Transparent display device and manufacturing method thereof

Abstract

To provide: a transparent display apparatus which can improve the transmittance or opening ratio; and a manufacturing method the same.SOLUTION: A transparent display apparatus comprises a substrate with a transparent area and a light emitting area. The light emitting area includes: a first bank layer; a first light emitting cell contacting a first side of the first bank layer; and a second light emitting cell contacting a second side of the first bank layer. The first light emitting cell and the second light emitting cell are apart from each other with the first bank layer held therebetween. The transparent area includes: a second bank layer; a first transparent cell contacting one side of the second bank layer; and a second transparent cell contacting the other side of the second bank layer. The first transparent cell and the second transparent cell are apart from each other with the second bank layer held therebetween. The transparent display apparatus further comprises a third bank layer overlapping a boundary between the transparent area and the light emitting area. The first bank layer and the third bank layer have a regular tapered shape, and the second bank layer has an inverted tapered shape. There is also provided a manufacturing method of the transparent display apparatus.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a transparent display device and a method for manufacturing the same. [Background technology]

[0002] As the information society develops, the demand for display devices to display images is increasing in various forms. As a result, display devices such as liquid crystal displays (LCDs), organic light emitting displays (OLEDs), micro light emitting diodes (Micro LED displays), and quantum dot displays (QDs) are being used in recent years.

[0003] The display device is a display device that outputs light using light-emitting elements, and includes a display panel equipped with the light-emitting elements.

[0004] 2. Description of the Related Art In recent years, active research has been conducted into transparent display devices that not only display images to a user, but also allow light to pass through the display device, thereby enabling a user to see objects or images located behind the display device.

[0005] The transparent display device includes a display area where an image is displayed and a non-display area, and the display area may include a transmissive portion and a light emitting portion that can transmit external light. The transparent display device may have high light transmittance in the display area through the transmissive portion.

[0006] However, in a transparent display device, the formation of organic matter constituting a light-emitting element in the transmissive portion is unavoidable, and this causes a problem of reduced transmittance in the transmissive portion. Summary of the Invention [Problem to be solved by the invention]

[0007] An object of one embodiment of the present invention is to provide a transparent display device and a manufacturing method thereof that can improve the transmittance or aperture ratio of the transmissive portion by having a bank layer in an inverted tapered shape in the transmissive portion.

[0008] One embodiment of the present invention aims to provide a transparent display device and a manufacturing method thereof that can improve the transmittance or aperture ratio of the transmissive portion by forming a hydrophilic bank layer at the boundary between the transmissive portion and the luminescent portion.

[0009] In addition to the objects of the present specification mentioned above, other features and advantages of the present specification will be described below or will be clearly understood by those having ordinary skill in the art to which the technical ideas of the present specification belong from such descriptions and explanations. [Means for solving the problem]

[0010] In order to achieve the above technical objectives, one embodiment of the present invention provides a transparent display device and a manufacturing method thereof, the transparent display device including a substrate having a transmissive portion and a light-emitting portion, the light-emitting portion including a first bank layer, a first light-emitting cell in contact with one side of the first bank layer, and a second light-emitting cell in contact with the other side of the first bank layer, the first light-emitting cell and the second light-emitting cell being spaced apart from each other with the first bank layer in between, the transmissive portion including a second bank layer, a first transmissive cell in contact with one side of the second bank layer, and a second transmissive cell in contact with the other side of the second bank layer, the first transmissive cell and the second transmissive cell being spaced apart from each other with the second bank layer in between, and a third bank layer overlapping a boundary between the transmissive portion and the light-emitting portion, the first bank layer and the third bank layer having a positive tapered shape, and the second bank layer having an inverse tapered shape. Effect of the Invention

[0011] In a transparent display device and a manufacturing method thereof according to one embodiment of the present invention, the bank layer of the transmissive portion has an inverted tapered shape, and a hydrophilic bank layer is formed at the boundary between the transmissive portion and the light-emitting portion, thereby making it possible to improve the transmittance or aperture ratio of the transmissive portion.

[0012] In addition to the effects mentioned above, other features and advantages of the present invention will be described below or will be clearly understood by those having ordinary skill in the art to which the present invention pertains from such description and explanation. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic diagram illustrating a transparent display device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a diagram illustrating an example of a pixel provided in region A of FIG. 1 according to an embodiment of the present invention. [Diagram 3] FIG. 3 is a cross-sectional view taken along line II' in FIG. [Figure 4] 3 is a cross-sectional view taken along line II-II' of FIG. 2, showing a schematic shape of a first bank layer. FIG. [Diagram 5] 3 is a cross-sectional view taken along line III-III' in FIG. 2, showing a schematic shape of a second bank layer. FIG. [Figure 6] 4 is a cross-sectional view taken along line IV-IV' of FIG. 2, showing a schematic shape of a third bank layer. FIG. [Figure 7] FIG. 3 is a perspective view showing a schematic view of region B in FIG. 2. [Figure 8A] FIG. 2 is a cross-sectional view taken along line II-II' of FIG. 2 for illustrating another embodiment of the first bank layer. [Figure 8B] FIG. 3 is a cross-sectional view taken along line III-III' of FIG. 2 for illustrating another embodiment of the second bank layer. [Figure 9] 1. FIG. 4 is a plan view showing another embodiment of the pixel arranged in FIG. [Figure 10] 10 is a cross-sectional view taken along line VV' in FIG. [Figure 11A] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11B] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11C] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11D] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11E] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11F] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11G] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11H] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11I] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11J] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11K] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11L] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 11M] 3A to 3C are process diagrams illustrating a method for manufacturing a transparent display device according to the embodiment of FIG. 2 of the present invention. [Figure 12A] 3A to 3C are process diagrams showing a process for forming a bank layer according to the embodiment of the present invention shown in FIG. 2. [Figure 12B] 3A to 3C are process diagrams showing a process for forming a bank layer according to the embodiment of the present invention shown in FIG. 2. [Figure 12C] 3A to 3C are process diagrams showing a process for forming a bank layer according to the embodiment of the present invention shown in FIG. 2. [Figure 13A] 10 is a process diagram of a transparent film forming process according to still another embodiment of the present invention shown in FIG. [Figure 13B] 10 is a process diagram of a transparent film forming process according to still another embodiment of the present invention shown in FIG. [Figure 13C] 10 is a process diagram of a transparent film forming process according to still another embodiment of the present invention shown in FIG. [Figure 13D] 10 is a process diagram of a transparent film forming process according to still another embodiment of the present invention shown in FIG. [Figure 13E] 10 is a process diagram of a transparent film forming process according to still another embodiment of the present invention shown in FIG. [Figure 13F] 10 is a process diagram of a transparent film forming process according to still another embodiment of the present invention shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The advantages and features of the present invention, as well as the methods for achieving them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. The embodiments are provided solely for the purpose of making the disclosure of the present invention complete, and to fully convey the scope of the invention to those skilled in the art to which the present invention pertains.

