Cutting device

Abstract

To provide a processing device which can effectively utilize a time when the processing device is stopped.SOLUTION: A processing device 1 comprises: a holding table 10 having a holding surface 11 holding a processed material 200; a cutting unit 20 that processes the processed material 200 held by the holding table 10; a processing feeding unit 41 that relatively moves the holding table 10 to the cutting unit 20; an imaging unit 30 that images the processed material 200 held by the holding table 10; and a control unit 100. The control unit 100 includes: an abnormality detection part 101 that detects an abnormality of the processing device 1; a processing stop part 102 that stops a cutting processing by the cutting unit 20 when the abnormality is detected; and a data collection part 103 that collects data related to the processing device 1 during a standby time until an operation for recovering the abnormality from the stop of the processing is performed by an operator is performed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention processes a workpiece. cutting Regarding the device. [Background technology]

[0002] BACKGROUND ART In order to divide a wafer such as a semiconductor wafer into individual devices, various processing devices such as cutting devices have been used conventionally (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-4807 Summary of the Invention [Problem to be solved by the invention]

[0004] In the processing device described in Patent Document 1 and elsewhere, an alarm sounds to notify the operator when an error occurs that requires an operator to take action. However, in production sites, operators may be managing multiple processing devices, and may not be able to immediately perform operations to recover from the error and resume processing. In such cases, the processing device simply waits with processing stopped, leaving room for improvement in how to utilize the waiting time.

[0005] Therefore, an object of the present invention is to provide a method for effectively utilizing the time when the processing device is stopped. cutting The key is to provide the equipment. [Means for solving the problem]

[0006] In order to solve the above problems and achieve the object, the present invention cuttingThe apparatus includes a holding table having a holding surface for holding a workpiece, a processing unit for processing the workpiece held on the holding table, a processing feed unit for moving the holding table relatively to the processing unit, an imaging unit for imaging the workpiece held on the holding table, and a control unit. cutting 1. An apparatus, the control unit comprising: cutting An abnormality detection unit that detects an abnormality in the device, a processing stop unit that stops processing by the processing unit when an abnormality is detected, and a processing stop unit that stops the waiting time from when processing is stopped until an operator performs an operation to recover from the abnormality. cutting a data collection unit that collects data related to the device, and the type of data collected by the data collection unit is linked to the type of error detected by the abnormality detection unit. When the abnormality detection unit detects an abnormality, the data collection unit captures an image of the processed groove on the upstream side from the cutting point just before the processing is stopped using the imaging unit, and collects the image of the processed groove as image data. It is characterized by:

[0007] The aforementioned cutting In the apparatus, the control unit may include a data analysis section that analyzes the data collected by the data collection section.

[0009] The aforementioned cutting In the device, cutting The apparatus may have a plurality of transport units for transporting workpieces therein, and the abnormality detection section may detect an abnormality in transport by the transport units.

[0010] The aforementioned cutting In the apparatus, the data collection section may drive the imaging unit to capture images of the processed groove in a plurality of regions and collect a plurality of images of the processed groove as the data.

[0011] The cutting of the present invention Device is a cutting device comprising a holding table having a holding surface for holding a workpiece, a processing unit for processing the workpiece held on the holding table, a processing feed unit for moving the holding table relatively to the processing unit, an imaging unit for imaging the workpiece held on the holding table, and a control unit, wherein the control unit has an abnormality detection section for detecting an abnormality in the cutting device, a processing stop section for stopping processing by the processing unit when an abnormality is detected, and a data collection section for collecting data related to the cutting device during a waiting time from when processing is stopped until an operator performs an operation to recover from the abnormality, and the type of data collected by the data collection section is linked to the type of error detected by the abnormality detection section, The machining unit has a cutting blade fixed to the tip of the spindle for forming a groove in the workpiece, and a motor for rotating the spindle. cutting The apparatus further includes a diameter detection unit for detecting a diameter of the cutting blade, and the data collection unit detects the diameter of the cutting blade using the diameter detection unit. It is characterized by: [Effects of the Invention]

[0012] The present invention has the effect of making effective use of the time when the processing device is stopped. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device according to the first embodiment. [Figure 2] FIG. 2 is a side view, partly in section, schematically showing the configuration of a cutting unit and a holding table of the processing apparatus shown in FIG. [Figure 3] FIG. 3 is a perspective view of a main part of the cutting unit shown in FIG. [Figure 4] FIG. 4 is a front view schematically showing the configuration of a diameter detection unit of the processing apparatus shown in FIG. [Figure 5] FIG. 5 is a plan view schematically showing a workpiece being cut by the processing device shown in FIG. [Figure 6] FIG. 6 is a diagram showing an example of an image acquired by capturing an image of a part of a workpiece when checking a kerf during cutting processing by the processing apparatus shown in FIG. [Figure 7] FIG. 7 is a plan view showing an example of a wafer position at which image data, which is data collected by the data collecting unit of the processing apparatus shown in FIG. 1, is acquired. [Figure 8] FIG. 8 is a plan view showing another example of the wafer position at which image data, which is data collected by the data collecting unit of the processing apparatus shown in FIG. 1, is acquired. [Figure 9] FIG. 9 is a diagram showing an example of a display screen displayed on the display unit when the abnormality detection section of the control unit of the processing apparatus shown in FIG. 1 detects a chipping size error. [Figure 10] FIG. 10 is a diagram showing an example of the display screen when the recovery area or the data display area of the display screen shown in FIG. 9 is operated while the data collecting unit is acquiring image data. [Figure 11]FIG. 11 is a diagram showing an example of the display screen when the data display area of the display screen shown in FIG. 9 is operated after the data acquisition unit acquires image data. [Figure 12] FIG. 12 is a perspective view showing a configuration example of a processing device according to a modified example of the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0015] [Embodiment 1] A processing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing an example of the configuration of the processing apparatus according to the first embodiment. Fig. 2 is a side view, partially in cross section, showing the configuration of the cutting unit and holding table of the processing apparatus shown in Fig. 1. Fig. 3 is a perspective view of the main part of the cutting unit shown in Fig. 2. Fig. 4 is a front view showing the configuration of the diameter detection unit of the processing apparatus shown in Fig. 1.

[0016] (Workpiece) The processing apparatus 1 shown in Fig. 1 according to the first embodiment is a cutting apparatus that cuts (corresponding to processing) a workpiece 200. The workpiece 200 to be processed by the processing apparatus 1 shown in Fig. 1 is a disk-shaped semiconductor wafer or an optical device wafer having a substrate made of silicon, gallium arsenide, SiC (silicon carbide), sapphire, or the like. The workpiece 200 has a plurality of division lines 202 formed in a grid pattern on its surface 201, and devices 203 are formed in each region defined by the plurality of division lines 202. The devices 203 are integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integration), or image sensors such as CCDs (Charge Coupled Devices) or CMOSs (Complementary Metal Oxide Semiconductors).

