Inductance element and its manufacturing method

Abstract

To provide an inductance element and a manufacturing method of the same, which avoids reduction of an influence and a reliability of an electric characteristic.SOLUTION: An inductance element Z1 contains: a magnetic base 1; a coil structure 2; and a package structure 3. The magnetic base contains: a bottom plate; a side wall 11; and a column core. The coil structure contains: a coil body 20; and first and second extension parts 21 and 22. The extension parts contain first and second bending parts 210 and 220 and first and second pin parts 211 and 221 which are connected to each other, respectively. The first and second bending parts are bent from the coil body toward a direction separated from the bottom plate, and include first and second connection ends, respectively. The pin parts are extended up to an upper direction of a side wall from the respective connection ends. The shortest distance of a virtual line connecting the first and second connection ends and a center shaft of the column core is shorter than the minimum outer radius of the coil body. The package structure covers the magnetic base and the coil structure. Conductive parts 211S and 221S of the first and second pin parts are exposed to the outside of the package structure.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to a passive element and a manufacturing method thereof, and more particularly to an inductance element and a manufacturing method thereof. [Background technology]

[0002] Inductors are passive elements widely used in circuit design, and have different structures for different applications. In one conventional inductor structure, a coil is installed to be wound around a magnetic core. Specifically, the conventional magnetic core includes a bottom plate and a pillar core protruding from the bottom plate. When manufacturing the coil, the pillar core can be used as a support structure to form the coil winding portion. In addition, the non-rolled portion that is not wound around the pillar core is bent downward to be fixed to the bottom plate of the magnetic core. However, in the process of fixing the non-rolled portion to the bottom plate, the bottom plate is prone to breaking and cracking.

[0003] In addition, when forming a magnetic covering structure that covers the magnetic core and coil in a subsequent molding process, the coil is easily deformed and shifted by pressure. Cracking of the bottom plate and deformation and shifting of the coil will result in poor electrical characteristics of the inductor and reduce the reliability of the inductor. Therefore, improving the structure and manufacturing method of the inductor to maintain the reliability of the inductor while also providing the inductor with excellent electrical characteristics is a challenge that the industry must solve. Summary of the Invention [Problem to be solved by the invention]

[0004] The technical problem that the present invention aims to solve is to provide an inductance element and a manufacturing method thereof that can avoid the shortcomings of the conventional art and the influence on the electrical characteristics of the inductance element and the reduction in the reliability of the inductor. [Means for solving the problem]

[0005] In order to solve the above technical problems, one technical means adopted by the present invention provides an inductance element, including a magnetic base, a coil structure, and a package structure. The magnetic base includes a bottom plate, a side wall, and a column core. The side wall and the column core protrude from the surface of the bottom plate, and the bottom plate, the side wall, and the column core together define a positioning groove. The coil structure includes a coil body, a first extension, and a second extension. The coil body is installed in the positioning groove around the column core. The first extension includes a first bent portion and a first pin portion connected to each other. The first bent portion is bent from the coil body in a direction away from the bottom plate and has a first connection end. The first pin portion is extended from the first connection end to above the side wall. The second extension includes a second bent portion and a second pin portion connected to each other. The second bent portion is bent from the coil body in a direction away from the bottom plate and has a second connection end. The second pin portion extends from the second connection end to above the side wall. A shortest distance between a first imaginary line connecting the first connection end and the second connection end and a central axis of the pillar core is shorter than a minimum outer radius of the coil body. The package structure covers the magnetic base and the coil structure. The first conductive portion of the first pin portion and the second conductive portion of the second pin portion are exposed to the outside of the package structure.

[0006] In order to solve the above technical problem, another technical means adopted by the present invention provides a method for manufacturing an inductance element. The method for manufacturing an inductance element includes the steps of: providing a magnetic base having a pillar core, forming a positioning groove surrounding the pillar core in the magnetic base; forming a coil structure including a coil body, a first extension, and a second extension so as to be wound; installing the coil structure in the positioning groove around the pillar core; and forming a package structure. Among them, the coil body has a through hole. The first extension includes a first bent portion and a first pin portion connected to each other. The second extension includes a second bent portion and a second pin portion connected to each other. The first bent portion and the second bent portion are bent to the same side from the coil body and have a first connection end and a second connection end, respectively. The shortest distance between a first virtual line connecting the first connection end and the second connection end and the central axis of the pillar core is shorter than the minimum outer radius of the coil body. The first pin portion and the second pin portion extend from the first connection end and the second connection end, respectively, in directions that are substantially parallel to each other and protrude from the side surface of the coil body, and the first conductive portion of the first pin portion and the second conductive portion of the second pin portion are exposed to the outside of the package structure. Effect of the Invention

[0007] As advantageous effects of the present invention, the inductance element and its manufacturing method according to the present invention have the following technical features: "a positioning groove is defined by a magnetic base including a pillar core", "a coil structure is installed in the positioning groove and includes a coil body, a first extension portion and a second extension portion. The first extension portion includes a first bent portion and a first pin portion connected to each other. The second extension portion includes a second bent portion and a second pin portion connected to each other", and "the first bent portion and the second bent portion are bent to the same side from the coil body and have a first connection end and a second connection end, respectively. The shortest distance between a first virtual line connecting the first connection end and the second connection end and the central axis of the pillar core is shorter than the minimum outer radius of the coil body. The first pin portion and the second pin portion are extended from the first connection end and the second connection end, respectively, so as to protrude from the side of the coil body", thereby maintaining the reliability of the inductance element and providing the inductance element with excellent electrical properties. [Brief description of the drawings]

