PCB Work Equipment

Abstract

To provide a substrate work device which performs work to a substrate and achieves a low maintenance frequency while securing a high air flow rate.SOLUTION: A surface mounting machine 15 performs work of mounting a component E on a substrate P and includes: a work part 30; a housing 70 (a frame 71 and an upper housing 72) which houses the work part 30; an intake fan 100 which generates airflow in the housing 70; and a first electric dust collector 101 which collects dust 133 contained in air blown by the intake fan 100.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a substrate working device that performs work on a substrate. [Background technology]

[0002] Conventionally, among board working devices for working on boards, there is known a device that uses a fan to generate air flow within the housing for purposes such as cooling the housing and collecting dust contained in the air within the housing (see, for example, Patent Document 1). Specifically, the X-ray inspection device described in Patent Document 1 is a board inspection device (corresponding to a board working device) that inspects a circuit board on which electronic components are mounted as an object to be inspected and performs various inspections such as inspecting the solder joint state of the electronic components on the board. In this X-ray inspection device, an air vent is formed in the upper surface of the shielding wall, and a ventilation fan is attached inside to cover the air vent. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-122404 A (paragraph 0038, Figures 4 and 8) Summary of the Invention [Problem to be solved by the invention]

[0004] When a fan generates an airflow inside a housing, dust contained in the air may adhere to components inside the housing. For this reason, conventional board processing devices that generate an airflow inside a housing using a fan have collected dust by filtering out the dust in the air using a dust collection filter made of a mesh of thin metal wires. However, there is still room for improvement in dust collection using a mesh dust collection filter.

[0005] This specification provides a technology that can ensure a large air flow rate while achieving low maintenance frequency in a substrate working device that works on substrates. [Means for solving the problem]

[0006] A substrate working device for performing work on a substrate, comprising a working unit for performing the work, a housing in which the working unit is housed, a fan for generating an air flow within the housing, and an electric dust collector for collecting dust contained in the air blown by the fan. [Effects of the Invention]

[0007] According to the above configuration, in a substrate processing device that performs processing on a substrate, it is possible to ensure a large air flow rate while achieving low maintenance frequency. [Brief explanation of the drawings]

[0008] [Figure 1] Schematic diagram of a production line according to embodiment 1 [Figure 2] Cross section of the housing [Figure 3] A top view schematically showing the configuration of the working unit. [Figure 4] Head unit side view [Figure 5] Block diagram showing the electrical configuration of the surface mounter [Figure 6] Cross section of the mount taken along line AA in Figure 2 [Figure 7] Cross-sectional view showing the structure of an electrostatic precipitator [Figure 8] FIG. 10 is a top view schematically illustrating the inside of a work chamber of a surface mounter according to a second embodiment. [Figure 9] FIG. 10 is a top view schematically illustrating the inside of a work chamber of a surface mounter according to a third embodiment. [Figure 10] 10 is a flowchart showing a process for exclusively operating an ionizer and an electrostatic precipitator according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] (Outline of this embodiment) (1) A substrate work device according to an embodiment is a substrate work device that performs work on a substrate, and includes a work unit that performs the work, a housing that houses the work unit, a fan that generates air flow within the housing, and an electric dust collector that collects dust contained in the air blown by the fan.

[0010] The inventors of the present application have found that dust collection filters that collect dust by filtering out dust in the air, such as mesh dust collection filters, have the following problems. - The dust collection filter creates resistance to airflow, making it difficult to ensure a large air flow rate. The dust collection filter is prone to clogging and requires frequent maintenance.

[0011] According to the board processing device (1) above, dust contained in the air blown by the fan is collected by an electrostatic precipitator. Because the electrostatic precipitator does not use a dust collection filter, a larger air flow rate can be ensured compared to when a dust collection filter is used. Furthermore, because the electrostatic precipitator does not use a dust collection filter, clogging is less likely to occur. Therefore, maintenance frequency can be reduced compared to when a dust collection filter is used. Therefore, according to the board working device of (1) above, in the board working device for working on boards, it is possible to ensure a large air flow rate while realizing low maintenance frequency.

[0012] (2) The housing may be formed with a first intake port for drawing air from outside the housing into the housing, and the fan may be disposed in the first intake port.

