Electronic component, electronic component manufacturing method, electronic component management method, and program

Abstract

To provide an electronic component capable of identifying the manufacturing information of the electronic component when the characteristics of the electronic component deteriorate during use, a manufacturing method, a management method, and a program.SOLUTION: An electrolytic capacitor 1 as an electronic component includes internal elements and an exterior case 20. The production lot of the internal elements includes multiple subunits. An identifier 70 for identifying a plurality of small units is attached to the exterior. The identifier may be a one-dimensional code (barcode) / two-dimensional code, symbol, characters, or an IC chip, tag, and so on, or the identifier is not affixed to the exterior by printing but may be affixed to the exterior by sticking a sticker bearing the identifier to the exterior, or may be attached to a location other than the side of the exterior (top or bottom).SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure generally relates to electronic components, methods for manufacturing electronic components, methods for managing electronic components, and programs, and more particularly, to electronic components having an exterior, methods for manufacturing such electronic components, methods for managing such electronic components, and programs for realizing such management methods. [Background technology]

[0002] Patent Document 1 discloses a finite-life electronic component having at least initial characteristics and a life judgment value displayed on the outer surface of the electronic component body. In Patent Document 1, the characteristics of the finite-life electronic component are measured during use, and the measurement results are compared with the initial characteristics and life judgment value displayed on the electronic component body, making it possible to estimate the life transition time and remaining life, and to determine whether the electronic component can be reused. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-6976 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, when the characteristics of an electronic component deteriorate during use, it is required to identify the manufacturing information of the electronic component (information at the time of manufacture) so that it can be determined whether there was an abnormality in the manufacturing system for manufacturing the electronic component when the electronic component was manufactured. With the finite-life electronic component described in Patent Document 1, it is possible to determine whether the characteristics of the electronic component have deteriorated by comparing the measurement results with the initial characteristics, but it is not possible to know the manufacturing information of the electronic component.

[0005] The present disclosure has been made in consideration of the above-mentioned problems, and aims to provide an electronic component capable of identifying manufacturing information, a manufacturing method for an electronic component, a management method for an electronic component, and a program. [Means for solving the problem]

[0006] According to an aspect of the present disclosure, there is provided an electronic component including an internal element and an exterior, the internal element being produced in a production lot that includes a plurality of subunits, the exterior being provided with an identifier for identifying the plurality of subunits.

[0007] A method for manufacturing an electronic component according to one aspect of the present disclosure is a method for manufacturing an electronic component comprising an internal element and an exterior. The method comprises a lot process for manufacturing the internal element on a production lot basis, a separation process for separating the production lot into a plurality of small units each including one or more pieces, and a small unit process for processing the small units. The exterior is integrated with the internal element. The electronic component has an identifier attached to the exterior that identifies the plurality of small units.

[0008] According to one aspect of the present disclosure, there is provided a method for managing electronic components, the electronic components including an internal element and an exterior, the exterior being provided with an identifier for identifying a plurality of subunits in a production lot, the method managing the electronic components for each of the subunits by managing management information associated with the identifier.

[0009] A program according to an aspect of the present disclosure, when executed by a computer, causes the computer to execute the management method. Effect of the Invention

[0010] According to the present disclosure, it is possible to identify manufacturing information of electronic components. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view of an electrolytic capacitor, which is an example of an electronic component according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a partial cross-sectional view of the electrolytic capacitor as viewed obliquely. [Diagram 3]FIG. 3 is a cross-sectional view of the electrolytic capacitor. [Figure 4] FIG. 4 is a flowchart of a method for manufacturing an electrolytic capacitor, which is an example of an electronic component according to an embodiment of the present disclosure. [Diagram 5] FIG. 5 is a flow chart of a lot process in the above manufacturing method. [Figure 6] FIG. 6 is a flow chart of the separation and integration step in the above-mentioned production method. [Figure 7] FIG. 7 is a flow chart of a sub-unit process in the above manufacturing method. [Figure 8] FIG. 8 is a schematic diagram of a manufacturing system for an electrolytic capacitor, which is an example of an electronic component according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] (1) Implementation form (1.1) Configuration of electronic components First, an electrolytic capacitor 1 as an example of an electronic component according to this embodiment will be described with reference to Figs. 1 to 3. Fig. 1 is a perspective view of electrolytic capacitor 1. Fig. 2 is a partial cross-sectional view of electrolytic capacitor 1 viewed from an oblique angle. Fig. 3 is a cross-sectional view of electrolytic capacitor 1. Electrolytic capacitor 1 of this embodiment is a surface mount type electrolytic capacitor, and is a so-called hybrid type electrolytic capacitor in which a conductive polymer and an electrolytic solution are combined in the electrolyte.

[0013] As shown in FIG. 2, the electrolytic capacitor 1 includes a capacitor element (internal element) 10, a case (outer packaging) 20, a sealing member 30, an electrolyte 40, and a seat plate 50.

[0014] As shown in FIGS. 2 and 3, capacitor element 10 includes anode foil 11, cathode foil 12, separator 13, anode lead terminal 14, and cathode lead terminal 15.

[0015] The anode foil 11 comprises a metal foil whose surface has been roughened by, for example, an etching process. The metal foil is, for example, an aluminum foil. The material of the metal foil is preferably a valve metal such as aluminum, tantalum, niobium, or an alloy thereof. A dielectric film (dielectric layer) 16 is formed on the surface of the metal foil. The dielectric film 16 is formed, for example, by subjecting the metal foil to a chemical conversion treatment. The chemical conversion treatment is performed, for example, by immersing the metal foil in a chemical conversion solution and applying heat and voltage as necessary.

[0016] The cathode foil 12 includes, for example, a metal foil. The metal foil is, for example, an aluminum foil. The material of the metal foil is preferably a valve metal such as aluminum, tantalum, or niobium, or an alloy thereof. The metal foil of the cathode foil 12 may be subjected to a surface roughening treatment and / or a chemical conversion treatment, as necessary. The surface of the metal foil of the cathode foil 12 may be covered with a carbon coating, a titanium coating, or the like.

[0017] The separator 13 is disposed between the anode foil 11 and the cathode foil 12 to prevent contact between the anode foil 11 and the cathode foil 12. The separator 13 is made of an insulating material. The separator 13 is not particularly limited, and may be, for example, insulating paper or a nonwoven fabric mainly composed of cellulose, polyethylene terephthalate, vinylon, polyamide, glass, or the like.

