Cleaning agent composition for removing resin mask

Abstract

To provide a cleaner composition for removing resin masks that effectively suppresses metal corrosion on substrates, with reduced environmental load.SOLUTION: According to one aspect, a cleaner composition for removing resin masks contains polyhydric alcohol (component A), inorganic alkali (component B) and water (component C), with the molar ratio of component A to component B, A / B, being more than 2.SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to a cleaning agent composition for resin mask peeling and a method for cleaning a substrate using the cleaning agent composition.

Background Art

[0002] In recent years, in personal computers and various electronic devices, power consumption has been reduced, processing speed has been increased, and miniaturization has advanced. Wiring such as package substrates mounted on these devices has been becoming finer year by year. For such fine wiring and formation of connection terminals such as pillars and bumps, the metal mask method has been mainly used. However, due to its low versatility and difficulty in coping with the miniaturization of wiring and the like, it is being replaced by other new methods. As one of the new methods, a method using a resin mask, also called a dry film resist, is known. In this method, a metal seed layer is formed by electroless plating on an insulating substrate. Subsequently, the metal seed layer is laminated with a resin mask, a pattern is formed by exposure and development processes, and copper wiring and tin bumps are formed by electrolytic plating. The resin mask remaining on the substrate is finally peeled off and removed, and an alkaline peeling cleaning agent is used at that time.

[0003] In forming fine wiring on a printed circuit board or the like, in addition to the residual resin mask, in order to prevent damage to the seed layer and deterioration of reliability, the demand for metal etching suppression performance is intensifying.

[0004] However, since the corrosion of metals used in many connection terminals causes a decrease in the quality and value of package substrates, the cleaning agent composition is required to have high corrosion prevention ability. In addition, electrification is progressing in various fields and the production volume of electronic substrates is increasing. Especially since the outbreak of the novel coronavirus, the demand for electronic substrates has increased explosively, and the usage amount of the cleaning agent composition also tends to increase. Along with the increase in the usage amount of this cleaning agent composition, the drainage treatment load of waste liquid and the like has also increased, so a cleaning agent composition with a small environmental load is strongly desired.

[0005] In addition, nitrogen-containing compounds have been widely used as detergent compositions. For example, quaternary ammonium salts such as tetramethylammonium hydroxide (TMAH) can be mentioned. However, such quaternary ammonium salts are often classified as poisons and require great care in handling, and incineration in waste treatment places a large burden on the environment. For example, Patent Document 1 discloses, as an alternative to a TMAH-containing release agent composition, a release agent solution comprising about 20% by mass to about 90% by mass of a first solvent, about 5% by mass to about 50% by mass of a second solvent, about 1% by mass to about 7% by mass of an inorganic base, about 1% by mass to about 30% by mass of an amine, and about 0.0001% by mass to about 10% by mass of a corrosion inhibitor, wherein the solution exhibits a flash point above about 90°C and essentially does not contain quaternary ammonium hydroxide. Resorcinol, glycerol, xylitol, sorbitol, or copper(II) nitrate hemi(pentahydrate) etc. are mentioned as the corrosion inhibitor in the same document. On the other hand, for the peeling of the resin mask, a strongly alkaline water solubility of pH 13 or higher is generally often used. Therefore, the substrate underlayer may be damaged, or the solder may be overly etched. And in the subsequent seed layer etching process, defects such as etch-out of the seed layer and chipping of the solder may occur. As a technique for suppressing solder dissolution, for example, Patent Document 2 discloses a method for peeling a water-soluble resist, in which a plating resist is formed on a substrate laminated with a copper foil by a water-soluble resist such as a dry film, solder plating is performed, and the water-soluble resist is peeled with a strongly alkaline aqueous solution. A release agent solution containing 0.05 to 100 g / L of an organic substance having 4 or more carbon atoms to which a hydroxyl group is added in one molecule or a salt thereof, and the organic substance added to the release liquid is any one of gluconic acid, heptonic acid, sorbitol, or its stereoisomer.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0007] In recent years, the substrate manufacturing industry has been increasingly aware of environmental compatibility. For the sake of a labor-friendly and environmentally friendly workplace, environmental compatibility is recognized as part of the cleaning agent performance. However, it is difficult to achieve both metal etching inhibition performance (metal corrosion inhibition performance) and environmental compatibility with the stripping cleaning agents widely used in the industry. The stripping solution of Patent Document 1 is a solvent-based cleaning agent, which may not be desirable in terms of environmental compatibility. In addition, although the strongly alkaline aqueous solution used in Patent Document 2 discloses the prevention of lead precipitation of lead-containing solder, there is no disclosure regarding the corrosion inhibition of metals (for example, tin) of lead-free substrates.

