Contactless card and assembly method

Abstract

A method for forming a contactless transaction card includes providing a card body defining a window and attaching an antenna assembly layer to the card body. The antenna assembly may include an antenna, a pair of curable connectors disposed at a pair of end regions of the antenna within the window, and a UV-transparent layer supporting the antenna. The method includes providing a contactless chip module within the window on a first side of the antenna assembly layer and applying radiation through the UV-transparent layer. The contactless chip module is electrically connected to the antenna by the curable connector.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. Patent Application No. 16 / 731,337, entitled "CONTACTLESS CARD AND METHOD OF ASSEMBLY," filed December 31, 2019, the contents of which are incorporated herein by reference in their entirety. [Technical field]

[0002] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate to transaction cards, and more particularly, to transaction cards having a metal body. [Background technology]

[0003] Generally, transaction cards such as smart credit / debit cards, access cards, EMV cards, etc., may include components such as electronic chips to perform memory storage, computational, or communication functions. Transaction cards with electronic chips generally include an area for embedding the electronic chip on or near the surface of the card. Such cards may or may not have contactless capabilities. Contactless capabilities allow for wireless communication using radio frequency (RF) signals provided by wireless communication capabilities built into the contactless card.

[0004] Metal transaction cards, such as metal credit cards, have become increasingly popular in recent years. Because the body of a metal credit card is conductive, there are various difficulties in manufacturing a metal credit card, especially for contactless cards that incorporate a conductive antenna, such as a coil. One approach is to laminate a coil onto one side of a metal card. When assembling a plastic transaction card, a layer stack formed of a front layer, a back layer, and a coil may be preassembled, whereby an electronic chip may be placed on the preassembled layer stack and bonded to other components of the card using a conductive material. However, this bonding approach is somewhat imprecise and does not present a robust approach to forming a metal contactless card, as the metal card body may come into accidental contact with the conductive material.

[0005] In view of the above discussion, the present embodiment is provided. Summary of the Invention

[0006] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended as an aid in determining the scope of the claimed subject matter.

[0007] In one embodiment, a method of forming a contactless transaction card is provided. The method includes providing a card body defining a window and attaching an antenna assembly layer to the card body. Wherein the antenna assembly may include an antenna, a set of curable connectors disposed at a set of end regions of the antenna within the window, and a UV transparent layer supporting the antenna. The method includes providing a contactless chip module within the window on a first side of the antenna assembly layer, and applying radiation through the UV transparent layer. Wherein the contactless chip module is electrically connected to the antenna by the curable connector.

[0008] In a further embodiment, a contactless transaction card is provided. The contactless transaction card may include a card body defining a window and an antenna assembly layer disposed adjacent to the card body. Wherein the antenna assembly layer includes an antenna including a pair of end regions, a UV transmissive layer supporting the antenna, and a pair of curable connectors disposed at the pair of end regions. The pair of end regions and the pair of curable connectors may be disposed within the window. The contactless transaction card may further include a contactless chip module disposed within the window and electrically connected to the pair of end regions by the pair of curable connectors.

[0009] In another embodiment, a method of forming a contactless transaction card may include providing a card body defining a window and coupling an antenna assembly layer to the card body, where the antenna assembly layer includes an antenna and a transparent layer supporting the antenna. The method may include providing a first curable connector at a first end region of the antenna and providing a second curable connector at a second end region of the antenna, where the first end region, the second end region, the first curable connector, and the second curable connector are disposed within the window. The method may further include providing a contactless chip module within the window on a first side of the transparent layer and irradiating radiation through the transparent layer from a second side of the transparent layer opposite the first side. In this manner, the contactless chip module may be electrically connected to the antenna by the first curable connector and the second curable connector. [Brief description of the drawings]

[0010] The accompanying drawings illustrate exemplary approaches of the present disclosure, including practical applications of its principles, as follows:

