Vacuum pump and control device for vacuum pump

Abstract

To provide a vacuum pump, a controller of the vacuum pump and a remote controller, capable of reducing the workload of a user or a field service engineer.SOLUTION: A vacuum pump 10 includes a turbo-molecular pump 100 that exhausts gas inside a semiconductor manufacturing device X, and a controller 200 that controls the turbo-molecular pump 100. The controller 200 comprises remote signal receiving means of receiving a command signal from a remote controller 300 that remotely controls the turbo-molecular pump 100, and based on the command signal received by the remote signal receiving means, changes setting related to the operation specifications of the turbo-molecular pump 100.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a vacuum pump and and a control device for the vacuum pump. placement

Background Art

[0002] As a type of vacuum pump that evacuates the gas inside the device to be evacuated, a turbomolecular pump is known that evacuates the gas by bouncing the molecules of the gas sucked into the pump body with a rotating blade. For example, Patent Document 1 discloses a turbomolecular pump that evacuates the inside of a chamber of a semiconductor manufacturing apparatus to a vacuum or evacuates a process gas used in semiconductor manufacturing from the chamber.

[0003] A base portion is provided at the bottom of the outer cylinder of the turbomolecular pump described in Patent Document 1, and a heater for heating the base portion and a water-cooling pipe for cooling the base portion are arranged on the outer periphery of the base portion. The turbomolecular pump described in Patent Document 1 includes a sensor for measuring the temperature of a motor that rotates the rotating blade, a sensor for measuring the internal temperature of the base portion, and a sensor for measuring the external temperature of the base portion, and sends the detection signals of these sensors to a control device. This control device is configured to be able to send an on-off control command signal to the heater provided in the turbomolecular pump or send an on-off control command to an electromagnetic valve that controls the flow of cooling water to the water-cooling pipe provided in the turbomolecular pump. When the control device sends an on command signal to the electromagnetic valve, the electromagnetic valve opens and cooling water flows through the water-cooling pipe, and when an off command signal is sent, the electromagnetic valve closes and cooling water stops flowing through the water-cooling pipe.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a semiconductor manufacturing apparatus equipped with a turbo molecular pump described in Patent Document 1, it is normal to select an optimal pump according to a predetermined process. However, combined with the recent complication of processes, it has been necessary to prepare pumps with many specifications.

[0006] On the other hand, the number of chambers per semiconductor manufacturing apparatus has also increased, and in preparation for the maintenance of the turbo molecular pump, spares for each specification are required, resulting in a large inventory.

[0007] As one of the methods for solving the above problems, in a semiconductor manufacturing apparatus equipped with a turbo molecular pump, a user may desire to change the operating specifications of the turbo molecular pump. In this case, the user or field service engineer has to go to the location where the turbo molecular pump and the control device are installed, perform the attachment and detachment work of the specification change device for changing the operating specifications of the turbo molecular pump, or input an instruction to change the settings related to the operating specifications of the turbo molecular pump by manually operating the control device after detaching the device. Therefore, there is a problem that the workload on the user or the field service engineer is large.

[0008] The present invention has been made in view of the above circumstances, and provides a vacuum pump capable of reducing the workload of users and field service engineers. and Control device of vacuum pump placement with the aim of providing.

Means for Solving the Problem

[0009] To achieve the above object, the vacuum pump of the present invention A pump body that evacuates the gas inside the device to be evacuated, A control device that controls the pump body, is a vacuum pump provided with The control device a storage unit that stores a plurality of operating specifications of the pump body according to the rated rotational speed of the motor of the pump body and the set temperature controlled by the heating means or the cooling means of the pump body; from a remote control device that remotely controls the pump body including an instruction to change the operating specification of the pump body remote signal receiving means for receiving a command signal and and comprising Based on the command signal received by the remote signal receiving means, the a plurality operating specifications the rated rotational speed of the motor and the set temperature so as to be one of the operating specifications among them are changed, which is characterized in that

[0010] In the above vacuum pump When the pump body is operating, when the remote signal receiving means receives the command signal from the remote control device, without stopping the operation of the pump body, based on the command signal the rated rotational speed of the motor and the set temperature it may be changed

[0011] In the above vacuum pump further comprising a specification change device for changing the operating specifications of the pump body The control device may change the settings regarding the operation of the specification change device based on the command signal received by the remote signal receiving means

[0012] In the above vacuum pump The specification change device may be heating means for heating the pump body the or cooling means for cooling the pump body the as follows

[0013] In the above vacuum pump, before the operating specifications possessed by the pump body the a control target device whose operating specifications can be changed, and By changing the operating specifications of the control target device, the a plurality operating specifications the rated rotational speed of the motor and the set temperature so as to be one of the operating specifications among them are changed, and comprising a specification setting device it may be made so.

[0014] In the above vacuum pump, the remote control device remote signal transmission means for transmitting the command signal to the control device; It may be provided with remote control means for remotely controlling the pump body by causing the remote signal transmission means to transmit the command signal to the control device.

[0015] Also, in order to achieve the above object, the control device of the vacuum pump of the present invention control means for controlling the pump body that evacuates the gas inside the device to be evacuated; a storage unit that stores a plurality of operating specifications of the pump body according to the rated rotational speed of the motor of the pump body and the set temperature controlled by the heating means or the cooling means of the pump body; remote signal receiving means for receiving a command signal including an instruction to change the operating specification of the pump body from a remote control device that remotely controls the pump body; A control device for a vacuum pump, comprising: The control means is characterized in that, based on the command signal received by the remote signal receiving means, the rated rotational speed of the motor and the set temperature are changed so as to be one of the plurality of operating specifications.

Advantages of the Invention

[0016] According to the present invention, a vacuum pump capable of reducing the work load of users and field service engineers can be provided. and The control device of the vacuum pump placement can be provided.

Brief Description of the Drawings

[0017]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Best Mode for Carrying Out the Invention

[0018] Embodiments of the present invention will be described below with reference to the accompanying drawings. In the figures, components that are the same or equivalent to each other are denoted by the same reference numerals.

[0019] The vacuum pump system 1 shown in FIG. 1 evacuates gases such as air and process gas inside the semiconductor manufacturing apparatus X. The semiconductor manufacturing apparatus X includes a chamber XR, and manufactures a semiconductor by executing various processes for manufacturing a semiconductor inside the chamber XR. Specific examples of the processes executed by the semiconductor manufacturing apparatus X inside the chamber XR include a process of forming a circuit on a semiconductor substrate by etching or film formation, a process of introducing a process gas into the chamber XR and causing the process gas to act on the semiconductor substrate, and the like. The semiconductor manufacturing apparatus X is an example of an apparatus to be evacuated. In the present embodiment, the apparatus to be evacuated is described as the semiconductor manufacturing apparatus X, but this is merely an example, and the apparatus to be evacuated may be any apparatus.

[0020] As shown in FIG. 1, the vacuum pump system 1 includes a vacuum pump 10 and a remote control device 300. The vacuum pump 10 is attached to the chamber XR of the semiconductor manufacturing apparatus X, and includes a turbo molecular pump 100 that evacuates the gas inside the chamber XR, and a control device 200 that controls the turbo molecular pump 100 and monitors its operating state. The turbo molecular pump 100 is an example of a pump body. In the present embodiment, the pump body is described as the turbo molecular pump 100, but this is merely an example, and the pump body may be a vacuum pump other than the turbo molecular pump, such as an oil rotary vacuum pump or a diaphragm type vacuum pump.

[0021] The control device 200 is connected to the turbo molecular pump 100 by a connection cable 11 which is a signal transmission path, and transmits and receives signals by performing wired communication with the turbo molecular pump 100 via the connection cable 11. Specifically, the control device 200 controls the operation of the turbo molecular pump 100 by transmitting a command signal to the turbo molecular pump 100 via the connection cable 11. Further, the control device 200 monitors the operating state of the turbo molecular pump 100 by receiving detection signals output from various sensors provided in the turbo molecular pump 100 via the connection cable 11. In this embodiment, the turbo molecular pump 100 and the control device 200 are provided independently of each other and are described as being connected to each other via the connection cable 11, but this is merely an example, and the turbo molecular pump 100 and the control device 200 may be integrated into a single device.