[0018] The anode lead terminal 14 is connected to the anode foil 11. There are no particular limitations on the material of the anode lead terminal 14 as long as it is a conductive material. The anode lead terminal 14 integrally includes a lead tab 141 and a terminal plate 142. The lead tab 141 is connected to the anode foil 11 inside the case 20. The terminal plate 142 is exposed to the outside of the case 20.

[0019] Cathode lead terminal 15 is connected to cathode foil 12. There are no particular limitations on the material of cathode lead terminal 15 as long as it is a conductive material. Cathode lead terminal 15 integrally includes a lead tab 151 and a terminal plate 152. Lead tab 151 is connected to cathode foil 12 inside case 20. Terminal plate 152 is exposed to the outside of case 20.

[0020] Anode foil 11 connected to anode lead terminal 14 and cathode foil 12 connected to cathode lead terminal 15 are disposed opposite each other with separator 13 interposed therebetween. Anode foil 11, cathode foil 12, and separator 13 are then wound up into a roll to form capacitor element (wound element) 10 in a cylindrical shape.

[0021] Case 20 is made of a material such as aluminum and has a cylindrical shape with an open bottom. Capacitor element 10 is housed in case 20 such that terminal plate 142 of anode lead terminal 14 and terminal plate 152 of cathode lead terminal 15 are exposed to the outside.

[0022] In the electrolytic capacitor 1, a conductive polymer is disposed between the anode foil 11 and the cathode foil 12 in the case 20. The material of the conductive polymer may be, for example, polypyrrole, polythiophene, polyaniline, or a derivative thereof, and may further include a dopant. The conductive polymer may be attached in the form of a film to at least a part of the surface of the dielectric film 16 of the anode foil 11, the surface of the cathode foil 12, and the surface of the separator 13. After the capacitor element 10 is accommodated in the case 20, an electrolytic solution (electrolyte 40) is injected into the case 20.

[0023] The sealing member 30 is made of an elastic material such as rubber. The sealing member 30 is attached to the case 20 so as to close the opening in the lower surface of the case 20. The sealing member 30 has two through holes formed therein.

[0024] The seat plate 50 is made of an insulating material. The seat plate 50 is attached to the lower part of the case 20. Two through holes are formed in the seat plate 50 at positions corresponding to the through holes of the sealing member 30. In addition, two accommodation recesses are formed in the bottom surface (lower surface) of the seat plate 50, extending outward from the outlets of the through holes.

[0025] The anode lead terminal 14 and the cathode lead terminal 15 protruding from the inside of the case 20 to the outside are passed through the through hole of the sealing member 30 and the through hole of the seat plate 50, and are bent outward. The outwardly bent portion of the anode lead terminal 14 is accommodated in one of the two accommodating recesses of the seat plate 50 as a terminal plate 142. The outwardly bent portion of the cathode lead terminal 15 is accommodated in the other of the two accommodating recesses of the seat plate 50 as a terminal plate 152.

[0026] As shown in FIG. 1, a display section 60 indicating the characteristics of the electrolytic capacitor 1 is provided on the top surface 21 of the case 20. The display section 60 is displayed by printing on the top surface 21 of the case 20. In FIG. 2, the display section 60 is omitted. The display contents of the display section 60 include, for example, a black polarity display indicating the polarity (negative side) of the electrolytic capacitor 1, a capacitance value (numerical value: unit is μF), a rated voltage symbol, a series symbol, a lead-free compatible product mark (black dot), and a lot number (a number indicating a production lot). In the electrolytic capacitor 1 of this embodiment, a polarity display is provided in a first region (left side of FIG. 1) of the top surface 21 of the case 20. In addition, in a second region (right side of FIG. 1) of the top surface 21 of the case 20, a capacitance is provided in the upper row, a rated voltage symbol and a series symbol are provided in the middle row, and a lot number is provided in the lower row. Of course, the display contents and numerical values ​​of the display section 60 are not limited to those shown in FIG. 1.

[0027] 1, in addition to the display unit 60, an identifier 70 is attached to the case (exterior) 20. The identifier 70 is attached to the case 20 by display. More specifically, the identifier 70 is printed directly on the case 20. The identifier 70 is also on the side surface 22 of the case 20. In this embodiment, the identifier 70 is a matrix type two-dimensional code.

[0028] Here, the production lot of capacitor element (internal element) 10 of electrolytic capacitor 1 includes multiple small units (assemblies), and identifier 70 is an identifier that identifies the multiple small units. In other words, the production lot includes multiple assemblies (small units), each of which includes multiple electrolytic capacitors 1. Then, identifier 70 specifies the small unit to which electrolytic capacitor 1 belongs among the multiple small units included in a production lot that includes multiple electrolytic capacitors 1.

[0029] The minimum number of electrolytic capacitors 1 included in one small unit is 1. The number of electrolytic capacitors 1 included in each of the multiple small units is preferably the same, but may be different. For example, each of the multiple small units may include 1 to 10 electrolytic capacitors 1. Each of the multiple small units may include 10 to 100 electrolytic capacitors 1. Each of the multiple small units may include 100 to 1,000 electrolytic capacitors 1. Each of the multiple small units may include 1,000 to 10,000 electrolytic capacitors 1. Each of the multiple small units may include 10,000 or more electrolytic capacitors 1.

[0030] In this embodiment, the number of electrolytic capacitors 1 included in each of the multiple small units is one. In other words, in this embodiment, the small units are individual pieces. In short, the multiple electrolytic capacitors 1 included in one production lot are given identifiers 70 that are different from one another. In particular, in this embodiment, all of the electrolytic capacitors 1 included in all of the production lots are given identifiers 70 that are different from one another.

[0031] Identifier 70 is affixed to case (outer packaging) 20 of electrolytic capacitor 1 when electrolytic capacitor 1 is manufactured. Furthermore, when electrolytic capacitor 1 is manufactured, manufacturing information at the time of manufacturing of each electrolytic capacitor 1 is stored as management information in a database of management device 200 (described below) in association with identifier 70 affixed to this electrolytic capacitor 1. Therefore, by reading identifier 70 of electrolytic capacitor 1 and comparing it with the management information in the database, it is possible to individually identify manufacturing information (information at the time of manufacture) of electrolytic capacitor 1.

