Composition

Abstract

According to the present invention, it is possible to provide a composition that includes a resin component and a filler component, is filled with a high content of filler, and has sufficient physical properties due to the filler filling, thereby achieving a low specific gravity effect and improving storage stability without reducing physical properties such as thermal conductivity, a heat generating element, and a product that includes the composition or a cured product thereof in thermal contact with the heat generating element.

Description

[Technical Field]

[0001] Cross-reference to related applications

[0002] This application claims the benefit of priority based on Korean Patent Application No. 10-2021-0017013, filed on February 5, 2021, and all contents disclosed in the documents of that Korean patent application are incorporated herein by reference.

[0003] Technical Field

[0004] The present application relates to compositions. [Background technology]

[0005] A cured product having desired physical properties can be formed by blending a filler into a composition that can form an adhesive or pressure-sensitive adhesive. To ensure the desired physical properties, a high content of the filler must be incorporated into the composition. However, because commonly used fillers have a high specific gravity, incorporating a high content of filler increases the specific gravity of the composition, making it difficult to reduce the weight of the applied product and limiting its applications.

[0006] For example, alumina filler has high thermal conductivity but a high specific gravity, so if a high content of alumina filler is used to improve heat dissipation, it becomes difficult to reduce the weight of the product, and if a low content of alumina filler is used to reduce the specific gravity, the heat dissipation effect also decreases.

[0007] Therefore, there is a demand for the development of a composition that can be filled with a high filler content, thereby ensuring sufficient filler properties (e.g., heat dissipation performance), and has a low specific gravity so that it can be used for various purposes. Summary of the Invention [Problem to be solved by the invention]

[0008] The present application aims to provide a composition that can achieve a low specific gravity effect while being filled with a high content of filler and while fully realizing the physical properties due to the filler filling.

[0009] Another object of the present application is to provide a composition that exhibits excellent storage stability without a decrease in physical properties such as thermal conductivity. [Means for solving the problem]

[0010] Of the physical properties referred to in this specification, those that are affected by the temperature at which they are measured are those measured at room temperature, unless otherwise specified.

[0011] As used herein, the term "room temperature" refers to a natural temperature without heating or cooling, and means, for example, any one temperature within a range of about 10°C to 30°C, such as about 15°C, about 18°C, about 20°C, about 23°C, or about 25°C. Unless otherwise specified, the unit of temperature used in this specification is °C.

[0012] When the measurement pressure of a physical property mentioned in this specification affects the results, the relevant physical property is measured at atmospheric pressure unless otherwise specified. The term "atmospheric pressure" refers to the natural pressure without pressure increase or decrease, and is usually about 1 atmosphere.

[0013] As used herein, unless otherwise specified, the term "alkyl group" or "alkylene group" can mean a straight-chain or branched-chain acyclic alkyl group or alkylene group having 1 to 20 carbon atoms, or 1 to 16 carbon atoms, or 1 to 12 carbon atoms, or 1 to 8 carbon atoms, or 1 to 6 carbon atoms.

[0014] As used herein, unless otherwise specified, the term "alkenyl group" or "alkenylene group" can mean a straight-chain or branched, non-cyclic alkenyl group or alkenylene group having 2 to 20, 2 to 16, 2 to 12, 2 to 8, or 2 to 6 carbon atoms.

[0015] As used herein, unless otherwise specified, the term "alkynyl group" or "alkynylene group" can mean a straight-chain or branched, non-cyclic alkynyl group or alkynylene group having 2 to 20, or 2 to 16, or 2 to 12, or 2 to 8, or 2 to 6 carbon atoms.

[0016] As used herein, the term "carboxylic acid-derived unit" may refer to the portion of a carboxylic acid compound excluding the carboxy group. Similarly, the term "polyol-derived unit" may refer to the portion of a polyol compound excluding the hydroxy group.

[0017] The term "D50 particle size" used in this application refers to the particle diameter (median diameter) at 50% cumulative volume of particle size distribution, i.e., the particle diameter at the point where the cumulative value reaches 50% on a cumulative curve where the total volume is 100% when particle size distribution is calculated based on volume. The D50 particle size can be measured by laser diffraction.

[0018] In this application, the term "spherical" refers to a sphericity of about 0.95 or more, and "angular" refers to a sphericity of less than 0.95. The sphericity of the particles can be confirmed through particle shape analysis. Specifically, the sphericity of a filler, which is a three-dimensional particle, can be defined as the ratio (S' / S) of the surface area of ​​a particle (S) to the surface area of ​​a sphere having the same volume as the particle. For actual particles, circularity is generally used. The circularity is expressed as the ratio of the boundary (P) of a two-dimensional image of the actual particle to the boundary of a circle having the same area (A) as the image, and can be calculated using the following formula: The sphericity herein is the average circularity measured using a particle shape analyzer (FPIA-3000) from Marvern.

[0019] <Circularity formula> Circularity = 4πA / P 2

[0020] The circularity is expressed as a value between 0 and 1, with a perfect circle having a value of 1, and particles with an irregular shape having a value lower than 1.

[0021] The composition of the present application includes a resin component and a filler component, and the filler component includes a filler having a specific gravity of 3 or more and a filler having a specific gravity of less than 3. The content of the filler component in the composition is 80% by weight or more, and the composition forms a cured product having a specific gravity of less than 3.

[0022] In the present application, the term "resin component" may include a component that is a resin component itself or a precursor of the resin component, i.e., a component that can become a resin component through a reaction such as a curing reaction or a polymerization reaction.

[0023] As an example, the resin component may be a polyol, an isocyanate compound, a urethane resin, an acrylic resin, an epoxy resin, an olefin resin, or a silicone resin.

[0024] In one example of the present application, when the resin component is a polyol, a polyester polyol may be used. The polyester polyol of the present invention may be amorphous or have sufficiently low crystallinity. As used herein, "amorphous" refers to a polyol in which no crystallization temperature (Tc) or melting temperature (Tm) is observed in a differential scanning calorimetry (DSC) analysis, as described below. The DSC analysis may be performed at a rate of 10°C / min within a range of -80°C to 60°C. For example, the DSC analysis may be performed by heating from 25°C to 60°C at the same rate, then cooling to -80°C, and then heating to 60°C again. Furthermore, "sufficiently low crystallinity" refers to a polyol in which the melting point (Tm) observed in the DSC analysis is less than 15°C, such as about 10°C or less, 5°C or less, 0°C or less, -5°C or less, -10°C or less, or about -20°C or less. In this case, the lower limit of the melting point is not particularly limited, but may be, for example, about -80°C or higher, -75°C or higher, or about -70°C or higher.

