Maintenance jig, plating device, and power supply contact maintenance method

Abstract

To reduce the time required for maintenance to remove plated metal from a power supply contact. A maintenance jig 490 for removing a metal film deposited on a power supply contact 442-4 provided on a substrate holder of a plating apparatus includes: a cathode chamber 492 configured to contain an electrolytic solution; a cathode 493 disposed in the cathode chamber 492 and configured to apply a voltage between the cathode 493 and the power supply contact 442-4; and a diaphragm 494 having a first surface 494a in contact with the electrolytic solution in the cathode chamber 492 and a second surface 494b in contact with the power supply contact 442-4 when the maintenance jig 490 is installed on the substrate holder, the diaphragm 494 being capable of retaining the electrolytic solution in the cathode chamber 492 and configured to allow anions to pass through from the first surface 494a side to the second surface 494b side.

Description

[Technical Field]

[0001] The present application relates to a maintenance jig, a plating apparatus, and a maintenance method for a power supply contact. [Background technology]

[0002] A cup-type electrolytic plating apparatus is known as an example of a plating apparatus. In a cup-type electrolytic plating apparatus, a substrate (e.g., a semiconductor wafer) held by a substrate holder is immersed in a plating solution with the surface to be plated facing downward, and a voltage is applied between the substrate and an anode to deposit a conductive film on the surface of the substrate.

[0003] The substrate holder of the plating apparatus disclosed in Patent Document 1 is equipped with a power supply contact for applying a voltage to a substrate. In such a plating apparatus, plating solution may leak into the area where the power supply contact is installed during plating processing, causing plating metal (and its oxide) to deposit on the power supply contact. In the prior art, when plating metal deposits on the power supply contact, maintenance work has been performed, in which the power supply contact is removed from the substrate holder and the plating metal is removed from the power supply contact. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7114002 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the maintenance work of the conventional technology takes a long time because it requires the steps of removing the power supply contact from the board holder, removing the plated metal from the power supply contact, and then attaching the power supply contact to the board holder.

[0006] Therefore, one object of the present invention is to reduce the time required for maintenance to remove plated metal from power supply contacts. [Means for solving the problem]

[0007] According to one embodiment, a maintenance jig for removing a metal film deposited on a power supply contact provided on a substrate holder of a plating apparatus is disclosed, the maintenance jig including: a cathode chamber configured to contain an electrolytic solution; a cathode disposed in the cathode chamber and configured to apply a voltage between the cathode and the power supply contact; and a diaphragm having a first surface that contacts the electrolytic solution in the cathode chamber and a second surface that contacts the power supply contact when the maintenance jig is installed on the substrate holder, the diaphragm being capable of retaining the electrolytic solution in the cathode chamber and being configured to allow anions to pass through from the first surface side to the second surface side. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. [Figure 2] FIG. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. [Figure 3] FIG. 3 is a vertical cross-sectional view schematically showing the configuration of the plating module of this embodiment. [Figure 4] FIG. 4 is a vertical cross-sectional view schematically showing a state in which a maintenance jig is installed in a plating module. [Figure 5] FIG. 5 is a vertical cross-sectional view schematically showing the configuration of the maintenance jig of this embodiment. [Figure 6] FIG. 6 is a vertical cross-sectional view schematically showing the configuration of the maintenance jig of this embodiment. [Figure 7] FIG. 7 is a flowchart of the maintenance method for the power supply contact of this embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals, and redundant description will be omitted.

[0010] <Overall configuration of plating equipment> Fig. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. Fig. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0011] The load port 100 is a module for loading substrates stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading substrates from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are optional. The transfer robot 110 is a robot for transporting substrates and is configured to transfer substrates between the load ports 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. When transferring substrates between the transfer robot 110 and the transfer apparatus 700, the transfer robot 110 and the transfer apparatus 700 can transfer the substrates via a temporary stage (not shown).

[0012] The aligner 120 is a module for aligning the positions of the substrate's orientation flat, notch, and the like in a predetermined direction. In this embodiment, two aligners 120 are arranged horizontally, but the number and arrangement of the aligners 120 are arbitrary. The prewet module 200 wets the surface of the substrate to be plated with a treatment liquid such as pure water or degassed water before plating, thereby replacing air inside the pattern formed on the substrate surface with the treatment liquid. The prewet module 200 is configured to perform a prewet process that replaces the treatment liquid inside the pattern with a plating liquid during plating, making it easier to supply the plating liquid inside the pattern. In this embodiment, two prewet modules 200 are arranged vertically, but the number and arrangement of the prewet modules 200 are arbitrary.

