Display device

Abstract

To block a moisture penetrating path and maintain performance of an organic light-emitting element.SOLUTION: A display device comprises: a display panel including a display area and a non-pad area located outside of the display area; a plurality of transmissive areas disposed in the non-pad area and spaced apart from each other in a first direction and a second direction different from the first direction; a circuit area disposed between the plurality of transmissive areas; a plurality of connection lines each disposed between adjacent transmissive areas of the plurality of transmissive areas; and a plurality of wiring lines disposed in the circuit area and each disposed so as to cross the plurality of connection lines. The plurality of wiring lines is disposed in different layers and includes an undercut structure under each of the plurality of wiring lines.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present specification relates to a display device, and more particularly to a display device capable of blocking a path of moisture penetration into an organic light emitting device to improve the reliability of the organic light emitting device. [Background technology]

[0002] Display devices are used in a variety of electronic devices, such as TVs, mobile phones, notebook computers, tablet PCs, etc. For this reason, research is ongoing to develop thinner, lighter, and less power-consuming display devices.

[0003] Examples of display devices include liquid crystal display devices (LCDs), plasma display panel devices (PDPs), field emission display devices (FEDs), electro-wetting display devices (EWDs), organic light emitting display devices (OLEDs), etc.

[0004] An OLED includes a plurality of pixel regions arranged in a display region where an image is displayed, and a plurality of organic light emitting elements corresponding to the plurality of pixel regions. Since the organic light emitting element is a self-emitting element that emits light, the OLED has advantages of a faster response speed, a larger light emitting efficiency, a larger brightness, a larger viewing angle, and an excellent contrast ratio and color reproduction rate compared to a liquid crystal display.

[0005] Organic light-emitting elements contain organic materials that are easily deteriorated by moisture, etc. For this reason, research is being conducted into methods for blocking portions that serve as paths for moisture penetration and preventing the deterioration of the organic materials.

[0006] In addition, there is an increasing demand for display devices capable of forming a large-area screen by arranging a plurality of display devices, as well as display devices having various sizes. Accordingly, it is important to be able to form display devices of various sizes, and to block the permeation path of moisture and oxygen in the organic light-emitting element, thereby improving the quality of the display device. Summary of the Invention [Problem to be solved by the invention]

[0007] The problem to be solved by the embodiments of the present specification is to provide a display device that can maintain the performance of the organic light-emitting element by blocking the moisture permeation path, which is one of the causes of deterioration of the organic light-emitting element in a cuttable display device, so that display devices of various sizes can be constructed.

[0008] An object of the present invention is to provide a display device capable of preventing an organic material layer disposed in an area other than a display area from becoming a moisture permeation path.

[0009] The problem to be solved by one embodiment of the present specification is not limited to the above-mentioned object, and other objects and advantages of the present invention not mentioned can be understood from the following description and can be more clearly understood from the embodiment of the present specification. In addition, it is easy to understand that the objects and advantages of the present specification can be realized by the means and combinations thereof set forth in the claims. [Means for solving the problem]

[0010] A display device according to one embodiment of the present specification includes a display panel including a display area and a non-pad area located outside the display area, a plurality of transmissive areas arranged in the non-pad area and spaced apart from each other in a first direction and a second direction different from the first direction, a circuit area arranged between the plurality of transmissive areas, a plurality of connecting wires arranged between adjacent transmissive areas among the plurality of transmissive areas, and a plurality of wires arranged in the circuit area and arranged in a direction crossing the plurality of connecting wires, the plurality of wires being located in different layers, and including an undercut structure below each of the plurality of wires. Effect of the Invention

[0011] According to one embodiment of the present specification, by disconnecting an organic material layer that can be a moisture penetration path in a cuttable display device so that display devices of various sizes can be constructed, the performance and lifespan of an organic light-emitting element can be maintained for a long period of time.

[0012] By maintaining the performance and lifespan of the organic light-emitting element for a long period of time, it becomes possible to ensure the quality of images displayed on the display device even with low power consumption, and it becomes possible to reduce power consumption.

[0013] In addition, by introducing the same array structure as that of the display area into the area other than the display area of ​​the cuttable display device, process convenience can be improved.

[0014] In addition, by inserting dummy patterns in the corners of the non-pad portion of the cuttable display device, the time for moisture and oxygen to penetrate can be further delayed, thereby increasing the life span of the product and further improving its reliability.

[0015] In addition, by disconnecting the organic material layer in the non-pad portion in a direction perpendicular to the moisture permeation path direction by using a multi-layer structure, it is possible to block moisture penetration into the display area, thereby enabling a long life of the organic light-emitting element arranged inside the display area to be configured and enabling the display device to be driven using low power.

[0016] The effects of the present specification are not limited to those mentioned above, and other effects not mentioned herein will be clearly understood by those skilled in the art from the following description. [Brief description of the drawings]

[0017] [Figure 1] 1 is a schematic plan view of a display device according to an embodiment of the present disclosure; [Figure 2A] FIG. 2 is a diagram showing a part of a non-pad area of ​​a display device according to an embodiment of the present specification. [Figure 2B] FIG. 2 is a diagram showing a part of a non-pad area of ​​a display device according to an embodiment of the present specification. [Figure 2C] FIG. 2 is a diagram showing a part of a non-pad area of ​​a display device according to an embodiment of the present specification. [Diagram 3] 13 is an enlarged plan view showing a part of a non-pad portion area of ​​a display device according to another embodiment of the present specification. FIG. [Figure 4A] FIG. 4 is a diagram showing each part of FIG. [Figure 4B] FIG. 4 is a diagram showing each part of FIG. [Diagram 5] 4 is a schematic perspective view of another embodiment of FIG. 3. [Figure 6A] FIG. 13 is an enlarged plan view showing a portion of a non-padded area according to another embodiment of the present specification. [Figure 6B] FIG. 13 is an enlarged plan view of a portion of a display area according to another embodiment of the present specification. [Figure 7] 7 is a cross-sectional view of each part of FIG. 6. [Figure 8] 7 is a cross-sectional view of each part of FIG. 6. [Figure 9] 7 is a cross-sectional view of each part of FIG. 6. [Figure 10] 7 is a cross-sectional view of each part of FIG. 6. [Figure 11] 7 is a cross-sectional view of each part of FIG. 6. [Figure 12] 7 is a cross-sectional view of each part of FIG. 6. [Figure 13] 7 is a cross-sectional view of each part of FIG. 6. [Figure 14] 7 is a cross-sectional view of each part of FIG. 6. [Figure 15] FIG. 2 is an enlarged plan view of 15 in FIG. [Figure 16] FIG. 16 is an enlarged plan view of 16 in FIG. [Figure 17] FIG. 2 is a cross-sectional view illustrating a configuration in which a moisture permeation path is blocked by a multi-layer structure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] The advantages and features of the present specification, as well as the methods for achieving them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present specification is not limited to the embodiments disclosed below, but may be configured in various different forms. However, the present embodiments are provided to complete the disclosure of the present specification and to fully convey the scope of the invention to those skilled in the art to which the present specification pertains.

[0019] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings to explain the embodiments of this specification are illustrative, and this specification is not limited to the matters shown in the drawings. The same reference symbols throughout the specification refer to the same components. In addition, when explaining this specification, if a specific description of related known technology is judged to make the gist of this specification unclear, the detailed description will be omitted. When "including," "having," "being," etc. are used as mentioned in this specification, other parts can be added unless "only" is used. When a component is indicated in the singular, it includes the case where it includes a plurality, unless otherwise explicitly stated.

[0020] When interpreting elements, they are to be interpreted as including a range of error unless otherwise expressly stated.

[0021] When describing the positional relationship between two parts, for example, using "on", "at the top", "below", "to the side", etc., one or more other parts may be located between the two parts, unless "immediately" or "directly" is used.

[0022] When describing a temporal relationship, for example, when using "after", "following", "next to", "before", etc., it is acceptable for things not to be consecutive, unless "immediately" or "directly" is used.

[0023] Although the terms "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Thus, the first component referred to below may be the second component within the technical concept of this specification.

[0024] The features of the embodiments of this specification may be combined or combined with each other, either partially or wholly, and may be technically linked and driven in various ways, and each embodiment may be implemented independently of each other or may be implemented together in a linked relationship.

[0025] Hereinafter, display devices according to embodiments of the present invention will be described with reference to the accompanying drawings.

[0026] 1 is a schematic plan view of a display device according to an embodiment of the present specification. For convenience of explanation, FIG. 1 shows only a display panel (PNL), a dam pattern 200, a printed circuit board (PCB), and a flexible printed circuit board (FPCB) among various components of the display device.

[0027] Referring to FIG. 1, a display panel (PNL) of a display device according to an embodiment of the present specification may include a display area (AA), a pad area (PAD) and a non-pad area (NPAD).

[0028] The display area (AA) is an area where an image is displayed, and may include a plurality of sub pixels. The display device according to the embodiment of the present specification may be a transparent display device that displays an image and transmits light so that objects arranged on the back of the display panel (PNL) can be visually recognized by a user. In one method for making the display panel (PNL) transparent, the plurality of sub pixels may be divided into a transmissive area and a circuit area, and light may be transmitted so that the back of the display panel in the transmissive area can be recognized. For this reason, the transmissive area may be an area where no opaque material or reflective material is arranged. In addition, an organic material layer that is a light-emitting layer may be arranged in each of the transmissive area and the circuit area. The organic light-emitting element may include an organic material layer, an anode, and a cathode, and the organic material layer may be arranged between the anode and the cathode. In one example, the transmissive area may include the organic material layer and the cathode except for the anode.

[0029] Each sub-pixel arranged on the display area includes an area that emits light corresponding to a certain hue. Three or more sub-pixels adjacent to each other and corresponding to different hues among the plurality of sub-pixels can form one pixel area that emits light of various hues. That is, the pixel area can display various hues and emit an image in the display area (AA) by combining light emitted from two or more sub-pixels adjacent to each other that constitute one pixel area. For example, the sub-pixels constituting one pixel area can emit light corresponding to green (G), blue (B) and red (R) hues, or light corresponding to green (G), blue (B), red (R) and white (W) hues.

[0030] The pad area (PAD) may be disposed on the non-display area (NAA) excluding the display area (AA) and may be an area where a flexible printed circuit board (FPCB) and a printed circuit board (PCB) are disposed. The flexible printed circuit board (FPCB) and the printed circuit board (PCB) may be disposed on at least one side edge of the display panel (PNL). An integrated circuit chip may be disposed on the flexible printed circuit board (FPCB). The flexible printed circuit board (FPCB) may be combined with the printed circuit board (PCB) to supply power and various signals to the display area (AA) from the printed circuit board (PCB) for driving the organic light emitting element. For example, the various signals may include a high potential voltage, a low potential voltage, a scan signal, or a data signal.

[0031] The printed circuit board (PCB) can provide signals to the integrated circuit chips disposed on the flexible printed circuit board (FPCB). Various components may be disposed on the printed circuit board (PCB) to provide various signals to the integrated circuit chips. Although the printed circuit board (PCB) in FIG. 1 is shown as being one, this is not limiting. For example, multiple printed circuit boards (PCB) may be disposed on one side edge of the display panel (PNL).

