Transmission structures, antennas, and terminals

The transmission structure with a circuit board design and strategic apertures enhances bandwidth and impedance matching, addressing the bandwidth limitations of millimeter-wave radar systems by reducing energy leakage and reflection.

JP7772951B2Active Publication Date: 2025-11-18YINWANG INTELLIGENT TECHNOLOGIES CO LTD
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Patent Information

Application Number
JP2024539413
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-12-28
Publication Date
2025-11-18
Estimated Expiration
2041-12-28

AI Technical Summary

Technical Problem

Existing millimeter-wave radar systems face challenges in improving their effective bandwidth, which affects their performance in detecting and measuring objects.

Method used

A transmission structure is designed with a circuit board comprising a first metal layer, a second metal layer, and a dielectric layer, featuring a radiating portion with openings and a waveguide that includes a microstrip avoidance groove and a waveguide port, along with strategic apertures and ground portions to enhance impedance matching and reduce electromagnetic energy leakage.

Benefits of technology

The solution expands the operating bandwidth range of the transmission structure, improves impedance matching, reduces energy reflection, and minimizes electromagnetic energy leakage, leading to enhanced performance in millimeter-wave radar systems.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiments of the present application provide a transmission structure, an antenna, and a terminal. The transmission structure includes a circuit board. Wherein the circuit board includes a first metal layer, a second metal layer, and a dielectric layer, the dielectric layer is disposed between the first metal layer and the second metal layer, the first metal layer includes a radiating portion and a microstrip, the microstrip is connected to one end of the radiating portion, and the second metal layer is grounded. The radiating portion is provided with an opening, which allows the radiating portion to form at least two resonant frequencies. According to the solution provided in the embodiments of the present application, the operating bandwidth of the transmission structure can be extended.
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Description

[Technical Field]

[0001] This application relates to the field of communications technology, and more particularly to transfer structures, antennas, and terminals. [Background technology]

[0002] With the development and progress of science and technology, vehicle intelligence has gradually become a research hotspot in the vehicle field. Vehicles with intelligence (shortly referred to as intelligent vehicles) can bring people a safer and more comfortable driving experience. For example, multiple sensors may be installed in an intelligent vehicle, so that the surrounding environment information of the intelligent vehicle can be obtained by using the sensors, and assisted driving or self-driving can be implemented based on the surrounding environment information. Sensors include, for example, cameras, laser radars, millimeter-wave radars, and ultrasonic sensors.

[0003] Millimeter-wave radar uses millimeter waves as a detection medium and can measure the distance, angle, movement speed, etc. from the millimeter-wave radar to a measurement object. Millimeter-wave radar can send a signal to an antenna radiator by using a feed. The antenna radiator can radiate the signal into a waveguide. The waveguide transmits the signal. In this way, millimeter-wave radar can relatively accurately detect the position, movement speed, etc. of a measurement object. The effective bandwidth of millimeter-wave radar has a significant impact on millimeter-wave performance. How to improve the effective bandwidth of millimeter-wave radar is a problem that needs to be solved. Summary of the Invention

[0004] SUMMARY OF THE INVENTION Embodiments of the present application provide a transmission structure and extend the operating bandwidth range of the transmission structure.

[0005] According to a first aspect, a transmission structure is provided. The transmission structure includes a circuit board. The circuit board includes a first metal layer, a second metal layer, and a dielectric layer, the dielectric layer being disposed between the first metal layer and the second metal layer. The first metal layer includes a radiating portion and a microstrip, the microstrip is connected to one end of the radiating portion, and the second metal layer is grounded. An opening is provided in the radiating portion, allowing the radiating portion to form at least two resonant frequencies.

[0006] The present application provides a transmission structure. The transmission structure includes a circuit board, and a dielectric layer on the circuit board is disposed between a first metal layer and a second metal layer. The transmission structure provided in the present application helps to reduce the space corresponding to the metal back cavity and reduces the overall thickness of the circuit board, so that the transmission structure can be easily integrated with other components. Opening a radiating portion on the first metal layer expands the bandwidth of the transmission structure, so that the transmission structure can be used in more scenarios.

[0007] In relation to the first aspect, in some embodiments of the first aspect, the transmission structure further includes a waveguide arranged on a side of the circuit board that is closer to the first metal layer, the waveguide including a microstrip avoidance groove and a waveguide port, the microstrip being spaced apart from a groove wall of the microstrip avoidance groove and arranged opposite the microstrip avoidance groove, the waveguide port being arranged opposite the radiating portion, and a signal radiated by the radiating portion passing through the waveguide port and radiating out of the transmission structure.

[0008] The transmission structure in the present application further improves the waveguide. The waveguide includes a waveguide port and a microstrip avoidance groove. The presence of the microstrip avoidance groove makes it possible to reduce the possibility of electromagnetic energy leakage when the waveguide cooperates with a circuit board, or to reduce the amount of electromagnetic energy leakage caused by contact between the microstrip and the waveguide, so that the electromagnetic wave can enter the radiation section from the microstrip on the circuit board and then radiate out of the entire transmission structure through the waveguide port.

[0009] With respect to the first aspect, in some implementations of the first aspect, the radiating portion is rectangular, and the microstrip is positioned off an axis of symmetry of the radiating portion.

[0010] The axes of symmetry of the radiating section and the microstrip on the circuit board are deviated from each other, which helps to reduce energy reflection caused by the transition of the electromagnetic wave from the microstrip to the radiating section, i.e., enhances the impedance matching of the transition of the electromagnetic wave from the microstrip to the radiating section, and improves the matching bandwidth of the transmission structure.

[0011] In relation to the first aspect, in some implementations of the first aspect, the aperture is a strip-shaped aperture, and the aperture is spaced apart from an edge of the radiating portion.

[0012] The aperture of the radiating portion is located inside the radiating portion, and the strip-shaped aperture inside the radiating portion allows the current to form multiple resonant frequencies near the strip-shaped aperture, thereby extending the operating bandwidth range of the transmission structure.

[0013] In relation to the first aspect, in some implementation forms of the first aspect, the aperture is a strip-shaped aperture, and one end of the aperture is connected to an edge of the radiating portion that is away from the edge connected to the microstrip.

[0014] The apertures of the radiating section are at the edges of the radiating section and are connected to the edges of the radiating section and to the edges remote from the microstrip, and by using several edge-connected apertures the current diffraction path is increased and as a result the operating bandwidth of the transmission structure is increased.

[0015] In relation to the first aspect, in some implementation forms of the first aspect, the opening includes a first strip-shaped opening segment and a second strip-shaped opening segment, and one end of the second strip-shaped opening segment is connected to one end of the first strip-shaped opening segment.

[0016] In this embodiment of the present application, the ends of the two strip-shaped aperture segments are connected to form a certain angle. When passing through the radiating section, the electromagnetic wave can bypass the structure formed by the two strip-shaped aperture segments and can be radiated near the structure formed by the two strip-shaped aperture segments, thereby increasing the radiation position of the electromagnetic wave energy and improving the operating bandwidth of the transmission structure.

[0017] In relation to the first aspect, in some implementations of the first aspect, the aperture further includes a third strip-shaped aperture segment, one end of which is connected to the other end of the second strip-shaped aperture segment, the other end of which is far away from the end connected to the first strip-shaped aperture segment, and the third strip-shaped aperture segment is parallel to the first strip-shaped aperture segment and spaced apart from the first strip-shaped aperture segment.

[0018] The structure formed by the three aperture segments of the radiating section further increases the current resonance point and extends the operating bandwidth range of the transmission structure.

