Magnetic junction having an oxide interlayer containing a glass forming agent, method for providing same, and magnetic device - Patents.com

Abstract

To provide a magnetic junction with oxide intermediate film containing glass molding agent and method for providing the same, and magnetic device.SOLUTION: The magnetic junction includes a free film and an oxide intermediate film on the free film. The oxide intermediate film includes at least one glass molding agent and the magnetic junction further includes a reference film and a non-magnetic spacer film arranged between the reference film and the free film. The free film is arranged between the non-magnetic spacer film and the oxide intermediate film.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to magnetic junctions having oxide interlayers containing glass formers, methods for providing same, and magnetic devices. [Background technology]

[0002] Magnetic memories such as magnetic random access memories (MRAMs) store information using magnetic materials as information recording media. For example, magnetic tunneling junctions (MTJs) are used in MRAMs such as spin-transfer torque MRAMs (STT-MRAMs). MTJs typically reside on a substrate and include a reference film, a free film, and a tunneling barrier film between the reference film and the free film. The reference film and the free film are magnetic. The magnetic moment of the reference film is fixed or pinned in a particular direction. The free film has a changeable magnetic moment. A bottom contact and a top contact below the MJT are used in STT-MRAMs to drive a current through the MJT in a current-perpendicular-to-plane (CPP) direction. When a sufficient current is driven in a direction perpendicular to the plane, e.g., from top to bottom, the magnetic moment of the free film is transformed to be parallel to the magnetic moment of the reference film. When a sufficient current is driven in the opposite direction, e.g., from bottom to top, the magnetic moment of the free film is transformed to be opposite to the magnetic moment of the reference film. The different magnetic configurations correspond to different reluctances of the MJTs and different logic states (eg, logic "0" and logic "1").

[0003] Magnetic memories are being researched due to their potential use in a variety of applications, and therefore, there is a need for methods and systems for improving the performance of magnetic junctions. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-015490 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in consideration of the above-mentioned conventional technology, and an object of the present invention is to provide a magnetic junction having an oxide intermediate film containing a glass molding agent, a method for providing the same, and a magnetic device. [Means for solving the problem]

[0006] In order to achieve the above object, a magnetic junction according to one aspect of the present invention includes a free film and an oxide intermediate film on the free film, the oxide intermediate film including at least one glass-forming agent.

[0007] In order to achieve the above-mentioned object, a magnetic device according to one aspect of the present invention has a plurality of magnetic junctions and a plurality of conductive lines coupled to the plurality of magnetic junctions, each of the plurality of magnetic junctions including a reference film, a non-magnetic spacer film, a free film, and an oxide intermediate film formed on the free film, the non-magnetic spacer film being disposed between the reference film and the free film, the free film being disposed between the non-magnetic spacer film and the oxide intermediate film, and the oxide intermediate film including at least one glass forming agent.

[0008] In order to achieve the above object, a method for providing a magnetic junction according to one aspect of the present invention includes the steps of providing a reference film, providing a non-magnetic spacer film, providing a free film, and providing an oxide intermediate film on the free film, the oxide intermediate film including at least one glass forming agent.

[0009] Specific details of other embodiments are included in the description of the invention and the drawings. Effect of the Invention

[0010] In the magnetic junction of the present invention, the oxide intermediate film on the free film is smooth, thin, stable, amorphous and continuous, and has negligible resistance compared to the non-magnetic spacer film, thereby improving properties such as high tunneling magnetoresistance (TMR), high stability (e.g., reduced diffusion), and low magnetic damping. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 illustrates a first embodiment of a magnetic junction having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. [Diagram 2] 1 is a flow chart illustrating one embodiment of a method for providing a magnetic junction having an oxide interlayer that includes a glass former and can be used in a magnetic device such as a programmable magnetic memory using spin transfer torque. [Diagram 3] 1 is a flow chart illustrating one embodiment of a method for providing an oxide interlayer that includes a glass former and can be used in magnetic bonding. [Figure 4] 1(a)-(c) show some embodiments of a magnetic junction during the formation of an oxide interlayer containing a glass forming agent. [Diagram 5] 4 is a flow chart illustrating another embodiment of a method for providing an oxide interlayer that includes a glass former and can be used in magnetic bonding. [Figure 6] FIG. 1 illustrates a second embodiment of a magnetic junction having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. [Figure 7] FIG. 13 illustrates a third embodiment of a magnetic junction having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. [Figure 8] FIG. 13 illustrates a fourth embodiment of a magnetic junction having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. [Figure 9] FIG. 5 illustrates a fifth embodiment of a magnetic junction having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. [Figure 10] FIG. 1 illustrates an exemplary embodiment of a memory utilizing a magnetic junction having a glass former in an oxide film of a memory element of a storage cell. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific examples of the embodiments of the present invention will be described in detail with reference to the drawings.

[0013] The present invention is a process, an apparatus, a system, and compositions of matter. As used herein, such implementations or any other form the invention may take are referred to as techniques. In general, the order of steps of the disclosed steps (or processes) may be varied within the scope of the invention.

[0014] A detailed description of one or more embodiments of the present invention is provided below along with figures that illustrate the principles of the present invention. Although the present invention will be described in connection with such embodiments, the present invention is not limited to any particular embodiment. The present invention includes many alternatives, modifications, and equivalents. Numerous specific details are set forth in the following description in order to provide a thorough understanding of the present invention. These details are provided for the purpose of example, and the present invention may be practiced without some or all of such details. For the sake of clarity, technical materials known in the art related to the present invention will not be described in detail so as not to unnecessarily obscure the present invention.