[0032] The non-pad area (NPAD) may be disposed on the non-display area (NAA) excluding the display area (AA) and may be located on the other side edge opposite to the pad area (PAD) disposed on one side of the display panel (PNL). The non-pad area (NPAD) may be defined by a cutting line (CL).

[0033] As the demand for display devices of various sizes increases, research into this issue is being conducted, and one of the methods is to introduce a cuttable display panel (PNL). The cuttable display panel (PNL) has a cutting line (CL) disposed on the other edge opposite the pad area (PAD). The removal area (D / A) is an area that is separated and removed when the display panel (PNL) is cut through the cutting line (CL). By separating the removal area (D / A) from the display panel (PNL) through the cutting line (CL), it is possible to adjust the size of the display device to be constructed. And, the other edge opposite the pad area (PAD) except for the removal area (D / A) that is removed through the cutting line (CL) can become a non-pad area (NPAD).

[0034] In the case of a display panel whose size is already determined, sub-pixels each having a transmissive region and a circuit region are arranged only on the display region (AA). However, in the case of a cuttable display panel (PNL), the region (PX) in which a plurality of sub-pixels are formed may be arranged to extend to the non-pad area (NPAD). In other words, a plurality of transmissive regions and a plurality of circuit regions each including an organic material layer may be arranged in the non-pad area (NPAD). The organic material layer is easily deteriorated by moisture, oxygen, or the like.

[0035] As a result, the portion where the organic material layer is disposed on the other side edge of the display panel (PNL) where the non-pad area (NPAD) is located can become a moisture permeation path. The moisture permeation path direction (VP) through which moisture permeates can be from the other side edge of the display panel (PNL) toward the display area (AA) as shown by the arrow in Figure 1. The organic material layer disposed along the moisture permeation path direction (VP) can act as a moisture permeation path, allowing moisture to penetrate into the display area (AA).

[0036] It is important hereby to prevent the penetration of moisture or oxygen through the organic material layers arranged in the moisture permeation path direction (VP).

[0037] In order to prevent moisture and oxygen from penetrating into the organic light emitting element of the display panel (PNL), a dam pattern 200 may be disposed. The dam pattern 200 may have a shape surrounding the four edges of the display panel (PNL). The dam pattern 200 serves to prevent oxygen and moisture from penetrating in the direction of the display area (AA).

[0038] In the embodiment of the present specification, the organic material layer that acts as a path for moisture or oxygen to penetrate and is disposed on the non-pad area (NPA) together with the dam pattern 200 is disconnected, thereby preventing moisture or oxygen from penetrating into the display area (AA). The following will be described with reference to the drawings.

[0039] 2A to 2C are plan views showing an enlarged view of a portion of a non-pad area of ​​a display device according to an embodiment of the present specification. Fig. 2B is a cross-sectional view taken along line 2B-2B' in area A of Fig. 2A. Fig. 2C is a cross-sectional view taken along line 2C-2C' in area A of Fig. 2A.

[0040] 2A to 2C, the non-pad area (NPAD) may include a plurality of transmissive areas (TA) and a plurality of circuit areas (CA). The transmissive areas (TA) may be areas where no opaque or reflective material is disposed.

[0041] The plurality of transparent regions (TA) may be arranged to be spaced apart from one another via the circuit region (CA). The transparent regions (TA) may be arranged to be spaced apart from one another in a first direction and a second direction different from the first direction. Here, the first direction may be the X-axis direction, and the second direction may be the Y-axis direction. In addition, the first direction may be the horizontal direction, and the second direction may be the vertical direction.

[0042] The substrate (SUB) of the circuit area (CA) of the non-pad area (NPAD) may include a light-shielding layer wiring (LS). The light-shielding layer wiring (LS) may extend along the same first direction as the transparent area (TA) arranged in the first direction. A buffer insulating layer (BUF), an interlayer insulating layer (ILD), a passivation layer (PAS), an overcoat layer (OC), a bank (BNK), an organic material layer (EL), and a cathode layer (CTH) may be arranged on the light-shielding layer wiring (LS). Although not shown in the drawing for convenience of explanation, a sealing layer for sealing the lower structure may be arranged on the upper part of the cathode layer (CTH).

[0043] 2A shows that the organic material layer (EL) is disposed only in the transmissive area (TA) for convenience of explanation, the organic material layer (EL) may be disposed on the front surface of the display device, so that the organic material layer (EL) may also be disposed on the top of the overcoat layer (OC) in the circuit area (CA).

[0044] By disposing the organic material layer (EL) on the overcoat layer (OC) of the circuit area (CA), the first connection wiring (CLa) and the second connection wiring (CLb) are generated between the adjacent transmissive areas (TA), thereby ensuring the reliability of the display device. For example, if the transmissive area (TA) is surrounded only by the overcoat layer (OC), a problem may occur in which moisture penetrates into the display area (AA) through the organic material layer (EL) disposed on the overcoat layer (OC).

[0045] In order to prevent moisture from penetrating to the display area (AA), an undercut structure (UC) may be disposed under the overcoat layer (OC) on the display section (EA). Specifically, the undercut structure (UC) may be located along the boundary of the transmissive area (TA). When the organic material layer (EL) is laminated after the undercut structure (UC) is formed under the overcoat layer (OC), the first connection wiring (CLa) and the second connection wiring (CLb) may be generated while the continuity of the organic material layer (EL) is interrupted and separated between the adjacent transmissive areas (TA). For example, the first connection wiring (CLa) may be disposed between the transmissive areas (TA) adjacent in a first direction (e.g., X-axis direction), and the second connection wiring (CLb) may be disposed between the transmissive areas (TA) adjacent in a second direction (e.g., Y-axis direction).

[0046] In addition, an undercut structure (UC) is disposed under the overcoat layer (OC) in the lateral direction of the first connection wiring (CLa) and the second connection wiring (CLb) to disconnect the organic material layer (EL) on the overcoat layer (OC) and ensure reliability. The undercut structure (UC) is formed by removing the interlayer dielectric layer (ILD) and the passivation layer (PAS) inwardly, so that the end portion (E1) of the overcoat layer (OC) protrudes from the end portion (E2) of the interlayer dielectric layer (ILD) or the passivation layer (PAS).

[0047] 2A, the first connection wiring (CLa) may be located between the transparent areas (TA) arranged in a first direction (e.g., X-axis direction), and the second connection wiring (CLb) may be located between the transparent areas (TA) arranged in a second direction (e.g., Y-axis direction). The first connection wiring (CLa) and the second connection wiring (CLb) may include the same material as the organic material layer (EL).

[0048] The undercut structure (UC) may be disposed below the overcoat layer (OC) in a second direction different from the first direction in which the first connection wiring (CLa) is located. Alternatively, the undercut structure (UC) may be disposed below the overcoat layer (OC) in a first direction different from the second direction in which the second connection wiring (CLb) is located.

[0049] 2A and 2B, an undercut structure (UC) may be disposed under the overcoat layer (OC) in a second direction (Y-axis direction) different from the first connection wiring (CLa) disposed in the first direction (X-axis direction). The undercut structure (UC) disconnects the organic material layer (EL) disposed on the upper part of the overcoat layer (OC) in the second direction (Y-axis direction) from the first connection wiring (CLa) to prevent the occurrence of a moisture permeation path (VP1) in the second direction (Y-axis direction). In addition, the undercut structure (UC) disconnects the organic material layer (EL) disposed on the upper part of the overcoat layer (OC) in the first direction (X-axis direction) from the second connection wiring (CLb) to prevent the occurrence of another moisture permeation path (VP2) in the first direction (X-axis direction).

[0050] 2A and 2C, however, the transmissive areas (TA) spaced apart from each other in the first direction (X-axis direction) may have another moisture permeation path (VP3) in the first direction (X-axis direction) through the first connection wiring (CLa). Also, the transmissive areas (TA) spaced apart from each other in the second direction (Y-axis direction) may have a problem of moisture or oxygen permeating through yet another moisture permeation path (VP4) that extends to the display area (AA) through the second connection wiring (CLb) that extends along the second direction (Y-axis direction).

[0051] As a result, in another embodiment of this specification, the organic material layer that acts as a path for moisture or oxygen to penetrate in all directions, the first direction (X-axis direction) and the second direction (Y-axis direction), is disconnected, thereby preventing moisture or oxygen from penetrating into the display area (AA). The following will be described with reference to the drawings.

[0052] Fig. 3 is a plan view showing an enlarged portion of a non-pad area according to another embodiment of the present specification. For example, Fig. 3 is an enlarged plan view of part 3 of Fig. 1. For convenience of explanation, Fig. 3 shows only the organic material layer 145 arranged in the transmissive area (TA), the overcoat layer 125 arranged in the circuit area (CA), the first wiring (ML1), and the second wiring (ML2) among various components arranged on the non-pad area (NPAD).

[0053] 1 and 3, the non-pad area (NPAD) may include a plurality of transmissive areas (TA) and a plurality of circuit areas (CA). Thus, the transmissive area (TA) may be an area where no opaque material or reflective material is arranged. And, the circuit area (CA) may have various circuit elements arranged therein. The display device according to the embodiment of the present specification can ensure the transmittance through the transmissive area (TA). Thus, the display device may be a transparent display device in which an object arranged on the rear side of the display panel (PNL) can be seen when viewed from the front face of the display panel (PNL).

[0054] The transmissive area (TA) may be an area in which the organic material layer 145 is disposed. A plurality of transmissive areas (TA) may be disposed apart from one another via the circuit area (CA). For convenience of explanation, the organic material layer 145 is shown to be disposed only in the transmissive area (TA), but the organic material layer 145 may be disposed on the front surface of the display device. Thus, the organic material layer 145 may also be disposed on the top of the overcoat layer 125 in the circuit area (CA).

[0055] Between adjacent transmissive regions (TA), the connection wiring (CLa, CLb) may be generated by the undercut structure (UC). For example, when the transmissive region (TA) is surrounded only by the overcoat layer (OC), moisture may penetrate to the display region through the organic material layer. In order to prevent this, the undercut structure (UC) is disposed under the overcoat layer (OC) to separate the organic material layer, and the connection wiring (CLa, CLb) may be generated. The connection wiring (CLa, CLb) may include a first connection wiring (CLa) and a second connection wiring (CLa). The first connection wiring (CLa) may be disposed between the transmissive regions (TA) arranged in a first direction, and the second connection wiring (CLb) may be disposed between the transmissive regions (TA) arranged in a second direction different from the first direction. Here, the first direction may be the X-axis direction, and the second direction may be the Y-axis direction. The first direction may be the horizontal direction, and the second direction may be the vertical direction. The first connection wiring (CLa) and the second connection wiring (CLb) may contain the same material as the organic material layer 145.

[0056] In one or more embodiments, the first connection wiring (CLa) and the second connection wiring (CLb) may each include the same organic material layer as the organic material layer 145. In one or more embodiments, the first connection wiring (CLa) and the second connection wiring (CLb) may be formed at the same time (or at the same process stage) as the organic material layer 145. The first connection wiring (CLa) and the second connection wiring (CLb) may be formed at a different time (or process stage) than the organic material layer 145. In one or more embodiments, the first connection wiring (CLa) may extend along the same direction as the second wiring (ML2). In one or more embodiments, the second connection wiring (CLb) may extend along the same direction as the first wiring (ML1).

