Sensor

Abstract

To provide a sensor whose characteristics can be improved.SOLUTION: A sensor comprises a base, a first detection section, and a second detection section. The base includes a first base region and a second base region. A first detection element of the first detection section includes a first resistance member, a first conductive member, and a first insulating member. At least a part of the first insulating member is between the first resistance member and the first conductive member. A first gap is provided between the first base region and the first detection element. The first detection element has a first area in a plane crossing a first direction from the first base region to the first detection element. A second detection element of the second detection section includes a second resistance member, a second conductive member, and a second insulating member. At least a part of the second insulating member is between the second resistance member and the second conductive member. A second gap is provided between the second base region and the second detection element. The second detection element has a second area in the plane. The second area is smaller than the first area.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD OF THE INVENTION An embodiment of the present invention relates to a sensor. [Background technology]

[0002] For example, there are sensors using MEMS (Micro Electro Mechanical Systems) elements, etc. Improvement of the characteristics of sensors is desired. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-205105 Summary of the Invention [Problem to be solved by the invention]

[0004] The embodiments provide sensors that allow for improved performance. [Means for solving the problem]

[0005] According to an embodiment, the sensor includes a base, a first detection unit, and a second detection unit. The base includes a first base region and a second base region. The first detection unit includes a first detection element. The first detection element includes a first resistive member, a first conductive member, and a first insulating member. At least a portion of the first insulating member is between the first resistive member and the first conductive member. A first gap is provided between the first base region and the first detection element. The first detection element has a first area in a plane intersecting a first direction from the first base region to the first detection element. The second detection unit includes a second detection element. The second detection element includes a second resistive member, a second conductive member, and a second insulating member. At least a portion of the second insulating member is between the second resistive member and the second conductive member. A second gap is provided between the second base region and the second detection element. The second detection element has a second area in the plane. The second area is smaller than the first area. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic view illustrating the sensor according to the first embodiment. [Figure 2] FIG. 2 is a schematic view illustrating the sensor according to the first embodiment. [Figure 3] FIG. 3 is a schematic view illustrating the sensor according to the first embodiment. [Figure 4] FIG. 4 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Figure 5] FIG. 5 is a schematic view illustrating the sensor according to the second embodiment. [Figure 6] FIG. 6 is a schematic view illustrating the sensor according to the second embodiment. [Figure 7] FIG. 7 is a schematic view illustrating the sensor according to the second embodiment. [Figure 8] FIG. 8 is a schematic cross-sectional view illustrating the sensor according to the second embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view illustrating the sensor according to the second embodiment. [Figure 10]FIG. 10 is a schematic view illustrating the sensor according to the embodiment. [Figure 11] 11(a) and 11(b) are graphs illustrating the characteristics of the sensor according to the embodiment. [Figure 12] 12(a) and 12(b) are graphs illustrating the characteristics of the sensor according to the embodiment. [Figure 13] FIG. 13 is a schematic cross-sectional view illustrating the sensor according to the third embodiment. [Figure 14] FIG. 14 is a schematic cross-sectional view illustrating the sensor according to the third embodiment. [Figure 15] FIG. 15 is a schematic cross-sectional view illustrating the sensor according to the third embodiment. [Figure 16] FIG. 16 is a schematic cross-sectional view illustrating the sensor according to the fourth embodiment. [Figure 17] FIG. 17 is a schematic cross-sectional view illustrating the sensor according to the fourth embodiment. [Figure 18] 18(a) to 18(c) are schematic cross-sectional views illustrating the sensor according to the fourth embodiment. [Figure 19] FIG. 19 is a schematic cross-sectional view illustrating the sensor according to the fifth embodiment. [Figure 20] FIG. 20 is a schematic cross-sectional view illustrating the sensor according to the fifth embodiment. [Figure 21] 21A and 21B are schematic cross-sectional views illustrating the sensor according to the fifth embodiment. [Figure 22] 22(a) and 22(b) are schematic cross-sectional views illustrating the sensor according to the fifth embodiment. [Figure 23] 23(a) and 23(b) are schematic cross-sectional views illustrating the sensor according to the fifth embodiment. [Figure 24] 24(a) and 24(b) are schematic cross-sectional views illustrating the sensor according to the fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Even when the same part is shown, the dimensions and ratios may be different depending on the drawing. In this specification and in each drawing, elements similar to those previously described with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted where appropriate.

[0008] (First embodiment) 1 to 3 are schematic views illustrating the sensor according to the first embodiment. Fig. 1 is a cross-sectional view taken along line A1-A2 in Fig. 2. Fig. 2 and Fig. 3 are plan views. As shown in Figs. 1 to 3, a sensor 110 according to the embodiment includes a base 41, a first detection unit 10A, and a second detection unit 10B.

[0009] 1, the base 41 includes a first base region 41a and a second base region 41b. In this example, the base 41 includes a substrate 41s and an insulating film 41i. The substrate 41s may be, for example, a semiconductor substrate (e.g., a silicon substrate). The substrate 41s may include, for example, a semiconductor circuit. The substrate 41s may include a connecting member such as a via electrode.

[0010] The direction from the first substrate region 41a to the second substrate region 41b is along the upper surface of the substrate 41, for example.

[0011] As shown in FIG. 1 , the first detection unit 10A includes a first detection element 11E. The first detection element 11E includes a first resistive member 11, a first conductive member 21, and a first insulating member 18A. At least a portion of the first insulating member 18A is located between the first resistive member 11 and the first conductive member 21. In this example, the first insulating member 18A is located around the first resistive member 11. The first insulating member 18A is located around the first conductive member 21. In this example, the first conductive member 21 is located between the base 41 and the first resistive member 11. In an embodiment, the first resistive member 11 may be located between the base 41 and the first conductive member 21. A first gap g1 is provided between the first base region 41a and the first detection element 11E.

[0012] 2 illustrates an example of a planar pattern of the first conductive member 21 and the second conductive member 22. FIG. 3 illustrates an example of a planar pattern of the first resistive member 11 and the second resistive member 12.

[0013] As shown in Figures 2 and 3, in this example, the first detection element 11E (the portion including the first resistance member 11, the first conductive member 21, and the first insulating member 18A) is octagonal. The planar shape of the first detection element 11E is arbitrary. The first detection element 11E has a first area S1. The first area S1 is the area of ​​the first detection element 11E in a plane that intersects with a first direction from the first base region 41a to the first detection element 11E.

[0014] As shown in Figure 1, the first direction is the Z-axis direction. The direction perpendicular to the Z-axis direction is the X-axis direction. The direction perpendicular to the Z-axis direction and the X-axis direction is the Y-axis direction. The plane intersecting with the first direction is, for example, the XY plane.

[0015] As shown in FIG. 1 , the second detection unit 10B includes a second detection element 12E. The second detection element 12E includes a second resistive member 12, a second conductive member 22, and a second insulating member 18B. At least a portion of the second insulating member 18B is located between the second resistive member 12 and the second conductive member 22. In this example, the second insulating member 18B is located around the second resistive member 12. The second insulating member 18B is located around the second conductive member 22. In this example, the second conductive member 22 is located between the base 41 and the second resistive member 12. In an embodiment, the second resistive member 12 may be located between the base 41 and the second conductive member 22. A second gap g2 is provided between the second base region 41b and the second detection element 12E.

[0016] As shown in Figures 2 and 3, in this example, the second detection element 12E (the portion including the second resistance member 12, the second conductive member 22, and the second insulating member 18B) is octagonal. The planar shape of the second detection element 12E is arbitrary. The second detection element 12E has a second area S2. The second area S2 is the area of ​​the second detection element 12E in the above-mentioned plane (the plane intersecting with the first direction). The second area S2 is smaller than the first area S1.

[0017] 2 and 3, a control unit 70 may be provided. The control unit 70 is electrically connectable to the first resistance member 11, the first conductive member 21, the second resistance member 12, and the second conductive member 22. The control unit 70, for example, supplies a first current i1 to the first conductive member 21 to increase the temperature of the first detection element 11E. The control unit 70 supplies a second current i2 to the second conductive member 22 to increase the temperature of the second detection element 12E.

[0018] The temperature of these detection elements rises due to Joule heat generated by the supplied current. The amount of heat generated by these detection elements changes through substances (such as gas) contained in the space surrounding these detection elements. The degree of change in the amount of heat depends on the thermal conductivity of the substances contained in the surrounding space. The temperature of these detection elements is detected by a resistive element. By detecting the temperature of these detection elements, the presence or absence and concentration of substances contained in the surrounding space can be detected. A detection signal 70s containing the detection result is output from the control unit 70.

[0019] In the embodiment, the first detection element 11E and the second detection element 12E have different areas. The difference in area causes the characteristics of the change in heat quantity (for example, heat dissipation characteristics) of these detection elements to differ. The difference in area causes the characteristics of the change in temperature of these detection elements to differ from each other. By utilizing the difference in the characteristics of the change in temperature, for example, it is possible to detect the substance to be detected with higher accuracy. According to the embodiment, a sensor capable of improving characteristics can be provided.

[0020] For example, the space around these detection elements may contain multiple different types of substances. For example, the space may contain carbon monoxide, carbon dioxide (e.g., a first substance), and hydrogen (e.g., a second substance). In the first reference example using one detection element, the temperature of the detection element is affected by both the thermal conductivity of the multiple different types of substances and the concentrations of those substances. For this reason, in the first reference example, it is difficult to detect multiple different types of substances (e.g., a first substance and a second substance).

[0021] In the second reference example, one detection element is used, and the detection element is heated to multiple temperatures, and the temperature (degree of heat dissipation) of the detection element at the multiple temperatures is detected. In the second reference example, when multiple types of substances are detected using the measurement results of the multiple temperatures of the detection element, the detection accuracy is insufficient. In the second reference example, only one detection element is used and there is only one type of heat dissipation characteristic, so the accuracy is insufficient. Furthermore, in the second reference example, multiple temperature increases are required, so the measurement time is long. In the second reference example, the control circuit is complex.