[0008] [Figure 1] 4 is a flowchart of a method for manufacturing an inductance element according to an embodiment of the present invention. [Diagram 2] FIG. 2 is an exploded view of a coil structure and a magnetic base according to an embodiment of the present invention. [Diagram 3] FIG. 2 is an exploded view of a coil structure according to an embodiment of the present invention mounted on a magnetic base. [Figure 4] FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. [Figure 5A] FIG. 4 is a top view of the coil structure shown in FIG. 3 mounted on a magnetic base. [Figure 5B] FIG. 13 is a top view of a coil structure of another embodiment of the present invention mounted on a magnetic base. [Figure 5C] FIG. 13 is a top view of a coil structure of another embodiment of the present invention mounted on a magnetic base. [Figure 5D] FIG. 13 is a top view of a coil structure of another embodiment of the present invention mounted on a magnetic base. [Figure 5E] FIG. 13 is a top view of a coil structure of another embodiment of the present invention mounted on a magnetic base. [Figure 6] 1A-1D are exploded views of a process for forming a package structure in an embodiment of the present invention. [Figure 7] 1A-1D are exploded views of a process for forming a package structure in an embodiment of the present invention. [Figure 8] 1A-1D are exploded views of a process for forming a package structure in an embodiment of the present invention. [Figure 9] 1 is a three-dimensional exploded view of an inductance element according to a first embodiment of the present invention. [Figure 10] 10 is a schematic cross-sectional view taken along line XX in FIG. 9. [Figure 11] FIG. 4 is a schematic cross-sectional view of an inductance element according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In order to better understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, which are provided for reference and explanation only and are not intended to limit the scope of the present invention.

[0010] Hereinafter, the "inductance element and its manufacturing method" will be described by a specific embodiment, and a person skilled in the art can understand the advantages and effects of the present invention based on the contents disclosed in this specification. The present invention can be implemented or applied by other different specific embodiments, and various modifications and changes can be made to each detail in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, as described in advance, the accompanying drawings of the present invention are simple schematic illustrations and are not drawn based on actual size. The technical contents of the present invention will be described in more detail based on the following embodiments, but the disclosure does not limit the scope of protection of the present invention. In addition, the term "or" used in this specification may include any one or more combinations of the items listed in relation to each other according to the actual situation.

[0011] [First embodiment] FIG. 1 is a flow chart showing a method for manufacturing an inductance element according to an embodiment of the present invention. In step S100, a magnetic base having a pillar core is provided, and a positioning groove is formed in the magnetic base to surround the pillar core. In step S110, a coil structure including a coil body, a first extension, and a second extension is formed to be wound. In step S120, the coil structure is placed in the positioning groove around the pillar core. In step S130, a package structure is formed to cover the magnetic base and the coil structure. In step S140, a first electrode portion and a second electrode portion are formed in the package structure to electrically connect with the first extension portion and the second extension portion, respectively. Details of each step of the inductance element are further described below.

[0012] 2 is a three-dimensional exploded view of the coil structure and the magnetic base according to an embodiment of the present invention. As shown in FIG. 2, a positioning groove H1 is formed in the magnetic base 1. More specifically, in the magnetic base 1, the bottom plate 10, the side wall 11 and the column core 12 together define the positioning groove H1. The side wall 11 and the column core 12 protrude from the surface 10S of the bottom plate 10. More specifically, the positioning groove H1 having a closed loop shape is formed so that the side wall 11 is provided around the column core 12. For example, looking down on the positioning groove H1, it may have a ring shape, an elliptical ring shape, a square ring shape, a D-shape, or other asymmetric shape. In addition, in this embodiment, the side wall 11 is a side wall arranged in the circumferential direction of the column core, and the upper surface 11S of the side wall 11 is a flat surface, but the present invention is not limited thereto.

[0013] In one embodiment, the magnetic base 1 is made of a magnetic material. The magnetic material is at least one of crystalline magnetic metal powder and amorphous magnetic metal powder. Examples of the crystalline magnetic metal powder include Fe-Si powder, Fe-Si-Cr powder, Fe-Si-Al powder, Fe-Ni powder, carbonyl iron powder (CIP), iron powder, Fe-Ni-Mo powder, and Fe-Co-V, but the present invention is not limited thereto. Examples of the amorphous magnetic metal powder include iron-based amorphous magnetic metal powder (Fe-based amorphous magnetic metal power), and examples of the amorphous magnetic metal powder include Fe-Si-BC powder and Fe-Si-Cr-BPC powder, but the present invention is not limited thereto. The magnetic base 1 according to the embodiment of the present invention is mainly manufactured from crystalline magnetic metal powder, and for example, a material mixed with carbonyl iron powder is adopted. Also, the magnetic base 1 may be manufactured by well-known processes such as cold pressing, hot pressing, transfer molding or compression molding.

[0014] 2, the coil structure 2 is formed by winding a conductor wire to form a coil body 20, a first extension portion 21, and a second extension portion 22. For example, the conductor wire may be wound in a flat winding, an inner-outer winding, or an alpha winding to form the coil structure 2. The conductor wire may be a flat wire, a square wire, or a round wire, and may include an insulating coating layer and an inner conductive wire, but the present invention is not limited thereto.