[0017] In the present invention, the workpiece 200 may be a so-called TAIKO (registered trademark) wafer, which is thinned in the center and has a thick portion formed on the periphery. In addition, in the present invention, the workpiece 200 is not limited to a wafer, and may be various plate-shaped workpieces such as a rectangular resin package substrate having a plurality of devices sealed with resin, a ceramic substrate, or a glass substrate.

[0018] In the first embodiment, the workpiece 200 has a back surface 204 behind a front surface 201 attached to an adhesive tape 206 having an annular frame 205 attached to its outer periphery, and is supported by the annular frame 205. The workpiece 200 according to the first embodiment is divided into individual chips 207 along planned division lines 202. Each chip 207 includes a portion of a substrate and a device 203 formed on the substrate.

[0019] (Processing equipment) The processing device 1 is a cutting device that holds a workpiece 200 on a holding table 10 and cuts it with a cutting blade 21 along a planned division line 202 to divide the workpiece 200 into individual chips 207. The processing device 1 includes the holding table 10 having a holding surface 11 that suction-holds the workpiece 200, a sub-chuck table 15, a cutting unit 20 that divides the workpiece 200 held on the holding table 10 along the planned division line 202 with the cutting blade 21 to form a plurality of chips 207, and an imaging unit 30 that images the workpiece 200 held on the holding table 10. Note that the sub-chuck table 15 is not essential.

[0020] 2, the processing apparatus 1 also includes a moving unit 40 that moves the holding table 10 and the spindle 23 of the cutting unit 20 relative to one another. The moving unit 40 includes at least a processing feed unit 41 that performs processing feed on the holding table 10 in the X-axis direction parallel to the horizontal direction, an indexing feed unit 42 that performs indexing feed on the cutting unit 20 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction, a cutting feed unit 43 that performs cutting feed on the cutting unit 20 in the Z-axis direction parallel to the vertical direction and perpendicular to both the X-axis and Y-axis directions, and a rotational movement unit 44 that rotates the holding table 10 around an axis parallel to the Z-axis direction.

[0021] The processing feed unit 41 moves the holding table 10 along the X-axis direction, which is the processing feed direction, by moving the holding table 10 along the X-axis direction relative to the cutting unit 20. The indexing feed unit 42 moves the cutting unit 20 along the Y-axis direction, which is the indexing feed direction, by moving the cutting unit 20 and the holding table 10 along the Y-axis direction relative to each other. The cutting feed unit 43 moves the cutting unit 20 along the Z-axis direction, which is the cutting feed direction, by moving the cutting unit 20 and the holding table 10 along the Z-axis direction relative to each other. The rotational movement unit 44 is supported by the processing feed unit 41, supports the holding table 10, and is disposed so as to be movable together with the holding table 10 in the X-axis direction.

[0022] The processing feed unit 41, the indexing feed unit 42 and the cutting feed unit 43 are each equipped with a well-known ball screw that is rotatable around its axis, a well-known motor that rotates the ball screw around its axis, and a well-known guide rail that supports the holding table 10 or the cutting unit 20 so that it can move freely in the X-axis, Y-axis or Z-axis direction.

[0023] The holding table 10 is disk-shaped, and its holding surface 11 for holding the workpiece 200 is made of porous ceramic or the like. The holding table 10 is movable between a processing area below the cutting unit 20 and a carry-in / out area spaced from below the cutting unit 20 for carrying in and out the workpiece 200 by a processing feed unit 41, thereby allowing it to move in the X-axis direction. The holding table 10 is rotatable about an axis parallel to the Z-axis direction by a rotational movement unit 44. The holding table 10 is connected to a vacuum suction source (not shown) and sucks and holds the workpiece 200 placed on the holding surface 11 by being sucked by the vacuum suction source. In the first embodiment, the holding table 10 sucks and holds the back surface 204 of the workpiece 200 via adhesive tape 206. As shown in FIG. 1 , a plurality of clamps 12 for clamping an annular frame 205 are provided around the periphery of the holding table 10.

[0024] The cutting unit 20 is a processing unit in which a cutting blade 21 is attached to a spindle 23 and cuts a workpiece 200 held on the holding table 10. The cutting unit 20 is provided so as to be movable in the Y-axis direction by an indexing feed unit 42 relative to the workpiece 200 held on the holding table 10, and is provided so as to be movable in the Z-axis direction by a cutting feed unit 43. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by the indexing feed unit 42 and the cutting feed unit 43.

[0025] As shown in Figure 2, the cutting unit 20 comprises a cutting blade 21, a spindle housing 22 that is movable in the Y-axis and Z-axis directions by an indexing feed unit 42 and a cutting feed unit 43, a spindle 23 that is rotatably mounted on the spindle housing 22 around its axis and has the cutting blade 21 attached to its tip, a spindle motor 24 that rotates the spindle 23 around its axis, a blade cover 25 shown in Figure 3 that is attached to the tip surface of the spindle 23, and a nozzle 26 shown in Figure 3 that supplies cutting water, which is a fluid, to the cutting blade 21.

[0026] The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape. The cutting blade 21 is fixed to the tip of the spindle 23 and forms a cutting groove 208 (shown by a two-dot chain line in FIG. 5) in the workpiece 200. In the first embodiment, the cutting blade 21 is a so-called hub blade, as shown in FIG. 2, which includes an annular circular base 211 and an annular cutting edge 212 disposed on the outer periphery of the circular base 211 and cutting the workpiece 200. The cutting edge 212 is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and is formed to a predetermined thickness. The cutting edge 212 of the cutting blade 21 wears when cutting the workpiece 200. Note that in the present invention, the cutting blade 21 may be a so-called washer blade composed only of the cutting edge 212.

[0027] The cutting blade 21 is fixed to the tip of the spindle 23, and is rotated around its axis by the spindle motor 24, thereby rotating the cutting blade 21. The spindle motor 24 is provided with a rotor 241 that is attached to the spindle 23 and rotates integrally with the spindle 23, and a stator 242 that is disposed on the outer periphery of the rotor 241 and in the spindle housing 22, and rotates the rotor 241 when power is supplied from a power source 243. In the spindle motor 24, the stator 242 rotates the rotor 241, thereby rotating the spindle 23 around its axis.

[0028] The blade cover 25 covers at least the upper part of the cutting blade 21. The blade cover 25 is fixed to the tip surface of the spindle housing 22. As shown in FIG. 3, the nozzle 26 includes a shower nozzle 261 and a pair of blade nozzles 262. Cutting water is supplied to the nozzles 261, 262 from a fluid supply source 27. The shower nozzle 261 faces the cutting edge of the cutting blade 212 of the cutting blade 21 in the X-axis direction and supplies cutting water to the cutting edge of the cutting blade 212 of the cutting blade 21 during cutting. The blade nozzles 262 extend parallel to the X-axis direction and are spaced apart from each other in the Y-axis direction. The blade nozzles 262 position the lower ends of the cutting blades 212 of the cutting blades 21 between them and supply cutting water to the lower ends of the cutting blades 212 of the cutting blades 21 during cutting. The nozzle 26 supplies cutting water from the shower nozzle 261 and the blade nozzle 262, and thereby supplies cutting water via the cutting blade 21 to the processing point where the cutting blade 21 cuts the workpiece 200.

