Wiring Module

Abstract

To provide a wiring module that can increase the connection reliability of an electric wire.SOLUTION: A wiring module 20 comprises: an electric wire 30 that includes a core wire 31; an electric wire relay member 80 that is connected with the core wire 31; a bus bar 40 that is connected with electrode terminals 11A, 11B; and a circuit board 50 that includes a conducting path 52 including a first rand 53 electrically connected with the bus bar 40 and a second rand 54 connected with the electric wire relay member 80. The second rand 54 includes a connection rand part 55, and a mounting rand part 56 that is arranged separate from the connection rand part 55. The electric wire relay member 80 includes a core wire connection part 81 that is connected with the core wire 31 and the connection rand part 55 by first solder S1, and a mounting part 83 that is connected with the mounting rand part 56 by second solder S2 different from the first solder S1.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a wiring module.

[0002] A battery pack used in an electric vehicle, a hybrid vehicle, or the like includes a plurality of unit cells, a plurality of bus bars connecting the electrodes of the unit cells, and a detection module (wiring module) electrically connected to the bus bars for detecting the voltage of each unit cell, etc. Such a wiring module includes, for example, a fuse unit that integrates bus bar connection terminals connected to the bus bars, electric wire connection terminals connected to the ends of electric wires, and fuses that connect the bus bar connection terminals and the electric wire connection terminals (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-115616 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above configuration, the fuse unit includes many components, such as busbar connection terminals, wire connection terminals, and a synthetic resin housing that houses the fuse, which increases the complexity of the configuration and raises concerns about increased manufacturing costs. To simplify the configuration of the wiring module and reduce costs, it is conceivable to prepare a circuit board that has conductive paths including lands for busbars and lands for wires and is mounted with necessary electronic components, and then connect the busbars and wires to the respective lands. However, if the wires are directly connected to the lands, there is a risk that the wires may lift off the lands during soldering, making it difficult to ensure connection strength. [Means for solving the problem]

[0005] The wiring module disclosed in this specification is a wiring module attached to a plurality of energy storage elements having electrode terminals, and includes: an electric wire having a core wire; a wire relay member connected to the core wire; a bus bar connected to the electrode terminal; and a circuit board having a conductive path including a first land electrically connected to the bus bar and a second land connected to the electric wire relay member, wherein the second land includes a connection land portion and a mounting land portion arranged spaced apart from the connection land portion, and the electric wire relay member includes a core wire connecting portion connected to the core wire and the connection land portion by a first solder, and a mounting portion connected to the mounting land portion by a second solder different from the first solder. [Effects of the Invention]

[0006] According to the wiring module disclosed in this specification, the connection reliability of the electric wires can be improved. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a partially enlarged plan view of the electricity storage module of the first embodiment. [Figure 2] FIG. 2 is a partially enlarged plan view showing the periphery of a circuit board in the line module of the first embodiment. [Figure 3] FIG. 3 is a partially enlarged perspective view showing the periphery of a circuit board in the line module of the first embodiment. [Figure 4] FIG. 4 is an enlarged exploded perspective view showing the board mounting portion, the circuit board, the bus bar relay member, and the electric wire relay member of the first embodiment. [Figure 5] FIG. 5 is a cross-sectional view taken along line AA in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line BB in FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line CC in FIG. [Figure 8] FIG. 8 is a partially enlarged perspective view showing a peripheral portion of a wire relay member in the wiring module of the second embodiment. [Figure 9]FIG. 9 is a plan view showing the circuit board and the wire relay member of the second embodiment. [Figure 10] FIG. 10 is an exploded perspective view showing the circuit board and the wire relay member of the second embodiment. [Figure 11] FIG. 11 is a cross-sectional view taken along line DD in FIG. [Figure 12] FIG. 11 is a cross-sectional view taken along line EE in FIG. [Figure 13] FIG. 13 is a partially enlarged perspective view showing a peripheral portion of a wire relay member in the wiring module of the third embodiment. [Figure 14] FIG. 14 is a plan view showing the circuit board and the wire relay member of the third embodiment. [Figure 15] FIG. 15 is an exploded perspective view showing the circuit board and the wire relay member of the third embodiment. [Figure 16] FIG. 16 is a cross-sectional view taken along the line FF in FIG. [Figure 17] FIG. 17 is a cross-sectional view taken along line GG in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] [Outline of the embodiment] (1) The wiring module disclosed in this specification is a wiring module attached to a plurality of energy storage elements having electrode terminals, and includes: an electric wire having a core wire; a wire relay member connected to the core wire; a bus bar connected to the electrode terminal; and a circuit board having a conductive path including a first land electrically connected to the bus bar and a second land connected to the electric wire relay member, wherein the second land includes a connection land portion and a mounting land portion spaced apart from the connection land portion, and the electric wire relay member includes a core wire connecting portion connected to the core wire and the connection land portion by a first solder and a mounting portion connected to the mounting land portion by a second solder different from the first solder.