[0019] In relation to the first aspect, in some implementations of the first aspect, the second strip-shaped aperture segment is disposed perpendicular to the first strip-shaped aperture segment.

[0020] The aperture of the radiator is a generally U-shaped aperture, so that the radiator forms a multi-tuned circuit, thus reducing the quality factor and increasing the bandwidth range of the radiator.

[0021] In relation to the first aspect, in some implementations of the first aspect, the length of the aperture ranges from 0.5×λ to 1.5×λ. For example, the width of the aperture ranges from 0.01×λ to 0.2×λ, where λ is the operating wavelength of the transmission structure.

[0022] The aperture is strip-shaped and has a total length in the range of approximately 0.5×λ to 1.5×λ and a width in the range of approximately 0.01×λ to 0.2×λ. The specific shape is not limited, so that apertures of different shapes in the radiating portion can increase the current diffraction paths and increase the operating bandwidth of the transmission structure.

[0023] In relation to the first aspect, in some implementations of the first aspect, the aperture includes a fourth strip-shaped aperture segment and a fifth strip-shaped aperture segment, where the fourth strip-shaped aperture segment extends along a first direction to a first edge of the radiating portion and the fifth strip-shaped aperture segment extends along a second direction to the first edge, and the fourth strip-shaped aperture segment intersects with the fifth strip-shaped aperture segment at the first edge.

[0024] The aperture of this radiating section is V-shaped, which results in an increased current diffraction path and an increased operating bandwidth of the transmission structure.

[0025] In relation to the first aspect, in some embodiments thereof, the first edge is an edge of the radiating portion and is adjacent to an edge connected to the microstrip.

[0026] The vertex of the V-shaped opening of the radiating section is located on the adjacent edge of the edge of the radiating section and connected to the microstrip, so that the actual length of the adjacent edge increases and the edge of the adjacent edge extends inside the radiating section, thus redistributing the energy radiated by the electromagnetic wave and increasing the operating bandwidth range of the transmission structure.

[0027] In relation to the first aspect, in some embodiments of the first aspect, the waveguide further includes a shield groove, and the shield groove is disposed on a side of the waveguide and closer to the waveguide port, and is spaced apart from the waveguide port and the microstrip avoidance groove.

[0028] The shielding groove around the waveguide port can reduce the leakage of electromagnetic energy so that most of the energy can be radiated out of the transmission structure through the waveguide port.

[0029] In relation to the first aspect, in some implementations of the first aspect, the shield groove surrounds the periphery of the waveguide port.

[0030] The shield groove surrounds the periphery of the waveguide port so that a relatively large amount of area of ​​the waveguide port can be surrounded by the shield groove, which helps to limit energy loss and improves energy utilization in the transmission process.

[0031] In relation to the first aspect, in some implementations of the first aspect, the depth of the shield groove is an odd multiple of λ / 4, where λ is the operating wavelength of the transmission structure.

[0032] The shape of the shield groove on the waveguide is not limited and may be, for example, a long rectangular strip. A long rectangular strip-shaped shield groove helps reduce energy leakage from one side of the long strip. As another example, the shield groove can alternatively surround the waveguide port to better reduce electromagnetic energy leakage. The depth of the shield groove is set to an odd multiple of λ / 4, so that the shield groove has a relatively large impedance after impedance transformation.

[0033] In some implementations of the first aspect, the waveguide further includes a waveguide body and a boss, the boss protruding from the waveguide body toward the circuit board and in contact with the circuit board, for example, the waveguide body and the boss may be integrally formed.

[0034] The waveguide contacts the circuit board through the use of positioned bosses to reduce the contact area, thereby reducing the effect of waveguide or circuit board processing tolerances on assembly.

[0035] In relation to the first aspect, in some implementation forms of the first aspect, the first metal layer further includes a first transition portion configured for impedance matching between the microstrip and the radiating portion, and the first transition portion is connected between the radiating portion and the microstrip along a direction from the radiating portion to the microstrip.

[0036] The transition segment is disposed between the radiating portion and the microstrip, so that the impedance on the transmission path can be in a gradient state, and energy loss caused by reflections, etc. in the electromagnetic wave transmission process can be reduced.

[0037] In relation to the first aspect, in some embodiments thereof, the first metal layer further includes a ground portion that surrounds the radiating portion and the microstrip and is spaced apart from the radiating portion and the microstrip, and the ground portion is in contact with the waveguide and is electrically connected to the second metal layer.

[0038] The exterior of the radiating portion surrounds the ground portion so that when the waveguide cooperates with the circuit board, the waveguide is in good contact with the ground portion.

[0039] In relation to the first aspect, in some implementations of the first aspect, the ground portion is electrically connected to the second metal layer through a plated through hole or a metal wall.

[0040] The plated-through holes between the ground portion and the second metal layer allow the ground portion to make good contact with the second metal layer. In addition, the metal walls or plated-through holes can further limit the radiation of electromagnetic energy, thereby improving the efficiency of the transmission structure.

[0041] With respect to the first aspect, in some implementations of the first aspect, an orthogonal projection of the waveguide port on the circuit board is located within an area surrounded by an inner contour of the ground portion.

[0042] The area surrounded by the inner contour of the ground portion is the transmission area between the circuit board and the waveguide, which may be slightly larger than the size of the waveguide port, so that the effect of alignment error on the transmission performance is reduced and good transmission performance is implemented.

[0043] In relation to the first aspect, in some embodiments thereof, the ground portion includes a ground portion body and a ground extension, the ground extension facing and spaced apart from a junction between the microstrip and the radiating portion, and the ground extension extending from the ground portion body toward the junction.

[0044] The ground portion is provided with a ground extension, which extends to the junction between the radiating portion and the microstrip, and may be positioned to enhance impedance matching for electromagnetic wave transmission.

[0045] According to a second aspect, an antenna is provided, the antenna including a transmission structure according to any one of the implementation forms of the first aspect.

[0046] According to a third aspect, there is provided a detection device, the detection device including an antenna according to any one of the implementations of the second aspect, for example, the detection device being a radar.

[0047] According to a fourth aspect, there is provided a terminal, the terminal including a detection device according to any one of the implementation forms of the third aspect.

[0048] In relation to the fourth aspect, in some implementation forms of the fourth aspect, the terminal is a vehicle.

[0049] According to a fifth aspect, there is provided a vehicle, the vehicle including a detection device according to any one of the third aspects. [Brief explanation of the drawings]

[0050] [Figure 1] FIG. 1 is a diagram of a scenario in which a transmission structure according to one embodiment of the present application can be applied. [Figure 2] FIG. 2 is a perspective view of a transmission structure according to one embodiment of the present application. [Figure 3]FIG. 3 is a schematic structural diagram of the first metal layer on the circuit board corresponding to FIG. [Figure 4] FIG. 4 is a schematic diagram of the first transition portion corresponding to FIG. [Figure 5] FIG. 5 is a perspective view of another transmission structure according to an embodiment of the present application. [Figure 6A] FIG. 6(a) is a schematic diagram of the first end surface of the waveguide corresponding to FIG. [Figure 6B] FIG. 6(b) is a schematic diagram of the first end surface of the waveguide corresponding to FIG. [Figure 7] FIG. 7 is a projection view corresponding to FIG. [Figure 8] FIG. 8 is a schematic structural diagram of an opening of a radiation portion according to one embodiment of the present application. [Figure 9] FIG. 9 is a diagram showing the simulation results of the aperture of the radiation part corresponding to FIG. [Figure 10] FIG. 10 is a schematic structural diagram of an aperture of a radiating portion according to one embodiment of the present application. [Figure 11] FIG. 11 is a schematic structural diagram of an aperture of a radiating portion according to one embodiment of the present application. [Figure 12] FIG. 12 is a schematic structural diagram of an aperture of a radiating portion according to one embodiment of the present application. [Figure 13] FIG. 13 is a schematic structural diagram of an array of transmission structures according to one embodiment of the present application. [Figure 14] FIG. 14 is a schematic diagram of another transmission structure according to an embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0051] The following describes the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part, not all, of the embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0052] The technical solution disclosed in this application uses applications in the radar field as an example, but is not limited to radar systems. The transmission structure can be applied to any scenario where transmission between a waveguide and a circuit board is required.

