Mold and method for producing a part by molding, the part, and a shoe with such a part

Abstract

To provide a mold for molding a component, in particular a piece of sports apparel, a method for producing the component using such a mold, and a shoe with such a component.SOLUTION: There is provided a mold for molding a component, in particular a piece of sports apparel, comprises (a) a mixture of a polymer material and a filler material, wherein (b) the filler material is configured to allow heating of the component inside the mold by means of an electromagnetic field.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a mold for forming a part, in particular a sports garment, and to a method for forming a part using such a mold. The present invention relates to a method for manufacturing an article, and to a shoe equipped with such an article. [Background technology]

[0002] Use of expanded particle materials, i.e. materials composed of individual particles of expanded plastic material. The present invention relates to the manufacture of cushioning elements for sports clothing, in particular for the manufacture of shoe soles for sports shoes. In particular, exposure to pressurized steam in a mold (known in the art) In some cases, this is done by a process called "steam chest molding." The use of expanded thermoplastic polyurethane (eTPU) particles that are fused together at their respective surfaces It is being considered for the manufacture of shoe soles.

[0003] However, conventional molds for steam chest molding of shoe soles vary depending on the specific material used. For example, the conventional type is used to produce particles. In our steam chest molding process, the mass of a conventional mold is usually large, Heating requires a lot of energy. Furthermore, the cooling process of this type is slow. This results in longer cycle times. Finally, the steam chest of the shoe sole is In the molding process, pressurized steam is uniformly supplied to the particles to achieve uniform interconnection of the particles. In this respect, conventional types are not adapted to such uniform medium supply.

[0004] Energy carriers other than pressurized steam are also being considered, particularly for cushioning elements in sports clothing. 1. A method for manufacturing a foamed article, comprising: charging a first material containing particles of a foamed material into a mold; and supplying energy in the form of at least one electromagnetic field to fuse the surfaces of the particles. , the method is described in German Patent Application Publication No. 102015202013 and European Patent Application Publication No. However, in these methods, the running Modern performance shoes like Nike shoes (specifically, their respective soles and midsoles) There is room for improvement as the specific material properties of the molds required for their manufacture are not fully taken into account. It remains. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] German Patent Application Publication No. 102015202013 [Patent Document 2] European Patent Application Publication No. 3053732 Summary of the Invention [Problem to be solved by the invention]

[0006] The object of the present invention is to overcome the above-mentioned drawbacks of the prior art and to provide a method for molding a part, in particular a sports garment. The object of the present invention is to provide an improved form for carrying out the process. [Means for solving the problem]

[0007] This object is achieved by the teaching of the independent claims. The dependent claims provide advantageous implementations. This includes the form.

[0008] In one embodiment, a mold for forming a part, in particular a sports garment, comprises: (a) a poly (b) the filler material is a mixture of the activator material and the filler material; It is configured to allow heating of the part inside the mold.

[0009] The inventors of the present invention have surprisingly found that such a mould can be used to form sports garments. It has been found that such polymeric and filler materials provide an improved method. By using a mixture of these materials, other material properties of the mold (e.g. In this case, it is possible to significantly improve certain properties of the mold material without compromising its properties (e.g., its stability). The use of electromagnetic fields, in particular electromagnetic radiation, to heat sports clothing inside a mold can The thermal energy is not coupled to any kind of medium transport (e.g., introduction of pressurized steam). This allows for the production of parts with complex shapes and varying thicknesses. The sports garment material penetrates the loaded mold essentially uniformly and releases an essentially constant amount of air. It supplies energy to all parts of the sportswear and and can be selected to provide uniform and consistent shaping at all depths of the sports garment. .

[0010] At this point, for the sake of clarity, filler materials are referred to as solid additives incorporated into polymeric materials. It should be noted that the filler material may be a polymer material. In other words, it may be a functional filler used to improve the polymer material. When added, increasing amounts of filler material can impart specific properties to polymeric molds. Furthermore, the mixture of fillers can be used to "tune" the material properties and , can help balance the mechanical performance of the overall mold with its dielectric behavior.

[0011] The filler material may be configured to increase the thermal conductivity of the mold. Heat is released from the mold, so the loss of heat energy during mold heating as heat inflow increases significantly. Furthermore, by increasing the thermal conductivity of the mold, the cooling process as heat dissipation after molding can be improved. The improved performance is due to the blend of polymeric and filler materials according to the present invention. This is further boosted by the fact that no additional cooling is required, either externally or internally, for the components. This simplifies the entire molding process. This can improve the overall productivity of the manufacturing process.

[0012] As used herein, the term "thermal conductivity" refers to "ty" refers to the ability of a material to conduct heat. In other words, heat conduction is the process of transferring heat across a temperature gradient. It is defined as the transport of energy by random molecular motion. It is distinguished from energy transport by convection and molecular motion in that it does not involve internal stresses that cause the In the International System of Units (SI), thermal conductivity is expressed in watts per metre Kelvin (W / (m ·K)).

[0013] The filler material may be configured to increase the dielectric constant of the mold compared to the part. Furthermore, the filler material may be a dielectric material, in particular a mixture of at least two inorganic materials, preferably Preferably, metal nitrides, metal oxides, metal carbides, metal sulfides, metal silicates, silicon carbide and silicon nitride, most preferably boron nitride (BN). The dielectric constant of the mold, as understood by those skilled in the art, is the dielectric constant of the mold (when a constant "external" electromagnetic field is applied to the mold). directly affect the field strength of the electromagnetic field or electromagnetic radiation inside the mold (when applied to the It also affects the electromagnetic field distribution inside the mold (e.g., the local value of the electromagnetic field strength). Another advantage of increasing the dielectric constant of the mold to affect the electromagnetic field distribution is that the dielectric Since a wide variety of filler materials with different dielectric constant values ​​are known and available, The choice and / or combination of materials allows for such great adjustment and adaptation. Furthermore, by increasing the dielectric constant of the mold, the electromagnetic field density is concentrated in the component material. This indirectly reduces the loss of heat energy during the molding process by keeping it away from the mold material itself. It can be done.

