Quality Improvement Support Device

Abstract

To provide a technology capable of performing cause analysis and countermeasure determination for a short period of time in the event that plural kinds of faults or errors have occurred in a manufacturing facility.SOLUTION: A quality improvement support device that supports improvement in the quality of products to be manufactured in a manufacturing facility includes a display unit that associates quality information concerning the quality, which is generated or detected at a manufacturing process in the manufacturing facility, with a manufacture member or component included in the manufacturing facility, and displays manufacturing situation information having the pieces of quality information arranged time-sequentially. In the manufacturing situation information, the pieces of quality information generated or detected in relation to the manufacture member or component included in the manufacturing facility are arranged for each product or in units of plural products according to the order that the products are manufactured.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a management device and a management system for managing manufacturing facilities for manufacturing printed circuit boards and the like. [Background technology]

[0002] Conventionally, devices have been proposed that display defects, errors, etc. in various forms as management support devices that analyze the causes of defects and errors in manufacturing facilities that manufacture printed circuit boards, etc., and decide on countermeasures. For example, there have been devices that display only inspection results or only mounting errors.

[0003] Meanwhile, a management support device that takes the passage of time into consideration is proposed in the device described in Patent Document 1. In this device, the time axis of each process is displayed vertically, and multiple processes that are performed in sequence are arranged from left to right so that the time axes of each process are parallel. Then, marks that extend in the time axis direction with a width corresponding to the manufacturing start time and manufacturing end time in each process of one product are displayed on the time axis of each process, and the manufacturing start times and manufacturing end times of consecutive processes are connected by lines, and pins indicating errors that have occurred in each process are placed on the time axis.

[0004] However, in these management support devices, when multiple types of defects or errors occur, it is not possible to know whether the defects or errors occur at the same time or on the same board. It is also not possible to know which types of defects or errors occur continuously, whether they are concentrated on a specific time or board, or whether they occur sporadically. Furthermore, it is not possible to know status changes such as which types of defects or errors occur suddenly or have already ended. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 6287018 Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention has been made in consideration of the above-mentioned problems, and has an object to provide a technique that enables quick analysis of the causes and determination of countermeasures when multiple types of defects or errors occur in manufacturing equipment. [Means for solving the problem]

[0007] To solve the above problems, the present invention provides: A quality improvement support device that supports improvement of the quality of a product manufactured by a manufacturing facility, Quality information regarding the quality generated or detected during the manufacturing process by the manufacturing facility and , a display unit that displays manufacturing status information in which the quality information is associated with a manufacturing member or part included in the manufacturing equipment and arranged in a chronological order; In the production status information, the quality information for each unit product which is one or more of the products is arranged in accordance with the order in which the products are manufactured.

[0008] According to the manufacturing status information of the present invention, for each unit product, which is one or more products, quality information is associated with the manufacturing materials or parts and arranged according to the order in which the products are manufactured. Therefore, the quality information based on the unit products which are manufactured in sequence, with one or more products as a unit, is Even when multiple types of errors occur, the causes of those abnormalities can be narrowed down by the time fluctuation of quality information based on the unit products that are sequentially manufactured and associated with the manufacturing materials or parts, and the time tendency of occurrence, such as sudden or continuous, can be grasped, so that even when multiple types of defects or errors occur, causes that affect such time tendency can be isolated, and cause analysis and countermeasure decision can be made in a short time.

[0009] In the present invention, For each of the multiple manufacturing members or parts related to the unit product, the quality information for the same unit product may be arranged at the same position in the time series.

[0010] In this way, not only can it be recognized that the time fluctuation of the quality information of each manufacturing member or part is based on the unit products manufactured in sequence, but also for multiple related manufacturing members or parts, since the quality information for the same unit product is placed at the same position in the time series, it is possible to recognize the fluctuation of the quality information that has occurred in the same unit product in the manufacturing process.Even when multiple types of errors occur, it is possible to know that the cause of those abnormalities was an abnormality in a device located at the front of the production line, which caused the abnormality in a device located at the back, and it is possible to narrow down the device causing the abnormality, so that it is possible to analyze the causes and decide on countermeasures in a short time when multiple types of defects or errors occur. Here, when displaying quality information associated with each of multiple manufacturing components or parts, the multiple manufacturing components or parts may be arranged according to the flow of unit products in the manufacturing process, or may be arranged together according to the function of the manufacturing components or parts.

[0011] In the present invention, The quality information includes a plurality of types of the quality information, The quality information may be displayed in a different display mode for each type.

[0012] This allows the time fluctuation of each type of quality information to be clearly recognized, making it possible to more efficiently analyze the causes and determine countermeasures when multiple types of defects or errors occur.

[0013] In the present invention, Event information indicating an event that has occurred or been executed in relation to the manufacturing component or part may be arranged in chronological order together with the quality information depending on the timing at which the event occurred or was executed and the context of the quality information that occurred or was detected in relation to the manufacturing component or part.

[0014] According to this, events that may be the cause of defects, errors, etc. or that may have the effect of reducing defects, errors, etc. are displayed together with quality information, so that when multiple types of defects or errors occur, cause analysis and decision-making on countermeasures can be performed more efficiently.

[0015] In the present invention, Marks indicating the one or more products may be arranged in a time axis direction defined for each of the manufacturing components or parts related to the quality information in accordance with the order, and the quality information may be displayed in association with the marks.

[0016] This allows the relationship between manufacturing materials or parts, one or more products, and the order in which they are manufactured to be visually and clearly recognized, making it possible to distinguish between causes that affect the occurrence of multiple types of defects or errors over time, such as sudden or continuous, and to analyze the causes and determine countermeasures when multiple types of defects or errors occur. This allows for more efficient decision making.

[0017] In the present invention, The manufacturing status information may include time-dependent quality information regarding the quality generated or detected in relation to the manufactured materials or parts, arranged in chronological order as time progresses within a predetermined period of time.

[0018] This makes it possible to recognize the fluctuation of quality information based on a time expression different from the time expression based on the order in which unit products are manufactured, and therefore makes it possible to more efficiently analyze the cause and decide on countermeasures when multiple types of defects or errors occur. Such quality information over time may be displayed on a separate screen from the above-mentioned manufacturing status information in which the quality information is arranged according to the order in which the unit products are manufactured, or may be displayed on the same screen. When these pieces of information are displayed on the same screen, the time ranges can be aligned to make the cause analysis and decide on countermeasures more efficient.

[0019] In the present invention, before The time-dependent quality information, in which the time passage within the predetermined period is plotted on the horizontal axis, may be arranged vertically for each of the multiple manufactured members or parts.

[0020] This makes it possible to recognize fluctuations in quality information that occur simultaneously during the manufacturing process and narrow down the causes of fluctuations to those that occurred simultaneously in each manufacturing material or part, thereby making it possible to more efficiently analyze the causes and determine countermeasures when multiple types of defects or errors occur. Effect of the Invention

[0021] According to the present invention, when multiple types of defects or errors occur in a manufacturing facility, the causes can be analyzed and measures can be determined in a short period of time. [Brief description of the drawings]

[0022] [Figure 1] 1 is a diagram showing a schematic configuration of a manufacturing facility according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a functional block diagram of a management device according to an embodiment of the present invention. [Diagram 3] FIG. 4 is a functional block diagram of an administrator terminal according to an embodiment of the present invention. [Figure 4] FIG. 2 is a functional block diagram of an operator terminal, a mounting machine, an inspection machine, and a program management server according to an embodiment of the present invention. [Diagram 5] FIG. 1 is a schematic diagram showing a configuration of a mounter according to an embodiment of the present invention. [Figure 6] FIG. 11 is a diagram showing an example of manufacturing log data according to an embodiment of the present invention. [Figure 7] FIG. 2 is a functional block diagram of a management device clearly showing its relationship with a mounter according to an embodiment of the present invention. [Figure 8] FIG. 11 is a diagram showing an example of a display screen of a production status map in the manager terminal according to the first embodiment of the present invention. [Figure 9] FIG. 4 is a diagram showing an example of display items of a production status map according to the first embodiment of the present invention. [Figure 10] FIG. 11 is a diagram showing an example of a display screen of a production status map according to the second embodiment of the present invention. [Figure 11] FIG. 11 is a diagram showing an example of a display screen of a production status map according to the third embodiment of the present invention. [Figure 12] FIG. 13 is a diagram showing an example of a display screen of a production status map according to the fourth embodiment of the present invention. [Figure 13] FIG. 13 is a diagram showing an example of a display screen of a production status map according to the fifth embodiment of the present invention. [Figure 14] FIG. 13 is a diagram showing an example of a display screen of a production status map according to the sixth embodiment of the present invention. [Figure 15] FIG. 13 is a diagram showing an example of a display screen of a production status map according to the seventh embodiment of the present invention. [Figure 16] FIG. 23 is a diagram showing an example of a display screen of a production status map according to the eighth embodiment of the present invention. [Figure 17] FIG. 2 is a functional block diagram of a management device according to an application example of the present invention. [Figure 18] FIG. 1 is a schematic diagram illustrating features of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] [Application example] Hereinafter, application examples of the present invention will be described with reference to the drawings. 17 shows a management system 1 to which the present invention is applied. The management system 1 includes a management device 100, and a manager terminal 10 and an operator terminal 20 connected to the management device 100 so as to be able to communicate with each other via a network. The manufacturing equipment in the surface mounting line for printed circuit boards includes a mounter X2 and a mounter X3 connected to the management device 100 so as to be able to communicate with each other via a network. cormorant The manufacturing equipment includes a printer X1, a reflow oven X3, and a post-printing inspection machine Y1, as shown in FIG. 1. As will be described later, the management device 10 according to the present invention Although the management device 100 can be connected to these devices via a network and operated, the management device 100 in the configuration shown in Fig. 17 will be described here. The manager terminal 10 corresponds to the quality improvement support device of the present invention. Also, the manager terminal 10, including a part or the whole of the management device 100, can also constitute the quality improvement support device of the present invention.