[0022] In the embodiment, a plurality of detection elements having different heat dissipation characteristics are used. By utilizing the temperature change characteristics of the detection elements having different heat dissipation characteristics, it is possible to separate the influence of the thermal conductivity of a plurality of different substances from the concentrations of those substances. For example, for each of the plurality of detection elements, information regarding the relationship between the concentration of each of the plurality of different substances and temperature (or a value corresponding to temperature) is acquired in advance. By using this information and the measured values ​​(multiple values) of temperature (or a value corresponding to temperature) obtained from these detection elements, it is possible to detect the concentrations of each of the plurality of different substances with high accuracy. For example, by solving simultaneous equations, it is possible to detect the concentrations of each of the plurality of different substances with high accuracy. In the embodiment, since measurements are performed using a plurality of detection elements, the measurement time is short.

[0023] In the embodiment, an example of a processing method for detection will be described later.

[0024] As described above, in the embodiment, the second area S2 of the second detection element 12E is smaller than the first area S1 of the first detection element 11E. In the embodiment, the relationship between these areas may be reversed.

[0025] As shown in FIG. 1, the first detection element 11E has a first length L1 in a direction (e.g., a second direction) intersecting the first direction (Z-axis direction). The second direction is a direction along the XY plane. The second direction may be, for example, the X-axis direction. The second detection element 12E has a second length L2 in a direction (e.g., the second direction) intersecting the first direction (Z-axis direction). In this example, the second length L2 is shorter than the first length L1. The difference in area is obtained.

[0026] As shown in FIGS. 1 to 3, for example, the first detection unit 10A may further include a first support portion 31S and a first connection portion 31C. The first support portion 31S is fixed to the base 41. The first connection portion 31C is supported by the first support portion 31S and supports the first detection element 11E. A gap is provided between the first base region 41a and the first connection portion 31C. The first connection portion 31C has, for example, a spring structure. The first detection unit 10A may have a cantilever structure.

[0027] The second detection unit 10B may further include a second support portion 32S and a second connection portion 32C. The second support portion 32S is fixed to the base 41. The second connection portion 32C is supported by the second support portion 32S and supports the second detection element 12E. A gap is provided between the second base region 41b and the second connection portion 32C. The second connection portion 32C has, for example, a spring structure. The second detection unit 10B may have a cantilever structure.

[0028] As shown in FIGS. 1 to 3, for example, the first detection unit 10A may further include a first other support portion 31aS and a first other connection portion 31aC. The first other support portion 31aS is fixed to the base 41. The first other connection portion 31aC is supported by the first other support portion 31aS and supports the first detection element 11E. A gap is provided between the first base region 41a and the first other connection portion 31aC. In this example, the first detection element 11E is provided between the first connection portion 31C and the first other connection portion 31aC. The first detection unit 10A may have a doubly supported beam structure.

[0029] The second detection unit 10B may further include a second other support portion 32aS and a second other connection portion 32aC. The second other support portion 32aS is fixed to the base 41. The second other connection portion 32aC is supported by the second other support portion 32aS and supports the second detection element 12E. A gap is provided between the second base region 41b and the second other connection portion 32aC. In this example, the second detection element 12E is provided between the second connection portion 32C and the second other connection portion 32aC. The second detection unit 10B may have a doubly supported beam structure.

[0030] 2 and 3, the first detection unit 10A may further include a support portion 31bS and a connection portion 31bC. The support portion 31bS is fixed to the base 41. The connection portion 31bC is supported by the support portion 31bS and supports the first detection element 11E. A gap (not shown) is provided between the first base region 41a and the connection portion 31bC. The connection portion 31bC has, for example, a spring structure.

[0031] The first detection unit 10A may further include a support portion 31cS and a connection portion 31cC. The support portion 31cS is fixed to the base 41. The connection portion 31cC is supported by the support portion 31cS and supports the first detection element 11E. A gap (not shown) is provided between the first base region 41a and the connection portion 31cC. The connection portion 31cC has, for example, a spring structure.

[0032] In this example, the direction from connecting portion 31bC to connecting portion 31cC intersects with the direction from first connecting portion 31C to first other connecting portion 31aC. In this example, first conductive member 21 is electrically connected to wiring provided on base 41 via connecting portion 31bC, connecting portion 31cC, supporting portion 31bS, and supporting portion 31cS. The wiring is electrically connected to control portion 70. First conductive member 21 has a meander structure.

[0033] 2 and 3, the second detection unit 10B may further include a support portion 32bS and a connection portion 32bC. The support portion 32bS is fixed to the base 41. The connection portion 32bC is supported by the support portion 32bS and supports the second detection element 12E. A gap (not shown) is provided between the second base region 41b and the connection portion 32bC. The connection portion 32bC has, for example, a spring structure.

[0034] The second detection unit 10B may further include a support portion 32cS and a connection portion 32cC. The support portion 32cS is fixed to the base 41. The connection portion 32cC is supported by the support portion 32cS and supports the second detection element 12E. A gap (not shown) is provided between the second base region 41b and the connection portion 32cC. The connection portion 32cC has, for example, a spring structure.

[0035] In this example, the direction from the connecting portion 32bC to the connecting portion 32cC intersects with the direction from the second connecting portion 32C to the second other connecting portion 32aC. In this example, the second conductive member 22 is electrically connected to wiring provided on the base 41 via the connecting portion 32bC, the connecting portion 32cC, the supporting portion 32bS, and the supporting portion 32cS. The wiring is electrically connected to the control unit 70. The second conductive member 22 has a meandering structure. In one example, the shape of the second conductive member 22 may be similar to that of the first conductive member 21.

[0036] For example, the first connecting portion 31C, the first other connecting portion 31aC, the connecting portion 31bC, and the connecting portion 31cC may have a meander structure. For example, the second connecting portion 32C, the second other connecting portion 32aC, the connecting portion 32bC, and the connecting portion 32cC may have a meander structure.

[0037] 3, the first detection element 11E may include a first layer 15a and a second layer 15b. The first layer 15a and the second layer 15b have the same material and thickness as the first resistance member 11. The first resistance member 11 is provided between the first layer 15a and the second layer 15b. By providing these layers, warping (deformation) of the first detection element 11E is suppressed.

[0038] 3, the second detection element 12E may include a third layer 15c and a fourth layer 15d. The third layer 15c and the fourth layer 15d have the same material and thickness as the second resistance member 12. The second resistance member 12 is provided between the third layer 15c and the fourth layer 15d. By providing these layers, warping (deformation) of the second detection element 12E is suppressed.

[0039] As shown in FIG. 1 , the sensor 110 may further include a resistive element 16. For example, the resistive element 16 is fixed to the base 41. As described below, the control unit 70 may derive a difference between an electrical signal obtained from the first resistive element 11 and an electrical signal obtained from the resistive element 16. The control unit 70 may derive a difference between an electrical signal obtained from the second resistive element 12 and an electrical signal obtained from the resistive element 16. This, for example, can suppress the effects of fluctuations in the ambient temperature or the temperature of the base 41. This enables more accurate detection. The resistive element 16 is omitted in FIGS. 2 and 3 . Multiple resistive elements 16 may be provided. For example, the difference between the electrical signal obtained from the first resistive element 11 and an electrical signal obtained from one of the multiple resistive elements 16 may be derived. For example, the difference between the electrical signal obtained from the second resistive element 12 and an electrical signal obtained from another one of the multiple resistive elements 16 may be derived.

[0040] FIG. 4 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. Fig. 4 is a cross-sectional view corresponding to the cross section taken along line A1-A2 in Fig. 2. As shown in Fig. 4, in sensor 111 according to the embodiment, first detection element 11E and second detection element 12E have different heights relative to base 41. The remaining configuration of sensor 111 may be similar to that of sensor 110.

[0041] In the sensor 111, a first distance d1 in the first direction (Z-axis direction) between the first substrate region 41a and the first detection element 11E is different from a second distance d2 in the first direction between the second substrate region 41b and the second detection element 12E. These distances correspond to the lengths of the gaps (first gap g1 and second gap g2). These different distances result in different heat dissipation characteristics from these detection elements via the substrate 41. Different heat dissipation characteristics are obtained. Utilizing the difference in heat dissipation characteristics enables detection with higher accuracy.

[0042] For example, the first distance d1 is longer than the second distance d2. Due to the longer first distance d1, heat dissipation through the base 41 of the first detection element 11E is suppressed more than that of the second detection element 12E. For example, the first area S1 of the first detection element 11E is larger than the second area S2 of the second detection element 12E. The difference in area and the difference in distance (difference in gap length) more effectively achieves a difference in heat dissipation characteristics.

[0043] (Second embodiment) 5 to 7 are schematic views illustrating the sensor according to the second embodiment. Fig. 5 is a cross-sectional view taken along line A1-A2 in Fig. 6. Figs. 6 and 7 are plan views. As shown in Figs. 5 to 7, sensor 120 according to this embodiment includes a base 41, a first detection unit 10A, and a second detection unit 10B. In sensor 120, the configuration of the connection units included in the detection units differs from the configuration in sensor 110. For example, the thermal resistance of the connection unit included in first detection unit 10A differs from the thermal resistance of the connection unit included in second detection unit 10B. The configuration of sensor 120 other than this may be the same as the configuration in sensor 110 or sensor 111.

[0044] 5 to 7, in sensor 120, for example, first detection unit 10A includes a first support portion 31S and a first connection portion 31C. First support portion 31S is fixed to base 41. First connection portion 31C is supported by first support portion 31S and supports first detection element 11E. A gap is provided between first base region 41a and first connection portion 31C.