[0015] Exemplary embodiments of the invention are described in the context of specific methods, specific magnetic junctions, and magnetic memories having specific components. The techniques described herein are consistent with the use of magnetic junctions and magnetic memories having other and / or additional components and / or other features not consistent with the invention. The methods and systems of the invention are also described in the context of a current understanding of spin transfer phenomena, magnetic anisotropy, and other physical phenomena. Consequently, theoretical explanations for the behavior of the methods and systems of the invention are based on a current understanding of spin transfer, magnetic anisotropy, and other physical phenomena. However, the techniques described herein do not rely on a particular physical explanation. The embodiments are described in the context of a structure having a particular relationship to a substrate. However, the embodiments may comprise other structures. Also, specific embodiments are described in the context of being synthetic and / or simple with respect to particular films. However, one of ordinary skill in the art can readily recognize that the films may have other structures. Also, the techniques are described in the context of magnetic junctions and / or sub-structures having particular films. However, magnetic junctions and / or sub-structures having additional and / or different films not consistent with the methods and systems of the invention may be used. Additionally, certain components are described as magnetic, ferromagnetic, and ferrimagnetic. As used herein, the term magnetic may include ferromagnetic, ferrimagnetic, or similar structures. Thus, as used herein, the terms "magnetic" or "ferromagnetic" include, but are not limited to, ferromagnetic and ferrimagnetic materials. As used herein, "in-plane" refers to being substantially within or parallel to the plane of one or more of the magnetic junction films. Conversely, "perpendicular" and "perpendicular-to-plane" refer to a direction that is substantially perpendicular to one or more of the films of the magnetic junction. The methods and systems of the present invention are also described in the context of specific alloys. Unless otherwise specified, unless a specific concentration of alloy is mentioned, any non-corresponding stoichiometry may be used. Various embodiments are also described herein.The components described may be combined in non-consistent manners and systems not shown.

[0016] FIG. 1 illustrates a first embodiment of a magnetic junction 100 having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. For clarity, FIG. 1 is not drawn to scale. The magnetic junction 100 can be used in magnetic devices such as STT-MRAM, spin-orbit torque MRAM (SOT-MRAM), logic devices, other integrated circuits, and a variety of electronic devices. The magnetic junction 100 is formed on a substrate 101 and includes a selective seed film 102, a reference film 110 having a magnetic moment 112, a non-magnetic spacer film 120, a selective wetting agent 125, a free film 130 having a magnetic moment 132, an oxide interlayer 140, and a selective capping film 150. In one embodiment, the capping film 150 is a metallic film. Bottom and top contacts are formed, but are not shown in the drawing. Similarly, polarization enhancing and other films may be present, but are not shown for simplicity. As can be seen in FIG. 1, the magnetic junction 100 is a bottom pinned magnetic junction. Thus, the reference membrane 110 is closer to the underlying substrate (not shown in FIG. 1) than the free membrane 130 .

[0017] The reference film 110 is magnetic. In the illustrated embodiment, the reference film 110 has high perpendicular magnetic anisotropy. Thus, the perpendicular magnetic anisotropy energy for the reference film 110 is greater than the out-of-plane magnetic erase energy of the reference film 110. Thus, the reference film magnetic moment 112 is oriented perpendicular to the plane. In other embodiments, the reference film 110 does not have high perpendicular magnetic anisotropy. For example, in one embodiment, the reference film 110 has an in-plane magnetic moment. A selective pinning film (not shown) is used to pin the magnetic moment 112 of the reference film 110. In one embodiment, the selective pinning film is an AFM film or a multi-film that pins the magnetization by exchange-bias interactions. In one embodiment, the selective pinning film includes a highly anisotropic magnetic film (e.g., one or more CoPt and / or CoPd films) coupled via a metallic spacer film that induces an antiferromagnetic configuration, thus forming (collectively) a synthetic antiferromagnetic (SAF) reference film. However, in other embodiments, the selective pinning film is omitted or other structures are used. In one embodiment, the reference film 110 does not contain a deposited glass former.

[0018] The non-magnetic spacer film 120 is disposed between the reference film 110 and the free film 130. In one embodiment, the non-magnetic spacer film 120 is a tunneling barrier film. For example, the non-magnetic spacer film 120 is a crystalline MgO film. In some embodiments where the non-magnetic spacer film 120 is a tunneling barrier film, the resistance of the non-magnetic spacer film 120 is much higher than the resistance of the oxide intermediate film 140. However, other materials can be used for the non-magnetic spacer film 120. For example, the non-magnetic spacer film 120 has other structures, such as conductive or semiconductive.

[0019] The free film 130 is fabricated on a wetting agent 125, such as an atomic film wetting agent. Such wetting agent 125 may include or consist of 3d transition elements such as V, Cr, Mn, Fe, Co, and / or Ni exposed to oxygen (e.g., oxidation treatment) and / or other gaseous elements or compounds that provide similar wetting functions. Formation of the wetting agent 125 occurs prior to free film deposition. The wetting agent 125 is deposited or fabricated on the non-magnetic spacer film 120. In one embodiment, the wetting agent 125 is thinner than two atomic films (e.g., less than 2 Å thick). The thickness of such wetting agent 125 allows for the presence of a discontinuous film that allows oxygen atoms to be in the gaps between the nearest pre-deposited ferromagnetic atoms. In one embodiment, the wetting agent 125 is omitted.

[0020] The free film 130 is magnetic. Thus, the free film 130 includes or is composed of a ferromagnetic material, such as Fe, Co, CoFe, Co-based Heusler alloys, and / or Mn-based Heusler alloys. Other and / or additional materials are used in some embodiments. For example, in one embodiment, ferromagnetic and non-magnetic materials are included in the free film 130. In the illustrated embodiment, the free film 130 has high perpendicular anisotropy. The perpendicular magnetic anisotropy energy for the free film 130 is greater than the out-of-plane magnetic erase energy of the free film 130. Thus, the free film magnetic moment 132 is oriented perpendicular to the plane. In other embodiments, the free film 130 does not have high perpendicular magnetic anisotropy. In one embodiment, the free film 130 has a small thickness. For example, in one embodiment, the thickness (t) of the free film 130 is less than 30 Å. In one embodiment, the free film 130 is less than 15 Å. In one embodiment, the free film 130 has a thickness of less than 4 Å and 8 Å, although other thicknesses are possible.