[0014] Further, the filler material may be a mixture of carbon materials and inorganic materials, carbon fiber, glassy carbon, etc. , carbon nanotubes, carbon nanobuds, aerographite, linear acetylene carbon silicon, q-carbon, graphene, salt, single crystal powder, polycrystalline powder, amorphous powder, glass fiber pouch In addition to the above-mentioned effects, the fiber or fiber composite material may include at least one of the following: Lightweight yet very strong. In particular, glass or glass fibre is fairly cheap and durable. It has high moisture resistance and a high strength-to-weight ratio. Therefore, the mould material has an impact on the overall process performance. By appropriately selecting mold materials with different dielectric properties, efficient dielectric This allows for optimal properties for electrical heating and subsequent cooling. In this case, a certain range of electrical resistance and mechanical stability and related properties are taken into consideration. It may be possible.

[0015] The above-described embodiments may include components that differ in shape, optical properties, thermal and electrical properties, or material properties. These include a variety of filler materials, all of which are used to fill the sports garment inside the mold. Electric heating and subsequent cooling of the entire mold ensures optimum properties for efficient molding. For example, if the sports garment being molded is a shoe sole, The mold of the present invention reduces cycle time in manufacturing shoe soles and improves the This can result in both improved quality of the code.

[0016] As used herein, the term "sports apparel" refers to a garment that is worn by a person wearing sports apparel. " may represent clothing such as shoes and accessories worn for sports or exercise. Sports-specific clothing or apparel is rarely worn for practical, comfort, or safety reasons. Sports and athletic apparel can be worn in a variety of sports and athletic endeavors. These include suits, shorts, T-shirts, and polo shirts. Swimsuits (for swimming), wetsuits (for diving or surfing), ski suits Sports shoes include training shoes (for skiing), and leotards (for gymnastics). Examples include running shoes, soccer cleats, riding boots, and ice skates. In addition, sportswear includes bikinis, some crop tops, and jockstraps. Also included are underwear such as wraps and sports bras. Sportswear is also suitable for casual wear. It may also be worn as a casual fashion garment.

[0017] The mixture is present in an amount of 1 to 75% by volume, particularly 1 to 30% by volume, preferably 1 to 25% by volume, more preferably 1 to 75% by volume. More preferably, the filler material is present in an amount of 1 to 20% by volume, and most preferably in an amount of 5 to 20% by volume. and may contain filler material in an amount of 10 to 40% by volume, in particular 15 to 35% by volume. These specified values ​​are the optical properties and their properties optimized for efficient dielectric heating. A reasonable compromise between sufficient thermal properties to provide high thermal conductivity for the mold for subsequent cooling is sought. It has been found to bring about

[0018] The polymeric material may be a thermoplastic material, preferably polyethylene terephthalate (PET). , Polybutylene terephthalate (PBT), Polyoxymethylene (POM), Polyamide Imide (PAI), polycarbonate (PC), polyketone (PK), polyether ether Polyethylene etherketone (PEEK), or polyethylene (PE) Additionally, the polymeric material may include foamed materials. , have been found to be advantageous and can be used in the context of the present invention. The dielectric loss coefficient D of POM for high frequency radiation is approximately 0.008. These materials are essentially transparent to high frequency radiation because they absorb only a small portion of the electromagnetic radiation. Since the loss factor is relatively low, it can be formed with a constant thickness.

[0019] The polymer material may be configured to increase the dielectric constant of the mold compared to the part. For example, certain polymer grades have a higher intrinsic dielectric constant compared to the component material. Certain polymer materials can be used, so that the dielectric constant of the mold is such that the electromagnetic field inside the mold or The electromagnetic field density is concentrated in the component material, which directly affects the electromagnetic field strength of the electromagnetic radiation. The heat inflow and outflow of the mold can be optimized. ), polyamide, or polyethylene terephthalate (PET) In a preferred embodiment, the mold is made of PET and 30% by volume of aluminum oxide. Contains a mixture of aluminum (Al2O3) or a mixture of POM and titanium dioxide (TiO2). It's okay to do that.

[0020] The polymer material may be configured to increase the dielectric loss factor of the mold. It is considered that a specific portion of the dielectric loss coefficient may be configured to be high. According to such an embodiment, the mold material may absorb a large amount of electromagnetic radiation, resulting in high dielectric loss. This allows the entire mold or only specific parts within the mold to be selectively heated locally. Examples include polyketone (PK), poly Vinylidene fluoride or polyvinylidene difluoride (PVDF), or polyamideimide In a preferred embodiment, the mold is at least one of: It may also comprise a mixture of POM and titanium dioxide (TiO2).

[0021] The mold may be a sole mold, and the part may be a shoe sole, particularly a midsole. The molding process by dielectric heating of the shoe sole and the subsequent cooling process may be The process is very fast, which increases productivity. This allows for the production of lightweight, durable shoe soles that offer optimal cushioning properties. become.

[0022] The present invention further provides a method for manufacturing a component, in particular a sports garment, comprising the steps of: (a) applying a composition according to the present invention; and forming a part using a mold as described in the document. The method includes the steps of (b) loading a first material of the part, which includes particles of a foam material, into a mold; c) applying an electromagnetic field to the mixture of the first material, the mold polymer material and the filler material, and and / or heating the mold susceptor. The susceptor may be made of at least the following materials: expanded polypropylene (ePP), poly Urethane (PU), polylactide (PLA), polyether block amide (PEBA) and polyethylene terephthalate (PET). .

[0023] The heating step may include fusing the surfaces of the particles. Magnetic fields, and in particular electromagnetic radiation, are essentially uniformly transmitted through the particle-loaded mold and essentially It provides a certain amount of energy to all particles and also to the whole part and all of its components. It can be selected to achieve uniform and consistent fusion of the particle surface through the depth.

[0024] The particles of the part shall consist of at least the following materials: expanded thermoplastic polyurethane (eTPU), foam Polyamide (ePA), Expanded Polyether Block Amide (ePEBA), Polylactide (PLA), polyether block amide (PEBA), polyethylene terephthalate ( PET), polybutylene terephthalate (PBT), thermoplastic polyester ether ela For example, a shoe sole may include at least one of the following: eTPU, ePEBA, and / or ePA particles are advantageous for use in the manufacture of polymers. and can be used in the context of the present invention.

[0025] The particles may be pumped by conventional techniques known in the art (e.g., by pressure pumping through a fill gate). The mold may be filled by force filling.

[0026] The particles may include a foam material. For example, both the particles and the mold surface may include a foam material. By using the same loss factor, both the particle and the mold are substantially uniform. Uniform heating allows for better surface fusion of the parts.

[0027] The electromagnetic field may be in a high frequency band of 30 kHz to 300 GHz. For example, it is provided in the form of radiation in the microwave band, i.e., in the frequency range of 300 MHz to 300 GHz. The system may be designed to provide the necessary information.