[0029] The axes of the cutting blade 21 and spindle 23 of the cutting unit 20 are set parallel to the Y-axis direction.

[0030] The sub-chuck table 15 is provided adjacent to the holding table 10 and is movable in the X-axis direction together with the holding table 10 by the processing feed unit 41. The dressing board 210 holds the dressing board 210 by suction on the holding surface. The dressing board 210 sharpens the cutting edge 212 of the cutting blade 21, which has become clogged or dulled and reduced in cutting ability due to cutting by the cutting edge 212 of the cutting blade 21, and removes cutting chips adhering to the cutting edge 212 of the cutting blade 21, thereby restoring the cutting ability of the cutting edge 212 of the cutting blade 21. The act of sharpening the cutting edge 212 of the cutting blade 21 by cutting the dressing board 210 with the cutting edge 212 of the cutting blade 21 and restoring the cutting ability of the cutting edge 212 of the cutting blade 21 is called "dressing." The dressing board 210 has abrasive grains fixed with a bond material, and in the first embodiment, is formed into a rectangular flat plate shape. If the sub-chuck table 15 is not provided, the dressing board 210 is held on the holding table 10 and the cutting edge 212 of the cutting blade 21 is sharpened.

[0031] The imaging unit 30 is disposed above the holding table 10, which moves between the loading / unloading area and the processing area. The imaging unit 30 includes an imaging element that images an area to be divided of the workpiece 200 held on the holding table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 images the workpiece 200 held on the holding table 10, acquires an image, and outputs the acquired image to the control unit 100.

[0032] The processing apparatus 1 also includes an X-axis position detection unit (not shown) for detecting the position of the holding table 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit may be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a reading head. The Z-axis position detection unit detects the position of the cutting unit 20 in the Z-axis direction using motor pulses. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding table 10 in the X-axis direction and the position of the axis of the spindle 23 and the cutting blade 21 of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100.

[0033] In the first embodiment, the positions of the holding table 10 and the cutting unit 20 of the processing device 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined based on a predetermined reference position (not shown). In the first embodiment, the positions of the holding table 10 and the cutting unit 20 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined by the distances from the reference position in the X-axis direction, the Y-axis direction, and the Z-axis direction. In the first embodiment, the reference position in the Z-axis direction is located on the same plane as the holding surface 11.

[0034] The processing device 1 also includes a cassette elevator 50 on which a cassette 51 containing a plurality of workpieces 200 before and after cutting is placed and which moves the cassette 51 in the Z-axis direction, a cleaning unit 60 which cleans the workpieces 200 after cutting, and a transport unit 70 which takes the workpieces 200 in and out of the cassette 51 and transports the workpieces 200 between the cassette 51, the holding table 10, and the cleaning unit 60.

[0035] The cleaning unit 60 includes a spinner table 62 that holds the workpiece 200 by suction on a holding surface 61 and rotates around an axis parallel to the Z-axis direction, and a cleaning water supply nozzle (not shown) that supplies cleaning water to the workpiece 200 that is held by suction on the spinner table 62 that rotates around the axis.

[0036] The transport unit 70 transports the workpiece 200 inside the processing apparatus 1 and includes a carry-in / out unit 71, a first transport unit 72, and a second transport unit 73. The carry-in / out unit 71 includes a pair of temporary placement rails 74 on which the workpiece 200 is temporarily placed, and an take-in / out unit 75 that carries the workpiece 200 before cutting out of the cassette 51 and temporarily places it on the pair of temporary placement rails 74, and carries the workpiece 200 after cutting that has been temporarily placed on the pair of temporary placement rails 74 into the cassette 51. The take-in / out unit 75 clamps the end of an annular frame 205 to which the workpiece 200 is attached, and moves the workpiece 200 in and out of the cassette 51.

[0037] The first transport unit 72 suction-holds the workpiece 200 temporarily placed on a pair of temporary placement rails 74 and transports it to the holding table 10 in the carry-in / out area. The first transport unit 72 also transports the cleaned workpiece 200 on the spinner table 62 onto the pair of temporary placement rails 74. The first transport unit 72 is connected to a vacuum suction source (not shown) and includes a suction holding section 76 that suction-holds the workpiece 200 temporarily placed on the pair of temporary placement rails 74 and the workpiece 200 on the spinner table 62 by being sucked by the vacuum suction source.

[0038] The second transport unit 73 transports the workpiece 200 after cutting on the holding table 10 in the carry-in / out area to the spinner table 62 of the cleaning unit 60. The second transport unit 73 is connected to a vacuum suction source (not shown) and includes a suction holding section 77 that is sucked by the vacuum suction source to hold the workpiece 200 on the holding surface 11 of the holding table 10 in the carry-in / out area by suction.

[0039] 2, the processing device 1 is also equipped with a current value detection sensor 80 that detects the current value of the power supplied to the stator 242 of the spindle motor 24 (hereinafter referred to as the load current value), and a damage detection sensor 81. The current value detection sensor 80 outputs the detected load current value to the control unit 100. The load current value is the value of the current flowing through the stator 242 of the spindle motor 24, and tends to increase when the cutting resistance increases when cutting the workpiece 200 due to an increase in the processing load caused by blunting of the cutting blade 212 during cutting, for example.

[0040] The breakage detection sensor 81 measures the state of breakage of the cutting edge of the cutting edge 212 of the cutting blade 21 during cutting. The breakage detection sensor 81 measures the state of breakage of the cutting edge, such as the occurrence of chipping, in which a portion is missing from the outer edge of the cutting edge 212 of the cutting blade 21.

[0041] As shown in Fig. 3, the breakage detection sensor 81 is provided on the blade cover 25. As shown in Fig. 2, the breakage detection sensor 81 includes a light-emitting unit 811 and a light-receiving unit 812 that are spaced apart from each other in the Y-axis direction of the blade cover 25 and position the upper end of the cutting edge 212 of the cutting blade 21 between them.

[0042] The light emitting unit 811 emits pulsed light from a light source (not shown) toward the light receiving unit 812. The light receiving unit 812 receives the pulsed light emitted from the light emitting unit 811 and outputs a detection result indicating the amount of the received pulsed light to the control unit 100.

[0043] When a chip occurs on the cutting edge of the cutting blade 212 of the cutting blade 21 during cutting, the amount of light received by the light-receiving unit 812 from the light-emitting unit 811 periodically increases compared to the amount of light before the chip occurred, because the cutting blade 21 rotates around its axis during cutting. Also, the amount of light received by the light-receiving unit 812 from the light-emitting unit 811 gradually increases as the cutting edge of the cutting edge 212 of the cutting blade 21 wears during cutting.