[0021] In one embodiment, the free film 130 does not contain a glass former such as deposited boron. This is in contrast to a CoFeB free film that contains deposited boron. Thus, the free film 130 is a boron-free free film. That is, the free film 130 is free of deposited boron. Thus, the free film 130 may not be completely amorphous as deposited. The deposited free film 130 is a mixture of crystalline or nanocrystalline and an amorphous matrix. As used herein with respect to a free film, "crystalline as-deposited" refers to a free film that is at least partially crystalline as-deposited. In one embodiment, a free film that is crystalline as-deposited is predominantly crystalline (e.g., more than half crystalline or nanocrystalline). In some such embodiments, the deposited free film is considered to be completely crystallized. Although described below with respect to a boron-free free film, in one embodiment, the described free film is free of other and / or all glass formers as-deposited. For example, the free film 130 does not include boron (B), carbon (C), and other glass forming substances used to provide amorphous deposited films. Thus, as used herein, a film that is said to be free of glass forming elements does not include deposited glass forming elements. However, in one embodiment, the free film 130 does include one or more glass forming agents.

[0022] The oxide interlayer 140 is disposed on the free film 130. In one embodiment, the oxide interlayer 140 is adjacent to or shares a boundary with the free film 130. In one embodiment, one or more intervening films are between the free film 130 and the oxide interlayer 140. The oxide interlayer 140 is an oxide that includes one or more glass formers. In one embodiment, the oxide interlayer 140 is an oxide of one or more metals, such as Mg, Ti, Ta, Zr, Hf, V, and / or Nb. In some such embodiments, oxides of Ta, Zr, and / or Hf form part of the oxide interlayer 140. The glass formers include one or more of Si, Be, B, Al, P, and Ga. In one embodiment, other glass formers are used instead, or Si, Be, B, Al, P, and / or Ga are used in addition. In one embodiment, the oxide interlayer 140 includes 0 atomic % to 50 atomic % of the glass formers. In one embodiment, the oxide interlayer 140 includes 30 atomic % or less of the glass forming agent. In one embodiment, the oxide interlayer 140 includes 5 atomic % or more of the glass forming agent. However, other stoichiometries are possible.

[0023] The presence of glass formers allows the material to have an amorphous (e.g., glass-like) structure rather than being crystalline. In one embodiment, the oxide interlayer 140 is majority (more than half) amorphous. In one embodiment, the oxide interlayer 140 is considered to be fully amorphous. "Amorphous" as used herein to describe oxide films that include glass formers includes those that are partially majority and fully amorphous. Thus, the oxide interlayer 140 includes glass formers and is amorphous.

[0024] The oxide interlayer 140 is also thin. In one embodiment, the oxide interlayer 140 is 20 Å or less in thickness. In one embodiment, the oxide interlayer 140 is less than 15 Å. In one embodiment, the oxide interlayer 140 has a thickness of 12 Å or less. For example, the oxide interlayer 140 is at least 6 Å and no more than 12 Å. In one embodiment, the oxide interlayer 140 is 8 Å or less in thickness.

[0025] The oxide interlayer 140 improves the performance of the magnetic junction 100. Such improvement has particular utility when the free film 130 is a free film free of glass formers, such as a free film free of boron. The oxide interlayer 140 is smooth, continuous, stable, amorphous, and thin. The oxide interlayer 140 has reduced roughness, fewer pinholes, and / or fewer porosity than oxide films free of glass formers. The use of glass formers in the oxide film 140 is effective in achieving a more stable amorphous state. Such high quality thin oxide films can prevent or inhibit element diffusion from films over the oxide interlayer 140 (e.g., metallic capping film 150) and / or from the oxide interlayer 140 itself to the free film 130 or vice versa. For example, diffusion of Ti, Ta, Zr, Hf, V, and / or Nb can be reduced or prevented. Because the oxide interlayer 140 is amorphous, the lattice mismatch with the underlying crystalline film, such as the boron-free free film 130, is mitigated or eliminated. The smooth, continuous, and stable film improves the electrical properties of the junction. As a result, a high tunneling magnetoresistance (TMR) and low damping with respect to the free film 130 is obtained. Thus, the oxide interlayer 140 has improved stability, quality (e.g., increased stability and / or fewer or no porosity and / or pinholes) and thickness. The oxide interlayer 140 also reduces interdiffusion between the films (130, 140, and / or 150) to mitigate the lattice mismatch. The characteristics of the free film 130 and the magnetic junction 100 are improved.

[0026] The metallic capping layer 150 may be a single metallic capping layer, a bilayer, a triple layer, other multilayer, or have other structures. Some materials that can be used for the metallic capping layer 150 include refractory metals or high melting point metals (e.g., W, Mo, Ta, Nb, Ru, Ir, Re, Os), metallic alloys with glass formers, CoFeB, or CoFeB-M, where M includes one or more refractory metals and nitrides (e.g., TaN, TiN, MoN, VN, MN, NBN). In one embodiment, two or more of these materials are combined to form the metallic capping layer 150.

[0027] FIG. 2 is a flow chart illustrating an embodiment of a method 200 for providing a magnetic junction having an oxide interlayer that includes a glass former and can be used in a magnetic device such as a programmable magnetic memory using spin transfer torque. To simplify this, some processes may be omitted, performed in a different order, include substeps, or be combined. Also, the method 200 may begin after other processes for forming the magnetic junction have been performed. Typically, the films for the magnetic junction are deposited in a stack, the stack undergoes some steps such as annealing, a mask film is provided on the stack that is photolithographically defined, and the edge of the magnetic junction is provided by etching the portion of the stack film exposed by the mask. Thus, the processes of the method 200 are interleaved.