[0009] According to the above configuration, connecting the core wire to the land via a wire relay member provides greater design freedom for increasing connection strength compared to connecting the core wire directly to the land, thereby improving the connection reliability of the wire. Furthermore, the second land connected to the wire relay member includes a connection land portion and a mounting land portion spaced apart from the connection land portion, and the wire relay member includes a core wire connecting portion connected to the core wire and the connection land portion by a first solder and a mounting portion connected to the mounting land portion by a second solder different from the first solder. This prevents the first solder and the second solder, which have different compositions, from mixing and adversely affecting the electrical connection, thereby improving the connection reliability of the wire.

[0010] (2) In the wiring module of (1) above, the mounting land portion may be disposed independently of the connection land portion, or the circuit board may include a resist that partially covers the second land portion, and the connection land portion and the mounting land portion may be separated by the resist.

[0011] (3) In the wiring module of (1) or (2), the wire relay member may include a partition wall extending from the core wire connecting portion and separating a space adjacent to the core wire connecting portion from the mounting land portion, and the first solder may be disposed within the space. This configuration reliably prevents the first solder and the second solder from mixing and adversely affecting the electrical connection.

[0012] [Details of the embodiment] Specific examples of the technology disclosed in this specification will be described below with reference to the drawings. Note that the present invention is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0013] <Embodiment 1> A first embodiment will be described with reference to Fig. 1 to Fig. 7. The energy storage module 1 of this embodiment is a power supply device used as a drive source for electric vehicles and hybrid vehicles, and includes a plurality of energy storage elements 10 and a wiring module 20 connected to the energy storage elements 10, as shown in Fig. 1.

[0014] [Electricity storage element 10] The energy storage elements 10 are, for example, secondary batteries. As shown in FIG. 1, each energy storage element 10 has a flat rectangular parallelepiped shape overall and includes two electrode terminals 11A, 11B arranged on one surface. One of the two electrode terminals 11A, 11B is a positive terminal 11A, and the other is a negative terminal 11B. The multiple energy storage elements 10 are arranged in a row. Two adjacent energy storage elements 10 are arranged so that the electrode terminals 11A, 11B of opposite polarities are adjacent to each other, that is, so that the positive terminal 11A of one energy storage element 10 and the negative terminal 11B of the adjacent energy storage element 10 are adjacent to each other.

[0015] [Wiring module 20] As shown in FIG. 1, the wiring module 20 includes a plurality of electric wires 30, a plurality of bus bars 40, a plurality of circuit boards 50, a plurality of rivets 60 that fix the circuit boards 50 to the bus bars 40, a plurality of bus bar relay members 70 that electrically connect the bus bars 40 to the circuit boards 50, a plurality of electric wire relay members 80 that electrically connect the circuit boards 50 to the electric wires 30, and a holding member 90 that holds these members.

[0016] [Wire 30] As shown in FIGS. 2 and 3 , the electric wire 30 includes a core wire 31 and an insulating coating 32 made of synthetic resin and surrounding the outer periphery of the core wire 31. The core wire 31 is, for example, a single-core wire made of metal and is electrically conductive. Examples of materials for the core wire 31 include copper, copper alloy, aluminum, and aluminum alloy. At one end of the electric wire 30, the insulating coating 32 is stripped to expose the core wire 31. The other end of the electric wire 30 is connected to an external ECU (Electronic Control Unit) via, for example, a connector. The ECU is equipped with a microcomputer, elements, and the like, and has a well-known configuration having functions for detecting the voltage, current, temperature, etc. of each energy storage element 10 and controlling the charging and discharging of each energy storage element 10.