[0008] Therefore, the present disclosure provides a cleaning agent composition for resin mask stripping, which is excellent in suppressing metal corrosion of a substrate and has a small environmental load, and a method for cleaning a substrate using the same.

Means for Solving the Problems

[0009] In one aspect, the present disclosure relates to a cleaning agent composition for resin mask stripping, which contains a polyhydric alcohol (Component A), an inorganic alkali (Component B), and water (Component C), and the molar ratio A / B of Component A to Component B is more than 2.

[0010] In one aspect, the present disclosure relates to a method for cleaning a substrate, which includes a step of cleaning a lead-free solder or solder-free substrate having a resin mask attached thereto using the cleaning agent composition of the present disclosure.

Effects of the Invention

[0011] According to the present disclosure, in one aspect, it is possible to provide a cleaning agent composition for resin mask stripping, which is excellent in suppressing metal corrosion of a substrate and has a small environmental load, and a method for cleaning a substrate.

Mode for Carrying Out the Invention

[0012] The present disclosure is based on the finding that by using a cleaning composition containing a polyhydric alcohol (component A) and an inorganic alkali (component B) in a predetermined molar ratio, the resin mask can be efficiently removed even with a low environmental load. It is also based on the finding that corrosion of the metal seed layer and solder on the substrate can be suppressed, that is, corrosion of the metal on the substrate can be suppressed.

[0013] That is, in one aspect, the present disclosure relates to a cleaning composition for removing a resin mask (hereinafter, also referred to as "the cleaning composition of the present disclosure") containing a polyhydric alcohol (component A), an inorganic alkali (component B), and water (component C), wherein the molar ratio A / B of component A to component B is more than 2. According to the present disclosure, it is possible to provide a cleaning composition for removing a resin mask that can remove the resin mask, suppress corrosion of the metal, and has a low environmental load. By using the cleaning composition of the present disclosure, highly reliable electronic components can be obtained.

[0014] Although there are still unclear parts in the detailed mechanism of action of the effects in the cleaning composition of the present disclosure, it is presumed as follows. Generally, it is considered that the suppression of metal etching during cleaning can be achieved by the multi-point adsorption type inhibitor adsorbing on the metal interface and forming a hydrophobic layer. However, such metal etching suppression performance does not function in an inorganic alkali system with a low environmental load. It is presumed that the inorganic alkali (component B) interacts with the inhibitor, deactivating the etching suppression function (metal corrosion suppression function). In the cleaning composition of the present disclosure, by setting the polyhydric alcohol (component A) and the inorganic alkali (component B) to a specific molar ratio, the interaction between the inorganic alkali and the inhibitor is weakened, and the deactivation of the metal corrosion suppression function can be suppressed. In general, the peeling of the resin mask is considered to be caused by the interfacial stress resulting from the penetration of the components of the cleaning composition into the resin mask and the swelling of the resin mask. In the cleaning composition of the present disclosure, it is considered that the inorganic alkali (Component B) and water (Component C) penetrate into the resin mask, promoting the dissociation of the alkali-soluble resin incorporated in the resin mask, and further promoting the peeling of the resin mask by causing charge repulsion. When a large amount of water (Component C) is present during the use of the cleaning composition of the present disclosure, it is presumed that the organic matter content in the cleaning composition can be reduced and the increase in the drainage treatment load can be suppressed. Thereby, it is considered that it becomes possible to manufacture an electronic substrate that achieves both environmental compatibility and corrosion inhibition of metals. However, the present disclosure may not be construed as being limited to this mechanism.

