Imaging devices and electronic devices

Abstract

An imaging device and an electronic device are provided, and the imaging device disclosed includes a support circuit board (100), an outer frame base (200), an inner frame base (300), a photosensitive chip (400), a lens bracket (500), a lens (600), and a first driving mechanism (700), in which the outer frame base (200) is mounted on the support circuit board (100), the lens bracket (500) is mounted on the outer frame base (200), the lens (600) is mounted on the lens bracket (500), and the support circuit board (100) is, in turn, mounted on the outer frame base (200). ) and the inner frame base (300), which is movably mounted on the outer frame base (200), the photosensitive chip (400) is mounted on the inner frame base (300), and the photosensitive chip (400) is installed opposite the lens (600). The first driving mechanism (700) is used to drive the inner frame base (300) to move, and the photosensitive chip (400) can perform anti-shake movement together with the inner frame base (300) within a plane perpendicular to the optical axis of the lens (600).

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority from Chinese Patent Application No. 202110405573.2 filed in China on April 15, 2021, the entire contents of which are incorporated herein by reference.

[0002] The present application belongs to the field of communication equipment technology, and more particularly to imaging devices and electronic equipment. [Background technology]

[0003] As user demands increase, the performance of electronic devices continues to be optimized. The development of imaging devices installed in electronic devices is particularly rapid. The imaging devices disclosed in the related art employ image stabilization technology to prevent camera shake during shooting, ultimately improving image quality. As the weight of the lens increases, achieving image stabilization by driving the lens movement poses a problem of relatively high power consumption. However, because the photosensitive chip is electrically connected via a flexible circuit board, when the photosensitive chip is driven to move, it is dragged by the flexible circuit board, further affecting the image stabilization effect. Summary of the Invention [Problem to be solved by the invention]

[0004] The purpose of the embodiments of the present application is to provide an imaging device and electronic equipment that can solve the problem that when the movement of the photosensitive chip is driven, it is dragged by the flexible circuit board, which further affects the anti-shake effect. [Means for solving the problem]

[0005] In order to solve the above technical problems, the present application is realized as follows.

[0006] According to a first aspect, an embodiment of the present application provides an imaging device, and the disclosed imaging device includes a supporting circuit board, an outer frame base, an inner frame base, a photosensitive chip, a lens bracket, a lens, and a first driving mechanism, wherein: the outer frame base is mounted on the supporting circuit board, the lens bracket is mounted on the outer frame base, the lens is mounted on the lens bracket, and the supporting circuit board is electrically connected to the photosensitive chip via the outer frame base and the inner frame base in order; The inner frame base is movably mounted on the outer frame base, the photosensitive chip is mounted on the inner frame base, and the photosensitive chip is installed opposite the lens, the first driving mechanism is used to drive the inner frame base to move, and the photosensitive chip can perform anti-shake movement together with the inner frame base in a plane perpendicular to the optical axis of the lens.

[0007] According to a second aspect, an embodiment of the present application provides an electronic device, the disclosed electronic device including any of the imaging devices described above. [Effects of the Invention]

[0008] The technical methods adopted in the embodiments of the present application can achieve the following beneficial effects:

[0009] The imaging device disclosed in the embodiments of this application improves the structure of imaging devices in the related art by installing a photosensitive chip on an inner frame base, installing the inner frame base on an outer frame base, installing the outer frame base on a support circuit board, installing a lens bracket on the outer frame base, installing a lens on the lens bracket, and movably installing the inner frame base on the outer frame base. The photosensitive chip is electrically connected to the support circuit board through the inner frame base and the outer frame base, so that the lens, lens bracket, photosensitive chip, inner frame base and outer frame base are sequentially installed on the support circuit board. The inner frame base can move the photosensitive chip by driving a first driving mechanism, and is used to realize the anti-shake movement of the imaging device. This prevents the photosensitive chip from being dragged by the support circuit board when performing the anti-shake movement, and further solves the problem in the background art that the photosensitive chip is dragged by the flexible circuit board when driving the movement of the photosensitive chip. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic exploded view of an imaging device disclosed in an embodiment of the present application. [Figure 2] 1 is a cross-sectional view of an imaging device disclosed in an embodiment of the present application. [Figure 3] 1 is a schematic diagram of the overall structure of an imaging device disclosed in an embodiment of the present application; [Figure 4] 1 is a structural schematic diagram of an imaging device disclosed in an embodiment of the present application; [Figure 5] 1 is a schematic exploded view of an imaging device disclosed in an embodiment of the present application. [Figure 6] 1 is a structural schematic diagram of a part of an imaging device disclosed in an embodiment of the present application; [Figure 7] FIG. 2 is a schematic plan view of a first driving mechanism of the imaging device disclosed in the embodiment of the present application. [Figure 8] FIG. 2 is a schematic perspective view of a first driving mechanism of the imaging device disclosed in the embodiment of the present application. [Figure 9] 1 is a structural schematic diagram of a photosensitive chip of an imaging device disclosed in an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0011] The following clearly and completely describes the technical solutions in the embodiments of the present application, in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without any creative effort fall within the scope of protection of the present application.

[0012] The terms "first," "second," etc. in the specification and claims of this application are intended to distinguish between similar objects and are not intended to describe a particular order or sequence. It should be understood that such terms are interchangeable where appropriate, so that embodiments of this application may be performed in orders other than those illustrated or described herein, and that objects distinguished by "first," "second," etc. are generally of the same type and do not limit the number of objects; for example, a first object may be one or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the related objects.

[0013] Hereinafter, the imaging device and electronic device according to the embodiments of the present application will be described in detail with reference to specific examples and application scenarios in conjunction with the drawings.

[0014] As shown in Figures 1 to 9, the embodiments of the present application disclose an imaging device and electronic equipment, and the disclosed imaging device includes a support circuit board 100, an outer frame base 200, an inner frame base 300, a photosensitive chip 400, a lens bracket 500, a lens 600, and a first driving mechanism 700.

[0015] The support circuit board 100 can supply power to the power consumption structure in the imaging device and can also provide support for the structure installed on it, and the inner frame base 300 and the outer frame base 200 can support the photosensitive chip 400, lens bracket 500, lens 600 and first driving mechanism 700 and can realize electrical connection between the support circuit board 100 and the photosensitive chip 400.

[0016] The frame base 200 is mounted on the support circuit board 100, and the frame base 200 and the support circuit board 100 may be connected by a conductive adhesive layer A. The conductive particles in the conductive adhesive layer A may connect the frame base 200 and the support circuit board 100 and also provide electrical conductivity between them. Of course, the frame base 200 may be electrically connected to the support circuit board 100 in other ways. For example, the frame base 200 and the support circuit board 100 may be electrically connected by a conductive coating, welding material, etc.

[0017] The lens bracket 500 is mounted on the outer frame base 200, and the lens 600 is mounted on the lens bracket 500. That is, the lens 600, the lens bracket 500 and the outer frame base 200 are sequentially mounted on the support circuit board 100. The support circuit board 100 is electrically connected to the photosensitive chip 400 via the outer frame base 200 and the inner frame base 300, respectively. The outer frame base 200 and the inner frame base 300 can transmit the electrical energy on the support circuit board 100 to the photosensitive chip 400, thereby realizing the function of the photosensitive chip 400.

[0018] The inner frame base 300 is movably mounted on the outer frame base 200, and the photosensitive chip 400 is mounted on the inner frame base 300. The photosensitive chip 400 and the supporting circuit board 100 are separated by the inner frame base 300 and the outer frame base 200, allowing the photosensitive chip 400 to move relative to the supporting circuit board 100 without being dragged by the inner frame base 300. The photosensitive chip 400 is positioned opposite the lens 600, which is advantageous for electronic devices to capture high-quality images through the lens 600. The first driving mechanism 700 is used to drive the inner frame base 300, allowing the photosensitive chip 400 to perform anti-shake movement together with the inner frame base 300 in a plane perpendicular to the optical axis of the lens 600. This installation method of the photosensitive chip 400 separates the photosensitive chip 400 from the supporting circuit board 100 by the inner frame base 300 and the outer frame base 200, so that the photosensitive chip 400 can be electrically connected to the supporting circuit board 100 but is not interlocked with it, thereby avoiding the photosensitive chip 400 being affected by the supporting circuit board 100 when it is driven to move to prevent camera shake.