[0015] The coil body 20 according to this embodiment includes a plurality of annular bodies. The plurality of annular bodies are arranged around the same central axis Y. Thus, the coil body 20 has a through hole 20H. It should be noted that in this embodiment, before the coil structure 2 is arranged in the positioning groove H1 on the magnetic base 1, the first extension 21 and the second extension 22 are first bent to form a bending angle. To further explain, as shown in FIG. 1, the first extension 21 and the second extension 22 are bent to the same side (e.g., the upper side) of the coil body 20 and extended beyond the uppermost annular body. Then, the first extension 21 and the second extension 22 are further bent and extended beyond the side of the coil body 20 along the two tangential directions of the uppermost annular body.

[0016] In this embodiment, the first extension portion 21 and the second extension portion 22 are bent upward and then bent and extended to the same side of the coil body 20, but the present invention is not limited thereto. Please also refer to Fig. 4. In this embodiment, the first extension portion 21 and the second extension portion 22 are each bent from the extension direction toward the first side (the left side in Fig. 4) of the coil body 20 toward the upper surface side of the coil body 20, and then bent again from the upper surface side toward the first side of the coil body 20. In another embodiment, the first extension portion 21 and the second extension portion 22 are bent upward and then bent to different sides of the coil body 20 and extended in different directions, respectively.

[0017] More specifically, the first extension portion 21 includes a first bent portion 210 and a first pin portion 211 that are connected to each other. The second extension portion 22 includes a second bent portion 220 and a second extension portion 221 that are connected to each other. The first bent portion 210 and the second bent portion 220 are bent upward and extended to protrude from the uppermost annular body of the coil body 20.

[0018] In this embodiment, the first bent portion 210 includes a first bent start end 210b and a first connecting end 210a. The first bent start end 210b is a start end where the first bent portion 210 bends upward from one annular body. The first connecting end 210a is a connecting end between the first bent portion 210 and the first pin portion 211. Similarly, the second bent portion 220 of the second extension portion 22 includes a second bent start end 220b and a second connecting end 220a. The second bent start end 220b is a start end where the second bent portion 220 bends upward from one annular body. The second connecting end 220a is a connecting end between the second bent portion 220 and the second pin portion 221.

[0019] The first pin portion 211 starts from the first connection end 210a and extends along one tangent direction of the uppermost annular body of the coil body 20 so as to protrude from the side surface of the coil body 20. Similarly, the second bent portion 220 of the second extension portion 22 includes a second bend starting end 220b and a second connection end 220a. The second pin portion 221 starts from the second connection end 220a and extends along another tangent direction of the uppermost annular body of the coil body 20 so as to exceed the side surface of the coil body 20. The extension direction of the first pin portion 211 is not necessarily parallel to the extension direction of the second pin portion 221.

[0020] It should be noted that in this embodiment, the first imaginary line A connecting the first connection end 210a and the second connection end 220a crosses the through hole 20H of the coil body 20. In one embodiment, when observed from above, the first imaginary line A connecting the first connection end 210a and the second connection end 220a crosses the region between the central axis Y and the outer edge of the coil body 20. Also, the second imaginary line B connecting the first bending start end 210b and the second bending start end 220b is on a vertical reference plane passing through the through hole 20H of the coil body 20. Thus, the first pin portion 211 and the second pin portion 221 have a relatively long extension length.

[0021] As shown in Figures 3 to 5A, Figure 3 is a three-dimensional exploded view of a coil structure of an embodiment of the present invention being installed on a magnetic base, and Figures 4 and 5A are a schematic cross-sectional view and a top view, respectively, of a coil structure of an embodiment of the present invention being installed on a magnetic base.

[0022] 3 and 4, the coil structure 2 is placed in the positioning groove H1 on the magnetic base 1 around the column core 12. More specifically, the through hole 20H of the coil body 20 is placed in the positioning groove H1 so as to align with the column core 12. It should be noted that the side wall 11 of the magnetic base 1 and the column core 12 serve to center the coil structure 2, and to avoid deformation and shift caused by compression of the coil structure 2 in the subsequent process, which may affect the electrical characteristics and yield of the inductance element.

[0023] In addition, the height h2 of the column core 12 relative to the bottom plate 10 and the height h1 of the side wall 11 relative to the bottom plate 10 may be the same or different. In a preferred embodiment, the height h2 of the column core 12 relative to the bottom plate 10 is equal to or less than the height h1 of the side wall 11 relative to the bottom plate 10. The height h2 of the column core 12 relative to the bottom plate 10 is equal to or more than half the height T1 of the coil body 20. In the present invention, the height T1 of the coil body 20 is the distance from the top end to the bottom end of the coil body. In one embodiment, the height h2 of the column core 12 relative to the bottom plate 10 is higher than the height T1 of the coil body 20. That is, the position of the top end of the coil body 20 is lower than the upper surface of the column core 12, but the present invention is not limited thereto.

[0024] Since the preformed magnetic base 1 has a higher density than a magnetic material formed by molding magnetic powder, the closer the height h2 of the column core 12 to the bottom plate 10 is to the height T1 of the coil body 20, the higher the density of the magnetic material at the through hole 20H of the coil body 20, and therefore the higher the inductance value of the inductance element.