[0022] The control device 200 transmits and receives signals by performing remote communication with the remote control device 300. Note that the control device 200 may transmit and receive signals by performing remote communication with the remote control device 300 via a communication cable, or may transmit and receive signals by performing wireless communication with the remote control device 300. The control device 200 receives a command signal by remote communication from the remote control device 300, and controls the turbo molecular pump 100 according to the received command signal. The remote control device 300 remotely controls the turbo molecular pump 100 according to an instruction by a user (for example, an operator in a factory where the semiconductor manufacturing apparatus X is installed). Specifically, the remote control device 300 receives an input of an instruction by the user, transmits a command signal corresponding to the received instruction to the control device 200 by remote communication, and causes the control device 200 to control the turbo molecular pump 100 according to the received command signal, thereby remotely controlling the turbo molecular pump 100. In the present embodiment, the remote control device 300 is described as remotely controlling the turbo molecular pump 100, but this is merely an example, and a monitoring system including a host computer (server) may be configured to remotely control the turbo molecular pump 100 by functioning as a remote control device. The remote control device 300 is installed at a location away from the location where the semiconductor manufacturing apparatus X and the vacuum pump 10 are installed within the factory where the semiconductor manufacturing apparatus X is installed. Note that this is merely an example, and the remote control device 300 may be installed at a location away from the factory where the semiconductor manufacturing apparatus X and the vacuum pump 10 are installed.

[0023] A longitudinal sectional view of this turbo molecular pump 100 is shown in FIG. 2. In FIG. 2, an intake port 101 is formed at the upper end of a cylindrical outer cylinder 127 of the turbo molecular pump 100. And inside the outer cylinder 127, a rotating body 103 is provided with a plurality of rotating blades 102 (102a, 102b, 102c ···), which are turbine blades for sucking and exhausting gas, formed radially and in multiple stages on the circumferential part. A rotor shaft 113 is attached to the center of this rotating body 103, and this rotor shaft 113 is levitated and position - controlled in the air by, for example, a magnetic bearing with 5 - axis control. The rotating body 103 is generally composed of a metal such as aluminum or an aluminum alloy.

[0024] The upper - side radial electromagnets 104 have four electromagnets arranged in pairs with respect to the X - axis and the Y - axis. Four upper - side radial sensors 107 are provided in proximity to and corresponding to each of the upper - side radial electromagnets 104. For the upper - side radial sensor 107, for example, an inductance sensor having a conductive winding or an eddy - current sensor is used, and the position of the rotor shaft 113 is detected based on the change in the inductance of this conductive winding that changes according to the position of the rotor shaft 113. This upper - side radial sensor 107 is configured to detect the radial displacement of the rotor shaft 113, that is, the rotating body 103 fixed thereto, and send it to the control device 200.

[0025] In this control device 200, for example, a compensation circuit having a PID adjustment function generates an excitation control command signal for the upper - side radial electromagnet 104 based on the position signal detected by the upper - side radial sensor 107, and an amplifier circuit 150 (described later in FIG. 3) controls the excitation of the upper - side radial electromagnet 104 based on this excitation control command signal, thereby adjusting the radial position above the rotor shaft 113.

[0026] The rotor shaft 113 is made of a high magnetic permeability material (such as iron or stainless steel) and is attracted by the magnetic force of the upper radial electromagnet 104. Such adjustment is performed independently in the X-axis direction and the Y-axis direction. Also, the lower radial electromagnet 105 and the lower radial sensor 108 are arranged in the same manner as the upper radial electromagnet 104 and the upper radial sensor 107, and the radial position of the lower side of the rotor shaft 113 is adjusted in the same way as the radial position of the upper side.

[0027] Furthermore, the axial electromagnets 106A and 106B are arranged sandwiching the disk-shaped metal disk 111 provided at the lower part of the rotor shaft 113 from above and below. The metal disk 111 is made of a high magnetic permeability material such as iron. An axial sensor 109 is provided to detect the axial displacement of the rotor shaft 113, and its axial position signal is configured to be sent to the control device 200.

[0028] Then, in the control device 200, a compensation circuit having, for example, a PID adjustment function generates respective excitation control command signals for the axial electromagnet 106A and the axial electromagnet 106B based on the axial position signal detected by the axial sensor 109. The amplifier circuit 150 performs excitation control on the axial electromagnet 106A and the axial electromagnet 106B respectively based on these excitation control command signals. Thus, the axial electromagnet 106A attracts the metal disk 111 upward by magnetic force, the axial electromagnet 106B attracts the metal disk 111 downward, and the axial position of the rotor shaft 113 is adjusted.

[0029] In this way, the control device 200 appropriately adjusts the magnetic force exerted by the axial electromagnets 106A and 106B on the metal disk 111 to magnetically levitate the rotor shaft 113 axially and hold it in space in a non-contact manner. The amplifier circuit 150 for performing excitation control on these upper radial electromagnet 104, lower radial electromagnet 105, and axial electromagnets 106A and 106B will be described later.

[0030] On one hand, the motor 121 includes a plurality of magnetic poles arranged circumferentially so as to surround the rotor shaft 113. Each magnetic pole is controlled by the control device 200 so as to rotationally drive the rotor shaft 113 via the electromagnetic force acting between the magnetic pole and the rotor shaft 113. Further, a rotation speed sensor such as a Hall element, a resolver, or an encoder (not shown) is incorporated in the motor 121, and the rotation speed of the rotor shaft 113 is detected by the detection signal of this rotation speed sensor.

[0031] Furthermore, a phase sensor (not shown) is attached near, for example, the lower radial sensor 108 to detect the rotation phase of the rotor shaft 113. In the control device 200, the detection signals of this phase sensor and the rotation speed sensor are used together to detect the position of the magnetic pole.

[0032] A plurality of fixed blades 123 (123a, 123b, 123c ···) are arranged with a slight gap from the rotary blades 102 (102a, 102b, 102c ···). The rotary blades 102 (102a, 102b, 102c ···) are each formed by being inclined by a predetermined angle from a plane perpendicular to the axis of the rotor shaft 113 in order to transfer the molecules of the exhaust gas downward by collision. The fixed blades 123 (123a, 123b, 123c ···) are made of, for example, a metal such as aluminum, iron, stainless steel, copper, or an alloy containing these metals as components.

[0033] Also, the fixed blades 123 are similarly formed by being inclined by a predetermined angle from a plane perpendicular to the axis of the rotor shaft 113 and are arranged alternately with the stages of the rotary blades 102 toward the inside of the outer cylinder 127. The outer peripheral ends of the fixed blades 123 are supported in a state of being inserted between a plurality of stacked fixed blade spacers 125 (125a, 125b, 125c ···).

[0034] The fixed-wing spacer 125 is a ring-shaped member and is made of, for example, metals such as aluminum, iron, stainless steel, copper, or alloys containing these metals as components. An outer cylinder 127 is fixed to the outer periphery of the fixed-wing spacer 125 with a slight gap therebetween. A base portion 129 is disposed at the bottom of the outer cylinder 127. An exhaust port 133 is formed in the base portion 129 and communicates with the outside. The exhaust gas that enters the intake port 101 from the chamber (vacuum chamber) side and is transferred to the base portion 129 is sent to the exhaust port 133.

[0035] Furthermore, depending on the application of the turbo molecular pump 100, a threaded spacer 131 is disposed between the lower part of the fixed-wing spacer 125 and the base portion 129. The threaded spacer 131 is a cylindrical member made of a metal such as aluminum, copper, stainless steel, iron, or an alloy containing these metals as components, and a plurality of spiral thread grooves 131a are engraved on its inner peripheral surface. The direction of the spiral of the thread grooves 131a is such that when the molecules of the exhaust gas move in the rotational direction of the rotating body 103, these molecules are transferred toward the exhaust port 133. A cylindrical portion 102d hangs down at the lowermost part following the rotating blades 102 (102a, 102b, 102c ···) of the rotating body 103. The outer peripheral surface of this cylindrical portion 102d is cylindrical and protrudes toward the inner peripheral surface of the threaded spacer 131, and is close to the inner peripheral surface of the threaded spacer 131 with a predetermined gap therebetween. The exhaust gas transferred to the thread grooves 131a by the rotating blades 102 and the fixed-wing 123 is sent to the base portion 129 while being guided by the thread grooves 131a.

[0036] The base portion 129 is a disk-shaped member that constitutes the base of the turbo molecular pump 100 and is generally made of metals such as iron, aluminum, and stainless steel. Since the base portion 129 physically holds the turbo molecular pump 100 and also serves as a heat conduction path, it is desirable to use a metal with high rigidity and high thermal conductivity such as iron, aluminum, or copper.