[0013] According to the board working device of (2) above, the fan disposed in the first air intake port draws air from outside the housing into the housing, thereby ventilating the inside of the housing. Furthermore, according to the board working device of (2) above, dust contained in the air blown by the fan disposed in the first air intake port is collected by an electrostatic precipitator, thereby ensuring a large air flow rate. This allows for efficient ventilation inside the housing. Furthermore, according to the board working device of (2) above, dust is collected by an electrostatic precipitator, thereby realizing low maintenance frequency.

[0014] (3) The device may include a control board and a storage box housed in the housing and housing the control board, wherein the storage box is formed with a second air intake for drawing air outside the storage box into the storage box, and the fan is arranged in the second air intake.

[0015] Some control boards are susceptible to dust (for example, dust can easily cause malfunctions). According to the board processing device described above in (3), dust contained in the air blown by the fan disposed in the second air intake is collected by an electrostatic precipitator, so that dust-sensitive control boards can be more reliably protected from dust.

[0016] (4) The housing may have a working chamber in which the working unit is housed, and the fan may be disposed in the working chamber.

[0017] Fine dust particles may be floating in the work chamber. If this dust particles adhere to the boards or work areas, it may affect the quality of the boards and the operation of the work areas. According to the board processing device of (4) above, dust contained in the air blown by the fan installed in the processing chamber is collected by the electrostatic precipitator, so that dust floating in the processing chamber can be collected. This prevents dust from adhering to the board or processing unit, and reduces the possibility of the dust affecting the quality of the board or the operation of the processing unit. Furthermore, with the board working device described above in (4), dust is collected by an electrostatic precipitator, ensuring a large air flow rate. This allows dust in the working chamber to be collected efficiently, and dust adhesion to the board or working section can be more reliably prevented. Furthermore, with the board working device described above in (4), dust is collected by an electrostatic precipitator, which allows for low maintenance frequency.

[0018] (5) An ionizer may be provided to generate ions for neutralizing the object in the working chamber, and the electrostatic precipitator may be disposed outside the range of influence of the ionizer.

[0019] An ionizer (static eliminator, static eliminator) is a device that neutralizes static electricity from an object by generating positively charged air (positive ions) and negatively charged air (negative ions). For example, if the object is positively charged, the positive ions emitted from the ionizer will be repelled and will not reach the object, but the negative ions will be attracted to the object, neutralizing the object's charge. Ionizers emit both positive and negative ions, so when the air collides with the ions in the space where they are released, they are neutralized, making it impossible to neutralize static electricity over long distances. In other words, the range of an ionizer's effect can be defined as "the distance that the air emitted from the ionizer can travel without being neutralized and remaining charged." This distance varies depending on the flow rate and speed of the air emitted and the discharge output, but for use in circuit board processing equipment, the limit is generally around 300mm to 500mm. There is a concern that if the electrostatic precipitator sucks in the charged air (ionized air) released from the ionizer, the dust may not be properly charged.

[0020] According to the substrate processing device of (5) above, the electrostatic precipitator is disposed outside the range of influence of the ionizer, so that it is possible to prevent the electrostatic precipitator from sucking in the charged air (ionized air) emitted from the ionizer, thereby preventing the dust from being properly charged. The outside of the range of influence of the ionizer is a position 300 mm or more away from the ionizer, and more preferably a position 500 mm or more away.

[0021] (6) The working chamber may include an ionizer that generates ions for neutralizing the object in the working chamber, and a partition wall may be disposed between the electrostatic precipitator and the ionizer.

[0022] According to the substrate processing device of (6) above, a partition wall is provided between the ionizer and the electrostatic precipitator, so that the distance over which ions emitted from the ionizer reach the electrostatic precipitator can be increased. This prevents the electrostatic precipitator from sucking in the charged air (ionized air) emitted from the ionizer, making it impossible to properly charge dust. The distance over which ions emitted from the ionizer reach the electrostatic precipitator is 300 mm or more, and more preferably 500 mm or more.

[0023] (7) The working chamber may include an ionizer that generates ions for neutralizing an object in the working chamber, and a control unit, and the control unit may operate the electrostatic precipitator and the ionizer exclusively.

[0024] According to the substrate working device of (7) above, the electrostatic precipitator and the ionizer are operated exclusively, so that the electrostatic precipitator is prevented from being affected by the ionizer (i.e., dust is not able to be properly charged).