[0032] In one example, the manufacturing information includes information indicating the state of the manufacturing system for electrolytic capacitor 1, information indicating the inspection results of electrolytic capacitor 1, etc. Information on the state of the manufacturing system includes, for example, information such as the drive speed (motor rotation speed) of the devices included in the manufacturing system, and information on the temperature of the devices. Information indicating the inspection results includes, for example, information indicating the evaluation rank of the inspection results (such as a rank indicating excellent, good, or acceptable). In other words, the manufacturing information disclosed herein means information indicating the state of each product at the time of manufacture, rather than information indicating the general specifications of the product.

[0033] (1.2) Manufacturing method Next, a method for manufacturing electrolytic capacitor 1, as an example of an electronic component according to this embodiment, will be described with reference to Fig. 4 to Fig. 7. Fig. 4 is a flowchart showing the method for manufacturing electrolytic capacitor 1. The method for manufacturing electrolytic capacitor 1 includes a plurality of steps, and electrolytic capacitor 1 is manufactured by performing the plurality of steps in a predetermined order.

[0034] 4, the method for manufacturing an electronic component (electrolytic capacitor 1) of this embodiment includes a lot process S1, a separation and integration process S2, and a small unit process S3. In this embodiment, the lot process S1, the separation and integration process S2, and the small unit process S3 are performed in this order.

[0035] The lot process S1 is a process for manufacturing the capacitor element (internal element) 10 of the electrolytic capacitor 1 in production lot units (for each production lot). The separation / integration process S2 is a process for integrating the capacitor element (internal element) 10 with a case (exterior) 20, and separating the production lot into a plurality of small units. Here, each small unit includes one or more individual pieces. The small unit process S3 is a process for processing each small unit (for each small unit).

[0036] In this embodiment, in the separation / integration process S2, a production lot is separated into a plurality of pieces (individual capacitor elements 10). Then, in the small unit process S3, processing is performed on a piece-by-piece basis (for each capacitor element 10). In other words, in this embodiment, the small unit process S3 is a singulation process in which processing is performed on a piece-by-piece basis.

[0037] The method for manufacturing the electrolytic capacitor 1 of this embodiment will be described in more detail below.

[0038] As shown in FIG. 5, in the manufacturing method of the electrolytic capacitor 1 of this embodiment, the lot process S1 includes a lead connection process S11, a winding process S12, a rubber assembling process S13, a holding process S14, a cross section forming process S15, and a polymer process S16.

[0039] First, before the lead connection step S11, a metal foil (aluminum foil) of a predetermined size is etched and chemically treated, and then cut to a desired size to prepare an anode foil 11. Also, a metal foil (aluminum foil) of a predetermined size is cut to a desired size to prepare a cathode foil 12.

[0040] In the lead connecting step S11, lead tab 141 of anode lead terminal 14 is connected to anode foil 11 by, for example, crimping or ultrasonic welding, and lead tab 151 of cathode lead terminal 15 is connected to cathode foil 12 by, for example, crimping or ultrasonic welding.

[0041] In the winding step S12, the anode foil 11 and the cathode foil 12 are set to face each other with the separator 13 therebetween. The anode foil 11, the cathode foil 12, and the separator 13 are then wound into a roll to produce a wound element (capacitor element 10). Here, the multiple anode foils 11 and the cathode foils 12 are wound in order in the order in which the lead terminals 14, 15 were connected in the lead connecting step S11.

[0042] In the rubber assembling process S13, the sealing member 30 is attached to the wound element produced in the winding process S12. The anode lead terminal 14 and the cathode lead terminal 15 of the wound element are inserted into two through holes in the sealing member 30, respectively, to attach the sealing member 30 to the wound element. In the rubber assembling process S13, the sealing members 30 are attached to the wound elements in the order in which they were produced in the winding process S12, for example. That is, the sealing members 30 are attached to the wound elements in the order in which the wound elements were produced (chronologically).

[0043] In the holding step S14, the wound elements to which the sealing members 30 are attached are sequentially held by a band-shaped holder. The holder is, for example, a metal carrier bar. The wound elements are held by the holder so as to be lined up from the first end to the second end of the holder in the order in which they were produced (the order in which they were wound; the order in which the sealing members 30 were attached). The holder holds (for example, welds) the anode lead terminals 14 of the wound elements so that the height directions of the respective wound elements are aligned with each other. A plurality of wound elements held by one holder constitutes one production lot. One production lot includes, for example, about 10,000 to 50,000 wound elements.

[0044] In the cross-section chemical conversion step S15, a chemical conversion treatment is applied to the anode foil 11 of the wound element. In the cross-section chemical conversion step S15, for example, a plurality of wound elements held by a holder (carrier bar) are immersed in a chemical conversion solution in a chemical conversion tank, and a voltage is applied between the holder and the chemical conversion solution, thereby performing the chemical conversion treatment. In the cross-section chemical conversion step S15, a dielectric film 16 is formed on the cut surface of the anode foil 11 formed by cutting, and cracks in the dielectric film 16 that may occur in the winding step S12 or the like are repaired. In the cross-section chemical conversion step S15, after the chemical conversion treatment, the wound element may be washed and dried as necessary.

[0045] In the polymerization step S16, a conductive polymer is attached to at least a portion of the surface of the anode foil 11 (dielectric film 16), the surface of the cathode foil 12, and the surface of the separator 13. In the polymerization step S16, for example, the wound element held by a holder is immersed in a dispersion liquid in which a conductive polymer is dispersed in a solvent, the dispersion liquid is allowed to permeate the entire inside of the wound element, and the wound element is removed from the dispersion liquid. The wound element impregnated with the dispersion liquid is then subjected to a heat treatment to volatilize at least a portion of the solvent and coagulate the conductive polymer.

[0046] 6, the separation / integration process S2 includes a removal process (separation process) S21, a press-fitting process S22, a drawing process S23, and an identifier providing process S24. In the removal process (separation process) S21, a plurality of small units are sequentially separated from the production lot. Then, identifiers 70 are attached to the exterior (case 20) in the order in which they are separated in the removal process (separation process) S21.

[0047] In the removal step (separation step) S21, the wound element is removed from the holder. The wound elements are removed in order starting from the wound element held on the first end side of the holder. The removal step S21 is performed, for example, by removing the anode lead terminal 14 held by the holder from the holder (for example, by cutting the anode lead terminal 14 at an appropriate length when it is welded to the holder).