[0037] In such a configuration, when the rotary blade 102 is rotationally driven by the motor 121 together with the rotor shaft 113, exhaust gas is sucked from the chamber through the intake port 101 due to the action of the rotary blade 102 and the fixed blade 123. The rotational speed of the rotary blade 102 is usually 20,000 rpm to 90,000 rpm, and the peripheral speed at the tip of the rotary blade 102 reaches 200 m / s to 400 m / s. The exhaust gas sucked from the intake port 101 passes between the rotary blade 102 and the fixed blade 123 and is transferred to the base portion 129. At this time, the temperature of the rotary blade 102 rises due to frictional heat generated when the exhaust gas contacts the rotary blade 102 and conduction of heat generated by the motor 121. This heat is transferred to the fixed blade 123 side by radiation or conduction by gas molecules of the exhaust gas.

[0038] The fixed blade spacers 125 are joined to each other at the outer peripheral portion, and transfer heat received by the fixed blade 123 from the rotary blade 102 and frictional heat generated when the exhaust gas contacts the fixed blade 123 to the outside.

[0039] In the above description, the threaded spacer 131 is disposed on the outer periphery of the cylindrical portion 102d of the rotating body 103, and the thread groove 131a is formed on the inner peripheral surface of the threaded spacer 131. However, conversely, there may be a case where a thread groove is formed on the outer peripheral surface of the cylindrical portion 102d, and a spacer having a cylindrical inner peripheral surface is disposed around it.

[0040] Also, depending on the use of the turbo molecular pump 100, in order to prevent the gas sucked from the intake port 101 from entering the electrical component section composed of the upper radial electromagnet 104, the upper radial sensor 107, the motor 121, the lower radial electromagnet 105, the lower radial sensor 108, the axial electromagnets 106A, 106B, the axial sensor 109, etc., the electrical component section is covered by the stator column 122 around it, and the inside of this stator column 122 may be maintained at a predetermined pressure with purge gas.

[0041] In this case, pipes (not shown) are arranged in the base portion 129, and purge gas is introduced through these pipes. The introduced purge gas is sent to the exhaust port 133 through the gaps between the protective bearing 120 and the rotor shaft 113, between the rotor and the stator of the motor 121, and between the stator column 122 and the inner peripheral cylindrical portion of the rotating blade 102.

[0042] Here, the turbo molecular pump 100 requires control based on the identification of the model and specific parameters (for example, various characteristics corresponding to the model) adjusted individually. To store this control parameter, the turbo molecular pump 100 is provided with an electronic circuit unit 141 inside its body. The electronic circuit unit 141 is composed of electronic components such as a semiconductor memory such as an EEP-ROM and semiconductor elements for accessing it, and a substrate 143 for mounting them. This electronic circuit unit 141 is housed below a rotation speed sensor (not shown) near the center, for example, of the base portion 129 that constitutes the lower part of the turbo molecular pump 100, and is closed by an airtight bottom cover 145.

[0043] By the way, in the semiconductor manufacturing process, among the process gases introduced into the chamber, there are some that become solid when their pressure becomes higher than a predetermined value or their temperature becomes lower than a predetermined value. Inside the turbo molecular pump 100, the pressure of the exhaust gas is the lowest at the intake port 101 and the highest at the exhaust port 133. When the pressure of the process gas becomes higher than a predetermined value or its temperature becomes lower than a predetermined value during the transfer of the process gas from the intake port 101 to the exhaust port 133, the process gas becomes solid and adheres and accumulates inside the turbo molecular pump 100.

[0044] For example, when SiCl4 is used as a process gas in an Al etching apparatus, solid products (e.g., AlCl3) precipitate at low vacuum (760 [torr] to 10-2 [torr]) and low temperature (about 20 [°C]), and it can be seen from the vapor pressure curve that they adhere and deposit inside the turbo molecular pump 100. As a result, when deposits of the process gas accumulate inside the turbo molecular pump 100, these deposits narrow the pump flow path, causing a decrease in the performance of the turbo molecular pump 100. And the above-mentioned products were in a situation where they were likely to solidify and adhere at high-pressure parts near the exhaust port 133 and near the threaded spacer 131.

[0045] Therefore, in order to solve this problem, conventionally, a heater (not shown) or an annular water-cooling pipe 149 is wound around the outer periphery of the base portion 129 or the like, and for example, a temperature sensor (e.g., a thermistor) not shown is embedded in the base portion 129, and based on the signal of this temperature sensor, the temperature of the base portion 129 is maintained at a constant high temperature (set temperature) by controlling the heating of the heater and the cooling by the water-cooling pipe 149 (hereinafter referred to as TMS. TMS; Temperature Management System).

[0046] Next, regarding the turbo molecular pump 100 configured as described above, an amplifier circuit 150 for exciting and controlling the upper radial electromagnet 104, the lower radial electromagnet 105, and the axial electromagnets 106A and 106B will be described. The circuit diagram of this amplifier circuit 150 is shown in FIG. 3.

[0047] In FIG. 3, one end of the electromagnetic coil 151 constituting the upper radial electromagnet 104 or the like is connected to the positive electrode 171a of the power supply 171 via the transistor 161, and the other end is connected to the negative electrode 171b of the power supply 171 via the current detection circuit 181 and the transistor 162. The transistors 161 and 162 are so-called power MOSFETs and have a structure in which a diode is connected between their source and drain.

[0048] At this time, for transistor 161, the cathode terminal 161a of its diode is connected to the positive electrode 171a, and the anode terminal 161b is connected to one end of the electromagnet winding 151. Also, for transistor 162, the cathode terminal 162a of its diode is connected to the current detection circuit 181, and the anode terminal 162b is connected to the negative electrode 171b.

[0049] On the other hand, for the current regeneration diode 165, its cathode terminal 165a is connected to one end of the electromagnet winding 151, and its anode terminal 165b is connected to the negative electrode 171b. Similarly, for the current regeneration diode 166, its cathode terminal 166a is connected to the positive electrode 171a, and its anode terminal 166b is connected to the other end of the electromagnet winding 151 via the current detection circuit 181. And the current detection circuit 181 is composed of, for example, a Hall sensor type current sensor or an electrical resistance element.

[0050] The amplifier circuit 150 configured as described above corresponds to one electromagnet. Therefore, when the magnetic bearing is under five-axis control and there are a total of 10 electromagnets 104, 105, 106A, 106B, similar amplifier circuits 150 are configured for each of the electromagnets, and 10 amplifier circuits 150 are connected in parallel to the power supply 171.

[0051] Furthermore, the amplifier control circuit 191 is composed of, for example, a digital signal processor section (hereinafter referred to as the DSP section) not shown in the control device 200, and this amplifier control circuit 191 is configured to switch the on / off of transistors 161 and 162.

[0052] The amplifier control circuit 191 is configured to compare the current value detected by the current detection circuit 181 (a signal reflecting this current value is referred to as the current detection signal 191c) with a predetermined current command value. And based on this comparison result, it determines the magnitude of the pulse width (pulse width times Tp1, Tp2) generated within the control cycle Ts which is one period by PWM control. As a result, the gate drive signals 191a, 191b having this pulse width are output from the amplifier control circuit 191 to the gate terminals of the transistors 161, 162.

[0053] Note that when passing through the resonance point during the acceleration operation of the rotational speed of the rotating body 103 or when a disturbance occurs during the constant speed operation, etc., it is necessary to control the position of the rotating body 103 with high speed and strong force. Therefore, as the power supply 171, a high voltage of about 50V, for example, is used so that a rapid increase (or decrease) in the current flowing through the electromagnet winding 151 can occur. Also, a normal capacitor is connected between the positive electrode 171a and the negative electrode 171b of the power supply 171 for the stabilization of the power supply 171 (not shown in the figure).

[0054] In such a configuration, when both of the transistors 161, 162 are turned on, the current flowing through the electromagnet winding 151 (hereinafter referred to as the electromagnet current iL) increases, and when both are turned off, the electromagnet current iL decreases.

[0055] Also, when one of the transistors 161, 162 is turned on and the other is turned off, a so-called flywheel current is maintained. And by flowing the flywheel current through the amplifier circuit 150 in this way, the hysteresis loss in the amplifier circuit 150 can be reduced, and the power consumption of the entire circuit can be kept low. Also, by controlling the transistors 161, 162 in this way, high-frequency noise such as harmonics generated in the turbo molecular pump 100 can be reduced. Furthermore, by measuring this flywheel current with the current detection circuit 181, the electromagnet current iL flowing through the electromagnet winding 151 can be detected.

[0056] That is, when the detected current value is smaller than the current command value, as shown in FIG. 4, only once during the control cycle Ts (for example, 100 μs), both transistors 161 and 162 are turned on for a time corresponding to the pulse width time Tp1. Therefore, during this period, the electromagnetic current iL increases toward the current value iLmax (not shown) that can flow from the positive electrode 171a to the negative electrode 171b via the transistors 161 and 162.

