Heat dissipation device

Abstract

To solve the problem in which: there is demanded an electronic apparatus of an external connection type that reduces an increase in internal temperature of an imaging apparatus without causing a reduction in convenience for a user.SOLUTION: An electronic apparatus has a first connection unit configured to be attachable to an interface terminal included in a first external device, a heat transfer unit, a heat radiation unit, and a second connection unit. The first connection unit is in contact with the heat transfer unit and the heat radiation unit. The heat radiation unit, the heat transfer unit, and the first connection unit are laminated and arranged in this order and are thermally joined to each other. The second connection unit can be connected to a second external device and is electrically connected with the first connection unit.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to an electronic device that operates when attached to an external device such as an imaging device.

Background Art

[0002] In recent years, the processing performed by imaging devices has become more complex, the amount of processing performed by the internal circuits of imaging devices has increased, and heat generation has become an issue.

[0003] In order to reduce the temperature rise of electronic components due to heat generation, for example, Patent Document 1 proposes a technique of configuring an air-cooling duct inside a housing and attaching a heat dissipation device to forcibly cool a heat-generating body inside the housing.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the technique described in Patent Document 1, arranging a ventilation duct inside the imaging device requires a large installation space for the ventilation duct, which may prevent the miniaturization of the imaging device.

[0006] In addition, an external connection type cooling device in which a cooling device and an imaging device are configured separately and the cooling device is detachably attached to the imaging device can be considered. However, if the cooling device is attached to the interface part where the imaging device and the external device are electrically connected, other electronic devices cannot be electrically connected via the interface part while the cooling device is being attached, resulting in a decrease in convenience.

[0007] The present invention has been made in view of the above-described problems, and an object thereof is to provide an externally connectable electronic device that reduces the internal temperature rise of an imaging device without causing a decrease in user convenience.

Means for Solving the Problems

[0008] To solve the above problems, the present invention has a first connection portion configured to be attachable to an interface terminal provided in a first external device, a heat transfer portion, a heat dissipation portion, and a second connection portion. The first connection portion is in contact with the heat transfer portion and the heat dissipation portion, and the heat dissipation portion, the heat transfer portion, and the first connection portion are stacked and arranged in this order and thermally coupled. The second connection portion can be connected to a second external device and is electrically connected to the first connection portion. The thermal resistance from the first connection part to the second connection part is greater than the thermal resistance from the second connection part to the heat dissipation part. Characterized by .

Effects of the Invention

[0009] According to the configuration of the present invention, it is possible to reduce the internal temperature rise of the imaging device without reducing the user convenience.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0011] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Note that the embodiments described below are merely examples of means for realizing the present invention, and may be appropriately modified or changed depending on the configuration of the device to which the present invention is applied and various conditions.

[0012] (First Embodiment) Hereinafter, the first embodiment will be described with reference to the drawings.

[0013] FIG. 1 is a diagram for explaining the external view and schematic diagram of the imaging device in the present embodiment. FIG. 1(a) is a view of the imaging device 1 seen from the front. FIG. 1(b) is a view of the imaging device 1 seen from the side. FIG. 1(c) is a diagram schematically showing the inside of the imaging device 1.

[0014] In the imaging device 1 according to this embodiment, the lens unit is attached to the imaging device main body. A receptacle connector 2 (interface terminal) is arranged on the side surface of the main body of the imaging device 1. The receptacle connector 2 is a connector having a receptacle shape that enables mechanical and electrical connection to an external interface. The receptacle connector 2 is compatible with general-purpose interfaces, for example, the USB (Universal Serial Bus) standard, the HDMI (registered trademark) (High-Definition Multimedia Interface) standard, and the like. In this embodiment, a USB Type-C connector is used. The receptacle connector 2 is mounted on a control board 3. The control board 3 mounts various electronic components such as a control IC (heat-generating electronic component) 4 in addition to the receptacle connector 2, and controls the main operations of the imaging device 1. When performing video imaging or high-speed continuous shooting of still images using the imaging device 1, the amount of electrical signal processing increases due to image processing and the like. Then, the element package of the control IC 4 generates heat. When performing video imaging or high-speed continuous shooting of still images for a long time, the control IC 4 becomes hot, and the heat generated by the control IC 4 propagates to the conductor layer, insulating layer, etc. of the control board 3, and the temperature of the control board 3 rises. Fig. 1(c) schematically shows the state in which the heat generated by the control IC 4 propagates to the control board 3 by the shade of hatching. The heat generated by the control IC 4 also propagates to the receptacle connector 2 mounted on the control board 3, and the temperature of the receptacle connector 2 rises. If video imaging or high-speed continuous shooting of still images continues for a certain period of time or more, and the heat-generating electronic components such as the control IC 4 mounted on the control board 3 reach a high temperature exceeding their respective operating guarantee temperatures, it will lead to damage to the electronic components and the control board 3. Therefore, certain restrictions may be set on the continuous recording time of the operation and the number of high-speed continuous shooting still images to prevent damage caused by heat generation. However, since setting an operation limit on the imaging device 1 reduces the convenience during use by the imaging person, it is desirable to suppress the temperature rise of heat-generating electronic components such as the control IC 4 as much as possible and not set an operation limit.

[0015] FIG. 2 is a front view for explaining the attachment of an electronic device (heat dissipation device) to the imaging device according to the present embodiment. FIG. 2(a) shows the state before attachment, and FIG. 2(b) shows the state after attachment. The electronic device 10 is configured to be attachable to the imaging device 1 as an external device. Details of the internal configuration of the electronic device 10 will be described later. The electronic device 10 has a plug connector 11 (interface unit). The plug connector 11 is configured to be mechanically connectable (for example, fitted) to a receptacle connector of a general-purpose interface, and has a plug-side shape of the same interface standard as the receptacle connector 2 of the imaging device 1. The receptacle connector 2 may be in the form of a pin jack or a female shape instead of the receptacle shape, and the plug connector 11 may be in the form of a header or a male shape instead of the plug shape of the same interface standard.

[0016] It is mechanically connectable to the receptacle connector 2 and is mainly composed of a metal material. Although details will be described later, the electronic device 10 has at least one receptacle connector (not shown) of the same standard / same TYPE as the plug connector 11, and the imaging device 1 and other external devices can be connected via the electronic device 10. Thus, even when the electronic device 10 is attached, the use of other external devices by the imaging device 1 is not hindered.

[0017] For example, by attaching one end of a USB cable 30 to the electronic device 10 and connecting the other end of the USB cable 30 to an external PC (not shown), power can be supplied from the external PC to the electronic device 10 and communication can be established between the imaging device 1 and the external PC. Details regarding the operation and action of the electronic device 10 will also be described separately later.

