Camera modules and electronic devices

Abstract

The present disclosure relates to a camera module and an electronic apparatus that achieve better heat dissipation. A movable member has an image sensor mounted on an upper surface side thereof, and is provided movably in a direction along an imaging surface of the image sensor. A fixed member is fixed on a back surface side of the movable member with a predetermined air gap from the movable member. One or a plurality of heat-dissipating members are provided in the air gap so as to be fixed onto one of the fixed member and the movable member and to be in contact with the other. The present disclosure may be applied to a camera module in which a sensor shift scheme is adopted.

Description

[Technical Field]

[0001] The present disclosure relates to a camera module and an electronic device, and more particularly to a camera module and an electronic device that enable better heat dissipation. [Background technology]

[0002] A known technique for correcting camera shake in an imaging device is a sensor shift method in which an image sensor is moved in a direction perpendicular to the direction of incidence of light, rather than by moving a lens.

[0003] For example, Patent Document 1 discloses an imaging element driving device that supports an imaging element assembly that moves relative to a fixed portion by electromagnetic force so that the imaging element assembly is movable relative to the fixed portion. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2020-60726 Summary of the Invention [Problem to be solved by the invention]

[0005] However, a structure that uses the sensor shift method is disadvantageous in terms of heat dissipation because an air gap exists below the movable member on which the image sensor is mounted (on the opposite side to the imaging surface of the image sensor).

[0006] The present disclosure has been made in view of such circumstances, and aims to achieve better heat dissipation. [Means for solving the problem]

[0007] The camera module of the present disclosure is a camera module comprising an image sensor, a movable member having the image sensor mounted on its surface and movable in a direction along the imaging surface of the image sensor, a fixed member fixed with a predetermined gap between it and the back surface of the movable member, and one or more heat dissipation members fixed to at least one of the fixed member and the movable member in the gap and arranged to be in contact with the other.

[0008] The electronic device disclosed herein is an electronic device that includes a camera module having an image sensor, a movable member having the image sensor mounted on its front side and movable in a direction along the imaging surface of the image sensor, a fixed member fixed on the back side of the movable member with a predetermined gap between it and the movable member, and one or more heat dissipation members fixed to at least one of the fixed member and the movable member in the gap and arranged so as to be in contact with the other.

[0009] In the present disclosure, the movable member has an image sensor mounted on its front side and is arranged to be movable in a direction along the imaging surface of the image sensor, the fixed member is fixed to the back side of the movable member with a predetermined gap between it and the movable member, and one or more heat dissipation members are fixed to at least one of the fixed member and the movable member in the gap and arranged to be in contact with the other. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a diagram showing the appearance of a camera module to which the technology according to the present disclosure is applied. [Figure 2] FIG. 2 is a diagram illustrating an example of the internal configuration of a camera module. [Figure 3] 1 is a cross-sectional view showing a configuration example of a camera module according to a first embodiment. [Figure 4] 1A and 1B are diagrams illustrating the arrangement and shape of bumps. [Figure 5] FIG. 10 is a cross-sectional view showing another configuration example of the camera module. [Figure 6]FIG. 10 is a cross-sectional view showing another configuration example of the camera module. [Figure 7] 1A to 1C are diagrams illustrating examples of bump shapes. [Figure 8] FIG. 10 is a cross-sectional view showing another configuration example of the camera module. [Figure 9] FIG. 10 is a diagram showing an example of the arrangement of bumps. [Figure 10] FIG. 10 is a diagram showing an example of the arrangement of bumps. [Figure 11] FIG. 10 is a diagram showing an example of the arrangement of bumps. [Figure 12] FIG. 10 is a diagram showing examples of bump sizes. [Figure 13] FIG. 10 is a cross-sectional view showing another configuration example of the camera module. [Figure 14] FIG. 10 is a cross-sectional view showing a configuration example of a camera module according to a second embodiment. [Figure 15] FIG. 10 is a cross-sectional view showing a configuration example of a camera module according to a third embodiment. [Figure 16] FIG. 10 is a cross-sectional view showing another configuration example of the camera module. [Figure 17] FIG. 10 is a cross-sectional view showing another configuration example of the camera module. [Figure 18] FIG. 10 is a cross-sectional view showing another configuration example of the camera module. [Figure 19] FIG. 10 is a diagram illustrating a configuration example of a movable member according to a fourth embodiment. [Figure 20] 10A and 10B are diagrams illustrating the inclination of a movable member. [Figure 21] 10A and 10B are diagrams illustrating the inclination of a movable member. [Figure 22] FIG. 10 is a cross-sectional view showing a configuration example of a camera module according to a fifth embodiment. [Figure 23] FIG. 10 is a diagram showing a first modified example of a camera module having a bump. [Figure 24] FIG. 10 is a diagram showing a second modified example of a camera module having a bump. [Figure 25] FIG. 10 is a diagram showing a third modified example of a camera module having a bump. [Figure 26]1 is a block diagram illustrating an example of the configuration of an electronic device to which the technology according to the present disclosure is applied. DETAILED DESCRIPTION OF THE INVENTION

[0011] Modes for carrying out the present disclosure (hereinafter referred to as embodiments) will be described below. The description will be made in the following order.