[0044] In this way, the breakage detection sensor 81 receives light whose intensity changes due to chipping and wear on the cutting edge of the cutting edge 212 of the cutting blade 21 using the light receiving unit 812, and outputs a detection result indicating the intensity of the received light to the control unit 100, thereby measuring the state of breakage, such as wear and chipping, on the cutting edge of the cutting edge 212 of the cutting blade 21 during cutting.

[0045] 3, the processing device 1 is also equipped with a cutting water flow rate detection sensor 82 and a cutting water temperature detection sensor 83. The cutting water flow rate detection sensor 82 detects the flow rate, which is the amount of cutting water supplied to the nozzles 261, 262. The cutting water flow rate detection sensor 82 outputs the detection result to the control unit 100. The cutting water temperature detection sensor 83 detects the temperature of cutting water supplied to the cutting edge 212 of the cutting blade 21 through the nozzles 261, 262. The cutting water temperature detection sensor 83 outputs the detection result to the control unit 100.

[0046] As shown in FIG. 1 , the processing device 1 also includes a diameter detection unit 84 that detects the diameter of the cutting edge 212 of the cutting blade 21. The diameter detection unit 84 is located adjacent to the holding table 10 and is movable in the X-axis direction together with the holding table 10 by the processing feed unit 41. The diameter detection unit 84 detects the positions of the spindle 23 and the axis of the cutting blade 21 in the Z-axis direction when the lower end of the cutting edge of the cutting edge 212 of the cutting blade 21 is positioned flush with the holding surface 11. The diameter detection unit 84 also detects the diameter of the cutting blade 21 by detecting the positions of the spindle 23 and the axis of the cutting blade 21 in the Z-axis direction when the lower end of the cutting edge of the cutting edge 212 of the cutting blade 21 is positioned flush with the holding surface 11. The cutting edge 212 wears as cutting progresses, but by detecting the diameter of the cutting blade 21 at any desired timing, the cutting depth of the cutting blade 21 into the workpiece 200 can be controlled taking into account the amount of wear of the cutting blade 21.

[0047] As shown in Figure 4, the diameter detection unit 84 comprises a unit body 843 having a pair of legs 841 spaced apart from each other in the Y-axis direction and between which the lower end of the cutting edge 212 of the cutting blade 21 can be inserted, and a connecting portion 842 connecting the lower ends of the pair of legs 841, a light-emitting portion 844 provided on one of the legs 841 of the unit body 843, and a light-receiving portion 845 provided on the other leg 841.

[0048] The light-emitting unit 844 emits pulsed light from a light source (not shown) toward the other leg 841, i.e., the light-receiving unit 845. The light-receiving unit 845 receives the pulsed light emitted from the light-emitting unit 844 and outputs a detection result indicating the amount of the received pulsed light to the control unit 100.

[0049] The amount of light received by the light-receiving unit 845 from the light-emitting unit 844 gradually decreases as the lower end of the cutting edge 212 of the cutting blade 21, which has entered between the pair of legs 841, descends. In this way, the diameter detection unit 84 receives light whose amount decreases as the light-receiving unit 845 descends of the cutting edge of the cutting blade 212 of the cutting blade 21, and outputs a detection result indicating the amount of received light to the control unit 100. The control unit 100 detects when the amount of light indicated by the detection result of the light-receiving unit 845 becomes the amount of light when the lower end of the cutting edge of the cutting blade 212 of the cutting blade 21 is positioned on the same plane as the holding surface 11, and detects the Z-axis positions of the axial center of the cutting blade 21 and the spindle 23 when the lower end of the cutting edge of the cutting edge 212 of the cutting blade 21 is positioned on the same plane as the holding surface 11 from the detection result of the Z-axis position detection unit.

[0050] The processing apparatus 1 also includes a detection sensor 85 that detects whether the loading / unloading unit 75 of the loading / unloading unit 71 of the transport unit 70 is clamping the annular frame 205, a detection sensor 86 that detects whether the first transport unit 72 of the transport unit 70 is holding the workpiece 200 by suction, and a detection sensor 87 that detects whether the second transport unit 73 of the transport unit 70 is holding the workpiece 200 by suction. The processing apparatus 1 also includes a detection sensor 88 that detects whether the holding table 10 is holding the workpiece 200 by suction, and a detection sensor 89 that detects whether the spinner table 62 of the cleaning unit 60 is holding the workpiece 200 by suction. These detection sensors 85, 86, 87, 88, and 89 output the detection results to the control unit 100.

[0051] Furthermore, when the detection sensor 85 detects that the loading / unloading unit 75 is not clamping the annular frame 205, when the detection sensor 86 detects that the first conveying unit 72 is not suction-holding the workpiece 200, and when the detection sensor 87 detects that the second conveying unit 73 is not suction-holding the workpiece 200, these indicate that the conveying unit 70 is not able to convey the workpiece 200, that is, that a conveying error has occurred, which is an abnormality in the conveying of the workpiece 200 by the conveying unit 70.

[0052] The detection sensors 86, 87 detect whether the transport units 72, 73 are holding the workpiece 200 by suction by the control unit 100 determining whether the detection results of the detection sensors 86, 87 are equal to or less than a predetermined pressure. If the control unit 100 determines that the detection results of the detection sensors 86, 87 are equal to or less than the predetermined pressure, it detects that the transport units 72, 73 are holding the workpiece 200 by suction, and if the control unit 100 determines that the detection results of the detection sensors 86, 87 exceed the predetermined pressure, it detects that the transport units 72, 73 are not holding the workpiece 200 by suction.

[0053] Furthermore, when the detection sensors 88, 89 detect that the holding table 10 and the spinner table 62 are not holding the workpiece 200 by suction, this indicates that the holding table 10 and the spinner table 62 are not holding the workpiece 200 in the correct state, i.e., that the holding table 10 and the spinner table 62 are experiencing a holding error, which is an abnormality in the holding of the workpiece 200.

[0054] The detection sensors 88, 89 detect whether the holding table 10 and spinner table 62 are holding the workpiece 200 by suction by the control unit 100 determining whether the detection results of the detection sensors 88, 89 are equal to or less than a predetermined pressure. If the control unit 100 determines that the detection results of the detection sensors 88, 89 are equal to or less than the predetermined pressure, it determines that the holding table 10 and spinner table 62 are holding the workpiece 200 by suction, and if the control unit 100 determines that the detection results of the detection sensors 88, 89 exceed the predetermined pressure, it determines that the holding table 10 and spinner table 62 are not holding the workpiece 200 by suction.

[0055] The control unit 100 controls each component of the processing device 1 and causes the processing device 1 to perform processing operations on the workpiece 200. The control unit 100 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device.

[0056] The control unit 100 is connected to a display unit 110 configured with a liquid crystal display device or the like that displays the status and images of the machining operation, an input unit 120 that the operator uses to register machining content information, and a notification unit 130 that notifies the operator. The input unit 120 is configured with a touch panel provided on the display unit 110. The notification unit 130 notifies the operator by emitting at least one of sound and light.