[0018] FIG. 3 is an exploded perspective view for explaining the internal configuration of the electronic device according to the present embodiment. The electronic device 10 is configured to accommodate various components including a plug 11 inside a housing case 12 and combine a cover 13. First, the electronic device 10 has heat radiation fins 14 (heat radiation part). The heat radiation fins 14 form a fixing part 14b on the main surface 14a. The fixing part 14b mainly consists of four screw fixing holes. A plurality of fins 14c stand upright from the main surface 14a in a direction opposite to the arrangement surface of the fixing part 14b. The heat radiation fins 14 are integrally formed with the main surface 14a, the fixing part 14b, and the fins 14c by die casting (die casting) using an alloy material such as aluminum, magnesium, or zinc. A Peltier element 17 (heat transfer part) is disposed in the inner region surrounded by the four screw fixing holes of the fixing part 14b. The Peltier element 17 is a semiconductor element utilizing the Peltier effect and includes a rectangular main body part 17a and two terminal parts 17b extending from the main body part 17a. A heat transfer rubber 18 (elastic heat transfer part) is disposed so as to abut against the main body part 17a. The heat transfer rubber 18 is a rubber sheet having elasticity and excellent thermal conductivity, and is configured by adding various admixtures based on, for example, silicone rubber. The outer shape of the heat transfer rubber 18 is processed into substantially the same shape as the main body part 17a of the Peltier element 17 and attached to the Peltier element 17.

[0019] A flexible substrate 21 is disposed on the fixing part 14b of the heat radiation fins 14 so as to abut against the heat transfer rubber 18. A plug connector 11 is mounted on the flexible substrate 21.

[0020] The flexible substrate 21 mainly includes a copper-clad laminate 21a and a reinforcing plate 21b.

[0021] The copper-clad laminate 21a is a composite material having a layer structure in which an adhesive layer is formed on a base film that is a thin-film insulator, and a conductor layer is further laminated thereon. The reinforcing plate 21b is a metal reinforcing plate adhesively fixed to the copper-clad laminate 21a by, for example, a thermosetting adhesive or the like, and is composed of a material such as aluminum or stainless steel (SUS). The conductor layer constituting the copper-clad laminate 21a is etched into an arbitrary pattern shape, and a cover film having an opening in a shape necessary for mounting the plug connector 11 is coated thereon, thereby forming a land design for mounting the plug connector 11. The land design for mounting the plug connector 11 mainly consists of a surface-mount land 21c (pad portion) and a dip-terminal mount land 21d. The surface-mount land 21c consists of a plurality of conductor pads arranged at equal intervals. The dip-terminal mount land 21d is formed by first forming a plurality of conductor pads such as circular, elliptical, or rectangular shapes on the copper-clad laminate 21a, and further forming a through-hole by punching or the like inside the conductor pads. The plug connector 11 mainly consists of a connection portion 11a (contact terminal portion) and a base portion 11b. The connection portion 11a has a shape corresponding to the plug-side outer shape standard of a general-purpose interface. The base portion 11b is mainly formed by insert molding integrally with a communication terminal of the connection portion 11a, an insulator holding the communication terminal, and the like, and is composed of a material such as a heat-resistant resin capable of withstanding heat such as reflow mounting. The base portion 11b further has a surface-mount terminal 11c (mounting terminal portion) electrically connected to the communication terminal of the connection portion 11a, and a dip terminal 11d electrically connected to a metal shell covering around the insulator.

[0022] The arrangement of the surface-mount land 21c and the dip-terminal mount land 21d formed on the flexible substrate 21 is formed at positions corresponding to the arrangement of the surface-mount terminal 11c and the dip terminal 11d of the plug connector 11.

[0023] Insert each dip terminal 11d into the through-hole of the dip terminal mounting land 21d, mount the plug connector 11 on the flexible substrate 21, and connect each land and terminal with an electrical bonding material such as solder. The flexible substrate 21 further has four through-holes so as to surround the land portion for mounting the plug connector 11, and the arrangement of the through-holes is formed corresponding to the arrangement of the screw holes of the fixing portion 14b of the heat dissipation fin 14.

[0024] With the Peltier element 17, the heat transfer rubber 18, the flexible substrate 21, and the plug connector 11 laminated in order from the side close to the main surface 14a of the heat dissipation fin 14, fasten four screws 20 from the through-hole side of the flexible substrate 21 toward the screw holes of the fixing portion 14b. Also, the Peltier element 17, the heat transfer rubber 18, the flexible substrate 21, and the plug connector 11 are fixedly held on the heat dissipation fin 14. Four resin washers 19 are inserted between the reinforcing plate 21b of the flexible substrate 21 and the fixing portion 14b of the heat dissipation fin 14.

[0025] The heat dissipation fin 14 forms a fixing portion 14e on the side surface 14d perpendicular to the main surface 14a. The fixing portion 14e mainly consists of four screw holes. A printed circuit board 16 is arranged on the side surface 14d so as to contact the heat transfer rubber 22 and is fixedly held by four screws 23.

[0026] Furthermore, the heat dissipation fin 14 forms a fixing portion 14g on the upper surface 14f perpendicular to each of the main surface 14a and the side surface 14d. The fixing portion 14g consists of four screw holes. A fan 15 is arranged on the upper surface 14f. The fan 15 has a configuration of a so-called axial flow fan motor, and a substrate (not shown) electrically connected to a copper wire coil and various electronic components is mounted on the stator arranged at the center of the rectangular frame body, and a blade 15a with a magnet mounted thereon is formed on the rotor portion. The corner portions of the frame body have four through-holes 15b. Fasten four screws 24 from the through-hole 15b side of the fan 15 toward the fixing portion 14g to fixedly hold the fan 15. That is, the printed circuit board 16 and the flexible substrate 21 are arranged at an angle substantially perpendicular to the side surface of the heat dissipation fin 14.

[0027] The printed circuit board 16 is mounted with a USB connector 16a of the same standard and type as the plug connector 11. As shown in FIG. 3, the USB connector 16a is arranged in a direction facing the plug connector 11, and the user can connect other external devices even when the electronic device 10 is mounted on the imaging device 1. That is, the user can insert an external cable into the USB connector 16a even when the electronic device 10 is mounted on the imaging device 1.

[0028] Details regarding the operation and function of the electronic device 10 will be described separately later.

[0029] Furthermore, a tact switch 16c is mounted on the printed circuit board 16. When the operation button 12c formed on the housing case 12 is operated in a state where the assembly of the electronic device 10 is completed, the tact switch 16c is configured to be pressed. The operation button 12c is arranged to face the imaging person side when the electronic device 10 is mounted on the imaging device 1, and is configured to enable a smooth transition from the operation of the imaging device 1 to the operation of the electronic device 10. Also, a fan connector 16d is mounted on the printed circuit board 16. The fan connector 16d is a connector that is electrically connected to the fan 15. The fan 15 has a lead wire 15c extending from a board arranged in the stator portion, and a header-side connector 15d that fits the connector 16d is joined to the tip of the lead wire 15c. The fan 15 operates by a drive / control circuit of the fan 15 constituted by various electronic components mounted on the printed circuit board 16.