[0024] The mounting information and inspection result collection unit 111 of the management device 100 collects mounting information from the mounter X2 and inspection results from the post-mount inspection machine Y2 and the post-reflow inspection machines Y3 and Y4, and records them in a production information database (DB) 112.

[0025] The abnormality detection unit 113 detects the abnormality in the production information database 112. Inscribed Based on the recorded information, the mounter and the inspection machine compile and judge the types of defects and errors detected or generated, and detect an abnormality in any of the components on the printed circuit board. Then, the cause analysis unit 114 analyzes the cause of the abnormality detected by the abnormality detection unit 113. These compilation results, abnormality judgment results, and abnormality analysis results are recorded in the management database 116.

[0026] The work instruction generation unit 115 generates a work instruction for eliminating the abnormality based on the work instruction rules 119 according to the cause of the abnormality identified by the analysis by the cause analysis unit 114. Work instructions related to the mounter X2 include, for example, maintenance and replacement of the nozzle, but are not limited to these.

[0027] The work instruction generated by the work instruction generation unit 115 is recorded in the management database 116 together with the location and condition of the abnormality. In addition, the work instruction generated by the work instruction generation unit 115 is transmitted to the worker terminal 20 via the work instruction transmission unit 117.

[0028] In the worker terminal 20, work information related to the status of response to the transmitted work instruction information is input. The instructed work transmitted to the worker terminal 20 is not necessarily performed, and may not be performed. For this reason, when the instructed work is performed, the fact that the work has been performed is input to the worker terminal 20. When the fact that the work has been performed is not input to the worker terminal 20, the work has not been performed. In other words, as work information, implementation status information indicating whether the instructed work has been performed or not is transmitted from the worker terminal 20 to the work information receiving unit 120 of the management device 100.

[0029] The work information received by the work information receiving unit 120 is recorded in the management database 116 by the work information recording unit 121 in association with the location of the abnormality corresponding to the work content.

[0030] The production status map generating unit 118 generates a production status map based on the information recorded in the management database 116. The production status map is specifically data that constitutes the production status map display screen 70 (see FIG. 8) that is displayed on the production status map display unit 12 of the manager terminal 10. This production status map shows a collection of defects and errors detected and generated by mounting machines and inspection machines by type. It is possible to display both the tabulation results for each type of defect or error detected or generated by the mounting machine or inspection machine and the work information, or only one of them.

[0031] The production status map display screen 70 includes a main section 71 and a legend section 72. An upper left column 73 of the main section 71 displays the item names "Program" 731, "PCB ID" 732, and "Time" 733, and an upper right column 74 displays information corresponding to each item.

[0032] The names of the mounting and inspection machines included in one line are displayed in the header column 75 in the lower left column of the production status map display screen. Here, the header column 75 displays the mounters "CM-003-1" to "CM-003-6", the post-mount inspection machine "PREAOI-003", and the post-reflow inspection machines "POSTAOI-003" and "AXI-003".

[0033] A plurality of vertically long rectangular marks are displayed in the lower right column 76 of the main part 71 of the production status map display screen 70. Here, one mark represents one board (hereinafter, the mark representing a board is also referred to as a board). The board in the lower right column 76 arranged in the same row as the device displayed in the header column 75 indicates that the board represented by the mark is the mounting target of the device. The plurality of boards arranged in the same row are arranged according to the order in which they are mounted. When focusing on a specific device displayed in the header column 75, for example, the mounter CM-003-1, the time axis Ta1 (the time axis Ta1 is not displayed) defined for the mounter CM-003-1 extends in the right direction so that time advances, and a plurality of boards B1a, B2a, B3a, etc. are arranged along this time axis Ta1. In addition, in the row direction, the timing of events, which are 4M fluctuations that occurred in the device, are displayed in accordance with time by event information E1, etc., represented by a rectangle narrower than the board. Furthermore, among the multiple boards etc. displayed in the lower right column 76 of the main part 71 of the production status map display screen 70, boards arranged in the same row indicate the same board.

[0034] Overlaid on each board displayed in the lower right column 76 of the main part 71 of the production status map display screen 70, the number of defects or errors that occurred or were detected in the board in the process of the equipment displayed in the same row of the header column 75 is displayed in a stacked bar graph for each type of error, etc.

[0035] In the legend section 72 below the main section 71 of the production status map display screen 70, a legend is arranged which indicates the correspondence between the types of errors, defects, etc. displayed superimposed on the board and the display modes.

[0036] 8, the event information E1 arranged to the left of the board B1a in the first row of the lower right column 76, which corresponds to the mounter CM-003-1, indicates a feeder replacement. For example, it is assumed that a feeder with a new reel is being prepared because parts are running low, but the reel of the previously installed feeder runs out of parts, so the feeder is replaced with the prepared feeder. The stacked bar graph displayed over boards B1a, etc., arranged to the right of event information E1 in the first row in the lower right column 76 of the production status map display screen 70, indicates that there are many occurrences of component non-suction errors. Also, the stacked bar graph displayed over boards B1b, etc., B1c, etc., arranged in the same row as the post-mount inspection machine PREAOI-003 and the post-reflow inspection machine POSTAOI-003, indicates that there are many occurrences of actual defects. In such a situation, a work instruction is issued to check the installation status of the replaced feeder reel, and the mounter CM-003- 1 to Event information E2 indicates that the reel of the installed feeder was reattached. This shows that the situation has improved, and that no component non-suction errors or actual defects have occurred since the reel was reattached.

[0037] In this way, in the production status map display screen 70, the boards B1a, etc. to be mounted are arranged on the time axis of each device constituting the printed circuit board mounting line, and the time series of each device is aligned, and the results of the compilation of each error type are displayed in chronological order by overlapping the boards B1a, etc. arranged in this way. This makes it possible to narrow down the cause of the abnormality based on the defects and errors that occur simultaneously. In addition, it is possible to grasp the time dependency of whether the defects and errors occur simultaneously, continuously, intensively, or sporadically, so that it is possible to determine whether a measure is necessary at the present time or is no longer necessary. In addition, by arranging and displaying event information according to the time series in which the boards B1a, etc. are arranged, it is possible to understand the cause of the error occurrence and the measures that have had an improvement effect. In this way, by using the production status map display screen 70, it is possible to perform cause analysis and measure determination in a short time when multiple types of defects and errors occur or are detected.

[0038] FIG. 18 is a schematic diagram for explaining the features of the present invention that are applied to the manager terminal 10 having the production status map display section 12 that displays the above-mentioned production status map display screen 70. As described above, this figure explains the relationship between the analysis period, which is the time range of the mounting information and inspection results that are the subject of analysis when analyzing the cause of an abnormality in the cause analysis unit 114 of the management device 100, and the range displayed on the production status map display screen 70, etc.

[0039] In Fig. 18, mounting machines and inspection machines are arranged from top to bottom according to the mounting process in a printed circuit board mounting line. Assuming an analysis period as shown by the dashed line, the mounting time in each of the printer X1, mounters 1-N (X2), and reflow furnace X3 progresses as shown by the dashed arrows. Also, the time (inspection time) when the printed circuit board to be inspected is mounted in each of the post-printing inspection machine Y1, post-mounting inspection machine Y2, and post-reflow inspection machines Y3 and Y4 progresses as shown by the dashed arrows. The solid arrows indicate the mounting time and inspection time when the same board is used as a reference.

[0040] In this case, if a certain time range between two dotted lines is set as the analysis period to analyze an abnormality, it can be seen that the analysis period includes boards in which the process from printing to post-reflow inspection falls within the analysis period and boards in which only a part of the process falls within the analysis period. In other words, if the analysis period is set to a certain time range, even if an attempt is made to assign inspection results to all boards and components mounted by the mounting machine, some of the mounting information or inspection results will be missing. For this reason, in the present invention, as shown in FIG. 8, the analysis period is displayed by board, so that the analysis period can be aligned for the same board. This allows for a shorter cause analysis and decision on countermeasures when multiple types of defects or errors have occurred or been detected, compared to the case where the analysis period is aligned by the time of each mounting machine (display by time). Of course, by using the production status map according to Examples 3 to 8 described later in combination, cause analysis based on information expressed in different times is possible.

[0041] Example 1 Hereinafter, a management system including an administrator terminal according to a first embodiment of the present invention will be described in more detail with reference to the drawings. (System Configuration) 1 is a schematic diagram showing an example of the configuration of manufacturing equipment in a surface mounting line for printed circuit boards according to this embodiment. Surface mounting technology (SMT) is a technology for soldering electronic components to the surface of a printed circuit board, and the surface mounting line mainly consists of three processes: solder printing, component mounting, and reflow (solder deposition).