[0013] The presoak module 300 is configured to perform a presoak process, which involves etching away, for example, a highly electrically resistive oxide film present on the surface of a seed layer formed on the surface of a substrate to be plated using a treatment solution such as sulfuric acid or hydrochloric acid, thereby cleaning or activating the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are optional. The plating module 400 performs plating on the substrate. In this embodiment, two sets of 12 plating modules 400 are arranged vertically, three vertically and four horizontally, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are optional.

[0014] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and other substances remaining on the substrate after plating. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of the cleaning modules 500 are optional. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers are arranged vertically, but the number and arrangement of the spin rinse dryers are optional. The transport device 700 is a device for transporting substrates between multiple modules in the plating apparatus 1000. The control module 800 is configured to control the multiple modules of the plating apparatus 1000 and can be configured, for example, as a general-purpose computer or a dedicated computer equipped with an input / output interface with an operator.

[0015] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette on the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the substrate's orientation flat, notch, etc. to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the pre-wet module 200.

[0016] The pre-wet module 200 performs a pre-wet process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-soak process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0017] The transfer device 700 transfers the plated substrate to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the cleaned substrate to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the dried substrate to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0018] <Plating module configuration> Next, the configuration of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same configuration, only one plating module 400 will be described. Figure 3 is a vertical cross-sectional view that schematically shows the configuration of a plating module in one embodiment.

[0019] 3, the plating module 400 includes a plating tank 410 for containing a plating solution. The plating module 400 also includes a membrane 420 that vertically separates the interior of the plating tank 410. The interior of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by the membrane 420.

[0020] The cathode region 422 and the anode region 424 are each filled with plating solution. The plating module 400 is equipped with a nozzle 426 opening toward the cathode region 422 and a supply source 428 for supplying plating solution to the cathode region 422 via the nozzle 426. The plating module 400 is also equipped with a mechanism for supplying plating solution to the anode region 424, but this is not shown. An anode 430 is provided on the bottom surface of the plating tank 410 in the anode region 424. A resistor 450 is disposed in the cathode region 422 facing the membrane 420. The resistor 450 is a member for ensuring uniformity in the plating process on the plating surface Wf-a of the substrate Wf, and is composed of a plate-like member with a large number of holes formed therein.

[0021] The plating module 400 also includes a substrate holder 440 for holding the substrate Wf with its plating surface Wf-a facing downward. The substrate holder 440 includes a power supply contact for supplying power to the substrate Wf from a power source (not shown). The substrate holder 440 also includes a seal ring holder 442 for supporting the outer edge of the plating surface Wf-a of the substrate Wf, and a frame 446 for holding the seal ring holder 442 to a substrate holder main body (not shown). The substrate holder 440 also includes a back plate 444 for pressing the back surface of the plating surface Wf-a of the substrate Wf, and a shaft 448 attached to the back surface of the back plate 444 opposite the substrate pressing surface.

[0022] The plating module 400 includes a lifting mechanism 443 for raising and lowering the substrate holder 440, and a rotation mechanism 447 for rotating the substrate holder 440 so that the substrate Wf rotates around a virtual axis of a shaft 448 (a virtual rotation axis extending vertically through the center of the surface Wf-a to be plated). The lifting mechanism 443 and the rotation mechanism 447 can be realized by known mechanisms such as a motor. The plating module 400 is configured to perform a plating process on the surface Wf-a to be plated of the substrate Wf by using the lifting mechanism 443 to immerse the substrate Wf in the plating solution in the cathode region 422 and applying a voltage between the anode 430 and the substrate Wf.

[0023] In the plating module 400 of this embodiment, during plating processing, the plating solution may leak into the area where the power supply contacts of the substrate holder 440 are installed. In this case, the plating metal (and its oxide) may be deposited on the surface of the power supply contacts, which may result in uneven thickness of the conductive film formed on the plating surface Wf-a.