[0025] Moreover, the height h1 of the side wall 11 relative to the bottom plate 10 is equal to or greater than one third of the height T1 of the coil body 20. In one embodiment, the height h1 of the side wall 11 relative to the bottom plate 10 exceeds the height T1 of the coil body 20. In other words, the position of the uppermost end of the coil body 20 is lower than the upper surface 11S of the side wall 11.

[0026] However, as shown in Figs. 3 and 4, after the coil structure 2 is installed in the positioning groove H1, the first pin portion 211 of the first extension portion 21 and the second pin portion 221 of the second extension portion 22 are extended to above the side wall 11. In this embodiment, as shown in Fig. 4, the first pin portion 211 and the second pin portion 221 are higher than the side wall 11 and spaced apart from the upper surface 11S, but the present invention is not limited thereto. In another embodiment, the first pin portion 211 and the second pin portion 221 contact the upper surface 11S of the side wall 11. In addition, the height position of the first connection end 210a and the height position of the second connection end 220a are both higher than the upper surface 11S of the side wall 11 of the magnetic base 1.

[0027] It should be noted that in this embodiment, the upper surface 11S of the side wall 11 is flat, while in another embodiment, the upper surface 11S of the side wall 11 has two grooves respectively corresponding to the positions of the first pin portion 211 and the second pin portion 221. After the coil structure 2 is installed in the positioning groove H1, the first pin portion 211 and the second pin portion 221 may be accommodated in the two grooves, respectively.

[0028] In this embodiment, as shown in Fig. 4, the width of the positioning groove H1 is the same from top to bottom, but the present invention is not limited thereto. In another embodiment, the width of the positioning groove H1 may be tapered from top to bottom, so that the cross-sectional shape of the positioning groove H1 is trapezoidal. In addition, the inner surface of the side wall 11 and the region of the column core 12 close to the bottom plate 10 each have a chamfer or a fillet.

[0029] It should be noted that, as shown in FIG. 3 and FIG. 5A, when the coil body 20 of this embodiment is observed from above, it is not limited to a circular shape, so the coil body 20 has a minimum outer radius Ra and a maximum outer radius Rb. When the coil structure 2 is observed from above after being installed in the positioning groove H1, the first virtual line A connecting the first connection end 210a and the second connection end 220a crosses the upper part of the coil body 20. To explain further, the first connection end 210a and the second connection end 220a are connected to form the first virtual line A. The shortest distance d1 between the first virtual line A and the central axis Y of the column core 12 (or the coil body 20) is shorter than the minimum outer radius Ra of the coil body 20. In one embodiment, the shortest distance d1 between the first virtual line A connecting the first connection end 210a and the second connection end 220a and the central axis Y of the column core 12 (or the coil body 20) is less than two-thirds of the maximum outer radius Rb of the coil body 20. In this way, the contact areas between the first pin portion 211 and the second pin portion 221 and the external electrodes can be increased.

[0030] In this embodiment, the first virtual line A connecting the first connection end 210a and the second connection end 220a passes through the column core 12 (or the through hole 20H). As shown in Fig. 5A, the second virtual line B connecting the first bending start end 210b and the second bending start end 220b is on a vertical reference plane including the central axis Y of the column core, but the present invention is not limited thereto.

[0031] 5B to 5E are top views of a coil structure according to another embodiment of the present invention, which is installed on a magnetic base. As shown in FIG. 5B, the first virtual line A connecting the first connection end 210a and the second connection end 220a may just pass through the central axis Y of the column core 12 (or the through hole 20H). As shown in FIG. 5C, the first virtual line A connecting the first connection end 210a and the second connection end 220a passes through the central axis Y of the column core 12 (or the through hole 20H). On the other hand, in the embodiment shown in FIG. 5D, the first virtual line A connecting the first connection end 210a and the second connection end 220a may not pass through the central axis Y of the column core 12 (or the through hole 20H), but the shortest distance d1 between the first virtual line A and the central axis Y of the column core 12 is still shorter than the minimum outer radius Ra of the coil body 20.

[0032] In the embodiment shown in Figures 5A to 5D, the first imaginary line A connecting the first connection end 210a and the second connection end 220a is parallel to the maximum outer radius Rb of the coil body 20. In another embodiment, as shown in Figure 5E, the first connection end 210a and the second connection end 220a are not necessarily on the same horizontal reference line. Thus, in the embodiment shown in Figure 5E, the first pin portion 211 and the second pin portion 221 may have different lengths.

[0033] After that, a package structure 3 is formed to cover the magnetic base 1 and the coil structure 2. As shown in Figs. 6 to 8, a three-dimensional exploded view of a process for forming a package structure in an embodiment of the present invention is shown. As shown in Fig. 6, a magnetic package body 3A covering the coil structure 2 and the magnetic base 1 is formed by a molding process. The molding process is not particularly limited as long as it can form a magnetic package body, and examples of the molding process include molding methods such as cold pressing, hot pressing, transfer molding, and compression molding, but the present invention is not limited thereto. In addition, the magnetic package body 3A may be formed in multiple stages, and different magnetic materials or molding methods are adopted in different stages.