[0025] [Details of the embodiments of the present disclosure] The present disclosure will be described below with reference to exemplary embodiments. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims. The embodiments of the present disclosure can be realized in various forms, such as an apparatus, a method, a computer program for realizing the functions of these apparatuses or methods, and a recording medium on which the computer program is recorded.

[0026] <Embodiment 1> The first embodiment will be described with reference to Figures 1 to 7. In the following description, the reference numerals of the drawings may be omitted for the same components, with some exceptions.

[0027] (1) Production line With reference to Fig. 1, a production line 1 according to a first embodiment will be described. The production line 1 is a line that produces boards on which components are mounted. The production line 1 is equipped with a plurality of board working devices that perform work on the boards (a loader 11, a screen printing machine 12, a print inspection machine 13, a dispenser 14, three surface mounting machines 15, a post-mounting appearance inspection machine 16, a reflow machine 17, a post-cure appearance inspection machine 18, and an unloader 19), which are lined up in a row via a plurality of conveyors 20. In the following description, the surface mounting machine 15 will be used as an example of the board working device.

[0028] (2) Configuration of surface mounter The surface mounter 15 is a device that mounts components on a board on which a circuit pattern is printed. The surface mounter 15 includes a housing 70 shown in Fig. 2, a working unit 30 shown in Fig. 3, a control unit 50 shown in Fig. 5, intake fans 100 and 105 shown in Fig. 6, and a plurality of electrostatic precipitators (a first electrostatic precipitator 101 and a second electrostatic precipitator 106) that collect dust contained in the air blown by the intake fans 100 and 105.

[0029] 2, the housing 70 has a stand 71 and a generally box-shaped upper housing 72 arranged above the stand 71. The upper housing 72 forms a working chamber 120 in which the working unit 30 is housed. The housing 70 will be described later.

[0030] The configuration of the working unit 30 will be described with reference to Fig. 3. The working unit 30 is a mechanism that performs the work of mounting components E on a substrate P. An area A indicated by a two-dot dashed line in Fig. 3 indicates a working position (hereinafter referred to as working position A) where the substrate P is fixed when mounting components E on the substrate P.

[0031] The working section 30 includes a transport conveyor 31, four component supply devices 32, a head unit 33, a head moving section , two component imaging cameras 35, and a board imaging camera . The transport conveyor 31 includes a pair of conveyor belts (front conveyor belt 31A and rear conveyor belt 31B) that move in a circular motion in the X-axis direction, a conveyor drive motor 62 (see FIG. 5) that drives these conveyor belts, etc. The transport conveyor 31 transports the board P from the upstream side to the work position A, and carries out the board P on which the components E have been mounted at the work position A from the downstream side.

[0032] The four component supply devices 32 are arranged in four locations, two at each end in the X-axis direction, on the front and rear sides of the transport conveyor 31. Multiple tape feeders 37 are attached to the component supply devices 32 and aligned horizontally in the X-axis direction. Each tape feeder 37 is equipped with a reel (not shown) around which a component tape (not shown) containing multiple components E is wound, and an electric feeding device (not shown) that unwinds the component tape from the reel, and supplies components E one by one from a component supply position located at the end on the transport conveyor 31 side.

[0033] The head unit 33 is equipped with a plurality of mounting heads 38 that pick up and release components E. The head unit 33 will be described later. The head moving section 34 moves the head unit 33 in the X-axis direction and the Y-axis direction within a predetermined movable range. The head moving section 34 includes a beam 39 that supports the head unit 33 so that it can move back and forth in the X-axis direction, a pair of Y-axis guide rails 40 that support the beam 39 so that it can move back and forth in the Y-axis direction, an X-axis servo motor 58 that moves the head unit 33 back and forth in the X-axis direction, and a Y-axis servo motor 59 that moves the beam 39 back and forth in the Y-axis direction.

[0034] The two component imaging cameras 35 are provided between the two component supply devices 32 aligned in the X-axis direction. The component imaging cameras 35 are provided on the upper surface of the stand 71, and capture images of the component E sucked onto the mounting head 38 from below. The board imaging camera 36 is provided in the head unit 33. The board imaging camera 36 captures an image of a fiducial mark (not shown) attached to the board P from above.