[0024] In contrast, the plating module 400 of this embodiment is provided with a maintenance jig for removing the metal film deposited on the power supply contact. The maintenance jig will be described below.

[0025] Fig. 4 is a longitudinal cross-sectional view showing a maintenance jig installed in a plating module. As shown in Fig. 4, the maintenance jig 490 is formed in a disk shape with approximately the same diameter as the substrate Wf, and is designed to be held by the substrate holder 440 in place of the substrate Wf. The maintenance jig 490 is configured to remove a metal film deposited on the power supply contacts while installed on the substrate holder 440 as shown in Fig. 4.

[0026] Fig. 5 is a vertical cross-sectional view showing a schematic configuration of the maintenance jig of this embodiment. Fig. 5 shows an enlarged view of region α in Fig. 4. First, the configuration of the substrate holder 440 will be described.

[0027] The seal ring holder 442 includes an annular support member 442-1 for supporting the outer periphery of the maintenance jig 490. The support member 442-1 has a flange 442-1a that protrudes from the outer periphery of the lower surface of the maintenance jig 490. An annular seal member 442-2 is disposed on top of the flange 442-1a. The seal member 442-2 is an elastic member. The support member 442-1 supports the outer periphery of the maintenance jig 490 via the seal member 442-2.

[0028] The seal ring holder 442 includes an annular pedestal 442-3 attached to the inner circumferential surface of a support member 442-1. The pedestal 442-3 is a conductive member such as stainless steel. The seal ring holder 442 includes a power feed contact 442-4 for supplying power to the substrate. The power feed contact 442-4 is annularly attached to the inner circumferential surface of the pedestal 442-3 with screws or the like. The support member 442-1 holds the power feed contact 442-4 via the pedestal 442-3. The power feed contact 442-4 is a conductive member for supplying power to the substrate held by the substrate holder 440 during plating processing.

[0029] The substrate holder 440 includes an electrode member 484 disposed near the power supply contact 442-4. The electrode member 484 is an annular member having electrical conductivity. The substrate holder 440 includes an annular spacer 482 disposed between the power supply contact 442-4 and the electrode member 484. The spacer 482 is an insulator. The power supply contact 442-4 and the electrode member 484 are insulated by the spacer 482.

[0030] The plating module 400 applies a voltage between the power supply contact 442-4 and the electrode member 484 using a power supply (not shown) and measures the current flowing between them, thereby detecting leakage of plating solution into the area where the power supply contact 442-4 is installed. Specifically, when a plating process is performed with a substrate Wf held by the substrate holder 440, plating solution may leak into the internal area of ​​the substrate holder 440 (the area where the power supply contact 442-4 is installed) through a gap in the seal member 442-2. In this case, the measured current value increases due to the influence of the leaked plating solution. Therefore, the plating module 400 can detect leakage of plating solution into the area where the power supply contact 442-4 is installed based on the measured current.

[0031] Next, details of the maintenance jig 490 will be described. The maintenance jig 490 includes a disk-shaped jig body 491 having a diameter corresponding to the substrate Wf held by the substrate holder 440. The jig body 491 has an opposing surface that faces the tip of the power feed contact 442-4 when the jig body 491 is installed on the substrate holder 440.

[0032] The maintenance jig 490 includes a cathode chamber 492 configured to contain an electrolyte. More specifically, the cathode chamber 492 includes a groove formed along the periphery of the surface of the jig body 491 facing the power supply contact 442-4. The cathode chamber 492 may include an injection port for injecting the electrolyte into the cathode chamber 492. The maintenance jig 490 includes a cathode 493 disposed in the cathode chamber 492. The cathode 493 is configured to have a voltage applied between it and the power supply contact 442-4.

[0033] The maintenance jig 490 includes a diaphragm 494 disposed to cover the groove of the cathode chamber 492. The diaphragm 494 has a first surface 494a that contacts the electrolyte in the cathode chamber 492 and a second surface 494b that contacts the power supply contact 442-4 when the maintenance jig 490 is installed on the substrate holder 440. The diaphragm 494 is configured to retain the electrolyte in the cathode chamber 492 and to allow anions to pass from the first surface 494a to the second surface 494b. The diaphragm 494 may include an anion exchange membrane having the first surface 494a and the second surface 494b. The diaphragm 494 is not limited to an anion exchange membrane, and may include a porous membrane having the first surface 494a and the second surface 494b. In this specification, contact between the power supply contact 442-4 and the second surface 494b of the diaphragm 494 includes not only direct contact between the power supply contact 442-4 and the second surface 494b of the diaphragm 494, but also contact between the power supply contact 442-4 and the second surface 494b of the diaphragm 494 via a liquid (e.g., water).

