer ACT2 are disposed on the interlayer insulating layer 113. The second drain electrode DE2 may be electrically connected to the second active layer ACT2 and a high potential power wiring VDD, and the second source electrode SE2 may be electrically connected to the second active layer ACT2 and the light emitting element LED. The second source electrode SE2 and the second drain electrode DE2 may be made of a conductive material, for example, but not limited to, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof.

[0060] A third transistor T3 is disposed on the buffer layer 111 in each of the sub-pixels SP. The third transistor T3 is a transistor for compensating for a threshold voltage of the second transistor T2. The third transistor T3 is connected between the second source electrode SE2 of the second transistor T2 and a reference line RL. The third transistor T3 is turned on to transmit a reference voltage to the second source electrode SE2 of the second transistor T2 to sense the threshold voltage of the second transistor T2. Thus, the third transistor T3 sensing the characteristic of the second transistor T2 may be referred to as a sensing transistor.

[0061] The third transistor T3 includes a third active layer ACT3, a third gate electrode GE3, a third source electrode SE3 and a third drain electrode DE3.

[0062] A third active layer ACT3 is disposed on the buffer layer 111. The third active layer ACT3 may be made of a semiconductor material such as, but not limited to, an oxide semiconductor, amorphous silicon, or polysilicon.

[0063] A gate insulating layer 112 is disposed on the third active layer ACT3, and a third gate electrode GE3 is disposed on the gate insulating layer 112. The third gate electrode GE3 may be electrically connected to a scan line SL. The third gate electrode GE3 may be made of a conductive material, for example, but is not limited to, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof.

[0064] An interlayer insulating layer 113 is disposed on the third gate electrode GE3, and a third source electrode SE3 and a third drain electrode DE3 electrically connected to the third active layer ACT3 are disposed on the interlayer insulating layer 113. The third drain electrode DE3 may be electrically connected to the third active layer ACT3 and a reference line RL, and the third source electrode SE3 may be electrically connected to the third active layer ACT3 and a second source electrode SE2 of the second transistor T2. The third source electrode SE3 and the third drain electrode DE3 may be made of a conductive material, for example, but not limited to, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof.

[0065] The first transistor T1 and the third transistor T3 shown in FIG. 2 are both transistors connected to and controlled by the scan line SL, but are not limited thereto, and the pixel circuit may include a transistor connected to an emission line to which an emission control signal is applied.

[0066] A second capacitor electrode SC2 is disposed on the gate insulating layer 112. The second capacitor electrode SC2 is one of electrodes forming the storage capacitor Cst and may be disposed to overlap the first capacitor electrode SC1. The second capacitor electrode SC2 may be integrally formed with the second gate electrode GE2 of the second transistor T2 and may be electrically connected to the second gate electrode GE2. The first capacitor electrode SC1 and the second capacitor electrode SC2 may be disposed spaced apart from each other with the buffer layer 111 and the gate insulating layer 112 interposed therebetween.

[0067] On the interlayer insulating layer 113, a plurality of scan lines SL, an auxiliary high potential power supply line VDDA, and a third capacitor electrode SC3 are arranged.

[0068] First, the scan line SL is a line that transmits a scan signal SCAN to each of the sub-pixels SP. The scan line SL may extend in a row direction across the sub-pixels SP. The scan line SL may be electrically connected to the first gate electrode GE1 of the first transistor T1 and the third gate electrode GE3 of the third transistor T3 of each of the sub-pixels SP.

[0069] An auxiliary high potential power supply wiring VDDA is disposed on the interlayer insulating layer 113. The auxiliary high potential power supply wiring VDDA may be disposed extending in the row direction across the sub-pixels SP. The auxiliary high potential power supply wiring VDDA may be electrically connected to the high potential power supply wiring VDD extending in the column direction and the second drain electrodes DE2 of the second transistors T2 of the sub-pixels SP disposed along the row direction.

[0070] A third capacitor electrode SC3 is disposed on the interlayer insulating layer 113. The third capacitor electrode SC3 is an electrode forming the storage capacitor Cst, and may be disposed to overlap the first capacitor electrode SC1 and the second capacitor electrode SC2. The third capacitor electrode SC3 may be integrally formed with the second source electrode SE2 of the second transistor T2 and may be electrically connected to the second source electrode SE2. The second source electrode SE2 may also be electrically connected to the first capacitor electrode SC1 through a contact hole formed in the interlayer insulating layer 113 and the buffer layer 111. Thus, the first capacitor electrode SC1 and the third capacitor electrode SC3 may be electrically connected to the second source electrode SE2 of the second transistor T2.

[0071] The storage capacitor Cst stores a potential difference between the second gate electrode GE2 and the second source electrode SE2 of the second transistor T2 while the light emitting element LED emits light, thereby allowing a constant current to be supplied to the light emitting element LED. The storage capacitor Cst includes a first capacitor electrode SC1 formed on the substrate 110 and connected to the second source electrode SE2, a second capacitor electrode SC2 formed on the buffer layer 111 and the gate insulating layer 112 and connected to the second gate electrode GE2, and a third capacitor electrode SC3 formed on the interlayer insulating layer 113 and connected to the second source electrode SE2, and can store a voltage between the second gate electrode GE2 and the second source electrode SE2 of the second transistor T2.

[0072] A first passivation layer 114 is disposed on the first transistor T1, the second transistor T2, the third transistor T3, and the storage capacitor Cst. The first passivation layer 114 is an insulating layer for protecting the components below the first passivation layer 114, and may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0073] A first planarization layer 115 is disposed on the first passivation layer 114. The first planarization layer 115 may planarize an upper portion of the substrate 110 on which the plurality of transistors T1, T2, T3 and the storage capacitor Cst are disposed. The first planarization layer 115 may be configured as a single layer or multiple layers and may be made of, for example, a photoresist or an acrylic organic material, but is not limited thereto.

[0074] A second passivation layer 116 is disposed on the first planarization layer 115. The second passivation layer 116 is an insulating layer for protecting the structure below the second passivation layer 116, and may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. A connecting electrode 150 and a plurality of assembly electrodes 120 are disposed on the second passivation layer 116 .

[0075] The connecting electrode 150 is an electrode that electrically connects the second transistor T2 and the pixel electrode PE. The connecting electrode 150 is the second source electrode SE2 and may be electrically connected to the third capacitor electrode SC3 through contact holes formed in the second passivation layer 116, the first planarization layer 115, and the first passivation layer 114.

[0076] The connecting electrode 150 may have a multi-layer structure including a first connecting layer 150a and a second connecting layer 150b. The first connecting layer 150a is disposed on the second passivation layer 116, and the second connecting layer 150b is disposed to cover the first connecting layer 150a. The second connecting layer 150b may be disposed to surround all of the top and side surfaces of the first connecting layer 150a.

[0077] The second connecting layer 150b is made of a material that is more resistant to corrosion than the first connecting layer 150a, and can minimize short circuit defects caused by migration between the first connecting layer 150a and adjacent wiring during the manufacture of the display device 100. For example, the first connecting layer 150a can be made of a conductive material such as copper (Cu) or chromium (Cr), and the second connecting layer 150b can be made of molybdenum (Mo), molybdenum titanium (MoTi), etc., but is not limited thereto.

[0078] A plurality of assembly electrodes 120 are disposed on the second passivation layer 116 .

[0079] The electrode assembly 120 includes a first electrode assembly 122 and a second electrode assembly 123 .

[0080] The first assembly electrodes 122 and the second assembly electrodes 123 may extend in the column direction in each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3, and may be spaced apart from each other at regular intervals.

[0081] The first assembly electrode 122 may be disposed in a region corresponding to one side of the light-emitting element LED. The first assembly electrode 122 of the assembly electrode 120 may be disposed in a region overlapping with the low-potential power supply wiring and may be electrically connected to the low-potential power supply wiring. The low-potential power supply wiring is a wiring that transmits a low-potential power supply voltage to the light-emitting element LED. The low-potential power supply wiring may extend in the column direction in each of the multiple sub-pixels SP. For example, a low-potential power supply wiring may be disposed in each of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3.

[0082] The second electrode assembly 123 may be spaced apart from the first electrode assembly 122 and disposed in a region corresponding to the other side of the light-emitting element LED.

[0083] Each of the multiple assembled electrodes 120 includes a conductive layer 122a, 123a disposed on the second passivation layer 116, and a cladding layer 122b, 123b disposed on the conductive layers 122a, 123a and covering all the upper and side surfaces of the conductive layers 122a, 123a.

[0084] The first electrode assembly 122 includes a first conductive layer 122a and a first cladding layer 122b, and the second electrode assembly 123 includes a second conductive layer 123a and a second cladding layer 123b.