[0025] As one example, the polyester polyol may be, for example, a carboxylic acid polyol or a caprolactone polyol.

[0026] The carboxylic acid polyol can be formed by reacting a component containing a carboxylic acid with a polyol (e.g., a diol or triol), and the caprolactone polyol can be formed by reacting a component containing caprolactone with a polyol (e.g., a diol or triol), in which case the carboxylic acid may be a dicarboxylic acid.

[0027] In one example, the polyol may be a polyol represented by the following Chemical Formula 1 or 2:

[0028] [ka]

[0029] [ka]

[0030] In the above Chemical Formulas 1 and 2, X is a carboxylic acid-derived unit, and Y is a polyol-derived unit. The polyol-derived unit may be, for example, a triol unit or a diol unit. Furthermore, n and m may be any numbers. For example, n may be a number in the range of 2 to 10 or 2 to 5, and m may be a number in the range of 1 to 10 or 1 to 5. In the above Chemical Formulas 1 and 2, R1 and R2 are each independently an alkylene group, and specific types of alkylene groups are as described at the beginning of the solution to the problem of this specification.

[0031] That is, when a hydroxy group of a polyol reacts with a carboxyl group of a carboxylic acid, an ester bond is formed while a water (H2O) molecule is eliminated by a condensation reaction. When a carboxylic acid forms an ester bond by a condensation reaction, the carboxylic acid-derived unit may refer to the portion of the carboxylic acid structure that does not participate in the condensation reaction. Also, the polyol-derived unit may refer to the portion of the polyol structure that does not participate in the condensation reaction.

[0032] Additionally, Y in Chemical Formula 2 also represents the portion of the polyol that remains after the ester bond is removed after the polyol and caprolactone form an ester bond. That is, when the polyol and caprolactone form an ester bond, the polyol-derived unit Y in Chemical Formula 2 can refer to the portion of the polyol structure that does not participate in the ester bond. The ester bonds are represented by Chemical Formulas 1 and 2, respectively.

[0033] Meanwhile, in the above chemical formula, when the polyol-derived unit of Y is a unit derived from a polyol containing three or more hydroxy groups, such as a triol unit, the Y portion of the above chemical formula structure may have a branched structure.

[0034] In Formula 1, the type of the carboxylic acid-derived unit of X is not particularly limited, but may be a unit derived from one or more compounds selected from the group consisting of a fatty acid compound, an aromatic compound having two or more carboxyl groups, an alicyclic compound having two or more carboxyl groups, and an aliphatic compound having two or more carboxyl groups, in order to ensure desired physical properties.

[0035] Examples of the aromatic compound having two or more carboxyl groups include phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, and tetrachlorophthalic acid. Examples of the alicyclic compound having two or more carboxyl groups include tetrahydrophthalic acid, hexahydrophthalic acid, and tetrachlorophthalic acid. Examples of the aliphatic compound having two or more carboxyl groups include oxalic acid, adipic acid, azelaic acid, sebacic acid, succinic acid, malic acid, glutaric acid, malonic acid, pimelic acid, suberic acid, 2,2-dimethylsuccinic acid, 3,3-dimethylglutaric acid, 2,2-dimethylglutaric acid, maleic acid, fumaric acid, and itaconic acid.

[0036] Meanwhile, in Chemical Formulas 1 and 2, the type of polyol-derived unit of Y is not particularly limited, but may be derived from one or more compounds selected from the group consisting of alicyclic compounds having two or more hydroxy groups and aliphatic compounds having two or more hydroxy groups in order to ensure the desired physical properties.

[0037] The alicyclic compound having two or more hydroxy groups may be, for example, 1,3-cyclohexanedimethanol or 1,4-cyclohexanedimethanol, and the aliphatic compound having two or more hydroxy groups may be, for example, ethylene glycol, propylene glycol, 1,2-butylene glycol, 2,3-butylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, 1,2-ethylhexyldiol, 1,5-pentanediol, 1,9-nonanediol, 1,10-decanediol, glycerin, or trimethylolpropane.

[0038] In one example of the present application, when the resin component is an isocyanate compound, it may include a difunctional isocyanate compound and a polyfunctional isocyanate compound.

[0039] The bifunctional isocyanate compound refers to a compound containing two isocyanate groups (-N=C=O) in one molecule, and the polyfunctional isocyanate compound refers to a compound containing three or more isocyanate groups. In other examples, the polyfunctional isocyanate compound may contain 3 to 10, 3 to 9, 3 to 8, 3 to 7, 3 to 6, 3 to 5, or 3 to 4 isocyanate groups.

[0040] The bifunctional isocyanate compound may have a functional group value in the range of 0.5 to 1 according to the following formula 1: [Formula 1] Functional group value = 100 × N / M

[0041] In formula 1, N is the number of isocyanate groups contained in the isocyanate compound, and M is the molar mass (unit: g / mol) of the isocyanate compound.

[0042] In other examples, the functionality of the difunctional isocyanate compound according to Formula 1 may be 0.55 or more, 0.6 or more, 0.65 or more, 0.7 or more, 0.75 or more, 0.8 or more, or 0.85 or more, or 1 or less, 0.95 or less, or 0.9 or less.

[0043] The bifunctional isocyanate compound may have a molar mass in the range of 100 to 500 g / mol. In other examples, the molar mass may be 110 g / mol or more, 120 g / mol or more, 130 g / mol or more, 140 g / mol or more, 150 g / mol or more, 160 g / mol or more, 170 g / mol or more, 180 g / mol or more, 190 g / mol or more, 200 g / mol or more, 210 g / mol or more, or 220 g / mol or more, or 480 g / mol or less, 460 g / mol or less, 440 g / mol or less, 420 g / mol or less, 400 g / mol or less, 380 g / mol or less, 360 g / mol or less, 340 g / mol or less, 320 g / mol or less, 300 g / mol or less, 280 g / mol or less, 260 g / mol or less, 240 g / mol or less, or 230 g / mol or less.