[0048] In the press-fitting step S22, the cases 20 are individually attached to the winding elements removed from the holder. The cases 20 are attached to the winding elements in the order in which they were removed from the holder in the removal step S21. More specifically, the winding elements removed from the holder are individually inserted into the case (outer packaging) 20 in which the electrolytic solution (electrolyte 40) is injected. Here, the diameter of the opening of the case 20 is slightly smaller than the outer diameter of the sealing member 30, and the winding element is inserted into the case 20, so that the sealing member 30 is pressed into the case 20. This produces an assembly in which the case 20 is attached to the winding element. In the press-fitting step S22, the cases 20 are attached to the winding elements in the order in which they were removed from the holder. That is, in the press-fitting step S22, the cases 20 are attached in the order in which the winding elements were produced, starting from the winding elements held at the first end of the holder. That is, the cases 20 are attached to the winding elements in the order in which the winding elements were produced (chronologically).

[0049] In the drawing process S23, a drawing process is performed on the side wall of the case 20, which corresponds to the sealing member 30, so that the case 20 is sealed by the sealing member 30. In the drawing process S23, the drawing process is performed on the wound elements in the order in which the cases 20 were attached in the press-fitting process S22. That is, in the drawing process S23, the drawing process is performed in order starting from the wound elements (assembly) held at the first end of the holder, for example.

[0050] In the identifier assigning step S24, identifiers 70 are sequentially assigned to the cases 20 of the assemblies held by the holder. In the identifier assigning step S24, the identifiers 70 are printed on the side surfaces 22 of the cases 20 of the assemblies by an inkjet printer (first inkjet printer). In the identifier assigning step S24, the identifiers 70 are printed, for example, in order starting from the cases 20 of the winding elements (assemblies) that have been subjected to the drawing process. That is, the identifiers 70 are assigned to the assemblies in the order in which the winding elements are produced (in chronological order). The identifiers 70 assigned in the identifier assigning step S24 are stored in chronological order in the database of the management device 200 together with the times at which the identifiers 70 were assigned.

[0051] In addition, the removing step S21, the pressing step S22, the drawing step S23, and the identifier providing step S24 in the separating / integrating step S2 may be performed consecutively by a series of devices.

[0052] The assembly to which the identifier 70 is assigned is stored in a storage box (first storage box). A plurality of assemblies included in one production lot may be stored in one first storage box, or may be stored in multiple first storage boxes. For example, one first storage box may store approximately several thousand assemblies. Also, a first storage box may store a plurality of assemblies included in multiple production lots.

[0053] As shown in Fig. 7, the small unit process (individual process) S3 includes a first reading process S31, an aging process S32, a second reading process S33, a printing process S34, a third reading process S35, and a processing process S36. The first reading process S31 and the aging process S32 are performed consecutively as one set of two processes. The second reading process S33 and the printing process S34 are performed consecutively as one set of two processes. The third reading process S35 and the processing process S36 are performed consecutively as one set of two processes.

[0054] In the first reading step S31, an arbitrary assembly is taken out from the first storage box, and the identifier 70 of the taken out assembly is read. The identifier 70 read in the first reading step S31 is stored in chronological order in the database of the management device 200.

[0055] In the aging process S32, a voltage is applied between the anode lead terminal 14 and the cathode lead terminal 15 of the assembly whose identifier 70 was read in the first reading process S31, thereby performing a chemical re-conversion process on the dielectric film 16. In the aging process S32, the assembly is appropriately heated as necessary. The assembly after the chemical re-conversion process is stored in a storage box (second storage box). A plurality of assemblies included in one production lot may be stored in one second storage box, or may be stored separately in a plurality of second storage boxes. Also, for example, a plurality of assemblies that were stored in the same first storage box may be stored in the same second storage box.

[0056] In the second reading step S33, an arbitrary assembly is taken out from the second storage box, and the identifier 70 of the taken out assembly is read. The identifier 70 read in the second reading step S33 is stored in chronological order in the database of the management device 200.

[0057] In the printing step S34, the display unit 60 is printed by an inkjet printer (second inkjet printer) on the top surface 21 of the case 20 of the assembly whose identifier 70 was read in the second reading step S33. The assembly on which the display unit 60 is printed is stored in a storage box (third storage box). A plurality of assemblies included in one production lot may be stored in one third storage box, or may be stored separately in a plurality of third storage boxes. Also, for example, a plurality of assemblies that were stored in the same second storage box may be stored in the same third storage box.

[0058] In a third reading step S35, an arbitrary assembly is taken out from the third storage box, and the identifier 70 of the taken out assembly is read. The identifier 70 read in the third reading step S35 is stored in a database of the management device 200 in chronological order.

[0059] In processing step S36, a seat plate 50 is attached to the assembly whose identifier 70 has been read in the third reading step S35. In processing step S36, the anode lead terminal 14 and the cathode lead terminal 15 of the assembly are inserted into two through holes in the seat plate 50, respectively, thereby attaching the seat plate 50 to the assembly. After the seat plate 50 is attached, the anode lead terminal 14 and the cathode lead terminal 15 are bent outward, and the bent portions of the lead terminals are accommodated in the two accommodating recesses of the seat plate 50 as terminal plates 142, 152, respectively.

[0060] Through the above-described procedure, the electrolytic capacitor 1 of the present embodiment is manufactured.

[0061] As can be seen from the above explanation, in the separating / integrating step S2, the identifiers 70 are assigned in the order in which the wound elements are produced. Then, in each processing step (aging step S32, printing step S34, processing step S36) in the subunit process S3, which assembly is being processed is identified based on the identifiers 70 read in the immediately preceding reading steps (first, second, and third reading steps S31, S33, and S35). That is, the order of the assemblies processed in the processing steps in the subunit process S3 and the order of the wound elements separated in the separating / integrating step S2 (removing step S21) are associated with each other based on the identifiers 70 read in the reading step.