[0028] In step 202, a reference film is provided. In one embodiment, step 202 includes depositing materials for the reference film. In one embodiment, the reference film is a multi-layer film, such as a composite reference film including two magnetic films sandwiching a non-magnetic film. Thus, step 202 includes depositing a multi-layer film in such an embodiment. In step 204, a non-magnetic spacer film is provided. For example, step 204 includes depositing and crystallizing a MgO or other oxide film by annealing. In one embodiment, other materials are deposited as part of step 204.

[0029] A free film is provided in step 206. In one embodiment, step 206 includes providing a wetting layer and depositing a free film material on the wetting layer. Thus, step 206 includes depositing a layer of approximately two 3d transition metal atoms and performing a heat treatment to provide the wetting layer. Following this process, the free film is formed. Also, step 206 includes depositing a free film that is free of glass formers. Thus, the free film material deposited in step 206 is crystalline and free of glass formers as deposited. In one embodiment, step 206 includes deposition materials such as Fe, Co, CoFe, Co-based Heusler alloys, and / or Mn-based Heusler alloys.

[0030] An oxide intermediate layer containing a glass former is provided on the free film in step 208. In one embodiment, step 208 includes depositing a metallic film containing a glass former and oxidizing the film. As described above, the edges of the reference film, the non-magnetic spacer film, the free film, and the oxide capping are defined at some time during the process. Thus, parts of steps 202, 204, 206, and 208 are performed at other times. In one embodiment, step 208 includes depositing an oxide film having a glass former. Fabrication is completed in step 210. Thus, additional structures are fabricated, such as metallic capping films, insulating films, and / or different structures used in the device. Steps such as annealing or other processing steps may also be provided.

[0031] For example, magnetic and / or other materials for the reference film 110 are provided in step 202. An oxide or other material for the non-magnetic spacer film 120 is deposited in step 204. The free film 130 is deposited in step 206. The oxide intermediate film 140 is deposited in step 208. The capping film 150 is formed as part of step 210. In steps 202, 204, 206, 208, and part of step 210, a mask (e.g., a hard mask) is provided having openings that allow the film for the multiple features (110, 120, 130, 140, and 150) to be removed. The mask is used to etch the exposed portions of the film for the multiple features (110, 120, 130, 140, and 150) to form the magnetic junction 100. Thus, the magnetic junction 100 can be provided and its advantages achieved.

[0032] 3 is a flow chart illustrating one embodiment of a method 300 for providing an oxide interlayer that includes a glass former and can be used for magnetic bonding. Thus, method 300 is used in step 208 of method 200. For simplicity, some processes may be omitted, performed in another order, include substeps, or be combined. Also, method 300 begins after other steps of forming a magnetic bond have been performed.

[0033] 4(a)-4(c) illustrate an embodiment of a portion of a magnetic junction 400 during formation of an oxide interlayer that includes a glass former. Thus, the method 300 is described with respect to the magnetic junction 400. However, in an embodiment, other magnetic junctions are formed.

[0034] In step 302, a metallic film is deposited that includes one or more metals and one or more glass formers. In one embodiment, the film is amorphous. In one embodiment, a binary metallic / glass former film is deposited in step 302. In one embodiment, the film deposited in step 302 is a silver alloy. In one embodiment, the film deposited in step 302 is an amorphous binary alloy film, such as Mg-X, Ti-X, Ta-X, Zr-X, Hf-X, VX, and Nb-X, where X is a glass former. In one embodiment, the glass former is 50 atomic % or less of the alloy. In one embodiment, the glass former is 30 atomic % or less of the alloy. In one embodiment, the glass former is 5 atomic % or more of the alloy. However, other stoichiometries are possible.

[0035] FIG. 4(a) illustrates some of the elements of the magnetic junction 400 after step 302. Thus, the lower non-magnetic spacer film 420 and the free film 430 are illustrated. The individual components 422 (light grey circles) and 432 (dark grey circles) of the non-magnetic spacer film 420 and the free film 430 are illustrated, respectively. The composition of the non-magnetic spacer film 420 (individual components 422) is shown to be the same, but the individual components 422 show a number of different elements, such as Mg and O. Similarly, the individual components 432 of the free film 430 are shown to be the same, but the composition of the individual components 432 shows a number of different elements, such as Co and Fe. In the illustrated embodiment, the non-magnetic spacer film 420 and the free film 430 are crystalline. Thus, the free film 430 is a free film without any deposited glass formers (e.g., no boron). Also illustrated in FIG. 4(a) is an amorphous metallic / glass former film 440. Metallic / glass former film 440 includes a metal component 442 (large grey circle) and a glass former component 444 (small grey circle). In one embodiment, metal component 442 represents a single metal (e.g., Ti) and glass former component 444 represents a single glass former (e.g., B). In one embodiment, film 440 is a bilayer film. In other embodiments, metal component 442 represents multiple metals and glass former component 444 represents multiple glass formers.

[0036] A natural or reactive oxidation of the metallic / glass former film 440 is performed in step 304. The oxidation may be performed by a single oxidation step or multiple oxidation steps. Also, the deposition in step 302 and / or the oxidation in step 304 may be repeated in step 306 to provide an oxide interlayer of a desired thickness. FIG. 4(b) illustrates the magnetic junction 400 after the oxidation steps performed in steps 304 and / or 306. Thus, the oxide interlayer 440' includes oxygen 446 (small black colored circles). In one embodiment, steps 304 and / or 306 include an annealed magnetic junction 400. In one embodiment, the magnetic junction 400 is annealed in a subsequent process. For example, the annealing or heat treatment may be performed after the metal capping film is formed or after device patterning / fabrication. In one embodiment, the magnetic junction is heat treated in steps 304 / 306 as part of the annealing process. FIG. 4(c) illustrates the magnetic junction 400 after the heat treatment as part of the annealing or oxidation. Thus, an oxide intermediate film 440' containing glass former constituents 444 is formed. Oxygen 446 is distributed in the oxide intermediate film 440". Thus, a stable amorphous oxide intermediate film 440" is formed. In some cases, some of the glass former constituents 444 diffuse somewhat into the free film 430'. However, as shown in FIG. 4(c), diffusion is expected to be relatively minimal. An additional film similar to the metal capping film may also be provided at step 308.