[0011] [Figure 1] FIG. 2 is a top view of a contactless card according to an embodiment of the present disclosure. [Diagram 2] 2 is a side exploded view of a variation of the contactless card of FIG. 1 in accordance with an embodiment of the present disclosure. [Diagram 3]2 is a side exploded view of another variation of the contactless card of FIG. 1 in accordance with an embodiment of the present disclosure. [Figure 4A] FIG. 2 is a top view illustrating antenna assembly layers according to some embodiments of the present disclosure. [Figure 4B] FIG. 13 is a top view showing details of an end region of an antenna according to an embodiment of the present disclosure. [Diagram 5] 1 is a side exploded view of an example of a contactless card during manufacture according to an embodiment of the present disclosure; FIG. [Figure 6] 6 is a top perspective view of a portion of the contactless card in the example of FIG. 5 according to an embodiment of the present disclosure. [Figure 7] 1 shows a flowchart for performing a method according to an embodiment of the present disclosure. [Figure 8] 4 shows another flowchart for carrying out a method according to an embodiment of the present disclosure. [Figure 9] 4 shows another flowchart for carrying out a method according to an embodiment of the present disclosure.

[0012] The drawings are not necessarily to scale. The drawings are merely representational and are not intended to depict specific parameters of the present disclosure. The drawings are intended to depict example embodiments of the present disclosure and therefore are not to be considered limiting in scope. In the drawings, like numbering represents like elements.

[0013] Additionally, certain elements in some figures may be omitted or drawn to scale for illustrative clarity. Cross-sectional views may be in the form of "slices" or "myopic" cross-sections by omitting certain background lines visible in a "true" cross-sectional view for clarity of illustration. Additionally, some reference numbers may be omitted in certain figures. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The present embodiments will now be described more fully with reference to the accompanying drawings, in which several embodiments are shown. The subject matter of the present disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the subject matter to those skilled in the art. In the drawings, like numerals refer to like elements throughout.

[0015] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present embodiments are directed to contactless transaction cards that include an electronic or semiconductor chip module and an antenna, and may be suitable, for example, for transaction cards having a metallic or other conductive body.

[0016] Figure 1 is a top view of a contactless card 100 arranged in accordance with an embodiment of the present disclosure, Figure 2 is a side exploded view of a variation of the contactless card of Figure 1 in accordance with an embodiment of the present disclosure, and Figure 3 is a side exploded view of another variation of the contactless card of Figure 1 in accordance with an embodiment of the present disclosure.

[0017] As used herein, the term contactless card may refer to a transaction card such as a credit card, debit card, or other card. A contactless card may include electronic components, such as a semiconductor chip or semiconductor chip module, and circuitry for wireless communication, such as an antenna. In various embodiments, the contactless cards detailed herein may be arranged in accordance with SO / IEC 7816, an international standard for electronic identification cards with contacts, where this standard is jointly maintained by the International Organization for Standardization (ISO) and the International Electrotechnical Commission (IEC).

[0018] For example, as shown in FIG. 2, the contactless card 100 may be disposed with a card body 102. According to various embodiments, the card body 102 may be formed of a metallic material. In these embodiments, the contactless card 100 may be considered a metallic contactless card. In general, the card body of the contactless card of the present embodiment may constitute a relatively thick layer of the transaction card, as opposed to other layers that are laminated together with the card body to form a complete contactless card. As shown in FIG. 1, for example, the contactless card 100 includes a window 104 that represents an opening or recess for receiving an electronic chip module. The module may include an electronic chip and packaging, such as contacts for electrically coupling with an external component. In the embodiment of FIGS. 1-3, the electronic chip module is configured to contact, for example, an antenna, and is referred to herein as a contactless chip module 140. The contactless card 100 may include an antenna assembly layer 106. This layer is attached to the card body 102 after assembly. The antenna assembly layer 106 may include an antenna 110, a pair of curable connectors 112 disposed on a pair of end regions of the antenna 110 within the window 104, and a UV transparent layer 109 that supports the antenna 110. The pair of end regions are shown as serpentine regions located at opposing ends of the antenna 110. In various embodiments, these components of the antenna assembly layer 106 may be assembled together prior to attachment to other components of the contactless card 100, as described in more detail below.

[0019] As shown in Figure 2, contactless card 100 may include a contactless chip module 140 located within window 104 and on a first side of antenna assembly layer 106. First side 111 is the upper side in Figure 2. When fully assembled, contactless chip module 140 may be electrically connected to a set of end regions via a set of hardenable connectors 112. For example, electronic chip module 140 may include a semiconductor die (not shown separately) and a set of contacts or conductors that contact hardenable connectors 112.