[0034] The maintenance jig 490 includes a water-retentive porous body (e.g., a sponge) 495 laminated on the second surface 494b. The porous body 495 is wetted with water when performing maintenance on the power feed contact 442-4. This allows the power feed contact 442-4 and the second surface 494b of the diaphragm 494 to come into contact with each other via the water held in the porous body 495 when the maintenance jig 490 is placed on the substrate holder 440. Furthermore, providing the porous body 495 can prevent damage to the diaphragm 494 that would otherwise occur if the tip of the power feed contact 442-4 were to come into direct contact with the diaphragm 494.

[0035] The maintenance jig 490 includes a power supply 497 disposed within a jig body 491. The power supply 497 has a negative voltage pole connected to the cathode 493 and a positive voltage pole connected to a positive voltage port 498 formed in the jig body 491. The maintenance jig 490 includes a connection member 496 configured to connect the positive voltage port 498 and the power supply contact 442-4 when the maintenance jig 490 is installed on the substrate holder 440.

[0036] Use of the maintenance jig 490 of this embodiment can shorten the time required for maintenance to remove the plating metal from the power feed contact 442-4. Specifically, when plating metal is deposited on the power feed contact 442-4, the maintenance jig 490, with the porous body 495 moistened with water, is placed on the substrate holder 440. Then, by applying a voltage between the cathode 493 and the power feed contact 442-4, anions are supplied from the cathode 493 side through the diaphragm 494, and at the same time, some of the water is decomposed on the surface of the power feed contact 442-4, producing acid. Furthermore, the plating metal on the surface of the power feed contact 442-4 is oxidized and dissolved, resulting in electrolytic etching of the plating metal.

[0037] More specifically, when the maintenance jig 490 with the porous body 495 wetted with water is placed on the substrate holder 440, the water wets the power supply contact 442-4 side of the diaphragm 494, causing some of the acid in the electrolyte to permeate the membrane and diffuse toward the power supply contact 442-4. Furthermore, when a voltage is applied between the cathode 493 and the power supply contact 442-4, anions in the electrolyte permeate the diaphragm 494 and migrate toward the power supply contact 442-4. Hydrogen ions are generated on the surface of the power supply contact 442-4 by electrolysis of water, increasing the acid concentration (decreasing the pH). The plating metal attached to the surface of the power supply contact 442-4 is oxidized by an electrode reaction and becomes a hydroxide in the neutral range, becoming passivated. However, as the pH decreases, the hydroxide is neutralized, becoming metal ions, and dissolving.

[0038] As an example, when the electrolyte is H2SO4 and the metal attached to the power supply contact 442-4 is Cu, the reaction on the surface of the power supply contact 442-4 is as follows: H2O→2H + +1 / 2O2+2e - Electrolysis of water, acid production Cu+2H2O→Cu(OH)2+2H + +2e - Cu oxidation Cu(OH)2+H2SO4→Cu 2+ +SO4 2- +2H2O···Neutralizes copper hydroxide, dissolves Cu ions

[0039] Use of the maintenance jig 490 of this embodiment makes it possible to omit the steps of removing the feed contact 442-4 from the substrate holder 440 and attaching the feed contact 442-4 to the substrate holder 440, thereby shortening the time required for maintenance to remove the plated metal from the feed contact 442-4. Furthermore, with the maintenance jig 490 of this embodiment, current flows concentrated at the tip of the feed contact 442-4 near the diaphragm 494, thereby efficiently activating the tip of the feed contact 442-4.

[0040] In the above description, an example has been shown in which the porous body 495 is wetted with water, but the present invention is not limited to this, and maintenance work may be performed by supplying water to the area where the power supply contact 442-4 of the substrate holder 440 is installed. In addition, in the above description, an example has been shown in which the power supply 497 is arranged inside the maintenance jig 490, but the present invention is not limited to this, and power may be supplied from outside the maintenance jig 490. In this case, a terminal for supplying power to the cathode 493 may be installed in the jig body 491.