[0057] On the other hand, when the detected current value is larger than the current command value, as shown in FIG. 5, only once during the control cycle Ts, both transistors 161 and 162 are turned off for a time corresponding to the pulse width time Tp2. Therefore, during this period, the electromagnetic current iL decreases toward the current value iLmin (not shown) that can be regenerated from the negative electrode 171b to the positive electrode 171a via the diodes 165 and 166.

[0058] And in any case, after the elapse of the pulse width times Tp1 and Tp2, one of the transistors 161 and 162 is turned on. Therefore, during this period, the flywheel current is held in the amplifier circuit 150.

[0059] Next, the configuration and functions of the control device 200 will be described. As shown in FIG. 6, the control device 200 includes a CPU (Central Processing Unit) 201, a storage unit 202, a wired communication unit 203, a remote communication unit 204, an output interface 205, an operation unit 206, and a system bus 207.

[0060] The CPU 201 executes various processes according to the programs and data stored in the storage unit 202. The storage unit 202 includes a non-volatile memory (not shown) such as a ROM (Read Only Memory), a flash memory, and an EPROM (Erasable Programmable Read Only memory), and stores the programs and data used by the CPU 201 to execute various processes in a non-volatile manner. Further, the storage unit 202 includes a RAM (Random Access Memory) (not shown) that functions as a work area for the CPU 201.

[0061] The wired communication unit 203 performs wired communication and transmits and receives signals with a device external to the control device 200 according to the control by the CPU 201. Specifically, the wired communication unit 203 includes a connector (not shown) to which the above-described connection cable 11 is connected, and transmits and receives signals to and from the turbo molecular pump 100 via the connection cable 11. More specifically, the wired communication unit 203 transmits a command signal generated by the CPU 201 to the turbo molecular pump 100 via the connection cable 11. Further, the wired communication unit 203 receives detection signals from various sensors included in the turbo molecular pump 100 via the connection cable 11, and outputs the received detection signals to the CPU 201. The remote communication unit 204 performs remote communication and transmits and receives signals with a device external to the control device 200. Specifically, the remote communication unit 204 includes a remote I / O (Input / Output) unit (not shown), and uses the remote I / O unit to perform remote communication in a serial communication method via a communication network with the remote control device 300, thereby transmitting and receiving signals. The remote communication unit 204 receives a command signal from the remote control device 300 by performing remote communication with the remote control device 300. The remote communication unit 204 is an example of remote signal receiving means.

[0062] The output interface 205 presents information regarding the operating state of the turbo molecular pump 100 to the user. Specifically, the output interface 205 includes an LCD (Liquid Crystal Display) panel (not shown), and various images for notifying the operating state of the turbo molecular pump 100, such as a message indicating the setting of the operating state of the turbo molecular pump 100, a message indicating the current operating state of the turbo molecular pump 100, and an error message for notifying an operation abnormality of the turbo molecular pump 100, are displayed on the LCD panel. Further, the output interface 205 includes notification lamps (not shown) for notifying the operating state of the turbo molecular pump 100, such as a power lamp (not shown) that lights up when the power of the turbo molecular pump 100 is on, and an error lamp (not shown) that lights up when an operation abnormality of the turbo molecular pump 100 occurs. The operating state of the turbo molecular pump 100 is notified to the user by switching the lighting / extinguishing of the notification lamp.

[0063] The operation unit 206 is provided with operators and receives inputs of various instructions from the user according to the user's operations on the operators. Specifically, as operators, the operation unit 206 includes operation switches such as a start switch for receiving a start instruction for the turbo molecular pump 100 and a stop switch for receiving a stop instruction for the turbo molecular pump 100, and receives inputs of various instructions according to the user's operations on the operation switches. The operation switches included in the operation unit 206 include a mode switch for switching between a remote control mode in which the control device 200 controls the turbo molecular pump 100 according to a command signal received by the remote communication unit 204 from the remote control device 300 and a manual operation control mode in which the turbo molecular pump 100 is controlled according to an instruction input by the user operating the operation unit 206. When the control device 200 is operating in the remote control mode, the CPU 201 transmits a command signal corresponding to the command signal received from the remote control device 300 to the turbo molecular pump 100 via the wired communication unit 203, thereby setting the control parameters of the turbo molecular pump 100 according to the received command signal and controlling the operation of the turbo molecular pump 100. When the control device 200 is operating in the manual operation control mode, the CPU 201 transmits a command signal corresponding to the instruction input by the user operating the operation unit 206 to the turbo molecular pump 100 via the wired communication unit 203, thereby setting the control parameters of the turbo molecular pump 100 according to the input instruction and controlling the operation of the turbo molecular pump 100. Hereinafter, in the present embodiment, the operation mode of the control device 200 will be described as being set to the remote control mode. The system bus 207 is a transmission path for commands and data and connects the CPU 201 to the operation unit 206 to each other.

[0064] The functions of the CPU 201 will be described in detail below. The CPU 201 controls the operation of the turbo molecular pump 100 by transmitting a command signal to the turbo molecular pump 100 via the connection cable 11 to the wired communication unit 203 and setting the control parameters of the turbo molecular pump 100. The CPU 201 is an example of a control means. The CPU 201 controls the operation of the turbo molecular pump 100 according to the command signal received by the remote communication unit 204 from the remote control device 300. Specifically, when the remote communication unit 204 receives a command signal from the remote control device 300 instructing the startup of the turbo molecular pump 100, the CPU 201 transmits the command signal via the wired communication unit 203 to start the turbo molecular pump 100. When the remote communication unit 204 receives a command signal from the remote control device 300 instructing the stop of the turbo molecular pump 100, the CPU 201 transmits the command signal via the wired communication unit 203 to stop the turbo molecular pump 100.

[0065] When the remote communication unit 204 receives a command signal from the remote control device 300 instructing the confirmation of the setting of the operation specifications of the turbo molecular pump 100, the CPU 201 generates a signal indicating the setting of the operation specifications and transmits the generated signal to the remote control device 300 via the remote communication unit 204. When the remote communication unit 204 receives a command signal from the remote control device 300 instructing the confirmation of the current operation specifications of the turbo molecular pump 100, the CPU 201 generates a signal indicating the operation specifications based on the detection signals input via the wired communication unit 203 from each sensor provided in the turbo molecular pump 100 and transmits the generated signal to the remote control device 300 via the remote communication unit 204.

[0066] The above-described turbo molecular pump 100 includes a heater (not shown) and a water cooling pipe 149 as a specification change device for changing (controlling) the temperature inside the turbo molecular pump 100, which is an example of the operating specifications of the turbo molecular pump 100. The heater is disposed, for example, on the base portion 129 of the turbo molecular pump 100 and heats the base portion 129. The heater is an example of a heating means. The water cooling pipe 149 is disposed on the base portion 129 of the turbo molecular pump 100 and cools the base portion 129. The water cooling pipe 149 is an example of a cooling means. A temperature sensor (e.g., a thermistor) (not shown) for measuring the temperature of the base portion 129 is disposed on the base portion 129 of the turbo molecular pump 100, and the CPU 201 receives the detection signal output by the temperature sensor via the wired communication unit 203. The CPU 201 performs TMS control to control the heating of the base portion 129 by the heater and the cooling of the base portion 129 by the water cooling pipe 149 so as to keep the temperature of the base portion 129 at a preset TMS set temperature according to the detection signal received from the temperature sensor.

[0067] In TMS control, the CPU 201 performs control to send an on control command signal to the heater via the wired communication unit 203 to start heating the base portion 129, or to send an off control command signal to the heater to stop heating the base portion 129. Further, in TMS control, the CPU 201 performs control to send an on command signal to a solenoid valve (not shown) that controls the flow of cooling water to the water cooling pipe 149 via the wired communication unit 203 to open the solenoid valve, or to send an off command signal to the solenoid valve to close the solenoid valve. When the CPU 201 sends an on command signal to the solenoid valve to open the solenoid valve, cooling water flows through the water cooling pipe 149, and cooling of the base portion 129 by the water cooling pipe 149 is started. When the CPU 201 sends an off command signal to the solenoid valve to close the solenoid valve, the flow of cooling water through the water cooling pipe 149 stops, and cooling of the base portion 129 by the water cooling pipe 149 is stopped.

