Flexure for disk device suspension, and disk device suspension

Abstract

To provide a flexure of a suspension for a disk drive and a suspension for the disk drive that can be thinner.SOLUTION: A flexure of a disk drive suspension includes: a metal base 40; and a wiring portion 50 provided along the metal base. The wiring portion has: a base insulating layer 61; a conductive layer 71 overlapping with the base insulating layer; and a cover insulating layer 81 overlapping with the conductive layer. The metal base has a pair of first portions 41A and 41B having side surfaces facing each other. At least one of the base insulating layer and the cover insulating layer is in contact with the side surface between the pair of first portions. The conductive layer does not overlap with the metal base in a stacking direction of the wiring portion.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a flexure for a suspension for a disk drive, and a suspension for a disk drive. [Background technology]

[0002] Hard disk drives (HDDs) are used in information processing devices such as personal computers. Hard disk drives include a magnetic disk that rotates around a spindle and a carriage that rotates around a pivot shaft. The carriage has an actuator arm and rotates around the pivot shaft in the track width direction of the disk by a positioning motor such as a voice coil motor.

[0003] A disk drive suspension (hereinafter simply referred to as the suspension) is attached to the actuator arm. The suspension includes a load beam and a flexure placed on the load beam. A slider that constitutes a magnetic head is mounted on a gimbal portion formed near the tip of the flexure.

[0004] The slider is provided with an element (transducer) for accessing the disk, such as reading or writing data. The load beam, flexure, and slider constitute a head gimbal assembly.

[0005] To accommodate the increasing recording density of disks, it is necessary to further miniaturize the head gimbal assembly and to position the slider with higher precision relative to the recording surface of the disk.

[0006] Due to strong demand for improved recording capacity of hard disk drives in response to improved recording density, efforts are being made to increase the number of magnetic disks installed in hard disk drives (so-called multi-disk configurations). For example, Patent Document 1 discloses a disk drive that can accommodate an increased number of magnetic disks as recording media. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2020-129423 Summary of the Invention [Problem to be solved by the invention]

[0008] In order to increase the number of magnetic disks, it is necessary not only to make the magnetic disks thinner, but also to reduce the spacing between the magnetic disks. Reducing the spacing between magnetic disks increases the risk of contact between the suspensions facing each other between the magnetic disks. This has led to a demand for thinner suspensions.

[0009] However, there is still room for improvement in terms of reducing the thickness of the suspension. For example, reducing the thickness of the load beam can be difficult because it has a significant effect on the spring load and suspension resonance.

[0010] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a flexure for a disk drive suspension that can be made thinner, and a disk drive suspension. [Means for solving the problem]

[0011] A flexure for a disk drive suspension according to one embodiment includes a metal base and a wiring portion provided along the metal base, the wiring portion including a base insulating layer, a conductor layer overlaid on the base insulating layer, and a cover insulating layer overlaid on the conductor layer, and the metal base includes a pair of first portions having side surfaces facing each other.

[0012] At least one of the insulating base layer and the insulating cover layer is in contact with the side surface between the pair of first portions, and the conductor layer does not overlap the metal base in the stacking direction of the wiring portion.

[0013] The insulating base layer, the conductor layer, and the insulating cover layer may be located between the side surfaces, and the thickness of the wiring portion may be equal to or less than the thickness of the pair of first portions. At least a portion of the conductor layer may be embedded in the insulating base layer.

[0014] The insulating base layer may be located between the side surfaces, and the conductor layer and the insulating cover layer may not be located between the side surfaces. An air layer may be further provided, and the insulating base layer may be in contact with the air layer between the side surfaces.

[0015] The base insulating layer may further include a support layer that supports the wiring portion, and in the stacking direction, the base insulating layer may have a first surface to which the conductor layer contacts and a second surface opposite the first surface, and the support layer may contact the second surface.

[0016] The semiconductor device may further include a connection portion, the conductor layer having a plurality of wirings arranged in a direction perpendicular to the extension direction of the wiring portion, and the connection portion being electrically connected to at least one of the plurality of wirings.

[0017] A flexure for a disk drive suspension according to one embodiment includes a metal base and a wiring portion provided along the metal base. The wiring portion includes a base insulating layer, a conductor layer overlaid on the base insulating layer, and a cover insulating layer overlaid on the conductor layer. The metal base includes a pair of first portions having opposing side surfaces and a second portion overlaid on the conductor layer and connected to the pair of first portions.

[0018] At least one of the insulating base layer and the insulating cover layer is in contact with the side surface between the pair of first portions, and the thickness of the second portion is smaller than the thickness of the first portion. The second portion may have an opening overlapping the conductor layer.

[0019] A disk drive suspension according to one embodiment includes a load beam and the flexure superposed on the load beam. [Effects of the Invention]

[0020] According to the present invention, it is possible to provide a flexure for a disk drive suspension that can be made thinner, and a disk drive suspension. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. 1 is a schematic perspective view showing an example of a disk device. [Figure 2] FIG. 2 is a schematic cross-sectional view showing a part of the disk device. [Figure 3] FIG. 3 is a schematic plan view of the suspension according to the first embodiment. [Figure 4] FIG. 4 is a schematic plan view of the flexure shown in FIG. [Figure 5] FIG. 5 is a schematic perspective cross-sectional view of the flexure taken along line VV in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional view of the flexure shown in FIG. [Figure 7] FIG. 7 shows a comparative example of the flexure according to the first embodiment. [Figure 8] FIG. 8 is a schematic cross-sectional view of a flexure according to the second embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view of a flexure according to the third embodiment. [Figure 10] FIG. 10 is a schematic cross-sectional view of a flexure according to the fourth embodiment. [Figure 11] FIG. 11 is a schematic cross-sectional view of a flexure according to the fifth embodiment. [Figure 12] FIG. 12 is a schematic cross-sectional view of a flexure according to the sixth embodiment. [Figure 13]FIG. 13 is a schematic cross-sectional view of a flexure according to the seventh embodiment. [Figure 14] FIG. 14 is a schematic cross-sectional view of a flexure according to the eighth embodiment. [Figure 15] FIG. 15 is a schematic cross-sectional view of a flexure according to the ninth embodiment. [Figure 16] FIG. 16 is a schematic cross-sectional view of a flexure according to the tenth embodiment. [Figure 17] FIG. 17 is a schematic partial plan view of a flexure according to the eleventh embodiment. [Figure 18] FIG. 18 is a schematic cross-sectional view of the flexure taken along line XVIII-XVIII in FIG. [Figure 19] FIG. 19 is a schematic partial plan view of a flexure according to the twelfth embodiment. [Figure 20] FIG. 20 is a schematic cross-sectional view of the flexure taken along line XX-XX in FIG. [Figure 21] FIG. 21 is a schematic cross-sectional view of a flexure according to the thirteenth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0022] [First embodiment] Fig. 1 is a schematic perspective view showing an example of a disk drive (HDD) 1. In the example shown in Fig. 1, the disk drive 1 has a case 2, a plurality of magnetic disks (hereinafter simply referred to as disks 4) that rotate around a spindle 3, a carriage 6 that can rotate around a pivot shaft 5, and a positioning motor (voice coil motor) 7 for driving the carriage 6. The case 2 is sealed with a lid (not shown).