[0057] The first connection wiring (CLa) is disposed between and connected to the transmissive areas (TA) arranged in a first direction, and the second connection wiring (CLb) is disposed between and connected to the transmissive areas (TA) arranged in a second direction different from the first direction. This allows moisture to permeate toward the display area (AA) along the direction in which the first connection wiring (CLa) or the second connection wiring (CLa) is arranged. In other words, moisture can permeate through the first moisture permeable path (P1) in which the first connection wiring (CLa) is arranged, the second moisture permeable path (P2) in which the second connection wiring (CLb) is arranged, and the third moisture permeable path (P3) in the side direction of the transmissive area (TA).

[0058] In an exemplary embodiment, the first connection wiring (CLa) may extend along a first direction (e.g., X-axis direction). In a second direction (e.g., Y-axis direction) of the first connection wiring (CLa) extending in the first direction, an undercut structure (UC) is disposed on one side, and an undercut structure (UC) is disposed on the other side opposite to the one side of the first connection wiring (CLa). As a result, the undercut structure (UC) separates (or divides) the overcoat layer 125 in the second direction (e.g., Y-axis direction). The first connection wiring (CLa) can act as a moisture prevention film and block moisture from moving in the second direction (e.g., Y-axis direction). As a result, the undercut structures (UC) located on one side and the other side of the first connection wiring (CLa) can block moisture movement from the overcoat layer 125 located on one side of the first connection wiring (CLa) to the overcoat layer 125 located on the other side of the first connection wiring (CLa). However, in these examples, the first connection wiring (CLa) itself cannot block moisture moving in the first direction (e.g., the X-axis direction), and the first connection wiring (CLa) itself also extends along the first direction (e.g., the X-axis direction).

[0059] The second connection wiring (CLb) may extend along the second direction (e.g., the Y-axis direction). An undercut structure (UC) is arranged on one side of the second connection wiring (CLb) extending in the second direction in the first direction (e.g., the X-axis direction), and an undercut structure (UC) is arranged on the other side opposite to the one side of the second connection wiring (CLb). As a result, the undercut structure (UC) separates (or divides) the overcoat layer 125 in the first direction (e.g., the X-axis direction). The second connection wiring (CLb) acts as a moisture prevention film and can block moisture from moving in the first direction (e.g., the X-axis direction). As a result, the undercut structures (UC) located on one and the other sides of the second connection wiring (CLb) can block moisture movement from the overcoat layer 125 located on one side of the second connection wiring (CLb) (e.g., on the left or right side of the second connection wiring (CLb)) to the overcoat layer 125 located on the other side of the second connection wiring (CLb) (e.g., on the right or left side of the second connection wiring (CLb)). However, in these examples, the second connection wiring (CLb) itself cannot block moisture moving in the second direction (e.g., the Y-axis direction), and the second connection wiring (CLb) itself also extends in the second direction (e.g., the Y-axis direction).

[0060] In order to solve the above-mentioned technical problems, in another embodiment of the present specification, the organic material layer 145, the first connecting wiring (CLa) and the second connecting wiring (CLb) arranged on the transmissive area (TA) or the circuit area (CA) can prevent the occurrence of moisture permeation paths (P1, P2).

[0061] The following description will be given with reference to FIGS. 4A to 5.

[0062] Figures 4A and 4B are diagrams showing various parts of Figure 3. Here, Figure 4A shows a cross section along line 4A in Figure 3. In this regard, Figure 4A can be said to be a composite of a cross section of the first connection wiring (CLa) (located to the left of the first wiring (ML1)), a cross section of the first wiring (ML1), and a cross section of the first connection wiring (CLa) located to the right of the first wiring (ML1) and cross sections of other layers.

[0063] Figure 4B shows a cross-sectional view along line 4B in Figure 3. And Figure 5 shows a schematic perspective view according to another embodiment of Figure 3. In this regard, it can be said that Figure 5 shows a configuration in which the first wiring (ML1) and the second wiring (ML2) are spaced apart from each other in a first direction (e.g., the X-axis direction) and extend along a second direction (e.g., the Y-axis direction).

[0064] 4A and 4B together with FIG. 1, a first wiring (ML1) and a second wiring (ML2) may be arranged in the non-pad area (NPAD). The first wiring (ML1) may be arranged on the circuit area (CA) and may extend along a second direction of the display panel (PNL). The second wiring (ML2) may be arranged on the circuit area (CA), and the second wiring (ML2) may be arranged to extend across the first direction intersecting with the second direction. Here, the first direction may be the X-axis direction, and the second direction may be the Y-axis direction, but is not limited thereto. For example, the first direction may be the horizontal direction, and the second direction may be the vertical direction.

[0065] Referring to Figure 5, in another exemplary embodiment, the first wiring (ML1) may be arranged to extend along the second direction (Y-axis direction) of the display panel (PNL), and the second wiring (ML2) may be arranged to extend along the second direction (Y-axis direction), which is the same direction as the first wiring (ML1).

[0066] The first wiring (ML1) and the second wiring (ML2) may be arranged in different layers. For example, the second wiring (ML2) may be arranged in a lower portion, and the first wiring (ML1) may be arranged in an upper portion of the second wiring (ML2). A multi-layer insulating layer may be arranged between the first wiring (ML1) and the second wiring (ML2).

[0067] The first wiring (ML1) and the second wiring (ML2) may be wirings extending from the display area (AA). For example, the first wiring (ML1) may be a source / drain wiring that forms a source electrode or a drain electrode on the display area (AA) and extends to the non-pad area (NPAD). The second wiring (ML2) may be a gate wiring that forms a gate electrode on the display area (AA) and extends to the non-pad area (NPAD).

[0068] The first wiring (ML1) and the second wiring (ML2) arranged on the non-pad area (NPA) may be in a floating state, not electrically connected to the source / drain electrodes or gate electrodes arranged on the display area (AA), in other words, they are not electrically connected to the second electrode 150, and therefore do not affect the operation of the display device.

[0069] The first wiring (ML1) may be arranged across the first connection wiring (CLa) arranged between the transparent regions (TA) arranged in the first direction. The second wiring (ML2) may be arranged across the second connection wiring (CLb) arranged between the transparent regions (TA) arranged in the second direction.

[0070] Undercut structures (UC1, UC3) may be disposed under the first wiring (ML1) and the second wiring (ML2). Another undercut structure (UC2) may be disposed under the overcoat layer 125 in the circuit region (CA). The undercut structures (UC1, UC2, UC3) may include a first undercut structure (UC1), a second undercut structure (UC2), and a third undercut structure (UC3). Each undercut structure (UC1, UC2, UC3) may disconnect the organic material layer 145, the first connection wiring (CLa), and the second connection wiring (CLb), thereby preventing the first and second moisture permeation paths (P1, P2). The undercut structures (UC1, UC2, UC3) may be disposed, for example, in different layers.

[0071] In one embodiment of the present specification, for example, a first wiring (ML1) including a first undercut structure (UC1) and a second undercut structure (UC2) disposed in a layer different from the first undercut structure (UC1) may be disposed between the transmissive regions (TA) arranged in the X-axis, which is the first direction. Thereby, the organic material layer 145 and the first connection wiring (CLa) may be discontinuous, and the organic material layer 145 and the first connection wiring (CLa) may be disconnected to prevent the first moisture permeation path (P1) from occurring. Here, the second undercut structure (UC2) may be adjacent to the first wiring (ML1) in the horizontal direction. The first undercut structure (UC1) may be disposed below the first wiring (ML1).

[0072] The following description will be given with reference to FIG. 4A.

[0073] 4A, a buffer layer 110, an interlayer insulating layer 115, a first wiring (ML1), a protective film 120, an overcoat layer 125, a bank 140, an organic material layer 145, and a second electrode 150 may be disposed on the substrate 100 in the non-pad area (NPAD). Although not shown in the drawing for convenience of explanation, a sealing layer for sealing the lower structure may be disposed on the second electrode 150.

[0074] The buffer layer 110 and the interlayer insulating layer 115 can each be formed of an insulating film and can be formed in a single layer or a multilayer structure. The interlayer insulating layer 115 can be formed to cover the gate electrodes of the thin film transistors on the display area (AA) and extend to the non-pad area (NPAD).

[0075] The first wiring (ML1) may be disposed on the interlayer insulating layer 115. The first wiring (ML1) may be, for example, a source / drain wiring that forms a source electrode or a drain electrode on the display area (AA) and extends to the non-pad area (NPAD). The first wiring (ML1) may include a first undercut structure (UC1) at the bottom.

[0076] The first undercut structure (UC1) may have an undercut shape with respect to the interlayer insulating layer 115. The undercut may be understood as a phenomenon in which the interlayer insulating layer 115 is further removed below the first wiring (ML1). In other words, the first undercut structure (UC1) is not vertically removed in alignment with the end portion (EG1a) of the first wiring (ML1), but is further removed inward from the end portion (EG1a) of the first wiring (ML1) by a predetermined depth.

[0077] As a result, both end portions (EG1a) of the first wiring (ML1) are located below the first wiring (ML1) and have a shape that protrudes outward beyond the end portion (EG1b) of the interlayer insulating layer 115 in which the first undercut structure (UC1) is arranged.

[0078] A protective film 120 may be disposed on the first wiring (ML1) in which the first undercut structure (UC1) is disposed, and an overcoat layer 125 may be disposed on the protective film 120. The protective film 120 may include an insulating film such as an oxide. The overcoat layer 125 can flatten steps of various circuit elements disposed on the circuit area (CA). The overcoat layer 125 may be configured to include a photoactive compound (PAC).

[0079] The overcoat layer 125 may include a second undercut structure (UC2) at the bottom. The second undercut structure (UC2) may be formed by further removing the protective film 120 and the interlayer insulating layer 115 below the overcoat layer 125. In the second undercut structure (UC2), the protective film 120 is further removed inward from an end portion (EG2a) of the overcoat layer 125 by a predetermined depth (d). As a result, the end portion (EG2a) of the overcoat layer 125 may have a shape that protrudes outward more than the end portion (EG2b) of the protective film 120 disposed below.

[0080] The second undercut structure (UC2) can be formed through a wet etching process using a wet solution after dry etching. The wet solution may include a buffered oxide etchant (BOE). The wet solution penetrates into the protective film 120 containing oxide and selectively removes only the protective film 120 without affecting other components such as the overcoat layer 125, thereby forming the second undercut structure (UC2).

[0081] A bank 140 may be disposed on the overcoat layer 125. An organic material layer 145 and a second electrode 150 may be sequentially disposed on the bank 140 in the non-pad area (NPAD).