[0015] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are merely illustrative, and the present invention is not limited to the matters shown in the drawings. The same reference numbers may refer to the same components throughout the specification. In addition, in the description of the present invention, if a detailed description of related known technology is deemed to unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

[0016] When the terms "comprise", "have", "consist of", etc. are used in the present invention, other parts may be added unless "only" is used. When an element is expressed in the singular, it includes the plural unless otherwise expressly stated.

[0017] When interpreting elements, they are interpreted as including a margin of error unless otherwise expressly stated.

[0018] For example, when the location of two parts is described using "on," "at the top," "at the bottom," "beside," etc., one or more other parts may be located between the two parts, unless the word "immediately" or "directly" is used.

[0019] Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like, may be used to facilitate the description of the relationship of one element or component to another element or component, as shown in the figures. Spatially relative terms should be understood as terms that include different orientations of elements in use or operation in addition to the orientation shown in the figures. For example, if elements shown in the figures are inverted, an element described as "below" or "below" the other element may be placed "above" the other element. Thus, the exemplary term "below" can include both an orientation below and above. Similarly, the exemplary terms "above" or "upper" can include both an orientation above and below.

[0020] When describing a temporal relationship, for example, when the temporal precedence / subsequence relationship is described using "after," "following," "next to," "before," etc., it can also include cases where the relationship is not consecutive, unless the words "immediately" or "directly" are used.

[0021] Although the terms "first", "second" and the like are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Therefore, the first component referred to below may be the second component within the technical concept of the present invention.

[0022] The term "at least one" should be understood to include all combinations that can be presented from one or more of the associated items. For example, the meaning of "at least one of the first item, the second item, and the third item" can mean not only each of the first item, the second item, or the third item, but also all combinations of items that can be presented from two or more of the first item, the second item, and the third item.

[0023] The features of the various embodiments of the present invention may be partially or fully combined or combined with each other, and may be technically interlocked and driven in various ways, and each embodiment may be implemented independently of the others or together in a linked relationship.

[0024] When adding reference numbers to components in each figure illustrating an embodiment of the present invention, the same numbers may be given to identical components as far as possible, even if they are shown in different figures.

[0025] In the embodiments of the present invention, the source electrode and the drain electrode are distinguished only for convenience of explanation, and the source electrode and the drain electrode can be interchanged. A source electrode can be a drain electrode, and a drain electrode can be a source electrode. Also, a source electrode in any one embodiment can be a drain electrode in another embodiment, and a drain electrode in any one embodiment can be a source electrode in another embodiment.

[0026] In some embodiments of the present invention, for convenience of explanation, the source region and the source electrode may be distinguished, and the drain region and the drain electrode may be distinguished, but the embodiments of the present invention are not limited thereto. The source region may be the source electrode, and the drain region may be the drain electrode. In addition, the source region may be the drain electrode, and the drain region may be the source electrode.

[0027] FIG. 1 is a schematic diagram of a transparent display device 100 according to an embodiment of the present invention.

[0028] In the following, the X-axis indicates a direction parallel to the scan lines, the Y-axis indicates a direction parallel to the data lines, and the Z-axis indicates a height direction of the transparent display device.

[0029] Although the transparent display device 100 according to an embodiment of the present invention has been described mainly as an organic light emitting display, it may also be realized as a liquid crystal display, a plasma display panel (PDP), a quantum dot light emitting display (QLED), or an electrophoresis display.

[0030] Referring to FIG. 1, a transparent display device 100 according to one embodiment of the present invention may include a transparent display panel 101 including a display area (DA) where pixels are formed to display an image, and a non-display area (NDA) where no image is displayed.

[0031] The display area (DA) of the transparent display panel 101 may include a first signal line (SL1), a second signal line (SL2), and pixels, and the non-display area (NDA) may include a pad area (PA) in which pads are arranged and at least one gate driver 205.

[0032] The first signal line (SL1) can extend in a first direction (or Y-axis direction) and can intersect with the second signal line (SL2) in the display area (DA). The second signal line (SL2) can extend in a second direction (or X-axis direction). The pixels are disposed in the areas where the first signal line (SL1) and the second signal line (SL2) intersect, and can emit a predetermined light to display an image.

[0033] The gate driver 205 may be connected to the scan lines to supply scan signals. The gate driver 205 may be configured in a gate driver in panel (GIP) or tape automated bonding (TAB) manner in a non-display area (NDA) on one or both sides of a display area (DA) of the transparent display panel 101.

[0034] A source driver integrated circuit, a circuit board, or a timing controller, which can be connected via a flexible circuit film, can be electrically connected to the pad area (PA) of the transparent display panel 101 .

[0035] FIG. 2 is a diagram illustrating an example of a pixel provided in region A of FIG.

[0036] 1 and 2, the display area (DA) may include an emission section (EA) and a transmissive section (TA). The transmissive section (TA) may be a section that transmits most of the light incident from the outside. The emission section (EA) may be a section that does not transmit most of the light incident from the outside. The emission section (EA) may be a pixel section in which a plurality of emission cells (EA1, EA2) are arranged. The transparent display panel 101 allows an object or background located behind (or on) the transparent display panel 101 to be seen through the transmission section (TA).