[0023] 2 is a schematic cross-sectional view showing a part of the disk device 1. As shown in FIGS. 1 and 2, a carriage 6 is provided with a plurality of arms (carriage arms) 8. A suspension 10 is attached to the tip of each of the plurality of arms 8. A slider 11 constituting a magnetic head is provided at the tip of each of the suspensions 10.

[0024] When the disk 4 rotates at high speed, air flows in between the disk 4 and the slider 11, forming an air bearing. When the positioning motor 7 rotates the carriage 6, the suspension 10 moves in the radial direction of the disk 4, causing the slider 11 to move to the desired track on the disk 4.

[0025] 2, the disk 4 includes a first disk 4A and a second disk 4B. The first disk 4A faces the second disk 4B at a predetermined distance. The disk device 1 includes a plurality of suspensions 10, which include a first suspension 10A and a second suspension 10B.

[0026] The first suspension 10A and the second suspension 10B are located between the first disc 4A and the second disc 4B. The first suspension 10A faces the second suspension 10B in the thickness direction of the case 2. The number of discs 4 is not limited to two, but may be three or more. The number of suspensions 10 can be changed appropriately depending on the number of discs 4.

[0027] Fig. 3 is a schematic plan view of the suspension 10 according to the first embodiment. Fig. 4 is a schematic plan view of the flexure 30 shown in Fig. 3. The suspension 10 includes a base plate 21, a load beam 22, and the flexure 30.

[0028] The load beam 22 and the flexure 30 both extend in the longitudinal direction of the suspension 10. Hereinafter, the longitudinal direction of the suspension 10, the load beam 22, and the flexure 30 is defined as the longitudinal direction X, and the direction perpendicular to the longitudinal direction X is defined as the lateral direction Y of the suspension 10, the load beam 22, the flexure 30, etc.

[0029] The direction intersecting (e.g., perpendicular to) the longitudinal direction X and the lateral direction Y is defined as the thickness direction Z of the suspension 10, the load beam 22, the flexure 30, etc. Furthermore, a sway direction S is defined as indicated by an arc-shaped arrow near the tip of the load beam 22.

[0030] The base plate 21 is made of a metal material such as stainless steel. The thickness of the base plate 21 is, for example, 120 μm, but is not limited to this example. The base plate 21 is provided with a boss portion 23 for attaching the suspension 10 to the arm 8 (shown in FIGS. 1 and 2) of the carriage 6.

[0031] The load beam 22 is made of a metal material such as stainless steel. The thickness of the load beam 22 is, for example, 30 to 80 μm. The load beam 22 has a shape that tapers toward the tip (left in the drawing).

[0032] The load beam 22 has a spring portion 24 at one end in the longitudinal direction X. The load beam 22 is fixed to the base plate 21 at a welded portion 25 by spot welding using a laser, for example. The load beam 22 is elastically supported by the base plate 21 via the spring portion 24.

[0033] The flexure 30 is disposed along the base plate 21 and the load beam 22. The flexure 30 is fixed to the base plate 21 and the load beam 22 at a welded portion 25 by spot welding using, for example, a laser.

[0034] The flexure 30 includes a tip portion 31 (left side in the drawing) that overlaps the load beam 22, and a flexure tail 32 that extends from the tip portion 31 toward the rear of the base plate 21 (right side in the drawing).

[0035] The flexure 30 includes a metal base 40 made of, for example, a thin stainless steel plate, and a wiring portion 50 provided along the metal base 40. The flexure 30 has a laminated structure. The metal base 40 is sometimes called a stainless steel layer. The thickness of the metal base 40 is smaller than the thickness of the load beam 22.

[0036] The flexure 30 further includes a tongue 33 and a pair of outriggers 34A and 34B at the tip end portion 31. The slider 11 is mounted on the tongue 33. An element capable of converting magnetic signals and electric signals, such as an MR element, is provided at the tip end of the slider 11.

[0037] At the tip end portion 31, the wiring section 50 is electrically connected to elements of the slider 11 via terminals 51. These elements are used to access the disk, such as to write or read data. The slider 11, load beam 22, and flexure 30 constitute a head gimbal assembly.

[0038] The pair of outriggers 34A, 34B are disposed on both sides of the tongue 33 in the short-side direction Y. The pair of outriggers 34A, 34B are shaped to protrude outward from both sides of the tongue 33 in the short-side direction Y. The tongue 33 and the pair of outriggers 34A, 34B are all part of the metal base 40, and the contours of each are formed by, for example, etching.

[0039] The tongue 33, the pair of outriggers 34A, 34B, etc. form a gimbal portion 35. The gimbal portion 35 is formed on the tip portion 31 of the flexure 30. Microactuator elements 36A, 36B are mounted on the gimbal portion 35. The microactuator elements 36A, 36B have the function of rotating the tongue 33 in the sway direction S.

[0040] The microactuator elements 36A and 36B are arranged on both sides of the slider 11 in the short-side direction Y. The microactuator elements 36A and 36B are made of a piezoelectric material such as lead zirconate titanate (PZT). The microactuator elements 36A and 36B are each fixed to an actuator support portion of the tongue 33 with a conductive adhesive or the like.

[0041] Fig. 5 is a schematic perspective cross-sectional view of the flexure 30 taken along line VV in Fig. 4. Fig. 6 is a schematic cross-sectional view of the flexure 30 shown in Fig. 5. In Figs. 5 and 6, the cross section is viewed from the flexure tail 32 side.

[0042] Hereinafter, the direction perpendicular to the extension direction of the wiring portion 50 may be referred to as the "width direction of the wiring portion 50." The width direction of the wiring portion 50 varies depending on the position of the wiring portion 50 in the longitudinal direction X. For example, in the examples shown in FIGS. 5 and 6, the extension direction of the wiring portion 50 corresponds to the longitudinal direction X, and the width direction of the wiring portion 50 corresponds to the lateral direction Y.

[0043] As described above, the flexure 30 has the metal base 40 and the wiring portion 50. As shown in Figures 5 and 6, the metal base 40 has a pair of first portions 41A and 41B.

[0044] The pair of first portions 41A, 41B are located on both sides of the flexure 30 in the short-side direction Y. The width of the metal base 40 in the short-side direction Y is greater than the width of the wiring portion 50 in the short-side direction Y. From another perspective, the metal base 40 can be seen in a plan view of the suspension 10 seen from the flexure 30 side.