[0057] Furthermore, the control unit 100 detects the state of chipping and wear of the cutting edge of the cutting edge 212 of the cutting blade 21 based on the detection result from the light receiving unit 812 of the breakage detection sensor 81. Specifically, when the amount of received light indicated by the measurement result from the light receiving unit 812 of the breakage detection sensor 81 does not increase or decrease periodically but is equal to or greater than a predetermined value, the control unit 100 detects that the cutting edge 212 of the cutting blade 21 has worn too much and has reached its wear limit, making it unsuitable for cutting the workpiece 200.

[0058] Furthermore, when the amount of received light indicated by the measurement results from the light receiving section 812 of the breakage detection sensor 81 periodically increases and decreases, the control unit 100 detects that a portion has been chipped from the outer edge of the cutting edge 212 of the cutting blade 21, causing a chip (i.e., breakage) in the cutting edge 212. The control unit 100 calculates the increase in the amount of received light per unit time based on the measurement results from the light receiving section 812 of the breakage detection sensor 81. The control unit 100 detects the amount of wear per unit time of the cutting edge 212 of the cutting blade 21 based on the calculated increase in the amount of received light per unit time, and if the detected amount of wear is equal to or greater than a predetermined value, detects that the amount of wear per unit time of the cutting edge 212 of the cutting blade 21 is abnormal.

[0059] Furthermore, the control unit 100 detects the Z-axis direction positions of the spindle 23 and the axial center of the cutting blade 21 when the lower end of the cutting edge of the cutting blade 212 of the cutting blade 21 is located on the same plane as the holding surface 11 based on the detection result from the light receiving unit 845 of the diameter detection unit 84 and the detection result from the Z-axis direction position detection unit, and detects the diameter of the cutting blade 21. Specifically, the control unit 100 detects the detection result from the Z-axis direction position detection unit when the amount of light indicated by the detection result from the light receiving unit 845 becomes the amount of light when the lower end of the cutting edge of the cutting blade 212 of the cutting blade 21 is located on the same plane as the holding surface 11, as the Z-axis direction positions of the axial center of the cutting blade 21 and the spindle 23 when the lower end of the cutting edge of the cutting blade 212 of the cutting blade 21 is located on the same plane as the holding surface 11. Since the control unit 100 has a reference position in the Z-axis direction that is on the same plane as the holding surface 11, when the amount of light indicated by the detection result from the light receiving unit 845 becomes the amount of light when the lower end of the cutting edge of the cutting edge 212 of the cutting blade 21 is positioned on the same plane as the holding surface 11, the Z-axis direction position detection unit detects the detection result as the radius of the cutting blade 21 and detects the diameter of the cutting blade 21.

[0060] Next, the processing operation of the processing apparatus 1, which is performed by controlling each component of the processing apparatus 1 with the control unit 100, will be described. FIG. 5 is a plan view schematically showing a workpiece being cut by the processing apparatus shown in FIG. 1. FIG. 6 is a view showing an example of an image acquired by capturing an image of a portion of a workpiece during a kerf check during cutting by the processing apparatus shown in FIG. 1. FIG. 7 is a plan view showing an example of a wafer position at which image data, which is data collected by the data collection unit of the processing apparatus shown in FIG. 1, is acquired. FIG. 8 is a plan view showing another example of a wafer position at which image data, which is data collected by the data collection unit of the processing apparatus shown in FIG. 1, is acquired. FIG. 9 is a view showing an example of a display screen displayed on the display unit when the anomaly detection unit of the control unit of the processing apparatus shown in FIG. 1 detects a chipping size error. FIG. 10 is a view showing an example of a display screen when the recovery area or data display area of the display screen shown in FIG. 9 is operated while the data collection unit is acquiring image data. FIG. 11 is a view showing an example of a display screen when the data display area of the display screen shown in FIG. 9 is operated after the data collection unit has acquired image data.

[0061] The control unit 100 described above controls each component of the processing device 1 to perform a processing operation in which the workpiece 200 held by suction on the holding table 10 is cut by the cutting blade 21. Before the processing operation, the processing device 1 places the cassette 51 containing the workpiece 200 in the cassette elevator 50, and places the dressing board 210 on the holding surface 16 of the sub-chuck table 15. In addition, the control unit 100 sets processing conditions in the storage device, and starts the processing operation of the processing device 1 when it receives a command to start the processing operation from an operator or the like.

[0062] When the machining operation starts, the control unit 100 controls the transport unit 70 to take out one workpiece 200 from the cassette 51 and place it on the holding surface 11 of the holding table 10 in the carry-in / out area via the adhesive tape 206. During the machining operation, the control unit 100 suction-holds the workpiece 200 on the holding surface 11 via the adhesive tape 206, clamps the annular frame 205 with the clamp unit 12, rotates the spindle 23 about its axis, and supplies cutting water from the nozzles 261 and 262. The control unit 100 controls the moving unit 40 to move the holding table 10 from the carry-in / out area toward the machining area to below the imaging unit 30, and the imaging unit 30 captures an image of the workpiece 200 suction-held on the holding table 10. The control unit 100 acquires images for the imaging unit 30 to perform alignment for aligning the workpiece 200 and the cutting blade 21, and performs alignment based on the images captured by the imaging unit 30.

[0063] In the processing operation, the control unit 100 controls the moving unit 40 and the like based on the processing conditions to relatively move the cutting blade 21 and the workpiece 200 along the planned dividing lines 202, and causes the cutting blade 21 to cut into the planned dividing lines 202 of the workpiece 200 until it reaches the adhesive tape 206. The control unit 100 cuts the planned dividing lines 202 of the workpiece 200 in accordance with the processing conditions, forming cutting grooves 208 (shown by two-dot chain lines in FIG. 5 ) that penetrate the workpiece 200 at the planned dividing lines 202, and divides the workpiece 200 into individual chips 207. When all the planned dividing lines 202 of the workpiece 200 have been cut, the control unit 100 controls the moving unit 40 to move the holding table 10 from the processing area toward the loading / unloading area.

[0064] The control unit 100 controls the moving unit 40 and the like to stop the movement of the holding table 10 in the carry-in / out area, stops the suction holding of the workpiece 200 on the holding table 10, releases the clamping of the clamping section 12, and controls the transport unit 70 to transport the workpiece 200 from the holding table 10 to the spinner table 62 of the cleaning unit 60. The control unit 100 controls the cleaning unit 60 to clean the workpiece 200, and controls the transport unit 70 to move the cut workpiece 200 onto the temporary placement rail 74, and then loads it into the cassette 51. The control unit 100 finishes the processing operation when all of the workpieces 200 in the cassette 51 have been cut and divided into chips 207.

[0065] In this way, the control unit 100 controls each component of the processing device 1 to cut each planned dividing line 202 of the workpiece 200 with the cutting blade 21, thereby forming a processed groove 208 shown by a two-dot chain line in FIG. 5 on each planned dividing line 202. The control unit 100 also performs a kerf check at a predetermined timing during the processing operation (for example, every time a predetermined number of planned dividing lines 202 are cut, or every time a predetermined number of workpieces 200 are cut, etc.). When performing the kerf check, the control unit 100 captures an image of the processed groove 208 at a predetermined position of the workpiece 200 determined by the processing conditions (for example, position 214 surrounded by a dotted line circle in FIG. 5) with the imaging unit 30, and obtains, for example, an image 300, an example of which is shown in FIG. 6.