[0019] The imaging device disclosed in the embodiments of the present application improves the structure of imaging devices in the related art, and installs a photosensitive chip 400 on an inner frame base 300, which is installed on an outer frame base 200, which is installed on a support circuit board 100, a lens bracket 500 on the outer frame base 200, a lens 600 on the lens bracket 500, and the inner frame base 300 is movably installed on the outer frame base 200. The photosensitive chip 400 is electrically connected to the support circuit board 100 via the inner frame base 300 and the outer frame base 200, thereby forming a lens 600, lens bracket 500, photosensitive chip 400, inner frame base 300 and outer frame base 200 are sequentially mounted on the support circuit board 100, and the inner frame base 300 can move the photosensitive chip 400 by driving the first driving mechanism 700, which is used to realize the anti-shake movement of the imaging device. This prevents the photosensitive chip 400 from being dragged by the support circuit board 100 when performing the anti-shake movement, and further solves the problem in the background art that the photosensitive chip is dragged by the flexible circuit board when the movement of the photosensitive chip is driven.

[0020] In the imaging device disclosed in the embodiments of the present application, the support circuit board 100, outer frame base 200, lens bracket 500, and lens 600 may be enclosed to form a sealed space, and the inner frame base 300 and photosensitive chip 400 are disposed within the sealed space. In this case, the sealed space forms a protective structure for the inner frame base 300 and the photosensitive chip 400, and such a sealed space can prevent foreign matter such as water and dust from entering, thereby providing a relatively good dustproof and waterproof performance and further preventing other foreign matter from entering and falling onto the photosensitive chip 400, which could affect shooting.

[0021] In the imaging device disclosed in the embodiments of the present application, the imaging device further includes an adjustable lens module (T-lens lens module) 800. The adjustable lens module 800 may include a zoom region disposed opposite the lens 600. The adjustable lens module 800 is electrically connected to the support circuit board 100, so that the zoom region can cooperate with the lens 600 to realize the zoom function of the imaging device. This allows the imaging device to capture images with relatively high quality even when the distance between the imaging device and the subject changes. In the embodiments of the present application, the T-lens lens module 800 can change the thickness of the zoom region when powered on, thereby achieving the purpose of zooming, and enabling the imaging device to achieve zoom without the need for a zoom motor. This not only avoids the volume and cost issues associated with installing a zoom motor, but also reduces the weight of the entire imaging device, which is advantageous for the development of thinner electronic devices when the imaging device is installed in an electronic device.

[0022] In a further technical solution, the imaging device may further include a protective cover case 1000, which can protect the internal structure of the imaging device. The protective cover case 1000 is attached to the outer frame base 200, and has an escape hole 1000a formed therein. The lens 600 and the lens bracket 500 are positioned within the protective cover case 1000. The adjustable lens module 800 is attached to the protective cover case 1000 and covers the escape hole 1000a. The lens 600 and the escape hole 1000a are positioned opposite each other. When the internal structure of the imaging device is protected by the protective cover case 1000, the lens 600 can be positioned opposite the adjustable lens module 800 through the escape hole 1000a, thereby realizing the focus-adjustable shooting function of the imaging device.

[0023] In a more specific solution, the first driving mechanism 700 may be a first electromagnetic driving mechanism, and the protective cover case 1000 may be an electromagnetic shielding cover case. The protective cover case 1000 is arranged to cover the first driving mechanism 700, so that the protective cover case 1000 can protect the first driving mechanism 700 and also act as a shield for the first driving mechanism 700. This can prevent electromagnetic interference with the first driving mechanism 700 due to magnetic fields in the external environment, and the first driving mechanism 700 can stably and accurately drive the inner frame base 300.