[0044] The polyfunctional isocyanate compound may have a functional group value, as determined by the following formula 1, in the range of 0.01 to 0.7. [Formula 1] Functional group value = 100 × N / M

[0045] In formula 1, N is the number of isocyanate groups contained in the isocyanate compound, and M is the molar mass (unit: g / mol) of the isocyanate compound.

[0046] In other examples, the functionality of the polyfunctional isocyanate compound according to Formula 1 may be 0.05 or more, 0.1 or more, 0.15 or more, 0.2 or more, 0.25 or more, 0.3 or more, 0.35 or more, 0.4 or more, 0.45 or more, 0.5 or more, or 0.55 or more, or 0.68 or less, 0.64 or less, 0.62 or less, or 0.6 or less.

[0047] The polyfunctional isocyanate compound may have a molar mass in the range of 300 to 1500 g / mol. In other examples, the molar mass may be 320 g / mol or more, 340 g / mol or more, 360 g / mol or more, 380 g / mol or more, 400 g / mol or more, 420 g / mol or more, 440 g / mol or more, 460 g / mol or more, 480 g / mol or more, or 500 g / mol or more, or 1500 g / mol or less, 1400 g / mol or less, 1300 g / mol or less, 1200 g / mol or less, 1100 g / mol or less, 1000 g / mol or less, 900 g / mol or less, 800 g / mol or less, 700 g / mol or less, 600 g / mol or less, 550 g / mol or less, or 520 g / mol or less.

[0048] The difunctional isocyanate compound of the present application may be at least one of an aliphatic difunctional isocyanate compound and an alicyclic difunctional isocyanate compound, but it is preferable to use an alicyclic difunctional isocyanate compound.

[0049] Examples of aliphatic difunctional isocyanate compounds include, but are not limited to, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate, and tetramethylene diisocyanate. Examples of alicyclic difunctional isocyanate compounds include, but are not limited to, transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanatemethyl)cyclohexane diisocyanate, and dicyclohexylmethane diisocyanate. The difunctional isocyanate compounds may be used singly or in combination of two or more.

[0050] The polyfunctional isocyanate compound according to the present application may be, for example, a trimer or higher polymer of an isocyanate compound, or a biuret compound obtained by reacting an isocyanate compound with water. That is, the polyfunctional isocyanate compound may be at least one selected from a polymer of an isocyanate compound and a biuret compound.

[0051] Specific examples of polyfunctional isocyanate compounds include polymers and biuret compounds such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate, tetramethylene diisocyanate, transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanatemethyl)cyclohexane diisocyanate, and dicyclohexylmethane diisocyanate.

[0052] According to one example of the present application, the polyfunctional isocyanate compound may be a trifunctional isocyanate compound containing three isocyanate groups.

[0053] The trifunctional isocyanate compound may be a compound represented by the following chemical formula 3: [ka]

[0054] In Chemical Formula 3, L7, L8, and L9 may each independently be an alkylene group, an alkenylene group, or an alkynylene group. Specific types of the alkylene group, alkenylene group, or alkynylene group in the definition of Chemical Formula 3 are as described at the beginning of the Solution to the Problems of the Invention of this specification.

[0055] When the resin component is an isocyanate compound containing a difunctional isocyanate compound and a polyfunctional isocyanate compound, the content of the polyfunctional isocyanate compound may be 30% by weight or more, 35% by weight or more, 40% by weight or more, 45% by weight or more, 50% by weight or more, 55% by weight or more, or 60% by weight or more, or 85% by weight or less, 80% by weight or less, 75% by weight or less, 70% by weight or less, or 65% by weight or less, based on the total isocyanate compounds.

[0056] In addition, the content of the bifunctional isocyanate compound may be 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 50 parts by weight or more, or 55 parts by weight or more, or 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, or 65 parts by weight or less, based on the total isocyanate compounds.

[0057] The filler component contained in the composition of the present application is a thermally conductive filler that can ensure the heat dissipation or thermal conductivity of the composition or a cured product of the composition. In the present application, the filler component may include a thermally conductive filler having a specific gravity of 3 or more and a thermally conductive filler having a specific gravity of less than 3.

[0058] Thermally conductive filler components that can be used in the present application include, but are not limited to, oxides such as alumina (aluminum oxide), magnesium oxide, beryllium oxide, or titanium oxide; nitrides such as boron nitride, silicon nitride, or aluminum nitride; carbides such as silicon carbide; hydrated metals such as aluminum hydroxide or magnesium hydroxide; metal fillers such as copper, silver, iron, aluminum, or nickel; metal alloy fillers such as titanium; and silicon powders such as quartz, glass, or silica. Furthermore, carbon fillers such as graphite can also be considered as long as they can ensure insulating properties. For example, the carbon filler can be activated carbon, but is not limited to this.

[0059] In the present application, the above-mentioned thermally conductive fillers having a specific gravity of 3 or more and thermally conductive fillers having a specific gravity of less than 3 can be appropriately selected and used. In addition, there are no limitations on the specific type of filler that can be selected and used, as long as the above-mentioned thermally conductive fillers having a specific gravity of 3 or more and thermally conductive fillers having a specific gravity of less than 3 can be appropriately mixed to form a composition having a specific gravity of less than 3 in the cured product.

[0060] The composition of the present application may contain an excess amount of filler. In one example, the composition of the present application may contain 80 wt% or more of a filler component to ensure a desired physical property (e.g., thermal conductivity). In another example, the filler component may be contained in the composition at 82 wt% or more, 85 wt% or more, 87 wt% or more, or 90 wt% or more, or at 95 wt% or less, 94 wt% or less, 93 wt% or less, 92 wt% or less, or 90 wt% or less.

[0061] If an excessive amount of filler is included, the specific gravity of the cured product of the composition increases, making it difficult to realize a lightweight product. Therefore, it is necessary to include an excessive amount of filler and lower the specific gravity of the cured product. Furthermore, even if the desired physical properties (e.g., thermal conductivity) are secured, it is also necessary that the physical properties do not change over time to ensure storage stability and processability.