[0028] Microwave generators are commercially available and are relatively inexpensive compared to manufacturing equipment using the mold of the present invention. The component material may be relatively easily mounted. By essentially focusing the microwave radiation into the cavity of the mold being loaded, It may also be possible to improve the energy efficiency of the method using microwaves. The intensity and frequency of the radiation can be easily varied and adapted to each requirement.

[0029] The electromagnetic field has a frequency of 1 MHz to 200 MHz, more preferably 1 MHz to 50 MHz, and most preferably In a preferred embodiment, the electromagnetic wave may be in a high frequency band of 25 to 30 MHz. The field may have a frequency in the high frequency band around 27.12 MHz. It is believed that multiple high frequencies or frequency bands can be used.

[0030] High frequency generators are commercially available and may be easily implemented into manufacturing equipment. Furthermore, high frequency radiation is concentrated in various parts of the manufacturing equipment and its intensity and frequency vary relative to requirements. The method may be adapted accordingly.

[0031] Furthermore, the electromagnetic field, in particular the electromagnetic radiation, may be provided in a frequency band different from the aforementioned frequency bands. is.

[0032] The mold is further loaded with a second material that is essentially unchanged by the electromagnetic field. This may be, for example, a material through which the electromagnetic field is transmitted without significant absorption. Additionally, the second material may not contain any electromagnetic field absorbing material. , may mean no melting, initiation of melting, softening, or hardening of the second material.

[0033] All the above embodiments relate to an improved method for manufacturing components, in particular sports garments. Further details and technical effects and advantages are described in detail above with respect to the mold. That is exactly what happened.

[0034] The present invention also relates to components, particularly sports equipment, manufactured by the method as described herein. Furthermore, the component may be a shoe sole, particularly a midsole. .

[0035] The invention also relates to a shoe, in particular a sports shoe, equipped with a component as described herein. Regarding Jewels.

[0036] Possible embodiments of the invention will now be further described with reference to the drawings. [Brief explanation of the drawings]

[0037] [Figure 1] 10A-10C illustrate the surprising effect of the sole mold according to the present invention. [Figure 2a] FIG. 10 is a diagram illustrating the dielectric constant of materials suitable for use as a mold according to the present invention. [Figure 2b] FIG. 10 is a diagram illustrating the dielectric constant of materials suitable for use as a mold according to the present invention. [Figure 2c] FIG. 10 is a diagram illustrating the dielectric constant of materials suitable for use as a mold according to the present invention. [Figure 2d] FIG. 10 is a diagram illustrating the dielectric constant of materials suitable for use as a mold according to the present invention. [Figure 3a] FIG. 10 shows the dielectric loss factors of materials suitable for use as molds in accordance with the present invention. [Figure 3b] FIG. 10 shows the dielectric loss factors of materials suitable for use as molds in accordance with the present invention. [Figure 3c] FIG. 10 shows the dielectric loss factors of materials suitable for use as molds in accordance with the present invention. [Figure 3d] FIG. 10 shows the dielectric loss factors of materials suitable for use as molds in accordance with the present invention. [Figure 4a] FIG. 1 illustrates the storage modulus of materials suitable for use as molds according to the present invention. [Figure 4b] FIG. 1 illustrates the storage modulus of materials suitable for use as molds according to the present invention. [Figure 5a] FIG. 1 is a diagram illustrating the thermal expansion of materials suitable for use as a mold according to the present invention. [Figure 5b] FIG. 1 is a diagram illustrating the thermal expansion of materials suitable for use as a mold according to the present invention. [Figure 6a] FIG. 10 illustrates the thermal conductivity of materials suitable for use as a mold according to the present invention. [Figure 6b] FIG. 10 illustrates the thermal conductivity of materials suitable for use as a mold according to the present invention. [Figure 6c] FIG. 10 illustrates the thermal conductivity of materials suitable for use as a mold according to the present invention. [Figure 6d] FIG. 10 illustrates the thermal conductivity of materials suitable for use as a mold according to the present invention. [Figure 7] FIG. 1 illustrates an improvement in process cycle time for a material suitable for use as a mold according to the present invention. [Figure 8a]FIG. 1 illustrates an improvement in process cycle time for a material suitable for use as a mold according to the present invention. [Figure 8b] FIG. 1 illustrates an improvement in process cycle time for a material suitable for use as a mold according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0038] The present invention includes the following embodiments.

[0039] [1] A mold (100) for forming a part (120), in particular a sports garment (120). ) and a. comprising a mixture of a polymeric material and a filler material; b. The filler material allows for heating of the part inside the mold (100) by an electromagnetic field. A mold (100) configured to

[0040] [2] The filler material is configured to increase the thermal conductivity of the mold (100), 1].

[0041] [3] The filler material increases the dielectric constant of the mold (100) compared to the part (120). The mold (100) according to [1] or [2], configured to:

[0042] [4] The filler material is preferably a dielectric material, in particular a mixture of at least two inorganic materials. or metal nitrides, metal oxides, metal carbides, metal sulfides, metal silicates, silicon carbide and silicon nitride, most preferably boron nitride (BN). The mold (100) according to any one of [1] to [3].

[0043] [5] The filler material is a mixture of a carbon material and an inorganic material, carbon fiber, glassy carbon, Carbon nanotubes, carbon nanobuds, aerographite, linear acetylene carbon , q-carbon, graphene, salt, single crystal powder, polycrystalline powder, amorphous powder, glass fiber The mold (100) according to any one of [1] to [4], including at least one of the following:

[0044] [6] The mixture is 1 to 75% by volume, particularly 1 to 30% by volume, preferably 1 to 25% by volume, More preferably, the filler material is contained in an amount of 1 to 20% by volume, and most preferably, in an amount of 5 to 20% by volume. or containing filler materials in an amount of 10 to 40% by volume, in particular 15 to 35% by volume, The mold (100) according to any one of [1] to [5].

[0045] [7] The polymer material is a thermoplastic material, preferably polyethylene terephthalate (PE T), polybutylene terephthalate (PBT), polyoxymethylene (POM), polya Polyamide imide (PAI), polycarbonate (PC), polyketone (PK), polyether Contains at least one of the following materials: ether ketone (PEEK), or polyethylene (PE). The mold (100) according to any one of [1] to [6].