[0068] The CPU 201 controls the operation of the turbo molecular pump 100 and performs TMS control to operate the turbo molecular pump 100 in any one of the specifications (operation specifications) 1 to 4 shown in FIG. 7. As shown in FIG. 7, depending on the specification, the setting of the rated rotational speed of the motor 121 that rotationally drives the rotating blades 102 of the turbo molecular pump 100 is different. Specifically, the rotational speed ω2 set as the rated rotational speed of the motor 121 in specification 2 and the rotational speed ω3 set as the rated rotational speed of the motor 121 in specification 3 are the same as the rotational speed ω1 set as the rated rotational speed of the motor 121 in specification 1. In contrast, the rotational speed ω4 set as the rated rotational speed of the motor 121 in specification 4 is smaller than the rotational speed ω1.

[0069] Furthermore, as shown in FIG. 7, depending on the specification, the control mode of the TMS control executed by the CPU 201 and the TMS set temperature that is the target temperature in the TMS control are also different. In specification 1, the TMS control is not executed and the TMS set temperature is not set either. In specification 1, the solenoid valve that controls the flow of cooling water to the water cooling pipe 149 is always open, and cooling by the water cooling pipe 149 is always performed. In specification 2, TMS control in the TMS standard mode with the temperature T2 as the TMS set temperature is performed. In specification 3, TMS control in the TMS first special mode with a temperature T3 higher than the temperature T2 as the TMS set temperature is performed. In specification 4, TMS control in the TMS second special mode with a temperature T4 higher than the temperature T3 as the TMS set temperature is performed. In specification 1 where the TMS control is not performed, neither the control of heating by the heater nor the control of cooling by the water cooling pipe 149 is performed. In specifications 2 to 3 where the TMS control in the TMS standard mode, the TMS first special mode, or the TMS second special mode is performed, the control of heating by the heater and the control of cooling by the water cooling pipe 149 are performed. Thus, depending on the specification, due to the difference in the control mode of the TMS control, the execution or non-execution of the control of heating by the heater and the execution or non-execution of the control of cooling by the water cooling pipe 149 are different.

[0070] The exhaust performance of the turbo molecular pump 100, such as the exhaust speed of the turbo molecular pump 100, the compression ratio of the turbo molecular pump 100, and the ultimate pressure of the turbo molecular pump 100, the allowable flow rate of the turbo molecular pump 100, and the temperature inside the pump, which is the temperature of the gas flow path inside the turbo molecular pump 100, all depend on the rated rotational speed of the motor 121 and the TMS set temperature, and vary according to the specifications. Specifically, in Specification 2 and Specification 3, the exhaust speed, compression ratio, and ultimate pressure of the turbo molecular pump 100 are equivalent to those of Specification 1, which is the reference, while in Specification 4, they are lower than those of Specification 1. The allowable flow rate of the turbo molecular pump 100 is lower in Specification 2 than in Specification 1, lower in Specification 3 than in Specification 2, and lower in Specification 2 and higher than in Specification 3 in Specification 4. The temperature T P 2 inside the pump in Specification 2 is the temperature T P 1 inside the pump in Specification 1, and is higher than T P 3 inside the pump in Specification 3 is the temperature T P 2 inside the pump in Specification 2, and is higher than T P 4 inside the pump in Specification 4 is the temperature T P 3 inside the pump in Specification 3, and is higher than T

[0071] In this embodiment, the specifications of the turbo molecular pump 100 are described as four types, namely Specification 1 to Specification 4. However, this is merely an example, and the specifications of the turbo molecular pump 100 may be three or less types, or five or more types. Also, the setting of the specifications shown in FIG. 7 is merely an example, and the specifications of the turbo molecular pump 100 can be set arbitrarily.

[0072] In the storage unit 202 included in the control device 200, specification information indicating settings related to the operating state of the turbo molecular pump 100 in Specifications 1 to 4 shown in FIG. 7 is stored in advance. The CPU 201 controls the operation of the turbo molecular pump 100 according to the specification information and performs TMS control to operate the turbo molecular pump 100 in any one of Specifications 1 to 4. Specifically, the CPU 201 identifies the rated rotation speed of the motor 121 corresponding to the currently set specification by referring to the specification information, and transmits a command signal to the turbo molecular pump 100 via the wired communication unit 203, thereby setting the control parameters of the turbo molecular pump 100 so that the rated rotation speed of the motor 121 becomes the identified rated rotation speed. Further, the CPU 201 identifies the control mode and the TMS set temperature of the TMS control corresponding to the currently set specification by referring to the specification information, and performs the TMS control in the identified control mode with the identified TMS set temperature as the target temperature.

[0073] As will be described later, when the remote control device 300 receives an instruction from the user to change the specification of the turbo molecular pump 100 to the specification specified by the user, the remote control device 300 transmits a setting change command signal, which is a command signal for instructing the change of the specification of the turbo molecular pump 100 to the specification specified by the user, to the control device 200 by remote communication. When the remote communication unit 204 of the CPU 201 receives the setting change command signal from the remote control device 300, the CPU 201 changes the specification (operation specification) of the turbo molecular pump 100, which is an example of the setting related to the operating state of the turbo molecular pump 100, based on the received setting change command signal.

[0074] Specifically, when the remote communication unit 204 receives a setting change command signal, the CPU 201 refers to the above-described specification information to identify the rated rotational speed of the motor 121 corresponding to the specifications of the turbo molecular pump 100 after the change indicated by the setting change command signal. Then, the CPU 201 transmits a command signal to the turbo molecular pump 100 via the wired communication unit 203, and by changing the control parameters of the turbo molecular pump 100, changes the rated rotational speed of the motor 121 from the rated rotational speed corresponding to the currently set specifications of the turbo molecular pump 100 to the rated rotational speed corresponding to the specified changed specifications of the turbo molecular pump 100.

[0075] Furthermore, when the remote communication unit 204 receives a setting change command signal, the CPU 201 refers to the specification information to identify the control mode and TMS set temperature of the TMS control corresponding to the specifications of the turbo molecular pump 100 after the change indicated by the setting change command signal. Then, the CPU 201 changes the control mode of the TMS control from the control mode corresponding to the currently set specifications of the turbo molecular pump 100 to the control mode corresponding to the specified changed specifications of the turbo molecular pump 100, and at the same time, changes the TMS set temperature from the TMS set temperature corresponding to the currently set specifications of the turbo molecular pump 100 to the TMS set temperature corresponding to the specified changed specifications of the turbo molecular pump 100. In this way, when the remote communication unit 204 receives a setting change command signal from the remote control device 300, the CPU 201 changes the control mode and TMS set temperature of the TMS control, which are settings related to the operations of the heater and the water-cooling pipe 149 as a specification change device for changing the operating specifications of the turbo molecular pump 100, based on the received setting change command signal.

[0076] When the turbo molecular pump 100 is operating and TMS control is being performed, if the remote communication unit 204 receives a setting change command signal, the CPU 201 changes the specifications of the turbo molecular pump 100 based on the received setting change command signal without stopping the operation of the turbo molecular pump 100 and without stopping the TMS control, and changes the control mode of the TMS control and the TMS set temperature. Specifically, when the turbo molecular pump 100 is operating and the remote communication unit 204 receives a setting change command signal, the CPU 201 transmits a command signal to the turbo molecular pump 100 via the wired communication unit 203, so that without stopping the rotational drive of the rotary blade 102 by the motor 121, the rated rotational speed of the motor 121 is changed from the currently set rated rotational speed to the rated rotational speed corresponding to the specifications of the turbo molecular pump 100 after the change. Also, when the TMS control is being performed and the remote communication unit 204 receives a setting change command signal, the CPU 201 changes the control mode of the TMS control from the currently set control mode to the control mode corresponding to the specifications of the turbo molecular pump 100 after the change without stopping the TMS control, and changes the TMS set temperature from the currently set TMS set temperature to the TMS set temperature corresponding to the specifications of the turbo molecular pump 100 after the change.

[0077] Next, the configuration and functions of the remote control device 300 will be described. As shown in FIG. 8, the remote control device 300 includes a CPU 301, a storage unit 302, a remote communication unit 303, an output interface 304, an operation unit 305, and a system bus 306.

[0078] The CPU 301 executes various processes in accordance with the programs and data stored in the storage unit 302. The storage unit 302 includes a non-volatile memory (not shown) such as a ROM, a flash memory, or an EPROM, and stores the programs and data used by the CPU 301 to execute various processes in a non-volatile manner. Further, the storage unit 302 includes a RAM (not shown) that functions as a work area for the CPU 301. The remote communication unit 303 performs remote communication with devices external to the remote control device 300 and transmits and receives signals. Specifically, the remote communication unit 303 includes a remote I / O unit (not shown), and uses the remote I / O unit to perform serial communication-based remote communication via a communication network with the control device 200, thereby transmitting and receiving signals. The remote communication unit 303 transmits a command signal to the control device 200 by performing remote communication with the control device 200. The remote communication unit 303 is an example of remote signal transmission means.