[0020] 1, the hardenable connector 112 may reside within the window 104 such that it does not contact the card body 102. Thus, if the card body 102 is a metallic body, the hardenable connector 112 and the antenna 110 will not be electrically shorted. As further shown in FIG. 2, the contactless chip module 140 may reside within the window 104 such that it does not electrically contact the card body 102 at the edge 114 of the window 104.

[0021] Notably, the antenna 110 may be disposed on the first surface 111 of the UV-transparent layer 109 facing the card body 102, while an insulating material, meaning an electrically insulating material, may be disposed between the antenna 110 and the card body 102 in an outer region of the antenna 110 that is outside the window 104. In one example, the antenna 110 may be formed of a metal core covered with an insulating coating. Thus, when the card body 102 is bonded and assembled to the UV-transparent layer 109, the metal core of the antenna 110 is still electrically insulated from the card body 102, preventing any electrical short circuit between the antenna 110 and the card body 102 in embodiments where the card body 102 is formed of a metallic material.

[0022] As further shown in Figures 1 and 2, the UV transparent layer 109 may define a recess 108. As shown in Figure 2, the recess 108 is aligned within the window 104, such as being centered within the window 104. As shown in Figure 2, the window 104 defines a first area (A1, the area within the dotted line, where the area is defined in the XY plane of the Cartesian coordinate system shown in Figure 1), and the recess 108 defines a second area (A2, the area within the solid line) that is smaller than the first area. Notably, the contactless chip module 140 defines a third area (A3) that is intermediate in size between the first and second areas.

[0023] 3 illustrates another embodiment of a contactless card 150, where the contactless card 150 includes various components of the contactless card 100, as previously described. In this embodiment, an electrically insulating layer, shown as layer 152, is disposed between the antenna assembly layer 106 and the card body 102 and provides electrical insulation between the antenna 110 of the antenna assembly layer 106 and the card body 102. Notably, the layer 152 includes an opening to form a portion of the window 104 in the area of ​​the contactless chip module 140, which may accommodate the contactless chip module 140 for connection to the antenna 110.

[0024] When contactless chip module 140 is bonded to antenna assembly layer 106 to assemble contactless card 100 or contactless card 150, contactless chip module 140 may be aligned within window 104, such as generally centered within window 104. Thus, when assembled, in the embodiment of Figures 2 and 3, contactless chip module 140 is disposed within window 104 without contacting card body 102 and makes electrical contact with antenna 110 by way of curable connector 112.

[0025] To further illustrate the geometry for assembling a contactless card, FIG. 4A is a top view showing details of the antenna assembly layer 106 according to some embodiments of the present disclosure. In this view, a portion of the antenna assembly layer 106 is shown within the window 104, as well as an outer portion 116 of the antenna assembly layer 106 adjacent the card body 102, as previously described. The antenna 110 may define any suitable shape, as generally shown in FIG. 4A. As shown, at two different end regions, the antenna 110 terminates within the window 104. In particular, the end region 122 and the end region 124 of the antenna 110 are disposed towards opposite sides of the window 104. In embodiments in which the UV-transparent layer 109 includes a recess 108, the end region 122 and the end region 124 may be disposed on opposite sides of the recess 108.

[0026] In certain embodiments, a set of end regions of the antenna, such as end region 122 and end region 124, may be arranged in a serpentine pattern (as shown in FIG. 4A), a spiral pattern, or other patterns. As further shown in FIG. 4A, a first curable connector 132 and a second curable connector 134 are disposed on end region 122 and end region 124, respectively. Additionally, first curable connector 132 extends partially over end region 122 of antenna 110 and partially over the exposed region of UV transparent layer 109.

[0027] In particular, as shown in the detailed view of FIG. 4B, the serpentine pattern of end region 122 or end region 124 defines an open area of ​​UV transparent layer 109 that is not covered by antenna 110. Thus, a first region 136 of first curable connector 132 or second curable connector 134 will be located directly on the material, which may be an opaque metal wire or foil, of antenna 110. A second region 138 of first curable connector 132 or second curable connector 134 will be located directly on the exposed area of ​​UV transparent layer 109. These second regions 138 will be directly exposed to light, such as UV radiation and / or visible radiation, that is directed toward the underside of UV transparent layer 109, i.e., the side opposite first side 111 as defined above.