[0085] The first conductive layer 122a and the second conductive layer 123a may not overlap the light-emitting element LED, that is, the ends of the first conductive layer 122a and the second conductive layer 123a may be disposed outside the ends of the light-emitting element LED.

[0086] The first cladding layer 122b of the first electrode assembly 122 may be disposed to cover the upper and side surfaces of the first conductive layer 122a. In this case, the first cladding layer 122b and the second cladding layer 123b may extend from the ends of the first conductive layer 122a and the second conductive layer 123a toward the center of the light-emitting element LED and overlap with the light-emitting element LED. For example, the first cladding layer 122b and the second cladding layer 123b may be disposed to overlap an area corresponding to less than half of the area of ​​the lower surface of the light-emitting element LED.

[0087] The first conductive layer 122a and the second conductive layer 123a may be made of the same material and through the same process as the first connecting layer 150a of the connecting electrode 150. For example, the first conductive layer 122a and the second conductive layer 123a may be made of a conductive material such as copper (Cu) and chromium (Cr). The first clad layer 122b and the second clad layer 123b may be made of the same material and through the same process as the second connecting layer 150b of the connecting electrode 150. For example, the first clad layer 122b and the second clad layer 123b may be made of a material that is more resistant to corrosion than the first conductive layer 122a and the second conductive layer 123a, such as, but not limited to, molybdenum (Mo) or molybdenum titanium (MoTi).

[0088] A third passivation layer 117 is disposed on the connecting electrode 150 and the assembly electrode 120. The third passivation layer 117 is an insulating layer for protecting the structure below the third passivation layer 117, and may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0089] A plurality of light-emitting elements LEDs are disposed on the third passivation layer 117 .

[0090] The third passivation layer 117 may have a portion opened in a region adjacent to the plurality of light-emitting elements LED. For example, the third passivation layer 117 may have a portion opened in a region adjacent to one of both sides of the plurality of light-emitting elements LED. For example, the third passivation layer 117 may expose a portion of an upper surface of the first assembly electrode 122 in a region adjacent to one side of the plurality of light-emitting elements LED.

[0091] One or more light emitting elements LED are disposed in one sub-pixel SP on the third passivation layer 117. The light emitting element LED is an element that emits light by current. The light emitting element LED may include light emitting elements LED that emit red light, green light, blue light, etc., and various colors including white light may be realized by combining these light emitting elements LED. In addition, various colors of light may be realized by using a light emitting element LED that emits light of a specific color and a light conversion member that converts light from the light emitting element LED into light of another color.

[0092] The light emitting element LED can emit light by receiving a driving current from the second transistor T2. The size of the light emitting element LED can vary depending on the type of the light emitting element LED. In this case, the type of the light emitting element LED means the type of light emitted, so the size can vary depending on whether the light emitting element LED is a red light emitting element, a green light emitting element, or a blue light emitting element. The light emitting element can have different light emitting efficiency for each color it emits. Therefore, the size of the light emitting element LED can be determined depending on the efficiency of the light emitting element LED so that the light emitting elements emitting different colors can emit light with the same brightness.

[0093] For example, when the light emitting efficiency of a light emitting element that emits a specific color is relatively low, it can be formed to be larger than other light emitting elements so that it can emit light with the same luminance as the other light emitting elements. In Fig. 2, the size of the light emitting element LED arranged in the first sub-pixel SP1 is the largest, the size of the light emitting element LED arranged in the second sub-pixel SP2 is smaller than the size of the light emitting element LED arranged in the first sub-pixel SP1, and the size of the light emitting element LED arranged in the third sub-pixel SP3 is smaller than the size of the light emitting element LED arranged in the second sub-pixel SP2. In this case, the light emitting element LED arranged in the first sub-pixel SP1 may be a red light emitting element, the light emitting element LED arranged in the second sub-pixel SP2 may be a green light emitting element, and the light emitting element LED arranged in the third sub-pixel SP3 may be a blue light emitting element, but is not limited thereto.

[0094] In this case, the light emitting elements LED arranged in one sub-pixel SP may be connected in parallel, that is, one electrode of each of the light emitting elements LED may be connected to the source electrode SE2 of the same second transistor T2, and the other electrodes of each of the light emitting elements LED may be connected to the same assembly electrode 120.

[0095] The light emitting element LED may include a first light emitting element 130 and a second light emitting element 140. Meanwhile, the light emitting element LED arranged in each of the plurality of sub-pixels SP may be arranged to be spaced apart with a pixel circuit therebetween. Specifically, the first light emitting element 130 may be arranged on one side of the pixel circuit, and the second light emitting element 140 may be arranged on the other side of the pixel circuit. For example, as shown in FIG. 2, the first light emitting element 130 may be arranged on the upper side of the pixel circuit, and the second light emitting element 140 may be arranged on the lower side of the pixel circuit.

[0096] The first light emitting element 130 may emit the same color as the second light emitting element 140. In this case, since the first light emitting element 130 and the second light emitting element 140 are the same type of light emitting element LED, the size of the first light emitting element 130 may be the same as the size of the second light emitting element 140. Here, the size of the light emitting element LED may refer to the area of ​​the bottom surface of the light emitting element LED, the width on the cross section, the volume, the height, etc., but is not limited thereto.

[0097] In Figures 2 and 4, for convenience of explanation, two light-emitting elements LED are arranged in each of the multiple sub-pixels SP, but the number of light-emitting elements LED arranged in each of the multiple sub-pixels SP is not limited to this.

[0098] 3 and 4, the light emitting element 130 includes a first semiconductor layer 131, a light emitting layer 132, a second semiconductor layer 133, a first electrode 134, a second electrode 135, and a sealing layer 136.

[0099] A first semiconductor layer 131 is disposed on the third passivation layer 117, and a second semiconductor layer 133 is disposed on the first semiconductor layer 131. The first semiconductor layer 131 and the second semiconductor layer 133 may be layers formed by doping a specific material with n-type and p-type impurities. For example, the first semiconductor layer 131 and the second semiconductor layer 133 may be layers formed by doping a material such as gallium nitride (GaN), indium aluminum phosphide (InAlP), gallium arsenide (GaAs), etc. with p-type or n-type impurities. The p-type impurities may be magnesium (Mg), zinc (Zn), beryllium (Be), etc., and the n-type impurities may be silicon (Si), germanium (Ge), tin (Sn), etc., but are not limited thereto.

[0100] A portion of the first semiconductor layer 131 may be disposed to protrude outward from the second semiconductor layer 133. The top surface of the first semiconductor layer 131 may include a portion overlapping the bottom surface of the second semiconductor layer 133 and a portion disposed outside the bottom surface of the second semiconductor layer 133. However, the sizes and shapes of the first semiconductor layer 131 and the second semiconductor layer 133 may be modified in various ways and are not limited thereto.

[0101] The light emitting layer 132 is disposed between the first semiconductor layer 131 and the second semiconductor layer 133. The light emitting layer 132 can emit light by receiving holes and electrons from the first semiconductor layer 131 and the second semiconductor layer 133. The light emitting layer 132 can have a single layer or a multi-quantum well (MQW) structure and can be made of, for example, indium gallium nitride (InGaN) or gallium nitride (GaN), but is not limited thereto.

[0102] A first electrode 134 is disposed surrounding the bottom and side surfaces of the first semiconductor layer 131. The first electrode 134 is an electrode for electrically connecting the first light emitting element 130 and the assembly electrode 120. The first electrode 134 may be made of a conductive material, for example, a transparent conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), or an opaque conductive material such as titanium (Ti), gold (Au), silver (Ag), copper (Cu), or an alloy thereof, but is not limited thereto.

[0103] The second electrode 135 is disposed on an upper surface of the second semiconductor layer 133. The second electrode 135 is an electrode that electrically connects a pixel electrode PE (to be described later) and the second semiconductor layer 133. The second electrode 135 may be made of a conductive material, for example, a transparent conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), but is not limited thereto.

[0104] An encapsulation layer 136 is disposed to surround at least a portion of the first semiconductor layer 131, the light emitting layer 132, the second semiconductor layer 133, the first electrode 134, and the second electrode 135. The encapsulation layer 136 is made of an insulating material and can protect the first semiconductor layer 131, the light emitting layer 132, and the second semiconductor layer 133. The encapsulation layer 136 can be disposed to cover the light emitting layer 132, a portion of a side surface of the first semiconductor layer 131 adjacent to the light emitting layer 132, and a portion of a side surface of the second semiconductor layer 133 adjacent to the light emitting layer 132. The first electrode 134 and the second electrode 135 can be exposed from the encapsulation layer 136, and the first electrode 134 and the second electrode 135 can be electrically connected to a chip contact electrode CCE and a pixel electrode PE to be formed later.