[0041] The maintenance jig 490 can be stored in a storage location within the plating module 400 or the plating apparatus 1000. When maintenance work on the power supply contact 442-4 is to be performed, the maintenance jig 490 can be placed on the substrate holder 440 by a robot or the like.

[0042] In the above description, the diaphragm 494 includes either an anion exchange membrane or a porous membrane, but is not limited to this. Fig. 6 is a longitudinal cross-sectional view schematically showing the configuration of the maintenance jig of this embodiment. As shown in Fig. 6, the diaphragm 494 may include an anion exchange membrane 494-1 having a first surface 494a, and a porous membrane 494-2 laminated on the anion exchange membrane 494-1 and having a second surface 494b.

[0043] Next, a maintenance method for the power supply contact of this embodiment will be described with reference to Fig. 7, which is a flowchart of the maintenance method for the power supply contact of this embodiment.

[0044] 7, in the maintenance method for the power feed contact of this embodiment, a plating process is performed on the substrate Wf held by the substrate holder 440 (plating step S110). Next, in the maintenance method, after the plating step (S110), leakage of plating solution into the area of ​​the substrate holder 440 where the power feed contact 442-4 is installed is detected (leak detection step S112). In one example, the leak detection step S112 can be performed by applying a voltage between the power feed contact 442-4 and the electrode member 484 and measuring the current therebetween, but is not limited to this.

[0045] Next, in the maintenance method, if a plating solution leak is detected in the leak detection step (S112), the porous body 495 is wetted with water (S114), and the maintenance jig 490 is installed on the substrate holder 440 (installation step S116). Next, in the maintenance method, a voltage is applied between the power feed contact 442-4 and the cathode 493 of the maintenance jig 490 to etch the power feed contact 442-4 (maintenance step S118). This makes it possible to remove metal adhering to the power feed contact 442-4. Next, in the maintenance method, the maintenance jig 490 is removed from the substrate holder 440 (S120).

[0046] The maintenance method involves, after removing the maintenance jig 490 from the substrate holder 440, or when no plating solution leakage is detected by the leakage detection step (S112), supplying a cleaning liquid (e.g., pure water) to the area where the power supply contact 442-4 of the substrate holder 440 is installed, to clean the power supply contact 442-4 (S122).

[0047] According to the maintenance method of this embodiment, by using the maintenance jig 490, the steps of removing the power feed contact 442-4 from the substrate holder 440 and attaching the power feed contact 442-4 to the substrate holder 440 can be omitted, thereby shortening the time required for maintenance to remove the plated metal from the power feed contact 442-4.

[0048] Although several embodiments of the present invention have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects.

[0049] The present application discloses, as one embodiment, a maintenance jig for removing a metal film deposited on a power supply contact provided on a substrate holder of a plating apparatus, the maintenance jig including: a cathode chamber configured to contain an electrolytic solution; a cathode disposed in the cathode chamber and configured to apply a voltage between the cathode and the power supply contact; and a diaphragm having a first surface that contacts the electrolytic solution in the cathode chamber and a second surface that contacts the power supply contact when the maintenance jig is installed on the substrate holder, the diaphragm being capable of retaining the electrolytic solution in the cathode chamber and being configured to allow anions to pass from the first surface side to the second surface side.

[0050] Moreover, the present application discloses, as one embodiment, a maintenance jig that further includes a disk-shaped jig body having a diameter corresponding to the substrate held by the substrate holder, the jig body having an opposing surface that faces the power supply contact when the jig body is installed on the substrate holder, the cathode chamber including a groove formed along a peripheral portion of the opposing surface of the jig body, and the diaphragm being disposed so as to cover the groove of the cathode chamber.

[0051] Furthermore, the present application discloses, as one embodiment, a maintenance jig, in which the diaphragm includes an anion exchange membrane having the first surface and the second surface.

[0052] The present application also discloses, as one embodiment, a maintenance tool, in which the diaphragm includes a porous membrane having the first surface and the second surface.

[0053] Furthermore, the present application discloses, as one embodiment, a maintenance jig, in which the diaphragm includes an anion exchange membrane having the first surface, and a porous membrane laminated on the anion exchange membrane and having the second surface.