[0017] [Busbar 40] The bus bar 40 is made of a metal and is electrically conductive. Examples of materials for the bus bar 40 include copper, a copper alloy, aluminum, an aluminum alloy, and stainless steel (SUS). As shown in Figs. 1 and 4, the bus bar 40 includes a bus bar main body 41 that connects the positive terminal 11A of one energy storage element 10 to the negative terminal 11B of another energy storage element 10 adjacent to this energy storage element 10, and a board mounting portion 42 that is continuous with the bus bar main body 41 and to which a circuit board 50 is fixed.

[0018] 1, the busbar body 41 includes a plate-shaped first electrode connection portion 41A that is placed on one of the electrode terminals 11A, 11B, a plate-shaped second electrode connection portion 41B that is placed on the other electrode terminal, and a connecting portion 41C that connects the first electrode connection portion 41A and the second electrode connection portion 41B. The first electrode connection portion 41A and the second electrode connection portion 41B are connected to the electrode terminals 11A, 11B, respectively, by, for example, laser welding.

[0019] As shown in FIG. 4 , the board placement portion 42 includes a board support portion 43 that is connected to the first electrode connection portion 41A and supports the circuit board 50, a wire holding portion 45 that is connected to the board support portion 43 and holds the wire 30, and a positioning protrusion 46 that extends from the board support portion 43 and positions the circuit board 50. The board placement portion 42 is plate-shaped and has a first fixing hole 44. The first fixing hole 44 is a through-hole for inserting a rivet 60. The wire holding portion 45 is U-shaped overall and is capable of receiving the wire 30 inside the U. The positioning protrusion 46 is a plate piece that extends perpendicular to the board support portion 43.

[0020] [Circuit board 50] As shown in FIGS. 2, 3, and 4, the circuit board 50 includes an insulating plate 51 and a conductive path 52 disposed on one surface of the insulating plate 51. The insulating plate 51 is a hard plate made of, for example, a glass cloth-based epoxy resin and has insulating properties. The conductive path 52 is made of, for example, a conductive metal such as copper or a copper alloy and is formed by printed wiring technology. The conductive path 52 includes a first land 53 connected to the bus bar 40 via a bus bar relay member 70, a second land 54 connected to the electric wire 30 via an electric wire relay member 80, and a main line 57 connecting the first land 53 and the second land 54.

[0021] 4, the second land 54 is composed of a connection land portion 55 and two mounting land portions 56 arranged on both sides of the connection land portion 55. The connection land portion 55 and the two mounting land portions 56 are arranged spaced apart from each other.

[0022] The connection land portion 55 has two side edges 55E1 adjacent to each of the two mounting lands 56, and two end edges 55E2 and 55E3 connecting the two side edges 55E1. The main line 57 is connected to one end edge 55E2 of the connection land portion 55, and the first land 53, the main line 57, and the connection land portion 55 form wiring that electrically connects the bus bar 40 and the electric wire 30. Most of the connection land portion 55, except for portions along the two end edges 55E2 and 55E3, is covered with resist R1. Portions of the connection land portion 55 along the two end edges 55E2 and 55E3 that are exposed from the resist R1 are two exposed portions 55A and 55B. A portion of the main line 57 adjacent to the exposed portion 55A is covered with resist R2.

[0023] The mounting land portion 56 is a land for fixing the electric wire relay member 80 to the circuit board 50, and is arranged independently of the connection land portion 55. The mounting land portion 56 is independent of the wiring that electrically connects the bus bar 40 and the electric wire 30, and is a land to which no voltage or signal is applied.

[0024] A chip fuse H is connected to the conductive path 52 between a first land 53 and a second land 54. The conductive path 52 has two third lands 58 midway along a main line 57, and two terminal portions of the chip fuse H are connected to these two third lands 58 by soldering. Most of the conductive path 52, excluding the first land 53, the second land 54, and the two third lands 58, is covered with an insulating film made of synthetic resin.