[0042] As shown in Figure 1, the manufacturing equipment on the surface mounting line is as follows, starting from the upstream side: solder marking The surface mounting line is equipped with a solder printing device X1, a mounter X2, and a reflow furnace X3. The solder printing device X1 is a device that uses screen printing to print solder paste onto the electrodes (called lands) on a printed circuit board. The mounter X2 is a device that picks up electronic components to be mounted on the board and places the components on the solder paste at the appropriate location, and is also called a chip mounter. The reflow furnace X3 is a heating device that heats and melts the solder paste, then cools it, and solders the electronic components onto the board. When there are a large number and types of electronic components to be mounted on the board, multiple mounters X2 may be installed on the surface mounting line.

[0043] In addition, the surface mounting line is equipped with a system that inspects the condition of the board at the exit of each process, from solder printing to component mounting to reflow, and automatically detects defects or potential defects. In addition to automatically separating good and bad products, the system also has the function of feeding back the results of inspection and analysis to the operation of each manufacturing device (for example, changing the mounting program).

[0044] The solder print inspection device Y1 is a device for inspecting the printing condition of the solder paste on the board discharged from the solder printing device X1. The solder print inspection device Y1 measures the solder paste printed on the board in two or three dimensions, and judges whether or not various inspection items are normal (within the allowable range) based on the measurement results. Inspection items include, for example, the volume, area, height, positional deviation, and shape of the solder. An image sensor (camera) can be used for two-dimensional measurement of the solder paste, and a laser displacement meter, phase shift method, spatial coding method, light section method, etc. can be used for three-dimensional measurement.

[0045] The component inspection device Y2 is a device for inspecting the placement of electronic components on the board carried out from the mounter X2. The component inspection device Y2 measures the components (which may be parts of the components such as the component body or electrodes) placed on the solder paste in two or three dimensions, and judges whether or not various inspection items are within normal values ​​(tolerance ranges) based on the measurement results. Inspection items include, for example, component position deviation, angle (rotation) deviation, missing parts (no components placed), wrong components (different components placed), wrong polarity (different polarity of electrodes on the component side and the board side), inversion (components placed upside down), and component height. As with solder printing inspection, an image sensor (camera) can be used for two-dimensional measurement of electronic components, and a laser displacement meter, phase shift method, spatial coding method, light section method, etc. can be used for three-dimensional measurement.

[0046] The visual inspection device Y3 is a device for inspecting the quality of soldering on the boards removed from the reflow furnace X3. The visual inspection device Y3 measures the soldered part after reflow in two or three dimensions, and judges whether various inspection items are normal (within the allowable range) based on the measurement results. Inspection items include the same items as in component inspection, as well as the quality of the solder fillet shape. In addition to the above-mentioned laser displacement meter, phase shift method, spatial coding method, and light section method, the so-called color highlight method (a method in which R, G, and B lighting are applied to the solder surface at different angles of incidence, and the reflected light of each color is photographed with a zenith camera to detect the 3D shape of the solder as 2D hue information) can be used to measure the solder shape.

[0047] The X-ray inspection device Y4 is a device for inspecting the state of soldering on a board using X-ray images. For example, in the case of packaged components such as BGA (Ball Grid Array) and CSP (Chip Size Package) or multi-layer boards, the solder joints are hidden under the components or board, so the appearance inspection device Y3 (i.e., appearance images) cannot inspect the state of the solder. The X-ray inspection device Y4 is a device for compensating for such weaknesses of appearance inspection. Inspection items of the X-ray inspection device Y4 include, for example, component positional deviation, solder height, solder volume, solder ball diameter, back fillet length, and the quality of the solder joints. Note that X-ray transmission images may be used as X-ray images, or images taken using CT (Computer Scanning). It is also preferable to use a scanned tomography (CT) image.

[0048] (Management device) The manufacturing equipment X1-X3 and inspection equipment Y1-Y4 described above are connected to a management device 100 via a network (LAN). The management device 100 is a system that manages and controls the manufacturing equipment X1-X3 and inspection equipment Y1-Y4, and is configured by a general-purpose computer system including a CPU (processor), a main storage device (memory), an auxiliary storage device (hard disk, etc.), an input device (keyboard, mouse, controller, touch panel, etc.), a display device, etc., although not shown. The functions of the management device 100 described below are realized by the CPU reading and executing a program stored in the auxiliary storage device.

[0049] The management device 100 may be configured with one computer or multiple computers. Alternatively, all or part of the functions of the management device 100 may be implemented in a computer built into any of the manufacturing devices X1 to X3 or the inspection devices Y1 to Y4. Alternatively, part of the functions of the management device 100 may be realized by a server (such as a cloud server) on a network.

[0050] An administrator terminal 10, an operator terminal 20, and a program management server 40 are connected to the management device 100 via a network (LAN). The program management server 40 is a server that manages an inspection and mounting program 50. The inspection and mounting program 50 is actually a program that controls the manufacturing devices X1 to X3 and the inspection devices Y1 to Y4, and is stored in a predetermined storage area of ​​the program management server 40, while being downloaded to each of the manufacturing devices X1 to X3 and the inspection devices Y1 to Y4 as necessary, stored in a predetermined storage area of ​​each device, and executed by each device.

[0051] The management device 100 of this embodiment has a functional unit for realizing a function for a manager of a manufacturing facility to efficiently perform maintenance and quality control of the facility. FIG. 2 shows a block diagram of the functional unit of the management device 100.

[0052] As shown in FIG. 2, the management device 100 has a mounting information / inspection result collection unit 111, a production information database 112, an abnormality detection unit 113, a cause analysis unit 114, a work instruction generation unit 115, a management database 116, a work instruction transmission unit 117, a production status map generation unit 118, work instruction rules 119, a work information receiving unit 120, and a work information recording unit 121.

[0053] The mounting information and inspection result collecting unit 111 collects mounting information including information on components such as boards, solder, and various electronic components used in the manufacturing equipment X1 to X3, and information on various members and mechanisms that constitute these manufacturing equipment X1 to X3, and inspection results by the inspection equipment Y1 to Y4. As the inspection results, information on cases where there is an abnormality is collected. Here, cases where there is an abnormality include not only "actual defects" that are determined to be defective by the inspection equipment Y1 to Y4 and also determined to be defective by visual inspection, but also so-called "overlooking" cases that are determined to be defective by the inspection equipment Y1 to Y4 but are determined to be "good" by visual inspection. The information on the abnormality is linked to mounting information on the equipment components and components where the abnormality occurred. The inspection results also include information on errors detected in each process of the manufacturing equipment X1 to X3. Such error information is also linked to mounting information on the equipment components and components where the error occurred.

[0054] The production information database 112 is a database in which the mounting information and inspection results collected by the mounting information and inspection result collecting unit 111 are recorded in association with each other for the same board, the same component, the same date and time, etc.

[0055] The abnormality detection unit 113 detects an abnormality in any of the components on the printed circuit board based on the information recorded in the production information database 112. Here, the presence or absence of an abnormality is detected based on, for example, the continuous occurrence or occurrence rate of actual defects or the like. The location and circumstances of the abnormality are recorded in the management database 116 in association with the production status.

[0056] The cause analysis unit 114 analyzes the cause of the abnormality detected by the abnormality detection unit 113 .

[0057] The work instruction generation unit 115 generates work instructions for eliminating the abnormality based on the work instruction rules 119 according to the cause of the abnormality identified by the analysis by the cause analysis unit 114. Examples of such work instructions for the printing machine X1 include mask cleaning, solder refilling, changing or correcting the mask position, etc. The contents of the work instructions are not limited to these. The contents of the work instructions related to the mounter will be described later.

[0058] The work instruction generated by the work instruction generating unit 115 is recorded in the management database 116 together with the location and the situation of the abnormality. Furthermore, the work instruction generated by the work instruction generating unit 115 is transmitted via the work instruction transmitting unit 117 to at least one of the worker terminal 20, the mounting machine / inspection machine 30, or the program management server 40 depending on the content of the work instruction. That is, if the work instruction is an instruction for the worker, it is sent to the worker terminal 20, if it is an instruction for device control, it is sent to the target device included in the mounting machine / inspection machine 30, and if it is an instruction for changing the parameters of the program, it is sent to the program management server 40. Here, the mounting machine / inspection machine 30 is a collective term for the manufacturing devices X1 to X3 and the inspection devices Y1 to Y4, and in reality, the work instruction is transmitted to at least one of these devices.

[0059] Work information for the work instructions sent from the work instruction sending unit 117 to the worker terminal 20, the mounting machine / inspection machine 30 or the program management server 40 is sent from each of the worker terminal 20, the mounting machine / inspection machine 30 or the program management server 40 to the work information receiving unit 120.