[0054] Moreover, the present application discloses, as one embodiment, a maintenance jig further including a porous body having water retention properties laminated on the second surface.

[0055] In addition, as one embodiment, the present application discloses a maintenance jig further including: a power supply disposed within the jig body, the power supply having a negative voltage pole connected to the cathode and a positive voltage pole connected to a positive voltage port formed in the jig body; and a connecting member configured to connect the positive power supply port and the power supply contact when the maintenance jig is installed on the substrate holder.

[0056] In addition, as one embodiment, the present application discloses a plating apparatus including a plating tank for containing a plating solution, an anode disposed in the plating tank, a substrate holder configured to hold a substrate with its surface to be plated facing downward, and any of the maintenance jigs described above for removing a metal film deposited on a power supply contact provided on the substrate holder.

[0057] Furthermore, as one embodiment, the present application discloses a maintenance method for a power supply contact, including: a plating step of performing a plating process on a substrate held by a substrate holder; a leak detection step of detecting, after the plating step, leakage of plating solution into an area where a power supply contact of the substrate holder is installed; an installation step of installing any of the maintenance jigs described above on the substrate holder when leakage of plating solution is detected in the leak detection step; and a maintenance step of applying a voltage between the power supply contact and the cathode of the maintenance jig. [Explanation of symbols]

[0058] 400 plating modules 410 Plating tank 430 Anode 440 PCB holder 442-4 Power supply contact 490 Maintenance Jig 491 Jig body 492 Cathode Chamber 493 cathode 494 Diaphragm 494a First Face 494b Second Side 494-1 Anion exchange membrane 494-2 Porous membrane 495 Porous Materials 496 Connecting members 497 Power supply 498 Positive Voltage Port 1000 plating equipment Wf substrate Wf-a Plated surface

Claims

1. A maintenance jig for removing a metal film deposited on a power supply contact provided on a substrate holder of a plating apparatus, a cathode chamber configured to contain an electrolyte; a cathode disposed in the cathode chamber, the cathode configured to have a voltage applied between the cathode and the power supply contact; a diaphragm having a first surface that contacts the electrolytic solution in the cathode chamber and a second surface that contacts the power supply contact when the maintenance jig is installed on the substrate holder, the diaphragm being configured to be able to retain the electrolytic solution in the cathode chamber and to allow anions to pass from the first surface side to the second surface side; Including maintenance fixtures.

2. a jig body having a disk-like shape and a diameter corresponding to the diameter of the substrate held by the substrate holder, the jig body having an opposing surface that faces the power supply contact when the jig body is installed on the substrate holder; the cathode chamber includes a groove formed along a peripheral portion of the opposing surface of the jig body, The diaphragm is disposed so as to cover the groove of the cathode chamber. The maintenance jig according to claim 1 .

3. the diaphragm includes an anion exchange membrane having the first surface and the second surface; The maintenance jig according to claim 2 .

4. the diaphragm includes a porous membrane having the first surface and the second surface; The maintenance jig according to claim 2 .

5. The diaphragm includes an anion exchange membrane having the first surface and a porous membrane laminated on the anion exchange membrane and having the second surface. The maintenance jig according to claim 2 .

6. Further comprising a porous body having water retention properties laminated on the second surface. The maintenance jig according to any one of claims 3 to 5.

7. a power supply disposed within the jig body, the power supply having a negative voltage pole connected to the cathode and a positive voltage pole connected to a positive voltage port formed in the jig body; a connection member configured to connect the positive voltage port and the power supply contact when the maintenance jig is installed on the substrate holder; further comprising: The maintenance jig according to claim 6.

8. a plating tank for containing a plating solution; an anode disposed in the plating tank; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a maintenance jig according to any one of claims 1 to 5 for removing a metal film deposited on a power supply contact provided on the substrate holder; Including, Plating equipment.

9. a plating step of performing a plating process on the substrate held by the substrate holder; a leakage detection step of detecting leakage of the plating solution into an area of ​​the substrate holder where a power supply contact is provided after the plating step; an installation step of installing the maintenance jig according to claim 1 on the substrate holder when a leakage of the plating solution is detected in the leakage detection step; a maintenance step of applying a voltage between the power supply contact and the cathode of the maintenance jig; A method for maintaining a power supply contact, comprising:

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