[0045] The second detection unit 10B includes a second support portion 32S and a second connection portion 32C. The second support portion 32S is fixed to the base 41. The second connection portion 32C is supported by the second support portion 32S and supports the second detection element 12E. A gap is provided between the second base region 41b and the second connection portion 32C.

[0046] 6, in the sensor 120, the first connection portion 31C has a first connection length LC1. The first connection length LC1 is the length of the first connection portion 31C along the path (first connection portion path) between the first support portion 31S and the first detection element 11E.

[0047] As shown in FIG. 6, the second connection portion 32C has a second connection length LC2. The second connection length LC2 is the length of the second connection portion 32C along the path (second connection path) between the second support portion 32S and the second detection element 12E. The second connection length LC2 is different from the first connection length LC1. This difference in length results in a difference in the thermal resistance of the connection portion. For example, a difference in the heat dissipation characteristics through the connection portion is created. By utilizing the difference in the heat dissipation characteristics through the connection portion, it is possible to detect the detection target substance with higher accuracy. According to the embodiment, it is possible to provide a sensor with improved characteristics. For example, it is possible to detect the respective concentrations of multiple different types of substances with high accuracy. In the embodiment, the measurement time is short.

[0048] 6, in the sensor 120, the first other connection portion 31aC has a first other connection length LCa1. The first other connection length LCa1 is the length of the first other connection portion 31aC along the path (first other connection portion path) between the first other support portion 31aS and the first detection element 11E.

[0049] 6, the second other connection portion 32aC has a second other connection length LCa2. The second other connection length LCa2 is the length of the second other connection portion 32aC along the path (second other connection portion path) between the second other support portion 32aS and the second detection element 12E. The second other connection length LCa2 is different from the first other connection length LCa1. This difference in length results in a difference in the thermal resistance of the other connection portion.

[0050] In this example, the second connection length LC2 is shorter than the first connection length LC1 In this example, the second other connection length LCa2 is shorter than the first other connection length LCa1.

[0051] In the sensor 120, the first area S1 may be the same as or different from the second area S2. In this example, the first area S1 is larger than the second area S2. In this case, the second connection length LC2 is shorter than the first connection length LC1. The difference in heat dissipation characteristics based on the difference in area and the difference in heat dissipation characteristics based on the difference in connection length are utilized. This makes it possible to more effectively utilize the difference in heat dissipation characteristics.

[0052] In the embodiment, for example, the length of connecting portion 31bC along the path of connecting portion 31bC may be different from the length of connecting portion 32bC along the path of connecting portion 32bC. The length of connecting portion 31cC along the path of connecting portion 31cC may be different from the length of connecting portion 32cC along the path of connecting portion 32cC.

[0053] As shown in FIG. 6 , the first connection portion 31C has a first connection portion width w1. The first connection portion width w1 is the width of the first connection portion 31C along a direction intersecting the first connection portion path between the first support portion 31S and the first detection element 11E. The second connection portion 32C has a second connection portion width w2. The second connection portion width w2 is the width of the second connection portion 32C along a direction intersecting the second connection portion path between the second support portion 32S and the second detection element 12E. The second connection portion width w2 may be different from the first connection portion width w1. The difference in width creates a difference in thermal resistance between the connection portions. By utilizing the difference in heat dissipation characteristics through the connection portions, it is possible to detect the target substance with higher accuracy. According to the embodiment, a sensor with improved characteristics can be provided. For example, the respective concentrations of multiple different types of substances can be detected with high accuracy.

[0054] As shown in FIG. 6, the first other connection portion 31aC has a first other connection portion width wa1. The first other connection portion width wa1 is the width of the first other connection portion 31aC in a direction intersecting the first other connection portion path between the first other support portion 31aS and the first detection element 11E. The second other connection portion 32aC has a second other connection portion width wa2. The second other connection portion width wa2 is the width of the second other connection portion 32aC in a direction intersecting the second other connection portion path between the second other support portion 32aS and the second detection element 12E. The second other connection portion width wa2 is different from the first other connection portion width wa1. The difference in width results in a difference in the thermal resistance of the connection portion.

[0055] In the sensor 120, at least one of a difference in length and a difference in width may be provided between the connection portion of the first detection unit 10A and the connection portion of the second detection unit 10B.

[0056] FIG. 8 is a schematic cross-sectional view illustrating the sensor according to the second embodiment. Fig. 8 is a cross-sectional view corresponding to the cross section taken along line A1-A2 in Fig. 6. As shown in Fig. 8, in sensor 121 according to the embodiment, the thicknesses of the connecting portions are different among the multiple detection elements. Except for this, the configuration of sensor 121 may be the same as the configuration of sensor 110 or sensor 111.

[0057] As shown in FIG. 8 , in the sensor 121, the first connection portion 31C has a first connection portion thickness t1. The first connection portion thickness t1 is the thickness of the first connection portion 31C in the first direction (Z-axis direction). The second connection portion 32C has a second connection portion thickness t2. The second connection portion thickness t2 is the thickness of the second connection portion 32C in the first direction (Z-axis direction). The second connection portion thickness t2 is different from the first connection portion thickness t1. This difference in thickness results in a difference in the thermal resistance of the connection portion. For example, a difference in the heat dissipation characteristics through the connection portion is provided. By utilizing the difference in the heat dissipation characteristics through the connection portion, it is possible to detect a substance to be detected with higher accuracy. According to the embodiment, a sensor capable of improving characteristics can be provided. For example, the respective concentrations of multiple different types of substances can be detected with high accuracy. In the embodiment, the measurement time is short.

[0058] In the sensor 121, the first other connection portion 31aC has a first other connection portion thickness ta1. The first other connection portion thickness ta1 is the thickness of the first other connection portion 31aC in the first direction (Z-axis direction). The second other connection portion 32aC has a second other connection portion thickness ta2. The second other connection portion thickness ta2 is the thickness of the second other connection portion 32aC in the first direction (Z-axis direction). The second other connection portion 32aC is different from the first other connection portion thickness ta1. Such a difference in thickness results in a difference in the thermal resistance of the connection portion. For example, a difference in the heat dissipation characteristics via the connection portion.

[0059] In sensor 121, at least one of a difference in length of the connection portion and a difference in width of the connection portion may be provided, as in the example of sensor 120. A difference in length of the connection portion, a difference in width of the connection portion, and a difference in thickness of the connection portion may provide a difference in thermal resistance of the connection portion.

[0060] In this example, the second connection portion thickness t2 is thicker than the first connection portion thickness t1. In this example, the second other connection portion thickness ta2 is thicker than the first other connection portion thickness ta1.

[0061] In the sensor 121, the first area S1 may be the same as or different from the second area S2. In this example, the first area S1 is larger than the second area S2. In this case, the second connection portion thickness t2 is thicker than the first connection portion thickness t1. The difference in heat dissipation characteristics based on the difference in area and the difference in heat dissipation characteristics based on the difference in connection portion thickness are utilized. This makes it possible to more effectively obtain the difference in heat dissipation characteristics.

[0062] FIG. 9 is a schematic cross-sectional view illustrating the sensor according to the second embodiment. Fig. 9 is a cross-sectional view corresponding to the cross section taken along line A1-A2 in Fig. 6. As shown in Fig. 9, in sensor 122 according to the embodiment, a connection portion is provided for each of a plurality of detection elements. In sensor 122, the connection portions of the plurality of detection elements are made of different materials. Except for this, the configuration of sensor 122 may be the same as the configuration of sensor 110 or sensor 111.

[0063] In the sensor 122, the first connection portion 31C includes a first connection portion material. The second connection portion 32C includes a second connection portion material that is different from the first connection portion material. This difference in materials results in a difference in the thermal resistance of the connection portion. For example, a difference in the heat dissipation characteristics through the connection portion.

[0064] In sensor 122, the lengths of the connecting portions may be different, as in the example of sensor 120. In sensor 122, the thicknesses of the connecting portions may be different, as in the example of sensor 121. Differences in the thermal resistance of the connecting portions may be created by at least one of differences in the lengths of the connecting portions, differences in the thicknesses of the connecting portions, and differences in the materials of the connecting portions.

[0065] For example, the thermal conductivity of the second connection portion material is different from the thermal conductivity of the first connection portion material, for example, the thermal conductivity of the second connection portion material is higher than the thermal conductivity of the first connection portion material.

[0066] In the sensor 122, the first area S1 may be the same as or different from the second area S2. In this example, the thermal conductivity of the second connection material is higher than that of the first connection material. The difference in heat dissipation characteristics based on the difference in area and the difference in heat dissipation characteristics based on the difference in thermal conductivity of the connection are utilized. This makes it possible to more effectively utilize the difference in heat dissipation characteristics.

[0067] The configurations of the sensors 120 to 122 may be combined. For example, the first connection portion 31C includes a first connection length LC1, a first connection width w1, a first connection thickness t1, and a first connection material. The first connection length LC1 is the length of the first connection portion 31C along the first connection path between the first support portion 31S and the first detection element 11E. The first connection width w1 is the width of the first connection portion 31C in a direction intersecting the first connection path. The first connection thickness t1 is the thickness of the first connection portion 31C in the first direction (Z-axis direction).

[0068] The second connection portion 32C may include at least one of a second connection length LC2 different from the first connection length LC1, a second connection width w2 different from the first connection width w1, a second connection thickness t2 different from the first connection thickness t1, and a second connection material different from the first connection material. The second connection length LC2 is the length of the second connection portion 32C along the second connection path between the second support portion 32S and the second detection element 12E. The second connection width w2 is the width of the second connection portion 32C in a direction intersecting the second connection path. The second connection thickness t2 is the thickness of the second connection portion 32C in the first direction (Z-axis direction).