[0037] The light emitting portion (EA) is disposed in an area adjacent to the transmissive portion (TA). Although not shown in the figure, a plurality of signal lines can be disposed in the light emitting portion (EA) and the transmissive portion (TA) area. For example, the signal lines can include at least one of a pixel power line, a common power line, a data line, a reference line, and a scan line, but are not necessarily limited thereto.

[0038] Referring to FIG. 2, the light emitting unit (EA) includes a first light emitting cell (EA1), a second light emitting cell (EA2), and a first bank layer 195a. In particular, the light emitting unit (EA) includes the first bank layer 195a, a first light emitting cell (EA1) contacting one side of the first bank layer 195a, and a second light emitting cell (EA2) contacting the other side of the first bank layer 195a. Here, the light emitting cell means a region that emits light of a color. However, the embodiment of the present invention is not limited thereto, and may further include a third light emitting cell (EA3) and a fourth light emitting cell (EA4). In particular, each of the light emitting cells (EA1, EA2, EA3, EA4) may be partitioned by the first bank layer 195a. As an example, the first light emitting cell (EA1) to the fourth light emitting cell (EA4) may emit light of different colors. For example, the first light emitting cell (EA1) may emit green light, the second light emitting cell (EA2) may emit red light, the third light emitting cell (EA3) may emit blue light, and the fourth light emitting cell (EA4) may emit white light, but is not limited thereto. Also, the number, color type, arrangement type, arrangement order, etc. of each light emitting cell (EA1, EA2) may be configured in various forms depending on the light emitting characteristics, element life, device specifications, etc.

[0039] Referring to FIG. 2, a substrate 110 of a transparent display panel 101 according to an embodiment of the present invention may include a transmissive portion (TA) and an emissive portion (EA).

[0040] FIG. 3 is a cross-sectional view taken along line II' of FIG.

[0041] 3, the emission unit (EA) may include a pixel circuit including at least one thin film transistor (TFT) and a capacitor or a plurality of signal lines. For example, the at least one thin film transistor (TFT) may include a switching thin film transistor, a sensing thin film transistor, a driving thin film transistor, etc. Such a thin film transistor (TFT) may include an active layer 130, a gate electrode 150, a source electrode 171, and a drain electrode 172. In addition, the emission unit (EA) may include a first electrode 191, an organic emission unit 192, and a second electrode 193 constituting a light emitting element.

[0042] In particular, the substrate 110 can be a transparent glass substrate or a transparent plastic substrate as a base substrate. A buffer layer 120 can be disposed on the substrate 110.

[0043] The buffer layer 120 can be formed of a single layer or a stack of multiple inorganic films. For example, the buffer layer 120 can be formed of a single layer made of a silicon oxide film (SiOx), a silicon nitride film (SiNx), and a silicon oxynitride film (SiOxNy). Alternatively, the buffer layer 120 can be formed of a multilayer film made of at least two films of a silicon oxide film (SiOx), a silicon nitride film (SiNx), and a silicon oxynitride film (SiOxNy). Such a buffer layer 120 can be formed on the entire upper surface of the substrate 110 to block ions and impurities diffusing from the substrate 110 and to block moisture penetrating into a thin film transistor (TFT) or a light emitting element through the substrate 110.

[0044] The active layer 130 may be disposed on the buffer layer 120. The active layer 130 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. The active layer 130 may include a channel region overlapping with the gate electrode 150 and source / drain regions connected to the source / drain electrodes 171 and 172.

[0045] A gate insulating film 140 may be disposed on the active layer 130. The gate insulating film 140 may function to insulate between the active layer 130 and the gate electrode 150. The gate insulating film 140 may be formed of an inorganic insulating material, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), a silicon oxynitride film (SiOxNy), or a multi-layer film thereof. Alternatively, the gate insulating film 140 may be disposed only on a portion that can cover the active layer 130. The gate insulating film 140 may be disposed on the emission portion (EA), and may not be disposed on at least a portion of the transmission portion (TA) in order to improve the light transmittance of the transmission portion (TA).

[0046] A gate electrode 150 may be disposed on the gate insulating film 140. The gate electrode 150 may be disposed so as to overlap the active layer 130 with the gate insulating film 140 sandwiched therebetween. The gate electrode 150 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0047] An interlayer insulating film 160 may be disposed on the gate insulating film 140 including the gate electrode 150. The interlayer insulating film 160 may be formed to cover the gate electrode 150. The interlayer insulating film 160 may function to protect the thin film transistor (TFT). The interlayer insulating film 160 may be made of a silicon oxide film (SiOx), a silicon nitride film (SiNx), a silicon oxynitride film (SiOxNy), or a multi-layer film thereof. Alternatively, the interlayer insulating film 160 may be disposed in the light emitting portion (EA), and may not be disposed in at least a part of the transmissive portion (TA) in order to improve the light transmittance of the transmissive portion (TA).

[0048] Source / drain electrodes 171 and 172 may be disposed on the interlayer insulating film 160. Corresponding regions of the interlayer insulating film 160 may be removed to allow the active layer 130 to contact the source / drain electrodes 171 and 172. For example, the source / drain electrodes 171 and 172 may be in contact with and electrically connected to the active layer 130 through contact holes penetrating the interlayer insulating film 160 and the gate insulating film 140. The source / drain electrodes 171 and 172 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0049] A planarization film 180 may be disposed on the interlayer insulating film 160 including the thin film transistors (TFTs). The planarization film 180 may be formed to cover the thin film transistors (TFTs). The planarization film 180 protects the thin film transistors (TFTs) and may be made of an inorganic insulating material. For example, the planarization film 180 may be made of a silicon oxide film (SiOx), a silicon nitride film (SiNx), a silicon oxynitride film (SiOxNy), or a multi-layer film thereof.

[0050] A first electrode 191 (or an anode electrode) constituting a light emitting element may be disposed on the planarization film 180. The first electrode 191 may be disposed in the light emitting portion (EA). The first electrode 191 may be connected to source / drain electrodes 171, 172 of a thin film transistor (TFT) through a contact hole penetrating the planarization film 180. FIG. 3 shows a configuration in which the first electrode 191 is connected to the source electrode 171 of the thin film transistor (TFT) through a contact hole.