[0028] To facilitate assembly of the contactless card 100 or the contactless card 150, for example, the curable connector 112 (shown as the first curable connector 132 and the second curable connector 134 in FIG. 4A ) may be formed of a conductive adhesive. Examples of suitable conductive adhesives according to this embodiment include conductive epoxy materials, or similar conductive composites. The conductive adhesive may be applied onto the end regions 122 and 124 as dots or similarly shaped objects, as suggested by the illustration in FIG. 4A . The first curable connector 132 and the second curable connector 134 may be positioned sufficiently away from the edge 114 of the window 104 such that when the card body 102 is brought into contact with the antenna assembly layer 106, the first curable connector 132 and the second curable connector 134 do not deform sufficiently to contact the edge 114 to avoid electrical connection between the antenna 110 and the card body 102.

[0029] 2 and 3, the above-described embodiments of the contactless card may be formed by a process in which the antenna assembly layer 106 is attached to the card body 102 by an optional layer disposed between the antenna assembly layer 106 and the card body, such as the embodiment of Fig. 3. In this manner, the window 104 already at least partially defined in the card body 102 will form a recess extending at least to the top surface of the antenna assembly layer 106.

[0030] The contactless chip module 140 may then be provided in the window 104 on the first surface 111 of the antenna assembly layer 106. The contactless chip module 140 may be brought into contact with the curable connector 112 (or the first curable connector 132, the second curable connector 134) and the curable connector 112 may be cured while in contact with the contactless chip module 140 in order to affix the contactless chip module to the contactless card and to electrically connect the contactless chip module to the antenna 110. In this manner, after curing, a mechanical bond and an electrical connection are established between the antenna 110 and the contactless chip module 140.

[0031] Advantageously, curing of the curable connector 112 may be accomplished by briefly exposing it to radiation through the UV transparent layer 109 while the contactless chip module 140 is in place within the window 104. The curable connector 112 may be formed of a chemical or set of chemicals that will compliantly harden when exposed to suitable radiation, such as ultraviolet light.

[0032] To illustrate this process, FIG. 5 shows a side exploded view of a contactless card. This shows an example of a contactless card during manufacture according to an embodiment of the present disclosure. FIG. 6 shows a top perspective view of the same operation depicted in FIG. 5, with the card body 102 removed for clarity. In the operation depicted in FIGS. 5 and 6, a light source, such as a laser source 160, is disposed on the lower surface 115 of the UV-transparent layer 109. In the example of FIG. 5, the laser source 160 is disposed to irradiate a laser beam 162 through the UV-transparent layer 109 to a pair of curable connectors 112 disposed on a first surface 111 of the UV-transparent layer 109. According to different embodiments, the laser source 160 may include, for example, two laser beams, such that two different laser beams, each beam shown as laser beam 162, are irradiated simultaneously to two different curable connectors. Thus, a first exposure, such as a first UV laser beam exposure, may be applied to a first curable connector of the pair of curable connectors 112, and a second exposure, such as a second UV laser beam exposure, may be applied to a second curable connector of the pair of curable connectors 112.

[0033] Alternatively, the laser source 160 may use only one laser to direct the laser beam 162 through the UV transparent layer 109, sequentially, to a first of the curable connectors 112 and then to a second of the curable connectors 112. According to various non-limiting embodiments, the wavelength of the radiation of the laser beam 162 may be in the ultraviolet range, such as about 400 nm or less. The wavelength may be selected to suit a given material of the curable connectors 112. For example, some known epoxies may be suitable for curing using radiation in the range of 320 nm to 380 nm. Thus, for example, if the curable connectors 112 are made from an epoxy that is curable in this wavelength range, the wavelength of the laser beam 162 may be set in the range of 320 nm to 380 nm. Of course, for epoxies or other curable materials suitable for curing in different wavelength ranges, the wavelength of the laser beam 162 may be in a different range. According to various non-limiting embodiments, the UV transparent layer 109 may transmit 5% or more, 10% or more, 20% or more, 50% or more of the radiation from the surface 115 to the first surface 111 for UV radiation within a range suitable for curing the curable connector 112, such as 400 nm or less. It should be noted that the transmittance of the UV transparent layer 109 suitable for curing the curable connector 112 depends on the epoxy or other material used in the curable connector and its sensitivity to radiation. In some instances, a lower transmittance may be compensated for by increasing the exposure time required for full cure. Also, the power of the laser beam 162 may be adjusted upward to accommodate the lower percentage transmittance.

