Device

Abstract

To provide an apparatus and a display apparatus, including a vibration device that improves a sound characteristic and / or a sound pressure characteristic in a broad pitched sound band.SOLUTION: A display apparatus includes: a vibration member 100; a support member 300 that is provided on a rear surface of the vibration member 100; a first vibration device 200 that is coupled to the rear surface of the vibration member 100; and a second vibration device 200' that is provided between the vibration member 100 and the support member 300, and is overlapped with the first vibration device 200. The first vibration device is vibrated by alternately repeating a contraction and / or an expansion by an inverse piezoelectric effect when an AC voltage is applied, and makes the vibration member vibrate. The second vibration device includes a voice coil that is realized by a coil-type vibration device, and outputs a low-pitched sound band that is lower than middle-high-pitched sound bands.SELECTED DRAWING: Figure 9

Description

Technical Field

[0001] This specification relates to an apparatus.

Background Art

[0002] The apparatus includes a separate speaker or audio device to provide sound. When a speaker is arranged in a display device, problems arise where the design and spatial arrangement of the device are restricted by the space occupied by the speaker.

[0003] Since the sound output from the speaker of the display device travels to the rear or below the display device, there is a problem that the sound quality deteriorates due to interference between the sounds reflected by the wall or the ground. Therefore, there is a problem that accurate sound transmission is difficult, and there is a problem that the immersion feeling of the viewer or user decreases.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Therefore, the inventors of this specification recognized the above-mentioned problems and conducted many experiments that can improve the acoustic characteristics and / or sound pressure characteristics of the apparatus or audio device. Through many experiments, they invented an apparatus that can improve the sound quality of sound and improve the sound pressure characteristics.

[0005] The problem to be solved by the embodiments of this specification is to provide an apparatus that can vibrate a vibrating member to generate vibration or sound and can improve acoustic characteristics and / or sound pressure characteristics.

[0006] The problem to be solved by the embodiments of this specification is to provide an apparatus that can vibrate a vibrating member to generate vibration or sound and can improve wide-band acoustic characteristics and / or sound pressure characteristics.

[0007] The problem to be solved by the embodiments of this specification is to provide an apparatus that can efficiently release the heat generated by a vibrating device.

[0008] The problems to be solved by the embodiments of this specification are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

Means for Solving the Problems

[0009] The device according to the embodiments of this specification can include a vibrating member and a support member provided on the rear surface of the vibrating member. The first vibrating device can be connected to the rear surface of the vibrating member. The second vibrating device is provided between the vibrating member and the support member and can overlap with the first vibrating device.

[0010] The device according to some embodiments of this specification includes a vibrating member, a support member on the rear surface of the vibrating member, a first vibrating device connected to the rear surface of the vibrating member and located between the vibrating member and the support member, and a second vibrating device located between the first vibrating device and the support member and overlapping with the first vibrating device. The first vibrating device is vibrated so that the vibrating member vibrates, and the second vibrating device can be vibrated so that the vibrating member vibrates.

[0011] The device according to some embodiments of this specification includes a display panel including a front surface and a rear surface opposite to the front surface, a first type of vibrating device provided on the rear surface of the display panel and configured to vibrate, and a second type of vibrating device that overlaps with the first type of vibrating device and is different from the first type of vibrating device configured to vibrate. The first type of vibrating device is located between the display panel and the second type of vibrating device, and the display panel can be configured to emit sound in response to the vibration of the first type of vibrating device or the vibration of the second type of vibrating device.

[0012] Specific matters of other embodiments are included in the detailed description and drawings.

Advantages of the Invention

[0013] The device according to the embodiments of this specification can generate sound such that the propagation direction of the sound is directed toward the front surface of the display panel or the vibrating member by configuring a vibration device that vibrates the display panel or the vibrating member.

[0014] The device according to the embodiments of this specification is configured by a vibration device including a coil type and a piezoelectric type, so that the coil type vibration device and the piezoelectric type vibration device can complement each other in terms of the acoustic characteristics and / or sound pressure characteristics in the low frequency band and the high frequency band, thereby outputting sound with improved acoustic characteristics and / or sound pressure characteristics in a wide frequency band.

[0015] The device according to the embodiments of this specification is embodied in a laminated structure integrating a coil type vibration device and a piezoelectric type vibration device, so that the gap distance of the internal space between the vibrating member and the support member can be reduced, and the heat generated during vibration drive can be efficiently released.

[0016] The device according to the embodiments of this specification is configured by an integrated connector that simultaneously applies vibration signals for vibration drive of the coil type vibration device and the piezoelectric type vibration device, thereby providing a device with a simplified structure.

[0017] The effects of this specification are not limited to the effects mentioned above, and other effects not mentioned will be clearly understandable to those skilled in the art from the following description.

[0018] Since the content of the invention described in the above problems to be solved, means for solving the problems, and effects does not specify the essential features of the claims, the scope of rights of the claims is not limited by the matters described in the content of the invention.

Brief Description of the Drawings

[0019]

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Mode for Carrying Out the Invention

[0020] The advantages, features, and the methods for achieving them of this specification will become apparent by referring to various examples described in detail later based on the accompanying drawings. However, this specification is not limited to an example disclosed below and can be embodied in various different forms. Examples such as those in this specification are only to complete the disclosure of this specification and are provided to fully inform those with ordinary knowledge in the technical field to which the technical idea of this specification belongs of the scope of the technical idea. The technical idea of this specification is only defined by the scope of the claims.

[0021] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are exemplary, so this specification is not limited to the illustrated matters. The same reference signs throughout the specification indicate the same components. Also, in the description of this specification, when it is determined that a specific description of related known technologies may unnecessarily obscure the gist of this specification, the detailed description thereof is omitted.

[0022] When using terms such as "comprising", "having", "becoming", etc. referred to in this specification, other parts can be added unless "only" is used. When a component is expressed in the singular, it includes the case of including a plurality unless otherwise explicitly stated.

[0023] In the interpretation of components, even if there is no separate explicit description regarding the error range, it is interpreted as including the error range.

[0024] In the case of an explanation of the positional relationship, for example, when explaining the positional relationship between two parts such as "on ~", "above ~", "below ~", "next to ~", etc., unless "immediately" or "directly" is used, one or more other parts can also be located between the two parts.

[0025] In the case of an explanation of the time relationship, for example, when explaining the temporal sequence such as "after ~", "subsequent to ~", "next to ~", "before ~", etc., unless "immediately" or "directly" is used, it can also include the case where it is not continuous.

[0026] The first, second, etc. are used to describe various components, but these components are not limited to these terms. These terms are only used to distinguish one component from another. Therefore, the first component referred to below can also be the second component within the technical idea of this specification.

[0027] In the description of the components of this specification, terms such as first, second, A, B, (a), (b), etc. can be used. Such terms are only for distinguishing the components from other components, and the essence, order, sequence, or number of the components are not limited by such terms. When a component is described as being "coupled", "connected", or "joined" to another component, the component can be directly coupled or connected to the other component, but it should be understood that other components can also be [interposed] between the components that can be indirectly coupled or connected, unless otherwise explicitly stated.

[0028] The term "at least one" should be understood to include all combinations of one or more. For example, the meaning of "at least one of the first, second, and third components" can be said to include not only each of the first, second, or third alone, but also all combinations of two or more of the first, second, and third components.

[0029] In this specification, "device" can include display devices such as liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs) that include a display panel and a driving unit for driving the display panel. And in this specification, "device" can also include electrical equipment devices such as notebook computers, televisions, computer monitors, automotive apparatus or other forms of vehicles, and set electronic devices or set devices such as mobile electronic devices like smartphones or electronic pads.

[0030] Therefore, the devices described in this specification can include the display device itself, such as an LCD or an OLED, and a set of devices that are application products or end-consumer devices including an LCD or an OLED.

[0031] And in some embodiments, an LCD or an OLED composed of a display panel, a driving unit, etc. can be expressed as a "display device", and an electronic device as a finished product including an LCD or an OLED can be distinguished and expressed as a "set of devices". For example, the display device can include a display panel of a liquid crystal display panel or an organic light-emitting display panel, and a source PCB which is a control unit for driving the display panel. The set of devices can further include a set PCB which is a set control unit electrically connected to the source PCB to drive the whole set of devices.

[0032] The display panels used in the embodiments of this specification can use all forms of display panels, such as liquid crystal display panels, organic light-emitting display panels, and electroluminescent display panels, and the embodiments of this specification are not limited thereto. For example, the display panel can be a display panel that can generate sound by vibrating by the vibration device according to the embodiments of this specification. The display panel applied to the device or display device according to the embodiments of this specification is not limited by the form and size of the display panel.

[0033] For example, when the display panel is a liquid crystal display panel, it can include a number of gate lines and data lines, and pixels formed in the intersection area of the gate lines and the data lines. And it can include an array substrate including thin film transistors which are switching elements for adjusting the light transmittance in each pixel, an upper substrate provided with a color filter and / or a black matrix, etc., and a liquid crystal layer formed between the array substrate and the upper substrate.

[0034] When the display panel is an organic light-emitting (OLED) display panel, it can include a number of gate lines, data lines, and pixels formed in the intersection regions of the gate lines and data lines. And it can include an array substrate including thin-film transistors which are elements for selectively applying voltage to each pixel, an organic light-emitting element (OLED) layer on the array substrate, and a sealing substrate or an encapsulation substrate disposed on the array substrate so as to cover the organic light-emitting element layer, etc. The sealing substrate can protect the thin-film transistors and the organic light-emitting element layer from external impacts, and can prevent moisture and oxygen from penetrating into the organic light-emitting element layer. And the layers formed on the array substrate can include an inorganic light-emitting layer, for example, a nano-sized material layer, and a quantum dot light-emitting layer, etc. As another example, it can include micro light-emitting diodes.

[0035] The display panel can further include a backing such as a metal plate attached to the display panel. It can also include other structures, for example, other structures made of other substances.

[0036] The features of each of many embodiments in this specification can be partially or wholly combined or combined with each other, and various technical linkages and drives are possible. Each embodiment can be implemented independently of each other, or can be implemented together in an associated relationship.

[0037] Hereinafter, embodiments of this specification will be described based on the accompanying drawings and examples. Since the scales of the components shown in the drawings have scales different from the actual ones for the convenience of explanation, it is not limited to the scales shown in the drawings.

[0038] FIG. 1 is a diagram showing an apparatus according to an embodiment of this specification. FIG. 2 is a cross-sectional view of the line I-I' shown in FIG. 1 according to an embodiment of this specification.

[0039] Referring to FIGS. 1 and 2, an apparatus (e.g., a display device) according to an embodiment of the present specification may include a vibration member 100 and vibration devices 200, 200' disposed on the rear surface (or back surface) of the vibration member 100. For example, the vibration devices 200, 200' may include a first vibration device 200 and a second vibration device 200'. For example, the vibration member 100 may be a manual vibration member, a vibration object, a display panel, a diaphragm, or a front member, but the embodiments of the present specification are not limited thereto. Hereinafter, the case where the vibration member is a display panel will be described.

[0040] The vibration member 100 according to an embodiment of the present specification may be a display panel configured to display an image. The display panel can display an image, for example, an image (such as an electronic image, a digital image, a still image, or a video image). For example, the display panel can output light to display an image. The display panel can be any form of display panel or a curved display panel such as a liquid crystal display panel, an organic light emitting display panel, a quantum dot light emitting display panel, a micro light emitting diode display panel, and an electrophoretic display panel. The display panel can be a flexible display panel. For example, the display panel can be a flexible light emitting display panel, a flexible electrophoretic display panel, a flexible electronic wetting display panel, a flexible micro light emitting diode display panel, or a flexible quantum dot light emitting display panel, but the embodiments of the present specification are not limited thereto.

[0041] The display panel according to an embodiment of the present specification may include a display area for displaying an image by driving a plurality of pixels. And the display panel may include a non-display area surrounding the display area, but the embodiments of the present specification are not limited thereto.

[0042] The display panel according to the embodiments of this specification can display images in forms such as the Top Emission method, the Bottom Emission method, or the Dual Emission method, depending on the structure of the pixel array layer including the anode electrode, the cathode electrode, and the light-emitting elements. In the Top Emission method, the visible light generated in the pixel array layer can be emitted forward of the base substrate to display an image, and in the Bottom Emission method, the visible light generated in the pixel array layer can be emitted backward of the base substrate to display an image.

[0043] The display panel according to the embodiments of this specification can include a pixel array portion disposed in a pixel region composed of a plurality of gate lines and / or a plurality of data lines. The pixel array portion can include a plurality of pixels that display an image according to a signal supplied to the signal lines. The signal lines can include gate lines, data lines, pixel drive power lines, etc., but the embodiments of this specification are not limited thereto.

[0044] Each of the plurality of pixels can include a pixel circuit layer including a driving thin-film transistor provided in the pixel region, an anode electrode electrically connected to the driving thin-film transistor, a light-emitting element formed on the anode electrode, and a cathode electrode electrically connected to the light-emitting element.

[0045] The driving thin-film transistor can be formed in the transistor region of each pixel region disposed on the substrate. The driving thin-film transistor can include a gate electrode, a gate insulating film, a semiconductor layer, a source electrode, and a drain electrode. The semiconductor layer of the thin-film transistor can include silicon such as a-Si, poly-Si, or low-temperature poly-Si, or can include an oxide such as IGZO (Indium-Gallium-Zinc-Oxide), but the embodiments of this specification are not limited thereto.

[0046] The anode electrode is provided in an opening area disposed in each pixel area and can be electrically connected to the driving thin film transistor.

[0047] The light emitting device according to an embodiment of the present specification may include a light emitting device layer formed on the anode electrode. The light emitting device layer may be embodied to emit light of the same color for each pixel, for example, white light, or may be embodied to emit light of different colors for each pixel, for example, red, green, or blue light. The cathode electrode (or common electrode) may be commonly connected to the light emitting device layer provided in each pixel area. For example, the light emitting device layer may be a single structure including the same color for each pixel or a stack structure including two or more structures. In another embodiment of the present specification, the light emitting device layer may be a stack structure including two or more structures including one or more different colors for each pixel. The two or more structures including one or more different colors may be one or more of blue, red, yellow-green, and green or may be composed of a combination thereof, but the embodiments of the present specification are not limited thereto. Examples of the combination may be blue and red, red and yellow-green, red and green, and red / yellow-green / green, etc., but the embodiments of the present specification are not limited thereto. And it can be applied regardless of these stacking orders. The stack structure including two or more structures having the same color or one or more different colors may further include a charge generation layer between the two or more structures. The charge generation layer may be a pn junction structure and may include an N-type charge generation layer and a P-type charge generation layer.

[0048] The light emitting device according to another embodiment of the present specification may include a micro light emitting diode device electrically connected to each of the anode electrode and the cathode electrode. The micro light emitting diode device may be a light emitting diode embodied in the form of an integrated circuit (IC) or a chip. The micro light emitting diode device may include a first terminal electrically connected to the anode electrode and a second terminal electrically connected to the cathode electrode. The cathode electrode may be commonly connected to the second terminals of the light emitting diode devices provided in each pixel area.

[0049] The sealing part is formed on the substrate so as to surround the pixel array part, and can prevent oxygen or moisture from penetrating into the light-emitting elements of the pixel array part. The sealing part according to the embodiment of this specification can be formed in a multilayer structure in which an organic material layer and an inorganic material layer are alternately laminated, but the embodiment of this specification is not limited thereto. The inorganic material layer can block oxygen or moisture from penetrating into the light-emitting elements of the pixel array part. The organic material layer can be formed to have a relatively thicker thickness than the inorganic material layer so as to cover foreign substances (particles) that may be generated during the manufacturing process, but the embodiment of this specification is not limited thereto. For example, the sealing part can include a first inorganic film, an organic film on the first inorganic film, and a second inorganic film on the organic film. The organic film can be referred to as a foreign substance cover layer, but is not limited to this term. The touch panel can be disposed on the sealing part or behind the pixel array part.