[0051] The first electrode 191 may be formed of a metal, a metal alloy, or a combination of a metal and an oxide. For example, the first electrode 191 may be formed in a multi-layer structure including a transparent electrode layer made of a transparent conductive film and a reflective electrode layer made of an opaque conductive film with high reflection efficiency. The transparent electrode layer of the first electrode 191 is made of a material having a relatively large work function value, such as indium-tin oxide (ITO) or indium-tin oxide (IZO), and the reflective electrode layer is any one selected from the group consisting of silver (Ag), aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr), or tungsten (W). Alternatively, the first electrode 191 may be formed of a single layer or multiple layers of an alloy thereof. For example, the first electrode 191 may be formed in a structure in which a transparent electrode layer, a reflective electrode layer, and a transparent electrode layer are stacked in order, or a structure in which a transparent electrode layer and a reflective electrode layer are stacked in order. However, the present invention is not limited to this.

[0052] A bank layer 195 may be disposed on the first electrode 191 and the planarization film 180. The bank layer 195 includes a first bank layer 195a, a second bank layer 195b, and a third bank layer 195c, which will be described later. FIG. 3 shows a configuration in which the third bank layer 195c is disposed on the first electrode 191 and the planarization film 180. Although not shown in the figure, the first bank layer 195a and the second bank layer 195b may also be disposed on the first electrode 191 and the planarization film 180. The bank layer 195 may be disposed on the light-emitting portion (EA) and the transmissive portion (TA). In detail, FIG. 3 shows a configuration in which the third bank layer 195c is disposed so as to overlap the boundary portion between the light-emitting portion (EA) and the transmissive portion (TA).

[0053] According to an embodiment of the present invention, the bank layer 195 may be made of an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), etc. Alternatively, the bank layer 195 may be made of an organic material such as polyimide, acrylate, benzocyclobutene-based resin, etc. The bank layer 195 will be described in detail later.

[0054] An organic light-emitting unit 192 and a second electrode 193 constituting a light-emitting element can be disposed on the first electrode 191 and the bank layer 195. Fig. 3 shows a configuration in which the organic light-emitting unit 192 is disposed on the first electrode 191, the third bank layer 195c, and the planarization film 180. Fig. 3 also shows a configuration in which the second electrode 193 is disposed on the organic light-emitting unit 192 and the planarization film 180.

[0055] The organic light emitting unit 192 includes an R-organic light emitting layer that emits red light, a G-organic light emitting layer that emits green light, and a B-organic light emitting layer that emits blue light. Although not shown in the figure, the organic light emitting unit 192 may be formed with not only an organic light emitting layer, but also an electron injection layer and a hole injection layer that inject electrons and holes into the organic light emitting layer, respectively, and an electron transport layer and a hole transport layer that transport the injected electrons and holes to the organic light emitting layer, respectively. The organic light emitting layer may also be formed of a white organic light emitting layer that emits white light.

[0056] Referring to FIG. 3, the first electrode 191 is the anode of the organic light emitting unit 192, and the second electrode 193 is the cathode of the organic light emitting unit 192. When a voltage is applied between the first electrode 191 and the second electrode 193, electrons are injected from the first electrode 191 into the organic light emitting unit 192, and holes are injected from the second electrode 193 into the organic light emitting unit 192, generating light.

[0057] 3, the light emitting unit (EA) includes a first electrode 191, an organic light emitting unit 192, and a second electrode 193. In FIG 3, a configuration is shown in which the first electrode 191, the organic light emitting unit 192 on the first electrode 191, and the second electrode 193 on the organic light emitting unit 192 are arranged in the light emitting unit (EA).

[0058] 3, the transmissive portion (TA) includes an organic light emitting portion 192 and a second electrode 193. In FIG. 3, a configuration is shown in which the organic light emitting portion 192 on the planarization film 180 and the second electrode 193 on the organic light emitting portion 192 are disposed in the transmissive portion (TA). In particular, at least a portion of the second electrode 193 may be in contact with the planarization film 180.

[0059] More specifically, in the transmissive portion (TA), a portion of the organic light-emitting portion 192 remains on the side surface of the bank layer 195 and can be in contact with at least a portion of the planarization film 180. For example, in FIG. 3, a portion of the organic light-emitting portion 192 remains on the side surface of the third bank layer 195c and can be in contact with a portion of the planarization film 180.

[0060] According to an embodiment of the present invention, the light emitting portion (EA) includes a first bank layer 195a, a first light emitting cell (EA1), and a second light emitting cell (EA2).

[0061] In detail, the light emitting portion (EA) includes a first bank layer 195a, a first light emitting cell (EA1) contacting one side of the first bank layer 195a, and a second light emitting cell (EA2) contacting the other side of the first bank layer 195a. The first light emitting cell (EA1) and the second light emitting cell (EA2) are spaced apart with the first bank layer 195a in between. FIG. 2 shows a configuration in which the first light emitting cell (EA1) and the second light emitting cell (EA2) are spaced apart with the first bank layer 195a in between. Although not shown in the figure, in addition to the first light emitting cell (EA1) and the second light emitting cell (EA2), a third light emitting cell (EA3) and a fourth light emitting cell (EA4) may be included, and five or more light emitting cells may be included. Here, a first bank layer 195a may be included between each of the light emitting cells.

[0062] According to one embodiment of the present invention, the transmissive portion (TA) includes a second bank layer 195b, a first transmissive cell (TA1), and a second transmissive cell (TA2).

[0063] In detail, the transmissive part (TA) includes a second bank layer 195b, a first transmissive cell (TA1) contacting one side of the second bank layer 195b, and a second transmissive cell (TA2) contacting the other side of the second bank layer 195b. The first transmissive cell (TA1) and the second transmissive cell (TA2) are spaced apart with the second bank layer 195b in between. FIG. 2 shows a configuration in which the first transmissive cell (TA1) and the second transmissive cell (TA2) are spaced apart with the second bank layer 195b in between. Although not shown in the figure, in addition to the first transmissive cell (TA1) and the second transmissive cell (TA2), a third transmissive cell (TA3) and a fourth transmissive cell (TA4) may be included, and five or more transmissive cells may be included. Here, a second bank layer 195b may be included between each light emitting cell.