[0034] Further, referring again to FIG. 4B, the serpentine pattern of the end regions 122, 124 may be arranged to provide a majority of the exposed area of ​​the curable connector 112, i.e., the area of ​​the second region 138 (A138). For example, the ratio of A138 to the total area (A136+138) of the first region 136 and the second region 138 may be greater than 10%, greater than 20%, greater than 30%, greater than 50%, in some non-limiting embodiments. Again, the power or duration of exposure for the laser beam 162 may be adjusted depending on the transmittance of the UV transparent layer 109, as well as the ratio of A138 / (A136+138). Thus, to cure the curable connector, the curable connector may be exposed for a time ranging from 0.1 seconds to several seconds. Of note, the cure time may vary depending on the energy intensity and the exact material of the curable connector. For example, curing with a mercury lamp source having an energy density in the range of 200 watts / inch may cure the curable connector in a time period ranging from a few seconds to a minute when placed at a distance of about 6-10 inches from the curable connector. Curing with a laser source provides a higher energy density and may result in curing in a time period ranging from a few tenths of a second to a few seconds, for example.

[0035] In an embodiment of a conductive adhesive material, such as a conductive epoxy, exposure to the laser beam 162 can rapidly harden the curable connector 112 to form a robust bond between the antenna 110 and the contactless chip module 140 via the curable connector 112. The UV irradiation results in a polymerization (curing) reaction that promotes adhesion between the antenna assembly layer 106 and the contactless chip module 140.

[0036] Because the curable connector is conductive, a conductive path is established between the antenna 110 and the contactless chip module 140. The exposure to the laser beam 162 may be of a sufficiently short duration that the curable connector 112 does not deform or expand excessively so that the curable connector 112 does not contact the edge 114 of the window 104 defined by the card body 102.

[0037] 1-3, according to some embodiments, during the process of bonding the contactless chip module 140 to the antenna 110, the recess 108 may accommodate a portion of the curable connector 112. Because the recess 108 is below a major surface of the UV transparent layer of the first face 111, the curable connector 112 under pressure may tend to deform into the recess 108 rather than toward the edge 114.

[0038] 7 illustrates a flowchart 700 for performing a method according to an embodiment of the present disclosure. At block 710, a card body of a transaction card is provided, the card body including a window. In some embodiments, the card body may be formed of a metallic material and the window extends through the card body.

[0039] At block 720, an antenna assembly layer is attached to the card body. The antenna assembly layer may include a thin transparent layer, such as a UV-transparent layer, that supports an antenna on a first side of the transparent layer. The antenna assembly layer may further include a pair of curable connectors disposed on end regions of the antenna. In various embodiments, the pair of curable connectors may be two curable connectors that are electrically conductive and that are disposed on opposing end regions of the antenna in an uncured state. Suitable materials for the pair of curable connectors include conductive epoxies or other conductive composites.

[0040] At block 730, the contactless chip module is disposed within a window on the first side of the antenna assembly layer. In various embodiments, the hardenable connectors may extend above the antenna. In this manner, the contactless chip module may be in direct contact with a set of hardenable connectors. The contactless chip module may include, for example, two electrical contacts that contact two respective hardenable connectors.

[0041] At block 740, once the contactless chip module is placed in the window, radiation is applied through the transparent layer from a second side of the antenna assembly layer opposite the first side. The radiation may comprise UV radiation, which cures the curable connectors and promotes adhesion between the curable connectors and the contactless chip module. In certain embodiments, the radiation may be applied as one or more laser beams characterized by electromagnetic waves in the ultraviolet range that impact each of the set of curable connectors. At least a portion of the curable connectors may be disposed directly on the UV transparent layer, and another portion is disposed on an end region of the antenna. In this manner, the curable connectors may be exposed to sufficient radiation to cause rapid curing. The contactless chip module now becomes electrically connected to the antenna by the set of curable connectors.