[0053] The circuit board used in this application may be a general printed circuit board (PCB), or may be a substrate integrated waveguide (SIW).

[0054] The waveguide used in this application can be a rectangular waveguide, or a tubular waveguide with other non-standard or standard waveguide ports. In the following, a metal waveguide with a rectangular waveguide port is used as an example to explain the main technical solution of this application. Similar examples are also used when the waveguide port has other shapes.

[0055] 1 is a schematic structural diagram of a radar in the form of a waveguide antenna to which the transmission structure of the present application can be applied. As shown in FIG. 1, the radar includes a shield layer 110, a PCB layer 120, a cooling layer 130, a filter / feed layer 140, and a radiation layer 150.

[0056] The shielding layer 110 is configured to reduce the influence of external electromagnetic fields on the entire antenna. The shielding layer can be grounded, so that external interference signals are guided to ground by this layer. The shielding layer can also prevent circuits inside the antenna from radiating electromagnetic energy to the outside, so that internal signal transmission losses are reduced. The shielding layer can also have excellent thermal conductivity to conduct heat generated by internal lines to the outside of the entire device, so that the internal lines operate at a relatively stable temperature.

[0057] Active devices are located on PCB layer 120 and can process signals generated by the active devices. The processed signals can travel from a layer to the next layer structure via radiation or by using transmission lines.

[0058] The cooling layer 130 is disposed between the PCB layer 120 and the filter / feed layer 140. Similar to the shielding layer, the cooling layer 130 can conduct heat generated within the antenna out of the entire antenna system. The specific geometric design of the layer can further facilitate transmission between the PCB layer 120 and the filter / feed layer 140.

[0059] The filter / feed layer 140 is configured to perform processing, such as filtering, on the signals from the PCB layer 120 to obtain electromagnetic waves within a particular bandwidth range.

[0060] The radiating layer 150 includes a slot radiating array formed by several slots, and is configured to use the array to radiate the electromagnetic waves processed by the filter / feed layer 140 outward from the entire millimeter-wave antenna arrangement.

[0061] In the radar shown in Fig. 1, the transmission associated with the PCB layer 120 has a significant impact on the performance of the entire device. Therefore, the technical solution provided in this application optimizes the transmission between the PCB layer 120 and the waveguide, thereby covering a relatively wide bandwidth range and providing the advantage of a low cross-sectional area, which facilitates the installation of the entire module.

[0062] 2 is a perspective view of a transmission structure according to one embodiment of the present application. As shown in FIG. 2, the transmission structure provided in this embodiment of the present application may include a circuit board 20.

[0063] The circuit board 20 of Figure 2 may be the PCB layer 120 of Figure 1. The circuit board 20 includes a first metal layer 230, a second metal layer 210, and a dielectric layer 220. The dielectric layer 220 is disposed between the first metal layer 230 and the second metal layer 210. The dielectric layer 220 may be an insulating material, and the second metal layer 210 is grounded.

[0064] In one embodiment, the first metal layer 230 and the second metal layer 210 may be two adjacent metal layers on the circuit board 20. The first metal layer 230 and the second metal layer 210 may be disposed on two surfaces of the dielectric layer 220 by a method such as electroplating.

[0065] In this embodiment of the present application, in order to reduce processing difficulty and manufacturing cost, the circuit board 20 uses a structure without a back cavity. The dielectric layer 220 is directly below the first metal layer 230 without any other metal back cavity between the first metal layer 230 and the dielectric layer 220. In this way, the processing difficulty can be effectively reduced, and the overall thickness of the circuit board 20 is relatively small, so that the cost is effectively reduced.

[0066] For example, the thickness of the vehicle radar plate NF30 may be only 0.05 mm to 0.2 mm, for example 0.12 mm.

[0067] 3 shows the structure of the first metal layer 230 on the circuit board 20 of the transmission structure according to the present application. As shown in FIG. 3, the first metal layer 230 includes a radiating portion 231 and a microstrip 232. One end of the microstrip 232 is connected to a feed, which may be a feed for the entire transmission structure, the circuit board, or an electronic device. The other end of the microstrip 232 may be connected to the radiating portion 231.

[0068] In some embodiments, the radiating portion 231 may be directly connected to the microstrip 232. In some other embodiments, the radiating portion 231 may alternatively be connected to the microstrip 232 by using a first transition portion 233, which is also metallic. The presence of the first transition portion 233 may allow the impedance from the microstrip 232 to the radiating portion 231 to be in a gradient state when the electromagnetic wave enters the radiating portion 231 from the microstrip 232. As a result, the reflection of electromagnetic wave energy at the joint between the microstrip 232 and the radiating portion 231 is reduced. This helps to increase the energy entering the radiating portion 231 and reduces losses.

[0069] The width of the first transition portion 233 at a position closer to the microstrip 232 may be smaller than the width of the first transition portion 233 at a position closer to the radiating portion 231. The width direction of the first transition portion 233 may be perpendicular to the direction from the microstrip 232 to the radiating portion 231 and parallel to the direction of the first metal layer 230. For example, the width direction of the first transition portion 233 may be perpendicular to the extension direction of the microstrip 232.

[0070] 4 shows the structure of the first transition section according to one embodiment of the present invention. As shown in (a) of FIG. 4, the width of the first transition section 233 may gradually increase, for example, linearly, from the microstrip 232 to the radiating section 231.

[0071] As shown in (b) of FIG. 4 , the width of the first transition portion 233 may increase stepwise from the microstrip 232 to the radiating portion 231. That is, the edge of the first transition portion 233 may be stepped. The edge of the first transition portion 233 may include a first step edge 2331 and a second step edge 2332 parallel to the width direction of the first transition portion 233, and a third step edge 2333 and a fourth step edge 2334 perpendicular to the width direction of the first transition portion 233. The third step edge 2333 may be connected between the first step edge 2331 and the second step edge 2332, and the fourth step edge 2334 may be connected between the second step edge 2332 and the microstrip 232. The width of the first transition portion 233 at the first step edge is different from the width of the first transition portion 233 at the second step edge.

[0072] The radiating portion 231 may be rectangular. In some embodiments, the axis of symmetry of the microstrip 232 in the extension direction may be arranged to deviate from the axis of symmetry of the radiating portion 231.

[0073] Microstrip 232From the perspective of the port, the impedance presented by the microstrip 232 is the impedance value conducted from the back-end circuit. Usually, the impedance of the microstrip 232 is set to 50 ohms, taking into account the power supply capacity and various factors. From the perspective of the transmission port, i.e., the radiating portion 231, the impedance presented by the radiating portion 231 is the impedance of the entire transmission structure. The microstrip is positioned off the radiating portion, so that the difference between the microstrip and the radiating portion can be reduced.

[0074] In addition, for the radiating portion 231, the impedance value appearing in the middle portion is usually small, which is unfavorable to impedance matching, and the impedance at the edge is large. By selecting an appropriate offset size, the difficulty in debugging the impedance matching can be greatly reduced, which facilitates the impedance matching between the microstrip 232 and the radiating portion 231.