[0034] In one embodiment, the magnetic package 3A is formed by a molding process. In detail, the coil structure 2 and the magnetic base 1 are placed together in a cavity of a mold, and then the cavity is filled with powder to form the magnetic package 3A. The powder may include only magnetic material powder, or may include magnetic material powder and non-magnetic material powder.

[0035] The magnetic material may be at least one of crystalline magnetic metal powder and amorphous magnetic metal powder. Examples of crystalline magnetic metal powder include Fe-Si powder, Fe-Si-Cr powder, Fe-Si-Al powder, Fe-Ni powder, carbonyl iron powder (CIP), iron powder, Fe-Ni-Mo powder, and Fe-Co-V powder, but the present invention is not limited thereto. Examples of amorphous magnetic metal powder include iron-based amorphous magnetic metal powder, such as Fe-Si-BC powder and Fe-Si-Cr-BPC powder, but the present invention is not limited thereto. The magnetic package 3A according to the embodiment of the present invention is mainly made of crystalline magnetic metal powder, and may be a material mixed with carbonyl iron powder, but the present invention is not limited thereto. In addition, the material for forming the magnetic package 3A may be different from the material of the magnetic base 1.

[0036] It should be noted that in this process, the remaining space in the positioning groove H1 of the magnetic base 1 is completely filled with the powder. Then, a punching machine is used to apply pressure to the powder in the cavity, so that the powder is pressed to completely fill the gap between the cavity and the coil structure 2 and the magnetic base 1, thereby forming the magnetic package 3A. That is, a part of the magnetic package 3A is filled in the positioning groove H1 of the magnetic base 1.

[0037] It is noteworthy that in this embodiment, before the coil structure 2 is placed in the positioning groove H1, the first pin portion 211 and the second pin portion 221 may have their protruding portions from the side wall 11 cut off before forming the package structure 3. Therefore, as shown in Fig. 6, after the coil structure 2 is placed in the positioning groove H1, the first pin portion 211 and the second pin portion 221 do not protrude from the outer surface of the side wall 11.

[0038] In the manufacturing method according to the present embodiment, after the magnetic package 3A is taken out, the magnetic package 3A is subjected to a thermal curing treatment so as to improve the mechanical strength of the magnetic package 3A. In one preferred embodiment, pressure is applied to the magnetic package 3A while the thermal curing treatment is being performed, thereby making the magnetic package 3A more dense.

[0039] It should be noted that, when the magnetic package 3A and the magnetic base 1 are made of the same material, after the punching and heat treatment processes, the magnetic package 3A and the magnetic base 1 are substantially joined together to be integrally molded. In another embodiment, the magnetic package 3A and the magnetic base 1 may be made of different materials. To further explain, the material constituting the magnetic package 3A and the material constituting the magnetic base 1 may include different magnetic materials. For example, the material of the magnetic package 3A may be a material mixed with carbonyl iron powder, and the material of the magnetic base 1 may be Fe-Si-Cr, but the present invention is not limited thereto.

[0040] As shown in Fig. 6, the magnetic package 3A includes a first protrusion 31 and a second protrusion 32. The first protrusion 31 and the second protrusion 32 are provided on the same side of the magnetic package 3A, spaced apart from each other. In this embodiment, the first protrusion 31 and the second protrusion 32 are strip-shaped protrusions corresponding to the extension directions of the first pin 211 and the second pin 221, respectively. To explain further, the first protrusion 31 and the first pin 211 extend along substantially the same direction, and the second protrusion 32 and the second pin 221 extend along substantially the same direction.

[0041] 7, the process of forming the package structure includes forming an insulating layer 3B that covers the outer surfaces of the magnetic package body 3A and the magnetic base 1. In one embodiment, the insulating layer 3B may be formed by a method such as atomization spray, immersion method, or chemical vapor deposition method.

[0042] 8, a part of the insulating layer 3B and a part of the magnetic package 3A are removed so as to expose the first conductive portion 211S of the first pin portion 211 and the second conductive portion 221S of the second pin portion 221. More specifically, the first protrusion 31 and the insulating layer 3B covering it, and the second protrusion 32 and the insulating layer 3B covering it may be polished so as to expose the first pin portion 211 and the second pin portion 221.

[0043] In this embodiment, a part of the first pin portion 211 and a part of the second pin portion 221 are removed in the polishing process, thereby exposing the first conductive portion 211S of the first pin portion 211 to the first protrusion 31 and exposing the second conductive portion 221S of the second pin portion 221 to the second protrusion 32. Since the extension directions of the first protrusion 31 and the first pin portion 211 are substantially the same, and the extension directions of the second protrusion 32 and the second pin portion 221 are substantially the same, after the polishing process is performed, the first conductive portion 211S and the second conductive portion 221S are exposed on the surfaces of the first protrusion 31 and the second protrusion 32 over a relatively large area.

[0044] It is noteworthy that in this embodiment, a plane defined by the extending direction of the first pin portion 211 and the extending direction of the second pin portion 221 is approximately parallel to the upper surface 11S of the side wall 11. Therefore, after the polishing process is performed, a large area of ​​the first conductive portion 211S is exposed to the first protruding portion 31, and a large area of ​​the second conductive portion 221S is exposed to the second protruding portion 32.