[0015] In the present disclosure, the resin mask to be peeled off and removed is a mask for protecting the surface of a substance from processes such as etching, plating, and heating, that is, a mask that functions as a protective film. As the resin mask, in one or more embodiments, a resist layer after exposure or development, a resist layer subjected to at least one of exposure and development (hereinafter also referred to as "exposed and / or developed"), or a cured resist layer can be mentioned. Further, the resin mask is formed using a resist whose physical properties such as solubility in a developer change by light, an electron beam, or the like in one or more embodiments. Resists are roughly classified into negative types and positive types according to the reaction method with light or an electron beam. The negative resist has the property that its solubility in the developer decreases when exposed, and in a layer containing the negative resist (hereinafter also referred to as "negative resist layer"), the exposed portion is used as the resin mask after exposure and development. The positive resist has the property that its solubility in the developer increases when exposed, and in a layer containing the positive resist (hereinafter also referred to as "positive resist layer"), the exposed portion is removed after exposure and development, and the unexposed portion is used as the resin mask. By using a resin mask having such characteristics, fine connection portions of a circuit board such as metal wiring, metal pillars, and solder bumps can be formed. As the resin material for forming the resin mask, in one or more embodiments, a film-shaped photosensitive resin or a resist film can be mentioned. A general-purpose resist film can be used. The resin mask is, in one or more embodiments, a copper or tin plating mask for use in copper or tin plating treatment.

[0016] [Component A: Polyhydric alcohol] The cleaning agent composition of the present disclosure contains a polyhydric alcohol (hereinafter also referred to as "Component A"). Component A may be used alone or in combination of two or more. Examples of Component A include polyhydric alcohols having 2 or more and 6 or less hydroxyl groups in the molecule. In one or more embodiments, from the viewpoint of improving the resin mask removability, the number of hydroxyl groups of Component A is preferably 2 or more and 6 or less, more preferably 2 or more and 5 or less, and still more preferably 2 or more and 4 or less. In one or more embodiments, from the viewpoint of suppressing metal corrosion, the number of hydroxyl groups of Component A is preferably 2 or more and 6 or less, more preferably 4 or more and 6 or less, and still more preferably 5 or more and 6 or less. The carbon number of Component A may not be particularly limited, and is preferably 12 or less from the viewpoints of productivity and stability.

[0017] Examples of Component A include divalent alcohols (diols) such as ethylene glycol; trivalent alcohols (triols) such as glycerin; tetravalent alcohols (tetraols) such as thritol; pentavalent alcohols such as xylitol; and hexavalent alcohols such as sorbitol and mannitol; and one or a combination of two or more selected therefrom. Among these, from the viewpoint of suppressing metal corrosion, trivalent or higher alcohols are preferable, pentavalent or higher alcohols are more preferable, and from the viewpoint of improving the resin mask removability, hexavalent or lower alcohols are preferable.

[0018] When using the cleaning composition of the present disclosure, the content of component A is preferably 40% by mass or less, more preferably 35% by mass or less, still more preferably 30% by mass or less, from the viewpoint of improving the resin mask removability, and preferably 5% by mass or more, more preferably 15% by mass or more, still more preferably 25% by mass or more from the viewpoint of suppressing metal corrosion. More specifically, the content of component A when using the cleaning composition of the present disclosure is preferably 5% by mass or more and 40% by mass or less, more preferably 15% by mass or more and 35% by mass or less, still more preferably 25% by mass or more and 30% by mass or less. When component A is a combination of two or more, the content of component A refers to their total content.

[0019] In the present disclosure, "the content of each component when using the cleaning composition" refers to the content of each component at the time of cleaning, that is, when starting to use the cleaning composition for cleaning. In one or more embodiments, the content of each component in the cleaning composition of the present disclosure can be regarded as the blending amount of each component in the cleaning composition of the present disclosure.

[0020] [Component B: Inorganic alkali] The cleaning composition of the present disclosure contains an inorganic alkali (hereinafter also referred to as "component B"). Component B may be used alone or in combination of two or more.

[0021] Examples of component B include one or a combination of two or more selected from sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, sodium carbonate, potassium carbonate, sodium silicate and potassium silicate. From the viewpoint of improving the resin mask removability, one or a combination of two or more selected from sodium hydroxide, potassium hydroxide, sodium carbonate and potassium carbonate is preferable, and at least one of sodium hydroxide and potassium hydroxide is more preferable.

[0022] When using the cleaning composition of the present disclosure, the content of component B is preferably 1.5% by mass or more, more preferably 2% by mass or more, still more preferably 2.5% by mass or more, from the viewpoint of improving the resin mask removability; and preferably 5% by mass or less, more preferably 4% by mass or less, still more preferably 3% by mass or less, from the viewpoints of improving the resin mask removability and suppressing metal corrosion. More specifically, when using the cleaning composition of the present disclosure, the content of component B is preferably 1.5% by mass or more and 5% by mass or less, more preferably 2% by mass or more and 4% by mass or less, still more preferably 2.5% by mass or more and 3% by mass or less. When component B is a combination of two or more kinds, the content of component B refers to their total content.