[0030] The housing case 12 is formed with an exhaust port 12a consisting of a plurality of slits on the surface facing the fan 15. An intake port 12b is formed on the surface facing the exhaust port 12a. The intake port 12b also has a plurality of slit shapes similar to the exhaust port 12a. When the heat dissipation fins 14 are accommodated inside the housing case 12, a duct 12d (duct portion) connecting the exhaust port 12a and the intake port 12b is formed. When the fan 15 is driven, an air flow path is formed that takes in outside air from the intake port 12b, passes through the duct 12d and the fin 14c, and discharges it to the exhaust port 12a. The printed circuit board 16 is further formed with a conductor land 16e having a through hole through which the tip of the terminal portion 17b of the Peltier element 17 can be inserted. First, the Peltier element 17 is fixedly held with respect to the heat dissipation fins 14, the terminal portion 17b is inserted into the conductor land 16e, and the printed circuit board 16 is fixedly held to the heat dissipation fins 14. The terminal portion 17b and the conductor land 16e are electrically connected by soldering or the like. The Peltier element 17 operates by a drive / control circuit of the Peltier element 17 composed of various electronic components mounted on the printed circuit board 16. When the Peltier element 17 operates, the plane side facing the heat transfer rubber 18 becomes the heat absorption surface, and the plane side facing the heat dissipation fins 14 becomes the heat generation surface. Then, the plug 11 is cooled through the heat transfer rubber 18, and conversely, the heat of the Peltier element 17 is dissipated to the heat dissipation fins 14. When the attachment of the various members to the heat dissipation fins 14 described above is completed, the heat dissipation fins 14 are fixed to the housing case 12, the cover 13 is further incorporated, and the screw 23 is fastened. Also, a flexible connector 16f is mounted on the printed circuit board 16.

[0031] The flexible connector 16f is a connector that electrically connects to the flexible printed board 21. The flexible printed board 21 is formed with a wiring arm portion 21e, and a connector connection portion 21f is formed at the tip thereof. The narrow portion of the wiring arm portion 21e is thinner than the outermost dimensions of the plug connector 11, facilitating connection to the printed circuit board 16 disposed in a substantially vertical plane.

[0032] The connector connection part 21f has some conductor layers exposed to form a connection terminal shape. The connector connection part 21f is arranged at the same pin pitch as the contact terminals arranged inside the flexible connector 16f, and has a terminal part shape that can be connected to the flexible connector 16f, such as the outer shape of the flexible part and the conductor exposure width. After the flexible substrate 21 and the printed circuit board 16 are fixedly held with respect to the heat dissipation fins 14, the connection part 21f is assembled to the flexible connector 16f, and the flexible substrate 21 and the printed circuit board 16 are electrically connected.

[0033] FIG. 4 is a diagram for explaining the flexible substrate 21 in the present embodiment.

[0034] FIG. 4(a) is a front view of the flexible substrate 21 as viewed from the side of the reinforcing plate 21b.

[0035] FIG. 4(b) is a diagram of the state where the flexible substrate 21 is arranged at the assembling positions of the Peltier element 17 and the heat transfer rubber 18. As described above, the flexible substrate 21 is configured by joining the reinforcing plate 21b to the copper-clad laminate 21a. The reinforcing plate 21b has through holes formed at positions corresponding to the dip terminal mounting lands 21d and is configured to allow the dip terminals 11d to be inserted. Through holes are also formed at positions facing the fixing part 14b when assembling to the heat dissipation fins 14 and are configured to allow the screws 20 to be inserted. A plurality of slits 21g are further formed in the reinforcing plate 21b and have a shape along the outer shape of the main body part 17a of the Peltier element 17. By providing the slits 21g in the reinforcing plate 21b, the thermal resistance of the reinforcing plate 21b between the region in contact with the Peltier element 17 through the heat transfer rubber 18 and the non-contact region increases. The range where the cooling effect of the Peltier element 17 reaches is likely to remain in the region in contact with the heat transfer rubber 18, and the plug connector 11 can be cooled more efficiently.

[0036] FIG. 5 is a diagram for explaining the wiring pattern of the conductor layer of the flexible substrate in the present embodiment.

[0037] The flexible substrate 21 in this embodiment has a double-sided flexible layer structure in which conductor layers are formed on both sides of the base film.

[0038] Fig. 5(a) is a wiring pattern of the flexible substrate 21, and is a diagram of the wiring pattern on the side to which the reinforcing plate 21b is bonded.

[0039] Fig. 5(b) is a wiring pattern of the flexible substrate 21, and is a perspective view of the wiring pattern on the side where the plug connector 11 is mounted as viewed from the surface side of the reinforcing plate 21b.

[0040] As described above, when the Peltier element 17 operates, the heat transfer rubber 18 and the flexible substrate 21 are cooled, and the plug connector 11 is cooled. In this case, except for the region where the dip terminal 11d of the flexible substrate 21 is in direct contact with the heat transfer rubber 18, when the temperature of the heat transfer rubber 18 decreases, the reinforcing plate 21b in contact with the heat transfer rubber 18 is cooled, and further, the conductor layer on the side where the reinforcing plate 21b is bonded is cooled. Then, the temperature drop of the conductor layer of the flexible substrate 21 acts to cool the plug connector 11. Here, a plurality of slits 21h are formed on both sides of the conductor layer of the flexible substrate 21, and the slits have a shape along the outer shape of the main body portion 17a of the Peltier element 17. By forming the slits 21h in the conductor layer of the flexible substrate 21, the thermal resistance of the conductor layer connecting the region overlapping the main body portion 17a of the Peltier element 17 in projection and the region not overlapping increases. The cooling effect of the Peltier element 17 propagates to the heat transfer rubber 18 and the reinforcing plate 21b, and the range reaching the conductor layer tends to remain in the region where the conductor layer and the main body portion 17a of the Peltier element 17 overlap in projection, and the plug connector 31 can be cooled more efficiently. Further, a dip terminal mounting land 21d for mounting the dip terminal 11d of the plug connector 11 is formed on the flexible substrate 21. Then, by mounting the plug connector 11, it is electrically connected to a metal shell covering the periphery of the insulator of the plug connector 11. Further, a ground pattern 21i is formed on both sides of the conductor layer of the flexible substrate 21, covering the periphery of the dip terminal mounting land 21d. The dip terminal mounting land 21d and the ground pattern 21i are electrically connected by a connection portion 21j. The connection portion 21j is connected to the ground pattern 21i in the direction toward the center of the plug connector 11 along the plane of the conductor layer. In FIG. 5(b), the connection portion 21j is connected to the ground pattern 21i formed in the range surrounded by the dip terminal mounting land 21d and the surface mounting land 21c. Further, the connection portion 21j is not arranged in the direction from the dip terminal mounting land 21d along the plane of the conductor layer toward the outside of the outer shape of the main body portion 17a of the Peltier element 17 from the plug connector 11.By forming the ground pattern 21i and the connection part 21j of the flexible substrate 21 in this way, it is possible to configure the heat transmitted from the metal shell of the plug connector 11 to be concentratedly transmitted to the conductor layer directly below the plug connector 11. Then, similar to the slit 21h described above, the range in which the cooling action propagates to the conductor layer due to the operation of the Peltier element 17 tends to be limited to the region where the conductor layer and the main body 17a of the Peltier element 17 overlap in projection, and the plug connector 11 can be cooled more efficiently.

[0041] Next, the operation of the electronic device 10 will be described.