[0082] The organic material layer 145 may be disposed on the front surface of the display panel (PNL) including the display area (AA) and the non-pad area (NPAD). As a result, the organic material layer 145 may be disposed extending from the upper surface of the bank 140 along the side direction to the overcoat layer 125. The organic material layer 145 is disposed along the surface of the overcoat layer 125. At this time, the organic material layer 145 may be disconnected (S2) at the end portion (EG2a) of the overcoat layer 125 having a shape protruding outward from the end portion (EG2b) of the protective film 120 by the second undercut structure (UC2).

[0083] Furthermore, the first connection wiring (CLa) and the second connection wiring (CLb) connecting adjacent transmissive regions (TA) may be arranged by patterning together with the organic material layer 145. The first connection wiring (CLa) (including the same organic layer as the organic material layer 145) may be arranged on the upper surface of the first wiring (ML1). Here, the organic material layer 145 may be disconnected (S2) at the end portion (EG1a) of the overcoat layer 125 having a shape protruding outward from the end portion (EG1b) of the interlayer insulating film 115 by the first undercut structure (UC1).

[0084] As a result, the organic material layer 145 and the first connection wiring (CLa) are disconnected (S1, S2) by the second undercut structure (UC2) and the first undercut structure (UC1), respectively, thereby blocking the generation of the first moisture permeation path (P1).

[0085] Further referring to FIG. 3, a display device according to an embodiment of the present invention may include a plurality of blocking channels such as first and second blocking channels (BCHa, BCHb). Each blocking channel may be disposed between adjacent transparent regions among a plurality of transparent regions (TA). The first blocking channel (BCHa) may be disposed between transparent regions arranged in a first direction (e.g., X-axis direction) among a plurality of transparent regions (TA). The second blocking channel (BCHb) may be disposed between transparent regions arranged in a second direction (e.g., Y-axis direction) among a plurality of transparent regions (TA). The first connection wiring (CLa) and the second connection wiring (CLb) (or at least a part thereof) may be disposed in the first blocking channel (BCHa) and the second blocking channel (BCHb), respectively. Each of the wirings (ML1, ML2) (or a part thereof) may extend to cross a corresponding one of the plurality of blocking channels. For example, the wirings (ML1) and (ML2) may extend to cross the first blocking channel (BCHa) and the second blocking channel (BCHb), respectively. The first and second blocking channels (BCHa and BCHb) can be utilized to block the movement of moisture across and / or along the respective blocking channels (BCHa and BCHb). In one or more embodiments, the first and second blocking channels (BCHa, BCHb) can be utilized to block the formation of moisture penetration paths (e.g., P1, P2).

[0086] Referring to FIG. 4A, a first blocking channel (BCHa) is shown according to one or more exemplary embodiments herein. The dotted line in FIG. 4A indicates the edge (etc.) or outline (etc.) of the first blocking channel (BCHa). In one or more embodiments, the side of the bank 140 and the overcoat layer 125 may be disposed in the first blocking channel (BCHa) or form the edge of the first blocking channel (BCHa). The first and second undercut structures (UC1, UC2) may be disposed in the first blocking channel (BCHa) or form the edge of the first blocking channel (BCHa). The first wiring (ML1), the first connecting wiring (CLa) and the second electrode 150 (e.g., the second electrode 150 on the first connecting wiring (CLa)) may be disposed in the first blocking channel (BCHa) or may be disposed below the first blocking channel (BCHa). The second electrode 150 may be disposed on the organic material layer 145 disposed on the side of the bank 140 and the overcoat layer 125. Thus, the second electrode 150 and the organic material layer 145 may be disposed in the first blocker channel (BCHa) or on top of the first blocker channel (BCHa).

[0087] An example of a first blocking channel (BCHa) and a second blocking channel (BCHb) is also shown with reference to FIG. 4B. As shown on the left side of FIG. 4B, the first wiring (ML1), the first connecting wiring (CLa) (or both the middle and opposite portions of the first connecting wiring (CLa)) and the second electrode 150 may be disposed in the first blocking channel (BCHa). The first undercut structure (UC1) may be disposed in the first blocking channel (BCHa) or form an edge of the first blocking channel (BCHa). As shown on the right side of FIG. 4B, the second wiring (ML2), the second connecting wiring (CLb) (or both the middle and opposite portions of the second connecting wiring (CLb)) and the second electrode 150 may be disposed in the second blocking channel (BCHb). The third undercut structure (UC3) may be disposed in the second blocking channel (BCHb) or form an edge of the second blocking channel (BCHb).

[0088] In addition, in one embodiment of the present specification, for example, the second wiring (ML2) including the third undercut structure (UC3) can be arranged between the transmissive regions (TA) arranged in the Y-axis, which is the second direction, to disconnect the organic material layer 145 and the second connection wiring (CLb), thereby blocking the generation of the second moisture permeation path (P2). The following will be described with reference to FIGS. 3 to 5.

[0089] 3 to 5, the buffer layer 110, the gate insulating layer (GI), the second wiring (ML2), the interlayer insulating layer 115, the first wiring (ML1), the organic material layer 145, and the second electrode 150 may be sequentially stacked on the substrate 100 in the circuit region (CA). In one example, the buffer layer 110, the interlayer insulating layer 115, the first wiring (ML1), the first connection wiring (CLa), and the second electrode 150 may be sequentially stacked on the substrate 100 and the circuit region (CA). In one example, the buffer layer 110, the gate insulating layer (GI), the second wiring (ML2), the second connection wiring (CLb), and the second electrode 150 may be sequentially stacked on the substrate 100 and the circuit region (CA). In FIG. 5, the second electrode 150 is not shown for convenience of explanation.

[0090] In a region where the first wiring (ML1) is arranged in a second direction crossing the first wiring (CLa) and is disposed under the first connection wiring (CLa) arranged between the transparent regions (TA) arranged in the first direction, as shown in FIG. 4A, the end portion (EG1a) of the first wiring (ML1) protrudes from the end portion (EG1b) of the interlayer insulating layer 115 due to the first undercut structure (UC1). As a result, the first connection wiring (CLa) can be disconnected (or separated) into a first portion disposed on the upper surface of the first wiring (ML1) and a second portion disposed on both sides of the first wiring (ML1) via the first undercut structure (UC1). In this case, the first connection wiring (CLa) can be separated into the first portion and at least two second portions. The at least two second portions of the first connection wiring (CLa) may be disposed in a region adjacent (or adjacent) to the corresponding side surface of the first wiring (ML1). In addition, the organic material layer 145 and the first connection wiring (CLa) may be disconnected by a second undercut structure (UC2) that is disposed under the overcoat layer 125 and disposed above (at least partially or entirely) the first connection wiring (CLa) in a direction perpendicular to the first connection wiring (CLa). The organic material layer 145 and the first connection wiring (CLa) are disconnected by the second undercut structure (UC2) and the first undercut structure (UC1), respectively, thereby preventing the first moisture permeation path (P1) from occurring in the first direction.

[0091] Furthermore, as shown in Figure 4B, in a region where the second wiring (ML2) is arranged in the first direction crossing the second connection wiring (CLb) and is arranged below the second connection wiring (CLb) arranged between the transparent regions (TA) arranged in the second direction, the third undercut structure (UC3) causes the end portion (EG3a) of the second wiring (ML2) to protrude outward further than the end portion (EG3b) of the gate insulation layer (GI).

[0092] As a result, the second connection wiring (CLb) is disconnected (or separated) via the third undercut structure (UC3) into a first portion disposed on the upper surface of the second wiring (ML2) and a second portion disposed on both sides of the second wiring (ML2), thereby preventing the occurrence of the second moisture permeation path (P2). The second wiring (ML2) may be a gate wiring that forms a gate electrode on the display area (AA) and extends to the non-pad area (NPAD), but is not limited to this.

[0093] In addition, the second electrodes 150 disposed on the first connection wiring (CLa) and the second connection wiring (CLb) can be electrically connected without being disconnected. These second electrodes 150 can be used as, for example, auxiliary electrodes.

[0094] 5, the first wiring (ML1) may be arranged to extend along the second direction (Y-axis direction) of the display panel (PNL), and the second wiring (ML2) may be arranged to extend along the second direction (Y-axis direction) which is the same direction as the first wiring (ML1). In a region where the first wiring (ML1) is arranged under the first connection wiring (CLa) arranged between the transmissive regions (TA) arranged in the first direction and arranged in the second direction crossing the first connection wiring (CLa), the first undercut structure (UC1) causes the end portion of the first wiring (ML1) to protrude from the end portion of the interlayer insulating layer 115. As a result, the first connection wiring (CLa) may be disconnected (or separated) into a first portion arranged on the upper surface of the first wiring (ML1) and a second portion arranged on the side of the first wiring (ML1) via the first undercut structure (UC1).

[0095] The second wiring (ML2) may be arranged at a distance from the first wiring (ML1) in the first direction (X-axis direction). In a region where the first wiring (ML1) and the second wiring (ML2) arranged in another layer are arranged, the third undercut structure (UC3) causes an end portion of the second wiring (ML2) to protrude beyond an end portion of the gate insulating layer (GI). This allows the first connection wiring (CLa) to be disconnected (or separated) into a first portion arranged on the upper surface of the second wiring (ML2) and a second portion arranged on the side of the second wiring (ML2).

[0096] As a result, the first connection wiring (CLa) is disconnected (or separated) through the first undercut structure (UC1) and the third undercut structure (UC3) arranged in different layers, thereby preventing the first moisture permeation path (P1) from occurring. With the configuration of FIG. 5, the blocking channel used to block the movement of moisture can correspond to the first blocking channel (BCHa). The second wiring (ML2) may be, but is not limited to, a gate wiring extending to the non-pad area (NPAD) while forming a gate electrode on the display area (AA).

[0097] 3 and 5, each undercut structure may be arranged vertically to each moisture permeation path. For example, the second undercut structure (UC2) arranged under the overcoat layer 125 may be arranged vertically to the organic material layer 145 arranged on the transmissive areas (TA) arranged in the first and second directions, respectively. Thus, the second undercut structure (UC2) may be defined as at least three sides of the circuit area (CA) facing at least three corresponding sides of the transmissive areas (TA).

[0098] The first wiring (ML1) and the second wiring (ML2) may be arranged in different layers. For example, the second wiring (ML2) may be arranged in a lower portion, and the first wiring (ML1) may be arranged in an upper portion of the second wiring (ML2). As a result, the first connection wiring (CLa) and the second connection wiring (CLb) are disconnected in different layers by the first undercut structure (UC1) arranged in a lower portion of the first wiring (ML1) arranged in different layers, and the third undercut structure (UC3) arranged in a lower portion of the second wiring (ML2), so that the moisture permeation path that may occur in the vertical or horizontal direction can be blocked by the multi-layer structure.

[0099] By disconnecting the organic material layers that act as moisture permeation paths in multiple layers by an undercut structure arranged in a direction perpendicular to the moisture permeation path direction on the non-pad area (NPAD), moisture permeation toward the display area can be blocked. This makes it possible to secure the life of the organic light-emitting element arranged inside the display area, and to drive the display device using low power. This has the effect of ensuring the quality of images on the display device even with low power by maintaining the performance and life of the organic light-emitting element for a long time, and reducing power consumption.

[0100] Meanwhile, in the non-pad area (NPAD) of the cuttable display device, the convenience of the process steps can be improved by introducing an array structure similar to that of the display area (AA), which will be described below with reference to the drawings.