[0075] In some other embodiments, the axis of symmetry in the extension direction of the microstrip 232 may be in the extension direction of the axis of symmetry of the radiating portion 231 .

[0076] The radiating portion 231 includes an opening 234 that allows the radiating portion to form at least two resonant frequencies.

[0077] The opening 234 is a pattern formed by removing a portion of the metal from the radiating portion 231 to expose the dielectric layer (220) underneath the radiating portion 231. In some embodiments, the opening in the radiating portion 231 may also be referred to as a slot. The presence of the opening 234 in the radiating portion 231 changes the capacitance and inductance components, allowing current to form a new resonant frequency near the opening. In this way, at least two resonant frequencies are formed in the radiating portion 231, and the operating bandwidth of the transmission structure is increased.

[0078] The opening 234 may be located inside the radiating portion 231 , ie, spaced apart from the edge of the radiating portion 231 , or may be connected to the edge of the radiating portion 231 .

[0079] The first metal layer 230 may further include a grounding portion 235 outside the radiating portion 231 and the microstrip 232. The grounding portion 235 surrounds the radiating portion 231 and the microstrip 232. The metal between the radiating portion 231, the microstrip 232, and the grounding portion 235 may be removed by a method such as chemical etching, so that the radiating portion 231, the microstrip 232, and the grounding portion 235 are separated from each other or spaced apart from each other. Alternatively, the middle portion may be removed from the entire metal layer on the dielectric layer 220, and the radiating portion 231 and the microstrip 232 are fixed to the middle portion as a whole. A portion of the surface of the dielectric layer 220 (where the exposed portion of the dielectric layer is indicated by the hatched portion in FIG. 3 ) may be exposed in the middle portion where the radiating portion 231 and the microstrip 232 are not located.

[0080] The ground portion 235 may be grounded by using a transmission line, or may be connected to the second metal layer 210 by using a plurality of plated through holes 237 disposed on the ground portion 235 and positioned close to the radiating portion 231 and the microstrip 232. The distance between the plurality of plated through holes may be less than a target threshold, so that the energy of the electromagnetic wave is limited to the area surrounded by the plated through holes 237, and the loss of the energy of the electromagnetic wave is reduced.

[0081] In some embodiments, some of the plated through holes 237 may alternatively be replaced with a metal wall connecting the ground portion 235 and the second metal layer 210 .

[0082] The ground portion 235 may include a ground portion body and a ground extension 236. The ground extension 236 is disposed at a position close to where the microstrip 232 is connected to the radiating portion 231, and the distance between the ground extension 236 and the microstrip 232 is smaller than the distance between the ground portion body and the microstrip 232. The distance between the ground portion 235 and the microstrip 232 may be the length from the inner profile of the ground portion to the microstrip 232 in an extension direction perpendicular to the microstrip 232.

[0083] In some embodiments, as shown in FIG. 3, a ground extension 236 extends from the ground portion body to the microstrip 232.

[0084] In some other embodiments, the ground extension is positioned opposite the junction between the radiating portion 231 and the microstrip 232 and may extend to the junction between the radiating portion 231 and the microstrip 232.

[0085] The placement of the ground extension 236 can further improve the impedance matching between the radiating portion 231 and the microstrip 232. And the entire ground portion 235 and the ground extension 236 are not in contact with the microstrip 232 and the radiating portion 231.

[0086] 5 is a perspective view of another transmission structure according to an embodiment of the present application. The transmission structure provided in this embodiment of the present application may further include a waveguide 30. The waveguide 30 is formed by machining an entire metal piece, and each structure of the waveguide 30 in the present application may be processed on a first end surface of the waveguide 30 by a machining method such as milling.

[0087] The waveguide 30 may include a waveguide port 311 and a microstrip avoidance groove 312. The waveguide port 311 may be a standard waveguide port, such as a WR12 waveguide port (where the size of a WR12 standard waveguide port is 3.0988 mm × 1.5494 mm), or may be a non-standard waveguide port. The waveguide port 311 penetrates a first end face of the waveguide 30 to a surface opposite the first end face, and transmits electromagnetic waves from the waveguide 30. The first end face of the waveguide 30 may be an end face of the waveguide 30 and closer to the circuit board 20. As shown in FIG. 4 , the first metal layer 230 on the circuit board 20 may be disposed on the side of the circuit board 20 and closer to the waveguide 30.

[0088] When the circuit board 20 cooperates with the waveguide 30, the waveguide port 311 on the first end face of the waveguide 30 faces the first metal layer 230 on the circuit board 20, so that electromagnetic wave energy is radiated from the first metal layer 230 on the circuit board 20 through the waveguide port 311.

[0089] 6(a) and 6(b) are schematic diagrams of the first end face of the waveguide 30 corresponding to FIG. 5. As shown in FIGS. 6(a) and 6(b), the first end face of the waveguide 30 has various processed structures. A waveguide port 311 and a microstrip avoidance groove 312 are arranged on the first end face. The waveguide port 311 is connected to the microstrip avoidance groove 312 or passes through the microstrip avoidance groove 210. The depth of the microstrip avoidance groove 312 may be approximately 0.6 mm or may be another value. This is not limited in the present application.

[0090] The waveguide port 311 may be directly connected to the microstrip avoidance groove 312, or may be connected to the microstrip avoidance groove 312 via a second transition section 313. The second transition section 313 may be a strip-shaped groove whose width is smaller than the width of the microstrip avoidance groove 312. Alternatively, the width of the second transition section 313 may change linearly or stepwise. The width of the second transition section 313 is the length of the second transition section 313 in an extension direction perpendicular to the microstrip avoidance groove 312.

[0091] A shielding groove 314 may further be arranged outside the waveguide port 311. The shielding groove 314 is arranged at a distance from the waveguide port 311 and the microstrip avoidance groove 312 connected to the waveguide port 311, and is configured to limit the main energy of the electromagnetic wave to a range on the side of the shielding groove 314 and close to the waveguide port 311.

[0092] The shield groove 314 may surround the periphery of the waveguide port 311. In some embodiments, the shield groove 314 may include a first groove band 3141, a second groove band 3142, and a third groove band 3143 as shown in FIG. 6( a). The first groove band 3141 may be spaced apart from the third groove band 3143, and the second groove band 3142 may be connected between the first groove band 3141 and the third groove band 3143. The arrangement of the three groove bands helps to confine the energy of the electromagnetic wave to an area defined by the shield groove and reduces the loss of the energy of the electromagnetic wave in the transmission structure.

[0093] The depth of shield groove 314 does not need to be limited. In some embodiments, the depth of shield groove 314 may be an odd multiple of λ / 4, resulting in a relatively large impedance at the groove opening, i.e., the first end face, and suppressing the propagation of electromagnetic wave energy. In some other embodiments, shield groove 314 may penetrate through the first end face of waveguide 30 to the surface opposite the first end face. The depth direction of the shield groove is the normal direction to the first end face of the waveguide.

[0094] The width of the shield groove 314 is not limited. For example, the width of the shield groove 314 may be 0.5 mm. The width direction of the shield groove 314 may be parallel to the direction of the first end face and perpendicular to the extension direction of the shield groove 314. The extension direction of the shield groove 314 may be the axial direction of the shield groove 314. The shape of the shield groove 314 is also not limited and may be circular or polygonal.

[0095] In some embodiments, the shield grooves 314 may be arranged in a closed manner outside the waveguide ports. For example, at least one of the first strip-shaped groove 3141, the second strip-shaped groove 3142, and the third strip-shaped groove 3143 in FIG. 6( a) may be replaced with a polygonal annular groove formed by a plurality of interconnected strip-shaped grooves. For example, the shield grooves 314 may include a fourth groove 3144, a fifth groove 3145, and a sixth groove 3146 shown by the shaded areas in FIG. 6( b). Specifically, the inner and outer profiles of each groove may be concentric rectangles, and the waveguide ports 311 may be arranged outside the grooves. The groove shape may alternatively be replaced with a circular groove or a groove with another irregular shape. This is not a limitation of the present application.