[0046] [8] A polymer material increases the dielectric constant of the mold (100) compared to the part (120). The mold (100) according to any one of [1] to [7], configured to:

[0047] [9] The polymer material is configured to increase the dielectric loss factor of the mold (100). The mold (100) according to any one of [1] to [8].

[0048]

[10] The mold according to any one of [1] to [9], wherein the polymer material includes a foam material. (100).

[0049]

[11] The mold (100) is a sole mold (100), and the part (120) is a shoe mold. Any of [1] to

[10] , which is a midsole (120), especially a midsole (120) or one of the types (100).

[0050]

[12] The electromagnetic field is 30 kHz to 300 GHz, preferably 1 MHz to 200 MHz; More preferably, it is in the high frequency band of 1 MHz to 50 MHz, and most preferably, it is in the high frequency band of 25 to 30 MHz. The mold (100) according to any one of [1] to

[11] .

[0051]

[13] A method for manufacturing a component (120), in particular a sports garment (120), comprising: a. A part (120) is made by using the mold (100) described in any one of [1] to

[12] above. ).

[0052]

[14] b. Loading the first material of the part (120) containing particles of foam material into the mold (100) and c. The first material, the polymer material of the mold (100) and the filler material are subjected to an electromagnetic field. heating the mixture and / or the susceptor of the mold (100); The method according to

[13] , further comprising at least one of:

[0053]

[15] The susceptor is made of at least the following materials: Expanded polypropylene (ePP), polyurethane (PU), polylactide (PLA), Polyether Block Amide (PEBA), and Polyethylene Terephthalate (PET) The method according to

[13] or

[14] , comprising at least one of the following:

[0054]

[16] The method according to

[14] or

[0015] , wherein the heating step includes a step of fusing the surfaces of the particles.

[0055]

[17] The particles of the part are made of at least the following materials: Expanded Thermoplastic Polyurethane (eTPU), Expanded Polyamide (ePA), Expanded Polyether Polyethylene block amide (ePEBA), polylactide (PLA), polyether block amide Polyethylene terephthalate (PEBA), Polyethylene terephthalate (PET), Polybutylene terephthalate (PBT), thermoplastic polyester ether elastomer (TPEE) The method according to any one of

[14] to

[16] , comprising at least one of the following:

[0056]

[18] The method according to any one of

[14] to

[17] , wherein the particles comprise a foamed material.

[0057]

[19] The electromagnetic field is 30 kHz to 300 GHz, preferably 1 MHz to 200 MHz; More preferably, it is in the high frequency band of 1 MHz to 50 MHz, and most preferably, it is in the high frequency band of 25 to 30 MHz. The method according to any one of

[13] to

[18] .

[0058]

[20] The mold (100) is further loaded with a second material that is essentially unchanged by the electromagnetic field. The method according to any one of

[14] to

[19] ,

[0059]

[21]

[13] to

[20] 0), especially sports clothing (120).

[0060]

[22] The part (120) is a shoe sole (120), particularly a midsole (120 ) The part (120) described in

[21] .

[0061]

[23] A shoe equipped with the part (120) according to

[21] or

[22] , in particular a shoe Sports shoes.

[0062] The present invention relates primarily to molds for molding cushioning elements such as garments, especially midsoles. Possible embodiments of various aspects are described in the detailed description below, however, the present invention is It is emphasized that the present invention is not limited to these embodiments. Rather, various types of sporting goods can be used. It can also be used for cushioning elements of the same kind (for example knee pads or elbow pads).

[0063] Only individual embodiments of the invention may be described in more detail below. However, those skilled in the art will be able to understand the description with reference to these specific embodiments. The optional features and possible modifications set forth herein may also be incorporated without departing from the scope of the invention. , further refinements and / or combinations with each other in different aspects or different subcombinations. It will be understood that individual features are not essential to achieving the desired results. In this case, it may be omitted. To avoid duplication, the explanations of the above items are referred to. These also apply to the detailed description below.

[0064] FIG. 1 illustrates the surprising benefits of the sole mold 100 according to the present invention.

[0065] The embodiment of FIG. 1 shows a prior art sole mold and a sole mold 100 (dielectric heating) according to the present invention. and subsequent cooling, the shoe sole 120, particularly the midsole 120, is split into two Simulation of thermal radiation or temperature of the sole mold The comparison of heat dissipation is shown for two sole types and a midsole of 120 This is a simulation after 10 minutes of cooling.

[0066] This type of comparison between the prior art and the present invention regarding the improvement of cooling performance is based on the dielectric heating phenomenon and The system features a fully coupled multiphysics simulation model for both thermal and thermodynamic heat transfer. This model was generated using a simulation model that The finite element method is used to calculate the thermal energy induced inside the mold structure in the presence of a field. the material model represents the dielectric properties of the shoe sole 120 and the components of the sole mold 100; The standard dielectric heating equation allows the correlation between the material used and the induction heating power to be expressed as a partial differential equation. It is computable.

[0067] The sole mold 100 of the present invention comprises a mixture of polymeric material and filler material. The filler material is a midsole material that is resistant to electromagnetic fields, particularly high frequency radiation, inside the sole mold 100. 120. As can be seen in FIG. The filler material configured to increase the thermal conductivity of the sole mold 100 and the mid The inventors have shown a dramatic reduction in cooling time for both the thermal sole 120 and the thermal It was found that increasing the conductivity did not affect the dielectric heating process. The mold contains polyethylene terephthalate (PET), which has a thermal conductivity of approximately 0.35 W / (m K).

[0068] In the exemplary embodiment of FIG. 1, the sole mold 100 of the present invention is made of polyethylene terephthalate. A mixture of polyethylene terephthalate (PET) and boron nitride (BN) as a filler material at 30% by volume The thermal conductivity is approximately 1.85 W / (m K) because it contains The value is five times higher than that of the sole type. It was found that this significantly reduced the cooling time compared to conventional sole molds.

[0069] In the case shown in FIG. 1, the sole mold 100 includes a lower part 105a, an upper part 105b, and a side part. For example, the lower part 105a and the upper part 105b of the sole mold 100 have dimensions Dimensions: 200 x 200 x 10 mm 3 Other shapes of the sole mold 100 In addition to the shape, it is also possible to add or remove parts.

[0070] In another embodiment of the invention that is the subject of experimental investigation, the sole mold is made of expanded PET and and a mixture of BN as a filler material in an amount of 15% by volume, which The conductivity is about 0.85 W / (m·K). In some embodiments, the cooling time is 10 minutes compared to the 10 minutes required for the conventional sole mold described above. The cooling time was found to be about 5.9 minutes. In other words, the cooling time was shortened by about 41%.