[0069] For example, in one example, the second connection length LC2 is shorter than the first connection length LC1. The second connection width w2 is greater than the first connection width w1. The second connection thickness t2 is thicker than the first connection thickness t1. The thermal conductivity of the second connection material is higher than the thermal conductivity of the first connection material. For example, the second connection portion 32C includes at least one of the following: a second connection length LC2 shorter than the first connection length LC1; a second connection width w2 greater than the first connection width w1; a second connection thickness t2 thicker than the first connection thickness t1; and a thermal conductivity of the second connection material higher than the thermal conductivity of the first connection material. A difference in thermal resistance is effectively obtained.

[0070] For example, the first other connection portion 31aC includes a first other connection portion length LCa1, a first other connection portion width wa1, a first other connection portion thickness ta1, and a first other connection portion material. The first other connection portion length LCa1 is the length of the first other connection portion 31aC along the first other connection portion path between the first other support portion 31aS and the first detection element 11E. The first other connection portion width wa1 is the width of the first other connection portion 31aC in a direction intersecting the first other connection portion path. The first other connection portion thickness ta1 is the thickness of the first other connection portion 31aC in the first direction (Z-axis direction).

[0071] For example, the second other connection portion 32aC may include at least one of a second other connection portion length LCa2 different from the first other connection portion length LCa1, a second other connection portion width wa2 different from the first other connection portion width wa1, a second other connection portion thickness ta2 different from the first other connection portion thickness ta1, and a second other connection portion material different from the first other connection portion material. The second other connection portion length LCa2 is the length of the second other connection portion 32aC along the second other connection portion path between the second other support portion 32aS and the second detection element 12E. The second other connection portion width wa2 is the width of the second other connection portion 32aC in a direction intersecting the second other connection portion path. The second other connection portion thickness ta2 is the thickness of the second other connection portion 32aC in the first direction (Z-axis direction).

[0072] For example, in one example, the second other connection length LCa2 is shorter than the first other connection length LCa1. The second other connection width wa2 is larger than the first other connection width wa1. The second other connection thickness ta2 is thicker than the first other connection thickness ta1. The thermal conductivity of the second other connection portion material is higher than the thermal conductivity of the first other connection portion material. A difference in thermal resistance is effectively achieved.

[0073] FIG. 10 is a schematic view illustrating the sensor according to the embodiment. 10 shows an example of the control unit 70. As already described, the sensor according to the embodiment (for example, the sensor 110) may include the resistance element 16 provided on the base body 41.

[0074] 10, the control unit 70 may include a differential circuit 71. The differential circuit 71 may include a first differential circuit 71a and a second differential circuit 71b.

[0075] In this example, the first resistance element 11 and the resistance element 16 are electrically connected in parallel. A resistor 16a is connected in series with the first resistance element 11 and the resistance element 16 and electrically connected to ground GND. A current is supplied from a constant current source 72 to the first resistance element 11 and the resistance element 16 connected in parallel. The voltage of the first resistance element 11 is input to one input terminal of a first differential circuit 71a. The voltage of the resistance element 16 is input to another input terminal of the first differential circuit 71a.

[0076] The second resistance member 12 and the resistance element 16 are electrically connected in parallel. A resistor 16b is connected in series with the second resistance member 12 and the resistance element 16 and is electrically connected to ground GND. A current is supplied from a constant current source 72 to the second resistance member 12 and the resistance element 16 connected in parallel. The voltage of the second resistance member 12 is input to one input terminal of a second differential circuit 71b. The voltage of the resistance element 16 is input to another input terminal of the second differential circuit 71b.

[0077] The differential circuit 71 (first differential circuit 71a) is capable of deriving a value (first value va1) corresponding to the difference between the potential corresponding to the electrical resistance of the resistive element 16 and the potential corresponding to the first electrical resistance of the first resistive member 11. The differential circuit 71 (second differential circuit 71b) is capable of deriving a value (second value va2) corresponding to the difference between the potential corresponding to the electrical resistance of the resistive element 16 and the potential corresponding to the second electrical resistance of the second resistive member 12. These values ​​are, for example, voltages.

[0078] In the above, a voltage may be applied to each of the first resistance element 11 and the second resistance element 12. These voltages may be the same. A configuration in which the same voltage is applied simplifies the circuit, for example.

[0079] For example, the outputs (first value va1 and second value va2) of the first differential circuit 71a and the second differential circuit 71b are supplied to the processing unit 75. Detection is performed in the processing unit 75 based on these values. A detection signal 70s (information) including the detection result is output from the control unit 70.

[0080] The control unit 70 is capable of performing the following first operation. In the first operation, the control unit 70 supplies a first current i1 to the first conductive member 21 to increase the temperature of the first detection element 11E. In the first operation, the control unit 70 supplies a second current i2 to the second conductive member 22 to increase the temperature of the second detection element 12E. In the first operation, the control unit 70 derives a first value va1 corresponding to the first electrical resistance of the first resistance member 11. In the first operation, the control unit 70 derives a second value va2 corresponding to the second electrical resistance of the second resistance member 12.

[0081] In the first operation, the control unit 70 can output a detection signal 70s including a first detection value corresponding to the concentration of a first substance contained in the space around the first detection element 11E and the second detection element 12E and a second detection value corresponding to the concentration of a second substance contained in the space based on the first value va1 and the second value va2. The first detection value and the second detection value may be obtained by, for example, a processing unit 75 included in the control unit 70.

[0082] For example, the control unit 70 (processing unit 75) can derive the first detection value and the second detection value based on first information i01 and second information i02 (see FIG. 10). For example, the first information i01 relates to the relationship between the concentration of the first substance for the first detection element 11E and the first value va1, and the relationship between the concentration of the second substance for the first detection element 11E and the first value va1. The second information i02 relates to the relationship between the concentration of the first substance for the second detection element 12E and the second value va2, and the relationship between the concentration of the second substance for the second detection element 12E and the second value va2.

[0083] The first information i01 is obtained in advance for the first detection element 11E, for example. The second information i02 is obtained in advance for the second detection element 12E, for example. These pieces of information may include an equation (e.g., an approximate equation) showing the relationship between the concentration and the value. These pieces of information may also be a table including the relationship between the concentration and the value.

[0084] 10, a memory unit 76 may be provided. The control unit 70 may include the memory unit 76. The memory unit 76 stores first information i01 and second information i02. The control unit 70 (processing unit 75) reads the first information i01 and the second information i02 from the memory unit 76. The processing unit 75 can output a detection signal 70s including a first detection value corresponding to the concentration of a first substance contained in the space around the first detection element 11E and the second detection element 12E, and a second detection value corresponding to the concentration of a second substance contained in the space, based on the read-out first information i01 and second information i02 and the measured first value va1 and second value va2.

[0085] 11(a) and 11(b) are graphs illustrating the characteristics of the sensor according to the embodiment. FIG. 11(a) corresponds to the first detection element 11E. FIG. 11(b) corresponds to the second detection element 12E. The horizontal axis of these figures represents the concentration Cg1 of a substance contained in the space. These figures illustrate the characteristics when the first substance contained in the space is carbon dioxide (CO2) and the characteristics when the second substance contained in the space is helium (He). In these cases, the space contains nitrogen (N2) as a third substance in addition to the above substances. When the first substance is carbon dioxide, the concentration Cg1 corresponds to the concentration of the first substance relative to the sum of carbon dioxide (first substance) and nitrogen (third substance). When the second substance is helium, the concentration Cg1 corresponds to the concentration of the second substance relative to the sum of helium (second substance) and nitrogen (third substance). The vertical axis of FIG. 11(a) represents the signal value Sg0 (e.g., voltage) obtained from the first detection element 11E. The vertical axis of FIG. 11(b) is the signal value Sg0 (for example, voltage) obtained from the second detection element 12E.

[0086] 11(a) and 11(b), the signal value Sg0 depends on the concentration Cg1. In this example, the signal value Sg0 for carbon dioxide is approximately represented by a linear function of the carbon dioxide concentration Cg1. The signal value Sg0 for helium is approximately represented by a quadratic function of the helium concentration Cg1.

[0087] With respect to carbon dioxide, at least one coefficient included in the linear function differs between the first detection element 11E and the second detection element 12E. With respect to helium, at least one coefficient included in the quadratic function differs between the first detection element 11E and the second detection element 12E. The above coefficient for carbon dioxide becomes at least a part of the first information i01. The above coefficient for helium becomes at least a part of the second information i02. Such characteristics are acquired in advance and stored, for example, in the storage unit 76.

[0088] For example, a function for the signal value Sg0 when the first substance and the second substance are included may be derived from these multiple functions. This function may be stored in the storage unit .

[0089] Similarly, coefficients of the functions may be obtained in advance for other substances (for example, hydrogen or methane), and information including these coefficients is stored in the storage unit 76.

[0090] Meanwhile, in detection using the sensors, measurement data (first value va1 and second value va2) are obtained from the first detection element 11E and the second detection element 12E. The obtained measurement data is processed using the stored information (e.g., coefficients included in the function). As a result, a first detection value corresponding to the concentration of the first substance and a second detection value corresponding to the concentration of the second substance are derived from the measurement data. Even when these multiple detection target substances are contained in a space, the concentrations of each of these multiple detection target substances can be detected with high accuracy.

[0091] 12(a) and 12(b) are graphs illustrating the characteristics of the sensor according to the embodiment. 12(a) corresponds to the first detection element 11E. FIG. 12(b) corresponds to the second detection element 12E. These figures illustrate the signal value Sg1 (e.g., voltage) when the space contains carbon dioxide (first substance), helium (second substance), and nitrogen (third substance). The horizontal axis of these figures is the carbon dioxide concentration Cg1. The vertical axis of these figures is the signal value Sg1. In this example, the change in the signal value Sg1 with respect to the carbon dioxide concentration Cg1 is illustrated when the helium concentration is 6.9 vol%, 13.5 vol%, or 25.9 vol%.