[0012] 1. Camera module configuration 2. First embodiment (configuration in which multiple bumps are formed on the upper surface of the fixing member) 3. Second embodiment (structure in which only one bump is formed on the upper surface of the fixing member) 4. Third embodiment (structure in which a gel material is filled in the gap) 5. Fourth embodiment (configuration in which vias are formed in the movable member) 6. Fifth embodiment (structure in which heat dissipation fins are formed on the rear surface of the movable member) 7. Sixth embodiment (structure in which the upper surface of the fixing member is inclined) 8. Variations 9. Electronic Device Configuration

[0013] <1. Camera module configuration> FIG. 1 is a diagram showing the appearance of a camera module to which the technology according to the present disclosure is applied.

[0014] 1 is configured as an imaging device built into, for example, a smartphone. Camera module 1 is not limited to being built into a smartphone, but may also be built into a tablet terminal, a portable PC (Personal Computer), or other electronic device. Camera module 1 is a camera module that employs a sensor shift method in which an image sensor is moved in a direction perpendicular to the direction of light incidence.

[0015] In camera module 1, a lens unit 12, an image sensor (not shown), and the like are housed inside housing 11. Housing 11 is made of, for example, a predetermined metal. Lens unit 12 is configured so that a plurality of lenses are supported by a holder.

[0016] The housing 11 is fixed to a fixing member 21 configured as, for example, a stiffener that increases the strength of the entire camera module 1. The housing 11 may be fixed directly to the fixing member 21, or may be fixed indirectly to the fixing member 21 via a predetermined member. The fixing member 21 may be configured as a printed circuit board (PCB).

[0017] One end of an FPC (Flexible Printed Circuits) 22 is connected to the fixing member 21, and the other end of the FPC 22 is connected to a connector 23. The camera module 1 is electrically connected to a power source and electronic circuits inside the smartphone in which the camera module 1 is built, via the FPC 22 and the connector 23.

[0018] In the following, the x-axis and y-axis are defined as two axes that are perpendicular to each other on a plane perpendicular to the incident direction of light (the optical axis direction of lens unit 12), and the z-axis is defined as the incident direction of light. The imaging surface of the image sensor is assumed to be on the xy plane.

[0019] 2 is a diagram showing an example of the internal configuration of the camera module 1. Note that the lens unit 12 is not shown in FIG.

[0020] Inside the housing 11 of the camera module 1, a movable body 30 is provided on the fixed member 21.

[0021] The movable body 30 is composed of an image sensor 31 and a movable member 32 on the surface of which the image sensor 31 is mounted. The movable member 32 is configured as, for example, a printed circuit board (PCB).

[0022] The fixed member 21 is fixed with a predetermined gap (air gap) between it and the rear surface of the movable member 32. That is, the movable body 30 (the movable member 32 on which the image sensor 31 is mounted) is provided so as to be movable in a direction along the imaging surface (xy plane) of the image sensor 31. That is, the movable member 32 can be said to be a first member on whose surface the image sensor 31 is mounted and which is provided so as to be movable in a direction along the imaging surface of the image sensor 31. The fixed member 21 can be said to be a second member fixed with a predetermined gap between it and the rear surface of the first member. Furthermore, the movable member 32 can be said to be a first substrate on whose surface the image sensor 31 is mounted and which is provided so as to be movable in a direction along the imaging surface of the image sensor 31. The fixed member 21 can be said to be a second substrate fixed with a predetermined gap between it and the rear surface of the first substrate.

[0023] The image sensor 31 is electrically connected to a power source and electronic circuits to which the camera module 1 is connected via a movable member 32 serving as a PCB and an FPC 33 provided around the movable member 32. The movable member 32 may be configured as an FPC formed integrally with the FPC 33.

[0024] Inside the housing 11 of the camera module 1, an actuator mechanism section 40 is provided above the movable body 30.

[0025] The actuator mechanism 40, together with the housing 11 that serves as a cover, constitutes an actuator component. The actuator mechanism 40, which functions as an actuator, is composed of a coil, a magnet, a resin support member that supports them, and the like, and supports the movable body 30 by suspending it from above. The actuator mechanism 40 achieves image stabilization by moving the movable body 30 in response to vibrations of the camera module 1 based on a control signal from a control circuit (not shown). The actuator mechanism 40 may achieve autofocus by moving the movable body 30 in the z-axis direction in addition to moving the movable body 30 in directions along the xy plane.

[0026] Conventionally, a structure employing a sensor shift method, such as the camera module 1, has been disadvantageous in terms of heat dissipation because an air gap exists below the movable body 30 (movable member 32 on which image sensor 31 is mounted).

[0027] Therefore, an embodiment of the camera module 1 that can achieve better heat dissipation will be described below.

[0028] 2. First Embodiment (First example of heat dissipation structure) 3 is a cross-sectional view showing an example of the configuration of the camera module 1 according to the first embodiment. In FIG. 3, the housing 11 and the lens unit 12 are omitted from the illustration.