[0105] An adhesive layer AD may be disposed between the light emitting elements LED and the third passivation layer 117 and the assembly electrode 120. The adhesive layer AD may be an organic film that temporarily fixes the light emitting elements LED during the self-assembly process of the light emitting elements LED. When the organic film covering the light emitting elements LED is formed during the manufacture of the display device 100, a portion of the organic film fills the space between the light emitting elements LED and the third passivation layer 117 and the assembly electrode 120, so that the light emitting elements LED can be temporarily fixed on the third passivation layer 117 and the assembly electrode 120. Even if the organic film is subsequently removed, a portion of the organic film that has seeped into the lower portion of the light emitting elements LED may remain without being removed and may become an adhesive layer. The adhesive layer AD may be made of an organic material, for example, a photoresist or an acrylic organic material, but is not limited thereto.

[0106] A chip contact electrode CCE is disposed on one surface of the light emitting element LED. The chip contact electrode CCE is an electrode for electrically connecting the light emitting element LED and the assembly electrode 120. The chip contact electrode CCE may be disposed to surround at least a portion of the first semiconductor layer 131 and the first electrode 134 of the light emitting element LED in a region overlapping with the first assembly electrode 122. In this case, the chip contact electrode CCE may be electrically connected to the first assembly electrode 122 exposed by the third passivation layer 117 in a region where the third passivation layer 117 is opened.

[0107] Meanwhile, the chip contact electrode CCE may not be disposed on the other side of the light emitting element LED. Thus, the first electrode 134 of the first light emitting element 130 and the first electrode 144 of the second light emitting element 140 may be electrically connected to the first assembly electrode 122, but may not be connected to the second assembly electrode 123 and may be directly insulated from the second assembly electrode 123.

[0108] A second planarization layer 118 is disposed on the light emitting element LED and the chip contact electrode CCE. The second planarization layer 118 flattens the upper surface of the substrate 110 on which the light emitting element LED is disposed, and can fix the light emitting element LED onto the substrate 110 together with the adhesive layer AD.

[0109] Thus, the second planarization layer 118 can be disposed so as to contact the chip contact electrode CCE on one surface of the light-emitting element LED, and can be disposed so as to contact the side surface of the light-emitting element LED on the other surface of the light-emitting element.

[0110] Meanwhile, in the drawings, the second planarization layer 118 is shown as a single layer, but is not limited thereto, and the second planarization layer 118 may be configured as a single layer or multiple layers, and may be made of, for example, photoresist or an acrylic-based organic material, but is not limited thereto.

[0111] The pixel electrode PE is disposed on the second planarization layer 118.

[0112] The pixel electrode PE is an electrode for electrically connecting the plurality of light emitting elements LED and the connecting electrode 150. Referring to Figures 2 to 4, the pixel electrode PE is electrically connected to the pixel circuit and is disposed extending to the first light emitting element 130 and the second light emitting element 140. That is, the pixel electrode PE may extend to the first light emitting element 130 and be connected to the second light emitting element 140, and may be electrically connected to the connecting electrode 150 and the second transistor T2 through a contact hole formed in the second planarization layer 118.

[0113] The pixel electrode PE may be made of a conductive material, for example, a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

[0114] 4, a second light emitting element 140 is disposed on the third passivation layer 117. The second light emitting element 140 is disposed in one sub-pixel SP together with the first light emitting element 130 and the driving circuit. The second light emitting element 140 is disposed in the sub-pixel SP in an opposite direction to the first light emitting element 130 with the pixel circuit at the center.

[0115] The second light emitting element 140 includes a first semiconductor layer 141, a light emitting layer 142, a second semiconductor layer 143, a first electrode 144, a second electrode 145, and a sealing layer 146. The first semiconductor layer 141, the light emitting layer 142, the second semiconductor layer 143, the second electrode 145, and the sealing layer 146 of the second light emitting element 140 may be substantially the same as the first semiconductor layer 131, the light emitting layer 132, the second semiconductor layer 133, the second electrode 135, and the sealing layer 136 of the first light emitting element 130. Therefore, a duplicated description will be omitted.

[0116] The second light emitting element 140 may be electrically connected to the first light emitting element 130 and the pixel electrode PE extending from the pixel circuit through a contact hole formed in the second planarization layer 118. Thus, in one subpixel SP, the first light emitting element 130 and the second light emitting element 140 may be electrically connected to the second transistor T2.

[0117] Meanwhile, when a display device is manufactured by using an assembly electrode to self-align light emitting devices inside an opening, color mixing defects may occur when light emitting devices emitting different colors are arranged in a single subpixel. At this time, the light emitting devices emitting different colors may have different sizes because the materials constituting the light emitting devices and the efficiencies of the materials are different. For example, a light emitting device having a relatively low light emitting efficiency may be formed to be larger than other light emitting devices so that it can emit light with the same luminance as light emitting devices emitting other colors. Thus, when the light emitting efficiency of a red light emitting device is the lowest, the red light emitting device may be formed to be relatively large, and when the light emitting efficiency of a blue light emitting device among the light emitting devices is the highest, the blue light emitting device may be formed to be relatively small.

[0118] Therefore, the size of the openings on the substrate where the light emitting elements are arranged may be arranged to correspond to the size of the light emitting elements, so that the elements emitting the same color may be self-aligned in the same sub-pixel. However, when the self-alignment process is performed in the above-mentioned manner, the light emitting elements having a relatively small size may be arranged in the openings where the light emitting elements having a relatively large size are arranged, i.e., in the sub-pixels emitting the other color. For example, a green light emitting element or a blue light emitting element having a smaller size than the red light emitting element may be arranged in the sub-pixel where the red light emitting element is arranged, and a blue light emitting element having a smaller size than the green light emitting element may be arranged in the sub-pixel where the green light emitting element is arranged. Therefore, there is a problem that color mixing defects may occur when light emitting elements emitting different colors are arranged in one sub-pixel, or when a light emitting element emitting an unintended color is arranged in one sub-pixel.

[0119] Therefore, when a color mixing defect occurs in a sub-pixel, the pixel electrode of the light-emitting element causing the color mixing defect can be disconnected to darken the incorrectly arranged light-emitting element. However, when a display device is configured in such a manner that a pixel electrode extends in one direction from a pixel circuit and is connected to a first light-emitting element and a second light-emitting element, if a defect occurs in a light-emitting element arranged at a distance from the pixel circuit, the pixel electrode between the light-emitting elements can be disconnected to darken the defective light-emitting element. On the other hand, when the light-emitting element arranged at a distance from the pixel circuit is a normal light-emitting element and another light-emitting element arranged between the pixel circuit and the normal light-emitting element is arranged at a distance from the pixel circuit, the pixel electrode is disconnected between the pixel circuit and the light-emitting element, and the normal light-emitting element arranged at a distance from the pixel circuit is also disconnected from the pixel circuit. As a result, the entirety of the multiple light-emitting elements arranged in the sub-pixel may be darkened, and the darkened area may be visually recognized by a user.

[0120] Therefore, in the display device 100 according to an embodiment of the present specification, a pair of light emitting elements LED arranged in each of the sub-pixels SP may be arranged to be spaced apart across the pixel circuit, so that only a single light emitting element LED may be connected to the pixel electrode PE extending from the center of the pixel circuit. For example, referring to FIG. 2, the first light emitting element 130 is arranged on the upper side of the pixel circuit, and the second light emitting element 140 is arranged on the lower side of the pixel circuit. When the display device 100 is configured in this manner, if one of the first light emitting element 130 and the second light emitting element 140 is misaligned, the other one can maintain connection to the pixel circuit. Therefore, in the display device 100 according to an embodiment of the present specification, only the misaligned light emitting element is selectively darkened, thereby improving the level of the darkened area perceived by the eye.

[0121] Meanwhile, FIG. 5 will be referred to for an explanation of a repair process in the case where one light emitting device is misaligned in the display device 100 described with reference to FIGS.

[0122] Fig. 5 is a cross-sectional view of a display device according to another embodiment of the present specification. Specifically, in Fig. 5, it is assumed that the first light emitting element 130 of the first light emitting element 130 and the second light emitting element 140 is misaligned. The display device 500 shown in Fig. 5 is substantially the same as the display device 100 shown in Figs. 1 to 4 except for the pixel electrode PE, and the other configurations are substantially the same, so a duplicated description will be omitted.

[0123] 5, the subpixel SP includes a first light emitting element 130 and a second light emitting element 140. Here, when the subpixel SP shown in FIG. 5 is a red subpixel, the second light emitting element 140 is a red light emitting element, but the first light emitting element 130 may be a blue light emitting element or a green light emitting element that emits a different color from the second light emitting element 140. Thus, the first light emitting element 130 and the second light emitting element 140 are light emitting elements LED that emit different colors, and the size of the first light emitting element 130 may be different from the size of the second light emitting element 140.