[0023] The molar ratio A / B of component A to component B in the cleaning composition of the present disclosure is more than 2, preferably more than 2.5, still more preferably more than 3, from the viewpoint of suppressing metal corrosion; and preferably 8 or less, from the viewpoint of improving the resin mask removability.

[0024] [Component C: Water] The cleaning composition of the present disclosure contains water (hereinafter also referred to as "component C"). Examples of component C include ion-exchanged water, RO water, distilled water, pure water, ultrapure water, and the like.

[0025] The content of component C in the cleaning composition of the present disclosure can be the remainder excluding component A, component B, and optional components described later. Specifically, when using the cleaning composition of the present disclosure, the content of component C is preferably 50% by mass or more, more preferably 60% by mass or more, still more preferably 70% by mass or more, from the viewpoints of suppressing metal corrosion and reducing environmental load without significantly impairing the resin mask removability; and preferably 90% by mass or less, from the same viewpoints.

[0026] [Other Components] The cleaning composition of the present disclosure can contain other components as necessary, as long as the effects of the present disclosure are not impaired, in addition to the above components A to C. Examples of other components include components used in ordinary cleaning agents, such as chelating agents, thickeners, dispersants, rust inhibitors, basic substances, surfactants, polymer compounds, solubilizers, antioxidants, preservatives, defoaming agents, antibacterial agents, and the like. When using the cleaning composition of the present disclosure, the total content of other components is preferably 2% by mass or less, more preferably 1.5% by mass or less, still more preferably 1% by mass or less, still more preferably 0.5% by mass or less, and still more preferably 0% by mass (i.e., not contained).

[0027] In one or more embodiments, the cleaning composition of the present disclosure may contain an organic solvent other than component A.

[0028] From the viewpoint of improving the resin mask removability, the pH during the use of the cleaning composition of the present disclosure is preferably 12 or higher, more preferably 12.5 or higher, and still more preferably 13 or higher. In the present disclosure, the "pH during use" refers to the pH at 25°C and can be measured using a pH meter. Specifically, it can be measured by the method described in the examples.

[0029] [Method for manufacturing a cleaning composition] The cleaning composition of the present disclosure can be produced by blending component A, component B, component C, and, as necessary, the above-mentioned optional components (other components) by a known method. For example, in one or more embodiments, the cleaning composition of the present disclosure can be made by blending at least component A, component B, and component C. Therefore, the present disclosure relates to a method for manufacturing a cleaning composition, which includes a step of blending at least component A, component B, and component C. In the present disclosure, "blending" includes mixing component A, component B, component C, and, as necessary, the above-mentioned optional components (other components) simultaneously or in any order. In the method for manufacturing the cleaning composition of the present disclosure, the preferred blending amounts of the respective components can be the same as the preferred contents of the respective components of the cleaning composition of the present disclosure described above.

[0030] The cleaning composition of the present disclosure may be used as it is for cleaning, or may be prepared as a concentrate with the amount of water (Component C) reduced within a range that does not cause separation, precipitation, etc. and does not impair storage stability. Examples of the concentration ratio include 2 to 10 times. The concentrate of the cleaning composition of the present disclosure can be diluted with water (Component C) so that each component (Component A, Component B, Component C, and other components) reaches the above-described content (i.e., the content during cleaning) during use. The concentrate of the cleaning composition of the present disclosure can also be used by adding each component separately during use. In the present disclosure, "during use" or "during cleaning" of the cleaning composition in the concentrated liquid refers to a state in which the concentrate of the cleaning composition is diluted.

[0031] [Object to be cleaned] In one or more embodiments, the cleaning composition of the present disclosure can be used for cleaning a substrate (object to be cleaned) with a resin mask attached, which is lead-free solder or has no solder. In one or more embodiments, examples of the object to be cleaned include a substrate having a metal layer such as copper or tin and a resin mask on its surface, for example, a substrate having metal bumps such as copper or tin and a resin mask. Examples of the substrate include an insulating board, a film, and the like. In one or more embodiments, the metal layer is a metal layer that is essentially lead-free or lead-free solder. In one or more embodiments, the metal layer that is essentially lead-free is a metal plating layer that is essentially lead-free. Examples of the metal plating layer that is essentially lead-free include a tin plating layer and a copper plating layer. The metal plating layer can be formed, for example, by an electroless plating method. In one or more embodiments, the metal layer that is essentially lead-free or lead-free solder is used as a metal wiring or a wiring connection part. In one or more embodiments, the object to be cleaned has undergone a process of performing at least one of plating treatment and soldering using a resin mask.