[0042] FIG. 6 is a block diagram showing the configuration of the electronic device 10 in the present embodiment.

[0043] Hereinafter, the configuration of <the imaging device 1>, <the electronic device 10>, and <the external PC 300> will be described with reference to FIG. 6.

[0044] <Configuration of the imaging device 1> In FIG. 6, the imaging unit 101 is composed of an imaging element such as a CCD or CMOS element that converts an optical image introduced through an imaging lens (not shown) into an electrical signal.

[0045] The image processing unit 102 performs resizing processing such as predetermined pixel interpolation and reduction, and color conversion processing on the image data. Also, in the image processing unit 102, predetermined arithmetic processing is performed using the captured image data, and based on the obtained arithmetic result, the system control unit 103 performs exposure control and distance measurement control.

[0046] The system control unit 103 controls the entire imaging device 1.

[0047] The connector 104 is a connector that can be electrically connected to an external device. The connector 104 (receptacle connector 2) is a USB Type-C connector, and the imaging device 1 can perform power exchange and data communication with the electronic device 10 and other external devices via the connector 104.

[0048] The power control unit 105 is composed of a current detection circuit, a voltage detection circuit, a DC-DC converter, a switch circuit for switching the energized block, and the like. The power control unit 105 detects current, voltage, and battery remaining amount, controls the DC-DC converter based on the detection results and the instructions of the system control unit 103, and supplies the necessary voltage to each part for the necessary period.

[0049] The PD control unit 106 performs a predetermined negotiation (power supply negotiation) compliant with the USB PD standard between the imaging device 1 and an external device or a mobile battery only when the imaging device 1 is connected to an external device having a battery or a mobile battery. The imaging device 1 is configured to operate as a power receiving device that receives power supply from the outside.

[0050] If imaging is performed while the imaging device 1 supplies power to an external device, the power consumption from the power source mounted on the imaging device 1 increases, and the imaging available time of the imaging device 1 may be shortened, leading to a decrease in user convenience. Therefore, the imaging device 1 in the present embodiment does not implement the function of supplying power to an external device.

[0051] The battery 107 is a rechargeable secondary battery such as a Li-ion battery. The power control unit 105 performs charge control when charging the battery 107 based on the instructions of the system control unit 103.

[0052] The USB data communication unit 108 performs data communication with an external device connected to the connector 104 based on the instructions of the system control unit 103.

[0053] <Configuration of the electronic device 10> In FIG. 6, the connectors 201 and 202 are connectors of the same standard / same type that can be electrically connected to an external device. The connector 201 (plug connector 11) is a USB Type-C connector, and the electronic device 10 can perform data communication with the imaging device 1 via the connector 201.

[0054] Connector 202 is a USB Type-C connector, and the electronic device 10 can perform power exchange and data communication with the external PC 300 via the connector 202.

[0055] The system control unit 203 controls the entire electronic device 10.

[0056] The power control unit 204 is composed of a current detection circuit, a voltage detection circuit, a DC-DC converter, a switch circuit for switching the energized block, etc. The power control unit 204 detects current and voltage, controls the DC-DC converter based on the detection results and the instructions of the system control unit 203, and supplies the required voltage to each part for the required period. Also, the power control unit 204 controls the PD control unit 205 based on the instructions of the system control unit 203. Furthermore, the power control unit 204 controls the PD control unit 205 based on the instructions of the system control unit 203, and supplies power corresponding to the USB PD (USB Power Delivery) standard from the external PC 300 via the connector 202.

[0057] The PD control unit 205 performs a predetermined negotiation corresponding to the USB PD standard between the electronic device 10 and the external PC 300.

[0058] The operation unit 206 is an operation unit for inputting various operation instructions to the system control unit 203. The operation unit 206 is an operation button 16c for switching the ON / OFF of the Peltier element 17 and the fan 15, and the start and stop of the Peltier element 17 and the fan 15 can be controlled by the user's input instruction.

[0059] The fan control unit 207 controls the driving of the fan 15 based on the instructions of the system control unit 203.

[0060] The Peltier control unit 208 controls the driving of the Peltier element 17 based on the instructions of the system control unit 203.

[0061] The USB data communication unit 209 performs data communication with the imaging device 1 connected to the connector 201 and the external PC 300 connected to the connector 202 based on the instructions of the system control unit 203, and exchanges data as an intermediary between the imaging device 1 and the external PC 300.

[0062] <Configuration of the external PC 300> In FIG. 6, the connector 301 is a connector that can be electrically connected to the electronic device 10. The connector 301 is a USB Type-C connector, and the external PC 300 can exchange power and data communication with the electronic device 10 via the connector 301.

[0063] The system control unit 302 controls the entire external PC 300.

[0064] The power control unit 303 is composed of a current detection circuit, a voltage detection circuit, a DC-DC converter, a switch circuit for switching the energized block, etc. The power control unit 303 detects current, voltage, and battery remaining amount, controls the DC-DC converter based on the detection results and the instructions of the system control unit 302, and supplies the necessary voltage to each part for the necessary period. In addition, the power control unit 303 controls the PD control unit 304 based on the instructions of the system control unit 302. Furthermore, the power control unit 303 controls the PD control unit 304 based on the instructions of the system control unit 302, and supplies power corresponding to the USB PD standard to the electronic device 10 via the connector 301.

[0065] The PD control unit 304 performs a predetermined negotiation corresponding to the USB PD standard between the electronic device 10 and the external PC 300.

[0066] The battery 305 is a battery, for example, a rechargeable secondary battery such as a Li-ion battery. The power control unit 303 performs charging control when charging the battery 305 with power supplied from an external power source via a connector (not shown) based on the instructions of the system control unit 302.

[0067] The USB data communication unit 306 performs data communication with an external device connected to the connector 301 based on an instruction from the system control unit 302.

[0068] The operation unit 307 is an operation unit for inputting various operation instructions to the system control unit 302. For example, a keyboard and a mouse can be mentioned. The operation unit 307 enables various controls by the user inputting instructions.

[0069] The display unit 308 is composed of an LCD or the like having a display function.

[0070] <Operation description> Next, the operation of the electronic device 10 in this embodiment will be described.

[0071] Since the electronic device 10 emphasizes miniaturization and has a configuration without a power source, it is driven by power supply from an external device. In this embodiment, the electronic device 10 is attached to the imaging device 1, and the external PC 300 is further connected with the electronic device 10 as an adapter.

[0072] When the system control unit 203 of the electronic device 10 detects that the connector 202 is connected to the external PC 300, negotiation is carried out between the electronic device 10 and the external PC 300. At the same time, the system control unit 203 instructs the power control unit 204 to start power supply from the external PC 300 to the electronic device 10 according to the USB PD standard. On the other hand, although the system control unit 203 detects that the connector 201 is connected to the imaging device 1, as described above, since the imaging device 1 does not have a function of supplying power to an external device, negotiation is not carried out between the imaging device 1 and the electronic device 10.

[0073] Therefore, the system control unit 203 does not give an instruction for power supply to the power control unit 204.