[0092] 12(a) and 12(b), when the space contains carbon dioxide (first substance), helium (second substance), and nitrogen (third substance), signal values ​​Sg1 corresponding to the concentrations of carbon dioxide (first substance) and helium (second substance) are obtained. Based on the signal value Sg1 obtained from the first detection element 11E and the signal value Sg1 obtained from the second detection element 12E, the concentrations of carbon dioxide (first substance) and helium (second substance) can be derived.

[0093] (Third embodiment) FIG. 13 is a schematic cross-sectional view illustrating the sensor according to the third embodiment. 13, the sensor 130 according to the embodiment may further include a third detection unit 10C in addition to the first detection unit 10A and the second detection unit 10B. The remaining configuration of the sensor 130 may be the same as the configuration of the sensor according to the first or second embodiment.

[0094] In the sensor 130, the base 41 further includes a third base region 41c. The third detection unit 10C includes a third detection element 13E. The third detection element 13E includes a third resistive member 13, a third conductive member 23, and a third insulating member 18C. At least a portion of the third insulating member 18C is located between the third resistive member 13 and the third conductive member 23. A third gap g3 is provided between the third base region 41c and the third detection element 13E. The third detection element 13E has a third area S3 in the above-mentioned plane (XY plane). The third area S3 is different from the first area S1 and different from the second area S2.

[0095] For example, the first detection element 11E has a first length L1 in a direction intersecting the first direction (Z-axis direction). The second detection element 12E has a second length L2 in a direction intersecting the first direction. The third detection element 13E has a third length L3 in a direction intersecting the first direction. The second length L2 is different from the first length L1. The third length L3 is different from the first length L1 and different from the second length L2. In this example, the second length L2 is shorter than the first length L1. In this example, the third length L3 is shorter than the second length L2.

[0096] For example, by providing three or more detection elements with different heat dissipation characteristics, even when the number of types of substances (gases) contained in the space increases, the substances can be detected with high accuracy.

[0097] In the sensor 130, the third distance d3 in the first direction (Z-axis direction) between the third substrate region 41c and the third detection element 13E may be different from at least one of the first distance d1 (see Figure 4) and the second distance d2 (see Figure 4).

[0098] 14 and 15 are schematic cross-sectional views illustrating the sensor according to the third embodiment. 14 and 15, the sensors 131 and 132 according to the embodiment further include a third detection unit 10C in addition to the first detection unit 10A and the second detection unit 10B. The remaining configuration of the sensors 131 and 132 may be the same as the configuration of the sensors according to the first or second embodiment.

[0099] In the sensors 131 and 132, the third detection unit 10C includes a third detection element 13E, a third support portion 33S, and a third connection portion 33C. The third support portion 33S is fixed to the base 41. The third connection portion 33C is supported by the third support portion 33S and supports the third detection element 13E. Gaps (e.g., third gap g3) are provided between the third base region 41c and the third connection portion 33C, and between the third base region 41c and the third detection element 13E. The third detection element 13E includes a third resistance member 13 and a third conductive member 23.

[0100] In the sensors 131 and 132, the third connection portion 33C includes at least one of a third connection length LC3 that is different from the first connection length LC1 (see FIG. 6) and different from the second connection length LC2 (see FIG. 6), a third connection width w3 that is different from the first connection width w1 (see FIG. 6) and different from the second connection width w2 (see FIG. 6), a third connection thickness t3 that is different from the first connection thickness t1 (see FIG. 8) and different from the second connection thickness t2 (see FIG. 8), and a third connection material that is different from the first connection material and different from the second connection material. The third connection length LC3 is the length of the third connection portion 33C along the third connection path between the third support portion 33S and the third detection element 13E. The third connection width w3 is the width of the third connection portion 33C in a direction intersecting the third connection path. The third connection thickness t3 is the thickness of the third connection portion 33C in the first direction (Z-axis direction).

[0101] For example, the thermal resistance at the third connection portion 33C is different from the thermal resistance at the first connection portion 31C, and different from the thermal resistance at the second connection portion 32C.

[0102] In sensor 131, third connection length LC3 is different from first connection length LC1 and different from second connection length LC2. Third connection portion width w3 is different from first connection portion width w1 and different from second connection portion width w2. In sensor 131, third connection portion thickness t3 is different from first connection portion thickness t1 and different from second connection portion thickness t2.

[0103] In the sensors 131 and 132, the first other connection portion 31aC includes a first other connection length LCa1 (see FIG. 6), a first other connection width wa1 (see FIG. 6), a first other connection thickness ta1 (see FIG. 8), and a first other connection material. The first other connection length LCa1 is the length of the first other connection portion 31aC along the first other connection path between the first other support portion 31aS and the first detection element 11E. The first other connection width wa1 is the width of the first other connection portion 31aC in a direction intersecting the first other connection path. The first other connection thickness ta1 is the thickness of the first other connection portion 31aC in the first direction (Z-axis direction).

[0104] The second other connection portion 32aC includes at least one of a second other connection length LCa2 (see FIG. 6) different from the first other connection length LCa1, a second other connection width wa2 (see FIG. 6) different from the first other connection length wa1, a second other connection portion thickness ta2 (see FIG. 8) different from the first other connection portion thickness ta1, and a second other connection material different from the first other connection portion material. The second other connection length LCa2 is the length of the second other connection portion 32aC along the second other connection portion path between the second other support portion 32aS and the second detection element 12E. The second other connection portion width wa2 is the width of the second other connection portion 32aC in a direction intersecting with the second other connection portion path. The second other connection portion thickness ta2 is the thickness of the second other connection portion 32aC in the first direction (Z-axis direction).

[0105] In the sensors 131 and 132, the third other connection portion 33aC includes at least one of a third other connection length LCa3 that is different from the first other connection length LCa1 (see FIG. 6) and different from the second other connection length LCa2 (see FIG. 6), a third other connection width wa3 that is different from the first other connection width wa1 (see FIG. 6) and different from the second other connection width wa2 (see FIG. 6), a third other connection thickness ta3 that is different from the first other connection thickness ta1 (see FIG. 8) and different from the second other connection thickness ta2 (see FIG. 8), and a third other connection portion material that is different from the first other connection portion material and different from the second other connection portion material. The third other connection length LCa3 is the length of the third other connection portion 33aC along the third other connection portion path between the third other support portion 33aS and the third detection element 13E. The third other connection portion width wa3 is the width of the third other connection portion 33aC in a direction intersecting the third other connection portion path. The third other connection portion thickness ta3 is the thickness of the third other connection portion 33aC in the first direction (Z-axis direction).

[0106] For example, the thermal resistance at the third other connection portion 33aC is different from the thermal resistance at the first other connection portion 31aC, and different from the thermal resistance at the second other connection portion 32aC. For example, by providing three or more detection elements with different heat dissipation characteristics, even when the number of types of substances (gases) contained in the space increases, the substances can be detected with high accuracy.

[0107] As already described, in the embodiment, the space around the detection element may further include a third substance in addition to the first substance and the second substance. For example, the third substance may include at least one selected from the group consisting of nitrogen, air, carbon monoxide, and oxygen. The first substance may include, for example, one selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride (SF6), and hydrogen. The second substance may include, for example, another selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride (SF6), and hydrogen.

[0108] These materials have different thermal conductivities, and in the embodiment, a characteristic based on a difference in heat dissipation characteristics caused by the difference in thermal conductivity of the materials is detected.

[0109] For example, the thermal conductivity at one temperature condition is as follows: The thermal conductivity of carbon dioxide is 14.5 mW / (m·K). The thermal conductivity of helium is 144.2 mW / (m·K). The thermal conductivity of methane is 30.4 mW / (m·K). The thermal conductivity of hydrogen is 167.5 mW / (m·K). The thermal conductivity of nitrogen is 24.1 mW / (m·K). The thermal conductivity of carbon monoxide is 23.3 mW / (m·K).

[0110] The embodiment may include the following configurations (e.g., technical solutions). (Configuration 1) a substrate including a first substrate region and a second substrate region; a first detection unit including a first detection element, the first detection element including a first resistive member, a first conductive member, and a first insulating member, at least a portion of the first insulating member being between the first resistive member and the first conductive member, a first gap being provided between the first base region and the first detection element, and the first detection element having a first area in a plane intersecting a first direction from the first base region to the first detection element; a second detection unit including a second detection element, the second detection element including a second resistive member, a second conductive member, and a second insulating member, at least a portion of the second insulating member being between the second resistive member and the second conductive member, a second gap being provided between the second base region and the second detection element, the second detection element having a second area in the plane, the second area being smaller than the first area; A sensor comprising:

[0111] (Configuration 2) the first detection element has a first length in a direction intersecting the first direction; the second detection element has a second length in a direction intersecting the first direction; 2. The sensor of claim 1, wherein the second length is shorter than the first length.

[0112] (Configuration 3) 3. The sensor of claim 1, wherein a first distance in the first direction between the first substrate region and the first sensing element is different from a second distance in the first direction between the second substrate region and the second sensing element.

[0113] (Configuration 4) 4. The sensor of configuration 3, wherein the first distance is greater than the second distance.

[0114] (Configuration 5) the first detection unit further includes a first support unit and a first connection unit; the first support portion is fixed to the base, the first connection portion is supported by the first support portion and supports the first detection element; a gap is provided between the first base region and the first connection portion; the second detection unit further includes a second support unit and a second connection unit; the second support portion is fixed to the base, the second connection portion is supported by the second support portion and supports the second detection element; The sensor of configuration 1 or 2, wherein a gap is provided between the second substrate region and the second connection portion.

[0115] (Configuration 6) the first detection unit further includes a first other support unit and a first other connection unit; the first other support part is fixed to the base, the first other connection portion is supported by the first other support portion and supports the first detection element; a gap is provided between the first base region and the first other connection portion, the second detection unit further includes a second other support unit and a second other connection unit, the second other support part is fixed to the base, the second other connection portion is supported by the second other support portion and supports the second detection element; The sensor of configuration 5, wherein a gap is provided between the second base region and the second other connection portion.