[0035] The head unit 33 will be described with reference to Fig. 4. The head unit 33 is a so-called in-line type, with multiple mounting heads 38 arranged side by side in the X-axis direction. The head unit 33 is provided with a Z-axis servo motor 60 (see Fig. 5) that raises and lowers these mounting heads 38 individually, and an R-axis servo motor 61 (see Fig. 5) that rotates these mounting heads 38 all together around their axes.

[0036] Each mounting head 38 is used to pick up and release components E, and has a nozzle shaft 38A and a suction nozzle 38B that is detachably attached to the lower end of the nozzle shaft 38A. Negative and positive pressures are supplied to the suction nozzle 38B from an air supply device (not shown) via the nozzle shaft 38A. The suction nozzle 38B picks up components E when negative pressure is supplied, and releases the components E when positive pressure is supplied. Here, an in-line type head unit 33 has been described as an example, but the head unit 33 may also be, for example, a so-called rotary head in which a plurality of mounting heads 38 are arranged on the circumference.

[0037] (3) Electrical configuration of the surface mounter 5, the surface mounter 15 includes a control unit 50 and an operation unit 51. The control unit 50 includes an arithmetic processing unit 52, a motor control unit 53, a memory unit 54, an image processing unit 55, an external input / output unit 56, a feeder communication unit 57, etc.

[0038] The arithmetic processing unit 52 includes a CPU, a RAM, etc., and controls each unit of the surface mounter 15 by executing a control program stored in the storage unit 54 . The motor control unit 53 controls the rotation of each motor such as the X-axis servo motor 58 and the Y-axis servo motor 59 under the control of the arithmetic processing unit 52. The motor control unit 53 is a so-called servo amplifier. The storage unit 54 stores various programs and data executed by the arithmetic processing unit 52.

[0039] The image processing unit 55 is configured to take in image signals output from the component imaging camera 35 and the board imaging camera 36 . The external input / output unit 56 is a so-called interface, and is configured to receive detection signals output from various sensors 63 provided in the main body of the surface mounter 15. The external input / output unit 56 is also configured to control the operation of various actuators 64 (such as an air supply device and electrostatic precipitators 101 and 106 described below) based on control signals output from the arithmetic processing unit 52.

[0040] The feeder communication unit 57 is connected to the tape feeder 37 and controls the tape feeder 37 in an integrated manner. The operation unit 51 includes a display device such as a liquid crystal display, and input devices such as a touch panel, a keyboard, a mouse, etc. An operator can operate the operation unit 51 to perform various settings.

[0041] (4) Housing The housing 70 will be described with reference to FIGS. (4-1) Stand 2, the stand 71 is formed in a box shape having a bottom wall 80, left and right side walls 81, and an upper wall 82. Legs 83 are provided at the four corners of the lower surface of the bottom wall 80.

[0042] 6, the interior of the cradle 71 is partitioned by three partitions 84, 85, and 86 into two air flow paths 87 and 88, a power supply chamber 89, and a control chamber 90. Specifically, an air flow path 87 extending in the front-to-rear direction is formed between a partition 84 extending in the front-to-rear direction near the left side wall 81 of the cradle 71 and the left side wall 81. Similarly, an air flow path 88 extending in the front-to-rear direction is formed between a partition 86 extending in the front-to-rear direction near the right side wall 81 of the cradle 71 and the right side wall 81. The space between the two partitions 84 and 85 is partitioned into a power supply chamber 89 and a control chamber 90 by a partition 85 extending in the left-to-right direction.

[0043] The rear side of the power supply chamber 89 is closed by a metal or resin rear cover 91. The front side of the control chamber 90 is closed by a metal or resin front cover 92. The front openings of the air flow path 87 and the air flow path 88 are also closed by metal or resin covers 93. The rear opening of the air flow path 87 does not have a cover attached, and forms a first air intake port 94 for drawing in air from outside the base 71 to cool the inside of the base 71. The rear opening of the air flow path 88 also does not have a cover attached, and forms an exhaust port 95 for exhausting to the outside of the base 71 the air that has been drawn in from the first air intake port 94 and used to cool the heat-generating elements (power supply unit 97 and control board 98) inside the base 71.