[0050] The display panel according to the embodiment of this specification can include a first substrate, a second substrate, and a liquid crystal layer. The first substrate can be an upper substrate or a thin film transistor array substrate. For example, the first substrate can include a pixel array part (or display part or display area) having a plurality of pixels formed in pixel regions intersected by a plurality of gate lines and / or a plurality of data lines. Each of the plurality of pixels can include a thin film transistor connected to a gate line and / or a data line, a pixel electrode connected to the thin film transistor, and a common electrode formed adjacent to the pixel electrode and supplied with a common voltage.

[0051] The first substrate can further include a pad part provided at a first edge part (or non-display part) and a gate driving circuit provided at a second edge part (or second non-display part).

[0052] The pad portion can supply a signal supplied from the outside to the pixel array portion and / or the gate driving circuit. For example, the pad portion can include a plurality of data pads connected to a plurality of data lines via a plurality of data link lines and / or a plurality of gate input pads connected to the gate driving circuit via a gate control signal line. For example, the size of the first substrate may be larger than that of the second substrate, but the embodiments of this specification are not limited thereto.

[0053] The gate driving circuit (or scan driving circuit) can be built in (or integrated) on the second edge of the first substrate so as to be connected to a plurality of gate lines. For example, the gate driving circuit can be implemented by a shift register including transistors formed by the same process as the thin film transistors provided in the pixel region. The gate driving circuit according to other embodiments of this specification is not built in the first substrate, is configured in the form of an integrated circuit, and can also be included in the panel driving circuit of the display panel.

[0054] The second substrate can be a lower substrate or a color filter array substrate. For example, the second substrate can include a pixel opening pattern (or black matrix) including an opening region overlapping the pixel region formed on the first substrate, and a color filter layer formed in the opening region. The second substrate may have a size smaller than that of the first substrate, but the embodiments of this specification are not limited thereto. For example, the second substrate can overlap the remaining portion of the first substrate excluding the first edge. The second substrate can be attached to the remaining portion of the first substrate excluding the first edge with a liquid crystal layer sandwiched therebetween by a sealant.

[0055] The liquid crystal layer can be disposed between the first substrate and the second substrate. The liquid crystal layer can be made of a liquid crystal in which the alignment direction of liquid crystal molecules changes due to an electric field formed by a data voltage and a common voltage applied to the pixel electrode for each pixel.

[0056] The second polarizing member is disposed on the lower surface of the second substrate and can polarize the light incident from the backlight and traveling through the liquid crystal layer. The first polarizing member is disposed on the upper surface of the first substrate and can polarize the light transmitted through the first substrate and emitted to the outside.

[0057] The display panel according to the embodiment of the present specification can display an image with the light transmitted through the liquid crystal layer by driving the liquid crystal layer by an electric field formed for each pixel by a data voltage and a common voltage applied for each pixel.

[0058] In the display panel according to another embodiment of the present specification, the first substrate may be a color filter array substrate, and the second substrate may be a thin film transistor array substrate. For example, the display panel according to another embodiment of the present specification may have a form in which the display panel according to the embodiment of the present specification is inverted up and down. In this case, the pad portion of the display panel according to another embodiment of the present specification can be blocked by a separate instrument.

[0059] The display panel according to another embodiment of the present specification can be bent or have a bending portion with a curved shape or a certain radius of curvature.

[0060] The bending portion of the display panel can be implemented on at least one of one side edge portion and the other side edge portion parallel to each other in the display panel. One side edge portion and / or the other side edge portion of the display panel implementing the bending portion may include only a non-display area, or may include an edge portion of the display area and a non-display area. The display panel including the bending portion implemented by bending the non-display area may have a one-side bezel bending structure or a both-side bezel bending structure. And the display panel including the bending portion implemented by bending the edge portion of the display area and the non-display area may have a one-side active bending structure or a both-side active bending structure.

[0061] According to other embodiments of the present specification, the vibrating member 100 can be one or more of metal, wood, rubber, plastic, carbon, glass, fabric, fiber, paper, mirror, and leather, but the embodiments of the present specification are not limited thereto. For example, the paper can be cone paper for a speaker. For example, the cone paper can be pulp or foamed plastic, etc., but the embodiments of the present specification are not limited thereto.

[0062] According to other embodiments of the present specification, the vibrating member 100 can include one or more of a display panel having a plurality of pixels for displaying an image, a screen panel on which an image is projected from a display device, an illumination panel, a signage panel, an interior material of a transportation means (or an automobile or a vehicle), a glass window of a transportation means, an exterior material of a transportation means, a ceiling material of a building, an interior material of a building, a glass window of a building, and a mirror, but the embodiments of the present specification are not limited thereto. For example, the display panel can be any form of display panel such as a liquid crystal display panel, an organic light emitting display panel, a quantum dot light emitting display panel, a micro light emitting diode display panel, and an electrophoretic display panel, or a curved display panel. For example, the display panel can be a flexible display panel. For example, the flexible display panel can be a flexible light emitting display panel, a flexible electrophoretic display panel, a flexible electronic wetting display panel, a flexible micro light emitting diode display panel, or a flexible quantum dot light emitting display panel, but the embodiments of the present specification are not limited thereto. For example, the illumination panel (or non-display panel) can be a light emitting diode illumination panel (or device), an organic light emitting illumination panel (or device), or an inorganic light emitting illumination panel (or device), etc., but the embodiments of the present specification are not limited thereto.

[0063] The vibration devices 200 and 200' can vibrate the vibration member 100. For example, the vibration devices 200 and 200' can directly or indirectly vibrate the vibration member 100. The vibration devices 200 and 200' can include a first vibration device 200 and a second vibration device 200'. For example, the vibration devices 200 and 200' can be implemented on the rear surface of the vibration member 100. For example, the vibration devices 200 and 200' can vibrate the vibration member 100 on the rear surface of the vibration member 100, so that the vibration of the vibration member 100 can provide an acoustic S and / or haptic feedback to the user. For example, the vibration member 100 can output an acoustic S due to the vibration of the vibration devices 200 and 200'. The vibration devices 200 and 200' can output an acoustic S by using the vibration member 100 as a diaphragm. For example, the vibration devices 200 and 200' can output an acoustic S in the front (or front face) direction FD of the vibration member 100 by using the vibration member 100 as a diaphragm. For example, the vibration devices 200 and 200' can generate an acoustic S such that the sound propagation direction is in the front (or front face) direction FD of the display panel or the vibration member 100. The vibration devices 200 and 200' can vibrate the vibration member 100 to output an acoustic S. For example, the vibration devices 200 and 200' can directly vibrate the vibration member 100 to output an acoustic S in the front (or front face) direction FD of the device. The vibration devices 200 and 200' can indirectly vibrate the vibration member 100 to output an acoustic S.

[0064] According to the embodiments of the present specification, the vibration devices 200, 200' can vibrate according to a vibration drive signal synchronized with the video displayed on the display panel which is the vibration member 100, and vibrate the display panel. According to other embodiments of the present specification, the vibration devices 200, 200' can vibrate according to a haptic feedback signal (or tactile feedback signal) synchronized with the user touch on the touch panel (or touch sensor layer) disposed on or built in the display panel, and vibrate the display panel. Therefore, the display panel can vibrate due to the vibration of the vibration devices 200, 200' to provide at least one or more of the sound S and haptic feedback to the user (or viewer).

[0065] The vibration devices 200, 200' according to the embodiments of the present specification can include a first vibration device 200 and a second vibration device 200'. For example, the first vibration device 200 can be connected to the back surface of the vibration member 100 or the display panel. The second vibration device 200' is provided between the vibration member 100 or the display panel and the support member 300 and can overlap with the first vibration device 200. Therefore, the first vibration device 200 can be between the vibration member 100 and the vibration device 200'.

[0066] The first vibration device 200 according to the embodiments of the present specification may be implemented by a piezoelectric vibration device (for example, a first type of vibration device). For example, the first vibration device 200 may be implemented in a film form. The first vibration device 200 may be configured to output sounds in a first sound range band (for example, a first pitch). For example, the first sound range band may include a high sound range band. The first sound range band may be sounds in a high sound range band or a mid-high sound range band. Therefore, the display device or the display panel can output sounds having a first pitch in response to the vibration of the first vibration device 200. Since the first vibration device 200 is implemented in a film form and may have a thickness thinner than that of the vibration member 100 or the display panel, an increase in the thickness of the vibration member 100 or the display panel due to the arrangement of the first vibration device 200 can be minimized. For example, the first vibration device 200 may be referred to as a first acoustic generation module, a first acoustic device, a first vibration generation device, a first displacement device, a first acoustic device, a piezoelectric vibration device, a film actuator, a film-type piezoelectric composite actuator, a film speaker, a film-type piezoelectric speaker, or a film-type piezoelectric composite speaker that uses the vibration member 100 or the display panel as an acoustic diaphragm, but is not limited to these terms.

[0067] The first vibration device 200 may be connected or coupled to the rear surface of the vibration member 100 or the display panel. For example, the first vibration device 200 may be disposed on the rear surface of the vibration member 100 or the display panel so as to overlap the display area of the vibration member 100 or the display panel. For example, the first vibration device 200 may overlap with a display area of more than half of the display area of the vibration member 100 or the display panel. According to other embodiments of the present specification, the first vibration device 200 may overlap with the entire display area of the vibration member 100 or the display panel.

[0068] According to an embodiment of the present specification, when an AC voltage is applied, the first vibration device 200 can vibrate by alternately repeating contraction and / or expansion due to the inverse piezoelectric effect, and can vibrate the vibration member 100 or the display panel by the vibration. For example, the first vibration device 200 can vibrate according to a voice signal synchronized with the video displayed on the vibration member 100 or the display panel to vibrate the vibration member 100 or the display panel. According to another embodiment of the present specification, the first vibration device 200 vibrates according to a haptic feedback signal (or tactile feedback signal) synchronized with a user touch on a touch panel (or touch sensor layer) disposed on or incorporated in the vibration member 100 or the display panel to vibrate the vibration member 100 or the display panel. Therefore, the vibration member 100 or the display panel can vibrate by the vibration of the first vibration device 200 to provide at least one or more of acoustic and haptic feedback to the user (or viewer).

[0069] Therefore, the device according to the embodiment of the present specification can output the sound generated by the vibration of the vibration member 100 or the display panel due to the vibration of the first vibration device 200 in front of the vibration member 100 or the display panel. And since most regions of the vibration member 100 or the display panel can vibrate by the film-shaped first vibration device 200 according to the embodiment of the present specification, the sound pressure characteristics and sound localization sense of the sound due to the vibration of the vibration member 100 or the display panel can be further improved.

[0070] The device according to the embodiment of the present specification can further include a connecting member 160 (or a first connecting member) between the vibration member 100 or the display panel and the first vibration device 200.

[0071] For example, by being disposed between the vibration member 100 or the back surface of the display panel and the first vibration device 200, the connecting member 160 can connect or couple the first vibration device 200 to the back surface of the vibration member 100 or the display panel. For example, the first vibration device 200 can be supported or disposed on the back surface of the vibration member 100 or the display panel by being connected or coupled to the back surface of the vibration member 100 or the display panel via the connecting member 160. For example, the first vibration device 200 can be disposed on the back surface of the vibration member 100 or the display panel via the connecting member 160.

[0072] The connecting member 160 according to the embodiments of the present specification can be made of a material including an adhesive layer excellent in adhesion or adhesive force to each of the back surface of the vibration member 100 or the display panel and the first vibration device 200. For example, the connecting member 160 can include a foam pad, a double-sided tape, an adhesive, or the like, but the embodiments of the present specification are not limited thereto. For example, the adhesive layer of the connecting member 160 can include epoxy, acryl, silicone, or urethane, but the embodiments of the present specification are not limited thereto. For example, the adhesive layer of the connecting member 160 can include an acrylic-based substance (or material) having relatively excellent adhesive force and high hardness among acrylic and urethane. Thereby, the vibration of the first vibration device 200 can be well transmitted to the vibration member 100 or the display panel.

[0073] The adhesive layer of the connecting member 160 can further include additives such as an adhesion promoter, a wax component, or an antioxidant, but the embodiments of the present specification are not limited thereto. The additives can prevent the separation (or peeling) of the connecting member 160 from the vibration member 100 or the display panel due to the vibration of the first vibration device 200. For example, the adhesion promoter can be a rosin derivative or the like, the wax component can be paraffin wax or the like, and the antioxidant can be a phenolic antioxidant such as thioester, but the embodiments of the present specification are not limited thereto.

[0074] The connecting member 160 according to another embodiment of the present specification may further include a hollow portion provided between the vibrating member 100 or the display panel and the first vibrating device 200. The hollow portion of the connecting member 160 can provide an air gap between the vibrating member 100 or the display panel and the first vibrating device 200. By making the sound wave (or sound pressure) caused by the vibration of the first vibrating device 200 not be dispersed by the connecting member 160 but concentrated on the vibrating member 100 or the display panel, the loss of vibration caused by the connecting member 160 can be minimized, and the sound pressure characteristics and / or acoustic characteristics of the sound generated by the vibration of the vibrating member 100 or the display panel can be improved.

[0075] The second vibration device 200' according to the embodiments of the present specification can be implemented by a coil-type vibration device (e.g., a second type of vibration device different from the first type of vibration device). For example, the second vibration device 200' can be implemented in the form of a voice coil. The second vibration device 200' can be configured to output sound in a second sound range band (e.g., a second pitch) different from the first sound range band. For example, the second sound range band can include a low sound range band lower than the mid-high sound range band. The second sound range band can be sound in the low sound range band or the mid-low sound range band. Therefore, the display device or the display panel can output sound having a second pitch in response to the vibration of the second vibration device 200. The second vibration device 200' can be configured to overlap the first vibration device 200. The second vibration device 200' can be spaced apart from the rear surface of the vibration member 100. The second vibration device 200' can be spaced apart from the rear surface of the vibration member 100, and the first vibration device 200 can be disposed between the vibration member 100 and the second vibration device 200'. For example, the second vibration device 200' can be configured to be stacked with the first vibration device 200. The second vibration device 200' can be disposed adjacent to the rear surface of the first vibration device 200 through the support member 300. The second vibration device 200' can contact the rear surface of the first vibration device 200 through the thickness of the support member 300. By penetrating the support member 300 and disposing the second vibration device 200' on the rear surface of the vibration member 100 with the first vibration device 200 interposed therebetween, the vibration member 100 can be vibrated directly or indirectly. For example, the upper portion of the second vibration device 200' is inserted (or accommodated) into through holes 315, 335 (or first holes) provided in the support member 300, adjacent to or connected to the rear surface of the first vibration device 200, and the lower portion of the second vibration device 200' can be fixed or coupled to the support member 300. For example, the second vibration device 200' can vibrate with the support member 300 as a support base to directly or indirectly vibrate the vibration member 100, and the vibration member 100 can output sound S in the front direction FD.For example, the second vibration device 200' can be expressed as a second acoustic generation module, a second acoustic device, a second vibration generation device, a second displacement device, a second acoustic device, a coil-type vibration device, a voice coil-type vibration device, a transducer, an actuator, or an exciter that uses the vibration member 100 or the display panel as an acoustic diaphragm, but is not limited to this term.

[0076] In the device according to the embodiments of this specification, the first vibration device 200 can be disposed between the vibration member 100 and the second vibration device 200'.

[0077] The first vibration device 200 can be disposed on the rear surface of the vibration member 100, and the second vibration device 200' can be disposed on the rear surface of the first vibration device 200. The first vibration device 200 is provided between the vibration member 100 and the second vibration device 200', and can reduce or decrease the heat generated by the second vibration device 200'. For example, the first vibration device 200 can prevent or minimize the heat generated by the second vibration device 200' from being transmitted to the vibration member 100. The first vibration device 200 can limit the local temperature rise of the vibration member 100 due to the heat generated by the second vibration device 200'. For example, the first vibration device 200 can prevent or minimize the heat generated by the second vibration device 200' from being transmitted to the display panel that is the vibration member 100. In this case, when the first vibration device 200 outputs sound of the display panel or the vibration member 100, the first vibration device 200 can limit the temperature rise of the display panel or the vibration member 100 due to the heat generated by the operation of the second vibration device 200', thereby preventing image quality defects of the vibration member 100 or the display panel caused by a rapid temperature difference in the local area of the display panel or the vibration member 100 that overlaps with the second vibration device 200'.