[0060] The work instructions transmitted from the work instruction transmission unit 117 to the worker terminal 20, the mounting machine / inspection machine 30, or the program management server 40 are not necessarily carried out. For example, there are cases where a work instruction is sent to the worker terminal 20, but the operator does not have time to view the work instruction. There are also cases where the operator recognizes the work instruction received at the worker terminal 20, but does not have time to carry it out. There are also cases where the production model is changed or replaced due to a changeover, and the target of the work instructed via the worker terminal 20 is no longer available. Regarding the work instructions sent to the mounting machine / inspection machine 30, there are cases where the production model has changed or been replaced due to a change in setup, and the instructed work is no longer applicable. In addition, when a certain device ID is deactivated, there are cases where the production stops because there is no alternative, or the instructed work cannot be performed due to production reasons such as not wanting to stop the production line. In addition, there are cases where the instructed work is rejected by a judgment unit in the mounting machine. Regarding the work instructions sent to the program management server 40, the version of the mounting program or part library to be the subject of the instructed work may not match the contents of the instructions. Also, the mounting program or part library to be the subject of the instructed work may be locked and cannot be changed. Also, the instructed work may be rejected by the judgment section in the program management server.

[0061] The work information received by the work information receiving unit 120 from each of the worker terminal 20, the mounting machine / inspection machine 30, and the program management server 40 is recorded by the work information recording unit 121 as the work content. The abnormality occurrence location is recorded in the management database 116 in association with the abnormality occurrence location.

[0062] The production status map generating unit 118 generates a production status map based on the work instructions generated in the work instruction generating unit 115 and the information recorded in the management database 116. The production status map is specifically data that constitutes a production status map display screen that is displayed on the production status map display unit 12 of the manager terminal 10.

[0063] The production status map generated by the production status map generating unit 118 is transmitted to the manager terminal 10 and displayed thereon.

[0064] (Administrator terminal) 3, the manager terminal 10 includes a production status map receiving unit 11 and a production status map display unit 12. The manager terminal 10 is configured by a general-purpose computer system including a CPU (processor), a main storage device (memory), an auxiliary storage device (hard disk, etc.), an input device (keyboard, mouse, controller, touch panel, etc.), a display device, etc. Each of the functional units of the manager terminal 10 described above is realized by the CPU reading and executing a program stored in the auxiliary storage device.

[0065] The production status map receiving unit 11 receives the production status map generated by the production status map generating unit 118 of the management device 100 .

[0066] The production status map display unit 12 displays the production status map received by the production status map receiving unit 11. Specifically, the production status map display unit 12 is configured by a display device such as a display, but may also serve as an input device such as a touch panel display.

[0067] (Worker terminal) Here, the operator is instructed to perform a task via the worker terminal 20, and the operator carries out the task. 4, the worker terminal 20 has a work instruction receiving unit 21, a work instruction display unit 22, a work information input unit 23, and a work information transmitting unit 24. Depending on the worker and the work content, the worker terminal 20 corresponds to various devices such as an inspection program creation terminal, a mounting program creation terminal, a maintenance work terminal, a line management terminal, etc. Such a worker terminal 20 may be configured by a general-purpose computer system equipped with a CPU (processor), a main storage device (memory), an auxiliary storage device (hard disk, etc.), an input device (keyboard, mouse, controller, touch panel, etc.), a display device, etc., or it is also possible to implement all or a part of the functions of the worker terminal 20 in a computer built into any of the manufacturing devices X1 to X3 and the inspection devices Y1 to Y4.

[0068] The work instruction receiving unit 21 receives a work instruction transmitted from the work instruction transmitting unit 117 of the management device 100 .

[0069] The work instruction display unit 22 displays the work instructions received by the work instruction receiving unit 21. Specifically, the work instruction display unit 22 is configured by a display device such as a display, but may also serve as an input device such as a touch panel display.

[0070] Work information corresponding to the work instruction is input by the work information input unit 23. Specifically, the work information input unit 23 is configured by an input device capable of inputting work information corresponding to the work instruction displayed on the display device, but may also function as the display device, such as a touch panel display.

[0071] The work information input by the work information input unit 23 is transmitted from the work information transmitting unit 24 to the work information receiving unit 120 of the management device 100.

[0072] (Mounting machines / Inspection machines) Here, the mounting and inspection machine 30 automatically executes the instructed work. 4, the mounting / inspection machine 30 has a work instruction receiving unit 31, a work execution unit 32, a work information recording unit 33, and a work information transmitting unit 34. As described above, the mounting / inspection machine 30 collectively refers to the manufacturing devices X1 to X3 and the inspection devices Y1 to Y4, and actually corresponds to at least one of these devices depending on the content of the work instruction.

[0073] The work instruction receiving unit 31 receives a work instruction transmitted from the work instruction transmitting unit 117 of the management device 100 .

[0074] Based on the work instruction received by the work instruction receiving unit 31, the work execution unit 32 executes the instructed work on the members and mechanisms that constitute the target device.

[0075] The work information recording unit 33 records work information, which is information related to the work carried out by the work execution unit 32.

[0076] The work information recorded by the work information recording unit 33 is transmitted from the work information transmitting unit 34 to the work information receiving unit 120 of the management device 100.

[0077] (Program management server) Here, the program management server 40 automatically executes the instructed work. As shown in FIG. 4, the program management server 40 includes a work instruction receiving unit 41, a program changing unit 42, a work information recording unit 43, and a work information transmitting unit 44.

[0078] The work instruction receiving unit 41 receives a work instruction transmitted from the work instruction transmitting unit 117 of the management device 100 .

[0079] The program modification unit 42 modifies the inspection and mounting program 50 based on the work instruction received by the work instruction receiving unit.

[0080] The work information recording unit 43 records work information, which is information relating to the state of program modification by the program modification unit .

[0081] The work information recorded by the work information recording unit 43 is transmitted from the work information transmitting unit 44 to the work information receiving unit 120 of the management device 100.

[0082] (Mounter) In the following, the operation of each functional unit of the management device 100, the manager terminal 10, and the worker terminal 20 will be described in detail using the mounter X2 as an example.

[0083] 5 is a diagram showing a schematic configuration of the mounter X2. The mounter X2 includes a stage 60 on which the board B is placed, a plurality of feeders 61 that supply electronic components P, a movable head 62 that picks up the electronic components P, a plurality of nozzles 63 attached to the head 62, and a vacuum pump 64 that controls the air pressure of each nozzle. Electronic components P with different part numbers are set in each row of the feeders 61. The mounter X2 also includes an observation system for detecting abnormalities in its own operation, including an upper camera 65, a lower camera 66, a contact sensor 67 that measures the contact pressure of the nozzle end face, and a pressure sensor 68 that measures the air pressure of the nozzle. The control unit 69 includes: This is a block that controls each part of the mounter X2, performs calculations, and processes information, and is equipped with a CPU (processor), memory, etc. It may also be equipped with an output device that outputs information. The coordinate system has the X-axis and Y-axis parallel to the board surface, and the Z-axis perpendicular to the board surface.

[0084] When the board B is carried onto the stage 60, the control unit 69 controls each nozzle 63 according to a mounting program to pick up and transport the necessary electronic components P from the feeders 61 and sequentially place them on the board B. When the placement (mounting) of all the electronic components P is completed, the board B is carried out to the downstream process (inspection device Y2). In addition, as manufacturing information of the board B, manufacturing log information including manufacturing abnormality information associated with the board ID, the part number of each component, the circuit number, and information indicating the equipment member that processed each component (nozzle ID, feeder ID) is recorded in the memory of the mounter X2.

[0085] Figure 6 is an example of manufacturing log information for mounter X2. Each line is a manufacturing record for one component, and includes information such as the board ID, component part number, circuit number, nozzle ID, feeder ID, and manufacturing abnormality information (number of image judgment processing errors, number of component non-pickup errors). By referencing the manufacturing log information, it is possible to know which equipment or component was used to manufacture each component on the board.

[0086] Fig. 7 is a functional block diagram of the management device 100, which clearly shows the configuration related to the mounter X2. The same reference numerals are used for functional blocks common to those in the functional block diagram shown in Fig. 2, and detailed explanations are omitted. Here, the inspection and mounting program 50m indicates a program related to the mounter X2 among the inspection and mounting programs 50.

[0087] The mounting information and inspection result collecting unit 111 collects information on components such as various electronic components, boards, and solders used in the production line, information on various members and mechanisms constituting manufacturing equipment such as the mounter X2, the above-mentioned manufacturing log information (including manufacturing abnormality information) from the mounter X2, and information on the inspection results of the board after mounting (particularly information on actual defects and oversight) from the component inspection equipment Y2. The timing of collecting this information is arbitrary, and the information may be acquired at a predetermined time or frequency, or the information may be acquired in response to an acquisition request from a user. Information on components can be collected, for example, when a new component is introduced into the production line, or when a component of a different manufacturing lot with an existing component number is introduced into the production line. Information on various members and mechanisms can be collected, for example, when equipment components are replaced or maintained, or when new equipment components are introduced into the production line. The control unit 69 of the mounter X2 can transmit manufacturing log information to the management device 100, for example, every time mounting of a board is completed in the mounter X2. The inspection result information can be collected, for example, each time the component inspection device Y2 completes the inspection of a board.

[0088] The abnormality detection unit 113 detects abnormalities such as errors during component manufacturing and defects during inspection from the information collected by the mounting information and inspection result collection unit 111 and recorded in the production information database 112 .

[0089] The cause analysis unit analyzes the cause of an anomaly detected by the anomaly detection unit 113, and extracts device components, part numbers, and program parameters that are presumed to be the cause of the anomaly. The timing and method of the cause analysis are not particularly limited, but the cause analysis can be performed for each predetermined collection period based on, for example, a comparison of the number of times an anomaly has occurred for each device component and part number with a normal value, a comparison of the number of times an anomaly has occurred between different components and part numbers of the same type, etc.