[0064] The transparent display device 100 according to the embodiment of the present invention includes a third bank layer 195c overlapping the boundary between the transmissive portion (TA) and the emissive portion (EA).

[0065] 2 shows a configuration in which the third bank layer 195c overlaps at least a part of the transmissive portion (TA) and at least a part of the emissive portion (EA). The third bank layer 195c is separated from the first bank layer 195a and the second bank layer 195b by sandwiching them therebetween. Although not shown in the figure, the third bank layer 195c may include third and fourth transmissive cells (TA3, TA4) and third and fourth emissive cells (EA3, EA4), and may include third bank layer 195c overlapping the boundaries between the third and fourth transmissive cells (TA3, TA4) and the third and fourth emissive cells (EA3, EA4).

[0066] That is, the bank layer 195 can include all of the first bank layer 195a, the second bank layer 195b, and the third bank layer 195c described in the previous embodiment.

[0067] According to one embodiment of the present invention, the first bank layer 195a and the second bank layer 195b may be aligned with each other (see FIG. 2).

[0068] FIG. 4 is a cross-sectional view taken along line II-II' of FIG. 2, showing a schematic shape of first bank layer 195a.

[0069] FIG. 5 is a cross-sectional view taken along line III-III' of FIG. 2, showing a schematic shape of the second bank layer.

[0070] Fig. 6 is a cross-sectional view taken along line IV-IV' in Fig. 2 to show a schematic shape of the third bank layer. The components of the thin film transistor (TFT) have been described in the previous figures and will be omitted here, and the first bank layer 195a, the second bank layer 195b and the third bank layer 195c disposed on the planarization film 180 will be described in detail with reference to Figs. 4 to 6.

[0071] According to one embodiment of the present invention, the first bank layer 195a may have a positive taper shape. In detail, Fig. 4 shows a configuration in which the first bank layer 195a has a positive taper shape. More specifically, the first bank layer 195a having a positive taper shape has a shape in which the width increases toward the tip, and the lower side of the tip protrudes more than the upper side.

[0072] According to another embodiment of the present invention, the second bank layer 195b may have an inverted tapered shape. In detail, Fig. 5 shows a configuration in which the second bank layer 195b has an inverted tapered shape. More specifically, the second bank layer 195b having an inverted tapered shape has a shape in which the width becomes narrower toward the tip, and the upper side of the tip protrudes more than the lower side.

[0073] According to another embodiment of the present invention, the third bank layer 195c may have a positive taper shape. In detail, Fig. 6 shows a configuration in which the third bank layer 195c has a positive taper shape. More specifically, the third bank layer 195c having a positive taper shape has a shape in which the width gradually increases toward the tip, and the lower side of the tip protrudes more than the upper side.

[0074] According to an embodiment of the present invention, the third bank layer 195c overlaps the boundary between the transmissive portion (TA) and the emissive portion (EA) to separate the transmissive portion (TA) and the emissive portion (EA). In addition, the third bank layer 195c is disposed at the boundary between the transmissive portion (TA) and the emissive portion (EA) to block or prevent overflow of an organic emissive material when ink-jetting an organic emissive material into the emissive portion (EA) and the transmissive portion (TA), and to block or prevent overflow of a solvent from the transmissive portion (TA) to the emissive portion (EA) when a solvent is added to the organic emissive portion 192 of the transmissive portion (TA), thereby ensuring stability of the device.

[0075] According to an embodiment of the present invention, when the first bank layer 195a has a positive taper shape and the second bank layer 195b has an inverse taper shape, the taper directions of the first bank layer 195a and the second bank layer 195b can be reversed. Therefore, in addition to the third bank layer 195c, when an organic light emitting material is ink-jetted into the emission section (EA) and the transmission section (TA), the effect of blocking or preventing overflow of the organic light emitting material can be improved, and when a solvent is added to the organic light emitting section 192 of the transmission section (TA), the solvent in the transmission section (TA) can be blocked or prevented from overflowing into the emission section (EA), ensuring the stability of the device.

[0076] According to an embodiment of the present invention, the first bank layer 195a may be hydrophobic. In particular, the first bank layer 195a may be formed of an organic insulating material or an inorganic insulating material, and the surface of the first bank layer 195a may be hydrophobic surface-treated. For example, a mixture of a fluoride gas, such as CF4 or C2F6, and an Ar gas may be turned into plasma, and then the surface of the first bank layer 195a may be plasma-treated with the plasma, thereby increasing the contact angle of the first bank layer 195a and making the surface of the first bank layer 195a hydrophobic.

[0077] In addition, an additive such as a hydrophobic polymer may be added to the organic insulating material for forming the first bank layer 195a so that the surface of the first bank layer 195a has hydrophobicity. Here, the embodiment for making the first bank layer 195a hydrophobic is not limited thereto, and other methods may be used.

[0078] According to one embodiment of the present invention, the second bank layer 195b may be hydrophobic. The second bank layer 195b may be hydrophobic in a manner similar to that of the first bank layer 195a. However, one embodiment of the present invention is not limited thereto, and the second bank layer 195b may be hydrophobic in a manner different from that of the first bank layer 195a.

[0079] According to one embodiment of the present invention, since the first bank layer 195a and the second bank layer 195b are hydrophobic, the organic light-emitting material is not present on the upper surfaces or inclined side surfaces of the first bank layer 195a and the second bank layer 195b, but is formed only in the etched areas, i.e., the first electrode 191 or the planarization film 180.

[0080] According to an embodiment of the present invention, the third bank layer 195c may have hydrophilic properties. In particular, the surface of the third bank layer 195c may be made hydrophilic by coating the third bank layer 195c with a photosensitive material having hydrophilic properties, such as polyimide or acrylic, using a coating device (not shown).

[0081] According to an embodiment of the present invention, the third bank layer 195c has hydrophilicity and therefore may not impede the spread of the organic light emitting material. More specifically, the hydrophilicity of the third bank layer 195c allows the organic light emitting material to spread evenly in the vertical direction.