[0101] Fig. 6a is a plan view showing an enlarged portion of a non-padded area according to another embodiment of the present specification. And Fig. 6b is a plan view showing an enlarged portion of a display area according to another embodiment of the present specification. For example, Fig. 6a is an enlarged plan view of 6a in Fig. 1. And Fig. 6b is an enlarged plan view of 6b in Fig. 1.

[0102] 6a and 6b, the non-pad area (NPAD) may include a plurality of transparent areas (TA) and a plurality of circuit areas (CA). For example, the plurality of transparent areas (TA) may include a first transparent area (TA1), a second transparent area (TA2), a third transparent area (TA3), and a fourth transparent area (TA4). Here, the first transparent area (TA1) and the second transparent area (TA2) may be spaced apart from each other in a first direction, and the third transparent area (TA3) and the fourth transparent area (TA4) may be spaced apart from each other in the first direction. Also, the first transparent area (TA1) and the third transparent area (TA3) may be spaced apart from each other in a second direction, and the second transparent area (TA2) and the fourth transparent area (TA4) may be spaced apart from each other in the second direction.

[0103] Connection wirings (CL1, CL2) may be arranged between adjacent transparent regions (TA). The connection wirings (CL1, CL2) may include a first connection wiring (CL1) arranged between a first transparent region (TA1) and a second transparent region (TA2) arranged in a first direction, and a second connection wiring (CL2) arranged between a first transparent region (TA1) and a third transparent region (TA3) arranged in a second direction. Here, the first direction may be the X-axis direction, and the second direction may be the Y-axis direction, but is not limited thereto. For example, the first direction may be the horizontal direction, and the second direction may be the vertical direction.

[0104] A plurality of signal wirings extending from the display area (AA) may be arranged in the circuit area (CA) on the non-pad area (NPAD). For example, the plurality of signal wirings may include a light shielding layer line (N_LS), a source / drain line (N_SD1, N_SD2), a gate electrode line (N_GE), and a drive signal transmission line (N_ML).

[0105] In one or more embodiments, the first connection wiring (CLa) and the second connection wiring (CLb) may each include the same organic material layer as the organic material layer 145. In one or more embodiments, the first connection wiring (CLa) and the second connection wiring (CLb) may be formed simultaneously (or at the same process stage) with the organic material layer 145. The first connection wiring (CLa) and the second connection wiring (CLb) may be formed at a different time (or process stage) from the organic material layer 145. In one or more embodiments, the first connection wiring (CLa) may extend along the same direction as the second wiring (ML2) such as the gate electrode line (N_GE). In one or more embodiments, the second connection wiring (CLb) may extend along the same direction as the first wiring (ML1). In an exemplary embodiment, the second connection wiring (CL2) may extend along the same direction as the first wiring, such as the light shielding layer line (N_LS), the source / drain line (NSD1, N_SD2), and / or the drive signal transmission line (N_ML).

[0106] The multiple transparent areas (TA1, TA2, TA3, TA4) and the circuit area (CA) of the non-pad area (NPAD) can have an array structure having the same characteristics as the structure of the multiple transparent areas (TA1_A, TA2_A, TA3_A, TA4_A) and the circuit area (CA_A) of the display area (AA).

[0107] For example, the light blocking layer line (N_LS) of the non-pad area (NPAD) may form a light blocking layer (A_LS) on the display area (AA) and be arranged to extend to the non-pad area (NPAD). The source / drain lines (N_SD1, N_SD2) of the non-pad area (NPAD) may form source electrodes / drain electrodes (A_SD1, A_SD2) on the display area (AA) and be arranged to extend to the non-pad area (NPAD). The source / drain lines (N_SD1, N_SD2) may include a first source / drain line (N_SD1) and a second source / drain line (N_SD2). Also, the gate electrode line (N_GE) of the non-pad area (NPAD) may form a gate electrode (A_GE) on the display area (AA) and be arranged to extend to the non-pad area (NPAD). The driving signal transmission line (N_ML) of the non-pad area (NPAD) may be various signal transmission lines (A_ML) arranged on the display area (AA). For example, it may be one of a high potential voltage line, a low potential voltage line, a data line, or a reference voltage line, but is not limited thereto. In addition, on the display area (AA), connection wirings (A_CL1, A_CL2) may be arranged between adjacent transmissive areas (TA1_A, TA2_A, TA3_A, TA4_A).

[0108] The light blocking layer line (N_LS) and the first and second source / drain lines (N_SD1, N_SD2) may be arranged in a direction crossing the first connection wiring (CL1). The signal wirings arranged on the non-pad area (NPAD) may be in a floating state not electrically connected, unlike the signal wirings arranged on the display area (AA). For example, the signal wirings arranged on the display area (AA) are electrically connected to wirings (e.g., high potential voltage lines or low potential voltage lines) that supply electrical signals or voltages. On the other hand, the signal wirings arranged on the non-pad area (NPAD) may not be electrically connected to wirings that supply electrical signals or voltages.

[0109] The convenience of the process steps can be improved by arranging an array structure similar to that of the display area (AA) on the non-pad area (NPAD). For example, in order to form a plurality of signal wirings having a shape different from that of the display area (AA) on the non-pad area (NPAD), a separate process step must be performed. However, in a display device according to another embodiment of the present specification, a plurality of signal wirings are formed on the display area (AA) and a plurality of signal wirings having the same shape are arranged on the non-pad area (NPAD), so that the process steps do not need to be changed, and the convenience of the process steps can be improved. In other words, the plurality of transmissive areas (TA) and the circuit area (CA) of the non-pad area (NPAD) may have the same characteristics as the structure of the plurality of transmissive areas (TA) and the circuit area (CA) of the display area (AA).

[0110] In addition, by arranging an array structure similar to that of the display area (AA), the individual undercut structures arranged under the multiple signal wirings arranged in different layers constitute a multi-layer structure arranged in different layers, thereby making it possible to prevent the occurrence of moisture permeation paths across multiple layers.

[0111] Referring to FIG. 6A, a plurality of blocking channels such as first and second blocking channels (BCH1, BCH2) may be provided. Each blocking channel may be disposed between adjacent transparent regions of a plurality of transparent regions (TA). The first blocking channel (BCH1) may be disposed between transparent regions arranged in a first direction (e.g., X-axis direction) of a plurality of transparent regions (TA). The second blocking channel (BCH2) may be disposed between transparent regions arranged in a second direction (e.g., Y-axis direction) of a plurality of transparent regions (TA). The light blocking layer line (N_LS), the source / drain lines (N_SD1, N_SD2) and the driving signal transmission line (N_ML) (or a part thereof) may extend to cross the first blocking channel (BCH1) (or each part of the first blocking channel (BCH1)). The gate electrode line (N_GE) (or a part thereof) may extend to cross the second blocking channel (BCH2) (or a part of the second blocking channel (BCH2)). The first and second blocking channels (BCH1, BCH2) can be utilized to block the movement of moisture across the respective blocking channels (BCH1, BCH2). In one or more embodiments, the first and second blocking channels (BCH1, BCH2) can be utilized to prevent a moisture permeation path from forming.

[0112] 7 to 14 are drawings showing cross sections at the positions of the parts of FIG. 6A and FIG. 6B. Here, FIG. 7 and FIG. 8 are horizontal and vertical cross sections of the part where the light blocking layer line (N_LS) is arranged. In particular, FIG. 7 shows an example of a cross section cut along line 7-7 of FIG. 6A, and FIG. 8 shows an example of a cross section cut along line 8-8 of FIG. 6A. FIG. 9 shows an example of a cross section cut along line 9-9 of FIG. 6A, and FIG. 10 shows an example of a cross section cut along line 10-10 of FIG. 6A. FIG. 11 shows an example of a cross section cut along line 11-11 of FIG. 6A, and FIG. 12 shows an example of a cross section cut along line 12-12 of FIG. 6A. FIG. 13 shows an example of a cross section cut along line 13-13 of FIG. 6A, and FIG. 14 shows an example of a cross section cut along line 14-14 of FIG. 6A. 17 is a perspective view for explaining a configuration in which the moisture permeation path is blocked by a multi-layer structure. For convenience of explanation, the second electrode 150 is not shown in FIG.

[0113] 6A and 6B, and referring to FIGS. 7 and 8, a first connection wiring (CL1) may be disposed between a first transmission area (TA1) and a second transmission area (TA2) spaced apart from each other in a first direction. A light blocking layer line (N_LS) may be disposed in a direction crossing the first connection wiring (CL1). A light blocking layer line (N_LS), a buffer layer 110, an interlayer insulating layer 115, a protective film 120, and an overcoat layer 125 may be disposed on the substrate 100. The light blocking layer line (N_LS) may be disposed in the bottom layer that forms a light blocking layer on the display area (AA) and extends to the non-pad area (NPAD) to contact the substrate 100. The overcoat layer 125 may be disposed on both circuit areas (CA) via the first connection wiring (CL1). In this regard, in one or more embodiments, the overcoat layer 125 may have opposing portions and the circuit area (CA) may have two opposing sides, and each of the opposing portions of the overcoat layer 125 may be disposed on a corresponding one of the two opposing sides of the circuit area (CA).

[0114] The overcoat layer 125 may include a first undercut structure (UCa) at the bottom. The first undercut structure (UCa) may have an undercut shape with respect to the protective film 120 and the interlayer insulating layer 115, respectively. As a result, the end portion (ED7a) of the overcoat layer 125 arranged on both sides via the first connection wiring (CL1) has a shape protruding from the end portion (ED7b) of the protective film 120 and the interlayer insulating layer 115. Then, the organic material layer 145 may be disconnected on the upper surface of the overcoat layer 125. A second electrode 150 may be arranged on the front surface of the first connection wiring (CL1) and the organic material layer 145. The second electrode 150 can be used as an auxiliary electrode.

[0115] Furthermore, referring to FIG. 8, the first connection wiring (CL1) may extend laterally while covering the upper surface of the light blocking layer line (N_LS).

[0116] 6A and 6B, the first transmissive region (TA1) and the second transmissive region (TA2) spaced apart from each other in the first direction are connected to each other by the first connection wiring (CL1). The light-blocking layer line (N_LS) may be disposed crossing the first connection wiring (CL1). The light-blocking layer line (N_LS), the buffer layer 110, the interlayer insulating layer 115, the first source / drain line (N_SD1), the protective film 120, the overcoat layer 125, the organic material layer 145, and the second electrode 150 may be disposed on the substrate 100. The light-blocking layer line (N_LS) may be disposed in the bottom layer on the substrate 100 by forming a light-blocking layer on the display area (AA) and extending to the non-pad area (NPAD). The first source / drain line N_SD1 may be located on the light blocking layer line N_LS via the buffer layer 110 and the interlayer insulating layer 115, and may be arranged to overlap the light blocking layer line N_LS.