[0037] Thus, using method 300, an oxide interlayer, such as oxide interlayer 440'', is formed for a magnetic junction, such as magnetic junction 400. The oxide interlayer 440'' thus formed is thin, stable, amorphous, and continuous. The oxide interlayer 440'' has a much lower resistance than the non-magnetic spacer film 420. For example, the oxide interlayer 440' has negligible resistance compared to the resistance of the non-magnetic spacer film 420. As a result, properties such as TMR, stability (e.g., reduced diffusion), and magnetic damping are improved. Thus, the performance of a magnetic junction formed, such as magnetic junction 400, is improved.

[0038] 5 is a flow chart illustrating another embodiment of a method 500 for providing an oxide interlayer that includes a glass former and can be used for magnetic bonding. Thus, method 500 can be used in step 208 of method 200. For simplicity, some processes may be omitted, performed in a different order, include substeps, or be combined. Also, method 500 may begin after other steps of forming a magnetic bond have been performed.

[0039] At step 502, an oxide interlayer including a glass former is provided. In one embodiment, step 502 includes sputtering an oxide target (e.g., MgO, TiOx, TaOx, ZrOx, HfOx, VOx, and / or NbOx, where Ox represents an oxide) containing a glass former (e.g., Si, Be, B, Al, P, and / or Ga). In one embodiment, the glass former is 50 atomic % or less of the oxide target. In one embodiment, the glass former is 30 atomic % or less of the oxide target. In one embodiment, the glass former is 5 atomic % or more of the oxide target. However, other stoichiometries are possible. Thus, an oxide interlayer including a glass former is formed. An additional film, such as a metal capping film, is also provided at step 504.

[0040] Using the method 500, an oxide interlayer, such as the oxide interlayer (140 and / or 440"), is formed for a magnetic junction, such as the magnetic junction (100 and / or 400). The formed oxide interlayer is thin, stable, amorphous, and continuous. The oxide interlayer (140 and / or 440") has a much lower resistance than the non-magnetic spacer film 120. For example, the oxide interlayer (140 and / or 440") has negligible resistance compared to the non-magnetic spacer film (120 and / or 420). As a result, properties such as TMR, stability (e.g., reduced diffusion), and magnetic damping are improved. Thus, the performance of the formed magnetic junction, such as the magnetic junction (100 and / or 400), is improved.

[0041] FIG. 6 illustrates a second embodiment of a magnetic junction 600 having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. For clarity, FIG. 6 is not drawn to scale. The magnetic junction 600 can be used in magnetic devices such as STT-MRAM, spin-orbit torque MRAM (SOT-MRAM), logic devices, other integrated circuits, and a variety of electronic devices. The magnetic junction 600 includes an optional seed film 602 residing on a substrate 610, a reference film 610 having a magnetic moment 612, a free film 630 having a magnetic moment 632, an oxide interlayer 640, and an optional capping film 650. In one embodiment, the capping film 650 is a metallic film. Bottom and top contacts are formed, not shown. Similarly, polarization enhancement and other films may be present, but are not shown for simplicity. As can be seen from FIG. 6, the magnetic junction 600 is a top pinned magnetic junction. Thus, the free membrane 630 is closer to the underlying substrate (not shown in FIG. 1) than the reference membrane 610 .

[0042] The reference film 610 is magnetic and similar to the reference film 110. Thus, the reference film 610 has a perpendicular magnetic anisotropy that exceeds the out-of-plane magnetic erase energy. The free film 630 is similar to the free film 130. Thus, the free film 630 is a free film without a glass former. Thus, the free film 630 is crystalline. Thus, the seed film 602 includes a hardener. The free film 130 is magnetic and includes or consists of a ferromagnetic material, such as Fe, Co, CoFe, Co-based Heusler alloys, and / or Mn-based Heusler alloys. Other and / or additional materials are used in some embodiments. In the illustrated embodiment, the free film 630 has a high perpendicular magnetic anisotropy. In one embodiment, the free film 630 is thin. For example, the thickness (t) of the free film 630 is less than 30 Å in some embodiments. In some such embodiments, the free film 630 is less than 15 Å. In one embodiment, the free film 630 is ultimately less than 4 Å or less than 8 Å. However, other thicknesses are possible. In one embodiment, the free film 630 does not contain any glass formers, such as deposited boron. As such, the free film 630 is crystalline as deposited.

[0043] The oxide interlayer 640 overlies the free film 630 and functions as a tunneling barrier film. The oxide interlayer 640 also includes glass formers as described above in connection with the oxide interlayers (140 and 440"). Thus, the oxide interlayer is similar to the oxide interlayers (140 and 440"). However, the oxide interlayer 640 preferably allows tunneling magnetoresistance to occur between the reference film 610 and the free film 630. In one embodiment, the oxide interlayer 640 is an oxide of one or more metals, such as Mg, Ti, Ta, Zr, Hf, V, and / or Nb. In some such embodiments, oxides of Ta, Zr, and / or Hf form part of the oxide interlayer 640. The glass formers include one or more of Si, Be, B, Al, P, and Ga. In one embodiment, the oxide interlayer 640 includes between 0 atomic % and 50 atomic % of the glass formers. In one embodiment, the oxide interlayer 640 includes less than 30 atomic % of the glass formers. In one embodiment, the oxide interlayer 640 comprises 5 atomic % or more of the glass formers; however, other stoichiometries are possible. In one embodiment, there is an oxide interlayer 660 that comprises the glass formers. The oxide interlayer 660 is similar to the oxide interlayer 640, but is between the optional seed layer 602 and the free layer 630. The oxide interlayer 660 may be used in addition to or instead of the oxide interlayer 640. In one embodiment, the oxide interlayer 660 is omitted.