[0124] As described above, when the first light emitting element 130 is erroneously disposed in the sub-pixel SP, the electrical connection between the first light emitting element 130 and the pixel circuit must be cut off. Therefore, in the display device 500 according to another embodiment of the present specification, a cutting process may be performed to cut off the pixel electrode PE connecting the first light emitting element 130 and the pixel circuit.

[0125] For example, the pixel electrode PE may be disconnected by a laser irradiation method. Referring to FIG. 5, the pixel electrode PE is in a state of being separated between the first light emitting element 130, the pixel circuit, and the second light emitting element 140. Then, the pixel electrode PE is connected to one of the light emitting elements LED that is normally arranged among the first light emitting element 130 and the second light emitting element 140, i.e., the second light emitting element 140. Then, the second light emitting element 140, which is the normal light emitting element LED, may be emitted by the pixel circuit, and the first light emitting element 130, which is the light emitting element LED causing the color mixing defect, is not connected to the pixel circuit and does not emit light.

[0126] Meanwhile, in FIG. 5, it has been described on the assumption that the first light-emitting element 130 arranged at the upper part of the sub-pixel SP is a light-emitting element that causes color mixing defects, but this is not limited thereto. If the second light-emitting element 140 arranged at the lower part of the sub-pixel SP is a light-emitting element LED that causes color mixing defects, the pixel electrode PE between the pixel circuit and the second light-emitting element 140 can be separated to darken the light-emitting element LED that causes color mixing defects.

[0127] In addition, in FIG. 5, the description is given assuming that a color mixing defect occurs in the sub-pixel SP, but the present invention is not limited to this. Even if there is a defect in the light-emitting element LED itself or in the electrical connection between the pixel circuit and the light-emitting element LED, the pixel electrode PE in the sub-pixel SP can be subjected to a disconnection process to darken the defective light-emitting element LED.

[0128] In the display device 100 according to another embodiment of the present specification, a pair of light emitting elements LED arranged in each of the plurality of sub-pixels SP are arranged to be spaced apart with a pixel circuit therebetween. In this case, the electrical connection between the incorrectly placed or defective light emitting element LED and the pixel circuit PE can be separated, and only the normal light emitting element LED can be connected to the pixel circuit PE, so that the incorrectly placed or defective light emitting element LED is prevented from emitting any more light through the pixel circuit PE.

[0129] Fig. 6 is an enlarged plan view of a display device according to another embodiment of the present specification. Fig. 7 is a cross-sectional view taken along the line D-D' of Fig. 5. The display device 600 of Figs. 6 and 7 is substantially the same as the display device 100 of Figs. 1 to 4 except that the shapes of the pixel electrode PE and the second planarization layer 618 are changed, and other configurations are substantially the same, so duplicated descriptions will be omitted.

[0130] 6, the pixel electrode PE includes a first portion PE1 extending to the first light emitting element 130 and the second light emitting element 140, a second portion PE2 arranged to overlap the second assembly electrode 123 of the subpixel SP in which the pixel electrode PE is arranged, and a third portion PE3 extending from the first portion PE1 and arranged to overlap the second assembly electrode 123 of the subpixel SP arranged in a column adjacent to the subpixel SP in which the pixel electrode PE is arranged. Thus, the pixel electrodes PE of the plurality of subpixels SP may be arranged to overlap the second assembly electrode 123 of the corresponding subpixel SP and the second assembly electrode 123 of the subpixel SP arranged in the adjacent column. For example, the pixel electrode PE of the first subpixel SP1 may overlap with the second assembly electrode 123 of each of the first subpixel SP1 and the third subpixel SP3, the pixel electrode PE of the second subpixel SP2 may overlap with the second assembly electrode 123 of each of the second subpixel SP2 and the first subpixel SP1, and the pixel electrode PE of the third subpixel SP3 may overlap with the second assembly electrode 123 of each of the third subpixel SP3 and the second subpixel SP2.

[0131] First, the second portion PE2 and the third portion PE3 of the first sub-pixel SP1 are arranged on the same line. For example, the second portion PE2 and the third portion PE3 of the first sub-pixel SP1 may be arranged to extend in the row direction above the first light emitting element 130 and the second light emitting element 140 of the first sub-pixel SP1.

[0132] Next, the second portion PE2 and the third portion PE3 of the second subpixel SP2 are disposed to extend at different positions in the first portion PE1. For example, the second portion PE2 of the second subpixel SP2 may be disposed to extend in the row direction above the first light emitting element 130 and the second light emitting element 140 of the second subpixel SP2, and the third portion PE3 of the second subpixel SP2 may be disposed to extend in the row direction above the pixel circuit of the second subpixel SP2.

[0133] Next, the second portion PE2 and the third portion PE3 of the third subpixel SP3 are arranged on the same line. For example, the second portion PE2 of the third subpixel SP3 and the third portion PE3 of the third subpixel SP3 may be arranged to extend in the row direction above the pixel circuit of the third subpixel SP3.

[0134] Next, referring to FIG. 7, a groove may be disposed in the second planarization layer 618 in a region corresponding to a part of the pixel electrode PE of the subpixel SP. The groove in the second planarization layer 618 is a region where the second planarization layer 618 is removed, and may expose an upper surface of the third passivation layer 117 disposed under the second planarization layer 618. The groove in the second planarization layer 618 may be disposed in a region corresponding to the second portion PE2 and the third portion PE3 of the pixel electrode PE of the subpixel SP. Thus, the second portion PE2 and the third portion PE3 of the pixel electrode PE are disposed along the groove disposed in the second planarization layer 618. Meanwhile, the second portion PE2 and the third portion PE3 of the pixel electrode PE may contact an upper surface of the third passivation layer 117 disposed on the second assembly electrode 123 in the region where the groove in the second planarization layer 618 is disposed. Thus, the second portion PE2 and the third portion PE3 of the pixel electrode PE may be insulated from the second assembly electrode 123.

[0135] For example, referring to FIG. 7, the groove of the second planarization layer 118 is arranged in an area where the second portion PE2 of the first subpixel SP1 and the second assembly electrode 123 of the first subpixel SP1 overlap, and the second portion PE2 of the pixel electrode PE of the first subpixel SP1 may contact the upper surface of the third passivation layer 117 arranged on the second assembly electrode 123 of the first subpixel SP1.

[0136] Next, the groove of the second planarization layer 618 is arranged in the area where the third portion PE3 of the second subpixel SP2 and the second assembly electrode 123 of the first subpixel SP1 overlap, and the third portion PE3 of the pixel electrode PE of the second subpixel SP2 may contact the upper surface of the third passivation layer 117 arranged on the second assembly electrode 123 of the first subpixel SP1.

[0137] 7 shows the case where the groove of the second planarization layer 618 is disposed in a region overlapping with the second assembly electrode 123 of the first subpixel SP1, but the groove of the second planarization layer 618 may be disposed in a region overlapping with the second assembly electrode 123 of the second subpixel SP2 and the second assembly electrode 123 of the third subpixel SP3. Thus, the groove of the second planarization layer 618 may be disposed in a region where the second assembly electrode 123 of the second subpixel SP2, the second portion PE2 of the pixel electrode PE of the second subpixel SP2, and the third portion PE3 of the pixel electrode PE of the third subpixel SP3 overlap. Also, the groove of the second planarization layer 618 may be disposed in a region where the second assembly electrode 123 of the third subpixel SP3, the second portion PE2 of the pixel electrode PE of the third subpixel SP3, and the third portion PE3 of the pixel electrode PE of the first subpixel SP1 overlap.

[0138] In a display device 600 according to another embodiment of the present specification, the pixel electrode PE of the subpixel SP is arranged to overlap with the subpixel SP arranged in an adjacent column. Specifically, the pixel electrode PE of one subpixel SP is arranged to overlap with the second assembly electrode 123 of another subpixel SP arranged in the adjacent column. Therefore, when a light emitting element LED having a color mixing defect that emits the same color as the light emitting element LED arranged in an adjacent column is arranged in the subpixel SP of the display device, the light emitting element LED causing the color mixing defect can be repaired by connecting it to the pixel circuit of the subpixel SP arranged in the adjacent column.

[0139] Hereinafter, in order to describe a case where a color mixing defect occurs in the first sub-pixel SP1 and the light-emitting element LED of the first sub-pixel SP1 is repaired, reference will be made to both FIG. 8 and FIG.

[0140] Fig. 8 is an enlarged plan view of a display device according to another embodiment of the present specification. Fig. 9 is a cross-sectional view taken along the line E-E' of Fig. 8. Figs. 8 and 9 are cross-sectional views of a display device after a repair process is performed in a case where a light emitting element LED that emits the same color as a light emitting element LED to be disposed in a second sub-pixel SP2 is disposed in a first sub-pixel SP1. The display device 800 of Figs. 8 and 9 is substantially the same as the display device 600 of Figs. 6 and 7 except that the shapes of the light emitting element LED, the pixel electrode PE, and the third passivation layer 817 are changed, and other configurations are substantially the same, so that a duplicated description will be omitted.