[0078] According to the embodiments of the present specification, the first vibration device 200 can be disposed on the rear surface of the display panel or the vibration member 100 via the connecting member 160. The first vibration device 200 can have a size larger than that of the second vibration device 200' or can be configured to cover the second vibration device 200'. For example, the first vibration device 200 can have a polygonal plate shape or a disc shape with a certain thickness, but the embodiments of the present specification are not limited thereto. The device according to the embodiments of the present specification can further play a role of preventing or minimizing the heat generated by the second vibration device 200' from being transmitted to the vibration member 100, so that the influence on the display panel or the vibration member 100 caused by the heat generated during the vibration of the second vibration device 200' or the influence on the image quality of the display panel can be reduced.

[0079] The device according to the embodiments of the present specification can further include a support member 300 disposed on the rear surface (or the back surface) of the vibration member 100.

[0080] The support member 300 can be disposed on the rear surface of the vibration member 100 or the display panel. For example, the support member 300 can cover the rear surface of the vibration member 100 or the display panel. For example, the support member 300 can cover the entire rear surface of the vibration member 100 or the display panel with a gap space GS (or an internal space) interposed therebetween. The support member 300 can be separated from the rearmost surface of the vibration member 100 or the display panel or from the first vibration device 200 with the gap space GS interposed therebetween. For example, the gap space GS can be referred to as an internal space, an air gap, a vibration space, or an acoustic box, but is not limited to this term.

[0081] For example, the support member 300 can include at least one or more of a glass material, a metal material, and a plastic material. For example, the support member 300 can be referred to as a rear structure, a set structure, a support structure, a support cover, a rear member, a case, or a housing, but is not limited to this term. The support member 300 can be expressed by other terms such as a Cover Bottom, a Plate Bottom, a Back Cover, a Base Frame, a Metal Frame, a Metal Chassis, a Chassis Base, or an m-chassis. For example, the support member 300 can be embodied as any form of a frame or a plate-like structure disposed on the rear surface of the vibration member 100.

[0082] The edge or sharp edge portion of the support member 300 can have an inclined surface form or a curved surface form by a chamfering process or a corner rounding process. For example, the support member 300 made of a glass material can be sapphire glass. According to other embodiments of the present specification, the support member 300 made of a metal material can be made of one or more of aluminum, an aluminum alloy, magnesium, a magnesium alloy, and an iron-nickel alloy.

[0083] The support member 300 according to the embodiments of the present specification can include through holes 315 and 335 (or a first hole) into which the second vibration device 200' is inserted (or housed). For example, the through holes 315 and 335 can be perforated to have a circular or polygonal shape in a set partial region of the support member 300 along the thickness direction Z of the support member 300 so that the second vibration device 200' is inserted (or housed).

[0084] According to the embodiments of this specification, the through holes 315, 335 (or the first holes) may be configured to reduce the air pressure in the gap space GS (or the internal space) between the vibration member 100 and the support member 300. For example, the through holes 315, 335 can provide a path through which the second vibration device 200' can be inserted (or accommodated), and can provide a path through which the gap space GS between the vibration member 100 and the support member 300 is connected to or communicates with the outside. In this case, a through hole (or the second hole) may be formed in a portion of the second vibration device 200' that overlaps with the through holes 315, 335. For example, the through hole of the second vibration device 200' may be formed to penetrate a part of the second vibration device 200' in the portion overlapping with the through holes 315, 335 or to penetrate vertically. Thereby, the gap space GS between the vibration member 100 and the support member 300 or the inside of the second vibration device 200' communicates with the outside through the through holes 315, 335 of the support member 300 and the through holes of the second vibration device 200', so that the air pressure in the gap space GS between the vibration member 100 and the support member 300 or the air pressure inside the second vibration device 200' can be reduced.

[0085] The support member 300 according to the embodiments of this specification may include a first support member 310 and a second support member 330.

[0086] The first support member 310 can be disposed between the rear surface of the vibration member 100 or the display panel and the second support member 330. For example, the first support member 310 can be disposed between the rear edge of the vibration member 100 or the display panel and the front edge of the second support member 330. That is, the first support member 310 can be between the vibration member 100 and the second support member 330. The first support member 310 can support one or more of the edges of the vibration member 100 or the display panel and the edges of the second support member 330. According to other embodiments of the present specification, the first support member 310 can cover the rear surface of the vibration member 100 or the display panel. For example, the first support member 310 can cover the entire rear surface of the vibration member 100 or the display panel except for the region where it overlaps with the second vibration device 200'. For example, the first support member 310 can be a member that covers the entire rear surface of the vibration member 100 or the display panel. For example, the first support member 310 can include at least one of a glass material, a metal material, and a plastic material. For example, the first support member 310 can be referred to as an inner plate, a first rear structure, a first support structure, a first support cover, a first back cover, a first rear member, an inner surface plate, or an inner surface cover, but is not limited to this term. For example, the first support member 310 can be omitted.

[0087] The first support member 310 can be separated from the rearmost surface of the vibration member 100 with a gap space GS (or internal space) therebetween. The first support member 310 can support or fix the second vibration device 200'. For example, the gap space GS can be referred to as an internal space, an air gap, a vibration space, or an acoustic box, etc., but is not limited to this term.

[0088] The second support member 330 may be disposed on the rear surface of the first support member 310. The second support member 330 may be a member that overlaps with the second vibration device 200' and covers the entire rear surface of the vibration member 100 or the display panel except for the portion of the vibration member 100. For example, the second support member 330 may include at least one of a glass material, a metal material, and a plastic material. For example, the second support member 330 may be referred to as an outer plate, a rear plate, a back plate, a back cover, a rear cover, a second rear structure, a second support structure, a second support cover, a second back cover, a second rear member, an external plate, or an external cover, but is not limited to this term.

[0089] According to the embodiments of the present specification, the first support member 310 and the second support member 330 may include through holes 315, 335 (or first holes) into which the second vibration device 200' is inserted (or accommodated). For example, the through holes 315, 335 may be perforated to have a circular or polygonal shape in a set partial region of the first support member 310 and the second support member 330 along the thickness direction Z of the first support member 310 and the second support member 330 so that the second vibration device 200' can be inserted (or accommodated). For example, the first support member 310 may include a first through hole 315, and the second support member 330 may include a second through hole 335. For example, the first through hole 315 of the first support member 310 may have the same size as the second through hole 335 of the second support member 330, or may have a size smaller than the second through hole 335 of the second support member 330. For example, the first through hole 315 of the first support member 310 may have a size smaller than the second through hole 335 of the second support member 330, and a part of the rear surface of the first support member 310 may be exposed through the second through hole 335 of the second support member 330. In this case, the second vibration device 200' may be fixed or coupled to the rear surface of the first support member 310 exposed through the second through hole 335 of the second support member 330. For example, the upper part (or one side) of the second vibration device 200' may penetrate through the through holes 315, 335 of the first support member 310 and the second support member 330 and contact the rear surface of the first vibration device 200, and the lower part (or the other side) of the second vibration device 200' may be fixed or coupled to the rear surface of the first support member 310 exposed through the second through hole 335 of the second support member 330.

[0090] According to the embodiments of the present specification, the first support member 310 and the second support member 330 may be made of different materials from each other. For example, the first support member 310 may be made of a metal material such as an aluminum (Al) material with excellent thermal conductivity, and the second support member 330 may be made of a glass material, but the embodiments of the present specification are not limited thereto.

[0091] According to the embodiments of the present specification, the first support member 310 and the second support member 330 may have the same thickness as each other or may have different thicknesses from each other. For example, the first support member 310 may have a relatively thinner thickness than the second support member 330, but the embodiments of the present specification are not limited thereto.

[0092] The support member 300 according to the embodiments of the present specification may further include a connecting member 350.

[0093] The connecting member 350 may be disposed between the first support member 310 and the second support member 330. For example, the first support member 310 and the second support member 330 may be coupled or connected to each other via the connecting member 350. For example, the connecting member 350 may be an adhesive resin, a double-sided tape, or a double-sided adhesive foam pad, but the embodiments of the present specification are not limited thereto. For example, the connecting member 350 may have elasticity for shock absorption, but the embodiments of the present specification are not limited thereto. For example, the connecting member 350 may be disposed in the entire area between the first support member 310 and the second support member 330. For example, the connecting member 350 may be formed in a net structure having an air gap between the first support member 310 and the second support member 330.

[0094] The device according to the embodiments of the present specification may further include a middle frame 400. The middle frame 400 may be disposed between the rear edge of the vibration member 100 or the display panel and the front edge of the support member 300. The middle frame 400 can support one or more of the edges of the vibration member 100 or the display panel and the edges of the support member 300. The middle frame 400 can surround one or more of the respective sides of the vibration member 100 or the display panel and the support member 300. The middle frame 400 can include a gap space GS between the vibration member 100 or the display panel and the support member 300. The middle frame 400 can be referred to as a middle cabinet, a middle cover, a middle chassis, a connecting member, a frame, a frame member, an intermediate member, or a side cover member, etc., but is not limited to this term.

[0095] The middle frame 400 according to the embodiments of this specification may include a first support portion 410 and a second support portion 430. For example, the first support portion 410 can be referred to as a support portion, but is not limited to this term. For example, the second support portion 430 can be referred to as a side wall portion, but is not limited to this term.

[0096] By arranging the first support portion 410 between the rear edge of the vibration member 100 or the display panel and the front edge of the support member 300, a gap space GS can be provided between the vibration member 100 or the display panel and the support member 300. The front surface of the first support portion 410 can be coupled or connected to the rear edge of the vibration member 100 or the display panel via a first connecting member 401. The rear surface of the first support portion 410 can be coupled or connected to the front edge of the support member 300 via a second connecting member 403. For example, the first support portion 410 can have a single frame structure in the shape of a quadrilateral or a frame structure having a plurality of divided bar shapes, but the embodiments of this specification are not limited thereto.

[0097] The second support portion 430 can be arranged parallel to the thickness direction Z of the device. For example, the second support portion 430 can be perpendicularly coupled to the outer surface of the first support portion 410 so as to be parallel to the thickness direction Z of the device. By surrounding one or more of the outer surface of the vibration member 100 and the outer surface of the support member 300, the second support portion 430 can protect the respective outer surfaces of the vibration member 100 and the support member 300. The first support portion 410 can protrude from the inner surface of the second support portion 430 into the gap space GS between the vibration member 100 and the support member 300.

[0098] The device according to the embodiments of this specification can include a panel connecting member (or connecting member) instead of the middle frame 400.

[0099] The panel connecting member is disposed between the rear edge portion of the vibrating member 100 and the front edge portion of the support member 300, thereby providing a gap space GS between the vibrating member 100 and the support member 300. The panel connecting member can be disposed between the rear edge portion of the vibrating member 100 and the edge portion of the support member 300 to bond the vibrating member 100 and the support member 300. For example, the panel connecting member can be embodied by a double-sided tape, a single-sided tape, or a double-sided adhesive foam pad, but the embodiments of this specification are not limited thereto. For example, the adhesive layer of the panel connecting member can include epoxy, acrylic, silicone, or urethane, but the embodiments of this specification are not limited thereto. For example, the adhesive layer of the panel connecting member can include a urethane-based substance (or material) having relatively softer characteristics than acrylic among acrylic and urethane in order to minimize the transmission of the vibration of the vibrating member 100 to the support member 300. Thereby, the vibration of the vibrating member 100 transmitted to the support member 300 can be minimized.

[0100] In the device according to the embodiments of the present specification, when including a panel connecting member instead of the middle frame 400, the support member 300 can be bent from one side (or end) of the second support member 330 to include a bending side wall that surrounds one or more of the outer surfaces (or outer walls) of the first support member 310, the panel connecting member, and the vibration member 100. The bending side wall according to the embodiments of the present specification can have a single side wall structure or a hemming structure. The hemming structure can be a structure in which the end of a member is bent into a curved shape and overlaps with each other or is spaced apart from each other in parallel. For example, for improving the aesthetics on the side of the design, the bending side wall can include a first bending side wall bent from one side (or end) of the second support member 330, and a second bending side wall bent from the first bending side wall between the first bending side wall and the outer surface of the vibration member 100. The second bending side wall can be in contact with the inner surface of the first bending side wall or can be spaced apart from the inner surface of the first bending side wall so as to mitigate the transmission of an external impact in the side direction to the outer surface of the vibration member 100. Thereby, the second bending side wall can mitigate the contact of the outer surface of the vibration member 100 with the inner surface of the first bending side wall or the transmission of an external impact in the side direction to the outer surface of the vibration member 100.

[0101] According to other embodiments of the present specification, in the device according to the embodiments of the present specification, the middle frame 400 can be omitted. Instead of the middle frame 400, it can be composed of a panel connecting member or an adhesive. According to other embodiments of the present specification, instead of the middle frame 400, it can be composed of a partition.

[0102] FIG. 3 is a diagram showing a vibration device according to an embodiment of the present specification. FIG. 4 is a cross-sectional view taken along line II-II' shown in FIG. 3. FIG. 5 is a diagram showing the vibration part shown in FIG. 4. FIGS. 3 to 5 are diagrams showing the first vibration device described with reference to FIGS. 1 and 2.

[0103] Referring to FIGS. 3 to 5, the first vibration device 200 according to the embodiments of the present specification can be expressed as an active vibration member, a piezoelectric vibration device, a flexible vibration device, a flexible vibration structure, a flexible oscillator, a flexible vibration generating element, a flexible vibration generator, a flexible acoustic device, a flexible acoustic element, a flexible acoustic generating element, a flexible acoustic generator, a flexible actuator, a flexible speaker, a flexible piezoelectric speaker, a film actuator, a film-type piezoelectric composite actuator, a film speaker, a film-type piezoelectric speaker, or a film-type piezoelectric composite speaker, etc., but the embodiments of the present specification are not limited thereto.

[0104] The first vibration device 200 according to the embodiments of the present specification can include a vibration part 201. For example, the vibration part 201 can be a piezoelectric vibration part or a piezoelectric-type vibration part. The vibration part 201 can include a vibration layer 201a, a first electrode layer 201b, and a second electrode layer 201c.

[0105] The vibration layer 201a can include a piezoelectric material (or electroactive material) having a piezoelectric effect. For example, the piezoelectric material can have the property that when a pressure or torsional phenomenon acts on the crystal structure by an external force, a potential difference is generated due to dielectric polarization caused by the relative position change of positive (+) ions and negative (-) ions, and conversely, vibration is generated by an electric field caused by an applied voltage. The vibration layer 201a can be expressed by other terms such as a piezoelectric layer, a piezoelectric material layer, an electroactive layer, a piezoelectric material part, an electroactive part, a piezoelectric structure, a piezoelectric composite layer, a piezoelectric composite, or a piezoelectric ceramic composite, etc., but the embodiments of the present specification are not limited thereto. The vibration layer 201a can be made of a transparent, translucent, or opaque piezoelectric material. For example, the vibration layer 201a can be transparent, translucent, or opaque.

[0106] The vibration part 201 according to the embodiments of the present specification can include a plurality of inorganic material parts and an organic material part provided between the plurality of inorganic material parts. For example, the plurality of inorganic material parts can have piezoelectric characteristics. For example, the plurality of inorganic material parts can be the first part 201a1, and the organic material part can be the second part 201a2. For example, the vibration layer 201a can include a plurality of first parts 201a1 and a plurality of second parts 201a2. For example, the plurality of first parts 201a1 and the plurality of second parts 201a2 can be alternately and repeatedly arranged along the first direction X (or the second direction Y). For example, the first direction X can be the lateral direction of the vibration layer 201a, and the second direction Y can be the longitudinal direction of the vibration layer 201a intersecting the first direction X, but is not limited thereto. The first direction X can be the longitudinal direction of the vibration layer 201a, and the second direction Y can be the lateral direction of the vibration layer 201a.