[0044] Not only the oxide interlayer 640, but also the oxide interlayer 660 improves the function of the magnetic junction 600. The oxide interlayer 640 is smooth, continuous, stable, amorphous, and thin. The oxide interlayer 660 has a much lower resistance than the oxide interlayer 640. For example, the oxide interlayer 660 has negligible resistance compared to the oxide interlayer 640 corresponding to the tunneling barrier film. As a result, properties such as TMR, stability (e.g., reduced diffusion), and magnetic damping are improved. Thus, the performance of the magnetic junction 600 is improved.

[0045] FIG. 7 illustrates a third embodiment of a magnetic junction 700 having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. For clarity, FIG. 7 is not drawn to scale. The magnetic junction 700 can be used in magnetic devices such as STT_MRAM, spin-orbit torque MRAM (SOT-MRAM), logic devices, other integrated circuits, and a variety of electronic devices. The magnetic junction 700 is on a substrate 701 and includes an optional seed film 702, a reference film 710 having a magnetic moment 712, a non-magnetic spacer film 720, a free film 730 having a magnetic moment 732, an oxide interlayer 740, and an optional capping film 750. In one embodiment, the capping film 750 is a metallic film. Bottom and top contacts are not shown, but are formed. Similarly, polarization enhancing and other films may be present, but are not shown for simplicity. The reference film 710, the non-magnetic spacer film 720, and the free film 730 are similar to the reference film (110, 610), the non-magnetic spacer film 120, and the free film (130, 630). Thus, the free film 730 is a free film without a glass former. The reference film 760, which includes a magnetic moment 762, is similar to the reference film 710. Thus, the magnetic junction 700 is a double magnetic junction.

[0046] The oxide interlayer 740 overlies the free film 730 and functions as a tunneling barrier film. The oxide interlayer 740 also includes a glass former as described above in connection with the oxide interlayers (140 and 440"). That is, the oxide interlayer is similar to the oxide interlayers (140, 440"). However, the oxide interlayer 740 preferably enables a tunneling magnetoresistance to occur between the reference film 760 and the free film 730. Thus, the oxide interlayer is similar to the oxide interlayer 640. In one embodiment, the oxide interlayer 740 is an oxide of one or more metals, such as Mg, Ti, Ta, Zr, Hf, V, and / or Nb. In some such embodiments, oxides of Ta, Zr, and / or Hf form part of the oxide interlayer 740. The glass former includes one or more of Si, Be, B, Al, P, and Ga. In one embodiment, the oxide interlayer 740 includes 0 atomic % to 50 atomic % of the glass former. In one embodiment, the oxide interlayer 740 comprises 30 atomic % or less of the glass former. In one embodiment, the oxide interlayer 740 comprises 5 atomic % or more of the glass former. However, other stoichiometries are possible.

[0047] The oxide interlayer 740 improves the performance of the magnetic junction 700. The oxide interlayer 740 is smooth, continuous, stable, amorphous, and thin. The oxide interlayer 740 has a much lower resistance than the non-magnetic spacer film 720. For example, the oxide interlayer 740 has negligible resistance compared to the non-magnetic spacer film 720. As a result, properties such as TMR, stability (e.g., reduced diffusion), and magnetic damping are improved. Thus, the performance of the magnetic junction 700 is improved.

[0048] FIG. 8 illustrates a fourth embodiment of a magnetic junction 800 having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. For clarity, FIG. 8 is not drawn to scale. The magnetic junction 800 can be used in magnetic devices such as STT-MRAM, spin-orbit torque MRAM (SOT-MRAM), logic devices, other integrated circuits, and a variety of electronic devices. The magnetic junction 800 is on a substrate 801 and includes an optional seed film 802, a reference film 810 having a magnetic moment 812, a non-magnetic spacer film 820, a free film 830 having a magnetic moment 832, an oxide interlayer 840, and an optional capping film 850. In one embodiment, the capping film 850 is a metallic film. Bottom and top contacts are not shown, but are formed. Similarly, polarization enhancing and other films may be present, but are not shown for simplicity. The reference film 810, the non-magnetic spacer film 820, and the free film 830 are similar to the reference film (110, 610, 710), the non-magnetic spacer film (120, 720), and the free film (130, 630, 730). In the illustrated embodiment, the free film 830 is a free film that is free of glass formers. In one embodiment, the reference film 810 is free of glass formers. In the illustrated embodiment, the substrate 801 is a crystalline substrate, such as MgO(001) or Si(001). In one embodiment, the films (802, 810, 820, and 830) are epitaxially grown on a crystalline substrate. In such an embodiment, the deposited films (802, 810, 820, and 830) must be crystalline.

[0049] Oxide interlayer 840 is on free film 830 and includes glass formers as described above in connection with oxide interlayers (140 and 440"). Thus, oxide interlayer 840 is similar to oxide interlayers (140 and 440"). In one embodiment, oxide interlayer 840 is an oxide of one or more metals, such as Mg, Ti, Ta, Zr, Hf, V, and / or Nb. In some such embodiments, oxides of Ta, Zr, and / or Hf form part of oxide interlayer 840. The glass formers include one or more of Si, Be, B, Al, P, and Ga. In one embodiment, oxide interlayer 840 includes 0 atomic % to 50 atomic % of the glass formers. In one embodiment, oxide interlayer 840 includes 30 atomic % or less of the glass formers. In one embodiment, oxide interlayer 840 includes 5 atomic % or more of the glass formers. However, other stoichiometries are possible.