[0117] The overcoat layer 125 may be disposed on both circuit areas (CA) via the first connection wiring (CL1). The overcoat layer 125 may include a first undercut structure (UCa) at the bottom. The first undercut structure (UCa) may have an undercut shape with respect to the protective layer 120. The first undercut structure (UCa) may be disposed (at least partially or entirely) on the first connecting line (CL1). As a result, the end portions (ED9a) of the opposing both side portions of the overcoat layer 125 disposed on the opposite side of the circuit area (CA) via the first connection wiring (CL1) have a shape protruding more than the end portion (ED9b) of the protective layer 120, and the organic material layer 145 disposed on the upper surface of the overcoat layer 125 may be disconnected. A second electrode 150 may be disposed on the first connection wiring (CL1) and the organic material layer 145.

[0118] 10, the first source / drain line (N_SD1) may include a second undercut structure (UCb) at the bottom. The second undercut structure (UCb) may have an undercut shape with respect to the interlayer insulating layer 115. As a result, the end portion (ED10a) of the first source / drain line (N_SD1) has a shape protruding from the end portion (ED10b) of the interlayer insulating layer 115, and the first connection wiring (CL1) may be disconnected at the upper surface of the first source / drain line (N_SD1) and separated from other parts of the first connection wiring (CL1) arranged on the interlayer insulating layer 115. A second electrode 150 may be arranged on the first connection wiring (CL1) and the organic material layer 145.

[0119] 17, the first connection wiring (CL1) may be disconnected or discontinuous in the organic material layer 145 due to the first undercut structure (UCa) disposed in the protective film 120 disposed on the upper part of the first source / drain line (N_SD1). Also, the first connection wiring (CL1) may be disconnected or discontinuous due to the second undercut structure (UCb) located under the first source / drain line (N_SD1) and disposed in the interlayer insulating layer 115, which is a different layer from the protective film 120. In other words, the first connection wiring (CL1) may be disconnected or discontinuous due to the first and second undercut structures (UCa, UCb) disposed in different layers, respectively, thereby blocking the moisture permeation path in any direction, either the first direction (X-axis direction) or the second direction (Y-axis direction). 17 shows only the first source drain line (N_SD1) for ease of explanation, the second source drain (N_SD2) may be arranged adjacent to the first source drain line (N_SD1) in the first direction (X-axis direction) and spaced apart from each other. The first connection wiring (CL1) may also block moisture permeation paths in all directions, the first direction (X-axis direction) and the second direction (Y-axis direction), due to the first undercut structure (UCa) and the second undercut structure (UCb) arranged in the second source drain line (N_SD2).

[0120] In other words, the first connection wiring (CL1) extending in the first direction (X-axis direction) is broken or has discontinuity due to the first and second undercut structures (UCa, UCb) arranged in different layers, respectively, thereby blocking moisture permeation paths in any direction, either the first direction (X-axis direction) or the second direction (Y-axis direction).

[0121] 11 and 12 together with Figures 6A and 6B, a first connection wiring (CL1) is disposed between a first transmissive region (TA1) and a second transmissive region (TA2) spaced apart from each other in a first direction. A second source / drain line (N_SD2) may be disposed in a direction crossing the first connection wiring (CL1). The second source / drain line (N_SD2) may be disposed on the same plane (e.g., the same layer) as the first source / drain line (N_SD1).

[0122] A buffer layer 110, an interlayer insulating layer 115, a second source / drain line (N_SD2), a protective film 120, an overcoat layer 125, an organic material layer 145, and a second electrode 150 may be disposed on the substrate 100. The second source / drain line (N_SD2) may be disposed on the interlayer insulating layer 115.

[0123] The overcoat layer 125 may be disposed on the circuit regions (CA) on both sides via the first connection wiring (CL1). The overcoat layer 125 may include a first undercut structure (UCa) at the bottom. The first undercut structure (UCa) may have an undercut shape with respect to the protective layer 120. As a result, the end portion (ED11a) of the overcoat layer 125 disposed on both sides via the first connection wiring (CL1) may have a shape protruding more than the end portion (ED11b) of the protective layer 120. Due to such a shape, the organic material layer 145 disposed on the upper surface of the overcoat layer 125 may be disconnected.

[0124] In addition, the first connection wiring (CL1) may be disconnected or discontinuous in the organic material layer 145 due to the first undercut structure (UCa) disposed in the protective film 120 disposed on the upper part of the second source / drain line (N_SD2), and the first connection wiring (CL1) may be disconnected or discontinuous due to the second undercut structure (UCb) disposed in the interlayer insulating layer 115 disposed under the second source / drain line (N_SD2). In other words, the first undercut structure (UCa) and the second undercut structure (UCb) disposed in different layers respectively disconnect the first connection wiring (CL1) over multiple layers, thereby blocking the moisture permeation path. A second electrode 150 may be disposed on the first connection wiring (CL1) and the organic material layer 145.

[0125] Also, as shown in FIG. 12, the second source / drain line (N_SD2) may include a second undercut structure (UCb) at the bottom. The second undercut structure (UCb) may have an undercut shape with respect to the interlayer insulating layer 115. Due to the undercut shape, the end portion (ED12a) of the second source / drain line (N_SD2) has a shape that protrudes more than the end portion (ED12b) of the interlayer insulating layer 115, and the first connection wiring (CL1) (or a part thereof) disposed on the upper surface of the second source / drain line (N_SD2) may be separated or disconnected from the first connection wiring (CL1) (or other part or other part) disposed on the buffer layer 110. This can block the moisture permeation path from the first connection wiring (CL1) to the second transmissive region (TA2). A second electrode 150 may be disposed on the first connection wiring (CL1) and the organic material layer 145.

[0126] 13 and 14 together with Fig. 6A and Fig. 6B, a second connection wiring (CL2) may be disposed between a first transmissive region (TA1) and a third transmissive region (TA3) spaced apart from each other in the second direction. A gate electrode line (N_GE) may be disposed in a direction crossing the second connection wiring (CL2). A buffer layer 110, a gate insulating layer (GI), a gate electrode line (N_GE), an interlayer insulating layer 115, a protective film 120, an overcoat layer 125, an organic material layer 145, and a second electrode 150 may be disposed on the substrate 100.

[0127] The gate electrode line (N_GE) may include a third undercut structure (UCc) at the bottom. The third undercut structure (UCc) may have an undercut shape with respect to the gate insulating layer (GI). Due to the undercut shape, the end portion (ED13a) of the gate electrode line (N_GE) has a shape that protrudes more than the end portion (ED13b) of the gate insulating layer (GI). As a result, the second connection wiring (CL2) of the portion disposed on the upper surface of the gate electrode line (N_GE) is disconnected, and thus the second connection wiring (CL2) of the portion disposed on the buffer layer 110 may be separated from the second connection wiring (CL2). As a result, the moisture permeation path from the second connection wiring (CL2) to the third transparent region (TA3) may be blocked. A second electrode 150 may be disposed on the first connection wiring (CL1) and the organic material layer 145.

[0128] The overcoat layer 125 may be disposed on both circuit regions (CA) via the second connection wiring (CL2). The overcoat layer 125 may include a first undercut structure (UCa) at the bottom. The first undercut structure (UCa) may have an undercut shape with respect to the protective layer 120 and the interlayer insulating layer 115. As a result, the end portion (ED14a) of the overcoat layer 125 disposed on both sides via the second connection wiring (CL2) may have a shape protruding more than the end portion (ED14b) of the protective layer 120 and the interlayer insulating layer 115. Due to such a shape, the organic material layer 145 disposed on the upper surface of the overcoat layer 125 may be disconnected and separated from the second connection wiring (CL2). A second electrode 150 may be disposed on the second connection wiring (CL2) and the organic material layer 145.

[0129] Examples of the first block channel (BCH1) and the second block channel (BCH2) are illustrated with reference to FIGS.

[0130] In FIG. 7, the side of the overcoat layer 125 may be disposed in the first blocking channel (BCH1) or may form an edge of the first blocking channel (BCH1). The first and second undercut structures (UCa, UCb) may be disposed in the first blocking channel (BCH1) or may form an edge of the first blocking channel (BCH1). The first connecting line (CL1) and the second electrode 150 (e.g., the second electrode 150 and the second electrode 150 on the side of the overcoat layer 125 located in the first and second undercut structures (UCa, UCb)) may be disposed in (or within or on) the first blocking channel (BCH1). In FIG. 8, the first connecting line (CL1) (or a portion of the first connecting line (CL1)) and the second electrode 150 may be disposed in the first blocking channel (BCH1).

[0131] In FIG. 9, the side of the overcoat layer 125 may be disposed in the first blocking channel (BCH1) or may form an edge of the first blocking channel (BCH1). The first undercut structure (UCa) may be disposed in the first blocking channel (BCH1) or may form an edge of the first blocking channel (BCH1). The first connecting line (CL1) and the second electrode 150 (e.g., the second electrode 150 on the side of the overcoat layer 125 and the second electrode 150 inside the first undercut structure (UCa)) may be disposed in the first blocking channel (BCH1). In FIG. 10, the source / drain line (N_SD1), the first connecting line (CL1) (or both the middle part and the opposite part of the first connecting line (CL1)) and the second electrode 150 may be disposed in the first blocking channel (BCH1). The second undercut structure (UCb) may be disposed in the first blocking channel (BCH1) or may form an edge of the first blocking channel (BCH1).

[0132] The arrangement of the first blocking channel (BCH1) in FIGS. 11 and 12 is similar to the arrangement of the first blocking channel (BCH1) in FIGS. 9 and 10, except that the source / drain line (N_SD1) is replaced with a source / drain line (N_SD2).

[0133] In FIG. 13, the gate electrode line (N_GE), the second connection wiring (CL2) (or both the middle part and the opposite part of the second connection line (CL2)) and the second electrode 150 may be disposed in the second blocking channel (BCH2). The third undercut structure (UCc) may be disposed in the second blocking channel (BCH2) or may form the edge of the second blocking channel (BCH2). In FIG. 14, the side of the overcoat layer 125 may be disposed in the second blocking channel (BCH2) or may form the edge of the second blocking channel (BCH2). The first undercut structure (UCa) may be disposed in the second blocking channel (BCH2) or may form the edge of the second blocking channel (BCH2). The second connection wiring (CL2) and the second electrode 150 (e.g., the second electrode 150 on the side of the overcoat layer 125 and the second electrode 150 inside the first undercut structure (UCa)) may be disposed in the second blocking channel (BCH2).

[0134] Meanwhile, the dam pattern 200 is disposed at the corners of the non-pad area (NPAD) of the non-display area (PAD, NPAD) to further block the moisture permeation path.

[0135] The following description will be given with reference to the drawings.

[0136] Fig. 15 is an enlarged plan view showing a part of a corner of a non-padded area according to another embodiment of the present specification. For example, Fig. 15 is an enlarged plan view of 15 in Fig. 1. And Fig. 16 is an enlarged plan view of 16 in Fig. 15.

[0137] Referring to Figures 15 and 16, a dam area (DAM) in which a dam pattern 200 is arranged may be arranged at the corner portion of the non-pad area (NPAD) to block moisture penetration from the side direction of the display panel (PNL) toward the display area (AA).