[0096] In some other embodiments, the shield groove 314 surrounds the outside of the waveguide port 311 in an unclosed manner, which is the structure of the shield groove 314 shown in FIG. 6(a).

[0097] The waveguide 30 may further include a waveguide body and a boss 315. The waveguide body includes structures such as a waveguide port 311, a microstrip avoidance groove 312, and a shield groove 314. The boss 315 protrudes from the waveguide body toward the circuit board 20 and is in contact with the circuit board 20. The position of the boss 315 is not limited, and the shape of the boss 315 is also not limited. In some embodiments, as shown in FIGS. 6( a) and 6(b), the boss 315 may be integrally formed. For example, the boss 315 may include a first boss portion 3151, a second boss portion 3152, and a third boss portion 3153. The first boss portion 3151 is disposed outside the shield groove 314. When the shield groove 314 includes the first band-shaped groove 3141, the second band-shaped groove 3142, and the third band-shaped groove 3143, the first boss portion 3151 may further include a boss portion located on the side of the first band-shaped groove 3141 and away from the waveguide port 311, a boss portion located on the side of the second band-shaped groove 3142 and away from the waveguide port 311, and a boss portion located on the side of the third band-shaped groove 3143 and away from the waveguide port 311. The second boss portion 3152 is a region located between the waveguide port 311 and the shield groove 314. The third boss portion 3153 includes boss portions located on two sides of the microstrip avoidance groove 312, where the two boss portions are both band-shaped bosses and the axes of the two band-shaped bosses are parallel to the extension direction of the microstrip avoidance groove 312.

[0098] In some other embodiments, the boss may alternatively include only the portion surrounding the waveguide port, such as the boss 315 shown in FIG. 6(b). The boss 315 and the portion of the microstrip avoidance groove 312 connected to the waveguide port 311 surround the waveguide port 311 and are in contact with the outer contour of the waveguide port 311. The shape and position of the boss 315 in FIGS. 6(a) and 6(b) are provided merely as an example. The shape of the boss 315 is not limited. The boss 315 may alternatively include a different number of spaced-apart sub-bosses. The distance between each portion of the boss 315 and the microstrip avoidance groove 312, the waveguide port 311, and the shield groove 314 is also not limited.

[0099] The waveguide 30 contacts the circuit board 20 through the boss 315. Because the area of ​​the boss 315 is smaller than the area of ​​the first end face of the waveguide 30, the contact between the boss 315 and the circuit board 20 reduces the contact area between the waveguide 30 and the circuit board 20, thereby reducing the effect of processing tolerances of the waveguide 30 and the circuit board 20 during assembly. The height of the boss 315 may not be limited. In some embodiments, the surface of the boss 315 that faces the circuit board 20 may be flat and contact and cooperate with a planar structure on the circuit board 20.

[0100] In some other embodiments, the surface of boss 315 and the surface facing circuit board 20 may be curved to accommodate some curved structures on circuit board 20 or use cases where circuit board 20 is curved.

[0101] The surface of the boss 315 may continue to be etched to obtain other structures, such as grooves or slots, to further reduce the contact area, thereby reducing the effect of processing tolerances of the boss 315 and the circuit board on assembly.

[0102] 7 is a projection view of a partial structure of the waveguide 30 on the circuit board 20 corresponding to FIG. 5. As shown in FIG. 7, the structure indicated by the dashed line is a projection of the partial structure of the waveguide 30 on the circuit board 20 when the circuit board 20 cooperates with the waveguide 30. An orthographic projection 316 of the outer contour of the waveguide port 311 on the circuit board 20 and an orthographic projection 317 of the outer contour of the microstrip avoidance groove 312 on the circuit board 20 are disposed outside the radiating portion 231 and the microstrip 232. Specifically, the orthographic projection 316 of the outer contour of the waveguide port 311 is spaced apart from the radiating portion 231, and the orthographic projection 317 of the outer contour of the microstrip avoidance groove is spaced apart from the microstrip 232. In addition, when circuit board 20 cooperates with waveguide 30, microstrip 232 is spaced apart from the groove wall of microstrip avoidance groove 312. In this way, it is avoided that a short circuit occurs when electromagnetic waves do not enter waveguide port 311.

[0103] The inner profile of the ground portion 235 of the circuit board 20 includes a first portion 2351 near the radiating portion, a second portion 2352 near the ground extension, and a third portion 2353 near the main body of the microstrip avoidance groove. When the circuit board 20 cooperates with the waveguide 30, the first portion 2351 may be located outside the projection 316 of the waveguide port 311 on the circuit board 20. That is, the orthogonal projection of the waveguide port 311 on the circuit board 20 is located within the area surrounded by the inner contour of the ground portion 235, thereby reducing alignment errors (as shown by the projection 3161 of the waveguide port on the circuit board in FIG. 7 ), or the first portion 2351 may overlap with the projection 316 of the waveguide port 311 on the circuit board 20. The relationship between the second portion 2352 or the third portion 2353 and the projection 318 of the outer contour of the second transition section 313 of the waveguide 30 and the projection 317 of the outer contour of the microstrip avoidance groove is not limited.

[0104] The waveguide 30 and circuit board 20 may further include structures for connection and positioning, such as screw holes or restricting holes, not shown.

[0105] In the present application, the bandwidth of the transmission structure is expanded by changing the shape of the opening 234 of the radiating portion in the first metal layer 230 on the circuit board 20. The opening 234 of the radiating portion 231 may be located inside the radiating portion 231, i.e., may be spaced apart from the radiating portion 231, or may intersect with the edge of the radiating portion 231.

[0106] The radiating portion aperture 234 may be a strip aperture. The length of the strip aperture is the dimension in the extension direction of the strip aperture, and the width of the strip aperture is the dimension perpendicular to the extension direction of the strip aperture. In some embodiments, the apertures may be strip apertures with equal widths. The total axial length of the strip aperture may range from 0.5×λ to 1.5×λ. For example, the aperture length may be 0.5×λ, λ, or 1.5×λ. The strip aperture width may range from 0.01×λ to 0.2×λ. For example, the aperture width may be 0.05×λ or 0.1×λ, where λ is the operating wavelength of the transmission structure.

[0107] The band opening may include different portions. Condition The aperture may include a first strip-shaped aperture segment and a second strip-shaped aperture segment. One end of the first strip-shaped aperture segment may be connected to one end of the second strip-shaped aperture segment, so that the two strip-shaped aperture segments form a specific included angle. For example, if the included angle is 90°, i.e., if the first strip-shaped aperture segment is perpendicular to the second strip-shaped aperture segment, the aperture is generally L-shaped. If the included angle is not 90°, the aperture is generally V-shaped.

[0108] In some other embodiments, in addition to the first and second strip aperture segments, aperture 234 further includes a third strip aperture segment, one end of which is connected to the other end of the second strip aperture segment, the other end of which is remote from the end connected to the first strip aperture segment, the third strip aperture segment being parallel to and spaced apart from the first strip aperture segment, and the second strip aperture segment being perpendicular to the first strip aperture segment, such that the three segments form a U-shaped structure.

[0109] In some other embodiments, aperture 234 may include a fourth strip aperture segment and a fifth strip aperture segment, where the fourth strip aperture segment extends along a first direction to a first edge of the radiating portion, the fifth strip aperture segment extends along a second direction to the first edge, and the fourth strip aperture segment intersects with the fifth strip aperture segment at the first edge.