[0045] In one embodiment, the area of ​​the exposed first conductive portion 211S (or the second conductive portion 221S) is larger than the area of ​​the cross section of the first pin portion 211 (or the second pin portion 221). In more detail, the length of the exposed first conductive portion 211S (or the second conductive portion 221S) is larger than the wire diameter of the cross section of the first pin portion 211 (or the second pin portion 221).

[0046] Thereafter, the first electrode portion 4 and the second electrode portion 5 are formed on the package structure 3 so as to be electrically connected to the first extension portion 21 and the second extension portion 22, respectively. Please refer to Fig. 9 which is a three-dimensional exploded view of the inductance element according to the first embodiment of the present invention, and Fig. 10 which is a schematic cross-sectional view of the cross section XX in Fig. 9.

[0047] In the inductance element Z1 according to this embodiment, the first electrode portion 4 is positioned on the first protrusion 31 so as to contact the first conductive portion 211S, and is electrically connected to the first pin portion 211. The second electrode portion 5 is positioned on the second protrusion 32 so as to contact the second conductive portion 221S, and is electrically connected to the second pin portion 221. As described above, compared to the conventional inductance structure, in the present invention, the area of ​​the exposed first conductive portion 211S and the exposed second conductive portion 221S is large, so that the contact area between the first electrode portion 4 (or the second electrode portion 5) and the first conductive portion 211S (or the second conductive portion 221S) can be increased, and the adhesive force between the first electrode portion 4 (or the second electrode portion 5) and the first conductive portion 211S (or the second conductive portion 221S) can be increased. When an external force is applied to the inductance element Z1, it is possible to avoid rupture of the adhesive surface between the first electrode portion 4 (or the second electrode portion 5) and the first conductive portion 211S (or the second conductive portion 221S), thereby improving the reliability of the inductance element Z1.

[0048] The first electrode portion 4 and the second electrode portion 5 can be formed by processes such as electroplating, sputtering, and vapor deposition, but the present invention is not limited thereto. In this embodiment, the first electrode portion 4 and the second electrode portion 5 are provided on the same side of the magnetic inductance element Z1, spaced apart from each other. When the inductance element Z1 is installed on another circuit board, the inductance element Z1 as shown in FIG. 9 is inverted and installed so that the first electrode portion 4 and the second electrode portion 5 face the circuit board.

[0049] To explain further, current electronic products are developed to be light and thin, and the density of elements inside electronic products is also gradually increasing, so the distance between adjacent elements is also reduced. Therefore, in the inductance element Z1 according to this embodiment, the first electrode portion 4 and the second electrode portion 5 are located on the same side of the magnetic inductance element Z1 (for example, the bottom side of the inductance element Z1) rather than on the opposite side of the magnetic inductance element Z1, so that when the inductance element Z1 is installed on a circuit board, contact with the adjacent element can be avoided. Meanwhile, since the surface of the inductance element Z1 has a problem of magnetic leakage, it is usually necessary to install another electrically grounded shield to cover the inductance element Z1. The first electrode portion 4 and the second electrode portion 5 of the inductance element Z1 are respectively located on the same side (bottom side) of the magnetic inductance element Z1, so that a short circuit caused by contact between the first electrode portion 4 or the second electrode portion 5 and the shield can be avoided.

[0050] However, the present invention is not limited to the electrode structure of the above embodiment. As shown in Fig. 11, which is a schematic cross-sectional view of an inductance element according to another embodiment of the present invention, in an inductance element Z2 according to this embodiment, elements similar to those in the inductance element Z1 according to the above embodiment have the same reference numerals, and therefore will not be described here.

[0051] As shown in FIG. 11, when the inductance element Z2 is installed on another circuit board and the distance between the elements is wide, the first electrode portion 4 and the second electrode portion 5 of the inductance element Z2 may be L-shaped electrodes. That is, the first electrode portion 4 includes a first bottom portion 40 and a first side portion 41 extending to the side of the inductance element Z2. Among them, the first bottom portion 40 is positioned on the first protrusion portion 31 so as to be in electrical contact with the first pin portion 211. In addition, the second electrode portion 5 includes a second bottom portion 50 and a second side portion 51 extending to the side of the inductance element Z1. The second bottom portion 50 is positioned on the second protrusion portion 32 so as to be in electrical contact with the second pin portion 221.

[0052] When the inductance element Z2 is mounted on another circuit board, the first bottom portion 40 and the second bottom portion 50 are mounted so as to face the circuit board. Also, by increasing the amount of solder (e.g., tin paste) that rises to the first side portion 41 and the second side portion 51, the adhesive strength between the inductance element Z2 and the circuit board can be improved.

[0053] [Advantageous Effects of the Embodiments] As advantageous effects of the present invention, the inductance element and its manufacturing method according to the present invention include: "a positioning groove H1 is defined by a magnetic base 1 including a column core 12;" "the coil structure 2 is installed in the positioning groove H1 and includes a coil body 20, a first extension portion 21 and a second extension portion 22. The first extension portion 21 includes a first bent portion 210 and a first pin portion 221 that are connected to each other; the second extension portion 22 includes a second bent portion 220 and a second pin portion 221 that are connected to each other;" and "the first bent portion 210 and the second bent portion 220 are bent to the same side from the coil body 20 and , have a first connection end 210a and a second connection end 220a, respectively. The shortest distance d1 between a first imaginary line A connecting the first connection end 210a and the second connection end 220a and the central axis Y of the pillar core 12 is shorter than the minimum outer radius Ra of the coil body 20. The technical feature that the first pin portion 211 and the second pin portion 221 extend from the first connection end 210a and the second connection end 220a, respectively, so as to protrude from the side surface of the coil body 20 maintains the reliability of the inductance elements Z1 and Z2 and provides the inductance elements Z1 and Z2 with excellent electrical characteristics.