[0066] As shown in FIG. 1, the control unit 100 also includes an abnormality detection unit 101, a processing stop unit 102, a data collection unit 103, and a data analysis unit 104.

[0067] The abnormality detection unit 101 detects abnormalities during the machining operation by checking the quality of the machined groove 208 during the machining operation of the machining device 1. The abnormality detection unit 101 extracts the planned division line 202, the machined groove 208, and chips 209 (hereinafter referred to as chippings) formed on both edges of the machined groove 208 from the image 300 acquired when the kerf check is performed. The control unit 100 detects the normal position 301 where the processing groove 208 of the planned dividing line 202 determined by the processing conditions is formed (in embodiment 1, this is the central position in the width direction of the planned dividing line 202), the central position 302 in the width direction of the processing groove 208, the width 303 of the processing groove 208, the size 304 of the largest chipping 209 (the distance between the tip of the chipping 209 whose tip is furthest from the processing groove 208 among the multiple chippings 209 and both edges of the processing groove 208), and the distance 305 (hereinafter referred to as the cutting position deviation) between the normal position 301 where the processing groove 208 is formed and the central position 302 in the width direction of the processing groove 208.

[0068] As described above, in the first embodiment, the kerf check refers to checking whether or not the cutting position deviation 305, the width 303 of the machined groove 208, and the size 304 of the chipping 209 are within allowable ranges. The abnormality detection unit 101 determines whether or not the cutting position deviation 305, the width 303 of the detected machined groove 208, and the size 304 of the chipping 209 are within allowable ranges determined by the machining conditions, and checks whether or not the machined groove 208 is good.

[0069] The machining stop unit 102 stops the cutting process by the cutting unit 20 when an abnormality is detected by the abnormality detection unit 101. The machining stop unit 102 continues the machining operation when the abnormality detection unit 101 determines that the cutting position deviation 305, the width 303 of the machined groove 208, and the size 304 of the chipping 209 are all within the allowable range. When the abnormality detection unit 101 determines that at least one of the cutting position deviation 305, the width 303 of the machined groove 208, and the size 304 of the chipping 209 is not within the allowable range (i.e., the abnormality detection unit 101 detects an abnormal kerf check error), the machining stop unit 102 stops the machining operation (i.e., the cutting process by the cutting unit 20) and activates the alarm unit 130 to notify the operator.

[0070] Note that, hereinafter, a finding during the kerf check that the size is not within the allowable range will be referred to as a kerf check error, which is an abnormality in the machined groove 208, and a finding that the size 304 of the chipping 209 is not within the allowable range will be referred to as a chipping size error. Furthermore, when the kerf check is performed, the control unit 100 stores the detected cutting position deviation 305, width 303 of the machined groove 208, and size 304 of the chipping 209. In this way, the abnormality detection unit 101 detects a kerf check error from the image 300 of the machined groove 208 captured by the imaging unit 30.

[0071] Furthermore, during the processing operation of the processing device 1, the abnormality detection unit 101 detects, based on the detection results of the breakage detection sensor 81, that the cutting edge 212 of the cutting blade 21 has reached its wear limit, that a chip has occurred in the cutting edge 212 of the cutting blade 21, and that the amount of wear per unit time of the cutting edge 212 of the cutting blade 21 is abnormal, i.e., an abnormal blade error.

[0072] During the processing operation of the processing device 1, when the abnormality detection unit 101 detects, based on the detection result of the breakage detection sensor 81, that the cutting edge 212 of the cutting blade 21 has reached its wear limit, that a chip has occurred in the cutting edge 212 of the cutting blade 21, or that the amount of wear per unit time of the cutting edge 212 of the cutting blade 21 is abnormal (i.e., a blade error is detected by the abnormality detection unit 101), the processing stop unit 102 stops the processing operation and activates the alarm unit 130 to alert the operator.

[0073] Furthermore, based on the detection results of the detection sensors 85, 86, and 87, the abnormality detection unit 101 detects at least one of the following during the processing operation of the processing device 1: that the loading / unloading unit 75 is not clamping the annular frame 205, that the first conveying unit 72 is not suction-holding the workpiece 200, and that the second conveying unit 73 is not suction-holding the workpiece 200, i.e., an abnormal conveying error.

[0074] During the processing operation of the processing device 1, when the abnormality detection unit 101 detects, based on the detection results of the detection sensors 85, 86, 87, that the loading / unloading unit 75 is not clamping the annular frame 205, that the first conveying unit 72 is not suction-holding the workpiece 200, or that the second conveying unit 73 is not suction-holding the workpiece 200 (i.e., a conveying error is detected by the abnormality detection unit 101), the processing stop unit 102 stops the processing operation and activates the alarm unit 130 to alert the operator.

[0075] Furthermore, the abnormality detection unit 101 detects a holding error, which is an abnormality in the holding table 10 and the spinner table 62, based on the detection results of the detection sensors 88 and 89 during the processing operation of the processing device 1.

[0076] When the abnormality detection unit 101 detects a holding error in either the holding table 10 or the spinner table 62 during the processing operation of the processing device 1 (i.e., when the holding error is detected by the abnormality detection unit 101), the processing stop unit 102 stops the processing operation and activates the alarm unit 130 to notify the operator.

[0077] The abnormality detection unit 101 also determines whether the flow rate detected by the cutting water flow rate detection sensor 82 is within an allowable range. The abnormality detection unit 101 also determines whether the temperature detected by the cutting water temperature detection sensor 83 is within an allowable range.

[0078] During the machining operation of the machining device 1, if the abnormality detection unit 101 determines that the flow rate detected by the cutting water flow rate detection sensor 82 is within an allowable range, the machining stop unit 102 continues the machining operation. If the abnormality detection unit 101 determines that the flow rate detected by the cutting water flow rate detection sensor 82 is not within an allowable range (i.e., if the abnormality detection unit 101 detects an abnormal cutting water flow rate error), the machining stop unit 102 stops the machining operation and activates the alarm unit 130 to alert the operator.

[0079] During the machining operation of the machining device 1, if the abnormality detection unit 101 determines that the temperature detected by the cutting water temperature detection sensor 83 is within an allowable range, the machining stop unit 102 continues the machining operation. If the abnormality detection unit 101 determines that the temperature detected by the cutting water temperature detection sensor 83 is not within an allowable range (i.e., if the abnormality detection unit 101 detects an abnormal cutting water temperature error), the machining stop unit 102 stops the machining operation and activates the alarm unit 130 to alert the operator.

[0080] The data collection unit 103 acquires data related to the processing device 1 during the waiting time from when the processing operation is stopped by the processing stop unit 102 until the operator completes operations to recover from kerf check errors, blade errors, transport errors, holding errors, cutting water flow rate errors, and cutting water temperature errors (operations to resume processing operations).