[0110] The fourth and fifth strip-shaped aperture segments generally form a V-shaped structure, which results in an extended operating bandwidth range for the transmission structure.

[0111] The first edge may be the edge of the radiating portion 231 and adjacent to the edge connected to the microstrip 232 .

[0112] The apex of the “V” of the V-shaped aperture is located on the edge of the radiating portion 231 and adjacent to the edge connected to the microstrip 232 .

[0113] 8 is a schematic structural diagram of a radiating portion aperture 234 in the first metal layer 230 on the circuit board 20 according to one embodiment of the present application. As shown in FIG. 8, the aperture is a strip-shaped aperture disposed inside the radiating portion 231 and includes a first strip-shaped aperture segment 2341, a second strip-shaped aperture segment 2342, and a third strip-shaped aperture segment 2343. The first strip-shaped aperture segment 2341 is parallel to the third strip-shaped aperture segment 2343. The second strip-shaped aperture segment 2342 is connected to the first strip-shaped aperture segment 2341 and the third strip-shaped aperture segment 2343. The second strip-shaped aperture segment 2342 is perpendicular to the first strip-shaped aperture segment 2341. The three strip-shaped aperture segments form a generally U-shaped structure, and the total length 2a+b of the three strip-shaped aperture segments is generally in the range of 0.5×λ to 1.5×λ. For example, a is 0.3 × λ and b is 0.6 × λ. Or, a is 0.15 × λ and b is 0.3 × λ. The width e of the strip-shaped aperture segment is generally in the range of 0.01 × λ to 0.2 × λ. For example, e can be 0.01 × λ, 0.05 × λ, or 0.1 × λ.

[0114] In some embodiments of the present application, the lengths of the first and second strip-shaped aperture segments 2341 and 2342 of the U-shaped aperture may each be 0.25×λ, and the length of the third strip-shaped aperture segment 2343 may be 0.55×λ. The width of each strip-shaped aperture segment may be 0.05×λ, and the overall length and width of the radiating portion 231 are not limited. For example, the width c may range from 0.45×λ to λ, and the length d of the radiating portion may range from 0.75×λ to 2×λ, where λ is the operating wavelength of the transmission structure.

[0115] FIG. 9 is a simulation result diagram of the relationship between scattering parameters and operating frequency corresponding to FIG. 8. As shown in FIG. 9, when the frequency is 76 GHz, s12 is −2.77 dB and s11 is −22.4 dB, or when the frequency is 81 GHz, s12 is −3.3 dB and s11 is −24.2 dB. In the frequency range from 76 GHz to 81 GHz, the transmission coefficient (i.e., dashed line s12 in FIG. 9) changes slowly and is greater than −3.3 dB, and the return loss (solid line s11 in FIG. 9) shows several resonance points. However, in the range from 76 GHz to 81 GHz, both the transmission coefficient and the return loss are less than −20 dB. In this application, it is seen that the transmission structure has a relatively good impedance matching, resulting in reduced reflected energy loss of the electromagnetic wave caused by impedance discontinuities when the electromagnetic wave enters the circuit board from the microstrip, and a relatively large range of operating bandwidth.

[0116] In addition to the U-shaped aperture mentioned above, the aperture may alternatively be a V-shaped aperture, a W-shaped aperture, etc. The overall length and width of the aperture meet the requirements of impedance matching performance.

[0117] FIG. 10 is a schematic structural diagram of an aperture of a radiating portion according to one embodiment of the present application.

[0118] In FIG. 10, the right edge of the radiating portion is the second edge 1001, and the two axes of symmetry 1002 and 1003 of the radiating portion are further indicated in the figure.

[0119] FIG. 10(a) shows one embodiment of the internal aperture of the radiating section. The internal aperture includes four strip apertures. One end of a first strip aperture is connected to one end of a second strip aperture. The first strip aperture extends to the opposite edge of the second edge 1001, and the extension direction is offset from the axis of symmetry 1002 of the radiating section. The second strip aperture extends to the second edge 1001, and the extension direction is offset from the axis of symmetry 1002 of the radiating section. One end of a third strip aperture is connected to one end of a fourth strip aperture. The third strip aperture extends to the opposite edge of the second edge 1001, and the extension direction is offset from the axis of symmetry 1002 of the radiating section. The fourth strip aperture extends to the second edge 1001, and the extension direction is offset from the axis of symmetry 1002 of the radiating section. The other end of the second strip aperture is connected to the other end of the third strip aperture. The four strip openings are W-shaped. In some embodiments, the first strip opening and the fourth strip opening may be symmetrical about the axis of symmetry 1002, and the second strip opening and the third strip opening may be symmetrical about the axis of symmetry 1002.

[0120] FIG. 10(b) shows one embodiment of the internal opening of the radiating section. The internal opening includes two strip-shaped openings. The first strip-shaped opening is perpendicularly connected to the second strip-shaped opening. The first strip-shaped opening extends along the direction of the symmetry axis 1002 of the radiating section to an adjacent edge of the second edge 1001. The second strip-shaped opening extends along the direction of the symmetry axis 1003 of the radiating section to the second edge 1001. The two strip-shaped openings form an L-shape as a whole.

[0121] FIG. 10(c) shows one embodiment of the internal aperture of the radiating section. The internal aperture includes two strip apertures. One end of one strip aperture is connected to one end of the other strip aperture. One strip aperture extends to the opposite edge of the second edge 1001, and the extension direction is offset from the axis of symmetry 1003 of the radiating section. The other strip aperture extends to the second edge 1001, and the extension direction is offset from the axis of symmetry 1003 of the radiating section. The two strip apertures generally form a V-shape. In some embodiments, the one strip aperture and the other strip aperture may be symmetrical with respect to the axis of symmetry 1002.

[0122] FIG. 10(d) shows one embodiment of the internal aperture of the radiating section. The internal aperture includes three strip apertures. One end of the first strip aperture is connected to one end of the second strip aperture. The first strip aperture extends from the connected end to the opposite edge of the second edge 1001 along the symmetry axis 1003 of the radiating section. The second strip aperture extends from the connected end to the opposite edge of the second edge 1001 along a direction away from the symmetry axis. The third strip aperture is connected to an end of the second strip aperture that is far away from the end connected to the first strip aperture, and extends along the symmetry axis 1003 of the radiating section to the second edge 1001. The three strip apertures as a whole form a Z-shape.

[0123] It should be understood that in addition to the shapes of the internal opening of the radiating portion shown in Figures 7 and 10, the internal opening may be of other shapes, provided that the opening is not closed and meets the above-mentioned requirements for the overall length and width of the opening.

[0124] In addition to the case where the aperture is completely inside, the aperture may alternatively be rotated by a certain angle, or one of the two ends of the aperture may be connected to the edge of the radiating portion.

[0125] According to the various aperture structures shown in FIG. 10, the coupling capacitance value of the frequency of the transmission structure is changed, the resonance point is increased, and the matching bandwidth of the transmission structure is widened.

[0126] FIG. 11 is a schematic structural diagram of the apertures of the radiating portion according to one embodiment of the present application. As shown in FIG. 11, two edges of the radiating portion are provided with three apertures. The size of the first aperture 1101 is W1×L1, the size of the second aperture 1102 is W2×L2, and the size of the third aperture 1103 is W3×L3 (where the right edge of the radiating portion is the second edge 1104 and is connected to the microstrip 232, which is not shown). L1 or L2 is smaller than the width of the radiating portion, and W1+W2+W3 is smaller than the length of the radiating portion. W1, W2, and W3 are the sizes of the apertures in the direction perpendicular to the second edge, and L1, L2, and L3 are the sizes of the apertures in the direction parallel to the second edge.