[0025] The insulating plate 51 has a second fixing hole 51H and a positioning recess 59. The second fixing hole 51H is a through hole for inserting a rivet 60. The positioning recess 59 is a recess recessed from the outer edge of the insulating plate 51 and is capable of receiving the positioning protrusion 46 therein. The circuit board 50 is positioned relative to the board support part 43 by accommodating the positioning protrusion 46 inside the positioning recess 59.

[0026] [Rivet 60] 5 , the rivet 60 is made of metal and includes a shank 61 that is inserted into the first fixing hole 44 and the second fixing hole 51H, and two heads 62A, 62B that are formed on both ends of the shank 61 and have outer diameters larger than the diameters of the first fixing hole 44 and the second fixing hole 51H. The circuit board 50 is arranged so as to overlap the board support part 43, the shank 61 is inserted into the first fixing hole 44 and the second fixing hole 51H, and the two heads 62A, 62B are arranged to sandwich the peripheral portion of the first fixing hole 44 in the board support part 43 and the peripheral portion of the second fixing hole 51H in the circuit board 50. In this way, the circuit board 50 is fixed to the board support part 43.

[0027] [Busbar relay member 70] 2 and 4, one end of the busbar relay member 70 is a busbar connection portion 71, and the other end is a land connection portion 72. The busbar connection portion 71 is connected to the busbar 40 by welding, for example. The land connection portion 72 is connected to the first land 53 by soldering.

[0028] [Electric wire relay member 80] The wire relay member 80 is made of a conductive metal and, as shown in FIGS. 4, 6, and 7, includes a core wire connecting portion 81 connected to the core wire 31 and the connection land portion 55, two partition walls 82, two mounting portions 83 connected to the two mounting lands 56, respectively, and two connecting portions 84 connecting the two partition walls 82 and the two mounting portions 83, respectively. The core wire connecting portion 81 is shaped like a rectangular plate. The two partition walls 82 extend from two side edges of the core wire connecting portion 81, respectively, and are arranged opposite each other. The connecting portion 84 is a J-shaped wall that extends in an arch shape from the extending end of the partition wall 82 and then extends parallel to the partition wall 82. The mounting portion 83 is shaped like a plate and extends outward (away from the core wire connecting portion 81) from the extending end of the connecting portion 84.

[0029] As shown in FIGS. 6 and 7 , the core wire 31 exposed from the insulating coating 32 at the end of the electric wire 30 is placed in the core wire connection portion 81, and this core wire 31 is connected to the core wire connection portion 81 by soldering. In the following description, the solder connecting the core wire 31 to the core wire connection portion 81 is referred to as a first solder S1. The first solder S1 is disposed in the electric wire relay member 80 in a space Sp surrounded by the core wire connection portion 81 and two partition walls 82, and the core wire 31 is embedded in the first solder S1. The first solder S1 is disposed between the two partition walls 82 with a certain thickness, and the core wire 31 is embedded in the first solder S1. This ensures that the core wire 31 is embedded in the first solder S1, and the entire circumference of the core wire 31 is covered with the first solder S1.

[0030] The wire relay member 80 is disposed on the second land 54 such that the core wire connecting portion 81 overlaps the connection land portion 55 and the two mounting portions 83 overlap each of the two mounting lands 56. The core wire connecting portion 81 is connected to the two exposed portions 55A, 55B of the connection land portion 55 by the first solder S1. The core wire 31 and the core wire connecting portion 81, and the core wire connecting portion 81 and the connection land portion 55 are connected by the first solder S1, respectively, thereby connecting the wire 30 to the conductive path 52 via the wire relay member 80. Furthermore, each of the two mounting portions 83 is connected to each of the two mounting lands 56 by soldering. In this way, the wire relay member 80 is fixed on the circuit board 50. The solder connecting the mounting portions 83 to the mounting lands 56 is a second solder S2 having a different composition from the first solder S1. Because the first solder S1 and the second solder S2 have different compositions, they are preferably not mixed with each other, i.e., not in contact with each other, to avoid a decrease in connection reliability. In this embodiment, the mounting land portion 56 is a land for fixing the wire relay member 80 to the circuit board 50, and is independent of the wiring in the conductive path 52 that electrically connects the bus bar 40 and the electric wire 30, and is not involved in the electrical connection between the core wire 31 and the bus bar 40. By arranging the mounting land portion 56 independently from the connection land portion 55, the first solder S1 and the second solder S2, which have different compositions, can be prevented from mixing with each other, which would adversely affect the electrical connection, and the wire relay member 80 can be firmly fixed to the circuit board 50.