[0107] Each of the plurality of first parts 201a1 can be composed of an inorganic material part. The inorganic material part can include a piezoelectric material including a piezoelectric effect, a composite piezoelectric material, or an electroactive material, but the embodiments of the present specification are not limited thereto.

[0108] Each of the plurality of first parts 201a1 can be made of a ceramic-based material capable of realizing relatively high vibration or a piezoelectric ceramic having a perovskite crystal structure. The perovskite crystal structure can have piezoelectric and inverse piezoelectric effects and can have an oriented structure. The perovskite crystal structure is represented by the chemical formula ABO3, where the A site can be composed of a divalent metal element, and the B site can be a tetravalent metal element. As an embodiment of the present specification, in the chemical formula ABO3, the A site and the B site can be cations, and O can be an anion. For example, each of the plurality of first parts 201a1 can include at least one of PbTiO3, PbZrO3, PbZrTiO3, BaTiO3, and SrTiO3, but the embodiments of the present specification are not limited thereto.

[0109] The perovskite crystal structure can generate a piezoelectric effect by the change of polarization due to the position fluctuation of the central ion, e.g., Ti ion in the case of PbTiO3, caused by external stress or magnetic field. For example, the perovskite crystal structure can generate a piezoelectric effect by changing from a cubic shape, which is a symmetric structure, to a tetragonal, orthorhombic, and / or rhombohedral shape, which are unsymmetric structures, due to external stress or magnetic field. The polarization is high in the tetragonal or rhombohedral crystal phase boundary region (Morphotropic Phase Boundary: MPB) with an unsymmetric structure, and the rearrangement of polarization is easy, so it can have high piezoelectric properties.

[0110] The vibration layer 201a or the first portion 201a1 according to other embodiments of the present specification can include one or more of lead (Pb), zirconium (Zr), titanium (Ti), zinc (Zn), nickel (Ni), and niobium (Nb), but the embodiments of the present specification are not limited thereto.

[0111] The vibration layer 201a or the first portion 201a1 according to other embodiments of the present specification can include a PZT (lead zirconate titanate) - based material including lead (Pb), zirconium (Zr), and titanium (Ti), or a PZNN (lead zirconate nickel niobate) - based material including lead (Pb), zirconium (Zr), nickel (Ni), and niobium (Nb), but the embodiments of the present specification are not limited thereto. Alternatively, the vibration layer 201a or the first portion 201a1 can include at least one or more of CaTiO3, BaTiO3, and SrTiO3 that do not contain lead (Pb), but the embodiments of the present specification are not limited thereto.

[0112] Each of the plurality of first portions 201a1 according to the embodiments of the present specification is disposed between the plurality of second portions 201a2, has a first width W1 parallel to the first direction X (or the second direction Y), and may have a length parallel to the second direction Y (or the first direction X). Each of the plurality of second portions 201a2 has a second width W2 parallel to the first direction X (or the second direction Y) and may have a length parallel to the second direction Y (or the first direction X). The first width W1 may be the same as or different from the second width W2. For example, the first width W1 may be larger than the second width W2. For example, the first portion 201a1 and the second portion 201a2 may have a line shape or a stripe shape that are the same as or different from each other in size. Therefore, the vibration layer 201a may have a resonance frequency of 20 kHz or less by having a 2-2 composite structure having piezoelectric characteristics of a 2-2 vibration mode, but the embodiments of the present specification are not limited thereto. For example, the resonance frequency of the vibration layer 201a may be changed by at least one of the form, length, thickness, and the like.

[0113] In the vibration layer 201a, each of the plurality of first portions 201a1 and the plurality of second portions 201a2 may be arranged (or arrayed) parallel to each other in the same plane (or the same layer). Each of the plurality of second portions 201a2 is configured to fill the gap between two adjacent first portions 201a1, and thus may be connected or adhered to the adjacent first portion 201a1. Thereby, the vibration layer 201a can be extended to a desired size or length by side coupling (or side connection) of the first portion 201a1 and the second portion 201a2.

[0114] In the vibration layer 201a, the width W2 of each of the plurality of second portions 201a2 may gradually decrease from the middle portion of the vibration layer 201a or the first vibration device 200 toward both end portions (or both ends).

[0115] According to the embodiments of the present specification, the second portion 201a2 having the largest width W2 among the plurality of second portions 201a2 may be located at a portion where the maximum stress is concentrated when the vibration layer 201a or the first vibration device 200 vibrates in the vertical direction (Z) (or the thickness direction). The second portion 201a2 having the smallest width W2 among the plurality of second portions 201a2 may be located at a portion where the relatively smallest stress is generated when the vibration layer 201a or the first vibration device 200 vibrates in the vertical direction (Z). For example, the second portion 201a2 having the largest width W2 among the plurality of second portions 201a2 may be disposed in the middle portion of the vibration layer 201a, and the second portion 201a2 having the smallest width W2 among the plurality of second portions 201a2 may be disposed at both end portions of the vibration layer 201a. Thereby, when the vibration layer 201a or the first vibration device 200 vibrates in the vertical direction (Z), the interference of sound waves or the overlap of resonance frequencies generated at the portion where the maximum stress is concentrated can be minimized, thereby improving the sound pressure drop (dip) phenomenon occurring in the low frequency band, and improving the flatness of the acoustic characteristics in the low frequency band. For example, the flatness of the acoustic characteristics may be the size of the deviation between the maximum sound pressure and the minimum sound pressure.

[0116] In the vibration layer 201a, each of the plurality of first portions 201a1 may have a different size (or width) from each other. For example, the size (or width) of each of the plurality of first portions 201a1 may gradually decrease or increase from the middle portion to both end portions (or both ends) of the vibration layer 201a or the first vibration device 200. In this case, the sound pressure characteristics of the sound can be improved by various natural vibration frequencies caused by the vibration of each of the plurality of first portions 201a1 having different sizes in the vibration layer 201a, and the reproduction band of the sound can be expanded.

[0117] Each of the plurality of second portions 201a2 can be disposed between the plurality of first portions 201a1. Thus, in the vibration layer 201a or the first vibration device 200, the vibration energy due to the links within the unit cell of the first portion 201a1 can be increased by the second portion 201a2, so that the vibration characteristics can be increased and piezoelectric characteristics and flexibility can be ensured. For example, the second portion 201a2 can be one or more of an epoxy-based polymer, an acrylic-based polymer, and a silicone-based polymer, but the embodiments of the present specification are not limited thereto.

[0118] Each of the plurality of second portions 201a2 according to the embodiments of the present specification can be composed of an organic material portion. For example, by disposing the organic material portion between each of the inorganic material portions, the impact applied to the inorganic material portion (or the first portion) can be absorbed, the stress concentrated on the inorganic material portion can be released, the durability of the vibration layer 201a or the first vibration device 200 can be improved, and flexibility can be provided to the vibration layer 201a or the first vibration device 200. Thereby, the first vibration device 200 can be configured to have flexibility.

[0119] The second portion 201a2 according to the embodiments of the present specification can have a lower modulus (or Young's modulus) and viscoelasticity than the first portion 201a1, and thus, the reliability of the first portion 201a1, which is vulnerable to impact due to the brittle characteristics of the first portion 201a1, can be improved. For example, the second portion 201a2 can be composed of a material having a loss factor of 0.01 to 1 and a modulus of 0.1 to 10 GPa (Gigapascal).

[0120] The organic material portion constituting the second portion 201a2 can include an organic material, an organic polymer, an organic piezoelectric material, or an organic non-piezoelectric material having flexible characteristics as compared with the inorganic material portion that is the first portion 201a1. For example, the second portion 201a2 can be referred to as an adhesive portion having flexibility, a stretching portion, a bending portion, a damping portion, or a soft portion, etc., but the embodiments of the present specification are not limited thereto.

[0121] According to the embodiments of the present specification, the vibration layer 201a may have a single thin film shape by arranging (or connecting) a plurality of first portions 201a1 and second portions 201a2 in the same plane. For example, the vibration layer 201a may have a structure in which a plurality of first portions 201a1 are connected on one side. For example, the plurality of first portions 201a1 may have a structure that is connected throughout the vibration layer 201a. For example, the vibration layer 201a can vibrate vertically by the first portion 201a1 having vibration characteristics, and can bend into a curved surface shape by the second portion 201a2 having flexibility. And, in the vibration layer 201a according to the embodiments of the present specification, the size of the first portion 201a1 and the size of the second portion 201a2 can be set according to the piezoelectric characteristics and flexibility required for the vibration layer 201a or the first vibration device 200. According to the embodiments of the present specification, in the case of the vibration layer 201a that requires piezoelectric characteristics rather than flexibility, the size of the first portion 201a1 may be configured to be larger than the size of the second portion 201a2. According to other embodiments of the present specification, in the case of the vibration layer 201a that requires flexibility rather than piezoelectric characteristics, the size of the second portion 201a2 may be configured to be larger than the size of the first portion 201a1. Therefore, since the size of the vibration layer 201a can be adjusted according to the required characteristics, there is an advantage that the design of the vibration layer 201a is easy.

[0122] The first electrode layer 201b may be disposed on the first surface (or upper surface) of the vibration layer 201a. The first electrode layer 201b may be commonly disposed or bonded (or connected) to the first surface of each of the plurality of first portions 201a1 and the first surface of each of the plurality of second portions 201a2, and may be electrically connected to the first surface of each of the plurality of first portions 201a1. For example, the first electrode layer 201b may have the shape of a single electrode (or one electrode) disposed on the entire first surface of the vibration layer 201a. For example, the first electrode layer 201b may have substantially the same shape as the vibration layer 201a, but the embodiments of the present specification are not limited thereto.

[0123] The second electrode layer 201c can be disposed on a second surface (or back surface) different from (or opposite to) the first surface of the vibration layer 201a. The second electrode layer 201c can be commonly disposed or coupled to the second surface of each of the plurality of first portions 201a1 and the second surface of each of the plurality of second portions 201a2, and can be electrically connected to the second surface of each of the plurality of first portions 201a1. For example, the second electrode layer 201c can have the shape of a single electrode (or one electrode) disposed on the entire second surface of the vibration layer 201a. For example, the second electrode layer 201c can have the same shape as the vibration layer 201a, but the embodiments of this specification are not limited thereto.

[0124] One or more of the first electrode layer 201b and the second electrode layer 201c according to the embodiments of this specification can be made of a transparent conductive material, a translucent conductive material, or an opaque conductive material. For example, the transparent or translucent conductive material can include ITO (indium tin oxide) or IZO (indium zinc oxide), but the embodiments of this specification are not limited thereto. The opaque conductive material can include aluminum (Al), copper (Cu), gold (Au), silver (Ag), molybdenum (Mo), or magnesium (Mg), etc., or can be an alloy thereof, but the embodiments of this specification are not limited thereto.

[0125] The vibration layer 201a can be polarized by a constant voltage applied to the first electrode layer 201b and the second electrode layer 201c in a constant temperature atmosphere or a temperature atmosphere that changes from high temperature to normal temperature, but the embodiments of this specification are not limited thereto. For example, the vibration layer 201a can vibrate by alternately repeating contraction and / or expansion due to the inverse piezoelectric effect by an acoustic signal (or voice signal or drive signal) externally applied to the first electrode layer 201b and the second electrode layer 201c. For example, the vibration layer 201a can vibrate by vertical vibration and planar vibration according to the acoustic signal applied to the first electrode layer 201b and the second electrode layer 201c. The vibration layer 201a can increase the displacement of the vibration member by contraction and / or expansion in the planar direction, and thus can further improve the vibration of the vibration member.

[0126] The first vibration device 200 according to the embodiment of the present specification may further include a first cover member 202 and a second cover member 203.

[0127] The first cover member 202 may be disposed on the first surface of the vibrating portion 201. For example, the first cover member 202 may be configured to cover the first electrode layer 201b. Therefore, the first cover member 202 can protect the first electrode layer 201b.

[0128] The second cover member 203 may be disposed on the second surface of the vibrating portion 201. For example, the second cover member 203 may be configured to cover the second electrode layer 201c. Therefore, the second cover member 203 can protect the second electrode layer 201c.

[0129] Each of the first cover member 202 and the second cover member 203 according to the embodiment of the present specification may include one or more materials among plastic, fiber, leather, wood, fabric, rubber, carbon, glass, and paper, but the embodiments of the present specification are not limited thereto. For example, each of the first cover member 202 and the second cover member 203 may include the same or different materials. For example, each of the first cover member 202 and the second cover member 203 may be a polyimide film or a polyethylene terephthalate film, but the embodiments of the present specification are not limited thereto.

[0130] The first cover member 202 according to the embodiment of the present specification may be connected or bonded to the first electrode layer 201b via the first adhesive layer 204. For example, the first cover member 202 may be connected or bonded to the first electrode layer 201b by a film laminating process performed via the first adhesive layer 204.

[0131] The second cover member 203 according to the embodiment of the present specification can be connected or coupled to the second electrode layer 201c via the second adhesive layer 205. For example, the second cover member 203 can be connected or coupled to the second electrode layer 201c by a film laminating process performed via the second adhesive layer 205. For example, the first vibration device 200 can be realized as a single film by the first cover member 202 and the second cover member 203.

[0132] The first adhesive layer 204 can be disposed between the first electrode layer 201b and the first cover member 202. The second adhesive layer 205 can be disposed between the second electrode layer 201c and the second cover member 203. For example, the first adhesive layer 204 and the second adhesive layer 205 can be configured between the first cover member 202 and the second cover member 203 so as to wrap the vibration layer 201a, the first electrode layer 201b, and the second electrode layer 201c. For example, the first adhesive layer 204 and the second adhesive layer 205 can be configured between the first cover member 202 and the second cover member 203 so as to completely wrap the vibration layer 201a, the first electrode layer 201b, and the second electrode layer 201c. For example, the vibration layer 201a, the first electrode layer 201b, and the second electrode layer 201c can be embedded or incorporated between the first adhesive layer 204 and the second adhesive layer 205.

[0133] Each of the first adhesive layer 204 and the second adhesive layer 205 according to the embodiment of the present specification can include an electrically insulating material having adhesiveness and being capable of compression and restoration. For example, each of the first adhesive layer 204 and the second adhesive layer 205 can include an epoxy resin, an acrylic resin, a silicone resin, or a urethane resin, but the embodiments of the present specification are not limited thereto.

[0134] The first vibration device 200 according to the embodiment of the present specification can further include a first power supply line PL1 disposed on the first cover member 202, a second power supply line PL2 disposed on the second cover member 203, and a pad portion 206 electrically connected to the first power supply line PL1 and the second power supply line PL2.

[0135] The first power supply line PL1 is disposed between the first electrode layer 201b and the first cover member 202 and can be electrically connected to the first electrode layer 201b. The first power supply line PL1 extends long along the second direction Y and can be electrically connected to the central portion of the first electrode layer 201b. According to an embodiment of the present specification, the first power supply line PL1 can be electrically connected to the first electrode layer 201b via an anisotropic conductive film. According to another embodiment of the present specification, the first power supply line PL1 can be electrically connected to the first electrode layer 201b via a conductive substance (or particles) contained in the first adhesive layer 204.

[0136] The second power supply line PL2 is disposed between the second electrode layer 201c and the second cover member 203 and can be electrically connected to the second electrode layer 201c. The second power supply line PL2 extends long along the second direction Y and can be electrically connected to the central portion of the second electrode layer 201c. According to an embodiment of the present specification, the second power supply line PL2 can be electrically connected to the second electrode layer 201c via an anisotropic conductive film. According to another embodiment of the present specification, the second power supply line PL2 can be electrically connected to the second electrode layer 201c via a conductive substance (or particles) contained in the second adhesive layer 205.

[0137] According to an embodiment of the present specification, the first power supply line PL1 can be arranged so as not to overlap the second power supply line PL2. When the first power supply line PL1 is arranged so as not to overlap the second power supply line PL2, the problem of short-circuit failure between the first power supply line PL1 and the second power supply line PL2 can be improved.