[0045] 5 and 6, the pair of first portions 41A, 41B are formed to have a rectangular cross section. The pair of first portions 41A, 41B may also have a square cross section. The pair of first portions 41A, 41B may also include a curved surface in the cross section. The pair of first portions 41A, 41B are approximately equal in size.

[0046] The first portion 41A has a surface 42, a surface 43 opposite to the surface 42 in the thickness direction Z, and a side surface 44 connecting the surfaces 42 and 43. The first portion 41B has a surface 45, a surface 46 opposite to the surface 45 in the thickness direction Z, and a side surface 47 connecting the surfaces 45 and 46.

[0047] In the tip portion 31, the surfaces 43 and 46 are surfaces that face, for example, the load beam 22 (shown in FIG. 3). In the thickness direction Z, the surface 42 is located on the same plane as the surface 45, and the surface 43 is located on the same plane as the surface 46.

[0048] The side surfaces 44 and 47 face each other in the short-side direction Y. In the example shown in Figures 5 and 6, the side surfaces 44 and 47 are surfaces that are approximately parallel to a plane defined by the longitudinal direction X and the thickness direction Z, for example.

[0049] The wiring portion 50 has a base insulating layer 61, a conductor layer 71 overlaid on the base insulating layer 61, and a cover insulating layer 81 overlaid on the conductor layer 71. The stacking direction of the wiring portion 50 is the direction along the thickness direction Z.

[0050] The insulating base layer 61 and the insulating cover layer 81 are made of an electrically insulating resin material such as polyimide. In the example shown in Figures 5 and 6, the insulating base layer 61 has a uniform thickness in the short-side direction Y.

[0051] The insulating base layer 61 has a surface 62 (first surface) and a surface 63 (second surface) opposite to the surface 62 in the thickness direction Z. The surface 62 is the surface where the conductor layer 71 and the insulating cover layer 81 come into contact. In the tip side portion 31, the surface 63 is the surface facing, for example, the load beam 22 (shown in FIG. 3).

[0052] 5 and 6, the surface 63 in the thickness direction Z is located on the same plane as the surfaces 43 and 46. The insulating base layer 61 further has an end surface 64 and an end surface 65 opposite to the end surface 64 in the short-side direction Y. The end surfaces 64 and 65 connect the surface 62 and the surface 63.

[0053] The cover insulating layer 81 has an end face 82 and an end face 83 opposite to the end face 82 in the short direction Y. In the thickness direction Z, the end face 64 is located directly below the end face 82, and the end face 65 is located directly below the end face 83.

[0054] The conductor layer 71 is made of a highly conductive metal material such as copper. The conductor layer 71 is formed by etching to form a predetermined pattern along the insulating base layer 61. Alternatively, the conductor layer 71 may be formed by a layer formation process such as plating on the insulating base layer 61 that has been masked with a predetermined pattern.

[0055] 5 and 6, the conductor layer 71 has a plurality of wirings 72 arranged in the width direction of the wiring portion 50 (the short-side direction Y in the example shown in FIGS. 5 and 6). The plurality of wirings 72 includes, for example, a reading wiring and a writing wiring. The plurality of wirings 72 are covered with a cover insulating layer 81.

[0056] A cover insulating layer 81 is located in the region between the pair of first portions 41A, 41B and the conductor layer 71. A cover insulating layer 81 is located in the region between the plurality of wirings 72. This insulates the plurality of wirings 72 from each other.

[0057] In the region between the pair of first portions 41A, 41B and the conductor layer 71 and in the region between the plurality of wirings 72, the cover insulating layer 81 does not overlap with the conductor layer 71 in the thickness direction Z. In these regions, the cover insulating layer 81 is in contact with the surface 62 of the base insulating layer 61.

[0058] A plurality of grooves 84 are formed in the cover insulating layer 81 in the region between the pair of first portions 41A, 41B and the conductor layer 71 and in the region between the plurality of wirings 72. The plurality of grooves 84 are recessed toward the surface 62 and are formed along the conductor layer 71.

[0059] 5 and 6, the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 are located between the side surface 44 and the side surface 47 in the short-side direction Y. From another perspective, the wiring portion 50 is sandwiched between the side surface 44 and the side surface 47. In the thickness direction Z, the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 do not overlap with the pair of first portions 41A, 41B of the metal base 40.

[0060] At least one of the base insulating layer 61 and the cover insulating layer 81 is in contact with the side surfaces 44, 47 between the pair of first portions 41A, 41B. In the examples shown in Figures 5 and 6, the base insulating layer 61 and the cover insulating layer 81 are in contact with the side surfaces 44, 47, respectively.

[0061] More specifically, the end faces 64 and 82 are in contact with the side face 44, and the end faces 65 and 83 are in contact with the side face 47. From another perspective, no gaps are formed between the end faces 64 and 82 and the side face 44, and no gaps are formed between the end faces 65 and 83 and the side face 47. The side faces 44 and 47 have portions that are not in contact with the insulating base layer 61 and the insulating cover layer 81.

[0062] Here, as shown in Figure 6, the thickness of the pair of first portions 41A, 41B is thickness T41, the thickness of the wiring portion 50 is thickness T50, the thickness of the base insulating layer 61 is thickness T61, the thickness of the conductor layer 71 is thickness T71, and the thickness of the cover insulating layer 81 is thickness T81.

[0063] A thickness T41 of the pair of first portions 41A, 41B is approximately equal to the distance between the faces 42, 45 and the faces 43, 46 in the thickness direction Z. The thickness T50 of the wiring portion 50 refers to the thickness of the portion where the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 all overlap in the thickness direction Z.

[0064] In the example shown in FIG. 6, the thickness T50 of the wiring portion 50 is the sum of the thickness T61 of the base insulating layer 61, the thickness T71 of the conductor layer 71, and the thickness T81 of the cover insulating layer 81.

[0065] The thickness T61 of the base insulating layer 61 is approximately equal to the distance between the surface 62 and the surface 63 in the thickness direction Z. The thickness T81 of the cover insulating layer 81 refers to, for example, the thickness in the region overlapping with the conductor layer 71. The thickness T81 of the cover insulating layer 81 is smaller than the thickness T61 of the base insulating layer 61, for example.

[0066] The thickness T50 of the wiring portion 50 is, for example, equal to or less than the thickness T41 of the pair of first portions 41A, 41B (T50≦T41). In this case, the thickness of the flexure 30 in the portion shown in FIGS. 5 and 6 is approximately equal to the thickness T41 of the pair of first portions 41A, 41B.

[0067] 6, the thickness T50 of the wiring portion 50 is approximately equal to the thickness T41 of the pair of first portions 41A, 41B. The thickness T50 of the wiring portion 50 may be smaller than the thickness T41 of the pair of first portions 41A, 41B.