[0090] The work instruction generating unit 115 generates a work instruction based on the cause of the abnormality analyzed by the cause analyzing unit 114 and work instruction rules 119 that are predefined for eliminating the abnormality according to the cause of the abnormality. Examples of work instructions include the following. That is, a work instruction for the mounter X2 is to stop using a particular nozzle or feeder. Furthermore, work instructions for the program management server 40 are, for the mounter X2, a change or correction of mounting coordinates, a change in component dimensions or tolerance, and a change in inspection standards for the post-mount inspection machine Y2. Work instructions to the worker via the worker terminal 20 include replacement or maintenance of nozzles, feeders, and heads, and work that cannot be performed automatically by the mounter X2 or the post-mount inspection machine Y2. The contents of the work instructions are not limited to these.

[0091] The production status map generated based on the information recorded in the management database 116 is transmitted from the production status map generating unit 118 to the manager terminal 10 and displayed on the production status map display unit 12 .

[0092] (Administrator screen (production status map display screen)) Fig. 8 shows an example of a production status map display screen 70 displayed on the production status map display unit 12 of the manager terminal 10. In Fig. 8, the leading lines of the symbols are shown with dashed lines to distinguish them from the display on the screen. This production status map shows the chronological results of the aggregation of types of defects and errors detected or occurred by mounting machines and inspection machines.

[0093] The production status map display screen 70 includes a main section 71 and a legend section 72. An upper left column 73 of the main section 71 displays the item names of "Program" 731, "PCB ID" 732, and "Time" 733, and an upper right column 74 displays information corresponding to each item. "Program" 731 indicates the program name, and in this item, for example, the name of the program is displayed as "MPRG1501." "PCB ID" 732 is a PCB ID that identifies the board. D, and in this item, board IDs such as "PCBA001", "PCBA021", "PCBA041", and "PCBA061" are displayed, which are assigned to boards displayed on the production status map display screen. Since the production status map display screen 70 shown in FIG. 8 displays information on 58 boards, due to display space limitations, a predetermined number of boards (e.g., 20 boards) are grouped together, and the board IDs of the boards included in each group are represented by the board ID of the board at the top of each group. Boards may also be grouped into one group every 5 minutes using a representative time such as the mounting time at the top mounter. Depending on the number of boards, the board IDs of all boards may be displayed. "Time" 633 indicates the mounting time of the board assigned with the board ID displayed in the "PCB ID" 732 item. Here, the time when the board was put into the top device of multiple devices is used to represent it. In "Time" 733, "2020-10-15 08:36:58" is displayed for the "PCBA001" board, and "2020-10- 15 09:03:02" is displayed, and for board "PCB041", "2020-10-15 09:27:07" is displayed.

[0094] The header column 75 in the lower left column of the production status map display screen displays the names of the mounting machines and inspection machines included in one line. Here, the header column 75 displays mounters "CM-003-1" to "CM-003-6", a post-mount inspection machine "PREAOI-003", and post-reflow inspection machines "POSTAOI-003" and "AXI-003". Device IDs may be displayed instead of the names of the machines. The arrangement order of the machine names in the header column 75 can be set appropriately. The machine names may be arranged from top to bottom in the header column 75 according to the process, but here, the mounter 751 and the inspection machine 752 are displayed separately, and the inspection machine 752 displays the post-mount inspection machine and the post-reflow inspection machine. Here, the mounting machines and inspection machines displayed in the header column 75 correspond to the manufacturing members of the present invention.

[0095] In the lower right column 76 of the main part 71 of the production status map display screen 70, there are several vertically long rectangular marks. In this example, one mark represents one board (hereinafter, the mark representing a board is also referred to as a board). The board in the lower right column 76 arranged in the same row as the device displayed in the header column 75 indicates that the board represented by the mark is the mounting target of the device. The multiple boards arranged in the same row are arranged in the order in which they are mounted. In other words, the more to the right the multiple boards are, the later the time at which they are mounted by the device. Focusing on a specific device displayed in the header column 75, for example, the mounter CM-003-1, a time axis Ta1 (time axis Ta1 is not displayed) defined for the mounter CM-003-1 extends so that time advances to the right, and multiple boards B1a, B2a, B3a... are arranged along this time axis Ta1. The multiple boards B1a, B2a, B3a... arranged in the same row are evenly arranged in the row direction, but only show the chronological relationship and do not represent the interval between the processing times of the respective boards B1a, B2a, B3a.... The expression of time is not limited to this, and multiple boards B1a, B2a, B3a... may be arranged in the row direction at intervals according to the intervals of the processing times of each period. In addition, in the row direction, along with the boards processed by the device, the timing of events that are 4M fluctuations that occurred in the device are displayed by event information E1, etc., represented by a rectangle narrower than the board. In addition, among the multiple boards, etc. displayed in the lower right column 76 of the main part 71 of the production status map display screen 70, boards arranged in the same column indicate the same board. In other words, multiple boards arranged in the same column represent the same boards that are mounted in each process in the multiple devices displayed in the header column 75. For example, board B1a displayed in the first column of the first row of the lower right column 76, board B1b displayed in the first column of the third row from the bottom, board B1c displayed in the first column of the second row from the bottom, and board B1d displayed in the first column of the bottom row indicate the same board identified by the board ID of PCBA001. Here, the boards correspond to the products of the present invention (similar to the following examples).Also, here, since the unit product of the present invention consists of one product, one rectangular mark corresponds to one substrate, but since the unit product of the present invention may consist of multiple products, one rectangular mark may correspond to one or multiple substrates.

[0096] The number of defects or errors that occurred or were detected in the process of the device displayed in the same row of the header column 75 for the board displayed in the lower right column 76 of the main part 71 of the production status map display screen 70 is displayed as a stacked bar graph for each type of error, etc., superimposed on the board B2a displayed in the first row of the lower right column 76. For example, a bar graph Q1 indicating the number of component non-pickup errors detected when the board B2a was mounted by the mounter CM-003-1 is displayed superimposed on the board B2a displayed in the first row of the lower right column 76. Also, a bar graph Q2 indicating the number of image recognition errors detected when the board B4a was mounted by the mounter CM-003-1 is displayed on the board B4a displayed in the same first row. Furthermore, a bar graph Q3 indicating the number of component non-pickup errors detected when the board B6a was mounted and a bar graph Q4 indicating the number of image recognition errors are displayed as a stacked bar graph for the board B6a displayed in the same first row. In the process of inspecting a board by inspection, a stacked bar graph for each error, etc., showing the number of defects or errors that occurred or were detected in the board is displayed superimposed on the board. For example, a bar graph Q5 showing the number of actual defects detected is displayed superimposed on board B6b inspected by the post-mount inspection machine PREAOI-003, which is displayed in the third row from the bottom of the header column 75. Also, a bar graph Q6 showing the number of oversights detected during inspection by the post-mount inspection machine PREAOI-003 is displayed superimposed on board B8b in the same row.

[0097] Below the main part 71 of the production status map display screen 70, a legend section 72 is displayed that displays a legend indicating the correspondence between the types of errors and defects displayed over the board and the display style. Here, since the mounter and the inspection machine are displayed in the header column 75 of the main part 71 of the production status map display screen 70, the types are displayed differently by the shading style, such as an image recognition error 761 in the mounter being hatched from left to right, a non-suction component error 762 being hatched from right to left, an oversight 763 in the inspection machine being displayed in gray, and an actual defect 764 being displayed in black. In reality, these defects, errors, etc. are displayed in different colors. The legend further includes indications explaining the correspondence 766 between the height of the bar graph indicating the number of errors and the number of errors, the correspondence 767 between the number of components mounted on the board and the display mode of the board, and the correspondence 768 between the type of event (e.g., reel mounting) and the display mode of rectangular event information. The correspondence between these display modes and display contents can also be displayed in a pop-up by selecting the corresponding indication on the screen by clicking or touching it.

[0098] The production status displayed on the production status map display screen 70 shown in FIG. 8 will be described. Here, the board B1a, etc. displayed in the top row of the lower right column 76 is the target for mounting only by mounter CM-003-1 among the multiple mounters CM-003-1 to CM-003-6 displayed in the header column 75, and is not the target for mounting by mounters CM-003-2 to CM-003-6. For this reason, no board is displayed in the same column as the board B1a, etc. arranged in the first row, which is the same rows as the mounters CM-003-2 to CM-003-6 in the header column 75, 2 to 6.

[0099] 8, the event information E1 arranged to the left of the board B1a in the first row of the lower right column 76, which corresponds to the mounter CM-003-1, indicates a feeder replacement. For example, it is assumed that a feeder with a new reel is being prepared because parts are running low, but the reel of the previously installed feeder runs out of parts, so the feeder is replaced with the prepared feeder. The stacked bar graph displayed over boards B1a, etc., arranged to the right of event information E1 in the first row in the lower right column 76 of the production status map display screen 70, indicates that there are many occurrences of component non-suction errors. Also, the stacked bar graph displayed over boards B1b, etc., B1c, etc., arranged in the same row as the post-mount inspection machine PREAOI-003 and the post-reflow inspection machine POSTAOI-003, indicates that there are many occurrences of actual defects. In such a situation, a work instruction is issued to check the installation status of the replaced feeder reel, and the mounter CM-003- 1 to Event information E2 indicates that the reel of the installed feeder was reattached. This shows that the situation has improved, and that no component non-suction errors or actual defects have occurred since the reel was reattached.