[0032] In one or more other embodiments, the cleaning composition of the present disclosure can be used for cleaning an object to be cleaned with a resin mask attached. In one or more embodiments, objects to be cleaned with a resin mask include electronic components having a lead-free metal portion and a resin mask on the surface and intermediate products in the manufacture thereof. Examples of the electronic components include at least one component selected from metal plates such as printed circuit boards, wafers, copper plates, and aluminum plates. The intermediate product is an intermediate product of components in the manufacturing process of an electronic component, and includes an intermediate product after resin mask treatment. Specific examples of objects to be cleaned with a resin mask include, for example, electronic components in which wirings, connection terminals, etc. are formed on the surface of a substrate through a process of performing at least one of soldering and plating treatments (copper plating, aluminum plating, nickel plating, tin plating, etc.) using a resin mask. In the present disclosure, soldering means causing solder to exist in a resin mask non-existing portion on a substrate and forming solder bumps by heating. In the present disclosure, plating treatment means performing at least one plating treatment selected from copper plating, aluminum plating, nickel plating, and tin plating on a resin mask non-existing portion on a substrate. The resin mask non-existing portion is a portion where the resin mask has been removed by imagewise treatment in a resist pattern (pattern-shaped resin mask) formed by imagewise treating a resin mask laminated on a substrate. Therefore, in one aspect, the present disclosure relates to the use of the cleaning agent composition of the present disclosure as a cleaning agent in the manufacture of electronic components.

[0033] In one or more embodiments, the object to be cleaned has undergone a process of performing at least one of soldering and plating treatment on a substrate having a resist pattern (pattern-shaped resin mask) formed by imagewise treating a resin mask laminated on the substrate. For example, an example of the object to be cleaned is a substrate having a site that is a resin mask existing portion where a cured resist layer is formed on the substrate and a site where a solder bump or a plating layer is formed in a resin mask non-existing portion.

[0034] In one or more embodiments, the cleaning composition of the present disclosure can be suitably used for cleaning a resin mask or an object to be cleaned with a resin mask that has been further subjected to plating treatment and / or heat treatment, from the viewpoint of cleaning effect. As the resin mask, for example, a negative resin mask or a positive resin mask may be used. In the present disclosure, the negative resin mask is formed using a negative resist, and examples thereof include a negative resist layer that has been exposed and / or developed. In the present disclosure, the positive resin mask is formed using a positive resist, and examples thereof include a positive resist layer that has been exposed and / or developed.

[0035] [Cleaning Method] In one or more embodiments, the present disclosure relates to a method for cleaning a substrate (object to be cleaned) including a step of cleaning a lead-free solder or a solderless substrate (object to be cleaned) with a resin mask attached thereto (hereinafter, also referred to as the "cleaning step") (hereinafter, also referred to as the "cleaning method of the present disclosure"). In one or more embodiments, the cleaning step includes bringing the object to be cleaned into contact with the cleaning composition of the present disclosure. Examples of the object to be cleaned include the objects to be cleaned described above. According to the cleaning method of the present disclosure, in one or more embodiments, the resin mask can be removed while suppressing corrosion of the lead-free solder or solderless substrate. Further, by using the cleaning composition of the present disclosure, the substrate can be cleaned in a manner that is gentler on the workplace and the environment than conventional methods.

[0036] Examples of the method for cleaning the object to be cleaned with the cleaning composition of the present disclosure or the method for bringing the cleaning composition of the present disclosure into contact with the object to be cleaned include a method of bringing them into contact by immersing them in a cleaning bath containing the cleaning composition, a method of injecting the cleaning composition in a spray form to bring them into contact (shower method), an ultrasonic cleaning method of irradiating ultrasonic waves during immersion, and the like. The cleaning composition of the present disclosure can be used for cleaning as it is without dilution. Examples of the object to be cleaned include the objects to be cleaned described above. Examples of the immersion time include 1 minute or more and 10 minutes or less, and more preferably 3 minutes or more and 6 minutes or less. Examples of the spray time include 1 minute or more and 10 minutes or less, and more preferably 3 minutes or more and 6 minutes or less.