[0044] The left partition wall 84 is formed with a through-hole for introducing air drawn into the air flow path 87 into the power supply chamber 89, and a through-hole for introducing air into the control chamber 90. Fans 96 for drawing air into the air flow path 87 are attached to each of these through-holes. Similarly, the right partition wall 86 is formed with a through-hole for exhausting air from the power supply chamber 89 to the air flow path 88, and a through-hole for exhausting air from the control chamber 90 to the air flow path 88. Fans 96 for exhausting air into the air flow path 88 are attached to each of these through-holes.

[0045] The power supply chamber 89 houses a power supply unit 97 that converts AC current into DC current and supplies it to each unit of the surface mounter 15. The control chamber 90 houses a plurality of control boards 98 on which the control unit 50 is mounted. Some of the plurality of control boards 98 that are susceptible to dust (for example, the control board on which the motor control unit 53 is mounted) are housed in a metal storage box 99.

[0046] An intake fan 100 (an example of a fan) that generates an air flow inside the housing 70 is disposed in a first intake port 94 formed on the rear side of the air flow path 87. The intake fan 100 is a fan that draws in air outside the base 71 to cool the inside of the base 71. A first electrostatic precipitator 101 that collects dust contained in the air blown by the intake fan 100 is disposed behind the intake fan 100 (in other words, upstream of the intake fan 100 in the direction of the air flow generated by the intake fan 100). The first electrostatic precipitator 101 will be described later.

[0047] An exhaust fan 102 is disposed in the exhaust port 95 formed on the rear side of the air flow path 88. The exhaust fan 102 is a fan for exhausting the air drawn in by the intake fan 100 and heated by the heating element in the base 71 to the outside of the base 71.

[0048] The storage box 99 is formed with a second intake port 103 for drawing air outside the storage box 99 into the storage box 99, and an exhaust port 104 for exhausting air inside the storage box 99 to the outside of the storage box 99. An intake fan 105 (an example of a fan) for drawing air outside the storage box 99 into the storage box 99 is disposed in the second intake port 103. A second electrostatic precipitator 106 for collecting dust contained in the air blown by the intake fan 105 is disposed in front of the intake fan 105 (in other words, upstream of the intake fan 105 in the direction of air flow generated by the intake fan 105). The second electrostatic precipitator 106 will be described later.

[0049] (4-2) Upper housing 2, the upper housing 72 is formed in the shape of a hollow box. The upper housing 72 is disposed on a stand 71, and forms a working chamber 120 in which the working unit 30 described above is housed. An opening (not shown) is formed in the right side wall 72A of the upper housing 72 for carrying the board P into the work chamber 120. An opening (not shown) is formed in the left side wall 72B of the upper housing 72 for carrying the board P, on which components E have been mounted at work position A, downstream. Openings (not shown) for setting the component supply device 32 are formed in the front and rear side walls of the upper housing 72. An opening / closing cover (not shown) for opening and closing the housing 70 is arranged at the corner formed by the top wall 72C and the front side wall of the upper housing 72.

[0050] (5) Electrostatic precipitator The first electrostatic precipitator 101 and the second electrostatic precipitator 106 will be described with reference to FIG. 7. The first electrostatic precipitator 101 and the second electrostatic precipitator 106 are substantially the same, and therefore the first electrostatic precipitator 101 will be described here as an example. There are various types of electrostatic precipitators, such as the penny type and the Cottrell type, but the penny type will be described here as an example. Penny type electrostatic precipitators also have various configurations. The electrostatic precipitator described below is an example of a penny type electrostatic precipitator, and penny type electrostatic precipitators are not limited to the configuration described below.

[0051] The first electrostatic precipitator 101 includes a charging section 130 and a dust collecting section 131. The charging section 130 and the dust collecting section 131 are each formed in a cylindrical shape and are connected via a cylindrical insulating section 132 made of an insulating material such as resin. The charging unit 130 negatively charges the dust 133 by corona discharge, and has a cylindrical positive electrode 130A and a negative electrode 130B such as a tungsten wire arranged inside the positive electrode 130A. A pulsed voltage of, for example, 11,000 V (volts) is applied to the charging unit 130. A high-frequency AC voltage may also be applied to the charging unit 130. When a voltage is applied to the charging unit 130, a corona discharge occurs between the positive electrode 130A and the negative electrode 130B, and the dust 133 in the air becomes negatively charged.