[0100] In this way, in the production status map display screen 70, the boards B1a, etc. to be mounted are arranged on the time axis of each device constituting the printed circuit board mounting line, and the time series of each device is aligned, and the results of the compilation of each error type are displayed in chronological order by overlapping the boards B1a, etc. arranged in this way. This makes it possible to narrow down the cause of the abnormality based on the defects and errors that occur simultaneously. In addition, it is possible to grasp the time dependency of whether the defects and errors occur simultaneously, continuously, intensively, or sporadically, so that it is possible to determine whether a measure is necessary at the present time or is no longer necessary. In addition, by arranging and displaying event information according to the time series in which the boards B1a, etc. are arranged, it is possible to understand the cause of the error occurrence and the measures that have had an improvement effect. In this way, by using the production status map display screen 70, it is possible to perform cause analysis and measure determination in a short time when multiple types of defects and errors occur or are detected.

[0101] The devices displayed in the lower left column of the production status map display screen are not limited to the example shown in FIG. 8. As shown in FIG. 9(A), the devices constituting the printed circuit board mounting line may be arranged from top to bottom by type. For example, mounting machines and inspection machines are arranged from top to bottom. As mounting machines, the printer PR-003, the mounters CM-003- to CM-003-4, and the reflow furnace OV-003 are arranged from top to bottom. Furthermore, as inspection machines, the post-printing inspection machine SPI-003, the post-mounting inspection machine PREAOI-003, the post-reflow inspection machine POSTAOI-003, and the AXI-003 are arranged from top to bottom.

[0102] Also, the devices displayed in the lower left column of the production status map display screen can be arranged in the order in which the boards are inserted in the printed circuit board mounting line, as shown in Fig. 9(B). For example, they can be arranged from top to bottom in the following order: printer PR-003, post-printing inspection machine SPI-003, mounters CM-003- to CM-003-4, post-mount inspection machine PREAOI-003, reflow furnace OV-003, post-reflow inspection machine POSTAOI-003, and AXI-003.

[0103] The number of errors related to the printer, such as insufficient solder, may be displayed as errors superimposed on the board B1a on the production status map display screen 70 shown in Fig. 8. Also, the number of errors related to the reflow furnace, such as discrepancies between the set temperature and the actual measured value, may be displayed.

[0104] The event information displayed in chronological order together with the display of the boards in the lower right column 76 of the production status map display screen 70 shown in Fig. 8 is not limited to the above. Various 4M fluctuations that occur on the printed circuit board mounting line correspond to events. For the mounter, there are events related to the nozzle, feeder, head, and holder. An event related to the nozzle is nozzle replacement. Events related to the feeder include changing to a new reel when the reel is out of parts, or changing to another feeder with a new reel attached, and inserting or removing a feeder when it is not inserted properly in the mounter, etc. An event related to the head and holder is maintenance of the air path. Events related to the mounter also include temporary suspension due to an operator's action, and stopping due to some kind of error.

[0105] Events related to the printer include refilling solder, changing mounting parameters (printing pressure, ski J It is possible to display changes to maintenance (number of times, squeegee speed, etc.) and maintenance. Furthermore, as an event related to the reflow furnace, a change in the temperature profile can be displayed. Additionally, information regarding setup changes, changes to the mounting program, and interruptions to production may be displayed as event information superimposed on the board B1a, etc. in the lower right column 76 of the production status map display screen 70.

[0106] In addition to the information shown in FIG. 8, the production status map display screen 70 may display information about the implementation of maintenance within a certain period of time, the number of days since maintenance, and the number of mountings performed, for nozzles, feeders, heads, and holders in common. Terminals It is also possible to display information such as component recognition parameters such as the number, component color, brightness, etc., models of the nozzle and feeder used for mounting, and mounting coordinates and rotation angle on the board in the mounting program.

[0107] Example 2 A management system including a manager terminal 10 according to a second embodiment of the present invention will be described below. Since the second embodiment is the same as the first embodiment except for a production status map display screen 80 displayed on a production status map display unit 12, the components common to the first embodiment will be designated by common reference numerals and detailed descriptions thereof will be omitted.

[0108] Fig. 10 shows a production status map display screen 80. In Fig. 10, the leading lines of the symbols are shown with dashed lines in order to distinguish them from the display on the screen. This production status map shows the chronological results of the aggregation of types of defects and errors detected or occurred by mounting machines and inspection machines.

[0109] The production status map display screen 80 has, at the top, a legend section 81 that displays a legend, and, at the bottom, a main section 82 that displays the tally of errors and the like in chronological order.

[0110] The legend section 81 displays a correspondence 83 between the quality fluctuations and events to be displayed and their display modes. Here, information indicating actual defects, image recognition errors, component non-pickup errors, and defect signs is displayed as the quality fluctuation information. Actual defects 831 are displayed in black, image recognition errors 832 are displayed with left-leaning hatching, component non-pickup errors 833 are displayed with right-leaning hatching, and defect signs 834 are displayed with lattice hatching. Information indicating reel replacement and work instruction issuance is displayed as event information. Reel replacement 835 is displayed with vertical stripe hatching, and work instruction issuance 836 is displayed with diagonal lattice hatching. The quality fluctuation information to be displayed may be appropriately selected according to the device to be improved. Moreover, the event information to be displayed is not limited to these, and various 4M fluctuations may be appropriately selected as events. Moreover, the display modes of the quality fluctuation information and the event information are not limited to those described above, and each may be displayed with a different color.

[0111] The legend section 81 also displays a legend for the number of quality variation occurrences 84. In the main body section 82, a horizontally long rectangle represents a substrate, and a bar graph extending horizontally is displayed superimposed inside the rectangle. The length of the bar graph represents the number of occurrences of quality variation, and the lengths of the bar graphs representing the number of quality variations per substrate being 1, 2, and 3 or more, respectively, are shown.

[0112] The legend section 81 also displays a legend for the number of components (number of mounted components) 85 mounted on the board. Here, the number of components mounted on the board is represented by the horizontal length of a horizontally long rectangle representing the board. Here, the lengths of the rectangles indicate that the number of mounted components per board is 10, 20, or 100 or more, respectively.

[0113] The main part 82 includes a header row 821, a header column 822, and a main body part 823 in which a plurality of rectangles (hereinafter, the mark representing the board is also referred to as a board) are arranged as marks indicating boards. The header column 822 displays the board mounting end time. This board mounting end time progresses from bottom to top, and "2020 / 6 / 1 10:40" is displayed as the mounting end time for the board in the bottom row, and "2020 / 6 / 1 11:58" is displayed as the mounting end time for the board in the top row. The top row of the header column 822 displays three items as the item names of each column: "Improvement target" 8211, "Applicable mounter" 8212, and "Applicable line" 8213. The "Improvement target" 8211 item displays the name of the device to be improved, the "Applicable mounter" 8212 displays the name of the mounter on which the device to be improved is mounted, and the "Applicable line" 8213 item displays the name of the line on which the mounter on which the device to be improved is mounted is located. The second line of the header line 821 displays the name of the device to be improved, "NOZZLE200340", the mounter name of the mounter, "CM-003-1", and the line name of the line, "Line-1". The display area of ​​the "improvement target" item name and device name in the header line 821 highlights the device to be improved. Here, the display area is highlighted by shading, but it may have a background color different from that of the other display areas. Here, the improvement target, the mounter, and the line displayed in the header line 821 correspond to the manufacturing components of the present invention. In this way, the manufacturing components of the present invention are not limited to devices such as mounters and inspection machines, but also include components that constitute these, such as nozzles, and further include lines that are constituted by mounters and inspection machines.

[0114] As described above, of the multiple boards P1a etc. arranged in each column 8231-8233 of the main body 823, the boards displayed lower have the oldest mounting end time, and the boards displayed higher have the newest mounting end time. In other words, of the boards P1a-P12a arranged in the first column 8231 of the improvement target 8211, the board P12a has the oldest mounting end time, and the board P1a has the newest mounting end time. The same is true for the boards P1b-P12b arranged in the second column 8232 and the boards P1c-P12c arranged in the third column 8233. Focusing on a specific device, equipment, or line, such as the nozzle NOZZLE200340, displayed in the header row 821, A time axis Ta2 (time axis Ta2 is not displayed) defined for the NOZZLE200340 extends from bottom to top so that time advances, and multiple boards P12a to P3a, P2a, and P1a are arranged along this time axis. The boards P1a, etc. displayed in the main body 823 are arranged in multiple columns (three columns in this case) 8231 to 8233 in the horizontal direction, and multiple boards arranged in the same row indicate the same board. That is, the boards P1a, P1b, and P1c arranged in the same row indicate the same board. The same is true for the boards P2a, etc., P2b, etc., and P2c arranged in other rows. The horizontal length of the rectangles representing the boards displayed in each column is plotted as the number of mounted components on one board, as displayed in the legend section 81.