[0138] The pad portion 206 can be formed at one side edge of either the first cover member 202 or the second cover member 203 so as to be electrically connected to one side (or one end) of each of the first power supply line PL1 and the second power supply line PL2.

[0139] The pad portion 206 according to the embodiment of the present specification may include a first pad electrode electrically connected to one end of the first power supply line PL1 and a second pad electrode electrically connected to one end of the second power supply line PL2.

[0140] The first pad electrode is disposed on one side edge of either the first cover member 202 or the second cover member 203 and can be connected to one end of the first power supply line PL1. For example, the first pad electrode can penetrate either the first cover member 202 or the second cover member 203 and be electrically connected to one end of the first power supply line PL1.

[0141] The second pad electrode is disposed parallel to the first pad electrode and can be connected to one end of the second power supply line PL2. For example, the second pad electrode can penetrate either the first cover member 202 or the second cover member 203 and be electrically connected to one end of the second power supply line PL2.

[0142] According to the embodiment of the present specification, each of the first power supply line PL1, the second power supply line PL2, and the pad portion 206 can be configured to be transparent, translucent, or opaque.

[0143] The pad portion 206 according to the embodiment of the present specification can be electrically connected to a signal cable 207 (or a signal connection member).

[0144] The signal cable 207 (or signal connection member) is electrically connected to the pad portion 206 disposed on the first vibration device 200, and can supply a vibration drive signal (or acoustic signal or voice signal) provided from the acoustic processing circuit to the first vibration device 200. The signal cable 207 according to the embodiments of the present specification can include a first terminal electrically connected to the first pad electrode of the pad portion 206 and a second terminal electrically connected to the second pad electrode of the pad portion 206. For example, the signal cable 207 can be a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multi-layer printed circuit, or a flexible multi-layer printed circuit board, but the embodiments of the present specification are not limited thereto.

[0145] The acoustic processing circuit can generate an alternating current type vibration drive signal including a first vibration drive signal and a second vibration drive signal based on acoustic data provided from an external acoustic data generation circuit unit. The first vibration drive signal can be either a positive polarity (+) vibration drive signal or a negative polarity (-) vibration drive signal, and the second vibration drive signal can be either a positive polarity (+) vibration drive signal or a negative polarity (-) vibration drive signal. For example, the first vibration drive signal can be supplied to the first electrode layer 201b via the first terminal of the signal cable 207, the first pad electrode of the pad portion 206, and the first power supply line PL1. The second vibration drive signal can be supplied to the second electrode layer 201c via the second terminal of the signal cable 207, the second pad electrode of the pad portion 206, and the second power supply line PL2.

[0146] According to an embodiment of the present specification, the signal cable 207 can be configured to be transparent, translucent, or opaque.

[0147] The first vibration device 200 according to the embodiment of this specification can be realized as a thin film by alternately and repeatedly connecting a first part 201a1 having piezoelectric characteristics and a second part 201a2 having flexibility. Therefore, in the first vibration device 200, the vibration amplitude (or displacement amplitude) can be increased by the second part 201a2 having flexibility. Therefore, the acoustic characteristics and / or sound pressure characteristics in the low frequency band generated by the vibration of the vibration member can be improved.

[0148] FIGS. 6 to 8 are diagrams showing other embodiments of the vibration part shown in FIG. 5.

[0149] Referring to FIG. 6, the vibration layer 201a of the vibration part 201 according to another embodiment of this specification may include a plurality of first parts 201a1 spaced apart from each other along a first direction X and a second direction Y, and a second part 201a2 disposed between the plurality of first parts 201a1.

[0150] Each of the plurality of first parts 201a1 may be arranged to be spaced apart from each other along each of the first direction X and the second direction Y. For example, each of the plurality of first parts 201a1 may have a hexahedral shape having the same size as each other and may be arranged in a lattice. Since each of the plurality of first parts 201a1 is made of substantially the same piezoelectric material as the first part 201a1 described with reference to FIGS. 3 to 5, the same drawing reference numerals are given thereto, and the overlapping description thereof is omitted.

[0151] The second part 201a2 can be arranged between a plurality of first parts 201a1 along each of the first direction X and the second direction Y. The second part 201a2 can be connected or adhered to the adjacent first parts 201a1 by being configured to fill the gap between two adjacent first parts 201a1 or surround each of the plurality of first parts 201a1. According to the embodiments herein, the width W4 of the second part 201a2 arranged between two adjacent first parts 201a1 along the first direction X may be the same as or different from the width W3 of the first part 201a1, and the width W4 of the second part 201a2 arranged between two adjacent first parts 201a1 along the second direction Y may be the same as or different from the width W3 of the first part 201a1. Since the second part 201a2 is made of substantially the same organic material as the second part 201a2 described with reference to FIGS. 3 to 5, the same drawing reference numerals are given thereto, and the repeated description thereof is omitted.

[0152] According to other embodiments herein, the vibration layer 201a may have a resonance frequency of 30 MHz or less by having a 1-3 composite structure having piezoelectric characteristics of 1-3 vibration modes, but the embodiments herein are not limited thereto. For example, the resonance frequency of the vibration layer 201a can be changed by at least one of form, length, and thickness.

[0153] Referring to FIG. 7, the vibration layer 201a of the vibration part 201 according to other embodiments herein can include a plurality of first parts 201a1 spaced apart from each other along the first direction X and the second direction Y, and a second part 201a2 arranged between the plurality of first parts 201a1.

[0154] Each of the plurality of first portions 201a1 may have a circular planar structure. For example, each of the plurality of first portions 201a1 may have a disc shape, but the embodiments of this specification are not limited thereto. For example, each of the plurality of first portions 201a1 may have a point shape including an elliptical shape, a polygonal shape, or a donut shape. Since each of the plurality of first portions 201a1 is made of substantially the same piezoelectric material as the first portion 201a1 described with reference to FIGS. 3 to 5, the same drawing reference numerals are given thereto, and redundant descriptions thereof are omitted.

[0155] The second portion 201a2 may be disposed between the plurality of first portions 201a1 along each of the first direction X and the second direction Y. By being configured to surround each of the plurality of first portions 201a1, the second portion 201a2 may be connected or adhered to the side surfaces of each of the plurality of first portions 201a1. Each of the plurality of first portions 201a1 and the second portion 201a2 may be arranged (or arrayed) parallel to each other in the same plane (or the same layer). Since the second portion 201a2 is made of substantially the same organic material as the second portion 201a2 described with reference to FIGS. 3 to 5, the same drawing reference numerals are given thereto, and redundant descriptions thereof are omitted.

[0156] Referring to FIG. 8, the vibration layer 201a of the vibration part 201 according to another embodiment of this specification may include a plurality of first portions 201a1 spaced apart from each other along the first direction X and the second direction Y, and a second portion 201a2 disposed between the plurality of first portions 201a1.

[0157] Each of the plurality of first portions 201a1 may have a triangular planar structure. For example, each of the plurality of first portions 201a1 may have a triangular plate shape. Since each of the plurality of first portions 201a1 is made of substantially the same piezoelectric material as the first portion 201a1 described with reference to FIGS. 3 to 5, the same drawing reference numerals are given thereto, and redundant descriptions thereof are omitted.

[0158] According to the embodiments of this specification, four adjacent first parts 201a1 among the plurality of first parts 201a1 may be arranged adjacent to form a quadrilateral (or square). Each vertex of the four adjacent first parts 201a1 forming the quadrilateral may be arranged adjacent to the central part (or the exact middle part) of the quadrilateral.

[0159] The second part 201a2 may be arranged between the plurality of first parts 201a1 along each of the first direction X and the second direction Y. By being configured to surround each of the plurality of first parts 201a1, the second part 201a2 may be connected or adhered to the side surfaces of each of the plurality of first parts 201a1. Each of the plurality of first parts 201a1 and the second part 201a2 may be arranged (or arrayed) parallel to each other in the same plane (or the same layer). Since the second part 201a2 is made of substantially the same organic substance as the second part 201a2 described with reference to FIGS. 3 to 5, the same drawing reference numerals are assigned thereto, and duplicate descriptions thereof are omitted.

[0160] According to other embodiments of this specification, 2N (N is a natural number greater than or equal to 2) adjacent first parts 201a1 among the plurality of first parts 201a1 having triangles may be arranged adjacent to form a 2N-sided polygon. For example, six adjacent first parts 201a1 among the plurality of first parts 201a1 may be arranged adjacent to form a hexagon (or square). Each vertex of the six adjacent first parts 201a1 forming the hexagon may be arranged adjacent to the central part (or the exact middle part) of the hexagon. By being configured to surround each of the plurality of first parts 201a1, the second part 201a2 may be connected or adhered to the side surfaces of each of the plurality of first parts 201a1. Each of the plurality of first parts 201a1 and the second part 201a2 may be arranged (or arrayed) parallel to each other in the same plane (or the same layer).

[0161] FIG. 9 is a diagram showing a vibration device according to an embodiment of this specification.

[0162] Referring to FIG. 9, the vibration devices 200, 200' according to the embodiments of the present specification can include a first vibration device 200 and a second vibration device 200'.

[0163] The first vibration device 200 can be disposed on the rear surface of the vibration member 100. The first vibration device 200 can be connected or coupled to the rear surface of the vibration member 100 via the connecting member 160. The first vibration device 200 can be embodied in a film form that is connected or coupled to the rear surface of the vibration member 100 via the connecting member 160.

[0164] The first vibration device 200 can be referred to as a first acoustic generation module, a first acoustic device, a first vibration generation device, a first displacement device, a first acoustic device, a piezoelectric vibration device, a film actuator, a film-type piezoelectric composite actuator, a film speaker, a film-type piezoelectric speaker, or a film-type piezoelectric composite speaker having piezoelectric characteristics, but is not limited to this term.

[0165] The connecting member 160 is disposed between the first vibration device 200 and the vibration member 100 and can connect or couple the first vibration device 200 to the vibration member 100. For example, the first vibration device 200 can be supported or disposed on the rear surface of the vibration member 100 by being connected or coupled to the rear surface of the vibration member 100 via the connecting member 160.

[0166] The second vibration device 200' can be disposed between the vibration member 100 and the support member 300. The second vibration device 200' can be adjacent to or in contact with the rear surface of the first vibration device 200. The second vibration device 200' can include a frame 210, a magnet 220, a center pole 230, a bobbin 240, and a coil 250, etc.

[0167] The frame 210 is fixed to the support member 300 so as to overlap with the through holes 315 and 335 (or the first holes) of the support member 300, and can support the magnet 220. The frame 210 can accommodate the magnet 220, the center pole 230, the bobbin 240, and the coil 250.

[0168] For example, the magnet 220 can be disposed on the frame 210. For example, the center pole 230 can be disposed on the frame 210. For example, the frame 210 can include a first frame 211 that accommodates the magnet 220, the center pole 230, the bobbin 240, and the coil 250, and a second frame 212 that protrudes from the edge of the first frame 211. The first frame 211 and the second frame 212 can be integrally formed. For example, the first frame 211 and the second frame 212 can be made of a material such as iron (Fe), but the embodiments herein are not limited thereto. The first frame 211 and the second frame 212 can be expressed in other terms such as yoke, but are not limited to this term.

[0169] The first frame 211 can accommodate the magnet 220, the center pole 230, the bobbin 240, and the coil 250. For example, the interior of the first frame 211 can have a cylindrical, elliptical cylinder or cylinder shape. The magnet 220 is disposed on the first frame 211, and the center pole 230 can be disposed on the magnet 220. The first frame 211 can support the magnet 220 and the center pole 230. The first frame 211 can be configured to surround the magnet 220 and the center pole 230 on the first frame 211 and the bobbin 240 and the coil 250 disposed around the center pole 230. For example, the coil 250 can be wound around the outer contour of the bobbin 240.

[0170] The second frame 212 may be formed to protrude from the edge of the first frame 211. The second frame 212 may be integrally formed with the first frame 211. For example, the second frame 212 may have an annular form surrounding the first frame 211. A coupling part 213 for being fixed to the support member 300 may be formed in a part of the second frame 212. The second frame 212 may be coupled to the support member 300 by a connecting member 270 fastened to the coupling part 213. For example, the connecting member 270 may include a screw 271 and a nut 272. The nut 272 of the connecting member 270 may be fixed to the support member 300. For example, the nut 272 may be fixed to the first support member 310. A part of the rear surface of the first support member 310 may be exposed through the through hole 335 of the second support member 330, and the nut 272 may be fixed to the rear surface of the first support member 310 exposed through the second through hole 335 of the second support member 330. The screw 271 of the connecting member 270 is fastened to the nut 272 fixed to the first support member 310 by the coupling part 213, whereby the second frame 212 can be coupled to the first support member 310. For example, the nut 272 may be a self-clinching nut. Thus, the vibration device 200 may be fixed to the support member 300. An example of the self-clinching nut may be a PEM (registered trademark) nut, but the embodiments of the present specification are not limited thereto.

[0171] The second vibration device 200' according to the embodiments of the present specification may further include a frame cover 280 covering the rear surface of the frame 210.

[0172] The frame cover 280 may be configured to surround the rear surface of the frame 210. For example, the frame cover 280 is configured to surround the rear surface of the frame 210 and can release the heat generated during the vibration of the second vibration device 200'. The frame cover 280 may be configured to surround the rear surfaces of the first frame 211 and the second frame 212 of the frame 210. For example, the frame cover 280 may be made of a metal material with high thermal conductivity such as aluminum (Al), copper (Cu), silver (Ag), or magnesium (Mg) and their alloys, but the embodiments of this specification are not limited thereto.

[0173] A heat dissipation member 285 may be disposed on the inner surface of the frame cover 280. The heat dissipation member 285 may be disposed between the frame cover 280 and the rear surface of the frame 210. The heat dissipation member 285 may be disposed between the frame cover 280 and the rear surface of the first frame 211. For example, the heat dissipation member 285 may be made of a metal material with high thermal conductivity such as aluminum (Al), copper (Cu), silver (Ag), or magnesium (Mg) and their alloys, but the embodiments of this specification are not limited thereto.

[0174] The magnet 220 may be disposed on the frame 210. For example, the magnet 220 may be disposed on the first frame 211 of the frame 210. The lower end of the magnet 220 is supported by the first frame 211, and the periphery of the magnet 220 may be surrounded. For example, the magnet 220 may be a permanent magnet having a ring shape, a cylindrical shape, or an elliptical shape. The magnet 220 can use a sintered magnet such as barium ferrite, and alloy cast magnets such as iron(III) oxide (Fe2O3), witherite (BaCO3), neodymium (Nd), strontium ferrite (Fe 12 O 19 Sr), aluminum (Al), nickel (Ni), or cobalt (Co), but the embodiments of this specification are not limited thereto. For example, the neodymium magnet may be neodymium-iron-boron (Nd-Fe-B).

[0175] A center pole 230 can be disposed on the magnet 220. The center pole 230 can also be referred to as pole pieces. According to other embodiments, pole pieces can be further disposed on the center pole 230.

[0176] The bobbin 240 can surround the magnet 220. For example, the bobbin 240 can surround the magnet 220 and the center pole 230. The bobbin 240 can be disposed on the frame 210. For example, the bobbin 240 can be disposed on the first frame 211 of the frame 210. The bobbin 240 can be accommodated within the first frame 211. The bobbin 240 can be surrounded by the first frame 211. For example, the bobbin 240 can be disposed between the magnet 220 and the first frame 211.

[0177] The bobbin 240 can be adjacent to or in contact with the rear surface of the first vibrator 200. The bobbin 240 can be attached to the rear surface of the first vibrator 200. The bobbin 240 can be attached to the rear surface of the first vibrator 200 via a bobbin ring 245. For example, when a current or voice signal for generating sound is applied to a coil 250 wound around the outer peripheral surface of the bobbin 240, the entire bobbin 240 can move (or vibrate) up and down by Fleming's left hand rule due to the applied magnetic field formed around the coil 250 and the magnetic field formed around the magnet 220. The up and down movement (or vibration) of the bobbin 240 can directly or indirectly vibrate the vibrating member 100. For example, the bobbin 240 can vibrate the first vibrator 200 or the vibrating member 100 via the bobbin ring 245. The bobbin 240 can directly vibrate the first vibrator 200 and the vibrating member 100. Alternatively, the vibration of the bobbin 240 can be transmitted to the vibrating member 100 via the first vibrator 200. Then, the vibrating member 100 receives the vibration directly or indirectly from the bobbin 240 or the bobbin ring 245 to generate sound or sound waves, and the sound or sound waves can be output in front of the vibrating member 100.