[0029] In the camera module 1 of Fig. 3, the image sensor 31 is mounted on the surface of the movable member 32 by being adhered with a chip fixing material 51. The chip fixing material 51 is made of a die-bonding material such as a die attach film (DAF), adhesive, or solder, and has thermal conductivity. Heat generated in the image sensor 31 is transferred to the movable member 32 via the chip fixing material 51. An actuator mechanism 40 is mounted on the movable member 32 so as to cover the image sensor 31.

[0030] The movable member 32 is supported by the actuator mechanism 40 so as to have a predetermined gap above the fixed member 21. An FPC 61 as part of the above-mentioned FPC 33 is provided around the movable member 32. In the gap between the fixed member 21 and the movable member 32, a plurality of bumps 100 are provided as heat dissipation members that dissipate heat from the movable member 32 to the fixed member 21.

[0031] The bumps 100 are fixed to the fixed member 21 and are provided so as to contact the movable member 32. The bumps 100 are formed of a material with a higher thermal conductivity than air. Examples of materials for the bumps 100 include at least one of Au, Ag, Cu, Ni, and solder. Furthermore, when the fixed member 21 is configured as a stiffener made of a metal such as stainless steel, the bumps 100 may be formed as protrusions formed by processing the upper surface of the fixed member 21. In other words, the heat dissipation member in the camera module 1 to which the technology disclosed herein is applied can be considered a thermal conductor that is fixed to the second member (second substrate) in the gap between the first member (first substrate) and the second member (second substrate) and is provided so as to contact the first member (first substrate). In the camera module 1 to which the technology disclosed herein is applied, the heat dissipation member is formed of bumps. However, it may also be formed of nodular or granular metal or resin that is sufficiently small relative to the fixed member 21 and the movable member 32.

[0032] 4, for example, 50 to 100 bumps 100 are arranged in a grid pattern on the upper surface of the fixed member 21. The bumps 100 are formed in a hemispherical shape, with their flat sides fixed to the fixed member 21 and their spherical sides in point contact with the movable member 32. The height of all the bumps 100 is the same, for example, 100 μm.

[0033] According to the above configuration, heat transferred from the image sensor 31 to the movable member 32 can be transferred to the fixed member 21 via the bumps 100, thereby realizing better heat dissipation.

[0034] Furthermore, since the movable member 32 and the bumps 100 are in point contact, it is possible to reduce friction between the movable member 32 and the bumps 100, thereby suppressing an increase in the drive torque of the actuator mechanism 40. The number of bumps 100 is preferably determined depending on the required heat dissipation effect and the allowable drive torque of the actuator mechanism 40.

[0035] (Second example of heat dissipation structure) FIG. 5 is a diagram showing another example of the configuration of the camera module 1 according to the present embodiment.

[0036] 5, in addition to the configuration of camera module 1 in Fig. 3, a heat dissipation material 111 having thermal conductivity is provided on the back surface of movable member 32. Heat dissipation material 111 is configured by a heat dissipation sheet made of, for example, carbon graphite or a Cu-based metal.

[0037] In the example of FIG. 5, the bumps 100 are provided so as to come into point contact with the heat dissipation material 111.

[0038] According to the above configuration, the heat transferred from the image sensor 31 to the movable member 32 can be efficiently transferred to the fixed member 21 via the heat dissipation material 111 and the bumps 100, thereby achieving better heat dissipation.

[0039] (Third example of heat dissipation structure) FIG. 6 is a diagram showing another example of the configuration of the camera module 1 according to the present embodiment.

[0040] In the camera module 1 of FIG. 6, in addition to the configuration of the camera module 1 of FIG. 3, a low-friction material 112 with a low coefficient of friction is provided on the back surface of the movable member 32. The low-friction material 112 is formed from a sheet whose surface is made of a material with low polarity (that is, it does not easily stick to other objects). Examples of low-polarity materials include PTFE (Poly Tetra Fluoro Ethylene), which has a relatively rigid molecular structure surrounded by CH atoms with a small atomic radius, paraffin, high-density polyethylene, and Bakelite (phenolic resin). Note that the material constituting the low-friction material 112 is preferably a thermally conductive material.

[0041] In the example of FIG. 6, the bumps 100 are provided so as to come into point contact with the low-friction material 112 .

[0042] According to the above configuration, even when the number of bumps 100 increases and the friction between the movable member 32 and the bumps 100 becomes large, the increase in friction can be suppressed, and the increase in the driving torque of the actuator mechanism part 40 can be suppressed.

[0043] (Bump shape) FIG. 7 is a diagram showing examples of bump shapes.

[0044] In this embodiment, the bumps serving as heat dissipation members are formed in a hemispherical shape, but the shape is not limited to a hemisphere and may be any shape that makes point contact or contacts the movable member 32 over an extremely small area.

[0045] For example, the bump in this embodiment may be formed in a tablet shape, such as bump 100a shown in FIG. 7A, which has convex curved surfaces on both bottom surfaces of a flat cylinder.

[0046] The bump in this embodiment may be formed in a capsule-like shape, such as bump 100b shown in FIG. 7B, in which both bottom surfaces of a thin and long cylinder have hemispherical curved surfaces.

[0047] The bump in this embodiment may be formed in a spherical shape, like the bump 100c shown in FIG.

[0048] The bump in this embodiment may be formed in a so-called torus or doughnut shape, like a bump 100d shown in FIG. 7D.