[0054] To explain further, if the magnetic base 1 with the coil structure 2 preformed thereon is placed in the positioning groove H1, the coil structure 2 is deformed and shifted by compression during the manufacturing process, which can avoid the effects on the electrical characteristics and yield of the inductance elements, and the sizes of the inductance elements Z1 and Z2 can be controlled more effectively. In addition, the preformed magnetic base 1 has a higher density than a magnetic material formed by compacting magnetic powder. Therefore, since the density of the magnetic material in the through hole 20H of the coil body 20 of the inductance elements Z1 and Z2 according to this embodiment is high, the inductance elements Z1 and Z2 have a higher inductance value.

[0055] The shortest distance d1 between the first imaginary line A connecting the first connection end 210a and the second connection end 220a and the central axis Y of the column core 12 is shorter than the minimum outer radius Ra of the coil body 20, and the first pin portion 211 and the second pin portion 221 extend from the first connection end 210a and the second connection end 220a, respectively, thereby increasing the contact area (i.e., the first conductive portion 211S) between the first pin portion 211 and the first electrode portion 4, improving the adhesive force between the first pin portion 211 and the first electrode portion 4, and improving the reliability of the inductance elements Z1 and Z2. Similarly, the contact area (i.e., the second conductive portion 221S) between the second pin portion 221 and the second electrode portion 5 is increased, reducing the resistance between the second pin portion 221 and the second electrode portion 5, thereby providing the inductance elements Z1 and Z2 with better electrical characteristics.

[0056] The above disclosure is merely a preferred embodiment of the present invention, and the scope of the claims of the present invention is not limited thereto. Therefore, all equivalent technical modifications made by utilizing the contents of the specification and drawings of the present invention are included in the scope of the claims of the present invention. [Explanation of symbols]

[0057] Z1, Z2: Inductance elements 1...Magnetic base 10…Bottom plate 10S…Surface 11…Side wall 11S…Top surface 12…Column core H1... Positioning groove 2. Coil structure 20…Coil body 20H…Through hole 21...First extension 210…First bent portion 210a...first extension 210b...First bending start end 211…First pin 211S…First conductive part 22...Second extension part 220…Second bend 220b...Second bending start end 220a...second connection end 221…Second pin section 221S…Second conductive part Ra…Minimum outer radius Rb…Maximum outer radius d1: Shortest distance A…First imaginary line B…Second imaginary line h1: Height of side wall h2…height of column core T1: Coil height Y…center axis 3. Package structure 3A…Magnetic package 31…First protrusion 32…Second protrusion 3B…Insulating layer 4...First electrode part 40…First bottom 41...first side 5...Second electrode part 50…Second bottom 51...second side S100, S110, S120, S130, S140... Manufacturing process steps

Claims

1. An inductance element comprising: a magnetic base including a bottom plate, a side wall, and a column core; a coil structure; and a package structure covering the magnetic base and the coil structure, The side walls and the column core are protruded from a surface of the bottom plate, and the bottom plate, the side walls and the column core together define a positioning groove; The coil structure includes: a coil body disposed around the column core in the positioning groove and having a through hole; a first extension portion including a first bend portion and a first pin portion connected to each other; a second extension portion including a second bent portion and a second pin portion connected to each other; the first bent portion is bent in a direction away from the bottom plate from the coil body and has a first connection end, and the first pin portion extends from the first connection end to above the side wall so as to be substantially parallel to an extension direction of the bottom plate, the second bent portion is bent in a direction away from the bottom plate from the coil body and has a second connection end, and the second pin portion extends from the second connection end to above the side wall so as to be substantially parallel to the extending direction of the bottom plate, a shortest distance between a first imaginary line connecting the first connection end and the second connection end and a central axis of the pillar core is shorter than a minimum outer radius of the coil body, and a first imaginary line defined between the first connection end and the second connection end crosses the coil body and is located above the coil body; a first conductive portion of the first pin portion and a second conductive portion of the second pin portion are exposed from the package structure, the first conductive portion is provided on the first pin portion along an extension direction of the first pin portion, and the second conductive portion is provided on the second pin portion along an extension direction of the second pin portion; the package structure further includes a first electrode portion and a second electrode portion, the first electrode portion covers the first conductive portion so as to be electrically connected to the first conductive portion of the first pin portion, and the second electrode portion covers the second conductive portion so as to be electrically connected to the second conductive portion of the second pin portion; a height position of the first connection end and a height position of the second connection end are both higher than an upper surface of the side wall; the first bent portion has a first bend start end, the second bend portion has a second bend start end, a second imaginary line connecting the first bend start end and the second bend start end is on a vertical reference plane passing through the through hole, The first extension portion and the second extension portion are each bent from an extension direction toward a first side of the coil body toward an upper surface side of the coil body, and then bent again from the upper surface side toward the first side of the coil body. An inductance element comprising:

2. The inductance element according to claim 1 , wherein the first pin portion and the second pin portion extend so as not to exceed an outer edge of the side wall.