[0141] The first sub-pixel SP1 includes a first light emitting element 130 and a second light emitting element 140 that are spaced apart from each other with a pixel circuit therebetween.

[0142] The first light emitting element 130 of the first subpixel SP1 and the second light emitting element 140 of the first subpixel SP1 may emit different colors. For example, when the first subpixel SP1 arranged in the first column is a red subpixel, the second light emitting element 140 of the first subpixel SP1 may be a red light emitting element, but the first light emitting element 130 of the first subpixel SP1 may be a green light emitting element that emits a different color from the second light emitting element 140 of the first subpixel SP1. In this case, the first light emitting element 130 of the first subpixel SP1 may be the same as the first light emitting element 130 and the second light emitting element 140 of the second subpixel SP2. In this case, the first light emitting element 130 and the second light emitting element 140 are different types of light emitting elements LED, so the size of the first light emitting element 130 may be different from the size of the second light emitting element 140.

[0143] In a display device 800 according to another embodiment of the present specification, a cutting process may be performed to disconnect the first light-emitting element 130 of the first sub-pixel SP1 and the pixel electrode PE so that the first light-emitting element 130 of the first sub-pixel SP1, which emits green light, does not emit any more light due to the pixel circuit of the first sub-pixel SP1 driving the red light-emitting element.

[0144] Therefore, the pixel electrode PE of the first sub-pixel SP1 may be disposed separately. For example, the first portion PE1 of the pixel electrode PE of the first sub-pixel SP1 is separated between the first light emitting element 130 and the pixel circuit and the second light emitting element 140, and is electrically connected only to the second light emitting element 140 of the first light emitting element 130 and the second light emitting element 140 of the first sub-pixel SP1. Referring to FIG. 8, the second light emitting element 140 of the first sub-pixel SP1 is connected to the pixel circuit by the first portion PE1 of the pixel electrode PE, and the first light emitting element 130 of the first sub-pixel SP1 is electrically insulated from the second light emitting element 140 of the first sub-pixel SP1 and the pixel circuit.

[0145] Therefore, the second light-emitting element 140 of the first sub-pixel SP1 can be emitted by the pixel circuit of the first sub-pixel SP1, and the signal applied from the pixel circuit of the first sub-pixel SP1 does not need to be transmitted to the first light-emitting element 130 of the first sub-pixel SP1.

[0146] The first light emitting element 130 of the first subpixel SP1 may be connected to a pixel circuit of a second subpixel SP2 in which a light emitting element emitting the same color as the first light emitting element 130 of the first subpixel SP1 is arranged. Referring to Figures 8 and 9, the second assembly electrode 123 of the first subpixel SP1 is connected to the second portion PE2 of the first subpixel SP1 and is electrically connected to the third portion PE3 of the pixel electrode PE of the second subpixel SP2.

[0147] First, when a welding process is performed by irradiating a laser on an overlapping region of the second assembly electrode 123 of the first subpixel SP1 and the second portion PE2 of the pixel electrode PE, the third passivation layer 817 is opened in the laser irradiated region, and the second portion PE2 of the pixel electrode PE of the first subpixel SP1 may be electrically connected to the second assembly electrode 123 of the first subpixel SP1. Next, when a welding process is performed by irradiating a laser on an overlapping region of the second assembly electrode 123 of the first subpixel SP1 and the third portion PE3 of the pixel electrode PE of the second subpixel SP2, the third passivation layer 817 is opened between the second assembly electrode 123 of the first subpixel SP1 and the third portion PE3 of the pixel electrode PE of the second subpixel SP2, and the third portion PE3 of the pixel electrode PE of the second subpixel SP2 may be electrically connected to the second assembly electrode 123 of the first subpixel SP1. Therefore, the first light emitting element 130 of the first sub-pixel SP1 can be driven by the pixel circuit of the second sub-pixel SP2.

[0148] 8, the second assembly electrode 123 of the first subpixel SP1 may be separated from the second assembly electrode 123 of another first subpixel SP1 adjacent thereto in the row direction, thereby cutting off an electrical connection of the driving circuit of the second subpixel SP2 to another subpixel SP adjacent thereto in the row direction. For example, the second assembly electrode 123 of the first subpixel SP1 may be disconnected by irradiating a laser outside the first light emitting element 130 and the second light emitting element 140 of the first subpixel SP1.

[0149] Therefore, when a color mixture defect occurs in another subpixel SP adjacent to the first subpixel SP1 in the row direction, further repairs can be performed using the second assembly electrode 123 of the first subpixel SP1 as a repair line.

[0150] 8 and 9, the first light emitting element 130 of the first sub-pixel SP1 is assumed to have a color mixing defect, but the present invention is not limited thereto, and if the second light emitting element 140 of the first sub-pixel SP1 is arranged with the same light emitting element LED as the light emitting element LED arranged in the second sub-pixel SP2, the second light emitting element 140 of the first sub-pixel SP1 can be connected to the pixel circuit of the second sub-pixel SP2 in the same manner as described above to perform repair. Also, if the first light emitting element 130 and the second light emitting element 140 of the first sub-pixel SP1 are all arranged with the same light emitting element LED as the light emitting element LED arranged in the second sub-pixel SP2, the first light emitting element 130 and the second light emitting element 140 can be connected to the pixel circuit of the second sub-pixel SP2 to perform repair.

[0151] In a display device 800 according to still another embodiment of the present specification, the pixel electrode PE of the subpixel SP is arranged to overlap with the subpixel SP arranged in an adjacent column. Thus, when a color mixing defective element in which a light emitting element LED emitting the same color as the second subpixel SP2 is arranged in the first subpixel SP1, the subpixel SP in which the color mixing defect occurs can be easily repaired by using the second assembly electrode 123 of the assembly electrodes 120. For example, when a green light emitting element emitting green is arranged in the first subpixel SP1 emitting red, the repair can be performed by connecting the green light emitting element of the first subpixel SP1 to the pixel circuit of the second subpixel SP2 in which the light emitting element emitting green is arranged.

[0152] In addition, in the display device 800 according to another embodiment of the present specification, the light-emitting element LED of the sub-pixel SP having color mixing defects is connected to the pixel circuit of the adjacent sub-pixel SP by utilizing the second assembly electrode 123 without any additional structure, thereby simplifying the structure of the display device 100 and simplifying and / or unifying the materials of the components.

[0153] Fig. 10 is an enlarged plan view of a display device according to another embodiment of the present specification. Fig. 11 is a cross-sectional view taken along the line F-F' of Fig. 10. Figs. 10 and 11 are cross-sectional views of a display device after a repair process is performed in a case where a light emitting element LED that emits the same color as a light emitting element LED to be disposed in a third sub-pixel SP3 is disposed in a first sub-pixel SP1. The display device 1100 of Figs. 10 and 11 is substantially the same as the display device 600 of Figs. 6 and 7 except that the shapes of the light emitting element LED, the pixel electrode PE, and the third passivation layer 1017 are changed, and other configurations are substantially the same, so that a duplicated description will be omitted.

[0154] The first sub-pixel SP1 includes a first light emitting element 130 and a second light emitting element 140 that are spaced apart from each other with a pixel circuit therebetween.

[0155] The first light emitting element 130 of the first subpixel SP1 and the second light emitting element 140 of the first subpixel SP1 may emit different colors. For example, when the first subpixel SP1 arranged in the first column is a red subpixel, the second light emitting element 140 of the first subpixel SP1 may be a red light emitting element, while the first light emitting element 130 of the first subpixel SP1 may be a blue light emitting element that emits a different color from the second light emitting element 140 of the first subpixel SP1. In this case, the first light emitting element 130 of the first subpixel SP1 may be the same as the first light emitting element 130 and the second light emitting element 140 of the third subpixel SP3.

[0156] In the display device 1000 according to another embodiment of the present specification, a cutting process may be performed to disconnect the first light-emitting element 130 of the first sub-pixel SP1 and the pixel electrode PE so that the first light-emitting element 130 of the first sub-pixel SP1, which emits blue light, does not emit any more light due to the pixel circuit of the first sub-pixel SP1 driving the red light-emitting element.

[0157] For example, the pixel electrode PE may be disconnected by a laser irradiation method. The first portion PE1 of the pixel electrode PE of the first sub-pixel SP1 is separated between the first light emitting element 130, the pixel circuit, and the second light emitting element 140, and is electrically connected only to the second light emitting element 140 of the first light emitting element 130 and the second light emitting element 140 of the first sub-pixel SP1. Referring to FIG. 10, the second light emitting element 140 of the first sub-pixel SP1 is connected to the pixel circuit by the first portion PE1 of the pixel electrode PE, and the first light emitting element 130 of the first sub-pixel SP1 is electrically insulated from the second light emitting element 140 and the pixel circuit of the first sub-pixel SP1. Therefore, the second light emitting element 140 of the first sub-pixel SP1 may be emitted by the pixel circuit of the first sub-pixel SP1, and a signal applied from the pixel circuit of the first sub-pixel SP1 does not need to be transmitted to the first light emitting element 130 of the first sub-pixel SP1.