[0079] The output interface 304 presents information regarding the operating state of the turbo molecular pump 100 to the user. Specifically, the output interface 304 includes an LCD panel (not shown), and displays various images for notifying the operating state of the turbo molecular pump 100 on the LCD panel, such as a message indicating the setting of the operating specifications of the turbo molecular pump 100, a message indicating the current operating state of the turbo molecular pump 100, and an error message for notifying an operation abnormality of the turbo molecular pump 100. The operation unit 305 includes operators such as a keyboard, a touch panel, and operation switches, and accepts input of various instructions by the user according to the user's operations on the operators. The system bus 306 is a transmission path for commands and data, and connects the CPU 301 to the operation unit 305 to each other.

[0080] The functions of the CPU 301 will be described in detail below. The CPU 301 remotely controls the turbo molecular pump 100 in accordance with an instruction input by the user operating the operation unit 305. Specifically, the CPU 301 causes the remote communication unit 303 to transmit a command signal corresponding to the instruction received by the operation unit 305 to the control device 200, and causes the control device 200 to control the operation of the turbo molecular pump 100 according to the received command signal, thereby remotely controlling the turbo molecular pump 100. The CPU 301 is an example of remote control means. Specifically, when the user operates the operation unit 305 to input an instruction to start the turbo molecular pump 100, the CPU 301 causes the remote communication unit 303 to transmit a command signal for instructing the start of the turbo molecular pump 100 to the control device 200. When the user operates the operation unit 305 to input an instruction to stop the turbo molecular pump 100, the CPU 301 causes the remote communication unit 303 to transmit a command signal for instructing the stop of the turbo molecular pump 100 to the control device 200.

[0081] When the user operates the operation unit 305 to input an instruction to confirm the setting of the operation specifications of the turbo molecular pump 100, the CPU 301 causes the remote communication unit 303 to transmit a command signal for instructing the confirmation of the setting to the control device 200. When the control device 200 transmits a signal indicating the setting of the operation specifications of the turbo molecular pump 100 to the remote control device 300 in response to receiving the command signal, the CPU 301 receives the signal via the remote communication unit 303 and causes the output interface 304 to present the setting to the user based on the received signal. When the user operates the operation unit 305 to input an instruction to confirm the current operation specifications of the turbo molecular pump 100, the CPU 301 causes the remote communication unit 303 to transmit a command signal for instructing the confirmation of the operation specifications to the control device 200. When the control device 200 transmits a signal indicating the current operation specifications of the turbo molecular pump 100 to the remote control device 300 in response to receiving the command signal, the CPU 301 receives the signal via the remote communication unit 303 and causes the output interface 304 to present the operation specifications to the user based on the received signal.

[0082] When the CPU 301 receives an instruction from the user to operate the operation unit 305 to change the specifications of the turbo molecular pump 100 to the specifications specified by the user, the CPU 301 causes the remote communication unit 303 to transmit a setting change command signal, which is a command signal for instructing the control device 200 to change the specifications of the turbo molecular pump 100 to the specifications specified by the user, to the control device 200, so that the control device 200 changes the specifications of the turbo molecular pump 100 based on the received setting change command signal. As an example, the user refers to the schedule of the process performed in the chamber XR of the semiconductor manufacturing apparatus X and operates the operation unit 305 to instruct the switching of the specifications of the turbo molecular pump 100 at the timing when the process performed in the chamber XR is switched.

[0083] Hereinafter, with reference to the timing chart of FIG. 9, the change in the specifications of the turbo molecular pump 100 will be described by taking as an example the case where Process 1 and Process 2 are performed in the chamber XR. In Process 1, it is assumed that gases A, B, and C are introduced into the chamber XR as process gases by the semiconductor manufacturing apparatus X. In Process 2, it is assumed that gases D, E, and F are introduced into the chamber XR as process gases by the semiconductor manufacturing apparatus X. Hereinafter, the case where the control device 200 starts the operation according to Specification 2, which is the specification corresponding to Process 1, in the turbo molecular pump 100 and starts the TMS control corresponding to Specification 2 from time 0 will be described as an example. That is, the control device 200 starts the rotation of the motor 121 of the turbo molecular pump 100 at the rotation speed ω2, which is the rated rotation speed corresponding to Specification 2, from time 0. Further, the control device 200 starts the TMS control in the TMS standard mode with the temperature T2 as the TMS set temperature from time 0.

[0084] In the semiconductor manufacturing apparatus X, in Process 1, the introduction of gas A is started at time t1, the introduction of gas A is stopped at time t2, the introduction of gas B is started, the introduction of gas B is stopped at time t3, the introduction of gas C is started, and the introduction of gas C is stopped at time t4. Then, in Process 2, the semiconductor manufacturing apparatus X starts the introduction of gas D at time t6 after time t4, stops the introduction of gas D at time t7, starts the introduction of gas E, stops the introduction of gas E at time t8, starts the introduction of gas F, and stops the introduction of gas F at time t9. Next, in Process 1, the semiconductor manufacturing apparatus X starts the introduction of gas A at time t11 after time t9, stops the introduction of gas A at time t12, and starts the introduction of gas B.

[0085] Hereinafter, taking as an example the case where the user operates the remote control device 300 at a timing after the time t4 when the introduction of gas C is stopped in Process 1 and before the time t6 when the introduction of gas D is started in Process 2, and inputs an instruction to change the specification of the turbo molecular pump 100 from Specification 2, which is the currently set specification, to Specification 3, which is the specification corresponding to Process 2. In this case, the remote control device 300 transmits a setting change command signal to the control device 200 to instruct the control device 200 to switch the specification of the turbo molecular pump 100 from Specification 2 to Specification 3, which is the specification specified by the user, in response to the instruction by the user. Hereinafter, it is assumed that at time t5, which is after time t4 and before time t6, the control device 200 changes the specification of the turbo molecular pump 100 from Specification 2 to Specification 3 in response to receiving the setting change command signal from the remote control device 300.

[0086] At time t5, the control device 200 switches the specifications of the turbo molecular pump 100 from Specification 2 to Specification 3 without stopping the operation of the turbo molecular pump 100 and without stopping the TMS control. Specifically, the control device 200 identifies the rotational speed ω3, which is the rated rotational speed corresponding to Specification 3, by referring to the specification information stored in the storage unit 202. Then, the control device 200 changes the rated rotational speed of the motor 121 from the rotational speed ω2, which is the rated rotational speed corresponding to Specification 2, to the rotational speed ω3 by transmitting a command signal to the turbo molecular pump 100 to change the control parameters, without stopping the rotational drive of the rotor 102 by the motor 121. Further, the control device 200 identifies, by referring to the specification information, the TMS first special mode, which is the control mode of the TMS control corresponding to Specification 3, and the temperature T3, which is the TMS set temperature corresponding to Specification 3. Then, the control device 200 changes the control mode of the TMS control from the TMS standard mode corresponding to Specification 2 to the TMS first special mode and changes the TMS set temperature from the temperature T2 corresponding to Specification 2 to the temperature T3 without stopping the TMS control.

[0087] Hereinafter, taking as an example the case where at a timing after the time t9 when the introduction of gas F is stopped in Process 2 and before the time t11 when the introduction of gas A is started in Process 1, the user operates the remote control device 300 and inputs an instruction to change the specifications of the turbo molecular pump 100 from the currently set Specification 3 to Specification 2, which is the specification corresponding to Process 1. In this case, the remote control device 300 transmits a setting change command signal to the control device 200 to instruct the control device 200 to switch the specifications of the turbo molecular pump 100 from Specification 3 to Specification 2 specified by the user in response to the instruction by the user. Hereinafter, it is assumed that at the time t10 after the time t9 and before the time t11, the control device 200 changes the specifications of the turbo molecular pump 100 from Specification 3 to Specification 2 in response to receiving the setting change command signal from the remote control device 300.