[0049] The bump in this embodiment may be formed in a conical shape, such as bump 100e shown in Figure 7E. Alternatively, bump 100e may have a convex curved surface at the apex of the cone. Furthermore, bump 100e may have a shape in which a recess is formed in the center of a cross section obtained by cutting the apex of the cone, and the annular cross section is chamfered to form a curved surface.

[0050] In particular, when bumps having shapes such as the bumps 100a, 100b, and 100c are fixed to the fixing member 21, it is not easy to adhere the bumps to the fixing member 21 because the fixing member 21 side of the bumps is not flat.

[0051] Therefore, for example, when a spherically shaped bump 100c is fixed to the fixing member 21, as shown in Fig. 8, the bump 100c is fitted into a groove 131 consisting of a hemispherical recess formed in the fixing member 21. With this structure, even bumps shaped like the bumps 100a, 100b, and 100c, whose fixing member 21 side is not flat, can be fixed to the fixing member 21 without shifting or falling off.

[0052] 8, the grooves 131 increase the contact area between the fixed member 21 and the bumps 100, so that heat transferred from the image sensor 31 to the movable member 32 can be efficiently transferred to the fixed member 21 via the bumps 100c. Furthermore, the rotation of the bumps 100c in the grooves 131 allows the movable member 32 to move more smoothly.

[0053] (Bump placement) 9 to 11 are diagrams showing examples of bump arrangements.

[0054] In the above-described embodiment, the bumps serving as heat dissipation members are arranged in a lattice pattern on the upper surface of the fixing member 21, but the arrangement is not limited to a lattice pattern.

[0055] For example, the bumps 100 in this embodiment may be arranged in a staggered pattern on the upper surface of the fixing member 21, as shown in Fig. 9. Figs. 9 to 11 show top views of the fixing member 21 viewed from the front in the xy plane, and a rectangle corresponding to the image sensor 31 is indicated by a dashed line.

[0056] 10, the bumps 100 in this embodiment may be arranged radially on the upper surface of the fixing member 21 with the center of the image sensor 31 as the reference point. In this case, the number of bumps 100 arranged directly below the image sensor 31 increases, and therefore the efficiency of heat dissipation via the bumps 100 can be improved.

[0057] On the other hand, although not shown, they may be arranged radially on the upper surface of the fixed member 21 with the center of the movable member 32 as the reference point. In this case, the balance of the movable member 32 can be stabilized when the movable member 32 moves.

[0058] 11, the bumps 100 in this embodiment may be arranged on the upper surface of the fixing member 21 with a higher density the closer they are to the center of the image sensor 31. In this case as well, the number of bumps 100 arranged directly below the image sensor 31 increases, thereby improving the efficiency of heat dissipation via the bumps 100.

[0059] 10 and 11, instead of increasing the number of bumps 100 arranged directly below the image sensor 31, the size of the bumps 100 arranged directly below the image sensor 31 may be increased. Specifically, as shown in Fig. 12, the bumps 100 may be formed to be larger in size as they are closer to the center of the image sensor 31. In this case, the volume of the bumps 100 arranged directly below the image sensor 31 increases, and therefore the efficiency of heat dissipation via the bumps 100 can be improved.

[0060] The height of all the bumps 100 is the same. That is, instead of only some of the bumps 100 contacting the movable member 32, all of the bumps 100 contact the movable member 32 evenly, which allows for more efficient heat dissipation.

[0061] 3. Second Embodiment FIG. 13 is a cross-sectional view showing an example of the configuration of the camera module 1 according to the second embodiment.

[0062] In the camera module 1 of FIG. 13, instead of the multiple bumps 100 in the configuration of the camera module 1 of FIG. 3, only one bump 100f is provided as a heat dissipation member in the gap between the fixed member 21 and the movable member 32.

[0063] The bump 100f has a curved surface with a larger radius of curvature than the bump 100 described above, and is provided so as to come into contact with the movable member 32 over a surface that is slightly larger than a point.

[0064] In the example of FIG. 13, the heat dissipation material 111 described with reference to FIG. 5 or the low-friction material 112 described with reference to FIG. 6 may be provided on the rear surface of the movable member 32.

[0065] According to the above configuration, heat transferred from the image sensor 31 to the movable member 32 can be transferred to the fixed member 21 via the bumps 100f, thereby realizing better heat dissipation.

[0066] 4. Third Embodiment FIG. 14 is a cross-sectional view showing an example of the configuration of the camera module 1 according to the third embodiment.

[0067] In the camera module 1 of FIG. 13, instead of the multiple bumps 100 in the configuration of the camera module 1 of FIG. 3, a thermally conductive gel material 200 is filled or applied in the gap between the fixed member 21 and the movable member 32.

[0068] The gel material 200 may be a magnetic filler containing a magnetic fluid, or may be a carbon-based filler.

[0069] According to the above configuration, heat transferred from the image sensor 31 to the movable member 32 can be transferred to the fixed member 21 via the gel material 200, thereby realizing better heat dissipation.

[0070] 5. Fourth Embodiment (First example of heat dissipation structure) FIG. 15 is a cross-sectional view showing an example of the configuration of the camera module 1 according to the fourth embodiment.