[0062] In one example, the filler component of the present application may include 60 wt% or more of a filler having a specific gravity of 3 or more. In another example, the filler having a specific gravity of 3 or more may be included in an amount of 62 wt% or more, 64 wt% or more, 66 wt% or more, 68 wt% or more, 70 wt% or more, 72 wt% or more, 74 wt% or more, 76 wt% or more, 78 wt% or more, or 80 wt% or more. The upper limit of the content of the filler component having a specific gravity of 3 or more may be, for example, 90 wt% or less, 89 wt% or less, 88 wt% or less, 87 wt% or less, 86 wt% or less, 85 wt% or less, 84 wt% or less, 83 wt% or less, 82 wt% or less, 81 wt% or less, or 80 wt% or less. When a filler having a specific gravity of 3 or more is contained within the above range, a low specific gravity effect is achieved while the filler is filled at a high content and the physical properties due to the filler filling are fully realized, and a composition with improved storage stability without a decrease in physical properties such as thermal conductivity can be provided.

[0063] In one example, the filler component having a specific gravity of less than 3 may be included in an amount of 10 to 65 parts by weight per 100 parts by weight of fillers having a specific gravity of 3 or more. In another example, the filler component having a specific gravity of less than 3 may be included in an amount of 13 parts by weight or more, 15 parts by weight or more, 18 parts by weight or more, 21 parts by weight or more, 24 parts by weight or more, 27 parts by weight or more, 30 parts by weight or more, or 33 parts by weight or more, or 62 parts by weight or less, 59 parts by weight or less, 56 parts by weight or less, 54 parts by weight or less, 50 parts by weight or less, 48 ​​parts by weight or less, 46 parts by weight or less, 43 parts by weight or less, 40 parts by weight or less, 37 parts by weight or less, or 34 parts by weight or less, per 100 parts by weight of fillers having a specific gravity of 3 or more. When the filler having a specific gravity of less than 3 is contained within the above range relative to 100 parts by weight of the filler having a specific gravity of 3 or more, a low specific gravity effect is achieved while the filler is filled at a high content and the physical properties due to the filler filling are fully realized, and a composition having improved storage stability without a decrease in physical properties such as thermal conductivity can be provided.

[0064] In the present application, a filler having a specific gravity of less than 3 may have a D50 particle size of 50 to 90 μm. In other examples, a filler having a specific gravity of less than 3 may have a D50 particle size of 51 μm or more, 52 μm or more, 53 μm or more, 54 μm or more, 55 μm or more, 56 μm or more, 57 μm or more, 58 μm or more, 59 μm or more, or 60 μm or more, or 85 μm or less, 80 μm or less, 75 μm or less, 70 μm or less, 65 μm or less, or 60 μm or less.

[0065] In one example, the proportion of fillers having a specific gravity of less than 3 in the filler component may be 10 to 50 wt%. In another example, the proportion of fillers having a specific gravity of less than 3 may be 11 wt% or more, 12 wt% or more, 13 wt% or more, 14 wt% or more, 15 wt% or more, 16 wt% or more, 18 wt% or more, or 20 wt% or more, or 47 wt% or less, 45 wt% or less, 43 wt% or less, 40 wt% or less, 37 wt% or less, 35 wt% or less, 33 wt% or less, 30 wt% or less, 28 wt% or less, 26 wt% or less, 24 wt% or less, 22 wt% or less, or 20 wt% or less. If the proportion of fillers having a specific gravity of less than 3 in the filler component is less than 10 wt%, the specific gravity of the cured product may become high, and if it exceeds 50 wt%, the physical properties (e.g., thermal conductivity) of the cured product may change over time. Therefore, it is preferable that the proportion be within the above range. When a filler having a specific gravity of less than 3 is contained within the above range, a low specific gravity effect is achieved while the filler is highly filled and the physical properties due to the filler filling are fully realized, and a composition having improved storage stability without a decrease in physical properties such as thermal conductivity can be provided.

[0066] In one example, the filler component of the present application may include a first filler having a specific gravity of 3 or more and a D50 particle size in the range of 50 to 200 μm, and a second filler having a specific gravity of 3 or more and a D50 particle size in the range of 0.5 to 5 μm.

[0067] In one example, the D50 particle size of the first filler may be 55 μm or more, 60 μm or more, 65 μm or more, or 70 μm or more, or 195 μm or less, 190 μm or less, 185 μm or less, 180 μm or less, 175 μm or less, 170 μm or less, 165 μm or less, 160 μm or less, 155 μm or less, 150 μm or less, 145 μm or less, 140 μm or less, 135 μm or less, 130 μm or less, 125 μm or less, about 120 μm or less, 115 μm or less, 110 μm or less, 105 μm or less, 100 μm or less, 95 μm or less, 90 μm or less, 85 μm or less, 80 μm or less, or about 75 μm or less.

[0068] In one example, the D50 particle size of the second filler may be 0.01 μm or more, 0.1 μm or more, approximately 0.5 μm or more, 1 μm or more, 1.5 μm or more, or 2 μm or more, or may be 5 μm or less, 4.5 μm or less, approximately 4 μm or less, 3.5 μm or less, 3 μm or less, 2.5 μm or less, or 2 μm or less.

[0069] In one example, the first filler may be included in the filler component at 25 to 50 wt %. In another example, the first filler may be included in the filler component at 28 wt % or more, 30 wt % or more, 33 wt % or more, or 35 wt % or more, or 48 wt % or less, 46 wt % or less, 44 wt % or less, 42 wt % or less, 40 wt % or less, 38 wt % or less, or 35 wt % or less.

[0070] In one example, the second filler may be included in the filler component at 10 to 50 wt %. In another example, the second filler may be included in the filler component at 13 wt % or more, 15 wt % or more, 17 wt % or more, 20 wt % or more, 22 wt % or more, 25 wt % or more, 28 wt % or more, or 30 wt % or less, or 48 wt % or less, 46 wt % or less, 44 wt % or less, 42 wt % or less, 40 wt % or less, 38 wt % or less, 35 wt % or less, 33 wt % or less, or 30 wt % or less.