[0071] The following Figures 2a-8b show various polymeric and filler materials. The analysis of the dielectric and thermal properties of the matrix material is presented.

[0072] Materials including polyoxymethylene (POM) and polyethylene terephthalate (PET) The (relative) dielectric constant of the material (suitable for use with Sole Type 100) is measured in the temperature range of 20°C to 100°C. The values ​​measured at a frequency of about 27.12 MHz are shown in Figures 2a to 2d. Curve 210 (squares) in FIG. 2a shows the dielectric constant of POM without any filler material. Here, the measured dielectric constant increased from 3.00 to 3.55, and the dielectric constant became stable. The increase in the electrical conductivity is thought to be due to the high mobility of polymer molecules and their high degree of alignment in the electric field. can be obtained. Curve 215 (circle) shows the results for POM and 15 volume over the same temperature range as curve 210. % of the dielectric constant of the mixture with boron nitride (BN) as a filler material. The rate value also increased from 3.00 to 3.55. Curve showing the dielectric constant of a mixture of POM and BN as a filler material in an amount of 30% by volume The same applies to the value of 220 (triangle). Curve 225 (squares) in FIG. 2b shows the dielectric constant of POM without any filler material. The measured dielectric constant also increased from 3.00 to 3.55, very similar to curve 210 in Figure 2a. It is rising. Curve 230 (circle) represents the results of the comparison of POM and SILA as a filler material in an amount of 15% by volume. The dielectric constant of the THERM® (a mixture of Al2O3 and SiO2) mixture is shown. are. Curve 235 (triangles) represents the results of a 30% by volume blend of POM and SILATHERM® The dielectric constant of the mixture of (a) and (b) is shown. Here, the two filler materials BN and SILATHERM® were measured. The effect on the dielectric constant is clearly different. On the other hand, BN has a large effect on the dielectric constant of POM. Therefore, it can be assumed that the dielectric constant is close to that of POM. The dielectric constant of the THERM®-containing composite increases with increasing filler content. The slope remains the same. This is the result of the SILATHERM® This may suggest that although the dielectric constant is higher than that of POM, it is stable in the temperature range investigated. The steady increase is thought to be due to POM. Curve 240 (squares) in Figure 2c shows the dielectric constant of PET without any filler material. The dielectric constant of PET increases with increasing temperature from 2.75 to a maximum of 3.48. Compared to POM in Figures 2a and 2b, the overall dielectric constant is lower over the investigated temperature range. But the slope is steep. Curves 245 (circle), 250 (upward triangle), and 255 (downward triangle) are PET and 10% by volume (circle), 20% by volume (upward pointing triangle), and 30% by volume The dielectric constant of the mixtures of BN as filler material in amounts of product % (downward pointing triangles) is shown. The effect of BN is very small and is similar to the POM shown in Figure 2a. Curves 260 (square), 265 (circle), 270 (upward triangle), and 2 in Figure 2d 75 (downward pointing triangles) are PET without filler material (squares) and 1 0 vol% (circle), 20 vol% (upward triangle), and 30 vol% (downward triangle) The dielectric constant of the mixture with SILATHERM® as a filler material is shown. In this case as well, as the SILATHERM® content increases, the dielectric constant The value of SILATHERM® can be higher compared to POM, as shown in Figure 2b. The maximum value is lower when the dielectric constant of the component is 30% by volume. Therefore, this result is thought to be due to the low value of PET.

[0073] With BN or SILATHERM® as filler material according to the present invention Dielectric loss factor of materials including POM and PET (suitable for use with Sole Type 100) The values ​​in the temperature range of 20°C to 100°C are shown in Figures 3a to 3d. Curve 310 (squares) in FIG. 3a shows the dielectric loss factor of POM without any filler material. Here, POM shows a decrease in the dielectric loss factor. Curve 315 (circle) shows Over the same temperature range as curve 310, the POM and filler material at a 15% volume level were The values ​​of curve 320 (triangles) are the same as those of POM and 3BN. The dielectric constant of the mixture with 0% by volume of BN is shown. The dielectric loss factor of unfilled POM was measured to be up to 38mU at 20°C, and The dielectric loss factor showed a constant decrease with increasing temperature, reaching a minimum of 8.6mU at 100°C. The enhanced molecular motion due to the ion exchange and the resulting decrease in interchain interactions are responsible for this behavior. This is thought to be the cause of the movement. In FIG. 3b, curve 325 (squares) represents the dielectric loss factor of POM without filler. Curve 330 (circle) shows the results of the 15% by volume amount of POM and SILATHERM ( Curve 335 shows the dielectric loss factor of a mixture of POM and 30% by volume of The dielectric loss factor of the mixture with SILATHERM® as a filler material is shown. For both fillers, a shift to lower values ​​was observed depending on the filler content. However, the progression of the curves is slightly different. At 30% by volume, the measured losses at 20°C are 32.5 mU and 27.0 mU, respectively. This can be reduced to as low as 5-10 mU, which is a loss factor depending on the volume, in combination with the dielectric loss factor of BN of 5-10 mU. Assuming a mixture of loss coefficients, these values ​​are roughly consistent with the values ​​depending on the volume fraction. In this case, the curve slowly approaches the trajectory of pure POM and reaches almost the same level at 100°C. In contrast, the use of SILATHERM® results in lower dielectric loss values. This results in a total shift in the dielectric loss coefficient of SILATHERM®. It is conceivable that the number could be close to 0 mU. Curve 340 (squares) in Figure 3c shows the dielectric loss factor of PET without any filler material. Curves 345 (circle), 350 (upward triangle), and 355 (downward triangle) ) are PET and 10% by volume (circle), 20% by volume (upward pointing triangle), and Dielectric loss factor of a mixture of BN as a filler material in an amount of 30% by volume (downward pointing triangles) PET shows a consistent increase in the dielectric loss factor. The slope of 55 is almost constant in the temperature range of 20 to 70°C. The increase in the dielectric loss factor accelerates, and the dielectric loss of PET without filler is 12 mU (20 ℃) to 55mU (100℃). In this case too, the use of filler materials This can result in a decrease in the measured value. Curve 360 ​​(squares) in Figure 3d shows the dielectric loss factor of PET without any filler material. Curves 365 (circle), 370 (upward triangle), and 375 (downward triangle) ) are PET and 10% by volume (circle), 20% by volume (upward pointing triangle), and and SILATHERM (registered trademark) as a filler material in an amount of 30% by volume (downward pointing triangle). The dielectric loss factor of the mixture (single-layered) is shown.