[0068] The thickness T41 of the first portions 41A, 41B is, for example, 11 to 50 μm. The thickness T41 of the pair of first portions 41A, 41B is, for example, 18 μm. The thickness T61 of the base insulating layer 61 is, for example, 5 to 20 μm. The thickness T61 of the base insulating layer 61 is, for example, 6 μm.

[0069] The thickness T81 of the cover insulating layer 81 is, for example, 2 to 10 μm. The thickness T81 of the cover insulating layer 81 is, for example, 2 μm. The thickness T71 of the conductor layer 71 is, for example, 4 to 16 μm. The thickness T71 of the conductor layer 71 is, for example, 10 μm.

[0070] In at least a part of the flexure 30 shown in FIGS. 3 and 4, the metal base 40, the insulating base layer 61, the conductor layer 71, and the insulating cover layer 81 do not all overlap at the same time.

[0071] In the flexure 30, the examples shown in FIGS. 5 and 6 can be mainly applied to the range excluding, for example, the terminal portion of the wiring portion 50 provided on the flexure tail 32 side, the vicinity of the tongue 33, the portion where the aerial wiring portion is formed, and the portion where the via portion is formed.

[0072] The aerial wiring portion is a portion of the wiring portion 50 that is not in contact with the metal base 40. The aerial wiring portion is formed, for example, along the outriggers 34A and 34B. The via portion is a portion that includes a through hole that penetrates the base insulating layer 61, for example.

[0073] The configuration of the flexure 30 in the first embodiment can be applied to the area other than the area indicated by line VV, for example, the area between the area where the pair of outriggers 34A, 34B are formed and the flexure tail 32. This area includes the areas indicated by lines AA, BB, and CC in FIG. 4 and their vicinity.

[0074] As another example, the configuration of the flexure 30 may be applied to the flexure tail 32. As yet another example, the configuration of the flexure 30 may be applied to a range where the flexure 30 overlaps the load beam 22. As yet another example, the configuration of the flexure 30 may be applied to a range where the flexure 30 does not overlap the load beam 22.

[0075] As yet another example, the configuration of the flexure 30 may be applied to both an area where the flexure 30 overlaps the load beam 22 and an area where the flexure 30 does not overlap the load beam 22. However, the applicable area differs depending on the shape of the suspension 10 and other factors, and is not limited to the above example.

[0076] In the flexure 30 of the suspension 10 configured as described above, in at least a part of the flexure 30, the conductor layer 71 does not overlap the metal base 40 in the thickness direction Z, and the metal base 40, the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 do not all overlap at the same time.

[0077] The wiring portion 50 is provided on the metal base 40 so that at least one of the base insulating layer 61 and the cover insulating layer 81 contacts the side surfaces 44, 47 between the pair of first portions 41A, 41B. By configuring the flexure 30 in this manner, it is possible to prevent the thickness of the flexure 30 from increasing, and to make the flexure 30 thinner.

[0078] Fig. 7 is a comparative example of the flexure 30 according to the first embodiment. The flexure 300 shown in Fig. 7 has a wiring portion 50 provided on a metal base 40. A base insulating layer 61 is provided on the metal base 40, and a conductor layer 71 and a cover insulating layer 81 overlap the base insulating layer 61.

[0079] In this case, the thickness of the flexure 300 is the sum of the thickness of the metal base 40 and the thickness of the wiring portion 50. By configuring the flexure 30 as shown in Figures 5 and 6, the thickness of the flexure can be made smaller than that of the flexure 300 shown in Figure 7.

[0080] The base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 are located between the side surface 44 and the side surface 47 in the short-side direction Y. Furthermore, by setting the thickness T50 of the wiring portion 50 to be equal to or smaller than the thickness T41 of the pair of first portions 41A, 41B, the thickness of the flexure 30 does not exceed the thickness T41 of the pair of first portions 41A, 41B, and therefore, the thickness of the flexure 30 can be prevented from increasing.

[0081] For example, when the thickness T50 of the wiring portion 50 is approximately equal to the thickness T41 of the pair of first portions 41A, 41B, the thickness of the flexure 30 can be approximately equal to the thickness T41 of the pair of first portions 41A, 41B.

[0082] Furthermore, at least one of the base insulating layer 61 and the cover insulating layer 81 contacts the side surfaces 44, 47. At least one of the base insulating layer 61 and the cover insulating layer 81 supports the pair of first portions 41A, 41B in the short-side direction Y. This increases the rigidity of the flexure 30 in the short-side direction Y. The rigidity of the flexure 30 in the short-side direction Y is sometimes called "in-plane rigidity."

[0083] 5 and 6, the base insulating layer 61 and the cover insulating layer 81 are in contact with the side surfaces 44 and 47, respectively. Therefore, the rigidity of the flexure 30 in the short direction Y can be further increased compared to when either the base insulating layer 61 or the cover insulating layer 81 is in contact with the side surfaces 44 and 47.

[0084] Furthermore, the flexure 30 of the first embodiment can maintain in-plane rigidity and reduce the spring constant of the flexure 30. This allows for greater freedom in designing the vibration characteristics of the flexure 30.

[0085] By reducing the thickness of the flexure 30 by reducing the number of members stacked in the thickness direction Z, it is possible to increase the degree of freedom in designing, for example, the thickness T61 of the base insulating layer 61 in the wiring portion 50. Changing the thickness T61 of the base insulating layer 61 makes it easier to optimize the transmission characteristics of the flexure 30, such as impedance matching.

[0086] Furthermore, by thinning the flexure 30, it is possible to thin the suspension 10 including the flexure 30. Such a suspension 10 can be applied to a disk device 1 in which the distance between the disks 4 is reduced, and therefore it is possible to provide a disk device 1 that can accommodate an increase in the number of disks 4.

[0087] According to this embodiment, it is possible to provide the flexure 30 of the suspension 10 that can be made thinner, and the suspension 10. In addition to the above, this embodiment provides various other preferable effects.

[0088] Next, other embodiments will be described. In the other embodiments and modifications described below, the same components as those in the first embodiment described above will be assigned the same reference numerals as those in the first embodiment, and detailed descriptions thereof may be omitted or simplified.

[0089] [Second embodiment] 8 is a schematic cross-sectional view of the flexure 30 according to the second embodiment. The flexure 30 of the second embodiment differs from the first embodiment in the wiring section 50.

[0090] 8, the wiring portion 50 has a base insulating layer 61, a conductor layer 71, and a cover insulating layer 81. The cover insulating layer 81 has a surface 85 facing the surface 62 and a surface 86 opposite the surface 85 in the thickness direction Z. In the thickness direction Z, the surface 86 is located on the same plane as the surfaces 42, 45 of the pair of first portions 41A, 41B. The cover insulating layer 81 does not have multiple grooves 84 formed therein.