[0081] In the first embodiment, when the abnormality detection unit 101 detects any one of a kerf check error, a blade error, a transport error, or a holding error and the processing stop unit 102 stops the processing operation, the data collection unit 103 drives the moving unit 40, the imaging unit 30, etc. to capture images of the processed groove 208 in a sequentially upstream side (corresponding to a plurality of regions) from the cutting point immediately before the processing operation of the workpiece 200 was stopped, and collects and acquires the images of the processed groove 208 in a sequentially upstream side from the cutting point immediately before the processing was stopped as image data. Note that in Fig. 7, the position 215 on the surface 201 of the workpiece 200 where the imaging unit 30 captures an image and acquires the image data is indicated by hatching.

[0082] Furthermore, in the present invention, when the abnormality detection unit 101 detects any one of a kerf check error, a blade error, a transport error, or a holding error and the machining stop unit 102 stops the machining operation, the data collection unit 103 may drive the moving unit 40, the imaging unit 30, etc. to capture an image of the entire region 213 (shown by hatched lines in FIG. 8 ) on the surface 201 of the workpiece 200 where the machined groove 208 is formed, including the cutting location just before the machining operation of the workpiece 200 was stopped, and collect and acquire image data. Note that FIG. 8 shows by hatched lines the region 213 on the surface 201 of the workpiece 200 from which the imaging unit 30 captures and acquires image data. Note that when image data of the region 213 shown in FIG. 8 is acquired, it is easy to determine at which position on the workpiece 200 the error occurred during cutting of the machined groove 208 when later investigating the cause of the error.

[0083] In this way, before the operator performs an operation to recover from the error, the data collection unit 103 moves the holding table 10 and the imaging unit 30 relatively in the horizontal direction to the holding surface 11, and acquires image data of the machined groove 208. Since the data collection unit 103 collects image data, it is possible to determine the cause of a chipping error or the like not only when deciding on an operation to recover from the error, but also by reviewing the image data later.

[0084] Furthermore, when the abnormality detection unit 101 detects any one of a kerf check error, blade error, transport error, or holding error and the processing stop unit 102 stops the processing operation, the data collection unit 103 controls the moving unit 40 and the diameter detection unit 84 to detect the diameter of the cutting blade 21 with the diameter detection unit 84. The data collection unit 103 associates the acquired image data, the detected diameter of the cutting blade 21, and any one of a kerf check error, blade error, transport error, or holding error detected by the abnormality detection unit 101, and stores them in the storage device. In this way, it is desirable that the type of data collected by the data collection unit 103 be linked to the type of error.

[0085] The data analysis unit 104 analyzes the image data acquired and collected by the data collection unit 103. In the first embodiment, the data analysis unit 104 detects the machined groove 208 from the image data acquired and collected by the data collection unit 103, and detects the cutting position deviation 305, the width 303 of the machined groove 208, and the size 304 of the chipping 209 at predetermined intervals in the longitudinal direction of the machined groove 208.

[0086] The data analysis unit 104 stores the detected cutting position deviation 305, width 303 of the machined groove 208, and size 304 of the chipping 209 in association with the position on the surface 201 of the workpiece 200. The data analysis unit 104 calculates the average value and maximum value of the already stored cutting position deviation 305, width 303 of the machined groove 208, and size 304 of the chipping 209, and analyzes the tendency of changes in these values.

[0087] In the first embodiment, when the abnormality detection unit 101 detects a kerf check error and the processing stop unit 102 stops the processing operation, an operator or the like performs an operation to recover from the kerf check error, for example, by correcting the cutting position of the cutting blade 21, by dressing the cutting blade 21 so that it cuts into the dressing board 210, or by replacing the cutting blade 21. Specifically, if the kerf check error is that the width 303 of the processing groove 208 is not within the allowable range or there is a chipping size error, the operator replaces the cutting blade 21 or causes the processing device 1 to perform dressing by operating the input unit 120, for example.

[0088] If the kerf check error is that the cutting position deviation 305 is not within the tolerance, the operator operates the input unit 120 to align the imaging unit 30 with the intended processing position, register the deviation between the hairline displayed at the center of the imaging screen and the actually processed groove 208, and have the processing device 1 perform hairline alignment to update the positional relationship between the imaging unit 30 and the cutting blade 21, or move the cutting position of the cutting blade 21, register it, and perform correction. Also, if the kerf check error is that the processed groove 208 cannot be found, the operator operates the input unit 120 or the like to have the processing device 1 detect the diameter of the cutting blade 21 with the diameter detection unit 84, and reset the position of the cutting unit 20 in the Z-axis direction during cutting to a position where it can cut the workpiece 200 (i.e., blade setup).

[0089] For example, if the kerf check error is a chipping size error, the control unit 100 causes the display unit 110 to display a display screen 400 shown in Fig. 9. The display screen 400 shown in Fig. 9 includes an image display area 401 that displays the image 300 acquired during the kerf check, an alarm clear area 402 for inputting an instruction to the control unit 100 to stop the notification from the notification unit 130, a data display area 403 for inputting an instruction to the control unit 100 to display image data and the like collected by the data collection section 103, a recovery area 404 for inputting an instruction to the control unit 100 to display a menu for recovering from an abnormality such as a kerf check error, and an error content display area 405 that indicates the type of error. When the operator operates the alarm clear area 402 on the display screen 400, the control unit 100 stops the notification from the notification unit 130.

[0090] Furthermore, on the display screen 400, when the operator operates the data display area 403 or the recovery area 404 while the data collection unit 103 is collecting image data, etc., the control unit 100 displays a confirmation screen 500, superimposed on the display screen 400, for confirming whether or not to stop the collection of image data, etc., by the data collection unit 103. The confirmation screen 500 has set thereon a stop area 501 for inputting an instruction to the control unit 100 to stop the collection of image data, etc., by the data collection unit 103, a continue area 502 for inputting an instruction to the control unit 100 to continue the collection of image data, etc., by the data collection unit 103, and an area 503 for displaying a message for confirming whether or not to stop the collection of image data, etc., by the data collection unit 103.

[0091] Furthermore, when the operator operates the data display area 403 on the display screen 400 after the data collection unit 103 has collected image data, etc., the control unit 100 displays an image data display screen 600, which displays the image data collected and acquired by the data collection unit 103, superimposed on the display screen 400. The image data display screen 600 includes an image data display area 601 for displaying image data and a cursor 602 for inputting to the control unit 100 an instruction to change the position of the image data displayed in the image data display area 601. By operating the cursor 602, image data of the entire planned division line 202 can be displayed in sequence on the image data display screen 600, allowing the operator to determine the extent to which the entire cutting groove 208 has been removed. Furthermore, if the cutting groove 208 cannot be found, the operator can operate the cursor 602 to display image data of the entire planned division line 202 in sequence on the image data display screen 600, allowing the operator to determine whether the cutting groove 208 is actually present. Instead of operating the cursor 602, the image data displayed may be switched by scrolling the image data display screen 600 up, down, left, or right.