[0116] (Configuration 7) the first other connection portion includes a first other connection portion length, a first other connection portion width, a first other connection portion thickness, and a first other connection portion material, the first other connection portion length is the length of the first other connection portion along a first other connection portion path between the first other support portion and the first detection element, the first other connection portion width is the width of the first other connection portion in a direction intersecting with the first other connection portion path, and the first other connection portion thickness is the thickness of the first other connection portion in the first direction; The sensor of configuration 6, wherein the second other connection portion includes at least one of a second other connection portion length different from the first other connection portion length, a second other connection portion width different from the first other connection portion width, a second other connection portion thickness different from the first other connection portion thickness, and a second other connection portion material different from the first other connection portion material, wherein the second other connection portion length is the length of the second other connection portion along a second other connection portion path between the second other support portion and the second detection element, the second other connection portion width is the width of the second other connection portion in a direction intersecting the second other connection portion path, and the second other connection portion thickness is the thickness of the second other connection portion in the first direction.

[0117] (Configuration 8) the first connection portion includes a first connection length, a first connection width, a first connection thickness, and a first connection material, the first connection length being a length of the first connection portion along a first connection path between the first support portion and the first detection element, the first connection width being a width of the first connection portion in a direction intersecting the first connection path, and the first connection thickness being a thickness of the first connection portion in the first direction; The sensor of any one of configurations 5 to 7, wherein the second connection portion includes at least one of a second connection length different from the first connection length, a second connection width different from the first connection length, a second connection width different from the first connection length, a second connection thickness different from the first connection length, and a second connection material different from the first connection material, wherein the second connection length is the length of the second connection portion along a second connection path between the second support portion and the second detection element, the second connection width is the width of the second connection portion in a direction intersecting the second connection path, and the second connection thickness is the thickness of the second connection portion in the first direction.

[0118] (Configuration 9) The sensor of configuration 8, wherein the second connection portion includes at least one of the second connection length being shorter than the first connection length, the second connection width being larger than the first connection width, and the second connection thickness being thicker than the first connection thickness.

[0119] (Configuration 10) 10. The sensor of claim 8 or 9, wherein the thermal conductivity of the second connection material is higher than the thermal conductivity of the first connection material.

[0120] (Configuration 11) Further comprising a third detection unit, the substrate further comprises a third substrate region; the third detection unit includes a third detection element, the third detection element includes a third resistive member, a third conductive member, and a third insulating member, at least a portion of the third insulating member is between the third resistive member and the third conductive member, a third gap is provided between the third base region and the third detection element, and the third detection element has a third area in the plane; 11. The sensor of any one of configurations 1 to 10, wherein the third area is different from the first area and different from the second area.

[0121] (Configuration 12) a substrate including a first substrate region and a second substrate region; a first detection unit including a first detection element, a first support portion, and a first connection portion, wherein the first support portion is fixed to the base, the first connection portion is supported by the first support portion, and supports the first detection element, a gap is provided between the first base region and the first connection portion and between the first base region and the first detection element, and the first detection element includes a first resistive member and a first conductive member; a second detection unit including a second detection element, a second support portion, and a second connection portion, wherein the second support portion is fixed to the base, the second connection portion is supported by the second support portion, and supports the second detection element, a gap is provided between the second base region and the second connection portion and between the second base region and the second detection element, and the second detection element includes a second resistive member and a second conductive member; Equipped with the first connection portion includes a first connection length, a first connection width, a first connection thickness, and a first connection material, the first connection length being a length of the first connection portion along a first connection path between the first support portion and the first detection element, the first connection width being a width of the first connection portion in a direction intersecting the first connection path, and the first connection thickness being a thickness of the first connection portion in a first direction from the first base region to the first detection element; The second connection portion includes at least one of a second connection length different from the first connection length, a second connection width different from the first connection length, a second connection thickness different from the first connection thickness, and a second connection material different from the first connection material, wherein the second connection length is the length of the second connection portion along a second connection path between the second support portion and the second detection element, the second connection width is the width of the second connection portion in a direction intersecting the second connection path, and the second connection thickness is the thickness of the second connection portion in the first direction.

[0122] (Configuration 13) the first detection unit further includes a first other support unit and a first other connection unit; the first other support part is fixed to the base, the first other connection portion is supported by the first other support portion and supports the first detection element; a gap is provided between the first base region and the first other connection portion, the second detection unit further includes a second other support unit and a second other connection unit, the second other support part is fixed to the base, the second other connection portion is supported by the second other support portion and supports the second detection element; a gap is provided between the second base region and the second other connection portion, the first other connection portion includes a first other connection length, a first other connection width, a first other connection thickness, and a first other connection material, the first other connection length being a length of the first other connection portion along a first other connection path between the first other support portion and the first detection element, the first other connection width being a width of the first other connection portion along the first other connection path, and the first other connection thickness being a thickness of the first other connection portion in the first direction; The sensor described in configuration 12, wherein the second other connection portion includes at least one of a second other connection portion length different from the first other connection portion length, a second other connection portion width different from the first other connection portion width, a second other connection portion thickness different from the first other connection portion thickness, and a second other connection portion material different from the first other connection portion material, wherein the second other connection portion length is the length of the second other connection portion along a second other connection portion path between the second other support portion and the second detection element, the second other connection portion width is the width of the second other connection portion in a direction intersecting the second other connection portion path, and the second other connection portion thickness is the thickness of the second other connection portion in the first direction.

[0123] (Configuration 14) Further comprising a third detection unit, the substrate further comprises a third substrate region; the third detection unit includes a third detection element, a third support unit, and a third connection unit; the third support portion is fixed to the base, the third connection portion is supported by the third support portion and supports the third detection element; a gap is provided between the third base region and the third connection portion, and between the third base region and the third detection element; the third detection element includes a third resistive member and a third conductive member; The sensor of configuration 12 or 13, wherein the third connection portion includes at least one of a third connection length that is different from the first connection length and different from the second connection length, a third connection width that is different from the first connection length and different from the second connection length, a third connection width that is different from the first connection length and different from the second connection length, a third connection thickness that is different from the first connection length and different from the second connection length, and a third connection material that is different from the first connection length and different from the second connection material, wherein the third connection length is the length of the third connection portion along a third connection path between the third support portion and the third detection element, the third connection width is the width of the third connection portion in a direction intersecting the third connection path, and the third connection thickness is the thickness of the third connection portion in the first direction.

[0124] (Configuration 15) a control unit electrically connectable to the first resistance member, the first conductive member, the second resistance member, and the second conductive member; The control unit is capable of performing a first operation, In the first operation, the control unit supplies a first current to the first conductive member to increase the temperature of the first detection element; In the first operation, the control unit supplies a second current to the second conductive member to increase the temperature of the second detection element; the control unit derives a first value corresponding to a first electrical resistance of the first resistance member in the first operation; the control unit derives a second value corresponding to a second electrical resistance of the second resistance member in the first operation; The sensor of any one of configurations 1 to 14, wherein the control unit is capable of outputting, in the first operation, a detection signal including a first detection value corresponding to the concentration of a first substance contained in the space around the first detection element and the second detection element, and a second detection value corresponding to the concentration of a second substance contained in the space, based on the first value and the second value.

[0125] (Configuration 16) the control unit is capable of deriving the first detection value and the second detection value based on first information and second information, the first information relates to a relationship between the concentration of the first substance and the first value for the first detection element, and a relationship between the concentration of the second substance and the first value for the first detection element, The sensor of configuration 15, wherein the second information relates to a relationship between the concentration of the first substance and the second value for the second detection element, and a relationship between the concentration of the second substance and the second value for the second detection element.

[0126] (Configuration 17) the control unit includes a storage unit and a processing unit, the storage unit stores the first information and the second information; The sensor of configuration 15 or 16, wherein the processing unit is capable of reading out the first information and the second information from the memory unit, and outputting a detection signal including the first detection value and the second detection value based on the read-out first information and the read-out second information and the first value and the second value.

[0127] (Configuration 18) Further comprising a resistor element provided on the substrate, the control unit includes a differential circuit, the differential circuit is capable of deriving the first value based on a difference between a potential corresponding to the electrical resistance of the resistive element and a potential corresponding to the first electrical resistance of the first resistive member; The sensor described in any one of configurations 15 to 17, wherein the differential circuit is capable of deriving the second value based on the difference between the potential corresponding to the electrical resistance of the resistive element and the potential corresponding to the second electrical resistance of the second resistive element.

[0128] (Configuration 19) 19. The sensor of any one of configurations 15 to 18, wherein the space further contains a third substance, and the third substance includes at least one selected from the group consisting of nitrogen, air, carbon monoxide, and oxygen.

[0129] (Configuration 20) the first substance includes one selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride, and hydrogen; 19. The sensor according to any one of configurations 15 to 18, wherein the second substance includes at least one selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride, and hydrogen.

[0130] In embodiments, the first substance may include one selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride, hydrogen, ammonia, and ethylene. In embodiments, the second substance may include another selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride, hydrogen, ammonia, ethylene, and water. The second substance may include, for example, water vapor.

[0131] (Fourth embodiment) FIG. 16 is a schematic cross-sectional view illustrating the sensor according to the fourth embodiment. As shown in Fig. 16, sensor 135a according to the embodiment includes a first mounting member 56a. Other configurations of sensor 135a may be similar to the configurations of any of the sensors according to the first to third embodiments. As shown in Fig. 16, in sensor 135a, base 41 is fixed to first mounting member 56a. First mounting member 56a may be, for example, a printed circuit board.

[0132] FIG. 17 is a schematic cross-sectional view illustrating the sensor according to the fourth embodiment. As shown in Fig. 17, a sensor 135b according to the embodiment includes a first housing 55a. The first housing 55a is, for example, a package. Other configurations of the sensor 135b may be similar to those of any of the sensors according to the first to third embodiments. As shown in Fig. 17, in the sensor 135b, the base 41, the first detection unit 10A, and the second detection unit 10B are provided between multiple portions of the first housing 55a. The multiple portions are, for example, the bottom portion of the first housing 55a and the lid portion of the first housing 55a.