[0074] When the electronic device 10 is in a state where it can be powered from an external PC 300 and the user operates the operation unit 206 (operation button 12c), the system control unit 203 issues a drive start instruction to the fan control unit 207 and the Peltier control unit 208, and the electronic device 10 starts a cooling operation.

[0075] Also, when the user operates the operation button 12c (operation unit 206) again, the system control unit 203 issues a drive stop instruction to the fan control unit 207 and the Peltier control unit 208, and the electronic device 10 stops the cooling operation. The specific cooling operation of the electronic device 10 will be described later.

[0076] Also, since the USB data communication units 108, 209, and 306 are communicating with each other, if the user operates the operation unit 307 of the external PC 300, the image data captured by the imaging device 1 can be displayed on the display unit 308 according to the instruction of the system control unit 302 via each USB data communication unit. That is, the user can perform various operations on the imaging device 1 from the external PC 300.

[0077] In this way, the electronic device 10 has both a cooling function and an adapter function.

[0078] Regarding the method of power supply and reception, in this embodiment, USB PD using a USB Type-C connector has been described as an example, but the scope of application of the present invention is not limited to this, and all methods capable of power supply and reception are targeted.

[0079] FIG. 7 is a cross-sectional view showing a state where the electronic device 10 is attached to the imaging device 1.

[0080] FIG. 7(b) is an enlarged view of the area A in FIG. 7(a). With reference to FIG. 7, the cooling operation of the electronic device 10 in this embodiment will be described.

[0081] When the imaging device 1 operates continuously for a long time, the control IC 4 becomes hot, and the heat generated by the control IC 4 propagates to the conductor layer, insulation layer, etc. of the control board 3, causing the temperature of the control board 3 to rise. Then, the heat generated by the control IC 4 also propagates to the receptacle connector 2 mounted on the control board 3, causing the temperature of the receptacle connector 2 to rise. When the temperature of the receptacle connector 2 rises with the electronic device 10 attached, the temperature of the plug connector 11 connected to the receptacle connector 2 rises. And when the temperature of the plug connector 31 rises, the temperature of the conductor layer of the copper-clad laminate 21a of the flexible substrate 21, the reinforcing plate 21b made of metal, etc. rises accordingly.

[0082] When the operation button 12c is operated with the electronic device 10 attached to start the cooling operation of the electronic device 10, due to the action of the Peltier element 17, the heat absorption surface side of the Peltier element 17 is cooled, and the heat transfer rubber 18 in contact with the heat absorption surface is also cooled. Then, the reinforcing plate 21b is cooled via the heat transfer rubber 18, and further the copper-clad laminate 21a having a metal conductor layer is cooled. And the plug connector 11 soldered to the flexible substrate 21 is also cooled. Then, the temperature rise of the receptacle connector 2 connected to the plug connector 11 is reduced, and the temperature drop of the receptacle connector 2 propagates to the control board 3, and the temperature rise of the control IC 4 can be reduced. Therefore, it is possible to suppress the activation of the operation limit when performing video imaging, high-speed continuous shooting of still images, etc. in the imaging device 1.

[0083] Also, in this case, the temperature of the plane facing the heat dissipation fins 14 of the Peltier element 17 rises. If the temperature rises, the operation of the Peltier element 17 may become unstable due to heat generation, or the semiconductor or the like constituting the Peltier element 17 may be damaged. Therefore, the heat generation surface of the Peltier element 17 is brought into surface contact with the heat dissipation fins 14, and the heat generated on the heat generation surface side of the Peltier element 17 is transferred to the heat dissipation fins 14. The transferred heat propagates to the plurality of fins 14c. Further, the fan 15 is driven to intake outside air, and an air flow is generated in the flow path formed inside the electronic device 10 to discharge the warmed air staying near the fins 14c of the heat dissipation fins 14 to the outside. By executing such an operation, it is possible to suppress the temperature rise on the heat generation surface side of the Peltier element 17, stabilize the operation of the Peltier element 17, and prevent damage to the semiconductor. If the heat transferred from the heat generation surface of the Peltier element 17 to the heat dissipation fins 14 is transferred to the heat absorption surface side of the Peltier element 17 via the fixing portion 11b, the effect of reducing the temperature rise of the control board 3 and the control IC 4 due to the operation of the Peltier element 17 may be reduced. Therefore, by inserting the resin washer 19 between the fixing portion 11b of the plug 11 and the fixing portion 14b of the heat dissipation fins 14 as described above, it becomes difficult for the heat transferred from the heat generation surface of the Peltier element 17 to the heat dissipation fins 14 to be transmitted to the heat absorption surface side of the Peltier element 17 via the fixing portion 11b. Therefore, inserting the resin washer 19 contributes to more efficiently acting the cooling effect by the Peltier element 17. Here, for example, if a resin washer for the purpose of thermal insulation is further added between the fixing portion 11b and the head seating surface of the screw 20, the intrusion to the heat absorption surface side of the Peltier element 17 can be further reduced.

[0084] Also, as described above, electronic components for driving the Peltier element 17 and the fan 15 are mounted on the printed circuit board 16. Further, electronic components for performing power control such as USB PD are also mounted on the printed circuit board 16. These electronic components become hot during operation, and the generated heat propagates to the conductor layer, insulation layer, etc. of the printed circuit board 16, causing the temperature of the printed circuit board 16 to rise. Therefore, the printed circuit board 16 is brought into contact with the heat transfer rubber 22 to transfer the heat generated on the printed circuit board 16 to the heat dissipation fin 14. Similar to the waste heat dissipation method of the Peltier element 17 described above, the transferred heat propagates to the heat dissipation fin 14 and is discharged to the outside by the fan 15. The heat transfer rubber 22 makes it difficult for the heat generated on the printed circuit board 16 to be thermally coupled to the fin 14 and propagate to the flexible board 21 via the connector 16c or the like.

[0085] At this time, the thermal resistance between the connector 16c and the flex 21 is configured to be larger than the thermal resistance between the substrate 16 and the fin 14. That is, the heat generated from the components mounted on the substrate 16 is less likely to be transmitted to the flex 21 side and is more likely to be dissipated to the fin 14 side. Therefore, it is possible to suppress a decrease in the function of the Peltier 17 due to the heat generated on the substrate 16 being transmitted to the flex 21 side, and to suppress an increase in the internal temperature of the imaging device 1 by dissipating the heat generated on the substrate 16 to the fin 14.

[0086] By performing such waste heat dissipation, the temperature of the receptacle connector 16a is also less likely to rise, so that it is possible to reduce the temperature rise at the location where the user contacts during connector insertion and removal.

[0087] As described above, by having both the cooling function and the adapter function, the electronic device 10 can reduce the rise in the internal temperature of the imaging device 1 without hindering the use of other external devices by the imaging device 1.

[0088] In the configuration of the present embodiment, the printed circuit board 16 may be attached to any surface of the heat dissipation fin 14 as long as the user can connect other external devices in a state where the electronic device 10 is attached to the imaging device 1.