[0091] The entire side surfaces 44, 47 are in contact with the base insulating layer 61 and the cover insulating layer 81. There are no portions of the side surfaces 44, 47 that are not in contact with the base insulating layer 61 and the cover insulating layer 81, and the space between the side surfaces 44, 47 is filled with the base insulating layer 61 and the cover insulating layer 81. The end surfaces 64 and 82 are in contact with the side surface 44, respectively, and the end surfaces 65 and 83 are in contact with the side surface 47, respectively.

[0092] The thickness T82 of the cover insulating layer 81 in the region between the pair of first portions 41A, 41B and the conductor layer 71 and in the region between the multiple wirings 72 is greater than the thickness T81 of the cover insulating layer 81 in the region overlapping with the conductor layer 71.

[0093] In the region between the pair of first portions 41A, 41B and the conductor layer 71, and in the region between the multiple wirings 72, the combined thickness T61 of the base insulating layer 61 and the thickness T82 of the cover insulating layer 81 is approximately equal to the thickness T41 of the pair of first portions 41A, 41B.

[0094] The configuration of the flexure 30 of the second embodiment can also provide the same effects as those of the first embodiment. In the flexure 30 of the second embodiment, the insulating base layer 61 and the insulating cover layer 81 are filled between the side surface 44 and the side surface 47.

[0095] The insulating base layer 61 and the insulating cover layer 81 are in contact with the entire side surfaces 44, 47. Therefore, the rigidity of the flexure 30 in the short-side direction Y can be further increased compared to the first embodiment.

[0096] [Third embodiment] 9 is a schematic cross-sectional view of a flexure 30 according to the third embodiment. The flexure 30 of the third embodiment differs from the above-described embodiments in the wiring section 50.

[0097] 9, a plurality of grooves 66 recessed from the surface 62 toward the surface 63 are formed in the base insulating layer 61. The plurality of wirings 72 overlap the plurality of grooves 66, respectively. From another perspective, the plurality of wirings 72 are formed along the plurality of grooves 66.

[0098] At least a portion of the conductor layer 71 is buried in the base insulating layer 61. In the example shown in Fig. 9, the depth D66 of the groove 66 is smaller than the thickness T71 of the conductor layer 71. Therefore, the multiple wirings 72 each have a portion 73 that protrudes beyond the groove 66 and a portion 74 that is buried in the groove 66 in the thickness direction Z. In the example shown in Fig. 9, the thickness of the protruding portion 73 is greater than the thickness of the buried portion 74.

[0099] The same effects as those of the above-described embodiments can be obtained with the configuration of the flexure 30 of the third embodiment. In the flexure 30 of the third embodiment, the plurality of wirings 72 are embedded in the plurality of grooves 66 of the base insulating layer 61, respectively, and therefore the plurality of wirings 72 are less likely to move in the short-side direction Y.

[0100] In the manufacturing process, this facilitates positioning of the conductor layer 71. The thickness of the protruding portion 73 may be smaller than the thickness of the buried portion 74, or the thickness of the protruding portion 73 may be equal to the thickness of the buried portion 74.

[0101] [Fourth embodiment] 10 is a schematic cross-sectional view of a flexure 30 according to the fourth embodiment. In the fourth embodiment, the depth D66 of the groove 66 is greater than that in the third embodiment.

[0102] 10, the depth D66 of the groove 66 is approximately equal to the thickness T71 of the conductor layer 71. The plurality of wirings 72 are buried in the plurality of grooves 66, respectively. Compared to the example shown in FIG. 9, the plurality of wirings 72 do not have portions 73 that protrude beyond the grooves 66. The cover insulating layer 81 has a uniform thickness in the short-side direction Y.

[0103] The configuration of the flexure 30 of the fourth embodiment also provides the same effects as those of the above-described embodiments. In the flexure 30 of the fourth embodiment, the multiple wirings 72 are embedded in the multiple grooves 66 of the base insulating layer 61, respectively, and therefore the multiple wirings 72 are less likely to move in the short-side direction Y. The depth D66 of the grooves 66 may be greater than the thickness T71 of the conductor layer 71. In this case, a portion of the cover insulating layer 81 is embedded in the grooves 66.

[0104] [Fifth embodiment] 11 is a schematic cross-sectional view of a flexure 30 according to a fifth embodiment. The flexure 30 of the fifth embodiment differs from the above-described embodiments in the wiring section 50.

[0105] As shown in FIG. 11, in the short-side direction Y, the base insulating layer 61 is located between the side surface 44 and the side surface 47, and the conductor layer 71 and the cover insulating layer 81 are not located between the side surface 44 and the side surface 47.

[0106] A thickness T61 of the base insulating layer 61 is approximately equal to a thickness T41 of the pair of first portions 41A, 41B. In the thickness direction Z, a surface 62 of the base insulating layer 61 is located on the same plane as the surfaces 42, 45 of the pair of first portions 41A, 41B, and a surface 63 of the base insulating layer 61 is located on the same plane as the surfaces 43, 46 of the pair of first portions 41A, 41B.

[0107] The end face 64 is in contact with the side face 44, and the end face 65 is in contact with the side face 47. The side faces 44 and 47 do not have any portions that are not in contact with the insulating base layer 61. The end faces 82 and 83 are not in contact with the side faces 44 and 47.

[0108] The conductor layer 71 and the cover insulating layer 81 overlap the surface 62. In the example shown in Fig. 11, a part of the cover insulating layer 81 overlaps the surfaces 42 and 45 of the pair of first portions 41A and 41B.

[0109] In the short-side direction Y, the width of the cover insulating layer 81 is greater than the width of the base insulating layer 61. From another perspective, in the short-side direction Y, the end faces 82, 83 are farther from the conductor layer 71 than the side faces 44, 47 (end faces 64, 65).

[0110] The same effects as those of the above-described embodiments can be obtained with the configuration of the flexure 30 of the fifth embodiment. In the flexure 30 of the fifth embodiment, the base insulating layer 61 is located between the side surface 44 and the side surface 47. Therefore, the thickness of the flexure 30 can be reduced by an amount equivalent to the thickness T61 of the base insulating layer 61.

[0111] Furthermore, by making the base insulating layer 61 have the same thickness as the thickness T41 of the pair of first portions 41A, 41B, it is possible to eliminate the step of reducing the thickness T61 of the base insulating layer 61 in the manufacturing process. Note that, in the short direction Y, the width of the cover insulating layer 81 may be smaller than the width of the base insulating layer 61, or the width of the cover insulating layer 81 may be equal to the width of the base insulating layer 61.