[0024] In the imaging device disclosed in the embodiments of the present application, the photosensitive chip 400 can be welded to the inner frame base 300 via solder balls 410 arranged in rows, and the photosensitive chip 400 can be electrically connected to the inner frame base 300 via the solder balls 410, and / or the inner frame base 300 and the outer frame base 200 can be electrically connected via gold wires B arranged in rows. In this case, the photosensitive chip 400 is fixedly connected to the inner frame base 300 via the solder balls 410, and the solder balls 410 can serve to fix the photosensitive chip 400 when electrically connecting the photosensitive chip 400 and the inner frame base 300. However, the inner frame base 300 can be electrically connected to the outer frame base 200 via the gold wires B, thereby realizing electrical connection between the inner frame base 300 and the outer frame base 200 and enabling relative rotation between them.

[0025] In the imaging device disclosed in the embodiments of the present application, the imaging device may further include a filter 900 mounted on the inner frame base 300, which covers the photosensitive chip 400. In this case, the filter 900 can be connected to the photosensitive chip 400 via a connecting adhesive layer C. The filter 900 can be fixed to the photosensitive chip 400, and when the imaging device takes a picture, ambient light in the outside world can be first filtered by the filter 900. The filter filters out stray light in the ambient light, thereby preventing the stray light in the ambient light from entering the photosensitive chip 400 and affecting the imaging effect of the imaging device. Furthermore, the filter 900 is integrated into the inner frame base 300 and covers the photosensitive chip 400, which not only provides protection for the photosensitive chip 400 but also facilitates more compact assembly, facilitates module formation, and enables the entire device to be attached and detached.

[0026] In the imaging device disclosed in the embodiments of the present application, the first driving mechanism 700 may include a first driving sub-mechanism 710, and the first driving sub-mechanism 710 includes a first electromagnetic coil 711 and a first permanent magnet 712, the first electromagnetic coil 711 is provided on the outer frame base 200 and is electrically connected to the outer frame base 200, the first permanent magnet 712 is provided on the inner frame base 300, the first driving sub-mechanism 710 drives the inner frame base 300 to move along a first direction relative to the outer frame base 200, and the first driving mechanism 700 The second drive sub-mechanism 720 further includes a second electromagnetic coil 721 and a second permanent magnet 722, the second electromagnetic coil 721 is provided on the outer frame base 200 and is electrically connected to the outer frame base 200, the second permanent magnet 722 is provided on the inner frame base 300, the second drive sub-mechanism 720 drives the inner frame base 300 to move along a second direction relative to the outer frame base 200, the first direction intersects with the second direction, and the surface determined by the intersection of the first direction with the second direction is a plane.

[0027] In the above case, when the first electromagnetic coil 711 electrically connected to the outer frame base 200 is energized, it generates a driving force on the first permanent magnet 712, causing the inner frame base 300, on which the first permanent magnet 712 is mounted, to move in a first direction by driving the first electromagnetic coil 711. Similarly, when the second electromagnetic coil 721 electrically connected to the outer frame base 200 is energized, it generates a driving force on the second permanent magnet 722, causing the inner frame base 300, on which the second permanent magnet 722 is mounted, to move in a second direction by driving the second electromagnetic coil 721. As a result, the first driving mechanism 700 can drive the inner frame base 300 using the first driving sub-mechanism 710 and the second driving sub-mechanism 720, and can drive the inner frame base 300 to move in the first and second directions. As a result, the inner frame base 300 can move the photosensitive chip 400 in a plane where the first and second directions intersect to prevent camera shake. In this way, it is possible to realize multi-directional camera shake prevention, and further improve the camera shake prevention performance of the imaging device.

[0028] In a further technical solution, a first set of rolling elements 1100 may be provided between the inner frame base 300 and the outer frame base 200, and the inner frame base 300 moves in a first direction via the first set of rolling elements 1100; a second set of rolling elements 1200 may be further provided between the inner frame base 300 and the supporting circuit board 100, and the inner frame base 300 moves in a second direction via the second set of rolling elements 1200. In this case, the first set of rolling elements 1100 can help the inner frame base 300 move in the first direction, while the second set of rolling elements 1200 can help the inner frame base 300 move in the second direction. As a result, when the inner frame base 300 moves in the first direction and the second direction, the first set of rolling elements 1100 and the second set of rolling elements 1200 can reduce the friction force between the inner frame base 300 and the outer frame base 200, making it easier for the first driving mechanism 700 to drive the inner frame base 300.