[0092] Furthermore, on the display screen 400, when the operator operates the recovery area 404 after the data collection unit 103 has collected image data, etc., the control unit 100 displays a menu (not shown) on the display screen 400. The menu includes an area for instructing the restart of the machining operation, an area for instructing the dressing of the cutting blade 21, an area for instructing the correction of the cutting position, an area for instructing hairline alignment, an area for replacing the cutting blade 21, and the like. To determine which recovery operation to perform among these areas of the menu, the operator operates the data display area 403 to display the image data display screen 600 superimposed on the display screen 400, and checks whether the chipping 209 is sudden (check whether the chip 207 has been blown out and the cutting blade 21 has not been damaged, and if there is no problem, resume machining) or whether it has a tendency to gradually increase (it is assumed that the condition of the cutting blade 21 has deteriorated, so dressing is performed).

[0093] The functions of the abnormality detection unit 101, processing stop unit 102, data collection unit 103 and data analysis unit 104 of the control unit 100 described above are realized by the arithmetic processing unit of the control unit 100 executing a computer program stored in the memory device.

[0094] In the machining apparatus 1 according to the first embodiment described above, when the abnormality detection unit 101 detects any one of a kerf check error, blade error, transport error, holding error, cutting water flow rate error, and cutting water temperature error, the machining stop unit 102 stops the machining operation, and the data collection unit 103 detects image data, which is data of the machining apparatus 1, and the diameter of the cutting blade 21. For this reason, the machining apparatus 1 collects image data useful for analyzing the cause of each error and the diameter of the cutting blade 21, which is data for checking the state of the cutting unit 20, while the machining operation is stopped (the time from when the alarm unit 130 operates to issue an alarm to when the alarm unit 130 is stopped and a recovery operation is started, for example, by operating the alarm clear area 402 of the display unit 110), so that the machining stop time can be used effectively.

[0095] As a result, the processing device 1 according to the first embodiment has the effect of being able to effectively utilize the time during which the processing device 1 is stopped.

[0096] In addition, in the processing apparatus 1 according to the first embodiment, the data collection unit 103 captures an image of the processed surface 201 of the workpiece 200 to acquire image data, and the acquired image data can be used by the operator to analyze the cause of the error. Furthermore, in the processing apparatus 1 according to the first embodiment, the data analysis unit 104 can analyze trends in changes, such as whether the size 304 of the chipping 209 or the width 303 of the processed groove 208 is increasing or decreasing or has occurred suddenly, while the processing apparatus 1 is stopped, and provide the results to the operator, thereby achieving the effect that the operator can grasp the cause of the error and perform appropriate recovery operations.

[0097] Furthermore, in the processing device 1 according to the first embodiment, the data collection unit 103 detects the diameter of the cutting blade 21, and thus data that can be used to improve the quality of cutting processing in the future is acquired.

[0098] The present invention is not limited to the above-described embodiment and modifications. That is, various modifications can be made without departing from the gist of the present invention. For example, the processing apparatus 1 of the present invention is not limited to a cutting apparatus, but may be a laser processing apparatus shown in FIG. 12 or a grinding apparatus that grinds a workpiece 200. Note that FIG. 12 is a perspective view showing an example of the configuration of a processing apparatus according to a modification of the first embodiment, and the same parts as those in the first embodiment are designated by the same reference numerals and will not be described again.

[0099] The processing apparatus 1-1 shown in Fig. 12 is a laser processing apparatus that irradiates a laser beam having a wavelength that is absorbed by the workpiece 200, performs ablation processing on the workpiece 200, and forms a processing groove 208 along a planned dividing line 202 of the workpiece 200. The processing apparatus 1-1 shown in Fig. 12 includes a laser beam irradiating unit 20-1, which is a processing unit that irradiates the workpiece 200 with a laser beam, instead of the cutting unit 20, and a power meter 84-1, which irradiates the laser beam at a predetermined timing and measures the output of the laser beam irradiated by the laser beam irradiating unit 20-1, instead of the diameter detection unit 84.

[0100] In addition, the processing device 1 of the present invention may detect the diameter of the cutting blade 21 based on the amount of light from the light emitting element 811 received by the light receiving element 812 of the breakage detection sensor 81, that is, the breakage detection sensor 81 may be used as a diameter detection unit. [Explanation of symbols]

[0101] 1,1-1 Processing equipment 10 Holding table 11 Holding surface 20 Cutting unit (processing unit) 20-1 Laser beam irradiation unit (processing unit) 21 Cutting blade 23 Spindle 24 Spindle motor (motor) 30 Imaging unit 41 Processing feed unit 70 Transport Unit 84 Diameter detection unit 100 control unit 101 Abnormality detection unit 102 Machining stop part 103 Data Collection Department 104 Data Analysis Department 200 Workpiece 208 Machining groove 300 images

Claims

1. a holding table having a holding surface for holding a workpiece; a processing unit that processes the workpiece held on the holding table; a processing feed unit that moves the holding table relative to the processing unit; an imaging unit that images the workpiece held on the holding table; A cutting device comprising: The control unit an abnormality detection unit that detects an abnormality in the cutting device; a machining stop unit that stops machining by the machining unit when an abnormality is detected; a data collection unit that collects data related to the cutting device during a waiting time from when the machining is stopped until an operator performs an operation to recover from the abnormality; and The type of data collected by the data collection unit is associated with the type of error detected by the abnormality detection unit, The cutting device is characterized in that when the abnormality detection unit detects an abnormality, the data collection unit uses the imaging unit to capture an image of the processed groove upstream from the cutting point just before processing is stopped, and collects the image of the processed groove as image data.

2. The control unit is characterized by including a data analysis unit that analyzes the data collected by the data collection unit. The cutting device according to claim 1 .

3. The cutting device is a plurality of conveying units for conveying workpieces within the cutting device; The abnormality detection unit detects abnormalities in the transport by the transport unit. The cutting device according to claim 1 or 2.

4. The data collection unit The imaging unit is driven to capture images of the processed grooves in a plurality of areas, and a plurality of images of the processed grooves are collected as the data. The cutting device according to any one of claims 1 to 3.

5. a holding table having a holding surface for holding a workpiece; a processing unit that processes the workpiece held on the holding table; a processing feed unit that moves the holding table relative to the processing unit; an imaging unit that images the workpiece held on the holding table; A cutting device comprising: The control unit an abnormality detection unit that detects an abnormality in the cutting device; a machining stop unit that stops machining by the machining unit when an abnormality is detected; a data collection unit that collects data related to the cutting device during a waiting time from when the machining is stopped until an operator performs an operation to recover from the abnormality; and The type of data collected by the data collection unit is associated with the type of error detected by the abnormality detection unit, The processing unit comprises: a cutting blade fixed to the tip of the spindle to form a groove in the workpiece; a motor for rotating the spindle; The cutting device is a diameter detection unit for detecting the diameter of the cutting blade; The data collection unit The diameter of the cutting blade is detected by the diameter detection unit. cutting equipment.

Images