[0031] Furthermore, the wire relay member 80 has two partition walls 82 oriented along two side edges 55E1 of the connection land portion 55 that face the two mounting lands 56. The space Sp in which the first solder S1 is arranged is separated by the partition walls 82 from the mounting land portion 56 to which the mounting portion 83 is connected by the second solder S2. This reliably prevents the first solder S1 and the second solder S2 from mixing together and adversely affecting the electrical connection.

[0032] [Holding member 90] The holding member 90 is made of synthetic resin and includes busbar holding portions 91 that hold the plurality of busbars 40, respectively, and an electric wire routing portion 92 in which the electric wires 30 are routed.

[0033] [Method of manufacturing the energy storage module 1] Next, an example of a method for manufacturing the electricity storage module 1 having the above configuration will be described.

[0034] First, the circuit board 50 is manufactured using printed wiring technology. Next, the second solder S2 is applied to the first land 53, the mounting land portion 56, and the third land 58 of the circuit board 50, and the land connection portion 72, the mounting portion 83, and the chip fuse H are connected to the first land 53, the mounting land portion 56, and the third land 58, respectively, by reflow soldering. At this time, the second solder S2 is not applied to the connection land portion 55, and the connection land portion 55 and the core wire connection portion 81 are not connected by the second solder S2.

[0035] Next, the circuit board 50, to which the wire relay members 80, busbar relay members 70, and chip fuses H are connected, is placed on the board support member 43. At this time, the positioning protrusions 46 are received inside the positioning recesses 59, thereby positioning the circuit board 50. In this state, the circuit board 50 is fixed to the board mounting member 42 by the rivet 60. Before being fixed, the rivet 60 does not have a head 62B. After the shank 61 is inserted through the first fixing hole 44 and the second fixing hole 51H, the tip of the shank 61 is crushed to form the head 62B. Next, the busbar connecting portion 71 is connected to the busbar 40 by welding. This electrically connects the busbar 40 and the first land 53 via the busbar relay member 70.

[0036] Next, the multiple bus bars 40 to which the circuit boards 50 are fixed are respectively set in the bus bar holding portions 91 of the holding member 90. Next, the electric wires 30 are routed in the electric wire routing portion 92 of the holding member 90, and the core wires 31 exposed at the terminal portions of the electric wires 30 are placed on the core wire connection portions 81. The portion of the electric wires 30 that is covered with the insulating coating 32 and adjacent to the exposed portion of the core wire 31 is inserted into and held inside the electric wire holding portion 45. In this state, the core wires 31 are connected to the core wire connection portions 81 with the first solder S1 using, for example, a robot soldering device, and the core wire connection portions 81 are connected to the connection land portions 55. In this manner, the manufacture of the wiring module 20 is completed.

[0037] Finally, the wiring module 20 is arranged on the plurality of energy storage elements 10, and each bus bar 40 and the electrode terminals 11A, 11B are connected by laser welding. In this manner, the manufacture of the energy storage module 1 is completed.

[0038] [Action and effect] As described above, according to this embodiment, the wiring module 20 includes the electric wire 30 having the core wire 31, the electric wire relay member 80 connected to the core wire 31, the bus bar 40 connected to the electrode terminals 11A, 11B, and the circuit board 50 having the conductive path 52 including the first land 53 electrically connected to the bus bar 40 and the second land 54 connected to the electric wire relay member 80, wherein the second land 54 includes a connection land portion 55 and a mounting land portion 56 arranged spaced apart from the connection land portion 55, and the electric wire relay member 80 includes a core wire connecting portion 81 connected to the core wire 31 and the connection land portion 55 by a first solder S1, and a mounting portion 83 connected to the mounting land portion 56 by a second solder S2 different from the first solder S1.