[0037] In one or more embodiments, the cleaning method of the present disclosure can include a step of contacting a cleaning object with a cleaning agent composition, then rinsing with water, and drying. Examples of the rinsing method include running water rinsing. Examples of the drying method include air blow drying.

[0038] In one or more embodiments, the cleaning method of the present disclosure can include a step of rinsing a cleaning object with water after contacting the cleaning object with a cleaning agent composition.

[0039] In the cleaning method of the present disclosure, from the viewpoint that the detergency of the cleaning agent composition of the present disclosure is easily exerted, it is preferable to irradiate ultrasonic waves when the cleaning agent composition of the present disclosure comes into contact with the object to be cleaned, and the ultrasonic waves are preferably at a relatively high frequency. From the same viewpoint, the irradiation conditions of the ultrasonic waves are preferably, for example, 26 to 72 kHz and 80 to 1500 W, and more preferably 36 to 72 kHz and 80 to 1500 W.

[0040] In the cleaning method of the present disclosure, from the viewpoint that the detergency of the cleaning agent composition of the present disclosure is easily exerted, the temperature of the cleaning agent composition is preferably 40°C or higher, more preferably 50°C or higher, and from the viewpoint of reducing the influence on the substrate, it is preferably 70°C or lower, more preferably 60°C or lower.

[0041] [Method for manufacturing electronic components] In one aspect, the present disclosure relates to a method for manufacturing an electronic component (hereinafter, also referred to as "the method for manufacturing an electronic component of the present disclosure") including a step of cleaning a lead-free solder or a solder-free substrate (object to be cleaned) with a resin mask attached using the cleaning agent composition of the present disclosure (hereinafter, also referred to as "cleaning step"). Examples of the object to be cleaned include the objects to be cleaned described above. Examples of the cleaning method in the cleaning step include the same methods as the cleaning methods of the present disclosure described above. According to the method for manufacturing an electronic component of the present disclosure, by performing cleaning using the cleaning agent composition of the present disclosure, it is possible to remove the resin mask attached to the electronic component while suppressing the corrosion of the metal, and thus it is possible to manufacture highly reliable electronic components. Furthermore, by using the cleaning agent composition of the present disclosure, it is possible to manufacture electronic components in a way that is gentler on the workplace and the environment than conventional methods.

[0042] [Kit] In one aspect, the present disclosure relates to a kit (hereinafter, also referred to as "the kit of the present disclosure") for use in any of the cleaning method of the present disclosure and the method for manufacturing an electronic component of the present disclosure. The kit of the present disclosure is, in one or more embodiments, a kit for manufacturing the cleaning agent composition of the present disclosure. According to the kit of the present disclosure, in one or more embodiments, it is excellent in suppressing the corrosion of lead-free solder or a solder-free substrate, and a cleaning agent composition with a low environmental impact can be obtained. According to the kit of the present disclosure, in one or more embodiments, it is excellent in suppressing the corrosion of metals, and a cleaning agent composition with a small environmental load can be obtained.

[0043] As one embodiment of the kit of the present disclosure, it includes a solution containing component A (first liquid) and a solution containing component B (second liquid) in a state where they are not mixed with each other, and at least one of the first liquid and the second liquid further contains part or all of water (component C), and the first liquid and the second liquid are mixed at the time of use, and a kit (two-component type cleaning agent composition) can be mentioned. After the first liquid and the second liquid are mixed, they may be diluted with water (component C) as necessary. Each of the first liquid and the second liquid may contain the above-mentioned optional components as necessary.

Examples

[0044] Hereinafter, the present disclosure will be specifically described by way of examples, but the present disclosure is not limited by these examples in any way.

[0045] 1. Preparation of cleaning agent compositions of Examples 1 to 8 and Comparative Examples 1 to 7 The detergent compositions of Examples 1 to 8 and Comparative Examples 1 to 7 were prepared by blending each component shown in Table 1 in the blending amounts (mass%, active ingredient) described in Table 1 and stirring and mixing them. The pH at 25°C of each detergent composition shown in Table 1 is the value measured using a pH meter (HM-30G, manufactured by Toa Denpa Kogyo Co., Ltd.), and is the value after 1 minute of immersing the electrode of the pH meter in the detergent composition.