[0071] The filler component of the present application may further include a third filler having a specific gravity of 3 or more and a D50 particle size in the range of 10 to 30 μm. The D50 particle size of the third filler may be, for example, 12 μm or more, 13 μm or more, 14 μm or more, 15 μm or more, 16 μm or more, 17 μm or more, 18 μm or more, 19 μm or more, or 20 μm or more, or about 29 μm or less, 28 μm or less, 27 μm or less, 26 μm or less, 25 μm or less, 24 μm or less, 23 μm or less, 22 μm or less, 21 μm or less, or 20 μm or less.

[0072] The weight ratio (C3 / C2) of the third filler (C3) to the second filler (C2) may be equal to or less than 1. Specifically, the weight ratio (C3 / C2) may be equal to or less than 0.9, 0.8, 0.7, 0.6, 0.5, or 0.4, or may be equal to or greater than 0, 0.1, 0.2, or 0.3.

[0073] The shape of the filler component described above may be appropriately selected from spherical and / or angular shapes (e.g., needle-like and plate-like shapes) as needed, but is not limited thereto. Considering the amount to be filled, it is advantageous to use a spherical filler, but considering network formation and conductivity, angular fillers such as needle-like and plate-like shapes may also be used.

[0074] For example, a filler having a specific gravity of 3 or more and a filler having a specific gravity of less than 3 may have different shapes, and a first filler, a second filler, and a third filler having the same specific gravity may have different shapes. In another example, the first filler, the second filler, and the third filler having the same specific gravity and particle size may each be composed of a mixture of spherical and / or angular fillers, but in consideration of cost reduction effects, it is preferable to use an angular filler as the second filler.

[0075] The composition of the present application may be a one-component resin composition, a base composition or a curing agent composition of a two-component resin composition, or a mixture of a base composition and a curing agent composition of a two-component resin composition. A one-component resin composition is a resin composition in which the curable components are mixed and stored, while a two-component resin composition is a resin composition in which the curable components are physically separated into a base composition and a curing agent composition and stored. In the case of a two-component resin composition, the base composition and the curing agent composition are mixed under conditions that allow curing to occur at the time of use.

[0076] When the composition of the present application is a mixture of a base composition and a curing agent composition of a two-component resin composition, the ratio (V1 / V2) of the volume (V1) of the base composition to the volume (V2) of the curing agent composition may be within the range of 0.5 to 1.5 or within the range of 0.75 to 1.25.

[0077] The composition of the present application basically contains the above-mentioned components, namely, the resin component and the filler component, and may contain other components as required.

[0078] In one example, the curing reaction of the composition including the base resin and the curing resin can be assisted by a catalyst. The catalyst can be, for example, a tin-based catalyst. An example of a tin-based catalyst is dibutyltin dilaurate (DBTDL).

[0079] The composition of the present application may further include a thiol compound. The thiol compound may be included in the composition and serve as a cure retarder that adjusts the cure rate according to the application of the composition. In particular, the composition of the present application has the advantage that the cure rate of the composition can be adjusted to an appropriate level in terms of workability by appropriately adjusting the content of the catalyst and thiol compound.

[0080] As an example of the present application, the thiol compound is a compound containing one thiol group and can be represented by the following chemical formula 4. [ka]

[0081] In Formula 4, R5 is a single bond, an alkylene group, an alkenylene group, or an alkynylene group, and R6, R7, and R8 may each independently be a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group.

[0082] In the definition of Chemical Formula 4, the specific types of alkylene group, alkenylene group, or alkynylene group are as described at the beginning of the solution to the problem of this specification.

[0083] As an example, the thiol compound may be ethanethiol, propanethiol, butanethiol, pentanethiol, hexanethiol, heptanethiol, octanethiol, 2-ethylhexanethiol, nonanethiol, decanethiol, 2-propylheptanethiol, ethenethiol, propenethiol, butenethiol, acetylenethiol, propanethiol, butenethiol, benzenethiol, methylbenzenethiol, pyridinethiol, and methylpyridinethiol, but there is no particular limitation as long as it contains one thiol group. In addition, one or more types of thiol compounds can be used.

[0084] The composition may contain viscosity modifiers to adjust the viscosity, for example, to increase or decrease the viscosity or to adjust the viscosity due to shear force, and may also contain additional agents, such as thixotropic agents, diluents, dispersants, or coupling agents.

[0085] The thixotropy-imparting agent can adjust the viscosity of the composition due to shear stress, thereby enabling the battery module manufacturing process to be carried out efficiently. Examples of usable thixotropy-imparting agents include fumed silica.

[0086] The diluent or dispersant is generally used to reduce the viscosity of the composition, and various types of diluents or dispersants known in the art can be used as long as they can exhibit the above-mentioned effects.

[0087] In the case of coupling agents, for example, they can be used to improve the dispersibility of the filler, and various types known in the industry can be used without limitation as long as they can exhibit the above-mentioned effects.

[0088] The composition may further include a flame retardant or a flame retardant auxiliary. The flame retardant may be any known flame retardant, including, but not limited to, solid-phase filler-type flame retardants and liquid-phase flame retardants. Examples of the flame retardant include, but are not limited to, organic flame retardants such as melamine cyanurate and inorganic flame retardants such as magnesium hydroxide. When the amount of filler added is excessive, a liquid-phase flame retardant material (such as TEP, triethyl phosphate, TCPP, or tris(1,3-chloro-2-propyl)phosphate) may be used. A silane coupling agent capable of acting as a flame retardant enhancer may also be added.

[0089] The composition may also contain a moisture absorbent. The presence of a moisture absorbent ensures storage stability and solves problems such as surface hardening and increased viscosity of the composition due to moisture. Examples of the moisture absorbent include methyldiphenylethoxysilane, molecular sieves, p-toluenesulfonyl isocyanate (PTSI), tosyl isocyanate (TI), acid anhydride esters such as diethyl malonate and dimethyl succinate, (unsaturated) silane compounds, and mixtures thereof.

[0090] The composition of the present application can be cured to form a cured product, and can satisfy the following physical properties.