[0050] Also shown is a wetting film 822. The wetting film 822 may be provided by sputtering, physical vapor deposition (PVD), or other suitable process, and may be used in the glass former-free free film 830. Although shown as a continuous wetting film 822, it is not limited thereto. The wetting film 822 may include materials that may be used as precursors in subsequent magnetic films. The wetting film 822 may include or consist of 3d transition metals and / or alloys thereof. For example, the wetting film 822 may include at least one of Fe, Co, Ni, Mn, Co-containing alloys such as CoFe, Ni-containing alloys, and Mn-containing alloys. Optionally, other materials may be included as part of the wetting film 822. However, any elements that are not included in the subsequent glass former-free film may be omitted in the wetting film 822. In one embodiment, the material used in the wetting film 822 is magnetic. The wetting film 822 is also thin. In one embodiment, the thickness of the wetting film is at least 0.25 monolayers and does not exceed 3 monolayers. In some cases, the thickness is greater than or equal to 0.5 monolayers and less than or equal to 2 monolayers. In some such embodiments, the wet membrane 822 has a thickness between 0.75 monolayers and 1.25 monolayers. A fragmentary monolayer corresponds to a monolayer having holes therein, i.e., an incomplete monolayer.

[0051] The oxide interlayer 840 improves the performance of the magnetic junction 800. The oxide interlayer 840 is smooth, continuous, stable, amorphous, and thin. The oxide interlayer 840 has a much lower resistance than the non-magnetic spacer film 820. For example, the oxide interlayer 840 has negligible resistance compared to the non-magnetic spacer film 820. As a result, properties such as TMR, stability (e.g., reduced diffusion), and magnetic damping are improved. Thus, the performance of the magnetic junction 800 is improved.

[0052] FIG. 9 illustrates a fifth embodiment of a magnetic junction 900 having an oxide interlayer that includes a glass former and can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. For clarity, FIG. 9 is not drawn to scale. The magnetic junction 900 can be used in magnetic devices such as STT-MRAM, spin-orbit torque MRAM (SOT-MRAM), logic devices, other integrated circuits, and a variety of electronic devices. The magnetic junction 900 is on a substrate 901 and includes an optional seed film 902, a reference film 910 having a magnetic moment 912, a non-magnetic spacer film 920, an optional wetting film 922, a hybrid free film 930, an oxide interlayer 940, and an optional capping film 950. In one embodiment, the capping film 950 is a metallic film. Bottom and top contacts are not shown in the drawing, but are formed. Similarly, polarization enhancing and other films may be present but are not shown for simplicity. The reference membrane 910, the non-magnetic spacer membrane 920, and the selectively wetting membrane 922 are similar to the reference membranes (110, 610, 710, 810), the non-magnetic spacer membranes (120, 720, 820), and the selectively wetting membrane 822. In one embodiment, the reference membrane 910 is free of a glass former.

[0053] In the illustrated embodiment, the free film 930 is a hybrid free film including multiple films (934, 940, 936). The first free film 934 has a magnetic moment 932 and the second free film 936 has a magnetic moment 938. The first free film 934 and the second free film 936 are magnetically coupled through the oxide interlayer 940. Thus, when the magnetic junction 900 is at rest (e.g., not recording), the magnetic moments (932 and 938) are aligned parallel. The first free film 934 is similar to the free films (130, 630, 730, 830). Thus, the first free film 934 is a free film without a glass former. The oxide interlayer 940 is similar to the oxide interlayers (140, 640, 740, 840). Thus, the oxide interlayer 940 is on the first free film 934 and includes the glass formers described above in connection with the oxide interlayers (140, 440"). Thus, the oxide interlayer is similar to the oxide interlayers (140 and 440"). In one embodiment, the oxide interlayer 940 is an oxide of one or more metals, such as Mg, Ti, Ta, Zr, Hf, V, and / or Nb. In some such embodiments, oxides of Ta, Zr, and / or Hf form part of the oxide interlayer 840. The glass formers include one or more of Si, Be, B, Al, P, and Ga. In one embodiment, the oxide interlayer 940 includes between 0 atomic % and 50 atomic % of the glass formers. In one embodiment, the oxide interlayer 940 includes 30 atomic % or less of the glass formers. In one embodiment, the oxide interlayer 940 includes 5 atomic % or more of the glass formers. However, other stoichiometries are possible. Additionally, the oxide interlayer 940 forms a bonding layer between the first free layer 934 and the second free layer 936. The second free layer 936 may be configured as desired. For example, the second free layer 936 may be a CoFeB free layer.

[0054] The thin non-magnetic spacer film 960 is an insulator or a conductor. For example, the thin non-magnetic spacer film 960 is an oxide or a metal. The resistance of the thin non-magnetic spacer film 960 is much smaller than the resistance of the non-magnetic spacer film 920. In one embodiment, the resistance of the thin non-magnetic spacer film 960 is negligible compared to the resistance of the non-magnetic spacer film 920.

[0055] The oxide interlayer 940 improves the performance of the magnetic junction 900. The oxide interlayer 940 is smooth, continuous, stable, amorphous, and thin. The oxide interlayer 940 has a much lower resistance than the non-magnetic spacer film 920. For example, the oxide interlayer 940 has negligible resistance compared to the resistance of the non-magnetic spacer film 920. As a result, properties such as TMR, stability (e.g., reduced diffusion), and magnetic damping are improved. Thus, the performance of the magnetic junction 900 is improved.