[0082] FIG. 7 is a perspective view that diagrammatically illustrates region B in FIG.

[0083] 7 shows a first bank layer 195a, a second bank layer 195b, and a third bank layer 195c. In detail, the first bank layer 195a has a positive taper shape, the second bank layer 195b has a reverse taper shape, and the third bank layer 195c has a positive taper shape.

[0084] 7, the first bank layer 195a has a shape in which the width of the bottom surface of the first bank layer 195a narrows and the width of the top surface of the first bank layer 195a increases toward the third bank layer 195c, and the second bank layer 195b has a shape in which the width of the bottom surface of the second bank layer 195b increases and the width of the top surface of the second bank layer 195b increases toward the third bank layer 195c.

[0085] FIG. 8A is a cross-sectional view taken along line II-II' of FIG. 2, showing another embodiment of the first bank layer.

[0086] FIG. 8B is a cross-sectional view taken along line III-III' of FIG. 2 for illustrating another embodiment of the second bank layer.

[0087] The bank layer 195 may have a double layer structure. According to an embodiment of the present invention, the first bank layer 195a includes a first layer 201a and a second layer 202a. In detail, Fig. 8A shows the first bank layer 195a including a first layer 201a and a second layer 202a disposed on the first layer 201a. The first layer 201a may include a hydrophilic material, and the second layer 202a may include a hydrophobic material.

[0088] Because first layer 201a of first bank layer 195a is hydrophilic, a force attracting the organic light-emitting material acts on the side surface of first layer 201a of first bank layer 195a, causing the organic light-emitting material to spread well on the surface of first electrode 191 and to be in contact with the side surface of first layer 201a of first bank layer 195a.

[0089] In addition, since the second layer 202a of the first bank layer 195a has hydrophobicity, the side surface of the second layer 202a of the first bank layer 195a has a tendency to push out the organic light-emitting material, thereby blocking or preventing overflow. Therefore, since the first bank layer 195a of the light-emitting section (EA) has a double film structure having hydrophobicity and hydrophilicity, the aperture ratio or transmittance of the light-emitting section (EA) can be improved and the overflow of the organic light-emitting material can be prevented or suppressed.

[0090] According to one embodiment of the present invention, the second bank layer 195b includes a first layer 201b and a second layer 202b. In detail, Fig. 8B shows a configuration in which the second bank layer 195b includes a first layer 201b and a second layer 202b disposed on the first layer 201b. The first layer 201b may include a hydrophilic material, and the second layer 202b may include a hydrophobic material. Details overlapping with the first bank layer 195a will be omitted.

[0091] The second bank layer 195b has a double-layer structure having hydrophobic and hydrophilic properties, thereby improving the aperture ratio or transmittance of the transmissive portion (TA) and preventing or suppressing overflow of the organic light-emitting material.

[0092] Fig. 9 is a plan view showing another embodiment of the pixel arranged in Fig. 1, and Fig. 10 is a cross-sectional view taken along line VV' in Fig. 9. Hereinafter, overlapping content will be omitted.

[0093] According to another embodiment of the present invention, the transmissive part (TA) may include a transparent film 196. FIG. 9 shows a configuration in which the transmissive part (TA) further includes the transparent film 196. In detail, the transparent film 196 is disposed on a first transmissive cell (TA1) of the transmissive part (TA). However, the embodiment of the present invention is not limited thereto, and the transparent film 196 may be disposed on a second transmissive cell (TA2) of the transmissive part (TA), or may be disposed on the first transmissive cell (TA1) and the second transmissive cell (TA2) simultaneously.

[0094] 9 and 10, the transparent film 196 is disposed apart from the second bank layer 195b. However, the arrangement and structure of the transparent film 196 according to other embodiments of the present invention are not limited thereto.

[0095] According to another embodiment of the present invention, the transparent film 196 may be hydrophilic or hydrophobic, and may include a material with high transparency in a configuration disposed on the transmissive portion (TA).

[0096] According to another embodiment of the present invention, in order to increase the transmittance of the transmissive portion (TA), the organic light emitting portion 192 needs to remain on the side of the second bank layer 195b. In particular, the organic light emitting portion 192 needs to be pushed out to the side of the second bank layer 195b. The process of removing the organic light emitting portion 192 and leaving it on the side of the second bank layer 195b is shown in the right diagrams of Figures 11J to 11L.

[0097] 10, a second electrode 193 may be disposed on the second bank layer 195b and the transparent film 196. In detail, the second electrode 193 is disposed on the second bank layer 195b, the organic light emitting portion 192, the planarization film 180, and the transparent film 196.

[0098] According to another embodiment of the present invention, when the transparent film 196 has hydrophilicity, it may include a hydrophilic material. For example, the hydrophilic material may be poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) or transparent conductive oxide, which may include any one of IGZO (InGaZnO)-based, ITO (InSnO)-based, FTO (FSnO)-based, and ZO (ZnO). However, the embodiment of the present invention is not limited thereto. When the transparent film 196 has hydrophilicity, the organic light emitting unit 192 may remain only on the side of the second bank layer 195b through bending of each layer stacked under the transparent film 196.

[0099] According to another embodiment of the present invention, when the transparent film 196 has hydrophobicity, it may include a hydrophobic material. For example, the hydrophobic material may include any one of polythiophene, polyaniline, and carbon nanotubes. When the transparent film 196 has hydrophobicity, the organic light emitting units 192 are gathered toward the second bank layer 195b, and the transmittance or aperture ratio of the transmissive unit (TA) may be improved.

[0100] A method for manufacturing the transparent display device 100 according to an embodiment of the present invention will now be described.

[0101] According to an embodiment of the present invention, a method for manufacturing a transparent display device 100 may include forming a thin film transistor (TFT) on a substrate 110, forming a planarization film 180 on the thin film transistor (TFT), forming a first electrode 191 on the planarization film 180 in an area overlapping with an emission unit (EA), forming a bank layer 195 on the planarization film 180 and the first electrode 191, forming an organic emission unit 192 on the first electrode 191, the bank layer 195, and the planarization film 180, adding a solvent to the organic emission unit 192 disposed in an area overlapping with a transmission unit (TA) and exposing the planarization film 180 by a vaporizing process, and forming a second electrode 193 on the organic emission unit 192 and the exposed planarization film 180. Descriptions of each component will be omitted to avoid duplication.