3. The inductance element according to claim 1 , wherein the shortest distance between the first virtual line and the central axis of the pillar core is equal to or less than two-thirds of a maximum outer radius of the coil body.

4. The inductance element according to claim 1 , wherein the side wall is disposed in a circumferential direction of the pillar core, and an upper surface of the side wall is flat.

5. The inductance element according to claim 1 , wherein a height of the pillar core with respect to the bottom plate is equal to or less than a height of the side wall.

6. The inductance element according to claim 1 , wherein a height position of an uppermost end of the coil body is lower than an upper surface of the side wall and an upper surface of the column core.

7. The package structure includes: The connector further includes a first protrusion and a second protrusion spaced apart from each other so as to correspond to the first pin and the second pin, The inductance element according to claim 1 , wherein the first conductive portion and the second conductive portion are exposed on an upper surface of the first protrusion portion and an upper surface of the second protrusion portion, respectively.

8. The inductance element according to claim 7 , wherein the first protrusion and the first pin portion extend along a same direction, and the second protrusion and the second pin portion extend along a same direction.

9. the first electrode portion is positioned on the first protrusion portion so as to contact the first conductive portion and is electrically connected to the first pin portion; The inductance element according to claim 7 , wherein the second electrode portion is positioned on the second protrusion portion so as to be in contact with the second conductive portion, and is electrically connected to the second pin portion.

10. providing a magnetic base having a pole core, the magnetic base including a bottom plate and a side wall, and forming a positioning groove in the magnetic base to surround the pole core; a step of forming a coil structure including a coil body, a first extension portion, and a second extension portion to be wound, the first extension portion and the second extension portion being bent from an extending direction of the coil body toward a first side toward an upper surface side of the coil body, and then bent again from the upper surface side toward the first side of the coil body, the coil body having a through hole, the first extension portion including a first bent portion connected to each other and a first pin portion extending substantially parallel to the extending direction of the bottom plate, and the second extension portion including a second bent portion connected to each other and a second pin portion extending substantially parallel to the extending direction of the bottom plate; placing the coil structure in the positioning groove around the pillar core; forming a package structure covering the magnetic base and the coil structure, wherein a first conductive portion of the first pin portion and a second conductive portion of the second pin portion are exposed to the outside of the package structure, the first conductive portion is provided on the first pin portion along an extension direction of the first pin portion, and the second conductive portion is provided on the second pin portion along an extension direction of the second pin portion; the first bent portion and the second bent portion are bent toward the same side from the coil body and each have a first connection end and a second connection end, a shortest distance between a first virtual line connecting the first connection end and the second connection end and a central axis of the through hole is shorter than a minimum outer radius of the coil body; the first pin portion and the second pin portion extend from the first connection end and the second connection end so as to protrude from a side surface of the coil body, the first conductive portion of the first pin portion and the second conductive portion of the second pin portion are both exposed on the same side of the package structure; The method further includes forming a first electrode portion and a second electrode portion on the package structure; the first electrode portion and the second electrode portion cover the first conductive portion and the second conductive portion, respectively, and are electrically connected to the first conductive portion and the second conductive portion; After performing the step of placing the coil structure in the positioning groove around the column core, the height position of the first connection end and the height position of the second connection end are both higher than the upper surface of the magnetic base; After performing the step of placing the coil structure in the positioning groove around the pillar core, the first imaginary line defined between the first connection end and the second connection end crosses the coil body and is located above the coil body; the first bent portion has a first bend start end, and the second bent portion has a second bend start end; A second virtual line connecting the first bend start end and the second bend start end is on a vertical reference plane passing through the through hole. A method for manufacturing an inductance element comprising the steps of:

11. The method for manufacturing an inductance element according to claim 10 , wherein the shortest distance between the first virtual line and the central axis of the through hole is equal to or less than two-thirds of a maximum outer radius of the coil body.

12. The side walls and the column core are protruded from a surface of the bottom plate, and the bottom plate, the side walls and the column core together define a positioning groove; The method for manufacturing an inductance element according to claim 10 , wherein the side wall is disposed in a circumferential direction of the pillar core, and an upper surface of the side wall is flat.

13. The method for manufacturing an inductance element according to claim 12 , wherein a height position of an uppermost end of the coil body is lower than an upper surface of the side wall and an upper surface of the column core.

14. The method for manufacturing an inductance element according to claim 12 , wherein a height of the pillar core is lower than a height of an upper surface of the side wall.

15. The step of forming the package structure includes: forming a magnetic package covering the coil structure and the magnetic base through a molding process; forming an insulating layer covering the outer surfaces of the magnetic package and the magnetic base; The method for manufacturing an inductance element according to claim 10 , further comprising: removing a part of the insulating layer and a part of the magnetic package so as to expose the first conductive portion and the second conductive portion.

16. the package structure includes a first protrusion and a second protrusion spaced apart from each other on the same side of the package structure; The method for manufacturing an inductance element according to claim 10 , wherein the first conductive portion and the second conductive portion are exposed at the first protruding portion and the second protruding portion, respectively.

17. The method for manufacturing an inductance element according to claim 16 , wherein the first protrusion portion and the first pin portion extend along a same direction, and the second protrusion portion and the second pin portion extend along a same direction.

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