[0042] FIG. 8 illustrates another flowchart 800 for performing a method according to another embodiment of the present disclosure.

[0043] At block 810, an antenna assembly layer is provided that includes an antenna, a set of curable connectors disposed on the antenna, and a transparent layer supporting the antenna. In various embodiments, the set of curable connectors may be two curable connectors that are electrically conductive and disposed on opposing end regions of the antenna in an uncured state. Suitable materials for the set of curable connectors include conductive epoxies or other conductive composites.

[0044] At block 820, a contactless chip module is disposed on a first surface of the antenna assembly layer. A set of hardenable connectors may extend above a surface of the antenna such that the contactless chip module is in direct contact with the set of hardenable connectors. The contactless chip module may include, for example, two electrical contacts that contact two respective hardenable connectors.

[0045] At block 830, radiation is applied from the second side of the antenna assembly layer through the transparent layer, and the contactless chip module is electrically connected to the antenna by a set of curable connectors. The radiation may comprise UV radiation, which cures the curable connectors and promotes adhesion between the curable connectors and the contactless chip module. In certain embodiments, the radiation may be applied as one or more laser beams characterized by electromagnetic waves in the ultraviolet range that impact each of the set of curable connectors. In this manner, the curable connectors may undergo rapid curing. Here, the contactless chip module becomes electrically connected to the antenna by a set of curable connectors.

[0046] At block 840, a card body having a window is attached to the antenna assembly layer such that the contactless chip is disposed within the window and does not contact the card body. In other words, the card body may be positioned to align with the antenna assembly layer in a manner that positions the window around the contactless chip.

[0047] 9 illustrates another flowchart 900 for performing a method according to an embodiment of the present disclosure. At block 910, a metal card body is provided, the metal card body defining a chip window. The chip window may extend throughout the entire metal card body.

[0048] At block 920, an antenna assembly layer is aligned adjacent to the metal card body, the antenna assembly layer including an antenna and a transparent layer supporting the antenna. The antenna may include a first end region and a second end region such that alignment of the antenna assembly layer positions the first end region and the second end region within the chip window. In some embodiments, the antenna assembly layer may be bonded to the card body at this stage.

[0049] At block 930, a first curable connector is provided at a first end region of the antenna and a second curable connector is provided at a second end region of the antenna. The disposing of the first and second curable connectors at the first and second end regions, respectively, may occur when the first and second end regions are disposed within a window in the card body. The first and second curable connectors may be a conductive epoxy or other conductive composite.

[0050] At block 940, the contactless chip module is disposed over the first and second hardenable connectors in a manner such that the contactless chip module does not contact the metal card body. The contactless chip module may include a semiconductor chip and two electrical contacts that, for example, contact the first and second hardenable connectors when the contactless chip module is placed within the window of the metal card body.

[0051] In block 950, a laser (beam) is irradiated through the transparent layer to the first and second curable connectors to cure the first and second curable connectors. In some examples, the transparent layer may be a UV transparent layer and the laser may be formed with radiation having a wavelength in the UV range. In some non-limiting embodiments, the laser may expose the first and second curable connectors for a time period ranging from 0.1 seconds to several seconds. In this manner, the contactless chip module may be electrically connected to the antenna such that the first and second curable connectors do not contact the metal card body.

[0052] The foregoing discussion has been presented for purposes of illustration and description, and is not intended to limit the present disclosure to the forms disclosed herein. For example, various features of the present disclosure may be grouped together in one or more aspects, embodiments, or configurations for the purpose of streamlining the present disclosure. However, it should be understood that various features of a particular aspect, embodiment, or configuration of the present disclosure may be combined in alternative aspects, embodiments, or configurations. Moreover, the following claims are hereby incorporated by reference into this detailed description, with each claim standing on its own as a separate embodiment of the present disclosure.

[0053] As used herein, elements or steps described in the singular and preceded by the terms "a" or "an" should be understood not to exclude a plurality of elements or steps, unless such exclusion is expressly stated. Moreover, references to "one embodiment" of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features.