[0115] Bar graphs showing quality fluctuations are displayed superimposed on the board P1a etc. displayed in the main body section 823. These bar graphs are displayed according to the display mode for each type of quality fluctuation or event as displayed in the legend section 81. For example, one actual defect has been detected for each of the boards P12a, P12b, P12c in the bottom row, and black bar graphs Q7, Q8, Q9 extending horizontally are displayed superimposed on the boards P12a, P12b, P12c displayed in columns 8231, 8232, 8233, respectively, which correspond to the nozzle, mounter, and line items to be improved.

[0116] Event information E3, a rectangle with diagonal hatching indicating the issuance of a work instruction, is displayed between the bottom board P12c and the second bottom board P11c in column 8233 of the item of the corresponding line 8213. This indicates that a work instruction has been issued between mounting on the bottom board P12c and mounting on the second bottom board P11c. The same event information is not displayed in columns 8231 and 8232 of the items of the improvement target 8211 and the corresponding mounter 8212, indicating that a work instruction has been issued for a device included in line Line-1 that is different from the mounter CM-003-1 on which the improvement target device NOZZLE200340 displayed in the first column is mounted.

[0117] Furthermore, for boards P10a, P10b, and P10c in the third row from the bottom, a bar graph Q10 with hatching slanting upwards to the right is displayed superimposed, indicating that a component non-pickup error has been detected in board P10c displayed in column 8233 of the item for the corresponding line 8213. This indicates that, among the equipment included in line Line-1, a component non-pickup error has occurred in a mounter other than mounter CM-003-1 on which the improvement target device NOZZLE200340 displayed in the first column is mounted.

[0118] For the boards P8a, P8b, and P8c in the fifth row from the bottom, a bar graph Q11 indicating that an actual defect has been detected is displayed over the board P8a displayed in column 8231 of the improvement target 8211 item, and a bar graph Q11 indicating that an actual defect has been detected is displayed over the board P8a displayed in column 823 of the item of the corresponding line. 3 to On the displayed board P8c, a bar graph Q12 indicating an actual defect and a bar graph Q13 indicating the occurrence of non-pickup of components are displayed in parallel. In this way, when multiple types of quality fluctuations have been detected / occurred, a bar graph is displayed for each type. Multiple types of quality fluctuations may also be displayed as a stacked bar graph.

[0119] FIG. 10 shows an example in which one type of event has occurred, such as event information E3. However, when multiple events are present, the event information is displayed by dividing a rectangular display area, the length of which is the same as the horizontal length of the board, equally into parts for each event.

[0120] 10, multiple boards arranged in the same row are evenly arranged in the row direction, but the arrangement of the boards indicates only the temporal relationship and does not represent the interval between the processing times of each board. The expression of time is not limited to this, and multiple boards may be arranged in the row direction at intervals corresponding to the intervals between the processing times.

[0121] In this way, in the production status map display screen 80, the boards P1a, etc. to be mounted are arranged on the time axis for each device, equipment, and line constituting the printed circuit board mounting line, and the time series for each device, etc. are aligned, and the results of the aggregation for each error type are displayed in chronological order by overlapping the boards P1a, etc. arranged in this way. This makes it possible to narrow down the cause of the abnormality based on the defects and errors that occur simultaneously. In addition, it is possible to grasp the time dependency, such as whether the defects and errors occur simultaneously, continuously, intensively, or sporadically, so that it is possible to determine whether a measure is necessary at the present time or is no longer necessary. In addition, by arranging and displaying event information according to the time series in which the boards P1a, etc. are arranged, it is possible to understand the cause of the error occurrence and the measures that have had an improvement effect. In this way, by using the production status map display screen 80, it is possible to perform cause analysis and measure determination in a short time when multiple types of defects and errors occur or are detected.

[0122] Example 3 The following describes the manager terminal 10 according to the third embodiment of the present invention. Since the manager terminal 10 is the same as the first and second embodiments except for the production status map display screen 90 displayed on the production status map display unit 12, the components common to the first and second embodiments are designated by the same reference numerals and will not be described in detail.

[0123] The production status map display screen 90 shown in FIG. 11 shows an example in which defects or errors occurring simultaneously in a printed circuit board mounting line are displayed on the same graph by a stacked bar graph. The production status map display screen 90 according to this embodiment displays the results of aggregation for each type of defect or error that has occurred or been detected by a mounting machine or an inspection machine, using a time expression different from that of the production status map display screens 70 and 80 described in the first and second embodiments. By using it in combination with the production status map display screens 70 and 80, it is possible to perform cause analysis and countermeasure decision in a shorter time when multiple types of errors occur. The production status map display screen 90 corresponds to the time-dependent quality information of the present invention. A plurality of production status map display screens 90 for each mounting machine or inspection machine may be displayed vertically.

[0124] In FIG. 11, the horizontal axis indicates the mounting time in the printed circuit board mounting line, and the vertical axis indicates the number of defects or errors. The stacked graph shows the number of defects or errors detected within the plot width by stacking them up for each type. The plot width and the scale of the mounting time are changed according to the display time width. In FIG. 11, component non-pickup errors are indicated by hatching that slopes upward to the right, image recognition errors by hatching that slopes upward to the left, actual defects by black, and defect signs by lattice hatching. Here, the types of defects and errors are distinguished by the display mode of the shading, but the display mode for distinguishing between them is not limited to this, and in reality, they are displayed in different colors. As shown in FIG. 11, together with the stacked bar graph, a legend may be displayed that indicates the correspondence between the display mode of the bar graph and the type of error, etc., and the correspondence between the height of the bar graph and the error, etc. Here, 12:00 to 14:00 shown on the horizontal axis corresponds to the predetermined period of the present invention, and defects or errors, which are quality information, are arranged according to the passage of time.

[0125] Example 4 The manager terminal 10 according to the fourth embodiment of the present invention will be described below. Since the manager terminal 10 is common to the first and second embodiments except for the production status map display screen 91 displayed on the production status map display unit 12, the components common to the first and second embodiments will be designated by common reference numerals and detailed descriptions thereof will be omitted.

[0126] 12 shows an example in which defects or errors occurring simultaneously in a printed circuit board mounting line are displayed on the same graph as a line graph. A production status map display screen 91 according to this embodiment is the same as the production status map display screens 70 and 8 described in the first and second embodiments. It displays the results of tallying up defects or errors that have occurred or been detected by mounting machines or inspection machines by type, using a time expression other than 0, and by using it in combination with the production status map display screens 70 and 80, it is possible to analyze the causes and determine countermeasures in a shorter time when multiple types of errors have occurred. The production status map display screen 91 corresponds to the time-dependent quality information of the present invention. A plurality of production status map display screens 91 for mounting machines or inspection machines may be displayed vertically aligned.

[0127] In Figure 12, the horizontal axis indicates the mounting time on the printed circuit board mounting line, and the vertical axis indicates the number of defects or errors. The line graph displays the total number of defects or errors detected within the plot width as one plot. The plot width and the scale of the mounting time change according to the displayed time width. The oldest date in the plot range is displayed at the left end of the horizontal axis, for example, "08-31." The line graph in Figure 12 is, 1 of 08-31 From 7:00 09-01 It shows the number of actual defects in the range from 17:00 on 08-31 to 09:00 on 09-01. In addition, the line graph can plot image recognition errors, non-pickup errors, and defect signs in different display modes such as shading and colors. Here, the period from 17:00 on 08-31 to 09:00 on 09-01 shown on the horizontal axis corresponds to the specified period of the present invention, and defects or errors, which are quality information, are arranged over time.

[0128] Example 5 The manager terminal 10 according to the fifth embodiment of the present invention will be described below. Since the manager terminal 10 is the same as the first and second embodiments except for the production status map display screen 92 displayed on the production status map display unit 12, the configurations common to the first and second embodiments will be designated by the same reference numerals and detailed descriptions thereof will be omitted.

[0129] FIG. 13 is an example of a bar graph plotting the number of errors, etc., for each board in a printed circuit board mounting line, without adding up the errors, etc., within a period. The production status map display screen 92 according to this embodiment displays the results of counting by type of defects or errors that have occurred or been detected by mounting machines or inspection machines, using a time expression different from that of the production status map display screens 70 and 80 described in the first and second embodiments. By using the production status map display screen 92 in combination with the production status map display screens 70 and 80, it is possible to perform cause analysis and countermeasure decision in a shorter time when multiple types of errors, etc. have occurred. The production status map display screen 92 corresponds to the time-dependent quality information of the present invention. A plurality of production status map display screens 92 for mounting machines or inspection machines may be displayed vertically.

[0130] In FIG. 13, the horizontal axis indicates the mounting time on the printed circuit board mounting line, and the vertical axis indicates the number of defects or errors. In FIG. 13, the actual defects detected within the plot width are plotted in a bar graph. At the upper left and right ends of the graph, the start time of the displayed period, "2020-08-31 17:00", and the end time, "2020-09-01 09:00", are displayed. The time on the horizontal axis does not necessarily have to be uniform, so the start time and end time are displayed in this manner. In addition, the band-shaped background 921 shown with diagonal lattice hatching indicates the period during which the work instruction is notified (work instruction notification period). Here, the background 921 is displayed until the end time because the instructed work is not performed within the displayed range of the incident. In addition to the actual defects shown in FIG. 13, image recognition errors, component non-suction errors, and defect signs may be displayed in a bar graph using different display modes such as shading and colors. Here, 2020-08-31 17:00 to 2020-09-01 09:00 corresponds to the specified period of the present invention, and defects or errors, which are quality information, are arranged over time.