[0138] The first point (De1) where the dam area (DAM) starts may be disposed outside the outermost part of the gate driver (GIP), but is not limited thereto. In another example, the dam area may include a part of the gate driver (GIP) and be disposed on top of the part. The gate driver (GIP) may be disposed in a gate-in-panel manner. The second point (De2) where the dam area (DAM) ends may further include a barrier pattern (BR) outside, but is not limited thereto.

[0139] The non-pad area (NPAD) may be located on the other side edge of the display panel (PNL) opposite to the pad area (PAD) located on one side of the display panel (PNL). The dam area (DAM) may be located adjacent to the cutting line (CL).

[0140] In the cuttable display panel (PNL), an area in which a plurality of sub-pixels are formed may be arranged extending from the display area (AA) to the non-pad area (NPA), so that the non-pad area (NPAD) may include an area (NPAD_PX) in which the sub-pixels are formed and an area (NPAD_NPX) in which the sub-pixels are not arranged. The area (NPAD_NPX) in which the sub-pixels are not arranged may extend from an area in which the gate driver (GIP) is arranged.

[0141] In the region (NPAD_NPX) where no sub-pixel is arranged, the transmissive regions (TA5, TA6, TA7, TA8) may be arranged adjacent to each other as shown in FIG. 16. The transmissive regions (TA5, TA6, TA7, TA8) may include an organic material layer 145. The transmissive regions (TA5, TA6, TA7, TA8) may include a fifth transmissive region (TA5), a sixth transmissive region (TA6), a seventh transmissive region (TA7), and an eighth transmissive region (TA8). Here, the fifth transmissive region (TA5) and the sixth transmissive region (TA6) may be arranged apart from each other in the first direction, and a third connection wiring (CL3) may be arranged therebetween. The seventh transmissive region (TA7) and the eighth transmissive region (TA8) may be arranged apart from each other in the first direction. Also, the fifth transmissive region (TA5) and the seventh transmissive region (TA7) may be arranged apart from each other in the second direction, and a fourth connection wiring (CL4) may be arranged therebetween. The sixth transmissive region (TA6) and the eighth transmissive region (TA8) may be spaced apart from each other in the second direction.

[0142] Here, the first direction may be the X-axis direction and the second direction may be the Y-axis direction, but is not limited thereto. For example, the first direction may be the horizontal direction and the second direction may be the vertical direction.

[0143] In the region (NPAD_NPX) where sub-pixels are not arranged, an empty space region (N_ES) is arranged between a plurality of transmission regions (TA5, TA6, TA7, TA8) arranged apart from one another. Unlike the region (NPAD_PX) where the sub-pixels of the non-pad portion region (NPAD) are formed, the empty space region (N_ES) does not have a plurality of signal wirings arranged therein, and an overcoat layer 125 having an undercut structure arranged thereunder may be arranged therein.

[0144] However, the undercut structure disposed under the overcoat layer 125 has a limit in blocking the moisture permeation path that may occur due to the third connection wiring (CL3) and the fourth connection wiring (CL4).

[0145] For this reason, in yet another embodiment of the present specification, a plurality of dummy patterns 210 may be arranged on an area (NPAD_NPX) where no subpixels are arranged. The plurality of dummy patterns 210 may be arranged, for example, in the display area (AA) in a process of forming a source electrode or a drain electrode on the display area (AA) or in a process of forming a gate electrode. As a result, the plurality of dummy patterns 210 may be made of the same material as the source electrode or the drain electrode, or the same material as the gate electrode.

[0146] The plurality of dummy patterns 210 may be arranged such that adjacent dummy patterns 210a, 210b are spaced apart from each other by a predetermined distance (W1, W2). The plurality of dummy patterns 210 may include a square shape. The plurality of dummy patterns 210 may overlap the transmissive regions (TA5, TA6, TA7, TA8), the third connection wiring (CL3), and the fourth connection wiring (CL4). The plurality of dummy patterns 210 are arranged so as to overlap the positions where the organic material layer 145, the third connection wiring (CL3), and the fourth connection wiring (CL4), which may be moisture permeation paths, are arranged. In this manner, the plurality of dummy patterns 210 arranged on the region (NPAD_NPX) where the sub-pixels are not arranged, can act to block the moisture permeation path and delay the moisture penetration toward the display region (AA).

[0147] Referring to FIG. 16, a third blocking channel (BCH3) may be disposed between the transparent regions arranged in a first direction (e.g., X-axis direction) among the multiple transparent regions (TA) in the corner region. For example, the third blocking channel (BCH3) may be disposed between the fifth transparent region (TA5) and the sixth transparent region (TA6). Also, a fourth blocking channel (BCH4) may be disposed between the transparent regions arranged in a second direction (e.g., Y-axis direction) among the multiple transparent regions (TA) in the corner region. For example, the fourth blocking channel (BCH4) may be disposed between the fifth transparent region (TA5) and the seventh transparent region (TA7). The third connection wiring (CL3) may be disposed in the third blocking channel (BCH3). The fourth connection wiring (CL4) may be disposed in the fourth blocking channel (BCH4). Also, the multiple dummy patterns 210 may overlap the third blocking channel (BCH3) and the fourth blocking channel (BCH4).

[0148] According to the embodiments of the present specification, in order to enable the configuration of display devices of various sizes, a pattern including an organic material layer that can be a moisture penetration path in a cuttable display device is disconnected by a multi-layer structure, thereby making it possible to maintain the performance and lifespan of an organic light-emitting element for a long period of time.

[0149] By maintaining the performance and lifespan of the organic light emitting element for a long period of time, it is possible to ensure the quality of images displayed on the display device even with low power consumption, and this has the effect of reducing power consumption.

[0150] In addition, by inserting a plurality of dummy patterns in the corners of the non-pad portion of the cuttable display device, the moisture penetration time can be further delayed, thereby increasing the product lifespan and further improving the reliability.

[0151] A display device according to an embodiment of the present specification includes a display panel including a display area and a non-pad area located outside the display area, a plurality of transmissive areas disposed in the non-pad area and spaced apart from each other in a first direction and a second direction different from the first direction, a circuit area disposed between the plurality of transmissive areas, a plurality of connection wirings disposed between adjacent ones of the plurality of transmissive areas, and a plurality of wirings disposed in the circuit area and arranged in a direction crossing the plurality of wirings, each of the plurality of wirings being located in a different layer from each other, and each of the plurality of wirings may include a first undercut structure below the plurality of wirings.

[0152] In some embodiments of the display device herein, a side end of each of the plurality of connection wirings may protrude outward beyond a corresponding side end portion of the first undercut structure, so that the plurality of connection wirings are separated into a first portion and a second portion opposing each other, the opposing second portions being isolated from each other, the first portion being disposed on an upper surface of a corresponding one of the plurality of wirings, and the opposing second portion being disposed on both sides of the corresponding one of the plurality of wirings.

[0153] In the display device according to some embodiments of the present disclosure, the circuit region may further include an overcoat layer, and a second undercut structure may be formed under the overcoat layer.

[0154] In display devices according to some embodiments of the present specification, the plurality of transmissive regions include an organic material layer, and the organic material layer may be discontinuously disconnected at an end portion of the overcoat layer that protrudes outward beyond an end portion of the second undercut structure below the overcoat layer.

[0155] In display devices according to some embodiments of the present specification, the multiple connection wirings may include a first connection wiring arranged between the multiple transparent regions that are arranged in the first direction, and a second connection wiring arranged between the multiple transparent regions that are arranged in the second direction.

[0156] In display devices according to some embodiments of the present specification, the plurality of wirings may include a first wiring arranged in a direction crossing the first connection wiring, and a second wiring arranged in a direction crossing the second connection wiring.

[0157] In display devices according to some embodiments of the present specification, the first wiring and the second wiring may be arranged in different layers, the first wiring being arranged in a first layer and the second wiring being arranged in a second layer lower than the first layer.

[0158] In display devices according to some embodiments of the present specification, the first wiring may include either a light-shielding layer line or a plurality of source / drain lines extending from the display area to the non-pad area, and the second wiring may include a gate electrode line extending from the display area to the non-pad area.

[0159] In a display device according to some embodiments of the present disclosure, the first wiring or the second wiring may be in a floating state, that is, not electrically connected.

[0160] In some embodiments of the display device herein, the display device further includes a pad portion area disposed on one side of the display panel opposite the non-pad portion area, and a cutting line located on the other side edge of the display panel opposite the pad portion area, and the cutting line can adjust the size of the display panel.

[0161] In some display devices according to embodiments of the present specification, the display panel may further include a corner portion located on a side edge of the non-pad region, and the corner portion may include a plurality of transmissive regions arranged at a distance from each other in a first direction and a second direction different from the first direction, a third connection wiring arranged between the transmissive regions arranged in the first direction among the plurality of transmissive regions, a fourth connection wiring arranged between the transmissive regions arranged in the second direction among the plurality of transmissive regions, an overcoat layer arranged in a space between the plurality of transmissive regions and having a second undercut structure arranged at the bottom, and a plurality of dummy patterns arranged to overlap the plurality of transmissive regions, the third connection wiring, and the fourth connection wiring.

[0162] In a display device according to some embodiments of the present disclosure, the plurality of dummy patterns may be arranged such that adjacent dummy patterns are spaced apart from each other.

[0163] In some embodiments of the display device herein, the display device may further include a plurality of transmissive regions and a plurality of circuit regions arranged in the display region, and the arrangement of the plurality of transmissive regions and the circuit regions in the non-pad region may have the same characteristics as the arrangement of the plurality of transmissive regions and the circuit regions in the display region.

[0164] In the display device according to some embodiments of the present disclosure, the second undercut structure may be disposed on at least a portion of each of the plurality of connecting lines.

[0165] A display device according to an embodiment of the present specification may include a display panel including a display area and a non-pad area located outside the display area, a plurality of transmissive areas disposed in the non-pad area and spaced apart from each other in a first direction and a second direction different from the first direction, a circuit area disposed between adjacent transmissive areas of the plurality of transmissive areas, and a plurality of blocking channels each having a blocking channel disposed between adjacent areas of the plurality of transmissive areas, the plurality of wirings being disposed in the circuit area, each of the plurality of wirings extending to intersect with a corresponding one of the plurality of blocking channels, the plurality of wirings being disposed in different layers from each other, and a first undercut structure being formed under each of the plurality of wirings.

[0166] In some embodiments of the display device herein, each of a plurality of connecting wires may be disposed in a corresponding one of the plurality of blocking channels, a side end of each of the plurality of wires may protrude outward beyond a corresponding one of the side ends of the first undercut structure, and each of the plurality of connecting wires may be separated into a first portion and a second portion disposed opposite each other.

[0167] In some embodiments of the display device herein, the opposing second portions may be isolated from each other, the first portion may be disposed on an upper surface of a corresponding one of the plurality of wirings, and the opposing second portions may be disposed on both sides of the corresponding one of the plurality of wirings.

[0168] In the display device according to some embodiments of the present disclosure, the circuit region may further include an overcoat layer, and a second undercut structure may be formed under the overcoat layer.

[0169] In some embodiments of the display device herein, the plurality of transmissive regions may include an organic material layer that terminates discontinuously at a side end of the overcoat layer that protrudes outward beyond a side end of the second undercut structure beneath the overcoat layer.