[0074] The storage modulus of a material containing POM or PET and the filler material of the present invention is 2 The values ​​investigated in the temperature range of 0°C to 160°C are shown in Figures 4a and 4b. Curves 410, 415, 420, 425, and 430 represent the POM and 15% by volume or 30% by volume of BN or SILATHERM (registered trademark) as filler material. The storage modulus of the mixture (standard) is shown. Curves 435, 440, 445, 450, and 460 represent the results for PET and 10% by volume. or 30% by volume of BN or SILATHERM (registered trademark) as filler material. The thermal expansion of the mixture is shown. The glass transition temperature of POM can be measured at approximately 60°C. At a starting temperature of 20°C, the mechanical properties show a certain decrease. 2 The modulus of elasticity was measured to be a minimum of 205 N / mm at 160°C. 2 It decreases continuously until The maximum value increases with the use of filler, but the curve progresses steeply and the filler The increase in storage modulus is due to the higher filler material content. The shape of the filler also has an effect. The shaped structure provides a higher storage modulus than the irregularly shaped SILATHERM®. It could be.

[0075] The thermal expansion of the material containing POM or PET and the filler material of the present invention was measured at 20°C. The values ​​investigated in the temperature range of 100°C are shown in Figures 5a and 5b. "Thermal expansion" depends on the individual materials used and their respective concentrations. The thermal expansion is determined by the applied temperature and remains constant over the entire temperature range. This does not mean that. Curves 510, 515, 520, 525, and 530 represent the POM and 15% by volume or 30% by volume of BN or SILATHERM (registered trademark) as filler material. The thermal expansion of the mixture is shown. Curves 535, 540, 545, 550, and 560 represent the results for PET and 10% by volume. or 30% by volume of BN or SILATHERM (registered trademark) as filler material. The thermal expansion of the mixture is shown. Generally, POM-based parts exhibit higher values ​​of thermal expansion than PET-based parts. For PET without filler, the temperature plateaus at 85°C and the minimum at 120°C. The progression of the curve may be unstable, but this plateau is due to the glass transition of the material and the resulting However, the minimum is due to the relaxation of the formation-related stresses as the material undergoes post-crystallization. The crystallization rate of PET is extremely slow, so the crystallization rate is These effects may be due to the fact that the crystallization is not complete after cooling. Not measured in the case of T parts. However, both fillers contribute to a reduction in thermal expansion, regardless of the plastic material used. With the same amount of filler, BN has a higher thermal expansion coefficient than SILATHERM®. Increasing the filler content further reduces the thermal expansion. Furthermore, the mold may be fixed to an aluminum plate, which reduces thermal stress. To avoid this, the thermal expansion coefficients of both materials should be as close as possible. The expansion coefficient is 23.8μm / (m·K), and in the temperature range of 20℃ to 100℃, The average thermal expansion coefficient of POM has been measured to be 141.0 μm / (m·K). , 91.3 μm / (m·K) with 30% by volume of SILATHERM® In combination with 30% by volume of BN as a filler material, A coefficient of 65.1 μm / (m·K) can also be achieved. For PET shown in Figure 5b, the initial value of 111.2 μm / (m·K) is obtained for 30% SI by volume. It decreased to 52.5 μm / (m·K) for LATHERM®. The thermal expansion coefficient of BN can be 34.3 μm / (m·K), which is The thermal expansion coefficient of PET and 30% by volume of PET are very close to each other. Parts containing a mixture of BN are considered the best material.

[0076] BN or SILATHERM® as filler materials with different filler concentrations The thermal conductivity values ​​of POM and PET combined with ) are shown in Figures 6a to 6d. The values ​​were investigated in three directions X, Y, and Z, where X is the injection direction and Y is the vertical direction. Z represents the intersecting plane direction, and Z represents the penetrating plane direction. Figure 6a shows the thermal conductivity of the mixture of POM and BN as filler material, Curve 610 represents X (square), curve 615 represents Y (circle), and curve 620 represents Z (triangle). . Figure 6b shows a blend of POM and SILATHERM® as a filler material. The curve 625 represents the X (square), the curve 630 represents the Y (circle), and the curve 635 represents Z (triangle). Figure 6c shows the thermal conductivity of the mixture of PET and BN as filler material, Curve 640 represents X (square), curve 645 represents Y (circle), and curve 650 represents Z (triangle). . FIG. 6d shows a blend of PET and SILATHERM® as a filler material. The curve 655 shows the thermal conductivity of the material, X (square), curve 660 shows the Y (circle), and curve 665 represents Z (triangle). For both filler materials in Figures 6a to 6d, the thermal conductivity increased with increasing filler concentration. When combined with plate-shaped BN, the thermal conductivity in the X and Y directions increases significantly. While the Z direction shows an increase to This is thought to be due to the combination of filler thermal conductivity depending on the filler orientation and shape. In the injection molding process, the plate-like filler particles can be oriented in the XY plane. This is a result of the shear and expansion flows that occur during the injection molding process. The thermal conductivity of N is 400 W / (m·K) along the plane, while For POM, the maximum is 3.70 W / (m K) in the X direction. ) and 0.76 W / (m K) in the Z direction. For PET, a maximum of 2 Although the maximum value of 0.97W / (m·K) in the Z direction is relatively low, the maximum value of 0.77W / (m·K) in the Z direction is comparable. be. In combination with irregular cubic SILATHERM®, The thermal conductivity is more isotropic. In contrast to BN, the thermal conductivity of SILATHERM® The conductivity is equal in all filler directions, but the maximum value achieved is low. This is due to the SIL This is thought to be due to the low thermal conductivity of ATHERM (registered trademark) at 14 W / (m·K). When combined with SILATHERM® POM, the maximum is 1.48W. / (m·K). However, in the case of PET, the highest thermal conductivity was 1.16 W / (m·K). This is due to the relatively low thermal conductivity of the matrix material, PET. It is thought that this is the case. As shown, parts containing BN are significantly better than those combined with SILATHERM®. This is thought to be due to the difference in the intrinsic thermal conductivity of the filler. can be.