[0046] The following were used for the preparation of the detergent compositions of Examples 1 to 8 and Comparative Examples 1 to 7. (Component A) Sorbitol [manufactured by Fujifilm Wako Pure Chemical Corporation] Xylitol [manufactured by Fujifilm Wako Pure Chemical Corporation] Glycerin [manufactured by Fujifilm Wako Pure Chemical Corporation] (Component B) KOH: Potassium hydroxide [manufactured by Kanto Chemical Co., Inc., deer special grade, concentration 48%] (Component C) Water [pure water of 1 μS / cm or less produced by the pure water apparatus G-10DSTSET manufactured by Organo Corporation]

[0047] 2. Evaluation of detergent composition The following evaluations were performed on the prepared detergent compositions of Examples 1 to 8 and Comparative Examples 1 to 7.

[0048] [Test piece] A test piece (50 mm × 50 mm) made of a solid substrate (a substrate without solder) having a tin plating layer (thickness: about 2 μm) containing no lead on the surface was obtained by electroless plating on an insulating substrate.

[0049] [Evaluation of Sn etching rate (evaluation of corrosion (corrosiveness) of tin)] 2.5 L of each detergent composition was prepared and heated to 50°C, and while circulating in a box-type spray washing machine equipped with a full-cone nozzle (J020, manufactured by Ikeuchi Co., Ltd.) as a spray nozzle, tin plating was applied to the surface (the area was 25 cm per side 2 , 50 cm on both sides 2Spray for 4 minutes on a test piece (substrate having a tin plating layer on the surface) to which ) is applied (pressure: 0.2 MPa, spray distance: 80 mm). Sample the cleaning agent composition circulating in the cleaning machine. After diluting the cleaning agent composition, measure the elution amount of tin by ICP analysis (Agilent 5110 ICP-OES manufactured by Agilent Technologies), and according to the following formula, with the density of tin being 7.365 g / cm 3 The Sn etching rate (μm / min) was evaluated from the elution amount assuming 3 . The lower the numerical value of the Sn etching rate calculated below, the better the tin corrosion inhibition effect can be judged. Sn etching rate (μm / min) = elution amount of tin (weight) ÷ density of tin ÷ plated area ÷ treatment time

[0050]

Table 1

[0051] As shown in Table 1, the cleaning compositions of Examples 1 to 8 are inorganic alkali-based cleaning agent compositions with a small environmental load, and even compared with Comparative Example 1 that does not contain Component A and Comparative Examples 2 to 7 where the molar ratio A / B is 2 or less, the Sn etching rate could be reduced. That is, it was found that the cleaning compositions of Examples 1 to 7 have a small environmental load and are excellent in the effect of suppressing metal corrosion.

Industrial Applicability

[0052] According to the present disclosure, a cleaning agent composition excellent in suppressing metal corrosion of a substrate and having a small environmental load can be provided. By using the cleaning agent composition of the present disclosure, it is possible to shorten the cleaning process of electronic components with a resin mask attached and improve the performance and reliability of the manufactured electronic components, thereby improving the productivity of semiconductor devices.

Claims

1. containing a polyhydric alcohol (Component A), an inorganic alkali (Component B), and water (Component C), wherein the molar ratio A / B of Component A to Component B is more than 2, Component A is at least one selected from glycerin, threitol, xylitol, sorbitol, and mannitol, the content of Component B during use is 1.5% by mass or more and 4% by mass or less, Component B is at least one selected from sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, sodium carbonate, potassium carbonate, sodium silicate, and potassium silicate, a cleaning agent composition for resin mask stripping.

2. the content of Component A during use of the cleaning agent composition is 5% by mass or more and 40% by mass or less, the content of Component C during use of the cleaning agent composition is 50% by mass or more, the cleaning agent composition according to Claim 1.

3. The cleaning agent composition according to Claim 1, wherein the carbon number of Component A is 12 or less.

4. The cleaning agent composition according to Claim 1, wherein the molar ratio A / B of Component A to Component B is 8 or less.

5. A method for cleaning a substrate, comprising a step of cleaning a substrate having a metal layer and a resin mask on its surface using the cleaning agent composition according to any one of Claims 1 to 4.

6. A method for manufacturing an electronic component, comprising a step of cleaning a substrate having a metal layer and a resin mask on its surface using the cleaning method according to Claim 5.

Images