[0089] Also, when the plug connector 11 is mounted on the flexible substrate 21, the tip of the dip terminal 11d is configured to protrude slightly from the through hole of the reinforcing plate 21b. When assembled to the Peltier element 17 and the heat transfer rubber 18 with such a configuration, the tip of the dip terminal 11d directly presses the opposing portion of the heat transfer rubber 18. In the region where the dip terminal 11d directly contacts the heat transfer rubber 18, the heat transfer rubber 18 cooled by the operation of the Peltier element 17 can directly cool the plug connector 11 without passing through the flexible substrate 21. For the above reasons, it contributes to more efficiently reducing the temperature rise on the imaging device 1 side.

[0090] In the above description, as the substrate on which the plug connector 11 is mounted, the flexible substrate 21 formed by bonding a metal reinforcing plate 21b is adopted, but the present invention is not limited to this embodiment, and various modifications and changes are possible within the scope of the gist. For example, instead of the flexible substrate 21, a hard substrate based on a rigid base material such as glass epoxy may be adopted. In this case, the resist film covering the conductor layer on the plane side in contact with the heat transfer rubber 18 of the hard substrate is removed so that the heat transfer rubber 18 and the conductor layer are in direct contact. Therefore, the heat transfer with the heat transfer rubber 18 can be improved.

[0091] Furthermore, when assembling the electronic device 10, an electric driver may be used to fixedly hold the Peltier element 17 and the plug 11 to the heat radiation fins 14 using screws 20. These tools use the power of a motor to tighten screws, and impact occurs when tightening the screws and when the screw tightening is completed. If the heat transfer rubber 18 is not provided and the plug 11 is directly brought into contact with the Peltier element 17, there is a concern that the Peltier element 17 may be damaged due to such impact directly propagating from the rigid plug 11 to the Peltier element 17. If the heat transfer rubber 18 is not provided, a configuration for reducing damage to the Peltier element 17 during the assembly operation may be, for example, a configuration in which coil springs are additionally provided at four locations between the fixing portion 11b of the plug 11 and the screw 20 for screw tightening and fixing. In this case, it is possible to make it difficult for the impact during the screw tightening operation to propagate to the Peltier element 17, but the operation for screw tightening and fixing becomes complicated. Therefore, considering preventing damage to the Peltier element 17 during the assembly operation, the assembly workability, and stably transferring heat between the Peltier element 17 and the plug 11, the configuration of arranging the heat transfer rubber 18 between the Peltier element 17 and the plug 11 is useful. For the purpose of performing stable heat transfer, a certain amount of gap may be provided between the heat generating surface of the Peltier element 17 and the heat radiation fins 14, and a member equivalent to the heat transfer rubber 18 may be added to the gap. Alternatively, a configuration may be adopted in which grease with high thermal conductivity is applied between the heat generating surface of the Peltier element 17 and the heat radiation fins 14.

[0092] When the electronic device 10 is attached to the imaging device 1 and imaging is performed while operating the electronic device 10, warm air will continue to be discharged from the exhaust port 12a during imaging. If the exhaust port 12a is directed toward the subject, in a close-up imaging scene or the like, the subject or an object captured within the angle of view may shake, and it may not be possible to perform the intended imaging. Also, if the exhaust port 12a is directed toward the imager, there is a concern that the warm air will continuously hit the face or hands of the imager during imaging, which is troublesome. Therefore, it is desirable that the direction in which the exhaust port 12a discharges warm air is parallel to a plane orthogonal to the optical axis direction of the imaging device 1. Also, the warmed air expands and its specific weight becomes lighter. Therefore, when the imaging device 1 is placed in a so-called normal position with the tripod mount facing downward, it is desirable that the exhaust direction in which the attached electronic device 10 discharges warm air is configured to discharge in a direction opposite to the vertical direction. By configuring the exhaust direction in a direction opposite to the vertical direction, an efficient exhaust operation can be performed without opposing the movement of the warm air. That is, when the connection portion of the external interface in the imaging device 1 is arranged on the side surface of the housing as shown in FIGS. 1 and 2, it is desirable that the fins 14c of the heat dissipation fins 14 stand in a direction parallel to the attachment direction to which the electronic device 10 is connected. Further, it is desirable that the plurality of metal flat plates constituting the fins 14c are arranged parallel to the vertical direction. Furthermore, configuring the exhaust direction of the duct 12d linearly in a direction opposite to the vertical direction acts favorably on the cooling operation.

[0093] According to the present embodiment, the electronic device 10 is configured to be detachable from the imaging device 1, and for example, the imaging device 1 can be configured to be smaller compared to the case where a cooling structure similar to the electronic device 10 is configured inside the imaging device 1. Then, by attaching the electronic device 10 to the imaging device 1 and cooling the external interface, the miniaturization of the imaging device 1 main body can be maintained.

[0094] (Second Embodiment) Next, with reference to FIGS. 8 and 9, the electronic device 50 according to the second embodiment of the present invention will be described. In the electronic device 50, the number of receptacle connectors mounted on the printed circuit board 16 of the electronic device 10 described in the first embodiment is two, whereas it was one. In the second embodiment, the external devices connectable to the electronic device 50 are an external PC 600 and a mobile battery 700. Although details will be described later, since the external PC 600 does not comply with the USB PD standard, the power supply source to the electronic device 50 is the mobile battery 700.

[0095] Also, in the first embodiment, the substrate configuration was composed of two parts, the printed circuit board 16 and the flexible printed circuit 21, but in the electronic device 50, these are integrated and mounted as a flexible printed circuit board 60. The same parts as those of the electronic device 10 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0096] FIG. 8 is an exploded perspective view of the electronic device 50 in the present embodiment.

[0097] The flexible printed circuit board 60 has a double-sided flexible layer structure in which conductor layers are formed on both sides of a base film.

[0098] The flexible printed circuit board 60 includes a plug mounting portion 60a on which the plug connector 11 is mounted, a connector mounting portion 60b on which USB connectors 60d and 60e for connecting to an external device are mounted, and an arm portion 60c (connection region) connecting both mounting portions. The arm portion 60c has flexibility. The plug mounting portion 60a is fixed to the main surface 14a of the heat sink fins 14, and the connector mounting portion 60b is fixed to a side surface 14d perpendicular to the main surface 14a.

[0099] In this embodiment, the USB connectors 60d and 60e have the same standard / TYPE as the plug connector 11. The USB connector 60d is connected to an external PC 600 via a USB cable, and the USB connector 60e is connected to a mobile battery 700 via a USB cable. In the connector mounting portion 60b, the USB connector 60d is arranged closer to the intake port 12b of the duct 12d than the USB connector 60e.

[0100] As described above, the electronic device 50 needs to be powered from the mobile battery 700, and the USB connector 60e is always plugged into the plug on the mobile battery 700 side when the electronic device 50 is operating. Therefore, the user does not directly touch the USB connector 60e. On the other hand, regarding the USB connector 60d connected to the external PC 600, even when the electronic device 50 is operating, the user is entrusted with the selection of connecting / disconnecting from the external PC 600. Therefore, when the electronic device 50 and the external PC 600 are not connected, the user can directly touch the USB connector 60d.