[0062] In short, in the electronic component manufacturing method of this embodiment, the small unit process S3 includes a removal process, a reading process (first, second, and third reading processes S31, S33, and S35), and a processing process (aging process S32, printing process S34, and processing process S36). The removal process is a process of removing small units (pieces) in random order from a storage box (first to third storage box) in which two or more small units out of a plurality of small units (pieces) are stored. The reading process is a process of reading the identifier 70 of the small units (pieces) removed from the storage box. The processing process is a process of performing a predetermined process on the small units (pieces) whose identifier 70 has been read. In the electronic component manufacturing method of this embodiment, the order in which the small units (pieces) were processed in the processing process is associated with the order in which the small units (pieces) were separated in the separation process (removal process S21) based on the identifier 70 read in the reading process.

[0063] (1.3) Manufacturing System The above manufacturing method is carried out, for example, by a manufacturing system 100 shown in FIG.

[0064] The manufacturing system 100 of this embodiment includes a conventional electronic component (electrolytic capacitor) manufacturing system (basic manufacturing system) 110. In addition to the basic manufacturing system 110, the manufacturing system of this embodiment includes an inkjet printer (first inkjet printer) 120, a reader 130, an inspection machine 140, a measuring machine 150, and a management device 200.

[0065] The basic manufacturing system 110 is a conventionally known manufacturing system for electrolytic capacitors. The basic manufacturing system 110 performs the lead connection step S11, winding step S12, rubber assembly step S13, holding step S14, cross section formation step S15, polymer step S16, removal step S21, press-fitting step S22, squeezing step S23, aging step S32, printing step S34, and processing step S36 among the steps of the manufacturing method described in (1.2). The basic manufacturing system 110 includes one or more devices. The basic manufacturing system 110 includes, for example, a winding machine that performs the lead connection step S11 and the winding step S12, a formation bath used in the cross section formation step S15, an inkjet printer (second inkjet printer) for printing the display unit 60, and the like.

[0066] The inkjet printer (first inkjet printer) 120 performs the identifier assignment step S24 among the steps of the manufacturing method described in (1.2).

[0067] The reader 130 performs the first reading step S31, the second reading step S33, and the third reading step S35 in the manufacturing method described in (1.2). The reader 130 may include, for example, a first reader that performs the first reading step S31, a second reader that performs the second reading step S33, and a third reader that performs the third reading step S35. Alternatively, the reader 130 may be a single reader that performs the first, second, and third reading steps S31, S33, and S35.

[0068] The inspection machine 140 inspects whether the element members (winding element, assembly) have the desired performance in each step of the manufacturing method described in (1.2). The inspection machine 140 includes one or more devices.

[0069] The inspection machine 140 inspects whether the dimensions of the anode lead terminal 14 and the cathode lead terminal 15 after connection are within a desired range, for example, in the lead connection process S11. The inspection machine 140 inspects whether the anode foil 11 and the cathode foil 12 are shorted, for example, in the winding process S12. The inspection machine 140 inspects whether the height of the sealing member 30 is within a desired range, for example, in the rubber assembly process S13. The inspection machine 140 inspects whether the convergence current value is within a desired range, for example, in the cross section forming process S15 and / or the polymer process S16. The inspection machine 140 inspects whether the drawn shape of the case 20 has a desired shape, for example, in the drawing process S23. The inspection machine 140 inspects whether the capacitance value, the inductive tangent (tan δ), the leakage current (LC), etc. are within a desired range, for example, in the aging process S32. For example, in a printing step S34, the inspection machine 140 inspects whether a display unit 60 of a desired shape is attached to the top surface 21 of the case 20. For example, in a processing step S36, the inspection machine 140 inspects whether a capacitance value, a dissipation factor (tan δ), an equivalent series resistance (ESR), a leakage current (LC), and the like are within a desired range. Any element components that are not found to have the desired performance by the inspection machine 140 are appropriately removed from the manufacturing process.

[0070] The measuring machine 150 measures the state of the devices of the basic manufacturing system 110. The measuring machine 150 also measures information of the environment in which the devices of the basic manufacturing system 110 are installed. The measuring machine 150 includes one or more devices.

[0071] The measuring device 150 measures, for example, the winding speed of the winding machine for the wound element, the temperature of the anodizing bath / the voltage applied to the anodizing bath, etc. The measuring device 150 measures, for example, the temperature, humidity, etc. of the environment.

[0072] The management device 200 includes, for example, a microcomputer having a processor and a memory. The processor of the microcomputer executes a program recorded in the memory, thereby realizing various functions of the management device 200. The program executed by the processor of the management device 200 may be recorded in the memory of the microcomputer in advance, may be provided by being recorded on a recording medium such as a memory card, or may be provided through an electric communication line.

[0073] As described above, the management device 200 includes a database that stores management information. The database may be the same as the memory described above, or may be a different electrically rewritable recording medium.

[0074] The management device 200 is connected to an inkjet printer 120 , a reader 130 , an inspection device 140 , and a measuring device 150 .

[0075] The management device 200 acquires the identifier 70 (the shape of the identifier 70) printed on the case 20 in the identifier assignment step S24 from the inkjet printer 120. The management device 200 stores the identifier 70 acquired from the inkjet printer 120 in a database in chronological order.

[0076] The management device 200 acquires the identifier 70 (shape of the identifier 70) read in the first, second, and third reading steps S31, S33, and S35 from the reader 130. The management device 200 stores the identifier 70 acquired from the reader 130 in a database in chronological order.

[0077] Management device 200 acquires information on the inspection results (measurement values) in each process from inspection machine 140. Management device 200 stores the information on the inspection results acquired from inspection machine 140 in a database in chronological order.

[0078] The management device 200 acquires information indicating the state of the device and information on the environment from the measuring device 150. The management device 200 stores the information acquired from the measuring device 150 in a database in chronological order.

[0079] In other words, the management device 200 stores in a database in chronological order the identifier 70 obtained from the inkjet printing machine 120, the identifier 70 obtained from the reader 130, the inspection result information obtained from the inspection device 140, and the information obtained from the measuring device 150.

[0080] (1.4) Management method Next, a method for managing an electronic component (electrolytic capacitor 1) according to the present embodiment will be described. The method for managing an electronic component according to the present embodiment is executed by management device 200.

[0081] The method for managing an electronic component of this embodiment is a method for managing an electronic component (electrolytic capacitor 1) having an identifier 70 attached to its exterior (case 20) for identifying a plurality of subunits in a production lot. The method for managing the electronic component (electrolytic capacitor 1) manages management information associated with the identifier 70, thereby managing the electronic component (electrolytic capacitor 1) for each subunit.