[0091] The composition of the present application may have a specific gravity of less than 3 after curing. The specific gravity may be, for example, 2.95 or less, 2.9 or less, 2.85 or less, 2.8 or less, 2.75 or less, or 2.7 or less, but is not limited thereto. The lower the specific gravity of the cured composition of the present application, the more advantageous it is for reducing the weight of the product to which it is applied. Therefore, the lower limit of the specific gravity is not particularly limited, but may be, for example, 0.5 or more, 1 or more, 1.5 or more, 2 or more, 2.3 or more, or 2.5 or more. The cured composition of the present application has low specific gravity characteristics within the above range, which can be expected to reduce the weight of the product to which the composition is applied. The specific gravity may be a value measured by the specific gravity measurement method described below.

[0092] The composition of the present application may form a cured product having a thermal conductivity of 3 W / m·K or more. Specifically, the thermal conductivity may be 3.1 W / m·K or more, 3.2 W / m·K or more, 3.3 W / m·K or more, or 3.4 W / m·K or more, or may be 50 W / m·K or less, 45 W / m·K or less, 40 W / m·K or less, 35 W / m·K or less, 30 W / m·K or less, 25 W / m·K or less, 20 W / m·K or less, 15 W / m·K or less, 10 W / m·K or less, 5 W / m·K or less, 4.5 W / m·K or less, about 4.0 W / m·K or less, or 3.5 W / m·K or less. The thermal conductivity may be measured in accordance with ASTM D5470 or ISO 22007-2 in a thickness direction of a 5 mm thick sample of the composition.

[0093] Furthermore, a cured product of the composition of the present application may have a rate of change in thermal conductivity of 0.99 or more, as determined by the following formula 2. Specifically, a cured product of the composition of the present application may have a rate of change in thermal conductivity of 1 or more, 1.01 or more, 1.02 or more, 1.03 or more, 1.04 or more, or 1.05 or more, as determined by the following formula 2. The upper limit of the rate of change in thermal conductivity is not limited, and may be, for example, 3 or less, 2.5 or less, 2 or less, 1.5 or less, 1.3 or less, 1.1 or less, 1.08 or less, or 1.06 or less. [Formula 2] Thermal conductivity change rate = Tc2 / Tc1

[0094] In the above formula 2, Tc1 is the thermal conductivity measured after leaving the composition at room temperature (25°C) for 1 hour, and Tc2 is the thermal conductivity measured after leaving the composition at room temperature for 10 days.

[0095] As described above, the cured product of the composition of the present application can achieve a low specific gravity of less than 3 and a thermal conductivity of 3 W / m K or more, thereby providing excellent heat dissipation performance. Furthermore, since physical properties such as thermal conductivity do not decrease over time, the cured product has improved storage stability.

[0096] The present application also relates to a product including a heating element and a composition or a cured product thereof in thermal contact with the heating element. The same description as for the composition and its cured product can be applied to the composition or its cured product.

[0097] Products including the composition of the present application and its cured product include various electrical and electronic products such as irons, washing machines, dryers, clothing care machines, electric shavers, microwave ovens, electric ovens, electric rice cookers, refrigerators, dishwashers, air conditioners, electric fans, humidifiers, air cleaners, mobile phones, walkie-talkies, televisions, radios, computers, and notebook PCs, as well as batteries such as secondary batteries. In particular, the composition of the present application may be used as a material for connecting battery modules in automobile batteries, which are manufactured by assembling battery cells to form a battery module and assembling a number of battery modules to form a battery pack.

[0098] When the composition according to an example of the present application is used as a material for connecting battery modules, it can serve to dissipate heat emitted from the battery cells and secure the battery cells against external impact and vibration.

[0099] The composition of the present application and a cured product thereof can transfer heat generated from a heat-generating device such as the above-mentioned electric and electronic products or a battery to a cooling location, i.e., the composition of the present application and a cured product thereof can dissipate heat generated from the heat-generating device.

[0100] The composition and its cured product may be positioned between a heat-generating element and a cooling element to provide thermal contact therebetween. Thermal contact refers to the cured product of the composition being in direct physical contact with the heat-generating element and the cooling element to dissipate heat generated from the heat-generating element to the cooling element, or the cured product being in direct contact with the heat-generating element and / or the cooling element (i.e., a separate layer exists between the cured product of the composition and the heat-generating element and / or the cooling element) to dissipate heat generated from the heat-generating element to the cooling element. In other words, the composition and its cured product of the present application may dissipate heat within electrical and electronic products or batteries, and may provide impact resistance and insulation properties. [Effects of the Invention]

[0101] According to the present invention, a composition can be provided that achieves a low specific gravity effect while being filled with a high filler content and while ensuring sufficient realization of physical properties due to the filler filling, and that has improved storage stability without a decrease in physical properties such as thermal conductivity. DETAILED DESCRIPTION OF THE INVENTION

[0102] The present application will be described in detail below through examples, but the scope of the present application is not limited to the following examples.

[0103] Example 1

[0104] The filler component was prepared by mixing spherical alumina (C1a) with a D50 particle size of 70 μm, spherical alumina (C3a) with a D50 particle size of 20 μm, prismatic alumina (C2) with a D50 particle size of 2 μm, and prismatic aluminum hydroxide (AH) with a D50 particle size of 60 μm in a weight ratio of 40:20:20:20 (C1a:C3a:C2:AH). The specific gravity of the alumina used was 3.965, and the specific gravity of the aluminum hydroxide was 2.423.

[0105] The D50 particle size of a filler referred to herein is the particle diameter (median diameter) at 50% of the cumulative volumetric cumulative curve of the particle size distribution. This particle size can be defined as the particle diameter at the point where the cumulative value reaches 50% on the cumulative curve, where the total volume is 100%, when the particle size distribution is calculated based on volume. The D50 particle size can be measured using a MASTERSIZER 3000 instrument manufactured by Marven Corporation in accordance with ISO-13320, using ethanol as the solvent.

[0106] The prepared filler component was mixed with polyol and other additives (cure retarder, dispersant, flame retardant) in a weight ratio of 90:8:2 (filler component: polyol: additive), and dispersed by mixing in a paste mixer at 600 rpm revolution and 500 rpm rotation for about 3 minutes. After checking the generated heat, the mixture was degassed in a vacuum at 600 rpm revolution and 200 rpm rotation for 4 minutes to prepare the base composition.