[0056] FIG. 10 illustrates an exemplary embodiment of a memory 1000 utilizing magnetic junctions having an oxide film with a glass former that can be used in magnetic devices such as programmable magnetic memories using spin transfer torque. The memory 1000 uses one or more magnetic junctions (100, 400, 400', 400", 600, 700, 800, 900) and / or other magnetic junctions that include an oxide film with a glass former. In other embodiments, the memory is of other configurations or utilizes other mechanisms for reading and / or writing to the magnetic junctions. The magnetic memory 1000 includes read / write column select drivers (1002 and 1006) as well as a word line select driver 1004. Other components may also be provided. The storage area of ​​the memory 1000 is made up of magnetic storage cells 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 114, 115, 116, 117, 118, 119, 120, 121, 122, 123, 124, 125, 126, 127, 128, 129, 130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141, 142, 143, 144, 145, 146, 147, 148, 149, 150, 151, 152, 153, 154, 155, 156, 157, 158 0. Each magnetic storage cell includes at least one magnetic junction 1012 utilized as a memory element (e.g., to store data) and at least one selection element 1014. The selection element 1014 is activated by line 1005, while line 1003 is used for the magnetic junction 1012. In one embodiment, the selection element 1014 is a transistor. The magnetic junction 1012 is one of the magnetic junctions (100, 400, 400', 400", 600, 700, 800, 900) and / or other magnetic junctions including oxide films having a glass forming material. Although one magnetic junction 1012 is shown per magnetic storage cell 1010, in other embodiments other numbers of magnetic junctions 1012 per cell are provided. In this manner, the magnetic memory 1000 has the advantages discussed above.

[0057] Although the embodiments of the present invention have been described in detail above with reference to the drawings, the present invention is not limited to the above-described embodiments and can be modified in various ways without departing from the technical spirit of the present invention. [Explanation of symbols]

[0058] 100, 400, 600, 700, 800, 900, 1012 Magnetic Junction 101, 601, 701, 801, 901 boards 102, 602, 702, 802, 902 (selective) seed membrane 110, 610, 710, 760, 810, 910 reference membrane 112, 132, 612, 632, 712, 732, 762, 812, 832, 912, 932, 938 Magnetic moment 120, 420, 720, 820, 920 Non-magnetic spacer film 125 (Selective) Wetting Agent 130, 430, 430', 630, 730, 830 free membrane 140, 440', 440”, 640, 660, 740, 840, 940 Oxide interlayer 150, 650, 750, 850, 950 (Metallic) (Selective) Capping Film 440 Metallic / glass forming agent film 422, 432 Individual components 442 Metallic Components 444 Glass forming agent components 446 Oxygen 822, 922 (selective) Wetting membrane 930 Hybrid Free Film 934, 936 1st and 2nd free membrane 960 Thin non-magnetic spacer film 1000 Memory 1002, 1006 Read / record column selection driver 1003, 1005 lines 1004 Word Line Select Drive 1010 Magnetic Storage Cell 1014 Selection element

Claims

1. A free membrane, an oxide intermediate film on the free film; The oxide interlayer includes a metal and at least one glass forming agent; 5. A magnetic junction comprising: said at least one glass former in an amount of 5 atomic % to 50 atomic % based on the total atomic weight of said metal and said at least one glass former.

2. further comprising a reference film and a non-magnetic spacer film; the non-magnetic spacer film is disposed between the reference film and the free film; 2. The magnetic junction of claim 1, wherein the free film is disposed between the non-magnetic spacer film and the oxide interlayer.

3. The magnetic junction of claim 1 , wherein the free film is boron-free.

4. The magnetic junction of claim 1 , wherein the oxide intermediate film shares a boundary with the free film.

5. The oxide intermediate film contains a metal oxide, 2. The magnetic junction of claim 1, wherein the metal oxide comprises at least one of Mg, Ti, Ta, Zr, Hf, V, and Nb.

6. 2. The magnetic junction of claim 1, wherein the at least one glass former is selected from the group consisting of Si, Be, B, Al, P, and Ga.

7. Further comprising a substrate; 2. The magnetic junction of claim 1, wherein the free film is between the substrate and the oxide interlayer.

8. A plurality of magnetic junctions; a plurality of conductive lines coupled to the plurality of magnetic junctions; each of the plurality of magnetic junctions includes a reference film, a non-magnetic spacer film, a free film, and an oxide intermediate film formed on the free film; the non-magnetic spacer film is disposed between the reference film and the free film; the free film is disposed between the nonmagnetic spacer film and the oxide intermediate film; The oxide interlayer includes a metal and at least one glass forming agent; The magnetic device, wherein the at least one glass former is present in an amount of 5 atomic % to 50 atomic % based on the total atomic weight of the metal and the at least one glass former.

9. 9. The magnetic device of claim 8, wherein the free film is boron-free.

10. The oxide intermediate film contains a metal oxide, 9. The magnetic device of claim 8, wherein the metal oxide comprises at least one of Mg, Ti, Ta, Zr, Hf, V, and Nb.

11. 9. The magnetic device of claim 8, wherein the at least one glass former is selected from the group consisting of Si, Be, B, Al, P, and Ga.

12. Further comprising a substrate; 9. The magnetic device of claim 8, wherein the free film for each of the plurality of magnetic junctions resides between the oxide interlayer and the substrate.

13. providing a reference membrane; providing a non-magnetic spacer film; providing a free membrane; providing an oxide intermediate layer on the free film; The oxide interlayer includes a metal and at least one glass forming agent; 13. A method for providing a magnetic junction, comprising: providing said at least one glass former in an amount of from 5 atomic % to 50 atomic % based on a combined atomic weight of said metal and said at least one glass former.

14. The step of providing the oxide intermediate film includes at least one of a first process and a second process; the first process includes depositing a metallic film comprising a metal and the at least one glass forming agent, and oxidizing the metallic film; 14. The method of claim 13, wherein the second process includes depositing an oxide capping film.

15. The method of claim 13, wherein the step of providing a free film comprises providing a free film that does not include boron.

16. The oxide intermediate film contains a metal oxide, 14. The method of claim 13, wherein the metal oxide comprises at least one of Mg, Ti, Ta, Zr, Hf, V, and Nb.

17. 14. The method of claim 13, wherein the at least one glass former is selected from the group consisting of Si, Be, B, Al, P, and Ga.

Images