[0088] At time t10, the control device 200 switches the specifications of the turbo molecular pump 100 from Specification 3 to Specification 2 without stopping the operation of the turbo molecular pump 100 and without stopping the TMS control. That is, the control device 200 changes the rated rotation speed of the motor 121 from the rotation speed ω3, which is the rated rotation speed corresponding to Specification 3, to the rotation speed ω2 corresponding to Specification 2, by transmitting a command signal to the turbo molecular pump 100 to change the control parameters, without stopping the rotational drive of the rotary blade 102 by the motor 121. Further, the control device 200 changes the control mode of the TMS control from the TMS first special mode corresponding to Specification 3 to the TMS standard mode corresponding to Specification 2 without stopping the TMS control, and changes the TMS set temperature from the temperature T3 corresponding to Specification 3 to the temperature T2 corresponding to Specification 2.

[0089] As described above, the turbo molecular pump 100 included in the vacuum pump 10 is configured to be operable in any of Specifications 1 to 4, and operates in any of Specifications 1 to 4 according to the control by the control device 200 included in the vacuum pump 10. According to such a configuration, in a factory where the semiconductor manufacturing apparatus X is installed, compared with the case of purchasing and holding a vacuum pump of Specification 1, a vacuum pump of Specification 2, a vacuum pump of Specification 3, and a vacuum pump of Specification 4 respectively, it is possible to reduce the purchase cost of the vacuum pump and the space required for storing the vacuum pump.

[0090] Such advantages of the vacuum pump 10 according to the present invention become particularly prominent when the semiconductor manufacturing apparatus X includes a plurality of chambers XR and different types of processes are performed in each chamber. Specifically, when the semiconductor manufacturing apparatus X includes a plurality of chambers XR and different types of processes are performed in each chamber XR, if different types of vacuum pumps operating according to the specifications corresponding to the processes performed in each chamber XR are attached to each chamber XR, when a vacuum pump fails or when the vacuum pump needs to be maintained and a spare vacuum pump for replacement is to be prepared, different types of vacuum pumps for each chamber XR have to be prepared as spare vacuum pumps respectively. For this reason, there is a risk that the cost required to purchase a large number of spare vacuum pumps and the space required to store a large number of spare vacuum pumps will become a burden on the user.

[0091] On the contrary, when the vacuum pump 10 according to the present invention is attached as a common pump that can operate in any of the specifications required in each of the processes performed in each of the plurality of chambers XR provided in the semiconductor manufacturing apparatus X, a spare vacuum pump 10 for one chamber XR can be used also as a spare vacuum pump 10 for another chamber XR. Therefore, compared with the above example of preparing different types of vacuum pumps as spare vacuum pumps for each chamber XR, the number of vacuum pumps to be prepared as spare vacuum pumps can be reduced, the purchase cost of the vacuum pumps can be reduced, and the space required for storing the vacuum pumps can be reduced.

[0092] As described above, in this embodiment, when the remote communication unit 204 of the control device 200 receives a setting change command signal from the remote control device 300, the control device 200 changes the specifications of the turbo molecular pump 100, which is an example of the settings related to the operating state of the turbo molecular pump 100, based on the received setting change command signal. According to such a configuration, the user can change the specifications of the turbo molecular pump 100 by operating the remote control device 300 installed at a location away from the vacuum pump 10, without going to the location where the vacuum pump 10 is installed and operating the control device 200. Therefore, according to such a configuration, the work burden on the user can be reduced.

[0093] Such an advantage of the vacuum pump 10 according to the present invention becomes particularly prominent when the semiconductor manufacturing apparatus X includes a plurality of chambers XR and the vacuum pump 10 is attached to each chamber as the above-described common pump. Specifically, if the user has to go to the location where each vacuum pump 10 is installed and manually operate the control device 200 to set the specifications of the vacuum pumps 10 attached to each of the plurality of chambers XR included in the semiconductor manufacturing apparatus X according to the processes performed in each chamber XR, the work burden on the user will increase. However, since the vacuum pump 10 is configured to be able to change its specifications in response to an instruction input by the user operating the remote control device 300, the user can change the specifications of the vacuum pump 10 without going to the location where the vacuum pump 10 is installed and operating the control device 200. Therefore, according to such a configuration, the work burden on the user can be reduced.

[0094] Also, in the present embodiment, when the remote communication unit 204 of the control device 200 receives a setting change command signal, the control device 200 changes the control mode of the TMS control and the TMS set temperature, which are settings related to the operations of the heater and the water-cooling pipe 149 serving as a specification change device for changing the operation specifications of the turbo molecular pump 100, based on the received setting change command signal. According to such a configuration, the user can change the settings related to the operations of the specification change device without going to the location where the vacuum pump 10 is installed and operating the control device 200 by operating the remote control device 300, and can change the operation specifications of the turbo molecular pump 100. Therefore, according to such a configuration, the work load of the user can be reduced. More specifically, the user can change the settings related to the operations of the heater for heating the base portion 129 and the water-cooling pipe 149 for cooling the base portion 129, which serve as a specification change device, without going to the location where the vacuum pump 10 is installed and operating the control device 200 by operating the remote control device 300, and can change the temperature inside the turbo molecular pump 100, which is the operation specification of the turbo molecular pump 100.

[0095] Also, in the present embodiment, when the remote communication unit 204 of the control device 200 receives a setting change command signal while the turbo molecular pump 100 is operating, the control device 200 changes the specifications of the turbo molecular pump 100 based on the received setting change command signal without stopping the operation of the turbo molecular pump 100. According to such a configuration, compared with the case where the specifications of the turbo molecular pump 100 are changed after once stopping the operating turbo molecular pump 100 and the operation of the turbo molecular pump 100 is restarted after the change of the specifications is completed, the working time can be shortened and the convenience for the user can be improved.

[0096] Such advantages of the vacuum pump 10 according to the present invention become particularly prominent when the semiconductor manufacturing apparatus X performs a composite process within the chamber XR, that is, when a plurality of processes are performed within a single chamber XR. Specifically, by performing a plurality of processes within a single chamber XR, the semiconductor manufacturing apparatus X can be miniaturized compared to the case where each process is performed in a different chamber XR, and after performing a process in one chamber XR, the time required to move the semiconductor substrate to another chamber XR where another process is to be performed can be saved, and the time required to execute the process can be shortened. Specific examples of the case where a plurality of processes are performed within a single chamber XR include the case where a process of etching the semiconductor substrate and a film formation process for the semiconductor substrate are performed within a single chamber XR.

[0097] Also, in the present embodiment, when the control device 200 included in the vacuum pump 10 receives a setting change command signal from the remote control device 300 while the turbo molecular pump 100 included in the vacuum pump 10 is operating, the control device 200 changes the specifications of the turbo molecular pump 100 based on the received setting change command signal without stopping the operation of the turbo molecular pump 100. According to such a configuration, when a second process is performed after a first process is performed within the chamber XR, the specifications of the vacuum pump 10 attached to the chamber XR can be changed from the specifications corresponding to the first process to the specifications corresponding to the second process without stopping the operation of the vacuum pump 10. Therefore, compared to the case where the turbo molecular pump 100 operating according to the specifications corresponding to the first process is once stopped, the specifications of the turbo molecular pump 100 are changed to the specifications corresponding to the second process, and then the operation of the turbo molecular pump 100 is restarted after the change of the specifications is completed, the working time can be shortened and the convenience for the user can be improved.

[0098] Also, in the present embodiment, when the control device 200 is performing TMS control and the remote communication unit 204 receives a setting change command signal, without stopping the TMS control, it changes the specifications of the turbo molecular pump 100 based on the received setting change command signal, and changes the control mode of the TMS control and the TMS set temperature. According to such a configuration, compared with the case where the specifications of the turbo molecular pump 100 are changed after temporarily stopping the ongoing TMS control, the control mode of the TMS control and the TMS set temperature are changed, and the TMS control is restarted after the change of the specifications is completed, the working time can be shortened and the convenience for the user can be improved.

[0099] As described above, the vacuum pump 10 includes a turbo molecular pump 100 that evacuates the gas inside a semiconductor manufacturing apparatus X, which is an example of an apparatus to be evacuated, and a control device 200 that controls the turbo molecular pump 100. The control device 200 includes a remote communication unit 204 that receives a command signal from a remote control device 300 that remotely controls the turbo molecular pump 100, and changes the specifications of the turbo molecular pump 100, which is an example of a setting related to the operation specifications of the turbo molecular pump 100, based on the setting change command signal received by the remote communication unit 204. According to such a configuration, the work load of the user or the field service engineer can be reduced.

[0100] When the turbo molecular pump 100 is operating and the remote communication unit 204 receives a setting change command signal from the remote control device 300, the control device 200 changes the specifications of the turbo molecular pump 100 based on the setting change command signal without stopping the operation of the turbo molecular pump 100. According to such a configuration, the convenience for the user can be improved.