[0107] The polyol used was a caprolactone polyol obtained by reacting 1,4-butanediol and caprolactone in a weight ratio of 1:2.79 (1,4-butanediol:caprolactone).

[0108] In addition, the prepared filler component was mixed with an isocyanate mixture and other additives (moisture absorbent, dispersant, flame retardant) at a weight ratio of 90:8:2 (filler component: isocyanate mixture: additives), and dispersed by mixing in a paste mixer at 600 rpm revolution and 500 rpm rotation for about 3 minutes. After confirming the generated heat, the mixture was degassed in a vacuum at 600 rpm revolution and 200 rpm rotation for 4 minutes to prepare a curing agent composition.

[0109] The isocyanate mixture used was a mixture of hexamethylene diisocyanate trimer (number of isocyanate groups: 3, molar mass: approximately 504.6 g / mol) and isophorone diisocyanate (number of isocyanate groups: 2, molar mass: approximately 222.3 g / mol). The functional value of the hexamethylene diisocyanate trimer calculated using the following formula 1 was 0.59, and the functional value of isophorone diisocyanate was 0.89. [Formula 1] Functional group value = 100 x N / M

[0110] In formula 1, N is the number of isocyanate groups contained in the isocyanate compound, and M is the molar mass (unit: g / mol) of the isocyanate compound.

[0111] The prepared base composition and hardener composition were mixed in a volume ratio of 1:1 to prepare a composition.

[0112] <Example 2>

[0113] A composition was prepared in the same manner as in Example 1, except that a filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, spherical alumina (C3a) having a D50 particle size of 20 μm, prismatic alumina (C2) having a D50 particle size of 2 μm, and prismatic aluminum hydroxide (AH) having a D50 particle size of 60 μm in a weight ratio of 35:20:20:25 (C1a:C3a:C2:AH), respectively.

[0114] Example 3

[0115] A composition was prepared in the same manner as in Example 1, except that a filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, prismatic alumina (C2) having a D50 particle size of 2 μm, and prismatic aluminum hydroxide (AH) having a D50 particle size of 60 μm in a weight ratio of 30:40:30 (C1a:C2:AH), respectively.

[0116] Example 4

[0117] A composition was prepared in the same manner as in Example 1, except that the filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, prismatic alumina (C2) having a D50 particle size of 2 μm, and prismatic aluminum hydroxide (AH) having a D50 particle size of 60 μm in a weight ratio of 35:30:35 (C1a:C2:AH), respectively.

[0118] <Example 5>

[0119] A composition was prepared in the same manner as in Example 1, except that the filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, prismatic alumina (C3b) having a D50 particle size of 20 μm, prismatic alumina (C2) having a D50 particle size of 2 μm, and prismatic aluminum hydroxide (AH) having a D50 particle size of 60 μm in a weight ratio of 40:20:20:20 (C1a:C3b:C2:AH), respectively.

[0120] Example 6

[0121] A composition was prepared in the same manner as in Example 1, except that a filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, prismatic alumina (C1b) having a D50 particle size of 70 μm, prismatic alumina (C3b) having a D50 particle size of 20 μm, prismatic alumina (C2) having a D50 particle size of 2 μm, and prismatic aluminum hydroxide (AH) having a D50 particle size of 60 μm in a weight ratio of 20:20:20:20:20 (C1a:C1b:C3b:C2:AH), respectively.

[0122] Example 7

[0123] A composition was prepared in the same manner as in Example 1, except that the filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, spherical alumina (C3a) having a D50 particle size of 20 μm, prismatic alumina (C2) having a D50 particle size of 2 μm, and prismatic aluminum hydroxide (AH) having a D50 particle size of 60 μm in a weight ratio of 40:10:30:20 (C1a:C3a:C2:AH), respectively.

[0124] <Comparative Example 1>

[0125] A composition was prepared in the same manner as in Example 1, except that no aluminum hydroxide was used and a filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, spherical alumina (C3a) having a D50 particle size of 20 μm, and prismatic alumina (C2) having a D50 particle size of 2 μm in a weight ratio of 60:20:20 (C1a:C3a:C2).

[0126] <Comparative Example 2>

[0127] A composition was prepared in the same manner as in Example 1, except that no aluminum hydroxide was used and a filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, prismatic alumina (C3b) having a D50 particle size of 20 μm, and prismatic alumina (C2) having a D50 particle size of 2 μm in a weight ratio of 60:20:20 (C1a:C3b:C2).

[0128] <Comparative Example 3>

[0129] A composition was prepared in the same manner as in Example 1, except that no aluminum hydroxide was used and a filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, prismatic alumina (C1b) having a D50 particle size of 70 μm, spherical alumina (C3a) having a D50 particle size of 20 μm, and prismatic alumina (C2) having a D50 particle size of 2 μm in a weight ratio of 40:20:20:20 (C1a:C1b:C3a:C2), respectively.

[0130] <Comparative Example 4>

[0131] A composition was prepared in the same manner as in Example 1, except that no aluminum hydroxide was used and a filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, prismatic alumina (C1b) having a D50 particle size of 70 μm, prismatic alumina (C3b) having a D50 particle size of 20 μm, and prismatic alumina (C2) having a D50 particle size of 2 μm in a weight ratio of 40:20:20:20 (C1a:C1b:C3b:C2), respectively.

[0132] <Comparative Example 5>

[0133] A composition was prepared in the same manner as in Example 1, except that no aluminum hydroxide was used and a filler was prepared by mixing spherical alumina (C1a) having a D50 particle size of 70 μm, spherical alumina (C3a) having a D50 particle size of 20 μm, and prismatic alumina (C2) having a D50 particle size of 2 μm in a weight ratio of 40:30:30 (C1a:C3a:C2).

[0134] <Experimental Example 1. Measurement of thermal conductivity and measurement of the degree of change in thermal conductivity>

[0135] The thermal conductivity of the cured products was compared between the compositions of Examples 1 to 7 and the compositions of Comparative Examples 1 to 5. The compositions were left at 25° C. for 1 hour to produce cured products.