[0054] The use of "including," "comprising," or "having" and variations thereof herein is meant to encompass the subsequently listed items and equivalents thereof, as well as additional items. Thus, the terms "including," "comprising," or "having" and variations thereof are open-ended and may be used interchangeably herein.

[0055] As used herein, the phrases "at least one," "one or more," and "and / or" are open-ended expressions that are both conjunctive and disjunctive in operation. For example, each of the expressions "at least one of A, B, and C," "at least one of A, B, or C," "one or more of A, B, and C," "one or more of A, B, or C," and "A, B, and / or C" means A alone, B alone, C alone, A with B as well, A with C, B with C, or A, B and C.

[0056] All directional references (e.g., proximal, distal, upper, lower, left, right, lateral, longitudinal, front, rear, top, bottom, up, down, vertical, horizontal, radial, axial, clockwise, and counterclockwise) are used for identification purposes only to aid the reader in understanding this disclosure and do not create limitations on the location, orientation, or use of this disclosure in particular. References to connections (e.g., attached, coupled, connected, and joined) should be interpreted broadly and may include intermediate members between collections of elements and relative movement between the elements unless otherwise indicated. Thus, references to connections do not necessarily imply that two elements are directly connected and in a fixed relationship to each other.

[0057] Furthermore, references to identification (e.g., primary, secondary, first, second, third, fourth, etc.) are not intended to imply importance or priority, but are used to distinguish one feature from another. The drawings are for illustrative purposes, and the dimensions, positions, order, and relative sizes reflected in the drawings attached hereto may vary. Without limitation, the contactless card 150 and the contactless cards 150 described herein may have standardized dimensions. For example, ISO / IEC 7816 is an international standard related to electronic identification cards with contacts, particularly smart cards, and is jointly managed by the International Organization for Standardization (ISO) and the International Electrotechnical Commission (IEC). However, there are other standards for contactless cards (PayPass, PayWave, ExpressPay), such as ISO / IEC 14443. A further standard, ISO / IEC 7810ID-1, to which many credit cards conform, defines the dimensions as 85.60 x 53.98 mm (3.370 x 2.125 inches) and a thickness of 0.76 mm (0.030 inches).

[0058] Furthermore, the terms "substantial" or "substantially" and "about" or "approximately" can be used interchangeably in some embodiments and can be described using any relative measure accepted by those of skill in the art. For example, these terms can serve as a comparison to a reference parameter to indicate a deviation that can provide the intended function. Without limitation, the deviation from the reference parameter can be, for example, an amount of less than 1%, less than 3%, less than 5%, less than 10%, less than 15%, less than 20%, etc.

[0059] Additionally, although the exemplary methods described above are described above as a sequence of acts or events, the present disclosure is not limited by the illustrated order of such acts or events unless otherwise indicated. For example, some acts may occur in different orders and / or simultaneously with other acts or events in accordance with the present disclosure as shown and / or described herein. Moreover, not all illustrated acts or events may be required to implement a methodology in accordance with the present disclosure. Furthermore, the methods may be performed in conjunction with the formation and / or processing of structures shown and described herein, or in conjunction with other structures not illustrated.

[0060] The present disclosure is not limited in scope by the specific embodiments described herein. Indeed, in addition to those described herein, various other embodiments and modifications of the present disclosure will be apparent to those skilled in the art from the foregoing description and the accompanying drawings. Accordingly, such other embodiments and modifications are intended to fall within the scope of the present disclosure. Moreover, the present disclosure has been described herein in the context of specific implementations in specific environments for specific purposes. Those skilled in the art will recognize that the usefulness is not limited thereto, and that the present disclosure may be beneficially implemented in any number of environments for any number of purposes. Therefore, the claims set forth below should be construed in light of the full breadth and spirit of the present disclosure as described herein.

Claims

1. 1. A method of forming a contactless transaction card, comprising: providing a card body defining a window; attaching an antenna assembly layer to the card body, the antenna assembly layer comprising an antenna, a conductive composite in an uncured state disposed within the window at a pair of end regions of the antenna, and a transmission layer supporting the antenna; providing a contactless chip module within the window on a first side of the antenna assembly layer; and applying radiation through the transparent layer; the radiation cures the conductive composite; the contactless chip module is electrically connected to the antenna by the conductive composite; method.