[0112] [Sixth embodiment] 12 is a schematic cross-sectional view of a flexure 30 according to a sixth embodiment. The flexure 30 of the sixth embodiment differs from the above-described embodiments in the wiring section 50.

[0113] The flexure 30 further includes an air layer 91 in contact with the surface 63 of the insulating base layer 61. The surface 63 of the insulating base layer 61 is in contact with the air layer 91 between the side surface 44 and the side surface 47. The conductor layer 71 overlaps the air layer 91.

[0114] 12, the surface 63 of the base insulating layer 61 is spaced apart from the surfaces 43 and 46 of the pair of first portions 41A and 41B in the thickness direction Z. From another perspective, the surface 63 of the base insulating layer 61 is not located on the same plane as the surfaces 42 and 45 and the surfaces 43 and 46 of the pair of first portions 41A and 41B.

[0115] The thickness T61 of the insulating base layer 61 is smaller than the thickness T61 of the insulating base layer 61 shown in Fig. 6. The insulating base layer 61 shown in Fig. 12 is formed, for example, by over-etching when removing a backup layer, which will be described later, in an etching process.

[0116] When the flexure 30 is placed on the load beam 22, an air layer 91 is located directly above the load beam 22. The thickness T91 of the air layer 91 can be changed appropriately by changing the thickness T61 of the base insulating layer 61.

[0117] The same effects as those of the above-described embodiments can be obtained with the configuration of the flexure 30 of the sixth embodiment. In the flexure 30 of the sixth embodiment, when the suspension 10 is formed, the air layer 91 of the flexure 30 overlaps with the load beam 22 so as to face the load beam 22.

[0118] Therefore, by providing the air layer 91, the range of adjustment of the dielectric constant of the flexure 30 can be widened, and the degree of freedom in designing the flexure 30 can be increased to further optimize the transmission characteristics.

[0119] Although the air layer 91 is formed over the entire space between the side surfaces 44 and 47 in the short direction Y, the air layer 91 may be formed only in a portion of the space between the side surfaces 44 and 47 in the short direction Y. The air layer 91 is formed to have a uniform thickness in the short direction Y, but the thickness of the air layer 91 in the short direction Y may be changed as appropriate.

[0120] [Seventh embodiment] 13 is a schematic cross-sectional view of a flexure 30 according to a seventh embodiment. The flexure 30 of the seventh embodiment differs from the above-described embodiments in that it includes a support layer 92.

[0121] 13, the flexure 30 further includes a support layer 92 that supports the wiring portion 50. The support layer 92 is, for example, a backup layer used in the manufacturing process of the flexure 30.

[0122] The pair of first portions 41A, 41B and the wiring portion 50 overlap the support layer 92. More specifically, the support layer 92 contacts the surfaces 43, 46 of the pair of first portions 41A, 41B and the surface 63 of the base insulating layer 61.

[0123] The support layer 92 is made of an electrically insulating resin material such as polyimide. In the example shown in Fig. 13, the support layer 92 has a uniform thickness in the short-side direction Y. The thickness of the support layer 92 is smaller than the thickness of the base insulating layer 61, for example.

[0124] The configuration of the flexure 30 of the seventh embodiment also provides the same effects as those of the above-described embodiments. In the flexure 30 of the seventh embodiment, the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 are located between the side surface 44 and the side surface 47 in the short-side direction Y. Therefore, even if the flexure 30 includes the support layer 92, it is possible to prevent the thickness of the flexure 30 from increasing.

[0125] By reducing the thickness of the support layer 92, it is possible to further prevent the thickness of the flexure 30 from increasing. Furthermore, by providing the support layer 92 made of an electrically insulating resin material, it is possible to easily insulate the flexure 30 from the load beam 22 when forming the suspension 10. In this case, for example, the flexure 30 is fixed to the load beam 22 with an adhesive.

[0126] Furthermore, the number of steps can be reduced in the manufacturing process because there is no need for a step of removing the support layer 92. In the example shown in Fig. 13, the support layer 92 overlaps with the wiring portion 50 and the pair of first portions 41A, 41B, but the support layer 92 may overlap only with the wiring portion 50.

[0127] [Eighth embodiment] Fig. 14 is a schematic cross-sectional view of a flexure 30 according to the eighth embodiment. In the eighth embodiment, a support layer 92 included in the flexure 30 is different from that of the seventh embodiment. In the example shown in Fig. 14, the support layer 92 is formed of a metal material such as copper. The support layer 92 is formed by a method such as plating or sputtering.

[0128] The configuration of the flexure 30 of the eighth embodiment can also achieve the same effects as those of the above-mentioned embodiments. In the flexure 30 of the eighth embodiment, the support layer 92 is made of a metal material, so that the support layer 92 can function as a ground layer for the conductor layer 71. By providing a highly conductive ground layer near the conductor layer 71, the electrical characteristics of the flexure 30 can be improved.

[0129] In the example shown in FIG. 14, the support layer 92 overlaps the wiring portion 50 and the pair of first portions 41A, 41B, respectively. However, the support layer 92 may overlap only the wiring portion 50.

[0130] [Ninth embodiment] 15 is a schematic cross-sectional view of a flexure 30 according to a ninth embodiment. The flexure 30 of the ninth embodiment differs from the above-described embodiments in that it includes a connection portion 93.

[0131] As shown in FIG. 15, the flexure 30 further includes a connection portion 93. The connection portion 93 is formed of a metal material such as copper. The connection portion 93 is formed by a method such as plating or sputtering. In the short direction Y, the connection portion 93 is located, for example, between the side surface 44 and the side surface 47. The connection portion 93 does not overlap, for example, with the pair of first portions 41A and 41B.

[0132] The connection portion 93 is electrically connected to at least one of the plurality of wirings 72. The connection portion 93 has a connection portion 94 and a connection portion 95. The plurality of wirings 72 includes wirings 72A to 72D.

[0133] The connection portion 94 electrically connects the first portion 41B and the wiring 72A. The connection portion 94 is connected to, for example, the side surface 47 of the first portion 41B. The connection portion 95 electrically connects the wiring 72B and the wiring 72D.

[0134] Between the wiring 72B and the wiring 72D, there is located the wiring 72C that is not connected to the connection portion 95. Since the base insulating layer 61 is located between the connection portion 94 and the connection portion 95, the connection portion 94 is insulated from the connection portion 95.

[0135] 15 , the wirings 72A, 72B, and 72D are embedded in the base insulating layer 61, but the wiring 72C is not embedded in the base insulating layer 61. The thicknesses of the wirings 72A, 72B, and 72D are greater than the thickness of the wiring 72C, for example. By providing the wiring 72C in this manner, the wiring 72C can be insulated from the connecting portion 95, and the wirings 72B and 72D can be electrically connected by the connecting portion 95.