[0077] Next, we investigated the improvement of process cycle time by using improved mold materials. In this study, POM and PET without filler were used as mold materials. The temperatures measured inside the fused foam and mold during heating and cooling are shown. The minimum temperature T fuse It shows all the temperatures given for .

[0078] When POM is used as the sole mold material (curve 710), the maximum temperature of the foam is T f use The peak temperature of the mold was 43%. The process cycle was 43 The process ends after 2 seconds. In the case of PET as the mold material (curve 720), the peak foam temperature is 1 The maximum temperature reached by the mold is only 39%. The release temperature of the foam (curve 7) 30) is achieved after 413 seconds. The maximum temperature reached (lines 740 and 750) is 4% higher when POM is used. Due to the higher thermal conductivity of OM, the foam temperature may drop rapidly initially. Degree is T fuse As soon as the temperature reaches 75% of the melting point, the cooling of both materials becomes equal. In the case of T, the cooling is rapid. This is because the temperature difference between the foam and the mold is large in the case of PET. This is thought to be due to the fact that the maximum part of one cycle can be consumed by passive cooling. For the molded material without filler, the cooling time was 393 seconds (PET) and 412 seconds (POM). This is due to the low thermal conductivity of the foam and mold material. Regardless of the mold material, 20 seconds of heating is relatively short.

[0079] Figures 8a and 8b show the results of 15 and 30 volume % BN in combination with POM or PET. The figures show the filler concentration of 100% by volume. The temperature measured inside the mold is shown in Figure 8a. With increasing filler content, the temperature The foam peak temperature (curves 810, 815, and 820) decreases slightly. T of POM (curve 810) without fuse 15% by volume of BN compared to 118% by volume for POM with 0.1% BN and POM with 30% BN by volume (curves 815 and 820). On the other hand, the temperature inside the mold was low (curve 84). 0, 845, and 850). The thermally conductive filler reduces the dielectric loss factor, The peak temperature is T fuse The ratios were 32% and 31% (curves 845 and 850). The combination of increased thermal conductivity and decreased temperature of the mold The cooling time can be significantly reduced. The processing time for POM with 15% by volume of BN was 307 seconds. However, the use of 30% by volume of BN further reduces this to 251 seconds. This can mean up to a 29% and 40% reduction in cycle time.

[0080] The same analysis was performed for PET and 15 vol% BN in Figure 8b. Compared with the results for M, the peak temperatures were higher for the mold material with filler and the mold material without filler. The results are similar for the PET and 15% by volume materials (curves 855 and 860). The peak temperature of the mold containing the BN mixture (curve 870) is higher than that of the mold without filler (curve 86 5) is 4% higher. Dielectric characterization shows that the dielectric loss factors of both materials are very similar. Nevertheless, the increase in thermal conductivity may result in a similar temperature development. Heat transfer from the foam to the mold material can be rapid, which results in a peak temperature of the thermally conductive mold material of Due to the increased thermal conductivity, both the foam and the mold cool more rapidly. A cycle time of 313 seconds can be achieved, but this is This equates to a 20% reduction in time.

[0081] Those skilled in the art will appreciate that other filler materials or mixtures such as those mentioned above are also contemplated. For example, the filler material may be a dielectric material, particularly a mixture of at least two inorganic materials. Mixtures, preferably metal nitrides, metal oxides, metal carbides, metal sulfides, metal silicates , silicon carbide, and silicon nitride, most preferably boron nitride ( BN), SILATHERM® (a mixture of Al2O3 and SiO2), and may include SILATHERM® Advance. Additionally, filler materials include mixtures of carbonaceous and inorganic materials, carbon fibers, glassy carbon, and the like. Carbon nanotubes, carbon nanobuds, aerographite, linear acetylene Carbon, q-carbon, graphene, salt, single crystal powder, polycrystalline powder, amorphous powder, glass fiber As mentioned above, all of the above embodiments include a sole-shaped inner mirror. Efficient heating of the midsole by dielectric heating and subsequent cooling of the sole mold and midsole The same idea is followed: to achieve optimum properties for efficient molding.

[0082] Alternatively or additionally to the above, the inventive mold according to the present invention can be used to make parts, particularly micro In different areas of sports clothing such as the Midsole 120, It is also possible to select filler materials to obtain the desired mechanical properties. Different levels of fusion in different areas and therefore graded in the midsole 120 This may include physical or mechanical properties, for example, the presence of polyimides in different areas of the mold. Different mixtures of polymer and filler materials may be used. Such an embodiment would therefore allow for graded and therefore reproducible manufacturing processes. Opens up the possibility of providing tailored midsole characteristics.