[0158] The first light emitting element 130 of the first subpixel SP1 may be connected to a pixel circuit of a third subpixel SP3 in which a light emitting element emitting the same color as the first light emitting element 130 of the first subpixel SP1 is arranged. Referring to Figures 10 and 11, the second assembly electrode 123 of the third subpixel SP3 is connected to the second portion PE2 of the third subpixel SP3 and is electrically connected to the third portion PE3 of the first subpixel SP1.

[0159] First, when a welding process is performed by irradiating a laser on an area where the second assembly electrode 123 of the third subpixel SP3 and the second part PE2 of the pixel electrode PE overlap, the third passivation layer 1017 is opened in the laser irradiated area, and the pixel circuit of the third subpixel SP3 may be electrically connected to the second assembly electrode 123 of the third subpixel SP3. Next, when a welding process is performed by irradiating a laser on an area where the second assembly electrode 123 of the third subpixel SP3 and the second part PE2 of the pixel electrode PE of the first subpixel SP1 overlap, the third passivation layer 1017 is opened in the laser irradiated area, and the pixel circuit of the third subpixel SP3 may be electrically connected to the second part PE2 of the pixel electrode PE. Thus, the first light emitting element 130 of the first subpixel SP1 can be driven by the pixel circuit of the third subpixel SP3.

[0160] 10, the second assembly electrode 123 of the third subpixel SP3 may be separated from the second assembly electrode 123 of another third subpixel SP3 adjacent thereto in the row direction, so that the electrical connection of the driving circuit of the first subpixel SP1 to another subpixel SP adjacent thereto in the row direction may be cut off. Thus, when a color mixing defect occurs in another subpixel SP adjacent to the first subpixel SP1 in the row direction, further repairs may be performed using the second assembly electrode 123 of the third subpixel SP3 as a repair line.

[0161] Meanwhile, in FIGS. 10 and 11, the first light-emitting element 130 of the first sub-pixel SP1 has been described assuming a color mixing defect. However, this is not limited thereto. Even if the second light-emitting element 140 of the first sub-pixel SP1 or the first light-emitting element 130 and the second light-emitting element 140 are all arranged with the same light-emitting element LED as the light-emitting element arranged in the third sub-pixel SP3, the light-emitting element LED causing the color mixing defect can be connected to the pixel circuit of the third sub-pixel SP3 to perform repair.

[0162] In the display device 1000 according to still another embodiment of the present specification, the pixel electrode PE of the subpixel SP is arranged to overlap with the subpixel SP arranged in the adjacent column. Thus, when a color mixing defective element in which a light emitting element LED emitting the same color as the third subpixel SP3 is arranged in the first subpixel SP1, the subpixel SP in which the color mixing defect occurs can be easily repaired by using the second assembly electrode 123 of the assembly electrodes 120. For example, when a blue light emitting element emitting blue is arranged in the first subpixel SP1 emitting red, the repair can be performed by connecting the blue light emitting element of the first subpixel SP1 to the pixel circuit of the third subpixel SP3 in which the light emitting element LED emitting blue is arranged.

[0163] In addition, in the display device 1000 according to another embodiment of the present specification, the light-emitting element LED of the sub-pixel SP having color mixing defects is connected to the pixel circuit of the adjacent sub-pixel SP by utilizing the second assembly electrode 123 without disposing any additional structure, thereby simplifying the structure of the display device 1000.

[0164] Fig. 12 is an enlarged plan view of a display device according to another embodiment of the present specification. Fig. 13 is a cross-sectional view taken along the line G-G' of Fig. 12. Figs. 12 and 13 are cross-sectional views of a display device after a repair process is performed in a case where a light emitting element LED that emits the same color as the light emitting element LED to be disposed in the third sub-pixel SP3 is disposed in the second sub-pixel SP2. The display device 800 of Figs. 12 and 13 is substantially the same as the display device 600 of Figs. 6 and 7 except that the shapes of the light emitting element LED, the pixel electrode PE, and the third passivation layer 1317 are changed, and other configurations are substantially the same, so that a duplicated description will be omitted.

[0165] The second sub-pixel SP2 includes a first light emitting element 130 and a second light emitting element 140 that are spaced apart from each other with a pixel circuit therebetween.

[0166] The first light emitting element 130 of the second subpixel SP2 and the second light emitting element 140 of the second subpixel SP2 may emit different colors. For example, when the second subpixel SP2 arranged in the second column is a green subpixel, the second light emitting element 140 of the second subpixel SP2 may be a green light emitting element, while the first light emitting element 130 of the second subpixel SP2 may be a blue light emitting element that emits a different color from the second light emitting element 140. In this case, the first light emitting element 130 of the second subpixel SP2 may be the same as the first light emitting element 130 and the second light emitting element 140 of the third subpixel SP3.

[0167] In a display device 1300 according to another embodiment of the present specification, a cutting process may be performed to disconnect the first light-emitting element 130 of the second sub-pixel SP2 from the pixel electrode PE so that the first light-emitting element 130 of the second sub-pixel SP2, which emits blue light, does not emit any more light due to the pixel circuit of the second sub-pixel SP2 driving the green light-emitting element.

[0168] For example, the pixel electrode PE may be disconnected by a laser irradiation method. The first portion PE1 of the pixel electrode PE of the second sub-pixel SP2 is separated between the first light emitting element 130, the pixel circuit, and the second light emitting element 140, and is electrically connected only to the second light emitting element 140 of the first light emitting element 130 and the second light emitting element 140 of the second sub-pixel SP2. Referring to FIG. 12, the second light emitting element 140 of the second sub-pixel SP2 is connected to the pixel circuit by the first portion PE1 of the pixel electrode PE, and the first light emitting element 130 of the second sub-pixel SP2 is electrically insulated from the second light emitting element 140 and the pixel circuit of the second sub-pixel SP2. Therefore, the second light emitting element 140 of the second sub-pixel SP2 may be emitted by the pixel circuit of the second sub-pixel SP2, and a signal applied from the pixel circuit of the second sub-pixel SP2 does not need to be transmitted to the first light emitting element 130 of the second sub-pixel SP2.

[0169] The first light emitting element 130 of the second subpixel SP2 may be connected to a pixel circuit of a third subpixel SP3 in which a light emitting element emitting the same color as the first light emitting element 130 of the second subpixel SP2 is arranged. Referring to Figures 12 and 13, the second assembly electrode 123 of the second subpixel SP2 is connected to the second portion PE2 of the second subpixel SP2 and is electrically connected to the third portion PE3 of the third subpixel SP3.

[0170] First, when a welding process is performed by irradiating a laser on an area where the second assembly electrode 123 of the second subpixel SP2 and the second part PE2 of the pixel electrode PE overlap, the third passivation layer 1217 is opened in the laser irradiated area, and the pixel circuit of the second subpixel SP2 may be electrically connected to the second assembly electrode 123 of the second subpixel SP2. Next, when a welding process is performed by irradiating a laser on an area where the second assembly electrode 123 of the second subpixel SP2 and the third part PE3 of the pixel electrode PE of the third subpixel SP3 overlap, the third passivation layer 1217 is opened in the laser irradiated area, and the second assembly electrode 123 of the second subpixel SP2 and the third part PE3 of the pixel electrode PE of the third subpixel SP3 may be electrically connected. Thus, the first light emitting element 130 of the second subpixel SP2 can be driven by the pixel circuit of the third subpixel SP3.

[0171] 12, the second assembly electrode 123 of the second subpixel SP2 may be separated from the second assembly electrode 123 of another second subpixel SP2 adjacent thereto in the row direction, so that an electrical connection of the driving circuit of the third subpixel SP3 to another subpixel SP adjacent to the second subpixel SP2 in the row direction may be cut off. Thus, when a color mixing defect occurs in another subpixel SP adjacent to the second subpixel SP2 in the row direction, further repairs may be performed using the second assembly electrode 123 of the second subpixel SP2 as a repair line.

[0172] Meanwhile, in FIGS. 12 and 13, the first light-emitting element 130 of the second sub-pixel SP2 has been described as having a color mixing defect. However, this is not limited thereto. Even if the second light-emitting element 140 of the second sub-pixel SP2 or the first light-emitting element 130 and the second light-emitting element 140 are all arranged to be the same light-emitting element LED as the light-emitting element LED arranged in the third sub-pixel SP3, the light-emitting element causing the color mixing defect can be connected to the pixel circuit of the third sub-pixel SP3 to perform repair.