[0136] The configuration of the flexure 30 of the ninth embodiment also provides the same effects as those of the above-described embodiments. In the flexure 30 of the ninth embodiment, the connection portion 93 is located between the side surface 44 and the side surface 47 in the short-side direction Y, which prevents the thickness of the flexure 30 from increasing.

[0137] The connection portion 93 can be used to ground the conductor layer 71 to the metal base 40, or as a jumper to connect the multiple wires 72 together, thereby improving the electrical characteristics of the flexure 30.

[0138] The shape of the connection portion 93 is not limited to the above example. The connection portion 93 may be provided with either a connection portion 94 used to ground the conductor layer 71 or a connection portion 95 used as a jumper for connecting the plurality of wirings 72 together. The connection between the plurality of wirings can be changed as appropriate.

[0139] [Tenth embodiment] 16 is a schematic cross-sectional view of a flexure 30 according to a tenth embodiment. The flexure 30 of the tenth embodiment differs from the above-described embodiments in the wiring section 50.

[0140] 16, the pair of first portions 41A, 41B overlap the base insulating layer 61. More specifically, the surfaces 43, 46 of the pair of first portions 41A, 41B contact the surface 62 of the base insulating layer 61. From another perspective, the base insulating layer 61 is not located between the side surface 44 and the side surface 47 in the short-side direction Y.

[0141] The conductor layer 71 and the cover insulating layer 81 are located between the side surface 44 and the side surface 47 in the short-side direction Y. End surfaces 82 and 83 of the cover insulating layer 81 contact the side surfaces 44 and 47, respectively. The side surfaces 44 and 47 have portions that are not in contact with the cover insulating layer 81.

[0142] The same effects as those of the above-described embodiments can be obtained with the configuration of the flexure 30 of the tenth embodiment. In the flexure 30 of the tenth embodiment, the insulating base layer 61 is not located between the side surface 44 and the side surface 47.

[0143] 16, the conductor layer 71 and the cover insulating layer 81 can be spaced further away from the surfaces 42, 45 of the pair of first portions 41A, 41B in the thickness direction Z than in the example shown in FIG.

[0144] In the flexure 30 of the tenth embodiment, when forming the suspension 10, the surfaces 42, 45 of the pair of first portions 41A, 41B are overlapped so as to face the load beam 22, thereby separating the conductor layer 71 not only from the metal base 40 but also from the load beam 22.

[0145] This reduces the difference in electrical characteristics between the point-to-point wiring and the like in the flexure 30. The support layer 92 described with reference to Fig. 13 may be applied to the insulating base layer 61 of the flexure 30 of the tenth embodiment.

[0146] [Eleventh embodiment] Fig. 17 is a schematic partial plan view of the flexure 30 according to the eleventh embodiment. Fig. 18 is a schematic cross-sectional view of the flexure 30 taken along line XVIII-XVIII in Fig. 17. Fig. 17 shows the flexure 30 as viewed from the cover insulating layer 81 side. The flexure 30 of the eleventh embodiment differs from the above-described embodiments in the metal base 40.

[0147] 17 and 18, the metal base 40 further includes a second portion 48 connected to the pair of first portions 41A and 41B. The second portion 48 functions as a "miss" connecting the pair of first portions 41A and 41B.

[0148] In Fig. 17, the area where the second portion 48 is formed is indicated by dots. As shown in Fig. 17, the second portion 48 is formed in a part of the metal base 40 along the longitudinal direction X. The area where the second portion 48 is formed can be changed as appropriate.

[0149] 18, the second portion 48 is connected to the side surfaces 44 and 47 in the short-side direction Y. The second portion 48 is formed integrally with, for example, the pair of first portions 41A and 41B.

[0150] The second portion 48 is formed, for example, by half-etching a portion of the metal base 40 corresponding to the second portion 48 in an etching process when forming the metal base 40. The second portion 48 has a uniform thickness in the short-side direction Y.

[0151] The thickness T48 of the second portion 48 is smaller than the thickness T41 of the pair of first portions 41A, 41B. For example, the thickness T48 of the second portion 48 is equal to or less than half the thickness T41 of the pair of first portions 41A, 41B. As yet another example, the thickness T48 of the second portion 48 is equal to or less than one-fourth the thickness T41 of the pair of first portions 41A, 41B.

[0152] In the thickness direction Z, the second portion 48 overlaps the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81. The base insulating layer 61 and the cover insulating layer 81 contact the side surfaces 44, 47, respectively.

[0153] 18, the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 are located between the side surface 44 and the side surface 47 in the short direction Y. The sum of the thickness T48 of the second portion 48 and the thickness T50 of the wiring portion 50 is equal to or less than the thickness T41 of the pair of first portions 41A and 41B, for example.

[0154] 18, the sum of the thickness T48 of the second portion 48 and the thickness T50 of the wiring portion 50 is smaller than the thickness T41 of the pair of first portions 41A, 41B. Therefore, the wiring portion 50 does not protrude beyond the surfaces 42, 45 in the thickness direction Z.

[0155] The configuration of the flexure 30 of the eleventh embodiment also provides the same effects as those of the above-described embodiments. In the flexure 30 of the eleventh embodiment, the wiring portion 50 is located between the side surface 44 and the side surface 47, thereby preventing the thickness of the flexure 30 from increasing. Furthermore, by forming the second portion 48 connected to the pair of first portions 41A, 41B, the rigidity of the flexure 30 in the short direction Y can be further increased.

[0156] [Twelfth embodiment] Fig. 19 is a schematic partial plan view of the flexure 30 according to the twelfth embodiment. Fig. 20 is a schematic cross-sectional view of the flexure 30 taken along line XX-XX in Fig. 19. The flexure 30 of the twelfth embodiment differs from the eleventh embodiment in that the second portion 48 has an opening 49.

[0157] 19 and 20, the second portion 48 of the metal base 40 has an opening 49. The opening 49 overlaps the conductor layer 71 in the thickness direction Z. Of the multiple wirings 72A to 72D, the wirings 72A and 72B overlap the opening 49, while the wirings 72C and 72D do not overlap the opening 49.

[0158] In the example shown in FIG. 19, three openings 49 are formed along the longitudinal direction X. The number of openings 49 may be two or less, or four or more. Two or more openings 49 may be formed in the width direction of the wiring portion 50 (short-side direction Y in the examples shown in FIGS. 19 and 20). The size of the openings 49 can be changed as appropriate. By changing the size of the openings 49, the number and range of wirings overlapping with the openings 49 can be changed as appropriate.

[0159] The configuration of the flexure 30 of the twelfth embodiment can also provide the same effects as those of the above-described embodiments. In the flexure 30 of the twelfth embodiment, the opening 49 is formed in the second portion 48, which allows adjustment of the electrical characteristics of the flexure 30.