[0052] Dust collection unit 131 collects dust 133 negatively charged by charging unit 130, and has a cylindrical positive electrode 131A and a negative electrode 131B arranged inside positive electrode 131A. A voltage of, for example, 6000 V (volts) is applied to dust collection unit 131. The method of applying voltage to dust collection unit 131 differs from that of charging unit 130. A constant voltage (non-pulsed voltage) is applied to dust collection unit 131. When voltage is applied to dust collection unit 131, negatively charged dust 133 is attracted to positive electrode 131A of dust collection unit 131 by static electricity. As a result, dust 133 is collected.

[0053] When the surface mounter 15 is powered on (or when production of the board P starts), the control unit 50 rotates each fan (fan 96, intake fan 100, exhaust fan 102, and intake fan 105) and applies a voltage to each electrostatic precipitator 101, 106. When the intake fan 100 rotates, air outside the housing 70 is drawn into the housing 70. At this time, dust 133 in the air is collected by the first electrostatic precipitator 101, which is arranged upstream of the intake fan 100. Similarly, when the intake fan 105 rotates, air outside the container box 99 is drawn into the container box 99. At this time, dust 133 in the air is collected by the second electrostatic precipitator 106, which is arranged upstream of the intake fan 105.

[0054] (6) Effects of the embodiment In the surface mounter 15 according to the first embodiment, dust contained in the air blown by the fan is collected by electrostatic precipitators (first electrostatic precipitator 101 and second electrostatic precipitator 106). Because the electrostatic precipitators do not use dust collection filters, a larger air flow rate can be ensured compared to when dust collection filters are used. Furthermore, because the electrostatic precipitators do not use dust collection filters, they are less likely to become clogged. Therefore, maintenance frequency can be reduced compared to when dust collection filters are used. Therefore, according to the surface mounter 15, in the surface mounter 15 that performs work on the substrate P, it is possible to ensure a large air flow rate while achieving low maintenance frequency.

[0055] While cleaning mesh dust collection filters involves vacuuming or washing with water, cleaning electrostatic precipitators 101 and 106 can be achieved by simply wiping the dust collection section 131 with a cloth, which has the advantage of reducing the effort required for cleaning. Since the electrostatic precipitators 101 and 106 are not easily clogged, even if cleaning is neglected, the change in the air flow rate is small, and there is an advantage that the surface mounter 15 is not easily overheated.

[0056] According to the surface mounter 15, the air outside the housing 70 is drawn into the housing 70 by the intake fan 100 disposed in the first air intake port 94, thereby ventilating the inside of the housing 70. Furthermore, according to the surface mounter 15, dust contained in the air blown by the intake fan 100 is collected by the first electrostatic precipitator 101, so a large air flow rate can be ensured. This allows the inside of the housing 70 to be ventilated efficiently. Furthermore, according to the surface mounter 15, dust is collected by the first electrostatic precipitator 101, so that low maintenance frequency can be achieved.

[0057] According to the surface mounter 15, dust contained in the air blown by the intake fan 105 is collected by the second electrostatic precipitator 106, so that the control board 98, which is susceptible to dust, can be more reliably protected from dust.

[0058] <Embodiment 2> The second embodiment will be explained with reference to FIG. As shown in FIG. 8, the work chamber 120 of the surface mounter 15 according to the second embodiment contains a fan 142 that generates an air flow within the work chamber 120 in order to collect dust floating within the work chamber 120, and an electric dust collector 141 that collects dust contained in the air blown by the fan 142.

[0059] Furthermore, the surface mounter 15 according to the second embodiment is provided with an ionizer 140 (neutralizer) disposed within the working chamber 120, which generates ions for neutralizing objects (such as the substrate P and the working section 30) within the working chamber 120.

[0060] In the surface mounter 15 according to the second embodiment, in order to prevent the electrostatic precipitator 141 from being affected by the ionizer 140, the electrostatic precipitator 141 is disposed outside the range of influence of the ionizer 140. The outside the range of influence of the ionizer 140 is a position that is 300 mm or more away from the ionizer 140, and more preferably a position that is 500 mm or more away.