[0173] In a display device 1200 according to still another embodiment of the present specification, the pixel electrode PE of the subpixel SP is arranged to overlap with the subpixel SP arranged in an adjacent column. Thus, when a color mixing defective element in which a light emitting element emitting the same color as that of the third subpixel SP3 is arranged in the second subpixel SP2, the subpixel SP in which the color mixing defect occurs can be easily repaired by using the second assembly electrode 123 of the assembly electrodes 120. For example, when a blue light emitting element emitting blue is arranged in the second subpixel SP2 emitting green, the repair can be performed by connecting the blue light emitting element of the second subpixel SP2 to the pixel circuit of the third subpixel SP3 in which a light emitting element emitting blue is arranged.

[0174] In addition, in the display device 1300 according to another embodiment of the present specification, the light-emitting element LED of the sub-pixel SP having color mixing defects is connected to the pixel circuit of the adjacent sub-pixel SP by utilizing the second assembly electrode 123 without disposing any additional structure, thereby simplifying the structure of the display device 1300.

[0175] Hereinafter, in order to describe a case where a defect occurs in the pixel circuit of the sub-pixel SP and the light-emitting element LED of the sub-pixel SP is repaired, reference will be made to both FIGS.

[0176] Fig. 14 is an enlarged plan view of a display device according to another embodiment of the present specification. Fig. 15 is a cross-sectional view taken along the line H-H' of Fig. 14. Figs. 14 and 15 are cross-sectional views of a first sub-pixel, in which the first light emitting device 130 of the first light emitting device 130 and the second light emitting device 140 of the first sub-pixel does not emit light, after a repair process is performed. The display device 1400 of Figs. 14 and 15 is substantially the same as the display device 600 of Figs. 6 and 7 except that the shapes of the light emitting device LED, the pixel electrode PE, and the third passivation layer 1417 are changed, and other configurations are substantially the same, so that repeated description will be omitted.

[0177] The first sub-pixel SP1 includes a first light emitting element 130 and a second light emitting element 140 that are spaced apart from each other with a pixel circuit therebetween.

[0178] The first light emitting element 130 of the first subpixel SP1 and the second light emitting element 140 of the first subpixel SP1 may emit light of the same color. In this case, the first light emitting element 130 and the second light emitting element 140 arranged in the first subpixel SP1 may emit light of the same color as the light emitting element LED arranged in another subpixel SP adjacent to them in the row direction.

[0179] If the pixel circuit of one of the multiple subpixels SP is defective or a defect occurs in the electrical connection between the pixel circuit and the light-emitting element LED, at least one of the first light-emitting element 130 and the second light-emitting element 140 arranged in the subpixel SP may not emit light.

[0180] In the display device 1400 according to another embodiment of the present disclosure, a cutting process may be performed to disconnect the pixel electrode PE between the non-emitting light emitting element LED in the first sub-pixel SP1 and the pixel circuit of the first sub-pixel SP1.

[0181] For example, the pixel electrode PE may be disconnected by a laser irradiation method. The first portion PE1 of the pixel electrode PE of the first sub-pixel SP1 is separated between the first light emitting element 130, the pixel circuit, and the second light emitting element 140, and is electrically connected only to the second light emitting element 140 of the first light emitting element 130 and the second light emitting element 140 of the first sub-pixel SP1. Referring to FIG. 14, the second light emitting element 140 of the first sub-pixel SP1 is connected to the pixel circuit by the first portion PE1 of the pixel electrode PE, and the first light emitting element 130 of the first sub-pixel SP1 is electrically insulated from the second light emitting element 140 and the pixel circuit of the first sub-pixel SP1. Therefore, the second light emitting element 140 of the first sub-pixel SP1 may be emitted by the pixel circuit of the first sub-pixel SP1, and a signal applied from the pixel circuit of the first sub-pixel SP1 does not need to be transmitted to the first light emitting element 130 of the first sub-pixel SP1.

[0182] In addition, the first light emitting element 130 of the first subpixel SP1 may be connected to a pixel circuit of a subpixel SP arranged in the same column as the first subpixel SP1 in which a light emitting element LED emitting the same color as the first light emitting element 130 of the first subpixel SP1 is arranged. Referring to Figures 14 and 15, the second assembly electrode 123 of the first subpixel SP1 is connected to the second portion PE2 of the first subpixel SP1, and is also electrically connected to the second portion PE2 of another subpixel SP adjacent to the first light emitting element 130 in the column direction.

[0183] First, when a welding process is performed by irradiating a laser on an area where the second assembly electrode 123 of the first subpixel SP1 and the second part PE2 of the pixel electrode PE overlap, the third passivation layer 1417 is opened in the laser irradiated area, and the first light emitting element 130 may be electrically connected to the second assembly electrode 123 of the first subpixel SP1. Next, when a welding process is performed by irradiating a laser on an area where the second assembly electrode 123 of the first subpixel SP1 and the second part PE2 of the subpixel disposed above the first light emitting element 130 of the first subpixel SP1 overlap, the third passivation layer 1417 is opened in the laser irradiated area, and the second assembly electrode 123 of the first subpixel SP1 and the second part PE2 of the subpixel SP disposed above the first light emitting element 130 of the first subpixel SP1 may be electrically connected. Thus, the first light emitting element 130 of the first subpixel SP1 may be driven by the pixel circuit of another subpixel SP adjacent to it in the column direction.

[0184] 14, the second assembly electrode 123 of the first subpixel SP1 may be separated from the second assembly electrode 123 of another first subpixel SP1 adjacent thereto in the row direction, so that an electrical connection of the driving circuit of the first subpixel SP1 to another subpixel SP adjacent thereto in the column direction may be cut off. Therefore, when a defect occurs in another subpixel SP adjacent to the first subpixel SP1 in the column direction, repair may be performed using the second assembly electrode 123 of the first subpixel SP1 as a repair line.

[0185] Meanwhile, in Figures 14 and 15, the pixel circuit of the first subpixel SP1 is assumed to be defective, but this is not limited thereto. If the pixel circuits arranged in the second subpixel SP2 and the third subpixel SP3 are defective, repair can be performed by connecting the pixel circuits of adjacent subpixels SP in the column direction in a manner similar to that described above.

[0186] In a display device 1400 according to another embodiment of the present specification, the pixel electrode PE of the subpixel SP is arranged to overlap with the subpixel SP arranged in an adjacent column. Thus, when the light emitting element LED is not driven in the first subpixel SP1 due to a defect in the pixel circuit or a poor contact between the light emitting element LED and the pixel circuit, the subpixel SP where the defect occurs can be easily repaired by using the second assembly electrode 123 of the assembly electrodes 120 of the not driven subpixel SP. For example, when the first light emitting element 130 of the first subpixel SP1 does not emit light, the repair can be performed by connecting it to the pixel circuit of the light emitting element LED arranged above the first subpixel SP1.

[0187] In addition, in the display device 1400 according to another embodiment of the present specification, the light-emitting element LED of the sub-pixel SP having color mixing defects is connected to the pixel circuit of the adjacent sub-pixel SP by utilizing the second assembly electrode 123 without disposing any additional structure, thereby simplifying the structure of the display device 1400.

[0188] A display device according to various embodiments of the present disclosure can be described as follows.

[0189] A display device according to one embodiment of the present specification includes a substrate including a plurality of sub-pixels, a pixel circuit arranged in the plurality of sub-pixels on the substrate, a first light-emitting element arranged in the plurality of sub-pixels, on one side of the pixel circuit, and including a first electrode, a semiconductor layer, and a second electrode, a second light-emitting element arranged in the plurality of sub-pixels, on the other side of the pixel circuit, and including a first electrode, a semiconductor layer, and a second electrode, and a pixel electrode electrically connected to the pixel circuit and extending to the first light-emitting element and the second light-emitting element.

[0190] According to another feature of the present specification, a size of the first light emitting element may be the same as a size of the second light emitting element, and the pixel electrode may be connected to both the first light emitting element and the second light emitting element.

[0191] According to still another aspect of the present disclosure, a size of the first light emitting element may be different from a size of the second light emitting element, and the pixel electrode may be connected to one of the first light emitting element and the second light emitting element.

[0192] According to another feature of the present specification, the display device may further include a first assembly electrode and a second assembly electrode arranged spaced apart from each other at the bottom of the first light-emitting element and the second light-emitting element, and the first electrode of the first light-emitting element and the first electrode of the second light-emitting element may be electrically connected to the first assembly electrode and insulated from the second assembly electrode.