[0160] [Thirteenth embodiment] 21 is a schematic cross-sectional view of a flexure 30 according to a thirteenth embodiment. The flexure 30 of the thirteenth embodiment differs from the above-described embodiments in that it has a plurality of conductor layers.

[0161] 21 , the wiring section 50 has a base insulating layer 61, a plurality of conductor layers, and a cover insulating layer 81. The plurality of conductor layers includes a first conductor layer 75 and a second conductor layer 76 that overlaps the first conductor layer 75. The first conductor layer 75 and the second conductor layer 76 have a plurality of wirings 77, 78, respectively.

[0162] The first conductor layer 75 is in contact with the surface 62 of the base insulating layer 61. The first conductor layer 75 is located between the side surface 44 and the side surface 47 in the short-side direction Y. The multiple wirings 78 are provided so as to overlap the multiple wirings 77, respectively.

[0163] A portion 87 of the cover insulating layer 81 is provided between the first conductor layer 75 and the second conductor layer 76. The first conductor layer 75 and the second conductor layer 76 are insulated from each other by the cover insulating layer 81. The second conductor layer 76 is surrounded by the cover insulating layer 81.

[0164] The same effects as those of the above-described embodiments can be obtained with the configuration of the flexure 30 of the thirteenth embodiment. In the flexure 30 of the thirteenth embodiment, even when a plurality of conductor layers are provided, the first conductor layer 75 is provided between the side surface 44 and the side surface 47. This prevents the thickness T30 of the flexure 30 from increasing, and allows the flexure 30 to be made thinner.

[0165] The thickness of the first conductor layer 75 may be equal to or different from the thickness of the second conductor layer 76. The number of conductor layers is not limited to two and may be three or more. Providing multiple conductor layers as in the flexure 30 of the thirteenth embodiment can be applied to each of the above-mentioned embodiments.

[0166] In practicing the invention disclosed in the above embodiment, the specific aspects of the elements constituting the disk drive suspension, including the specific aspects such as the shape of the load beam and flexure, can be modified in various ways.

[0167] The wirings 72 may have different thicknesses. The grooves 66 described using the third and fourth embodiments can also be applied as appropriate to the base insulating layer 61 described in the fifth and subsequent embodiments. The air layer 91 described using the sixth embodiment can also be applied as appropriate to the other embodiments. [Explanation of symbols]

[0168] 1...disk device, 10...disk device suspension, 22...load beam, 30...flexure, 40...metal base, 41A, 41B...first part, 44, 47...side surface, 48...second part, 50...wiring portion, 61...base insulating layer, 71...conductor layer, 81...cover insulating layer.

Claims

1. Metal base and a wiring portion provided along the metal base, the wiring portion includes a base insulating layer, a conductor layer overlaid on the base insulating layer, and a cover insulating layer overlaid on the conductor layer, the metal base has a pair of first portions having side surfaces facing each other; At least one of the insulating base layer and the insulating cover layer is in contact with the side surface between the pair of first portions, In the lamination direction of the wiring portion, the conductor layer does not overlap the metal base, the base insulating layer, the conductor layer, and the cover insulating layer are located between the side surfaces; a thickness of the wiring portion is equal to or less than a thickness of the pair of first portions; Flexure for disk device suspension.

2. A metal base, a wiring portion provided along the metal base, the wiring portion includes a base insulating layer, a conductor layer overlaid on the base insulating layer, and a cover insulating layer overlaid on the conductor layer, the metal base has a pair of first portions having side surfaces facing each other; At least one of the insulating base layer and the insulating cover layer is in contact with the side surface between the pair of first portions, In the lamination direction of the wiring portion, the conductor layer does not overlap the metal base, At least a portion of the conductor layer is embedded in the base insulating layer. Flexure for disk device suspension.

3. A metal base, a wiring portion provided along the metal base, the wiring portion includes a base insulating layer, a conductor layer overlaid on the base insulating layer, and a cover insulating layer overlaid on the conductor layer, the metal base has a pair of first portions having side surfaces facing each other; At least one of the insulating base layer and the insulating cover layer is in contact with the side surface between the pair of first portions, In a lamination direction of the wiring portion, the conductor layer does not overlap the metal base, the base insulating layer is located between the side surfaces; the conductor layer and the cover insulating layer are not located between the side surfaces; Flexure for disk device suspension.

4. A metal base, a wiring portion provided along the metal base; an air layer; the wiring portion includes a base insulating layer, a conductor layer overlaid on the base insulating layer, and a cover insulating layer overlaid on the conductor layer, the metal base has a pair of first portions having side surfaces facing each other; At least one of the insulating base layer and the insulating cover layer is in contact with the side surface between the pair of first portions, In a lamination direction of the wiring portion, the conductor layer does not overlap the metal base, the insulating base layer is in contact with the air layer between the side surfaces; Flexure for disk device suspension.

5. A metal base, a wiring portion provided along the metal base; a support layer that supports the wiring portion, the wiring portion includes a base insulating layer, a conductor layer overlaid on the base insulating layer, and a cover insulating layer overlaid on the conductor layer, the metal base has a pair of first portions having side surfaces facing each other; At least one of the insulating base layer and the insulating cover layer is in contact with the side surface between the pair of first portions, In a lamination direction of the wiring portion, the conductor layer does not overlap the metal base, In the stacking direction, the insulating base layer has a first surface in contact with the conductor layer and a second surface opposite to the first surface, The support layer is in contact with the second surface. Flexure for disk device suspension.

6. A metal base; a wiring portion provided along the metal base; a connection portion, the wiring portion includes a base insulating layer, a conductor layer overlaid on the base insulating layer, and a cover insulating layer overlaid on the conductor layer, the metal base has a pair of first portions having side surfaces facing each other; At least one of the insulating base layer and the insulating cover layer is in contact with the side surface between the pair of first portions, In a lamination direction of the wiring portion, the conductor layer does not overlap the metal base, the conductor layer has a plurality of wirings arranged in a direction perpendicular to the extending direction of the wiring portion, The connection portion is electrically connected to at least one of the plurality of wirings. Flexure for disk device suspension.

7. Metal base and a wiring portion provided along the metal base, the wiring portion includes a base insulating layer, a conductor layer overlaid on the base insulating layer, and a cover insulating layer overlaid on the conductor layer, the metal base has a pair of first portions having side surfaces facing each other, and a second portion overlapping the conductor layer and connected to the pair of first portions; At least one of the insulating base layer and the insulating cover layer is in contact with the side surface between the pair of first portions, The thickness of the second portion is less than the thickness of the first portion. Flexure for disk device suspension.

8. the second portion has an opening overlapping the conductor layer; 8. The flexure of the disk drive suspension according to claim 7.

9. A load beam; and the flexure according to any one of claims 1 to 8, which is placed on the load beam. Suspension for disk drives.

Images