[0071] Unlike the camera modules 1 of the above-described embodiments, the camera module 1 of FIG. 15 does not have a heat dissipation member such as a bump 100 provided in the gap between the fixed member 21 and the movable member 32.

[0072] 15, a plurality of vias 300 are provided, penetrating from the front surface to the back surface of the movable member 32. The vias 300 are formed throughout the entire movable member 32, but may be formed at least in the portion of the movable member 32 where the image sensor 31 is mounted. The metal forming the vias 300 includes, for example, at least one of Au, Ag, Cu, Ni, and solder.

[0073] According to the above configuration, heat transferred from the image sensor 31 to the movable member 32 can be efficiently dissipated through the via 300 into the gap between the fixed member 21 and the movable member 32, thereby achieving better heat dissipation.

[0074] In particular, by increasing the number of vias 300 formed directly below the image sensor 31 in the movable member 32, the efficiency of heat dissipation through the vias 300 can be improved.

[0075] (Second example of heat dissipation structure) FIG. 16 is a diagram showing another example of the configuration of the camera module 1 according to the present embodiment.

[0076] 16, in addition to the configuration of the camera module 1 in FIG. 15, a heat dissipation layer 310 having thermal conductivity is formed on the surface of the movable member 32. Specifically, the heat dissipation layer 310 is formed on the surface of the movable member 32 so as to surround the periphery of the image sensor 31. The heat dissipation layer 310 is made of, for example, copper foil. The heat dissipation layer 310 may also be made of a thin metal film with high thermal conductivity formed by plating or vapor deposition.

[0077] According to the above configuration, the heat transferred from the image sensor 31 to the movable member 32 can be dissipated through the heat dissipation layer 310 to the actuator mechanism 40 and further to the housing 11, thereby achieving better heat dissipation.

[0078] (Third example of heat dissipation structure) FIG. 17 is a diagram showing another example of the configuration of the camera module 1 according to the present embodiment.

[0079] 17, in addition to the configuration of camera module 1 in Fig. 16, heat dissipation material 111 described with reference to Fig. 5 is provided on the back surface of movable member 32. Note that in the example of Fig. 17, heat dissipation layer 310 does not necessarily have to be provided.

[0080] According to the above configuration, heat transferred from the image sensor 31 to the movable member 32 can be efficiently dissipated into the gap between the fixed member 21 and the movable member 32 via the via 300 and the heat dissipation material 111, thereby achieving better heat dissipation.

[0081] 17, the heat dissipation material 111 and the via 300 may be integrally formed. Furthermore, when a heat dissipation layer 310 is formed between the image sensor 31 and the movable member 32 in place of the chip fixing material 51, the via 300 and the heat dissipation layer 310 may be integrally formed, or the heat dissipation material 111, the via 300, and the heat dissipation layer 310 may be integrally formed.

[0082] (Fourth example of heat dissipation structure) FIG. 18 is a diagram showing another example of the configuration of the camera module 1 according to the present embodiment.

[0083] 18, in addition to the configuration of camera module 1 in Fig. 15, a plurality of bumps 100 described with reference to Fig. 3 etc. are provided in the gap between fixed member 21 and movable member 32. The plurality of bumps 100 are arranged at positions corresponding to a plurality of vias 300 formed penetrating from the front surface to the back surface of movable member 32.

[0084] That is, in the camera module 1 of FIG. 18, the plurality of bumps 100 are fixed to the fixed member 21, and are provided so as to be in contact with the plurality of vias 300 formed in the movable member 32.

[0085] According to the above configuration, heat transferred from the image sensor 31 to the movable member 32 can be efficiently transferred to the fixed member 21 through the vias 300 and the bumps 100, thereby achieving better heat dissipation.

[0086] The arrangement of the vias 300 in the camera module 1 of this embodiment can be any of the arrangements of the bumps in the camera module 1 of the first embodiment.

[0087] 6. Fifth Embodiment FIG. 19 is a diagram showing an example of the configuration of the movable member 32 that constitutes the camera module 1 of the fifth embodiment.

[0088] 19 shows the rear surface (surface on the fixed member 21 side) of the movable member 32. A plurality of heat dissipation fins 400 are provided on the rear surface of the movable member 32. In the example of FIG. 19, the heat dissipation fins 400 have a rectangular parallelepiped (specifically, cubic) protruding structure.

[0089] According to the above configuration, the surface area of the rear side of the movable member 32 is increased, so that the heat transferred from the image sensor 31 to the movable member 32 can be efficiently dissipated, thereby achieving better heat dissipation.

[0090] The heat dissipation fins 400 are not limited to the protrusion-like structure shown in FIG. 19, but may have a fin-like structure, for example.

[0091] 7. Sixth Embodiment In the camera module 1 employing the sensor shift method, the heat dissipation effect can be improved by narrowing the air gap that exists below the movable member 32 on which the image sensor 31 is mounted.

[0092] On the other hand, as shown in FIG. 20, due to variations in the manufacturing process of the camera module 1, the actuator mechanism section 40 and the like may be joined at an angle to the movable member 32 on which the image sensor 31 is mounted.