[0178] The damper 260 is disposed between the bobbin 240 and the first frame 211 and can guide the vibration of the bobbin 240. For example, one end (or one side) of the damper 260 may be connected to the first frame 211, and the other end (or the other side) of the damper 260 may be connected to the bobbin 240. The damper 260 can adjust and guide the vibration of the bobbin 240 while contracting and relaxing due to the linear reciprocating motion of the bobbin 240 by having a wrinkled structure between one end and the other end of the damper 260. Thus, the damper 260 can limit the vibration distance of the bobbin 240 by the restoring force when connected between the first frame 211 and the bobbin 240. For example, when the bobbin 240 vibrates more than a certain distance or less than a certain distance, the bobbin 240 can return to its original position by the restoring force of the damper 260. For example, it can be said that the damper 260 can be expressed in other terms such as an edge, a spider, or a suspension, but is not limited to this term.

[0179] The bobbin ring 245 is interposed between the bobbin 240 and the first vibration device 200, so that the vibration of the bobbin 240 can be transmitted to the first vibration device 200 or the vibration member 100. The bobbin ring 245 can be disposed on the entire bobbin 240, but the embodiments of the present specification are not limited thereto, and the bobbin ring 245 can be disposed at a certain position of the bobbin 240. The bobbin ring 245 can be attached to the rear surface of the first vibration device 200 by an adhesive member. For example, the adhesive member can be a double-sided tape, a single-sided tape, an adhesive, and a bond, but the embodiments of the present specification are not limited thereto. For example, the bobbin ring 245 can block the heat generated by the bobbin 240 from being transmitted to the first vibration device 200 or the vibration member 100, and can efficiently transmit the vibration of the bobbin 240 to the first vibration device 200 or the vibration member 100.

[0180] According to the embodiments of this specification, when the second vibration device 200' vibrates, the heat generated can be reduced or decreased by the first vibration device 200 provided between the vibration member 100 and the second vibration device 200'. For example, the first vibration device 200 can prevent or minimize the heat generated by the second vibration device 200' from being transmitted to the vibration member 100. The first vibration device 200 can have a size larger than that of the second vibration device 200' or be configured to cover the second vibration device 200'. For example, the first vibration device 200 can contact the bobbin 240 of the second vibration device 200'. The first vibration device 200 can contact the bobbin ring 245 of the second vibration device 200'. The first vibration device 200 can have a size larger than that of the bobbin 240 or the bobbin ring 245 of the second vibration device 200' with which it contacts. Therefore, in the device according to the embodiments of this specification, the first vibration device 200 between the vibration member 100 and the second vibration device 200' can further play a role in preventing or minimizing the heat generated by the second vibration device 200' from being transmitted to the vibration member 100, so that the influence on the display panel or the vibration member 100 caused by the heat generated during the vibration of the second vibration device 200' or the influence on the image quality of the display panel can be reduced. For example, the first vibration device 200 can be attached to the second vibration device 200' by an adhesive member. The adhesive member can be a double-sided tape, a single-sided tape, an adhesive, and a bond, but the embodiments of this specification are not limited thereto. For example, the adhesive member can be disposed between the first vibration device 200 and the bobbin 240 or the bobbin ring 245.

[0181] A gap space GS can be included between the vibration member 100 and the support member 300. A partition member 600 that provides or limits the gap space GS can be further included between the vibration member 100 and the support member 300.

[0182] The partition member 600 can include or define a gap space GS where sound is generated when the vibration member 100 vibrates by the vibration devices 200, 200'. The partition member 600 can separate the sound generated by the vibration member 100 or separate the channels, and can prevent or reduce the interference of the sound. The partition member 600 can be referred to as an enclosure or a baffle, but is not limited to this term.

[0183] The partition member 600 can include or partition a gap space GS (or an internal space) corresponding to the vibration devices 200, 200'. For example, the partition member 600 can be configured to surround the periphery of the vibration devices 200, 200'. The partition member 600 can be composed of four sides surrounding the vibration devices 200, 200'. As an example, the partition member 600 can be formed in a structure where the four sides are integrated, thereby forming a structure that seals the gap space GS between the vibration member 100 and the support member 300 around the vibration devices 200, 200'. As another example, the partition member 600 can be formed in a structure that does not seal the gap space GS between the vibration member 100 and the support member 300 around the vibration devices 200, 200' by forming an opening on one or more of the four sides.

[0184] According to the embodiments of this specification, the partition member 600 can be made of a material that can absorb or adjust vibrations. The partition member 600 can include, but is not limited to, single-sided tape, single-sided foam tape, single-sided foam pad, double-sided tape, double-sided foam pad, double-sided tape, etc. For example, the partition member 600 can include one or more of silicone-based polymers, paraffin wax, urethane-based polymers, and acrylic-based polymers. For example, the partition member 600 can include a urethane-based substance (or material) that has relatively softer characteristics than acrylic among acrylic and urethane in order to minimize the transmission of the vibration of the vibration member 100 to the support member 300.

[0185] The device according to the embodiments of this specification can further include a control board 501 for controlling the first vibration device 200 and the second vibration device 200'.

[0186] The control board 501 can include an acoustic processing circuit that generates a vibration drive signal (or vibration signal or acoustic signal or voice signal) for controlling the drive or vibration drive of the first vibration device 200 and the second vibration device 200'. For example, the acoustic processing circuit can generate an alternating current form of vibration drive signal including a first vibration drive signal and a second vibration drive signal based on the acoustic data provided from an external acoustic data generation circuit unit. For example, the acoustic processing circuit can be said to be an audio circuit, an audio amplifier circuit, an audio amplifier, or an audio amplifier unit, etc., but is not limited to this term.

[0187] The control board 501 can be implemented by a printed circuit board on which the acoustic processing circuit is mounted. The control board 501 can be disposed on the rear surface of the support member 300. For example, the control board 501 can be attached to the rear surface of the support member 300.

[0188] According to the embodiments of the present specification, the control board 501 can be connected to the first vibration device 200 and the second vibration device 200' via other signal paths. The control board 501 can be connected to each of the first vibration device 200 and the second vibration device 200' via different signal paths. For example, the first vibration device 200 can be connected to the control board 501 via a first signal path, and the second vibration device 200' can be connected to the control board via a second signal path different from the first signal path. The control board 501 can be configured to apply different vibration drive signals to the first vibration device 200 and the second vibration device 200' via different signal paths, so that the first vibration device 200 and the second vibration device 200' can be driven individually or vibrated. For example, the first vibration device 200 and the second vibration device 200' can be driven individually or vibrated according to different vibration drive signals. For example, when the desired sound is in the first sound range band (or high sound range band or mid-high sound range band), the control board 501 can apply a vibration drive signal to the first vibration device 200 without applying a vibration drive signal to the second vibration device 200'. According to another example, when the desired sound is in the second sound range band (or low sound range band or mid-low sound range band), the control board 501 can apply a vibration drive signal to the second vibration device 200' without applying a vibration drive signal to the first vibration device 200. According to another example, the control board 501 can be individually configured for each of the first vibration device 200 and the second vibration device 200'. For example, the control board 501 can include a first control board for controlling the first vibration device 200 and a second control board for controlling the second vibration device 200'. The first control board and the second control board of the control board 501 can be configured to individually control the first vibration device 200 and the second vibration device 200'.

[0189] The control board 501 can include a signal connector 510 that applies a vibration drive signal to the first vibration device 200 and the second vibration device 200'. The signal connector 510 can be commonly connected to the first vibration device 200 and the second vibration device 200'. Alternatively, the signal connector 510 can be individually configured for each of the first vibration device 200 and the second vibration device 200'. For example, the signal connector 510 can include a first signal connector connected to the first vibration device 200 and a second signal connector connected to the second vibration device 200'.

[0190] The control board 501 can be electrically connected to the first vibration device 200 and the second vibration device 200' via a signal connection member 207 connected to the signal connector 510. For example, the signal connection member 207 can include at least one of a signal cable, a probe pin, and a pogo pin.

[0191] According to an embodiment of the present specification, the support member 300 can include a first contact hole 340 through which a signal connection member 207 connecting between the first vibration device 200 and the signal connector 510 of the control board 501 passes, as shown in FIG. 9. For example, the first contact hole 340 can be drilled in a set partial region of the support member 300 along the thickness direction Z of the support member 300 so that the signal connection member 207 passes between the outside and the inside of the support member 300. That is, a part of the signal connection member 207 can be disposed within the first contact hole 340. The first contact hole 340 can be formed in the support member 300 that does not overlap with the second vibration device 200'. The first vibration device 200 can be electrically connected to the signal connector 510 of the control board 501 via the signal connection member 207 passing through the first contact hole 340 of the support member 300. For example, the signal connection member 207 can have the same or a similar configuration as the signal cable 207 described with reference to FIG. 3.

[0192] One end (or one side) of the signal connection member 207 can be connected to the first vibration device 200, and the other end (or the other side) of the signal connection member 207 can be connected to the signal connector 510 of the control board 501. For example, the signal connection member 207 can be connected to each of the first and second power supply lines PL1, PL2 of the first vibration device 200 or the first electrode layer 201b and the second electrode layer 201c.

[0193] As shown in FIG. 9, the signal connection member 207 can be inserted into or accommodated in the first vibration device 200, so as to be connected to each of the first and second power supply lines PL1, PL2 of the first vibration device 200. The signal connection member 207 can be disposed between the first and second power supply lines PL1, PL2 of the first vibration device 200. For example, one surface (or the upper surface) of the signal connection member 207 can contact the first power supply line PL1 connected to the first electrode layer 201b, and the other surface (or the lower surface) of the signal connection member 207 can contact the second power supply line PL2 connected to the second electrode layer 201c.

[0194] FIGS. 10 and 11 are diagrams showing other embodiments of the vibration device shown in FIG. 9. FIGS. 10 and 11 show changes in the configuration of the control board and the signal connection member shown in FIG. 9. Therefore, redundant descriptions are omitted or briefly described for the remaining same configurations except for the changed configurations of the control board and the signal connection member and the related configurations.

[0195] Referring to FIG. 10, for the vibration devices 200, 200' according to other embodiments of the present specification, the control board 501 for controlling the first vibration device 200 and the second vibration device 200' can be disposed behind the second vibration device 200'. And it can further include the signal connector 510 of the control board 501 and the signal connection member 520 connected to the first vibration device 200.

[0196] The control board 501 can be embodied by a printed circuit board on which an acoustic processing circuit is implemented. The control board 501 can be disposed on the rear surface of the second vibration device 200'. For example, the control board 501 can be attached to the rear surface of the second vibration device 200'. The control board 501 can be attached to the rear surface of the frame 210 of the second vibration device 200'. The control board 501 can be attached to the rear surface of the second frame 212 of the frame 210.

[0197] According to another embodiment of the present specification, the control board 501 can be connected to the first vibration device 200 and the second vibration device 200' via the same signal path. The control board 501 can be configured to apply the same vibration drive signal to the first vibration device 200 and the second vibration device 200' via the same signal path so that the first vibration device 200 and the second vibration device 200' are driven simultaneously or vibrated. For example, the first vibration device 200 and the second vibration device 200' can be driven simultaneously or vibrated in response to the same vibration drive signal. For example, when the desired sound is in the first sound range band (or high sound range band or mid-high sound range band), the control board 501 can generate a vibration drive signal adapted or optimized for driving or vibrating the first vibration device 200 and apply it to the first vibration device 200 and the second vibration device 200'. According to another example, when the desired sound is in the second sound range band (or low sound range band or mid-high sound range band), the control board 501 can generate a vibration drive signal adapted or optimized for driving or vibrating the second vibration device 200' and apply it to the first vibration device 200 and the second vibration device 200'.

[0198] The control board 501 can include a signal connector 510 that applies a vibration drive signal to the first vibration device 200 and the second vibration device 200'. The signal connector 510 can be commonly connected to the first vibration device 200 and the second vibration device 200'.

[0199] The control board 501 can be electrically connected to the first vibration device 200 and the second vibration device 200' via a signal connection member 520 connected to the signal connector 510. For example, the signal connection member 520 can include at least one of a signal cable, a probe pin, and a pogo pin.

[0200] The support member 300 according to another embodiment of the present specification can include a first contact hole 340 through which a signal connection member 520 connecting between the first vibration device 200 and the signal connector 510 of the control board 501 passes, as shown in FIG. 10. For example, the first contact hole 340 can be drilled in a set partial region of the support member 300 along the thickness direction Z of the support member 300 so that the signal connection member 520 passes between the outside and the inside of the support member 300. The first contact hole 340 can be formed in the support member 300 that overlaps with the second vibration device 200'. For example, the first contact hole 340 can be formed in the first support member 310 of the support member 300. The first contact hole 340 can be formed in the first support member 310 exposed through the second through hole 335 of the second support member 330.

[0201] The second vibration device 200' can include a second contact hole 217 that overlaps with the first contact hole 340 of the support member 300. The second contact hole 217 can be formed in the frame 210 of the second vibration device 200'. The second contact hole 217 can be formed in the second frame 212 of the frame 210. By configuring the first contact hole 340 of the support member 300 and the second contact hole 217 of the second vibration device 200' to overlap, a path through which the signal connection member 520 passes can be provided. The first vibration device 200 can be electrically connected to the signal connector 510 of the control board 501 via the signal connection member 520 passing through the first contact hole 340 of the support member 300 and the second contact hole 217 of the second vibration device 200'. That is, a part of the signal connection member 520 can be disposed in the first contact hole 340, and the other part of the signal connection member 520 can be disposed in the second contact hole 217.

[0202] The signal connection member 520 can include a main body portion 521 and a contact portion 522. The main body portion 521 of the signal connection member 520 can be connected to the signal connector 510, and the contact portion 522 of the signal connection member 520 can be connected to the first vibration device 200. For example, the signal connection member 520 can be composed of probe pins. For example, the first vibration device 200 can include signal contact pads 208 connected to the first and second power supply lines PL1, PL2 or the first electrode layer 201b and the second electrode layer 201c, respectively. And the signal connection member 520 can be connected to the signal contact pads 208 of the first vibration device 200.

[0203] As shown in FIG. 10, the signal contact pads 208 can be inserted or accommodated in the first vibration device 200 and can be connected to the first and second power supply lines PL1, PL2 of the first vibration device 200, respectively. The signal contact pads 208 can be arranged between the first and second power supply lines PL1, PL2 of the first vibration device 200. For example, one surface (or upper surface) of the signal contact pad 208 can contact the first power supply line PL1 connected to the first electrode layer 201b, and the other surface (or lower surface) of the signal contact pad 208 can contact the second power supply line PL2 connected to the second electrode layer 201c.

[0204] As shown in FIG. 10, the contact portion 522 of the signal connection member 520 can include a first contact portion 522a and a second contact portion 522b. The signal connection member 520 can contact the signal contact pads 208 connected to the first vibration device 200 and be electrically connected. For example, the first contact portion 522a can contact one surface (or upper surface) of the signal contact pad 208 connected to the first electrode layer 201b, and the second contact portion 522b can contact the other surface (or lower surface) of the signal contact pad 208 connected to the second electrode layer 201c.

[0205] Referring to FIG. 11, for the vibration devices 200, 200' according to other embodiments of the present specification, a control board 501 for controlling the first vibration device 200 and the second vibration device 200' can be arranged at the rear of the second vibration device 200'. And it can further include a signal connector 510 of the control board 501 and a signal connection member 520 connected to the first vibration device 200.