[0101] During the operation of the electronic device 50, a temperature difference occurs in the flow path direction on the heat dissipation fins 14, and the temperature of the heat dissipation fins 14 is lower on the intake side than on the exhaust side. At this time, since the substrate is fixed to the fins in a state where the two connectors 60d and 60e are arranged side by side along the flow path direction, the connector 60d arranged on the intake side is more likely to have a relatively lower temperature than the connector 60e. By adopting such a configuration, it is difficult for the user to feel hot even when touching the USB connector 60d during the operation of the electronic device 50.

[0102] The plug mounting portion 60a has the same configuration as that of the wiring arm portion 21e of the flexible substrate 21 in the first embodiment, except that the wiring arm portion 21e is replaced by the arm portion 60c, so the description is omitted.

[0103] Unlike the printed circuit board 16 of the first embodiment, the connector mounting portion 60b is made of a flexible substrate. A tact switch 60f is mounted on the connector mounting portion 60b. When the operation button 12c formed on the housing 12 is operated in a state where the electronic device 10 is assembled, the tact switch 60f is configured to be pressed. A fan connector 60g is also mounted on the connector mounting portion 60b. The fan connector 60g is a connector that is electrically connected to the fan 15. A lead wire 15c extends from the substrate disposed in the stator portion of the fan 15, and a header-side connector 15d that fits the connector 60g is joined to the tip of the lead wire 15c. The fan 15 operates by a drive / control circuit of the fan 15 composed of various electronic components mounted on the connector mounting portion 60b.

[0104] The connector mounting portion 60b further has a conductor land 60h having a through hole through which the tip of the terminal portion 17b of the Peltier element 17 can be inserted. The Peltier element 17 is first fixedly held with respect to the heat radiation fin 14, the terminal portion 17b is inserted into the conductor land 60h, and the connector mounting portion 60b is fixedly held to the heat radiation fin 14. The terminal portion 17b and the conductor land 60h are electrically connected by soldering or the like. The Peltier element 17 operates by a drive / control circuit of the Peltier element 17 composed of various electronic components mounted on the connector mounting portion 60b. When the Peltier element 17 operates, the plane side facing the heat transfer rubber 18 becomes the heat absorption surface, and the plane side facing the heat radiation fin 14 becomes the heat dissipation surface. Then, the plug 11 is cooled through the heat transfer rubber 18, and conversely, the heat of the Peltier element 17 is dissipated to the heat radiation fin 14. When the attachment of the various members described above to the heat radiation fin 14 is completed, the heat radiation fin 14 is fixed to the housing 12, the cover 13 is further incorporated, and the screw 23 is tightened.

[0105] At this time, if heat generated when the electronic components for driving the Peltier element 17 and the fan 15 mounted on the connector mounting portion 60b becomes high during driving and propagates to the plug mounting portion 60a, it may prevent the reduction of the internal temperature of the imaging device 1 via the plug connector 11. In order to more efficiently reduce the internal temperature of the imaging device 1, it is desirable to make it difficult for the heat generated in the connector mounting portion 60b to propagate to the plug mounting portion 60a. Although integrated with a flexible substrate in this embodiment, similar to the first embodiment, it may be configured to be made into two flexible substrates and connected by thin wires to prevent heat from propagating from the connector mounting portion 60b to the plug mounting portion 60a.

[0106] Also, if the USB connectors 60d and 60e can be inserted by the user from the outside even when the electronic device 50 is mounted on the imaging device 1, they may be arranged in the plug mounting portion 60a. However, considering the convenience of the user, it is more suitable to arrange them in the connector mounting portion 60b as in this embodiment.

[0107] Also, the connector 16d electrically connected to the fan 15 and the conductor land 16e electrically connected to the Peltier element 17 are arranged on the connector mounting portion 60b side rather than the connector mounting portion 60a side of the flexible substrate 60, and the electronic circuit for controlling them is also mounted on the connector mounting portion 60b side. Therefore, the transmission wiring for driving the fan 15 and the Peltier element 17 does not pass through the arm portion 60c, and the width of the arm portion 60c can be made thinner. In this embodiment, the narrow portion of the width of the arm portion 60c is thinner than the outermost dimensions of the connector mounting portions 60a and 60b. Also, the influence of heat generation due to driving the fan 15 and the Peltier element 17 is less likely to propagate to the connector mounting portion 60a via the conductor layer of the connector mounting portion 60b, and it preferably acts without inhibiting the cooling operation of the plug 11.

[0108] FIG. 9 is a block diagram showing the configuration of the electronic device 50 in the second embodiment of the present invention.

[0109] Hereinafter, the configurations of the <imaging device 1>, <electronic device 50>, <external PC 600>, and <mobile battery 700> will be described with reference to FIG. 9.

[0110] <Configuration of Electronic Device 50> In FIG. 9, connectors 501 and 502 are connectors that can be electrically connected to external devices. Connector 501 is a USB Type-C connector, and the electronic device 50 can perform power exchange and data communication with the imaging device 50 via connector 501.

[0111] Connectors 502 and 503 are USB Type-C connectors, and the electronic device 50 can perform data communication with the external PC 600 via connector 502 (USB connector 60d). Also, power exchange with the mobile battery 700 is possible via connector 503 (USB connector 60e).

[0112] The system control unit 504 controls the entire electronic device 50.

[0113] The power control unit 505 is composed of a current detection circuit, a voltage detection circuit, a DC-DC converter, a switch circuit for switching the energized blocks, etc. The power control 505 detects current and voltage, controls the DC-DC converter based on the detection results and the instructions of the system control unit 504, and supplies the necessary voltage to each part for the necessary period. Also, the power control unit 505 controls the PD control unit 506 based on the instructions of the system control unit 504.

[0114] Furthermore, the power control unit 505 controls the PD control unit 506 based on the instructions of the system control unit 504, and supplies power compliant with the USB PD standard from the mobile battery 700 via connector 503. Also, the power supplied from the mobile battery can be supplied to the imaging device 1 via connector 501.

[0115] The PD control unit 506 performs a predetermined negotiation compliant with the USB PD standard between the imaging device 1 and the electronic device 50, or between the electronic device 50 and the mobile battery 700.

[0116] The operation unit 507 is an operation unit for inputting various operation instructions to the system control unit 504. The operation unit 507 is an operation button 16c for switching the ON / OFF of the Peltier element 17 and the fan 15, and the start and stop of the Peltier element 17 and the fan 15 can be controlled by a user input instruction.

[0117] The fan control unit 508 performs drive control of the fan 15 based on an instruction from the system control unit 504.

[0118] The Peltier control unit 509 performs drive control of the Peltier element 17 based on an instruction from the system control unit 504.

[0119] The USB data communication unit 510 performs data communication based on an instruction from the system control unit 504.

[0120] <Configuration of the external PC 600> In FIG. 9, reference numeral 601 denotes a connector that can be electrically connected to the electronic device 50. The connector 601 is a USB Type-C connector, and the external PC 600 can perform data communication with the electronic device 50 via the connector 601.

[0121] The system control unit 602 controls the entire external PC 600.