[0093] In this case, in the finally manufactured camera module 1, the movable member 32 will be tilted relative to the fixed member 21, as shown in Fig. 21. Furthermore, the movable member 32 may also be tilted relative to the fixed member 21 during the sensor shift operation of the camera module 1.

[0094] To address this, it was necessary to ensure an air gap of a certain width below the movable member 32. Specifically, while the displacement due to tilt is small near the center of the movable member 32, the displacement due to tilt increases toward the outer edge of the movable member 32. Therefore, it was necessary to ensure an air gap that would prevent the outer edge of the movable member 32 from coming into contact with the fixed member 21 when the movable member 32 was at its maximum tilt. Therefore, it was not easy to increase the heat dissipation effect by narrowing the air gap.

[0095] FIG. 22 is a cross-sectional view showing an example of the configuration of the camera module 1 according to the fifth embodiment.

[0096] 22, the movable member 32 is also tilted relative to the fixed member 21. In the camera module 1 of FIG. 22, a fixed member 521 is provided instead of the fixed member 21 in the configuration of the camera module 1 of FIG. 3, etc.

[0097] The fixed member 521 is basically configured in the same way as the fixed member 21, but the surface facing the movable member 32 (the surface on the movable member 32 side) is inclined so that the distance from the movable member 32 increases toward the outer edge. In other words, the surface of the fixed member 521 facing the movable member 32 is formed into a cone shape with its apex at approximately the center. The angle of inclination of the surface of the fixed member 521 facing the movable member 32 is determined based on the maximum amount of inclination of the movable member 32.

[0098] According to the above configuration, when the movable member 32 is tilted to the maximum extent, it is possible to ensure a minimum distance at which the outer edge of the movable member 32 does not come into contact with the fixed member 21. As a result, it is possible to narrow the air gap between the fixed member 21 and the movable member 32, thereby improving the heat dissipation effect.

[0099] <8. Variations> In the following, a modified example of the camera module 1 in which a bump is provided in the gap between the fixed member 21 and the movable member 32 will be described.

[0100] (First Modification) FIG. 23 is a cross-sectional view showing a first modified example of the camera module 1 having bumps.

[0101] In the camera module 1 of FIG. 23, instead of the plurality of bumps 100 in the configuration of the camera module 1 of FIG.

[0102] The bumps 100g are formed so that they are higher the closer to the center of the movable member 32 (and lower the farther from the center of the movable member 32). In the example of Fig. 23, the bumps 100g are fixed to the fixed member 21, while only the bumps 100g close to the center of the movable member 32 are provided so as to come into contact with the movable member 32.

[0103] 22, the amount of change in height of the bump 100g from the center of the movable member 32 is determined based on the maximum amount of tilt of the movable member 32. In other words, the bump 100g is provided so that the bump 100g farthest from the center of the movable member 32 comes into contact with the outer edge of the movable member 32 when the movable member 32 is tilted to the maximum.

[0104] According to the above configuration, even when the movable member 32 is tilted to the maximum extent, it is possible to avoid applying a load to the outer edge of the movable member 32 and to achieve better heat dissipation.

[0105] (Second Modification) In the above, the bumps provided in the gap between the fixed member 21 and the movable member 32 are fixed to the fixed member 21, but they may be fixed to either the fixed member 21 or the movable member 32 and provided so as to be in contact with the other. In other words, the heat dissipation member in the camera module 1 to which the technology according to the present disclosure is applied may be a thermal conductor that is fixed to either the first member (first substrate) or the second member (second substrate) and provided so as to be in contact with the other.

[0106] FIG. 24 is a cross-sectional view showing a second modified example of the camera module 1 having bumps.

[0107] In the camera module 1 of FIG. 24, instead of the plurality of bumps 100 in the configuration of the camera module 1 of FIG. 3, a plurality of bumps 600 are provided in the gap between the fixed member 21 and the movable member 32.

[0108] The bump 600 is fixed to the movable member 32 and is provided so as to come into point contact with the fixed member 21 .

[0109] According to the above configuration, heat transferred from the image sensor 31 to the movable member 32 can be transferred to the fixed member 21 via the bumps 600, thereby realizing better heat dissipation.

[0110] Furthermore, since the contact between the fixing member 21 and the bump 600 is point contact, friction between the fixing member 21 and the bump 600 can be reduced, and an increase in the drive torque of the actuator mechanism 40 can be suppressed.

[0111] (Third Modification) FIG. 25 is a cross-sectional view showing a third modified example of the camera module 1 having bumps.

[0112] In the camera module 1 of FIG. 25, the bumps 100 in the configuration of the camera module 1 of FIG. 3 and the bumps 600 in the configuration of the camera module 1 of FIG. 24 are mixed and provided in the gap between the fixed member 21 and the movable member 32.

[0113] According to the above configuration, heat transferred from the image sensor 31 to the movable member 32 can be transferred to the fixed member 21 via the bumps 100 and 600, thereby achieving better heat dissipation.

[0114] Furthermore, since the contact between the movable member 32 and the bump 100, and between the fixed member 21 and the bump 600 is point contact, friction between the movable member 32 and the bump 100, and between the fixed member 21 and the bump 600 can be reduced, making it possible to suppress an increase in the driving torque of the actuator mechanism unit 40.