[0083] In summary, the use of the sole mold according to the present invention improves the quality of the final product. In addition, in the field of sports clothing, particularly in the reduction of cycle times for shoe soles This brings about great benefits to the entire molding process, and can improve overall productivity. The present invention includes the following aspects. [Aspect 1] A mold for forming a part, in particular a sports garment, comprising: a. comprising a mixture of a polymeric material and a filler material; b. A mold wherein the filler material is configured to allow heating of the part inside said mold by an electromagnetic field. [Aspect 2] 10. The mold of embodiment 1, wherein the filler material is configured to increase the thermal conductivity of the mold. [Aspect 3] 3. The mold of any one of the preceding claims, wherein the filler material is configured to increase the dielectric constant of the mold relative to the part. [Aspect 4] The mold of any one of aspects 1-3, wherein the filler material comprises a dielectric material, particularly a mixture of at least two inorganic materials, preferably at least one of a metal nitride, a metal oxide, a metal carbide, a metal sulfide, a metal silicate, silicon carbide, and silicon nitride, most preferably boron nitride (BN). [Aspect 5] 5. The mold of any one of aspects 1-4, wherein the filler material comprises at least one of a mixture of carbonaceous and inorganic materials, carbon fibers, glassy carbon, carbon nanotubes, carbon nanobuds, aerographite, linear acetylenic carbon, q-carbon, graphene, salt, single crystal powder, polycrystalline powder, amorphous powder, and glass fibers. [Aspect 6] A mold according to any one of aspects 1 to 5, wherein the mixture comprises filler material in an amount of 1 to 75% by volume, in particular 1 to 30% by volume, preferably 1 to 25% by volume, more preferably 1 to 20% by volume, and most preferably 5 to 20% by volume, or the mixture comprises filler material in an amount of 10 to 40% by volume, in particular 15 to 35% by volume. [Aspect 7] Aspect 7. The mold of any one of aspects 1-6, wherein the polymeric material comprises a thermoplastic material, preferably at least one of polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyoxymethylene (POM), polyamideimide (PAI), polycarbonate (PC), polyketone (PK), polyetheretherketone (PEEK), or polyethylene (PE). [Aspect 8] Aspect 8. The mold of any one of aspects 1-7, wherein the polymer material is configured to increase the dielectric constant of the mold compared to the part. [Aspect 9] Aspect 9. The mold of any one of aspects 1-8, wherein the polymer material is configured to increase the dielectric loss factor of the mold. [Aspect 10] Aspect 10. The mold of any one of aspects 1-9, wherein the polymeric material comprises a foamed material. [Aspect 11] A mold according to any one of aspects 1 to 10, wherein the mold is a sole mold and the part is a shoe sole, in particular a midsole. [Aspect 12] The mold according to any one of aspects 1 to 11, wherein the electromagnetic field is in a high frequency band of 30 kHz to 300 GHz, preferably 1 MHz to 200 MHz, more preferably 1 MHz to 50 MHz, and most preferably 25 to 30 MHz. [Aspect 13] A method for manufacturing a component, in particular a sports garment, comprising the steps of: a. A method comprising: molding a part using the mold of any one of aspects 1-12. [Aspect 14] b. Loading a first material of the part, including particles of a foam material, into a mold; c. heating the first material, the mixture of polymeric material and filler material of the mold, and / or the susceptor of the mold by an electromagnetic field; 14. The method of embodiment 13, further comprising at least one of: [Aspect 15] The susceptor is made of at least the following materials: 15. The method of embodiment 13 or 14, comprising at least one of expanded polypropylene (ePP), polyurethane (PU), polylactide (PLA), polyether block amide (PEBA), and polyethylene terephthalate (PET). [Aspect 16] 16. The method of embodiment 14 or 15, wherein the heating step comprises fusing the surfaces of the particles. [Aspect 17] The particles of the part are made of at least the following materials: Expanded Thermoplastic Polyurethane (eTPU), Expanded Polyamide (ePA), Expanded Polyether Block Amide (ePEBA), Polylactide (PLA), Polyether Block Amide (PEBA), Polyethylene Terephthalate (PET), Polybutylene Terephthalate (PBT), Thermoplastic Polyester Ether Elastomer (TPEE) 17. The method of any one of aspects 14 to 16, comprising at least one of: [Aspect 18] 18. The method of any one of aspects 14-17, wherein the particles comprise a foamed material. [Aspect 19] A method according to any one of aspects 13 to 18, wherein the electromagnetic field is in a high frequency band of 30 kHz to 300 GHz, preferably 1 MHz to 200 MHz, more preferably 1 MHz to 50 MHz, and most preferably 25 to 30 MHz. [Aspect 20] Aspect 20. The method of any one of aspects 14-19, wherein the mold is further loaded with a second material that is essentially unaltered by the electromagnetic field. [Aspect 21] A component, in particular a sports garment, manufactured by the method according to any one of aspects 13 to 20. [Aspect 22] 22. The component according to embodiment 21, wherein the component is a shoe sole, in particular a midsole. [Aspect 23] A shoe, in particular a sports shoe, comprising a component according to aspect 21 or 22. [Explanation of symbols]

[0084] 100 type (sole type) 105a lower part 105b upper part 105c Side 120 parts (midsole)

Claims

1. a mold for forming a part, said part being a sports garment; a. comprising a mixture of a polymeric material and a filler material; b. the filler material is configured to allow heating of the part inside the mold by an electromagnetic field; The dielectric constant of said mold is high compared to the part, The mold, wherein the filler material comprises boron nitride (BN).

2. A mold as described in claim 1, wherein the filler material is configured to increase the dielectric constant of the mold compared to the part.

3. A mold as described in claim 1 or 2, wherein the polymer material is configured to increase the dielectric constant of the mold compared to the part.

4. The mold described in claim 3, wherein the polymer material includes at least one of polyacrylonitrile (PAN), polyamide, or polyethylene terephthalate (PET).

5. A mold described in any one of claims 1 to 4, wherein the mixture contains the filler material in an amount of 1 to 75 volume %, 1 to 30 volume %, 1 to 25 volume %, 1 to 20 volume %, 5 to 20 volume %, 10 to 40 volume %, or 15 to 35 volume %.

6. A mold described in any one of claims 1 to 5, wherein the polymer material is configured to increase the dielectric loss coefficient of the mold.

7. A mold described in any one of claims 1 to 6, wherein the polymer material comprises a foamed material.

8. The mold according to any one of claims 1 to 7, wherein the mold is a sole mold and the part is a shoe sole or a midsole.

9. A mold described in any one of claims 1 to 8, wherein the electromagnetic field is in a high frequency band of 30 kHz to 300 GHz, 1 MHz to 200 MHz, 1 MHz to 50 MHz, or 25 to 30 MHz.

10. 1. A method of manufacturing a part, the part being a sports garment, comprising: A method comprising the step of: moulding said part using a mould according to any one of claims 1 to 9.

11. b. Loading the mold with a first material for the part, the first material including particles of a foam material; c. heating the first material, the mixture of the polymeric material and the filler material of the mold, and / or a susceptor of the mold by an electromagnetic field; The method of claim 10 , further comprising at least one of:

12. The susceptor according to claim 1, wherein the susceptor is made of at least the following material:

12. The method of claim 11, comprising at least one of expanded polypropylene (ePP), polyurethane (PU), polylactide (PLA), polyether block amide (PEBA), and polyethylene terephthalate (PET).

13. A method as described in claim 11 or 12, wherein the heating step includes a step of fusing the surfaces of the particles.

14. The particles comprising at least one of the following materials: Expanded thermoplastic polyurethane (eTPU), expanded polyamide (ePA), expanded polyether block amide (ePEBA), polylactide (PLA), polyether block amide (PEBA), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), thermoplastic polyester ether elastomer (TPEE) The method according to any one of claims 11 to 13, comprising at least one of:

15. A method described in any one of claims 10 to 14, wherein the electromagnetic field is a high-frequency band of 30 kHz to 300 GHz, 1 MHz to 200 MHz, 1 MHz to 50 MHz, or 25 to 30 MHz.

16. A method according to any one of claims 10 to 15, wherein the mold is further loaded with a second material that does not melt, begin to melt, soften, or harden due to the electromagnetic field.

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