[0082] In this embodiment, an identifier 70 for identifying an individual piece is attached to case (exterior) 20 of electrolytic capacitor (electronic component) 1. In the electronic component management method of this embodiment, management information associated with identifier 70 is managed to manage electronic components (electrolytic capacitors 1) on an individual piece basis.

[0083] First, the method of managing electronic components in the lot process S1 and the separation / integration process S2 will be described.

[0084] As can be seen from the explanation in section (1.2), in the manufacturing method of the electronic component (electrolytic capacitor 1) of this embodiment, the order of processing of a plurality of assemblies (internal elements) does not change throughout the lot process S1 and the separation / integration process S2. The time required for processing in each process (S11-S16, S21-S24) is known, and these processes are performed consecutively. Therefore, if it is known when the identifier 70 was assigned in the identifier assignment process S24, it is possible to know which process was performed on the assembly to which the identifier 70 was assigned and at what point in time. In other words, if it is known when the identifier 70 was assigned to the assembly, it is possible to identify the time when a desired device in the manufacturing system 100 was processing this assembly.

[0085] In the management method of this embodiment, the identifier 70 assigned to each electronic component in the identifier assignment process S24 is stored in chronological order in the database of the management device 200 together with the time at which the identifier 70 was assigned. This makes it possible to know when each process in the lot process S1 and the separation / integration process S2 was performed for this electronic component simply by reading the identifier 70 of the electronic component (electrolytic capacitor 1).

[0086] Furthermore, in the management method of this embodiment, in the lot process S1 and the separation / integration process S2, information on the inspection results by the inspection machine 140 is stored in chronological order in the database of the management device 200. The information on the inspection results by the inspection machine 140 is ultimately stored in the database in association with the identifier 70 of each electronic component (electrolytic capacitor 1). As a result, after the electronic components (electrolytic capacitor 1) are manufactured, it is possible to grasp the inspection results of the electronic components at each process by the inspection machine 140 simply by reading the identifier 70 of each electronic component and comparing it with the database. In other words, it is possible to read information indicating the inspection results of the electronic components from the database as manufacturing information (information at the time of manufacture).

[0087] Furthermore, in the management method of this embodiment, in the lot process S1 and the separation / integration process S2, information on the state of the equipment measured by the measuring device 150 (e.g., the driving speed and temperature of the equipment) and environmental information (e.g., temperature, humidity, etc.) are stored in chronological order in the database of the management device 200. As a result, after the electronic components (electrolytic capacitors 1) are manufactured, by reading the identifier 70 of each electronic component, it becomes possible to read from the database the state of the equipment when the electronic components were manufactured (the state of the equipment in the manufacturing system 100 when the electronic components were manufactured). In other words, it becomes possible to read from the database, as manufacturing information (information at the time of manufacturing), information indicating the state of the equipment when the electronic components were manufactured.

[0088] Next, a method for managing electronic parts in the subunit process S3 will be described.

[0089] As explained in section (1.2), in the manufacturing method for electronic components of this embodiment, the small unit process S3 includes a removal process, a reading process (first, second, and third reading processes S31, S33, and S35), and processing processes (an aging process S32, a printing process S34, and a processing process S36). These three processes are performed consecutively as a series of processes.

[0090] In the electronic component management method of the present embodiment, the identifiers 70 read in the reading process in subunit process S3 are stored in chronological order (together with the times at which the identifiers 70 were read) in the database of management device 200. This makes it possible to know when the corresponding processing process was carried out for each electronic component (electrolytic capacitor 1) simply by reading the identifier 70 of that electronic component.

[0091] Furthermore, in the management method of this embodiment, in subunit process S3, information on the inspection results by inspection machine 140 is stored in chronological order in the database of management device 200. The information on the inspection results by inspection machine 140 is ultimately stored in the database in association with identifier 70 read in the reading process. As a result, after the manufacture of electronic components (electrolytic capacitor 1), it is possible to grasp the inspection results of this electronic component at each process by inspection machine 140 simply by reading identifier 70 of each electronic component and comparing it with the database. In other words, it is possible to read information indicating the inspection results of this electronic component from the database as manufacturing information (information at the time of manufacture).

[0092] Furthermore, in the management method of this embodiment, in subunit process S3, the information on the state of the equipment measured by measuring device 150 and the environmental information are stored in chronological order in the database of management device 200. As a result, after the manufacture of electronic components (electrolytic capacitors 1), by reading identifier 70 of each electronic component, it becomes possible to read from the database the state of the equipment when this electronic component was manufactured (the state of the equipment of manufacturing system 100 when the electronic component was manufactured). In other words, it becomes possible to read from the database, as manufacturing information (information at the time of manufacture), information indicating the state of the equipment when this electronic component was manufactured.

[0093] In short, in the management method of this embodiment, the management information stored in the database of management device 200 includes information on each process of manufacturing an electronic component (electrolytic capacitor 1). The information on each process of manufacturing an electronic component includes, for example, at least one of information on the state of the manufacturing equipment in each process of manufacturing the electronic component, information on the environment in each process of manufacturing the electronic component, and information on the inspection results in each process of manufacturing the electronic component.

[0094] As described above, in the management method of this embodiment, the management information includes information on each process of manufacturing the electronic component. Therefore, for example, if a defect occurs in the electronic component during use, by reading the identifier 70 of the electronic component, it is possible to extract information on each process of manufacturing the electronic component from the database (management information) as manufacturing information. This makes it possible to verify, for example, whether there were any abnormalities in the manufacturing equipment, manufacturing environment, inspection results, etc. during each process of manufacturing the defective electronic component.

[0095] In the management method of this embodiment, the management information stored in the database of management device 200 includes time series information on the manufacture of electronic components (electrolytic capacitors 1). The time series information on the manufacture of electronic components includes, for example, at least one of information on the time when each process was performed during the manufacture of the electronic components and information on the order in which multiple electronic components were manufactured.

[0096] As described above, in the management method of this embodiment, the management information includes time series information of the manufacture of the electronic component. Therefore, for example, if a defect occurs in an electronic component during use, by reading the identifier 70 of this electronic component, it is possible to extract the time series information of the manufacture of this electronic component from the database (management information) as manufacturing information. This makes it possible to verify, for example, whether there are other defective electronic components around the time of manufacture of the electronic component in which the defect occurred.