[0206] The control board 501 can be implemented by a printed circuit board on which an acoustic processing circuit is mounted. The control board 501 can be arranged at the rear of the second vibration device 200'. For example, the control board 501 can be attached to the rear of the second vibration device 200'. The control board 501 can be attached to the rear of the frame 210 of the second vibration device 200'. The control board 501 can be attached to the rear of the second frame 212 of the frame 210.

[0207] According to other embodiments of the present specification, the control board 501 can be connected to the first vibration device 200 and the second vibration device 200' via the same signal path.

[0208] The control board 501 can include a signal connector 510 for applying a vibration drive signal to the first vibration device 200 and the second vibration device 200'. The signal connector 510 can be commonly connected to the first vibration device 200 and the second vibration device 200'.

[0209] The control board 501 can be electrically connected to the first vibration device 200 and the second vibration device 200' via a signal connection member 520 connected to the signal connector 510. For example, the signal connection member 520 can include at least one of a signal cable, a probe pin, and a pogo pin.

[0210] According to another embodiment of the present specification, the support member 300 may include a first contact hole 340 through which a signal connection member 520 connecting between the first vibration device 200 and the signal connector 510 of the control board 501 passes, as shown in FIG. 10. And the second vibration device 200' may include a second contact hole 217 that overlaps with the first contact hole 340 of the support member 300. The first contact hole 340 of the support member 300 and the second contact hole 217 of the second vibration device 200' may be configured to overlap at least a part of the first vibration device 200. The first vibration device 200 may be electrically connected to the signal connector 510 of the control board 501 via the signal connection member 520 passing through the first contact hole 340 of the support member 300 and the second contact hole 217 of the second vibration device 200'.

[0211] The signal connection member 520 may include a main body portion 521, a contact portion 522, and an elastic portion 523. For example, the elastic portion 523 may be housed inside the main body portion 521, and the contact portion 522 may be disposed at one end of the elastic portion 523. The contact portion 522 of the signal connection member 520 may be configured to be able to move freely to a certain extent by the extension and / or contraction of the elastic portion 523. The main body portion 521 of the signal connection member 520 may be connected to the signal connector 510, and the contact portion 522 of the signal connection member 520 that can move freely to a certain extent by the elastic portion 523 may be connected to the first vibration device 200. For example, the signal connection member 520 may be composed of a pogo pin. For example, the signal connection member 520 can be in direct contact with each of the first and second power supply lines PL1, PL2 or the first electrode layer 201b and the second electrode layer 201c of the first vibration device 200 of the first vibration device 200. That is, the signal connection member 520 may include a part disposed in the first contact hole 340 and another part disposed in the second contact hole 217.

[0212] As shown in FIG. 11, the first vibration device 200 can be configured such that a part of the first and second power supply lines PL1 and PL2 of the first vibration device 200 is exposed to the outside. The signal connection member 520 can be connected to each of the first and second power supply lines PL1 and PL2 through the exposed portions of the first and second power supply lines PL1 and PL2. For example, the first vibration device 200 can be configured such that a part of the lower surfaces of the first and second power supply lines PL1 and PL2 is exposed.

[0213] As shown in FIG. 11, the contact portion 522 of the signal connection member 520 can include a first contact portion 522a and a second contact portion 522b. The signal connection member 520 can be in contact with and electrically connected to each of the first and second power supply lines PL1 and PL2 that are partially exposed from the first vibration device 200. For example, the first contact portion 522a can contact the exposed lower surface of the first power supply line PL1 connected to the first electrode layer 201b, and the second contact portion 522b can contact the exposed lower surface of the second power supply line PL2 connected to the second electrode layer 201c.

[0214] FIG. 12 is a diagram showing a vibration device according to another embodiment of the present specification. This is a modification of the structure of the vibration device described with reference to FIGS. 9 to 11. Therefore, duplicate descriptions of the same configurations except for the modified configurations of the vibration device and related configurations are omitted or briefly described.

[0215] Referring to FIG. 12, the vibration devices 200 and 200' according to another embodiment of the present specification can include a first vibration device 200 and a second vibration device 200'.

[0216] The first vibration device 200 can be arranged on the rear surface of the vibration member 100. The first vibration device 200 can be connected or coupled to the rear surface of the vibration member 100 via the connection member 160.

[0217] The second vibration device 200' can be disposed between the vibration member 100 and the support member 300. The second vibration device 200' can be adjacent to or in contact with the rear surface of the first vibration device 200. The second vibration device 200' can include a frame 210, a magnet 220, a center pole 230, a bobbin 240, and a coil 250, etc.

[0218] The frame 210 is fixed to the support member 300 so as to overlap with the through holes 315, 335 (or the first holes) of the support member 300 and can support the magnet 220. The frame 210 can accommodate the magnet 220, the center pole 230, the bobbin 240, and the coil 250. The frame 210 can be made of a heat-conductive material. The frame 210 can include a first frame 211 that accommodates the magnet 220, the center pole 230, the bobbin 240, and the coil 250, and a second frame 212 protruding from the edge of the first frame 211. The first frame 211 and the second frame 212 can be integrally formed. The first frame 211 and the second frame 212 can be integrally formed of the same material having heat conductivity. For example, the first frame 211 and the second frame 212 can be made of a substance such as iron (Fe), but the embodiments of this specification are not limited thereto. The first frame 211 and the second frame 212 can be expressed in other terms such as yoke, but are not limited to this term.

[0219] According to other embodiments of this specification, the first frame 211 can further include a plurality of through holes 215 (or the second holes).

[0220] The plurality of through holes 215 (or second holes) can provide a path through which the interior of the first frame 211 in which the bobbin 240 and the coil 250 are accommodated can be connected to or communicate with the exterior. For example, the plurality of through holes 215 can be formed to penetrate or vertically penetrate the first frame 211. The plurality of through holes 215 (or second holes) can be configured at a portion overlapping the through holes 315, 335 (or first holes) of the support member 300. For example, the plurality of through holes 215 can be formed to penetrate or vertically penetrate the first frame 211 that overlaps the through holes 315, 335 of the support member 300. Accordingly, the gap space GS (or internal space) between the vibration member 100 and the support member 300 or the interior of the first frame 211 can communicate with the exterior through the through holes 315, 335 of the support member 300 and the plurality of through holes 215. For example, the plurality of through holes 215 can connect or communicate the gap space GS between the vibration member 100 and the support member 300 to the exterior through the through holes 315, 335 of the support member 300. The plurality of through holes 215 can be configured in any one of a circular shape, an elliptical shape, and a slit shape, but the embodiments of the present specification are not limited thereto.

[0221] A plurality of through holes 215 (or second holes) may be configured to discharge heat generated by the bobbin 240 and the coil 250 housed in the first frame 211 to the outside. The plurality of through holes 215 may be formed in a portion overlapping the bobbin 240 and the coil 250 housed in the first frame 211. For example, the plurality of through holes 215 may be formed to penetrate or vertically penetrate the first frame 211 overlapping the bobbin 240 and the coil 250. The plurality of through holes 215 may be configured to have a certain interval from each other. For example, the plurality of through holes 215 may be configured to have a certain interval along the circumferential direction of the bobbin 240 and the coil 250 housed in the first frame 211. The center portion of each of the plurality of through holes 215 may overlap the bobbin 240 and the coil 250. The size (or diameter) of each of the plurality of through holes 215 may be the same as or larger than the thickness of the bobbin 240 and the coil 250. However, the embodiments of the present specification are not limited by the shape and arrangement of the plurality of through holes 215.

[0222] The magnet 220 may be disposed on the frame 210. For example, the magnet 220 may be disposed on the first frame 211 of the frame 210. The lower end of the magnet 220 may be supported by the first frame 211, and the periphery of the magnet 220 may be surrounded. The magnet 220 may be disposed at the inner center of the first frame 211, and a plurality of through holes 215 separated from the magnet 220 may be formed. The plurality of through holes 215 may be formed to be separated at regular intervals along the periphery of the magnet 220. The plurality of through holes 215 may be formed so as not to overlap the magnet 220.

[0223] The device according to another embodiment of the present specification may further include a control board 501 for controlling the first vibration device 200 and the second vibration device 200'.

[0224] The control board 501 may include an acoustic processing circuit that generates a vibration drive signal (or vibration signal or acoustic signal or voice signal) for controlling the drive or vibration drive of the first vibration device 200 and the second vibration device 200'.

[0225] The control board 501 can be embodied by a printed circuit board on which an acoustic processing circuit is implemented. The control board 501 can be disposed on the rear surface of the support member 300. For example, the control board 501 can be attached to the rear surface of the support member 300.

[0226] According to other embodiments of the present specification, the control board 501 can be connected to the first vibration device 200 and the second vibration device 200' via other signal paths. The control board 501 can be configured to apply different vibration drive signals to the first vibration device 200 and the second vibration device 200' via different signal paths so that the first vibration device 200 and the second vibration device 200' are individually driven or vibrated.

[0227] The control board 501 can include a signal connector 510 that applies a vibration drive signal to the first vibration device 200 and the second vibration device 200'.

[0228] The control board 501 can be electrically connected to the first vibration device 200 and the second vibration device 200' via a signal connection member 207 connected to the signal connector 510. For example, the signal connection member 207 can include at least one of a signal cable, a probe pin, and a pogo pin.

[0229] According to another embodiment of the present specification, the support member 300 may include a first contact hole 340 through which a signal connection member 207 that connects between the first vibration device 200 and the signal connector 510 of the control board 501 passes, as shown in FIG. 12. For example, the first contact hole 340 may be drilled in a set partial area of the support member 300 along the thickness direction Z of the support member 300 so that the signal connection member 207 passes between the outside and the inside of the support member 300. The first contact hole 340 may be formed in the support member 300 that does not overlap with the second vibration device 200'. The first vibration device 200 may be electrically connected to the signal connector 510 of the control board 501 via the signal connection member 207 passing through the first contact hole 340 of the support member 300. For example, the signal connection member 207 may have the same or a similar configuration as the signal cable 207 described with reference to FIG. 3. One end (or one side) of the signal connection member 207 may be connected to the first vibration device 200, and the other end (or the other side) of the signal connection member 207 may be connected to the signal connector 510 of the control board 501. For example, the signal connection member 207 may be connected to each of the first and second power supply lines PL1, PL2 of the first vibration device 200 or the first electrode layer 201b and the second electrode layer 201c.

[0230] As shown in FIG. 12, the signal connection member 207 may be inserted into or accommodated in the first vibration device 200 and connected to each of the first and second power supply lines PL1, PL2 of the first vibration device 200. The signal connection member 207 may be disposed between the first and second power supply lines PL1, PL2 of the first vibration device 200. For example, one surface (or the upper surface) of the signal connection member 207 may contact the first power supply line PL1 connected to the first electrode layer 201b, and the other surface (or the lower surface) of the signal connection member 207 may contact the second power supply line PL2 connected to the second electrode layer 201c.

[0231] FIG. 13 and FIG. 14 are diagrams showing other embodiments of the vibration device shown in FIG. 12. FIGS. 13 and 14 show a modified configuration of the control board and the signal connection member shown in FIG. 12. Therefore, redundant descriptions of the same configurations except for the modified configurations of the control board and the signal connection member and related configurations are omitted or briefly described.

[0232] Referring to FIG. 13, in the vibration devices 200, 200' according to other embodiments of the present specification, a control board 501 for controlling the first vibration device 200 and the second vibration device 200' can be arranged behind the second vibration device 200'. And it can further include a signal connector 510 of the control board 501 and a signal connection member 520 connected to the first vibration device 200.

[0233] According to other embodiments of the present specification, the control board 501 can be connected to the first vibration device 200 and the second vibration device 200' via the same signal path. By applying the same vibration drive signal to the first vibration device 200 and the second vibration device 200' via the same signal path, the first vibration device 200 and the second vibration device 200' can be configured to be driven simultaneously or vibrated.

[0234] The control board 501 can include a signal connector 510 for applying a vibration drive signal to the first vibration device 200 and the second vibration device 200'. The signal connector 510 can be commonly connected to the first vibration device 200 and the second vibration device 200'.

[0235] According to another embodiment of the present specification, the support member 300 may include a first contact hole 340 through which a signal connection member 520 connecting between the first vibration device 200 and the signal connector 510 of the control board 501 passes, as shown in FIG. 13. The second vibration device 200' may include a second contact hole 217 that overlaps with the first contact hole 340 of the support member 300. The first vibration device 200 may be electrically connected to the signal connector 510 of the control board 501 via a signal connection member 520 that passes through the first contact hole 340 of the support member 300 and the second contact hole 217 of the second vibration device 200'. That is, the signal connection member 520 may include a part disposed in the first contact hole 340 and another part disposed in the second contact hole 217.

[0236] The signal connection member 520 may include a main body portion 521 and a contact portion 522. The main body portion 521 of the signal connection member 520 may be connected to the signal connector 510, and the contact portion 522 of the signal connection member 520 may be connected to the first vibration device 200. For example, the signal connection member 520 may be composed of probe pins. For example, the first vibration device 200 may include signal contact pads 208 connected to the first and second power supply lines PL1, PL2 or the first electrode layer 201b and the second electrode layer 201c, respectively. And the signal connection member 520 may be connected to the signal contact pads 208 of the first vibration device 200.

[0237] As shown in FIG. 13, the signal contact pads 208 may be inserted or accommodated in the first vibration device 200 and may be connected to the first and second power supply lines PL1, PL2 of the first vibration device 200, respectively. The signal contact pads 208 may be disposed between the first and second power supply lines PL1, PL2 of the first vibration device 200. For example, one surface (or upper surface) of the signal contact pad 208 may contact the first power supply line PL1 connected to the first electrode layer 201b, and the other surface (or lower surface) of the signal contact pad 208 may contact the second power supply line PL2 connected to the second electrode layer 201c.

[0238] As shown in FIG. 13, the contact portion 522 of the signal connection member 520 can include a first contact portion 522a and a second contact portion 522b. The signal connection member 520 can be in contact with and electrically connected to the signal contact pad 208 connected to the first vibration device 200. For example, the first contact portion 522a can contact one surface (or the upper surface) of the signal contact pad 208 connected to the first electrode layer 201b, and the second contact portion 522b can contact the other surface (or the lower surface) of the signal contact pad 208 connected to the second electrode layer 201c.

[0239] Referring to FIG. 14, in the vibration devices 200 and 200' according to other embodiments of the present specification, a control board 501 for controlling the first vibration device 200 and the second vibration device 200' can be disposed on the rear surface of the second vibration device 200'. And it can further include a signal connector 510 of the control board 501 and a signal connection member 520 connected to the first vibration device 200.

[0240] According to other embodiments of the present specification, the control board 501 can be connected to the first vibration device 200 and the second vibration device 200' through the same signal path. The control board 501 can include a signal connector 510 for applying a vibration drive signal to the first vibration device 200 and the second vibration device 200'. The signal connector 510 can be commonly connected to the first vibration device 200 and the second vibration device 200'. The control board 501 can be electrically connected to the first vibration device 200 and the second vibration device 200' through a signal connection member 520 connected to the signal connector 510. For example, the signal connection member 520 can include at least one of a signal cable, a probe pin, and a pogo pin.

[0241] According to another embodiment of the present specification, the support member 300 may include a first contact hole 340 through which a signal connection member 520 that connects between the first vibration device 200 and the signal connector 510 of the control board 501 passes, as shown in FIG. 14. And the second vibration device 200' may include a second contact hole 217 that overlaps with the first contact hole 340 of the support member 300. The first contact hole 340 of the support member 300 and the second contact hole 217 of the second vibration device 200' may be configured to overlap at least a part of the first vibration device 200. The first vibration device 200 may be electrically connected to the signal connector 510 of the control board 501 via the signal connection member 520 that passes through the first contact hole 340 of the support member 300 and the second contact hole 217 of the second vibration device 200'. That is, the signal connection member 520 may include a part disposed in the first contact hole 340 and another part disposed in the second contact hole 217.