[0039] According to the above configuration, connecting the core wire 31 to the second land 54 via the wire relay member 80 provides greater design freedom for increasing connection strength compared to connecting the wire directly to the land, thereby improving the connection reliability of the wire 30. Furthermore, the second land 54 connected to the wire relay member 80 includes a connection land portion 55 and a mounting land portion 56 spaced apart from the connection land portion 55, and the wire relay member 80 includes a core wire connecting portion 81 connected to the core wire 31 and the connection land portion 55 by a first solder S1, and a mounting portion 83 connected to the mounting land portion 56 by a second solder S2 different from the first solder S1. This prevents the first solder S1 and the second solder S2, which have different compositions, from mixing and adversely affecting the electrical connection, thereby improving the connection reliability of the wire.

[0040] The wire relay member 80 is provided with a partition wall 82 that stands upright from the core wire connecting portion 81 and separates a space Sp that contacts the core wire connecting portion 81 from the mounting land portion 56, and the first solder S1 is disposed in the space Sp. This configuration reliably prevents the first solder S1 and the second solder S2 from mixing together and adversely affecting the electrical connection.

[0041] <Embodiment 2> Next, a second embodiment will be described with reference to Fig. 8 to Fig. 12. This embodiment differs from the first embodiment in the configuration of the second land 112 provided on the circuit board 110 and the configuration of the wire relay member 120. In this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0042] As shown in FIGS. 8, 9, and 10, the circuit board 110 includes an insulating plate 51 and a conductive path 111 arranged on one surface of the insulating plate 51. As shown in FIG. 10, the conductive path 111 includes a main line 57, a first land 53, and a second land 112. The second land 112 is composed of a connection land portion 55 and two mounting land portions 113 arranged on both sides of the connection land portion 55. The mounting land portion 113 is a land for fixing the wire relay member 120 to the circuit board 50, and is arranged independently of the connection land portion 55. The two mounting land portions 113 are rectangular and smaller than the connection land portion 55, and are arranged closer to one edge 55E3 of the connection land portion 55 than to the other edge 55E2.

[0043] The wire relay member 120 is made of a conductive metal, and as shown in Figures 10, 11 and 12, includes a core wire connection portion 81 connected to the core wire 31 and the connection land portion 55, two partition walls 121, two mounting portions 123 connected to the two mounting land portions 113 respectively, two connecting portions 122 connecting the two partition walls 121 and the two mounting portions 123 respectively, and top walls 124A, 124B extending from each of the two partition walls 121 and arranged opposite the core wire connection portion 81.

[0044] The two partition walls 121 extend from two side edges of the core wire connecting portion 81, respectively, and are arranged opposite each other. In each partition wall 121, the half adjacent to one end of the core wire connecting portion 81 is a high wall portion 121A, and the other half is a low wall portion 121B that is shorter than the high wall portion 121A. One top wall 124A extends from one of the two high wall portions 121A to the other, and the other top wall 124B extends from the other of the two high wall portions 121A to one of the two high wall portions 121A. The two top walls 124A, 124B overlap each other. Each of the two connecting portions 122 extends in an arch shape from each of the two low wall portions 121B and then forms a J shape extending parallel to the low wall portion 121B. The two mounting portions 123 extend outward (away from the core wire connecting portion 81) from the respective extending ends of the two connecting portions 122. The core wire connecting portion 81, the two high wall portions 121A, and the top walls 124A and 124B form a cylindrical portion 125 having a square cylindrical shape.