[0061] According to the surface mounter 15 of the second embodiment, dust contained in the air blown by the fan 142 arranged in the working chamber 120 is collected by the electrostatic precipitator 141, so that it is possible to collect dust floating in the working chamber 120. This prevents dust from adhering to the substrate P and the working unit 30, and reduces the possibility that the quality of the substrate P or the operation of the working unit 30 will be affected. Furthermore, the surface mounter 15 can ensure a large air flow rate by collecting dust using the electrostatic precipitator 141. This allows dust inside the working chamber 120 to be collected efficiently, and more reliably prevents dust from adhering to the board P or working section 30. Furthermore, the surface mounter 15 can achieve low maintenance frequency by collecting dust using the electrostatic precipitator 141.

[0062] According to the surface mounter 15, the electric dust collector 141 is arranged outside the range of influence of the ionizer 140, and therefore it is possible to prevent the electric dust collector 141 from sucking in the charged air (ionized air) emitted from the ionizer 140, thereby preventing the dust from being properly charged.

[0063] <Embodiment 3> The third embodiment will be explained with reference to FIG. 9, the surface mounter 15 according to the third embodiment also has an ionizer 140 and an electrostatic precipitator 141 arranged in a working chamber 120. Due to space constraints within the working chamber 120, it may not be possible to arrange the electrostatic precipitator 141 sufficiently far from the ionizer 140. For this reason, in the surface mounter 15 according to the third embodiment, a partition wall 150 is arranged between the electrostatic precipitator 141 and the ionizer 140 to prevent the electrostatic precipitator 141 from being affected by the ionizer 140.

[0064] 9 has a shape obtained by bending a metal plate 90 degrees in top view, and is arranged so that the ionizer 140 is not visible from the electrostatic precipitator 141. The partition 150 may be made of resin. By providing the partition 150, the distance over which the ions emitted from the ionizer 140 reach the electrostatic precipitator 141 is 300 mm or more. It is more preferable that the distance over which the ions emitted from the ionizer 140 reach the electrostatic precipitator 141 is 500 mm or more.

[0065] The shape of partition wall 150 is not limited to a shape formed by bending a metal plate 90 degrees, as long as it can make the distance over which ions emitted from ionizer 140 reach electrostatic precipitator 141 300 mm or more. For example, partition wall 150 may be arc-shaped or may be an unbent plate.

[0066] In the surface mounter 15 according to the third embodiment, the partition wall 150 is disposed between the ionizer 140 and the electrostatic precipitator 141, and this increases the distance over which the ions emitted from the ionizer 140 reach the electrostatic precipitator 141. This prevents the electrostatic precipitator 141 from sucking in the charged air (ionized air) emitted from the ionizer 140, thereby preventing dust from being properly charged.

[0067] <Embodiment 4> The fourth embodiment will be explained with reference to FIG. The surface mounter 15 according to the fourth embodiment is similar to that according to the second embodiment, and an ionizer 140 and an electrostatic precipitator 141 are provided in the work chamber 120. However, in the surface mounter 15 according to the fourth embodiment, the electrostatic precipitator 141 cannot be disposed apart from the ionizer 140, and the electrostatic precipitator 141 is within the range of influence of the ionizer 140.

[0068] The control unit 50 according to the fourth embodiment operates the ionizer 140 and the electrostatic precipitator 141 exclusively so that the electrostatic precipitator 141 is less susceptible to the influence of the ionizer 140. Specifically, when a mounting operation is in progress to mount a component E on a substrate P (hereinafter simply referred to as "mounting in progress"), the control unit 50 stops the electrostatic precipitator 141 and operates the ionizer 140. Conversely, when mounting is not in progress, the control unit 50 stops the ionizer 140 and operates the electrostatic precipitator 141.

[0069] 10, a description will be given of a process flow in which the control unit 50 exclusively operates the ionizer 140 and the electrostatic precipitator 141. This process starts when the power of the surface mounter 15 is turned on and the surface mounter 15 starts up.

[0070] In S101, the control unit 50 determines whether or not the surface mounter 15 is currently performing mounting. If mounting is currently being performed, the control unit 50 proceeds to S102, and if mounting is not currently being performed, the control unit 50 proceeds to S105. In S103, the control unit 50 stops the electrostatic precipitator 141. In S104, the control unit 50 activates the ionizer 140. In S105, the control unit 50 stops the ionizer 140. In S106, the control unit 50 starts the electrostatic precipitator 141.