[0115] The material, shape, and arrangement of the bumps (bumps 100g, 600, 100) in the above-described modified examples can be any of the material, shape, and arrangement of the bumps in the camera module 1 of the first embodiment.

[0116] <9. Configuration of electronic devices> FIG. 26 is a block diagram showing an example configuration of an electronic device to which the technology according to the present disclosure is applied.

[0117] 26 includes a camera module 1002 and a DSP (Digital Signal Processor) circuit 1003, which is an image signal processing circuit. The electronic device 1000 also includes a frame memory 1004, a display unit 1005, a recording unit 1006, an operation unit 1007, and a power supply unit 1008. The DSP circuit 1003, the frame memory 1004, the display unit 1005, the recording unit 1006, the operation unit 1007, and the power supply unit 1008 are connected to each other via a bus line 1009.

[0118] An image sensor 1001 in a camera module 1002 captures incident light (image light) from a subject, converts the amount of incident light imaged on an imaging surface into an electrical signal on a pixel-by-pixel basis, and outputs the signal as a pixel signal. The camera module 1 described above is used as the camera module 1002, and the image sensor 1001 corresponds to the image sensor 31 described above.

[0119] The display unit 1005 is formed of a panel display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and displays moving images or still images captured by the image sensor 1001. The recording unit 1006 records the moving images or still images captured by the image sensor 1001 on a recording medium such as a hard disk or semiconductor memory.

[0120] An operation unit 1007, under the operation of a user, issues operation commands for various functions of the electronic device 1000. A power supply unit 1008 appropriately supplies various types of power to the DSP circuit 1003, frame memory 1004, display unit 1005, recording unit 1006, and operation unit 1007 as operating power sources to these devices.

[0121] As described above, better heat dissipation can be achieved by using the above-described camera module 1 as the camera module 1002. Therefore, better heat dissipation can also be achieved in electronic devices 1000 such as smartphones, tablet terminals, and portable PCs.

[0122] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0123] Furthermore, the embodiments to which the technology disclosed herein is applied are not limited to the above-described embodiments, and various modifications are possible within the scope that does not deviate from the gist of the technology disclosed herein.

[0124] Furthermore, the present disclosure can be configured as follows. (1) An image sensor; a movable member having the image sensor mounted on a surface thereof and movable in a direction along an imaging surface of the image sensor; a fixed member fixed to the rear surface of the movable member with a predetermined gap therebetween; In the gap, one or more heat dissipation members are fixed to at least one of the fixed member and the movable member and are provided so as to be in contact with the other. A camera module comprising: (2) The heat dissipation member is formed of a bump. The camera module according to (1). (3) The bumps are made of a material with a higher thermal conductivity than air. The camera module according to (2). (4) The bumps are formed of a material containing at least one of Au, Ag, Cu, Ni, and solder, or are formed by processing the upper surface of the fixing member to form protrusions. (3) The camera module according to (3). (5) The heat dissipation member is fixed to the fixed member and is provided so as to be in point contact with the movable member. A camera module according to any one of (1) to (4). (6) a heat dissipation material having thermal conductivity provided on a rear surface of the movable member; The heat dissipation member is provided so as to be in point contact with the heat dissipation material. (5) The camera module according to (5). (7) Further comprising a low-friction material provided on a rear surface of the movable member, The heat dissipation member is provided so as to be in point contact with the low friction material. (5) The camera module according to (5). (8) The heat dissipation member is fixed to the fixing member. A camera module according to any one of (5) to (7). (9) The heat dissipation member is formed in a spherical shape and fitted into a groove formed in the fixing member. A camera module according to any one of (5) to (7). (10) The plurality of heat dissipation members are arranged in a lattice pattern. A camera module according to any one of (1) to (9). (11) The plurality of heat dissipation members are arranged in a staggered pattern. A camera module according to any one of (1) to (9). (12) The plurality of heat dissipation members are arranged radially with the center of the image sensor as a reference. A camera module according to any one of (1) to (9). (13) The heat dissipation members are arranged at a higher density as they approach the center of the image sensor. A camera module according to any one of (1) to (9). (14) The heat dissipation members are formed to have a larger size as they approach the center of the image sensor. A camera module according to any one of (1) to (9). (15) The movable member further includes a plurality of vias formed to penetrate from the front surface to the rear surface thereof, The plurality of heat dissipation members are disposed at positions corresponding to the plurality of vias. A camera module according to any one of (1) to (14). (16) The via is formed in a portion of the movable member where the image sensor is mounted. The camera module according to (15). (17) The heat dissipation member is fixed to the movable member and is provided so as to be in point contact with the fixed member. A camera module according to any one of (1) to (4), (10) to (16). (18) The heat dissipation members include a first heat dissipation member fixed to the fixed member and provided so as to be in point contact with the movable member, and a second heat dissipation member fixed to the movable member and provided so as to be in point contact with the fixed member. A camera module according to any one of (1) to (4), (10) to (16). (19) the movable member is formed by a printed circuit board, The fixing member is formed of a stiffener or the printed circuit board. A camera module according to any one of (1) to (18). (20) The movable member is supported by an actuator mechanism so as to be movable in a direction along the imaging surface. A camera module according to any one of (1) to (19). (twenty one) An image sensor; a movable member on whose front surface the image sensor is mounted and which is movable in a direction along the imaging surface of the image sensor; a fixed member fixed to the movable member on the rear surface side thereof with a predetermined gap therebetween; a camera module having one or more heat dissipation members fixed to at least one of the fixed member and the movable member in the gap and provided so as to be in contact with the other; An electronic device comprising:

[0125] The present disclosure can also be configured as follows. (1) An image sensor; a movable member on whose front surface the image sensor is mounted and which is movable in a direction along the imaging surface of the image sensor; a fixed member fixed to the movable member on the rear surface side thereof with a predetermined gap therebetween; a plurality of vias formed through the movable member from the front surface to the rear surface; A camera module comprising: (2) The movable member further includes a heat dissipation layer having thermal conductivity formed on the surface thereof. The camera module according to (1). (3) The movable member further includes a heat dissipation material having thermal conductivity provided on the rear surface of the movable member. The camera module according to (2). (4) An image sensor; a movable member on whose front surface the image sensor is mounted and which is movable in a direction along the imaging surface of the image sensor; a fixed member fixed to the movable member on the rear side thereof with a predetermined gap therebetween; Equipped with The surface of the fixed member facing the movable member has an inclination such that the distance from the movable member increases toward the outer edge. Camera module. [Explanation of symbols]

[0126] 1 camera module, 11 housing, 21 fixed member, 31 image sensor, 32 movable member, 40 actuator mechanism, 51 chip fixing member, 100, 100a to 100g bump, 111 heat dissipation material, 112 low-friction material, 131 groove, 200 gel material, 300 via, 310 heat dissipation layer, 400 heat dissipation fin, 521 fixing member, 600 bump

Claims

1. An image sensor; a movable member having the image sensor mounted on a surface thereof and movable in a direction along an imaging surface of the image sensor; a fixed member fixed to the rear surface of the movable member with a predetermined gap therebetween; one or more heat dissipation members fixed to at least one of the fixed member and the movable member in the gap and provided so as to be in contact with the other; Equipped with The plurality of heat dissipation members are arranged radially from the center of the image sensor, or are arranged with a higher density closer to the center of the image sensor, or are formed in a larger size closer to the center of the image sensor. Camera module.

2. The heat dissipation member is formed of a bump. The camera module of claim 1 .

3. The bumps are made of a material with a higher thermal conductivity than air. The camera module according to claim 2 .

4. The bumps are formed of a material containing at least one of Au, Ag, Cu, Ni, and solder, or are formed by processing the upper surface of the fixing member to form protrusions. The camera module according to claim 3 .

5. The heat dissipation member is fixed to the fixed member and is provided so as to be in point contact with the movable member. The camera module of claim 1 .

6. a heat dissipation material having thermal conductivity provided on a rear surface of the movable member; The heat dissipation member is provided so as to be in point contact with the heat dissipation material. The camera module according to claim 5 .

7. Further comprising a low-friction material provided on a rear surface of the movable member, The heat dissipation member is provided so as to be in point contact with the low friction material. The camera module according to claim 5 .

8. The heat dissipation member is fixed to the fixing member. The camera module according to claim 5 .

9. The heat dissipation member is formed in a spherical shape and fitted into a groove formed in the fixing member. The camera module according to claim 5 .

10. The plurality of heat dissipation members are arranged in a lattice pattern. The camera module of claim 1 .

11. The plurality of heat dissipation members are arranged in a staggered pattern. The camera module of claim 1 .

12. An image sensor; a movable member having the image sensor mounted on a surface thereof and movable in a direction along an imaging surface of the image sensor; a fixed member fixed to the rear surface of the movable member with a predetermined gap therebetween; one or more heat dissipation members fixed to at least one of the fixed member and the movable member in the gap and provided so as to be in contact with the other; a plurality of vias formed through the movable member from the front surface to the rear surface; Equipped with The plurality of heat dissipation members are disposed at positions corresponding to the plurality of vias. Camera module.

13. The via is formed in a portion of the movable member where the image sensor is mounted. The camera module of claim 12.

14. The heat dissipation member is fixed to the movable member and is provided so as to be in point contact with the fixed member.

13. The camera module according to claim 1 or 12.

15. The heat dissipation members include a first heat dissipation member fixed to the fixed member and provided so as to be in point contact with the movable member, and a second heat dissipation member fixed to the movable member and provided so as to be in point contact with the fixed member.

13. The camera module according to claim 1 or 12.

16. the movable member is formed by a printed circuit board, The fixing member is formed of a stiffener or the printed circuit board.

13. The camera module according to claim 1 or 12.

17. An image sensor; a movable member on whose front surface the image sensor is mounted and which is movable in a direction along the imaging surface of the image sensor; a fixed member fixed to the movable member on the rear surface side thereof with a predetermined gap therebetween; the gap includes one or more heat dissipation members fixed to at least one of the fixed member and the movable member and provided in contact with the other; The plurality of heat dissipation members are arranged radially from the center of the image sensor, or are arranged with a higher density as they approach the center of the image sensor, or are formed in a larger size as they approach the center of the image sensor. An electronic device comprising:

Images