[0127] In this embodiment of the present application, W1×L1 may be approximately (0.1×λ)×(0.15×λ), W1×L1 may be approximately (0.1×λ)×(0.15×λ), and W3×L3 may be approximately (0.05×λ)×(0.05×λ).

[0128] The opening at the edge of the radiating part can increase the current diffraction path, extend the operating bandwidth of the transmission structure, and improve the application scenario of the transmission structure in this application.

[0129] In this embodiment of the present application, openings may also be performed on a second edge of the radiating portion 231 that is connected to the microstrip 232, and on an edge of the radiating portion 231 that is opposite to the edge that is connected to the microstrip 232.

[0130] FIG. 12 is a schematic structural diagram of an aperture of a radiating portion according to one embodiment of the present application.

[0131] In FIG. 12, the right edge of the radiating portion is defined as the second edge 1201, i.e., the edge of the radiating portion 231 and connected to the microstrip 232 (where the microstrip is not shown), and the two symmetry axes of the radiating portion are 1202 and 1203, respectively (where the symmetry of the aperture is not taken into account).

[0132] 12(a) shows one embodiment of the edge opening of the radiating portion. The edge opening includes two strip openings. One strip opening extends from an apex where an adjacent edge of a second edge intersects with the second edge to the opposite edge of the adjacent edge, and extends in a direction that deviates from the direction of the symmetry axis 1202 of the radiating portion. The other strip opening extends from another apex of the adjacent edge to the opposite edge of the adjacent edge, and extends in a direction that deviates from the direction of the symmetry axis 1202 of the radiating portion.

[0133] In another embodiment, one strip of aperture extends from a vertex where an adjacent edge of the second edge intersects with the second edge to the opposite edge of the second edge, and extends in a direction that is offset from the radiating portion's axis of symmetry 1202. The other strip of aperture extends from a different vertex of the adjacent edge to the second edge, and extends in a direction that is offset from the radiating portion's axis of symmetry 1202.

[0134] 12(b) shows another embodiment of an edge aperture of a radiating portion. The edge aperture includes two strip apertures. One end of one strip aperture is connected to one end of the other strip aperture at a point on the adjacent second edge. One strip aperture extends from the connection point to the second edge, and extends in a direction that is offset from the axis of symmetry 1202. The other strip aperture extends from the connection point to the opposite edge of the second edge, and extends in a direction that is offset from the axis of symmetry of the radiating portion.

[0135] 12(c) shows another embodiment of the edge opening of the radiating portion. The edge opening includes a strip opening. One end of the strip opening is located at a point on one adjacent edge of the second edge and extends to the other adjacent edge. In one embodiment, the extension direction is parallel to the direction of the symmetry axis 1202 of the radiating portion.

[0136] 12(d) shows another embodiment of the edge opening of the radiating portion. The edge opening includes two strip openings. One end of one strip opening is disposed at a point on one adjacent edge of the second edge and extends to the other adjacent edge, with the extension direction being parallel to the direction of the symmetry axis 1202 of the radiating portion. One end of the other strip opening is disposed at a different point on the adjacent edge and extends to the other adjacent edge, with the extension direction being parallel to the direction of the symmetry axis 1202 of the radiating portion. The two strip openings may be symmetrical with respect to the symmetry axis 1202 of the radiating portion 231.

[0137] 12(e) shows another embodiment of the edge opening of the radiating portion. The edge opening includes one strip opening. One end of the strip opening is located at a point on the edge opposite to the second edge and extends to the second edge, and the extending direction is parallel to the direction of the symmetry axis 1203 of the radiating portion. In other words, the strip opening may be located perpendicular to the second edge.

[0138] 12(f) shows another embodiment of the edge opening of the radiating portion. The edge opening includes two strip openings. One end of one strip opening is located on the opposite edge of the second edge and extends to the second edge, and the extending direction is parallel to the direction of the symmetry axis 1203 of the radiating portion. One end of the other strip opening is located at a point on the adjacent edge of the second edge and extends to the opposite edge of the adjacent edge, and the extending direction is parallel to the direction of another symmetry axis 1202 of the radiating portion. The two strip openings do not intersect with each other.

[0139] From FIG. 12, it can be seen that the length, width and position of the edge opening can be set randomly, and the technical effect of the present application can be achieved, that is, the bandwidth of the transmission structure can be extended.

[0140] In addition, the transmission structure in this application may be implemented in an array manner. For the circuit board 20, multiple radiating sections and microstrips 232 are arranged on the circuit board 20 in a specific manner. Waveguides may also be arranged in the same manner as the radiating sections. In addition, the waveguides may share one or more edges of the shield groove.

[0141] According to the various aperture structures shown in FIG. 12, the coupling capacitance value of the transmission structure with frequency is changed, the resonance point is increased, and the matching bandwidth of the transmission structure is expanded.

[0142] FIG. 13 is a schematic structural diagram of an array of transmission structures according to one embodiment of the present application. As shown in FIG. 13, the transmission structure may include multiple waveguides. The multiple waveguides include waveguide a, waveguide b, waveguide c, and waveguide d, and the multiple waveguides are arranged, for example, in an array. The waveguide port of waveguide a may be arranged opposite the waveguide port of waveguide b. The microstrip avoidance groove of waveguide a and the microstrip avoidance groove of waveguide b are arranged on two sides of the waveguide ports of waveguide a and waveguide b, respectively, and extend in a direction away from the waveguide ports. The waveguide port of waveguide a is arranged opposite the waveguide port of waveguide c. The microstrip avoidance groove of waveguide a is arranged opposite the microstrip avoidance groove of waveguide c. The microstrip avoidance grooves of the waveguide c and the microstrip avoidance grooves of the waveguide d are respectively disposed on two sides of the waveguide ports of the waveguide c and the waveguide d and extend in directions away from the waveguide ports.

[0143] The shield groove includes a first edge 1301, a second edge 1302, a third edge 1303, a fourth edge 1304, a fifth edge 1305, a sixth edge 1306, a seventh edge 1307, and an eighth edge 1308. The first edge 1301, the third edge 1303, and the fourth edge 1304 surround waveguide port 1 of waveguide a. The second edge 1302, the third edge 1303, and the fifth edge 1305 surround waveguide port 2 of waveguide b. The fourth edge 1304, the sixth edge 1306, and the seventh edge 1307 surround waveguide port 3 of waveguide c. The fifth edge 1305, the sixth edge 1306, and the eighth edge 1308 surround waveguide port 4 of waveguide d. The waveguide ports of waveguide a and waveguide b are located on two sides of the third edge 1303. The waveguide ports of waveguide a and waveguide c are located on two sides of the fourth edge 1304. The waveguide ports of waveguide b and waveguide d are located on two sides of the fifth edge 1305. The waveguide ports of waveguide c and waveguide d are located on two sides of the sixth edge 1306. Adjacent waveguides share one edge of the shield groove. Waveguides a and b share the third edge 1303 of the shield groove. Waveguides a and c share the fourth edge 1304 of the shield groove. Waveguides b and d share the fifth edge 1305 of the shield groove. Waveguides c and d share the sixth edge 1306 of the shield groove.

[0144] The radiating parts on the circuit board 20 may be arranged in the same way inside the four waveguide ports of Fig. 13, and the microstrip 232 extends along the four avoidance grooves of the microstrip 232. Thus, the technical solution of the transmission structure in this application can form an array, and the array is integrated into another device or module.