[0097] (2) Variations The above-described embodiment is merely one of various embodiments of the present disclosure. In addition, the above-described embodiment can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Some modified examples of the above-described embodiment are listed below. The above-described embodiment and the following modified examples can be appropriately combined.

[0098] The same functions as the management device 200 and / or the management method in the embodiment may be embodied in a computer program, a non-transitory recording medium on which a program is recorded, or the like. Here, the executing entity of the management device 200 or the management method includes a computer system. The computer system is mainly composed of a processor and a memory as hardware. The processor executes the program recorded in the memory of the computer system, thereby realizing the function of the executing entity of the management device 200 or the management method. The program may be pre-recorded in the memory of the computer system, or may be provided through an electric communication line. The program may be recorded and provided in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large scale integrated circuit (LSI). The multiple electronic circuits may be integrated in one chip, or may be distributed among multiple chips. The multiple chips may be integrated in one device, or may be distributed among multiple devices.

[0099] The electronic component is not limited to the electrolytic capacitor 1. For example, the electronic component may be an electric double-layer capacitor (EDLC), a ceramic capacitor, etc. The electronic component may be a solid electrolytic capacitor using a solid electrolyte such as a conductive polymer, or an electrolytic capacitor using an electrolytic solution. The electrolytic capacitor 1 does not have to contain a conductive polymer. The capacitor may be a so-called sleeve type.

[0100] In the manufacturing method of the embodiment, some steps may be omitted as appropriate and / or other steps may be added as appropriate. For example, the cross section forming step S15 etc. may be omitted as appropriate.

[0101] In addition, in the manufacturing method of the embodiment, the order of each step in the lot process S1 and each step in the separation and integration process may be different from that of the above embodiment. For example, the rubber assembly process S13 may be performed after the press-fitting process S22. Furthermore, the identifier assignment process S24 may be performed before the drawing process S23. Furthermore, the removal process S21 may be performed after the press-fitting process S22 / drawing process S23, or after the identifier assignment process S24.

[0102] Also, the identifier 70 may be provided in advance to the case 20, and the case 20 provided with the identifier 70 may be attached to the winding element in the press-fitting step S22. That is, the press-fitting step S22 and the identifier providing step S24 may be performed simultaneously.

[0103] The holder is not limited to a carrier bar, but may be an electrically insulating hoop.

[0104] The electronic component is not limited to a capacitor, and may be another passive component, such as a resistor element or an inductor.

[0105] The exterior of the electronic component is not limited to the case 20. The exterior may be, for example, a resin mold.

[0106] The identifier 70 is not limited to a two-dimensional code printed on the side of the exterior (case 20). The identifier 70 may be, for example, a one-dimensional code (barcode), a symbol, or a character. Alternatively, the identifier 70 may be an IC chip, a tag, or the like. The identifier 70 does not have to be affixed to the exterior by printing, and may be affixed to the exterior by, for example, attaching a sticker on which the identifier 70 is written to the exterior. The identifier 70 may be affixed to a location other than the side of the exterior (for example, the top or bottom).

[0107] The manufacturing system 100 may include multiple devices (e.g., multiple winders) for performing the same process. For example, if the management information includes facility information for distinguishing between the multiple devices, it becomes possible to determine which device manufactured the electronic component. In other words, it becomes possible to determine which of the multiple devices manufactured the electronic component by simply reading the identifier 70.

[0108] The information that can be collated with the database by reading the identifier 70 is not particularly limited, but may include, for example, the date of manufacture, equipment information for distinguishing the device, a serial number, and the like.

[0109] (3) Description As is clear from the above-described embodiment and modified examples, the electronic component (electrolytic capacitor 1) of the first aspect includes an internal element (capacitor element 10) and an exterior (case 20). A production lot of the internal element includes a plurality of small units. In the electronic component, identifiers (70) that identify the plurality of small units are attached to the exterior.

[0110] According to the first aspect, since an identifier (70) for identifying a small unit is attached to the exterior, the small unit can be identified by reading the identifier (70). This makes it possible to identify manufacturing information (information at the time of manufacturing) of the electronic component.

[0111] In the electronic component of the second embodiment, in the first embodiment, the identifier (70) is attached to the exterior by a marking.

[0112] According to the second aspect, it is possible to easily read the identifier 70. In addition, for example, the identifier 70 can be photographed and the identifier shown in the photographed image can be read, thereby indirectly reading the identifier 70.

[0113] In the electronic component of the third embodiment, the identifier (70) is printed directly on the exterior of the electronic component of the second embodiment.

[0114] According to the third aspect, it becomes possible to easily attach the identifier (70).

[0115] In the electronic component of the fourth embodiment, in the second or third embodiment, the identifier (70) is on the side (22) of the exterior.

[0116] According to the fourth aspect, it is possible to attach the identifier (70) by utilizing the side surface (22) of the exterior (case 20).

[0117] In the electronic component of the fifth aspect, in any one of the second to fourth aspects, the identifier (70) is a one-dimensional code or a two-dimensional code.

[0118] According to the fifth aspect, it becomes possible to indicate more information by the identifier (70) than by symbols, letters, or the like.

[0119] In the electronic device of a sixth aspect, in any one of the first to fifth aspects, the small units are individual pieces.

[0120] According to the sixth aspect, it becomes possible to identify the individual piece by the identifier (70), and it becomes possible to identify the manufacturing information for each electronic component.

[0121] The seventh aspect of the method for manufacturing an electronic component (electrolytic capacitor 1) is a method for manufacturing an electronic component comprising an internal element (capacitor element 10) and an exterior (case 20). The method for manufacturing the electronic component comprises a lot process (S1) for manufacturing the internal element on a production lot basis, a separation process (removal process S21) for separating the production lot into a plurality of small units each including one or more pieces, and a small unit process (S3) for processing each small unit. The exterior is integrated with the internal element. In the electronic component, an identifier (70) for identifying the plurality of small units is affixed to the exterior.

[0122] According to the seventh aspect, it is possible to specify manufacturing information of the electronic component.

[0123] In the eighth aspect of the method for producing an electronic component, in the seventh aspect, the separation step (removal step S21) is a step of sequentially separating a plurality of small units from a production lot. Identifiers (70) are attached to the exterior in the order in which they are separated in the separation step (removal step S21).