[0133] 17, a hole 55aH is provided in a part (for example, the lid) of the first housing 55a. A plurality of holes 55aH may be provided. The hole 55aH serves as an inlet or outlet for the substance (gas, etc.) to be detected.

[0134] 18(a) to 18(c) are schematic cross-sectional views illustrating the sensor according to the fourth embodiment. 18(a), a structure including a base 41 and first and second detection units 10A and 10B is fixed to the bottom of a first housing 55a. For example, a terminal included in the first detection unit 10A and a terminal included in the second detection unit 10B are connected to electrodes 41E and the like provided on the base 41 by connecting members (such as bonding wires 50w). The remaining configuration of sensor 135c may be the same as the configuration of any of the sensors according to the first to third embodiments.

[0135] 18(b), a hole 55aH is provided in a part (for example, a lid) of the first housing 55a. A plurality of holes 55aH may be provided. The remaining configuration of the sensor 135d may be similar to that of the sensor 135c.

[0136] 18(c), a first housing 55a is fixed to a first mounting member 56a. The remaining configuration of the sensor 135e may be the same as that of the sensor 135c or the sensor 135d.

[0137] In the above sensors 135a to 135e, multiple detection units (such as the first detection unit 10A and the second detection unit 10B) are provided on one base 41. The multiple base regions (such as the first base region 41a and the second base region 41b) on the base 41 may be continuous with each other. The first detection unit 10A and the second detection unit 10B may be created simultaneously in one process. It is easy to control the thermal characteristics (such as thermal resistance or thermal conductivity) between the multiple detection units with high precision. It is easy to obtain detection results with higher precision.

[0138] (Fifth embodiment) In the fifth embodiment, a base is provided for each of the first detection unit 10A and the second detection unit 10B. FIG. 19 is a schematic cross-sectional view illustrating the sensor according to the fifth embodiment. As shown in FIG. 19, a sensor 140a according to this embodiment includes a first detection unit 10A and a second detection unit 10B.

[0139] The first detection unit 10A includes a first base 41A, a first support 31S, a first connection 31C, and a first detection element 11E. The position of the first support 31S relative to the first base 41A is fixed. For example, the first support 31S may be fixed to the first base 41A. The first connection 31C is supported by the first support 31S. The first connection 31C supports the first detection element 11E. A first gap g1 is provided between the first base 41A and the first detection element 11E.

[0140] As described in relation to the first and second embodiments, the first detection unit 10A has a first area S1 of the first detection element 11E, a first connection length LC1 of the first connection portion 31C, a first connection width w1 of the first connection portion 31C, a first connection thickness t1 of the first connection portion 31C, a first connection material of the first connection portion 31C, and a first distance d1, which is the distance between the first base region 41a and the first detection element 11E.

[0141] The second detection unit 10B includes a second base 41B, a second support 32S, a second connection 32C, and a second detection element 12E. The position of the second support 32S relative to the second base 41B is fixed. For example, the second support 32S may be fixed to the second base 41B. The second connection 32C is supported by the second support 32S. The second connection 32C supports the second detection element 12E. A second gap g2 is provided between the second base 41B and the second detection element 12E.

[0142] As described in relation to the first and second embodiments, second detection unit 10B has at least one of: second area S2 of second detection element 12E that is different from first area S1; second connection length LC2 of second connection portion 32C that is different from first connection length LC1; second connection width w2 of second connection portion 32C that is different from first connection width w1; second connection thickness t2 of second connection portion 32C that is different from first connection thickness t1; second connection material of second connection portion 32C that is different from first connection material; and second distance d2 that is different from first distance d1. Second distance d2 is the distance between second base region 41b and second detection element 12E.

[0143] In the fifth embodiment as well, it is possible to detect the concentration of the substance to be detected with higher accuracy. According to the embodiment, it is possible to provide a sensor with improved characteristics.

[0144] The first base 41A includes, for example, a substrate 41sA and an insulating film 41iA. The substrate 41sA may be, for example, a semiconductor substrate (e.g., a silicon substrate). The substrate 41sA may include, for example, a semiconductor circuit. The substrate 41sA may include a connection member such as a via electrode. The substrate 41sA is optional.

[0145] The second base 41B includes, for example, a substrate 41sB and an insulating film 41iB. The substrate 41sB may be, for example, a semiconductor substrate (e.g., a silicon substrate). The substrate 41sB may include, for example, a semiconductor circuit. The substrate 41sB may include a connection member such as a via electrode. The substrate 41sB is optional.

[0146] FIG. 20 is a schematic cross-sectional view illustrating the sensor according to the fifth embodiment. As shown in FIG. 20, a sensor 140b according to the embodiment includes a first housing 55a. The first housing 55a is, for example, a package. Other configurations of the sensor 140b may be similar to those of the sensor 140a. As shown in FIG. 20, in the sensor 140b, the first detection unit 10A and the second detection unit 10B are provided between multiple portions of the first housing 55a. The multiple portions are, for example, the bottom portion of the first housing 55a and the lid portion of the first housing 55a. As shown in FIG. 20, a hole 55aH is provided in a portion of the first housing 55a (for example, the lid portion). Multiple holes 55aH may be provided. The hole 55aH serves as an inlet or outlet for the substance to be detected (such as a gas).

[0147] 21A and 21B are schematic cross-sectional views illustrating the sensor according to the fifth embodiment. 21(a), a sensor 140c according to the embodiment is provided with a first housing 55a and a second housing 55b. The first detection unit 10A is fixed to the first housing 55a. The second detection unit 10B is fixed to the second housing 55b. The first housing 55a and the second housing 55b are fixed to a first mounting member 56a.

[0148] In a sensor 140d according to the embodiment shown in FIG. 21(b), the first detection unit 10A is provided between multiple portions of the first housing 55a. The multiple portions are, for example, the bottom of the first housing 55a and the lid of the first housing 55a. As shown in FIG. 21(b), a hole 55aH is provided in a portion of the first housing 55a (for example, the lid). Multiple holes 55aH may be provided. The hole 55aH serves as an inlet or outlet for the substance (such as a gas) to be detected.

[0149] As shown in FIG. 21(b), in sensor 140d, second detection unit 10B is provided between multiple portions of second housing 55b. The multiple portions are, for example, the bottom portion of second housing 55b and the lid portion of second housing 55b. As shown in FIG. 21(b), hole 55bH is provided in a portion of second housing 55b (for example, the lid portion). Multiple holes 55bH may be provided. Hole 55bH serves as an inlet or outlet for the substance to be detected (such as gas).

[0150] 22(a) and 22(b) are schematic cross-sectional views illustrating the sensor according to the fifth embodiment. In a sensor 140e according to the embodiment shown in Fig. 22(a), a first mounting member 56a and a second mounting member 56b are provided. The first detection unit 10A is fixed to a first housing 55a. The second detection unit 10B is fixed to a second housing 55b. The first housing 55a is fixed to the first mounting member 56a. The second housing 55b is fixed to the second mounting member 56b.

[0151] In a sensor 140f according to the embodiment shown in FIG. 22(b), the first detection unit 10A is provided between multiple portions of the first housing 55a. The multiple portions are, for example, the bottom of the first housing 55a and the lid of the first housing 55a. As shown in FIG. 22(b), a hole 55aH may be provided in a portion of the first housing 55a (for example, the lid). Multiple holes 55aH may be provided.

[0152] As shown in FIG. 22(b), in the sensor 140f, the second detection unit 10B is provided between multiple portions of the second housing 55b. The multiple portions are, for example, the bottom portion of the second housing 55b and the lid portion of the second housing 55b. As shown in FIG. 22(b), a hole 55bH may be provided in a portion of the second housing 55b (for example, the lid portion). Multiple holes 55bH may be provided.

[0153] 23(a) and 23(b) are schematic cross-sectional views illustrating the sensor according to the fifth embodiment. In a sensor 140g according to the embodiment shown in FIG. 23(a), a first base body 41A and a second base body 41B are fixed to a first mounting member 56a.

[0154] In a sensor 140h according to the embodiment shown in FIG. 23(b), a first detection unit 10A and a second detection unit 10B are provided between a first mounting member 56a and a first housing 55a.

[0155] 24(a) and 24(b) are schematic cross-sectional views illustrating the sensor according to the fifth embodiment. In a sensor 140i according to the embodiment shown in Fig. 24(a), a first base 41A is fixed to a first mounting member 56a, and a second base 41B is fixed to a second mounting member 56b.

[0156] 24(b), the first detector 10A is provided between the first mounting member 56a and the first housing 55a, and the second detector 10B is provided between the second mounting member 56b and the second housing 55b.

[0157] In the above sensors 140a to 140j, the configurations of the first support portion 31S, the first connection portion 31C, the first detection element 11E, the second support portion 32S, the second connection portion 32C, and the second detection element 12E can be the same as those described in relation to the first or second embodiment.

[0158] The sensors 135a to 135e and the sensors 140a to 140j may each be provided with three or more detectors. The three or more detectors may include, for example, a first detector 10A, a second detector 10B, and a third detector 10C. At least one of a third housing and a third mounting member may be applied to the third detector 10C. The third housing may have the same configuration as at least one of the first housing 55a and the second housing 55b. The third mounting member may have the same configuration as at least one of the first mounting member 56a and the second mounting member 56b.

[0159] According to the embodiment, a sensor capable of improving characteristics can be provided.

[0160] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configurations of the elements included in the sensor, such as the substrate, detection unit, and control unit, are within the scope of the present invention as long as a person skilled in the art can implement the present invention in a similar manner and obtain similar effects by appropriately selecting them from known ranges.