[0145] It should be understood that Figure 13 merely provides one example of how the waveguides, radiators, and microstrips 232 may be arranged in an array, and the waveguides, radiators, and microstrips 232 may alternatively be arranged in other ways to increase the integration of the transmission structures in this application.

[0146] In addition, the above describes an application in which the microstrip 232 and the waveguide are located on the same side of the circuit board 20 of the transmission structure in this application, i.e., the coplanar transmission between the microstrip or feed and the waveguide is performed on the same side of the circuit board. In this application, the transmission is performed on the side of the first metal layer. The transmission structure in this application can alternatively be used for non-coplanar transmission.

[0147] FIG. 14 is a schematic diagram of another transmission structure according to an embodiment of the present application.

[0148] 14 shows that the microstrip 232 is divided into two segments: a first segment 2321 on the first metal layer 230, which is in contact with the waveguide, and a second segment 2322 on the second metal layer 210 on the circuit board 20 (shown by a dashed line in FIG. 12). The second segment 2322 on the second metal layer 210 can be connected to the feed of the entire transmission structure. The two segments of the microstrip are connected through a plated-through hole 2323. In this way, the electromagnetic wave is transmitted through the waveguide from the second metal layer 210 side through the plated-through hole on the first metal layer 230. According to the transmission structure in this embodiment of the present application, non-coplanar transmission between the circuit board 20 and the waveguide can be flexibly implemented. Compared with common non-coplanar transmission methods, the plated-through hole solution is easier to integrate, and the bandwidth of the transmission structure in this application can be effectively extended through the opening of the radiating section.

[0149] The transmission structure described herein can be flexibly used in a variety of coplanar and non-coplanar transmission scenarios, effectively extending the bandwidth of the transmission structure and covering a common bandwidth range. In addition, the transmission structure is easy to assemble and can be used in a variety of radar and test scenarios.

[0150] The transmission structure in this application is described by using only one example where the feed enters the radiating transmission structure from the microstrip 23. In another case, the feed of the transmission structure in this application may alternatively be a structure on the waveguide side, including a waveguide, an upper-level antenna, a SIW, etc., so that the electromagnetic wave energy is introduced from the waveguide to the microstrip and then enters another structure on the circuit board for further processing.

[0151] An embodiment of the present application further provides an antenna, the antenna including any of the structures of FIGS.

[0152] An embodiment of the present application further provides a detection device, the detection device including the antenna described above. For example, the detection device is a radar.

[0153] An embodiment of the present application further provides a terminal, which includes the above-mentioned detection device. For example, the terminal may be a vehicle.

[0154] An embodiment of the present application further provides a vehicle, the vehicle including the above-described detection device.

[0155] The above description is merely a specific embodiment of the present application and is not intended to limit the scope of protection of the present application. Any variations or replacements that can be easily conceived by those skilled in the art within the technical scope disclosed in the present application shall fall within the scope of protection of the present application. Therefore, the scope of protection of the present application is limited to the protection of the claims.

Claims

1. A transmission structure comprising a circuit board, the circuit board includes a first metal layer, a second metal layer, and a dielectric layer; the dielectric layer is disposed between the first metal layer and the second metal layer; the first metal layer includes a radiating portion and a microstrip; the microstrip is connected to one end of the radiating portion; and the second metal layer is grounded; the radiating portion is provided with an opening, allowing the radiating portion to form at least two resonant frequencies; the microstrip is positioned off an axis of symmetry of the radiating portion; one end of the aperture is connected to an edge of the radiating portion and is away from the edge connected to the microstrip; Transmission structure.

2. The transmission structure further comprises: a waveguide disposed on a side of the circuit board and close to the first metal layer; the waveguide includes a microstrip avoidance groove and a waveguide port; the microstrip is disposed opposite the microstrip avoidance groove at a distance from a groove wall of the microstrip avoidance groove; the waveguide port is disposed opposite the radiating portion, the signal radiated by the radiating portion passes through the waveguide port and is radiated out of the transmission structure; 10. The transmission structure of claim 1.

3. The radiating portion is rectangular.

10. The transmission structure of claim 1.

4. the opening is a strip-shaped opening, and the aperture is spaced from an edge of the radiating portion.

10. The transmission structure of claim 1.

5. The opening is a strip-shaped opening.

4. The transmission structure of claim 3.

6. the aperture includes a first strip-shaped aperture segment and a second strip-shaped aperture segment; and One end of the second strip-shaped opening segment is connected to one end of the first strip-shaped opening segment.

5. The transmission structure of claim 4.

7. the aperture further includes a third strip-shaped aperture segment; and One end of the third strip-shaped opening segment is connected to the other end of the second strip-shaped opening segment, the other end of the second strip-shaped opening segment is far away from the end connected to the first strip-shaped opening segment; and the third aperture strip segment is parallel to and spaced apart from the first aperture strip segment; 7. The transmission structure of claim 6.

8. the second strip-shaped opening segment is disposed perpendicular to the first strip-shaped opening segment; 7. The transmission structure of claim 6.

9. the length of the opening is in the range of 0.5×λ to 1.5×λ; the width of the opening is in the range of 0.01×λ to 0.2×λ; and λ is the operating wavelength of the transmission structure; A transmission structure according to any one of claims 4 to 8.

10. the aperture includes a fourth strip-shaped aperture segment and a fifth strip-shaped aperture segment; the fourth strip-shaped aperture segment extends along a first direction to a first edge of the radiating portion; the fifth strip-shaped opening segment extends along a second direction to the first edge; and the fourth strip-shaped opening segment intersects with the fifth strip-shaped opening segment on the first edge; 4. The transmission structure of claim 3.

11. the first edge is an edge of the radiating portion and is adjacent to an edge connected to the microstrip; 11. The transmission structure of claim 10.

12. the waveguide further includes a shield groove; the shield groove is disposed on a side of the waveguide and proximal to the waveguide port, and is spaced apart from the waveguide port and the microstrip escape groove; 3. The transmission structure of claim 2.

13. The shield groove surrounds the periphery of the waveguide port.

13. The transmission structure of claim 12.

14. The depth of the shield groove is an odd multiple of λ / 4, and λ is the operating wavelength of the transmission structure; 13. The transmission structure of claim 12.

15. the waveguide further includes a waveguide body and a boss; the boss protrudes from the waveguide body toward the circuit board and is in contact with the circuit board; 3. The transmission structure of claim 2.

16. the first metal layer further includes a first transition portion configured for impedance matching between the microstrip and the radiating portion; the first transition section is connected between the radiating section and the microstrip along a direction from the radiating section to the microstrip.

10. The transmission structure of claim 1.

17. the first metal layer further includes a ground portion; the ground portion surrounds the radiating portion and the microstrip and is spaced apart from the radiating portion and the microstrip; the ground portion is in contact with the waveguide and is electrically connected to the second metal layer; 3. The transmission structure of claim 2.

18. The ground portion is electrically connected to the second metal layer through a plated through hole or a metal wall.

20. The transmission structure of claim 17.

19. an orthogonal projection of the waveguide port on the circuit board is located within an area surrounded by an inner contour of the ground portion; 19. A transmission structure according to claim 17 or 18.

20. the ground portion includes a ground portion body and a ground extension; the ground extension is positioned opposite and spaced apart from a junction between the microstrip and the radiating portion; the ground extension extends from the ground portion body toward the joint; 20. The transmission structure of claim 17.

21. 21. A transmission structure comprising: a transmission structure according to any one of claims 1 to 20; antenna.

22. 22. The antenna of claim 21, Detection device.

23. 23. A method for detecting a detection device comprising: Terminal.

24. the terminal is a vehicle; 24. The terminal of claim 23.

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