[0101] The vacuum pump 10 includes a heater for heating the turbo molecular pump 100 and a water cooling pipe 149 for cooling the turbo molecular pump 100 as a specification change device for changing the operating specifications of the turbo molecular pump 100. The control device 200 changes the settings related to the operation of the specification change device based on the setting change command signal received by the remote communication unit 204. With such a configuration, the work load of the user or the field service engineer can be reduced.

[0102] The remote control device 300 is provided in the vacuum pump 10, and includes a remote communication unit 303 that transmits a command signal to the control device 200 that controls the turbo molecular pump 100 for exhausting the gas inside the semiconductor manufacturing apparatus X, and a CPU 301 that remotely controls the turbo molecular pump 100 by causing the remote communication unit 303 to transmit the command signal to the control device 200. The CPU 301 causes the remote communication unit 303 to transmit a setting change command signal to the control device 200, so that the control device 200 changes the specifications of the turbo molecular pump 100 based on the received setting change command signal. With such a configuration, the work load of the user or the field service engineer can be reduced.

[0103] As described above, the present invention has been described with reference to the embodiments. However, the present invention is not limited to the above embodiments, and various modifications are possible without departing from the gist of the present invention. The above embodiments and each modification example can be combined in various ways.

[0104] For example, in the above embodiment, when the control device 200, which is an example of a specification setting device, receives a setting change command signal through the remote communication unit 204, it may be configured to change the operation specification of the control target device equipped with the turbo molecular pump 100 that can be changed, so as to change the setting related to the operation specification of the turbo molecular pump 100 based on the setting change command signal. With such a configuration, the workload of the user or the field service engineer can be reduced. As an example, the control device 200 may be configured to change the setting related to the operation specification of the turbo molecular pump 100 by changing the rotation speed of the motor 121, which is an example of the control target device. The rotation speed of the motor 121 is an example of the operation specification of the motor 121.

[0105] In addition, in the above-described modification, the control device 200 is provided separately from the turbo molecular pump 100 and is arranged at a location away from the turbo molecular pump 100. When the control device 200 is operating in the manual operation control mode described above, if the user inputs an instruction to change the specification of the turbo molecular pump 100 by operating the operation unit 206, the CPU 201 may be configured to change the specification of the turbo molecular pump 100 by changing the operation specification (such as the rotation speed) of the control target device (such as the motor 121). With such a configuration, the convenience for the user can be improved.

[0106] In the above embodiment, it has been described that the control device 200 changes the specification of the turbo molecular pump 100 based on the setting change command signal received from the remote control device 300, but this is only an example. The control device 200 can change any setting related to the operation specification of the turbo molecular pump 100 based on the command signal received from the remote control device 300. For example, the control device 200 may be configured to change only the rotation speed of the motor 121 based on the command signal received from the remote control device 300. Hereinafter, a modification example in which the control device 200 changes only the rotation speed of the motor 121 based on the command signal received from the remote control device 300 will be described.

[0107] In this modified example, the turbo molecular pump 100 is provided with a rotor temperature sensor (not shown) that measures the temperature of the rotor 102. The control device 200 receives the detection signal output from the rotor temperature sensor via the wired communication unit 203, and based on the received detection signal, transmits a rotor temperature signal indicating the temperature of the rotor 102 to the remote control device 300. The remote control device 300 constantly monitors the temperature of the rotor 102 based on the rotor temperature signal received from the control device 200.

[0108] The remote control device 300 calculates the maximum set rotation speed that can be drawn for the motor 121 based on the difference between the current temperature of the rotor 102 indicated by the rotor temperature signal received from the control device 200 and a preset set temperature. The remote control device 300 transmits a rotation speed change command signal instructing the motor 121 to rotate at the calculated set rotation speed to the control device 200, causing the control device 200 to perform control to rotate the motor 121 at the set rotation speed. The control device 200 drives the motor 121 based on the difference between the calculated set rotation speed indicated by the rotation speed change command signal received from the remote control device 300 and the current rotation speed of the motor 121 indicated by the detection signal of the rotation speed sensor provided in the motor 121, thereby rotating the motor 121 at the calculated set rotation speed. According to such a configuration, it is possible to increase the rotation speed of the motor 121 while maintaining the temperature of the rotor 102 within a limited range, and maximize the exhaust performance of the turbo molecular pump 100.

[0109] When the current temperature of the rotor 102 indicated by the rotor temperature signal received from the control device 200 exceeds a preset allowable value, the remote control device 300 transmits a command signal instructing the control device 200 to lower the rotation speed of the motor 121, causing the control device 200 to lower the rotation speed of the motor 121 and reduce the collision frequency between the rotor 102 and gas molecules. According to such a configuration, it is possible to lower the temperature of the rotor 102 and suppress deterioration of the rotor 102 due to heat.

[0110] In addition, by applying a program, an existing control device and remote control device for a vacuum pump can also function as the control device and remote control device for a vacuum pump according to the present invention. That is, by applying a program for realizing each function of the control device and remote control device for a vacuum pump according to the present invention so that a processor such as a CPU that controls the existing control device and remote control device for a vacuum pump can execute it, the existing control device and remote control device for a vacuum pump can function as the control device and remote control device for a vacuum pump according to the present invention.

[0111] Note that the method of applying such a program is arbitrary. The program can be applied by storing it in a computer-readable storage medium such as a flexible disk, CD (Compact Disc)-ROM, DVD (Digital Versatile Disc)-ROM, memory card, etc. Furthermore, the program can be superimposed on a carrier wave and applied via a communication medium such as the Internet. For example, the program may be posted on a bulletin board (BBS: Bulletin Board System) on a communication network for distribution. And by starting this program and executing it under the control of an OS (Operating System) in the same manner as other application programs, the above processing may be configured to be executable.

Explanation of Reference Numerals

[0112] 1 Vacuum pump system 10 Vacuum pump 11 Connection cable 100 Turbo molecular pump 102, 102a, 102b, 102c Rotating blades 121 Motor 149 Water cooling pipe 200 Control device 201, 301 CPU 202, 302 Storage unit 203 Wired communication unit 204, 303 Remote communication unit 205, 304 Output Interface 206, 305 Operation Unit 207, 306 System Bus 300 Remote Control Device X Semiconductor Manufacturing Equipment XR Chamber

Claims

1. A pump body for exhausting the gas inside the device to be exhausted, A control device for controlling the pump body, A vacuum pump comprising: The control device, A storage unit that stores a plurality of operating specifications of the pump body according to the rated rotation speed of the motor of the pump body and the set temperature controlled by the heating means or the cooling means of the pump body; Remote signal receiving means for receiving a command signal including an instruction to change the operating specification of the pump body from a remote control device for remotely controlling the pump body; A vacuum pump characterized in that based on the command signal received by the remote signal receiving means, the rated rotation speed of the motor and the set temperature are changed so as to be one of the plurality of operating specifications.

2. When the pump body is operating, if the remote signal receiving means receives the command signal from the remote control device, the control device changes the rated rotation speed of the motor and the set temperature based on the command signal without stopping the operation of the pump body. The vacuum pump according to claim 1, characterized in that.

3. Further comprising a specification change device for changing the operating specification of the pump body, The control device changes the setting regarding the operation of the specification change device based on the command signal received by the remote signal receiving means. The vacuum pump according to claim 1 or 2, characterized in that.

4. The specification change device is the heating means for heating the pump body or the cooling means for cooling the pump body. The vacuum pump according to claim 3, characterized in that.

5. A controllable device for changing the operating specification of the pump body, And a specification setting device for changing the rated rotation speed of the motor and the set temperature so as to be one of the plurality of operating specifications by changing the operating specification of the controllable device. The vacuum pump according to claim 1, characterized in that.

6. The remote control device, Remote signal transmitting means for transmitting the command signal to the control device, A remote control means for remotely controlling the pump body by causing the remote signal transmitting means to transmit the command signal to the control device. The vacuum pump according to claim 1, characterized in that.

7. Control means for controlling a pump body that exhausts gas inside a device to be evacuated, a storage unit that stores a plurality of operation specifications of the pump body corresponding to the rated rotational speed of the motor of the pump body and the set temperature controlled by the heating means or the cooling means of the pump body; remote signal receiving means for receiving a command signal including an instruction to change the operation specification of the pump body from a remote control device that remotely controls the pump body; A control device for a vacuum pump comprising: The control means changes the rated rotational speed of the motor and the set temperature so as to be one of the plurality of operation specifications based on the command signal received by the remote signal receiving means. A control device for a vacuum pump, characterized in that.

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