[0029] In the imaging device disclosed in the embodiments of the present application, the imaging device may further include an elevator mechanism 1300 provided within the accommodation space, the inner frame base 300 being connected to the elevator mechanism 1300, which drives the inner frame base 300 to move the photosensitive chip 400 along the optical axis direction. In this case, the photosensitive chip 400 is moved by the inner frame base 300 through the driving of the elevator mechanism 1300, and can move along the optical axis direction, thereby preventing camera shake in the optical axis direction of the imaging device.

[0030] In a more specific embodiment, the lifting mechanism 1300 may include a support 1310 and a second driving mechanism 1320. The second driving mechanism 1320 is used to drive the support 1310 to move along the optical axis. The inner frame base 300 is mounted on the support 1310, and the inner frame base 300 can move the photosensitive chip 400 together with the support 1310. The second driving mechanism 1320 is a second electromagnetic driving mechanism, which can drive the support 1310 to move along the optical axis. As a result, the inner frame base 300 mounted on the support 1310 is moved along the optical axis, ultimately realizing movement of the photosensitive chip 400 in the optical axis direction. Using an electromagnetic driving mechanism as the second driving mechanism 1320 simplifies the overall structure of the lifting mechanism 1300 and reduces the overall volume of the lifting mechanism 1300.

[0031] In a further optimized solution, a third set of rolling elements 1330 may be provided between the support 1310 and the frame base 200. The support 1310 may have a guide groove 1311 formed therein, and the third set of rolling elements 1330 may be provided in the guide groove 1311 and be able to roll relative to the guide groove 1311. Thus, when the second driving mechanism 1320 drives the support 1310 to move along the optical axis, the third set of rolling elements 1330 may reduce the frictional force between the frame base 200 and the support 1310. This makes it possible to advantageously drive the support part 1310 by the second driving mechanism 1320, and by installing the guide groove 1311, the third set of rolling bodies 1330 can be at least partially attached to the guide groove 1311, ensuring that the third set of rolling bodies 1330 can play a good role as a rolling guide, while at the same time reducing the size of the third set of rolling bodies 1330 in one direction in the imaging device.

[0032] Based on the above imaging device, an embodiment of the present application discloses an electronic device, which includes any one of the imaging devices described above.

[0033] The electronic devices disclosed in the embodiments of the present application may be devices such as smartphones, tablet computers, e-book readers, wearable devices (e.g., smart watches), electronic game consoles, etc., and the embodiments of the present application do not limit the specific types of electronic devices.

[0034] Although the embodiments of the present application have been described above in conjunction with the drawings, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not limiting. Those skilled in the art can take the teachings of the present application into account and implement many forms without departing from the spirit and scope of the claims, all of which fall within the scope of protection of the present application. [Explanation of symbols]

[0035] 100 Support circuit board 200 outer frame base 300 inner frame base 400 photosensitive chips 410 solder balls 500 lens bracket 600 lens 700 First Drive Mechanism 710 First drive sub-mechanism 711 First Electromagnetic Coil 712 First Permanent Magnet 720 Second drive sub-mechanism 721 Second Electromagnetic Coil 722 Second Permanent Magnet 800 Adjustable Lens Module 900 Filters 1000 Protective Cover Case 1000a Relief hole 1000b Escape Channel 1000c Electrical Connection Pin 1100 First set of rolling elements 1200 Second set of rolling elements 1300 Lifting mechanism 1310 Support part 1311 Guide groove 1320 Second Drive Mechanism 1321 Third Electromagnetic Coil 1322 Third Permanent Magnet 1330 Third set of rolling elements A Conductive adhesive layer B Gold wire C. Connecting adhesive layer