[0161] Furthermore, any combination of two or more elements of each specific example within the scope of technical feasibility is also included within the scope of the present invention as long as it includes the gist of the present invention.

[0162] In addition, all sensors that can be implemented by a person skilled in the art by appropriately modifying the design based on the sensor described above as an embodiment of the present invention also fall within the scope of the present invention as long as they include the gist of the present invention.

[0163] In addition, within the scope of the concept of the present invention, a person skilled in the art may come up with various modifications and alterations, and it will be understood that these modifications and alterations also fall within the scope of the present invention.

[0164] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0165] 10A to 10C...first to third detection portions, 11 to 13...first to third resistance members, 11E to 13E...first to third detection elements, 15a to 15d...first to fourth layers, 16...resistance element, 16a, 16b...resistor, 18A to 18C...first to third insulating members, 21 to 23...first to third conductive members, 31C to 33C...first to third connection portions, 31S to 33S...first to third support portions, 31aC to 33aC...first to third other connection portions, 31aS to 33aS...first to third other support portions, 31bC, 31cC, 32bC, 32cC...connection portions, 31bS, 31cS, 32bS, 32cS...support portions, 41...base, 41A, 41B...first and second substrates, 41E...electrode, 41a to 41c...first to third substrate regions, 41i, 41iA, 41iB...insulating film, 41s, 41sA, 41sB...substrate, 50w...bonding wire, 55a, 55b...first and second housings, 55aH, 55bH...hole, 56a, 56b...first and second mounting members, 70...control unit, 70s...detection signal, 71...differential circuit, 71a, 71b...first and second differential circuits, 72...constant current source, 75...processing unit, 76...storage unit, 110, 111, 120 to 122, 130 to 132, 135a to 135e, 140a to 140j...sensors, Cg1...concentration, GND...ground, L1~L3...first to third lengths, LC1~LC3...first to third connection lengths, LCa1~LCa3...first to third other connection lengths, S1~S3...first to third areas, Sg0, Sg1...signal value, d1~d3...first to third distances, g1~g3...first to third gaps, i01, i02...first and second information, i1, i2...first and second currents, t1~t3...first to third connection thicknesses, ta1~ta3...first to third other connection thicknesses, va1, va2...first and second values, w1~w3...first to third connection widths, wa1~wa3...first to third other connection widths

Claims

1. a substrate including a first substrate region and a second substrate region; a first detection unit including a first detection element, the first detection element including a first resistive member, a first conductive member, and a first insulating member, at least a portion of the first insulating member being between the first resistive member and the first conductive member, a first gap being provided between the first base region and the first detection element, and the first detection element having a first area in a plane intersecting a first direction from the first base region to the first detection element; a second detection unit including a second detection element, the second detection element including a second resistive member, a second conductive member, and a second insulating member, at least a portion of the second insulating member being between the second resistive member and the second conductive member, a second gap being provided between the second base region and the second detection element, the second detection element having a second area in the plane, the second area being smaller than the first area; Equipped with A sensor wherein a first distance in the first direction between the first substrate region and the first sensing element is different from a second distance in the first direction between the second substrate region and the second sensing element.

2. the first detection element has a first length in a direction intersecting the first direction; the second detection element has a second length in a direction intersecting the first direction; The sensor of claim 1 , wherein the second length is less than the first length.

3. A substrate including a first substrate region and a second substrate region; a first detection unit including a first detection element, the first detection element including a first resistive member, a first conductive member, and a first insulating member, at least a portion of the first insulating member being between the first resistive member and the first conductive member, a first gap being provided between the first base region and the first detection element, and the first detection element having a first area in a plane intersecting a first direction from the first base region to the first detection element; a second detection unit including a second detection element, the second detection element including a second resistive member, a second conductive member, and a second insulating member, at least a portion of the second insulating member being between the second resistive member and the second conductive member, a second gap being provided between the second base region and the second detection element, the second detection element having a second area in the plane, the second area being smaller than the first area; Equipped with the first detection unit further includes a first support unit and a first connection unit; the first support portion is fixed to the base, the first connection portion is supported by the first support portion and supports the first detection element; a gap is provided between the first base region and the first connection portion; the second detection unit further includes a second support unit and a second connection unit; the second support portion is fixed to the base, the second connection portion is supported by the second support portion and supports the second detection element; A sensor in which a gap is provided between the second base region and the second connection portion.

4. the first connection portion includes a first connection length, a first connection width, a first connection thickness, and a first connection material, the first connection length being a length of the first connection portion along a first connection path between the first support portion and the first detection element, the first connection width being a width of the first connection portion in a direction intersecting the first connection path, and the first connection thickness being a thickness of the first connection portion in the first direction; 4. The sensor of claim 3, wherein the second connection portion includes at least one of a second connection length different from the first connection length, a second connection width different from the first connection length, a second connection thickness different from the first connection thickness, and a second connection material different from the first connection material, wherein the second connection length is a length of the second connection portion along a second connection path between the second support portion and the second detection element, the second connection width is a width of the second connection portion in a direction intersecting the second connection path, and the second connection thickness is a thickness of the second connection portion in the first direction.

5. 5. The sensor of claim 4, wherein the second connection portion includes at least one of the second connection length being shorter than the first connection length, the second connection width being larger than the first connection width, and the second connection thickness being thicker than the first connection thickness.

6. Further comprising a third detection unit, the substrate further comprises a third substrate region; the third detection unit includes a third detection element, the third detection element includes a third resistive member, a third conductive member, and a third insulating member, at least a portion of the third insulating member is between the third resistive member and the third conductive member, a third gap is provided between the third base region and the third detection element, and the third detection element has a third area in the plane; The sensor of claim 1 , wherein the third area is different from the first area and different from the second area.

7. a substrate including a first substrate region and a second substrate region; a first detection unit including a first detection element, a first support portion, and a first connection portion, wherein the first support portion is fixed to the base, the first connection portion is supported by the first support portion, and supports the first detection element, a gap is provided between the first base region and the first connection portion and between the first base region and the first detection element, and the first detection element includes a first resistance member and a first conductive member; a second detection unit including a second detection element, a second support portion, and a second connection portion, wherein the second support portion is fixed to the base, the second connection portion is supported by the second support portion, and supports the second detection element, a gap is provided between the second base region and the second connection portion and between the second base region and the second detection element, and the second detection element includes a second resistance member and a second conductive member; Equipped with the first connection portion includes a first connection length, a first connection width, a first connection thickness, and a first connection material, the first connection length being a length of the first connection portion along a first connection path between the first support portion and the first detection element, the first connection width being a width of the first connection portion in a direction intersecting the first connection path, and the first connection thickness being a thickness of the first connection portion in a first direction from the first base region to the first detection element; The second connection portion includes at least one of a second connection length different from the first connection length, a second connection width different from the first connection length, a second connection thickness different from the first connection length, and a second connection material different from the first connection material, wherein the second connection length is the length of the second connection portion along a second connection path between the second support portion and the second detection element, the second connection width is the width of the second connection portion in a direction intersecting the second connection path, and the second connection thickness is the thickness of the second connection portion in the first direction.

8. Further comprising a third detection unit, the substrate further comprises a third substrate region; the third detection unit includes a third detection element, a third support unit, and a third connection unit; the third support portion is fixed to the base, the third connection portion is supported by the third support portion and supports the third detection element; a gap is provided between the third base region and the third connection portion, and between the third base region and the third detection element; the third detection element includes a third resistive member and a third conductive member, 8. The sensor of claim 7, wherein the third connection portion includes at least one of a third connection length that is different from the first connection length and different from the second connection length, a third connection width that is different from the first connection length and different from the second connection length, a third connection width that is different from the first connection length and different from the second connection length, a third connection thickness that is different from the first connection length and different from the second connection length, and a third connection material that is different from the first connection length and different from the second connection material, wherein the third connection length is a length of the third connection portion along a third connection path between the third support portion and the third detection element, the third connection width is a width of the third connection portion in a direction intersecting the third connection path, and the third connection thickness is a thickness of the third connection portion in the first direction.

9. a control unit electrically connectable to the first resistance member, the first conductive member, the second resistance member, and the second conductive member; The control unit is capable of performing a first operation, In the first operation, the control unit supplies a first current to the first conductive member to increase the temperature of the first detection element; In the first operation, the control unit supplies a second current to the second conductive member to increase the temperature of the second detection element; the control unit derives a first value corresponding to a first electrical resistance of the first resistance member in the first operation; the control unit derives a second value corresponding to a second electrical resistance of the second resistance member in the first operation; The sensor of any one of claims 1 to 8, wherein the control unit is capable of outputting, in the first operation, a detection signal including a first detection value corresponding to the concentration of a first substance contained in the space around the first detection element and the second detection element, and a second detection value corresponding to the concentration of a second substance contained in the space, based on the first value and the second value.

10. a first detection unit including a first base, a first support, a first connection portion, and a first detection element, wherein the position of the first support portion relative to the first base is fixed, the first connection portion is supported by the first support portion, the first connection portion supports the first detection element, a first gap is provided between the first base and the first detection element, and the first detection unit has a first area of ​​the first detection element, a first connection length of the first connection portion, a first connection width of the first connection portion, a first connection thickness of the first connection portion, a first connection material of the first connection portion, and a first distance, wherein the first distance is the distance between the first base and the first detection element; a second detection unit including a second base, a second support, a second connection, and a second detection element, wherein the position of the second support relative to the second base is fixed, and a second gap is provided between the second base and the second detection element, and the second detection unit has at least one of a second area of ​​the second detection element that is different from the first area, a second connection length of the second connection portion that is different from the first connection length, a second connection width of the second connection portion that is different from the first connection width, a second connection thickness of the second connection portion that is different from the first connection thickness, a second connection material of the second connection portion that is different from the first connection material, and a second distance that is different from the first distance, and the second distance is the distance between the second base and the second detection element; A sensor equipped with

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