[0122] The power control unit 603 is composed of a current detection circuit, a voltage detection circuit, a DC-DC converter, a switch circuit for switching the energized block, etc. The power control unit 603 detects current, voltage, and battery remaining amount, controls the DC-DC converter based on the detection results and an instruction from the system control unit 602, and supplies a necessary voltage to each part for a necessary period.

[0123] The battery 604 is a battery, for example, a rechargeable secondary battery such as a Li-ion battery. The power control unit 603 performs charge control when charging the battery 604 with power supplied from an external power source via a connector (not shown) based on an instruction from the system control unit 602.

[0124] The USB data communication unit 605 performs data communication based on an instruction from the system control unit 602.

[0125] The operation unit 606 is an operation unit for inputting various operation instructions to the system control unit 602. Various controls can be performed by the user inputting instructions through the operation unit 606.

[0126] The display unit 607 is composed of an LCD or the like having a display function.

[0127] <Configuration of the mobile battery 700> In FIG. 9, the connector 701 is a connector that can be electrically connected to an external device. The connector 701 is a USB Type-C connector, and the mobile battery 700 can exchange power with the electronic device 50 via the connector 701.

[0128] The system control unit 702 controls the entire mobile battery 700.

[0129] The power control unit 703 is composed of a current detection circuit, a voltage detection circuit, a DC-DC converter, a switch circuit for switching the energized block, and the like. The power control 703 detects current and voltage, controls the DC-DC converter based on the detection results and an instruction from the system control unit 702, and supplies the required voltage to each part for the required period. Also, the power control unit 703 controls the PD control unit 705 based on an instruction from the system control unit 702.

[0130] Furthermore, the power control unit 703 controls the PD control unit 506 based on an instruction from the system control unit 702, and supplies power compliant with the USB PD standard to the imaging device 50 via the connector 703.

[0131] The PD control unit 705 performs a predetermined negotiation compliant with the USB PD standard between the electronic device 50 and the mobile battery 700.

[0132] <Operation Explanation> Next, the operation of the electronic device 50 of the present embodiment will be described.

[0133] Attach the electronic device 50 to the imaging device 1, and further connect the external PC 600 and the mobile battery 700 using the electronic device 50 as an adapter.

[0134] When the system control unit 504 of the electronic device 50 detects that the connector 502 is connected to the mobile battery 700, it instructs the power control unit 505 to start power supply from the mobile battery 700 according to the USB PD standard. On the other hand, even if the system control unit 504 detects that the connector 502 is connected to the external PC 600, since the external PC 600 is not PD-compatible, no instruction to supply power is issued.

[0135] Also, when the system control unit 504 of the electronic device 50 detects that the connector 501 is connected to the imaging device 1 and power is being supplied from the mobile battery 700, it is also possible to supply power to the imaging device 1 through the power control unit 505 to the PD control unit 506.

[0136] When the user operates the operation unit 507 while the electronic device 50 is in a state where power can be supplied from the mobile battery 700, the system control unit 504 issues a drive start instruction to the fan control unit 508 and the Peltier control unit 509, and the electronic device 50 starts the cooling operation.

[0137] Also, when the user operates the operation unit 507 again, the system control unit 504 issues a drive stop instruction to the fan control unit 508 and the Peltier control unit 509, and the electronic device 50 stops the cooling operation.

[0138] The specific cooling operation of the electronic device 50 is the same as that of the electronic device 10, so it is omitted.

[0139] Also, if the user operates the operation unit 606 of the external PC 600, the USB data communication units 108, 510, and 605 of the imaging device 1, the electronic device 50, and the external PC 600 communicate with each other. Therefore, if the user operates the operation unit 606 of the external PC 600, the image data captured by the imaging device 1 can be displayed on the display unit 607 via each USB data communication unit according to the instruction of the system control unit 602.

[0140] According to this embodiment, the electronic device 50 has both a cooling function and an adapter function. By connecting the imaging device 1 and other external devices via the electronic device 50, even if the electronic device 50 is mounted, the use of other external devices by the imaging device 1 is not hindered, and the rise in the internal temperature of the imaging device 1 can be reduced.

[0141] In this embodiment, it has been described that both the USB connectors 60d and 60e have the same standard / same TYPE as the plug connector 11. However, the connector 60e does not have to have the same standard / same TYPE as the plug connector 11 as long as it can supply power.

[0142] (Other embodiments) As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist.

Explanation of reference numerals

[0143] 1 Imaging device (external device) 2 Receptacle connector 3 Control board 4 Control IC 10 Electronic device 11 Plug (interface unit) 11a Connection part 12d Duct 14 Heat dissipation fin (heat dissipation part) 14c Fin 15 Fan 16 Printed circuit board 16a / 202 receptacle connector 17 Peltier element 17 (heat transfer section) 18 Heat transfer rubber (elastic heat transfer section) 21 Flexible substrate

Claims

1. A heat dissipation device having a first connection portion configured to be attachable to an interface terminal provided in a first external device, a heat transfer portion, a heat radiating portion, and a second connection portion, The first connection portion is in contact with the heat transfer portion and the heat radiating portion, The heat radiating portion, the heat transfer portion, and the first connection portion are stacked and arranged in this order and thermally coupled, The second connection portion can be connected to a second external device and is electrically connected to the first connection portion, The heat dissipation device is characterized in that the thermal resistance from the first connection portion to the second connection portion is greater than the thermal resistance from the second connection portion to the heat radiating portion.

2. The first connection portion has any one of a header shape, a plug shape, and a male shape The heat dissipation device according to claim 1, wherein the second connection portion has any one of a receptacle shape, a pin jack shape, and a female shape.

3. Further having a third connection portion, The heat dissipation device according to claim 1 or 2, which receives power from the external device via the third connection portion.

4. A heat dissipation device according to any one of claims 1 to 3, having a first mounting portion having an electronic component for controlling the driving of the heat transfer portion, and a second mounting portion including an arm portion electrically connected to the first mounting portion.

5. The heat dissipation device according to claim 4, wherein the arm portion has a narrow portion narrower than the outermost dimensions of the first mounting portion and the second mounting portion.

6. Having a substrate integrally formed from the first mounting portion, the second mounting portion, and a connection region that electrically connects the first mounting portion and the second mounting portion and has flexibility, The heat dissipation device according to claim 5, wherein the first mounting portion and the second mounting portion are arranged on different surfaces of the heat radiating portion.

7. The heat dissipation device according to claim 5, wherein the second mounting portion is thermally coupled to the heat dissipation portion.

8. The heat dissipation device according to claim 5, wherein the second mounting portion has a connection portion electrically connected to the heat transfer portion.

9. A first connection portion configured to be attachable to an interface terminal provided in a first external device, A second connection portion capable of being electrically connected to the first connection portion, A third connection portion connected to a second external device, A heat transfer portion, A heat dissipation portion, A duct portion in which a flow path of outside air passing through the heat dissipation portion is formed, A fan that sucks outside air into the duct portion or exhausts the outside air in the duct portion, and has, The heat dissipation portion and the heat transfer portion are thermally coupled to the first connection portion to lower the temperature of the first connection portion, The heat dissipation device, wherein the third connection portion is disposed closer to an air intake of the fan than the second connection portion.

Images