Claims

1. An imaging device including a support circuit board (100), an outer frame base (200), an inner frame base (300), a photosensitive chip (400), a lens bracket (500), a lens (600), and a first drive mechanism (700), The outer frame base (200) is mounted on the support circuit board (100), the lens bracket (500) is mounted on the outer frame base (200), the lens (600) is mounted on the lens bracket (500), and the support circuit board (100) is electrically connected to the photosensitive chip (400) via the outer frame base (200) and the inner frame base (300) in order; The inner frame base (300) is movably mounted on the outer frame base (200), the photosensitive chip (400) is mounted on the inner frame base (300), and the photosensitive chip (400) is installed opposite the lens (600), and the first driving mechanism (700) is used to drive the inner frame base (300) to move, and the photosensitive chip (400) can perform anti-shake movement together with the inner frame base (300) in a plane perpendicular to the optical axis of the lens (600); The imaging device further includes an elevator mechanism (1300) provided in the accommodation space, the inner frame base (300) is connected to the elevator mechanism (1300), and the elevator mechanism (1300) drives the inner frame base (300) to move the photosensitive chip (400) along the optical axis direction; An imaging device, wherein the lifting mechanism (1300) includes a support portion (1310) and a second driving mechanism (1320), the second driving mechanism (1320) is used to drive the support portion (1310) to move along the optical axis, the inner frame base (300) is provided on the support portion (1310), and the inner frame base (300) can move the photosensitive chip (400) together with the support portion (1310), and the second driving mechanism (1320) is a second electromagnetic driving mechanism.

2. 2. The imaging device of claim 1, wherein the support circuit board (100), the outer frame base (200), the lens bracket (500) and the lens (600) are enclosed to form a sealed space, and the inner frame base (300) and the photosensitive chip (400) are provided within the sealed space.

3. 2. The imaging device of claim 1, further comprising an adjustable lens module (800), the adjustable lens module (800) including a zoom region located opposite the lens (600), the adjustable lens module (800) being electrically connected to the support circuit board (100).

4. 4. The imaging device of claim 3, further comprising a protective cover case (1000) attached to the outer frame base (200), the protective cover case (1000) having an escape hole (1000a), the lens (600) and the lens bracket (500) being positioned within the protective cover case (1000), the adjustable lens module (800) being attached to the protective cover case (1000) and covering the escape hole (1000a), and the lens (600) being positioned opposite the escape hole (1000a).

5. 5. The imaging device of claim 4, wherein the first drive mechanism (700) is a first electromagnetic drive mechanism, the protective cover case (1000) is an electromagnetic shield cover case, and the protective cover case (1000) is arranged to cover the first drive mechanism (700).

6. 2. The imaging device of claim 1, wherein the photosensitive chip (400) is welded to the inner frame base (300) via solder balls (410) arranged in a row, and the photosensitive chip (400) is electrically connected to the inner frame base (300) via the solder balls (410), and / or the inner frame base (300) and the outer frame base (200) are electrically connected via gold wires (B) arranged in a row.

7. The imaging device of claim 1 , further comprising a filter (900) mounted on the inner frame base (300), the filter (900) covering the photosensitive chip (400).

8. The first drive mechanism (700) includes a first drive sub-mechanism (710), which includes a first electromagnetic coil (711) and a first permanent magnet (712), the first electromagnetic coil (711) is provided on the outer frame base (200) and is electrically connected to the outer frame base (200), the first permanent magnet (712) is provided on the inner frame base (300), and the first drive sub-mechanism (710) drives the inner frame base (300) to move along a first direction relative to the outer frame base (200); 2. The imaging device of claim 1, wherein the first drive mechanism (700) further includes a second drive sub-mechanism (720), the second drive sub-mechanism (720) including a second electromagnetic coil (721) and a second permanent magnet (722), the second electromagnetic coil (721) being provided on the outer frame base (200) and electrically connected to the outer frame base (200), the second permanent magnet (722) being provided on the inner frame base (300), the second drive sub-mechanism (720) driving the inner frame base (300) to move along a second direction relative to the outer frame base (200), the first direction intersecting with the second direction, and the surface determined by intersecting the first direction with the second direction being the plane.

9. An imaging device as described in claim 1, wherein a third set of rolling bodies (1330) is provided between the support portion (1310) and the outer frame base (200), a guide groove (1311) is opened in the support portion (1310), and the third set of rolling bodies (1330) is provided within the guide groove (1311) and can roll relative to the guide groove (1311).

10. An electronic device including an imaging device described in any one of claims 1 to 9.

Images