[0242] The signal connection member 520 may include a main body portion 521, a contact portion 522, and an elastic portion 523. For example, the elastic portion 523 may be accommodated inside the main body portion 521, and the contact portion 522 may be disposed at one end of the elastic portion 523. The contact portion 522 of the signal connection member 520 may be configured to float to a certain extent by the extension and / or contraction of the elastic portion 523. The main body portion 521 of the signal connection member 520 may be connected to the signal connector 510, and the contact portion 522 of the signal connection member 520 that can float to a certain extent by the elastic portion 523 may be connected to the first vibration device 200. For example, the signal connection member 520 may be composed of a pogo pin. For example, the signal connection member 520 can directly contact each of the first and second power supply lines PL1, PL2 or the first electrode layer 201b and the second electrode layer 201c of the first vibration device 200 of the first vibration device 200.

[0243] As shown in FIG. 14, the first vibration device 200 can be configured such that a part of the first and second power supply lines PL1 and PL2 of the first vibration device 200 is exposed to the outside. The signal connection member 520 can be connected to each of the first and second power supply lines PL1 and PL2 via the exposed portions of the first and second power supply lines PL1 and PL2. For example, the first vibration device 200 can be configured such that a part of the lower surface of the first and second power supply lines PL1 and PL2 is exposed.

[0244] As shown in FIG. 14, the contact portion 522 of the signal connection member 520 can include a first contact portion 522a and a second contact portion 522b. The signal connection member 520 can come into contact with and be electrically connected to each of the first and second power supply lines PL1 and PL2 that are partially exposed from the first vibration device 200. For example, the first contact portion 522a can contact the exposed lower surface of the first power supply line PL1 connected to the first electrode layer 201b, and the second contact portion 522b can contact the exposed lower surface of the second power supply line PL2 connected to the second electrode layer 201c.

[0245] The device according to the embodiments of the present specification can be applied to a vibration generating device and / or an acoustic generating device. The device according to the embodiments of the present specification can be applied to mobile devices, video phones, smart watches, watch phones, wearable apparatuses, foldable apparatuses, rollable apparatuses, bendable apparatuses, flexible apparatuses, curved apparatuses, sliding apparatuses, variable apparatuses, electronic notebooks, e-books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop personal computers (PCs), laptop PCs, netbook computers, workstations, navigation devices, vehicle navigation devices, vehicle display devices, vehicle apparatuses, theater apparatuses, theater display devices, televisions, wallpaper devices, signage devices, game devices, notebook PCs, monitors, cameras, camcorders, and home appliances, etc.

[0246] The device according to the embodiments of the present specification can be described as follows.

[0247] The device according to some embodiments of the present specification can include a vibration member, a support member provided on the rear surface of the vibration member, a first vibration device connected to the rear surface of the vibration member, and a second vibration device provided between the vibration member and the support member and overlapping the first vibration device.

[0248] The device according to some embodiments of the present specification includes a vibrating member, a support member behind the vibrating member, a first vibration device connected to the rear surface of the vibrating member and located between the vibrating member and the support member, and a second vibration device located between the first vibration device and the support member and overlapping the first vibration device. The first vibration device is vibrated so that the vibrating member vibrates, and the second vibration device can be vibrated so that the vibrating member vibrates.

[0249] According to some embodiments of the present specification, the first vibration device may be configured to output sound in a first sound range band, and the second vibration device may be configured to output sound in a second sound range band different from the first sound range band.

[0250] According to some embodiments of the present specification, the first sound range band may include a high sound range band, and the second sound range band may include a low sound range band lower than the high sound range band.

[0251] According to some embodiments of the present specification, the first vibration device may be provided between the vibrating member and the second vibration device.

[0252] According to some embodiments of the present specification, the first vibration device may be in contact with the rear surface of the vibrating member.

[0253] According to some embodiments of the present specification, it may further include a connecting member provided between the vibrating member and the first vibration device. The connecting member can connect the vibrating member and the first vibration device together.

[0254] According to some embodiments of the present specification, the second vibration device may be spaced apart from the rear surface of the vibrating member.

[0255] According to some embodiments of the present specification, the second vibration device may be in contact with the rear surface of the first vibration device.

[0256] According to some embodiments of the present specification, it may further include a control board for controlling the vibrations of the first vibration device and the second vibration device.

[0257] According to some embodiments of the present specification, the first vibration device can be connected to the control board via a signal path different from that of the second vibration device. For example, the first vibration device is connected to the control board via a first signal path, and the second vibration device can be connected to the control board via a second signal path different from the first signal path.

[0258] According to some embodiments of the present specification, the first vibration device is connected to the control board via a first signal path, and the second vibration device can be connected to the control board via the same signal path as the first vibration device.

[0259] According to some embodiments of the present specification, the device further includes a signal connection member. The support member includes at least one first contact hole, and the signal connection member can include a portion disposed in at least one first contact hole and connecting the control board and the first vibration device.

[0260] According to some embodiments of the present specification, the control board is provided on the rear surface of the support member, and the first vibration device can be connected to the control board via a signal connection member having the portion disposed in at least one first contact hole.

[0261] According to some embodiments of the present specification, at least one first contact hole of the support member may not overlap with the second vibration device.

[0262] According to some embodiments of the present specification, the control board is provided on the rear surface of the second vibration device, and the second vibration device can include at least one second contact hole overlapping with at least one first contact hole.

[0263] According to some embodiments of the present specification, the first vibration device can be connected to the control board via a signal connection member having the portion disposed in at least one first contact hole and another portion disposed in at least one second contact hole.

[0264] According to some embodiments of the present specification, the control board may further include a signal connector configured to apply a vibration signal to the first vibration device and the second vibration device.

[0265] According to some embodiments of the present specification, the signal connector may be connected to the first vibration device and the second vibration device. For example, the signal connector may be commonly connected to the first vibration device and the second vibration device.

[0266] According to some embodiments of the present specification, the signal connection member may include at least one of a signal cable, a probe pin, and a pogo pin.

[0267] According to some embodiments of the present specification, the first vibration device includes a vibration layer, a first electrode layer provided on a first surface of the vibration layer, and a second electrode layer provided on a second surface opposite to the first surface of the vibration layer, and the vibration layer may be between the first electrode layer and the second electrode layer.

[0268] According to some embodiments of the present specification, the vibration layer may include a plurality of inorganic material portions having piezoelectric properties and an organic material portion provided between the plurality of inorganic material portions.

[0269] According to some embodiments of the present specification, the vibration layer may include a piezoelectric material.

[0270] According to some embodiments of the present specification, it may further include a control board configured to control the first vibration device and the second vibration device, and a signal connection member connected between the first vibration device and the control board. For example, the first vibration device may be electrically connected to the signal connection member connected to the control board.

[0271] According to some embodiments of the present specification, the signal connection member may directly contact the first electrode layer and the second electrode layer.

[0272] According to some embodiments of the present specification, the first vibration device further includes a signal contact pad connected to the first electrode layer and the second electrode layer, and the signal connection member can contact the signal contact pad.

[0273] According to some embodiments of the present specification, the support member includes at least one first hole that overlaps with the first vibration device, and the second vibration device is accommodated in at least one first hole of the support member and can be connected to the support member.

[0274] According to some embodiments of the present specification, the second vibration device can include a frame connected to the support member, a magnet provided on the frame, a bobbin provided around the magnet, and a coil wound around the bobbin. For example, the coil can be wound around the bobbin 240.

[0275] According to some embodiments of the present specification, the frame includes a first frame and a second frame that protrudes from the edge of the first frame and is connected to the support member, and the magnet, bobbin, and coil can be on the first frame. For example, the first frame can accommodate the magnet, bobbin, and coil.

[0276] According to some embodiments of the present specification, the second vibration device can further include a frame cover that covers the rear surface of the first frame and the rear surface of the second frame.

[0277] According to some embodiments of the present specification, it can further include a heat dissipation member provided between the frame cover and the rear surface of the first frame.

[0278] According to some embodiments of the present specification, the second vibration device can further include a plurality of second holes that overlap with at least one first hole.

[0279] According to some embodiments of the present specification, the plurality of second holes are in the first frame and can overlap with the bobbin and the coil.

[0280] According to some embodiments of the present specification, the apparatus further includes a control board having a signal connector, the signal connector applies a vibration signal generated by the control board to the first vibration device and the second vibration device, and the second vibration device can be electrically connected to the signal connector.

[0281] According to some embodiments of the present specification, the control board is provided on the rear surface of the second frame, the support member includes at least one first contact hole that overlaps with the signal connector, and the second frame can include at least one second contact hole that overlaps with the at least one first contact hole.

[0282] According to some embodiments of the present specification, the first vibration device can be electrically connected to the signal connector via a signal connection member having a portion disposed in at least one first contact hole and another portion disposed in at least one second contact hole.

[0283] According to some embodiments of the present specification, the vibrating member can include one or more materials among metal, plastic, fiber, leather, wood, fabric, rubber, carbon, glass, and paper.

[0284] The apparatus according to some embodiments of the present specification includes a display panel including a front surface and a rear surface opposite to the front surface, a first type of vibration device disposed behind the display panel and configured to vibrate, and a second type of vibration device that overlaps with the first type of vibration device and is different from the first type of vibration device configured to vibrate. The first type of vibration device is between the display panel and the second type of vibration device, and the display panel can be configured to emit sound in response to the vibration of the first type of vibration device or the vibration of the second type of vibration device.

[0285] According to some embodiments of the present specification, the first type of vibration device includes a piezoelectric type vibration device, and the second type of vibration device can include a coil type vibration device.

[0286] According to some embodiments of the present specification, the display panel is configured to emit sound having a first pitch in response to the vibration of the first type of vibration device, and may be configured to emit sound having a second pitch different from the first pitch in response to the vibration of the second type of vibration device.

[0287] According to some embodiments of the present specification, the display device further includes a support member behind the display panel, the first type of vibration device is between the display panel and the support member, the support member includes at least one hole, and the second type of vibration device may be within at least one hole.

[0288] Although the embodiments of the present specification have been described in more detail based on the accompanying drawings above, the present specification is not necessarily limited to such embodiments, and various modifications can be made without departing from the technical idea of the present specification. Therefore, the embodiments disclosed in the present specification are for the purpose of explanation rather than for limiting the technical idea of the present specification, and the scope of the technical idea of the present specification is not limited by such embodiments. Therefore, it should be understood that the above-described embodiments are exemplary in all aspects and not restrictive. The protection scope of the present specification must be interpreted according to the scope of the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present specification.

Description of Reference Numerals

[0289] 100 Vibration member 200, 200 Vibration device 300 Support member 207, 520 Signal connection member 501 Control board 510 Signal connector

Claims

1. A vibrating member, a support member provided on the rear surface of the vibrating member and including at least one first contact hole, a first vibration device connected to the rear surface of the vibrating member, a second vibration device provided between the vibrating member and the support member, overlapping the first vibration device, and including at least one second contact hole overlapping the at least one first contact hole, a control board provided on the rear surface of the second vibration device for controlling the vibrations of the first vibration device and the second vibration device, and a signal connection member including a part disposed in the at least one first contact hole and another part disposed in the at least one second contact hole, wherein the first vibration device is connected to the control board via the signal connection member passing through the at least one first contact hole and the at least one second contact hole.

2. The first vibration device is configured to output sound in a first sound range band, and the second vibration device is configured to output sound in a second sound range band different from the first sound range band. The device according to claim 1.

3. The first sound range band includes a high sound range band, and the second sound range band includes a low sound range band lower than the high sound range band. The device according to claim 2.

4. The first vibration device is provided between the vibrating member and the second vibration device. The device according to claim 1.

5. The first vibration device is in contact with the rear surface of the vibrating member. The device according to claim 1.

6. The device according to claim 1, further including a connection member provided between the vibrating member and the first vibration device.

7. The second vibration device is separated from the rear surface of the vibrating member. The device according to claim 1.

8. The second vibration device is in contact with the rear surface of the first vibration device. The device according to claim 1.

9. The first vibration device is connected to the control board via a first signal path, and the second vibration device is connected to the control board via a signal path different from the first signal path. The device according to claim 1.

10. The first vibration device is connected to the control board, and the second vibration device is connected to the control board via the same signal path as the first vibration device. The device according to claim 1.

11. The device according to claim 1, wherein the control board further includes a signal connector configured to apply a vibration signal to the first vibration device and the second vibration device.

12. The device according to claim 11, wherein the signal connector is connected to the first vibration device and the second vibration device.

13. The device according to claim 1, wherein the signal connection member includes at least one of a signal cable, a probe pin, and a pogo pin.

14. The first vibration device includes a vibration layer, a first electrode layer provided on a first surface of the vibration layer, and a second electrode layer provided on a second surface opposite to the first surface of the vibration layer, wherein the vibration layer is between the first electrode layer and the second electrode layer. The device according to claim 1.

15. The vibration layer includes a plurality of inorganic material portions having piezoelectric characteristics, and an organic material portion provided between the plurality of inorganic material portions. The device according to claim 14.

16. The device according to claim 14, wherein the vibration layer includes a piezoelectric material.

17. The device according to claim 14, wherein the signal connection member is in direct contact with the first electrode layer and the second electrode layer.

18. The first vibration device further includes a signal contact pad connected to the first electrode layer and the second electrode layer, and the signal connection member is in contact with the signal contact pad. The device according to claim 14.

19. The support member includes at least one first hole that overlaps with the first vibration device, and the second vibration device is housed in the at least one first hole of the support member and is connected to the support member. The device according to claim 1.

20. The second vibration device includes a frame connected to the support member, a magnet provided on the frame, a bobbin provided around the magnet, and a coil wound around the bobbin. The device according to claim 19.

21. The frame includes a first frame, and a second frame that protrudes from an edge of the first frame and is fixed to the support member. The magnet, the bobbin, and the coil are on the first frame. The device according to claim 20.

22. The device according to claim 21, wherein the second vibration device further includes a frame cover that covers a rear surface of the first frame and a rear surface of the second frame.

23. The apparatus according to claim 22, further comprising a heat dissipation member provided between the frame cover and the rear surface of the first frame.

24. The apparatus according to claim 21, wherein the second vibration device further includes a plurality of second holes that overlap the at least one first hole.

25. The apparatus according to claim 24, wherein the plurality of second holes are in the first frame and overlap the bobbin and the coil.

26. The control board further includes a signal connector, The signal connector applies a vibration signal generated by the control board to the first vibration device and the second vibration device, The apparatus according to claim 21, wherein the second vibration device is electrically connected to the signal connector.

27. The control board is provided on the rear surface of the second frame, The at least one first contact hole overlaps the signal connector, The apparatus according to claim 26, wherein the at least one second contact hole overlaps the at least one first contact hole.

28. The apparatus according to claim 27, wherein the first vibration device is electrically connected to the signal connector via the signal connection member.

29. The vibration member includes one or more materials selected from the group consisting of metal, plastic, fiber, leather, wood, fabric, rubber, carbon, glass, and paper, according to any one of claims 1 to 28.

30. A display panel including a front surface and a rear surface facing the front surface, A first type of vibration device that is behind the display panel and is configured to vibrate, A second type of vibration device that overlaps the first type of vibration device and is different from the first type of vibration device, wherein the first type of vibration device is between the display panel and the second type of vibration device, A support member that is behind the display panel, wherein the first type of vibration device is between the display panel and the support member, and the support member includes at least one first contact hole, A control board provided on the rear surface of the second type of vibration device for controlling the vibration of the first type of vibration device and the vibration of the second type of vibration device, The display panel is configured to emit sound in response to the vibration of the first type of vibration device or the vibration of the second type of vibration device. The second type of vibration device includes at least one second contact hole that overlaps with the at least one first contact hole. The display device, wherein the first type of vibration device is connected to the control board via a signal connection member having a part disposed in the at least one first contact hole and another part disposed in the at least one second contact hole.

31. The first type of vibration device includes a piezoelectric vibration device. The display device according to claim 30, wherein the second type of vibration device includes a coil vibration device.

32. The display device is configured to emit sound having a first pitch in response to the vibration of the first type of vibration device, and is configured to emit sound having a second pitch lower than the first pitch in response to the vibration of the second type of vibration device. The display device according to claim 30.

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