[0045] As shown in FIGS. 11 and 12 , the core wire 31 exposed from the insulating coating 32 at the end of the electric wire 30 is placed in the core wire connecting portion 81, and this core wire 31 is connected to the core wire connecting portion 81 by a first solder S1. The first solder S1 is disposed in a space Sp surrounded by the core wire connecting portion 81 and two partition walls 121 in the wire relay member 80, and the core wire 31 is embedded in the first solder S1. The first solder S1 is disposed between the two partition walls 121 with a certain thickness, and the core wire 31 is embedded in the first solder S1. This ensures that the core wire 31 is embedded in the first solder S1 and is covered all around with the first solder S1. In particular, the wire relay member 120 has a tubular portion 125, and the inside of this tubular portion 125 is filled with the first solder S1. This ensures that the core wire 31 is embedded in the first solder S1, and the entire periphery of the core wire 31 is covered with the first solder S1.

[0046] As shown in FIGS. 8, 11, and 12, the wire relay member 120 is disposed on the second land 112 such that the core wire connecting portion 81 is overlapped on the connection land portion 55 and each of the two mounting portions 123 is overlapped on each of the two mounting land portions 113. As shown in FIGS. 8 and 9, the wire relay member 120 is disposed with the tubular portion 125 facing the edge 55E2. As shown in FIG. 11, the core wire connecting portion 81 is connected to the two exposed portions 55A and 55B of the connection land portion 55 by the first solder S1. This electrically connects the core wire 31, the wire relay member 120, and the conductive path 111. As shown in FIG. 12, each of the two mounting portions 123 is connected to each of the two mounting land portions 113 by the second solder S2. This fixes the wire relay member 120 to the circuit board 110.

[0047] This embodiment also achieves the same effects as those of embodiment 1. Furthermore, in this embodiment, the wire relay member 120 includes a tubular portion 125, and a larger amount of first solder S1 is disposed inside this tubular portion 125. The tubular portion 125 is disposed on one edge 55E2 side of the connection land portion 55, and the mounting land portion 113 and the mounting portion 123, which are connected to each other by the second solder S2, are disposed on the other edge 55E3 side opposite the tubular portion 125. This reliably prevents the first solder S1 and the second solder S2 from mixing together and adversely affecting the electrical connection.

[0048] <Embodiment 3> Next, a second embodiment will be described with reference to Figures 13 to 17. In this embodiment, the configuration of the wire relay board 120 is the same as that of the second embodiment, but the configuration of the second land 132 provided on the circuit board 130 is different from that of the first and second embodiments. In this embodiment, the same components as those in the above embodiments are denoted by the same reference numerals, and the description thereof will be omitted.

[0049] 13, 14, and 15, the circuit board 130 includes an insulating plate 51 and a conductive path 131 arranged on one surface of the insulating plate 51. As shown in FIG. 15, the conductive path 131 includes a main line 57, a first land 53, and a second land 132.

[0050] The second land 132 has a rectangular main portion 133 and two extension portions 134 extending from the main portion 133. The main portion 133 has two side edges 133E1 and two end edges 133E2 and 133E3 connecting the two side edges 133E1. The two extension portions 134 extend from the two side edges 133E1, respectively, and are disposed on either side of the main portion 133. The second land 132 is covered with resist R3 over most of the main portion 133 except for portions along the two end edges 133E2 and 133E3, and over portions of the two extension portions 134 adjacent to the main portion 133. The portions of the main portion 133 along the two end edges 133E2 and 133E3 that are exposed from the resist R3 are connection land portions 133A and 133B, respectively. The portions of the two extension portions 134 that are exposed from the resist R3, excluding a portion adjacent to the main portion 133, form two mounting lands 134A. That is, the connection lands 133A and 133B and the mounting land 134A are separated from each other by the resist R3. The main line 57 is connected to one edge 133E2 of the main portion 133, and the second land 132, the main line 57, and the first land 53 form wiring that electrically connects the bus bar 40 and the electric wire 30. The two mounting lands 134A are located closer to one edge 133E3 of the main portion 133 than to the other edge 133E2.