[0071] According to the surface mounter 15 of the fourth embodiment, the electrostatic precipitator 141 and the ionizer 140 are operated exclusively, so that the electrostatic precipitator 141 can be prevented from being affected by the ionizer 140 (i.e., the electrostatic precipitator 141 can be prevented from being unable to charge dust appropriately).

[0072] <Other embodiments> The technology disclosed in this specification is not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed in this specification.

[0073] (1) In the above-described first embodiment, the charging unit 130 includes a cylindrical positive electrode 130A. However, the configuration of the positive electrode 130A is not limited to this. For example, the positive electrode 130A may be configured with two metal plates arranged in parallel. The same applies to the dust collecting unit 131.

[0074] (2) In the above-described first embodiment, the first air intake port is formed in the base 71 (part of the housing). However, the first air intake port may be formed in the upper housing 72 (part of the housing). A fan may be provided in the first air intake port to draw air outside the housing 70 into the working chamber 120. This allows ventilation inside the working chamber 120.

[0075] However, if dust in the sucked air adheres to substrate P or working unit 30, it may affect the quality of substrate P or the operation of working unit 30. For this reason, an electrostatic precipitator 141 may be provided to collect dust contained in the air blown by the fan arranged in the first air intake port. In this way, dust contained in the air blown by the fan arranged in the first air intake port is collected by electrostatic precipitator 141, thereby reducing the possibility that dust will affect the quality of substrate P or the operation of working unit 30. In addition, this configuration ensures a large air flow rate because dust is collected by the electrostatic precipitator 141. This allows for efficient ventilation inside the work chamber 120. Furthermore, in this configuration, dust is collected by the electrostatic precipitator 141, which allows for low maintenance frequency.

[0076] (3) In the above embodiment, the surface mounter 15 is exemplified as the board working device, but the board working device is not limited to the surface mounter 15. For example, the board working device may be a screen printing machine 12, a print inspection machine 13, a dispenser 14, a post-mounting appearance inspection machine 16, a reflow machine 17, a post-cure appearance inspection machine 18, or the like.

[0077] (4) In the above embodiment, the Penny system is used as an example of the system for collecting dust by the electrostatic precipitator 141. However, the electrostatic precipitator 141 may use the Cottrell system or other systems for collecting dust. [Explanation of symbols]

[0078] 15: Surface mounter (an example of a board work device) 30:Working section 50: Control unit 70: Cabinet 94: First intake 98: Control board 99: Storage box 100: Intake fan (example of a fan) 101: First electrostatic precipitator (an example of an electrostatic precipitator) 103: Second intake 105: Intake fan (an example of a fan) 106: Second electrostatic precipitator (an example of an electrostatic precipitator) 120:Workroom 133: Dust 140: Ionizer 141: Electrostatic precipitator 142: Fan 150: Bulkhead P: Substrate

Claims

1. A substrate working device for working on a substrate, a working unit that performs the work; a housing in which the working unit is housed; a fan that generates an air flow within the housing; an electric dust collector that collects dust contained in the air blown by the fan; A substrate working device comprising:

2. 2. The substrate working device according to claim 1, a first intake port is formed in the housing to draw air outside the housing into the housing; The fan is disposed in the first intake port.

3. 2. The substrate working device according to claim 1, A control board; a housing box that is housed in the housing and that houses the control board; Equipped with a second intake port is formed in the housing box to draw air outside the housing box into the housing box; The fan is disposed in the second intake port.

4. 2. The substrate working device according to claim 1, the housing has a working chamber in which the working unit is housed, The fan is disposed within the working chamber.

5. 5. The substrate working device according to claim 4, an ionizer that generates ions to neutralize the object in the working chamber; The substrate processing device, wherein the electrostatic precipitator is disposed outside the range of influence of the ionizer.

6. 5. The substrate working device according to claim 4, an ionizer that generates ions to neutralize the object in the working chamber; The substrate processing device, wherein a partition wall is disposed between the electrostatic precipitator and the ionizer.

7. 5. The substrate working device according to claim 4, an ionizer that generates ions to neutralize an object in the working chamber; A control unit; Equipped with The control unit operates the electric dust collector and the ionizer exclusively.

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