[0124] According to the eighth aspect, the identifier (70) is affixed to the exterior in the order in which the production lot is separated into small units. Therefore, the identifier (70) is affixed in the order in which the small units were manufactured, making it possible to identify chronological information on the manufacture of the small units.

[0125] A ninth aspect of the method for manufacturing an electronic component is the eighth aspect, and the small unit step (S3) includes a removal step, a reading step, and a processing step. The removal step is a step of removing small units in random order from a storage box in which two or more small units out of a plurality of small units are stored. The reading step is a step of reading an identifier (70) of the small unit removed from the storage box. The processing step is a step of performing a predetermined process on the small unit whose identifier (70) has been read. Based on the identifier (70) read in the reading step, the order in which the small units were processed in the processing step is associated with the order in which the small units were separated in the separation step (removal step S21).

[0126] According to the ninth aspect, even when a plurality of small units are temporarily stored in a storage box, it is possible to identify time-series information on the manufacturing time of the small units.

[0127] A tenth aspect of the method for producing an electronic component is the same as any one of the seventh to ninth aspects, in which the small unit step (S3) is a singulation step in which processing is carried out on an individual piece basis.

[0128] According to the tenth aspect, it becomes possible to identify the individual pieces by the identifier (70), and it becomes possible to specify the manufacturing information for each electronic component.

[0129] The electronic component management method of the eleventh aspect is a method for managing an electronic component (electrolytic capacitor 1) that includes an internal element (capacitor element 10) and an exterior (case 20), and has an identifier (70) attached to the exterior for identifying a plurality of subunits in a production lot. In the electronic component management method, management information associated with the identifier (70) is managed to manage the electronic component for each subunit.

[0130] According to the eleventh aspect, it is possible to specify manufacturing information of the electronic component by the management information.

[0131] A twelfth aspect of the electronic component management method is the eleventh aspect of the electronic component management method, wherein the management information includes information relating to each process of manufacturing the electronic component.

[0132] According to the twelfth aspect, it is possible to specify information relating to each process during the manufacture of an electronic component by using the management information.

[0133] A thirteenth aspect of the electronic component management method is the eleventh or twelfth aspect, in which the management information includes time-series information on the manufacture of the electronic components.

[0134] According to the thirteenth aspect, it becomes possible to identify time-series information in the manufacture of electronic components.

[0135] A program according to a fourteenth aspect is a program that, when executed by a computer, causes the computer to execute the management method according to any one of the eleventh to thirteenth aspects.

[0136] According to the fourteenth aspect, it is possible to specify manufacturing information of the electronic component by the management information.

[0137] The configurations according to the second to sixth aspects are not essential for the electronic component and may be omitted as appropriate. The configurations according to the eighth to tenth aspects are not essential for the electronic component manufacturing method and may be omitted as appropriate. The configurations according to the twelfth to fourteenth aspects are not essential for the electronic component management method and may be omitted as appropriate. [Explanation of symbols]

[0138] 1. Electrolytic capacitors (electronic components) 10 Capacitor element (internal element) 20 Case (outer packaging) 22 Side 70 Identifier S1 Lot process S21 Removal process (separation process) S3 Small unit process

Claims

1. A method for identifying manufacturing information of an electronic component having an internal element and an exterior, comprising the steps of: The step of manufacturing the electronic component includes: (i) a batch process for manufacturing a plurality of the internal elements on a production lot basis; (ii) separating the internal elements from the production lot into a plurality of small units, each of which includes one or more individual pieces; (iii) an integration step in which the small unit and the exterior are integrated to obtain an integrated product having a predetermined identifier attached to the exterior; (iv) a plurality of small unit processes for processing or treating the integrated product on a small unit basis; By associating lot process information relating to the processing or treatment carried out in the lot process for each of the small units until the small units are obtained, and small unit process information relating to the processing or treatment carried out in each of the small unit processes for each of the integrated objects, with each of the identifiers, Identifying manufacturing information of each of the electronic components, the manufacturing information including the lot process information and / or the small unit process information for each of the electronic components; A method for identifying manufacturing information of electronic components.

2. The lot process information includes time series information on the processing or treatment performed on each of the small units in the lot process until the small units are obtained. The method for identifying manufacturing information of an electronic component according to claim 1 .

3. the lot process includes a process of manufacturing the plurality of internal elements arranged and held in a holder; The lot process information includes information regarding an order in which the plurality of internal elements are held in the holder when each of the small units is processed or treated in the lot process until the small unit is obtained. The method for identifying manufacturing information of an electronic component according to claim 1 or 2.

4. The small unit process information includes time series information regarding the processing or treatment performed on each of the integrated objects in the small unit process. The method for identifying manufacturing information of an electronic component according to any one of claims 1 to 3.

5. The integration process includes a lot process information recording step of recording the lot process information in a first recording device in association with the identifier, The sub-unit process includes a sub-unit process information recording step of recording the sub-unit process information in a second recording device in association with the identifier, By comparing the information included in the identifier with the lot process information recorded in the first recorder and / or the small unit process information recorded in the second recorder, Identifying manufacturing information of each of the electronic components, the manufacturing information including the lot process information and / or the small unit process information for each of the electronic components; The method for identifying manufacturing information of an electronic component according to any one of claims 1 to 4.

6. the separating step includes one or more separating steps for sequentially separating the plurality of small units from the production lot; The identifier is attached to the exterior in each of one or more separation steps in which the separation is performed sequentially in the separation process. The method for identifying manufacturing information of an electronic component according to any one of claims 1 to 5.

7. The small unit process includes: A removal process of removing the integrated objects in random order from a storage box in which two or more of the integrated objects are stored; a reading step of reading the identifier of the integrated object taken out of the storage box; A processing step of performing a predetermined processing or treatment on the integrated object from which the identifier has been read; Equipped with Based on the identifier read in the reading step, the order in which the integrated object was processed or treated in the processing step is associated with the order in which the small units included in the integrated object were separated in the separating step. The method for identifying manufacturing information of an electronic component according to any one of claims 1 to 6.

8. The small unit process is a singulation process in which processing is performed on an individual piece basis. The method for identifying manufacturing information of an electronic component according to any one of claims 1 to 7.

9. In the lot process (i), 10,000 or more of the internal elements are manufactured. The method for identifying manufacturing information of an electronic component according to any one of claims 1 to 8.

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