[0170] The display device according to some embodiments of the present specification may further include a number of connecting wires, each of the plurality of connecting wires being disposed in a corresponding one of the plurality of blocking channels, each of the plurality of connecting wires including an organic material layer, and the organic material layer of each of the plurality of connecting wires may include the same material as the organic material layer of the plurality of transparent areas.

[0171] In some embodiments of the display device herein, the plurality of blocking channels may include a first blocking channel arranged between the plurality of transparent regions that are arranged in the first direction, and a second blocking channel arranged between the plurality of transparent regions that are arranged in the second direction.

[0172] In some embodiments of the display device herein, the plurality of wirings may include a first wiring extending to intersect with the first blocking channel, and a second wiring extending to intersect with the second blocking channel.

[0173] In some embodiments of the display device herein, the first wiring and the second wiring may be arranged in different layers, the first wiring being arranged in a first layer, and the second wiring being arranged in a second layer that is lower than the first layer.

[0174] In some embodiments of the display device herein, the display panel may further include a corner region located on a side edge of the non-pad portion region, wherein the corner region may include a plurality of transmissive regions spaced apart from each other in the first direction and a second direction different from the first direction, a third blocking channel disposed between the transmissive regions arranged in the first direction among the plurality of transmissive regions in the corner region, and a fourth blocking channel disposed between the transmissive regions arranged in the second direction among the plurality of transmissive regions in the corner region.

[0175] In some embodiments of the display device herein, the corner region may further include an overcoat layer disposed in a space between a plurality of transmissive regions in the corner region, the overcoat layer having a second undercut structure formed therebelow, and a plurality of dummy patterns overlapping the plurality of transmissive regions in the corner region, the third blocking channel, and the fourth blocking channel.

[0176] A display device according to some embodiments of the present disclosure may further include a plurality of connecting wires, each of the plurality of connecting wires being disposed in a corresponding one of the plurality of blocking channels, and the second undercut structure being disposed in at least one of the plurality of blocking channels, and the second undercut structure being at least partially disposed on at least one of the plurality of connecting wires.

[0177] The above describes the embodiments of the present specification in more detail with reference to the accompanying drawings, but the present specification is not necessarily limited to these embodiments, and various modifications can be made within the scope of the technical idea of ​​the present specification. Therefore, the embodiments disclosed in the present specification are for the purpose of explanation, not for the purpose of limiting the technical idea of ​​the present specification, and the scope of the technical idea of ​​the present specification is not limited by these embodiments. Therefore, it should be understood that the above-mentioned embodiments are illustrative and not limiting in all respects. [Explanation of symbols]

[0178] 100 Substrates 110 Buffer layer 115 Interlayer insulation layer 120 protective layer 125 Overcoat layer 145 Organic material layer 210 Dummy Pattern ML1 1st wiring ML2 2nd wiring N_LS Light shielding layer line N_SD1,NSD2 source / drain lines N_BE gate electrode line CL1, CL2, CL3, CL4 connection wiring UC1, UCa First undercut structure UC2, UCb Second undercut structure UC3, UCc 3rd undercut structure

Claims

1. a display panel including a display area and a non-pad area located outside the display area; a plurality of transmissive regions disposed in the non-pad portion region and arranged at a distance from each other in a first direction and a second direction different from the first direction; a circuit region disposed between the plurality of transparent regions; a plurality of connection wirings arranged between adjacent ones of the plurality of transparent regions; a plurality of wirings arranged in the circuit region and arranged in a direction crossing the plurality of connection wirings; The non-pad area is A substrate; a buffer layer provided on the substrate; an interlayer insulating layer provided on the buffer layer; a protective layer provided on the interlayer insulating layer; an overcoat layer provided on the protective layer and having first through holes overlapping the plurality of wirings; a bank provided on the overcoat layer and having a second through hole overlapping the first through hole; an organic material layer provided on the bank and on side walls of the first and second through holes; Including, The plurality of wirings are located on different layers, a first undercut structure formed by cutting the interlayer insulating layer to a first depth from an end of each of the plurality of wirings in a stacking direction of the non-pad portion region under each of the plurality of wirings; Display device.

2. a side end of each of the plurality of connection wirings protrudes outward beyond a corresponding side end portion of the first undercut structure; the plurality of connection wirings are separated into a first portion and a second portion opposed to each other; the opposing second portions are isolated from one another; the first portion is disposed on an upper surface of a corresponding one of the plurality of wirings; the opposing second portions are disposed on both sides of a corresponding one of the plurality of wirings; The display device according to claim 1 .

3. A second undercut structure is formed by cutting the interlayer insulating layer and the protective layer to a second depth from an end of the overcoat layer in a direction intersecting with the lamination direction of the non-pad portion region under the overcoat layer. The display device according to claim 1 .

4. The organic material layer is discontinuously disconnected at an end portion of the overcoat layer that protrudes outward from an end portion of the second undercut structure below the overcoat layer. The display device according to claim 3 .

5. The plurality of connection wirings include a first connection wiring arranged between the plurality of transparent regions arranged in the first direction; a second connection wiring arranged between the plurality of transparent regions arranged in the second direction, The display device according to claim 1 .

6. The plurality of wirings a first wiring extending so as to intersect with the first connection wiring; a second wiring extending so as to intersect with the second connection wiring; The display device according to claim 5 .

7. the first wiring and the second wiring are arranged in different layers; The first wiring is disposed in a first layer, The second wiring is disposed in a second layer below the first layer. The display device according to claim 6.

8. the first wiring includes either a light blocking layer line extending from the display area to the non-pad area or a plurality of source / drain lines; the second wiring includes a gate electrode line extending from the display region to the non-pad region; The display device according to claim 6.

9. The first wiring or the second wiring is in a floating state, that is, not electrically connected. The display device according to claim 6.

10. The display device includes: a pad area disposed on one side of the display panel opposite to the non-pad area; a cutting line located on the other side edge of the display panel facing the pad area, The cutting line adjusts the size of the display panel. The display device according to claim 1 .

11. The display panel includes: The non-padded area further includes a corner portion located on a side edge of the non-padded area, The corner portion is A plurality of transmission regions arranged at a distance from each other in the first direction and the second direction different from the first direction; a third connection wiring arranged between the plurality of transparent regions arranged in the first direction; a fourth connection wiring arranged between the plurality of transparent regions arranged in the second direction; an overcoat layer disposed in a space between the plurality of transmissive regions, the overcoat layer having a second undercut structure disposed thereunder; a plurality of dummy patterns that are superimposed on the plurality of transparent regions, the third connection wiring, and the fourth connection wiring and that are arranged in the same layer as the plurality of wirings, The display device according to claim 1 .

12. The plurality of dummy patterns are arranged such that adjacent dummy patterns are spaced apart from each other. The display device according to claim 11.

13. The display device further includes a plurality of transparent regions and a plurality of circuit regions disposed in the display region, an arrangement of the plurality of transmissive regions and the circuit region in the non-pad portion region has the same characteristics as an arrangement of the plurality of transmissive regions and the circuit region in the display region; The display device according to claim 1 .

14. the second undercut structure is disposed on at least a portion of each of the plurality of connecting wires; The display device according to claim 3 .

15. a display panel including a display area and a non-pad area located outside the display area; a plurality of transmissive regions disposed in the non-pad portion region and spaced apart from each other in a first direction and a second direction different from the first direction; a circuit region disposed between adjacent ones of the plurality of transparent regions; a plurality of blocking channels, each blocking channel being disposed between adjacent ones of the plurality of transmission regions; a plurality of wirings arranged in the circuit region; The non-pad area is A substrate; a buffer layer provided on the substrate; an interlayer insulating layer provided on the buffer layer; a protective layer provided on the interlayer insulating layer; an overcoat layer provided on the protective layer and having first through holes overlapping the plurality of wirings; a bank provided on the overcoat layer and having a second through hole overlapping the first through hole; an organic material layer provided on the bank and on side walls of the first and second through holes; Including, Each of the plurality of wirings extends so as to cross a corresponding one of the plurality of blocking channels; The plurality of wirings are arranged on different layers, A first undercut structure is formed under each of the plurality of wirings by cutting the interlayer insulating layer to a first depth from each end of the plurality of wirings in the stacking direction of the non-pad portion region. Display device.

16. Further comprising a plurality of connecting wires, each of the plurality of connection wirings is disposed in a corresponding one of the plurality of blocking channels; a side end of each of the plurality of wirings protrudes outward beyond a corresponding side end of the first undercut structure, and each of the plurality of connection wirings is separated into a first portion and a second portion disposed opposite to each other; The display device according to claim 15.

17. The opposing second portions are isolated from each other, the first portion is disposed on an upper surface of a corresponding one of the plurality of wirings, and the opposing second portions are disposed on both sides of the corresponding one of the plurality of wirings, respectively. The display device according to claim 16.

18. A second undercut structure is formed by cutting the interlayer insulating layer and the protective layer to a second depth from an end of the overcoat layer in a direction intersecting the lamination direction of the non-pad portion region under the overcoat layer. The display device according to claim 15.

19. The organic material layer protrudes outward beyond a side edge of the second undercut structure below the overcoat layer and terminates discontinuously at a side edge of the overcoat layer. The display device according to claim 18.

20. Further comprising a plurality of connecting wires, each of the plurality of connection wirings is disposed in a corresponding one of the plurality of blocking channels; each of the plurality of connection wirings includes an organic material layer; the organic material layer of each of the plurality of connection wirings contains the same material as the organic material layer of the plurality of transmission regions; The display device according to claim 18.

21. The plurality of blocking channels include a first blocking channel disposed between the plurality of transmission regions arranged in the first direction; and a second blocking channel disposed between the plurality of transparent regions arranged in the second direction. The display device according to claim 15.

22. The plurality of wirings include a first wiring extending to intersect with the first blocking channel; A second wiring extending to cross the second blocking channel. The display device according to claim 21.

23. the first wiring and the second wiring are arranged in different layers, The first wiring is disposed in a first layer, The second wiring is disposed in a second layer that is lower than the first layer. The display device according to claim 22.

24. The display panel further includes a corner region located on a side edge of the non-pad portion region, The corner region is A plurality of transmission regions arranged at a distance from each other in the first direction and the second direction different from the first direction; a third blocking channel disposed between the plurality of transmission regions in the corner region that are arranged in the first direction; and a fourth blocking channel disposed between the plurality of transparent regions in the corner region that are arranged in the second direction. The display device according to claim 15.

25. The corner region is an overcoat layer disposed in a space between the plurality of transmissive regions in the corner region, the overcoat layer having a second undercut structure formed thereon; a plurality of dummy patterns overlapping the plurality of transparent regions in the corner region, the third blocking channel, and the fourth blocking channel and disposed in the same layer as the plurality of wirings, The display device according to claim 24.

26. Further comprising a plurality of connecting wires; each of the plurality of connection wirings is disposed in a corresponding one of the plurality of blocking channels; the second undercut structure is disposed in at least one of the plurality of blocking channels; the second undercut structure is at least partially disposed over at least one of the plurality of connecting wires; The display device according to claim 18.

Images