[0102] 11A to 11M are process diagrams of a method for manufacturing the transparent display device 100 according to the embodiment of FIG. 2 of the present invention. In detail, the left diagrams of FIG. 11A to 11M are process diagrams for explaining the manufacturing method in the region overlapping with the first bank layer 195a, which corresponds to the cross-sectional view cut along II-II' in FIG. 2. The right diagrams of FIG. 11A to 11I are process diagrams for explaining the manufacturing method in the region overlapping with the second bank layer 195b, which corresponds to the cross-sectional view cut along III-III' in FIG. 2. In FIG. 11A to 11I, the manufacturing steps on the left and right sides proceed simultaneously. Here, the step of forming a thin film transistor (TFT) is omitted in FIG. 11A to 11I.

[0103] Referring to the left side of Fig. 11A, a bank material 197 is deposited on a first electrode 191 of the emission area (EA). Referring to the right side of Fig. 10A, a bank material 197 is deposited on a planarization film 180 of the transmission area (TA).

[0104] Referring to the left side of Fig. 11B, a first photoresist material 198a is patterned on the bank material 197 of the emission area (EA). Referring to the right side of Fig. 11B, a first photoresist material 198a is patterned on the bank material 197 of the transmission area (TA).

[0105] Referring to the left side of Fig. 11C, the bank material 197 in the EA portion is etched to expose the first electrode 191 in the EA portion. Referring to the right side of Fig. 11C, the bank material 197 in the TA portion is etched to expose the planarization film 180 in the TA portion.

[0106] Referring to the left side of Fig. 11D, the first photoresist material 198a in the light emitting portion (EA) is removed, and the bank material 197 is formed in a positive tapered shape. Referring to the right side of Fig. 11D, the first photoresist material 198a in the light transmitting portion (TA) is removed, and the bank material 197 is formed in a positive tapered shape.

[0107] Referring to the left side of Fig. 11E, a second photoresist material 198b is deposited on the bank material 197 from which the first photoresist material 198a in the light emitting portion (EA) has been removed. Referring to the right side of Fig. 11E, a second photoresist material 198b is deposited on the bank material 197 from which the first photoresist material 198a in the transmissive portion (TA) has been removed.

[0108] Referring to the left side of Fig. 11F, the second photoresist material 198b of the light emitting portion (EA) is not exposed to light, whereas referring to the right side of Fig. 11F, the second photoresist material 198b of the transmissive portion (TA) is exposed to light.

[0109] Referring to the left side of Fig. 11G, the second photoresist material 198b in the light emitting portion (EA) is not patterned, whereas referring to the right side of Fig. 11G, the second photoresist material 198b in the transmissive portion (TA) is patterned.

[0110] Referring to the right side of FIG. 11H, the bank material 197 in the transmissive portion (TA) is etched to form the bank material 197 in an inverse tapered shape.

[0111] Referring to the left side of Fig. 11I, the second photoresist material 198b in the light emitting portion (EA) is removed to form the first bank layer 195a having a positive taper shape, and referring to the right side of Fig. 11I, the second photoresist material 198b in the light transmitting portion (TA) is removed to form the second bank layer 195b having a reverse taper shape.

[0112] 11J, an organic light emitting unit 192 is formed on a first electrode 191. Referring to the left side of FIG.

[0113] Referring to the right side of FIG. 11K, a solvent is added onto the organic light-emitting portion 192.

[0114] Referring to the right side of FIG. 11L, the planarization layer 180 of the organic light emitting unit 192 to which the solvent is added is exposed from the organic light emitting unit 192 during a vaporizing process.

[0115] Referring to the left side of Fig. 11M, a second electrode 193 is formed on the first bank layer 195a and the organic light emitting portion 192 in the light emitting portion (EA). Referring to the right side of Fig. 11M, a second electrode 193 is formed on the second bank layer 195b and the planarization film 180 in the transmissive portion (TA).

[0116] 12A to 12C are process diagrams of a process of forming a bank layer 195 according to the embodiment of FIG. 2 of the present invention. Here, FIG. 12A to FIG. 12C show in plan views a process of forming a bank layer 195 according to the embodiment of FIG. 2 of the present invention. Moreover, the bank layer 195 formed according to FIG. 12A to FIG. 12C can include the first bank layer 195a, the second bank layer 195b, and the third bank layer 195c of FIG. 4 to FIG. 6. Here, the bank layer 195 formed according to FIG. 12A to FIG. 12C has a single-layer structure.

[0117] 12A, a positively tapered first bank layer 195a is formed on the light-emitting area (EA), and a positively tapered second bank layer 195b is formed on the light-transmitting area (TA). Here, the positively tapered first bank layer 195a and second bank layer 195b are formed through the manufacturing process shown in FIGS. 11A to 11D. In addition, the first bank layer 195a and the second bank layer 195b may be hydrophobic.

[0118] 12B, a second bank layer 195b having an inverse tapered shape is formed on the transmissive portion (TA). Here, the second bank layer 195b having an inverse tapered shape is formed through the manufacturing steps shown in FIGS. 11E to 11I.

[0119] 12C, a third bank layer 195c is formed in an area overlapping the boundary between the transmissive section (TA) and the emissive section (EA). Here, the third bank layer 195c has a positive tapered shape, and is formed through the manufacturing process shown in Figures 11A to 11D. In addition, the third bank layer 195c may have hydrophilic properties.

[0120] According to an embodiment of the present invention, a step of forming a transparent film 196 may be further included between the step of forming the bank layer 195 and the step of forming the organic light emitting portion 192 .

[0121] 13A to 13F are process diagrams of a process for forming a transparent film according to an embodiment of the present invention, and the cross sections of Fig. 13A to 13F correspond to the cross section of VV' in Fig. 9.

[0122] 13A, a transparent film material 196a is added onto the planarization film 180 of the transmissive portion (TA). The transparent film material 196a is laminated on the transmissive portion (TA) and may include a material with high transparency.