2. The step of irradiating the radiation through the transparent layer includes: directing a first laser beam at a first curable connector formed from the conductive composite and disposed at a first end region of the antenna; directing a second laser beam at a second curable connector formed from the conductive composite and disposed at a second end region of the antenna; The method of claim 1 , comprising:

3. The method of claim 1 , wherein the conductive composite comprises a conductive epoxy material.

4. the card body comprises a metal body; an outer portion of the antenna extends adjacent to the metallic body; The method further includes providing an insulating material between the outer portion of the antenna and the card body prior to the step of attaching the antenna assembly layer. The method of claim 1.

5. 2. The method of claim 1 , wherein the transparent layer is a UV transparent layer, and the conductive composite extends partially over the pair of end regions of the antenna and partially over exposed regions of the transparent layer not covered by the antenna.

6. The method of claim 1 , wherein the set of end regions of the antenna comprises a serpentine pattern.

7. the transmissive layer defines a recess; the window includes a first area; the recess includes a second area smaller than the first area; The method further includes aligning the window with respect to the recess. The method of claim 1.

8. the set of end regions includes a first end region and a second end region; the recess is disposed between the first end region and the second end region. The method according to claim 7.

9. the conductive composite includes a first connector disposed at the first end region of the antenna and a second connector disposed at the second end region of the antenna; the step of aligning the window includes aligning the window to avoid contact with the first connector and the second connector. The method according to claim 8.

10. 1. A contactless transaction card, comprising: a card body defining a window; an antenna assembly layer disposed adjacent to the card body; a contactless chip module; The antenna assembly layer comprises: an antenna including a pair of end regions; a UV transparent layer supporting the antenna; a conductive composite disposed in the pair of end regions, the conductive composite comprising a chemical or set of chemicals that hardens when exposed to UV radiation; the pair of end regions and the conductive composite are disposed within the window; the contactless chip module is disposed within the window and is electrically connected to the set of end regions by the conductive composite; Contactless transaction cards.

11. The contactless transaction card of claim 10 , wherein the conductive composite and the contactless chip module are not in contact with the card body.

12. The contactless transaction card of claim 10 , wherein the conductive composite comprises a conductive epoxy material.

13. The card body is conductive, an outer portion of the antenna extends adjacent to the card body; the contactless transaction card further comprising an insulating material disposed between the outer portion of the antenna and the card body.

11. The contactless transaction card of claim 10.

14. 11. The contactless transaction card of claim 10, wherein the conductive composite extends partially over the pair of end regions of the antenna and partially over exposed regions of the UV transparent layer not covered by the antenna.

15. The contactless transaction card of claim 10 , wherein the set of end regions of the antenna comprises a serpentine pattern.

16. the UV transparent layer defines a recess; the window includes a first area; the recess includes a second area smaller than the first area; The recess is aligned within the window.

11. The contactless transaction card of claim 10.

17. the set of end regions includes a first end region and a second end region; the recess is disposed between the first end region and the second end region.

17. The contactless transaction card of claim 16.

18. 1. A method of forming a contactless transaction card, comprising: providing a card body defining a window; coupling an antenna assembly layer, including an antenna and a transparent layer supporting the antenna, to the card body; providing a conductive composite at a first end region of the antenna and at a second end region of the antenna; providing a contactless chip module within the window on the first surface of the transparent layer; and irradiating radiation through the transparent layer from a second surface of the transparent layer opposite the first surface; the first end region, the second end region, and the conductive composite are disposed within the window; the conductive composite includes a chemical or set of chemicals that hardens when exposed to radiation; the radiation cures the conductive composite; the contactless chip module is electrically connected to the antenna by the conductive composite; method.

19. the conductive composite forming a first connector at the first end region and a second connector at the second end region; The step of irradiating radiation through the transparent layer includes: irradiating the first connector with a first UV laser beam; irradiating the second connector with a second UV laser beam; 20. The method of claim 18, comprising:

20. the first connector extends partially over the first end region of the antenna and partially over a first exposed region of the transparent layer not covered by the antenna; the second connector extends partially over the second end region of the antenna and partially over a second exposed region of the transparent layer not covered by the antenna; 20. The method of claim 19.

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