[0131] Example 6 In the following, the manager terminal 10 according to the sixth embodiment of the present invention will be described. Since the manager terminal 10 is the same as the first and second embodiments except for the production status map display screen 93 displayed on the production status map display unit 12, the components common to the first and second embodiments will be described in detail using the common reference numerals. The details are omitted.

[0132] FIG. 14 is an example in which the number of errors, etc., for each board in a printed circuit board mounting line is plotted in a bar graph without adding up the errors, etc., within a period, in the same manner as FIG. 13. The production status map display screen 93 according to this embodiment displays the results of aggregation for each type of defect or error that has occurred or been detected by a mounting machine or an inspection machine, using a time expression different from that of the production status map display screens 70 and 80 described in the first and second embodiments. By using the production status map display screen 93 in combination with the production status map display screens 70 and 80, it is possible to perform cause analysis and countermeasure decision in a shorter time when multiple types of errors, etc., have occurred. The production status map display screen 93 corresponds to the time-dependent quality information of the present invention. A plurality of production status map display screens 93 for mounting machines or inspection machines may be displayed vertically.

[0133] In FIG. 14, the horizontal axis indicates the mounting time in the printed circuit board mounting line, and the vertical axis indicates the number of defects. or the number of errors. In FIG. 14, image recognition errors and actual defects detected within the plot width are displayed in a bar graph. Here, image recognition errors are displayed with hatching that slopes upward to the left, and actual defects are displayed in black. Also, a band-shaped background 931 shown with hatching of dots displayed on the scale of the time axis indicates the work instruction notification period. Here, by displaying the background 931 only in a partial range of the time axis, it is shown that the instructed work was performed at the time when the display range of the background 931 ends. The display mode of the background indicating the work notification period may be different between when the instructed work has not been performed and when it has been performed. In addition to the image recognition errors and actual defects shown in FIG. 14, component non-suction errors, defect signs, etc. may be displayed in a bar graph using different display modes such as shading and colors. FIG. 1In FIG. 4, the upper left and right ends of the graph also display the start time of the displayed period, "2020-08-31 17:00," and the end time, "2020-09-01 09:00." In this case, 2020-08-31 17:00 to 2020-09-01 09:00 corresponds to the predetermined period of the present invention.

[0134] Example 7 The manager terminal 10 according to the seventh embodiment of the present invention will be described below. Since the manager terminal 10 is common to the first and second embodiments except for the production status map display screen 94 displayed on the production status map display unit 12, the components common to the first and second embodiments will be designated by common reference numerals and detailed descriptions thereof will be omitted.

[0135] 15 is a graph in which only frequently occurring errors are plotted. The production status map display screen 94 according to this embodiment displays the results of tabulation of defects or errors by type that have occurred or been detected by mounting machines or inspection machines, using a time expression different from that of the production status map display screens 70 and 80 described in the first and second embodiments, and by using it in combination with the production status map display screens 70 and 80, it is possible to perform cause analysis and determine countermeasures in a shorter time when multiple types of errors have occurred. The production status map display screen 94 corresponds to the time-dependent quality information of the present invention. A plurality of production status map display screens 94 for mounting machines or inspection machines may be displayed vertically.

[0136] In FIG. 15, the horizontal axis indicates the time when an abnormality was notified in the printed circuit board mounting line (abnormality notification time), and the vertical axis indicates the number of defects or errors. Here, an example is shown in which frequent occurrences of real defects are detected, and a black bar graph indicating the number of real defects is displayed on the graph. This bar graph displays only frequent errors, etc., among those detected within the plot width. Dashed lines 941 and 942 indicate the boundary times of the monitoring period. In addition to errors, the occurrence times of events such as reel replacement are plotted as event information 943 in FIG. 15. Event information 943 is displayed as a long and thin gray rectangle that is different from the bar graph. In addition to the real defects shown in FIG. 15, image recognition errors, component non-suction errors, signs of defects, etc. may be displayed in the bar graph using different display modes such as shading and color. Plots showing frequent occurrences are displayed as follows: The number of target errors, etc. can be, for example, three or more, but may be set appropriately. Here, the period between dashed lines 941 and 942, 2020 / 03 / 22 12:00 to 2020 / 3 / 24 12:00, corresponds to the predetermined period of the present invention, and defects or errors, which are quality information, are arranged over time.

[0137] Example 8 The manager terminal 10 according to the eighth embodiment of the present invention will be described below. Since the manager terminal 10 is common to the first and second embodiments except for the production status map display screen 95 displayed on the production status map display unit 12, the components common to the first and second embodiments will be designated by common reference numerals and detailed descriptions thereof will be omitted.

[0138] 16 is a line graph plotting the transition of the number of abnormality detections that are the target of warning in the past counting results. The production status map display screen 95 according to this embodiment displays the counting results of defects and errors that have occurred or been detected in the mounting machine or the inspection machine using a time expression different from that of the production status map display screens 70 and 80 described in the first and second embodiments, and by using it in combination with the production status map display screens 70 and 80, it is possible to perform cause analysis and countermeasure decision in a shorter time when multiple types of errors have occurred. The production status map display screen 95 corresponds to the time-dependent quality information of the present invention. A plurality of production status map display screens 95 for mounting machines or inspection machines may be displayed vertically.

[0139] In FIG. 16, the horizontal axis indicates the time when an abnormality was notified in the printed circuit board mounting line (abnormality notification time), and the vertical axis indicates the number of defects or errors. In FIG. 16, the number of abnormalities detected for all warnings in the latest notification is plotted. Here, for all warnings included in the latest notification, Warning 1, Warning 2, and Warning 3, which are analyzed at regular intervals, the warnings notified are traced back to the past, and the number of abnormalities detected in the past notification results is plotted. The number of abnormalities detected for Warning 1, Warning 2, and Warning 3 are displayed as a solid line, a dashed line, and a dashed line, respectively. The vertical dotted line indicates the boundary time of the monitoring period. The errors to be displayed are appropriately selected from actual defects, image recognition errors, component non-suction errors, and defects precursors. When plotting mounters, the number of cases for multiple mounters may be grouped together or separated. The time interval for display is appropriately changed depending on the settings. Here, the period from 6:00 on March 22, 2020 to 12:00 on March 24, 2020 shown on the horizontal axis corresponds to a predetermined period of the present invention, and defects or errors, which are quality information, are arranged over time.

[0140] In the following, the components of the present invention will be described with reference to the reference numerals in the drawings in order to make it possible to compare the components of the present invention with the configurations of the embodiments. <Invention 1> A quality improvement support device that supports improvement of the quality of a product manufactured by a manufacturing facility, Quality information (Q1, etc.) regarding the quality generated or detected in the manufacturing process by the manufacturing equipment, a display unit (12) that displays manufacturing status information (80, etc.) in which the quality information (Q1, etc.) is arranged in a chronological order in association with manufacturing members or parts included in the manufacturing equipment, A quality improvement support device (10) characterized in that in the manufacturing status information (80, etc.), for each unit product (B1a, etc.) which is one or more of the products, the quality information (Q1, etc.) is arranged in accordance with the order in which the product (B1a, etc.) is manufactured. [Explanation of symbols]

[0141] 10: Administrator terminal 12: Production status map display section B :substrate Q: Defects or errors X1~X3,Y1~Y4: Manufacturing equipment

Claims

1. A quality improvement support device that supports improvement of the quality of a product manufactured by a manufacturing facility, quality information regarding the quality generated or detected in a manufacturing process by the manufacturing facility; a display unit that displays manufacturing status information in which the quality information is associated with a manufacturing member or part included in the manufacturing equipment and arranged in a chronological order; In the production status information, the quality information for each unit product which is one or more of the products is arranged in accordance with the order in which the products are produced; A quality improvement support device, characterized in that, for each of a plurality of manufacturing components related to the unit product, the quality information for the same unit product is arranged at the same position in the time series.

2. The quality information includes a plurality of types of the quality information, 2. The quality improvement support device according to claim 1, wherein the quality information is displayed in a different display mode for each of the types.

3. The quality improvement support device according to claim 1 or 2, characterized in that event information indicating an event that has occurred or been executed in relation to the manufacturing component or part is arranged in chronological order together with the quality information in accordance with the timing at which the event occurred or was executed and the context of the quality information that has occurred or been detected in relation to the manufacturing component or part.

4. A quality improvement support device as described in any one of claims 1 to 3, characterized in that a mark indicating the unit product is arranged in a time axis direction defined for each manufacturing component or part related to the quality information in accordance with the order, and the quality information is displayed in association with the mark.

5. The quality improvement support device according to any one of claims 1 to 4, characterized in that the manufacturing status information includes time-dependent quality information regarding the quality generated or detected in relation to the manufactured components or parts, the time-dependent quality information being arranged in chronological order as time progresses within a specified period of time.

6. 6. The quality improvement support device according to claim 5, wherein the time-dependent quality information, in which the time lapse within the predetermined period is plotted on the horizontal axis, is arranged vertically for each of the multiple manufactured materials or parts.

Images