[0123] Referring to FIG. 13B, a step of vacuum drying the transparent film material 196a disposed on the planarization film 180 may be included.

[0124] 13C, a step of thermally curing the dried transparent film material 196a can be included. Transparent film 196 is formed through the steps of FIGS. 13A to 13C.

[0125] Referring to FIG. 13D, an organic light emitting portion 192 is formed on the manufactured transparent film 196 .

[0126] 13E, a process may include adding a solvent to the organic light emitting portion 192 and exposing the planarization film 180 from the organic light emitting portion 192 through a vaporizing process. The vaporizing process is described with reference to FIGS. 12K and 12L.

[0127] 13F, a second electrode 193 is formed on the organic light emitting portion 192, the second bank layer 195b and the transparent film 196. As shown in FIG.

[0128] According to an embodiment of the present invention, since a large amount of liquid solvent is contained in the transparent film material 196a, a vacuum drying and a baking process are required to volatilize the solvent contained in the transparent film material 196a and to strengthen the cross-linking inside the transparent film material 196a to stabilize the film. The transparent film 196 is formed through the vacuum drying and baking processes.

[0129] According to an embodiment of the present invention, a solvent is added to the organic light emitting unit 192, and a vaporizing process is performed to remove the organic light emitting unit 192 and expose the planarization layer 180. As a result, the organic light emitting unit 192 disposed in the transmissive portion (TA) is removed, and the transmittance or aperture ratio of the transmissive portion (TA) can be improved.

[0130] According to an embodiment of the present invention, the solvent added to the organic light emitting unit 192 may include at least one of 4-ethylene glycol, DEGBE (dethylene glycol monobutyl ether), TEGME (triethylene glycol monomethyl ether), DEGEE (distyrene glycol monoethyl ether), TPGME (tri(propylene glycol) methyl ether), TEG (tetraethylene glycol), EGHE (ethylene glycol monohexyl ether), DPPPE (dipropylene glycol mono-n-propyl ether), DEGBME (distyrene glycol monobutyl ether), 1-PH-2-Pol, carvacrol, 3-MBAol (3-methoxybutyl acetate), TEGEE (triethylene glycol monoethyl ether), TEGIPE (triethylene glycol monopropyl ether), TTEGME (tetraethylene glycol monomethyl ether), and DEGHE (diethylene glycol monohexyl ether).

[0131] The present invention described above is not limited by the above-mentioned embodiments and the accompanying drawings, and various substitutions, modifications and changes are possible within the scope of the technical subject of the present invention, which will be apparent to those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention is indicated by the claims below, and all modifications or alterations derived from the meaning, scope and equivalent concept of the claims should be interpreted as being included in the scope of the present invention. [Explanation of symbols]

[0132] 100: Transparent display device 101: Transparent display panel EA: Light emitting part TA: Transparent part EA1, EA2: 1st and 2nd light emitting cells TA1, TA2: 1st and 2nd transmission cells 110: Substrate 120: Buffer layer 130: Active layer 140: Gate insulating film 150: Gate electrode 160: Interlayer insulating film 171: Source electrode 172: Drain electrode 180: Flattening film 191: 1st electrode 192: Organic light-emitting section 193:Second electrode 195: Bank layer 195a: 1st bank layer 195b: 2nd bank layer 195c: 3rd bank layer 196: Transparent film 196a:Transparent membrane material 197: Bank material 198a: First photoresist material 198b: second photoresist material 199: Organic luminescent materials 201a, 201b: 1st layer 202a, 202b: 2nd layer

Claims

1. a substrate having a transmissive portion and a luminescent portion; The light emitting unit is A first bank layer; a first light emitting cell in contact with one side of the first bank layer; a second light emitting cell in contact with the other side of the first bank layer; The first light emitting cell and the second light emitting cell are spaced apart from each other with the first bank layer therebetween, The transmission portion is A second bank layer; a first transmission cell in contact with one side of the second bank layer; a second transmission cell in contact with the other side of the second bank layer; the first transmission cell and the second transmission cell are spaced apart from each other with the second bank layer therebetween; a third bank layer overlapping a boundary between the transmissive portion and the luminescent portion, the first bank layer and the third bank layer have a positive tapered shape, the second bank layer has an inverse tapered shape, A transparent display device, wherein, in a plan view, the first bank layer and the second bank layer are arranged in a straight line with each other, and an end of the first bank layer and an end of the second bank layer overlap each other.

2. The transparent display of claim 1 , wherein the first bank layer comprises a hydrophobic material.

3. The transparent display device of claim 1 , wherein the second bank layer comprises a hydrophobic material.

4. The transparent display device of claim 1 , wherein the third bank layer comprises a hydrophilic material.

5. The transparent display device of claim 1 , wherein the third bank layer is spaced apart from and sandwiches the first bank layer and the second bank layer.

6. The transparent display device of claim 1 , wherein the light-emitting portion comprises a first electrode, an organic light-emitting portion, and a second electrode.

7. The transparent display device of claim 1 , wherein the transmissive portion includes an organic light-emitting portion and a second electrode.

8. a thin film transistor on the substrate; a planarization film on the thin film transistor; The transparent display device according to claim 7 , wherein at least a portion of the second electrode in the transmissive portion is in contact with the planarization film.

9. The transmission portion further includes a transparent film, The transparent display device according to claim 1 , wherein the transparent film is disposed on the transmissive portion.

10. the first bank layer comprises a first layer and a second layer on the first layer; the first layer comprises a hydrophilic material; The transparent display device of claim 1 , wherein the second layer comprises a hydrophobic material.

11. the second bank layer comprises a first layer and a second layer on the first layer; the first layer comprises a hydrophilic material; The transparent display device of claim 1 , wherein the second layer comprises a hydrophobic material.

12. A transparent display device as described in Claim 7, wherein the organic light-emitting portion remains on a side of the third bank layer in the transmissive portion.

13. A thin film transistor comprising an active layer and a gate electrode; a planarization film disposed on the thin film transistor; The transparent display device according to claim 6 , wherein the first electrode is disposed on the planarization film.

Images