[0051] The core wire 31 is connected to the wire relay member 120 by the first solder S1, as in the second embodiment. As shown in FIGS. 13, 16, and 17, the wire relay member 120 is disposed on the second land 132 so that the core wire connecting portion 81 overlaps the connection land portions 133A and 133B and the two mounting portions 123 overlap the two mounting land portions 134A, respectively. The wire relay member 120 is disposed with the tubular portion 125 facing one edge 133E2. As shown in FIG. 16, the core wire connecting portion 81 is connected to the connection land portions 133A and 133B by the first solder S1. This electrically connects the core wire 31, the wire relay member 120, and the conductive path 131. As shown in FIG. 17, each of the two mounting portions 123 is connected to each of the two mounting land portions 134A by the second solder S2. As a result, the wire relay member 120 is fixed onto the circuit board 130.

[0052] In this embodiment as well, the second land 132 connected to the wire relay member 120 includes connection lands 133A and 133B and a mounting land 134A spaced apart from the connection lands 133A and 133B, and the wire relay member 120 includes a core wire connecting portion 81 connected to the core wire 31 and the connection lands 133A and 133B by a first solder S1, and a mounting portion 123 connected to the mounting land 134A by a second solder S2 different from the first solder S1. This prevents the first solder S1 and the second solder S2, which have different compositions, from mixing together, which can adversely affect the electrical connection.

[0053] <Other embodiments> (1) In the above-mentioned embodiments 1 and 2, a portion of the connection land portion 55 is covered with the resist R1, but if the mounting land portion is arranged independently from the connection land portion, the connection land portion does not need to be covered with the resist. (2) In the above embodiment, the second lands 54, 112, 132 have two mounting land portions 56, 113, 136, and the wire relay members 80, 120 have two mounting portions 83, 123, but the number of mounting land portions and mounting portions is arbitrary and may be one or three or more. [Explanation of symbols]

[0054] 1: Energy storage module 10: Energy storage element 11A: Positive terminal (electrode terminal) 11B: Negative terminal (electrode terminal) 20: Wiring module 30: Electric wire 31: Core wire 32: Insulation coating 40: Busbar 41: Busbar body 41A: First electrode connection part 41B: Second electrode connection part 41C: Connection part 42: Circuit board placement section 43: Substrate support part 44: 1st fixing hole 45: Electric wire holding part 46: Positioning protrusion 50, 110, 130: Circuit board 51: Insulating board 51H: 2nd fixing hole 52, 111, 131: Conductive path 53: First Land 54, 112, 132: 2nd Land 55, 133A, 133B: Connection land part 55A, 55B: Exposed part 55E1: Side edge 55E2, 55E3: Edge 56, 113, 134A: Mounting land section 57: Main Line 58: Third Land 59: Positioning recess 60: Rivet 61: Shaft 62A, 62B: Head 70: Busbar relay component 71: Busbar connection 72: Land connection part 80, 120: Electrical wire relay components 81: Core wire connection part 82, 121: Compartment walls 83, 123: Mounting section 84, 122: Connection part 90: Holding member 91: Busbar holding part 92: Wire routing section 121A: High wall section 121B: Low wall section 124A, 124B: Ceiling wall 125: Cylinder part 133: Main section 133A, 133B: Connection land part 133E1: Side edge 133E2, 133E3: Edge 134: Extension part H: Chip fuse R1, R2, R3: Resist S1: First solder S2: Second solder Sp: Space

Claims

1. A wiring module attached to a plurality of energy storage elements having electrode terminals, an electric wire having a core wire; a wire relay member connected to the core wire; a bus bar connected to the electrode terminal; a circuit board having a conductive path including a first land electrically connected to the bus bar and a second land connected to the wire relay member, the second land includes a connection land portion and a mounting land portion spaced apart from the connection land portion, A wiring module, wherein the wire relay member comprises a core wire connection portion connected to the core wire and the connection land portion by a first solder, and a mounting portion connected to the mounting land portion by a second solder having a composition different from that of the first solder.

2. The wiring module according to claim 1 , wherein the mounting land portion is disposed independently from the connection land portion.

3. the circuit board includes a resist that partially covers the second lands; The wiring module according to claim 1 , wherein the connection land portion and the mounting land portion are separated by the resist.

4. the wire relay member includes a partition wall that stands upright from the core wire connecting portion and separates a space in contact with the core wire connecting portion from the mounting land portion, The wiring module according to claim 1 , wherein the first solder is disposed in the space.

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