[0193] According to still another feature of the present specification, the plurality of subpixels are arranged such that a first subpixel arranged in a first column, a second subpixel arranged in a second column, and a third subpixel arranged in a third column are repeated in the row direction, and the pixel electrode may include a first portion extending to the first light-emitting element and the second light-emitting element, a second portion arranged to overlap with a second assembly electrode of the subpixel in which the pixel electrode is arranged, and a third portion extending from the first portion and arranged to overlap with a second assembly electrode of the subpixel arranged in a column adjacent to the subpixel in which the pixel electrode is arranged.

[0194] According to still another feature of the present disclosure, the second and third portions of the pixel electrode may be insulated from the second assembly electrode.

[0195] According to still another feature of the present specification, when the first and second light-emitting elements of the first subpixel have different sizes and the size of the first light-emitting element of the first subpixel is the same as the size of the first light-emitting element of the second subpixel, a second portion of the pixel electrode of the first subpixel may be electrically connected to the second assembly electrode of the first subpixel, and a third portion of the pixel electrode of the second subpixel may be electrically connected to the second assembly electrode of the first subpixel.

[0196] According to still another aspect of the present disclosure, the first portion of the pixel electrode of the first sub-pixel may be electrically connected only to the second light emitting element of the first and second light emitting elements of the first sub-pixel.

[0197] According to still another feature of the present disclosure, the second assembly electrode of a first sub-pixel may be separated from the second assembly electrodes of other first sub-pixels adjacent thereto in a row direction.

[0198] According to another feature of the present specification, when the first and second light-emitting elements of the first subpixel are different in size and the size of the first light-emitting element of the first subpixel is the same as the size of the first light-emitting element of the third subpixel, a third portion of the pixel electrode of the first subpixel may be electrically connected to the second assembly electrode of the third subpixel, and a second portion of the pixel electrode of the third subpixel may be electrically connected to the second assembly electrode of the third subpixel.

[0199] According to still another aspect of the present disclosure, the first portion of the pixel electrode of the first sub-pixel may be electrically connected only to the second light emitting element of the first and second light emitting elements of the first sub-pixel.

[0200] According to still another feature of the present disclosure, the second assembly electrode of a third sub-pixel may be separated from the second assembly electrodes of other third sub-pixels adjacent thereto in the row direction.

[0201] According to still another feature of the present specification, when the size of the first light-emitting element and the second light-emitting element of the second subpixel are different and the size of the first light-emitting element of the second subpixel is the same as the size of the first light-emitting element of the third subpixel, a second portion of the pixel electrode of the second subpixel may be electrically connected to the second assembly electrode of the second subpixel, and a third portion of the pixel electrode of the third subpixel may be electrically connected to the second assembly electrode of the second subpixel.

[0202] According to still another aspect of the present disclosure, the first portion of the pixel electrode of the second sub-pixel may be electrically connected only to the second light-emitting element of the first and second light-emitting elements of the second sub-pixel.

[0203] According to still another feature of the present disclosure, the second assembly electrode of the second sub-pixel may be separated from the second assembly electrodes of other second sub-pixels adjacent thereto in the row direction.

[0204] According to another feature of the present specification, when a pixel circuit of one of the plurality of subpixels is defective, a second portion of the pixel electrode of the one subpixel may be electrically connected to the second assembly electrode, and a second portion of the pixel electrode of another subpixel adjacent to the one subpixel in the column direction may be electrically connected to the second assembly electrode.

[0205] According to another aspect of the present disclosure, the second assembly electrodes of one sub-pixel and another sub-pixel may be separated from the second assembly electrodes of other sub-pixels adjacent thereto in the column direction.

[0206] Although the embodiments of the present specification have been described in more detail with reference to the accompanying drawings, the present specification is not necessarily limited to such embodiments, and various modifications can be made within the scope of the technical idea of ​​the present specification. Therefore, the embodiments disclosed in the present specification are for illustration purposes, not for limiting the technical idea of ​​the present specification, and the scope of the technical idea of ​​the present specification is not limited by such embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

Claims

1. A substrate including a plurality of sub-pixels; a pixel circuit disposed on the substrate in each of the plurality of sub-pixels; a first light-emitting element disposed in each of the plurality of sub-pixels, disposed on one side of the pixel circuit, the first light-emitting element including a first electrode, a semiconductor layer, and a second electrode; a second light-emitting element that is disposed in each of the plurality of sub-pixels, is disposed on the other side of the pixel circuit, and includes a first electrode, a semiconductor layer, and a second electrode; and a pixel electrode electrically connected to the pixel circuit and extending to the first light emitting device and the second light emitting device; The display device, wherein the first light emitting element and the second light emitting element are arranged apart from each other with the pixel circuit therebetween.

2. The size of the first light emitting element is the same as the size of the second light emitting element, The display device of claim 1 , wherein the pixel electrode is connected to both the first light emitting element and the second light emitting element.

3. The size of the first light emitting element is different from the size of the second light emitting element, The display device of claim 1 , wherein the pixel electrode is connected to one of the first light emitting element and the second light emitting element.

4. a first assembly electrode and a second assembly electrode spaced apart from each other below the first light emitting device and the second light emitting device, The display device of claim 1 , wherein the first electrode of the first light emitting element and the first electrode of the second light emitting element are electrically connected to the first assembly electrode and insulated from the second assembly electrode.

5. the plurality of sub-pixels are arranged such that a first sub-pixel arranged in a first column, a second sub-pixel arranged in a second column, and a third sub-pixel arranged in a third column are repeated in the row direction; The pixel electrode is a first portion extending to the first light emitting element and the second light emitting element; a second portion arranged to overlap the second assembly electrode of the sub-pixel in which the pixel electrode is arranged; and 5. The display device according to claim 4, further comprising a third portion extending from the first portion and arranged to overlap the second assembly electrode of the subpixel arranged in a column adjacent to the subpixel in which the pixel electrode is arranged.

6. The display device according to claim 5 , wherein the second portion and the third portion of the pixel electrode are insulated from the second assembly electrode.

7. When the first light emitting element and the second light emitting element of the first sub-pixel are different in size, and the size of the first light emitting element of the first sub-pixel is the same as the size of the first light emitting element of the second sub-pixel, the second portion of the pixel electrode of the first sub-pixel is electrically connected to the second assembly electrode of the first sub-pixel; The display device of claim 5 , wherein the third portion of the pixel electrode of the second sub-pixel is electrically connected to the second assembly electrode of the first sub-pixel.

8. The display device of claim 7 , wherein the first portion of the pixel electrode of the first sub-pixel is electrically connected only to the second light emitting element of the first sub-pixel and the second light emitting element of the first sub-pixel.

9. The display device of claim 7 , wherein the second assembly electrode of the first sub-pixel is separated from the second assembly electrode of another first sub-pixel adjacent thereto in a row direction.

10. When the first light emitting element and the second light emitting element of the first sub-pixel are different in size, and the size of the first light emitting element of the first sub-pixel is the same as the size of the first light emitting element of the third sub-pixel, the third portion of the pixel electrode of the first sub-pixel is electrically connected to the second assembly electrode of the third sub-pixel; The display device of claim 5 , wherein the second portion of the pixel electrode of the third sub-pixel is electrically connected to the second assembly electrode of the third sub-pixel.

11. The display device of claim 10 , wherein the first portion of the pixel electrode of the first sub-pixel is electrically connected only to the second light emitting element of the first sub-pixel and the second light emitting element of the first sub-pixel.

12. The display device of claim 10 , wherein the second assembly electrode of the third sub-pixel is separated from the second assembly electrode of another third sub-pixel adjacent thereto in a row direction.

13. When the size of the first light emitting element of the second sub-pixel is different from the size of the second light emitting element of the second sub-pixel, and the size of the first light emitting element of the second sub-pixel is the same as the size of the first light emitting element of the third sub-pixel, the second portion of the pixel electrode of the second sub-pixel is electrically connected to the second assembly electrode of the second sub-pixel; The display device of claim 5 , wherein the third portion of the pixel electrode of the third sub-pixel is electrically connected to the second assembly electrode of the second sub-pixel.

14. The display device of claim 13 , wherein the second assembly electrode of the second sub-pixel is separated from the second assembly electrode of another second sub-pixel adjacent thereto in a row direction.

15. The display device of claim 13 , wherein the first portion of the pixel electrode of the second sub-pixel is electrically connected only to the second light emitting element of the first light emitting element and the second light emitting element of the second sub-pixel.

16. When the pixel circuit of one of the plurality of sub-pixels is defective, the second portion of the pixel electrode of the one sub-pixel is electrically connected to the second assembly electrode; The display device of claim 5 , wherein the second portion of the pixel electrode of another sub-pixel adjacent to the one sub-pixel in a column direction is electrically connected to the second assembly electrode.

17. The display device of claim 16 , wherein the second assembly electrodes of the one sub-pixel and the other sub-pixel are separated from the second assembly electrodes of other sub-pixels adjacent in a column direction.

Images