[0136] The thermal conductivity of the cured composition was measured using the hot disk method according to ISO 22007-2. Specifically, the composition was placed in a mold about 5 mm thick, and the thermal conductivity was measured in the thickness direction (through-plane direction) using a hot disk device. As defined in the standard, the hot disk device is a device that can determine thermal conductivity by measuring temperature changes (electrical resistance changes) as a sensor made of a double-spiral nickel wire is heated. Thermal conductivity was measured according to this standard.

[0137] The degree of change in thermal conductivity of the cured products of the compositions of Examples 1 to 7 and Comparative Examples 1 to 5 was then compared. Specifically, the degree of change in thermal conductivity was compared by comparing the thermal conductivity of the cured product after leaving the composition at room temperature for 1 hour, the thermal conductivity of the cured product after leaving at room temperature for 5 days, and the thermal conductivity of the cured product after leaving at room temperature for 10 days. The thermal conductivities after 5 days and 10 days were measured using the same method as the thermal conductivity measurement method described above. The ratio of the change in thermal conductivity of the cured product after leaving at room temperature for 1 hour to the thermal conductivity of the cured product after leaving at room temperature for 10 days was calculated using the following equation 2.

[0138] [Formula 2] Thermal conductivity change rate = Tc2 / Tc1

[0139] In Equation 2, Tc1 is the thermal conductivity measured after leaving the composition at room temperature (25°C) for 1 hour, and Tc2 is the thermal conductivity measured after leaving the composition at room temperature for 10 days.

[0140] The thermal conductivity of the cured products of Examples 1 to 7 and Comparative Examples 1 to 5 left at room temperature for 1 hour, the thermal conductivity of the cured products left at room temperature for 5 days, and the thermal conductivity and rate of change in thermal conductivity (Tc2 / Tc1) of the cured products left at room temperature for 10 days are summarized in Table 1 below.

[0141] [Table 1-1] [Table 1-2]

[0142] <Experimental Example 2: Specific Gravity Measurement>

[0143] The specific gravities of the cured products of the compositions of Examples 1 to 7 and the cured products of the compositions of Comparative Examples 1 to 5 were compared.

[0144] Specific gravity was measured according to ASTM D1475. For example, the cured product can be weighed according to the standard and then weighed again in water, and the density and specific gravity can be calculated from the difference between the measured weights. Alternatively, a predetermined amount (approximately 5 g) of powder or pellets can be placed in a pyrometer with a previously measured volume, and the specific gravity can be calculated from the difference between the weight and volume at 25°C.

[0145] The specific gravities of the cured products of the compositions of Examples 1 to 7 and Comparative Examples 1 to 5 are summarized in Table 2 below.

[0146] [Table 2]

Claims

1. a resin component; and a filler component, The filler component includes a filler having a specific gravity of 3 or more and a filler having a specific gravity of less than 3. the filler having a specific gravity of 3 or more is alumina, and includes a first filler having a D50 particle size within a range of 50 to 200 μm and a second filler having a D50 particle size within a range of 0.5 to 5 μm, the first filler being spherical and the second filler being angular; the filler having a specific gravity of less than 3 is aluminum hydroxide, and the filler having a D50 particle size within a range of 50 to 90 μm and a specific gravity of less than 3 being angular, the angular shape being an acicular or plate-like shape; The content of the filler component is 80% by weight or more, The resin component includes a difunctional isocyanate compound and a polyfunctional isocyanate compound, and the polyfunctional isocyanate compound is represented by the following chemical formula 3: 【Chemical 1】 wherein L 7 , L 8 and L 9 each independently represent an alkylene group, an alkenyl group, or a methyl group; a cyclohexyl group or an alkynylene group; A composition that forms a cured product having a specific gravity of less than 3.

2. The composition according to claim 1, wherein the difunctional isocyanate compound has a functionality of 0.5 to 1 according to the following formula 1: [Formula 1] Functional group value = 100 x N / M In Formula 1, N is the number of isocyanate groups contained in the isocyanate compound, and M is the molar mass (unit: g / mol) of the isocyanate compound.

3. 3. The composition according to claim 1, wherein the difunctional isocyanate compound has a molar mass in the range of 100 to 500 g / mol.

4. The composition according to any one of claims 1 to 3, characterized in that the difunctional isocyanate compound is a cycloaliphatic isocyanate compound.

5. The polyfunctional isocyanate compound has a functional group value in the range of 0.01 to 0.7 according to the following formula 1:

5. The composition according to claim 1, wherein the composition is comprised in [Formula 1] Functional group value = 100 x N / M In Formula 1, N is the number of isocyanate groups contained in the isocyanate compound, and M is the molar mass (unit: g / mol) of the isocyanate compound.

6. The polyfunctional isocyanate compound has a molar mass in the range of 300 to 1500 g / mol.

6. The composition according to claim 1, wherein

7. The composition according to claim 1 , wherein the filler component contains 60% by weight or more of a filler having a specific gravity of 3 or more.

8. The filler component is 10 to 65 parts by weight per 100 parts by weight of a filler having a specific gravity of 3 or more.

8. Any one of claims 1 to 7, characterized in that it contains a filler having a specific gravity of less than 3. The composition according to item .

9. The ratio of fillers with a specific gravity of less than 3 among the filler components is within the range of 10 to 50% by weight.

9. The composition according to claim 1, wherein

10. The ratio of the first filler in the filler component is within the range of 25 to 50% by weight. The composition according to any one of claims 1 to 9,

11. The proportion of the second filler in the filler component is within the range of 10 to 50% by weight. The composition according to any one of claims 1 to 10,

12. The filler component is a third filler having a specific gravity of 3 or more and a D50 particle size in the range of 10 to 30 μm.

12. The composition according to claim 1, further comprising a filler. Finished product.

13. The weight ratio (C3 / C2) of the third filler (C3) to the second filler (C2) is 13. The composition of claim 12, wherein the .alpha.-methyl- ...beta.

14. 10. The composition according to claim 1, wherein a cured product having a thermal conductivity of 3 W / m·K or more is formed.

14. The composition according to any one of claims 13.

15. a heating element; and the heating element according to any one of claims 1 to 14 in thermal contact with the heating element. A product comprising the composition or a cured product thereof.

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